A1699LUBTN-FSNBL-T [ALLEGRO]
Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output;
| 型号： | A1699LUBTN-FSNBL-T |
| 厂家： | 
ALLEGRO MICROSYSTEMS |
| 描述： | Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output |
| 文件： | 总18页 (文件大小：1026K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
A1699
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
FEATURES AND BENEFITS
DESCRIPTION
• Integrated IC and capacitor, single overmolded package
to reduce external EMI-protection requirements
• Two-wire, pulse-width output protocol
• Highly configurable output protocol options
• Digital output representing target profile
• Speed and direction information of target
• Vibration tolerance
The A1699 is an optimized Hall-effect integrated circuit (IC)
that provides a user-friendly solution for direction detection
and true zero-speed, digital ring-magnet sensing. The small
package can be easily assembled and used in conjunction with
a wide variety of target sensing applications.
TheICemployspatentedalgorithmsforthespecialoperational
requirements of automotive transmission applications. The
speed and direction of the target are communicated through a
variablepulse-widthoutputprotocol.TheA1699isparticularly
adept at handling vibration without sacrificing maximum air
gapcapabilityorcreatinganyerroneousdirectioninformation.
Theadvancedvibrationdetectionalgorithmwillsystematically
calibrate the sensor IC on the initial magnetic poles of true
target rotation and not on vibration, always guaranteeing an
accurate signal in running mode.
□ Small-signal lockout for small amplitude vibration
□ Proprietary vibration detection algorithms for large
amplitude vibration
• Air-gap-independent switchpoints
• Large operating air gap capability
• Undervoltage lockout
• True zero-speed operation
• Wide operating voltage range
• AEC-Q100 automotive qualified
• Robust test-coverage capability with Scan Path and
IDDQ measurement
Advanced signal processing and innovative algorithms make
the A1699 an ideal solution for a wide range of speed- and
direction-sensing needs.
Package: 2-Pin SIP (Suffix UB)
The A1699 is provided in a 2-pin miniature SIP package
(suffix UB) that is lead (Pb) free, with tin leadframe plating.
The UB package includes an IC and capacitor integrated into a
single overmolded package to reduce external EMI protection
requirements.
Not to scale
VCC
Regulator
(Analog)
Regulator
(Digital)
Offset
Adjust
Hall Amp
AGC
Filter
ADC
Synchronous
Digital Controller
Output
Control
Offset
Adjust
Hall Amp
AGC
Filter
ADC
GND
Functional Block Diagram
April 3, 2019
A1699-DS, Rev. 8
MCO-0000636
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Configuration
Complete Part
Number Format
L UB TN -X X X X X -T
A1699
Allegro Identifier and Device Type
Operating Temperature Range
Package Designation
Instructions (Packing)
Leadframe Plating
Allegro Identifier and Device Type
[A1699]
[L]
Operating Temperature Range
Package Designation
Instructions (Packing)
[UB] 2-pin plastic SIP
[TN] Tape and reel
[-F] pin 1-to-2 forward or
[-R] pin 2-to-1 forward
Rotation Direction
[S] single, one pulse per magnetic pole pair or
[D] dual, one pulse for each north and south pole
Number of Pulses
[N] 90 µs (narrow) or
[W] 180 µs (wide)
Reverse Pulse
Width
Configuration
[B] Blanked, no output during Calibration or
[P] Pulses during Calibration
Calibration Pulses
[L] Low vibration immunity with immediate
direction change detection or
[H] High vibration immunity with non-direction
pulses
Vibration Immunity
/ Direction Change
[T] Lead (Pb) free
Leadframe Plating
For example: A1699LUBTN-RSNPL-T
Where a configuration character is unspecified, “x” will be used. For example, -xSNPL applies to both
Rotation Direction configuration variants.
2
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
SELECTION GUIDE
Part Number
Packing*
4000 pieces per 13-in. reel
A1699LUBTN–xxxxx–T
*Contact Allegro™ for additional packing options.
ABSOLUTE MAXIMUM RATINGS*
Characteristic
Symbol
Notes
Refer to Power Derating Section
Rating
28
Unit
V
Supply Voltage
VCC
Reverse Supply Voltage
VRCC
TA
–18
V
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
L temperature range
–40 to 150
165
ºC
ºC
ºC
TJ(max)
Tstg
–65 to 170
INTERNAL DISCRETE CAPACITOR RATINGS
Characteristic
Symbol
Test Conditions
Value (Typ.)
Unit
Nominal Capacitance
CSUPPLY
Connected between VCC and GND
10000
pF
Terminal List Table
Name
Number
Function
VCC
1
Supply Voltage
Ground
GND
2
1
2
Package UB, 2-Pin SIP Pinout Diagram
3
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
OPERATING CHARACTERISTICS: Valid throughout full operating and temperature ranges, unless otherwise specified
Characteristic
ELECTRICAL CHARACTERISTICS
Supply Voltage2
Symbol
Test Conditions
Min.
Typ.1
Max.
Unit
VCC
VCC(UV)
IRCC
Operating, TJ < TJ(max)
4
–
–
3.6
–
24
3.95
–10
–
V
V
Undervoltage Lockout
VCC transitioning from 0 → 5 V or 5 → 0 V
Reverse Supply Current3
Supply Zener Clamp Voltage
VCC = VRCC(max)
–
mA3
V
VZSUPPLY ICC = ICC(max) + 3 mA, TA = 25ºC
ICC(LOW) Low-current state (running mode)
ICC(HIGH) High-current state (running mode)
28
5
–
–
8
mA
mA
12
–
16
Supply Current
ICC(SU)
(LOW)
Low-current level (calibration) and Power-on
mode
5
–
–
8.5
–
mA
–
ICC(HIGH)
ICC(LOW) current
/
Measured as a ratio of high current to low
Supply Current Ratio
OUTPUT
1.9
ΔI/Δt from 10% to 90% ICC level; Corresponds to
measured output slew rate with CSUPPLY
Output Rise Time
tr
tf
–
–
2
2
4
4
μs
μs
ΔI/Δt from 90% to 10% ICC; Corresponds to
measured output slew rate with CSUPPLY
Output Fall Time
OUTPUT PULSE CHARACTERISTICS4
Pulse Width, Forward Rotation
tw(FWD)
38
76
45
90
52
μs
μs
μs
μs
μs
-xxNxx variant
104
207
207
414
Pulse Width, Reverse Rotation
tw(REV)
-xxWxx variant
153
153
306
180
180
360
-xxNPx and -xxNxH variants
-xxWPx and -xxWxH variants
Pulse Width, Non-Direction
tw(ND)
Continued on the next page…
VS
1
VCC
CSUPPLY
2
GND
RL
A1699
VOUT
CL
Figure 1: Typical Application Circuit
4
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise
specified
Characteristic
OPERATING CHARACTERISTICS
Operate Point
Symbol
Test Conditions
Min.
Typ.1
Max.
Unit
BOP
BRP
% of peak-to-peak IC-processed magnetic signal
% of peak-to-peak IC-processed magnetic signal
-xSxxx variant
–
–
0
0
0
0
0
0
0
0
0
0
69
31
–
–
–
%
Release Point
%
12
6
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
Operating Frequency, Forward
Rotation
fFWD
-xDxxx variant
–
-xSNxx variant
–
7
-xDNxx variant
–
3.5
4
Operating Frequency, Reverse
Rotation5
fREV
-xSWxx variant
–
-xDWxx variant
–
2
-xSNxx variant
–
4
-xDNxx variant
–
2
Operating Frquency, Non-Direction
Pulses5
fND
-xSWxx variant
–
2.2
1.1
-xDWxx variant
–
DAC CHARACTERISTICS
Magnitude valid for both differential magnetic
channels
Allowable User-Induced Offset
PERFORMANCE CHARACTERISTICS
Operational Magnetic Range
–300
–
300
G
Peak to peak differential signal; valid for each
magnetic channel.
BIN
30
–
1200
G
-xxxxL variant
See Figure 2
TTARGET
TTARGET
–
–
–
–
deg.
deg.
Vibration Immunity (Startup)
ErrVIB(SU)
-xxxxH variant
0.12 ×
TTARGET
-xxxxL variant
See Figure 2
–
–
deg.
Vibration Immunity (Running Mode)
Magnetic Temperature Coefficient
ErrVIB
-xxxxH variant
TTARGET
–
–
–
–
deg.
TCMAG
Optimized value, for ring magnet
–0.2
%/°C
1 Typical values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits.
2 Maximum voltage must be adjusted for power dissipation and junction temperature; see representative discussions in Power Derating section.
3 Negative current is defined as conventional current coming out of (sourced from) the specified device terminal.
4 Load circuit is RL = 100 Ω and CL = 10 pF. Pulse duration measured at threshold of ( (ICC(HIGH) + ICC(LOW)) /2).
5 Maximum Operating Frequency is determined by satisfactory separation of output pulses: ICC(LOW) of tw(FWD)(MIN). If the customer can resolve shorter low-state durations,
maximum fREV and fND may be increased.
360º (degrees prime)
S
N
S
N
Target
VSP
VPROC(BOP)
TTARGET
TVPROC
(BOP
)
VPROC
VPROC(pk-pk)
(BRP
)
VPROC(BRP)
VPROC = the processed analog signal of the sinusoidal magnetic input (per channel)
VSP
VSP
VPROC(pk-pk)
TTARGET = the period between successive sensed target magnetic edges of the same
polarity (either both north-to-south or both south-to-north)
VSP(sep)
=
Figure 2: Definition of TTARGET
5
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise
specified
Characteristic
INPUT MAGNETIC CHARACTERISTICS
BSEQ(n+1)
Symbol
Test Conditions
Min.
Typ.1
Max.
Unit
/
Signal cycle-to-cycle variation (see Figure 3)
Overall signal variation (see Figure 3)
0.6
0.4
–
–
–
–
–
–
BSEQ(n)
Allowable Differential Sequential
Signal Variation
BSEQ(n+i)
BSEQ(n)
/
CALIBRATION
Amount of target rotation
(constant direction) following
power-on until first electrical
output pulse of either tw(FWD)
or tw(REV). See Figure 2
BIN > 60 GPP
BIN ≤ 1200 GPP
2 ×
TTARGET
<3 ×
TTARGET
–
–
degrees
degrees
First Direction Output Pulse6
30 GPP ≤ BIN
BIN ≤ 60 GPP
2.5 ×
TTARGET
<4 ×
TTARGET
Amount of target rotation
(constant direction) following
event until first electrical
output pulse of either tw(FWD)
or tw(REV). VSP(sep) ≥ 35.
See Figure 2
switch-
point
-xxxxL variant
-xxxxH variant
–
1
–
First Direction Pulse Output Following
Direction Change
NCD
1 ×
TTARGET
2 ×
TTARGET
3 ×
TTARGET
degrees
1.25 ×
TTARGET
Amount of target rotation
(constant direction) following
event until first electrical
output pulse of either tw(FWD)
or tw(REV). See Figure 2
-xxxxL variant
-xxxxH variant
–
–
degrees
degrees
First Direction Pulse Output Following
Running Mode Vibration
1 ×
TTARGET
2 ×
TTARGET
3 ×
TTARGET
Minimum separation between channels as a
percentage of signal amplitude at each switching
point. See Figure 2
%
pk-pk
Switch Point Separation
VSP(sep)
20
–
–
6 Power-up frequencies ≤ 200 Hz. Higher power-on frequencies may require more input magnetic cycles until output edges are achieved.
BSEQ(n)
BSEQ(n + 1)
BSEQ(n+1), i ≥ 2
Figure 3: Differential Signal Variation
6
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
THERMAL CHARACTERISTICS
Characteristic
Package Thermal
Resistance
Symbol
Test Conditions*
Value
Unit
RθJA
Single-layer PCB with copper limited to solder pads
213
ºC/W
*Additional thermal information is available on the Allegro website.
Power Derating Curve
26
24
22
20
18
16
14
12
10
8
VCC(max)
RθJA = 213 °C/W
6
VCC(min)
4
2
0
20
40
60
80
100
120
140
160
Ambient Temperature, TA (ºC)
Power Dissipation versus Ambient Temperature
1000
900
800
700
600
500
400
300
200
100
0
RθJA = 213 °C/W
20
40
60
80
100
120
140
160
Ambient Temperature, TA (ºC)
7
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
CHARACTERISTIC PERFORMANCE
Supply Current
18
16
14
12
18
VCC = 4 V
TA = +25ºC
16
14
12
ICC HIGH
ICC HIGH
10
8
10
8
6
4
6
4
ICC LOW
ICC LOW
0
50
0
10
SUPPLY VOLTAGE (V)
25
100
150
5
20
-50
-25
125
25
75
15
AMBIENT TEMPERATURE (ºC)
18
16
14
12
18
16
14
12
VCC = 24 V
TA = +150ºC
ICC HIGH
ICC HIGH
10
8
10
8
ICC LOW
6
4
6
4
ICC LOW
0
50
AMBIENT TEMPERATURE (ºC)
0
10
25
100
150
5
20
-50
-25
125
25
75
15
SUPPLY VOLTAGE (V)
8
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Supply Current Ratio
5
4.5
4
5
Vcc= 4 V
TA = +25°C
4.5
4
3.5
3
3.5
3
ICCRATIO
2.5
2
2.5
2
ICCRATIO
1.5
1
1.5
1
0.5
0
0.5
0
-50
-25
0
25
50
75
100
125
150
0
5
10
15
20
25
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
5
4.5
4
5
4.5
4
Vcc = 24 V
TA = +150°C
3.5
3
3.5
3
2.5
2
2.5
2
ICCRATIO
ICCRATIO
1.5
1
1.5
1
0.5
0
0.5
0
0
5
10
15
20
25
-50
-25
0
25
50
75
100
125
150
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (°C)
9
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Pulse Width
500
500
450
400
350
300
250
200
150
100
50
TA = +25°C
Vcc = 4 V
NON DIRECTION (-xxWPx and -xxWxH variants)
450
NON DIRECTION (-xxWPx and -xxWxH variants)
400
350
300
250
REVERSE ( -xxWxx variant )
200
REVERSE ( -xxWxx variant )
150
REVERSE ( -xxNxx variant )
100
REVERSE ( -xxNxx variant )
FORWARD
FORWARD
50
0
0
0
5
10
15
20
25
-50
-25
0
25
50
75
100
125
150
SUPPLY VOLTAGE (V)
AMBIENT TEMPERATURE (°C)
500
450
400
350
300
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
TA = +150°C
Vcc = 24 V
NON DIRECTION (-xxWPx and -xxWxH variants)
NON DIRECTION (-xxWPx and -xxWxH variants)
REVERSE ( -xxWxx variant )
REVERSE ( -xxWxx variant )
REVERSE ( -xxNxx variant )
FORWARD
REVERSE ( -xxNxx variant )
FORWARD
0
0
-50
-25
0
25
50
75
100
125
150
0
5
10
15
20
25
AMBIENT TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
10
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
FUNCTIONAL DESCRIPTION
Sensing Technology
Direction Detection
The sensor IC contains a single-chip Hall-effect circuit that
supports a trio of Hall elements. These elements are used in
The sensor IC compares the relative phase of its two differential
channels to determine which direction the target is moving. The
differential pairs to provide electrical signals containing informa- relative switching order is used to determine the direction, which
tion regarding edge position and direction of target rotation. The
A1699 is intended for use with ring magnet and gear targets.
is communicated through the output protocol.
Data Protocol Description
After proper power is applied to the sensor IC, it is capable of
providing digital information that is representative of the mag-
netic features of a rotating target. The waveform diagrams in
Figure 4 present the automatic translation of the target profiles to
the digital output signal of the sensor IC
When a target passes in front of the device (opposite the branded
face of the package case), the A1699 generates an output pulse(s)
for each pair of magnetic poles of the target. Speed information is
provided by the output pulse rate, while direction of target rota-
tion is provided by the duration of the output pulses. The sensor
IC can sense target movement in both the forward and reverse
directions.
Target
Package Case Branded Face
Device Orientation to Target
Package Case
Branded Face
Device Orientation to Target
IC
E3
E2
E1
(Pin 2 Side)
(Top View of
(Pin 1 Side)
(Pin 1
Side)
(Top View of
Package Case)
(Pin 2
Side)
IC
Channel B
Element Pitch
Channel A
Element Pitch
E3
E1
E2
Pole Piece
Package Case)
(Concentrator)
Back-Biasing
Rare-Earth Pellet
B Channel
South Pole
A Channel
Mechanical Position (Target moves past device pin 1 to pin 2)
North Pole
Target
(Radial Ring Magnet)
This pole
sensed later
This pole
sensed earlier
Mechanical Position (Target moves past device pin 1 to pin 2)
N
S
N
This tooth
sensed later
This tooth
sensed earlier
Target Magnetic Profile
Channel
Element Pitch
+B
Target Magnetic Profile
+B
Channel
Element Pitch
–B
IC Internal Differential Analog Signals, VPROC
BOP BOP
IC Internal Differential Analog Signals, VPROC
BOP
A Channel
A Channel
BRP
BOP
BRP
BOP
B Channel
B Channel
BRP
BRP
Detected Channel Switching
Detected Channel Switching
A Channel
A Channel
B Channel
B Channel
Device Output Signal
Device Output Signal
CC(High)
I
CC(High)
I
I
I
CC(Low)
CC(Low)
Figure 4: The magnetic profile reflects the features of the target, allowing the sensor IC to present an accurate
digital output (-xSxxx variant shown).
11
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
face. For targets rotating from pin 2 to 1, this shift (Δfwd with R
variants, with south pole of backbiasing pellet toward IC) results
Forward Rotation (see Figure 5)
When the target is rotating such that a magnetic pole near the
sensor IC (of -Fxxxx variant) passes from pin 1 to pin 2, this is
referred to as forward rotation. This direction is opposite for the
-Rxxxx variant. Forward rotation is indicated by output pulse
widths of tw(FWD) (45 μs typical).
in the pulse corresponding to the valley with the sensed mechani-
cal edge; for targets rotating from pin 1 to 2, the shift (Δrev)
results in the pulse corresponding to the tooth with the sensed
edge. Figure 7 shows pulse timing for F variants. The sensed
mechanical edge that stimulates output pulses is kept the same for
both forward and reverse rotation by using only one channel to
control output switching.
Reverse Rotation (see Figure 5)
When the target is rotating such that a magnetic pole passes from
pin 2 to pin 1, it is referred to as reverse rotation for the -Fxxxx
variant. This direction is opposite for the -Rxxxx variant. Reverse
rotation is indicated by output pulse widths of tw(REV) (90 μs typi-
cal for -xxNxx variant, or 180 μs typical for -xxWxx variant).
Direction Validation
For the -xxxxL variant, following a direction change in run-
ning mode, direction changes are immediately transmitted to the
output.
Timing
For the -xxxxH variant, following a direction change in running
mode, output pulses have a width of tw(ND) until direction infor-
mation is validated.
As shown in Figure 6, the pulse appears at the output slightly
before the sensed magnetic edge traverses the package branded
Pin 2 to 1 Rotation
Pin 1 to 2 Rotation
Valley
Tooth
Δfwd
tw(FWD)
Branded Face
of Sensor
Rotating Target
Output Pulse
(Pin 2 to 1 Rotation)
N
S
S
N
N
S
S
N
t
S
N
Δrev
tw(REV)
Pin 1
Pin 2
(A) Forward Rotation
Output Pulse
(Pin 1 to 2 Rotation)
Figure 6: Output Protocol (-RSxxx variant)
Branded Face
of Sensor
Rotating Target
Δrev
N
S
tw(REV)
S
N
N
S
S
N
S
N
Pin 1
Pin 2
Output Pulse
(Pin 2 to 1 Rotation)
(B) Reverse Rotation
t
Δfwd
tw(FWD)
Figure 5: Target Rotation for -Fxxxx Variant.
-Rxxxx variant inverts detected direction of rotation.
Output Pulse
(Pin 1 to 2 Rotation)
Figure 7: Output Protocol (-FDxxx variant)
12
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Target Rotation Forward
Target Rotation Reverse
N
S
N
S
S
N
S
N
Target
Differential
Magnetic
Profile
tw(REV)
tw(REV)
tw(FWD)
tw(FWD)
IOUT
t
Figure 8: Example Running Mode Direction Change (-FSxxL variant)
Target Rotation Forward
Target Rotation Reverse
N
S
N
S
S
N
S
N
Target
Differential
Magnetic
Profile
tw(ND)
tw(REV)
tw(FWD)
tw(FWD)
IOUT
t
Figure 9: Example Running Mode Direction Change (-FSxxH variant)
13
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Startup Detection/Calibration
VPROC in the internal A-to-D range to allow for acquisition of
signal peaks. AOA and AGC function separately on the two dif-
ferential signal channels.
When power is applied to the A1699, the sensor IC internally
detects the profile of the target. The gain and offset of the
detected signals are adjusted during the calibration period, nor-
malizing the internal signal amplitude for the air gap range of the
device.
Direction information is available after calibration is complete.
For the -xxxBx variant, the output becomes active at the end of
calibration. Figure 10 shows where the first output edges may
occur for various starting target phases.
The Automatic Gain Control (AGC) feature ensures that opera-
tional characteristics are isolated from the effects of installation
air gap variation.
For the -xxxPx variant, output pulses of tw(ND) are supplied dur-
ing calibration. Figure 11 shows where the first output edges may
occur for various starting target phases.
Automatic Offset Adjustment (AOA) is circuitry that compen-
sates for the effects of chip, magnet, and installation offsets.
This circuitry works with the AGC during calibration to adjust
Target Rotation
N
S
N
S
N
S
N
S
N
Target
Differential
Magnetic
Profile
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
Opposite
north pole
Opposite
N→S boundary
I
CC
Opposite
south pole
Opposite
t
S→N boundary
Device Location at Power-On
Figure 10: Startup Position Effect on First Device Output Switching (-xxxBx variant)
Target Rotation
N
S
N
S
N
S
N
S
N
Target
Differential
Magnetic
Profile
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(ND)
tW(ND)
tW(ND)
tW(ND)
Opposite
north pole
tW(ND)
tW(ND)
Opposite
N→S boundary
I
CC
Opposite
south pole
tW(ND)
tW(ND)
Opposite
t
S→N boundary
Device Location at Power-On
Figure 11: Startup Position Effect on First Device Output Switching (-xxxPx variant)
14
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Vibration Detection
ing the proper direction information will resume when direction
information is validated on constant target rotation.
Algorithms embedded in the IC’s digital controller detect the
presence of target vibration through analysis of the two magnetic
input channels.
For the -xxxxH variant, in the presence of vibration, output pulses
of tw(ND) may occur or no pulses may occur, depending on the
amplitude and phase of the vibration. Output pulses have a width
of tw(ND) until direction information is validated on constant
target rotation.
For the -xxxxL variant, the first direction change is immediately
transmitted to the output. During any subsequent vibration, the
output is blanked and no output pulses will occur for vibrations
less than the specified vibration immunity. Output pulses contain-
Normal Target Rotation
Normal Target Rotation
Vibration
S
N
S
N
S
N
S
N
Target
Differential
Magnetic
Profile
tW(FWD)
[or tW(REV)]
tW(FWD)
[or tW(REV)]
tW(REV)
[or tW(FWD)]
tW(FWD)
[or tW(REV)]
tW(FWD)
[or tW(REV)]
t
Figure 12: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxL variant)
Normal Target Rotation
Normal Target Rotation
Vibration
S
N
S
N
S
N
S
N
Target
Differential
Magnetic
Profile
tW(FWD)
tW(FWD)
tW(FWD)
tW(ND)
tW(ND)
[or tW(REV)]
[or tW(REV)]
[or tW(REV)]
tW(ND)
tW(ND)
tW(ND)
tW(FWD)
tW(FWD)
tW(FWD)
[or tW(REV)]
[or tW(REV)]
[or tW(REV)]
t
Figure 13: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxH variant)
15
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
POWER DERATING
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max)
at a selected RθJA and TA.
,
Example: Reliability for VCC at TA = 150°C.
Observe the worst-case ratings for the device, specifically:
RθJA = 213°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and ICC(mean)
= 14.8 mA. (Note: For variant -xxWPx, at maximum target
frequency, ICC(LOW) = 8 mA, ICC(HIGH) = 16 mA, and maximum
pulse widths, the result is a duty cycle of 84% and thus a worst-
case mean ICC of 14.8 mA.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
UB, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RθJC, is
relatively small component of RθJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
∆Tmaxꢀ=ꢀTJ(max)ꢀ–ꢀTA = 165 °C – 150 °C = 15 °C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD(max)ꢀ=ꢀ∆Tmax ÷ RθJAꢀ=ꢀ15°Cꢀ÷ꢀ213ꢀ°C/Wꢀ(estimated)ꢀ=ꢀ70.4ꢀ
mW
PD = VIN × IIN
∆Tꢀ=ꢀPD × RθJA
TJꢀ=ꢀTAꢀ+ꢀ∆Tꢀꢀ
(1)
(2)
(3)
Finally, invert equation 1 with respect to voltage:
ꢀ
ꢀ
ꢀ
ꢀ
V
CC(est) = PD(max) ÷ ICC(max)ꢀ=ꢀ70.4ꢀmWꢀ÷ꢀ14.8ꢀmAꢀ=ꢀ4.7ꢀV
The result indicates at TA, the application and device can dissi-
pate adequate amounts of heat at voltages ≤ VCC(est)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, RθJAꢀ=ꢀ213ꢀ°C/W, and Iccꢀ=ꢀ6.5ꢀmA, then:
.
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
PD = VCC × ICCꢀ=ꢀ12ꢀVꢀ×ꢀ6.5ꢀmAꢀ=ꢀ78ꢀmW
ꢀ
ꢀ
∆Tꢀ=ꢀPD × RθJAꢀ=ꢀ78ꢀmWꢀ×ꢀ213ꢀ°C/Wꢀ=ꢀ16.6°C
TJꢀ=ꢀTAꢀ+ꢀ∆Tꢀ=ꢀ25°Cꢀ+ꢀ16.6°Cꢀ=ꢀ41.6°C
16
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
(Reference DWG-0000408, Rev. 1)
Dimensions in millimeters – NOT TO SCALE
Dimensions exclusive of mold flash, gate burs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.06
–0.05
4.00
B
4×10°
E 1.45
1.50 0.05
1.45 E
C
0.55 E
1.41 E
Mold Ejector
Pin Indent
+0.06
4.00
–0.07
E
E1
E3
E2
E
E
45°
Branded
Face
NNN
A
YYWW
0.85 0.07
LLLL
0.42 0.10
4 × 2.50 0.10
0.25 REF
0.30 REF
2.54 REF
D
Standard Branding Reference View
= Supplier emblem
N
Y
W
L
= Last three digits of device part number
= Last 2 digits of year of manufacture
= Week of manufacture
1
2
18.00 0.10
12.20 0.10
= Lot number
1.00 0.10
+0.07
0.25
4 × 7.37 REF
1.80 0.10
–0.03
A
B
C
D
E
F
Dambar removal protrusion (8×)
Gate and tie burr area
Active Area Depth, 0.38 mm 0.03
0.38 REF
0.25 REF
Branding scale and appearance at supplier discretion
Hall elements (E1, E2, and E3); not to scale
Molded Lead Bar for preventing damage to leads during shipment
4 × 0.85 REF
0.85 0.07
+0.06
1.80
–0.07
F
+0.06
4.00
1.50 0.05
–0.05
Figure 14: Package UB, 2-Pin SIP
17
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Two-Wire, Differential, Vibration-Resistant
Sensor IC with Speed and Direction Output
A1699
Revision History
Number
Date
Description
–
1
2
3
March 1, 2014
October 7, 2014
December 12, 2014
March 24, 2015
Initial release.
Updated Package Outline Drawing and reformatted document.
Revised CSUPPLY, tr, and tf.
Updated branding on Package Outline Drawing.
Updated Hall element number and positions in top outline of Package Outline Drawing; updated
4
5
September 23, 2015 Figures 6 and 7 and associated text on page 12; updated Pulse Width Characteristic Performance
plots on page 10; removed bulk offering on page 2-3; additional editorial changes.
Updated Package Outline Drawing molded lead bar footnote and Internal Discrete Capacitor
March 1, 2016
Ratings table.
6
7
8
April 7, 2016
September 23, 2016 Updated Package Outline Drawing.
April 3, 2019 Minor editorial updates
Corrected Figure 6 and 7 captions.
Copyright 2019, Allegro MicroSystems.
Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit
improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor
for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
For the latest version of this document, visit our website:
www.allegromicro.com
18
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
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