PPD-6002R [AGILENT]

Threshold Detector;
PPD-6002R
型号: PPD-6002R
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

Threshold Detector

射频 微波
文件: 总6页 (文件大小:39K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
H
Avantek Products  
Threshold Detector  
.1 to 6 GHz  
Technical Data  
PPD-6002  
Features  
Description  
Pin Configuration  
PP-25DD  
• Frequency Range: 0.1 to  
6GHz  
The PPD-6002 is a sensitive micro-  
wave threshold detector which  
provides efficient and accurate RF  
level measurement at critical  
system points. It contains a  
V
cc  
• Threshold Externally  
Programmable with One  
Resistor or Voltage  
RF  
V
IN  
OUT  
Schottky diode detector, a preci-  
sion integrated circuit operational  
amp, comparator and a tempera-  
ture compensated voltage refer-  
ence assembly. The unit is built  
with chip and wire construction  
on a thin-film substrate for small  
size and ruggedness.  
• Temperature Compensated  
Threshold  
THRESHOLD  
• TTL Output  
• 12 mA ( typ) Power  
Consumption @ +15 VDC  
• Surface Mount Package  
Applications  
• System Built-In Test ( BIT)  
Maximum Ratings  
Parameter  
Maximum  
• Channel RF Activity  
Monitoring  
DC Voltage  
±17 Volts  
DC Voltage Reference  
Continuous RF Input Power  
Operating Case Temperature  
Storage Temperature  
+2 Volts  
• Excessive VSWR Indicator  
• Gain Switch Control  
+15 dBm  
–55 to +125°C  
–62 to +150°C  
+125°C  
• Surface Mount Assembly  
“R” Series Burn-In Temperature  
Weight: (typical) 0.21 grams  
2
Electrical Specifications  
(Measured in 50 system @ +15 VDC nominal unless otherwise noted)  
Typical  
Guaranteed Specifications  
Symbol  
Characteristic  
Unit  
TC = 25°C TC = 0 to 50°C TC = –55 to +85°C  
GHz  
dB  
.1-6  
.1-6  
.1-6  
Frequency (Min.)  
Input Flatness (Max.),  
= –10 to +10 dBm  
±1.0  
±0.7  
±1.0  
P
IN  
dBm  
–10 to +10  
2.0:1  
–10 to +10  
1.5:1  
–10 to +10  
2.0:1  
Input Operating Range  
Input VSWR (Max.), P = –10 dBm  
IN  
dBm  
+15  
+15  
+15  
Input Power (Max.)  
Threshold Temperature Stability (Max.)  
@ –10 dBm Input Power  
@ 0 dBm Input Power  
@ +10 dBm Input Power  
Threshold Level Control  
@ –10 dBm Input Power  
@ 0 dBm Input Power  
@ +10 dBm Input Power  
Threshold Hysteresis  
dB  
dB  
dB  
±1.0  
±0.7  
±0.5  
±1.5  
±1.0  
±0.7  
mV/Ω  
mV/Ω  
mV/Ω  
75/220  
250/800  
900/3100  
dB  
dB  
mA  
0.5  
0.1  
0.3  
TTL  
2.7  
3.0  
2.0  
Resistance Control  
Voltage Control  
Control Terminal Current  
Output Compatibility  
TTL  
2.7  
3.0  
2.0  
TTL  
2.7  
3.0  
2.0  
V
Output at P Threshold (Min.)  
IN  
mA  
mA  
Output Short Circuit Current (Min.)  
Output Sink Current (Min.), V = 0.7 V  
0
Output for Input Power Change > 3 dB  
above CW Threshold  
Rise Time  
ns  
ns  
ns  
30  
80  
Fall Time  
1000  
Propagation Delay  
Supply Voltage  
VDC  
VDC  
mA  
15  
+15  
+11 to +16  
12  
15  
As Specified  
Operational  
Supply Current @ +15 Volts (Max.)  
Package  
PP-25DD  
3
Typical Performance Over Temperature  
(@ +15 VDC unless otherwise noted)  
Key: +25°C  
+85°C  
-55°C  
Input VSWR vs Frequency  
and Drive Level  
2.5  
Input VSWR vs Frequency  
and Temperature  
2.5  
2.0  
2.0  
PIN = +10 dBm  
PIN = –10 dBm  
1.5  
1.5  
1.0  
PIN = –10 dBm  
1.0  
.06  
2
4
6
8
.06  
2
4
6
8
Frequency, GHz  
Frequency, GHz  
Threshold Power  
Threshold Power  
–8  
2
VT = 75 mV  
VT = 250 mV  
–9  
1
0
–10  
–11  
–1  
–2  
–12  
.06  
2
4
6
8
.06  
2
4
6
8
Frequency, GHz  
Frequency, GHz  
Typical Control Resistance and  
Control Voltage vs. Threshold Power  
Threshold Power  
3600  
3000  
2400  
1800  
1.2  
1.0  
0.8  
0.6  
12  
11  
10  
VT = 900 mV  
Resistance  
1200  
600  
0
0.4  
0.2  
0
Voltage  
9
8
.06  
2
4
6
8
–10  
–6  
–2  
+2  
+6  
+10  
Frequency, GHz  
Threshold Power, dBm  
4
Output Schematic  
VCC  
1800 Ω  
OL 2 mA  
I
TTLOUT  
600 Ω  
LEADFRAME  
Resistive Control  
Voltage Control  
Vcc  
Vcc  
RFIN  
TTLOUT  
RFIN  
TTLOUT  
+15V  
Threshold  
Adjust  
15K  
Threshold  
Adjust  
RT  
+
VT  
1K  
Threshold Adjust  
at +15 VDC Bias  
Threshold Adjust  
at +15 VDC Bias  
Sensitivity  
(Typ)  
Hysteresis  
(Typ)  
82  
Sensitivity  
(Typ)  
Hysteresis  
(Typ)  
VT  
RT  
75 mV  
–10 dBm  
0 dBm  
0.1 dB  
0.1 dB  
0.1 dB  
220 Ω  
–10 dBm  
0 dBm  
0.5 dB  
0.5 dB  
0.5 dB  
250 mV  
900 mV  
800 Ω  
+10 dBm  
3100 Ω  
+10 dBm  
Indicator Drive  
Vcc  
TTLOUT  
RFIN  
Threshold  
Adjust  
LED  
5
Product Options  
PPA – 1021R  
Model Number Prefix  
PPA-  
PPD-  
PPF-  
PPL-  
PPM-  
PPS-  
Screening Option  
Blank = No Screening  
R = R-Series Screening  
For more information on R-Series screening,  
see Reliability Screening, Pub. 5963-3240E.  
Model Number  
PLP-  
PSP-  
H
Case Drawings  
PP-25  
.25 x .25 PLANARPAK SURFACE MOUNTED COMPONENTS  
.050 ± .010  
(8) PLCS.  
.250 Sq.  
.120 MAX.  
.010 (4) PLCS  
.015  
.035  
(4) Plcs.  
4
.010  
(4) PLCS.  
.040  
1
C
L
C
L
R
3
.015 ± .002  
(4) PLCS  
.010 R  
(4) PLCS.  
"A"  
.030  
(3) PLCS  
NOTE 4  
2
.035R  
(4) PLCS  
.006  
.004  
DETAIL "A"  
Typical Weight: 21 Grams  
NOTE: Certain high frequency models have 0.010" lead widths  
PIN DESIGNATION  
NOTES (UNLESS OTHERWISE SPECIFIED):  
1. DIMENSIONS ARE SPECIFIED IN INCHES  
2. TOLERANCES: xxx ± .005  
3. LEADS ARE FOR TESTING ONLY AND MAY BE  
TRIMMED FLUSH AT TIME OF INSTALLATION.  
4. PIN 2 IS AT GROUND POTENTIAL ONLY FOR  
PP-25. GROUNDING MAY BE AS SHOWN OR  
WITH THE WHOLE AREA METALIZED. FOR ALL  
OTHER PARTS PIN 2 LOOKS LIKE PINS 1, 3,  
AND 4.  
CASE  
1
2
3
4
V+  
PP-25  
RFIN  
RFIN  
J1  
Ground  
RFOUT  
PP-25A  
PP-25S  
PP-25DA  
PP-25DD  
PP-25M  
PP-25SP  
VCONTROL RFOUT  
V+  
VCONTROL  
V–  
J2  
J0  
RFIN  
RFIN  
RF  
VOUT  
VOUT  
IF  
V+  
Threshold  
LO  
V+  
Open  
RFOUT  
RFIN  
RFOUT  
GND  
Recommended Assembly Procedure  
1. Chemically clean the PC board and the unit to be mounted using a vapor degreaser or  
acetone followed by an isopropol alcohol wash. Do not use ultrasonic cleaning.  
2. Mask the backside of the PC board to prevent solder from reflowing through the plated  
thru-holes causing a rough ground plane surface. A suggested masking material is 2 mil  
thick Kapton® film with silicone adhesive back (Permacel part #P-222).  
3. Apply solder cream (suggest Multicore SN62PRMAB3 or equivalent) using screen  
printing techniques or careful hand application. A layer 4 to 6 mils thick is adequate.  
4. Reflow of the unit to the board may be done in many ways. Using a hot plate is one of  
the most simple. During reflow, pressure (with a clamping arrangement) on the unit is  
recommended, but not absolutely necessary. Absolute maximum reflow temperature is  
260°C for not more than 10 seconds.  
For more information:  
United States *  
Europe*  
Far East/Australasia: (65) 290-6305  
Canada: (416) 206-4725  
Japan: (81 3) 3331-6111  
5. Chemically reclean the unit using the procedures given in step one. Make sure that a flux  
remover is used which is appropriate for the type of solder cream used (Multicore PC81  
is the recommended flux remover for the above mentioned cream).  
*Call your local HP sales office listed  
in your telephone directory. Ask for a  
Components representative.  
It should be noted that there are many alternatives for component attachment. This  
procedure has been found to be simple and effective. For more detailed instructions on how  
to use PlanarPak Products, please see the application note “PlanarPak Users Information”  
Pub. 5963-3232E.  
Data Subject to Change  
Copyright © 1995 Hewlett-Packard Co.  
Printed in U.S.A.  
5963-2587E (10/94)  

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