HCPL-4562-320E [AGILENT]

Transistor Output Optocoupler, 1-Element, 3750V Isolation,;


型号：	HCPL-4562-320E
厂家：	AGILENT TECHNOLOGIES, LTD.
描述：	Transistor Output Optocoupler, 1-Element, 3750V Isolation,
文件：	总16页 (文件大小：500K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

High Bandwidth, Analog/Video

Optocouplers

Technical Data

HCPL-4562

HCNW4562

Applications

Description

Features

• Wide Bandwidth^[1]:

17 MHz (HCPL-4562)

9 MHz (HCNW4562)

• Video Isolation for the

Following Standards/

Formats: NTSC, PAL,

SECAM, S-VHS, ANALOG

RGB

The HCPL-4562 and HCNW4562

optocouplers provide wide band-

width isolation for analog signals.

They are ideal for video isolation

when combined with their

• High Voltage Gain^[1]:

2.0 (HCPL-4562)

application circuit (Figure 4).

High linearity and low phase shift

are achieved through an AlGaAs

LED combined with a high speed

detector. These single channel

optocouplers are available in

8-Pin DIP and Widebody package

configurations.

• Low Drive Current Feedback

Element in Switching Power

Supplies, e.g., for ISDN

Networks

• A/D Converter Signal

Isolation

• Analog Signal Ground

Isolation

• High Voltage Insulation

3.0 (HCNW4562)

• Low G_VTemperature

Coefficient: -0.3%/°C

• Highly Linear at Low Drive

Currents

• High-Speed AlGaAs Emitter

• Safety Approval

UL Recognized - 3750 V rms

for 1 minute (5000 V rms for

1 minute for HCPL-

4562#020 and HCNW4562)

per UL 1577

Functional Diagram

CSA Approved

IEC/EN/DIN EN 60747-5-2

Approved

-V_IORM= 1414 V peak for

HCNW4562

• Available in 8-Pin DIP and

Widebody Packages

ANODE

CATHODE

GND

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

Selection Guide

Single Channel Packages

8-Pin DIP

(300 Mil)

Widebody

(400 Mil)

HCPL-4562

HCNW4562

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-4562#XXXX

020 = UL 5000 V rms/1 Minute Option*

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

XXXE = Lead Free Option

Option data sheets are available. Contact your Agilent sales representative or authorized distributor for

information.

*For HCPL-4562 only.

†Gull wing surface mount option applies to through hole parts only.

Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July

2001 and lead free option will use “-”

Schematic

ANODE

–

CATHODE

GND

Package Outline Drawings

8-Pin DIP Package (HCPL-4562)

7.63 0.35

(0.ꢀ00 0.010ꢁ

9.65 0.35

(0.ꢀ80 0.010ꢁ

6.ꢀ5 0.35

(0.350 0.010ꢁ

TYPE NUMBER

OPTION CODE*

DATE CODE

A XXXXZ

YYWW

U R

ꢀ

RECOGNITION

1.78 (0.070ꢁ MAX.

1.19 (0.047ꢁ MAX.

+ 0.076

- 0.051

0.354

5° TYP.

+ 0.00ꢀꢁ

- 0.003ꢁ

ꢀ.56 0.1ꢀ

(0.140 0.005ꢁ

(0.010

4.70 (0.185ꢁ MAX.

0.51 (0.030ꢁ MIN.

3.93 (0.115ꢁ MIN.

DIMENSIONS IN MILLIMETERS AND (INCHESꢁ.

1.080 0.ꢀ30

(0.04ꢀ 0.01ꢀꢁ

0.65 (0.035ꢁ MAX.

* MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 030

OPTION NUMBERS ꢀ00 AND 500 NOT MARKED.

3.54 0.35

(0.100 0.010ꢁ

NOTE: FLOATING LEAD PROTRUSION IS 0.35 mm (10 milsꢁ MAX.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4562)

LAND PATTERN RECOMMENDATION

9.65 0.35

1.016 (0.040ꢁ

(0.ꢀ80 0.010ꢁ

6.ꢀ50 0.35

(0.350 0.010ꢁ

10.9 (0.4ꢀ0ꢁ

3.0 (0.080ꢁ

ꢀ

1.37 (0.050ꢁ

9.65 0.35

1.780

(0.070ꢁ

MAX.

(0.ꢀ80 0.010ꢁ

1.19

(0.047ꢁ

MAX.

7.63 0.35

(0.ꢀ00 0.010ꢁ

+ 0.076

0.354

- 0.051

ꢀ.56 0.1ꢀ

(0.140 0.005ꢁ

+ 0.00ꢀꢁ

- 0.003ꢁ

(0.010

1.080 0.ꢀ30

(0.04ꢀ 0.01ꢀꢁ

0.6ꢀ5 0.35

(0.035 0.010ꢁ

13° NOM.

0.6ꢀ5 0.1ꢀ0

(0.035 0.005ꢁ

3.54

(0.100ꢁ

BSC

DIMENSIONS IN MILLIMETERS (INCHESꢁ.

LEAD COPLANARITY = 0.10 mm (0.004 INCHESꢁ.

NOTE: FLOATING LEAD PROTRUSION IS 0.35 mm (10 milsꢁ MAX.

8-Pin Widebody DIP Package (HCNW4562)

11.00

(0.4ꢀꢀꢁ

11.15 0.15

(0.443 0.006ꢁ

MAX.

9.00 0.15

(0.ꢀ54 0.006ꢁ

TYPE NUMBER

DATE CODE

HCNWXXXX

YYWW

ꢀ

10.16 (0.400ꢁ

TYP.

1.55

(0.061ꢁ

MAX.

7° TYP.

+ 0.076

- 0.0051

0.354

+ 0.00ꢀꢁ

- 0.003ꢁ

(0.010

5.10

(0.301ꢁ

MAX.

ꢀ.10 (0.133ꢁ

ꢀ.90 (0.154ꢁ

0.51 (0.031ꢁ MIN.

3.54 (0.100ꢁ

TYP.

1.78 0.15

(0.070 0.006ꢁ

0.40 (0.016ꢁ

0.56 (0.033ꢁ

DIMENSIONS IN MILLIMETERS (INCHESꢁ.

NOTE: FLOATING LEAD PROTRUSION IS 0.35 mm (10 milsꢁ MAX.

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4562)

11.15 0.15

(0.443 0.006ꢁ

LAND PATTERN RECOMMENDATION

9.00 0.15

(0.ꢀ54 0.006ꢁ

1ꢀ.56

(0.5ꢀ4ꢁ

ꢀ

3.39

1.ꢀ

(0.09ꢁ

(0.051ꢁ

13.ꢀ0 0.ꢀ0

1.55

(0.061ꢁ

MAX.

(0.484 0.013ꢁ

11.00

MAX.

(0.4ꢀꢀꢁ

4.00

MAX.

(0.158ꢁ

1.78 0.15

(0.070 0.006ꢁ

1.00 0.15

(0.0ꢀ9 0.006ꢁ

0.75 0.35

(0.0ꢀ0 0.010ꢁ

+ 0.076

- 0.0051

3.54

(0.100ꢁ

BSC

0.354

+ 0.00ꢀꢁ

- 0.003ꢁ

(0.010

DIMENSIONS IN MILLIMETERS (INCHESꢁ.

7° NOM.

LEAD COPLANARITY = 0.10 mm (0.004 INCHESꢁ.

NOTE: FLOATING LEAD PROTRUSION IS 0.35 mm (10 milsꢁ MAX.

Solder Reflow Temperature Profile

ꢀ00

PREHEATING RATE ꢀ°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 3.5°C 0.5°C/SEC.

PEAK

TEMP.

345°C

PEAK

TEMP.

340°C

PEAK

TEMP.

3ꢀ0°C

300

3.5°C 0.5°C/SEC.

SOLDERING

TIME

ꢀ0

160°C

150°C

140°C

300°C

SEC.

ꢀ0

SEC.

ꢀ°C + 1°C/–0.5°C

100

PREHEATING TIME

150°C, 90 + ꢀ0 SEC.

50 SEC.

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

100

150

300

350

TIME (SECONDSꢁ

Recommended Pb-Free IR Profile

TIME WITHIN 5 °C of ACTUAL

PEAKTEMPERATURE

30-40 SEC.

360 +0/-5 °C

317 °C

RAMP-UP

ꢀ °C/SEC. MAX.

150 - 300 °C

RAMP-DOWN

6 °C/SEC. MAX.

smax

smin

60 to 150 SEC.

PREHEAT

60 to 180 SEC.

t 35 °C to PEAK

TIME

NOTES:

THE TIME FROM 35 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

= 300 °C, T = 150 °C

smax

smin

Regulatory Information

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01

The devices contained in this data

sheet have been approved by the

following organizations:

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

(HCNW4562 only)

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

8-Pin DIP Widebody

(300 Mil)

Value

(400 Mil)

Value

Parameter

Symbol

Units

Conditions

Minimum External

Air Gap (External

Clearance)

Minimum External

Tracking (External

Creepage)

Minimum Internal

Plastic Gap

(Internal Clearance)

L(101)

7.1

9.6

10.0

1.0

Measured from input terminals to

output terminals, shortest distance

through air.

Measured from input terminals to

output terminals, shortest distance

path along body.

Through insulation distance,

conductor to conductor, usually the

direct distance between the photo-

emitter and photodetector inside the

optocoupler cavity.

L(102)

7.4

0.08

Minimum Internal

Tracking (Internal

Creepage)

Tracking Resistance

(Comparative

Tracking Index)

Isolation Group

200

IIIa

4.0

200

IIIa

Measured from input terminals to

output terminals, along internal cavity.

CTI

Volts

DIN IEC 112/VDE 0303 Part 1

Material Group

(DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW4562 ONLY)

Description

Symbol Characteristic Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤ 600 V rms

for rated mains voltage ≤ 1000 V rms

Climatic Classification

I-IV

I-III

55/85/21

Pollution Degree (DIN VDE 0110/1.89)

Maximum Working Insulation Voltage

Input to Output Test Voltage, Method b*

IORM

1414

V peak

_IORMx 1.875 = V_PR, 100% Production Test with t_m= 1 sec,

V_PR

2652

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

V_IORMx 1.5 = V_PR, Type and sample test,

2121

8000

V peak

t_m= 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*

(Transient Overvoltage, t_ini= 10 sec)

IOTM

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Figure 17, Thermal Derating curve.)

Case Temperature

Input Current

Output Power

T_S

I_S,INPUT

P_S,OUTPUT

150

400

700

°C

Insulation Resistance at T_S, V = 500 V

R_S

≥ 10⁹

Ω

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN

60747-5-2, for a detailed description.

Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in

application.

Absolute Maximum Ratings

Parameter

Storage Temperature

Symbol

T_S

Device

Min.

-55

Max. Units Note

125

°C

Operating Temperature

T_A

-40

Average Forward Input Current

I_F(avg)

HCPL-4562

HCNW4562

HCPL-4562

HCNW4562

HCPL-4562

HCNW4562

Peak Forward Input Current

I_F(PEAK)

18.6

Effective Input Current

I_F(EFF)

V_R

12.9 mA rms

Reverse LED Input Voltage (Pin 3-2)

1.8

Input Power Dissipation

P_IN

Average Output Current (Pin 6)

Peak Output Current (Pin 6)

Emitter-Base Reverse Voltage (Pin 5-7)

Supply Voltage (Pin 8-5)

I_O(AVG)

I_O(PEAK)

EBR

V_CC

V_O

-0.3

Output Voltage (Pin 6-5)

Base Current (Pin 7)

I_B

°C

Output Power Dissipation

P_O

T_LS

100

260

Lead Solder Temperature

1.6 mm Below Seating Plane, 10 Seconds

up to Seating Plane, 10 Seconds

HCPL-4562

HCNW4562

260

°C

Reflow Temperature Profile

T_RP

Option

300

See Package Outline

Drawings Section

Recommended Operating Conditions

Parameter

Symbol

T_A

Device

Min.

Max.

Units

°C

Note

Operating Temperature

Quiescent Input Current

HCPL-4562

HCNW4562

HCPL-4562

HCNW4562

-10

I_FQ

Peak Input Current

I_F(PEAK)

Electrical Specifications (DC)

T_A= 25°C, I_F= 6 mA for HCPL-4562 and I_F= 10 mA for HCNW4562 (i.e., Recommended I_FQ) unless

otherwise specified.

Parameter

Symbol

Device

Min. Typ.* Max. Units

Test Conditions

Fig. Note

Base Photo

Current

I_PB

19.2

µA I_F= 10 mA V_PB≥ 5 V 2, 6

HCPL-4562

I_F= 6 mA

I_PB

∆I_PB/

∆T

-0.3

%/°C 2 mA < I_F< 10 mA,

V_PB≥ 5 V

Temperature

Coefficient

I_PB

HCPL-4562

HCNW4562

0.25

0.15

2 mA < I_F< 10 mA

6 mA < I_F< 14 mA

2, 6

Nonlinearity

Input Forward

Voltage

V_F

HCPL-4562

HCNW4562 1.2

1.1

1.3

1.6

1.8

I_F= 5 mA

I_F= 10 mA

Input Reverse

Breakdown

Voltage

BV_R

HCPL-4562

HCNW4562

1.8

I_R= 10 µA

I_R= 100 µA

Transistor

CurrentGain

h_FE

CTR

V_OUT

160

I_C= 1 mA,

V_CE= 1.25 V

Current

Transfer Ratio

HCPL-4562

HCNW4562

V_CE= 1.25 V,

V_PB≥ 5 V

G_V= 2, V_CC= 9 V

8, 9

DC Output

Voltage

HCPL-4562

HCNW4562

4.25

5.0

Small Signal Characteristics (AC)

T_A= 25°C, I_F= 6 mA for HCPL-4562 and I_F= 10 mA for HCNW4562 (i.e., Recommended I_FO) unless

otherwise specified.

Parameter

Symbol

Device

Min. Typ.* Max. Units

Test Conditions

V_IN= 1 V_P-P

Fig. Note

Voltage Gain

G_V

HCPL-4562 0.8

2.0

3.0

4.2

(0.1 MHz) HCNW4562

G_VTemperature

Coefficient

∆G_V/∆T

-0.3

%/°C V_IN= 1 V_P-P

f_REF= 0.1 MHz

-dB V_IN= 1 V_P-P

f_REF= 0.1 MHz

1, 11

Base Photo

Current

∆i_PB

HCPL-4562

1.1

0.36

3.0

3, 10,

(6 MHz) HCNW4562

Variation

-3 dB Frequency

(i_PB)

i_PB

(-3 dB) HCNW4562

G_VHCPL-4562

(-3 dB) HCNW4562

∆G_VHCPL-4562

HCPL-4562

MHz V_IN= 1 V_P-P

f_REF= 0.1 MHz

MHz V_IN= 1 V_P-P

3, 10,

-3 dB Frequency

(G_V)

1, 11

f_REF= 0.1 MHz

Gain Variation

1.1

0.54

0.8

3.0

-dB T_A= 25°C V = 1 V_P-P

1, 11

(6 MHz) HCNW4562

HCPL-4562

f_REF= 0.1 MHz

T_A= -10°C

T_A= 70°C

1.5

∆G_V

HCPL-4562

1.15

2.27

-dB V_IN= 1 V_P-P,

(10 MHz) HCNW4562

f_REF= 0.1 MHz

Differential

Gain at

f = 3.58 MHz

HCPL-4562

1.0

I_Fac= 0.7 mA p-p,

I_Fdc= 3 to 9 mA

I_Fac= 1 mA p-p,

I_Fdc= 7 to 13 mA

3, 7

HCNW4562

0.9

Differential

Phase at

f = 3.58 MHz

HCPL-4562

HCNW4562

deg. I_Fac= 0.7 mA p-p,

I_Fdc= 3 to 9 mA

0.6

I_Fac= 1 mA p-p,

I_Fdc= 7 to 13 mA

Total Harmonic

Distortion

THD

V_O(noise)

IMRR

HCPL-4562

HCNW4562

2.5

0.75

V_IN= 1 V_P-P

f = 3.58 MHz, G_V= 2

Output Noise

Voltage

950

µVrms 10 Hz to 10 MHz

Isolation Mode

Rejection Ratio

HCPL-4562

HCNW4562

122

119

dB f = 120 Hz, G_V= 2

Package Characteristics

All Typicals at T = 25°C

Parameter

Sym.

Device

Min. Typ.

Max. Units Test Conditions

Fig. Note

Input-Output

Momentary

Withstand

Voltage*

ISO

HCPL-4562 3750

HCNW4562 5000

HCPL-4562 5000

(Option 020)

V rms RH ≤ 50%,

5, 12

5, 13

t = 1 min.,

T = 25°C

Input-Output

Resistance

R_I-O

HCPL-4562

HCNW4562

10¹²

10¹³

Ω

V_I-O= 500 Vdc

10¹²

10¹¹

T = 25°C

T = 100°C

Input-Output

Capacitance

C_I-O

HCPL-4562

HCNW4562

0.6

0.5

f = 1 MHz

0.6

*The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output

continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Related Characteristics Table (if

applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance

Voltage,” publication number 5963-2203E.

Notes:

8. Differential gain is the change in the

small-signal gain of the optocoupler

at 3.58 MHz as the bias level is varied

over a given range.

where V is the isolation mode

voltage signal.

1. When used in the circuit of Figure 1

or Figure 4; G_V= V_OUT/V_IN; I_FQ

6 mA (HCPL-4562), I_FQ= 10 mA

(HCNW4562).

12. In accordance with UL 1577, each

optocoupler is proof tested by

applying an insulation test voltage

≥ 4500 V rms for 1 second (leakage

detection current limit, I_I-O≤ 5 µA).

This test is performed before the

100% Production test shown in the

IEC/EN/DIN EN 60747-5-2 Insulation

Related Characteristics Table, if

applicable.

13. In accordance with UL 1577, each

optocoupler is proof tested by

applying an insulation test voltage

≥ 6000 V rms for 1 second (leakage

detection current limit, I_I-O≤ 5 µA).

This test is performed before the

100% Production test shown in the

IEC/EN/DIN EN 60747-5-2 Insulation

Related Characteristics Table, if

applicable.

9. Differential phase is the change in the

small-signal phase response of the

optocoupler at 3.58 MHz as the bias

level is varied over a given range.

10. TOTAL HARMONIC DISTORTION

(THD) is defined as the square root

of the sum of the square of each

harmonic distortion component. The

THD of the isolated video circuit is

measured using a 2.6 kΩ load in

series with the 50 Ω input impedance

of the spectrum analyzer.

11. ISOLATION MODE REJECTION

RATIO (IMRR), a measure of the

optocoupler’s ability to reject signals

or noise that may exist between input

and output terminals, is defined by

20 log₁₀[(V_OUT/V_IN)/(V_OUT/V_IM)],

2. Derate linearly above 70°C free-air

temperature at a rate of 2.0 mW/°C

(HCPL-4562).

3. Maximum variation from the best fit

line of I_PBvs. I_Fexpressed as a

percentage of the peak-to-peak full

scale output.

4. CURRENT TRANSFER RATIO (CTR)

is defined as the ratio of output

collector current, I_O, to the forward

LED input current, I_F, times 100%.

5. Device considered a two-terminal

device: Pins 1, 2, 3, and 4 shorted

together and Pins 5, 6, 7, and 8

shorted together.

6. Flat-band, small-signal voltage gain.

7. The frequency at which the gain is

3 dB below the flat-band gain.

163 Ω (HCPL-4563ꢁ

90.9 Ω (HCNW4563ꢁ

Figure 1. Gain and Bandwidth Test Circuit.

163 Ω (HCPL-4563ꢁ

90.9 Ω (HCNW4563ꢁ

Figure 2. Base Photo Current Test

Circuit.

Figure 3. Base Photo Current Frequency Response Test Circuit.

Figure 4. Recommended Isolated Video Interface Circuit.

HCNW4563

HCPL-4563

100

–

= 70 °C

1.0

= 35 °C

= -10 °C

0.1

0.01

1.0

1.1

1.3

1.ꢀ

1.4

1.5

– FORWARD VOLTAGE – V

Figure 5. Input Current vs. Forward Voltage.

HCNW4563

HCPL-4563

= 35 °C

ꢀ0

> 5 V

10 13 14 16 18 30

– INPUT CURRENT – mA

Figure 6. Base Photo Current vs. Input Current.

HCPL-4563

HCNW4563

1.03

PHASE

0.98

-1

-3

-ꢀ

0.96

0.94

0.93

NORMALIZED

= 6 mA

GAIN

f = ꢀ.58 MHz

= 35 °C

SEE FIG. ꢀ

10 13 14 16 18 30

– INPUT CURRENT – mA

Figure 7. Small-Signal Response vs. Input Current.

HCNW4563

HCPL-4563

1.04

1.03

1.00

0.98

0.96

0.94

0.93

0.90

0.88

0.86

NORMALIZED

= 35 °C

= 6.0 mA

= 1.35 V

> 5 V

-10

10 30 ꢀ0 40 50 60 70

T – TEMPERATURE – °C

Figure 8. Current Transfer Ratio vs. Temperature.

HCNW4563

HCPL-4563

1.10

1.00

0.90

0.80

0.70

0.60

0.50

= 5.0 V

= 1.35 V

= 0.4 V

NORMALIZED

= 35 °C

= 6 mA

= 1.35 V

> 5 V

10 13 14 16 18 30

– INPUT CURRENT – mA

Figure 9. Current Transfer Ratio vs. Input Current.

HCNW4563

HCPL-4563

-0.9

-1.1

FREQUENCY = 6 MHz

-1.ꢀ

-1.5

-1.7

FREQUENCY = 10 MHz

-1.9

-3.1

= 35 °C

-3.ꢀ

-3.5

-3.7

= 0.1 MHz

REF

ꢀ

9 10 11 13

– QUIESCENT INPUT CURRENT – mA

Figure 10. Base Photo Current Variation vs. Bias Conditions.

HCNW4563

HCPL-4563

ꢀ

= -10 °C

= 35 °C

= 70 °C

-1

-3

-ꢀ

-4

NORMALIZED

= 35 °C

f = 0.1 MHz

-5

-6

-7

0.01 0.1 1.0 10 100 1000 10,000 100,000

f – FREQUENCY – KHz

Figure 11. Normalized Voltage Gain vs. Frequency.

HCNW4563

HCPL-4563

0.5

-0.5

-1.0

NORMALIZED

-1.5

-3.0

-3.5

-ꢀ.0

-ꢀ.5

= 35 °C

f = 0.1 MHz

-4.0

-4.5

0.01 0.1 1.0 10 100 1000 10,000 100,000

f – FREQUENCY – KHz

Figure 12. Normalized Base Photo Current vs. Frequency.

HCNW4563

HCPL-4563

PHASE

SEE FIGURE ꢀ

-35

-50

-75

= 35 °C

-100

-135

-150

-175

VIDEO INTERFACE

CIRCUIT PHASE

SEE FIGURE 4

-300

-335

-350

10 13 14 16 18 30

f – FREQUENCY – MHz

Figure 13. Phase vs. Frequency.

HCNW4563

HCPL-4563

150

130

= 35 °C

-30 dB/DECADE SLOPE

ꢀ0 IMRR = 30 LOG

OUT

0.01 0.1

1.0

100 1000 10,000

f – FREQUENCY – KHz

Figure 14. Isolation Mode Rejection Ratio vs. Frequency.

HCNW4563

HCPL-4563

6.0

5.5

5.0

4.5

4.0

ꢀ.5

ꢀ.0

50 100 150 300 350 ꢀ00 ꢀ50 400 450

– TRANSISTOR CURRENT GAIN

Figure 15. DC Output Voltage vs. Transistor Current Gain.

HCNW4563

1000

(mWꢁ

900

800

700

600

500

400

ꢀ00

300

= 3 mA

(mAꢁ

ADDITIONAL

BUFFER

STAGE

ꢀ

OUT

LOW

IMPEDANCE

LOAD

100

50 75 100 135 150 175

– CASE TEMPERATURE – °C

Figure 16. Output Buffer Stage for

Low Impedance Loads.

Figure 17. Thermal Derating Curve,

Dependence of Safety Limiting Value

with Case Temperature per IEC/EN/

DIN EN 60747-5-2.

Conversion from HCPL-4562 to

HCNW4562

Figure 15 shows the dependency of the DC output

voltage on h_FEX

In order to obtain similar circuit performance when

converting from the HCPL-4562 to the HCNW4562,

it is recommended to increase the Quiescent Input

Current, I_FQ, from 6 mA to 10 mA. If the application

circuit in Figure 4 is used, then potentiometer R4

should be adjusted appropriately.

For 9 V < V_CC< 12 V, select the value of R₁₁such

that

V_O

R₁₁

4.25 V

470 Ω

I_CQ4≅ ––– ≤ –––––– ≤ 9.0 mA

(8)

(9)

The voltage gain of the second stage (Q₃) is

approximately equal to:

Design Considerations of the

Application Circuit

R₁₀

––⁹– –––––––––––––––––––––––––

The application circuit in Figure 4 incorporates

several features that help maximize the bandwidth

performance of the HCPL-4562/HCNW4562. Most

important of these features is peaked response of

the detector circuit that helps extend the frequency

range over which the voltage gain is relatively

constant. The number of gain stages, the overall

circuit topology, and the choice of DC bias points

are all consequences of the desire to maximize

bandwidth performance.

1 + s R₉C_CQ+ –––––––––

2π R′ f_T4

Increasing R′ (R′ includes the parallel

combination of R₁₁and the load impedance) or

reducing R₉(keeping R₉/R₁₀ratio constant) will

improve the bandwidth.

If it is necessary to drive a low impedance load,

bandwidth may also be preserved by adding an

additional emitter following the buffer stage (Q₅in

Figure 16), in which case R₁₁can be increased to

set I_CQ4≅ 2 mA.

To use the circuit, first select R₁to set V_Efor the

desired LED quiescent current by:

V_EG_VV R₁₀

I_FQ= –– ≅ –––––––^E––––––

R₄(∂I_PB/∂I_F) R₇R₉

Finally, adjust R₄to achieve the desired voltage

gain.

(1)

V_OUT∂I_PBR₇R₉

For a constant value V_INp-p, the circuit topology

G_V≅ –––– ≅ –––– ––––––

(10)

(adjusting the gain with R₄) preserves linearity by

keeping the modulation factor (MF) dependent only

on V_E.

∂I_FR₄R₁₀

∂I_PB

where typically –––– = 0.0032

∂I_F

i_Fp-p≅ V /R₄

(2)

p-p

Definition:

G_V= Voltage Gain

i_Fp-p

i_PBp-p

INp-p

p-p

––^p–^-–^p≅ –––^p–^-–^p= –––––

(3)

(4)

I_FQ= Quiescent LED forward current

i_Fp-p= Peak-to-peak small signal LED forward

current

_INp-p= Peak-to-peak small signal input voltage

i_PBp-p= Peak-to-peak small signal

base photo current

I_PBQ= Quiescent base photo current

V_BEX= Base-Emitter voltage of HCPL-4562/

HCNW4562 transistor

I_BXQ= Quiescent base current of HCPL-4562/

HCNW4562 transistor

I_FQ

I_PBQ

V_E

Modulation

Factor (MF): ––––– = –––––

i_F(p-p)

2 I_FQ2 V_E

INp-p

p-p

(p-p)

For a given G_V, V_E, and V_CC, DC output voltage will

vary only with h_FEX

R₁₀

V_O= V_CC– V_BE– ––⁹– [V_BEX– (I_PBQ– I_BXQ) R₇]

(5)

Where:

h_FEX= Current Gain (I_C/I_B) of HCPL-4562/

HCNW4562 transistor

V_E= Voltage across emitter degeneration

resistor R₄

G V_ER

I_PBQ≅ ––^V–––––¹–⁰

R₇R₉

(6)

(7)

and,

= Unity gain frequency of Q₅

T₄

C_CQ= Effective capacitance from collector of Q₃

V_CC– 2 V_BE

I_BXQ≅ ––––––––––

R₆h_FEX

to ground

www.agilent.com/semiconductors

E-mail: SemiconductorSupport@agilent.com

Data subject to change.

Obsoletes 5989-0287EN

March 1, 2005

5989-2158EN

HCPL-4562-320E [AGILENT]

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