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HSMP-489R-BLK [AGILENT]

Surface Mount RF PIN Switch Diodes; 表面贴装射频PIN二极管开关
HSMP-489R-BLK
型号： HSMP-489R-BLK
厂家： AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述：

Surface Mount RF PIN Switch Diodes
表面贴装射频PIN二极管开关

二极管 开关 射频
文件： 总12页 (文件大小：162K)
中文：  中文翻译
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Surface Mount RF PIN  
Switch Diodes  
Technical Data  
HSMP-389x Series  
HSMP-489x Series  
Pin Connections and  
Package Marking  
Features  
Description/Applications  
The HSMP-389x series is  
• Unique Configurations in  
Surface Mount Packages  
– Add Flexibility  
optimized for switching applica-  
tions where low resistance at low  
current and low capacitance are  
required. The HSMP-489x series  
products feature ultra low  
parasitic inductance. These  
products are specifically  
designed for use at frequencies  
which are much higher than the  
upper limit for conventional PIN  
diodes.  
1
2
3
6
5
4
– Save Board Space  
– Reduce Cost  
• Switching  
– Low Capacitance  
– Low Resistance at Low  
Current  
Notes:  
1. Package marking provides  
orientation, identification, and  
date code.  
2. See “Electrical Specifications” for  
appropriate package marking.  
• Low Failure in Time (FIT)  
Rate[1]  
• Matched Diodes for  
Consistent Performance  
• Better Thermal  
Conductivity for Higher  
Power Dissipation  
• Lead-free Option Available  
Note:  
1. For more information see the  
Surface Mount PIN Reliability Data  
Sheet.  
2
Package Lead Code  
Identification, SOT-23/143 Identification, SOT-323  
(Top View)  
Package Lead Code  
Package Lead Code  
Identification, SOT-363  
(Top View)  
(Top View)  
SERIES  
#2  
UNCONNECTED  
DUAL SWITCH  
SINGLE  
SERIES  
SINGLE  
TRIO  
MODEL  
6
5
4
6
5
4
#0  
B
C
1
2
3
1
2
3
R
L
COMMON  
ANODE  
COMMON  
CATHODE  
COMMON  
ANODE  
COMMON  
CATHODE  
LOW  
INDUCTANCE  
SINGLE  
SERIES–  
SHUNT PAIR  
6
5
4
6
5
4
E
#3  
F
#4  
1
2
3
1
2
3
DUAL ANODE  
UNCONNECTED  
PAIR  
T
U
DUAL ANODE  
HIGH  
FREQUENCY  
SERIES  
6
5
4
489B  
4890  
#5  
1
2
3
V
Absolute Maximum Ratings[1] TC = +25°C  
ESD WARNING:  
Handling Precautions Should Be  
Taken To Avoid Static Discharge.  
Symbol Parameter  
Unit SOT-23/143 SOT-323/363  
If  
Forward Current (1 µs Pulse) Amp  
1
100  
1
100  
PIV  
Tj  
Peak Inverse Voltage  
Junction Temperature  
Storage Temperature  
Thermal Resistance[2]  
V
°C  
°C  
150  
150  
Tstg  
θjc  
-65 to 150  
500  
-65 to 150  
150  
°C/W  
Notes:  
1. Operation in excess of any one of these conditions may result in permanent damage to  
the device.  
2. TC = +25°C, where TC is defined to be the temperature at the package pins where  
contact is made to the circuit board.  
3
Electrical Specifications, TC = 25°C, each diode  
Package  
Minimum  
Maximum  
Maximum  
Part Number Marking Lead  
Breakdown  
Series Resistance Total Capacitance  
HSMP-  
Code  
Code Configuration  
Voltage VBR (V)  
RS (Ω)  
CT (pF)  
3890  
3892  
3893  
3894  
3895  
389B  
389C  
389E  
389F  
389L  
389R  
389T  
389U  
389V  
G0[1]  
G2[1]  
G3[1]  
G4[1]  
G5[1]  
G0[2]  
G2[2]  
G3[2]  
G4[2]  
GL[2]  
S[2]  
0
2
3
4
5
B
C
E
F
L
R
T
U
V
Single  
Series  
Common Anode  
Common Cathode  
Unconnected Pair  
Single  
100  
2.5  
0.30  
Series  
Common Anode  
Common Cathode  
Unconnected Trio  
Dual Switch Mode  
Low Inductance Single  
Series-Shunt Pair  
High Frequency Series Pair  
Z[2]  
GU[2]  
GV[2]  
Test Conditions  
VR = VBR  
Measure  
IR ≤ 10 µA  
IF = 5 mA  
f = 100 MHz  
VR = 5 V  
f = 1 MHz  
Notes:  
1. Package marking code is white.  
2. Package is laser marked.  
High Frequency (Low Inductance, 500 MHz–3 GHz) PIN Diodes  
Minimum  
Breakdown  
Voltage  
Maximum  
Series  
Resistance  
RS (Ω)  
Typical  
Total  
Maximum  
Total  
Typical  
Total  
Part  
Package  
Number Marking  
HSMP-  
Capacitance Capacitance Inductance  
CT (pF)  
Code[1] Configuration  
GA Dual Anode  
VBR (V)  
CT (pF)  
LT (nH)  
489x  
100  
2.5  
0.33  
0.375  
1.0  
Test Conditions  
VR = VBR  
Measure  
IR ≤ 10 µA  
IF = 5 mA  
f = 1 MHz  
VR = 5 V  
VR = 5 V  
f = 1 MHz  
f=500 MHz–  
3 GHz  
Note:  
1. SOT-23 package marking code is white; SOT-323 is laser marked.  
Typical Parameters at TC = 25°C  
Part Number  
HSMP-  
Series Resistance  
Carrier Lifetime  
Total Capacitance  
RS (Ω)  
τ (ns)  
CT (pF)  
389x  
3.8  
200  
0.20 @ 5V  
Test Conditions  
IF = 1 mA  
f = 100 MHz  
IF = 10 mA  
IR = 6 mA  
4
HSMP-389x Series Typical Performance, TC = 25°C, each diode  
100  
10  
1
0.55  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
120  
115  
110  
105  
100  
95  
Diode Mounted as a  
Series Attenuator in a  
50 Ohm Microstrip and  
Tested at 123 MHz  
1 MHz  
90  
1 GHz  
4
0.1  
0.01  
85  
0
8
12  
16  
20  
0.1  
1
10  
100  
1
10  
30  
I
– FORWARD BIAS CURRENT (mA)  
V
– REVERSE VOLTAGE (V)  
I
– FORWARD BIAS CURRENT (mA)  
F
R
F
Figure 3. 2nd Harmonic Input  
Intercept Point vs. Forward Bias  
Current.  
Figure 1. Total RF Resistance at 25°C  
vs. Forward Bias Current.  
Figure 2. Capacitance vs. Reverse  
Voltage.  
200  
160  
100  
10  
1
V
= –2V  
R
120  
80  
V
= –5V  
R
0.1  
40  
0
V
= –10V  
R
25°C –50°C  
125°C  
0.4  
– FORWARD VOLTAGE (V)  
0.01  
10  
15  
20  
25  
30  
0
0.2  
0.6  
0.8  
1.0 1.2  
FORWARD CURRENT (mA)  
V
F
Figure 4. Typical Reverse Recovery  
Time vs. Reverse Voltage.  
Figure 5. Forward Current vs. Forward  
Voltage.  
Typical Applications for Multiple Diode Products  
1
2
3
2
1
0
0
2
+V  
–V  
“ON”  
“OFF”  
3
4
2
5
1
6
1
1
3
4
2
5
1
6
0
b1  
b2  
b3  
RF out  
RF in  
Figure 6. HSMP-389L used in a SP3T Switch.  
Figure 7. HSMP-389L Unconnected Trio used in a  
Dual Voltage, High Isolation Switch.  
5
Typical Applications for Multiple Diode Products (continued)  
1
+V  
0
2
0
+V  
“ON”  
“OFF”  
RF out  
1
1
6
1
5
2
4
3
6
1
5
2
4
3
RF out  
RF in  
RF in  
2
Figure 9. HSMP-389T used in a Low Inductance  
Shunt Mounted Switch.  
Figure 8. HSMP-389L Unconnected Trio used in a  
Positive Voltage, High Isolation Switch.  
Bias  
Xmtr  
Ant  
λ
4
C
C
Rcvr  
Bias  
Xmtr  
bias  
Ant  
λ
4
Bias  
Rcvr  
Antenna  
Xmtr  
PA  
HSMP-389V  
λ
4
λ
4
HSMP-389U  
LNA  
Rcvr  
Figure 11. HSMP-389V Series/Shunt Pair used in a  
1.8 GHz Transmit/Receive Switch.  
Figure 10. HSMP-389U Series/Shunt Pair used in a  
900 MHz Transmit/Receive Switch.  
6
Typical Applications for Multiple Diode Products (continued)  
RF COMMON  
RF COMMON  
RF 2  
RF 1  
RF 1  
RF 2  
BIAS 1  
BIAS 2  
BIAS  
BIAS  
Figure 12. Simple SPDT Switch, Using Only Positive Current.  
Figure 13. High Isolation SPDT Switch, Dual Bias.  
RF COMMON  
RF COMMON  
BIAS  
RF 1  
RF 2  
RF 2  
RF 1  
BIAS  
Figure 14. Switch Using Both Positive and Negative Bias  
Current.  
Figure 15. Very High Isolation SPDT Switch, Dual Bias.  
7
50 OHM MICROSTRIP LINES  
Co-Planar Waveguide Shunt  
Connection for HSMP-489x  
Series  
Typical Applications for  
HSMP-489x Low  
Inductance Series  
Co-Planar waveguide, with  
ground on the top side of the  
printed circuit board, is shown in  
Figure 20. Since it eliminates the  
need for via holes to ground, it  
offers lower shunt parasitic  
inductance and higher maximum  
attenuation when compared to a  
microstrip circuit.  
Microstrip Series Connection  
for HSMP-489x Series  
In order to take full advantage of  
the low inductance of the  
HSMP-489x series when using  
them in series applications, both  
lead 1 and lead 2 should be  
connected together, as shown in  
Figure 17.  
PAD CONNECTED TO  
GROUND BY TWO  
VIA HOLES  
Figure 18. Circuit Layout.  
Co-Planar Waveguide  
Groundplane  
3
Center Conductor  
Groundplane  
1.5 nH  
1.5 nH  
0.3 pF  
1
2
HSMP-489x  
Figure 16. Internal Connections.  
0.3 nH  
0.3 nH  
Figure 20. Circuit Layout.  
0.3 pF  
Figure 19. Equivalent Circuit.  
Figure 17. Circuit Layout.  
0.75 nH  
Microstrip Shunt Connections  
for HSMP-489x Series  
Equivalent Circuit Model  
HSMP-389x Chip*  
Figure 21. Equivalent Circuit.  
In Figure 18, the center conductor  
of the microstrip line is inter-  
rupted and leads 1 and 2 of the  
HSMP-489x diode are placed  
across the resulting gap. This  
forces the 1.5 nH lead inductance  
of leads 1 and 2 to appear as part  
of a low pass filter, reducing the  
shunt parasitic inductance and  
increasing the maximum available  
attenuation. The 0.3 nH of shunt  
inductance external to the diode  
is created by the via holes, and is  
a good estimate for 0.032" thick  
material.  
R
R
s
j
A SPICE model is not available  
for PIN diodes as SPICE does not  
provide for a key PIN diode  
0.5 Ω  
Cj  
characteristic, carrier lifetime.  
0.12 pF*  
* Measured at -20 V  
RT = 0.5 + Rj  
CT = CP + Cj  
20  
Rj =  
Ω
I0.9  
I = Forward Bias Current in mA  
* See AN1124 for package models  
8
SMT Assembly  
passes through one or more  
Assembly Information  
Reliable assembly of surface  
mount components is a complex  
process that involves many  
material, process, and equipment  
factors, including: method of  
heating (e.g., IR or vapor phase  
reflow, wave soldering, etc.)  
circuit board material, conductor  
thickness and pattern, type of  
solder alloy, and the thermal  
conductivity and thermal mass of  
components. Components with a  
low mass, such as the SOT  
package, will reach solder reflow  
temperatures faster than those  
with a greater mass.  
preheat zones. The preheat zones  
increase the temperature of the  
board and components to prevent  
thermal shock and begin evaporat-  
ing solvents from the solder paste.  
The reflow zone briefly elevates  
the temperature sufficiently to  
produce a reflow of the solder.  
0.026  
0.075  
0.035  
The rates of change of tempera-  
ture for the ramp-up and cool-  
down zones are chosen to be low  
enough to not cause deformation  
of the board or damage to compo-  
nents due to thermal shock. The  
maximum temperature in the  
0.016  
Figure 22. PCB Pad Layout, SOT-363.  
(dimensions in inches).  
0.026  
reflow zone (T  
) should not  
MAX  
Agilent’s diodes have been  
qualified to the time-temperature  
profile shown in Figure 26. This  
profile is representative of an IR  
reflow type of surface mount  
assembly process.  
exceed 235°C.  
0.07  
These parameters are typical for a  
surface mount assembly process  
for Agilent diodes. As a general  
guideline, the circuit board and  
components should be exposed  
only to the minimum tempera-  
tures and times necessary to  
achieve a uniform reflow of  
solder.  
0.035  
0.016  
Figure 23. PCB Pad Layout, SOT-323.  
(dimensions in inches).  
After ramping up from room  
temperature, the circuit board  
with components attached to it  
(held in place with solder paste)  
0.037  
0.95  
0.037  
0.95  
0.079  
2.0  
250  
200  
TMAX  
0.035  
0.9  
0.031  
0.8  
150  
inches  
DIMENSIONS IN  
mm  
Reflow  
Zone  
Figure 24. PCB Pad Layout, SOT-23.  
100  
Preheat  
Zone  
Cool Down  
Zone  
0.112  
2.85  
50  
0
0.079  
2
0.033  
0.85  
0
60  
120  
180  
240  
300  
0.108  
2.75  
0.075  
1.9  
0.041  
1.05  
TIME (seconds)  
0.071  
1.8  
0.033  
0.85  
Figure 26. Surface Mount Assembly Profile.  
0.047 0.031 0.033  
1.2  
0.8  
0.85  
inches  
mm  
DIMENSIONS IN  
Figure 25. PCB Pad Layout, SOT-143.  
9
Package Dimensions  
Outline 23 (SOT-23)  
Outline SOT-323 (SC-70 3 Lead)  
1.02 (0.040)  
0.89 (0.035)  
PACKAGE  
MARKING  
CODE (XX)  
1.30 (0.051)  
REF.  
DATE CODE (X)  
0.54 (0.021)  
0.37 (0.015)  
DATE CODE (X)  
PACKAGE  
MARKING  
CODE (XX)  
3
2.20 (0.087)  
2.00 (0.079)  
1.35 (0.053)  
1.15 (0.045)  
X X X  
1.40 (0.055)  
1.20 (0.047)  
2.65 (0.104)  
2.10 (0.083)  
X X X  
2
1
0.650 BSC (0.025)  
0.60 (0.024)  
0.45 (0.018)  
2.04 (0.080)  
1.78 (0.070)  
0.425 (0.017)  
TYP.  
2.20 (0.087)  
1.80 (0.071)  
TOP VIEW  
0.10 (0.004)  
0.00 (0.00)  
0.30 REF.  
0.152 (0.006)  
0.066 (0.003)  
3.06 (0.120)  
2.80 (0.110)  
1.02 (0.041)  
0.85 (0.033)  
0.20 (0.008)  
0.10 (0.004)  
1.00 (0.039)  
0.80 (0.031)  
0.25 (0.010)  
0.15 (0.006)  
10°  
0.30 (0.012)  
0.10 (0.004)  
0.69 (0.027)  
0.45 (0.018)  
0.10 (0.004)  
0.013 (0.0005)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
SIDE VIEW  
END VIEW  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
Outline 143 (SOT-143)  
Outline SOT-363 (SC-70 6 Lead)  
0.92 (0.036)  
0.78 (0.031)  
PACKAGE  
MARKING  
CODE (XX)  
1.30 (0.051)  
REF.  
DATE CODE (X)  
DATE CODE (X)  
2
4
1
PACKAGE  
MARKING  
CODE (XX)  
1.40 (0.055)  
1.20 (0.047)  
2.65 (0.104)  
2.10 (0.083)  
2.20 (0.087)  
2.00 (0.079)  
1.35 (0.053)  
1.15 (0.045)  
X X X  
X X X  
3
0.60 (0.024)  
0.45 (0.018)  
0.650 BSC (0.025)  
0.54 (0.021)  
0.37 (0.015)  
0.425 (0.017)  
TYP.  
2.20 (0.087)  
1.80 (0.071)  
2.04 (0.080)  
1.78 (0.070)  
3.06 (0.120)  
2.80 (0.110)  
0.15 (0.006)  
0.09 (0.003)  
0.10 (0.004)  
0.00 (0.00)  
0.30 REF.  
1.04 (0.041)  
0.85 (0.033)  
1.00 (0.039)  
0.80 (0.031)  
0.20 (0.008)  
0.10 (0.004)  
0.69 (0.027)  
0.45 (0.018)  
0.10 (0.004)  
0.013 (0.0005)  
10°  
0.30 (0.012)  
0.10 (0.004)  
0.25 (0.010)  
0.15 (0.006)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
Package Characteristics  
Lead Material .................... Copper (SOT-323/363); Alloy 42 (SOT-23/143)  
Lead Finish............................................................................ Tin-Lead 85-15%  
Maximum Soldering Temperature.............................. 260°C for 5 seconds  
Minimum Lead Strength.......................................................... 2 pounds pull  
Typical Package Inductance .................................................................. 2 nH  
Typical Package Capacitance ..............................0.08 pF (opposite leads)  
10  
Ordering Information  
Specify part number followed by option. For example:  
HSMP  
-
389x  
-
XXX  
Bulk or Tape and Reel Option  
Part Number; x = Lead Code  
Surface Mount PIN  
Option Descriptions  
-BLK = Bulk, 100 pcs. per antistatic bag  
-TR1 = Tape and Reel, 3000 devices per 7" reel  
-TR2 = Tape and Reel, 10,000 devices per 13" reel  
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of  
Surface Mounted Components for Automated Placement.”  
For lead-free option, the part number will have the character "G" at the  
end, eg. -TR2G for a 10K pc lead-free reel.  
Device Orientation  
For Outlines SOT-23, -323  
REEL  
TOP VIEW  
4 mm  
END VIEW  
CARRIER  
TAPE  
8 mm  
ABC  
ABC  
ABC  
ABC  
USER  
FEED  
DIRECTION  
Note: "AB" represents package marking code.  
"C" represents date code.  
COVER TAPE  
For Outline SOT-143  
For Outline SOT-363  
TOP VIEW  
4 mm  
END VIEW  
TOP VIEW  
4 mm  
END VIEW  
8 mm  
8 mm  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
Note: "AB" represents package marking code.  
"C" represents date code.  
Note: "AB" represents package marking code.  
"C" represents date code.  
11  
Tape Dimensions and Product Orientation  
For Outline SOT-23  
P
P
D
2
E
F
P
0
W
D
1
t1  
Ko  
13.5° MAX  
8° MAX  
9° MAX  
B
A
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.15 0.10  
2.77 0.10  
1.22 0.10  
4.00 0.10  
1.00 + 0.05  
0.124 0.004  
0.109 0.004  
0.048 0.004  
0.157 0.004  
0.039 0.002  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
CARRIER TAPE  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
WIDTH  
W
8.00+0.30–0.10 0.315+0.012–0.004  
THICKNESS  
t1  
0.229 0.013  
0.009 0.0005  
DISTANCE  
BETWEEN  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CENTERLINE  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
For Outline SOT-143  
P
D
P2  
P0  
E
F
W
D1  
t1  
K
0
9° MAX  
9° MAX  
A0  
B
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.19 0.10  
2.80 0.10  
1.31 0.10  
4.00 0.10  
1.00 + 0.25  
0.126 0.004  
0.110 0.004  
0.052 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
CARRIER TAPE  
DISTANCE  
WIDTH  
THICKNESS  
W
t1  
8.00+0.30–0.10 0.315+0.012–0.004  
0.254 0.013  
0.0100 0.0005  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
Tape Dimensions and Product Orientation  
For Outlines SOT-323, -363  
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)  
T (COVER TAPE THICKNESS)  
t
1
K
An  
An  
0
A
B
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
2.40 0.10  
2.40 0.10  
1.20 0.10  
4.00 0.10  
1.00 + 0.25  
0.094 0.004  
0.094 0.004  
0.047 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
1.55 0.05  
4.00 0.10  
1.75 0.10  
0.061 0.002  
0.157 0.004  
0.069 0.004  
P
E
0
CARRIER TAPE  
COVER TAPE  
DISTANCE  
WIDTH  
THICKNESS  
W
8.00 0.30  
0.254 0.02  
0.315 0.012  
0.0100 0.0008  
t
1
WIDTH  
TAPE THICKNESS  
C
5.4 0.10  
0.062 0.001  
0.205 0.004  
0.0025 0.00004  
T
t
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
ANGLE  
FOR SOT-323 (SC70-3 LEAD)  
FOR SOT-363 (SC70-6 LEAD)  
An  
8°C MAX  
10°C MAX  
www.agilent.com/semiconductors  
For product information and a complete list of  
distributors, please go to our web site.  
For technical assistance call:  
Americas/Canada: +1 (800) 235-0312 or  
(916) 788-6763  
Europe: +49 (0) 6441 92460  
China: 10800 650 0017  
Hong Kong: (65) 6756 2394  
India, Australia, New Zealand: (65) 6755 1939  
Japan: (+81 3) 3335-8152(Domestic/International), or  
0120-61-1280(Domestic Only)  
Korea: (65) 6755 1989  
Singapore, Malaysia, Vietnam, Thailand, Philippines,  
Indonesia: (65) 6755 2044  
Taiwan: (65) 6755 1843  
Data subject to change.  
Copyright © 2004 Agilent Technologies, Inc.  
Obsoletes 5968-7701E  
March 24, 2004  
5989-0486EN  

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