HSMP-489F-TR2 [AGILENT]
Surface Mount RF PIN Switch Diodes; 表面贴装射频PIN二极管开关型号: | HSMP-489F-TR2 |
厂家: | AGILENT TECHNOLOGIES, LTD. |
描述: | Surface Mount RF PIN Switch Diodes |
文件: | 总12页 (文件大小:162K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount RF PIN
Switch Diodes
Technical Data
HSMP-389x Series
HSMP-489x Series
Pin Connections and
Package Marking
Features
Description/Applications
The HSMP-389x series is
• Unique Configurations in
Surface Mount Packages
– Add Flexibility
optimized for switching applica-
tions where low resistance at low
current and low capacitance are
required. The HSMP-489x series
products feature ultra low
parasitic inductance. These
products are specifically
designed for use at frequencies
which are much higher than the
upper limit for conventional PIN
diodes.
1
2
3
6
5
4
– Save Board Space
– Reduce Cost
• Switching
– Low Capacitance
– Low Resistance at Low
Current
Notes:
1. Package marking provides
orientation, identification, and
date code.
2. See “Electrical Specifications” for
appropriate package marking.
• Low Failure in Time (FIT)
Rate[1]
• Matched Diodes for
Consistent Performance
• Better Thermal
Conductivity for Higher
Power Dissipation
• Lead-free Option Available
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
2
Package Lead Code
Identification, SOT-23/143 Identification, SOT-323
(Top View)
Package Lead Code
Package Lead Code
Identification, SOT-363
(Top View)
(Top View)
SERIES
#2
UNCONNECTED
DUAL SWITCH
SINGLE
SERIES
SINGLE
TRIO
MODEL
6
5
4
6
5
4
#0
B
C
1
2
3
1
2
3
R
L
COMMON
ANODE
COMMON
CATHODE
COMMON
ANODE
COMMON
CATHODE
LOW
INDUCTANCE
SINGLE
SERIES–
SHUNT PAIR
6
5
4
6
5
4
E
#3
F
#4
1
2
3
1
2
3
DUAL ANODE
UNCONNECTED
PAIR
T
U
DUAL ANODE
HIGH
FREQUENCY
SERIES
6
5
4
489B
4890
#5
1
2
3
V
Absolute Maximum Ratings[1] TC = +25°C
ESD WARNING:
Handling Precautions Should Be
Taken To Avoid Static Discharge.
Symbol Parameter
Unit SOT-23/143 SOT-323/363
If
Forward Current (1 µs Pulse) Amp
1
100
1
100
PIV
Tj
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
V
°C
°C
150
150
Tstg
θjc
-65 to 150
500
-65 to 150
150
°C/W
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where
contact is made to the circuit board.
3
Electrical Specifications, TC = 25°C, each diode
Package
Minimum
Maximum
Maximum
Part Number Marking Lead
Breakdown
Series Resistance Total Capacitance
HSMP-
Code
Code Configuration
Voltage VBR (V)
RS (Ω)
CT (pF)
3890
3892
3893
3894
3895
389B
389C
389E
389F
389L
389R
389T
389U
389V
G0[1]
G2[1]
G3[1]
G4[1]
G5[1]
G0[2]
G2[2]
G3[2]
G4[2]
GL[2]
S[2]
0
2
3
4
5
B
C
E
F
L
R
T
U
V
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Single
100
2.5
0.30
Series
Common Anode
Common Cathode
Unconnected Trio
Dual Switch Mode
Low Inductance Single
Series-Shunt Pair
High Frequency Series Pair
Z[2]
GU[2]
GV[2]
Test Conditions
VR = VBR
Measure
IR ≤ 10 µA
IF = 5 mA
f = 100 MHz
VR = 5 V
f = 1 MHz
Notes:
1. Package marking code is white.
2. Package is laser marked.
High Frequency (Low Inductance, 500 MHz–3 GHz) PIN Diodes
Minimum
Breakdown
Voltage
Maximum
Series
Resistance
RS (Ω)
Typical
Total
Maximum
Total
Typical
Total
Part
Package
Number Marking
HSMP-
Capacitance Capacitance Inductance
CT (pF)
Code[1] Configuration
GA Dual Anode
VBR (V)
CT (pF)
LT (nH)
489x
100
2.5
0.33
0.375
1.0
Test Conditions
VR = VBR
Measure
IR ≤ 10 µA
IF = 5 mA
f = 1 MHz
VR = 5 V
VR = 5 V
f = 1 MHz
f=500 MHz–
3 GHz
Note:
1. SOT-23 package marking code is white; SOT-323 is laser marked.
Typical Parameters at TC = 25°C
Part Number
HSMP-
Series Resistance
Carrier Lifetime
Total Capacitance
RS (Ω)
τ (ns)
CT (pF)
389x
3.8
200
0.20 @ 5V
Test Conditions
IF = 1 mA
f = 100 MHz
IF = 10 mA
IR = 6 mA
4
HSMP-389x Series Typical Performance, TC = 25°C, each diode
100
10
1
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
120
115
110
105
100
95
Diode Mounted as a
Series Attenuator in a
50 Ohm Microstrip and
Tested at 123 MHz
1 MHz
90
1 GHz
4
0.1
0.01
85
0
8
12
16
20
0.1
1
10
100
1
10
30
I
– FORWARD BIAS CURRENT (mA)
V
– REVERSE VOLTAGE (V)
I
– FORWARD BIAS CURRENT (mA)
F
R
F
Figure 3. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current.
Figure 1. Total RF Resistance at 25°C
vs. Forward Bias Current.
Figure 2. Capacitance vs. Reverse
Voltage.
200
160
100
10
1
V
= –2V
R
120
80
V
= –5V
R
0.1
40
0
V
= –10V
R
25°C –50°C
125°C
0.4
– FORWARD VOLTAGE (V)
0.01
10
15
20
25
30
0
0.2
0.6
0.8
1.0 1.2
FORWARD CURRENT (mA)
V
F
Figure 4. Typical Reverse Recovery
Time vs. Reverse Voltage.
Figure 5. Forward Current vs. Forward
Voltage.
Typical Applications for Multiple Diode Products
1
2
3
2
1
0
0
2
+V
–V
“ON”
“OFF”
3
4
2
5
1
6
1
1
3
4
2
5
1
6
0
b1
b2
b3
RF out
RF in
Figure 6. HSMP-389L used in a SP3T Switch.
Figure 7. HSMP-389L Unconnected Trio used in a
Dual Voltage, High Isolation Switch.
5
Typical Applications for Multiple Diode Products (continued)
1
+V
0
2
0
+V
“ON”
“OFF”
RF out
1
1
6
1
5
2
4
3
6
1
5
2
4
3
RF out
RF in
RF in
2
Figure 9. HSMP-389T used in a Low Inductance
Shunt Mounted Switch.
Figure 8. HSMP-389L Unconnected Trio used in a
Positive Voltage, High Isolation Switch.
Bias
Xmtr
Ant
λ
4
C
C
Rcvr
Bias
Xmtr
bias
Ant
λ
4
Bias
Rcvr
Antenna
Xmtr
PA
HSMP-389V
λ
4
λ
4
HSMP-389U
LNA
Rcvr
Figure 11. HSMP-389V Series/Shunt Pair used in a
1.8 GHz Transmit/Receive Switch.
Figure 10. HSMP-389U Series/Shunt Pair used in a
900 MHz Transmit/Receive Switch.
6
Typical Applications for Multiple Diode Products (continued)
RF COMMON
RF COMMON
RF 2
RF 1
RF 1
RF 2
BIAS 1
BIAS 2
BIAS
BIAS
Figure 12. Simple SPDT Switch, Using Only Positive Current.
Figure 13. High Isolation SPDT Switch, Dual Bias.
RF COMMON
RF COMMON
BIAS
RF 1
RF 2
RF 2
RF 1
BIAS
Figure 14. Switch Using Both Positive and Negative Bias
Current.
Figure 15. Very High Isolation SPDT Switch, Dual Bias.
7
50 OHM MICROSTRIP LINES
Co-Planar Waveguide Shunt
Connection for HSMP-489x
Series
Typical Applications for
HSMP-489x Low
Inductance Series
Co-Planar waveguide, with
ground on the top side of the
printed circuit board, is shown in
Figure 20. Since it eliminates the
need for via holes to ground, it
offers lower shunt parasitic
inductance and higher maximum
attenuation when compared to a
microstrip circuit.
Microstrip Series Connection
for HSMP-489x Series
In order to take full advantage of
the low inductance of the
HSMP-489x series when using
them in series applications, both
lead 1 and lead 2 should be
connected together, as shown in
Figure 17.
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
Figure 18. Circuit Layout.
Co-Planar Waveguide
Groundplane
3
Center Conductor
Groundplane
1.5 nH
1.5 nH
0.3 pF
1
2
HSMP-489x
Figure 16. Internal Connections.
0.3 nH
0.3 nH
Figure 20. Circuit Layout.
0.3 pF
Figure 19. Equivalent Circuit.
Figure 17. Circuit Layout.
0.75 nH
Microstrip Shunt Connections
for HSMP-489x Series
Equivalent Circuit Model
HSMP-389x Chip*
Figure 21. Equivalent Circuit.
In Figure 18, the center conductor
of the microstrip line is inter-
rupted and leads 1 and 2 of the
HSMP-489x diode are placed
across the resulting gap. This
forces the 1.5 nH lead inductance
of leads 1 and 2 to appear as part
of a low pass filter, reducing the
shunt parasitic inductance and
increasing the maximum available
attenuation. The 0.3 nH of shunt
inductance external to the diode
is created by the via holes, and is
a good estimate for 0.032" thick
material.
R
R
s
j
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
0.5 Ω
Cj
characteristic, carrier lifetime.
0.12 pF*
* Measured at -20 V
RT = 0.5 + Rj
CT = CP + Cj
20
Rj =
Ω
I0.9
I = Forward Bias Current in mA
* See AN1124 for package models
8
SMT Assembly
passes through one or more
Assembly Information
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
0.026
0.075
0.035
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
0.016
Figure 22. PCB Pad Layout, SOT-363.
(dimensions in inches).
0.026
reflow zone (T
) should not
MAX
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 26. This
profile is representative of an IR
reflow type of surface mount
assembly process.
exceed 235°C.
0.07
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
0.035
0.016
Figure 23. PCB Pad Layout, SOT-323.
(dimensions in inches).
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
0.037
0.95
0.037
0.95
0.079
2.0
250
200
TMAX
0.035
0.9
0.031
0.8
150
inches
DIMENSIONS IN
mm
Reflow
Zone
Figure 24. PCB Pad Layout, SOT-23.
100
Preheat
Zone
Cool Down
Zone
0.112
2.85
50
0
0.079
2
0.033
0.85
0
60
120
180
240
300
0.108
2.75
0.075
1.9
0.041
1.05
TIME (seconds)
0.071
1.8
0.033
0.85
Figure 26. Surface Mount Assembly Profile.
0.047 0.031 0.033
1.2
0.8
0.85
inches
mm
DIMENSIONS IN
Figure 25. PCB Pad Layout, SOT-143.
9
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
1.02 (0.040)
0.89 (0.035)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
0.54 (0.021)
0.37 (0.015)
DATE CODE (X)
PACKAGE
MARKING
CODE (XX)
3
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
X X X
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
X X X
2
1
0.650 BSC (0.025)
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
TOP VIEW
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.20 (0.008)
0.10 (0.004)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
0.92 (0.036)
0.78 (0.031)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
DATE CODE (X)
2
4
1
PACKAGE
MARKING
CODE (XX)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
X X X
X X X
3
0.60 (0.024)
0.45 (0.018)
0.650 BSC (0.025)
0.54 (0.021)
0.37 (0.015)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.15 (0.006)
0.09 (0.003)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
1.04 (0.041)
0.85 (0.033)
1.00 (0.039)
0.80 (0.031)
0.20 (0.008)
0.10 (0.004)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
10°
0.30 (0.012)
0.10 (0.004)
0.25 (0.010)
0.15 (0.006)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material .................... Copper (SOT-323/363); Alloy 42 (SOT-23/143)
Lead Finish............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature.............................. 260°C for 5 seconds
Minimum Lead Strength.......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance ..............................0.08 pF (opposite leads)
10
Ordering Information
Specify part number followed by option. For example:
HSMP
-
389x
-
XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLK = Bulk, 100 pcs. per antistatic bag
-TR1 = Tape and Reel, 3000 devices per 7" reel
-TR2 = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
For lead-free option, the part number will have the character "G" at the
end, eg. -TR2G for a 10K pc lead-free reel.
Device Orientation
For Outlines SOT-23, -323
REEL
TOP VIEW
4 mm
END VIEW
CARRIER
TAPE
8 mm
ABC
ABC
ABC
ABC
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
For Outline SOT-143
For Outline SOT-363
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
8 mm
ABC
ABC
ABC
ABC
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
11
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00 + 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
WIDTH
W
8.00+0.30–0.10 0.315+0.012–0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CENTERLINE
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
0
9° MAX
9° MAX
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00 + 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30–0.10 0.315+0.012–0.004
0.254 0.013
0.0100 0.0005
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
An
An
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
2.40 0.10
2.40 0.10
1.20 0.10
4.00 0.10
1.00 + 0.25
0.094 0.004
0.094 0.004
0.047 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.55 0.05
4.00 0.10
1.75 0.10
0.061 0.002
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
COVER TAPE
DISTANCE
WIDTH
THICKNESS
W
8.00 0.30
0.254 0.02
0.315 0.012
0.0100 0.0008
t
1
WIDTH
TAPE THICKNESS
C
5.4 0.10
0.062 0.001
0.205 0.004
0.0025 0.00004
T
t
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
ANGLE
FOR SOT-323 (SC70-3 LEAD)
FOR SOT-363 (SC70-6 LEAD)
An
8°C MAX
10°C MAX
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Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5968-7701E
March 24, 2004
5989-0486EN
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