HCPL-4534-360 [AGILENT]
Transistor Output Optocoupler,;
| 型号： | HCPL-4534-360 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Transistor Output Optocoupler, |
| 文件： | 总13页 (文件大小：116K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent Dual Channel,
High Speed Optocouplers
Data Sheet
Features
• 15 kV/ µs minimum common mode
transient immunity at V = 1500 V
CM
(HCPL-4534/ 0534)
• High speed: 1 Mb/ s
• TTL compatible
HCPL-2530, HCPL-2531, HCPL-4534
HCPL-0530, HCPL-0531, HCPL-0534
Applications
• Available in 8 pin DIP, SO-8, and 8 pin
DIP – gull wing surface mount
(option 020) packages
Description
These dual channel optocouplers
contain a pair of light emitting
diodes and integrated photo-
detectors with electrical insulation
between input and output.
Separate connection for the
photodiode bias and output
transistor collectors increase the
speed up to a hundred times that
of a conventional phototransistor
coupler by reducing the base-
collector capacitance.
• Line receivers – high common mode
transient immunity (>1000 V/ µs)
and low input-output capacitance
(0.6 pF)
• High density packaging
• 3 MHz bandwidth
• High speed logic ground isolation –
TTL/ TTL, TTL/ LTTL, TTL/ CMOS,
TTL/ LSTTL
• Open collector outputs
• Guaranteed performance from
0°C to 70°C
• Replace pulse transformers –
save board space and weight
• Safety approval
UL Recognized – 3750 V rms for 1
minute (5000 V rms for 1 minute for
Option 020) per UL1577
• Analog signal ground isolation –
integrated photon detector provides
improved linearity over
CSA Approved
phototransistor type
IEC/ EN/ DIN EN 60747-5-2
– VIORM = 630 Vpeak for
HCPL-2530/ 2531/ 4534
0ption 060
– VIORM = 560 Vpeak for
HCPL-0530/ 0531/ 0534
0ption 060
• Polarity sensing
• Isolated analog amplifier –
dual channel packaging enhances
thermal tracking
Functional Diagram
• Single channel version available
(4502/ 3, 0452/ 3)
ANODE
CATHODE
CATHODE
ANODE
1
2
3
4
8
7
6
5
V
V
V
1
1
2
2
CC
O1
O2
TRUTH TABLE
(POSITIVE LOGIC)
• MIL-PRF-38534 hermetic version
available (55XX/ 65XX/ 4N55)
LED
V
O
ON
OFF
LOW
HIGH
GND
A 0.1 µF bypass capacitor between
pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
These dual channel optocouplers
are available in an 8 Pin DIP and
in an industry standard SO-8
package. The following is a cross
reference table listing the 8 Pin
DIP part number and the
The SO-8 does not require
The HCPL-2531/0531 is designed
for high speed TTL/TTL
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 kΩ pull-up resistor. CTR of
the HCPL-2531/0531 is 19%
minimum at IF = 16 mA.
electrically equivalent SO-8 part
number.
SO-8
Package
HCPL-0530
HCPL-0531
HCPL-0534
The HCPL-2530/0530 is for use in
TTL/CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
the HCPL-2530/0530 is 7%
8 Pin DIP
HCPL-2530
HCPL-2531
HCPL-4534
The HCPL-4534/0534 is an HCPL-
2531/0531 with increased
common mode transient immunity
of 15,000 V/µs minimum at
VCM = 1500 V guaranteed.
minimum at IF = 16 mA.
Selection Guide
Minimum CMR
Widebody
(400 Mil)
8-pin DIP (300 Mil)
Small-Outline SO-8
Hermetic
Current
Transfer
Ratio (%)
Dual
Channel
Package
Single
Channel
Package*
Dual
Channel
Package
Single
Channel
Package*
Single
Channel
Package*
Single and
Dual Channel
Packages*
dV/ dt
(V/ µs)
V
(V)
CM
1,000
10
7
HCPL-2530
HCPL-2531
6N135
HCPL-0530
HCPL-0531
HCPL-0500
HCNW135
19
6N136
HCPL-4502
HCPL-0501
HCPL-0452
HCNW136
HCNW4502
15,000 1500
1,000 10
19
9
HCPL-4534 HCPL-4503
HCPL-0534
HCPL-0453
HCNW4503
HCPL-55XX
HCPL-65XX
4N55
*Technical data for these products are on separate Agilent publications.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2531#XXXX
020 = UL 5000 V rms/1 Minute Option*
060 = IEC/EN/DIN EN 60747-5-2 Option
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
*For HCPL-2530/1 and HCPL-4534 only.
†Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–”
2
Schematic
1
+
I
CC
I
F1
V
CC
8
7
V
F1
I
O1
V
O1
–
2
3
I
F2
–
I
O2
V
O2
6
5
V
F2
+
4
GND
HCPL-4534/0534 SHIELD
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED.
Package Outline Drawings
8-Pin DIP Package (HCPL-2530/ 2531/ 4534)
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
1
7
6
5
TYPE NUMBER
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW
U R
UL
2
3
4
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
- 0.051
0.254
5° TYP.
+ 0.003)
- 0.002)
(0.010
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS.
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
1.080 ± 0.320
0.65 (0.025) MAX.
(0.043 ± 0.013)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
3
Package Outline Drawings, continued
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2530/ 2531/ 4534)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
1.016 (0.040)
(0.380 ± 0.010)
6
5
8
1
7
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
2.0 (0.080)
2
3
4
1.27 (0.050)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
- 0.051
0.254
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.003)
- 0.002)
(0.010
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
0.635 ± 0.130
(0.025 ± 0.005)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package (HCPL-0530/ 0531/ 0534)
LAND PATTERN RECOMMENDATION
8
1
7
2
6
5
4
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
3
1.9 (0.075)
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
0.64 (0.025)
0.432
(0.017)
7°
* 5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
4
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
100
0
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
30
160°C
150°C
140°C
SEC.
30
SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
t
p
20-40 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
150 - 200 °C
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
Regulatory Information
CSA
The devices contained in this data
sheet have been approved by the
following organizations:
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
UL
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
Recognized under UL 1577,
Component Recognition Program,
File E55361.
(Option 060 only)
5
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil) SO-8
Parameter
Symbol
Value
Value
Units
Conditions
Minimum External
Air Gap (External
Clearance)
L(101)
7.1
4.9
mm
Measured from input terminals to output to
to output terminals, shortest distance through air.
Minimum External
Tracking (External
Creepage)
L(102)
7.4
4.8
mm
mm
Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.08
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
200
IIIa
NA
200
IIIa
mm
Measured from input terminals to output
terminals, along internal cavity.
Tracking Resistance
(Comparative
Tracking Index)
CTI
Volts
DIN IEC 112/ VDE 0303 Part 1
Isolation Group
Material Group (DIN VDE 0110, 1/ 89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
6
IEC/ EN/ DIN EN 60747-5-2 Insulation Characteristics (Option 060)
Characteristic
HCPL-
HCPL-
Description
Symbol
2530/ 2531/ 4534 0530/ 0531/ 0534
Unit
Installation classification per DIN VDE 0110/ 1.89, Table 1
for rated mains voltage ≤ 150 V rms
I-IV
for rated mains voltage ≤ 300 V rms
for rated mains voltage ≤ 600 V rms
I-IV
I-III
I-III
I-II
Climatic Classification
55/ 100/ 21
55/ 100/ 21
Pollution Degree (DIN VDE 0110/ 1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
2
2
V
IORM
630
567
V
peak
V
IORM
x 1.875 = V , 100% Production Test
V
PR
1181
1050
V
peak
PR
with t = 1 sec, Partial Discharge < 5 pC
m
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V , Type and Sample Test,
V
PR
945
840
V
peak
PR
t = 60 sec, Partial Discharge < 5 pC
m
Highest Allowable Overvoltage
V
IOTM
6000
4000
V
peak
(Transient Overvoltage, t = 10 sec)
ini
Safety Limiting Values
(Maximum values allowed in the event of a failure.)
Case Temperature
T
175
230
600
150
230
600
˚C
mA
mW
S
Input Current**
Output Power**
I
S,INPUT
P
S,OUTPUT
9
9
Insulation Resistance at T , V = 500 V
R
S
> 10
> 10
Ω
S
IO
*
Refer to the optocoupler section of the Isolation and Control Components Designer's Catalog, under Product Safety Regulations section,
IEC/ EN/ DIN EN 60747-5-2, for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of P and I on ambient temperature.
S
S
Note: Isolation characteristics are guaranteed only within the safety maximum ratings, which must be ensured by protective circuits in application.
800
P
(mW)
(mA)
S
700
600
500
400
300
200
100
0
I
S
0
25 50 75 100 125 150 175 200
– CASE TEMPERATURE – °C
T
S
7
Absolute Maximum Ratings
Parameter
Symbol
Device
Min.
-55
Max.
125
100
25
Units
°C
Note
Storage Temperature
Operating Temperature
T
S
T
A
-55
°C
Average Forward Input Current
(each channel)
I
mA
F(AVG)
Peak Forward Input Current (each channel)
(50% duty cycle, 1 ms pulse width)
I
50
1
mA
A
F(PEAK)
Peak Transient Input Current (each channel)
I
F(TRANS)
(≤ 1 µs pulse width, 300 pps)
Reverse LED Input Voltage (each channel)
Input Power Dissipation (each channel)
Average Output Current (each channel)
Peak Output Current
V
5
V
R
P
IN
45
8
mW
mA
mA
V
I
O(AVG)
I
16
30
20
35
260
O(PEAK)
Supply Voltage (Pin 8-5)
V
CC
-0.5
-0.5
Output Voltage (Pins 7-5, 6-5)
V
O
V
Output Power Dissipation (each channel)
P
O
mW
°C
13
Lead Solder Temperature
T
LS
8 Pin DIP
(Through-Hole Parts Only)
1.6 mm below seating plane, 10 seconds
Reflow Temperature Profile
T
RP
SO-8 and
see Package Outline Drawings
Option 300
section
8
Electrical Specifications (DC)
Over recommended temperature (T = 0°C to 70°C) unless otherwise specified. See note 9.
A
Parameter
Sym.
Device
Min. Typ.* Max. Units
Test Conditions Fig.
Note
Current
Transfer
Ratio
CTR HCPL-2530/
0530
7
18
50
%
T = 25°C
IF = 16mA, 1, 2 1, 2
A
V = 4.5V
V = 0.5 V
O
4
1
CC
5
HCPL-2531/
0531
HCPL-4534/
0534
19
15
24
50
%
T = 25°C
A
Logic Low
Output
Voltage
V
OL
HCPL-2530/
0530
0.1
0.1
0.5
0.5
0.5
0.5
V
V
T = 25°C IO = 1.1 mA IF = 16mA,
1
A
V = 4.5V
CC
IO = 0.8 mA
HCPL-2531/
0531
HCPL-4534/
0534
T = 25°C IO = 3.0 mA
A
IO = 2.4 mA
Logic High
Output
Current
IOH
0.003 0.5
50
µA T = 25°C V = Open
IF = 0 mA
6
3
1
1
A
O
V = 5.5 V
CC
V = Open
O
V = 15.0 V
CC
Logic Low
Supply
Current
ICCL
100
0.05
1.5
400
4
µA IF = 16 mA, V = Open,
O
V = 15 V
CC
Logic High
Supply
Current
ICCH
µA IF = 0 mA, V = Open,
O
V = 15 V
CC
Input
Forward
Voltage
V
F
1.7
1.8
V
V
T = 25°C
1
1
A
IF = 16 mA
Input
BV
5
IR=10 µA
R
Reverse
Breakdown
Voltage
Temperature ∆V
-1.6
60
mV/ IF = 16 mA
°C
F
Coefficient
of Forward
Voltage
∆T
A
Input
C
IN
pF f = 1 MHz, V = 0 V
F
Capacitance
*All typicals at T = 25°C.
A
9
Switching Specifications (AC)
Over recommended temperature (T = 0°C to 70°C), V = 5 V, IF = 16 mA unless otherwise specified.
A
CC
Device
HCPL-
Parameter
Sym.
Min. Typ.* Max. Units
Test Conditions
Fig. Note
Propagation
Delay Time
to Logic Low
at Output
tPHL
2530/ 0530
0.2
1.5
2.0
0.8
1.0
µs
TA = 25°C
RL = 4.1 kΩ
5, 9, 6, 7
11
2531/ 0531/
4534/ 0534
0.2
TA = 25°C
RL = 1.9 kΩ
Propagation
Delay Time
High to Logic
at Output
tPLH
2530/ 0530
1.3
0.6
1.5
2.0
0.8
1.0
µs
TA = 25°C
TA = 25°C
RL = 4.1 kΩ
RL = 1.9 kΩ
5, 9, 6, 7
11
2531/ 0531/
4534/ 0534
Common
| CMH| 2530/ 0530
2531/ 0531
1
1
15
10
10
30
kV/ µs RL = 4.1 kΩ
RL = 1.9 kΩ
IF = 0 mA,
10
10
5, 6,
7
Mode Transient
Immunity at
Logic High
T = 25°C,
A
4534/ 0534
RL = 1.9 kΩ
VCM = 10 V
p-p
Level Output
Common
| CML| 2530/ 0530
2531/ 0531
1
1
15
10
10
30
kV/ µs RL = 4.1 kΩ
RL = 1.9 kΩ
IF = 0 mA,
5, 6,
7
Mode Transient
Immunity at
Logic Low
T = 25°C,
A
4534/ 0534
RL = 1.9 kΩ
VCM = 10 V
p-p
Level Output
Bandwidth
BW
3
MHz RL = 100 kΩ
7, 8
*All typicals at T = 25°C.
A
Package Characteristics
Parameter
Sym.
Device
Min. Typ.* Max. Units
Test Conditions
Fig.
Note
Input-Output
Momentary With-
stand Voltage**
V
3750
5000
V rms
RH < 50%,
t = 1 min.,
3, 10
3, 11
ISO
HCPL-2530/
2531/ 4534
Option 020
Resistance
R
I-O
1012
Ω
RH ≤45%
3
(Input-Output)
V = 500 Vdc,
I-O
t = 5 s
Capacitance
(Input-Output)
C
0.6
pF
f = 1 MHz,
T = 25°C
A
12
4
I-O
Input-Input
I
I-I
0.005
µA
RH ≤45%,
Insulation
t = 5 s,
Leakage Current
V = 500 Vdc
I-I
Resistance
(Input-Input)
R
1011
0.03
0.25
Ω
4
4
I-I
Capacitance
(Input-Input)
C
I-I
HCPL-2530/
2531/ 4534
pF
f = 1 MHz
HCPL-0530/
0531/ 0534
*All typicals at T = 25°C.
A
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage
rating. For the continuous voltage rating refer to the IEC/ EN/ DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level
safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E.
10
Notes:
1. Each channel.
transient immunity in a Logic Low level is
10. In accordance with UL 1577, each
optocoupler is proof tested by applying an
insulation test voltage ≥4500 V rms for 1
second (leakage detection current limit,
II-O ≤5 µA).
11. In accordance with UL 1577, each
optocoupler is proof tested by applying an
insulation test voltage ≥6000 V rms for 1
second (leakage detection current limit,
II-O ≤5 µA).
12. Measured between the LED anode and
cathode shorted together and pins 5
through 8 shorted together.
13. Derate linearly above 90°C free-air
temperature at a rate of 3.0 mW/ °C for
the SOIC-8 package.
the maximum tolerable (negative) dV / dt
CM
2. CURRENT TRANSFER RATIO is defined as
the ratio of output collector current, IO,
to the forward LED input current, IF,
times 100%.
3. Device considered a two-terminal device:
pins 1, 2, 3, and 4 shorted together and
pins 5, 6, 7, and 8 shorted together.
4. Measured between pins 1 and 2 shorted
together, and pins 3 and 4 shorted
together.
5. Common mode transient immunity in a
Logic High level is the maximum tolerable
(positive) dVCM/ dt on the rising edge of
the common mode pulse, VCM, to assure
that the output will remain in a Logic High
on the falling edge of the common mode
pulse signal, VCM, to assure that the
output will remain in a Logic Low state
(i.e., V < 0.8 V).
O
6. The 1.9 kΩ load represents 1 TTL unit load
of 1.6 mA and the 5.6 kΩ pull-up resistor.
7. The 4.1 kΩ load represents 1 LSTTL unit
load of 0.36 mA and the 6.1 kΩ pull-up
resistor.
8. The frequency at which the ac output
voltage is 3 dB below the low frequency
asymptote.
9. Use of a 0.1 µF bypass capacitor
connected between pins 5 and 8 is
recommended.
state (i.e., V > 2.0 V). Common mode
O
1.5
1000
100
40 mA
35 mA
T
= 25°C
= 5.0 V
A
HCPL-2530/0530
HCPL-2531/0531/4534/0534
10
V
CC
I
F
T
A
= 25°C
30 mA
25 mA
20 mA
+
1.0
10
1.0
V
F
–
5
0.1
0.5
NORMALIZED
15 mA
10 mA
I
V
V
T
= 16 mA
= 0.5 V
F
O
0.01
0.001
= 5 V
= 25°C
CC
I
= 5 mA
F
A
0.1
0
0
20
0
1
10
100
10
– OUTPUT VOLTAGE – V
1.1
1.2
1.3
1.4
1.5
1.6
I
– INPUT CURRENT – mA
V
V
– FORWARD VOLTAGE – VOLTS
F
O
F
Figure 1. DC and pulsed transfer
characteristics.
Figure 2. Current transfer ratio vs. input
current.
Figure 3. Input current vs. forward voltage.
+4
2000
1.1
1.0
10
I
= 16 mA, V
= 5.0 V
CC
F
I
V
= 0
= V
F
O
HCPL-2530/0530 (R = 4.1 kΩ)
HCPL-2531/0531/4534/0534
(R = 1.9 kΩ)
L
= 5.0 V
CC
+3
10
10
L
1500
1000
500
0
+2
0.9
NORMALIZED
+1
I
V
V
T
= 16 mA
F
10
= 0.5 V
= 5 V
= 25°C
O
CC
0.8
0.7
0.6
t
t
PHL
PLH
0
10
A
-1
HCPL-2530/0530
HCPL-2531/0531/4534/0534
10
10
-2
-60
-20
– TEMPERATURE – °C
20
60
100
-60 -40 -20
0
20 40 60 80 100
-50
-25
T
0
+25 +50 +75 +100
T
A
– TEMPERATURE – °C
T
– TEMPERATURE – °C
A
A
Figure 4. Current transfer ratio vs.
temperature.
Figure 5. Propagation delay vs. temperature.
Figure 6. Logic high output current vs.
temperature.
11
0
T
A
= 25°C
I
F
= 16 mA
-5
0.30
0.20
0.10
0
R
= 100 Ω
= 220 Ω
= 470 Ω
= 1 kΩ
L
T
= 25°C, R = 100 Ω, V = 5 V
CC
A
L
R
L
-10
-15
R
L
R
L
-20
-25
-30
0.01
0.1
1.0
10
f – FREQUENCY – MHz
0
4
8
12
16
20
24
+5 V
+5 V
1
8
7
I
– QUIESCENT INPUT CURRENT – mA
F
SET I
F
20 kΩ
2
R
L
AC INPUT
2N3053
Figure 7. Small-signal current transfer ratio vs.
quiescent input current.
0.1 µF
3
4
6
5
V
O
100 Ω
560 Ω
0.1 µF
1.6 V dc
0.25 Vp-p ac
Figure 8. Frequency response.
I
F
PULSE
GEN.
I
F
1
2
3
4
8
7
6
5
+5 V
Z
t
= 50 Ω
= 5 ns
O
r
0
R
L
5 V
V
O
10% DUTY CYCLE
1/f < 100 µs
V
O
1.5 V
1.5 V
0.1µF
V
I
MONITOR
F
OL
C
= 1.5 pF
L
R
M
t
t
PHL
PLH
Figure 9. Switching test circuit.
3.0
2.0
I
I
= 10 mA
= 16 mA
B
F
F
1
2
3
4
8
7
6
5
+5 V
I
F
A
V
T
A
= 5.0 V
= 25 °C
CC
R
L
1.0
0.8
t
V
CM
PLH
90% 90%
10%
r
10%
V
O
0 V
0.6
V
FF
t
t
f
0.1 µF
0.4
t
PHL
V
O
5 V
V
SWITCH AT A:
SWITCH AT B:
I
I
= 0 mA
F
F
0.2
0.1
V
O
OL
V
CM
= 16 mA
–
+
1
2
3
4
5
6 7 8 9 10
PULSE GEN.
R
– LOAD RESISTANCE – kΩ
L
Figure 11. Propagation delay time vs. load
resistance.
Figure 10. Test circuit for transient immunity and typical waveforms.
12
www.agilent.com/ semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/ Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
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Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/ Interna-
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Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004-2005 Agilent Technologies, Inc.
Obsoletes 5989-2115EN
June 17, 2005
5989-3350EN
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