A19570LUBBTN-FDWPL-A [ALLEGRO]

Large Air Gap, Vibration-Immune, GMR Transmission Speed and Direction Sensor IC;
A19570LUBBTN-FDWPL-A
型号: A19570LUBBTN-FDWPL-A
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

Large Air Gap, Vibration-Immune, GMR Transmission Speed and Direction Sensor IC

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A19570  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
FEATURES AND BENEFITS  
DESCRIPTION  
• GMR technology integrates high sensitivity MR  
(magnetoresistive) sensor elements and high precision  
BiCMOS circuits on a single silicon integrated circuit  
offering high accuracy, low magnetic field operation  
• Integrated capacitor in a single overmolded miniature  
package provides greater EMC robustness  
• SolidSpeed Digital Architecture supports advanced  
algorithms, maintaining performance in the presence of  
extreme system-level disturbances, including vibration  
immunity capability over the full target pitch  
• Flexible orientation for xMR or Hall replacement and  
application installation flexibility  
• ASIL B rating based on integrated diagnostics and  
certified safety design process  
• Two-wire current source output pulse-width protocol  
supporting speed, direction, and ASIL  
• EEPROM offers device traceability throughout the  
production process  
The A19570 is a giant magnetoresistance (GMR) integrated  
circuit (IC) that provides a user-friendly two-wire solution  
for applications where speed and direction information is  
required. The small integrated package includes an integrated  
capacitor and GMR IC in a single overmolded design with an  
additional molded lead stabilizing bar for robust shipping and  
ease of assembly.  
The GMR-based IC is designed for use in conjunction with  
front-biased ring magnet encoders. State-of-the-art GMR  
technologywithindustry-leadingsignalprocessingalgorithms  
accuratelyswitchinresponsetolow-leveldifferentialmagnetic  
signals.ThehighsensitivityofGMRcombinedwithdifferential  
sensing offers inherent rejection of interfering common-mode  
magnetic fields and valid speed and direction sensing over  
largerairgaps,commonlyrequiredintransmissionapplications.  
Patented GMR technology allows the same IC orientation as  
other MR technologies or the IC can be rotated for Hall-effect  
compatibility as a drop-in solution in the application.  
2
IntegrateddiagnosticsareusedtodetectanICfailurethatwould  
impact the output protocol’s accuracy, providing coverage  
compatiblewithASILBcompliance.Built-inEEPROMscratch  
memory offers traceability of the device throughout the IC’s  
production process.  
-
SOLIDSPEED  
DIGITAL ARCHITECTURE  
PACKAGE:  
2-Pin SIP  
(suffix UB)  
The IC is offered in the UB package, which integrates the IC  
andahightemperatureceramiccapacitorinasingleovermolded  
SIP package for enhanced EMC performance. The 2-pin SIP  
package is lead (Pb) free, with tin leadframe plating.  
Not to scale  
VCC  
+
ADC  
Output  
Current  
Generator  
ESD  
Analog-to-Digital  
Front End  
Amplification  
Digital  
Controller  
GMR  
Elements  
and  
Signal Conditioning  
+
ADC  
GND  
EEPROM  
Oscillator  
Diagnostics  
Regulator  
Figure 1: Functional Block Diagram  
A19570-DS  
November 14, 2018  
MCO-0000525  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
SELECTION GUIDE  
Configuration Options  
A19570 L UBB TN-  
-
ASIL Protocol:  
A – ASIL Protocol enabled  
[blanked] – ASIL Protocol disabled  
Vibration Immunity/Direction Change:  
L – No vibration immunity with immediate direction-change detection  
H – High vibration immunity  
Non-Direction Pulses:  
B – Blanked, no output during calibration or vibration  
P – Pulses during calibration or vibration  
Reverse Pulse Width:  
N – 90 µs (narrow)  
W – 180 µs (wide)  
Number of Pulses:  
S – Single, one pulse per pole-pair  
D – Dual, one pulse per each N and S pole of a pole-pair  
Rotation Direction:  
F – Forward rotation, pin 1 to pin 2  
R – Forward rotation, pin 2 to pin 1  
Instructions (Packing)  
Package Designation  
Operating Temperature Range  
Allegro Identifier and Device Type  
SELECTION GUIDE*  
Part Number  
Packing  
Tape and Reel, 4000 pieces per reel  
A19570LUBBTN-FSWPH  
A19570LUBBTN-RSWPH  
* Not all combinations are available. Contact Allegro sales for availability and pricing of  
custom programming options.  
2
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
SPECIFICATIONS  
ABSOLUTE MAXIMUM RATINGS  
Characteristic  
Symbol  
Notes  
Refer to Power Derating section;  
Potential between pin 1 and pin 2  
Rating  
Unit  
Supply Voltage  
VCC  
28  
V
Reverse Supply Voltage  
VRCC  
TA  
–18  
–40 to 150  
165  
V
Operating Ambient Temperature  
Maximum Junction Temperature  
Storage Temperature  
°C  
°C  
°C  
G
TJ(max)  
Tstg  
–65 to 170  
500  
Applied Magnetic Flux Density  
B
In any direction  
INTERNAL DISCRETE CAPACITOR RATINGS  
Characteristic  
Symbol  
Test Conditions  
Value  
Unit  
Nominal Capacitance  
CSUPPLY  
Connected between pin 1 and pin 2 (refer to Figure 2)  
10  
nF  
PINOUT DIAGRAM AND TERMINAL LIST  
VCC  
1
A19570  
IC  
1
2
2
VOUT = ICC × RL  
CL  
RL  
Package UB, 2-Pin SIP Pinout Diagram  
Terminal List Table  
GND  
Pin Name  
Pin Number  
Function  
Supply Voltage  
Ground  
VCC  
GND  
1
2
Figure 2: Application Circuit  
3
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
OPERATING CHARACTERISTICS: Valid throughout full operating voltage and ambient temperature ranges,  
unless otherwise specified  
Characteristic  
ELECTRICAL CHARACTERISTICS  
Supply Voltage[2]  
Symbol  
Test Conditions  
Min.  
Typ. [1]  
Max.  
Unit  
VCC  
IRCC  
Potential between pin 1 and pin 2  
VCC = VRCC(MAX)  
4
24  
V
Reverse Supply Current[3]  
–10  
mA  
ICC = ICC(MAX) + 3 mA, TA = 25°C;  
Potential between pin 1 and pin 2  
Supply Zener Clamp Voltage  
Supply Current  
VZsupply  
28  
V
ICC(LOW)  
ICC(HIGH)  
ICC(HIGH)  
ICC(LOW)  
Low-current state  
High-current state  
5.9  
12  
7
8.4  
16  
mA  
mA  
14  
/
Measured as a ratio of high current to low  
current (isothermal)  
Supply Current Ratio [4]  
ASIL Safe State Current  
1.9  
1.5  
3.9  
IRESET  
Refer to Figure 12 (-xxxxx-A variant)  
3.5  
90  
mA  
μs  
Refer to Figure 12 (-xxxxx-A variant) (Error  
Protocol 1)  
tRESET(EP1)  
ASIL Safe State Current Time  
Refer to Figure 12 (-xxxxx-A variant) (Error  
Protocol 2)  
tRESET(EP2)  
3
2
6
4
ms  
µs  
Voltage measured at terminal 2 in Figure 2;  
RL = 100 Ω, CL = 10 pF, measured between  
10% and 90% of ICC(LOW) and ICC(HIGH)  
Output Rise/Fall Time  
tr, tf  
POWER-ON CHARACTERISTICS  
Power-On State  
POS  
tPO  
V
CC > VCC(min), as connected in Figure 2  
ICC(LOW)  
mA  
ms  
Power-On Time  
VCC > VCC(min), as connected in Figure 2 [5]  
1
OUTPUT PULSE-WIDTH PROTOCOL [6]  
Forward Pulse Width  
tw(FWD)  
-xxNxx variant and -xxWxx variant  
-xxNxx variant  
38  
76  
45  
90  
52  
μs  
μs  
μs  
μs  
μs  
104  
207  
207  
414  
Reverse Pulse Width  
tw(REV)  
-xxWxx variant  
153  
153  
306  
180  
180  
360  
-xxNPx variant  
Nondirection Pulse Width  
tw(ND)  
-xxWPx variant  
[1] Typical values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits.  
[2] Maximum voltage must be adjusted for power dissipation and junction temperature; see representative Power Derating section.  
[3] Negative current is defined as conventional current coming out of (sourced from) the specified device terminal.  
[4] Supply current ratio is taken as a mean value of ICC(HIGH) / ICC(LOW)  
.
[5] Time between power-on to ICC stabilizing. Transitions prior to tPO should be ignored.  
[6] Pulse width measured at threshold of (ICC(HIGH) + ICC(LOW)) / 2. ASIL Safe State Current Time is measured at the threshold of (IRESET + ICC(LOW)) / 2.  
Continued on the next page…  
4
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
OPERATING CHARACTERISTICS (continued): Valid throughout full operating voltage and ambient temperature ranges,  
unless otherwise specified  
Characteristic  
Symbol  
Test Conditions  
Min.  
Typ. [1]  
Max.  
Unit  
INPUT CHARACTERISTICS AND PERFORMANCE  
Operating Frequency, Forward  
Rotation [7]  
fFWD  
-xSxxx variant  
0
12  
kHz  
-xSNxx variant  
-xSWxx variant  
-xSNPx variant  
-xSWPx variant  
0
0
0
0
7
4
kHz  
kHz  
kHz  
kHz  
Operating Frequency, Reverse  
Rotation [7]  
fREV  
4
Operating Frequency, Nondirection  
Pulses [7]  
fND  
2.2  
Minimum allowable for switching in Parallel  
Orientation (refer to Figure 8)  
5
G
Operating Differential Magnetic Input [8] BDIFF(pk-pk)  
Minimum allowable for switching in  
Perpendicular Orientation (refer to Figure 9)  
11  
–50  
60  
G
G
%
Operating Differential Magnetic Range [8]  
BDIFF  
Refer to Figure 6  
50  
BSEQ(n+1)  
BSEQ(n)  
/
Signal period-to-period variation (refer to Figure 3)  
200  
Allowable Differential Sequential  
Signal Variation  
BSEQ(n+i)  
BSEQ(n)  
/
Overall signal variation (run-out) (refer to Figure 3)  
40  
200  
%
Operate Point  
Release Point  
Target Pitch  
BOP  
BRP  
% of peak-to-peak IC-processed signal  
% of peak-to-peak IC-processed signal  
Arc length of each pole-pair (at 0 mm air gap)  
Required amount of amplitude separated  
70  
30  
8
%
%
TPITCH  
1.4  
mm  
Switch Point Separation  
BDIFF(SP-SEP) between channels at each BOP and BRP  
occurrence. (refer to Figure 5)  
20  
%pk-pk  
THERMAL CHARACTERISTICS  
Magnetic Temperature Coefficient[9]  
Package Thermal Resistance  
TC  
Valid for full temperature range based on ferrite  
Single-layer PCB with copper limited to solder pads  
0.2  
%/°C  
°C/W  
RθJA  
213  
[7] Maximum Operating Frequency is determined by satisfactory separation of output pulses: ICC(LOW) of tw(FWD)(min). If the customer can resolve shorter low-state durations, maximum fREV  
and fND may be increased.  
[8] Differential magnetic field is measured for the Channel A (E1-E3) and Channel B (E2-E4). Each channel’s differential magnetic field is measured between two GMR elements spaced by  
1.4 mm. Magnetic field is measured in the By direction (Refer to Figure 7). To maintain optimal performance, it is recommended that the |Bx| field be less than 80 G.  
[9] Ring magnet decreases strength with rising temperature, and the device compensates. Note that BDIFF(pk-pk) requirement is not influenced by this.  
Continued on the next page…  
5
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
OPERATING CHARACTERISTICS (continued): Valid throughout full operating voltage and ambient temperature ranges,  
unless otherwise specified  
Characteristic  
Symbol  
Test Conditions  
Min.  
Typ. [1]  
Max.  
Unit  
PERFORMANCE CHARACTERISTICS  
2 ×  
TCYCLE  
-xSxxH variant  
-xSxxL variant  
-xSxxH variant  
-xSxxL variant  
-xSxxH variant  
-xSxxL variant  
-xSxxH variant  
-xSxxL variant  
-xSxxH variant  
-xSxxL variant  
-xSxxH variant  
-xSxxL variant  
Vibration Immunity Startup  
ErrVIB(SU)  
0.06 ×  
TCYCLE  
2 ×  
TCYCLE  
Vibration Immunity Running Mode  
First Direction Output Pulse [10]  
ErrVIB  
0.03 ×  
TCYCLE  
4 ×  
TCYCLE  
4 ×  
TCYCLE  
4 ×  
TCYCLE  
First Direction-Pulse Output Following  
Direction Change [10]  
1.75 ×  
TCYCLE  
4.25 ×  
TCYCLE  
First Direction-Pulse Output Following  
Startup Mode Vibration [10]  
3.75 ×  
TCYCLE  
4.25 ×  
TCYCLE  
First Direction-Pulse Output Following  
Running Mode Vibration [10]  
3.75 ×  
TCYCLE  
[10] Power-up frequencies ≤ 1 kHz. Rotational frequencies above 1 kHz may require more input magnetic cycles until output edges are achieved.  
Target  
S
N
S
N
B SEQ(n)  
B SEQ(n + 1)  
TCYCLE  
B SEQ(n+i) , i ≥ 2  
BDIFF  
TCYCLE = Target Cycle; the amount of rotation that  
moves one north pole and one south pole  
across the sensor  
BDIFF = Differential Input Signal; the differential magnetic  
flux density sensed by the sensor  
Figure 3: Differential Signal Variation  
Figure 4: Definition of TCYCLE  
6
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
S
N
S
N
TCYCLE  
BDIFF(SP)  
BDIFF(BOP)  
(BOP  
)
Channel B  
BDIFF(pk-pk)  
(BRP  
)
BDIFF(BRP)  
BDIFF(SP)  
Channel A  
BDIFF(SP)  
BDIFF(pk-pk)  
BDIFF(SP-SEP)  
=
Figure 5: Definition of Switch Point Separation  
ꢂꢃꢄꢄꢅMAꢊꢆ  
Aꢈꢈlied ꢁꢂꢃꢄꢄ  
ꢂꢃꢄꢄꢅꢈꢉ-ꢈꢉꢆ  
0 ꢀ  
ꢂꢃꢄꢄꢅMꢃNꢆ  
ꢇime  
Figure 6: Input Signal Definition  
7
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
FUNCTIONAL DESCRIPTION  
The A19570 sensor IC contains a single-chip GMR circuit that  
uses spaced elements. These elements are used in differential  
pairs to provide electrical signals containing information regard-  
ing speed and direction of target rotation. The A19570 is intended  
for use with ring magnet targets.  
Installation Orientation Flexibility  
The A19570 can be installed in a parallel, perpendicular, or any  
orientation in between with respect to the ring magnet. Refer to  
Figure 7, Figure 8, and Figure 9 for parallel and perpendicular  
orientations of the sensor.  
The IC detects the peaks of the magnetic signals and sets  
dynamic thresholds based on these detected signals.  
ꢀꢁ  
ꢀy  
ꢀꢂ  
Pin 1  
Figure 7: Package Orientation  
Pin 1  
Rotation  
Rotation  
Pin 1  
Figure 9: Perpendicular Orientation  
Figure 8: Parallel Orientation  
8
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
Forward Rotation. For the -Fxxxx variant, when the target is  
rotating such that a target feature passes from pin 1 to pin 2, this  
Data Protocol Description  
When a target passes in front of the device (opposite the branded  
face of the package case), the A19570 generates an output pulse  
for each magnetic pole-pair (-xSxxx variant) of the target. Speed  
information is provided by the output pulse rate, while direction  
of target rotation is provided by the duration of the output pulses.  
The sensor IC can sense target movement in both the forward and  
reverse directions.  
is referred to as forward rotation. This direction of rotation is  
indicated on the output by a tW(FWD) pulse width. For the -Rxxxx  
variant, forward direction is indicated for target rotation from pin  
2 to 1.  
Reverse Rotation. For the -Fxxxx variant, when the target  
is rotating such that a target feature passes from pin 2 to pin 1,  
this is referred to as reverse rotation. This direction of rotation is  
indicated on the output by a tW(REV) pulse width. For the -Rxxxx  
variant, reverse direction is indicated for target rotation from pin  
1 to 2.  
Output edges are triggered by BDIFF transitions through the  
switchpoints. On a crossing, the output pulse of ICC(HIGH) is pres-  
S
N
N
Pacꢇage Case ꢀranded ꢈace  
Device Orientation to Target  
ent for tw(FWD) or tw(REV)  
.
ꢀꢁ  
ꢅPin ꢄ Sideꢆ  
Channel ꢀ  
ꢂꢃ ꢂ3 ꢂꢄ ꢂ1  
ꢅPin 1 Sideꢆ  
The IC is always capable of properly detecting input signals up to  
the defined operating frequency. At frequencies beyond the oper-  
ational frequency specifications (refer to Operational Frequency  
specifications noted on page 5), the ICC(HIGH) pulse duration will  
collide with subsequent pulses.  
oꢌ ꢍiew oꢎ  
Pacꢇage Caseꢆ ꢂlement Pitch  
Channel A  
ꢂlement Pitch  
Mechanical Position (Target moves past device pin 1 to pin 2)  
arget  
ꢋhis ꢌole  
sensed later  
ꢋhis ꢌole  
sensed earlier  
ꢅRadial Ring Magnetꢆ  
Target Magnetic Profile  
Channel  
ꢂlement Pitch  
ꢉꢀ  
N
S
N
S
ꢊꢀ  
ICC(HIGH)  
tW(FWD)  
tW(FWD)  
IC Internal Differential Analog Signals, BDIFF  
ꢁP  
ꢁP  
ICC(LOW)  
Channel A  
RP  
ꢁP  
Channel ꢀ  
Figure 11: Output Timing Example (-xSxxx variant)  
RP  
Detected Channel Switching  
Channel A  
Channel ꢀ  
Device Output Signal  
CCꢅHꢏꢐHꢆ  
CCꢅLꢁꢑꢆ  
Figure 10: Basic Operation  
9
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
ASIL Safe State Output Protocol  
The A19570 sensor IC contains diagnostic circuitry that will  
continuously monitor occurrences of failure defects within the IC.  
Refer to Figure 12 for the output protocol of the ASIL safe state  
after an internal defect has been detected. Error Protocol 1 will  
result from faults due to overfrequency conditions from the input  
signal. Error Protocol 2 will result from hard failures detected  
within the A19570 such as a regulator and front end fault.  
Note: If a fault exists continuously, the device will stay in perma-  
nent safe state. Refer to the A19570 Safety Manual for additional  
details on the ASIL Safe State Output Protocol.  
Magnetic  
ꢀncoder  
CCꢂHꢁꢃHꢄ  
Normal  
ꢅꢋeration  
CCꢂLꢅꢆꢄ  
CCꢂHꢁꢃHꢄ  
ꢀrror  
ꢀrror  
Protocol 1  
CCꢂLꢅꢆꢄ  
RꢀSꢀꢇ  
ꢈirst ꢉirection ꢅꢊtꢋꢊt Pꢊlse  
tRꢀSꢀꢂꢀP1ꢄ  
CCꢂHꢁꢃHꢄ  
ꢀrror  
ꢀrror  
Protocol ꢌ  
CCꢂLꢅꢆꢄ  
RꢀSꢀꢇ  
ꢈirst ꢉirection Pꢊlse ꢅꢊtꢋꢊt  
tRꢀSꢀꢂꢀPꢌꢄ  
Figure 12: Output Protocol of the -xxxBx-A Variant (ASIL Safe State)  
10  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
Calibration and Direction Validation  
When power is applied to the A19570, the built-in algorithm per-  
forms an initialization routine. For a short period after power-on,  
the device calibrates itself and determines the direction of target  
rotation. For the -xxxPx variant, the output transmits nondirection  
pulses during calibration (Figure 13). For the -xxxBx variant, the  
output does not transmit any pulses during calibration.  
Once the calibration routine is complete, the A19570 will trans-  
mit accurate speed and direction information.  
Target Rotation  
N
S
N
S
N
S
N
S
N
Target  
Differential  
Magnetic  
Profile  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(FWD) or  
tW(REV)  
tW(ND)  
tW(ND)  
tW(ND)  
tW(ND)  
Opposite  
north pole  
tW(ND)  
tW(ND)  
Opposite  
N→S boundary  
I
CC  
Opposite  
south pole  
tW(ND)  
Opposite  
t
S→N boundary  
Device Location at Power-On  
Figure 13: Calibration Behavior of the -xSxPH Variant  
11  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
Direction Changes, Vibrations, and  
Anomalous Events  
During normal operation, the A19570 will be exposed to changes The -xxxPx variant may transmit non-direction pulses during  
in the direction of target rotation (Figure 14), vibrations of the  
target (Figure 15), and anomalous events such as sudden air  
gap changes. These events cause temporary uncertainty in the  
A19570’s internal direction detection algorithm.  
vibrations, and the -xxxBx variant will not transmit any pulses  
during vibrations.  
Direcon  
Change  
Forward  
Reverse  
Rotaon  
Rotaon  
N
S
N
S
N
S
N
S
N
Target Dierenal  
Magnec Prole  
tW(FWD)  
tW(FWD)  
tW(FWD)  
tW(REV)  
tW(REV)  
ICC  
-xSxBH variant  
-xSxPH variant  
tW(FWD)  
tW(ND)  
tW(ND)  
Figure 14: Direction Change Behavior  
Vibraon  
Target Rotaon  
Target Rotaon  
N
S
N
S
N
S
N
S
N
Target Dierenal  
Magnec Prole  
tW(FWD)  
[or tW(REV)  
tW(FWD)  
tW(FWD)  
[or tW(REV)  
tW(FWD)  
tW(FWD)  
[or tW(REV)  
tW(FWD)  
-xSxPH variant  
-xSxBH variant  
]
]
]
ICC  
tW(ND)  
[or tW(REV)  
]
[or tW(REV)  
]
[or tW(REV)]  
Figure 15: Vibration Behavior  
12  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
POWER DERATING  
The device must be operated below the maximum junction  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating supplied  
power or improving the heat dissipation properties of the appli-  
cation. This section presents a procedure for correlating factors  
affecting operating TJ. (Thermal data is also available on the  
Allegro MicroSystems website.)  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RθJA and TA.  
,
Example: Reliability for VCC at TA = 150°C.  
Observe the worst-case ratings for the device, specifically:  
RθJA = 213°C/W (subject to change), TJ(max) = 165°C, VCC(max)  
= 24 V, and ICC(AVG) = 15.4 mA. ICC(AVG) is computed using  
ICC(HIGH)(max) and ICC(LOW)(max), with a duty cycle of 92%  
computed from tw(ND)(max) on-time and tw(FWD)(min) off-time  
(pulse-width protocol). This condition happens at a select limited  
frequency.  
The Package Thermal Resistance, RθJA, is a figure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity,  
K, of the printed circuit board, including adjacent devices and  
traces. Radiation from the die through the device case, RθJC, is  
a relatively small component of RθJA. Ambient air temperature,  
TA, and air motion are significant external factors, damped by  
overmolding.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
ΔTmaxꢀ=ꢀTJ(max)ꢀ–ꢀTAꢀ=ꢀ165°Cꢀ–ꢀ150°Cꢀ=ꢀ15ꢀ°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
The effect of varying power levels (Power Dissipation, PD) can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
P
D(max)ꢀ=ꢀΔTmax ÷ RθJAꢀ=ꢀ15°Cꢀ÷ꢀ213°C/Wꢀ=ꢀ70.4ꢀmWꢀ  
Finally, invert equation 1 with respect to voltage:  
CC(est) = PD(max) ÷ ICC(max)ꢀ=ꢀ70.4ꢀmWꢀ÷ꢀ15.4ꢀmAꢀ=ꢀ4.6ꢀVꢀ  
The result indicates that, at TA , the application and device can  
dissipate adequate amounts of heat at voltages ≤ VCC(est)  
PD = VIN × IIN  
ΔTꢀ=ꢀPD × RθJA  
TJꢀ=ꢀTAꢀ+ꢀΔTꢀꢀ  
(1)  
(2)  
(3)  
V
.
For example, given common conditions such as:  
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and  
VCC(max) is reliable under these conditions.  
TA= 25°C, VCC = 12 V, RθJA = 213°C/W, and ICC = 7.15 mA,  
then:  
PD = VCC × ICC = 12 V × 7.15 mA = 85.8 mW  
ΔTꢀ=ꢀPD × RθJAꢀ=ꢀ85.8ꢀmWꢀ×ꢀ213°C/Wꢀ=ꢀ18.3°C  
TJꢀ=ꢀTAꢀ+ꢀΔTꢀ=ꢀ25°Cꢀ+ꢀ18.3°Cꢀ=ꢀ43.3°C  
13  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
Power Derating Curve  
ꢃ5  
ꢃꢄ  
ꢃ3  
CCꢈmaꢋꢊ  
ꢃꢃ  
ꢃ1  
ꢃ0  
19  
1ꢂ  
1ꢁ  
1ꢀ  
15  
1ꢄ  
13  
1ꢃ  
11  
10  
9
1-layer PCꢒ, Pacꢓage Uꢒ  
ꢈRθꢎA ꢏ ꢃ13ꢉCꢐꢑꢊ  
5
3
CCꢈminꢊ  
ꢃ0  
ꢄ0  
ꢀ0  
ꢂ0  
100  
1ꢃ0  
1ꢄ0  
1ꢀ0  
1ꢂ0  
ꢅemꢆeratꢇre ꢈꢉCꢊ  
Power Dissipation versus Ambient Temperature  
1900  
1ꢄ00  
1ꢃ00  
1ꢂ00  
1500  
1ꢁ00  
1300  
1ꢀ00  
1100  
1000  
900  
1-layer PCꢑ, Pacꢒage Uꢑ  
ꢈRθꢍA ꢎ ꢀ13ꢏCꢐꢌꢊ  
ꢄ00  
ꢃ00  
ꢂ00  
500  
ꢁ00  
300  
ꢀ00  
100  
0
ꢀ0  
ꢁ0  
ꢂ0  
ꢄ0  
100  
1ꢀ0  
1ꢁ0  
1ꢂ0  
1ꢄ0  
emꢆeratꢇre ꢈꢉCꢊ  
14  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
PACKAGE OUTLINE DRAWING  
For Reference Only – Not for Tooling Use  
(Reference DWG-0000408, Rev. 3)  
Dimensions in millimeters – NOT TO SCALE  
Dimensions exclusive of mold flash, gate burs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
+0.06  
–0.05  
4.00  
B
4×10°  
1.50 ±0.05  
0.84  
C
0.56  
1.02  
0.56  
1.39  
Mold Ejector  
Pin Indent  
XXXXX  
Date Code  
Lot Number  
+0.06  
4.00  
–0.07  
E
E1  
E4  
E3  
E
E
E2  
E
45°  
Branded  
Face  
D
Standard Branding Reference View  
A
0.42 ±0.05  
0.85 ±0.05  
Line 1ꢀ 5 characters  
Lines ꢁ, 3ꢀ 5 characters  
4 × 2.50 ±0.10  
0.25 REF  
0.30 REF  
2.54 REF  
Line 1ꢀ Part Nꢂmꢃer  
Line ꢁꢀ ꢄ-digit date code  
Line 3ꢀ Characters 5, ꢅ, ꢆ, ꢇ oꢈ  
Assemꢃly Lot Nꢂmꢃer  
ꢉꢊceꢋtion allowed ꢈor ꢋarts with  
mꢂltiꢋle ꢋacꢌage ꢍariantsꢀ  
Line 1ꢀ Last ꢄ digits oꢈ ꢋart nꢂmꢃer ꢋlꢂs  
Pacꢌage ꢎariant  
1
2
18.00 ±0.10  
12.20 ±0.10  
4 × 7.37 REF  
1.00 ±0.05  
+0.07  
–0.03  
0.25  
1.80 ±0.10  
A
B
C
D
E
F
Dambar removal protrusion (8×)  
Gate and tie burr area  
Active Area Depth, 0.38 ±0.03 mm  
0.38 REF  
0.25 REF  
Branding scale and appearance at supplier discretion  
GMR elements (E1, E2, E3, and E4); not to scale  
Molded Lead Bar for preventing damage to leads during shipment  
4 × 0.85 REF  
0.85 ±0.05  
+0.06  
–0.07  
1.80  
F
+0.06  
4.00  
1.50 ±0.05  
–0.05  
Figure 16: Package UB, 2-Pin SIP  
15  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
Large Air Gap, Vibration-Immune,  
GMR Transmission Speed and Direction Sensor IC  
A19570  
Revision History  
Number  
Date  
Description  
November 14, 2018  
Initial release  
Copyright ©2018, Allegro MicroSystems, LLC  
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to  
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that  
the information being relied upon is current.  
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of  
Allegro’s product can reasonably be expected to cause bodily harm.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its  
use; nor for any infringement of patents or other rights of third parties which may result from its use.  
Copies of this document are considered uncontrolled documents.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
16  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  

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