HDSP-B66Z-0G400 [AGILENT]

32.9 mm (1.3 inch) General Purpose 5 x 8 Dot Matrix Alphanumeric Displays; 32.9毫米( 1.3英寸)通用5× 8点阵字母数字显示器
HDSP-B66Z-0G400
型号: HDSP-B66Z-0G400
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

32.9 mm (1.3 inch) General Purpose 5 x 8 Dot Matrix Alphanumeric Displays
32.9毫米( 1.3英寸)通用5× 8点阵字母数字显示器

显示器
文件: 总12页 (文件大小:125K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Agilent HDSP-S6xE, HDSP-S6xG,  
HDSP-B6xZ Series 32.9 mm (1.3 inch)  
General Purpose 5 x 8 Dot Matrix  
Alphanumeric Displays  
Data Sheet  
Features  
• 5 x 8 Dot matrix font  
• X-Y stackable  
• Pin-out  
– 28.3 mm (1.114 in.) Dual-In-Line  
(DIP) leads on 2.54 mm (0.1 in.)  
centers  
Description  
These displays have a 32.9 mm  
(1.3 inch) character height. The  
devices are available in either  
common row anode or common row  
cathode configurations. The  
These parts are subjected to Out-  
going Quality Assurance (OQA)  
inspection with an AQL of  
0.065% for functional and visual/  
cosmetic defects.  
• Choice of colors  
– Single color: red or green  
– Bi-color: red and green  
displays come in only black face  
paint and are available in a choice  
of GaP Red (HER) or GaP Green  
colors. The Bi-color display consists  
of HER and green colors.  
• Face paint color: black  
• Design flexibility  
– Common row anode or  
common row cathode  
• Categorized for luminous intensity  
• Green categorized for color  
Applications  
• Suitable for indoor use  
• Not recommended for industrial  
applications, i.e. operating  
Devices  
GaP Red GaP Green  
HDSP-  
temperature requirements  
exceeding 85°C or below –35°C  
HDSP-  
Description  
S61E  
S61G  
32.9 mm Black Surface Common Row Anode  
• Extreme temperature cycling not  
S66E  
S66G  
32.9 mm Black Surface Common Row Cathode  
32.9 mm Black Surface Bi-Color Common Row Anode  
32.9 mm Black Surface Bi-Color Common Row Cathode  
[1]  
recommended  
B61Z  
B66Z  
Note:  
1. For details, please contact your local Agilent components sales office or an authorized distributor.  
Package Dimensions  
(Single Color)  
23.40  
(0.921)  
0.40  
(0.016)  
18.40  
(0.724)  
COL 1  
ROW  
2
3
4
5
1
2
3
4
5
6
7
1.30  
(0.051)  
4.60  
(0.181)  
37.40  
(1.472)  
32.20  
(1.268)  
3.00 (0.118)  
8
1.20  
(0.047)  
4.60  
(0.181)  
37.40  
(1.472)  
PART NO.  
3.26 ± 0.50  
(0.128)  
8.00  
(0.315)  
2.15  
(0.085)  
2.20  
(0.087)  
2.54  
(0.10)  
28.30  
(1.114)  
PIN 1  
0.51  
(0.020)  
2.54 x 6 = 15.24  
(0.1 x 6 = 0.6)  
TOLERANCE: ± 0.25 mm UNLESS OTHERWISE STATED.  
2
Internal Circuit Diagram  
Common Row Anode (Single Color)  
COLUMN  
1
2
3
3
4
5
6
13  
4
11  
10  
PIN  
PIN NO.  
FUNCTION  
ROW  
1
2
ANODE ROW 6  
1
2
3
4
5
6
7
8
9
ANODE ROW 8  
3
CATHODE COLUMN 2  
CATHODE COLUMN 3  
ANODE ROW 5  
4
5
14  
8
6
CATHODE COLUMN 5  
ANODE ROW 7  
7
8
ANODE ROW 3  
9
ANODE ROW 1  
10  
11  
12  
13  
14  
CATHODE COLUMN 4  
CATHODE COLUMN 3  
ANODE ROW 4  
CATHODE COLUMN 1  
ANODE ROW 2  
12  
5
1
7
2
3
Internal Circuit Diagram  
Common Row Cathode (Single Color)  
COLUMN  
1
2
3
3
4
5
6
13  
11  
4
10  
PIN  
PIN NO.  
FUNCTION  
ROW  
1
2
CATHODE ROW 6  
CATHODE ROW 8  
ANODE COLUMN 2  
ANODE COLUMN 3  
CATHODE ROW 5  
ANODE COLUMN 5  
CATHODE ROW 7  
CATHODE ROW 3  
CATHODE ROW 1  
ANODE COLUMN 4  
ANODE COLUMN 3  
CATHODE ROW 4  
ANODE COLUMN 1  
CATHODE ROW 2  
1
2
3
4
5
6
7
8
9
3
4
5
14  
8
6
7
8
9
10  
11  
12  
13  
14  
12  
5
1
7
2
4
Package Dimensions  
(Bi-Color)  
23.40  
(0.921)  
0.40  
(0.016)  
18.40  
(0.724)  
COL 1  
ROW  
2
3
4
5
1
2
3
4
5
6
7
3.00 (0.118)  
1.30  
(0.051)  
32.20  
(1.268)  
37.40  
(1.472)  
4.60  
(0.181)  
8
PIN 1  
4.60  
(0.181)  
1.20 (0.047)  
37.40  
(1.472)  
23.40  
(0.921)  
PART NO.  
8.00  
(0.315)  
2.15  
(0.085)  
2.20  
(0.087)  
0.51 (0.020)  
28.30  
(1.114)  
3.26 ± 0.50  
(0.128)  
2.00  
(0.079)  
2.00 x 8 = 16.00  
(0.079 x 8 = 0.630)  
TOLERANCE: ± 0.25 mm UNLESS OTHERWISE STATED.  
5
Internal Circuit Diagram  
Common Row Cathode (Bi-Color)  
COLUMN  
PIN  
1
2
3
4
5
2
1
16  
3
13  
4
12  
11  
9
10  
ROW  
1
18  
15  
14  
17  
5
2
3
4
5
6
7
8
8
6
7
1. THE SIGN "  
2. THE SIGN "  
" STANDS FOR HER COLOR DICE.  
" STANDS FOR GREEN COLOR DICE.  
PIN NO.  
CONNECTION  
1
2
ANODE COLUMN 1 GREEN  
ANODE COLUMN 1 RED  
ANODE COLUMN 2 GREEN  
ANODE COLUMN 3 GREEN  
CATHODE ROW 5  
3
4
5
6
CATHODE ROW 7  
7
CATHODE ROW 8  
8
CATHODE ROW 6  
9
ANODE COLUMN 5 RED  
ANODE COLUMN 5 GREEN  
ANODE COLUMN 4 GREEN  
ANODE COLUMN 4 RED  
ANODE COLUMN 3 RED  
CATHODE ROW 3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
CATHODE ROW 2  
ANODE COLUMN 2 RED  
CATHODE ROW 4  
CATHODE ROW 1  
6
Internal Circuit Diagram  
Common Row Anode (Bi-Color)  
COLUMN  
PIN  
1
2
3
4
5
2
1
16  
3
13  
4
12  
11  
9
10  
ROW  
1
18  
15  
14  
17  
5
2
3
4
5
6
7
8
8
6
7
1. THE SIGN "  
2. THE SIGN "  
" STANDS FOR HER COLOR DICE.  
" STANDS FOR GREEN COLOR DICE.  
PIN NO.  
CONNECTION  
1
2
CATHODE COLUMN 1 GREEN  
CATHODE COLUMN 1 RED  
CATHODE COLUMN 2 GREEN  
CATHODE COLUMN 3 GREEN  
ANODE ROW 5  
3
4
5
6
ANODE ROW 7  
7
ANODE ROW 8  
8
ANODE ROW 6  
9
CATHODE COLUMN 5 RED  
CATHODE COLUMN 5 GREEN  
CATHODE COLUMN 4 GREEN  
CATHODE COLUMN 4 RED  
CATHODE COLUMN 3 RED  
ANODE ROW 3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
ANODE ROW 2  
CATHODE COLUMN 2 RED  
ANODE ROW 4  
ANODE ROW 1  
7
Absolute Maximum Ratings at T = 25˚C  
A
Parameter  
GaP Red  
GaP Green  
Units  
[1]  
Average Power per Dot  
65  
65  
mW  
[1]  
Peak Forward Current per Dot  
(1/8 Duty Cycle at 10 KHz)  
Average Forward Current per Dot  
Reverse Voltage per Dot  
Operating Temperature  
80  
100  
mA  
mA  
V
[1,2]  
[1,3]  
25  
25  
3
3
–35 to +85  
–35 to +85  
–35 to +85  
–35 to +85  
°C  
°C  
Storage Temperature  
[4]  
Wave Soldering Temperature for 3 seconds  
(2 mm [0.078 in.] below Body)  
250  
250  
°C  
Notes:  
1. Do not exceed maximum average current per dot.  
2. Derate above 25°C at 0.20 mA/°C.  
3. Derate above 25°C at 0.33 mA/°C.  
4. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not to exceed 3 seconds.  
8
Optical/Electrical Characteristics at T = 25˚C  
A
GaP Red  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
I = 40 mA,  
FP  
1/8 Duty Factor  
LuminousIntensity/Dot  
(Digit Average)  
I
0.97  
1.5  
mcd  
v
[1]  
Peak Wavelength  
λ
λ
V
V
632  
622  
2.1  
nm  
nm  
V
I = 20 mA  
peak  
F
S61E  
S66E  
B61Z  
B66Z  
[2]  
Dominant Wavelength  
I = 20 mA  
F
d
F
Forward Voltage  
2.4  
2:1  
I = 20 mA  
F
[3]  
Reverse Voltage  
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
I = 40 mA,  
FP  
1/8 Duty Factor  
v-m  
GaP Green  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
LuminousIntensity/Dot  
(Digit Average)  
I
1.46  
3.0  
mcd  
I = 40 mA,  
FP  
1/8 Duty Factor  
v
[1]  
Peak Wavelength  
λ
λ
V
V
568  
573  
2.3  
nm  
nm  
V
I = 20 mA  
peak  
F
S61G  
S66G  
B61Z  
B66Z  
[2]  
Dominant Wavelength  
I = 20 mA  
F
d
F
Forward Voltage  
2.6  
2:1  
I = 20 mA  
F
[3]  
Reverse Voltage  
3.0  
V
I = 100 µA  
R
R
Luminous Intensity  
Matching Ratio  
I
I = 40 mA,  
FP  
1/8 Duty Factor  
v-m  
Bi-Color  
Devices  
HDSP-  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Test Conditions  
2
Luminance/Dot  
(Digit Average)  
I
Cd/m  
I = 40 mA,  
FP  
1/8 Duty Factor  
B61Z  
B66Z  
v
[1]  
Notes:  
1. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.  
2. The dominant wavelength, λ , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.  
d
3. Typical specification for reference only. Do not exceed absolute maximum ratings.  
9
[1]  
Intensity Bin Limits (mcd at I = 40 mA, 1/8 Duty Factor)  
FP  
GaP Red  
[2]  
[2]  
Bin Name  
Min.  
0.97  
1.46  
2.2  
Max.  
1.45  
2.19  
3.3  
E
F
G
GaP Green  
[2]  
[2]  
Bin Name  
Min.  
1.46  
2.2  
Max.  
2.19  
3.3  
F
G
H
3.31  
4.97  
2
Bi-Color (Cd/m atI =40mA, 1/8DutyFactor)  
FP  
[2]  
[2]  
Bin Name  
Min.  
86  
Max.  
104  
124  
149  
179  
215  
258  
310  
F
G
H
I
104  
124  
149  
179  
215  
258  
J
K
L
Hue Grade  
Bin  
7
Coordinate  
4
5
6
8
9
10  
X
Y
0.542-0.553  
0.445-0.456  
0.552-0.563  
0.435-0.446  
0.562-0.573  
0.425-0.436  
0.572-0.583  
0.415-0.426  
0.582-0.593  
0.405-0.416  
0.592-0.603  
0.395-0.406  
0.602-0.613  
0.385-0.396  
Notes:  
1. Bin categories are established for classification of products. Products may not be available in all bin categories.  
2. Tolerance for each intensity bin limit is ± 10%.  
[1]  
ColorBinLimits(nm)  
GaP Green  
[2]  
[2]  
Bin Name  
Min.  
Max.  
571  
3
569.1  
571.1  
573.1  
4
573  
5
575  
Notes:  
1. Bin categories are established for classification of products. Products may not be available in  
all bin categories.  
2. Tolerance for each color bin limit is ± 1.0 nm.  
1 0  
45  
40  
35  
30  
25  
20  
15  
30  
25  
20  
15  
10  
GaP RED  
GaP RED  
GaP GREEN  
GaP  
GREEN  
10  
5
5
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
10 20 30 40 50 60 70 80 90  
AMBIENT TEMPERATURE – °C  
T
V FORWARD VOLTAGE V  
F
A
Figure 1. Maximum allowable average  
current per dot vs. ambient temperature.  
Figure 2. Forward current vs. forward voltage.  
1.2  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
GaP GREEN  
1.0  
GaP RED  
0.8  
0.6  
0.4  
0.2  
0
0
10 20 30 40 50 60 70 80 90 100  
0
10  
20  
30  
40  
50  
60  
I
PEAK DOT CURRENT mA  
I
PEAK FORWARD CURRENT mA  
PEAK  
PEAK  
Figure 3. Relative efficiency (luminous intensity  
per unit current per dot) vs. peak current per dot.  
Figure 4. Relative luminance vs. peak forward  
current.  
1 1  
Contrast Enhancement  
For information on contrast  
enhancement, please see  
Application Note 1015.  
Soldering/Cleaning  
Cleaning agents from the ketone  
family (acetone, methyl ethyl  
ketone, etc.) and from the  
chlorinated hydrocarbon family  
(methylene chloride, trichloroeth-  
ylene, carbon tetrachloride, etc.)  
are not recommended for cleaning  
LED parts. All of these various  
solvents attack or dissolve the  
encapsulating epoxies used to  
form the package of plastic LED  
parts.  
For information on soldering  
LEDs, please refer to Application  
Note 1027.  
Device Reliability  
For reliability information, please  
see the reliability data sheet  
32.9 mm General Purpose 5 x 8  
Dot Matrix Alphanumeric  
Displays.  
www.agilent.com/semiconductors  
For product information and a complete list of  
distributors, please go to our web site.  
For technical assistance call:  
Americas/Canada: +1 (800) 235-0312 or  
(916) 788-6763  
Europe: +49 (0) 6441 92460  
China: 10800 650 0017  
Hong Kong: (+65) 6756 2394  
India, Australia, New Zealand: (+65) 6755 1939  
Japan: (+81 3) 3335-8152 (Domestic/Interna-  
tional), or 0120-61-1280 (Domestic Only)  
Korea: (+65) 6755 1989  
Singapore, Malaysia, Vietnam, Thailand,  
Philippines, Indonesia: (+65) 6755 2044  
Taiwan: (+65) 6755 1843  
Data subject to change.  
Copyright © 2004 Agilent Technologies, Inc.  
Obsoletes 5988-1744EN  
July 9, 2004  
5988-5214EN  

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