HSMY-H670 [AGILENT]
Surface Mount Flip Chip LEDs; 表面贴装倒装芯片LED
| 型号： | HSMY-H670 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Surface Mount Flip Chip LEDs |
| 文件： | 总8页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
H
Surface Mount Flip Chip LEDs
Technical Data
HSMX-H670 Series
HSMX-H690 Series
Features
Description
• Improved Reliability
Through Elimination of
Internal Wire Bond
• -40 to 85°C Operating
Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR
Solder Process
• Four Colors Available
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
• Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Both packages are compatible
with IR and convective reflow
soldering processes.
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
Device Selection Guide
High
Efficiency
Footprint
(mm)[1][2]
Red
Orange
Yellow
Green
1.6 x 0.8 x 0.6
HSMS-H690
HSMD-H690
HSMY-H690
HSMG-H690
2.0 x 1.25 x 1.1
HSMS-H670
HSMD-H670
HSMY-H670
HSMG-H670
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Package Dimensions
HSMX-H670 Series
HSMX-H690 Series
CATHODE MARK
POLARITY
POLARITY
2.00
(0.079)
0.60
1.00
1.25
1.10
(0.049)
(0.043)
1.27
(0.050)
0.30
0.50 (0.020)
TOPSIDE
CATHODE
MARK
0.80
0.40
(0.016)
0.40 (0.016)
1.60
0.48 (0.019)
BOTTOMSIDE CATHODE MARK
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).
3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05
MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.
Absolute Maximum Ratings at T = 25°C
A
Parameter
HSMX-H670
HSMX-H690
Units
DC Forward Current[1]
20
20
mA
Power Dissipation
50
50
mW
V
Reverse Voltage (IR = 100 µA)
Operating Temperature Range
Storage Temperature Range[2]
5
5
-40 to +85
-40 to +85
-40 to +85
-40 to +85
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at TA = 25°C
Luminous
Intensity
IV (mcd)
Color,
Dominant
Viewing Luminous
Peak
Angle
2θ1/2
Efficacy
ηv
(lm/W)
Wavelength Wavelength
Part
Number
@ IF = 20 mA[1]
λpeak (nm)
λd[2] (nm)
Degrees[3]
Typ.
Color
Min.
Typ.
Typ.
Typ.
HSMS-H6X0
High
Efficiency
Red
1.6
5.0
639
626
165
145
HSMD-H6X0
HSMY-H6X0
Orange
Yellow
Green
1.6
1.6
4.0
4.0
5.0
9.0
606
584
566
604
586
571
165
165
165
380
500
595
HSMG-H6X0
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the
mechanical axis of the lamp package.
2. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25°C
Forward
Voltage
VF (Volts)
Reverse
Breakdown
VR (Volts)
Capacitance
C (pF),
VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ-PIN (°C/W)
Part
Number
@ IF = 20 mA @ IR = 100 µA
Color
Typ.
Max.
Min.
HSMS-H670 High Efficiency
2.0
2.6
5
6
5
5
5
250
250
250
250
HSMS-H690
Red
HSMD-H670
HSMD-H690
Orange
2.0
2.1
2.3
2.6
2.6
2.6
5
5
5
HSMY-H670
HSMY-H690
Yellow
Green
HSMG-H670
HSMG-H690
Green Color Bins[1]
Bin ID
Minimum (nm)
561.0
Maximum (nm)
565.0
Notes
A
B
C
D
E
F
G
H
J
564.0
568.0
567.0
571.0
570.0
574.0
573.0
577.0
561.0
568.0
Bin A & Bin B
Bin B & Bin C
Bin C & Bin D
Bin D & Bin E
564.0
571.0
567.0
574.0
570.0
577.0
Yellow Color Bins[1]
Bin ID
Minimum (nm)
581.5
Maximum (nm)
585.0
Notes
A
B
C
D
E
F
G
H
J
584.0
587.5
586.5
590.0
589.0
592.5
581.5
587.5
Bin A & Bin B
Bin B & Bin C
Bin C & Bin D
584.0
590.0
586.5
592.5
591.5
595.0
594.0
597.5
Luminous Intensity Bin Limits[1]
Bin ID
Minimum (med)
Maximum (med)
A
B
C
D
E
F
G
H
J
K
L
0.10
0.16
0.20
0.32
0.25
0.50
0.40
0.80
0.63
1.25
1.00
2.00
1.60
3.20
2.50
5.00
4.00
8.00
6.30
12.50
20.00
32.00
50.00
80.00
125.00
200.00
320.00
500.00
800.00
1250.00
2000.00
3200.00
5000.00
10.00
16.00
25.00
40.00
63.00
100.00
160.00
250.00
400.00
630.00
1000.00
1600.00
2500.00
M
N
P
Q
R
S
T
U
V
W
X
Y
Note:
1. Bin categories are established for classification of products. Products may not be available in all bin categories.
Please contact your Hewlett-Packard representative for information on currently available bins.
1.0
ORANGE
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
1.2
20
YELLOW
ORANGE
1.0
0.8
15
HER
GREEN
10
0.6
0.4
0.2
0
5
0
1.0
1.5
2.0
2.5
3.0
0
5
10
15
20
V
– FORWARD VOLTAGE – V
I
– DC FORWARD CURRENT – mA
F
DC
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Relative Luminous Intensity vs. DC Forward
Current.
0°
1.0
10°
40
35
20°
30°
.8
40°
30
50°
25
20
15
.6
.4
.2
60°
70°
10
5
80°
0
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
0
20
40
60
80
100
T
– AMBIENT TEMPERATURE – °C
A
Figure 4. Maximum DC Current vs. Ambient
Temperature.
Figure 5. Intensity vs. Angle.
0.8 (0.031)
0.80
0.80
0.85
10 SEC. MAX.
230°C MAX.
HSMX-H690 SERIES
4°C/SEC. MAX.
140-160°C
1.1 (0.043)
4°C/SEC. MAX.
1.25
1.25
(0.049)
(0.049)
OVER 2 MIN.
TIME
1.1
(0.043)
HSMX-H670 SERIES
Figure 6. Recommended Reflow Soldering Profile.
Figure 7. Recommended Solder Patterns.
USER FEED DIRECTION
CATHODE SIDE
180
(7.08)
Ø
21.0
(0.83)
PRINTED LABEL
2.0
(0.08)
60.0
(2.36)
Ø
Figure 8. Reeling Orientation.
13.0
Ø
(0.51)
LABEL
1.5
(0.06)
TYP.
60°
60°
13.0
(0.51)
10.0
(0.39)
Figure 9. Reel Dimensions.
NOTE:
ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.50 + 0.10
0
(0.059 + 0.004)
0
1.30 ± 0.10
(0.051 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
Ø
CATHODE
0.20 ± 0.05
(0.008 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
USER FEED
DIRECTION
CARRIER TAPE
COVER TAPE
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A DIM. B
± 0.10 (0.004) ± 0.10 (0.004)
PART NUMBER
HSMX-H670 SERIES 2.40 (0.094) 1.60 (0.064)
HSMX-H690 SERIES 1.98 (0.078) 1.02 (0.040)
Figure 10. Tape Dimensions.
END
START
THERE SHALL BE A
MOUNTED WITH THERE SHALL BE A
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
COMPONENTS
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS OF CARRIER
SEALED WITH COVER
TAPE.
AND/OR
COVER TAPE.
Figure 11. Tape Leader and Trailer Dimensions.
Convective IR Reflow
Soldering
For information on IR reflow
soldering, refer to Application
Note 1060, Surface Mounting
SMI LED Indicator
Components.
H
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: (65) 290-6305
Japan: (81 3) 3331-6111
Europe: Call your local HP sales office
listed in your telephone directory. Ask for
a Components representative.
Data subject to change.
Copyright © 1996 Hewlett-Packard Co.
Printed in U.S.A.
5965-1521E (5/96)
相关型号：
©2020 ICPDF网 联系我们和版权申明