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HSMS-281B-TR1 [AGILENT]

Surface Mount RF Schottky Barrier Diodes; 表面贴装射频肖特基势垒二极管
HSMS-281B-TR1
型号： HSMS-281B-TR1
厂家： AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述：

Surface Mount RF Schottky Barrier Diodes
表面贴装射频肖特基势垒二极管

二极管 射频 光电二极管
文件： 总10页 (文件大小：137K)
中文：  中文翻译
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Surface Mount RF Schottky  
Barrier Diodes  
Technical Data  
HSMS-281x Series  
Features  
Package Lead Code Identification, SOT-23/SOT-143  
(Top View)  
• Surface Mount Packages  
COMMON  
ANODE  
3
COMMON  
CATHODE  
3
• Low Flicker Noise  
SINGLE  
SERIES  
3
3
• Low FIT (Failure in Time)  
Rate*  
• Six-sigma Quality Level  
1
2
1
2
1
2
1
2
#4  
#0  
#2  
#3  
• Single, Dual and Quad  
Versions  
UNCONNECTED  
PAIR  
RING  
BRIDGE  
QUAD  
3
QUAD  
• Tape and Reel Options  
Available  
3
4
3
4
4
• Lead-free Option Available  
1
2
1
2
1
2
#5  
#7  
#8  
*
For more information see the  
Surface Mount Schottky Reliability  
Data Sheet.  
Package Lead Code  
Identification, SOT-323  
(Top View)  
Package Lead Code  
Identification, SOT-363  
(Top View)  
Description/Applications  
These Schottky diodes are  
specifically designed for both  
analog and digital applications.  
This series offers a wide range of  
specifications and package  
configurations to give the  
designer wide flexibility. The  
HSMS-281x series of diodes  
features very low flicker (1/f)  
noise.  
HIGH ISOLATION  
UNCONNECTED  
TRIO  
SERIES  
SINGLE  
UNCONNECTED PAIR  
6
5
4
6
5
4
B
C
1
2
3
1
2
3
COMMON  
ANODE  
COMMON  
CATHODE  
K
L
Pin Connections and  
Package Marking  
E
F
1
2
3
6
5
4
Note that Agilent’s manufacturing  
techniques assure that dice found  
in pairs and quads are taken from  
adjacent sites on the wafer,  
assuring the highest degree of  
match.  
Notes:  
1. Package marking provides  
orientation and identification.  
2. See “Electrical Specifications” for  
appropriate package marking.  
2
Absolute Maximum Ratings[1] TC = 25°C  
Symbol  
Parameter  
Unit  
Amp  
V
SOT-23/SOT-143  
SOT-323/SOT-363  
If  
Forward Current (1 µs Pulse)  
Peak Inverse Voltage  
Junction Temperature  
Storage Temperature  
Thermal Resistance[2]  
1
Same as VBR  
150  
1
Same as VBR  
150  
PIV  
Tj  
°C  
°C  
°C/W  
Tstg  
θjc  
-65 to 150  
500  
-65 to 150  
150  
Notes:  
1. Operation in excess of any one of these conditions may result in permanent damage to the device.  
2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.  
ESD WARNING:  
Handling Precautions Should Be Taken To Avoid Static Discharge.  
Electrical Specifications TC = 25°C, Single Diode[4]  
Maximum Maximum  
Minimum Maximum Forward  
Reverse  
Leakage  
Typical  
Dynamic  
Part  
Package  
Breakdown Forward  
Voltage  
VF (V) @  
IF (mA)  
Maximum  
Number Marking Lead  
Voltage  
VBR (V)  
Voltage  
VF (mV)  
IR (nA) @ Capacitance Resistance  
VR (V)  
HSMS[5]  
Code  
Code Configuration  
CT (pF)  
RD (Ω)[6]  
2810  
2812  
2813  
2814  
2815  
2817  
2818  
281B  
281C  
281E  
281F  
281K  
B0[3]  
B2[3]  
B3[3]  
B4[3]  
B5[3]  
B7[3]  
B8[3]  
B0[7]  
B2[7]  
B3[7]  
B4[7]  
BK[7]  
0
2
3
4
5
Single  
Series  
20  
400  
1.0  
35  
200 15  
1.2  
15  
Common Anode  
Common Cathode  
Unconnected Pair  
Ring Quad[5]  
Bridge Quad[5]  
Single  
7
8
B
C
E
F
K
Series  
Common Anode  
Common Cathode  
High Isolation  
Unconnected Pair  
Unconnected Trio  
281L  
BL[7]  
L
Test Conditions  
IR = 10 µA  
IF = 1 mA  
VF = 0 V  
IF = 5 mA  
f = 1 MHz  
Notes:  
1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA.  
2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum.  
3. Package marking code is in white.  
4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.  
5. See section titled “Quad Capacitance.”  
6. RD = RS + 5.2Ω at 25°C and If = 5 mA.  
7. Package marking code is laser marked.  
3
Quad Capacitance  
In a quad, the diagonal capaci-  
tance is the capacitance between  
points A and B as shown in the  
figure below. The diagonal  
capacitance is calculated using  
the following formula  
The equivalent adjacent  
capacitance is the capacitance  
between points A and C in the  
figure below. This capacitance is  
calculated using the following  
formula  
Capacitance of Schottky diode  
quads is measured using an  
HP4271 LCR meter. This  
instrument effectively isolates  
individual diode branches from  
the others, allowing accurate  
capacitance measurement of each  
branch or each diode. The  
conditions are: 20 mV R.M.S.  
voltage at 1 MHz. Agilent defines  
this measurement as “CM”, and it  
is equivalent to the capacitance of  
the diode by itself. The equivalent  
diagonal and adjacent  
C1 x C2  
C3 x C4  
1
CDIAGONAL = _______ + _______  
C
ADJACENT = C1 + ____________  
1
1
1
C1 + C2 C3 + C4  
–– + –– + ––  
C2 C3 C4  
A
B
C1  
C2  
C3  
C
C4  
capacitances can then be  
calculated by the formulas given  
below.  
Linear Equivalent Circuit, Diode Chip  
SPICE Parameters  
R
Parameter Units HSMS-281x  
j
BV  
CJ0  
EG  
IBV  
IS  
V
pF  
eV  
A
25  
1.1  
R
S
0.69  
E-5  
4.8E-9  
1.08  
10  
A
C
j
N
RS = series resistance (see Table of SPICE parameters)  
RS  
PB  
PT  
M
Ω
V
Cj = junction capacitance (see Table of SPICE parameters)  
0.65  
2
8.33 X 10-5 nT  
Rj =  
Ib + Is  
0.5  
where  
Ib = externally applied bias current in amps  
Is = saturation current (see table of SPICE parameters)  
T = temperature, °K  
n = ideality factor (see table of SPICE parameters)  
Note:  
To effectively model the packaged HSMS-281x product,  
please refer to Application Note AN1124.  
4
Typical Performance, TC = 25°C (unless otherwise noted), Single Diode  
100  
100,000  
1000  
10,000  
10  
100  
1000  
100  
1
10  
1
TA = +125°C  
0.1  
T
T
T
A = +75°C  
A = +25°C  
A = –25°C  
TA = +125°C  
10  
1
T
T
A = +75°C  
A = +25°C  
0.01  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
– FORWARD VOLTAGE (V)  
0
5
10  
15  
0.1  
1
10  
100  
V
V – REVERSE VOLTAGE (V)  
R
I
– FORWARD CURRENT (mA)  
F
F
Figure 1. Forward Current vs.  
Forward Voltage at Temperatures.  
Figure 2. Reverse Current vs.  
Reverse Voltage at Temperatures.  
Figure 3. Dynamic Resistance vs.  
Forward Current.  
1.25  
1
30  
30  
I
(Left Scale)  
F
10  
10  
0.75  
∆V (Right Scale)  
F
0.50  
0.25  
0
1
1
0.3  
0.2  
0.3  
1.4  
0
2
4
6
8
10 12 14 16  
0.4  
0.6  
0.8  
1.0  
1.2  
V
– REVERSE VOLTAGE (V)  
V
- FORWARD VOLTAGE (V)  
R
F
Figure 4. Total Capacitance vs.  
Reverse Voltage.  
Figure 5. Typical V Match, Pairs and  
f
Quads.  
5
resistance, will offer higher  
current carrying capacity and  
better performance. The HSMS-  
281x family is a hybrid Schottky  
(as is the HSMS-280x), offering  
lower 1/f or flicker noise than the  
HSMS-282x family.  
Applications Information  
Introduction—  
Product Selection  
Agilent’s family of Schottky  
products provides unique solu-  
tions to many design problems.  
0.026  
0.07  
0.035  
The first step in choosing the right  
product is to select the diode type.  
All of the products in the  
HSMS-282x family use the same  
diode chip, and the same is true of  
the HSMS-281x and HSMS-280x  
families. Each family has a  
In general, the HSMS-282x family  
should be the designer’s first  
choice, with the -280x family  
reserved for high voltage applica-  
tions and the HSMS-281x family  
for low flicker noise applications.  
0.016  
Figure 6. PCB Pad Layout  
(dimensions in inches).  
different set of characteristics  
which can be compared most  
easily by consulting the SPICE  
parameters in Table 1.  
Assembly Instructions  
Assembly Instructions  
SOT-323 PCB Footprint  
A recommended PCB pad layout  
for the miniature SOT-323 (SC-70)  
package is shown in Figure 6  
(dimensions are in inches). This  
layout provides ample allowance  
for package placement by auto-  
mated assembly equipment  
SOT-363 PCB Footprint  
A recommended PCB pad layout  
for the miniature SOT-363 (SC-70,  
6 lead) package is shown in  
Figure 7 (dimensions are in  
inches). This layout provides  
ample allowance for package  
placement by automated assembly  
equipment without adding  
parasitics that could impair the  
performance.  
A review of these data shows that  
the HSMS-280x family has the  
highest breakdown voltage, but at  
the expense of a high value of  
series resistance (R ). In applica-  
s
tions which do not require high  
voltage the HSMS-282x family,  
with a lower value of series  
without adding parasitics that  
could impair the performance.  
0.026  
Table 1. Typical SPICE Parameters.  
Parameter Units HSMS-280x HSMS-281x HSMS-282x  
0.075  
BV  
CJ0  
EG  
IBV  
IS  
V
pF  
eV  
A
75  
1.6  
25  
1.1  
15  
0.7  
0.69  
1 E-5  
3 E-8  
1.08  
30  
0.69  
1 E-5  
4.8 E-9  
1.08  
10  
0.69  
1 E-4  
2.2 E-8  
1.08  
6.0  
0.035  
A
0.016  
N
RS  
PB (VJ)  
PT (XTI)  
M
Figure 7. PCB Pad Layout  
(dimensions in inches).  
Ω
V
0.65  
2
0.65  
2
0.65  
2
0.5  
0.5  
0.5  
6
After ramping up from room  
temperature, the circuit board  
with components attached to it  
(held in place with solder paste)  
passes through one or more  
preheat zones. The preheat zones  
increase the temperature of the  
board and components to prevent achieve a uniform reflow of  
thermal shock and begin evaporat- solder.  
ing solvents from the solder paste.  
These parameters are typical for a  
surface mount assembly process  
for Agilent diodes. As a general  
guideline, the circuit board and  
components should be exposed  
only to the minimum tempera-  
tures and times necessary to  
SMT Assembly  
Reliable assembly of surface  
mount components is a complex  
process that involves many  
material, process, and equipment  
factors, including: method of  
heating (e.g., IR or vapor phase  
reflow, wave soldering, etc.)  
circuit board material, conductor  
thickness and pattern, type of  
solder alloy, and the thermal  
conductivity and thermal mass of  
components. Components with a  
low mass, such as the SOT  
package, will reach solder reflow  
temperatures faster than those  
with a greater mass.  
The reflow zone briefly elevates  
the temperature sufficiently to  
produce a reflow of the solder.  
The rates of change of tempera-  
ture for the ramp-up and cool-  
down zones are chosen to be low  
enough to not cause deformation  
of the board or damage to compo-  
nents due to thermal shock. The  
maximum temperature in the  
Agilent’s SOT diodes have been  
qualified to the time-temperature  
profile shown in Figure 8. This  
profile is representative of an IR  
reflow type of surface mount  
assembly process.  
reflow zone (T  
) should not  
MAX  
exceed 235°C.  
250  
200  
TMAX  
150  
Reflow  
Zone  
100  
Preheat  
Zone  
Cool Down  
Zone  
50  
0
0
60  
120  
180  
240  
300  
TIME (seconds)  
Figure 8. Surface Mount Assembly Profile.  
7
Part Number Ordering Information  
No. of  
Part Number  
HSMS-281x-TR2*  
HSMS-281x-TR1*  
HSMS-281x-BLK *  
Devices  
10000  
3000  
Container  
13" Reel  
7" Reel  
100  
antistatic bag  
x = 0, 2, 3, 4, 5, 7, 8, B, C, E, F, K, L  
For lead-free option, the part number will have the  
character "G" at the end, eg. HSMS-281x-TR2G for a  
10,000 lead-free reel.  
Package Dimensions  
Outline 23 (SOT-23)  
Outline SOT-323 (SC-70 3 Lead)  
1.02 (0.040)  
0.89 (0.035)  
PACKAGE  
MARKING  
CODE (XX)  
1.30 (0.051)  
REF.  
DATE CODE (X)  
0.54 (0.021)  
0.37 (0.015)  
DATE CODE (X)  
PACKAGE  
MARKING  
CODE (XX)  
3
2.20 (0.087)  
2.00 (0.079)  
1.35 (0.053)  
1.15 (0.045)  
X X X  
1.40 (0.055)  
1.20 (0.047)  
2.65 (0.104)  
2.10 (0.083)  
X X X  
2
1
0.650 BSC (0.025)  
0.60 (0.024)  
0.45 (0.018)  
2.04 (0.080)  
1.78 (0.070)  
0.425 (0.017)  
TYP.  
2.20 (0.087)  
1.80 (0.071)  
TOP VIEW  
0.10 (0.004)  
0.00 (0.00)  
0.30 REF.  
0.152 (0.006)  
0.066 (0.003)  
3.06 (0.120)  
2.80 (0.110)  
1.02 (0.041)  
0.85 (0.033)  
0.20 (0.008)  
0.10 (0.004)  
1.00 (0.039)  
0.80 (0.031)  
0.25 (0.010)  
0.15 (0.006)  
10°  
0.30 (0.012)  
0.10 (0.004)  
0.69 (0.027)  
0.45 (0.018)  
0.10 (0.004)  
0.013 (0.0005)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
SIDE VIEW  
END VIEW  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
Outline 143 (SOT-143)  
Outline SOT-363 (SC-70 6 Lead)  
0.92 (0.036)  
0.78 (0.031)  
PACKAGE  
MARKING  
CODE (XX)  
1.30 (0.051)  
REF.  
DATE CODE (X)  
DATE CODE (X)  
2
4
1
PACKAGE  
MARKING  
CODE (XX)  
1.40 (0.055)  
1.20 (0.047)  
2.65 (0.104)  
2.10 (0.083)  
2.20 (0.087)  
2.00 (0.079)  
1.35 (0.053)  
1.15 (0.045)  
X X X  
X X X  
3
0.60 (0.024)  
0.45 (0.018)  
0.650 BSC (0.025)  
0.54 (0.021)  
0.37 (0.015)  
0.425 (0.017)  
TYP.  
2.20 (0.087)  
1.80 (0.071)  
2.04 (0.080)  
1.78 (0.070)  
3.06 (0.120)  
2.80 (0.110)  
0.15 (0.006)  
0.09 (0.003)  
0.10 (0.004)  
0.00 (0.00)  
0.30 REF.  
1.04 (0.041)  
0.85 (0.033)  
1.00 (0.039)  
0.80 (0.031)  
0.20 (0.008)  
0.10 (0.004)  
0.69 (0.027)  
0.45 (0.018)  
0.10 (0.004)  
0.013 (0.0005)  
10°  
0.30 (0.012)  
0.10 (0.004)  
0.25 (0.010)  
0.15 (0.006)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
8
Device Orientation  
For Outlines SOT-23, -323  
REEL  
TOP VIEW  
4 mm  
END VIEW  
CARRIER  
TAPE  
8 mm  
ABC  
ABC  
ABC  
ABC  
USER  
FEED  
DIRECTION  
Note: "AB" represents package marking code.  
"C" represents date code.  
COVER TAPE  
For Outline SOT-143  
For Outline SOT-363  
TOP VIEW  
4 mm  
END VIEW  
TOP VIEW  
4 mm  
END VIEW  
8 mm  
8 mm  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
ABC  
Note: "AB" represents package marking code.  
"C" represents date code.  
Note: "AB" represents package marking code.  
"C" represents date code.  
9
Tape Dimensions and Product Orientation  
For Outline SOT-23  
P
P
D
2
E
F
P
0
W
D
1
t1  
Ko  
13.5° MAX  
8° MAX  
9° MAX  
B
A
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.15 0.10  
2.77 0.10  
1.22 0.10  
4.00 0.10  
1.00 + 0.05  
0.124 0.004  
0.109 0.004  
0.048 0.004  
0.157 0.004  
0.039 0.002  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
CARRIER TAPE  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
WIDTH  
W
8.00+0.30–0.10 0.315+0.012–0.004  
THICKNESS  
t1  
0.229 0.013  
0.009 0.0005  
DISTANCE  
BETWEEN  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CENTERLINE  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
For Outline SOT-143  
P
D
P2  
P0  
E
F
W
D1  
t1  
K
0
9° MAX  
9° MAX  
A0  
B
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.19 0.10  
2.80 0.10  
1.31 0.10  
4.00 0.10  
1.00 + 0.25  
0.126 0.004  
0.110 0.004  
0.052 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
CARRIER TAPE  
DISTANCE  
WIDTH  
THICKNESS  
W
t1  
8.00+0.30–0.10 0.315+0.012–0.004  
0.254 0.013  
0.0100 0.0005  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
Tape Dimensions and Product Orientation  
For Outlines SOT-323, -363  
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)  
T (COVER TAPE THICKNESS)  
t
1
K
An  
An  
0
A
B
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
2.40 0.10  
2.40 0.10  
1.20 0.10  
4.00 0.10  
1.00 + 0.25  
0.094 0.004  
0.094 0.004  
0.047 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
1.55 0.05  
4.00 0.10  
1.75 0.10  
0.061 0.002  
0.157 0.004  
0.069 0.004  
P
E
0
CARRIER TAPE  
COVER TAPE  
DISTANCE  
WIDTH  
THICKNESS  
W
8.00 0.30  
0.254 0.02  
0.315 0.012  
0.0100 0.0008  
t
1
WIDTH  
TAPE THICKNESS  
C
5.4 0.10  
0.062 0.001  
0.205 0.004  
0.0025 0.00004  
T
t
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
ANGLE  
FOR SOT-323 (SC70-3 LEAD)  
FOR SOT-363 (SC70-6 LEAD)  
An  
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