A80602 [ALLEGRO]

High Power LED Driver with Pre-Emptive Boost for Ultra-High Dimming Ratio and Low Output Ripple;
A80602
型号: A80602
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

High Power LED Driver with Pre-Emptive Boost for Ultra-High Dimming Ratio and Low Output Ripple

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A80602 and A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FEATURES AND BENEFITS  
DESCRIPTION  
The A80602 is a multi-output LED driver for automotive  
applicationssuchasexteriorlighting,heads-updisplay,andmid-  
size LCD backlighting. It implements a current-mode boost/  
SEPICconverterwithgatedriverforexternalN-MOSFET.This  
allows greater output power even at minimum supply voltage.  
• Automotive AEC-Q100 qualified  
• Enhanced fault handling for ASIL B system compliance  
• Wide input voltage range of 4.5 to 40 V for start/stop,  
cold crank, and load dump requirements  
• Operate in Boost or SEPIC mode for flexible output  
• Gate driver for external NMOS to deliver higher output power  
• Six integrated LED current sinks, up to 140 mA each  
• Boost switching frequency synced externally or  
programmed from 200 kHz to 2.3 MHz  
• Programmable boost frequency dithering to reduce EMI  
• Advanced control allows minimum PWM on-time down  
to 0.3 µs, and avoids MLCC audible noises  
• LED contrast ratio: 15,000:1 at 200 Hz using PWM  
dimming alone, 150,000:1 when combining PWM and  
analog dimming  
TheA80602 provides six integrated current sinks driving up to  
140 mAper string. Multiple sinks can be paralleled together to  
achieve higher LED currents up to 840 mA. The IC operates  
from single power supply from 4.5 to 40 V; once started, it can  
continue to operate down to 4 V. This allows it to withstand  
stop/start, cold crank, and load dump conditions encountered  
in automotive systems.  
TheA80602cancontrolLEDbrightnessthroughexternalPWM  
signal.ByusingthepatentedPre-EmptiveBoostcontrol,anLED  
brightnesscontrastratioof15,000:1canbeachievedusingPWM  
dimmingat200Hz.Ahigherratioof150,000:1ispossiblewhen  
using a combination of PWM and analog dimming.  
• Excellent input voltage transient response even at lowest  
PWM duty cycle  
• Gate driver for optional PMOS input disconnect switch  
• Extensive fault protection features  
Continued on next page...  
PACKAGE:  
APPLICATIONS  
• Automotive infotainment backlighting  
24-Pin 4 mm × 4 mm QFN  
with Wettable Flank  
• Automotive heads-up display  
• Automotive interior and exterior lighting  
Not to scale  
VIN  
VOUT  
ꢀoptional  
L1  
RSENSE  
RADJ  
D1  
Q1  
Cin  
ROVP  
RGDRV  
RCS  
CDRV  
COUT  
CS  
GATE  
VDRV GDRV  
A80602  
FSET  
PGND  
OVP  
Vsense  
VIN  
V
c
CVDD  
VDD  
RPU  
LED1  
FAULT  
Up to 11 WLEDs in series  
Up to 140 mA/channel  
LED2  
LED3  
EN/PWM  
ADIM  
Combine to drive up to 840 mA total  
PWM tON ≥ 0.3 µs  
LED6  
iLED  
COMP  
PEB  
100%  
AGND  
ISET  
DITH  
RZ  
ADIM  
CP  
RM  
PEB = Pre-Emptive Boost  
(RD controls the delay time)  
DITH = Dithering Control  
RISET  
RFSET  
RD  
CM  
CZ  
APWM 100 kHz 0-90%  
(Modulation frequency and range)  
Figure 1: A80602 in Boost configuration where VOUT is higher than VIN  
A80602-DS  
March 4, 2019  
MCO-0000620  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
DESCRIPTION (continued)  
Switchingfrequencycanbeexternallysynchronizedorprogrammed  
between 200 kHz and 2.3 MHz. This allows operation either above  
or below the AM band. A programmable dithering feature further  
reduces EMI.  
The A80602 provides protection against output short, overvoltage,  
open- or shorted-LED pin, and overtemperature. A cycle-by-cycle  
current limit protects the external boost switch against high current  
overloads. An external P-MOSFET can optionally be used to  
disconnect input supply in case of output to ground short fault. The  
A80602-1 is similar toA80602 except it adopts ‘One-Out-All-Out’  
fault handling (See Fault Table section for details).  
SELECTION GUIDE [1]  
Part Number  
A80602KESJSR  
A80602KESJSR-1  
Fault Handling  
One-Out-Continue  
One-Out-All-Out  
LED Driver  
Package  
Packing  
24-pin 4 × 4 mm wettable flank QFN  
with exposed thermal pad and sidewall plating  
6 × 140 mA  
6000 pieces per reel  
[1] Contact Allegro for additional packing options.  
ABSOLUTE MAXIMUM RATINGS [2]  
Characteristic  
Symbol  
Notes  
Rating  
–0.3 to 40  
–0.3 to 40  
–0.3 to 40  
Higher of –0.3  
Unit  
V
LEDx Pin  
OVP pin  
VIN  
VLEDx  
VOVP  
VIN  
x = 1..6  
V
V
VSENSE  
VGATE  
,
VSENSE, GATE  
and (VIN – 7.4) to  
VIN +0.4  
V
VDRV, GDRV  
CS  
V
DRV, VGDRV  
VCS  
–1.0 to 7.5  
–0.3 to 7  
V
V
EN/PWM, FAULT, ADIM, COMP,  
DITH, PEB, FSET, ISET, VDD  
External input signals must not be higher than VIN + 0.4 V  
Range K  
–0.3 to 5.5  
V
Operating Ambient Temperature  
Maximum Junction Temperature  
Storage Temperature  
TA  
TJ(max)  
Tstg  
–40 to 125  
150  
°C  
°C  
°C  
–55 to 150  
[2] Stresses beyond those listed in this table may cause permanent damage to the device. The absolute maximum ratings are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated in the Electrical Characteristics table is not implied.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information  
Characteristic  
Symbol  
Test Conditions [4]  
Value  
Unit  
Package Thermal Resistance  
RθJA  
ES package measured on 4-layer PCB based on JEDEC standard  
37  
°C/W  
[4] Additional thermal information available on the Allegro website.  
2
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table of Contents  
PWM Dimming ............................................................... 18  
Pre-Emptive Boost (PEB)................................................. 19  
Analog Dimming ............................................................. 20  
ADIM Mode ................................................................ 20  
APWM Mode .............................................................. 21  
Extending LED Dimming Ratio.......................................... 22  
Analog Dimming with External Voltage............................... 23  
VDD.............................................................................. 24  
VDRV............................................................................ 24  
Shutdown....................................................................... 24  
Fault Detection and Protection............................................. 25  
FAULT Status ................................................................. 25  
LED String Partial-Short Detect ........................................ 27  
Overvoltage Protection .................................................... 28  
Boost Switch Overcurrent Protection ................................. 29  
Input Overcurrent Protection and Disconnect Switch ........... 30  
Setting the Input Current Sense Resistor ........................... 31  
Input UVLO.................................................................... 31  
Fault Protection During Operation ..................................... 31  
Package Outline Drawing.................................................... 34  
Appendix: External MOSFET Selection Guide ....................... 35  
Features and Benefits........................................................... 1  
Description.......................................................................... 1  
Applications......................................................................... 1  
Package ............................................................................. 1  
Selection Guide ................................................................... 2  
Absolute Maximum Ratings................................................... 2  
Thermal Characteristics ........................................................ 2  
Typical Application – SEPIC .................................................. 3  
Functional Block Diagram ..................................................... 4  
Pinout Diagram and Terminal List........................................... 5  
Electrical Characteristics....................................................... 6  
Functional Description .........................................................11  
Enabling the IC................................................................11  
Powering Up: LED Detection Phase.................................. 12  
Powering Up: Boost Output Undervoltage.......................... 14  
Soft Start Function .......................................................... 14  
Frequency Selection........................................................ 15  
Synchronization.............................................................. 15  
Loss of External Sync Signal............................................ 16  
Switching Frequency Dithering ......................................... 17  
LED Current Setting ........................................................ 18  
Lꢋ  
L1  
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ꢃ1 mꢑst ꢒeꢂN ꢔ ꢁꢀUꢅ  
ꢂN  
ꢃ1  
ꢀUꢅ ≤ 40 V  
CC  
CꢂN  
ꢐ1  
RꢀꢁP  
CꢀUꢅ1  
CꢀUꢅꢋ  
CꢃRꢁ  
ꢄAꢅꢆ  
ꢁsense  
ꢁꢃRꢁ ꢄꢃRꢁ CS  
PꢄNꢃ  
ꢀꢁP  
C  
ꢁꢂN  
ꢃꢃ  
Cꢁꢃꢃ  
RPU  
Lꢆꢃ1  
Lꢆꢃꢋ  
Lꢆꢃ3  
A80602  
ꢊAULꢅ  
Uꢕ to 11 ꢉLꢆꢃs in series  
Uꢕ to 1ꢖ0 mAꢈch. Comꢒine  
to driꢎe ꢑꢕ to ꢗꢖ0 mA total  
ꢆNꢈPꢉM  
PꢉM t  
0.3 ꢘs  
on  
Lꢆꢃꢇ  
AꢃꢂMꢈ  
APꢉM  
iLꢆꢃ  
CꢀMP  
Pꢆꢌ  
100ꢛ  
ꢊSꢆꢅ  
AꢄNꢃ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
AꢃꢂM  
Rꢙ  
Cꢙ  
CP  
RꢃꢂꢅH  
CꢃꢂꢅH  
RꢂSꢆꢅ  
RPꢆꢌ  
RꢊSꢆꢅ  
APꢉM 100ꢍHꢚ 0-90ꢛ  
Figure 2: A80602 in SEPIC configuration where VOUT can be either higher or lower than VIN  
3
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢋꢄUꢈ  
SꢇNSꢇ  
ꢋꢅRꢋ  
Sꢔ  
ꢇꢙternal  
SꢗNC  
CꢅꢌꢈH  
RꢀSꢇꢈ  
RꢅꢌꢈH  
L1  
ꢍAꢈꢇ  
CꢅRꢋ  
ꢅꢌꢈH  
ꢀSꢇꢈꢊSꢗNC  
ꢋꢌN  
ꢄscillator  
ꢍate ꢅriꢆer  
Lꢅꢄ ꢏꢓ.5 ꢋꢑ  
ꢀreꢝꢁency  
dithering  
ꢍꢅRꢋ  
NMꢄS  
ꢍate  
ꢅriꢆe  
ꢇnaꢘle  
Sꢔ  
ꢂoost  
ꢇnaꢘle  
CS  
CꢄMP  
Comꢉarator  
RCS  
PꢍNꢅ  
CꢄMP  
PꢍNꢅ  
Cꢁrrent  
sense  
Soꢒt Start  
Ramꢉ  
ꢏꢞ msꢑ  
CCꢄMP  
Lꢇꢅ  
reꢒ  
1 MHꢚ  
ꢟꢐ  
Lꢇꢅ1  
ꢐ MHꢚ  
.
Mꢁlti-inꢉꢁt  
ꢄCPꢎ  
ꢈSꢅ  
ꢇrror Amꢉ  
.
System  
oscillator  
Lꢇꢅꢐ  
ꢋꢄUꢈ  
ꢀSꢇꢈ or ꢌSꢇꢈ  
ꢉin ꢄꢉenꢊShort  
ꢋꢅꢅ  
ꢌnternal ꢋꢅꢅ  
ꢏꢐ.ꢎ5 ꢋꢑ  
Cꢋꢅꢅ  
RꢄꢋP  
ꢋꢌN  
ꢄꢋP  
sense  
Regꢁlator  
UꢋLꢄ ꢂlocꢃ  
1.ꢎ35 ꢋ  
Rꢇꢀ  
ꢄꢋP  
ꢋreꢒ  
ꢀaꢁlt ꢂlocꢃ  
AꢍNꢅ  
RSꢇNSꢇ  
ꢇnaꢘle  
ꢄꢉenꢊShort  
Lꢇꢅ ꢅetect  
ꢌnꢉꢁt cꢁrrent  
sense amꢉ  
SꢇNSꢇ  
Choꢉꢉing  
ꢒreꢝ ꢠ ꢐ MHꢚ  
iAꢅꢖ  
Lꢇꢅ1  
Lꢇꢅꢎ  
Lꢇꢅ  
ꢅriꢆer  
ꢂlocꢃ  
ꢋꢌN  
ꢄnꢊꢄꢒꢒ  
ꢍAꢈꢇ  
ꢄꢀꢀ  
ꢂoost  
ꢇnaꢘle  
ꢍAꢈꢇ  
Cꢁrrent  
leꢆel  
Lꢇꢅꢓ  
AꢅꢌMꢊ  
PMꢄS  
ꢅriꢆer  
AꢍNꢅ  
Clocꢃ  
detector  
ꢇnaꢘle  
APꢔM  
50 kΩ  
ꢋreꢒ  
ꢌnt ꢋꢅꢅ  
ꢇNꢊPꢔM  
ꢌSꢇꢈ  
ꢜeeꢉ-Aliꢆe  
ꢈimer  
ꢌSꢇꢈ  
ꢂlocꢃ  
50 kΩ  
1 MHꢚ  
ꢇꢙternal PꢔM  
100 Hꢚ ꢛ ꢎ0 ꢜHꢚ  
RꢌSꢇꢈ  
ꢋꢅꢅ  
ꢇꢙternal  
Lꢇꢅ ꢇnaꢘle  
ꢀAULꢈ  
RPU  
start  
Pre-ꢇmꢉtiꢆe  
ꢂoost  
Pꢇꢂ  
ꢀAULꢈ  
ꢌnternal ꢀAULꢈ  
delay  
RPꢇꢂ  
A80602  
AꢍNꢅ  
Figure 3: Functional Block Diagram  
4
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
PINOUT DIAGRAM AND TERMINAL LIST  
FAULT  
VDD  
1
2
3
4
5
6
18 PGND  
17 OVP  
AGND  
COMP  
ISET  
16 LED1  
15 LED2  
14 LED3  
13 LED4  
PAD  
PEB  
Package ES, 24-Pin QFN Pinouts  
Terminal List Table  
Number  
Name  
Function  
This pin is an open drain type configuration that will be pulled low when a fault occurs. Connect a pull-up resistor between this pin and  
desired logic level voltage.  
1
FAULT  
2
3
4
5
VDD  
AGND  
COMP  
ISET  
Output of internal LDO (bias regulator). Connect a 1 µF decoupling capacitor between this pin and AGND. VDD is regulated at ~4.25 V.  
LED current Ground. Also serves as ‘quiet’ ground for analog signals.  
Output of the error amplifier and compensation node. Connect a series RZ-CZ network from this pin to AGND for control loop compensation.  
Connect RISET resistor between this pin and AGND to set the 100% LED current.  
Pre-Emptive Boost control: Connect resistor from PEB pin to AGND to fine-tune the delay between boost switch and LED current sinks.  
Leave pin open for minimum PEB delay of 1 µs.  
6
7
PEB  
Dithering control: connect a capacitor to AGND to set the dithering modulation frequency (1 to 22 kHz). Connect a resistor between DITH and  
FSET pins to set the dithering range (such as ±5% of fSW).  
DITH  
Frequency/synchronization pin. A resistor RFSET from this pin to AGND sets the switching frequency fSW (with dithering superimposed)  
between 200 kHz and 2.3 MHz. It can also be used to synchronize fSW to an external frequency between 260 kHz and 2.3 MHz (frequency  
dithering is disabled in this case).  
8
9
FSET  
ADIM  
Analog dimming. Apply a PWM clock (40 to 1000 kHz) to pin and the duty cycle of this clock determines the LED current. Alternatively, apply  
DC level between 0.2 and 2 V to vary LED current between 10% and 100%. If unused, pull pin above 2 V for 100%.  
Enables the IC when this pin is pulled high. It also controls the on/off state of LED current sinks to reduce the light intensity by using pulse  
width modulation. Typical PWM dimming frequency is in the range of 200 Hz to 2 kHz. When this pin is pulled low, the IC remains in standby  
mode for up to 16 ms, then shuts down completely.  
10  
EN/PWM  
LED6..LED1  
LED current sinks #6 to #1. Connect the cathode of each LED string to pin. Unused LED pin must be terminated to AGND through a resistor  
(4.75 kΩ for LED1/3/4/6, 2.37 kΩ for LED2/5).  
11-16  
17  
18  
19  
20  
21  
22  
OVP  
PGND  
VDRV  
CS  
Overvoltage Protection. Connect external resistor from VOUT to this pin to adjust the over voltage protection threshold.  
Power Ground for internal Gate Driver. Connect pin to external power GND with shortest path.  
Gate driver supply voltage (~6.5 V). Connect a 2.2 µF MLCC to PGND for buffer.  
Current Sense for peak current control of power switch. Connect to sense resistor at the Source terminal of external power MOSFET.  
Gate driver for power switch. Connect to Gate of external power MOSFET. (External FET must be fully enhanced at VGS = 5 V).  
Output gate driver pin for external P-channel MOSFET (input disconnect switch).  
GDRV  
GATE  
Connect this pin to the negative sense side of the input current sense resistor Rsc. The threshold voltage is measured as VIN – VSENSE  
There is also fixed iADJ current sink to allow for trip threshold adjustment.  
.
23  
24  
VSENSE  
VIN  
Input power to the IC as well as the positive side of input current sense resistor.  
Exposed pad of the package providing enhanced thermal dissipation. Must be connected to the ground plane(s) of the PCB with at least 8  
vias, directly in the pad.  
PAD  
5
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1]: Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indicates specifica-  
tions guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
INPUT VOLTAGE SPECIFICATIONS  
Operating Input Voltage Range [3]  
VIN UVLO Start Threshold  
VIN UVLO Stop Threshold  
UVLO Hysteresis [2]  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
VIN  
4.5  
40  
V
V
VUVLO(rise)  
VUVLO(fall)  
VUVLO_HYS  
VIN rising  
VIN falling  
4.45  
4.05  
500  
V
300  
400  
mV  
INPUT CURRENTS  
EN and PWM = H, CGATE = 1 nF from GDRV to  
PGND, fSW = 2 MHz  
VIN Pin Operating Current  
VIN Pin Sleep Current  
IOP  
22  
1
32  
5
mA  
µA  
ISLEEP  
VIN = 16 V, VEN / VPWM = VSYNC = 0 V  
INPUT LOGIC LEVELS (EN/PWM, ADIM)  
Input Logic Level-Low  
VIL  
VIH  
0.4  
V
V
Input Logic Level-High  
1.5  
REN/PWM  
RADIM  
,
Input Pull-Down Resistor  
Input = 5 V  
30  
50  
70  
kΩ  
ANALOG DIMMING (ADIM)  
iADIM50  
iADIM25  
fAPWM  
DC 1.0 V applied to ADIM pin  
DC 0.5 V applied to ADIM pin  
Clock signal applied to ADIM pin  
Clock signal applied to ADIM pin  
23  
40  
0
50  
25  
27  
%
%
Analog Dimming Current Level  
(shown as % of full-scale current)  
APWM Frequency Range [2]  
APWM Duty Cycle Range [2]  
VDD REGULATOR  
1000  
90  
kHz  
%
DAPWM  
Regulator Output Voltage  
VDD UVLO Start Threshold  
VDD UVLO Stop Threshold  
ERROR AMPLIFIER  
VDD  
VIN > 6 V, iLOAD < 1 mA  
4.05  
4.25  
3.2  
4.45  
V
V
V
VDDUVLOrise VDD rising, no external load  
VDDUVLOfall VDD falling, no external load  
2.65  
Amplifier Gain [2]  
gm  
VCOMP = 1.5 V  
900  
–500  
–700  
+500  
1.4  
μA/V  
μA  
VCOMP = 1.5 V, A80602 (symm COMP)  
Source Current  
IEA(SRC)  
VCOMP = 1.5 V, A80602-1 (asymm COMP)  
μA  
Sink Current  
IEA(SINK)  
RCOMP  
VCOMP = 1.5 V  
μA  
COMP Pin Pull Down Resistance  
FAULT = 0, VCOMP = 1.5 V  
kΩ  
Continued on the next page…  
6
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indi-  
cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OVERVOLTAGE PROTECTION  
OVP Pin Voltage Threshold  
VOVP(th)  
iOVP(th)  
OVP pin connected to VOUT  
Current into OVP pin at 125°C  
Measured over temperature  
2.2  
140  
140  
2.5  
146.5  
150  
2.8  
153  
160  
V
µA  
µA  
OVP Pin Sense Current Threshold  
OVP Sense Current Temperature  
Coefficient [2]  
∆iOVP  
Current into OVP pin  
VOUT = 16 V, EN = L  
−36  
nA/°C  
OVP Pin Leakage Current  
IOVPLKG  
0.1  
1
4
µA  
%
%
V
OVP Variation at Output  
ΔOVP  
Measured at VOUT when ROVP = 188 kΩ  
7
Measured at VOUT when ROVP = 188 kΩ [2]  
Measured at VOUT when ROVP = 0 Ω  
2.4  
0.13  
2.55  
0.20  
2.7  
0.25  
Undervoltage Detection Threshold  
VUVP(th)  
V
BOOST SWITCH GATE DRIVER  
Gate Driver Supply Voltage  
Gate Driver Pull-Up and Pull-Down  
Gate Pull-Down When Disabled  
Peak Sink Current [2]  
VDRV  
Measured at VIN > 7.5 V  
6.5  
2.5  
100  
2
V
Ω
RGDRV  
Measured at iGDRV = 100 mA  
RGDRV_OFF EN = L, VIN = 0 V  
kΩ  
A
iSINK  
Measured at VGDRV = VDRV  
Peak Source Current [2]  
iSOURCE  
Measured at VGDRV = 0 V  
2
A
Measured with CLOAD = 1.5 nF;  
VGDRV between 10% and 90% of VDRV  
Gate Rise / Fall Time [2]  
tRISE, tFALL  
7
ns  
Minimum Gate Driver On-Time  
Minimum Gate Driver Off-Time  
BOOST SWITCH CURRENT SENSE  
tSW(ON)  
100  
100  
ns  
ns  
tSW(OFF)  
Exceeding iCS(LIM1) causes gate driver to  
truncate existing cycle, but does not shut down  
Primary Current Sense Limit  
iCS(LIM1)  
iCS(LIM2)  
tCSDELAY  
175  
210  
300  
32  
245  
mV  
mV  
ns  
Exceeding iCS(LIM2) causes gate driver to shut  
down and latch off  
Secondary Current Sense Limit [2]  
Secondary Current Sense Limit  
Propagation Delay  
Overdrive CS threshold by 10%, excluding  
leading edge blanking  
OSCILLATOR FREQUENCY  
RFSET = 10 kΩ  
1.95  
2.15  
200  
2.35  
MHz  
kHz  
V
Oscillator Frequency  
fSW  
R
FSET = 110 kΩ  
FSET Pin Voltage  
VFSET  
RFSET = 10 kΩ  
1.00  
SYNCHRONIZATION  
VSYNCL  
VSYNCH  
FSET/SYNC pin logic Low  
FSET/SYNC pin logic High  
0.4  
V
V
Sync Input Logic Level  
1.5  
260  
150  
150  
Synchronized PWM Frequency  
Synchronization Input Min Off-Time  
Synchronization Input Min On-Time  
fSWSYNC  
2300  
kHz  
ns  
ns  
tPWSYNCOFF  
tPWSYNCON  
Continued on the next page…  
7
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 12 V, TJ = 25°C, • indi-  
cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C  
Characteristics  
LED CURRENT SINKS  
LEDx Accuracy [4]  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
ErrLED  
iISET = 120 µA (RISET = 8.33 kΩ)  
0.7  
0.8  
3
2
%
%
LEDx Matching  
ΔLEDx  
iISET = 120 µA  
Measured individually with all  
other LED pins tied to ≥1 V,  
iISET = 120 µA, VADIM > 2.1 V  
A80602  
650  
750  
850  
mV  
LEDx Regulation Voltage  
VLED  
A80602-1  
760  
955  
860  
978  
0.985  
960  
1000  
1.015  
144  
mV  
A/A  
V
I
ISET to ILEDx Current Gain  
AISET  
VISET  
iISET  
iISET = 120 µA  
VADIM > 2.1 V  
VADIM > 2.1 V  
ISET Pin Voltage  
0.955  
20  
Allowable ISET Current  
µA  
Sensed from each LED pin to GND while its current  
sink is in regulation; all other LED pins tied to 1 V  
LED String Partial-Short Detect  
VLEDSD  
tLEDSTG  
4.9  
5.5  
1.5  
6.1  
V
LED Pin Shorted-to-GND Test  
Duration [2]  
Wait time before proceeding with Soft-Start (if  
no LED pin is shorted to GND)  
ms  
Maximum time duration before all LED  
channels come into regulation, or OVP is  
tripped, whichever comes first  
Soft-Start Ramp-Up Time [2]  
Enable Pin Shut Down Delay  
tSSRU  
6.6  
8.2  
9.8  
ms  
EN goes from High to Low; exceeding tEN(OFF)  
results in IC shutdown  
tEN(OFF)  
tPWMH  
10  
16  
22  
ms  
µs  
Minimum PWM On-Time  
INPUT DISCONNECT GATE PIN  
Gate Pin Sink Current  
First and subsequent PWM pulses  
0.3  
0.4  
IGSINK  
VGS = VIN, no input OCP fault  
−113  
µA  
Gate Pin Source Current  
IGSOURCE  
VGS = VIN – 6 V, input OCP fault tripped  
6
mA  
Gate Shutdown Delay When Over-  
Current Fault Is Tripped [2]  
tGATEFAULT VIN – VSENSE = 200 mV; monitored at FAULT pin  
3
µs  
V
PMOS Gate to source voltage measured when  
Gate Voltage  
VGS  
−6.7  
gate is on  
VSENSE PIN  
VSENSE Pin Sink Current  
VSENSE Trip Point  
iADJ  
16  
88  
20  
98  
24  
µA  
VSENSETRIP Measured between VIN and VSENSE, RADJ = 0 Ω  
108  
mV  
FAULT PIN  
FAULT Output Pull-Down Voltage  
FAULT Pin Leakage Current  
External FAULT Input Low  
External FAULT Input High  
VFAULT  
IFAULT-LKG  
VFIL  
iFAULT = 1 mA  
0.5  
1
V
µA  
V
VFAULT = 5 V  
No internal faults; FAULT pin externally pulled down  
No internal faults  
0.8  
VFIH  
1.5  
V
No internal faults; delay (in fSW cycles) from  
FAULT pin externally pulled L to LED off;  
ignored if FAULT returns to H before that  
External FAULT Deglitch Timer  
tFIL  
8
cycles  
THERMAL PROTECTION (TSD)  
Thermal Shutdown Threshold [2]  
Thermal Shutdown Hysteresis [2]  
TSD  
Temperature rising  
155  
170  
20  
°C  
°C  
TSDHYS  
[1] For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing);  
positive current is defined as going into the node or pin (sinking).  
[2] Ensured by design and characterization; not production tested.  
[3] Minimum VIN = 4.5 V is only required at startup. After startup is completed, IC can continue to operate down to VIN = 4 V.  
[4] LED current is trimmed to cancel variations in both Gain and ISET voltage.  
8
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APPLICATION EXAMPLES  
ꢄN  
ꢅUꢆ ꢉ ꢊ0 ꢁ  
ꢇoꢈtional  
ꢃ1  
L1  
RSꢂNSꢂ  
ꢀꢎ  
CꢄN  
ꢀ1  
RꢅꢁP  
CꢅUꢆ  
CꢁꢃRꢁ  
ꢋAꢆꢂ  
ꢁꢃRꢁ ꢋꢃRꢁ CS  
PꢋNꢃ  
ꢅꢁP  
ꢁSꢂNSꢂ  
C  
ꢃRꢁ  
ꢆ  
ꢁꢄN  
Cꢁꢃꢃ  
RPU  
ꢁꢃꢃ  
Lꢂꢃ1  
Lꢂꢃꢎ  
A80602  
ꢍAULꢆ  
Cascode  
ꢂNꢏ  
ꢆransistors  
Lꢂꢃ3  
Lꢂꢃꢌ  
PꢐM  
PꢐM ton 0.3 ꢑs  
ꢀ3 .. ꢀꢙ  
AꢃꢄM  
Maꢕ. Lꢂꢃꢕ ꢈin ꢖoltage  
limited to ꢁꢃRꢁ - ꢁꢆ  
iLꢂꢃ  
100ꢔ  
CꢅMP  
Pꢂꢘ  
AꢃꢄM  
ꢍSꢂꢆ  
ꢃꢄꢆH  
AꢋNꢃ  
ꢄSꢂꢆ  
Rꢗ  
CP  
RM  
APꢐM 100 ꢒHꢓ 0-90ꢔ  
RꢍSꢂꢆ  
RꢄSꢂꢆ  
Cꢗ  
Rꢃ  
CM  
Figure 4: Cascode transistors can be used in case VOUT needs to be higher than 40 V  
To drive an output load with more than 11 white LEDs in series, the above application circuit can be  
used. The cascode transistors Q3..Q8 limits LED1-6 pin voltages to VDRV – VT, even in case of LED  
string direct short. (VT = threshold voltage of transistor, typically under 3 V).  
The cascode transistors can be any small-signal N-channel MOSFET, rated for the maximum output  
voltage and LED current per channel. As an example: consider T2N7002BK in SOT23 package. It is  
rated for 60 V breakdown and 400 mA continuous current.  
9
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢂN  
ꢃ1  
ꢀUꢅ ꢊ0 ꢁ  
L1  
ꢔ1  
ꢊ.ꢋ ꢌꢈ  
CꢀUꢅ  
RꢀꢁP1  
RꢀꢁPꢍ  
CꢁꢃRꢁ  
ꢁꢂN  
ꢄꢃRꢁ  
ꢁꢃRꢁ  
ꢄAꢅꢆ  
PꢄNꢃ  
ꢄꢃRꢁ  
ꢁꢃRꢁ  
ꢄAꢅꢆ  
PꢄNꢃ  
CS  
CS  
ꢁSꢆNSꢆ  
ꢁꢂN  
ꢁSꢆNSꢆ  
ꢀꢁP  
ꢀꢁP  
C  
Cꢁꢃꢃ  
ꢁꢂN  
Cꢁꢃꢃ  
ꢁꢃꢃ  
ꢁꢃꢃ  
10 ꢉΩ  
Lꢆꢃ1  
Lꢆꢃ1  
A80602-1  
ꢀꢁAꢂꢃꢄꢅꢆ  
A80602-1  
ꢀꢂꢇAꢈꢄꢆ  
Lꢆꢃꢍ  
Lꢆꢃ3  
Lꢆꢃꢍ  
Lꢆꢃ3  
ꢈAULꢅ  
ꢈAULꢅ  
ꢆNꢏ  
ꢆNꢏ  
PꢐM  
PꢐM  
Lꢆꢃꢇ  
Lꢆꢃꢇ  
Uꢒ to 1ꢊ0 mA ꢓ ꢇ  
Uꢒ to 1ꢊ0 mA ꢓ ꢇ  
AꢃꢂM  
AꢃꢂM  
CꢀMP  
Pꢆꢑ  
CꢀMP  
Pꢆꢑ  
ꢈSꢆꢅ  
AꢄNꢃ  
ꢈSꢆꢅ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
AꢄNꢃ  
ꢂSꢆꢅ  
ꢃꢂꢅH  
Rꢎ  
CP  
RM  
CM  
RꢂSꢆꢅ  
RꢈSꢆꢅ  
RPꢆꢑꢍ  
RPꢆꢑ1  
RꢂSꢆꢅ  
RꢈSꢆꢅ  
Cꢎ  
Figure 5: Two A80602-1 connected in Master/Slave Configuration to drive 140 mA × 12 LED strings  
Remarks on Master-Slave configuration:  
• Only one Slave to a Master.  
• Master-Slave operation requires asymmetrical COMP (for example: source = –700 µA and  
sink = 500 µA). This is available in A80602-1 only.  
• Also requires bidirectional FAULT pin of A80602-1, so that the slave can halt the switching of master.  
10  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FUNCTIONAL DESCRIPTION  
The A80602 is a multi-string LED regulator with six preci-  
sion current sinks and a gate driver for external boost MOSFET  
switch. It incorporates a patented Pre-Emptive Boost (PEB)  
control algorithm to achieve PWM dimming ratio over 15,000:1  
at 200 Hz. PEB control also minimizes output ripple to avoid  
audible noise from output ceramic capacitors.  
Only if no faults were detected, then the IC can proceed to start  
switching.  
During operation, the EN/PWM pin can be toggled to control the  
brightness of LEDs channels by using PWM dimming. If EN/  
PWM is pulled Low for longer than 16ms, the IC shuts off.  
The switching frequency can be either synchronized to an  
external clock or generated internally. Spread-spectrum tech-  
nique (with user-programmable dithering range and modulation  
frequency) is provided to reduce EMI. A clock-out signal (CLK-  
OUT) allows other converters to be synchronized to the switching  
frequency of A80602.  
Enabling the IC  
The A80602 wakes up when EN/PWM pin is pulled above logic  
high level, provided that VIN pin voltage is over the VIN_UVLO  
threshold. The boost stage and LED channels are enabled sepa-  
rately by PWM = H signal after the IC powers up.  
The IC performs a series of safety checks at power up, to deter-  
mine if there are possible fault conditions that might prevent the  
system from functioning correctly. Power-up checks include:  
Figure 6: Startup showing (from top to bottom) EN/PWM, VDD, VDRV,  
and ISET.  
• VOUT shorted to GND  
• LED pin shorted to GND  
• FSET pin open/shorted  
• ISET pin open/shorted to GND, etc.  
11  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Unused LED pins should be terminated with a resistor to GND.  
Powering Up: LED Detection Phase  
Value of this termination resistor is 4.75 kΩ for channel 1, 3, 4, 6;  
or 2.37 kΩ for channel 2, 5. At the end of LED detection phase,  
any channel with pull-down resistor is then disabled and will not  
contribute to the boost regulation loop.  
The VIN pin has an undervoltage lockout (UVLO) function that  
prevents the A80602 from powering up until the UVLO threshold is  
reached. Once the VIN pin goes above UVLO and a high signal is  
present on the EN pin, the IC proceeds to power up. At this point, the  
A80602 is going to enable the disconnect switch and will try to check  
if any LED pins are shorted to GND and/or are not used. The LED  
detection phase starts when the GATE voltage of the input disconnect  
PMOS switch is pulled down to 3.3 V below VIN.  
ꢄꢅUꢆ  
Lꢀꢁ Ch1 to ꢇ  
are enaꢋled  
Lꢀꢁ1  
Lꢀꢁꢌ  
Lꢀꢁ3  
Lꢀꢁꢇ  
Lꢀꢁ5  
Lꢀꢁꢂ  
ꢃNꢁ  
Lꢀꢁ Ch5 ꢊ ꢂ  
are disaꢋled  
ꢇ.ꢈ5 ꢉΩ ꢌ.3ꢈ ꢉΩ  
Figure 8: How to signal an unused LED channel  
during startup LED detection phase  
Table 1: LED Detection phase voltage threshold levels  
LED Pin  
Voltage Measured  
Interpretation  
Outcome  
Cannot proceed with  
soft-start unless fault  
is removed  
Figure 7: Startup showing EN/PWM, GATE, LED1, and ISET. Note  
that LED Detection Phase starts as soon as GATE pin is pulled  
LED pin shorted to  
GND fault  
< 120 mV  
down to 3.3 V below VIN  
.
LED channel is  
removed from  
operation  
LED channel not in  
use  
Once the voltage threshold on VLED pins exceeds ~120 mV, a  
delay of approximately 1.5 ms is used to determine the status of  
the pins.  
~230 mV  
> 340 mV  
LED channel in use  
Proceed with soft-start  
12  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
If an LED pin is shorted to ground, the A80602 will not proceed  
with soft start until the short is removed from the LED pin. This  
prevents the A80602 from ramping up the output voltage and put-  
ting an uncontrolled amount of current through the LEDs.  
The FAULT pin is pulled low in case of LED pin shorted-to-GND  
fault, but the IC continues to retry. Once the fault is removed, the  
soft-start process will continue. The same applies in case of FSET  
or ISET pin is shorted to GND.  
Figure 9: Normal startup showing all channels passed LED Detec-  
tion phase (only LED1 and LED2 pin voltages are shown). Output  
Voltage = 26.5 V (8× LED). Total LED current = 100 mA × 6.  
Figure 11: LED1 is shorted-to-GND initially, then released. After the  
fault is removed, the IC auto-recovers and proceeds with soft-start.  
FAULT is released at the end of LED detection phase.  
Figure 10: Normal startup showing LED1 channel is disabled with  
a 4.75 kΩ resistor to GND. Total LED current = 100 mA × 5.  
13  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
This is illustrated by the following startup timing diagram (not to  
scale):  
Power Up: Boost Output Undervoltage  
During startup, after the input disconnect switch has been  
enabled, the output voltage is checked through the OVP (over-  
voltage protection) pin. If the sensed voltage does not rise above  
VUVP(th), the output is assumed to be at fault and the IC will not  
proceed with soft start. Output UVP level is linked to the OVP  
level programmed according to the equation:  
ꢀꢁ  
ꢂꢃꢄ  
ꢀꢁN  
3.3 ꢀ  
ꢂ.ꢃ ꢀ  
ꢅAꢆꢀ  
0
VUVP = VOVP / 12  
1ꢀ  
ꢊꢀꢋꢌ  
0
Undervoltage protection may be caused by one of the following  
faults:  
Lꢆꢇ detection  
ꢈhase  
ꢄꢀP  
93ꢅ ꢄꢀP  
1.5 ms  
• Output capacitor shorted to GND  
• Boost inductor or diode open  
• OVP sense resistor open  
ꢇꢈꢉꢆ  
ꢀꢁN  
0
After an UVP (undervoltage protection) fault, the A80602 is  
immediately shutdown and latched off. To enable the IC again,  
the latched fault must be cleared. This can be achieved by  
powering-cycling the IC, which means either:  
tSSRU  
ꢊꢀꢋ  
0
Soꢉt-Start  
Regꢊlation  
A
• VIN falls below falling UVLO threshold, or  
• EN = L for >16 ms.  
Figure 12: Complete startup process of A80602  
Explanation of Events:  
Alternatively, latched fault can be cleared by keeping EN = H but  
pulling PWM = L for >16 ms. This method has the advantage that  
it does not interrupt the CLKOUT signal.  
A: EN = H wakes up the IC. VDD ramps up and CLKOUT  
becomes available. IC starts to pull down GATE slowly.  
Soft Start Function  
B: When GATE is pulled down to 3.3 V below VIN, ISET becomes  
enabled. IC is now waiting for PWM = H to startup.  
During startup, the A80602 ramps up its boost output voltage  
following a fixed slope, as determined by OVP set point and Soft-  
Start Timer. This technique limits the input inrush current, and  
ensures consistent startup time regardless of the PWM dimming  
duty cycle.  
C: Once PWM = H, the IC checks each LEDx pins to determine  
if it is in use, disabled, or shorted to GND.  
D: Soft-Start begins at the completion of LED pin short-detect  
phase of ~1.5 ms. VOUT ramps up following a fixed slope set by  
OVP and soft-start timer of ~8 ms.  
The soft-start process is completed when any one of the follow-  
ing conditions is met:  
E: Soft-start terminates when all LED currents reached regula-  
• All enabled LED channels have reached their regulation  
current,  
tion, VOUT reached 93% OVP, or soft-start timer expired.  
• Output voltage has reached 93% of its OVP threshold, or  
• Soft-start ramp time (tSS) has expired.  
To summarize, the complete startup process of A80602 consists  
of:  
• Power-up error checking  
• Enabling input disconnect switch  
• LED pin open/short detection  
• Soft-start ramp  
14  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Frequency Selection  
t PꢂSꢃNCꢄN  
15ꢁ ns  
The switching frequency of the boost regulator is programmed  
by a resistor connected to FSET pin. The switching frequency  
can be selected anywhere from 200 kHz to 2.3 MHz. The chart  
below shows the typical switching frequency verses FSET resis-  
tor value.  
150 ns  
150 ns  
tPꢂSꢃNCꢄꢅꢅ  
t ꢀ ꢁ5ꢁ ns  
Figure 14: Pulse width requirements  
for an External Sync clock at 2.2 MHz  
Based on the above, any clock with a duty cycle between 33%  
and 66% at 2.2 MHz can be used. The table below summarizes  
the allowable duty cycle range at various synchronization fre-  
quencies.  
Table 2: Acceptable Duty Cycle range for External Sync  
clock at various frequencies  
Sync. Pulse Frequency  
2.2 MHz  
Duty Cycle Range  
33% to 66%  
2 MHz  
30% to 70%  
1 MHz  
15% to 85%  
600 kHz  
9% to 91%  
Figure 13: Switching Frequency  
as a function of FSET Resistance  
300 kHz  
4.5% to 95.5%  
Alternatively, the following empirical formula can be used:  
If it is necessary to switch over between internal oscillator and  
external sync during operation, ensure the transition takes place  
at least 500 ns after the previous PWM = H rising edge. Alterna-  
tively, execute the switchover during PWM = L only. This restric-  
tion does not apply if PWM dimming is not being used.  
Equation 1:  
fSW = 21.5 / (RFSET + 0.2)  
where fSW is in MHz and RFSET is in kΩ.  
If a fault occurs during operation that will increase the switch-  
ing frequency, the internal oscillator frequency is clamped to a  
maximum of 3.5 MHz. If the FSET pin is shorted to GND, the  
part will shut down. For more details, refer to the Fault Mode  
Table section.  
ꢀꢁꢂ  
500 ns  
ꢃꢄꢅꢆꢇꢈnꢉ  
1 ꢀ  
ꢊ ꢋꢇꢃꢌ  
Synchronization  
The A80602 can also be synchronized using an external clock.  
At power up, if the FSET pin is held low, the IC will not start.  
Only when the FSET pin is tristated to allow for the pin to rise to  
about 1 V, or when a sync clock is detected, the A80602 will then  
try to power up.  
ꢍnꢅꢎꢏnaꢐ  
ꢑꢐꢒꢉꢓ  
ꢁnternal oscillator  
ꢂꢃternal Sync  
Figure 15: Avoid switching over between Internal  
Oscillator and External Sync in highlighted region  
The basic requirement of the external sync signal is 150 ns  
minimum on-time and 150 ns minimum off time. The diagram  
below shows the timing restrictions for a synchronization clock at  
2.2 MHz.  
15  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢁꢅternal  
Sychroniꢆation  
Signal  
Loss of External Sync Signal  
ꢊꢊ0ꢀ  
Suppose the A80602 started up with a valid external SYNC sig-  
nal, but the SYNC signal is lost during normal operation. In that  
case, one of the following happens:  
ꢀSꢁꢂꢃSꢄNC  
RꢀSꢁꢂ  
10kΩ  
Schottꢇy  
ꢈarrier  
ꢉiode  
• If the external SYNC signal is high impedance (open), the  
IC continues normal operation after approximately 5 μs, at  
the switching frequency set by RFSET. No FAULT flag is  
generated.  
Figure 16: Countermeasure for  
External Sync Stuck-at-Low Fault  
• If the external SYNC signal is stuck low (shorted to ground),  
the IC will detect an FSET-shorted-to-GND fault. FAULT  
pin is pulled low after approximately 10 μs, and switching is  
disabled. Once the FSET pin is released or SYNC signal is  
detected again, the IC will proceed to soft-start.  
It is important to use a small capacitance for the AC-coupling  
capacitor (220 pF in the above example). If the capacitance is too  
large, the IC may incorrectly declare a FSET-shorted-to-GND  
fault and restart.  
To prevent generating a fault when the external SYNC signal  
is stuck at low, the circuit shown below can be used. When the  
external SYNC signal goes low, the IC will continue to operate  
normally at the switching frequency set by the RFSET. No FAULT  
flag is generated.  
16  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Switching Frequency Dithering  
ꢄꢅꢃꢆ  
ꢀꢁꢈ 100 ꢊA  
ꢉ5 ꢊA  
ꢀꢁꢂꢃ  
ꢄꢅꢃꢆ  
1.ꢅ ꢌ  
1.0 ꢌ  
0.ꢋ ꢌ  
ꢄꢅꢃꢆ ꢈ ꢉꢅ0 ꢊA  
ꢆSꢂ  
To minimize the peak EMI spikes at switching frequency har-  
monics, the A80602 offers the option of frequency dithering, or  
spread-spectrum clocking. This feature simplifies the input filters  
needed to meet the automotive CISPR 25 conducted and radiated  
emission limits.  
RꢀꢁꢂH  
ꢃ0.1 ꢄΩ  
RꢆSꢂ  
10 ꢄΩ  
CꢀꢁꢂH  
ꢅꢅ nꢆ  
ꢄꢅꢃꢆ  
ꢅ0 ꢊA  
0
ꢀithering Range ꢈ  
ꢉ5ꢖ  
ꢍꢅ0 ꢊA  
Modꢒlation  
ꢓreꢒency  
ꢈ 1.1 ꢄHꢕ  
Period ꢈ 0.ꢋ ꢎ C ꢏ i  
For maximum flexibility, the A80602 allows both dithering range  
and modulation frequency to be independently programmable  
using two external components.  
ꢐ0.ꢋꢋ ms when C ꢈ ꢅꢅ nꢆꢑ  
ꢁꢊ ꢋꢌꢆꢍꢎ  
ꢅ.ꢅ5  
ꢅ.15  
ꢅ.05  
The Dithering Modulation Frequency is given by the approximate  
equation:  
ꢂime ꢐmsꢑ  
0
0.ꢋꢋ  
Equation 2:  
fDM (kHz) = 25 / CDITH (nF)  
Figure 17: How to Program Switching Frequency  
where CDITH is the value of capacitor connected from DITH  
pin to GND.  
Dithering Range and Modulation Frequency  
There are no hard limits on dithering range and modulation  
frequency. As a general guideline, pick a dithering range between  
±5% and 10%, with the modulation frequency between 1 kHz and  
3 kHz. In practice, using a larger dithering range and/or higher  
modulation frequency do not generate any noticeable benefits.  
The dithering Range is given by the approximate equation:  
Equation 3:  
Range (±%) = 20 × RFSET / RDITH  
where RFSET is the resistor from FSET pin to GND, RDITH is  
the resistor between DITH and FSET pins.  
If dithering function is not desired, it can be disabled by discon-  
necting the RDITH between DITH and FSET pins. Connect DITH  
pin to VDD if CDITH is not populated. Dithering is always dis-  
abled when fSW is controlled by external sync. RDITH and CDITH  
have no effects in this case even if they were populated.  
As an example, by using RFSET = 10 kΩ, RDITH = 40.1 kΩ,  
and CDITH = 22 nF, the resulted switching frequency is fSW  
2.15 MHz ±5% modulated at 1.1 kHz. This is illustrated by the  
following diagram.  
=
17  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
LED Current Setting  
The maximum LED current can be up to 140 mA per channel,  
and is set through the ISET pin. Connect a resistor RISET between  
this pin and GND. The relation between ILED and RISET is given  
below:  
Equation 4:  
ILED = ISET × AISET  
ISET = VISET / RISET  
Therefore RISET = (VISET × AISET ) / ILED  
= 963 / ILED  
where ILED current is in mA and RISET is in kΩ.  
This sets the maximum current through the LEDs, referred to  
as the ‘100% current’. The average LED current can be reduced  
from the 100% current level by using either PWM dimming or  
analog dimming.  
Figure 18: PWM dimming operation at 20% 1 kHz. CH1 = PWM (5 V/  
div), CH2 = SW (20 V/div), CH3 = VOUT, CH4 = iLED (200 mA/div).  
By using the patented Pre-Emptive Boost (PEB) control algo-  
rithm, the A80602 is able to achieve minimum PWM dimming  
on-time down to 300 ns. This translates to PWM dimming ratio  
up to 15,000:1 at the PWM dimming frequency of 200 Hz. Tech-  
nical details on PEB will be explained in the next section.  
Table 3: ISET resistor values vs. LED current. Resistances  
are rounded to the nearest E-96 (1%) resistor value.  
Standard Closest RISET  
LED current per channel  
Resistor Value  
6.81 kΩ  
9.53 kΩ  
12 kΩ  
140 mA  
100 mA  
80 mA  
60 mA  
40 mA  
16 kΩ  
24 kΩ  
PWM Dimming  
When the EN/PWM pin is pulled high, the A80602 turns on all  
enabled LED current sinks. When it is pulled low, all LED cur-  
rent sinks are turned off. By changing the duty cycle of PWM  
signal, the average LED current (and hence brightness) can be  
accurately controlled.  
During PWM = L, the IC floats the compensation (COMP) pin  
and waits for the next PWM rising edge. But if PWM stays Low  
longer than tEN(OFF) duration (16 ms typical), the IC shuts off  
completely.  
Figure 19: Zoom in view for PWM on-time = 10 µs. Notice that the  
LED current is shifted with respect to PWM signal. Ripple at VOUT  
is ~0.2 V when using 2 × 4.7 µF MLCC as output capacitors.  
18  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
CH1 (Yellow) = PWM (5 V/div); CH2 (Red) = Inductor current  
(500 mA/div); CH3 (Blue) = VOUT (1 V/div); CH4 (Green) =  
LED current (200 mA/div); time scale = 2 µs/div.  
Figure 20: Zoom-in view showing A80602 is able to regulate LED  
current at PWM on-time down to 300 ns.  
The typical PWM dimming frequencies fall between 200 Hz and  
1 kHz. There is no hard limit on the highest PWM dimming fre-  
quency that can be used. However at higher PWM frequency, the  
maximum PWM dimming ratio will be reduced. This is shown in  
the following table:  
Figure 21: Traditional PWM Dimming operation where boost switch  
and LED current are enabled at the same time. Note that VOUT  
shows overall ripple of ~0.5 V  
When PWM signal goes high, a conventional LED driver turns  
on its boost switching at the time with LED current sinks. The  
problem is that the inductor current takes several switching cycles  
to ramp up to its steady-state value before it can deliver full  
power to the output load. During the first few cycles, energy to  
the LED load is mainly supplied by the output capacitor, which  
results in noticeable dip in output voltage.  
Table 4: Maximum PWM Dimming Ratio that can be achieved  
when operating at different PWM Dimming Frequency  
Maximum PWM  
PWM Frequency  
PWM Period  
Dimming Ratio  
15,000:1  
3,000:1  
200 Hz  
1 kHz  
5 ms  
1 ms  
3.3 kHz  
20 kHz  
300 µs  
50 µs  
1,000:1  
150:1  
Pre-Emptive Boost  
The basic principle of pre-emptive boost (PEB) can be best  
explained by the following two waveforms. The first one shows  
how a conventional LED driver operates during PWM dimming  
operation. The second one shows that of the A80602.  
Common test conditions for both cases:  
PWM = 1% at 1 kHz (on-time = 10 µs), fSW = 2.15 MHz,  
L = 10 µH, VIN = 12 V, LED load = 8 series (VOUT = ~25 V)  
at 100 mA × 4. COUT = 2 × 4.7 µF 50 V 1210 MLCC.  
COMP: RZ = 280 Ω, CZ = 68 nF.  
Figure 22: A80602 PWM dimming operation with PEB delay set to  
3 µs. Note that VOUT ripple is reduced to ~0.2 V.  
Common scope settings:  
19  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
In the A80602, the boost switch is also enabled when PWM goes  
high. However, the LED current is not turned on until after a  
short delay of tPEB. This allows the inductor current to build up  
before it starts to deliver the full power to LED load. During the  
pre-boost period, VOUT actually bumps up very slightly, while  
the following dip is essentially eliminated. When PWM goes low,  
both boost switching and LED remains active for the same delay  
of tPEB. Therefore the PWM on-time is preserved in LED current.  
Analog Dimming  
The peak (100%) level of LED current is set by the RISET resistor.  
The actual peak LED current may also be adjusted continuously  
from approximately 10% up to 100%, by using the ADIM pin.  
There are two methods to do so:  
1. In ADIM mode: apply a DC voltage between 0.2 V and 2 V  
at the pin.  
PEB delay can be programmed using an external resistor, RPEB  
from PEB pin to GND. Their relationship is shown in the follow-  
ing chart:  
,
2. In APWM mode: apply a clock signal with duty cycle be-  
tween 90% and 0% at the pin.  
ADIM MODE  
PEB Delay (µs) vs. PEB Resistor value (k)  
10  
An analog voltage is applied at the ADIM/APMW pin. This DC  
voltage linearly controls the peak LED current, as illustrated by  
the chart below:  
9
8
7
6
5
4
3
2
1
0
Normalized LED Current vs. ADIM Voltage  
100%  
90%  
80%  
70%  
60%  
50%  
ADIM Decreasing  
40%  
6
8
10  
12  
14  
16  
18  
20  
22  
24  
RPEB (k)  
ADIM Increasing  
30%  
Figure 23: How PEB delay time varies with value of PEB pin resis-  
20%  
10%  
0%  
tor to GND.  
Ideally, tPEB is equal to the inductor current ramp up time. But the  
latter is affected by many external parameters, such as switching  
frequency, inductance, VIN and VOUT ratio, etc. Therefore, some  
experimentation is required to optimize the PEB delay time. In  
general for switching frequency at 2 MHz, tPEB = 2.5 to 4 µs is a  
good starting point.  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
2.2  
ADIM Voltage (V)  
Figure 24: In analog dimming mode, the LED current is linearly pro-  
portional to ADIM voltage between 0.2 V and 2 V approximately  
The advantage of PEB is that even a non-optimized delay time  
can significantly reduce the output ripple voltage compared to a  
conventional LED driver.  
There is an internal pull-down resistor (50 kΩ typical) from  
ADIM pin to GND. When this pin is left floating, LED current  
is actually being dimmed down to ~10%. Therefore, if analog  
dimming is not required, the ADIM pin should be pulled to over  
2 V (but below VDD) to ensure 100% LED current. One simple  
technique is to pull up ADIM to VDD through a 30 kΩ resistor.  
20  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APWM MODE  
When a clock signal is detected at ADIM pin, the A80602 goes  
into APWM mode. The typical APWM signal frequency is  
between 40 kHz and 1 MHz. The duty cycle of this signal is  
inversely proportional to the percentage of current delivered to  
the LED. The relationship is shown below:  
Normalized LED Current vs. APWM Duty Cycle  
100%  
80%  
Measured  
60%  
Theorecal  
Figure 26: PWM = H. Total LED current drops from 400 mA (4 ×  
100 mA/ch) to 300 mA when APWM of 25% duty cycle is applied.  
Note that LED current takes ~1 ms to settle after change in APWM.  
40%  
20%  
0%  
0%  
20%  
40%  
60%  
80%  
100%  
APWM Duty Cycle  
Figure 25: Showing LED current is inversely proportional to the  
APWM duty cycle. Test conditions: VIN = 12 V, VOUT = 25 V (8 ×  
WLED), total LED current = 100 mA × 4, APWM frequency = 100 kHz  
As an example, a system that delivers a full LED current of  
100 mA per channel would deliver 75 mA when an APWM signal  
with a duty-cycle of 25% is applied (because analog dimming  
level is 100% – 25% = 75%). This is demonstrated by the fol-  
lowing waveforms (only LED channels 1 to 4 are enabled).  
Figure 27: PWM = 10% at 1 kHz. Peak LED current drops from  
400 mA (4 × 100 mA/ch) to 300 mA when APWM of 25% duty cycle  
is applied  
21  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
One popular application of analog dimming is for LED brightness The net result of using both PWM and APWM is 100,000:1 dim-  
calibration, commonly known as ‘LED Binning’. LEDs from  
the same manufacturer and series are often grouped into differ-  
ent ‘bins’ according to their light efficacy (lumens per watt). It is  
therefore necessary to calibrate the ‘100% current’ for each LED  
bin, in order to achieve uniform luminosity.  
ming ratio, as shown in the chart below:  
Average LED Current vs. PWM Dimming Duty Cycle  
100  
10  
To use ADIM pin as a trim function, the user should first set the  
100% current based on efficacy of LED from the lowest bin.  
When using LED with higher efficacy, the required current is then  
trimmed down to the appropriate level using APWM duty cycle.  
1
As an example, assume that:  
0.1  
• LED from lowest bin has an efficacy of 80 lm/W  
• LED highest bin has an efficacy of 120 lm/W  
PWM Dimming  
APWM + PWM  
Ideal  
Suppose the maximum LED current was set at 100 mA based  
on LEDs from lowest bin. When using LEDs from highest bin,  
the current should then be reduces to 67% (80/120). This can be  
achieved by sending APWM clock with 33% duty cycle.  
0.01  
0.001  
0.001  
0.01  
0.1  
1
10  
100  
PWM Dimming Duty Cycle (%)  
Extending LED Dimming Ratio  
The dynamic range of LED brightness can be further extended,  
by using a combination of PWM duty cycle, APWM duty cycle,  
and analog dimming method.  
Figure 28: How to achieve 100,000:1 dimming ratio by using both  
PWM and APWM. Test conditions: VIN = 12 V, VOUT = 25 V (8 ×  
WLED), total LED current = 400 mA, PWM frequency = 200 Hz,  
APWM frequency = 100 kHz.  
For example, the following approach can be used to achieve a  
100,000:1 dimming ratio at 200 Hz:  
Note that the A80602 is capable of providing analog dimming  
range greater than 10:1. By applying APWM with 96% duty  
cycle, for example, an analog dimming range of 25:1 can be  
achieved. However, this requires the external APWM signal  
source to have very fine pulse-width resolution. At 200 kHz  
APWM frequency, a resolution of 50 ns is required to adjust its  
duty cycle by 1%.  
Vary PWM duty cycle from 100% down to 0.01% to give  
10,000:1 dimming. This requires PWM dimming on-time be  
reduced down to 0.5 µs.  
• With PWM dimming on-time fixed at 0.5 µs, reduce peak  
LED current from 100% down to 10%. This can be achieved  
by either:  
Apply a clock signal at APWM pin, and vary its duty cycle  
from 0% to 90%, or  
Apply a DC voltage at APWM pin, and vary its level from  
2 V down to 0.2 V.  
22  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
In the following application example, the thermistor used is NTC-  
Analog Dimming with External Voltage  
S0805E3684JXT (680 kΩ @ 25°C). R1 = 336 kΩ, R2 = 20 kΩ,  
and R3 = 8.45 kΩ. The LED current per channel is reduced from  
97 mA at 25°C to 34 mA at 125°C.  
Besides using ADIM pin, the LED current can also be reduced  
by using an external voltage source applied through a resistor  
to the ISET pin. The dynamic range of this type of dimming is  
dependent on the ISET pin current. The recommended iSET range  
is from 20 µA to 144 µA for the A80602. Note that the IC will  
continue to work at iSET below 20 µA, but the relative error in  
LED current becomes larger at lower dimming level.  
ꢀꢁꢁ  
ꢂꢃ.ꢄ5 ꢀꢅ  
Aꢉ0ꢊ0ꢄ  
NTC  
Rꢄ  
ꢆSꢇꢈ  
ꢂ1.0 ꢀꢅ  
Below is a typical application circuit using a DAC (digital-analog  
converter) to control the LED current. The ISET current (which  
R1  
directly controls the LED current) is normally set as VISET/RISET  
.
ꢋNꢁ  
R3  
The DAC voltage can be higher or lower than VISET, thus adjust-  
ing the LED current to a lower or higher value.  
Figure 30: Thermal foldback of  
LED current using NTC thermistor  
Aꢃ0ꢄ0ꢅ  
Rꢅ  
ꢈꢇAC  
ꢀSꢁꢂ  
RꢀSꢂ  
ꢆNꢇ  
Figure 29: Adjusting LED current  
with an external voltage source  
Equation 5:  
VISET  
RISET  
VDAC V  
R2  
ISET  
iISET  
=
where VISET is the ISET pin voltage (typically 1.0 V), and  
VDAC is the DAC output voltage.  
Figure 31: LED current varies with temperature  
when using thermistor NTCS0805E3684JXT  
for thermal foldback  
When VDAC is higher than 1.00 V, the LED current is reduced.  
When VDAC is lower than 1.00 V, the LED current is increased.  
Some common applications for the above scheme include:  
• LED binning  
• Thermal fold-back using external NTC (negative temperature  
coefficient) thermistor  
23  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
VDD  
Shutdown  
The VDD pin provides regulated bias supply for internal circuits.  
Connect a CVDD capacitor with a value of 1 μF or greater to this  
pin. The internal LDO can deliver up to 2 mA of current with a  
typical VDD voltage of about 4.25 V. This allows it to serve as  
the pull up voltage for FAULT pin.  
If the EN/PWM pin is pulled low for longer than tEN(OFF)  
(~16 ms), the A80602 enters shutdown (sleep mode). The next  
time the EN/PWM pin goes high, all internal fault registers are  
cleared. The IC needs to go through a complete soft start process  
after PWM goes high.  
VDRV  
The VDRV pin provides a regulated gate driver supply for  
external boost power MOSFET. Connect a CVDRV capacitor with  
a typical value of 2.2 μF to this pin. The gate driver can deliver  
up to 2 A of peak sink and source current, with a typical VDRV  
voltage of 6.5 V. However, its average output current is limited to  
approximately 36 mA. Note that average gate driver current is:  
Equation 6:  
iVDRV = fSW × QG  
where fSW is the switching frequency and QG is the total gate  
charge of the power MOSFET for VGS = 0 to 6.5 V.  
At higher switching frequency, it is important to select a power  
MOSFET with low QG to limit the average gate driver current.  
Refer to the appendix section for details on MOSFET selection.  
Figure 32: After EN/PWM (Yellow) goes Low for ~16 ms, the IC  
completely shuts down so both VDD (Blue) and COMP (Red) decay.  
24  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
FAULT DETECTION AND PROTECTION  
FAULT Status  
ꢃC ꢄꢅꢅ  
The FAULT pin is an open-drain output that will be pulled low  
when a fault occurs. A pull-up resistor (typically around 10 kΩ) is  
required between this pin and desired logic level voltage (typi-  
cally 3.3 to 5 V). Multiple devices with open-drain FAULT pins  
can be connected in parallel to form a wired-AND configuration.  
This way, when any device reports a fault, the system FAULT  
signal is pulled low.  
ꢎNꢒPꢓMꢔH ꢕ  
ꢈꢃNꢖUꢈLꢄ  
Power ꢁꢆ  
ꢇꢈꢉꢉ, ꢊꢋ readyꢌ ꢋAꢍꢎ  
ꢆꢁlled Lꢌ ꢀaꢁlt checꢏingꢐ  
ꢎNꢒPꢓMꢔL  
ꢀAULꢍ State  
ꢀAULꢍ ꢆꢁlled Lꢐ  
Any ꢀaꢁlt  
detectedꢂ  
The A80602-1 (One-Out-All-Out option) has a bidirectional  
FAULT pin. This means the same pin also serves as an input to  
monitor the status of system FAULT signal. When the FAULT  
pin is pulled low externally for >8 fSW cycles by another device,  
the A80602-1 disables its own boost switch and all LED current  
sinks in response. This feature is required in Master/Slave con-  
figuration, for example.  
es  
No  
ꢎNꢒPꢓMꢔL  
ꢃC Ready  
ꢀAULꢍ ꢆꢁlled Lꢐ  
ꢎNꢒPꢓMꢔH  
Pin shorted  
to ꢋNꢉ ꢅaꢁlt  
ꢀAULL  
The following two simplified flow charts demonstrate the differ-  
ence between A80602 (unidirectional FAULT pin) and A80602-1  
(bidirectional FAULT pin).  
Lꢎꢉ Pin Checꢏ  
ꢇꢃn Use, ꢉisaꢗled, or  
Shorted to ꢋNꢉꢐ  
ꢍime-oꢁt withoꢁt ꢅaꢁlts  
ꢀAULꢍ released  
Soꢅt Start  
ꢇenaꢗle ꢗoost Sꢓ and  
Lꢎꢉ cꢁrrent sinꢏsꢐ  
Any ꢀaꢁlt  
detectedꢂ  
es  
No  
PꢓM ꢉimming  
Lꢎꢉꢔon  
Clear 1ꢘms timer  
ꢎNꢒPꢓM ꢔ L  
ꢎNꢒPꢓM ꢔ H  
Lꢎꢉꢔoꢅꢅ  
Start 1ꢘ ms timer  
ꢍimer eꢙꢆired  
Figure 33: Simplified A80602 Startup Flowchart  
25  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
ꢀC ꢄꢅꢅ  
ꢐNꢑPꢒMꢓH ꢔ  
ꢈꢀNꢕUꢈLꢄ  
Power ꢂꢆ  
ꢇꢈꢉꢉ, ꢊgreadyꢋ ꢁaꢂlt  
checꢌingꢍ  
ꢐNꢑPꢒMꢓL  
ꢁAULꢎ State  
ꢁAULꢎ ꢆꢂlled Lꢍ  
Any ꢀnternal  
ꢁaꢂlt detectedꢃ  
es  
No  
ꢐNꢑPꢒMꢓL  
ꢀC Ready  
ꢁAULꢎ ꢆꢂlled Lꢍ  
ꢐNꢑPꢒMꢓH  
Pin shorted  
Lꢐꢉ Pin Checꢌ  
to ꢙNꢉ ꢅaꢂlt  
ꢇꢀn Use, ꢉisaꢖled, or  
ꢁAULL  
Shorted to ꢙNꢉꢍ  
ꢎime-oꢂt withoꢂt ꢅaꢂlts  
ꢁAULꢎ released  
Any ꢐꢘternal  
ꢁaꢂlt detectedꢃ  
ꢀꢁꢂ  
ꢇꢁAULꢎ ꢆꢂlled L  
eꢘternallyꢍ  
No  
ꢁAULHꢍ  
Soꢅt Start  
ꢇenaꢖle ꢖoost Sꢒ and  
Lꢐꢉ cꢂrrent sinꢌsꢍ  
Any ꢀnternal  
ꢁaꢂlt detectedꢃ  
es  
No  
Any ꢐꢘternal  
ꢁaꢂlt detected ꢃ  
ꢀꢁꢂ  
ꢇꢁAULꢎ ꢆꢂlled L  
eꢘternallyꢍ  
No  
PꢒM ꢉimming  
Lꢐꢉꢓon  
Clear 1ꢗ ms timer  
ꢐNꢑPꢒM ꢓ L  
ꢐNꢑPꢒM ꢓ H  
Lꢐꢉꢓoꢅꢅ  
Start 1ꢗ ms timer  
ꢎimer eꢘꢆired  
Figure 34: Simplified startup flow chart for A80602-1, showing responses to both Internal  
and External FAULT signals  
26  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
For A80602, the FAULT pin is pulled low in case any LED  
LED String Partial-Short Detect  
string is directly or partially shorted. The suspect LED string is  
disabled, while the rest of the LED strings continue to operate.  
FAULT pin is latched at low until it is reset by either EN = L or  
PWM = L for >16 ms  
All LED current sink pins (LED1 to LED6) are designed to with-  
stand the maximum output voltage, as specified in the Absolute  
Maximum Ratings table. This prevents the IC from being dam-  
aged if VOUT is directly applied to an LED pin due to an output  
connector short.  
For A80602-1, all LED strings are turned off in case any LED  
string has detected a partial short. FAULT pin is latched at low  
until the IC is reset.  
In case of direct-short or partial-shorted fault in any LED string dur-  
ing operation, the LED pin with voltage exceeding VLEDSD will be  
removed from regulation. This prevents the IC from dissipating too  
much power due to large voltage drop across the LED current sink.  
Figure 37: A80602-1 startup sequence when LED string#2 has a  
partial-short fault (6 × WLED instead of 8). As soon as LED2 pin rises  
above VLEDSD (~5 V), the channel is disabled but FAULT remains High.  
Figure 35: A80602 Normal startup sequence showing voltage at LED1 and  
At least one LED pin must be at regulation voltage (below  
~1.2 V) for the LED string partial-short detection to activate.  
In case all of the LED pins are above regulation voltage (this  
could happen when the input voltage rises too high for the LED  
strings), they will continue to operate normally.  
LED2 pins. VIN = 6 V, output = 8 × WLED in series, current = 6 × 100 mA  
Figure 36: A80602 startup sequence when LED string#2 has a partial-  
short fault (6 × WLED instead of 8). As soon as LED2 pin rises above  
VLEDSC (~5 V), the channel is disabled and FAULT = Low.  
27  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Overvoltage Protection  
The A80602 offers a programmable output overvoltage protection  
(OVP). The OVP pin has a threshold level of 2.5 V typical. Overvolt-  
age protection is tripped when current into this pin exceeds ~150 µA.  
A resistor can be used to set the OVP threshold up to 40 V approxi-  
mately. This is sufficient for driving 11 white LEDs in series.  
The formula for calculating the OVP resistor is shown below:  
Equation 7:  
ROVP = (VOVP – VOVP(th)) / iOVP(th)  
where VOVP is the desired OVP threshold, VOVP(th) = 2.5 V  
typical, iOVP(th) = 150 µA typical.  
To determine the desired OVP threshold, take the maximum LED  
string voltage at cold and add ~10% margin on top of it.  
Figure 38: A80602 startup with LED2 string open. VOUT hits OVP at  
~30 V and LED2 is removed from regulation. FAULT pin goes Low  
but remaining LED strings continue to operate.  
The OVP event is not a latched fault and, by itself, does not pull  
the FAULT pin to low. If the OVP condition occurs during a load  
dump, for example, the IC will stop switching but not shut down.  
For A80602-1, all LED strings are disabled in case any string is  
not in regulation when VOUT hits OVP. FAULT pin is pulled low  
and switching is stopped. The IC remains in latched off state until  
it is reset.  
OVP condition is typically caused by an open LED fault, or dis-  
connected output connector. It may be detected either at startup or  
during normal operation. This is explained separately below.  
CASE 1: OVP AT STARTUP  
During soft start period, the A80602 tries to boost VOUT until it  
becomes high enough for all LED string to come into regulation.  
But if any LED string is open, VOUT will eventually hit OVP. At  
this point, the A80602 will disable any LED string that is still not  
in regulation. The FAULT pin is pulled low and boost switching  
is stopped to allow VOUT to fall. Once VOUT falls below ~97%  
OVP, switching resumes to power the remaining LED strings.  
Figure 39: A80602-1 startup with LED2 string open. VOUT hits  
OVP and all LED string are disabled. FAULT pin goes Low and IC  
remains latched off until reset.  
28  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
CASE 2: OVP DURING NORMAL OPERATION  
Boost Switch Overcurrent Protection  
When one LED string becomes open during operation, current  
through its LED driver drops to zero. The A80602 responds by  
boosting the output voltage higher. When output reaches OVP  
threshold, the LED string without current is removed from  
regulation. The rest of LED strings continue to draw current and  
drain down VOUT. Once VOUT falls below ~97% OVP, boost will  
resume switching to power the remaining LED strings.  
The external boost switch is protected with a cycle-by-cycle  
primary current limit. When the voltage sensed at CS pin exceeds  
VCS(LIM1) (typically 210 mV), the existing switching cycle is  
truncated. That means the peak switching current is limited to:  
Equation 8:  
iSW(LIM1) = VCS(LIM1) / RCS  
where RCS is the sense resistor connected from source of boost  
MOSFET to power ground.  
As an example, if RCS = 39 mΩ, then iSW(LIM1) = 5.4 A approxi-  
mately.  
The waveform below shows normal switching at VIN = 6 V, VOUT  
= ~26 V and total LED current 800 mA. Average input current is  
around 4.5 A.  
Figure 40: An open-LED string faults causes VOUT to ramp up  
and trip OVP. The A80602 then disables the open LED string and  
continues with remaining strings.  
The A80602-1, in contrast, will disable all LED strings in case  
any LED string becomes open. The IC remains in latched off  
state until it is reset.  
Figure 42: Normal 400 kHz switching waveform at VIN = 6 V. Red  
trace is the SW node voltage at 10 V/div. Green trace is the induc-  
tor current at 1 A/div.  
When the input voltage is reduced further to 5.6 V, input current  
increases and peak switch current reaches 5.4 A. Overcurrent  
protection is tripped to limit the peak SW current.  
Figure 41: An open-LED string faults causes VOUT to ramp up and  
trip OVP. The A80602-1 then disables all LED string and remains in  
latched off state until reset.  
29  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
If the input current level goes above the preset threshold, the part  
will be shut down in less than 3 µs. The FAULT pin is pulled  
Low and the IC remains in latched off state until it is reset. This  
feature prevents catastrophic failure in the system when there is  
a direct short from VOUT to GND (caused by a shorted output  
connector or cable, for example).  
The waveform below illustrates the input overcurrent fault condi-  
tion during startup. As soon as input OCP limit is reached, the  
part disables the gate of the disconnect switch Q1 and latches off.  
Figure 43: When peak current through the inductor reaches ~5.4 A,  
overcurrent protection kicks in to truncate the present switching cycle.  
There is also a secondary current sense limit VCS(LIM2), set at  
about 40% higher than the cycle-by-cycle current limit. It is to  
protect the external MOSFET from destructive current spikes in  
case the boost inductor or boost diode is shorted. Once this limit  
is tripped, the A80602 will immediately shut down and latch off.  
Input Overcurrent Protection and  
Disconnect Switch  
Figure 45: Startup into an output shorted-to-GND fault. Input OCP  
is tripped when current (Green trace) exceeds ~6.5 A. PMOS Gate  
(Red) is turned off immediately and IC latches off.  
iSNSꢆ  
ꢇꢈN  
ꢅo L1  
RSꢆNSꢆ  
During startup when Q1 first turns on, an inrush current flows  
through Q1 into the output capacitance. If Q1 turns on too fast  
(due to its low gate capacitance), the inrush current may trip  
input OCP limit. In this case, an external gate capacitance CG is  
added to slow down the turn-on transition. Typical value for CG is  
around 4.7 to 22 nF. Do not make CG too large, since it also slows  
down the turn-off transient during a real input OCP fault.  
ꢀ1  
ꢁPMꢂSꢃ  
RAꢉꢊ  
Cꢄ  
iAꢉꢊ  
ꢄAꢅꢆ  
SNSꢆ  
ꢈN  
A80602  
ꢈN ꢋ ꢇSꢆNSꢆ ꢌ RSꢆNSꢆ ꢍ iSꢆNSꢆ ꢎ RAꢉꢊ ꢍ iAꢉꢊ  
Figure 44: Optional input disconnect switch using a PMOSFET  
The primary function of the input disconnect switch is to protect  
the system and the device from excessive input currents during a  
fault condition.  
30  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Setting the Input Current Sense Resistor  
Fault Protection During Operation  
The input disconnect switch threshold is typically 98 mV, mea-  
sured between VIN and VSENSE pins when RADJ is 0 Ω. This  
threshold can be trimmed slightly using the RADJ resistor.  
The A80602 constantly monitors the state of the system to deter-  
mine if any fault conditions occur during normal operation. The  
response to a triggered fault condition is summarized in the table  
below. It is important to note that there are several points at which  
the A80602 monitors for faults during operation. The locations are  
input current, switch current, output voltage, switch voltage, and  
LED pins. Some of the protection features might not be active dur-  
ing startup to prevent false triggering of fault conditions.  
To avoid false tripping, the input disconnect switch overcurrent  
limit should be set higher than the boost switch cycle-by-cycle cur-  
rent limit. For example, the boost switch OCP is set at 5.4 A, so the  
input disconnect switch OCP may be set 25% higher at 6.75 A. The  
input current sense resistor is then calculated as below.  
The possible fault conditions that the part can detect include:  
When RADJ is not used:  
• Open LED Pin or open LED string  
• Shorted or partially shorted LED string  
• LED pin shorted to GND  
• Open or shorted boost diode  
• Open or shorted boost inductor  
• VOUT short to GND  
VIN – VSENSE = RSENSE × iSENSE = 98 mV  
The desired sense resistor is RSENSE = 98 mV / 6.75 A =  
14.5 mΩ. But this is not a standard E-24 resistor value. Pick the  
closest lower value which is 13 mΩ.  
When RADJ is used:  
• SW shorted to GND  
VIN – VSENSE = RSENSE × iSENSE + RADJ × iADJ  
Therefore  
• ISET shorted to GND  
• FSET shorted to GND  
• Input disconnect switch drain shorted to GND  
RADJ = [(VIN – VSENSE) – (RSENSE × iSENSE)] / iADJ  
= [98 mV – 88 mV] / 20 µA = 500 Ω  
Pick the closest E-96 resistor value of 499 Ω.  
Note that some of these faults will not be protected if the input  
disconnect switch is not being used. An example of this is VOUT  
short to GND fault.  
Input UVLO  
When VIN rises above VUVLOrise threshold, the A80602 is  
enabled. The IC is disabled when VIN falls below VUVLOfall  
threshold for more than 50 μs. This small delay is used to avoid  
shutting down because of momentary glitches in the input power  
supply.  
31  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table 5: A80602 Fault Mode Table  
Fault Flag  
Set  
Disconnect  
Switch  
Fault Name  
Type  
Active  
Description  
Boost Switch  
LED Sink drivers  
This fault condition is triggered when the SW current exceeds the  
cycle-by-cycle current limit, ISW(LIM).The present SW on-time is  
truncated immediately to limit the current. Next switching cycle starts  
normally.  
Primary Switch Overcurrent  
Protection (Cycle-By-Cycle Auto-restart  
Current Limit)  
Off for a single  
cycle  
Always  
NO  
ON  
ON  
When current through boost switch exceeds secondary SW current  
limit (iSW(LIM2)) the device immediately shuts down the disconnect  
switch, LED drivers and boost. The Fault flag is set. To reset the fault  
the EN/PWM pin needs to be pulled low for ~16 ms.  
Secondary Switch Current  
Limit  
Latched  
Off  
Always  
YES  
OFF  
OFF  
OFF  
The device is immediately shut off if the voltage across the input  
sense resistor is above the VSENSEtrip threshold. To reset the fault the  
EN/PWM pin must be pulled low for ~16 ms.  
Input Disconnect Current  
Limit  
Latched  
Off  
Always  
Startup  
YES  
YES  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
If any of the LED pins is determined to be shorted to GND when PWM  
first goes high, soft-start process is halted. Only when the short is  
removed, then soft-start is allowed to proceed.  
LEDx Pin Shorted to GND  
Auto-restart  
Auto-restart  
If an LED string is not getting enough current, the device will first  
respond by increasing the output voltage until OVP is reached. Any  
LED string that is still not in regulation will be disabled. The device will  
then go back to normal operation by reducing the output voltage to  
the appropriate voltage level.  
LEDx Pin Open  
(One-Out-Continue option)  
Normal  
operation  
OFF for open pins.  
ON for all others.  
YES  
YES  
ON  
ON  
If an LED string is not getting enough current, the device will first  
respond by increasing the output voltage until OVP is reached. If any  
LED string is still not in regulation, all LED strings will be disabled and  
the device latched off. To reset the fault the EN/PWM pin must be  
pulled low for ~16 ms.  
LEDx Pin Open  
(One-Out-All-Out option)  
Normal  
operation  
Latched  
OFF  
OFF  
OFF  
Fault occurs when the ISET current goes above 150% of max current.  
The boost will stop switching and the IC will disable the LED sinks  
until the fault is removed. When the fault is removed, the IC will try to  
regulate to the preset LED current.  
ISET Short Protection  
Auto-restart  
Auto-restart  
Always  
Always  
YES  
YES  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
Fault occurs when the FSET current goes above 150% of max  
current. The boost will stop switching, Disconnect switch will turn off  
and the IC will disable the LED sinks until the fault is removed. When  
the fault is removed, the IC will try to restart with soft-start.  
FSET/SYNC Short  
Protection  
Fault occurs when current into OVP pin exceeds iOVP(th) (typically  
150 µA). The IC will immediately stop switching but keep the LED  
drivers active, to drain down the output voltage. Once the output  
voltage decreases to ~94% OVP level, the IC will restart switching to  
regulate the output current.  
STOP during  
OVP event.  
Overvoltage Protection  
Undervoltage Protection  
Auto-restart  
Auto-restart  
Always  
Always  
NO  
ON  
ON  
ON  
Device immediately shuts off boost and current sinks if the voltage at  
VOUT is below VUVP(th). This may happen if VOUT is shorted to GND,  
or boost diode is open before startup. It will auto-restart once the fault  
is removed.  
YES  
OFF  
OFF  
Fault occurs if an LED pin voltage exceeds VLEDSC with its current  
sink in regulation, while at least one other LED pin is below ~1.2 V.  
This may happen when two or more LEDs are shorted within a string.  
The LED string exceeding the threshold will be disabled and removed  
from operation. Device will re-enable the LED string when its pin  
voltage falls below threshold, or at the next PWM = H.  
LED String Partial Short  
Detection (One-Out-  
Continue option)  
OFF for shorted  
string, ON for all  
others.  
Auto-restart  
Latched  
Always  
Always  
YES  
YES  
ON  
ON  
LED String Partial Short  
Detection (One-Out-All-Out  
option)  
If two or more LEDs are shorted within a string, all LED strings will be  
disabled and the device latched off. To reset the fault, EN or PWM pin  
must be pulled low for ~16 ms.  
OFF  
OFF  
OFF  
Fault occurs when the die temperature exceeds the over-temperature  
threshold, typically 170°C. IC will restart after temperatures drops  
lower by TSDHYS  
Overtemperature Protection Auto-restart  
Always  
Always  
YES  
NO  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
Fault occurs when VIN drops below VUVLO(fall). This fault resets all  
latched faults.  
VIN UVLO  
Auto-restart  
Continued on next page...  
32  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Table 5: A80602 Fault Mode Table (continued)  
Fault Flag  
Set  
Disconnect  
Switch  
Fault Name  
Type  
Active  
Description  
Boost Switch  
LED Sink drivers  
FAULT pin pulled Low  
Externally (One-Out-  
Continue option)  
Always  
ignored  
In One-Out-Continue mode (with unidirectional FAULT pin), external  
status of FAULT pin does not affect the operation of the IC in any way.  
Always ignored  
No change  
No change  
No change  
No change  
No change  
In One-Out-All-Out mode (with bidirectional FAULT pin), if FAULT pin  
is externally pulled Low, the IC immediately shuts off its boost and  
LED current sinks. IC can only restart when external fault status is  
cleared AND there is no internal fault status pending. That means  
local latching faults cannot be cleared by externally forcing FAULT  
pin to High.  
FAULT pin pulled Low  
Externally (One-Out-All-Out Auto-restart  
option)  
Always  
OFF  
ON  
OFF  
ꢀꢁꢂ ꢃꢄꢅꢆnꢇ ꢈaꢅꢄꢆaꢉ-ꢃꢊꢋꢅꢄ ꢂꢌꢄꢌꢍꢄꢆꢋn ꢆn ꢎnꢌ-ꢎꢏꢄ-ꢐꢋnꢄꢆnꢏꢌ ꢑꢋdA80602ꢓ  
ꢃaꢄlt Remoꢅed  
No ꢃaꢄlts  
Lꢀꢁꢂ String Partial-Short  
ꢃaꢄlt asserted  
ꢈꢠꢡ  
Lꢀꢁꢂ  
Lꢀꢁ1  
ꢀꢁꢂ1ꢗ  
ꢀꢁꢂ2  
LꢀꢁSꢁ  
0
ꢂ00 mA  
ꢆꢢꢀꢁꢂ 100 mA  
0
ꢔAꢕꢀꢖ  
A
ꢁꢛꢜꢉanaꢄꢆꢋn ꢋꢝ ꢌꢞꢌnꢄꢟ ꢆ  
Aꢆ PꢇM goes High and all Lꢀꢁ driꢅers oꢈerate normally. ꢃor simꢈlicity, assꢄme only Lꢀꢁ 1  
and Lꢀare in ꢄse, each sinꢊing 100 mA.ꢋ  
ꢆ A ꢈartial-short ꢌaꢄlt is asserted to Lꢀꢁ ꢂ string. Nothing haꢈꢈens yet since PꢇM ꢍ L.  
ꢆ At the neꢎt PꢇM ꢍ H, Lꢀꢁꢂ ꢈin ꢅoltage stays aꢏoꢅe ꢐLꢀꢁSꢁ while Lꢀ1 in is at regꢄlation  
ꢅoltage.  
ꢆ Aꢌter ꢈartial-short detection time ꢉꢑꢂ ꢒsꢋ, Lꢀꢁꢂ string is disaꢏled and ꢃAULꢓ ꢈin ꢈꢄlled  
Low. Lꢀꢁ1 string continꢄes to oꢈerate.  
ꢆ At sꢄꢏseꢔꢄent PꢇM ꢍ H, ꢕC retries Lꢀ1 ꢄt shꢄts it oꢌꢌ again since the ꢌaꢄlt is still  
ꢈresent. ꢃAULꢓ ꢌlag remains Low.  
ꢆ Partial Short ꢌaꢄlt is remoꢅed ꢌrom Lꢀꢁ ꢂ string. Nothing haꢈꢈens yet since PꢇM ꢍ L.  
ꢆ At the neꢎt PꢇM ꢍ H, ꢕC retries Lꢀ1 and it ꢈasses. ꢄt ꢃAULꢓ ꢌlag is not cleared  
ꢆ ꢃAULꢓ ꢌlag is cleared at the second PꢇM ꢍ H aꢌter Partial Short ꢌaꢄlt was remoꢅed.  
33  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
PACKAGE OUTLINE DRAWING  
For ꢀeꢁerence ꢂnly ꢃ Not ꢁor Tooling ꢄse  
ꢀeference Allegro DWG-2ꢁ71 (ꢀev. A) or ꢂEDEC MO-220WGGD.  
Dimensions in millimeters ꢃ NOT TO SCALE.  
Exact case and lead configuration at supplier discretion within limits shown.  
0.50  
0.30  
4.00 ꢅ0.10  
24  
24  
0.95  
1
2
1
2
A
4.00 ꢅ0.10  
4.10  
2.ꢁ0  
DETAIL A  
2.ꢁ0  
4.10  
D
C
24ꢄ  
0.75 ꢅ0.05  
0.0-0.05  
0.0ꢁ  
C
SEATING  
PLANE  
C PCB Layout Reference View  
ꢇ0.05  
ꢃ0.07  
0.25  
0.50 BSC  
0.40 ꢅ0.10  
0.14 REF  
0.10 REF  
0.20 REF  
0.203 REF  
0.05 REF  
0.05 REF  
0.40 ꢅ0.10  
B
Detail A  
ꢇ0.10  
ꢃ0.15  
2.70  
2
1
A
B
Terminal ꢆ1 mark area  
Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion)  
24  
C
Reference land pattern layout (reference IPC7351 QFN50P400X400X80-25W6M); all pads a minimum of 0.20 mm  
from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances;  
when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation  
(reference EIA/ꢂEDEC Standard ꢂESD51-5)  
0.20 REF  
ꢇ0.10  
ꢃ0.15  
2.70  
0.10 REF  
D
Coplanarity includes exposed thermal pad and terminals  
Figure 46: Package ES, 24-Pin 4 mm × 4 mm QFN with Exposed Thermal Pad and Wettable Flank  
34  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
APPENDIX: EXTERNAL MOSFET SELECTION GUIDE  
The A80602 drives an external MOSFET for the boost stage. This  
solution provides maximum flexibility in delivering a wide range  
of output voltage and current for different LED panels, compared  
to controllers with built-in boost switches. On the other hand,  
care must be taken in selection of external MOSFET, to ensure  
optimal tradeoff between component size, efficiency, and cost.  
Primary Parameters to consider include the following.  
ON-RESISTANCE  
Device with lower RDSON can directly reduce the conduction loss  
of the boost converter. This is especially important when the out-  
put power is high and input supply voltage is low. Note that most  
datasheets typically highlight this parameter at VGS = 10 V and  
TJ = 25°C. It is important to examine how RDSON varies with gate  
voltage and temperature, as shown in the following charts:  
BREAKDOWN VOLTAGE  
Pick the device with “Drain to Source Breakdown Voltage” at  
least 20% higher than the maximum possible SW voltage.  
• For boost configuration, VSW = VOUT + VF; where VF = boost  
diode forward drop.  
The A80602 has a maximum VOUT of 40 V. Therefore, the  
MOSFET should be rated 50 V or higher.  
• For SEPIC configuration, VSW = VIN + VOUT + VF.  
Note that VIN can be as high as 40 V during load-dump  
conditions. The breakdown voltage needs to be increased  
accordingly.  
GATE THRESHOLD VOLTAGE  
The device must be fully enhanced by the time VGS = 5 V. Note  
that this is not the same as “Gate to Source Threshold Voltage”  
in most MOSFET datasheets, which is typically specified at very  
small current such as 250 µA. A more reliable way is to consult  
the “Gate Charge Characteristics” chart of the device, and make  
sure that the ‘plateau’ occurs well before VGS reaches 5 V. See  
example from datasheet of one potential candidate:  
Figure 48: Chart showing On-Resistance varies with Darin  
Current and Gate Voltage.  
Figure 49: Nominalized On-Resistance vs. Junction Tem-  
perature at VGS = 10 V. Note that resistance increases by  
100% when temperature rises from 25°C to 150°C.  
Figure 47: Gate Charge vs. Gate-Source Voltage for an ex-  
ample MOSFET. Note plateau at VGS = 4.2 V approximately.  
35  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
On the other hand, selecting a device with very low QG may  
cause excessive voltage spikes at SW node due to high dV/dt. In  
this case, a snubber circuit can be added to dampen the ringing.  
The switching speed can be slowed down by adding a series gate  
resistance (such as 1-5 ohm) between the driver and the device.  
The downside of doing this is higher switching losses.  
THERMAL RATING  
The thermal resistance (RθJA) is primarily determined by the  
device’s physical size. If the thermal resistance of the device is  
too high, or if there is insufficient heat dissipation on the PCB,  
the device may enter thermal run-away situation and burn itself  
out. For most medium-power (10-30 W) applications, a DPAK  
device is generally sufficient. For high-power (>50 W) applica-  
tions, a D2PAK device may be required. Depending on power  
loss, additional heat sink can be mounted to improve the heat  
dissipation from the PCB.  
GATE CHARGE  
As mentioned earlier, lower RDSON is desired to reduce conduc-  
tion loss. But devices with lower RDSON typically also have  
higher gate charge (QG), which can lead to higher switching loss.  
This is especially important when switching at high frequency  
(such as 2 MHz) and with high output voltage. Higher gate  
charge also results in higher gate driver current and hence higher  
power loss for the controller IC.  
The A80602 uses an LDO to supply the driver voltage (VDRV),  
which has a current limit of 36 mA typical. Average gate driver  
current is:  
Figure 51: Gate Charge vs. Gate-Source Voltage chart for  
a suitable MOSFET (NVD5867NL). Note that its plateau is  
at ~3.5 V, and its total gate charge is about 10 nC as VGS  
ramps up from 0 to 6.5 V.  
iVDRV = fSW × QG  
If the MOSFET selected has QG = 27 nC, for example, then the  
highest switching frequency is limited to 1.33 MHz. See the fol-  
lowing chart for relation between maximum switching frequency  
and MOSFET gate charge:  
Max. Switching Frequency vs. Gate Charge  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
10  
15  
20  
25  
30  
35  
40  
Gate Charge (nC)  
Figure 50: Maximum Switching Frequency vs. Gate Charge  
(to keep average VDRV current under 36 mA).  
36  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  
A80602 and  
A80602-1  
High Power LED Driver with Pre-Emptive Boost  
for Ultra-High Dimming Ratio and Low Output Ripple  
Revision History  
Number  
Date  
Description  
March 4, 2019  
Initial release  
Copyright 2019, Allegro MicroSystems, LLC  
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to  
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that  
the information being relied upon is current.  
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of  
Allegro’s product can reasonably be expected to cause bodily harm.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its  
use; nor for any infringement of patents or other rights of third parties which may result from its use.  
Copies of this document are considered uncontrolled documents.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
37  
Allegro MicroSystems, LLC  
955 Perimeter Road  
Manchester, NH 03103-3353 U.S.A.  
www.allegromicro.com  

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