ASMC-PAB9-TW7H5 [AGILENT]
Envisium Power PLCC-4 Surface Mount LED; Envisium功率PLCC - 4表面贴装LED
| 型号： | ASMC-PAB9-TW7H5 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Envisium Power PLCC-4 Surface Mount LED |
| 文件： | 总9页 (文件大小：85K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMC-PxB9-Txxxx
Envisium Power PLCC-4
Surface Mount LED
Data Sheet
Features
• Industry standard PLCC-4 (Plastic
Leaded Chip Carrier)
• High reliability LED package
• Mid-Power intensity brightness with
optimum flux performance using TS
AlInGaP dice technologies
• Available in Red, Red Orange and
Amber colors
Envisium
The Envisium Power PLCC-4 SMT
LEDs are designed for higher
reliability, better performance,
and operate under a wide range of
environmental conditions. The
performance characteristics of
these new mid-power LEDs make
them uniquely suitable for use in
harsh conditions such as in
• High optical efficiency
Envisium is the premier class of
mid-Power LEDs from Agilent
and Lumileds utilizing the very
best solid-state lighting
• Higher ambient temperature at the
same current possible compared to
PLCC-2
• Super wide viewing angle at 120°
technologies from these two
• Available in 8 mm carrier tape on 7-
inch reel
industry leaders. Envisium LEDs
offer unparalleled performance,
engineering and design flexibility.
For the very first time, customers
have options for mid-power LEDs.
• Compatible with both IR and TTW
soldering process
automotive applications, and in
electronics signs and signals.
Applications
• Interior automotive
To facilitate easy pick and place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel is shipped in single
intensity and color bin (except for
red), to provide close uniformity.
These LEDs are compatible with
the IR solder reflow process. Due
to the high reliability feature of
these products, they also can be
mounted using through-the-wave
soldering process.
Description
– Instrument panel backlighting
– Central console backlighting
– Navigation and audio system
– Push button backlighting
The Envisium Power PLCC-4 SMT
LED is an extension of Agilent’s
PLCC-4 SMT LEDs. The package
can be driven at high current due
to its superior package design.
The product is able to dissipate
the heat more efficiently
compared to the conventional
PLCC-2 SMT LEDs. These LEDs
produce higher light output with
better flux performance compared
to the conventional PLCC-4 SMT
LEDs.
• Exterior automotive
– Turn signals
– Side repeaters
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Channel lettering
– Contour lighting
– Indoor variable message sign
The Envisium Power PLCC-4 SMT
LED is available in 3 colors, red,
red-orange and amber.
• Office automation, home appliances,
industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
0.1 TYP.
0.8 ± 0.1
A
C
3.2 ± 0.2
3.5 ± 0.2
0.8 ± 0.3
C
C
0.5 ± 0.1
0.7 ± 0.1
CATHODE MARKING
NOTE: ALL DIMENSIONS IN mm.
Device Selection Guide
Total Flux FV
Test
Current Dice
(mlm)[2,3]
Intensity
Bin
Min. IV
(mcd)
Max. IV
(mcd)
Color
Part Number
Typ.
(mA)
Technology
V1
630.00
790.00
1000.00
1000.00
1200.00
1580.00
630.00
790.00
1000.00
1000.00
1260.00
1600.00
1600.00
2020.00
2500.00
1000.00
1260.00
1600.00
2600.00
3300.00
-
Red
ASMC-PRB9-TV005
V2
50
AlInGaP
AlInGaP
AlInGaP
W1
W1
W2
X1
4300.00
5000.00
-
Red Orange
ASMC-PHB9-TW005
ASMC-PAB9-TV005
50
50
V1
3000.00
3800.00
-
Amber
V2
W1
Notes:
1. The luminous intensity, IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
3. Flux tested at mono pulse conditions.
2
Part Numbering System
ASMC - PX B9 - TX
X
X
X
4 5
1
2
3
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
ASMC-PxB9-Txxxx
[3,4]
DC Forward Current[1]
Peak Forward Current[2]
Power Dissipation
70 mA
200 mA
240 mW
Reverse Voltage
5 V
Junction Temperature
Operating Temperature
Storage Temperature
125°C
-40°C to +100°C
-40°C to +100°C
Notes:
1. Derate linearly as shown in figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Optical Characteristics (TA = 25°C)
Luminous
Intensity/
Total Flux
IV (mcd)/
FV[4,5] (lm)
Peak
Wavelength
Dominant
Wavelength
lD[1] (nm)
Viewing
Luminous
Efficacy hV
(lm/ W)
Angle 2q1/ 2
[2]
[3]
lPEAK (nm)
(Degrees)
Dice
Color
Part Number
Technology
Typ.
Typ.
Typ.
120
120
120
Typ.
155
263
500
Typ.
0.30
0.29
0.26
Red
ASMC-PRB9-Txxx5
ASMC-PHB9-Txxx5
ASMC-PAB9-Txxx5
AlInGaP
AlInGaP
AlInGaP
639.0
623.0
594.0
630.0
617.0
592.0
Red Orange
Amber
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. q1/ 2 is the off-axis angle where the luminous intensity is 1/ 2 the peak intensity.
3. Radiant intensity, Ie in watts/ steradian, may be calculated from the equation Ie = IV/ hV, where IV is the luminous intensity in candelas and hV is the
luminous efficacy in lumens/ watt.
4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Electrical Characteristics (TA = 25°C)
Forward Voltage V (Volts) @ IF = 50 mA
Reverse Voltage V @ 100 µA
F
R
Part Number
Typ.
Max.
Min.
ASMC-PxB9-Txxx5
2.8
3.4
5
3
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
RED ORANGE
RED
AMBER
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
1.4
1.2
1.0
0.8
0.6
0.4
80
70
80
70
60
50
60
50
40
30
20
40
30
20
10
0
0.2
0
10
0
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
0
20
40
60
80
100 120
0
1
2
3
4
DC FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative intensity vs. forward current. Figure 4. Maximum forward current vs. ambient
temperature. Derated based on T MAX = 125°C,
J
RqJA = 300°C/ W.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
30
50
70
90
ANGLE – DEGREES
Figure 5. Radiation pattern.
4
20 SEC. MAX.
240°C MAX.
3°C/ SEC. MAX.
100-150°C
183°C
–6°C/ SEC.
MAX.
3°C/ SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 6a. Recommended Sn-Pb reflow soldering profile.
10 to 20 SEC.
+5 °C
-0 °C
255 °C
217 °C
3 °C/ SEC. MAX.
6 °C/ SEC. MAX.
125 °C ± 25 °C
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6b. Recommended Pb-free reflow soldering profile.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/ MIN (6 FT/ MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90 100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
5
4.05
3.8
SOLDER-RESIST
3.4
4.05
PAD
CLEARANCE
8.5
4.05
0.5
0.2
8.5
PAD CLEARANCE
Figure 8. Recommended soldering pad pattern.
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR 180 REEL.
200 mm MIN. FOR 330 REEL.
480 mm MIN. FOR 180 REEL.
960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 9. Tape leader and trailer dimensions.
6
4 ± 0.1
B
3.6 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
2 ± 0.05
1.5 +0.1/ -0
C
C
C
A
A
A
12 +0.3/ -0.1
3.8 ± 0.1
1 +0.1/ -0
B
0.229 ± 0.01
VIEW B-B
8 ± 0.1
3.45 ± 0.1
VIEW A-A
ALL DIMENSIONS ARE IN MILLIMEERS (mm).
Figure 10. Tape dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 11. Reeling orientation.
7
Color Bin Limits
Amber/
Intensity Bin Select (X X )
Individual reel will contain parts
from one half bin only
Color Bin Select (X )
Individual reel will contain parts
from one full bin only.
2
3
4
Yellow
Min. (nm)
Max. (nm)
584.5
X
2
Min IV Bin
X
4
1
2
3
4
5
6
582.0
584.5
587.0
589.5
592.0
594.5
0
Full Distribution
1 and 2 only
587.0
A
B
C
D
E
G
H
J
589.5
X
3
2 and 3 only
592.0
0
3
4
5
7
8
9
Full Distribution
3 and 4 only
594.5
3 half bins starting from X 1
6
4 and 5 only
597.0
4 half bins starting from X 1
6
5 and 6 only
5 half bins starting from X 1
6
1, 2 and 3 only
2, 3 and 4 only
3, 4 and 5 only
4, 5 and 6 only
1, 2, 3 and 4 only
2, 3, 4 and 5 only
3, 4, 5 and 6 only
1, 2, 3, 4, and 5 only
2, 3, 4, 5 and 6 only
Red
Orange
3 half bins starting from X 2
6
Min. (nm)
611.0
Max. (nm)
616.0
4 half bins starting from X 2
6
1
2
5 half bins starting from X 2
6
K
M
N
P
616.0
620.0
Intensity Bin Limits & Typical Flux
Red
Min. (nm)
Max. (nm)
Bin ID
V1
Min. (mcd) Max. (mcd)
Full Distribution
R
S
715.00
900.00
Tolerance of each bin limit = ± 1 nm.
V2
900.00
1125.00
1400.00
1800.00
2240.00
2850.00
W1
W2
X1
1125.00
1400.00
1800.00
2240.00
Packaging Option (X )
5
Option
Test Current
50 mA
Package Type
Reel Size
X2
5
Top Mount
7 inch
Tolerance of each bin limit = ±12%.
8
www.agilent.com/ semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/ Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/ Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
January 30, 2005
5989-2308EN
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