HSMS-280R-TR1G [AGILENT]
Mixer Diode, Silicon, LEAD FREE, SC-70, 6 PIN;型号: | HSMS-280R-TR1G |
厂家: | AGILENT TECHNOLOGIES, LTD. |
描述: | Mixer Diode, Silicon, LEAD FREE, SC-70, 6 PIN 测试 光电二极管 |
文件: | 总10页 (文件大小:137K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount RF Schottky
Barrier Diodes
Technical Data
HSMS-280x Series
Features
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
• Surface Mount Packages
COMMON
ANODE
3
COMMON
CATHODE
3
• High Breakdown Voltage
SINGLE
3
SERIES
3
• Low FIT (Failure in Time)
Rate*
• Six-sigma Quality Level
1
2
1
2
1
2
1
2
#4
#0
#2
#3
• Single, Dual and Quad
Versions
UNCONNECTED
PAIR
RING
BRIDGE
QUAD
3
QUAD
• Tape and Reel Options
Available
3
4
3
4
4
• Lead-free Option Available
1
2
1
2
1
2
#5
#7
#8
*
For more information see the
Surface Mount Schottky Reliability
Data Sheet.
Package Lead Code
Identification, SOT-323
(Top View)
Package Lead Code
Identification, SOT-363
(Top View)
Description/Applications
These Schottky diodes are
specifically designed for both
analog and digital applications.
This series offers a wide range of
specifications and package
configurations to give the
designer wide flexibility. The
HSMS-280x series of diodes is
optimized for high voltage
applications.
HIGH ISOLATION
UNCONNECTED
TRIO
SERIES
SINGLE
UNCONNECTED PAIR
6
5
4
6
5
4
B
C
1
2
3
1
2
3
COMMON
ANODE
COMMON
CATHODE
K
L
COMMON
CATHODE QUAD
COMMON
ANODE QUAD
6
1
6
1
5
4
6
1
6
1
5
4
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
E
F
2
3
2
3
M
N
BRIDGE
QUAD
RING
QUAD
5
4
5
4
2
3
2
3
P
R
2
Pin Connections and Package Marking, SOT-363
1
2
3
6
5
4
Notes:
ESD WARNING:
Handling Precautions Should Be Taken
To Avoid Static Discharge.
1. Package marking provides
orientation and identification.
2. See “Electrical Specifications” for
appropriate package marking.
Absolute Maximum Ratings[1] TC = 25°C
Symbol
Parameter
Unit
Amp
V
SOT-23/SOT-143
SOT-323/SOT-363
If
Forward Current (1 µs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance[2]
1
Same as VBR
150
1
Same as VBR
150
PIV
Tj
°C
°C
°C/W
Tstg
θjc
-65 to 150
500
-65 to 150
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TA = 25°C, Single Diode[4]
Maximum Maximum
Minimum Maximum Forward
Reverse
Leakage
Typical
Dynamic
Part
Package
Breakdown Forward
Voltage
VF (V) @
IF (mA)
Maximum
Number Marking Lead
Voltage
VBR (V)
Voltage
VF (mV)
IR (nA) @ Capacitance Resistance
VR (V)
HSMS[5]
Code
Code Configuration
CT (pF)
RD (Ω)[6]
2800
2802
2803
2804
2805
2807
2808
280B
280C
280E
280F
280K
A0[3]
A2[3]
A3[3]
A4[3]
A5[3]
A7[3]
A8[3]
A0[7]
A2[7]
A3[7]
A4[7]
AK[7]
0
2
3
4
5
Single
Series
70
410
1.0
15
200 50
2.0
35
Common Anode
Common Cathode
Unconnected Pair
Ring Quad[5]
7
8
Bridge Quad[5]
Single
Series
B
C
E
F
K
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
280L
280M
280N
280P
280R
AL[7]
H[7]
L
M
N
P
N[7]
AP[7]
O[7]
R
Ring Quad
Test Conditions
IR = 10 µA
IF = 1 mA
VF = 0 V
f = 1 MHz
IF = 5 mA
Notes:
1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.
2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.
3. Package marking code is in white.
4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
5. See section titled “Quad Capacitance.”
6. RD = RS + 5.2Ω at 25°C and If = 5 mA.
7. Package marking code is laser marked.
3
Quad Capacitance
In a quad, the diagonal capaci-
tance is the capacitance between
points A and B as shown in the
figure below. The diagonal
capacitance is calculated using
the following formula
The equivalent adjacent
capacitance is the capacitance
between points A and C in the
figure below. This capacitance is
calculated using the following
formula
Capacitance of Schottky diode
quads is measured using an
HP4271 LCR meter. This
instrument effectively isolates
individual diode branches from
the others, allowing accurate
capacitance measurement of each
branch or each diode. The
conditions are: 20 mV R.M.S.
voltage at 1 MHz. Agilent defines
this measurement as “CM”, and it
is equivalent to the capacitance of
the diode by itself. The equivalent
diagonal and adjacent
C1 x C2
C3 x C4
1
CDIAGONAL = _______ + _______
C
ADJACENT = C1 + ____________
1
1
1
C1 + C2 C3 + C4
–– + –– + ––
C2 C3 C4
A
B
C1
C2
C3
This information does not apply
to cross-over quad diodes.
C
C4
capacitances can then be
calculated by the formulas given
below.
Linear Equivalent Circuit, Diode Chip
SPICE Parameters
Parameter Units HSMS-280x
R
j
BV
CJ0
EG
IBV
IS
V
pF
eV
A
75
1.6
R
S
0.69
E-5
3E-8
1.08
30
A
C
j
N
RS
PB
PT
M
Ω
V
RS = series resistance (see Table of SPICE parameters)
0.65
2
Cj = junction capacitance (see Table of SPICE parameters)
8.33 X 10-5 nT
Rj =
Ib + Is
0.5
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = ideality factor (see table of SPICE parameters)
Note:
To effectively model the packaged HSMS-280x product,
please refer to Application Note AN1124.
4
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode
100
100,000
1000
10,000
10
100
1000
100
1
10
1
TA = +125°C
0.1
TA = +75°C
TA = +25°C
TA = –25°C
TA = +125°C
10
1
T
T
A = +75°C
A = +25°C
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
– FORWARD VOLTAGE (V)
0
10
20
30
40
50
0.1
1
10
I – FORWARD CURRENT (mA)
F
100
V
V
– REVERSE VOLTAGE (V)
F
R
Figure 1. Forward Current vs.
Forward Voltage at Temperatures.
Figure 2. Reverse Current vs.
Reverse Voltage at Temperatures.
Figure 3. Dynamic Resistance vs.
Forward Current.
2
30
30
I
(Left Scale)
F
10
10
1.5
1
∆V (Right Scale)
F
0.5
1
1
0
0.3
0.2
0.3
1.4
0
10
20
30
40
50
0.4
0.6
0.8
1.0
1.2
V
– REVERSE VOLTAGE (V)
V
- FORWARD VOLTAGE (V)
R
F
Figure 4. Total Capacitance vs.
Reverse Voltage.
Figure 5. Typical V Match, Pairs and
f
Quads.
5
resistance, will offer higher
current carrying capacity and
better performance. The HSMS-
281x family is a hybrid Schottky
(as is the HSMS-280x), offering
lower 1/f or flicker noise than the
HSMS-282x family.
Applications Information
Introduction—
Product Selection
Agilent’s family of Schottky
products provides unique solu-
tions to many design problems.
0.026
0.07
0.035
The first step in choosing the right
product is to select the diode type.
All of the products in the
HSMS-280x family use the same
diode chip, and the same is true of
the HSMS-281x and HSMS-282x
families. Each family has a
different set of characteristics
which can be compared most
easily by consulting the SPICE
parameters in Table 1.
In general, the HSMS-282x family
should be the designer’s first
choice, with the -280x family
reserved for high voltage applica-
tions and the HSMS-281x family
for low flicker noise applications.
0.016
Figure 6. PCB Pad Layout
(dimensions in inches).
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70,
6 lead) package is shown in
Figure 7 (dimensions are in
inches). This layout provides
ample allowance for package
placement by automated assembly
equipment without adding
parasitics that could impair the
performance.
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 6
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
A review of these data shows that
the HSMS-280x family has the
highest breakdown voltage, but at
the expense of a high value of
series resistance (R ). In applica-
s
tions which do not require high
voltage the HSMS-282x family,
with a lower value of series
without adding parasitics that
could impair the performance.
0.026
Table 1. Typical SPICE Parameters.
Parameter Units HSMS-280x HSMS-281x HSMS-282x
0.075
BV
CJ0
EG
IBV
IS
V
pF
eV
A
75
1.6
25
1.1
15
0.7
0.035
0.69
1 E-5
3 E-8
1.08
30
0.69
1 E-5
4.8 E-9
1.08
10
0.69
1 E-4
2.2 E-8
1.08
6.0
0.016
A
N
RS
Figure 7. PCB Pad Layout
(dimensions in inches).
Ω
PB (VJ)
PT (XTI)
M
V
0.65
2
0.5
0.65
2
0.5
0.65
2
0.5
6
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent achieve a uniform reflow of
thermal shock and begin evaporat- solder.
ing solvents from the solder paste.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
Agilent’s SOT diodes have been
qualified to the time-temperature
profile shown in Figure 8. This
profile is representative of an IR
reflow type of surface mount
assembly process.
reflow zone (T
) should not
MAX
exceed 235°C.
250
200
TMAX
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Figure 8. Surface Mount Assembly Profile.
7
Part Number Ordering Information
No. of
Part Number
HSMS-280x-TR2*
HSMS-280x-TR1*
HSMS-280x-BLK *
Devices
10000
3000
Container
13" Reel
7" Reel
100
antistatic bag
x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L, M, N, P, R
For lead-free option, the part number will have the
character "G" at the end, eg. HSMS-280x-TR2G for a
10,000 lead-free reel.
Package Dimensions
Outline 23 (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
1.02 (0.040)
0.89 (0.035)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
0.54 (0.021)
0.37 (0.015)
DATE CODE (X)
PACKAGE
MARKING
CODE (XX)
3
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
X X X
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
X X X
2
1
0.650 BSC (0.025)
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
TOP VIEW
0.10 (0.004)
0.00 (0.00)
0.30 REF.
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.20 (0.008)
0.10 (0.004)
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
Outline SOT-363 (SC-70 6 Lead)
0.92 (0.036)
0.78 (0.031)
PACKAGE
MARKING
CODE (XX)
1.30 (0.051)
REF.
DATE CODE (X)
DATE CODE (X)
2
4
1
PACKAGE
MARKING
CODE (XX)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
X X X
X X X
3
0.60 (0.024)
0.45 (0.018)
0.650 BSC (0.025)
0.54 (0.021)
0.37 (0.015)
0.425 (0.017)
TYP.
2.20 (0.087)
1.80 (0.071)
2.04 (0.080)
1.78 (0.070)
3.06 (0.120)
2.80 (0.110)
0.15 (0.006)
0.09 (0.003)
0.10 (0.004)
0.00 (0.00)
0.30 REF.
1.04 (0.041)
0.85 (0.033)
1.00 (0.039)
0.80 (0.031)
0.20 (0.008)
0.10 (0.004)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
10°
0.30 (0.012)
0.10 (0.004)
0.25 (0.010)
0.15 (0.006)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
8
Device Orientation
For Outlines SOT-23, -323
REEL
TOP VIEW
4 mm
END VIEW
CARRIER
TAPE
8 mm
ABC
ABC
ABC
ABC
USER
FEED
DIRECTION
Note: "AB" represents package marking code.
"C" represents date code.
COVER TAPE
For Outline SOT-143
For Outline SOT-363
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIEW
8 mm
8 mm
ABC
ABC
ABC
ABC
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" represents date code.
9
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9° MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.15 0.10
2.77 0.10
1.22 0.10
4.00 0.10
1.00 + 0.05
0.124 0.004
0.109 0.004
0.048 0.004
0.157 0.004
0.039 0.002
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
WIDTH
W
8.00+0.30–0.10 0.315+0.012–0.004
THICKNESS
t1
0.229 0.013
0.009 0.0005
DISTANCE
BETWEEN
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CENTERLINE
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
0
9° MAX
9° MAX
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
3.19 0.10
2.80 0.10
1.31 0.10
4.00 0.10
1.00 + 0.25
0.126 0.004
0.110 0.004
0.052 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
4.00 0.10
1.75 0.10
0.059 + 0.004
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30–0.10 0.315+0.012–0.004
0.254 0.013
0.0100 0.0005
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)
T (COVER TAPE THICKNESS)
t
1
K
An
An
0
A
B
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
2.40 0.10
2.40 0.10
1.20 0.10
4.00 0.10
1.00 + 0.25
0.094 0.004
0.094 0.004
0.047 0.004
0.157 0.004
0.039 + 0.010
0
0
0
BOTTOM HOLE DIAMETER
D
1
PERFORATION
DIAMETER
PITCH
POSITION
D
1.55 0.05
4.00 0.10
1.75 0.10
0.061 0.002
0.157 0.004
0.069 0.004
P
E
0
CARRIER TAPE
COVER TAPE
DISTANCE
WIDTH
THICKNESS
W
8.00 0.30
0.254 0.02
0.315 0.012
0.0100 0.0008
t
1
WIDTH
TAPE THICKNESS
C
5.4 0.10
0.062 0.001
0.205 0.004
0.0025 0.00004
T
t
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 0.05
0.138 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2.00 0.05
0.079 0.002
2
ANGLE
FOR SOT-323 (SC70-3 LEAD)
FOR SOT-363 (SC70-6 LEAD)
An
8°C MAX
10°C MAX
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5968-7960E
March 24, 2004
5989-0474EN
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