APS13295 [ALLEGRO]
Precision Hall-Effect Switch for Consumer and Industrial Applications;型号: | APS13295 |
厂家: | ALLEGRO MICROSYSTEMS |
描述: | Precision Hall-Effect Switch for Consumer and Industrial Applications |
文件: | 总14页 (文件大小:656K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
APS13295
Precision Hall-Effect Switch
for Consumer and Industrial Applications
FEATURES AND BENEFITS
DESCRIPTION
The APS13295 Hall-effect switch is a three-wire, planar
Hall-effect sensor integrated circuit (IC) especially suited for
operation over extended temperature ranges (up to 125°C).
• Unipolar switchpoints
• Superior ruggedness and fault tolerance
• Reverse-polarity and transient protection
• Operation from –40°C to 175°C junction temperature
• Output short-circuit and overvoltage protection
• Superior temperature stability
This Hall-effect switch IC is ideal for industrial and consumer
applicationsandfeaturesperformanceenhancementspermitting
high-temperatureoperationupto175°Cjunctiontemperatures.
In addition, the APS13295 includes a number of features
designed specifically to maximize system robustness such as
reverse-polarityprotection,outputcurrentlimiter,overvoltage,
and EMC protection.
• Resistant to physical stress
• High EMC immunity, ±12 kV HBM ESD
• Operation from unregulated supplies, 2.8 to 24 V
• Chopper stabilization
• Solid-state reliability
The single silicon chip includes: a voltage regulator, a Hall
plate, small signal amplifier, chopper stabilization, Schmitt
trigger, and a short-circuit-protected open-drain output. A
south pole of sufficient strength turns the output on. Removal
of the magnetic field—or a north pole—turns the output off.
The devices include on-board transient protection for all pins,
permitting operation directly from unregulated or regulated
supplies from 2.8 to 24 V.
• Industry-standard packages and pinouts
PACKAGES:
Not to scale
3-pin SIP
(suffix UA)
Twopackagestylesprovideachoiceofthrough-holeorsurface
mounting. Package type LH is a modified SOT23W, surface-
mount package, while UA is a three-lead ultra-mini SIP for
through-hole mounting. Both packages are lead (Pb) free and
RoHs compliant with 100% matte-tin leadframe plating.
3-pin SOT23W
(suffix LH)
Functional Block Diagram
VCC
REGULATOR
TO ALL SUBCIRCUITS
L
OW-PASS
ILTER
S
CHMITT
RIGGER
VOUT
F
T
Hall
Element
S
AMPLE, HOLD
&
H
ALL
C
ONTROL
URRENT
A
VERAGING
A
MP
.
C
L
IMIT
GND
APS13295-DS, Rev. 1
MCO-0000386
May 10, 2018
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
SELECTION GUIDE
Switchpoints
Ambient Temperature,
(Typ.)
Part Number
Packing[1]
Mounting
Branding
TA
BOP
BRP
APS13295KLHALX
APS13295KLHALT[2] 7-in. reel, 3000 pieces/reel
APS13295KUAA Bulk, 500 pieces/bag
13-in. reel, 10000 pieces/reel
3-pin SOT23W surface mount
3-pin SOT23W surface mount
3-pin SIP through hole
A33
A33
A34
–40°C to 125°C
35 G
25 G
[1] Contact Allegro for additional packing options.
[2] Available through authorized Allegro distributors only.
RoHS
COMPLIANT
ꢀSUPPLꢁ
RPULL-UP
ꢆ
1 ꢉΩ
APS13295
1
ꢄ
ꢀCC
ꢀꢂUꢃ
ꢀꢂUꢃ
CꢅꢁP
ꢆ
ꢊNꢋ
0.1 ꢇꢈ
3
Figure 1: Typical Application Circuit
2
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
ABSOLUTE MAXIMUM RATINGS
Characteristic
Forward Supply Voltage [1]
Reverse Supply Voltage [1]
Output Off Voltage [1]
Symbol
Notes
Rating
30
Units
V
VCC
VRCC
VOUT
IOUT
IROUT
B
–18
V
30
V
Output Current [2]
60
mA
mA
–
Reverse Output Current
Magnetic Flux Density [3]
–50
Unlimited
165
°C
°C
°C
kV
kV
Maximum Junction Temperature
Storage Temperature
ESD Voltage
TJ(max)
For 500 hours
175
Tstg
–65 to 170
±12
VESD(HBM)
VESD(CDM)
Human Body Model according to AEC-Q100-002
Charged Device Model according to AEC-Q100-011
±1
[1] This rating does not apply to extremely short voltage transients such as load dump and/or ESD. Those events have individual ratings,
specific to the respective transient voltage event.
[2] Through short-circuit current limiting device.
[3] Guaranteed by design.
PINOUT DIAGRAMS AND TERMINAL LIST
3
Terminal List
Number
Name
Description
LH
UA
1
VCC
VOUT
GND
Connects power supply to chip
Output from circuit
Ground
1
2
3
3
2
2
1
2
1
3
3-pin SIP
(suffix UA)
3-pin SOT23W
(suffix LH)
3
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
ELECTRICAL CHARACTERISTICS: Valid over full operating voltage, ambient temperature range TA = –40°C to 125°C,
and with CBYP = 0.1 µF, unless otherwise specified
Characteristics
ELECTRICAL CHARACTERISTICS
Forward Supply Voltage
Supply Current
Symbol
Test Conditions
Min.
Typ.[1]
Max.
Unit[2]
VCC
ICC
Operating, TJ < 175°C
2.8
1
–
2
24
3
V
mA
µA
mV
V
Output Leakage Current
Output Saturation Voltage
Output Off Voltage
IOUTOFF
VOUTOFF = 24 V, B < BRP
–
–
10
500
24
VOUT(SAT) IOUT = 20 mA, B > BOP
VOUTOFF B < BRP
–
200
–
–
VCC ≥ VCC(min), B < BRP(min) – 10 G,
B > BOP(max) + 10 G
Power-On Time [3]
tON
–
–
25
µs
Power-On State, Output[3]
Chopping Frequency
Output Rise Time[4]
Output Fall Time[4]
POS
VCC ≥ VCC(min), t < tON
Low
800
0.2
–
fC
tr
–
–
–
–
2
2
kHz
µs
RPULL-UP = 1 kΩ, CL = 20 pF
RPULL-UP = 1 kΩ, CL = 20 pF
tf
0.1
µs
TRANSIENT PROTECTION CHARACTERISTICS
Output Short-Circuit Current Limit
Output Zener Clamp Voltage
Reverse Battery Current
Supply Zener Clamp Voltage
MAGNETIC CHARACTERISTICS
Operate Point
IOM
VZoutput
IRCC
30
30
–
–
–
–
–
60
–
mA
V
IOUTOFF = 3 mA; TA = 25°C, Output Off
VRCC = –18 V, TA = 25°C
–5
–
mA
V
VZ
ICC = ICC(max) + 3 mA, TA = 25°C
30
BOP
BRP
–
5
7
35
25
10
50
–
G
G
G
Release Point
Hysteresis
BHYS
(BOP – BRP
)
20
[1] Typical data are at TA = 25°C and VCC = 12 V.
[2] 1 G (gauss) = 0.1 mT (millitesla).
[3] Guaranteed by device design and characterization.
[4] CL = oscilloscope probe capacitance.
4
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic
Symbol
Test Conditions
Value Units
Package LH, 1-layer PCB with copper limited to solder pads
228
110
165
°C/W
°C/W
°C/W
2
Package LH, 2-layer PCB with 0.463 in. of copper area each side
Package Thermal Resistance
RθJA
connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads
Power Derating Curve
TJ(max) = 175°C; ICC = ICC(max), IOUT = 0 mA (Output Off)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
VCC(max)
Package LH, 2-layer PCB
(RθJA = 110 °C/W)
Package UA, 1-layer PCB
(RθJA = 165 °C/W)
Package LH, 1-layer PCB
(RθJA = 228 °C/W)
8
7
6
5
4
VCC(min)
85 105 125 145 165 185
3
2
25
45
65
TJ(max)
Temperature (°C)
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
Package LH, 2-layer PCB
(RθJA = 110°C/W)
Package UA, 1-layer PCB
(RθJA = 165°C/W)
800
700
600
500
400
300
200
100
Package LH, 1-layer PCB
(RθJA = 228°C/W)
0
25
45
65
85
105 125 145 165 185
Temperature (°C)
5
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
CHARACTERISTIC PERFORMANCE DATA
Average Supply Current versus Supply Voltage
Average Supply Current versus Ambient Temperature
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
TA (°C)
-40
VCC (V)
2.8
25
12
24
125
2
6
10
14
18
22
26
-60
-40
-20
0
20
40
60
80
100
120
140
VCC (V)
TA (°C)
Average Low Output Voltage versus Supply Voltage for IOUT = 20 mA
Average Low Output Voltage versus Ambient Temperature for IOUT = 20 mA
500
500
450
400
350
300
250
200
150
100
50
450
400
350
300
250
200
150
100
50
TA (°C)
-40
VCC (V)
2.8
25
12
125
24
0
0
2
6
10
14
18
22
26
-60
-40
-20
0
20
40
60
80
100
120
140
VCC (V)
TA (°C)
6
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
CHARACTERISTIC PERFORMANCE DATA (continued)
Average Operate Point versus Ambient Temperature
Average Operate Point versus Supply Voltage
60
55
50
45
40
35
30
25
20
15
10
60
55
50
45
40
35
30
25
20
15
10
TA (°C)
-40
VCC (V)
2.8
25
12
24
125
-60
-40
-20
0
20
40
60
80
100
120
140
2
6
10
14
VCC (V)
18
22
26
TA (°C)
Average Release Point versus Ambient Temperature
Average Release Point versus Supply Voltage
50
45
40
35
30
25
20
15
10
5
50
45
40
35
30
25
20
15
10
5
TA (°C)
-40
VCC (V)
2.8
25
12
24
125
-60
-40
-20
0
20
40
60
80
100
120
140
2
6
10
14
VCC (V)
18
22
26
TA (°C)
Average Switchpoint Hysteresis versus Supply Voltage
Average Switchpoint Hysteresis versus Ambient Temperature
25
25
23
21
19
17
15
13
11
9
23
21
19
17
15
13
11
9
VCC (V)
2.8
TA (°C)
-40
12
25
24
125
7
7
5
5
-60
-40
-20
0
20
40
60
80
100
120
140
2
6
10
14
18
22
26
TA (°C)
VCC (V)
7
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
FUNCTIONAL DESCRIPTION
OPERATION
POWER-ON BEHAVIOR
The output of the APS13295 switches low (turns on) when a
south-polarity magnetic field perpendicular to the Hall element
exceeds the operate point threshold, BOP (see Figure 2). After
turn-on, the output voltage is VOUT(SAT). The output transistor is
Device power-on occurs once tON has elapsed. During the
time prior to tON, and after VCC ≥ VCC(min), the output state is
VOUT(SAT). After tON has elapsed, the output will correspond with
the applied magnetic field for B > BOP or B < BRP. See Figure 3
capable of continuously sinking up to 30 mA. When the magnetic for an example.
field is reduced below the release point, BRP, the device output
Powering-on the device in the hysteresis range (less than BOP and
higher than BRP) will give an output state of VOUTOFF. The cor-
goes high (turns off) to VOUTOFF
.
rect state is attained after the first excursion beyond BOP or BRP
.
V+
VOUTOFF
Key
POS
B>BOP
B<BRP,BRP<B<BOP
V
VOUT(OFF)
Output State
Undefined for
VOUT(SAT)
POS
VCC<VCC(min)
0
VOUT(SAT)
B+
(south)
0
t
t
V
BHYS
VCC(min)
Figure 2: Device Switching Behavior
On the horizontal axis, the B+ direction indicates increasing
south polarity magnetic field strength.
0
tON
The difference in the magnetic operate and release points is the
hysteresis, BHYS, of the device. This built-in hysteresis allows
clean switching of the output even in the presence of external
mechanical vibration and electrical noise.
Figure 3: Power-On Sequence and Timing
8
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
Applications
ꢀPULL-UP
ꢀSUPPLꢁ
It is strongly recommended that an external bypass capacitor be
connected (in close proximity to the Hall element) between the
supply and ground of the device to guarantee correct performance
under harsh environmental conditions and to reduce noise from
internal circuitry. As is shown in Figure 1: Typical Application
Circuit, a 0.1 µF capacitor is required. In applications where max-
imum robustness is required, additional measures may be taken.
In Figure 4: Enhanced Protection Circuit, a resistor in series with
the VCC pin and a capacitor on the VOUT pin enhance the EMC
immunity of the device. It is up to the user to fully qualify the
Allegro sensor IC in their end system to ensure they achieve their
system requirements.
A
RPULL-UP
1 ꢉΩ
ꢆ
RS ꢆ
100 Ω
APS13295
ꢀꢂUꢃ
1
ꢄ
ꢀCC
ꢀꢂUꢃ
A
ꢌNꢍ
3
CꢅꢁP
0.1 ꢇꢈ
ꢆ
CꢂUꢃ
ꢆ
ꢊ.ꢋ nꢈ
A
RS and CꢂUꢃ are recommended ꢎor maꢏimꢐm
roꢑꢐstness in an aꢐtomotiꢒe enꢒironment.
These devices are sensitive in the direction perpendicular to the
branded package face, and may be configured to sense magnetic
fields in a variety of orientations, such as the ones shown in
Figure 5.
Figure 4: Enhanced Protection Circuit
Extensive applications information for Hall-effect devices is
available in:
• Hall-Effect IC Applications Guide, AN27701,
• Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices AN27703.1
• Soldering Methods for Allegro’s Products – SMD and
Through-Hole, AN26009
All are provided on the Allegro website:
www.allegromicro.com
N
S
S
N
PCB
Figure 5: Sensing Configurations
9
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
CHOPPER STABILIZATION
A limiting factor for switchpoint accuracy when using Hall-effect the offset causing the magnetically induced signal to recover its
technology is the small-signal voltage developed across the Hall
plate. This voltage is proportionally small relative to the offset
that can be produced at the output of the Hall sensor. This makes
it difficult to process the signal and maintain an accurate, reliable
output over the specified temperature and voltage range. Chopper
stabilization is a proven approach used to minimize Hall offset.
original spectrum at baseband while the DC offset becomes a
high-frequency signal. Then, using a low-pass filter, the signal
passes while the modulated DC offset is suppressed. Allegro’s
innovative chopper stabilization technique uses a high-frequency
clock. The high-frequency operation allows a greater sampling
rate that produces higher accuracy, reduced jitter, and faster sig-
nal processing. Additionally, filtering is more effective and results
in a lower noise analog signal at the sensor output. Devices such
as the APS13295 that use this approach have an extremely stable
quiescent Hall output voltage, are immune to thermal stress,
and have precise recoverability after temperature cycling. This
technique is made possible through the use of a BiCMOS process
which allows the use of low-offset and low-noise amplifiers
in combination with high-density logic and sample-and-hold
circuits.
The Allegro technique, dynamic quadrature offset cancellation,
removes key sources of the output drift induced by temperature
and package stress. This offset reduction technique is based on
a signal modulation-demodulation process. Figure 6: Model of
Chopper Stabilization Circuit (Dynamic Offset Cancellation)
illustrates how it is implemented.
The undesired offset signal is separated from the magnetically
induced signal in the frequency domain through modulation.
The subsequent demodulation acts as a modulation process for
Regulator
Clock/Logic
Low-Pass
Filter
Hall Element
Amp
Figure 6: Model of Chopper Stabilization Circuit
(Dynamic Offset Cancellation)
10
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
For example, given common conditions such as: TA= 25°C,
POWER DERATING
The device must be operated below the maximum junction tem-
perature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
VCC = 12 V, ICC = 2 mA, VOUT = 185 mV, IOUT = 20 mA (output
on), and RθJA = 165°C/W, then:
PD = (VCC × ICC) + (VOUT × IOUT) =
(12 V × 2 mA) + (185 mV × 20 mA) =
24 mW + 3.7 mW = 27.7 mW
ΔT = PD × RθJA = 27.7 mW × 165°C/W = 4.6°C
TJ = TA + ΔT = 25°C + 4.6°C = 29.6°C
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding
TJ(max), at a selected RθJA
.
For example, given the conditions RθJA = 228°C/W, TJ(max) =
175°C, VCC(max) = 24 V, ICC(max) = 4 mA, VOUT = 500 mV,
and IOUT = 25 mA (output on), the maximum allowable operating
ambient temperature can be determined.
The resulting power dissipation capability directly reflects upon
the ability of the device to withstand extreme operating condi-
tions. The junction temperature mission profile specified in the
Absolute Maximum Ratings table designates a total operating life
capability based on qualification for the most extreme conditions,
where TJ may reach 175°C.
The power dissipation required for the output is shown below:
PD(VOUT) = VOUT × IOUT = 500 mV × 25 mA = 12.5 mW
The power dissipation required for the IC supply is shown below:
PD(VCC) = VCC × ICC = 24 V × 4 mA = 96 mW
The silicon IC is heated internally when current is flowing into
the VCC terminal. When the output is on, current sinking into the
VOUT terminal generates additional heat. This may increase the
junction temperature, TJ, above the surrounding ambient tempera-
ture. The APS13295 is permitted to operate up to TJ = 175°C. As
mentioned above, an operating device will increase TJ according
to equations 1, 2, and 3 below. This allows an estimation of the
maximum ambient operating temperature.
Next, by inverting using equation 2:
ΔT = PD × RθJA = [PD(VOUT) + PD(VCC)] × 228°C/W =
(12.5 mW + 96 mW) × 228°C/W =
108.5 mW × 228°C/W = 24.7°C
Finally, by inverting equation 3 with respect to voltage:
TA(est) = TJ(max) – ΔT = 175°C – 24.7°C = 150.3°C
In the above case, there is sufficient power dissipation capability
to operate up to TA(est).The example indicates that TA(max) can
be as high as 150.3°C without exceeding TJ(max). However, the
TA(max) rating of the device is 125°C; the APS13295 perfor-
mance is not guaranteed above TA = 125°C.
PD = VIN
I
(1)
(2)
(3)
×
IN
ꢀ
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀΔT = PD
R
θJA
×
TJ = TA + ΔT
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
Package LH, 3-Pin (SOT-23W)
+0.12
–0.08
2.98
3
D
1.49
4°±4°
A
+0.020
0.180
–0.053
D
0.96
D
+0.10
2.90
+0.19
–0.06
2.40
1.91
–0.20
0.70
0.25 MIN
1.00
2
1
0.55 REF
0.25 BSC
0.95
Seating Plane
Gauge Plane
PCB Layout Reference View
B
Branded Face
8X 10° REF
C
Standard Branding Reference View
1.00 ±0.13
+0.10
A33
0.05
–0.05
0.95 BSC
0.40 ±0.10
1
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Active Area Depth, 0.28 mm REF
A
B
Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
C
D
Branding scale and appearance at supplier discretion
Hall element, not to scale
12
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
Package UA, 3-Pin SIP
For Reference Only – Not for Tooling Use
(Reference DWG-0000406, Rev. 1)
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
+0.08
–0.05
4.09
45°
B
C
E
2.04
1.52 ±0.05
10°
1.44
E
E
Mold Ejector
Pin Indent
+0.08
3.02
–0.05
45°
Branded
Face
D
Standard Branding Reference View
0.51 REF
0.79 REF
1.02
MAX
A34
A
1
1
2
3
14.99 ±0.25
+0.03
–0.06
0.41
+0.05
–0.07
0.43
Dambar removal protrusion (6×)
Gate and tie bar burr area
A
B
C
D
Active Area Depth, 0.50 mm ±0.08
Branding scale and appearance at supplier discretion
Hall element, not to scale
E
1.27 NOM
13
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
Revision History
Number
Date
Description
–
1
February 26, 2018
May 10, 2018
Initial release
Corrected part numbers in selection guide (page 2); renamed RLOAD to RPULL-UP (page 2, 4, 9).
Copyright ©2018, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
For the latest version of this document, visit our website:
www.allegromicro.com
14
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
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