HSMP-389TBLKG [AGILENT]
100V, SILICON, PIN DIODE, LEAD FREE, SC-70, 6 PIN;
| 型号： | HSMP-389TBLKG |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | 100V, SILICON, PIN DIODE, LEAD FREE, SC-70, 6 PIN 二极管 |
| 文件： | 总12页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount PIN Diodes
in SOT-323 (SC-70 3-Lead)
Technical Data
HSMP-381B/C/E/F
HSMP-386B/C/E/F
HSMP-389B/C/E/F
HSMP-481B, -482B, -489B
Features
Package Lead Code
Identification
( Top View)
Description/Applications
The HSMP-381B/C/E/F series is
specifically designed for low
distortion attenuator applications.
The HSMP-386B/C/E/F series is a
general purpose PIN diode
designed for low current attenua-
tors and low cost switches. The
HSMP-389B/C/E/F series is
optimized for switching applica-
tions where low resistance at low
current, and low capacitance are
required.
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion Switching
Microwave Frequency
Operation
SERIES
SINGLE
B
C
• Surface Mount SOT-323
( SC-70) Package
COMMON
ANODE
COMMON
CATHODE
Single and Pair Versions
Tape and Reel Options
Available
E
F
DUAL ANODE DUAL CATHODE
• Low Failure in Time ( FIT)
Rate*
The HSMP-48XB series is special
products featuring ultra low
* For more information see the
Surface Mount PIN Reliability
Data Sheet.
parasitic inductance in the SOT-
323 package, specifically designed
for use at frequencies which are
much higher than the upper limit
for conventional SOT-323 PIN
diodes. The HSMP-481B diode is a
low distortion attenuating PIN
designed for operation to 3 GHz.
The HSMP-482B diode is ideal for
limiting and low inductance
482B/489B
481B
Absolute Maximum Ratings[1], TC = + 25°C
Symbol Parameter
Unit Absolute Maximum
If
Forward Current (1 µs Pulse) Amp
1
Piv
TJ
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
V
°C
Same as VBR
150
switching applications up to
1.5 GHz. The HSMP-489B is
optimized for low current switch-
ing applications up to 3 GHz.
TSTG
θjc
°C
-65 to 150
300
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. TC = 25°C, where TC is defined to be the temperature at the package
pins where contact is made to the circuit board.
2
Electrical Specifications, TC = +25°C, each diode
PIN Attenuator Diodes
Minimum Maximum Maximum Minimum Maximum
Part
Package
Breakdown
Voltage
Total
Total
High
Low
Number Marking Lead
Resistance Capacitance Resistance Resistance
RT (Ω)
HSMP- Code[1] Code Configuration
VBR ( V)
CT ( pF)
RH (Ω)
RL (Ω)
381B
381C
381E
381F
E0
E2
E3
E4
B
C
E
F
Single
Series
Common Anode
Common Cathode
100
3.0
0.35
1500
10
Test Conditions
VR = VBR IF = 100 mA VR = 50 V IR = 0.01 mA IF = 20 mA
Measure f = 100 MHz f = 1 MHz f = 100 MHz f = 100 MHz
IR ≤ 10 µA
PIN General Purpose Diodes
Minimum
Breakdown
Voltage
Typical
Total
Resistance
RT (Ω)
Typical
Total
Capacitance
CT ( pF)
Part
Package
Number Marking
HSMP-
Lead
Code
Code[1]
Configuration
VBR (V)
386B
386C
386E
386F
L0
L2
L3
L4
B
C
E
F
Single
Series
Common Anode
Common Cathode
50
3.0
1.5*
0.20
Test Conditions
VR = VBR
Measure
IR ≤ 10 µA
IF = 10 mA
f = 100 MHz
IF = 100 mA*
VR = 50 V
f = 1 MHz
PIN Switching Diodes
Minimum
Breakdown
Voltage
Maximum
Total
Resistance
RT (Ω)
Maximum
Total
Capacitance
CT ( pF)
Part
Package
Number Marking
HSMP-
Lead
Code
Code[1]
Configuration
VBR (V)
389B
389C
389E
389F
G0
G2
G3
G4
B
C
E
F
Single
Series
Common Anode
Common Cathode
100
2.5
0.30
Test Conditions
VR = VBR
Measure
IF = 5 mA
f = 100 MHz
VR = 5 V
f = 1 MHz
IR ≤ 10 µA
3
Electrical Specifications, TC = +25°C, each diode, continued
Typical Parameters
Part Number Total Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance
HSMP-
RT ( Ω)
τ ( ns)
Trr ( ns)
( pF)
381A Series
386A Series
389A Series
75
22
3.8
1500
500
200*
300
80
—
0.27
0.20
—
Test Conditions
IF = 1 mA
f = 100 MHz
IF = 50 mA
TR = 250 mA
IF = 10 mA*
IR = 6 mA*
VR = 10 V
IF = 20 mA
90% Recovery
50 V
Note:
1. Package marking code is laser marked.
High Frequency ( Low Inductance, 500 MHz–3 GHz PIN Diodes
Minimum Maximum
Typical
Total
Maximum
Total
Typical
Total
Part
Package
Breakdown
Voltage
Series
Number Marking
Resistance Capacitance Capacitance Inductance
HSMP-
Code Configuration VBR (V)
RS (Ω)
CT (pF)
CT (pF)
LT ( nH) Application
481B
482B
489B
EB
FA
GA
Dual Cathode
Dual Anode
Dual Anode
100
50
100
3.0
0.6*
2.5**
0.35
0.75*
0.33**
0.4
1.0
0.375*
1.0
1.0*
1.0
Attenuator
Limiter
Switch
Test Conditions
VR = VBR IF = 100 mA
Measure
IR ≤ 10 µA IF = 5 mA** VR = 20V*
VR = 50V
IF = 10 mA* f = 1 MHz
VR = 50V f=500 MHz–
f = 1 MHz
VR = 5 V*
3 GHz
VR = 20V*
VR = 5 V**
4
Typical Performance, TC = 25°C
0.45
0.40
0.35
0.30
0.25
0.20
0.35
10000
1000
100
10
HSMP-381B/C/E/F, -481B
0.30
1 MHz
1 MHz
HSMP-
386B/C/E/F
0.25
0.20
100 MHz
1 GHz
30 MHz
HSMP-482B
1
frequency>100 MHz
HSMP-389B/C/E/F, -489B
0.1
0.01
0.15
0.15
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
0.1
1
10
100
I
– FORWARD BIAS CURRENT (mA)
REVERSE VOLTAGE (V)
REVERSE VOLTAGE (V)
F
Figure 3. Total RF Resistance at
25° C vs. Forward Bias Current.
Figure 1. RF Capacitance vs. Reverse
Bias, HSMP-381B/C/E/F Series.
Figure 2. RF Capacitance vs. Reverse
Bias, HSMP-386B/C/E/F Series.
1.4
120
10000
TA = +85°C
TA = +25°C
TA = –55°C
Diode Mounted as a
Series Attenuator in
a 50Ω Microstrip and
Tested at 123 MHz
HSMP-381B/C/E/F
110
1.2
1
HSMP-386B/C/E/F
HSMP-389B/C/E/F
100
1000
HSMP-482B
90
80
0.8
0.6
0.4
0.2
0
100
10
70
HSMP-381B/C/E/F
60
50
40
1.0
0.01
0
10
20
30
40
50
0.1
1
10
100
1000
100
10
I
– FORWARD BIAS CURRENT (mA)
V
– REVERSE VOLTAGE (V)
DIODE RF RESISTANCE (OHMS)
F
R
Figure 4. RF Resistance vs. Forward
Bias Current for HSMP-381B/C/E/F
Series and HSMP-481B.
Figure 5. Capacitance vs. Reverse
Voltage at 1 MHz.
Figure 6. 2nd Harmonic Input
Intercept Point vs. Diode RF
Resistance for Attenuator Diodes.
120
100
1000
100
10
Diode Mounted as a
Series Switch in
a 50Ω Microstrip and
Tested at 123 MHz
115
110
105
100
95
V
R = 2V
V
V
= 5V
R
R
VR = 5V
= 10V
HSMP-389B/C/E/F
10
VR = 10V
V
= 20V
R
90
HSMP-386B/C/E/F
10 30
– FORWARD BIAS CURRENT (mA)
85
1
10
10
20
FORWARD CURRENT (mA)
30
20
FORWARD CURRENT (mA)
30
1
I
F
Figure 9. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-386B/C/E/F Series.
Figure 7. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current for Switch Diodes.
Figure 8. Reverse Recovery Time vs.
Forward Current for Various Reverse
Voltages. HSMP-482B.
5
Typical Performance, TC = 25°C
200
100
100
160
10
10
1
V
= –2V
R
120
80
1
V
= –5V
R
0.1
0.01
0.1
40
0
V
= –10V
R
–50°C
125°C 25°C
0.4 0.6
125°C
0.2 0.4
– FORWARD VOLTAGE (mA)
25°C –50°C
0.01
10
15
20
25
30
0
0.6 0.8
1.0 1.2
0
0.2
0.8
1.0 1.2
FORWARD CURRENT (mA)
V
V
– FORWARD VOLTAGE (mA)
F
F
Figure 10. Typical Reverse Recovery
Time vs. Reverse Voltage. ꢀ
HSMP-389B/C/E/F Series.
Figure 11. Forward Current vs.
Forward Voltage. HSMP-381B/C/E/F
Series and HSMP-481B.
Figure 12. Forward Current vs.
Forward Voltage. HSMP-482B.
100
10
100
10
1
1
0.1
0.1
125°C
0.2 0.4
–50°C
25°C
25°C –50°C
125°C
0.4
– FORWARD VOLTAGE (V)
0.01
0.01
0
0.6
0.8
1.0 1.2
0
0.2
0.6
0.8
1.0 1.2
V
– FORWARD VOLTAGE (V)
F
V
F
Figure 13. Forward Current vs.
Forward Voltage. HSMP-386B/C/E/F
Series.
Figure 14. Forward Current vs.
Forward Voltage. HSMP-389B/C/E/F
Series and HSMP-489B.
6
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1
RF 2
RF 1
RF 2
BIAS 1
BIAS 2
BIAS
BIAS
Figure 15. Simple SPDT Switch, Using Only Positive ꢀ
Bias Current.
Figure 16. High Isolation SPDT Switch.
RF COMMON
RF COMMON
BIAS
RF 1
RF 2
RF 2
RF 1
BIAS
Figure 17. SPDT Switch Using Both Positive and ꢀ
Negative Bias Current.
Figure 18. Very High Isolation SPDT Switch.
7
Typical Applications for Multiple Diode Products (continued)
VARIABLE BIAS
RF IN/OUT
INPUT
FIXED
BIAS
VOLTAGE
Figure 19. Four Diode π Attenuator.
BIAS
Figure 20. High Isolation SPST Switch ꢀ
( Repeat Cells as Required) .
8
Typical Applications for HSMP-48XX Low Inductance Series
3
3
Microstrip Series
Connection for
HSMP-48XB Series
In order to take full advantage of
the low inductance of the
HSMP-48XB series when using
them in series applications, both
lead 1 and lead 2 should be
connected together, as shown in
Figure 21.
1
2
1
2
HSMP-481B
HSMP-489B
Figure 21. Internal Connections.
Figure 22. Circuit Layout.
50 OHM MICROSTRIP LINES
Microstrip Shunt
Connections for
HSMP-48XB Series
In Figure 23, the center conductor
of the microstrip line is inter-
rupted and leads 1 and 2 of the
HSMP-48XB series diode are
placed across the resulting gap.
This forces the 0.5 nH lead induc-
tance of leads 1 and 2 to appear as
part of a low pass filter, reducing
the shunt parasitic inductance and
increasing the maximum available
attenuation. The 0.3 nH of shunt
inductance external to the diode is
created by the via holes, and is a
good estimate for 0.032" thick
material.
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
Figure 23. Circuit Layout.
1.5 nH
1.5 nH
0.3 pF*
0.3 nH
0.3 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 24. Equivalent Circuit.
9
Typical Applications for HSMP-48XX Low Inductance Series (continued)
Co-Planar Waveguide
Shunt Connection for
HSMP-48XB Series
Co-Planar waveguide, with ground
on the top side of the printed
circuit board, is shown in
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane
Figure 25. Since it eliminates the
need for via holes to ground, it
offers lower shunt parasitic
inductance and higher maximum
attenuation when compared to a
microstrip circuit.
Figure 25. Circuit Layout.
0.3 pF*
0.75 nH
*0.8 pF TYPICAL FOR HSMP-482B
Figure 26. Equivalent Circuit.
10
SMT Assembly
passes through one or more
Assembly Information
SOT-323 PCB Footprint
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 27
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair performance.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
0.026
0.07
reflow zone (T
exceed 235 °C.
) should not
MAX
0.035
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 28. This
profile is representative of an IR
reflow type of surface mount
assembly process.
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
0.016
Figure 27. PCB Pad Layout
( dimensions in inches) .
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
250
200
TMAX
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Figure 28. Surface Mount Assembly Profile.
11
Device Orientation
REEL
TOP VIEW
4 mm
END VIEW
8 mm
CARRIER
TAPE
##
##
##
##
USER
FEED
DIRECTION
Note: “##” represents Package Marking Code.
COVER TAPE
Tape Dimensions
For Outline SOT-323 ( SC-70 3 Lead)
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
8° MAX.
5° MAX.
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
2.24 ± 0.10
2.34 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.088 ± 0.004
0.092 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
1
0
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE WIDTH
THICKNESS
W
8.00 ± 0.30
0.315 ± 0.012
t
0.255 ± 0.013 0.010 ± 0.0005
5.4 ± 0.10 0.205 ± 0.004
0.062 ± 0.001 0.0025 ± 0.00004
1
COVER TAPE
WIDTH
C
TAPE THICKNESS
T
t
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2
2.00 ± 0.05
0.079 ± 0.002
Package Dimensions
Outline SOT-323 ( SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.20 (0.008)
0.10 (0.004)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ........................................................................................ Copper
Lead Finish .............................................................................Tin-Lead 85/15%
Maximum Soldering Temperature ............................... 260°C for 5 seconds
Minimum Lead Strength ........................................................... 2 pounds pull
Typical Package Inductance ................................................................... 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Ordering Information
Specify part number followed by option. For example:
HSMP- 38XA – XXX
www.hp.com/go/rf
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Bulk or Tape and Reel Option
Part Number
Americas/Canada: 1-800-235-0312 or
408-654-8675
Surface Mount PIN
Hewlett-Packard
Far East/Australasia: Call your local HP
sales office.
Option – BLK = Bulk, 100 pcs. per antistatic bag
Japan: (81 3) 3335-8152
Option – TR1 = Tape and Reel, 3000 devices per 7" reel
Europe: Call your local HP sales office.
Conforms to Electronic Industries RS-481, “Taping of Surface Mounted
Components for Automated Placement.” Standard Quantity is
3,000 Devices per Reel.
Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5966-2323E
Printed in U.S.A.
5967-6070E (5/98)
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