HSMC-H670 [AGILENT]
SINGLE COLOR LED, RED, 1.27mm;
| 型号： | HSMC-H670 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | SINGLE COLOR LED, RED, 1.27mm 光电 |
| 文件： | 总10页 (文件大小：217K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Performance Surface
Mount Flip Chip LEDs
Technical Data
HP SunPower Series
HSMA-H670/H690/H770/
H790/R661/R761
HSMC-H670/H690/H770/
H790/R661/R761
HSML-H670/H690/H770/
H790/R661/R761
Applications
Features
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
• High Brightness AlInGaP
Material
• Improved Reliability
through Elimination of
Internal Wire Bond
• -40 to 85°C Operating
Temperature Range
Description
The HSMx-H670/H770, -H690/
H790, and -R661/R761 combine
high reliability surface mount flip
chip LED construction with HP’s
bright AlInGaP material. These
very small, bright LEDs have a
high luminous efficiency capable
of producing high light output over
a wide range of drive currents. The
590 nm amber, 605 nm orange,
and 626 nm red colors are
• Three Small Package Sizes
• Industry Standard
2.0 x 1.25 mm and
1.6 x 0.8 mm Footprints
H790 has the industry standard
1.6 x 0.8 mm footprint, and its low
0.6 mm profile and wide viewing
angle make this LED excellent for
backlighting applications.
• Right Angle Package
• Three Colors Available
• Diffused Optics
• Compatible with IR and
Through-the-wave Solder
Processes
• Available in 8 mm Tape on
178 mm (7") and 330 mm
(13") Diameter Reels
The HSMx-R661/R761 has a small
2.1 x 1.3 mm footprint and a low
profile 0.7 mm height that makes
this part ideal for LCD backlighting
and sidelighting applications
where space is at a premium. All
packages are compatible with IR
and convective reflow soldering
processes. In addition, these parts
are also compatible with through-
the-wave soldering processes.
available in three compact, low
profile packages.
The HSMx-H670/H770 has the
industry standard 2.0 x 1.25 mm
footprint that is excellent for all
around use. The HSMx-H690/
2
Device Selection Guide
Amber 590 nm
13"
Orange 605 nm
Red 626 nm
13"
13"
Reel
Footprint (mm)[1][2]
1.6 x 0.8 x 0.6
7" Reel
Reel
-H790
-H770
-R761
7" Reel
Reel
-H790
-H770
-R761
7" Reel
HSMA-H690
HSMA-H670
HSMA-R661
HSML-H690
HSML-H670
HSML-R661
HSMC-H690
HSMC-H670
HSMC-R661
-H790
-H770
-R761
2.0 x 1.25 x 1.1
2.1 x 1.3 x 0.7[3]
Notes:
1. Dimensions in mm.
2. Tolerances ± 0.1 mm unless otherwise noted.
3. Right angle package.
Package Dimensions
HSMx-H670 Series
HSMx-H690 Series
POLARITY
POLARITY
CATHODE
MARK
CATHODE
MARK
2.00
(0.079)
0.60
1.00
1.10
(0.043)
1.27
(0.050)
1.25
(0.049)
0.30
0.50 (0.020)
0.45
0.40
(0.016)
0.40
(0.016)
0.80
1.60
BOTTOMSIDE CATHODE MARK
BOTTOMSIDE CATHODE MARK
HSMx-R661 Series
CATHODE
ANODE
POLARITY
2.10
CATHODE
MARK
0.70
EMITTED
DIRECTION
0.30
1.40
R 0.50
SOLDERING
METALLIZATION
1.30
0.80
POLARITY MARK
3
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current[1]
Max. Rating
Units
mA
20
50
5
Power Dissipation
mW
V
Reverse Voltage
(IR = 100 µA)
Operating Temperature Range
Storage Temperature Range[2]
Notes:
-40 to 85
-40 to 85
°C
°C
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at TA = 25°C
Peak
Wavelength
λpeak (nm)
Color, Dominant
Wavelength
λd[2] (nm)
Viewing
Luminous
Efficacy ηv
(lm/W)
1
Angle 2θ /2
Degrees[3]
Typ.
Part No.
Color
Typ.
Typ.
HSMA-H6X0
HSMA-R661
Amber
592
590
605
626
165
165
165
480
370
197
HSML-H6X0
HSML-R661
Orange
Red
607
638
HSMC-H6X0
HSMC-R661
Optical Characteristics at TA = 25°C (Cont’d)
Luminous
Intensity
Iv (mcd)
Luminous
Intensity
Iv (mcd)
Luminous
Intensity
Iv (mcd)
@ IF = 5 mA
@ IF = 20 mA @ IF = 2 mA
Part No.
Color
Min.
Typ.
Typ.
Typ.
HSMA-H6X0
HSMA-R661
Amber
2.5
7.5
35
2.5
HSML-H6X0
HSML-R661
Orange
Red
2.5
2.5
7.5
6.5
35
30
2.5
2.5
HSMC-H6X0
HSMC-R661
Notes:
1. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Operation below IF = 1 mA is not recommended.
4
Electrical Characteristics at TA = 25°C
Forward
Voltage
VF (Volts)
@ IF = 5 mA
Forward
Voltage
VF (Volts)
@ IF = 20 mA
Reverse
Breakdown VR
(Volts)
Capacitance
C (pF)
VF = 0,
f = 1 Mhz
@ IR = 100 µA
Part No.
Color
Typ.
Max.
Typ.
Max.
Min.
Typ.
HSMA-H670
HSMA-H690
HSMA-R661
Amber
1.9
1.9
1.9
2.2
2.2
2.2
2.0
2.0
2.0
2.4
2.4
2.4
5.0
5.0
5.0
20
20
20
HSML-H670
HSML-H690
HSML-R661
HSMC-H670
HSMC-H690
HSMC-R661
Orange
Red
1.9
1.9
1.9
1.8
1.8
1.8
2.2
2.2
2.2
2.2
2.2
2.2
2.0
2.0
2.0
1.9
1.9
1.9
2.4
2.4
2.4
2.4
2.4
2.4
5.0
5.0
5.0
5.0
5.0
5.0
20
20
20
20
20
20
Electrical Characteristics at TA = 25°C (Cont’d)
Thermal
Thermal
Resistance R
θJ-PIN (°C/W)
Resistance R
θJ-A (°C/W)
Part No.
Color
HSMA-H670
HSMA-H690
HSMA-R661
Amber
275
350
350
300
400
400
HSML-H670
HSML-H690
HSML-R661
HSMC-H670
HSMC-H690
HSMC-R661
Orange
Red
275
350
350
275
350
350
300
400
400
300
400
400
1.0
AMBER
ORANGE
RED
0.5
0
550
594 600 607
630
650
700
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
5
5
4
3
2
25
20
15
10
100
50
Rθ
Rθ
= 300°C/W
= 400°C/W
J-A
J-A
20
10
5
2
1
5
0
1
0
0.5
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
– FORWARD VOLTAGE – V
0
20
40
60
80
100
0
5
10
15
20
25
V
T – AMBIENT TEMPERATURE – °C
A
I
– FORWARD CURRENT – mA
F
F
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Relative Iv vs. DC Forward
Current (operation below 1 mA not
recommended).
Figure 4. Maximum DC Current vs.
Ambient Temperature.
0°
1.0
10°
20°
30°
40°
.8
.6
.4
.2
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 5. Intensity vs. Angle for HSMx-H670/H770 and HSMx-H690/H790.
0°
1.0
10°
20°
30°
.8
40°
50°
.6
.4
.2
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 6. Intensity vs. Angle (Horizontal) for HSMx-R661/R761.
6
0°
1.0
10°
20°
30°
.8
.6
.4
.2
40°
50°
60°
70°
80°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
Figure 7. Intensity vs. Angle (Vertical) for HSMx-R661/R761.
0.8 (0.031)
0.80
0.80
0.85
HSMX-H690/H790 SERIES
1.1 (0.043)
0.8
1.0
1.0
1.25
1.25
(0.049)
(0.049)
1.4
1.1
(0.043)
HSMX-H670/H770 SERIES
HSMX-R661/R761 SERIES
Figure 8. Recommended Solder Pad Patterns.
10 SEC. MAX.
10 SEC. MAX.
235°C MAX.
250°C MAX.
PRE-HEAT 140-160°C
3°C/SEC. MAX.
90 SEC. MAX.
ABOVE 183°C
PRE-HEAT 125-145°C
3°C/SEC. MAX.
90 SEC. MAX.
ABOVE 183°C
3°C/SEC. MAX.
3°C/SEC. MAX.
TIME
TIME
Figure 9. Recommended IR Reflow Soldering Profile.
Figure 10. Recommended Wave Solder Profile.
7
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 11. Reeling Orientation.
Ø DIM. A
21.0
(0.83)
2.0
(0.08)
PART NO.
DIM. A
60.0
(2.36)
Ø
HSMX-X6X0 178 mm (7.0 IN.)
HSMX-X7X0 330 mm (13.0 IN.)
13.0
Ø
(0.51)
LABEL
1.5
(0.06)
TYP.
13.0
(0.51)
10.0
(0.39)
Figure 12. Reel Dimensions.
8
1.50 + 0.10
0
(0.059 + 0.004)
0
1.30 ± 0.10
(0.051 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
Ø
CATHODE
0.20 ± 0.05
(0.008 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
2.44 ± 0.10
(0.096 ± 0.004)
8.00 ± 0.30
(0.315 ± 0.012)
1.68 ± 0.10
(0.066 ± 0.004)
USER FEED
DIRECTION
CARRIER TAPE
COVER TAPE
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
Figure 13. Tape Dimensions, HSMx-H670/H770 Series.
END
START
THERE SHALL BE A
MOUNTED WITH THERE SHALL BE A
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
COMPONENTS
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS OF CARRIER
SEALED WITH COVER
TAPE.
AND/OR
COVER TAPE.
Figure 14. Tape Leader and Trailer Dimensions for HSMx-H670/H770 Series.
9
1.50 + 0.10
0
(0.059 + 0.004)
0
0.74 ± 0.10
(0.029 ± 0.004)
Ø
4.00 ± 0.10
(0.157 ± 0.004)
CATHODE
0.20 ± 0.05
(0.008 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
1.87 ± 0.10
(0.074 ± 0.004)
8.00 ± 0.30
(0.315 ± 0.012)
1.07 ± 0.10
(0.040 ± 0.004)
CARRIER TAPE
COVER TAPE
USER FEED
DIRECTION
2.00 ± 0.05
(0.079 ± 0.002)
Figure 15. Tape Dimensions, HSMx-H690/H790 Series.
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 16. Tape Leader and Trailer Dimensions for HSMx-H690/H790 Series.
1.50 + 0.10
0
4.00 ± 0.10
(0.157 ± 0.004)
Ø
1.20
0.20
(0.059 + 0.004)
0
CATHODE
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
2.26
8.00 ± 0.30
(0.315 ± 0.012)
1.47
USER FEED
DIRECTION
Ø1.1
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
Figure 17. Tape Dimensions for HSMx-RX61.
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH THERE SHALL BE A
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
COMPONENTS
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS OF CARRIER
SEALED WITH COVER
TAPE.
AND/OR
COVER TAPE.
Figure 18. Tape Leader and Trailer Dimensions.
www.hp.com/go/led
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Convective IR Reflow
Soldering
For more information on IR reflow
soldering, refer to Application Note
1060, Surface Mounting SMT
LED Indicator Components.
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright © 1999 Hewlett-Packard Co.
Obsoletes 5968-1097E (8/98)
5968-3197E (2/99)
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