EP1SGX10GF1020I5N_技术文档

Section I. Stratix GX

Device Family Data Sheet

This section provides the data sheet specifications for Stratix^®GX

devices. It contains feature definitions of the internal architecture,

configuration information, testing information, DC operating conditions,

and AC timing parameters.

This section includes the following chapters:

■

Chapter 1, Introduction to the Stratix GX Device Data Sheet

Chapter 2, Stratix GX Transceivers

Chapter 3, Source-Synchronous Signaling With DPA

Chapter 4, Stratix GX Architecture

Chapter 5, Configuration & Testing

Chapter 6, DC & Switching Characteristics

Chapter 7, Reference & Ordering Information

The table below shows the revision history for Chapters 1 through 7.

Revision History

Chapter(s)

Date / Version

Changes Made

1

2

3

4

5

6

7

February 2005, v1.0 Initial Release.

August 2005, v1.1

Added Note (3) to Figure 3-7.

February 2005, v1.0 Initial Release.

August 2005, v1.1

Updated Tables 6-7 and 6-50.

February 2005, v1.0 Initial Release.

Altera Corporation

Section I–1

Preliminary

Stratix GX Device Family Data Sheet

Stratix GX Device Handbook, Volume 1

Section I–2

Preliminary

Altera Corporation

1. Introduction to the

Stratix GX Device Data Sheet

SGX51001-1.0

The Stratix^®GX family of devices is Altera’s second FPGA family to

combine high-speed serial transceivers with a scalable, high-performance

logic array. Stratix GX devices include 4 to 20 high-speed transceiver

channels, each incorporating clock data recovery (CDR) technology and

embedded SERDES capability at data rates of up to 3.1875 gigabits per

second (Gbps). These transceivers are grouped by four-channel

transceiver blocks, and are designed for low power consumption and

small die size. The Stratix GX FPGA technology is built upon the Stratix

architecture, and offers a 1.5-V logic array with unmatched performance,

flexibility, and time-to-market capabilities. This scalable,

Overview

high-performance architecture makes Stratix GX devices ideal for

high-speed backplane interface, chip-to-chip, and communications

protocol-bridging applications.

■

Transceiver block features are as follows:

Features

●

High-speed serial transceiver channels with CDR provides

500-megabits per second (Mbps) to 3.1875-Gbps full-duplex

operation

Devices are available with 4, 8, 16, or 20 high-speed serial

transceiver channels providing up to 127.5 Gbps of full-duplex

serial bandwidth

Support for transceiver-based protocols, including 10 Gigabit

Ethernet attachment unit interface (XAUI), Gigabit Ethernet

(GigE), and SONET/SDH

●

Compatible with PCI Express, SMPTE 292M, Fibre Channel, and

Serial RapidIO I/O standards

Programmable differential output voltage (V_OD), pre-emphasis,

and equalization settings for improved signal integrity

Individual transmitter and receiver channel power-down

capability implemented automatically by the Quartus^®II

software for reduced power consumption during non-operation

Programmable transceiver-to-FPGA interface with support for

8-, 10-, 16-, and 20-bit wide data paths

1.5-V pseudo current mode logic (PCML) for 500 Mbps to

3.1875 Gbps

Support for LVDS, LVPECL, and 3.3-V PCML on reference

clocks and receiver input pins (AC-coupled)

Built-in self test (BIST)

●

Hot insertion/removal protection circuitry

Altera Corporation

February 2005

1–1

Features

●

Pattern detector and word aligner supports programmable

patterns

8B/10B encoder/decoder performs 8- to 10-bit encoding and 10-

to 8-bit decoding

Rate matcher compliant with IEEE 802.3-2002 for GigE mode

and with IEEE 802-3ae for XAUI mode

Channel bonding compliant with IEEE 802.3ae (for XAUI mode

only)

Device can bypass some transceiver block features if necessary

■

FPGA features are as follows:

●

10,570 to 41,250 logic elements (LEs); see Table 1–1

Up to 3,423,744 RAM bits (427,968 bytes) available without

reducing logic resources

●

TriMatrix^™memory consisting of three RAM block sizes to

implement true dual-port memory and first-in-out (FIFO)

buffers

●

Up to 16 global clock networks with up to 22 regional clock

networks per device region

High-speed DSP blocks provide dedicated implementation of

multipliers (faster than 300 MHz), multiply-accumulate

functions, and finite impulse response (FIR) filters

Up to eight general usage phase-locked loops (four enhanced

PLLs and four fast PLLs) per device provide spread spectrum,

programmable bandwidth, clock switchover, real-time PLL

reconfiguration, and advanced multiplication and phase

shifting

●

Support for numerous single-ended and differential I/O

standards

High-speed source-synchronous differential I/O support on up

to 45 channels for 1-Gbps performance

Support for source-synchronous bus standards, including

10-Gigabit Ethernet XSBI, Parallel RapidIO, UTOPIA IV,

Network Packet Streaming Interface (NPSI), HyperTransport

TM

technology, SPI-4 Phase 2 (POS-PHY Level 4), and SFI-4

Support for high-speed external memory, including zero bus

turnaround (ZBT) SRAM, quad data rate (QDR and QDRII)

SRAM, double data rate (DDR) SDRAM, DDR fast cycle RAM

(FCRAM), and single data rate (SDR) SDRAM

●

Support for multiple intellectual property megafunctions from

Altera^®MegaCore^®functions and Altera Megafunction Partners

SM

Program (AMPP ) megafunctions

●

Support for remote configuration updates

Dynamic phase alignment on LVDS receiver channels

1–2

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Introduction to the Stratix GX Device Data Sheet

Table 1–1. Stratix GX Device Features

EP1SGX25C

EP1SGX25D

EP1SGX25F

EP1SGX10C

EP1SGX10D

EP1SGX40D

EP1SGX40G

Feature

LEs

10,570

25,660

41,250

Transceiver channels

Source-synchronous channels

M512 RAM blocks (32 × 18 bits)

M4K RAM blocks (128 × 36 bits)

M-RAM blocks (4K ×144 bits)

Total RAM bits

4, 8

4, 8, 16

8, 20

22

39

45

94

224

384

60

138

183

1

2

4

920,448

1,944,576

3,423,744

Digital signal processing (DSP) blocks

Embedded multipliers (1)

PLLs

6

48

4

10

80

4

14

112

8

Note to Table 1–1:

(1) This parameter lists the total number of 9- × 9-bit multipliers for each device. For the total number of 18- × 18-bit

multipliers per device, divide the total number of 9- × 9-bit multipliers by 2. For the total number of 36- × 36-bit

multipliers per device, decide the total number of 9- × 9-bit multipliers by 8.

Stratix GX devices are available in space-saving FineLine BGA^®packages

(refer to Tables 1–2 and 1–3), and in multiple speed grades (refer to

Table 1–4). Stratix GX devices support vertical migration within the same

package (that is, you can migrate between the EP1SGX10C and

EP1SGX25C devices in the 672-pin FineLine BGA package). See the

Stratix GX device pin tables for more information. Vertical migration

means that you can migrate to devices whose dedicated pins,

configuration pins, and power pins are the same for a given package

across device densities. For I/O pin migration across densities, you must

cross-reference the available I/O pins using the device pin-outs for all

planned densities of a given package type, to identify which I/O pins it

is possible to migrate. The Quartus II software can automatically cross

reference and place all pins for migration when given a device migration

list.

Table 1–2. Stratix GX Package Options & I/O Pin Counts (Part 1

of 2)

Note (1)

Device

672-Pin FineLine BGA

1,020-Pin FineLine BGA

EP1SGX10C

EP1SGX10D

EP1SGX25C

362

455

Altera Corporation

February 2005

1–3

Stratix GX Device Handbook, Volume 1

High-Speed I/O Interface Functional Description

Table 1–2. Stratix GX Package Options & I/O Pin Counts (Part 2

of 2) Note (1)

Device

672-Pin FineLine BGA

1,020-Pin FineLine BGA

EP1SGX25D

EP1SGX25F

EP1SGX40D

EP1SGX40G

455

607

624

Note to Table 1–2:

(1) The number of I/O pins listed for each package includes dedicated clock pins and

dedicated fast I/O pins. However, these numbers do not include high-speed or

clock reference pins for high-speed I/O standards.

Table 1–3. Stratix GX FineLine BGA Package Sizes

Dimension

672 Pin

1,020 Pin

Pitch (mm)

1.00

729

1.00

1,089

Area (mm²)

Length × width (mm × mm)

27 × 27

33 × 33

Table 1–4. Stratix GX Device Speed Grades

Device

672-Pin FineLine BGA

1,020-pin FineLine BGA

EP1SGX10

-5, -6, -7

EP1SGX25

EP1SGX40

-5, -6, -7

The Stratix GX device family supports high-speed serial transceiver

blocks with CDR circuitry as well as source-synchronous interfaces. The

channels on the right side of the device use an embedded circuit

dedicated for receiving and transmitting high-speed serial data streams

to and from the system board. These channels are clustered in a

four-channel serial transceiver building block and deliver high-speed

bidirectional point-to-point data transmissions to provide up to

3.1875 Gbps of full-duplex data transmission per channel. The channels

on the left side of the device support source-synchronous data transfers

at up to 1 Gbps using LVDS, LVPECL, 3.3-V PCML, or HyperTransport

technology I/O standards. Figure 1–1 shows the Stratix GX I/O blocks.

The differential source-synchronous serial interface and the high-speed

serial interface are described in the Stratix GX Transceivers chapter of the

Stratix GX Device Handbook, Volume 1.

High-Speed I/O

Interface

Functional

Description

1–4

Altera Corporation

Stratix GX Device Handbook, Volume 1

February 2005

Introduction to the Stratix GX Device Data Sheet

Figure 1–1. Stratix GX I/O Blocks

Note (1)

DQST9 DQST8 DQST7 DQST6 DQST5

DQST4 DQST3 DQST2 DQST1 DQST0

VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4

Bank 4

PLL5

PLL7 VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3

Bank 3

PLL11

9

10

I/O Bank 13 (5)

LVDS, LVPECL, 3.3-V PCML,

and HyperTransport I/O Block

and Regular I/O Pins (3)

(4)

I/O Banks 3, 4, 9 & 10 Support

All Single-Ended I/O Standards (2)

I/O Bank 14 (5)

I/O Bank 17 (5)

I/O Banks 1 and 2 Support All

Single-Ended I/O Standards Except

Differential HSTL Output Clocks,

Differential SSTL-2 Output Clocks,

HSTL Class II, GTL, SSTL-18 Class II,

PCI, PCI-X, and AGP 1×/2×

PLL1

PLL2

1.5-V PCML (5)

I/O Bank 16 (5)

I/O Bank 15 (5)

I/O Banks 7, 8, 11 & 12 Support

All Single-Ended I/O Standards (2)

(4)

LVDS, LVPECL, 3.3-V PCML,

and HyperTransport I/O Block

and Regular I/O Pins (3)

Bank 8

11

12

Bank 7

VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8

DQSB9 DQSB8 DQSB7 DQSB6 DQSB5

PLL12

VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7

DQSB4 DQSB3 DQSB2 DQSB1 DQSB0

PLL8

PLL6

Notes to Figure 1–1:

(1) Figure 1–1 is a top view of the Stratix GX silicon die.

(2) Banks 9 through 12 are enhanced PLL external clock output banks.

(3) If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the

I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.

(4) For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in

Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook, Volume 2.

(5) These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on

reference clocks and receiver input pins (AC coupled).

Stratix GX devices contain a two-dimensional row- and column-based

architecture to implement custom logic. A series of column and row

interconnects of varying length and speed provide signal interconnects

between logic array blocks (LABs), memory block structures, and DSP

blocks.

FPGA Functional

Description

Altera Corporation

February 2005

1–5

Stratix GX Device Handbook, Volume 1

FPGA Functional Description

The logic array consists of LABs, with 10 logic elements (LEs) in each

LAB. An LE is a small unit of logic providing efficient implementation of

user logic functions. LABs are grouped into rows and columns across the

device.

M512 RAM blocks are simple dual-port memory blocks with 512 bits plus

parity (576 bits). These blocks provide dedicated simple dual-port or

single-port memory up to 18-bits wide at up to 318 MHz. M512 blocks are

grouped into columns across the device in between certain LABs.

M4K RAM blocks are true dual-port memory blocks with 4K bits plus

parity (4,608 bits). These blocks provide dedicated true dual-port, simple

dual-port, or single-port memory up to 36-bits wide at up to 291 MHz.

These blocks are grouped into columns across the device in between

certain LABs.

M-RAM blocks are true dual-port memory blocks with 512K bits plus

parity (589,824 bits). These blocks provide dedicated true dual-port,

simple dual-port, or single-port memory up to 144-bits wide at up to

269 MHz. Several M-RAM blocks are located individually or in pairs

within the device’s logic array.

Digital signal processing (DSP) blocks can implement up to either eight

full-precision 9 × 9-bit multipliers, four full-precision 18 × 18-bit

multipliers, or one full-precision 36 × 36-bit multiplier with add or

subtract features. These blocks also contain 18-bit input shift registers for

digital signal processing applications, including FIR and infinite impulse

response (IIR) filters. DSP blocks are grouped into two columns in each

device.

Each Stratix GX device I/O pin is fed by an I/O element (IOE) located at

the end of LAB rows and columns around the periphery of the device.

I/O pins support numerous single-ended and differential I/O standards.

Each IOE contains a bidirectional I/O buffer and six registers for

registering input, output, and output-enable signals. When used with

dedicated clocks, these registers provide exceptional performance and

interface support with external memory devices such as DDR SDRAM,

FCRAM, ZBT, and QDR SRAM devices.

High-speed serial interface channels support transfers at up to 840 Mbps

using LVDS, LVPECL, 3.3-V PCML, or HyperTransport technology I/O

standards.

Figure 1–2 shows an overview of the Stratix GX device.

1–6

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Introduction to the Stratix GX Device Data Sheet

Figure 1–2. Stratix GX Block Diagram

M4K RAM Blocks

for True Dual-Port

M512 RAM Blocks for

Dual-Port Memory, Shift

Registers, & FIFO Buffers

DSP Blocks for

IOEs Support DDR, PCI, GTL+, SSTL-3,

Multiplication and Full

Memory & Other Embedded SSTL-2, HSTL, LVDS, LVPECL, PCML,

Implementation of FIR Filters

Memory Functions

HyperTransport & other I/O Standards

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

M-RAM Block

IOEs

LABs

IOEs

LABs

IOEs

LABs

IOEs

LABs

DSP

Block

The number of M512 RAM, M4K RAM, and DSP blocks varies by device

along with row and column numbers and M-RAM blocks. Table 1–5 lists

the resources available in Stratix GX devices.

Table 1–5. Stratix GX Device Resources

M512 RAM

Columns/Blocks Columns/Blocks

M4K RAM

M-RAM

Blocks

DSP Block

Columns/Blocks Columns

LAB

Device

LAB Rows

EP1SGX10

EP1SGX25

EP1SGX40

4 / 94

6 / 224

8 / 384

2 / 60

3 / 138

3 / 183

1

2

4

2 / 6

2 / 10

2 / 14

40

62

77

30

46

61

Altera Corporation

February 2005

1–7

Stratix GX Device Handbook, Volume 1

FPGA Functional Description

1–8

Altera Corporation

February 2005

Stratix GX Device Handbook, Volume 1

2. Stratix GX Transceivers

SGX51002-1.0

Stratix^®GX devices incorporate dedicated embedded circuitry on the

right side of the device, which contains up to 20 high-speed 3.1875-Gbps

serial transceiver channels. Each Stratix GX transceiver block contains

four full-duplex channels and supporting logic to transmit and receive

high-speed serial data streams. The transceiver block uses the channels to

deliver bidirectional point-to-point data transmissions with up to

3.1875 Gbps of data transition per channel.

Transceiver

Blocks

There are up to 20 transceiver channels available on a single Stratix GX

device. Table 2–1 shows the number of transceiver channels available on

each Stratix GX device.

Table 2–1. Stratix GX Transceiver Channels

Device

Number of Transceiver Channels

EP1SGX10C

EP1SGX10D

EP1SGX25C

EP1SGX25D

EP1SGX25F

EP1SGX40D

EP1SGX40G

4

8

4

8

16

8

20

Figure 2–1 shows the elements of the transceiver block, including the four

channels, supporting logic, and I/O buffers. Each transceiver channel

consists of a receiver and transmitter. The supporting logic contains a

transmitter PLL to generate a high-speed clock used by the four

transmitters. The receiver PLL within each transceiver channel generates

the receiver reference clocks. The supporting logic also contains state

machines to manage rate matching for XAUI and GigE applications, in

addition to channel bonding for XAUI applications.

Altera Corporation

February 2005

2–1

Figure 2–1. Stratix GX Transceiver Block

Receiver Channel 0

Channel 0

Receiver Pins

PLD

Logic

Array

Transmitter Channel 0

Transmitter Pins

Receiver Channel 1

Channel 1

Receiver Pins

PLD

Logic

Array

Transmitter Channel 1

Transmitter Pins

PLD

Logic

Array

XAUI

PLD

XAUI

Transmitter

State

Channel

Aligner

State

Transmitter

PLL

Receiver

State

Logic

Array

Machine

Receiver Pins

Receiver Channel 2

PLD

Logic

Array

Channel 2

Transmitter Pins

Transmitter Channel 2

Receiver Pins

Receiver Channel 3

Channel 3

PLD

Logic

Array

Transmitter Pins

Transmitter Channel 3

2–2

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Each Stratix GX transceiver channel consists of a transmitter and receiver.

The transmitter contains the following:

■

Transmitter PLL

Transmitter phase compensation FIFO buffer

Byte serializer

8B/10B encoder

Serializer (parallel to serial converter)

Transmitter output buffer

The receiver contains the following:

■

Input buffer

Clock recovery unit (CRU)

Deserializer

Pattern detector and word aligner

Rate matcher and channel aligner

8B/10B decoder

Receiver logic array interface

You can set all the Stratix GX transceiver functions through the Quartus II

software. You can set programmable pre-emphasis, programmable

equalizer, and programmable V_ODdynamically as well. Each Stratix GX

transceiver channel is also capable of BIST generation and verification in

addition to various loopback modes. Figure 2–2 shows the block diagram

for the Stratix GX transceiver channel.

Stratix GX transceivers provide physical coding sublayer (PCS) and

physical media attachment (PMA) implementation for protocols such as

10-gigabit XAUI and GigE. The PCS portion of the transceiver consists of

the logic array interface, 8B/10B encoder/decoder, pattern detector, word

aligner, rate matcher, channel aligner, and the BIST and pseudo-random

binary sequence pattern generator/verifier. The PMA portion of the

transceiver consists of the serializer/deserializer, the CRU, and the I/O

buffers.

Altera Corporation

February 2005

2–3

Stratix GX Device Handbook, Volume 1

Figure 2–2. Stratix GX Transceiver Channel

Note (1)

Note to Figure 2–2:

(1) There are four transceiver channels in a transceiver block.

2–4

Altera Corporation

February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Transceivers

Transmitter Path

This section describes the data path through the Stratix GX transmitter

(see Figure 2–2). Data travels through the Stratix GX transmitter via the

following modules:

■

Transmitter PLL

Transmitter phase compensation FIFO buffer

Byte serializer

8B/10B encoder

Serializer (parallel to serial converter)

Transmitter output buffer

Transmitter PLL

Each transceiver block has one transmitter PLL, which receives the

reference clock and generates the following signals:

■

High-speed serial clock used by the serializer

Slow-speed reference clock used by the receiver

Slow-speed clock used by the logic array (divisible by two for

double-width mode)

The INCLKclock is the input into the transmitter PLL. There is one INCLK

clock per transceiver block. This clock can be fed by either the REFCLKB

pin, PLD routing, or the inter-transceiver routing line. See the section

“Stratix GX Clocking” on page 2–30 for more information about the inter-

transceiver lines.

The transmitter PLL in each transceiver block clocks the circuits in the

transmit path. The transmitter PLL is also used to train the receiver PLL.

If no transmit channels are used in the transceiver block, the transmitter

PLL can be turned off. Figure 2–3 is a block diagram of the transmitter

PLL.

Altera Corporation

February 2005

2–5

Stratix GX Device Handbook, Volume 1

Figure 2–3. Transmitter PLL Block Diagram

Note (1)

Note to Figure 2–3:

(1) The divider in the PLL divides by 4, 8, 10, 16, or 20.

2–6

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

The transmitter PLL can support up to 3.1875 Mbps. The input clock

frequency for –5 and –6 speed grade devices is limited to 650 MHz if you

use the REFCLKBpin or to 325 MHz if you use the other clock routing

resources. For –7 speed grade devices, the maximum input clock

frequency is 312.5 MHz with the REFCLKBpin, and the maximum is

156.25 MHz for all other clock routing resources. An optional

PLL_LOCKEDport is available to indicate whether the transmitter PLL is

locked to the reference clock. The transmitter PLL has a programmable

loop bandwidth that can be set to low or high. The loop bandwidth

parameter can be statically set in the Quartus II software.

Table 2–2 lists the adjustable parameters in the transmitter PLL.

Table 2–2. Transmitter PLL Specifications

Parameter

Specifications

Input reference frequency range

Data rate support

25 MHz to 650 MHz

500 Mbps to 3.1875 Gbps

2, 4, 5, 8, 10, 16, or 20 (1)

Low, high

Multiplication factor (W)

Bandwidth

Note to Table 2–2:

(1) Multiplication factors 2 and 5 can only be achieved with the use of the pre-divider

on the REFCLKBpin.

Transmitter Phase Compensation FIFO Buffer

The transmitter phase compensation FIFO buffer resides in the

transceiver block at the PLD boundary. This FIFO buffer compensates for

the phase differences between the transmitter reference clock (inclk)

and the PLD interface clock (tx_coreclk). The phase difference

between the two clocks must be less than 360°. The PLD interface clock

must also be frequency locked to the transmitter reference clock. The

phase compensation FIFO buffer is four words deep and cannot be

bypassed.

Byte Serializer

The byte serializer takes double-width words (16 or 20 bits) from the PLD

interface and converts them to a single width word (8 or 10 bits) for use

in the transceiver. The transmit data path after the byte serializer is single

width (8 or 10 bits). The byte serializer is bypassed when single width

mode (8 or 10 bits) is used at the PLD interface.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

8B/10B Encoder

The 8B/10B encoder translates 8-bit wide data + 1 control enable bit into

a 10-bit encoded data. The encoded data has a maximum run length of 5.

The 8B/10B encoder can be bypassed. Figure 2–4 diagrams the encoding

process.

Figure 2–4. Encoding Process

+

7

6

5

F

4

3

2

1

0

ctrl

H

G

E

D

C

B

A

8b-10b conversion

j

h

g

f

i

e

4

d

3

c

b

a

0

9

8

7

6

5

2

1

MSB sent last

LSB sent first

Transmit State Machine

The transmit state machine operates in either XAUI mode or in GigE

mode, depending on the protocol used.

GigE Mode

In GigE mode, the transmit state machines convert all idle ordered sets

(/K28.5/, /Dx.y/) to either /I1/or /I2/ordered sets. /I1/consists

of a negative-ending disparity /K28.5/(denoted by /K28.5/-)

followed by a neutral /D5.6/. /I2/consists of a positive-ending

disparity /K28.5/(denoted by /K28.5/+) and a negative-ending

disparity /D16.2/(denoted by /D16.2/-). The transmit state machines

do not convert any of the ordered sets to match /C1/or /C2/, which are

the configuration ordered sets. (/C1/and /C2/are defined by

(/K28.5/, /D21.5/) and (/K28.5/, /D2.2/), respectively.) Both the

/I1/and /I2/ordered sets guarantee a negative-ending disparity after

each ordered set. The GigE transmit state machine can be statically

disabled in the Quartus II software, even if using the GigE protocol mode.

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Altera Corporation

February 2005

Stratix GX Transceivers

XAUI Mode

The transmit state machine translates the XAUI XGMII code group to the

XAUI PCS code group. Table 2–3 shows the code conversion.

Table 2–3. Code Conversion

XGMII TXC

XGMII TXD

PCS Code-Group

Description

0

1

00 through FF

07

Dxx.y

Normal data

K28.0 or K28.3 or

K28.5

Idle in ||I||

1

07

K28.5

K28.4

K27.7

K29.7

K30.7

Idle in ||T||

Sequence

Start

9C

FB

FD

FE

Terminate

Error

SeeIEEE802.3 See IEEE 802.3

reserved code reserved code groups

groups

Reserved code groups

1

Other value

K30.7

Invalid XGMII character

The XAUI PCS idle code groups, /K28.0/(/R/) and /K28.5/(/K/), are

automatically randomized based on a PRBS7 pattern with an x⁷+x⁶+1

polynomial. The /K28.3/(/A/) code group is automatically generated

between 16 and 31 idle code groups. The idle randomization on the /A/,

/K/, and /R/code groups are done automatically by the transmit state

machine.

Serializer (Parallel-to-Serial Converter)

The serializer converts the parallel 8-bit or 10-bit data into a serial stream,

transmitting the LSB first. The serialized stream is then fed to the transmit

buffer. Figure 2–5 is a diagram of the serializer.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

Figure 2–5. Serializer

D9

D8

D7

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

D6

D5

D4

D3

D2

D1

D0

10

Serial data

out (to output

buffer)

Low-speed

parallel clock

High-speed

serial clock

Transmit Buffer

The Stratix GX transceiver buffers support the 1.5-V pseudo current

mode logic (PCML) I/O standard at a rate up to 3.1875 Gbps, across up to

40 inches of FR4 trace, and across 2 connectors. Additional I/O standards,

LVDS, 3.3-V PCML, LVPECL, can be supported when AC coupled. The

common mode of the output driver is 750 mV.

The output buffer, as shown in Figure 2–6, consists of a programmable

output driver and a programmable pre-emphasis circuit.

2–10

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–6. Output Buffer

Serializer

Output Buffer

Programmable

Pre-Emphasis

Programmable

Termination

Output

Pins

Programmable

Output

Driver

Programmable Output Driver

The programmable output driver can be set to drive out 400 to 1,600 mV.

Table 2–4 shows the available settings for each termination value. The

V_ODcan be dynamically or statically set. The output driver requires either

internal or external termination at the source.

Table 2–4. Programmable V_OD(Differential)

Note (1)

V_ODSetting (mV)

Termination Setting (Ω)

100

120

150

400, 800, 1000, 1200, 1400, 1600

480, 960, 1200, 1440

600, 1200, 1500

Note to Table 2–4:

(1) V_ODdifferential is measured as V_A– V_B(see Figure 2–7).

Altera Corporation

February 2005

2–11

Stratix GX Device Handbook, Volume 1

Figure 2–7. V_ODDifferential

Single-Ended Waveform

Positive Channel (p) = V

OH

V

OD

Negative Channel (n) = V

OL

V

CM

Ground

Differential Waveform

(V

OD

(Differential) = 2 x V (single-ended))

OD

V

OD

p − n = 0 V

V

OD

Programmable Pre-Emphasis

The programmable pre-emphasis module controls the output driver to

boost the high frequency components, to compensate for losses in the

transmission medium, as shown in Figure 2–8. The pre-emphasis can be

dynamically or statically set. There are five possible pre-emphasis

settings (1 through 5), with 5 being the highest and 0 being no

pre-emphasis.

Figure 2–8. Programmable Pre-Emphasis Model

V

PP

V

S

V

V (p-p)

V

(p-p)

PP

CM

S

Bit

Time

Bit

Time

2–12

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Pre-emphasis percentage is defined as V_PP/V_S– 1, where V_PPis the

differential emphasized voltage (peak-to-peak) and V_Sis the differential

steady-state voltage (peak-to-peak).

Programmable Transmitter Termination

The programmable termination can be statically set in the Quartus II

software. The values are 100 Ω, 120 Ω, 150 Ω, and off. Figure 2–9 shows the

setup for programmable termination.

Figure 2–9. Programmable Transmitter Termination

V

CM

50, 60, or 75 Ω

Programmable

Output

Driver

Receiver Path

This section describes the data path through the Stratix GX receiver (refer

to Figure 2–2 on page 2–4). Data travels through the Stratix GX receiver

via the following modules:

■

Input buffer

Clock Recovery Unit (CRU)

Deserializer

Pattern detector and word aligner

Rate matcher and channel aligner

8B/10B decoder

Receiver logic array interface

Receiver Input Buffer

The Stratix GX receiver input buffer supports the 1.5-V PCML I/O

standard at a rate up to 3.1875 Gbps. Additional I/O standards, LVDS,

3.3-V PCML, and LVPECL can be supported when AC coupled. The

common mode of the input buffer is 1.1 V. The receiver can support

Stratix GX-to-Stratix GX DC coupling.

Altera Corporation

February 2005

2–13

Stratix GX Device Handbook, Volume 1

Figure 2–10 shows a diagram of the receiver input buffer, which contains:

■

Programmable termination

Programmable equalizer

Figure 2–10. Receiver Input Buffer

Programmable

Termination

Input

Pins

Programmable

Equalizer

Differential

Input

Buffer

Programmable Termination

The programmable termination can be statically set in the Quartus II

software. Figure 2–11 shows the setup for programmable receiver

termination.

Figure 2–11. Programmable Receiver Termination

Differential

Input

Buffer

50, 60, or 75 Ω

V

CM

50, 60, or 75 Ω

If you use external termination, then the receiver must be externally

terminated and biased to 1.1 V. Figure 2–12 shows an example of an

external termination/biasing circuit.

2–14

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–12. External Termination & Biasing Circuit

Receiver External Termination

and Biasing

Stratix GX Device

V

DD

50/60/75-Ω

Termination

Resistance

R1

C1

Receiver

R1/R2 = 1K

× {R2/(R1 + R 2)} = 1.1 V

RXIP

V

R2

DD

RXIN

Receiver External Termination

and Biasing

Transmission

Line

Programmable Equalizer

The programmable equalizer module boosts the high frequency

components of the incoming signal to compensate for losses in the

transmission medium. There are five possible equalization settings (0, 1,

2, 3, 4) to compensate for 0”, 10”, 20”, 30”, and 40” of FR4 trace. These

settings should be interpreted loosely. The programmable equalizer can

be set dynamically or statically.

Receiver PLL & CRU

Each transceiver block has four receiver PLLs and CRUs, each of which is

dedicated to a receive channel. If the receive channel associated with a

particular receiver PLL or CRU is not used, then the receiver PLL or CRU

is powered down for the channel. Figure 2–13 is a diagram of the receiver

PLL and CRU circuits.

Altera Corporation

February 2005

2–15

Stratix GX Device Handbook, Volume 1

Figure 2–13. Receiver PLL & CRU Circuit

Receiver PLL

÷ m (1)

rx_locked

PFD

Low-Speed TX_PLL_CLK

up

down

Inter Transceiver Routing (IQ1)

Charge Pump

and Loop Filter

VCO

up

RX CRUCLK

down

Global Clks, IO Bus, Gen Routing

Dedicated

Local

÷ 2

REFCLKB

rx_locktorefclk

rx_locktodata

RX_IN

rx_freqlocked[]

rx_riv[ ]

CRU

High-speed RCVD_CLK

Low-speed RCVD_CLK

Note to Figure 2–13:

(1) m = 8, 10 16, or 20.

The receiver PLLs and CRUs are capable of supporting up to 3.1875 Gbps.

The input clock frequency for –5 and –6 speed grade devices is limited to

650 MHz if you use the REFCLKBpin or 325 MHz if you use the other

clock routing resources. The maximum input clock frequency for –7 speed

grade devices is 312.5 MHz if you use the REFCLKBpin or 156.25 MHz

with the other clock routing resources. An optional RX_LOCKEDport

(active low signal) is available to indicate whether the PLL is locked to the

reference clock. The receiver PLL has a programmable loop bandwidth,

which can be set to low, medium, or high. The loop bandwidth parameter

can be statically set by the Quartus II software.

Table 2–5 lists the adjustable parameters of the receiver PLL and CRU. All

the parameters listed are statically programmable in the Quartus II

software.

Table 2–5. Receiver PLL & CRU Adjustable Parameters (Part 1 of 2)

Parameter

Specifications

Input reference frequency range

Data rate support

25 MHz to 650 MHz

500 Mbps to 3.1875 Gbps

2–16

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Table 2–5. Receiver PLL & CRU Adjustable Parameters (Part 2 of 2)

Multiplication factor (W)

PPM detector

2, 4, 5, 8, 10, 16, or 20 (1)

125, 250, 500, 1,000

Low, medium, high

Bandwidth

Run length detector

10-bit or 20-bit mode: 5 to 160 in steps of

5

8-bit or 16-bit mode: 4 to 128 in steps of 4

Note to Table 2–5:

(1) Multiplication factors 2, 4, and 5 can only be achieved with the use of the pre-

divider on the REFCLKBport or if the CRU is trained with the low speed clock

from the transmitter PLL.

The CRU has a built-in switchover circuit to select whether the

voltage-controlled oscillator of the PLL is trained by the reference clock or

the data. The optional port rx_freqlockedmonitors when the CRU is

in locked to data mode.

In the automatic mode, the following conditions must be met for the CRU

to switch from locked to reference to locked to data mode:

■

The CRU PLL is within the prescribed PPM frequency threshold

setting (125 PPM, 250 PPM, 500 PPM, 1,000 PPM) of the CRU

reference clock.

■

The reference clock and CRU PLL output are phase matched (phases

are within .08 UI).

The automatic switchover circuit can be overridden by using the optional

ports rx_lockedtorefclkand rx_locktodata. Table 2–6 shows the

possible combinations of these two signals.

Table 2–6. Possible Combinations of rx_lockedtorefclk & rx_locktodata

rx_locktodata

rx_lockedtorefclk

VCO (lock to mode)

0

1

0

1

x

Auto

Reference CLK

DATA

If the rx_lockedtorefclkand rx_locktodataports are not used,

the default is auto mode.

Altera Corporation

February 2005

2–17

Stratix GX Device Handbook, Volume 1

Deserializer (Serial-to-Parallel Converter)

The deserializer converts the serial stream into a parallel 8- or 10-bit data

bus. The deserializer receives the least significant bit first. Figure 2–14 is

a diagram of the deserializer.

Figure 2–14. Deserializer

D9

D8

D7

D8

D7

D6

D5

D4

D3

D2

D1

D0

D6

D5

D4

D3

D2

D1

D0

10

High-speed

serial clock

Low-speed

parallel clock

Word Aligner

The word aligner aligns the incoming data based on the specific byte

boundaries. The word aligner has three customizable modes of operation:

bit-slip mode, 16-bit mode, and 10-bit mode, the last of which is available

for the basic and SONET modes. The word aligner also has two

non-customizable modes of operation, which are the XAUI and GigE

modes.

Figure 2–15 shows the word aligner in bit-slip mode.

2–18

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–15. Word Aligner in Bit-Slip Mode

Word Aligner

Manual

Alignment

Mode

Patterm Detector

Bit-Slip

Mode

10-Bit

Mode

16-Bit

Mode

7-Bit

Mode

A1A2

Mode

A1A1A2A2

Mode

In the bit-slip mode, the byte boundary can be modified by a barrel shifter

to slip the byte boundary one bit at a time via a user-controlled bit-slip

port. The bit-slip mode supports both 8-bit and 10-bit data paths

operating in a single or double-width mode.

The pattern detector is active in the bit-slip mode, and it detects the

user-defined pattern that is specified in the MegaWizard^®Plug-In

Manager.

The bit-slip mode is available only in basic mode and SONET mode.

Figure 2–16 shows the word aligner in 16-bit mode.

Altera Corporation

February 2005

2–19

Stratix GX Device Handbook, Volume 1

Figure 2–16. Word Aligner in 16-Bit Mode

Word Aligner

Manual

Alignment

Mode

Pattern Detector

16-Bit

Mode

16-Bit

Mode

A1A2

Mode

A1A1A2A2

Mode

A1A2

Mode

A1A1A2A2

Mode

In the 16-bit mode, the word aligner and pattern detector automatically

aligns and detects a user-defined 16-bit alignment pattern. This pattern

can be in the format of A1A2 or A1A1A2A2 (for the SONET protocol). The

re-alignment of the byte boundary can be done via a user-controlled port.

The 16-bit mode supports only the 8-bit data path in a single-width or

double-width mode.

The 16-bit mode is available only for the basic mode and SONET mode.

The A1A1A2A2 word alignment pattern option is available only for the

SONET mode and cannot be used in the basic mode.

Figure 2–17 shows the word aligner in 10-bit mode.

2–20

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–17. Word Aligner in 10-Bit Mode

Word Aligner

Manual

Alignment

Mode

Pattern Detector

10-Bit

Mode

7-Bit

Mode

10-Bit

Mode

In the 10-bit mode, the word aligner automatically aligns the user’s

predefined 10-bit alignment pattern. The pattern detector can detect the

full 10-bit pattern or only the lower seven bits of the pattern. The word

aligner and pattern detector detect both the positive and the negative

disparity of the pattern. A user-controlled enable port is available for the

word aligner.

The 10-bit mode is available only for the basic mode.

Figure 2–18 shows the word aligner in XAUI mode.

Altera Corporation

February 2005

2–21

Stratix GX Device Handbook, Volume 1

Figure 2–18. Word Aligner in XAUI Mode

Word Aligner

Synchronization

State Machines

GigE

Mode

XAUI

Mode

In the XAUI and GigE modes, the word alignment is controlled by a state

machine that adheres to the IEEE 802.3ae standard for XAUI and the

IEEE 802.3 standard for GigE. The alignment pattern is predefined to be

a /K28.5/code group.

The XAUI mode is available only for the XAUI protocol, and the GigE

mode is available only for the GigE protocol.

Channel Aligner

The channel aligner is available only in XAUI mode and bonds all four

channels within a transceiver. The channel aligner adheres to the

IEEE 802.3ae, clause 48 specification for channel bonding.

The channel aligner is a 16-word deep FIFO buffer with a state machine

overlooking the channel bonding process. The state machine looks for an

/A/(/K28.3/) in each channel and aligns all the /A/s in the transceiver.

When four columns of /A/(denoted by //A//) are detected, the

rx_channelalignport goes high, signifying that all the channels in the

transceiver have been bonded. The reception of four consecutive

misaligned /A/s restarts the channel alignment sequence and de-asserts

rx_channelalign.

Figure 2–19 shows misaligned channels before the channel aligner and

the channel alignment after the channel aligner.

2–22

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–19. Before & After the Channel Aligner

Lane 0

K

R

A

K

R

K

R

K

R

Lane 0

K

R

A

K

R

K

R

K

R

Lane 0

K

R

A

K

R

K

R

K

R

Lane 0

K

R

A

K

R

K

R

K

R

Lane 0

K

R

A

K

R

K

R

K

R

Rate Matcher

The rate matcher, which is available only in XAUI and GigE modes,

consists of a 12-word deep FIFO buffer and a FIFO controller. The rate

matcher is bypassed when the device is not in XAUI or GigE mode.

In a multi-crystal environment, the rate matcher compensates for up to a

100-ppm difference between the source and receiver clocks.

GigE Mode

In the GigE mode, the rate matcher adheres to the specifications in

clause 36 of the IEEE 802.3 documentation, for idle additions or removals.

The rate matcher performs clock compensation only on /I2/ordered

sets, composing a /K28.5/+followed by a /D16.2/-. The rate matcher

does not perform a clock compensation on any other ordered set

combinations. An /I2/ is added or deleted automatically based on the

number of words in the FIFO buffer. A 9’h19Cis given at the control and

data ports when the FIFO is in an overflow or underflow condition.

Altera Corporation

February 2005

2–23

Stratix GX Device Handbook, Volume 1

XAUI Mode

In XAUI mode, the rate matcher adheres to clause 48 of the IEEE 802.3ae

specification for clock rate compensation. The rate matcher performs

clock compensation on columns of /R/(/K28.0/), denoted by //R//.

An //R//is added or deleted automatically based on the number of

words in the FIFO buffer.

8B/10B Decoder

The 8B/10B decoder converts the 10-bit encoded code group into 8-bit

data and 1 control bit. The 8B/10B decoder can be bypassed. The

following is a diagram of the conversion from a 10-bit encoded code

group into 8-bit data + 1-bit control.

Figure 2–20. 8B/10B Decoder Conversion

j

h

8

g

7

f

i

e

4

d

3

c

b

1

a

0

9

6

5

2

MSB received last

LSB received first

8b-10b conversion

+

Parallel data

7

6

5

F

4

3

2

1

0

ctrl

H

G

E

D

C

B

A

There are two optional error status ports available in the 8B/10B decoder,

rx_errdetectand rx_disperr. Table 2–7 shows the values of the

ports from a given error. These status signals are aligned with the code

group in which the error occurred.

Table 2–7. Error Signal Values

Types of Errors

rx_errdetect

rx_disperr

No errors

1’b0

1’b1

1’b0

1’b1

Invalid code groups

Disparity errors

2–24

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Receiver State Machine

The receiver state machine operates in GigE and XAUI modes. In GigE

mode, the receiver state machine replaces invalid code groups with

9’h1FE. In XAUI mode, the receiver state machine translates the XAUI

PCS code group to the XAUI XGMII code group. Table 2–8 shows the

code conversion. The conversion adheres to the IEEE 802.3ae

specification.

Table 2–8. Code Conversion

XGMII RXC

XGMII RXD

PCS code-group

Description

0

1

00 through FF

Dxx.y

Normal Data

07

K28.0 or K28.3 or K28.5

Idle in ||I||

07

K28.5

Idle in ||T||

9C

FB

FD

FE

K28.4

Sequence

K27.7

Start

K29.7

Terminate

K30.7

Error

Invalid code group

Invalid XGMII character

Reserved code groups

See IEEE 802.3 reserved code See IEEE 802.3 reserved

groups code groups

Byte Deserializer

The byte deserializer takes a single width word (8 or 10 bits) from the

transceiver logic and converts it into double-width words (16 or 20 bits)

to the phase compensation FIFO buffer. The byte deserializer is bypassed

when single width mode (8 or 10 bits) is used at the PLD interface.

Phase Compensation FIFO Buffer

The receiver phase compensation FIFO buffer resides in the transceiver

block at the programmable logic device (PLD) boundary. This buffer

compensates for the phase difference between the recovered clock within

the transceiver and the recovered clock after it has transferred to the PLD

core. The phase compensation FIFO buffer is four words deep and cannot

be bypassed.

Altera Corporation

February 2005

2–25

Stratix GX Device Handbook, Volume 1

Loopback Modes

The Stratix GX transceiver has built-in loopback modes to aid in debug

and testing. The loopback modes are set in the Stratix GX MegaWizard

Plug-In Manager in the Quartus II software. Only one loopback mode can

be set at any single instance of the transceiver block. The loopback mode

applies to all used channels in a transceiver block.

The available loopback modes are:

■

Serial loopback

Parallel loopback

Reverse serial loopback

Serial Loopback

Serial loopback exercises all the transceiver logic except for the output

buffer and input buffer. The loopback function is dynamically switchable

through the rx_slpbkport on a channel by channel basis. The V_ODof the

output is limited to 400 mV when the serial loopback option is selected.

Figure 2–21 shows the data path in serial loopback mode.

Figure 2–21. Data Path in Serial Loopback Mode

BIST PRBS

Verifier

BIST

Incremental

Verifier

Word

Aligner

Deserializer

Channel

Aligner

Rate

Matcher

8B/10B

Decoder

Phase

Compensation

FIFO

Byte

Deserializer

Clock

Recovery

Unit

Byte

Serializer

Phase

Compensation

FIFO

Serializer

8B/10B

Encoder

BIST

Generator

Active Path

BIST PRBS

Generator

Non-Active Path

2–26

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Parallel Loopback

The parallel loopback mode exercises the digital logic portion of the

transceiver data path. The analog portions are not use in the loopback

path. The received data is not retimed. Figure 2–22 shows the data path in

parallel loopback mode. This option is not dynamically switchable.

Reception of an external signal is not possible in this mode.

Figure 2–22. Data Path in Parallel Loopback Mode

BIST PRBS

Verifier

BIST

Incremental

Verifier

Word

Aligner

Deserializer

Channel

Aligner

Rate

Phase

Compensation

FIFO

Matcher

8B/10B

Decoder

Byte

Deserializer

Clock

Recovery

Unit

Phase

Compensation

FIFO

Byte

Serializer

8B/10B

Encoder

BIST

Generator

Active Path

BIST PRBS

Generator

Non-Active Path

Reverse Serial Loopback

The reverse serial loopback exercises the analog portion of the

transceiver. This loopback mode is dynamically switchable through the

tx_srlpbkport on a channel by channel basis. Asserting

rxanalogresetin reverse serial loopback mode powers down the

receiver buffer and CRU, preventing data loopback. Figure 2–23 shows

the data path in reverse serial loopback mode.

Altera Corporation

February 2005

2–27

Stratix GX Device Handbook, Volume 1

Figure 2–23. Data Path in Reverse Serial Loopback Mode

BIST PRBS

Verifier

BIST

Incremental

Verifier

Word

Aligner

Deserializer

Channel

Aligner

Rate

Matcher

Phase

Compensation

FIFO

8B/10B

Decoder

Byte

Deserializer

Clock

Recovery

Unit

Phase

Compensation

FIFO

Byte

Serializer

8B/10B

Encoder

BIST

Generator

Active Path

Non-Active Path

BIST PRBS

Generator

BIST (Built-In Self Test)

The Stratix GX transceiver has built-in self test modes to aid in debug and

testing. The BIST modes are set in the Stratix GX MegaWizard Plug-In

Manager in the Quartus II software. Only one BIST mode can be set for

any single instance of the transceiver block. The BIST mode applies to all

channels used in a transceiver.

The following is a list of the available BIST modes:

■

PRBS generator and verifier

Incremental mode generator and verifier

High-frequency generator

Low-frequency generator

Mixed-frequency generator

Figures 2–24 and 2–25 are diagrams of the BIST PRBS data path and the

BIST incremental data path, respectively.

2–28

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–24. BIST PRBS Data Path

BIST PRBS

Verifier

BIST

Incremental

Verifier

Word

Aligner

Deserializer

Channel

Aligner

Rate

Matcher

Phase

Compensation

FIFO

8B/10B

Decoder

Byte

Deserializer

Clock

Recovery

Unit

Phase

Compensation

FIFO

Byte

Serializer

8B/10B

Encoder

BIST

Generator

Active Path

Non-active Path

BIST PRBS

Generator

Figure 2–25. BIST Incremental Data Path

BIST PRBS

Verifier

BIST

Incremental

Verifier

Word

Aligner

Deserializer

Channel

Aligner

Rate

Matcher

Phase

Compensation

FIFO

8B/10B

Decoder

Byte

Deserializer

Clock

Recovery

Unit

Phase

Compensation

FIFO

Byte

Serializer

8B/10B

Encoder

BIST

Generator

Active Path

BIST PRBS

Generator

Non-active Path

Table 2–9 shows the BIST data output and verifier alignment pattern.

Table 2–9. BIST Data Output & Verifier Alignment Pattern (Part 1 of 2)

BIST Mode

Output

Polynomials

Verifier Word Alignment Pattern

1000000011111111

1111111111

2⁸– 1

x⁸+ x⁷+ x⁵+ x³+ 1

x¹⁰+ x⁷+ 1

PRBS 8-bit

2¹⁰– 1

PRBS 10-bit

Altera Corporation

February 2005

2–29

Stratix GX Device Handbook, Volume 1

Table 2–9. BIST Data Output & Verifier Alignment Pattern (Part 2 of 2)

BIST Mode

PRBS 16-bit

PRBS 20-bit

Output

Polynomials

Verifier Word Alignment Pattern

1000000011111111

1111111111

2⁸– 1

x⁸+ x⁷+ x⁵+ x³+ 1

x¹⁰+ x⁷+ 1

2¹⁰– 1

Incremental 10-bit K28.5, K27.7, Data (00-FF

incremental), K28.0, K28.1,

0101111100 (K28.5)

K28.2, K28.3, K28.4, K28.6,

K28.7, K23.7, K30.7, K29.7 (1)

Incremental 20-bit K28.5, K27.7, Data (00-FF

incremental), K28.0, K28.1,

0101111100 (K28.5)

K28.2, K28.3, K28.4, K28.6,

K28.7, K23.7, K30.7, K29.7 (1)

High frequency

Low frequency

Mixed frequency

1010101010

0011111000

0011111010 or 1100000101

Note to Table 2–9:

(1) This output repeats.

Stratix GX Clocking

The Stratix GX global clock can be driven by certain REFCLKBpins, all

transmitter PLL outputs, and all receiver PLL outputs. The REFCLKBpins

(except for transceiver block 0 and transceiver block 4) can drive inter-

transceiver and global clock lines as well as feed the transmitter and

receiver PLLs. The output of the transmitter PLL can only feed global

clock lines and the reference clock port of the receiver PLL.

Figures 2–26 and 2–27 are diagrams of the Inter-Transceiver line

connections as well as the global clock connections for the EP1SGX25F

and EP1SGX40G devices. For devices with fewer transceivers, ignore the

information about the unavailable transceiver blocks.

2–30

Altera Corporation

Stratix GX Device Handbook, Volume 1

February 2005

Stratix GX Transceivers

Figure 2–26. EP1SGX25F Device Inter-Transceiver & Global Clock Connections

Note (1)

IQ0

IQ1

IQ2

Quad 0

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

refclkb

/2

4

IQ2

Receiver

PLLs (2)

Global Clocks,

I/O Bus,

General Routing

Quad 1

Quad 2

Quad 3

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

/2

4

PLD

Global

Clocks

IQ2

Receiver

PLLs (2)

Global Clocks,

I/O Bus,

General Routing

16

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

IQ2

Receiver

PLLs (2)

Global Clocks,

I/O Bus,

General Routing

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

IQ2

Receiver

PLLs (2)

Global Clocks,

I/O Bus,

General Routing

Notes to Figure 2–26:

(1) IQ lines are inter-transceiver block lines.

(2) There are four receiver PLLs in each transceiver block.

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February 2005

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Stratix GX Device Handbook, Volume 1

Figure 2–27. EP1SGX40G Device Inter-Transceiver & Global Clock Connections

Note (1)

IQ0

IQ1

IQ2

Quad 0

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

/2

4

IQ2

Receiver

PLLs (1)

Global Clocks,

I/O Bus,

General Routing

Quad 1

Quad 4

Quad 2

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

/2

4

IQ2

Receiver

PLLs (1)

Global Clocks,

I/O Bus,

General Routing

16

PLD

Global

Clocks

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

IQ2

Receiver

PLLs (1)

Global Clocks,

I/O Bus,

General Routing

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

IQ2

Receiver

PLLs (1)

Global Clocks,

I/O Bus,

General Routing

Quad 3

IQ0

IQ1

Transmitter

PLL

Global Clocks,

I/O Bus,

General Routing

/2

4

IQ2

Receiver

PLLs (1)

Global Clocks,

I/O Bus,

General Routing

Notes to Figure 2–27:

(1) IQ lines are inter-transceiver block lines.

(2) There are four receiver PLLs in each transceiver block.

The receiver PLL can also drive the fast regional, regional clocks, and

local routing adjacent to the associated transceiver block. Figures 2–28

through 2–31 show which fast regional and regional clock resource can be

used by the recovered clock.

2–32

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

In the EP1SGX25 device, the receiver PLL recovered clocks from

transceiver blocks 0 and 1 drive RCLK[1..0]while transceiver blocks 2

and 3 drive RCLK[7..6]. The regional clocks feed logic in their

associated regions.

Figure 2–28. EP1SGX25 Receiver PLL Recovered Clock to Regional Clock

Connection

Stratix GX

PLD

Transceiver Blocks

Block 0

RCLK[11..10]

Block 1

Block 2

RCLK[9..8]

Block 3

In addition, the receiver PLL’s recovered clocks can drive fast regional

lines (FCLK) as shown Figure 2–29. The fast regional clocks can feed logic

in their associated regions.

Altera Corporation

February 2005

2–33

Stratix GX Device Handbook, Volume 1

Figure 2–29. EP1SGX25 Receiver PLL Recovered Clock to Fast Regional Clock

Connection

Stratix GX

Transceiver Blocks

Block 0

PLD

FCLK[1..0]

Block 1

Block 2

Block 3

FCLK[1..0]

In the EP1SGX40 device, the receiver PLL recovered clocks from

transceivers 0 and 1 drive RCLK[1..0]while transceivers 2, 3, and 4

drive RCLK[7..6]. The regional clocks feed logic in their associated

regions.

2–34

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

Stratix GX Transceivers

Figure 2–30. EP1SGX40 Receiver PLL Recovered Clock to Regional Clock

Connection

Stratix GX

PLD

Transceiver Blocks

Block 0

RCLK[11..10]

Block 1

Block 4

Block 2

RCLK[9..8]

Block 3

Figure 2–31 shows the possible recovered clock connection to the fast

regional clock resource. The fast regional clocks can drive logic in their

associated regions.

Altera Corporation

February 2005

2–35

Stratix GX Device Handbook, Volume 1

Figure 2–31. EP1SGX40 Receiver PLL Recovered Clock to Fast Regional Clock

Connection

Stratix GX

PLD

FCLK[1..0] Transceiver Blocks

Block 0

Block 1

Block 4

Block 2

Block 3

FCLK[1..0]

Table 2–10 summarizes the possible clocking connections for the

transceivers.

Table 2–10. Possible Clocking Connections for Transceivers (Part 1 of 2)

Destination

Source

Transmitter

PLL

Receiver

PLL

GCLK

RCLK

FCLK

IQ Lines

REFCLKB

Transmitter PLL

Receiver PLL

GCLK

v

v (1)

v

v (1)

v

RCLK

FCLK

2–36

Altera Corporation

February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Transceivers

Table 2–10. Possible Clocking Connections for Transceivers (Part 2 of 2)

Destination

GCLK RCLK

Source

Transmitter

PLL

Receiver

PLL

FCLK

IQ Lines

IQ lines

v (2)

Notes to Table 2–10:

(1) REFCLKBfrom transceiver block 0 and transceiver block 4 does not drive the inter-transceiver lines or the GCLK

lines.

(2) Inter-transceiver line 0 and inter-transceiver line 1 drive the transmitter PLL, while inter-transceiver line 2 drives

the receiver PLLs.

Other important features of the Stratix GX transceivers are the power

down and reset capabilities, the external voltage reference and bias

circuitry, and hot swapping.

Other

Transceiver

Features

Individual Power-Down & Reset for the Transmitter & Receiver

Stratix GX transceivers offer a power saving advantage with their ability

to shut off functions that are not needed. The device can individually

reset the receiver and transmitter blocks and the PLLs. The Stratix GX

device can either globally power down and reset the transmitter and

receiver channels or do each channel separately. Table 2–11 shows the

connectivity between the reset signals and the Stratix GX logical blocks.

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February 2005

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Stratix GX Device Handbook, Volume 1

Other Transceiver Features

Power-down functions are static, in other words., they are implemented

upon device configuration and programmed, through the Quartus II

software, to static values. Resets can be static as well as dynamic inputs

coming from the logic array or pins.

Table 2–11. Reset Signal Map to Stratix GX Blocks

Reset Signal

v

rxdigitalreset

rxanalogreset

v

txdigitalreset

pll_areset

pllenable

v

Voltage Reference Capabilities

Stratix GX transceivers provide voltage reference and bias circuitry. To

set-up internal bias for controlling the transmitter output drivers’ voltage

swing—as well as to provide voltage/current biasing for other analog

circuitry—use the internal bandgap voltage reference at 0.7 V. To provide

bias for internal pull-up PMOS resistors for I/O termination at the serial

interface of receiver and transmitter channels (independent of power

supply drift, process changes, or temperature variation) an external

resistor, which is connected to the external low voltage power supply, is

2–38

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Stratix GX Device Handbook, Volume 1

February 2005

Stratix GX Transceivers

accurately tracked by the internal bias circuit. Moreover, the reference

voltage and internal resistor bias current is generated and replicated to

the analog circuitry in each channel.

Hot-Socketing Capabilities

Each Stratix GX device is capable of hot-socketing. Because Stratix GX

devices can be used in a mixed-voltage environment, they have been

designed specifically to tolerate any possible power-up sequence. Signals

can be driven into Stratix GX devices before and during power-up

without damaging the device. Once operating conditions are reached and

the device is configured, Stratix GX devices operate according to your

specifications. This feature provides the Stratix GX transceiver line card

behavior, so you can insert it into the system without powering the

system down, offering more flexibility.

Each Stratix GX transceiver block is designed to operate at any serial bit

rate from 500 Mbps to 3.1875 Gbps per channel. The wide, data rate range

allows Stratix GX transceivers to support a wide variety of standard and

future protocols such as 10-Gigabit Ethernet XAUI, InfiniBand, Fibre

Channel, and Serial RapidIO. Stratix GX devices are ideal for many high-

speed communication applications such as high-speed backplanes, chip-

to-chip bridges, and high-speed serial communications standards

support.

Applications &

Protocols

Supported with

Stratix GX

Devices

Stratix GX Example Application Support

Stratix GX devices can be used for many applications, including:

■

Backplanes for traffic management and quality of service (QOS)

Switch fabric applications for complete set for backplane and switch

fabric transceivers

■

Chip-to-chip applications such as: 10 Gigabit Ethernet XAUI to

XGMII bridge, 10 Gigabit Ethernet XGMII to POS-PHY4 bridge,

POS-PHY4 to NPSI bridge, or NPSI to backplane bridge

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

Applications & Protocols Supported with Stratix GX Devices

High-Speed Serial Bus Protocols

With wide, serial data rate range, Stratix GX devices can support

multiple, high-speed serial bus protocols. Table 2–12 shows some of the

protocols that Stratix GX devices can support.

Table 2–12. High-Speed Serial Bus Protocols

Stratix GX (Gbps)

Bus Transfer Protocol

(Supports up to 3.1875 Gbps)

SONET backplane

10 Gigabit Ethernet XAUI

10 Gigabit fibre channel

InfiniBand

2.488

3.125

3.1875

2.5

Fibre channel (1G, 2G)

1.0625, 2.125

1.25, 2.5, 3.125

2.5

™

Serial RapidIO

PCI Express

SMPTE 292M

1.485

2–40

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

3. Source-Synchronous

Signaling With DPA

SGX51003-1.1

Expansion in the telecommunications market and growth in Internet use

requires systems to move more data faster than ever. To meet this

demand, rely on solutions such as differential signaling and emerging

high-speed interface standards including RapidIO, POS-PHY 4, SFI-4, or

XSBI.

Introduction

These new protocols support differential data rates up to 1 Gbps and

higher. At these high data rates, it becomes more challenging to manage

the skew between the clock and data signals. One solution to this

challenge is to use CDR to eliminate skew between data channels and

clock signals. Another potential solution, DPA, is beginning to be

incorporated into some of these protocols.

The source-synchronous high-speed interface in Stratix GX devices is a

dedicated circuit embedded into the PLD allowing for high-speed

communications. The High-Speed Source-Synchronous Differential I/O

Interfaces in Stratix GX Devices chapter of the Stratix GX Device Handbook,

Volume 2 provides information on the high-speed I/O standard features

and functions of the Stratix GX device.

Stratix GX I/O Banks

Stratix GX devices contain 17 I/O banks. I/O banks one and two support

high-speed LVDS, LVPECL, and 3.3-V PCML inputs and outputs. These

two banks also incorporate an embedded dynamic phase aligner within

the source-synchronous interface (see Figure 3–8 on page 3–10). The

dynamic phase aligner corrects for the phase difference between the clock

and data lines caused by skew. The dynamic phase aligner operates

automatically and continuously without requiring a fixed training

pattern, and allows the source-synchronous circuitry to capture data

correctly regardless of the channel-to-clock skew.

Principles of SERDES Operation

Stratix GX devices support source-synchronous differential signaling up

to 1 Gbps in DPA mode, and up to 840 Mbps in non-DPA mode. Serial

data is transmitted and received along with a low-frequency clock. The

PLL can multiply the incoming low-frequency clock by a factor of 1 to 10.

The SERDES factor J can be 8 or 10 for the DPA mode, or 4, 7, 8, or 10 for

all other modes. The SERDES factor does not have to equal the clock

Altera Corporation

August 2005

3–1

Introduction

multiplication value. The ×1 and ×2 operation is also possible by

bypassing the SERDES. The SERDES DPA cannot support ×1, ×2, or ×4

natively.

On the receiver side, the high-frequency clock generated by the PLL shifts

the serial data through a shift register (also called deserializer). The

parallel data is clocked out to the logic array synchronized with the low-

frequency clock. On the transmitter side, the parallel data from the logic

array is first clocked into a parallel-in, serial-out shift register

synchronized with the low-frequency clock and then transmitted out by

the output buffers.

There are two dedicated fast PLLs each in EP1SGX10 to EP1SGX25

devices, and four in EP1SGX40 devices. These PLLs are used for the

SERDES operations as well as general-purpose use.

Stratix GX Differential I/O Receiver Operation (Non-DPA Mode)

You can configure any of the Stratix GX source synchronous differential

input channels as a receiver channel (see Figure 3–1). The differential

receiver deserializes the incoming high-speed data. The input shift

register continuously clocks the incoming data on the negative transition

of the high-frequency clock generated by the PLL clock (×W).

The data in the serial shift register is shifted into a parallel register by the

RXLOADEN signal generated by the fast PLL counter circuitry on the third

falling edge of the high-frequency clock. However, you can select which

falling edge of the high frequency clock loads the data into the parallel

register, using the data-realignment circuit.

In normal mode, the enable signal RXLOADEN loads the parallel data into

the next parallel register on the second rising edge of the low-frequency

clock. You can also load data to the parallel register through the

TXLOADEN signal when using the data-realignment circuit.

Figure 3–1 shows the block diagram of a single SERDES receiver channel.

Figure 3–2 shows the timing relationship between the data and clocks in

Stratix GX devices in ×10 mode. W is the low-frequency multiplier and J

is the data parallelization division factor.

3–2

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

Source-Synchronous Signaling With DPA

Figure 3–1. Stratix GX High-Speed Interface Deserialized in ×10 Mode

Receiver Circuit

Serial Shift

Registers

Parallel

Registers

Parallel

Registers

RXIN+

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PD8

PD9

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PD8

PD9

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PD8

PD9

RXIN−

Stratix GX

Logic Array

×W

×W/J (1)

RXCLKIN+

Fast

PLL (2)

RXLOADEN

TXLOADEN

RXCLKIN−

Notes to Figure 3–1:

(1) W = 1, 2, 4, 7, 8, or 10.

J = 4, 7, 8, or 10 for non-DPA (J = 8 or 10 for DPA).

W does not have to equal J. When J = 1 or 2, the deserializer is bypassed. When J = 2, the device uses DDRIO registers.

(2) This figure does not show additional circuitry for clock or data manipulation.

Figure 3–2. Receiver Timing Diagram

Internal ×1 clock

Internal ×10 clock

RXLOADEN

Receiver

n – 1 n – 0

9

8

7

6

5

4

3

2

1

0

data input

Stratix GX Differential I/O Transmitter Operation

You can configure any of the Stratix GX differential output channels as a

transmitter channel. The differential transmitter serializes outbound

parallel data.

Altera Corporation

August 2005

3–3

Stratix GX Device Handbook, Volume 1

Introduction

The logic array sends parallel data to the SERDES transmitter circuit

when the TXLOADEN signal is asserted. This signal is generated by the

high-speed counter circuitry of the logic array low-frequency clock’s

rising edge. The data is then transferred from the parallel register into the

serial shift register by the TXLOADEN signal on the third rising edge of the

high-frequency clock.

Figure 3–3 shows the block diagram of a single SERDES transmitter

channel and Figure 3–4 shows the timing relationship between the data

and clocks in Stratix GX devices in ×10 mode. W is the low-frequency

multiplier and J is the data parallelization division factor.

Figure 3–3. Stratix GX High-Speed Interface Serialized in ×10 Mode

Transmitter Circuit

Parallel

Register

Serial

Register

TXOUT+

PD9

PD8

PD7

PD6

PD5

PD4

PD3

PD2

PD1

PD0

PD9

PD8

PD7

PD6

PD5

PD4

PD3

PD2

PD1

PD0

TXOUT−

Stratix GX

Logic Array

×W

Fast

PLL

TXLOADEN

Figure 3–4. Transmitter Timing Diagram

Internal ×1 clock

Internal ×10 clock

TXLOADEN

Receiver

n – 1 n – 0

data input

9

8

7

6

5

4

3

2

1

0

3–4

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

Source-Synchronous Signaling With DPA

DPA Block Overview

Each Stratix GX receiver channel features a DPA block. The block contains

a dynamic phase selector for phase detection and selection, a SERDES, a

synchronizer, and a data realigner circuit. You can bypass the dynamic

phase aligner without affecting the basic source-synchronous operation

of the channel by using a separate deserializer shown in Figure 3–5.

The dynamic phase aligner uses both the source clock and the serial data.

The dynamic phase aligner automatically and continuously tracks

fluctuations caused by system variations and self-adjusts to eliminate the

phase skew between the multiplied clock and the serial data. Figure 3–5

shows the relationship between Stratix GX source-synchronous circuitry

and the Stratix GX source-synchronous circuitry with DPA.

Figure 3–5. Source-Synchronous DPA Circuitry

Receiver Circuit

rx_in+

rx_in-

Deserializer

(1)

Stratix GX

Logic

Dynamic

Phase

Array

Aligner

8

Deserializer (1)

×W

PLL

rx_inclock_p

rx_inclock_n

×1

Note to Figure 3–5:

(1) Both deserializers are identical. The deserializer operation is described in the “Principles of SERDES Operation”

section.

Altera Corporation

August 2005

3–5

Stratix GX Device Handbook, Volume 1

Introduction

TM

Unlike the de-skew function in APEX 20KE and APEX 20KC devices,

you do not have to use a fixed training pattern with DPA in Stratix GX

devices. Table 3–1 shows the differences between source-synchronous

circuitry with DPA and source-synchronous circuitry without DPA

circuitry in Stratix GX devices.

Table 3–1. Source-Synchronous Circuitry With & Without DPA

Source-Synchronous Circuitry

Feature

Without DPA

With DPA

Data rate

300 to 840 Megabits per 300 Mbps to 1 Gbps

second (Mbps)

Deserialization factors

Clock frequency

Interface pins

1, 2, 4, 8, 10

8, 10

10 to 717 MHz

I/O banks 1 and 2

Dedicated inputs

74 to 717 MHz

I/O banks 1 and 2

Dedicated inputs

Receiver pins

DPA Input Support

Stratix GX device I/O banks 1 and 2 contain dedicated circuitry to

support differential I/O standards at speeds up to 1 Gbps with DPA (or

up to 840 Mbps without DPA). Stratix GX device source-synchronous

circuitry supports LVDS, LVPECL, and 3.3-V PCML I/O standards, each

with a supply voltage of 3.3 V. Refer to the High-Speed Source-Synchronous

Differential I/O Interfaces in Stratix GX Devices chapter of the Stratix GX

Device Handbook, Volume 2 for more information on these I/O standards.

Transmitter pins can be either input or output pins for single-ended I/O

standards. Refer to Table 3–2.

Table 3–2. Bank 1 & 2 Input Pins

Input Pin Type

I/O Standard

Receiver Pin

Transmitter Pin

Differential

Single ended

Input only

Output only

Single ended

Input or output

Interface & Fast PLL

This section describes the number of channels that support DPA and their

relationship with the PLL in Stratix GX devices. EP1SGX10 and

EP1SGX25 devices have two dedicated fast PLLs and EP1SGX40 devices

3–6

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

Source-Synchronous Signaling With DPA

have four dedicated fast PLLs for clock multiplication. Table 3–3 shows

the maximum number of channels in each Stratix GX device that support

DPA.

Table 3–3. Stratix GX Source-Synchronous Differential I/O Resources

Receiver Transmitter

Receiver &

Transmitter

Channel Speed

(Gbps) (2)

Device

Fast PLLs

Pin Count

Channels

LEs

(1)

EP1SGX10C

EP1SGX10D

EP1SGX25C

EP1SGX25D

2 (3)

2

672

22

39

45

22

39

45

1

10,570

25,660

41,250

672

2

672

1,020

EP1SGX25F

EP1SGX40D

EP1SGX40G

2

4 (4)

Notes to Table 3–3:

(1) This is the number of receiver or transmitter channels in the source-synchronous (I/O bank 1 and 2) interface of

the device.

(2) Receiver channels operate at 1,000 Mbps with DPA. Without DPA, the receiver channels operate at 840 Mbps.

(3) One of the two fast PLLs in EP1SGX10C and EP1SGX10D devices supports DPA.

(4) Two of the four fast PLLs in EP1SGX40D and EP1SGX40G devices support DPA

The receiver and transmitter channels are interleaved so that each I/O

row in I/O banks 1 and 2 of the device has one receiver channel and one

transmitter channel per row. Figures 3–6 and 3–7 show the fast PLL and

channels with DPA layout in EP1SGX10, EP1SGX25, and EP1SGX40

devices. In EP1SGX10 devices, only fast PLL 2 supports DPA operations.

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Introduction

Figure 3–6. PLL & Channel Layout in EP1SGX10 & EP1SGX25

Devices Notes (1), (2)

1 Receiver

1 Transmitter

11 Rows for

EP1SGX10 Devices

& 19 Rows for

EP1SGX25 Devices

8

1 Transmitter

1 Receiver

Fast

PLL 1 (1)

INCLK0

INCLK1

Eight-Phase

Clock

Fast

PLL 2

1 Receiver

1 Transmitter

8

11 Rows for

EP1SGX10 Devices

& 20 Rows for

EP1SGX25 Devices

1 Transmitter

1 Receiver

Notes to Figure 3–6:

(1) Fast PLL 1 in EP1SGX10 devices does not support DPA.

(2) Not all eight phases are used by the receiver channel or transmitter channel in

non-DPA mode.

3–8

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

Source-Synchronous Signaling With DPA

Figure 3–7. PLL & Channel Layout in EP1SGX40 Devices

Notes (1), (2), (3)

CLKIN

PLL (1)

1 Receiver

1 Transmitter

22 Rows

8

1 Transmitter

1 Receiver

Fast

PLL 1

Eight-Phase

Clock

INCLK0

INCLK1

Eight-Phase

Clock

Fast

PLL 2

1 Receiver

1 Transmitter

8

23 Rows

1 Transmitter

1 Receiver

CLKIN

PLL (1)

Notes to Figure 3–7:

(1) Corner PLLs do not support DPA.

(2) Not all eight phases are used by the receiver channel or transmitter channel in

non-DPA mode.

(3) The center PLLs can only clock 20 transceivers in either direction. Using Fast PLL2,

you can clock a total of 40 transceivers, 20 in each direction.

Altera Corporation

August 2005

3–9

Stratix GX Device Handbook, Volume 1

Introduction

DPA Operation

The DPA receiver circuitry contains the dynamic phase selector, the

deserializer, the synchronizer, and the data realigner (see Figure 3–8).

This section describes the DPA operation, synchronization and data

realignment. In the SERDES with DPA mode, the source clock is fed to the

fast PLL through the dedicated clock input pins. This clock is multiplied

by the multiplication value W to match the serial data rate.

For information on the deserializer, see “Principles of SERDES

Operation” on page 3–1.

Figure 3–8. DPA Receiver Circuit

DPA Receiver Circuit

Stratix GX Logic Array

Serial Data (1)

dpll_reset

Data

Realigner

Dynamic

Phase

Selector

rxin+

rxin-

Deserializer

Synchronizer

10

Parallel

Clock

×W Clock (1)

GCLK

8

×1 Clock

inclk+

inclk -

Fast PLL

RCLK

Reset

Note to Figure 3–8:

(1) These are phase-matched and retimed high-speed clocks and data.

The dynamic phase selector matches the phase of the high-speed clock

and data before sending them to the deserializer.

The fast PLL supplies eight phases of the same clock (each a separate tap

from a four-stage differential VCO) to all the differential channels

associated with the selected fast PLL. The DPA circuitry inside each

channel locks to a phase closest to the serial data’s phase and sends the

retimed data and the selected clock to the deserializer. The DPA circuitry

automatically performs this operation and is not something you select.

Each channel’s DPA circuit can independently choose a different clock

phase. The data phase detection and the clock phase selection process is

automatic and continuous. The eight phases of the clock give the DPA

circuit a granularity of one eighth of the unit interval (UI) or 125 ps at

1 Gbps. Figure 3–9 illustrates the clocks generated by the fast PLL

circuitry and their relationship to a data stream.

3–10

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

Source-Synchronous Signaling With DPA

Figure 3–9. Fast PLL Clocks & Data Input

Data input

Clock A

Clock B

Clock C

Clock D

Clock A'

Clock B'

Clock C'

Clock D'

D0

D1

D2

D3

D4

D5

Dn

Protocols, Training Pattern & DPA Lock Time

The dynamic phase aligner uses a fast PLL for clock multiplication, and

the dynamic phase selector for the phase detection and alignment. The

dynamic phase aligner uses the high-speed clock out of the dynamic

phase selector to deserialize high-speed data and the receiver's source

synchronous operations.

At each rising edge of the clock, the dynamic phase selector determines

the phase difference between the clock and the data and automatically

compensates for the phase difference between the data and clock.

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Introduction

The actual lock time for different data patterns varies depending on the

data’s transition density (how often the data switches between 1 and 0)

and jitter characteristic. The DPA circuitry is designed to lock onto any

data pattern with sufficient transition density, so the circuitry works with

current and future protocols. Experiments and simulations show that the

DPA circuitry locks when the data patterns listed in Table 3–4 are

repeated for the specified number of times. There are other suitable

patterns not shown in Table 3–4 and/or pattern lengths, but the lock time

may vary. The circuit can adjust for any phase variation that may occur

during operation.

Table 3–4. Training Patterns for Different Protocols

Number of

Repetitions

Protocols

Training Pattern

SPI-4, NPSI

Ten 0’s, ten 1’s

256

(00000000001111111111)

RapidIO

Four 0’s, four 1’s (00001111) or one 1,

two 0’s, one 1, four 0’s (10010000)

Other designs

SFI-4, XSBI

Eight alternating 1’s and 0’s (10101010 or

01010101)

Not specified

Phase Synchronizer

Each receiver has its own phase synchronizer. The receiver phase

synchronizer aligns the phase of the parallel data from all the receivers to

one global clock. The synchronizers in each channel consist of a 4-bit deep

and J-bit wide FIFO buffer. The parallel clock writes to the FIFO buffer

and the global clock (GCLK) reads from the FIFO buffer. The global and

parallel clock inputs into the synchronizers must have identical

frequencies and differ only in phase. The FIFO buffer never becomes full

or empty (because the source and receive signals are frequency locked)

when operating within the DPA specifications, and the operation does

not require an empty/full flag or read/write enable signals.

Receiver Data Realignment In DPA Mode

While DPA operation aligns the incoming clock phase to the incoming

data phase, it does not guarantee the parallelization boundary or byte

boundary. When the dynamic phase aligner realigns the data bits, the bits

may be shifted out of byte alignment, as shown in Figure 3–10.

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August 2005

Source-Synchronous Signaling With DPA

Figure 3–10. Misaligned Captured Bits

Correct Alignment

0

1

2

3

6

4

7

5

0

6

1

7

2

Incorrect Alignment

3

4

5

The dynamic phase selector and synchronizer align the clock and data

based on the power-up of both communicating devices, and the channel

to channel skew. However, the dynamic phase selector and synchronizer

cannot determine the byte boundary, and the data may need to be

byte-aligned. The dynamic phase aligner’s data realignment circuitry

shifts data bits to correct bit misalignments.

The Stratix GX circuitry contains a data-realignment feature controlled by

the logic array. Stratix GX devices perform data realignment on the

parallel data after the deserialization block. The data realignment can be

performed per channel for more flexibility. The data alignment operation

requires a state machine to recognize a specific pattern. The procedure

requires the bits to be slipped on the data stream to correctly align the

incoming data to the start of the byte boundary.

The DPA uses its realignment circuitry and the global clock for data

realignment. Either a device pin or the logic array asserts the internal

rx_channel_data_align node to activate the DPA data-realignment

circuitry. Switching this node from low to high activates the realignment

circuitry and the data being transferred to the logic array is shifted by

one bit. The data realignment block cannot be bypassed. However, if the

rx_channel_data_align is not turned on (through the altvlds

MegaWizard Plug-In Manager), or when it is not toggled, it only acts as a

register latency.

A state machine and additional logic can monitor the incoming parallel

data and compare it against a known pattern. If the incoming data pattern

does not match the known pattern, you can activate the

rx_channel_data_align node again. Repeat this process until the

realigner detects the desired match between the known data pattern and

incoming parallel data pattern.

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August 2005

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Stratix GX Device Handbook, Volume 1

Introduction

The DPA data-realignment circuitry allows further realignment beyond

what the J multiplication factor allows. You can set the J multiplication

factor to be 8 or 10. However, because data must be continuously clocked

in on each low-speed clock cycle, the upcoming bit to be realigned and

previous n − 1 bits of data are selected each time the data realignment

logic’s counter passes n − 1. At this point the data is selected entirely from

bit-slip register 3 (see Figure 3–11) as the counter is reset to 0. The logic

array receives a new valid byte of data on the next divided low speed

clock cycle. Figure 3–11 shows the data realignment logic output selection

from data in the data realignment register 2 and data realignment register

3 based on its current counter value upon continuous request of data

slipping from the logic array.

Figure 3–11. DPA Data Realigner

Bit Slip

Register 2 Register 3

Bit Slip

Register 2 Register 3

Bit Slip

Register 2 Register 3

Bit Slip

Register 2 Register 3

Bit Slip

Register 2 Register 3

Bit Slip

D19

D18

D17

D16

D15

D14

D13

D12

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

D29

D28

D27

D26

D25

D24

D23

D22

D21

D20

D19

D18

D17

D16

D15

D14

D13

D12

D11

D10

D99

D98

D97

D96

D95

D94

D93

D92

D91

D90

D89

D18

D87

D86

D85

D84

D83

D82

D81

D80

D119

D118

D117

D116

D115

D114

D113

D112

D111

D110

D99

D98

D97

D96

D95

D94

D93

D92

D91

D90

D119

D118

D117

D116

D115

D114

D113

D112

D111

D110

D109

D108

D107

D106

D125

D124

D123

D102

D101

D100

One bit

slipped

Seven more

bits slipped

One more

bit slipped

One more

bit slipped

Zero bits slipped.

Counter = 0

D10 is the upcoming

bit to be slipped.

One bit slipped.

Counter = 1

D21 is the upcoming

bit to be slipped.

Eight bits slipped.

Counter = 8

D98 is the upcoming

bit to be slipped.

Nine bits slipped.

Counter = 9

D119 is the upcoming

bit to be slipped.

10 bits slipped.

Counter = 0

Real data will resume

on the next byte.

Use the rx_channel_data_align signal within the device to activate

the data realigner. You can use internal logic or an external pin to control

the rx_channel_data_align signal. To ensure the rising edge of the

rx_channel_data_align signal is latched into the control logic, the

rx_channel_data_align signal should stay high for at least two low-

frequency clock cycles.

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August 2005

Source-Synchronous Signaling With DPA

To manage the alignment procedure, a state machine should be built in

the FPGA logic array to generate the realignment signal. The following

guidelines outline the requirements for this state machine.

■

The design must include an input synchronizing register to ensure

that data is synchronized to the ×W/J clock.

After the state machine, use another synchronizing register to

capture the generated rx_channel_data_align signal and

synchronize it to the ×W/J clock.

■

Because the skew in the path from the output of this synchronizing

register to the PLL is undefined, the state machine must generate a

pulse that is high for two W/J clock periods.

To guarantee the state machine does not incorrectly generate

multiple rx_channel_data_align pulses to shift a single bit, the

state machine must hold the rx_channel_data_align signal low

for at least three ×1 clock periods between pulses.

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Introduction

3–16

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August 2005

Stratix GX Device Handbook, Volume 1

4. Stratix GX Architecture

SGX51004-1.0

Each LAB consists of 10 LEs, LE carry chains, LAB control signals, local

interconnect, LUT chain, and register chain connection lines. The local

interconnect transfers signals between LEs in the same LAB. LUT chain

connections transfer the output of one LE’s LUT to the adjacent LE for fast

sequential LUT connections within the same LAB. Register chain

connections transfer the output of one LE’s register to the adjacent LE’s

register within an LAB. The Quartus^®II Compiler places associated logic

within an LAB or adjacent LABs, allowing the use of local, LUT chain,

and register chain connections for performance and area efficiency.

Figure 4–1 shows the Stratix^®GX LAB.

Logic Array

Blocks

Figure 4–1. Stratix GX LAB Structure

Row Interconnects of

Variable Speed & Length

Direct link

interconnect from

adjacent block

Direct link

interconnect from

adjacent block

Direct link

interconnect to

adjacent block

interconnect to

adjacent block

Local Interconnect

LAB

Three-Sided Architecture—Local

Interconnect is Driven from Either Side by

Columns & LABs, & from Above by Rows

Column Interconnects of

Variable Speed & Length

LAB Interconnects

The LAB local interconnect can drive LEs within the same LAB. The LAB

local interconnect is driven by column and row interconnects and LE

outputs within the same LAB. Neighboring LABs, M512 RAM blocks,

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February 2005

4–1

Logic Array Blocks

M4K RAM blocks, or DSP blocks from the left and right can also drive an

LAB’s local interconnect through the direct link connection. The direct

link connection feature minimizes the use of row and column

interconnects, providing higher performance and flexibility. Each LE can

drive 30 other LEs through fast local and direct link interconnects.

Figure 4–2 shows the direct link connection.

Figure 4–2. Direct Link Connection

Direct link interconnect from

left LAB, TriMatrix memory

block, DSP block, or IOE output

Direct link interconnect from

right LAB, TriMatrix memory

block, DSP block, or IOE output

Direct link

interconnect

to right

Direct link

interconnect

to left

Local

Interconnect

LAB

LAB Control Signals

Each LAB contains dedicated logic for driving control signals to its LEs.

The control signals include two clocks, two clock enables, two

asynchronous clears, synchronous clear, asynchronous preset/load,

synchronous load, and add/subtract control signals. This gives a

maximum of 10 control signals at a time. Although synchronous load and

clear signals are generally used when implementing counters, they can

also be used with other functions.

Each LAB can use two clocks and two clock enable signals. Each LAB’s

clock and clock enable signals are linked. For example, any LE in a

particular LAB using the labclk1signal also uses labclkena1. If the

LAB uses both the rising and falling edges of a clock, it also uses both

LAB-wide clock signals. De-asserting the clock enable signal turns off the

LAB-wide clock.

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Stratix GX Architecture

Each LAB can use two asynchronous clear signals and an asynchronous

load/preset signal. The asynchronous load acts as a preset when the

asynchronous load data input is tied high.

With the LAB-wide addnsubcontrol signal, a single LE can implement a

one-bit adder and subtractor. This saves LE resources and improves

performance for logic functions such as DSP correlators and signed

multipliers that alternate between addition and subtraction depending

on data.

The LAB row clocks [7..0] and LAB local interconnect generate the LAB-

TM

wide control signals. The MultiTrack interconnect’s inherent low skew

allows clock and control signal distribution in addition to data. Figure 4–3

shows the LAB control signal generation circuit.

Figure 4–3. LAB-Wide Control Signals

Dedicated

Row LAB

Clocks

8

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

labclkena2

labclkena1

syncload

labclr2

addnsub

Local

Interconnect

labclk1

labclk2

asyncload

or labpre

labclr1

synclr

The smallest unit of logic in the Stratix GX architecture, the LE, is compact

and provides advanced features with efficient logic utilization. Each LE

contains a four-input LUT, which is a function generator that can

implement any function of four variables. In addition, each LE contains a

programmable register and carry chain with carry select capability. A

single LE also supports dynamic single bit addition or subtraction mode

selectable by an LAB-wide control signal. Each LE drives all types of

interconnects: local, row, column, LUT chain, register chain, and direct

link interconnects. See Figure 4–4.

Logic Elements

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February 2005

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Stratix GX Device Handbook, Volume 1

Logic Elements

Figure 4–4. Stratix GX LE

Register chain

routing from

previous LE

LAB-wide

Synchronous

Load

Register Bypass

Packed

LAB Carry-In

Programmable

Register

LAB-wide

Carry-In1

Carry-In0

addnsub

Synchronous

Clear

Register Select

LUT chain

routing to next LE

data1

Row, column,

and direct link

routing

PRN/ALD

data2

data3

Synchronous

Load and

Clear Logic

Look-Up

Table

(LUT)

Carry

Chain

D

Q

ADATA

data4

ENA

CLRN

Row, column,

and direct link

routing

labclr1

labclr2

Asynchronous

Clear/Preset/

Load Logic

Local Routing

labpre/aload

Chip-Wide

Reset

Register chain

output

Clock &

Clock Enable

Select

Register

Feedback

labclk1

labclk2

labclkena1

labclkena2

Carry-Out0

Carry-Out1

LAB Carry-Out

Each LE’s programmable register can be configured for D, T, JK, or SR

operation. Each register has data, true asynchronous load data, clock,

clock enable, clear, and asynchronous load/preset inputs. Global signals,

general-purpose I/O pins, or any internal logic can drive the register’s

clock and clear control signals. Either general-purpose I/O pins or

internal logic can drive the clock enable, preset, asynchronous load, and

asynchronous data. The asynchronous load data input comes from the

data3input of the LE. For combinatorial functions, the register is

bypassed and the output of the LUT drives directly to the outputs of the

LE.

Each LE has three outputs that drive the local, row, and column routing

resources. The LUT or register output can drive these three outputs

independently. Two LE outputs drive column or row and direct link

routing connections and one drives local interconnect resources. This

allows the LUT to drive one output while the register drives another

output. This feature, called register packing, improves device utilization

because the device can use the register and the LUT for unrelated

functions. Another special packing mode allows the register output to

feed back into the LUT of the same LE so that the register is packed with

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February 2005

Stratix GX Architecture

its own fan-out LUT. This provides another mechanism for improved

fitting. The LE can also drive out registered and unregistered versions of

the LUT output.

LUT Chain & Register Chain

In addition to the three general routing outputs, the LEs within an LAB

have LUT chain and register chain outputs. LUT chain connections allow

LUTs within the same LAB to cascade together for wide input functions.

Register chain outputs allow registers within the same LAB to cascade

together. The register chain output allows an LAB to use LUTs for a single

combinatorial function and the registers to be used for an unrelated shift

register implementation. These resources speed up connections between

LABs while saving local interconnect resources. See “MultiTrack

Interconnect” on page 4–11 for more information on LUT chain and

register chain connections.

addnsub Signal

The LE’s dynamic adder/subtractor feature saves logic resources by

using one set of LEs to implement both an adder and a subtractor. This

feature is controlled by the LAB-wide control signal addnsub. The

addnsubsignal sets the LAB to perform either A + B or A – B. The LUT

computes addition, and subtraction is computed by adding the two’s

complement of the intended subtractor. The LAB-wide signal converts to

two’s complement by inverting the B bits within the LAB and setting

carry-in = 1 to add one to the least significant bit (LSB). The LSB of an

adder/subtractor must be placed in the first LE of the LAB, where the

LAB-wide addnsubsignal automatically sets the carry-in to 1. The

Quartus II Compiler automatically places and uses the adder/subtractor

feature when using adder/subtractor parameterized functions.

LE Operating Modes

The Stratix GX LE can operate in one of the following modes:

■

Normal mode

Dynamic arithmetic mode

Each mode uses LE resources differently. In each mode, eight available

inputs to the LE—the four data inputs from the LAB local interconnect;

carry-in0and carry-in1from the previous LE; the LAB carry-in

from the previous carry-chain LAB; and the register chain connection—

are directed to different destinations to implement the desired logic

function. LAB-wide signals provide clock, asynchronous clear,

asynchronous preset load, synchronous clear, synchronous load, and

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February 2005

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Stratix GX Device Handbook, Volume 1

Logic Elements

clock enable control for the register. These LAB-wide signals are available

in all LE modes. The addnsubcontrol signal is allowed in arithmetic

mode.

The Quartus II software, in conjunction with parameterized functions

such as library of parameterized modules (LPM) functions, automatically

chooses the appropriate mode for common functions such as counters,

adders, subtractors, and arithmetic functions. If required, you can also

create special-purpose functions that specify which LE operating mode to

use for optimal performance.

Normal Mode

The normal mode is suitable for general logic applications and

combinatorial functions. In normal mode, four data inputs from the LAB

local interconnect are inputs to a four-input LUT (see Figure 4–5). The

Quartus II Compiler automatically selects the carry-in or the data3

signal as one of the inputs to the LUT. Each LE can use LUT chain

connections to drive its combinatorial output directly to the next LE in the

LAB. Asynchronous load data for the register comes from the data3

input of the LE. LEs in normal mode support packed registers.

Figure 4–5. LE in Normal Mode

sload

sclear

aload

(LAB Wide) (LAB Wide)

(LAB Wide)

Register chain

connection

addnsub (LAB Wide)

ALD/PRE

(1)

Row, column, and

direct link routing

ADATA

D

Q

data1

data2

Row, column, and

direct link routing

ENA

CLRN

data3

cin (from cout

of previous LE)

4-Input

LUT

clock (LAB Wide)

Local routing

data4

ena (LAB Wide)

aclr (LAB Wide)

LUT chain

connection

Register

chain output

Register Feedback

Note to Figure 4–5:

(1) This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain.

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February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Dynamic Arithmetic Mode

The dynamic arithmetic mode is ideal for implementing adders, counters,

accumulators, wide parity functions, and comparators. An LE in dynamic

arithmetic mode uses four 2-input LUTs configurable as a dynamic

adder/subtractor. The first two 2-input LUTs compute two summations

based on a possible carry-in of 1 or 0; the other two LUTs generate carry

outputs for the two chains of the carry select circuitry. As shown in

Figure 4–6, the LAB carry-in signal selects either the carry-in0or

carry-in1chain. The selected chain’s logic level in turn determines

which parallel sum is generated as a combinatorial or registered output.

For example, when implementing an adder, the sum output is the

selection of two possible calculated sums: data1+ data2+ carry-in0

or data1+ data2+ carry-in1. The other two LUTs use the data1and

data2signals to generate two possible carry-out signals—one for a carry

of 1 and the other for a carry of 0. The carry-in0signal acts as the carry

select for the carry-out0output and carry-in1acts as the carry select

for the carry-out1output. LEs in arithmetic mode can drive out

registered and unregistered versions of the LUT output.

The dynamic arithmetic mode also offers clock enable, counter enable,

synchronous up/down control, synchronous clear, synchronous load,

and dynamic adder/subtractor options. The LAB local interconnect data

inputs generate the counter enable and synchronous up/down control

signals. The synchronous clear and synchronous load options are

LAB-wide signals that affect all registers in the LAB. The Quartus II

software automatically places any registers that are not used by the

counter into other LABs. The addnsubLAB-wide signal controls

whether the LE acts as an adder or subtractor.

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February 2005

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Stratix GX Device Handbook, Volume 1

Logic Elements

Figure 4–6. LE in Dynamic Arithmetic Mode

LAB Carry-In

Carry-In0

sload

sclear

aload

(LAB Wide)

(LAB Wide) (LAB Wide)

Carry-In1

Register chain

connection

addnsub

(LAB Wide)

(1)

ALD/PRE

data1

data2

data3

LUT

ADATA

D

Row, column, and

direct link routing

Q

LUT

Row, column, and

direct link routing

ENA

CLRN

clock (LAB Wide)

ena (LAB Wide)

aclr (LAB Wide)

Local routing

LUT chain

connection

Register

chain output

Register Feedback

Carry-Out0 Carry-Out1

Note to Figure 4–6:

(1) The addnsubsignal is tied to the carry input for the first LE of a carry chain only.

Carry-Select Chain

The carry-select chain provides a very fast carry-select function between

LEs in arithmetic mode. The carry-select chain uses the redundant carry

calculation to increase the speed of carry functions. The LE is configured

to calculate outputs for a possible carry-in of 1 and carry-in of 0 in

parallel. The carry-in0and carry-in1signals from a lower-order bit

feed forward into the higher-order bit via the parallel carry chain and

feed into both the LUT and the next portion of the carry chain. Carry-

select chains can begin in any LE within an LAB.

The speed advantage of the carry-select chain is in the parallel

pre-computation of carry chains. Because the LAB carry-in selects the

precomputed carry chain, not every LE is in the critical path. Only the

propagation delay between LAB carry-in generation (LE 5 and LE 10) are

now part of the critical path. This feature allows the Stratix GX

architecture to implement high-speed counters, adders, multipliers,

parity functions, and comparators of arbitrary width.

Figure 4–7 shows the carry-select circuitry in an LAB for a 10-bit full

adder. One portion of the LUT generates the sum of two bits using the

input signals and the appropriate carry-in bit; the sum is routed to the

output of the LE. The register can be bypassed for simple adders or used

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Stratix GX Architecture

for accumulator functions. Another portion of the LUT generates carry-

out bits. An LAB-wide carry in bit selects which chain to use for the

addition of given inputs. The carry-in signal for each chain, carry-in0

or carry-in1, selects the carry-out to carry forward to the carry-in

signal of the next-higher-order bit. The final carry-out signal is routed to

an LE, where it is fed to local, row, or column interconnects.

The Quartus II Compiler automatically creates carry chain logic during

design processing, or you can create it manually during design entry.

Parameterized functions such as LPM functions automatically take

advantage of carry chains for the appropriate functions.

The Quartus II Compiler creates carry chains longer than 10 LEs by

linking LABs together automatically. For enhanced fitting, a long carry

chain runs vertically allowing fast horizontal connections to TriMatrix^™

memory and DSP blocks. A carry chain can continue as far as a full

column.

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February 2005

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Stratix GX Device Handbook, Volume 1

Logic Elements

Figure 4–7. Carry Select Chain

LAB Carry-In

0

1

LAB Carry-In

Carry-In0

Sum1

Sum2

Sum3

Sum4

Sum5

A1

B1

LE1

LE2

LE3

LE4

LE5

Carry-In1

A2

B2

LUT

data1

data2

Sum

A3

B3

A4

B4

LUT

A5

B5

0

1

Carry-Out0

Carry-Out1

Sum6

Sum7

Sum8

Sum9

Sum10

A6

B6

LE6

LE7

LE8

LE9

A7

B7

A8

B8

A9

B9

A10

B10

LE10

LAB Carry-Out

Clear & Preset Logic Control

LAB-wide signals control the logic for the register’s clear and preset

signals. The LE directly supports an asynchronous clear and preset

function. The register preset is achieved through the asynchronous load

of a logic high. The direct asynchronous preset does not require a

NOT-gate push-back technique. Stratix GX devices support simultaneous

preset/ asynchronous load, and clear signals. An asynchronous clear

signal takes precedence if both signals are asserted simultaneously. Each

LAB supports up to two clears and one preset signal.

In addition to the clear and preset ports, Stratix GX devices provide a

chip-wide reset pin (DEV_CLRn) that resets all registers in the device. An

option set before compilation in the Quartus II software controls this pin.

This chip-wide reset overrides all other control signals.

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Stratix GX Architecture

In the Stratix GX architecture, connections between LEs, TriMatrix

MultiTrack

Interconnect

memory, DSP blocks, and device I/O pins are provided by the

TM

MultiTrack interconnect structure with DirectDrive technology. The

MultiTrack interconnect consists of continuous, performance-optimized

routing lines of different lengths and speeds used for inter- and intra-

design block connectivity. The Quartus II Compiler automatically places

critical design paths on faster interconnects to improve design

performance.

DirectDrive technology is a deterministic routing technology that ensures

identical routing resource usage for any function regardless of placement

within the device. The MultiTrack interconnect and DirectDrive

technology simplify the integration stage of block-based designing by

eliminating the re-optimization cycles that typically follow design

changes and additions.

The MultiTrack interconnect consists of row and column interconnects

that span fixed distances. A routing structure with fixed length resources

for all devices allows predictable and repeatable performance when

migrating through different device densities. Dedicated row

interconnects route signals to and from LABs, DSP blocks, and TriMatrix

memory within the same row. These row resources include:

■

Direct link interconnects between LABs and adjacent blocks.

R4 interconnects traversing four blocks to the right or left.

R8 interconnects traversing eight blocks to the right or left.

R24 row interconnects for high-speed access across the length of the

device.

The direct link interconnect allows an LAB, DSP block, or TriMatrix

memory block to drive into the local interconnect of its left and right

neighbors and then back into itself. Only one side of a M-RAM block

interfaces with direct link and row interconnects. This provides fast

communication between adjacent LABs and/or blocks without using

row interconnect resources.

The R4 interconnects span four LABs, three LABs and one M512 RAM

block, two LABs and one M4K RAM block, or two LABs and one DSP

block to the right or left of a source LAB. These resources are used for fast

row connections in a four-LAB region. Every LAB has its own set of R4

interconnects to drive either left or right. Figure 4–8 shows R4

interconnect connections from an LAB. R4 interconnects can drive and be

driven by DSP blocks and RAM blocks and horizontal IOEs. For LAB

interfacing, a primary LAB or LAB neighbor can drive a given R4

interconnect. For R4 interconnects that drive to the right, the primary

LAB and right neighbor can drive on to the interconnect. For R4

interconnects that drive to the left, the primary LAB and its left neighbor

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February 2005

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Stratix GX Device Handbook, Volume 1

MultiTrack Interconnect

can drive on to the interconnect. R4 interconnects can drive other R4

interconnects to extend the range of LABs they can drive. R4

interconnects can also drive C4 and C16 interconnects for connections

from one row to another. Additionally, R4 interconnects can drive R24

interconnects.

Figure 4–8. R4 Interconnect Connections

Adjacent LAB can

Drive onto Another

LAB's R4 Interconnect

C4, C8, and C16

Column Interconnects (1)

R4 Interconnect

Driving Right

R4 Interconnect

Driving Left

LAB

Neighbor

Primary

LAB (2)

LAB

Neighbor

Notes to Figure 4–8:

(1) C4 interconnects can drive R4 interconnects.

(2) This pattern is repeated for every LAB in the LAB row.

The R8 interconnects span eight LABs, M512 or M4K RAM blocks, or DSP

blocks to the right or left from a source LAB. These resources are used for

fast row connections in an eight-LAB region. Every LAB has its own set

of R8 interconnects to drive either left or right. R8 interconnect

connections between LABs in a row are similar to the R4 connections

shown in Figure 4–8, with the exception that they connect to eight LABs

to the right or left, not four. Like R4 interconnects, R8 interconnects can

drive and be driven by all types of architecture blocks. R8 interconnects

can drive other R8 interconnects to extend their range as well as C8

interconnects for row-to-row connections. One R8 interconnect is faster

than two R4 interconnects connected together.

R24 row interconnects span 24 LABs and provide the fastest resource for

long row connections between LABs, TriMatrix memory, DSP blocks, and

IOEs. The R24 row interconnects can cross M-RAM blocks. R24 row

interconnects drive to other row or column interconnects at every fourth

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February 2005

Stratix GX Architecture

LAB and do not drive directly to LAB local interconnects. R24 row

interconnects drive LAB local interconnects via R4 and C4 interconnects.

R24 interconnects can drive R24, R4, C16, and C4 interconnects.

The column interconnect operates similarly to the row interconnect and

vertically routes signals to and from LABs, TriMatrix memory, DSP

blocks, and IOEs. Each column of LABs is served by a dedicated column

interconnect, which vertically routes signals to and from LABs, TriMatrix

memory and DSP blocks, and horizontal IOEs. These column resources

include:

■

LUT chain interconnects within an LAB

Register chain interconnects within an LAB

C4 interconnects traversing a distance of four blocks in up and down

direction

■

C8 interconnects traversing a distance of eight blocks in up and

down direction

C16 column interconnects for high-speed vertical routing through

the device

Stratix GX devices include an enhanced interconnect structure within

LABs for routing LE output to LE input connections faster using LUT

chain connections and register chain connections. The LUT chain

connection allows the combinatorial output of an LE to directly drive the

fast input of the LE right below it, bypassing the local interconnect. These

resources can be used as a high-speed connection for wide fan-in

functions from LE 1 to LE 10 in the same LAB. The register chain

connection allows the register output of one LE to connect directly to the

register input of the next LE in the LAB for fast shift registers. The

Quartus II Compiler automatically takes advantage of these resources to

improve utilization and performance. Figure 4–9 shows the LUT chain

and register chain interconnects.

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February 2005

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Stratix GX Device Handbook, Volume 1

MultiTrack Interconnect

Figure 4–9. LUT Chain & Register Chain Interconnects

Local Interconnect

Routing Among LEs

in the LAB

LE 1

LUT Chain

Routing to

Adjacent LE

Register Chain

Routing to Adjacent

LE's Register Input

LE 2

LE 3

LE 4

LE 5

LE 6

LE 7

LE 8

LE 9

Local

Interconnect

LE 10

The C4 interconnects span four LABs, M512, or M4K blocks up or down

from a source LAB. Every LAB has its own set of C4 interconnects to drive

either up or down. Figure 4–10 shows the C4 interconnect connections

from an LAB in a column. The C4 interconnects can drive and be driven

by all types of architecture blocks, including DSP blocks, TriMatrix

memory blocks, and vertical IOEs. For LAB interconnection, a primary

LAB or its LAB neighbor can drive a given C4 interconnect.

C4 interconnects can drive each other to extend their range as well as

drive row interconnects for column-to-column connections.

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February 2005

Stratix GX Architecture

Figure 4–10. C4 Interconnect Connections

Note (1)

C4 Interconnect

Drives Local and R4

Interconnects

up to Four Rows

C4 Interconnect

Driving Up

LAB

Row

Interconnect

Adjacent LAB can

drive onto neighboring

LAB's C4 interconnect

Local

Interconnect

C4 Interconnect

Driving Down

Note to Figure 4–10:

(1) Each C4 interconnect can drive either up or down four rows.

C8 interconnects span eight LABs, M512, or M4K blocks up or down from

a source LAB. Every LAB has its own set of C8 interconnects to drive

either up or down. C8 interconnect connections between the LABs in a

column are similar to the C4 connections shown in Figure 4–10 with the

exception that they connect to eight LABs above and below. The C8

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February 2005

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Stratix GX Device Handbook, Volume 1

MultiTrack Interconnect

interconnects can drive and be driven by all types of architecture blocks

similar to C4 interconnects. C8 interconnects can drive each other to

extend their range as well as R8 interconnects for column-to-column

connections. C8 interconnects are faster than two C4 interconnects.

C16 column interconnects span a length of 16 LABs and provide the

fastest resource for long column connections between LABs, TriMatrix

memory blocks, DSP blocks, and IOEs. C16 interconnects can cross M-

RAM blocks and also drive to row and column interconnects at every

fourth LAB. C16 interconnects drive LAB local interconnects via C4 and

R4 interconnects and do not drive LAB local interconnects directly.

All embedded blocks communicate with the logic array similar to LAB-

to-LAB interfaces. Each block (that is, TriMatrix memory and DSP blocks)

connects to row and column interconnects and has local interconnect

regions driven by row and column interconnects. These blocks also have

direct link interconnects for fast connections to and from a neighboring

LAB. All blocks are fed by the row LAB clocks, labclk[7..0].

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Stratix GX Architecture

Table 4–1 shows the Stratix GX device’s routing scheme.

Table 4–1. Stratix GX Device Routing Scheme

Destination

Source

LUT Chain

v

Register Chain

Local

Interconnect

v

Direct Link

Interconnect

v

R4 Interconnect

R8 Interconnect

v

R24

Interconnect

v

C4 Interconnect

C8 Interconnect

v

C16

Interconnect

v

LE

v

M512 RAM

Block

M4K RAM Block

M-RAM Block

DSP Blocks

Column IOE

Row IOE

v

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

TriMatrix Memory

TriMatrix memory consists of three types of RAM blocks: M512, M4K,

and M-RAM blocks. Although these memory blocks are different, they

can all implement various types of memory with or without parity,

including true dual-port, simple dual-port, and single-port RAM, ROM,

and FIFO buffers. Table 4–2 shows the size and features of the different

RAM blocks.

TriMatrix

Memory

Table 4–2. TriMatrix Memory Features (Part 1 of 2)

M512 RAM Block M4K RAM Block M-RAM Block

Memory Feature

(32 × 18 Bits)

(128 × 36 Bits) (4K × 144 Bits)

Maximum

(1)

performance

True dual-port

memory

v

Simple dual-port

memory

v

Single-port memory

Shift register

ROM

v

(2)

FIFO buffer

v

Byte enable

Parity bits

v

Mixed clock mode

Memory initialization

Simple dual-port

memory mixed width

support

v

True dual-port

memory mixed width

support

v

Power-up conditions

Outputs cleared

Outputs cleared Outputs

unknown

Register clears

Input and output

registers

Input and output Output registers

registers

Mixed-port read-

during-write

Unknown

output/old data

Unknown

output/old data

Unknown output

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February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Table 4–2. TriMatrix Memory Features (Part 2 of 2)

M512 RAM Block M4K RAM Block M-RAM Block

(32 × 18 Bits) (128 × 36 Bits) (4K × 144 Bits)

Memory Feature

Configurations

512 ×1

4K × 1

2K × 2

1K × 4

512 × 8

512 × 9

256 × 16

256 × 18

128 × 32

128 × 36

64K × 8

64K × 9

32K × 16

32K × 18

16K × 32

16K × 36

8K × 64

8K × 72

4K × 128

4K × 144

256 × 2

128 × 4

64 × 8

64 × 9

32 × 16

32 × 18

Notes to Table 4–2:

(1) See the DC & Switching Characteristics chapter of the Stratix GX Device Handbook,

Volume 1 for maximum performance information.

(2) The M-RAM block does not support memory initializations. However, the

M-RAM block can emulate a ROM function using a dual-port RAM bock. The

Stratix GX device must write to the dual-port memory once and then disable the

write-enable ports afterwards.

Memory Modes

TriMatrix memory blocks include input registers that synchronize writes

and output registers to pipeline designs and improve system

performance. M4K and M-RAM memory blocks offer a true dual-port

mode to support any combination of two-port operations: two reads, two

writes, or one read and one write at two different clock frequencies.

Figure 4–11 shows true dual-port memory.

Figure 4–11. True Dual-Port Memory Configuration

A

B

data_A[]

data_B[]

address_A[]

wren_A

address_B[]

wren_B

clock_A

clocken_A

q_A[]

clock_B

clocken_B

q_B[]

aclr_A

aclr_B

In addition to true dual-port memory, the memory blocks support simple

dual-port and single-port RAM. Simple dual-port memory supports a

simultaneous read and write and can either read old data before the write

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February 2005

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TriMatrix Memory

occurs or just read the don’t care bits. Single-port memory supports

non-simultaneous reads and writes, but the q[]port outputs the data

once it has been written to the memory (if the outputs are not registered)

or after the next rising edge of the clock (if the outputs are registered). For

more information, see the TriMatrix Embedded Memory Blocks in

Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook,

Volume 2. Figure 4–12 shows these different RAM memory port

configurations for TriMatrix memory.

Figure 4–12. Simple Dual-Port & Single-Port Memory Configurations

Simple Dual-Port Memory

data[]

rdaddress[]

rden

wraddress[]

wren

q[]

inclock

inclocken

inaclr

outclock

outclocken

outaclr

Single-Port Memory (1)

data[]

address[]

wren

q[]

outclock

inclock

inclocken

inaclr

outclocken

outaclr

Note to Figure 4–12:

(1) Two single-port memory blocks can be implemented in a single M4K block as long

as each of the two independent block sizes is equal to or less than half of the M4K

block size.

The memory blocks also enable mixed-width data ports for reading and

writing to the RAM ports in dual-port RAM configuration. For example,

the memory block can be written in ×1 mode at port A and read out in ×16

mode from port B.

TriMatrix memory architecture can implement pipelined RAM by

registering both the input and output signals to the RAM block. All

TriMatrix memory block inputs are registered providing synchronous

write cycles. In synchronous operation, the memory block generates its

own self-timed strobe write enable (WREN) signal derived from the global

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February 2005

Stratix GX Architecture

or regional clock. In contrast, a circuit using asynchronous RAM must

generate the RAM WRENsignal while ensuring its data and address

signals meet setup and hold time specifications relative to the WREN

signal. The output registers can be bypassed. Flow-through reading is

possible in the simple dual-port mode of M512 and M4K RAM blocks by

clocking the read enable and read address registers on the negative clock

edge and bypassing the output registers.

Two single-port memory blocks can be implemented in a single M4K

block as long as each of the two independent block sizes is equal to or less

than half of the M4K block size.

The Quartus II software automatically implements larger memory by

combining multiple TriMatrix memory blocks. For example, two

256 × 16-bit RAM blocks can be combined to form a 256 × 32-bit RAM

block. Memory performance does not degrade for memory blocks using

the maximum number of words available in one memory block. Logical

memory blocks using less than the maximum number of words use

physical blocks in parallel, eliminating any external control logic that

would increase delays. To create a larger high-speed memory block, the

Quartus II software automatically combines memory blocks with LE

control logic.

Parity Bit Support

The memory blocks support a parity bit for each byte. The parity bit,

along with internal LE logic, can implement parity checking for error

detection to ensure data integrity. You can also use parity-size data words

to store user-specified control bits. In the M4K and M-RAM blocks, byte

enables are also available for data input masking during write operations.

Shift Register Support

You can configure embedded memory blocks to implement shift registers

for DSP applications such as pseudo-random number generators, multi-

channel filtering, auto-correlation, and cross-correlation functions. These

and other DSP applications require local data storage, traditionally

implemented with standard flip-flops, which can quickly consume many

logic cells and routing resources for large shift registers. A more efficient

alternative is to use embedded memory as a shift register block, which

saves logic cell and routing resources and provides a more efficient

implementation with the dedicated circuitry.

The size of a w × m × n shift register is determined by the input data

width (w), the length of the taps (m), and the number of taps (n). The size

of a w × m × n shift register must be less than or equal to the maximum

number of memory bits in the respective block: 576 bits for the M512

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February 2005

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TriMatrix Memory

RAM block and 4,608 bits for the M4K RAM block. The total number of

shift register outputs (number of taps n × width w) must be less than the

maximum data width of the RAM block (18 for M512 blocks, 36 for M4K

blocks). To create larger shift registers, the memory blocks are cascaded

together.

Data is written into each address location at the falling edge of the clock

and read from the address at the rising edge of the clock. The shift register

mode logic automatically controls the positive and negative edge

clocking to shift the data in one clock cycle. Figure 4–13 shows the

TriMatrix memory block in the shift register mode.

Figure 4–13. Shift Register Memory Configuration

w × m × n Shift Register

m-Bit Shift Register

w

m-Bit Shift Register

w

n Number

of Taps

m-Bit Shift Register

w

m-Bit Shift Register

w

Memory Block Size

TriMatrix memory provides three different memory sizes for efficient

application support. The large number of M512 blocks are ideal for

designs with many shallow first-in first-out (FIFO) buffers. M4K blocks

provide additional resources for channelized functions that do not

require large amounts of storage. The M-RAM blocks provide a large

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Stratix GX Architecture

single block of RAM ideal for data packet storage. The different-sized

blocks allow Stratix GX devices to efficiently support variable-sized

memory in designs.

The Quartus II software automatically partitions the user-defined

memory into the embedded memory blocks using the most efficient size

combinations. You can also manually assign the memory to a specific

block size or a mixture of block sizes.

M512 RAM Block

The M512 RAM block is a simple dual-port memory block and is useful

for implementing small FIFO buffers, DSP, and clock domain transfer

applications. Each block contains 576 RAM bits (including parity bits).

M512 RAM blocks can be configured in the following modes:

■

Simple dual-port RAM

Single-port RAM

FIFO

ROM

Shift register

When configured as RAM or ROM, you can use an initialization file to

pre-load the memory contents.

The memory address depths and output widths can be configured as

512 × 1, 256 × 2, 128 × 4, 64 × 8 (64 × 9 bits with parity), and 32 × 16

(32 × 18 bits with parity). Mixed-width configurations are also possible,

allowing different read and write widths. Table 4–3 summarizes the

possible M512 RAM block configurations.

Table 4–3. M512 RAM Block Configurations (Simple Dual-Port RAM)

Write Port

Read Port

512 × 1 256 × 2 128 × 4 64 × 8 32 × 16 64 × 9 32 × 18

512 × 1

v

256 × 2

128 × 4

64 × 8

v

32 × 16

64 × 9

v

32 × 18

v

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February 2005

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TriMatrix Memory

When the M512 RAM block is configured as a shift register block, a shift

register of size up to 576 bits is possible.

The M512 RAM block can also be configured to support serializer and

deserializer applications. By using the mixed-width support in

combination with DDR I/O standards, the block can function as a

SERDES to support low-speed serial I/O standards using global or

regional clocks. See “I/O Structure” on page 4–96 for details on dedicated

SERDES in Stratix GX devices.

M512 RAM blocks can have different clocks on its inputs and outputs.

The wren, datain, and write address registers are all clocked together

from one of the two clocks feeding the block. The read address, rden, and

output registers can be clocked by either of the two clocks driving the

block. This allows the RAM block to operate in read/write or

input/output clock modes. Only the output register can be bypassed. The

eight labclksignals or local interconnect can drive the inclock,

outclock, wren, rden, inclr, and outclrsignals. Because of the

advanced interconnect between the LAB and M512 RAM blocks, LEs can

also control the wrenand rdensignals and the RAM clock, clock enable,

and asynchronous clear signals. Figure 4–14 shows the M512 RAM block

control signal generation logic.

The RAM blocks within Stratix GX devices have local interconnects to

allow LEs and interconnects to drive into RAM blocks. The M512 RAM

block local interconnect is driven by the R4, R8, C4, C8, and direct link

interconnects from adjacent LABs. The M512 RAM blocks can

communicate with LABs on either the left or right side through these row

interconnects or with LAB columns on the left or right side with the

column interconnects. Up to 10 direct link input connections to the M512

RAM block are possible from the left adjacent LABs and another

10 possible from the right adjacent LAB. M512 RAM outputs can also

connect to left and right LABs through 10 direct link interconnects. The

M512 RAM block has equal opportunity for access and performance to

and from LABs on either its left or right side. Figure 4–15 shows the M512

RAM block to logic array interface.

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Stratix GX Architecture

Figure 4–14. M512 RAM Block Control Signals

Dedicated

8

Row LAB

Clocks

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

outclocken

inclocken

wren

outclr

Local

Interconnect

inclock

outclock

rden

inclr

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February 2005

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TriMatrix Memory

Figure 4–15. M512 RAM Block LAB Row Interface

C4 and C8

Interconnects

R4 and R8

Interconnects

10

Direct link

interconnect

to adjacent LAB

interconnect

to adjacent LAB

dataout

M512 RAM

Block

Direct link

interconnect

from adjacent LAB

Control

Signals

datain

Clocks

address

2

8

Small RAM Block Local

Interconnect Region

LAB Row Clocks

M4K RAM Blocks

The M4K RAM block includes support for true dual-port RAM. The M4K

RAM block implements buffers for a wide variety of applications such as

storing processor code, implementing lookup schemes, and

implementing larger memory applications. Each block contains

4,608 RAM bits (including parity bits). M4K RAM blocks can be

configured in the following modes:

■

True dual-port RAM

Simple dual-port RAM

Single-port RAM

FIFO

ROM

Shift register

When configured as RAM or ROM, you can use an initialization file to

pre-load the memory contents.

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Stratix GX Architecture

The memory address depths and output widths can be configured as

4,096 × 1, 2,048 × 2, 1,024 × 4, 512 × 8 (or 512 × 9 bits), 256 × 16 (or

256 × 18 bits), and 128 × 32 (or 128 × 36 bits). The 128 × 32- or 36-bit

configuration is not available in the true dual-port mode. Mixed-width

configurations are also possible, allowing different read and write

widths. Tables 4–4 and 4–5 summarize the possible M4K RAM block

configurations.

Table 4–4. M4K RAM Block Configurations (Simple Dual-Port)

Write Port

Read Port

4K 1

v

2K × 2 1K ° 4 512 ° 8 256 ° 16 128 ° 32 512 ° 9 256 ° 18 128 ° 36

4K × 1

2K × 2

v

1K × 4

512 × 8

256 × 16

128 × 32

512 × 9

256 × 18

128 × 36

v

Table 4–5. M4K RAM Block Configurations (True Dual-Port)

Port B

Port A

4K × 1

v

2K × 2

v

1K × 4

v

512 × 8

v

256 × 16

v

512 × 9

256 × 18

4K × 1

2K × 2

v

1K × 4

v

512 × 8

256 × 16

512 × 9

256 × 18

v

When the M4K RAM block is configured as a shift register block, you can

create a shift register up to 4,608 bits (w × m × n).

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February 2005

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TriMatrix Memory

M4K RAM blocks support byte writes when the write port has a data

width of 16, 18, 32, or 36 bits. The byte enables allow the input data to be

masked so the device can write to specific bytes. The unwritten bytes

retain the previous written value. Table 4–6 summarizes the byte

selection.

Table 4–6. Byte Enable for M4K Blocks Notes (1), (2)

byteena[3..0]

datain ×18

datain ×36

[0] = 1

[1] = 1

[2] = 1

[3] = 1

[8..0]

[17..9]

–

[26..18]

[35..27]

Notes to Table 4–6:

(1) Any combination of byte enables is possible.

(2) Byte enables can be used in the same manner with 8-bit words, that is, in ×16 and

×32 modes.

The M4K RAM blocks allow for different clocks on their inputs and

outputs. Either of the two clocks feeding the block can clock M4K RAM

block registers (renwe, address, byte enable, datain, and output

registers). Only the output register can be bypassed. The eight labclk

signals or local interconnects can drive the control signals for the A and B

ports of the M4K RAM block. LEs can also control the clock_a,

clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and

clocken_bsignals, as shown in Figure 4–16.

The R4, R8, C4, C8, and direct link interconnects from adjacent LABs

drive the M4K RAM block local interconnect. The M4K RAM blocks can

communicate with LABs on either the left or right side through these row

resources or with LAB columns on either the right or left with the column

resources. Up to 10 direct link input connections to the M4K RAM Block

are possible from the left adjacent LABs and another 10 possible from the

right adjacent LAB. M4K RAM block outputs can also connect to left and

right LABs through 10 direct link interconnects each. Figure 4–17 shows

the M4K RAM block to logic array interface.

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February 2005

Stratix GX Architecture

Figure 4–16. M4K RAM Block Control Signals

Dedicated

8

Row LAB

Clocks

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

alcr_a

clocken_a

renwe_b

clock_b

Local

Interconnect

clock_a

renwe_a

alcr_b

clocken_b

Figure 4–17. M4K RAM Block LAB Row Interface

C4 and C8

Interconnects

R4 and R8

Interconnects

10

Direct link

interconnect

to adjacent LAB

interconnect

to adjacent LAB

dataout

M4K RAM

Block

Direct link

interconnect

from adjacent LAB

Byte enable

Clocks

Control

Signals

address

datain

8

M4K RAM Block Local

Interconnect Region

LAB Row Clocks

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February 2005

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TriMatrix Memory

M-RAM Block

The largest TriMatrix memory block, the M-RAM block, is useful for

applications where a large volume of data must be stored on-chip. Each

block contains 589,824 RAM bits (including parity bits). The M-RAM

block can be configured in the following modes:

■

True dual-port RAM

Simple dual-port RAM

Single-port RAM

FIFO RAM

You cannot use an initialization file to initialize the contents of a M-RAM

block. All M-RAM block contents power up to an undefined value. Only

synchronous operation is supported in the M-RAM block, so all inputs

are registered. Output registers can be bypassed. The memory address

and output width can be configured as 64K × 8 (or 64K × 9 bits), 32K × 16

(or 32K × 18 bits), 16K × 32 (or 16K × 36 bits), 8K × 64 (or 8K × 72 bits), and

4K × 128 (or 4K × 144 bits). The 4K × 128 configuration is unavailable in

true dual-port mode because there are a total of 144 data output drivers

in the block. Mixed-width configurations are also possible, allowing

different read and write widths. Tables 4–7 and 4–8 summarize the

possible M-RAM block configurations:

Table 4–7. M-RAM Block Configurations (Simple Dual-Port)

Write Port

Read Port

64K × 9

32K × 18

16K × 36

8K × 72

v

4K × 144

64K × 9

32K × 18

16K × 36

8K × 72

4K × 144

v

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Stratix GX Architecture

Table 4–8. M-RAM Block Configurations (True Dual-Port)

Port B

32K × 18

Port A

64K × 9

v

16K × 36

v

8K × 72

v

64K × 9

v

32K × 18

16K × 36

8K × 72

v

The read and write operation of the memory is controlled by the WREN

signal, which sets the ports into either read or write modes. There is no

separate read enable (RE) signal.

Writing into RAM is controlled by both the WRENand byte enable

(byteena) signals for each port. The default value for the byteena

signal is high, in which case writing is controlled only by the WRENsignal.

The byte enables are available for the ×18, ×36, and ×72 modes. In the

×144 simple dual-port mode, the two sets of byteenasignals

(byteena_aand byteena_b) are combined to form the necessary

16 byte enables. Tables 4–9 and 4–10 summarize the byte selection.

Table 4–9. Byte Enable for M-RAM Blocks Notes (1), (2)

byteena[3..0]

datain ×18

datain ×36

datain ×72

[0] = 1

[1] = 1

[2] = 1

[3] = 1

[4] = 1

[5] = 1

[6] = 1

[7] = 1

[8..0]

[17..9]

–

[26..18]

[35..27]

[44..36]

[53..45]

[62..54]

[71..63]

[35..27]

–

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February 2005

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TriMatrix Memory

Table 4–10. M-RAM Combined Byte Selection for ×144 Mode Notes (1), (2)

byteena[15..0]

datain ×144

[0] = 1

[1] = 1

[2] = 1

[3] = 1

[4] = 1

[5] = 1

[6] = 1

[7] = 1

[8] = 1

[9] = 1

[10] = 1

[11] = 1

[12] = 1

[13] = 1

[14] = 1

[15] = 1

[8..0]

[17..9]

[26..18]

[35..27]

[44..36]

[53..45]

[62..54]

[71..63]

[80..72]

[89..81]

[98..90]

[107..99]

[116..108]

[125..117]

[134..126]

[143..135]

Notes to Tables 4–9 and 4–10:

(1) Any combination of byte enables is possible.

(2) Byte enables can be used in the same manner with 8-bit words, that is, in ×16, ×32,

×64, and ×128 modes.

Similar to all RAM blocks, M-RAM blocks can have different clocks on

their inputs and outputs. All input registers—renwe, datain, address,

and byte enable registers—are clocked together from either of the two

clocks feeding the block. The output register can be bypassed. The eight

labclksignals or local interconnect can drive the control signals for the

A and B ports of the M-RAM block. LEs can also control the clock_a,

clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and

clocken_bsignals as shown in Figure 4–18.

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February 2005

Stratix GX Architecture

Figure 4–18. M-RAM Block Control Signals

Dedicated

8

Row LAB

Clocks

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

Local

Interconnect

clocken_b

clocken_a

aclr_b

renwe_b

Local

clock_a

clock_b

aclr_a

renwe_a

Interconnect

One of the M-RAM block’s horizontal sides drive the address and control

signal (clock, renwe, byteena, etc.) inputs. Typically, the horizontal side

closest to the device perimeter contains the interfaces. The one exception

is when two M-RAM blocks are paired next to each other. In this case, the

side of the M-RAM block opposite the common side of the two blocks

contains the input interface. The top and bottom sides of any M-RAM

block contain data input and output interfaces to the logic array. The top

side has 72 data inputs and 72 data outputs for port B, and the bottom side

has another 72 data inputs and 72 data outputs for port A. Figure 4–19

shows an example floorplan for the EP1SGX40 device and the location of

the M-RAM interfaces.

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February 2005

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TriMatrix Memory

Figure 4–19. EP1SGX40 Device with M-RAM Interface Locations

Note (1)

Independent M-RAM blocks

interface to top, bottom, and side facing

device perimeter for easy access

to horizontal I/O pins.

M-RAM interface to

top, bottom, and side opposite

of block-to-block border.

M-RAM

Block

M-RAM

Block

M-RAM

Block

M-RAM

Block

DSP

Blocks

M512

Blocks

LABs

DSP

Blocks

Note to Figure 4–19:

(1) Device shown is an EP1SGX40 device. The number and position of M-RAM blocks varies in other devices.

The M-RAM block local interconnect is driven by the R4, R8, C4, C8, and

direct link interconnects from adjacent LABs. For independent M-RAM

blocks, up to 10 direct link address and control signal input connections

to the M-RAM block are possible from the left adjacent LABs for M-RAM

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Stratix GX Architecture

blocks facing to the left, and another 10 possible from the right adjacent

LABs for M-RAM blocks facing to the right. For column interfacing, every

M-RAM column unit connects to the right and left column lines, allowing

each M-RAM column unit to communicate directly with three columns of

LABs. Figures 4–20 through 4–22 show the interface between the M-RAM

block and the logic array.

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February 2005

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TriMatrix Memory

Figure 4–20. Left-Facing M-RAM to Interconnect Interface

Notes (1), (2)

M512 RAM Block Columns

Row Unit Interface

Allows LAB Rows to

Drive Address and

Control Signals to

M-RAM Block

LABs in Column

M-RAM Boundary

Column Interface Block

Drives to and from

C4 and C8 Interconnects

B1

B2

B3

B4

B5

B6

Port B

R11

R10

R9

R8

R7

M-RAM Block

R6

R5

R4

R3

R2

R1

Port A

A3

Column Interface Block

Allows LAB Columns to

Drive datain and dataout to

and from M-RAM Block

A1

A2

A4

A5

A6

LABs in Row

M-RAM Boundary

LAB Interface

Blocks

Notes to Figure 4–20:

(1) Only R24 and C16 interconnects cross the M-RAM block boundaries.

(2) The right-facing M-RAM block has interface blocks on the right side, but none on the left. B1 to B6 and A1 to A6

orientation is clipped across the vertical axis for right-facing M-RAM blocks.

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Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Figure 4–21. M-RAM Row Unit Interface to Interconnect

C4 and C8 Interconnects

R4 and R8 Interconnects

M-RAM Block

LAB

10

Direct Link

Interconnects

addressa

addressb

renwe_a

renwe_b

Up to 24

byteena [ ]

A

byteena [ ]

B

clocken_a

clocken_b

clock_a

clock_b

aclr_a

aclr_b

Row Interface Block

M-RAM Block to

LAB Row Interface

Block Interconnect Region

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February 2005

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TriMatrix Memory

Figure 4–22. M-RAM Column Unit Interface to Interconnect

C4 and C8 Interconnects

LAB

M-RAM Block to

LAB Row Interface

Block Interconnect

Region

Column Interface

Block

12

datain

12

dataout

M-RAM Block

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Stratix GX Architecture

Table 4–11 shows the input and output data signal connections for the

column units (B1 to B6 and A1 to A6). It also shows the address and

control signal input connections to the row units (R1 to R11).

Table 4–11. M-RAM Row & Column Interface Unit Signals

Unit Interface Block

Input SIgnals

Output Signals

R1

R2

R3

addressa[7..0]

addressa[15..8]

byte_enable_a[7..0]

renwe_a

R4

R5

R6

-

clock_a

clocken_a

clock_b

clocken_b

R7

R8

R9

-

byte_enable_b[7..0]

renwe_b

R10

R11

B1

B2

B3

B4

B5

B6

A1

A2

A3

A4

A5

A6

addressb[15..8]

addressb[7..0]

datain_b[71..60]

datain_b[59..48]

datain_b[47..36]

datain_b[35..24]

datain_b[23..12]

datain_b[11..0]

datain_a[71..60]

datain_a[59..48]

datain_a[47..36]

datain_a[35..24]

datain_a[23..12]

datain_a[11..0]

dataout_b[71..60]

dataout_b[59..48]

dataout_b[47..36]

dataout_b[35..24]

dataout_b[23..12]

dataout_b[11..0]

dataout_a[71..60]

dataout_a[59..48]

dataout_a[47..36]

dataout_a[35..24]

dataout_a[23..12]

dataout_a[11..0]

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February 2005

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TriMatrix Memory

Independent Clock Mode

The memory blocks implement independent clock mode for true dual-

port memory. In this mode, a separate clock is available for each port

(ports A and B). Clock A controls all registers on the port A side, while

clock B controls all registers on the port B side. Each port, A and B, also

supports independent clock enables and asynchronous clear signals for

port A and B registers. Figure 4–23 shows a TriMatrix memory block in

independent clock mode.

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February 2005

Stratix GX Architecture

Figure 4–23. Independent Clock Mode

Note (1)

Note to Figure 4–23:

(1) All registers shown have asynchronous clear ports.

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February 2005

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TriMatrix Memory

Input/Output Clock Mode

Input/output clock mode can be implemented for both the true and

simple dual-port memory modes. On each of the two ports, A or B, one

clock controls all registers for inputs into the memory block: data input,

wren, and address. The other clock controls the block’s data output

registers. Each memory block port, A or B, also supports independent

clock enables and asynchronous clear signals for input and output

registers. Figures 4–24 and 4–25 show the memory block in input/output

clock mode.

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February 2005

Stratix GX Architecture

Figure 4–24. Input/Output Clock Mode in True Dual-Port Mode

Note (1)

Note to Figure 4–24:

(1) All registers shown have asynchronous clear ports.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

TriMatrix Memory

Figure 4–25. Input/Output Clock Mode in Simple Dual-Port Mode

Note (1)

8 LAB Row

Clocks

Memory Block

8

256 ´ 16

512 ´ 8

1,024 ´ 4

2,048 ´ 2

4,096 ´ 1

data[ ]

address[ ]

byteena[ ]

D

ENA

Q

Data In

Read Address

D

ENA

To MultiTrack

Interconnect

Data Out

D

Q

ENA

Byte Enable

D

ENA

wraddress[ ]

rden

Write Address

Read Enable

D

ENA

Q

D

ENA

wren

outclken

Write

Pulse

Generator

D

ENA

Q

Write Enable

inclken

wrclock

rdclock

Note to Figure 4–25:

(1) All registers shown except the rdenregister have asynchronous clear ports.

Read/Write Clock Mode

The memory blocks implement read/write clock mode for simple dual-

port memory. You can use up to two clocks in this mode. The write clock

controls the block’s data inputs, wraddress, and wren. The read clock

controls the data output, rdaddress, and rden. The memory blocks

support independent clock enables for each clock and asynchronous clear

signals for the read- and write-side registers. Figure 4–26 shows a

memory block in read/write clock mode.

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Stratix GX Architecture

Figure 4–26. Read/Write Clock Mode in Simple Dual-Port Mode

Note (1)

8 LAB Row

Clocks

Memory Block

256 × 16

512 × 8

8

1,024 × 4

data[ ]

D

ENA

Q

Data In

2,048 × 2

4,096 × 1

To MultiTrack

Interconnect

Data Out

D

Q

ENA

address[ ]

Read Address

D

Q

ENA

wraddress[ ]

Write Address

Byte Enable

Read Enable

D

ENA

byteena[ ]

rden

D

ENA

D

Q

ENA

wren

outclken

Write

Pulse

Generator

D

ENA

Q

inclken

wrclock

Write Enable

rdclock

Note to Figure 4–26:

(1) All registers shown except the rdenregister have asynchronous clear ports.

Single-Port Mode

The memory blocks also support single-port mode, used when

simultaneous reads and writes are not required. See Figure 4–27. A single

block in a memory block can support up to two single-port mode RAM

blocks in the M4K RAM blocks if each RAM block is less than or equal to

2K bits in size.

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February 2005

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Digital Signal Processing Block

Figure 4–27. Single-Port Mode

8 LAB Row

Clocks

RAM/ROM

8

256 × 16

512 × 8

1,024 × 4

2,048 × 2

4,096 × 1

data[ ]

D

ENA

Q

Data In

To MultiTrack

Interconnect

Data Out

D

Q

ENA

address[ ]

wren

Address

D

Q

ENA

Write Enable

outclken

D

ENA

Q

inclken

inclock

Write

Pulse

Generator

outclock

The most commonly used DSP functions are finite impulse response (FIR)

filters, complex FIR filters, infinite impulse response (IIR) filters, fast

Fourier transform (FFT) functions, direct cosine transform (DCT)

functions, and correlators. All of these blocks have the same fundamental

building block: the multiplier. Additionally, some applications need

specialized operations such as multiply-add and multiply-accumulate

operations. Stratix GX devices provide DSP blocks to meet the arithmetic

requirements of these functions.

Digital Signal

Processing

Block

Each Stratix GX device has two columns of DSP blocks to efficiently

implement DSP functions faster than LE-based implementations. Larger

Stratix GX devices have more DSP blocks per column (see Table 4–12).

Each DSP block can be configured to support up to:

■

Eight 9 × 9-bit multipliers

Four 18 × 18-bit multipliers

One 36 × 36-bit multiplier

As indicated, the Stratix GX DSP block can support one 36 × 36-bit

multiplier in a single DSP block. This is true for any matched sign

multiplications (either unsigned by unsigned or signed by signed), but

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Stratix GX Architecture

the capabilities for dynamic and mixed sign multiplications are handled

differently. The following list provides the largest functions that can fit

into a single DSP block.

■

36 × 36-bit unsigned by unsigned multiplication

36 × 36-bit signed by signed multiplication

35 × 36-bit unsigned by signed multiplication

36 × 35-bit signed by unsigned multiplication

36 × 35-bit signed by dynamic sign multiplication

35 × 36-bit dynamic sign by signed multiplication

35 × 36-bit unsigned by dynamic sign multiplication

36 × 35-bit dynamic sign by unsigned multiplication

35 × 35-bit dynamic sign multiplication when the sign controls for

each operand are different

■

36 × 36-bit dynamic sign multiplication when the same sign control

is used for both operands

1

This list only shows functions that can fit into a single DSP block.

Multiple DSP blocks can support larger multiplication

functions.

Figure 4–28 shows one of the columns with surrounding LAB rows.

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February 2005

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Digital Signal Processing Block

Figure 4–28. DSP Blocks Arranged in Columns

DSP Block

Column

DSP Block

8 LAB

Rows

4–48

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February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Table 4–12 shows the number of DSP blocks in each Stratix GX device.

Table 4–12. DSP Blocks in Stratix GX Devices

Notes (1), (2)

Total 9 × 9

Multipliers

Total 18 × 18 Total 36 × 36

Device

DSP Blocks

Multipliers

EP1SGX10

EP1SGX25

EP1SGX40

6

48

80

24

40

56

6

10

14

10

14

112

Notes to Table 4–12:

(1) Each device has either the number of 9 × 9-, 18 × 18-, or 36 × 36-bit multipliers

shown. The total number of multipliers for each device is not the sum of all the

multipliers.

(2) The number of supported multiply functions shown is based on signed/signed

or unsigned/unsigned implementations.

DSP block multipliers can optionally feed an adder/subtractor or

accumulator within the block depending on the configuration. This

makes routing to LEs easier, saves LE routing resources, and increases

performance, because all connections and blocks are within the DSP

block. Additionally, the DSP block input registers can efficiently

implement shift registers for FIR filter applications.

Figure 4–29 shows the top-level diagram of the DSP block configured for

18 × 18-bit multiplier mode. Figure 4–30 shows the 9 × 9-bit multiplier

configuration of the DSP block.

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February 2005

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Digital Signal Processing Block

Figure 4–29. DSP Block Diagram for 18 × 18-Bit Configuration

Optional Serial Shift Register

Inputs from Previous

DSP Block

Multiplier Stage

Optional Stage Configurable

as Accumulator or Dynamic

Adder/Subtractor

Output Selection

Multiplexer

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

Adder/

Subtractor/

Accumulator

1

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

Summation

D

Q

ENA

CLRN

D

Q

Optional Output

Register Stage

Summation Stage

for Adding Four

ENA

CLRN

D

Q

Multipliers Together

ENA

CLRN

Adder/

Subtractor/

Accumulator

2

D

Q

ENA

CLRN

D

Q

Optional Serial

Shift Register

Outputs to

Optional Pipeline

Register Stage

ENA

Next DSP Block

in the Column

CLRN

D

Q

ENA

CLRN

Optional Input Register

Stage with Parallel Input or

Shift Register Configuration

to MultiTrack

Interconnect

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February 2005

Stratix GX Architecture

Figure 4–30. DSP Block Diagram for 9 × 9-Bit Configuration

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

Adder/

Subtractor/

1a

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

Summation

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

Adder/

Subtractor/

1b

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

Output

Selection

CLRN

D

ENA

Q

Multiplexer

D

ENA

Q

CLRN

D

Q

ENA

CLRN

D

Q

ENA

Adder/

Subtractor/

2a

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

Summation

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

Adder/

Subtractor/

2b

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

D

Q

ENA

CLRN

To MultiTrack

Interconnect

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February 2005

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Digital Signal Processing Block

The DSP block consists of the following elements:

■

Multiplier block

Adder/output block

Multiplier Block

The DSP block multiplier block consists of the input registers, a

multiplier, and pipeline register for pipelining multiply-accumulate and

multiply-add/subtract functions as shown in Figure 4–31.

Figure 4–31. Multiplier Sub-Block Within Stratix GX DSP Block

sign_a (1)

sign_b (1)

aclr[3..0]

clock[3..0]

ena[3..0]

shiftin A

shiftin B

D

Q

Data A

Result

to Adder

blocks

ENA

D

Q

ENA

CLRN

Optional

CLRN

Multiply-Accumulate

and Multiply-Add

Pipeline

D

Q

Data B

ENA

CLRN

shiftout B shiftout A

Note to Figure 4–31:

(1) These signals can be unregistered or registered once to match data path pipelines if required.

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Input Registers

A bank of optional input registers is located at the input of each multiplier

and multiplicand inputs to the multiplier. When these registers are

configured for parallel data inputs, they are driven by regular routing

resources. You can use a clock signal, asynchronous clear signal, and a

clock enable signal to independently control each set of A and B inputs for

each multiplier in the DSP block. You select these control signals from a

set of four different clock[3..0], aclr[3..0], and ena[3..0]

signals that drive the entire DSP block.

You can also configure the input registers for a shift register application.

In this case, the input registers feed the multiplier and drive two

dedicated shift output lines: shiftoutAand shiftoutB. The shift

outputs of one multiplier block directly feed the adjacent multiplier block

in the same DSP block (or the next DSP block) as shown in Figure 4–32, to

form a shift register chain. This chain can terminate in any block, that is,

you can create any length of shift register chain up to 224 registers. You

can use the input shift registers for FIR filter applications. One set of shift

inputs can provide data for a filter, and the other are coefficients that are

optionally loaded in serial or parallel. When implementing 9 × 9- and 18

× 18-bit multipliers, you do not need to implement external shift registers

in LAB LEs. You implement all the filter circuitry within the DSP block

and its routing resources, saving LE and general routing resources for

general logic. External registers are needed for shift register inputs when

using 36 × 36-bit multipliers.

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February 2005

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Digital Signal Processing Block

Figure 4–32. Multiplier Sub-Blocks Using Input Shift Register Connections

Note (1)

Data A

D

Q

ENA

A[n] × B[n]

D

Q

CLRN

ENA

Data B

D

Q

CLRN

ENA

CLRN

Data B

Data A

D

Q

ENA

A[n Ð 1] × B[n Ð 1]

D

Q

CLRN

ENA

D

CLRN

ENA

CLRN

Data A

Data B

D

Q

ENA

A[n Ð 2] × B[n Ð 2]

D

Q

CLRN

ENA

D

CLRN

ENA

CLRN

Note to Figure 4–32:

(1) Either Data A or Data B input can be set to a parallel input for constant coefficient multiplication.

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Table 4–13 shows the summary of input register modes for the DSP block.

Table 4–13. Input Register Modes

Register Input Mode

Parallel input

9 × 9

v

18 × 18

v

36 × 36

v

Shift register input

Multiplier

The multiplier supports 9 × 9-, 18 × 18-, or 36 × 36-bit multiplication. Each

DSP block supports eight possible 9 × 9-bit or smaller multipliers. There

are four multiplier blocks available for multipliers larger than 9 × 9 bits

but smaller than 18 × 18 bits. There is one multiplier block available for

multipliers larger than 18 × 18 bits but smaller than or equal to 36 × 36 bits.

The ability to have several small multipliers is useful in applications such

as video processing. Large multipliers greater than 18 × 18 bits are useful

for applications such as the mantissa multiplication of a single-precision

floating-point number.

The multiplier operands can be signed or unsigned numbers, where the

result is signed if either input is signed as shown in Table 4–14. The

sign_aand sign_bsignals provide dynamic control of each operand’s

representation: a logic 1 indicates the operand is a signed number, a logic

0 indicates the operand is an unsigned number. These sign signals affect

all multipliers and adders within a single DSP block and you can register

them to match the data path pipeline. The multipliers are full precision

(that is, 18 bits for the 18-bit multiply, 36-bits for the 36-bit multiply, and

so on), regardless of whether sign_aor sign_bset the operands as

signed or unsigned numbers.

Table 4–14. Multiplier Signed Representation

Data A

Data B

Result

Unsigned

Signed

Unsigned

Signed

Unsigned

Signed

Unsigned

Signed

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Digital Signal Processing Block

Pipeline/Post Multiply Register

The output of 9 × 9- or 18 × 18-bit multipliers can optionally feed a register

to pipeline multiply-accumulate and multiply-add/subtract functions.

For 36 × 36-bit multipliers, this register pipelines the multiplier function.

Adder/Output Blocks

The result of the multiplier sub-blocks are sent to the adder/output block

which consist of an adder/subtractor/accumulator unit, summation unit,

output select multiplexer, and output registers. The results are used to

configure the adder/output block as a pure output, accumulator, a simple

two-multiplier adder, four-multiplier adder, or final stage of the 36-bit

multiplier. You can configure the adder/output block to use output

registers in any mode, and must use output registers for the accumulator.

The system cannot use adder/output blocks independently of the

multiplier. Figure 4–33 shows the adder and output stages.

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February 2005

Stratix GX Architecture

Figure 4–33. Adder/Output Blocks

Note (1)

Accumulator Feedback

accum_sload0 (2)

Result A

overflow0

Adder/

Subtractor/

addnsub1 (2)

Accumulator1

Output Selection

Multiplexer

Result B

signa (2)

Summation

Output

Register Block

signb (2)

Result C

Adder/

Subtractor/

Accumulator2

addnsub3 (2)

overflow1

Result D

accum_sload1 (2)

Accumulator Feedback

Notes to Figure 4–33:

(1) Adder/output block shown in Figure 4–33 is in 18 × 18-bit mode. In 9 × 9-bit mode, there are four adder/subtractor

blocks and two summation blocks.

(2) These signals are either not registered, registered once, or registered twice to match the data path pipeline.

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Digital Signal Processing Block

Adder/Subtractor/Accumulator

The adder/subtractor/accumulator is the first level of the adder/output

block and can be used as an accumulator or as an adder/subtractor.

Adder/Subtractor

Each adder/subtractor/accumulator block can perform addition or

subtraction using the addnsubindependent control signal for each first-

level adder in 18 × 18-bit mode. There are two addnsub[1..0]signals

available in a DSP block for any configuration. For 9 × 9-bit mode, one

addnsub[1..0]signal controls the top two one-level adders and

another addnsub[1..0]signal controls the bottom two one-level

adders. A high addnsubsignal indicates addition, and a low signal

indicates subtraction. The addnsubcontrol signal can be unregistered or

registered once or twice when feeding the adder blocks to match data

path pipelines.

The signaand signbsignals serve the same function as the multiplier

block signaand signbsignals. The only difference is that these signals

can be registered up to two times. These signals are tied to the same

signaand signbsignals from the multiplier and must be connected to

the same clocks and control signals.

Accumulator

When configured for accumulation, the adder/output block output feeds

back to the accumulator as shown in Figure 4–33. The

accum_sload[1..0]signal synchronously loads the multiplier result

to the accumulator output. This signal can be unregistered or registered

once or twice. Additionally, the overflowsignal indicates the

accumulator has overflowed or underflowed in accumulation mode. This

signal is always registered and must be externally latched in LEs if the

design requires a latched overflowsignal.

Summation

The output of the adder/subtractor/accumulator block feeds to an

optional summation block. This block sums the outputs of the DSP block

multipliers. In 9 × 9-bit mode, there are two summation blocks providing

the sums of two sets of four 9 × 9-bit multipliers. In 18 × 18-bit mode, there

is one summation providing the sum of one set of four 18 × 18-bit

multipliers.

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Output Selection Multiplexer

The outputs from the various elements of the adder/output block are

routed through an output selection multiplexer. Based on the DSP block

operational mode and user settings, the multiplexer selects whether the

output from the multiplier, the adder/subtractor/accumulator, or

summation block feeds to the output.

Output Registers

Optional output registers for the DSP block outputs are controlled by four

sets of control signals: clock[3..0], aclr[3..0], and ena[3..0].

Output registers can be used in any mode.

Modes of Operation

The adder, subtractor, and accumulate functions of a DSP block have four

modes of operation:

■

Simple multiplier

Multiply-accumulator

Two-multipliers adder

Four-multipliers adder

1

Each DSP block can only support one mode. Mixed modes in the

same DSP block is not supported.

Simple Multiplier Mode

In simple multiplier mode, the DSP block drives the multiplier sub-block

result directly to the output with or without an output register. Up to four

18 × 18-bit multipliers or eight 9 × 9-bit multipliers can drive their results

directly out of one DSP block. See Figure 4–34.

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Figure 4–34. Simple Multiplier Mode

signa (1)

signb (1)

aclr

clock

ena

shiftin A

shiftin B

D

Q

Data A

Data Out

D

Q

ENA

D

Q

ENA

CLRN

D

Q

Data B

ENA

CLRN

shiftout B shiftout A

Note to Figure 4–34:

(1) These signals are not registered or registered once to match the data path pipeline.

DSP blocks can also implement one 36 × 36-bit multiplier in multiplier

mode. DSP blocks use four 18 × 18-bit multipliers combined with

dedicated adder and internal shift circuitry to achieve 36-bit

multiplication. The input shift register feature is not available for the

36 × 36-bit multiplier. In 36 × 36-bit mode, the device can use the register

that is normally a multiplier-result-output register as a pipeline stage for

the 36 × 36-bit multiplier. Figure 4–35 shows the 36 × 36-bit multiply

mode.

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Stratix GX Architecture

Figure 4–35. 36 × 36 Multiply Mode

signa (1)

signb (1)

aclr

clock

ena

A[17..0]

B[17..0]

D

Q

ENA

D

Q

ENA

CLRN

D

ENA

CLRN

A[35..18]

B[35..18]

D

Q

Data Out

D

Q

ENA

D

Q

ENA

36 × 36

Multiplier

Adder

CLRN

D

signa (2)

signb (2)

ENA

CLRN

A[35..18]

B[17..0]

D

Q

ENA

D

Q

ENA

CLRN

D

ENA

CLRN

A[17..0]

D

Q

ENA

D

Q

ENA

CLRN

B[35..18]

D

ENA

CLRN

Notes to Figure 4–35:

(1) These signals are not registered or registered once to match the pipeline.

(2) These signals are not registered, registered once, or registered twice for latency to match the pipeline.

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Digital Signal Processing Block

Multiply-Accumulator Mode

In multiply-accumulator mode (see Figure 4–36), the DSP block drives

multiplied results to the adder/subtractor/accumulator block configured

as an accumulator. You can implement one or two multiply-accumulators

up to 18 × 18 bits in one DSP block. The first and third multiplier sub-

blocks are unused in this mode, since only one multiplier can feed one of

two accumulators. The multiply-accumulator output can be up to 52

bits—a maximum of a 36-bit result with 16 bits of accumulation. The

accum_sloadand overflowsignals are only available in this mode.

The addnsubsignal can set the accumulator for decimation and the

overflowsignal indicates underflow condition.

Figure 4–36. Multiply-Accumulate Mode

signa (1)

signb (1)

aclr

clock

ena

Shiftin A

Shiftin B

D

Q

Data A

Data Out

overflow

D

Q

ENA

D

Q

ENA

Accumulator

ENA

CLRN

D

Q

Data B

ENA

CLRN

addnsub (2)

signa (2)

signb (2)

Shiftout B Shiftout A

accum_sload (2)

Notes to Figure 4–36:

(1) These signals are not registered or registered once to match the data path pipeline.

(2) These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.

Two-Multipliers Adder Mode

The two-multipliers adder mode uses the adder/subtractor/accumulator

block to add or subtract the outputs of the multiplier block, which is

useful for applications such as FFT functions and complex FIR filters. A

single DSP block can implement two sums or differences from two

18 × 18-bit multipliers each or four sums or differences from two 9 × 9-bit

multipliers each.

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You can use the two-multipliers adder mode for complex multiplications,

which are written as:

(a + jb) × (c + jd) = [(a × c) – (b × d)] + j × [(a × d) + (b × c)]

The two-multipliers adder mode allows a single DSP block to calculate

the real part [(a × c) – (b × d)] using one subtractor and the imaginary part

[(a × d) + (b × c)] using one adder, for data widths up to 18 bits. Two

complex multiplications are possible for data widths up to 9 bits using

four adder/subtractor/accumulator blocks. Figure 4–37 shows an 18-bit

two-multipliers adder.

Figure 4–37. Two-Multipliers Adder Mode Implementing Complex Multiply

DSP Block

18

A

36

18

C

B

37

Subtractor

(A × C) − (B × D)

(Real Part)

18

36

18

D

A

36

18

D

B

37

Adder

(A × D) + (B × C)

(Imaginary Part)

18

C

Four-Multipliers Adder Mode

In the four-multipliers adder mode, the DSP block adds the results of two

first -stage adder/subtractor blocks. One sum of four 18 × 18-bit

multipliers or two different sums of two sets of four 9 × 9-bit multipliers

can be implemented in a single DSP block. The product width for each

multiplier must be the same size. The four-multipliers adder mode is

useful for FIR filter applications. Figure 4–38 shows the four multipliers

adder mode.

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Figure 4–38. Four-Multipliers Adder Mode

signa (1)

signb (1)

aclr

clock

ena

shiftin A

shiftin B

D

Q

Data A

ENA

D

Q

ENA

CLRN

Adder/Subtractor

CLRN

D

Q

Data B

ENA

CLRN

D

Q

Data A

Data Out

D

Q

ENA

D

Q

ENA

addnsub1 (2)

signa (2)

signb (2)

ENA

CLRN

Summation

CLRN

addnsub3 (2)

D

Q

Data B

ENA

CLRN

D

Q

Data A

ENA

D

Q

ENA

CLRN

Adder/Subtractor

CLRN

D

Q

Data B

ENA

CLRN

D

Q

Data A

ENA

D

Q

ENA

CLRN

D

Q

Data B

ENA

CLRN

shiftout B shiftout A

Notes to Figure 4–38:

(1) These signals are not registered or registered once to match the data path pipeline.

(2) These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.

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Stratix GX Architecture

For FIR filters, the DSP block combines the four-multipliers adder mode

with the shift register inputs. One set of shift inputs contains the filter

data, while the other holds the coefficients loaded in serial or parallel. The

input shift register eliminates the need for shift registers external to the

DSP block (that is, implemented in LEs). This architecture simplifies filter

design since the DSP block implements all of the filter circuitry.

One DSP block can implement an entire 18-bit FIR filter with up to four

taps. For FIR filters larger than four taps, DSP blocks can be cascaded with

additional adder stages implemented in LEs.

Table 4–15 shows the different number of multipliers possible in each

DSP block mode according to size. These modes allow the DSP blocks to

implement numerous applications for DSP including FFTs, complex FIR,

FIR, and 2D FIR filters, equalizers, IIR, correlators, matrix multiplication

and many other functions.

Table 4–15. Multiplier Size & Configurations per DSP block

DSP Block Mode

9 × 9

18 × 18

36 × 36 (1)

Multiplier

Eight multipliers with

eight product outputs

Four multipliers with four One multiplier with one

product outputs

product output

–

Multiply-accumulator

Two-multipliers adder

Four-multipliers adder

Two multiply and

accumulate (52 bits)

Two multiply and

accumulate (52 bits)

Four sums of two

Two sums of two

–

multiplier products each multiplier products each

Two sums of four One sum of four multiplier

multiplier products each products each

Note to Table 4–15:

(1) The number of supported multiply functions shown is based on signed/signed or unsigned/unsigned

implementations.

DSP Block Interface

Stratix GX device DSP block outputs can cascade down within the same

DSP block column. Dedicated connections between DSP blocks provide

fast connections between the shift register inputs to cascade the shift

register chains. You can cascade DSP blocks for 9 × 9- or 18 × 18-bit FIR

filters larger than four taps, with additional adder stages implemented in

LEs. If the DSP block is configured as 36 × 36 bits, the adder, subtractor, or

accumulator stages are implemented in LEs. Each DSP block can route the

shift register chain out of the block to cascade two full columns of DSP

blocks.

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Digital Signal Processing Block

The DSP block is divided into eight block units that interface with eight

LAB rows on the left and right. Each block unit can be considered half of

an 18 × 18-bit multiplier sub-block with 18 inputs and 18 outputs. A local

interconnect region is associated with each DSP block. Like an LAB, this

interconnect region can be fed with 10 direct link interconnects from the

LAB to the left or right of the DSP block in the same row. All row and

column routing resources can access the DSP block’s local interconnect

region. The outputs also work similarly to LAB outputs as well. Nine

outputs from the DSP block can drive to the left LAB through direct link

interconnects and nine can drive to the right LAB though direct link

interconnects. All 18 outputs can drive to all types of row and column

routing. Outputs can drive right- or left-column routing. Figures 4–39

and 4–40 show the DSP block interfaces to LAB rows.

Figure 4–39. DSP Block Interconnect Interface

DSP Block

OA[17..0]

MultiTrack

Interconnect

A1[17..0]

OB[17..0]

B1[17..0]

OC[17..0]

A2[17..0]

OD[17..0]

B2[17..0]

OE[17..0]

A3[17..0]

OF[17..0]

B3[17..0]

OG[17..0]

A4[17..0]

OH[17..0]

B4[17..0]

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Stratix GX Architecture

Figure 4–40. DSP Block Interface to Interconnect

C4 and C8

Interconnects

Direct Link Interconnect

from Adjacent LAB

Nine Direct Link Outputs Direct Link Interconnect

to Adjacent LABs

from Adjacent LAB

R4 and R8 Interconnects

18

DSP Block

Row Structure

LAB

10

9

10

3

Control

[17..0]

18

[17..0]

Row Interface

Block

DSP Block to

18 Inputs per Row

18 Outputs per Row

LAB Row Interface

Block Interconnect Region

A bus of 18 control signals feeds the entire DSP block. These signals

include clock[0..3]clocks, aclr[0..3]asynchronous clears,

ena[1..4]clock enables, signa, signbsigned/unsigned control

signals, addnsub1and addnsub3addition and subtraction control

signals, and accum_sload[0..1]accumulator synchronous loads. The

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PLLs & Clock Networks

clock signals are routed from LAB row clocks and are generated from

specific LAB rows at the DSP block interface. The LAB row source for

control signals, data inputs, and outputs is shown in Table 4–16.

Table 4–16. DSP Block Signal Sources & Destinations

LAB Row at

Interface

Control Signals

Generated

Data Inputs

Data Outputs

1

2

signa

A1[17..0]

B1[17..0]

OA[17..0]

OB[17..0]

aclr0

accum_sload0

3

4

5

6

addnsub1

clock0

ena0

A2[17..0]

B2[17..0]

A3[17..0]

B3[17..0]

OC[17..0]

OD[17..0]

OE[17..0]

OF[17..0]

aclr1

clock1

ena1

aclr2

clock2

ena2

sign_b

clock3

ena3

7

8

clear3

accum_sload1

A4[17..0]

B4[17..0]

OG[17..0]

OH[17..0]

addnsub3

Stratix GX devices provide a hierarchical clock structure and multiple

PLLs with advanced features. The large number of clocking resources in

combination with the clock synthesis precision provided by enhanced

and fast PLLs provides a complete clock management solution.

Stratix GX devices contain up to four enhanced PLLs and up to four fast

PLLs. In addition, there are four receiver PLLs and one transmitter PLL

per transceiver block located on the right side of Stratix GX devices.

PLLs & Clock

Networks

Global & Hierarchical Clocking

Stratix GX devices provide 16 dedicated global clock networks,

16 regional clock networks (four per device quadrant), 8 dedicated fast

regional clock networks within EP1SGX10 and EP1SGX25, and 16

dedicated fast regional clock networks within EP1SGX40 devices.

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These clocks are organized into a hierarchical clock structure that allows

for up to 22 clocks per device region with low skew and delay. This

hierarchical clocking scheme provides up to 40 unique clock domains

within EP1SGX10 and EP1SGX25 devices, and 48 unique clock domains

within EP1SGX40 devices.

There are 12 dedicated clock pins (CLK[15..12], and CLK[7..0]) to

drive either the global or regional clock networks. Three clock pins drive

the top, bottom, and left side of the device. Enhanced and fast PLL

outputs as well as an I/O interface can also drive these global and

regional clock networks.

There are up to 20 recovered clocks (rxclkout[20..0]) and up to

5 transmitter clock outputs (coreclk_out) which can drive any of the

global clock networks (CLK[15..0]), as shown in Figure 4–41.

Global Clock Network

These clocks drive throughout the entire device, feeding all device

quadrants. The global clock networks can be used as clock sources for all

resources within the device IOEs, LEs, DSP blocks, and all memory

blocks. These resources can also be used for control signals, such as clock

enables and synchronous or asynchronous clears fed from the external

pin. The global clock networks can also be driven by internal logic for

internally generated global clocks and asynchronous clears, clock

enables, or other control signals with large fanout. Figure 4–41 shows the

12 dedicated CLKpins and the transceiver clocks driving global clock

networks.

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Figure 4–41. Global Clock Resources

CLK[15..12]

CLK[3..0]

Global Clock [15..0]

Transceiver

Clocks

CLK[7..4]

Regional Clock Network

There are four regional clock networks RCLK[3..0]within each

quadrant of the Stratix GX device that are driven by the same dedicated

CLK[7..0]and CLK[15..12]input pins, PLL outputs, or transceiver

clocks. The regional clock networks only pertain to the quadrant they

drive into. The regional clock networks provide the lowest clock delay

and skew for logic contained within a single quadrant. The CLKclock pins

symmetrically drive the RCLKnetworks within a particular quadrant, as

shown in Figure 4–42.

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Stratix GX Architecture

Figure 4–42. Regional Clocks

RCLK[15..14] RCLK[13..12]

CLK[15..12]

RCLK[1..0]

CLK[3..0]

RCLK[11..10]

Transceiver

Clocks

RCLK[3..2]

RCLK[9..8]

CLK[7..4]

Regional Clocks Only Drive a Device

Quadrant from Specified CLK Pins,

Recovered Clocks, or PLLs within

that Quadrant

RCLK[5..4]

RCLK[7..6]

Fast Regional Clock Network

In EP1SGX25 and EP1SGX10 devices, there are two fast regional clock

networks, FCLK[1..0], within each quadrant, fed by input pins (see

Figure 4–43). In EP1SGX40 devices, there are two fast regional clock

networks within each half-quadrant (see Figure 4–44). The FCLK[1..0]

clocks can also be used for high fanout control signals, such as

asynchronous clears, presets, clock enables, or protocol control signals

such as TRDYand IRDYfor PCI. Dual-purpose FCLKpins drive the fast

clock networks. All devices have eight FCLKpins to drive fast regional

clock networks. Any I/O pin can drive a clock or control signal onto any

fast regional clock network with the addition of a delay. The I/O

interconnect drives this signal.

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Figure 4–43. EP1SGX25 & EP1SGX10 Device Fast Clock Pin Connections to

Fast Regional Clocks

Fast Clock

[3..2]

[1..0]

FCLK[1..0]

[7..6]

[5..4]

Fast Clock

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Figure 4–44. EP1SGX40 Device Fast Regional Clock Pin Connections to Fast

Regional Clocks

Fast Clock

[3]

[2]

[1]

[0]

fclk[1..0]

[4]

[5]

[6]

[7]

Fast Clock

Combined Resources

Within each region, there are 22 distinct dedicated clocking resources

consisting of 16 global clock lines, 4 regional clock lines, and 2 fast

regional clock lines. Multiplexers are used with these clocks to form 8-bit

busses to drive LAB row clocks, column IOE clocks, or row IOE clocks.

Another multiplexer at the LAB level selects two of the eight row clocks

to feed the LE registers within the LAB. See Figure 4–45.

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Figure 4–45. Regional Clock Bus

Clocks Available

to a Quadrant

or Half-Quadrant

Vertical I/O Cell

IO_CLK[7..0]

Global Clock Network [15..0]

Regional Clock Network [3..0]

Clock [21:0]

Lab Row Clock [7..0]

Fast Regional Clock Network [1..0]

Horizontal I/O

Cell IO_CLK[7..0]

IOE clocks have horizontal and vertical block regions that are clocked by

eight I/O clock signals chosen from the 22-quadrant or half-quadrant

clock resources. Figures 4–46 and 4–47 show the quadrant and half-

quadrant relationship to the I/O clock regions, respectively. The vertical

regions (column pins) have less clock delay than the horizontal regions

(row pins).

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Stratix GX Architecture

Figure 4–46. EP1SGX25 & EP1SGX10 Device I/O Clock Groups

IO_CLKA[7:0]

IO_CLKB[7:0]

8

I/O Clock Regions

8

13

14

16

15

22 Clocks in

the Quadrant

22 Clocks in

the Quadrant

IO_CLKH[7:0]

8

IO_CLKG[7:0]

22 Clocks in

the Quadrant

22 Clocks in

the Quadrant

8

IO_CLKF[7:0]

IO_CLKE[7:0]

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Figure 4–47. EP1SGX40 Device I/O Clock Groups

IO_CLKA[7:0]

IO_CLKB[7:0]

IO_CLKC[7:0]

IO_CLKD[7:0]

8

I/O Clock Regions

8

13

IO_CLKP[7:0]

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

14

17

IO_CLKO[7:0]

IO_CLKN[7:0]

16

15

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

22 Clocks in the

Half-Quadrant

8

IO_CLKM[7:0]

8

IO_CLKL[7:0]

IO_CLKK[7:0]

IO_CLKJ[7:0]

IO_CLKI[7:0]

You can use the Quartus II software to control whether a clock input pin

is either global, regional, or fast regional. The Quartus II software

automatically selects the clocking resources if not specified.

Enhanced & Fast PLLs

Stratix GX devices provide robust clock management and synthesis using

up to four enhanced PLLs and four fast PLLs. These PLLs increase

performance and provide advanced clock interfacing and clock frequency

synthesis. With features such as clock switchover, spread spectrum

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clocking, programmable bandwidth, phase and delay control, and

dynamic PLL reconfiguration, the Stratix GX device’s enhanced PLLs

provide you with complete control of your clocks and system timing. The

fast PLLs provide general purpose clocking with multiplication and

phase shifting as well as high-speed outputs for high-speed differential

I/O support. Enhanced and fast PLLs work together with the Stratix GX

high-speed I/O and advanced clock architecture to provide significant

improvements in system performance and bandwidth.

The Quartus II software enables the PLLs and their features without

requiring any external devices. Table 4–17 shows which PLLs are

available for each Stratix GX device and their type. Table 4–18 shows the

enhanced PLL and fast PLL features in Stratix GX devices.

Table 4–17. Stratix GX Device PLL Availability

Fast PLLs

Enhanced PLLs

Device

1

2

3 (1) 4 (1)

7

8

9 (1) 10 (1) 5 (2) 6 (2) 11 (3) 12 (3)

EP1SGX10

EP1SGX25

EP1SGX40

v

Notes to Table 4–17:

(1) PLLs 3, 4, 9, and 10 are not available in Stratix GX devices. However, these PLLs are listed in Table 4–17 because

the Stratix GX PLL numbering scheme is consistent with Stratix devices.

(2) PLLs 5 and 6 each have eight single-ended outputs or four differential outputs.

(3) PLLs 11 and 12 each have one single-ended output.

Table 4–18. Stratix GX Enhanced PLL & Fast PLL Features (Part 1 of 2)

Notes (1)–(8)

Fast PLL

Feature

Enhanced PLL

Clock multiplication and division

Phase shift

m/ (n × post-scale counter) (1)

m/(post-scale counter) (2)

Down to 156.25-ps increments (3), Down to 125-ps increments (3), (4)

(4)

Delay shift

250-ps increments for ±3 ns

Clock switchover

v

PLL reconfiguration

Programmable bandwidth

Spread spectrum clocking

Programmable duty cycle

Number of internal clock outputs

v

3 (5)

6

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PLLs & Clock Networks

Table 4–18. Stratix GX Enhanced PLL & Fast PLL Features (Part 2 of 2)

Notes (1)–(8)

Fast PLL

Feature

Enhanced PLL

Number of external clock outputs

Four differential/eight singled-ended

(7)

or one single-ended (6)

Number of feedback clock inputs

4 (8)

Notes to Table 4–18:

(1) The maximum count value is 1024, with a 50% duty cycle setting on the counter. The maximum count value for

any other duty cycle setting is 512.

(2) For fast PLLs, m and post-scale counters range from 1 to 32.

(3) The smallest phase shift is determined by the VCO period divided by 8.

(4) For degree increments, Stratix GX devices can shift all output frequencies in increments of at least 45°. Smaller

degree increments are possible depending on the frequency and divide parameters.

(5) PLLs 7 and 8 have two output ports per PLL. PLLs 1 and 2 have three output ports per PLL.

(6) Every Stratix GX device has two enhanced PLLs (PLLs 5 and 6) with eight single-ended or four differential outputs

each. Two additional enhanced PLLs (PLLs 11 and 12) in EP1SGX40 devices each have one single-ended output.

(7) Fast PLLs can drive to any I/O pin as an external clock. For high-speed differential I/O pins, the device uses a data

channel to generate txclkout.

(8) Every Stratix GX device has two enhanced PLLs with one single-ended or differential external feedback input per

PLL.

Figure 4–48 shows a top-level diagram of the Stratix GX device and the

PLL floorplan.

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Figure 4–48. PLL Floorplan

CLK[15..12]

5 11

High-Speed

Transceivers

7

FPLL7CLK

inclk1

inclk2

1

2

inclk3

inclk4

inclk5

CLK[3..0]

PLLs

FPLL8CLK

8

6

12

CLK[7..4]

Figure 4–49 shows the global and regional clock connections from the

PLL outputs and the CLKpins.

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PLLs & Clock Networks

Figure 4–49. Global & Regional Clock Connections From Side Pins & Fast PLL Outputs Note (1)

RCLK1

RCLK0

G1

G3

G0

G2

FPLL7CLK

l0

l1

PLL 7

g0

CLK0

CLK1

l0

l1

PLL 1

PLL 2

g0

CLK2

CLK3

l0

2

l1

g0

l0

l1

PLL 8

g0

FPLL8CLK

RCLK2

RCLK3

Global

Clocks

Regional

Clocks

Note to Figure 4–49:

(1) PLLs 1,2 7, and 8 are fast PLLs. PLLs 7 and 8 do not drive global clocks.

Figure 4–50 shows the global and regional clocking from enhanced PLL

outputs and top CLKpins.

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Stratix GX Architecture

Figure 4–50. Global & Regional Clock Connections From Top Clock Pins & Enhanced PLL Outputs Note (1)

(1)

PLL5_OUT[3..0] CLK14

(2)

CLK12

(1)

PLL5_FB

CLK15

(2)

CLK13

E[0..3]

PLL 5

PLL 11

L0 L1 G0 G1 G2 G3

G0 G1 G2 G3 L0 L1

PLL11_OUT

RCLK10

RCLK11

Regional

Clocks

RCLK2

RCLK3

G12

G13

G14

G15

Global

Clocks

G4

G5

G6

G7

RCLK6

RCLK7

Regional

Clocks

RCLK12

RCLK13

PLL12_OUT

L0 L1 G0 G1 G2 G3

PLL 6

G0 G1 G2 G3 L0 L1

PLL 12

PLL6_OUT[3..0]

PLL6_FB

(1)

CLK6 (1)

CLK7 (2)

CLK4

CLK5

(2)

Note to Figure 4–50:

(1) PLLs 5, 6, 11, and 12 are enhanced PLLs.

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Enhanced PLLs

Stratix GX devices contain up to four enhanced PLLs with advanced

clock management features. Figure 4–51 shows a diagram of the

enhanced PLL.

Figure 4–51. Stratix GX Enhanced PLL

Programmable

Time Delay on

Each PLL Port

Post-Scale

Counters

VCO Phase Selection

Selectable at Each

PLL Output Port

From Adjacent PLL

/l0

/l1

Δt

Regional

Clocks

Clock

Switch-Over

Circuitry

Spread

Spectrum

Phase Frequency

Detector

CLK0

CLK1

4

8

/n

Δt

Charge

Pump

Loop

Filter

Global

Clocks

Δt

/g0

PFD

VCO

/g1

/g2

Δt

/m

(1)

I/O Buffers

(2)

/g3

Δt

to I/O or general

routing

Lock Detect

& Filter

FBIN

/e0

/e1

VCO Phase Selection

Affecting All Outputs

Δt

4

/e2

/e3

Δt

I/O Buffers (3)

Notes to Figure 4–51:

(1) External feedback is available in PLLs 5 and 6.

(2) This external output is available from the g0 counter for PLLs 11 and 12.

(3) These counters and external outputs are available in PLLs 5 and 6.

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Clock Multiplication & Division

Each Stratix GX device enhanced PLL provides clock synthesis for PLL

output ports using m/(n × post-scale counter) scaling factors. The input

clock is divided by a pre-scale divider, n, and is then multiplied by the m

feedback factor. The control loop drives the VCO to match f_IN× (m/n).

Each output port has a unique post-scale counter that divides down the

high-frequency VCO. For multiple PLL outputs with different

frequencies, the VCO is set to the least common multiple of the output

frequencies that meets its frequency specifications. Then, the post-scale

dividers scale down the output frequency for each output port. For

example, if output frequencies required from one PLL are 33 and 66 MHz,

set the VCO to 330 MHz (the least common multiple in the VCO’s range).

There is one pre-scale divider, n, and one multiply divider, m, per PLL,

with a range of 1 to 512 on each. There are two post-scale dividers (l) for

regional clock output ports, four counters (g) for global clock output

ports, and up to four counters (e) for external clock outputs, all ranging

from 1 to 512. The Quartus II software automatically chooses the

appropriate scaling factors according to the input frequency,

multiplication, and division values entered.

Clock Switchover

To effectively develop high-reliability network systems, clocking schemes

must support multiple clocks to provide redundancy. For this reason,

Stratix GX device enhanced PLLs support a flexible clock switchover

capability. Figure 4–52 shows a block diagram of the switchover

circuit.The switchover circuit is configurable, so you can define how to

implement it. Clock-sense circuitry automatically switches from the

primary to secondary clock for PLL reference when the primary clock

signal is not present.

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Figure 4–52. Clock Switchover Circuitry

CLK0_BAD

CLK1_BAD

Active Clock

SMCLKSW

Clock

Sense

Switch-Over

State Machine

CLKLOSS

CLKSWITCH

Δt

CLK0

CLK1

MUXOUT

PFD

n Counter

FBCLK

Enhanced PLL

Note to Figure 4–52:

(1) PFD: phase frequency detector.

There are two possible ways to use the clock switchover feature.

■

You can use automatic switchover circuitry for switching between

inputs of the same frequency. For example, in applications that

require a redundant clock with the same frequency as the primary

clock, the switchover state machine generates a signal that controls

the multiplexer select input on the bottom of Figure 4–52. In this case,

the secondary clock becomes the reference clock for the PLL.

You can use the clkswitchinput for user- or system-controlled

switch conditions. This is possible for same-frequency switchover or

to switch between inputs of different frequencies. For example, if

inclk0is 66 MHz and inclk1is 100 MHz, you must control the

switchover because the automatic clock-sense circuitry cannot

monitor primary and secondary clock frequencies with a frequency

difference of more than 20%. This feature is useful when clock

sources can originate from multiple cards on the backplane,

■

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requiring a system-controlled switchover between frequencies of

operation. You can use clkswitchtogether with the lock signal to

trigger the switch from a clock that is running but becomes unstable

and cannot be locked onto.

During switchover, the PLL VCO continues to run and either slows down

or speeds up, generating frequency drift on the PLL outputs. The clock

switchover transitions without any glitches. After the switch, there is a

finite resynchronization period to lock onto new clock as the VCO ramps

up. The exact amount of time it takes for the PLL to relock relates to the

PLL configuration and may be adjusted by using the programmable

bandwidth feature of the PLL. The preliminary specification for the

maximum time to relock is 100 µs.

f

For more information on clock switchover, see AN313: Implementing

Clock Switchover in Stratix & Stratix GX Devices.

PLL Reconfiguration

The PLL reconfiguration feature enables system logic to change

Stratix GX device enhanced PLL counters and delay elements without

reloading a Programmer Object File (.pof). This provides considerable

flexibility for frequency synthesis, allowing real-time PLL frequency and

output clock delay variation. You can sweep the PLL output frequencies

and clock delay in prototype environments. The PLL reconfiguration

feature can also dynamically or intelligently control system clock speeds

or t_COdelays in end systems.

Clock delay elements at each PLL output port implement variable delay.

Figure 4–53 shows a diagram of the overall dynamic PLL control feature

for the counters and the clock delay elements. The configuration time is

less than 20 μs for the enhanced PLL using a input shift clock rate of

25 MHz. The charge pump, loop filter components, and phase shifting

using VCO phase taps cannot be dynamically adjusted.

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Figure 4–53. Dynamically Programmable Counters & Delays in Stratix GX Device Enhanced PLLs

Counters and Clock

Delay Settings are

Programmable

All Output Counters and

Clock Delay Settings can

be Programmed Dynamically

Charge

Pump

Loop

Filter

f

÷n

Δt

÷g

Δt

PFD

VCO

REF

scandata

scanclk

÷m

Δt

scanaclr

÷l

Δt

÷e

Δt

PLL reconfiguration data is shifted into serial registers from the logic

array or external devices. The PLL input shift data uses a reference input

shift clock. Once the last bit of the serial chain is clocked in, the register

chain is synchronously loaded into the PLL configuration bits. The shift

circuitry also provides an asynchronous clear for the serial registers.

Programmable Bandwidth

You have advanced control of the PLL bandwidth using the

programmable control of the PLL loop characteristics, including loop

filter and charge pump. The PLL’s bandwidth is a measure of its ability to

track the input clock and jitter. A high-bandwidth PLL can quickly lock

onto a reference clock and react to any changes in the clock. It also allows

a wide band of input jitter spectrum to pass to the output. A

low-bandwidth PLL takes longer to lock, but it attenuates all

high-frequency jitter components. The Quartus II software can adjust

PLL characteristics to achieve the desired bandwidth. The programmable

bandwidth is tuned by varying the charge pump current, loop filter

resistor value, high frequency capacitor value, and m counter value. You

can manually adjust these values if desired. Bandwidth is programmable

from 150 kHz to 2 MHz.

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External Clock Outputs

Enhanced PLLs 5 and 6 each support up to eight single-ended clock

outputs (or four differential pairs). See Figure 4–54.

Figure 4–54. External Clock Outputs for PLLs 5 & 6

From IOE (1)

extclk0_a

(2)

e0 Counter

extclk0_b

extclk1_a

From IOE (1)

e1 Counter

extclk1_b

extclk2_a

From IOE (1)

4

e2 Counter

extclk2_b

extclk3_a

From IOE (1)

e3 Counter

extclk3_b

From IOE (1)

Notes to Figure 4–54:

(1) Each external clock output pin can be used as a general purpose output pin from

the logic array. These pins are multiplexed with IOE outputs.

(2) Two single-ended outputs are possible per output counter—either two outputs of

the same frequency and phase or one shifted 180°.

Any of the four external output counters can drive the single-ended or

differential clock outputs for PLLs 5 and 6. This means one counter or

frequency can drive all output pins available from PLL 5 or PLL 6. Each

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pair of output pins (four pins total) has dedicated VCCand GNDpins to

reduce the output clock’s overall jitter by providing improved isolation

from switching I/O pins.

For PLLs 5 and 6, each pin of a single-ended output pair can either be in

phase or 180° out of phase. The clock output pin pairs support the same

I/O standards as standard output pins (in the top and bottom banks) as

well as LVDS, LVPECL, 3.3-V PCML, HyperTransport technology,

differential HSTL, and differential SSTL. Table 4–19 shows which I/O

standards the enhanced PLL clock pins support. When in single-ended or

differential mode, the two outputs operate off the same power supply.

Both outputs use the same standards in single-ended mode to maintain

performance. You can also use the external clock output pins as user

output pins if external enhanced PLL clocking is not needed.

Table 4–19. I/O Standards Supported for Enhanced PLL Pins (Part 1 of 2)

Input

Output

I/O Standard

INCLK

FBIN

PLLENABLE

EXTCLK

LVTTL

v

LVCMOS

2.5 V

1.8 V

1.5 V

3.3-V PCI

3.3-V PCI-X

LVPECL

3.3-V PCML

LVDS

HyperTransport technology

Differential HSTL

Differential SSTL

3.3-V GTL

v

3.3-V GTL+

1.5-V HSTL class I

1.5-V HSTL class II

SSTL-18 class I

SSTL-18 class II

SSTL-2 class I

SSTL-2 class II

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Table 4–19. I/O Standards Supported for Enhanced PLL Pins (Part 2 of 2)

Input

Output

I/O Standard

INCLK

FBIN

PLLENABLE

EXTCLK

SSTL-3 class I

SSTL-3 class II

AGP (1× and 2×)

CTT

v

Enhanced PLLs 11 and 12 support one single-ended output each (see

Figure 4–55). These outputs do not have their own VCCand GNDsignals.

Therefore, to minimize jitter, do not place switching I/O pins next to this

output pin.

Figure 4–55. External Clock Outputs for Enhanced PLLs 11 & 12

g0

Counter

CLK13n, I/O, PLL11_OUT

or CLK6n, I/O, PLL12_OUT (1)

From Internal

Logic or IOE

Note to Figure 4–55:

(1) For PLL 11, this pin is CLK13n; for PLL 12 this pin is CLK7n.

Stratix GX devices can drive any enhanced PLL driven through the global

clock or regional clock network to any general I/O pin as an external

output clock. The jitter on the output clock is not guaranteed for these

cases.

Clock Feedback

The following four feedback modes in Stratix GX device enhanced PLLs

allow multiplication and/or phase and delay shifting:

■

Zero delay buffer: The external clock output pin is phase-aligned

with the clock input pin for zero delay.

■

External feedback: The external feedback input pin, FBIN, is

phase-aligned with the clock input, CLK, pin. Aligning these clocks

allows you to remove clock delay and skew between devices. This

mode is only possible for PLLs 5 and 6. PLLs 5 and 6 each support

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feedback for one of the dedicated external outputs, either one

single-ended or one differential pair. In this mode, one e counter

feeds back to the PLL FBINinput, becoming part of the feedback

loop.

■

Normal mode: If an internal clock is used in this mode, it is

phase-aligned to the input clock pin. The external clock output pin

has a phase delay relative to the clock input pin if connected in this

mode. You define which internal clock output from the PLL should

be phase-aligned to the internal clock pin.

No compensation: In this mode, the PLL does not compensate for

any clock networks or external clock outputs.

Phase & Delay Shifting

Stratix GX device enhanced PLLs provide advanced programmable

phase and clock delay shifting. For phase shifting, you can specify a

phase shift (in degrees or time units) for each PLL clock output port or for

all outputs together in one shift. Phase-shifting values in time units are

allowed with a resolution range of 160 to 420 ps. This resolution is a

function of frequency input and the multiplication and division factors.

In other words, it is a function of the VCO period equal to one-eighth of

the VCO period. Each clock output counter can choose a different phase

of the VCO period from up to eight taps. You can use this clock output

counter along with an initial setting on the post-scale counter to achieve

a phase-shift range for the entire period of the output clock. The phase tap

feedback to the m counter can shift all outputs to a single phase or delay.

The Quartus II software automatically sets the phase taps and counter

settings according to the phase shift entered.

In addition to the phase-shift feature, the fine tune clock delay shift

feature provides advanced time delay shift control on each of the four

PLL outputs. Each PLL output shifts in 250-ps increments for a range of

–3.0 ns to +3.0 ns between any two outputs using discrete delay elements.

Total delay shift between any two PLL outputs must be less than 3 ns. For

example, shifts on outputs of –1 and +2 ns is allowed, but not –1 and

+2.5 ns. There is some delay variation due to process, voltage, and

temperature. Only the clock delay shift blocks can be controlled during

system operation for dynamic clock delay control.

Spread-Spectrum Clocking

The Stratix GX device’s enhanced PLLs use spread-spectrum technology

to reduce electromagnetic interference generation from a system by

distributing the energy over a broader frequency range. The enhanced

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PLL typically provides 0.5% down spread modulation using a triangular

profile. The modulation frequency is programmable. Enabling spread

spectrum for a PLL affects all of its outputs.

Lock Detect

The lock output indicates that there is a stable clock output signal in

phase with the reference clock. Without any additional circuitry, the lock

signal may toggle as the PLL begins tracking the reference clock. You may

need to gate the lock signal for use as a system control. The lock signal

from the locked port can drive the logic array or an output pin.

Whenever the PLL loses lock for any reason (be it excessive inclk jitter,

clock switchover, PLL reconfiguration, power supply noise etc.), the PLL

must be reset with the aresetsignal for correct phase shift operation. If

the phase relationship between the input clock versus output clock, and

between different output clocks from the PLL is not important in the

design, then the PLL need not be reset.

f

See the Stratix GX FPGA Errata Sheet for more information on

implementing the gated lock signal in the design.

Programmable Duty Cycle

The programmable duty cycle allows enhanced PLLs to generate clock

outputs with a variable duty cycle. This feature is supported on each

enhanced PLL post-scale counter (g0..g3, l0..l3, e0..e3). The duty cycle

setting is achieved by a low and high time count setting for the post-scale

dividers. The Quartus II software uses the frequency input and the

required multiply or divide rate to determine the duty cycle choices.

Advanced Clear & Enable Control

There are several control signals for clearing and enabling PLLs and their

outputs. You can use these signals to control PLL resynchronization and

gate PLL output clocks for low-power applications.

The pllenablepin is a dedicated pin that enables/disables PLLs. When

the pllenablepin is low, the clock output ports are driven by GNDand

all the PLLs go out of lock. When the pllenablepin goes high again, the

PLLs relock and resynchronize to the input clocks. You can choose which

PLLs are controlled by the pllenablesignal by connecting the

pllenableinput port of the altpllmegafunction to the common

pllenableinput pin.

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The aresetsignals are reset/resynchronization inputs for each PLL. The

areset signal should be asserted every time the PLL loses lock to

guarantee correct phase relationship between the PLL output clocks.

Users should include the areset signal in designs if any of the following

conditions are true:

■

PLL Reconfiguration or Clock switchover enables in the design.

Phase relationships between output clocks need to be maintained

after a loss of lock condition

The device input pins or logic elements (LEs) can drive these input

signals. When driven high, the PLL counters resets, clearing the PLL

output and placing the PLL out of lock. The VCO sets back to its nominal

setting (~700 MHz). When driven low again, the PLL resynchronizes to

its input as it relocks. If the target VCO frequency is below this nominal

frequency, then the output frequency starts at a higher value than desired

as the PLL locks. If the system cannot tolerate this, the clkenasignal can

disable the output clocks until the PLL locks.

The pfdenasignals control the phase frequency detector (PFD) output

with a programmable gate. If you disable the PFD, the VCO operates at

its last set value of control voltage and frequency with some long-term

drift to a lower frequency. The system continues running when the PLL

goes out of lock or the input clock is disabled. By maintaining the last

locked frequency, the system has time to store its current settings before

shutting down. You can either use your own control signal or a clkloss

status signal to trigger pfdena.

The clkenasignals control the enhanced PLL regional and global

outputs. Each regional and global output port has its own clkenasignal.

The clkenasignals synchronously disable or enable the clock at the PLL

output port by gating the outputs of the g and l counters. The clkena

signals are registered on the falling edge of the counter output clock to

enable or disable the clock without glitches. Figure 4–56 shows the

waveform example for a PLL clock port enable. The PLL can remain

locked independent of the clkenasignals since the loop-related counters

are not affected. This feature is useful for applications that require a low

power or sleep mode. Upon re-enabling, the PLL does not need a

resynchronization or relock period. The clkenasignal can also disable

clock outputs if the system is not tolerant to frequency overshoot during

resynchronization.

The extclkenasignals work in the same way as the clkenasignals, but

they control the external clock output counters (e0, e1, e2, and e3). Upon

re-enabling, the PLL does not need a resynchronization or relock period

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unless the PLL is using external feedback mode. In order to lock in

external feedback mode, the external output must drive the board trace

back to the FBINpin.

Figure 4–56. extclkena Signals

COUNTER

OUTPUT

CLKENA

CLKOUT

Fast PLLs

Stratix GX devices contain up to four fast PLLs with high-speed serial

interfacing ability, along with general-purpose features. Figure 4–57

shows a diagram of the fast PLL.

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Figure 4–57. Stratix GX Device Fast PLL

Post-Scale

Counters

diffioclk1 (2)

Global or

÷l0

regional clock

txload_en

VCO Phase Selection

Selectable at each PLL

Output Port

Phase

Frequency

Detector

rxload_en

÷l1

Global or

regional clock

Global or

regional clock (1)

diffioclk2 (2)

8

Charge

Pump

Loop

Filter

Global or

regional clock

÷g0

PFD

VCO

Clock

Input

m÷

Notes to Figure 4–57:

(1) In high-speed differential I/O support mode, this high-speed PLL clock feeds the SERDES. Stratix GX devices only

support one rate of data transfer per fast PLL in high-speed differential I/O support mode.

(2) This signal is a high-speed differential I/O support SERDES control signal.

Clock Multiplication & Division

The Stratix GX device’s fast PLLs provide clock synthesis for PLL output

ports using m/(post scaler) scaling factors. The input clock is multiplied

by the m feedback factor. Each output port has a unique post scale counter

to divide down the high-frequency VCO. There is one multiply divider,

m, per fast PLL with a range of 1 to 32. There are two post scale L dividers

for regional and/or LVDS interface clocks, and g0 counter for global clock

output port; all range from 1 to 32.

In the case of a high-speed differential interface, you can set the output

counter to 1 to allow the high-speed VCO frequency to drive the SERDES.

External Clock Outputs

Each fast PLL supports differential or single-ended outputs for

source-synchronous transmitters or for general-purpose external clocks.

There are no dedicated external clock output pins. Any I/O pin can be

driven by the fast PLL global or regional outputs as an external output

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pin. The I/O standards supported by any particular bank determines

what standards are possible for an external clock output driven by the fast

PLL in that bank.

Table 4–20 shows the I/O standards supported by fast PLL input pins.

Table 4–20. Fast PLL Port Input Pin I/O Standards

Input

I/O Standard

INCLK

PLLENABLE

LVTTL

v

LVCMOS

2.5 V

1.8 V

1.5 V

3.3-V PCI

3.3-V PCI-X

LVPECL

v

3.3-V PCML

LVDS

HyperTransport technology

Differential HSTL

Differential SSTL

3.3-V GTL

v

3.3-V GTL+

1.5V HSTL class I

1.5V HSTL class II

SSTL-18 class I

SSTL-18 class II

SSTL-2 class I

SSTL-2 class II

SSTL-3 class I

SSTL-3 class II

AGP (1× and 2×)

CTT

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Phase Shifting

Stratix GX device fast PLLs have advanced clock shift capability that

enables programmable phase shifts. You can enter a phase shift (in

degrees or time units) for each PLL clock output port or for all outputs

together in one shift. You can perform phase shifting in time units with a

resolution range of 150 to 400 ps. This resolution is a function of the VCO

period.

Control Signals

The fast PLL has the same lockoutput, pllenableinput, and areset

input control signals as the enhanced PLL.

For more information on high-speed differential I/O support, see the

High-Speed Source-Synchronous Differential I/O Interfaces in Stratix GX

Devices chapter of the Stratix GX Device Handbook, Volume 2.

IOEs provide many features, including:

I/O Structure

■

Dedicated differential and single-ended I/O buffers

3.3-V, 64-bit, 66-MHz PCI compliance

3.3-V, 64-bit, 133-MHz PCI-X 1.0 compliance

Joint Test Action Group (JTAG) boundary-scan test (BST) support

Differential on-chip termination for LVDS I/O standard

Programmable pull-up during configuration

Output drive strength control

Slew-rate control

Tri-state buffers

Bus-hold circuitry

Programmable pull-up resistors

Programmable input and output delays

Open-drain outputs

DQ and DQS I/O pins

Double-data rate (DDR) Registers

The IOE in Stratix GX devices contains a bidirectional I/O buffer, six

registers, and a latch for a complete embedded bidirectional single data

rate or DDR transfer. Figure 4–58 shows the Stratix GX IOE structure. The

IOE contains two input registers (plus a latch), two output registers, and

two output enable registers. The design can use both input registers and

the latch to capture DDR input and both output registers to drive DDR

outputs. Additionally, the design can use the output enable (OE) register

for fast clock-to-output enable timing. The negative edge-clocked OE

register is used for DDR SDRAM interfacing. The Quartus II software

automatically duplicates a single OE register that controls multiple

output or bidirectional pins.

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Figure 4–58. Stratix GX IOE Structure

Logic Array

OE Register

D

Q

OE

OE Register

D

Q

Output Register

D

Q

Output A

CLK

Output Register

D

Q

Output B

Input Register

D

Q

Input A

Input B

Input Latch

Input Register

D

Q

D

Q

ENA

The IOEs are located in I/O blocks around the periphery of the Stratix GX

device. There are up to four IOEs per row I/O block and six IOEs per

column I/O block. The row I/O blocks drive row, column, or direct link

interconnects. The column I/O blocks drive column interconnects.

Figure 4–59 shows how a row I/O block connects to the logic array.

Figure 4–60 shows how a column I/O block connects to the logic array.

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Figure 4–59. Row I/O Block Connection to the Interconnect

R4, R8 & R24

C4, C8 & C16

I/O Interconnect

Interconnects

I/O Block Local

Interconnect

16 Control Signals

from I/O Interconnect (1)

16

28 Data & Control

Signals from

Logic Array (2)

28

LAB

Horizontal

I/O Block

io_dataouta[3..0]

io_dataoutb[3..0]

Direct Link

Interconnect

to Adjacent LAB

Horizontal I/O

Block Contains

up to Four IOEs

io_clk[7:0]

LAB Local

Interconnect

Notes to Figure 4–59:

(1) The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],

four clocks io_clk[3..0], and four clear signals io_bclr[3..0].

(2) The 28 data and control signals consist of eight data out lines: four lines each for DDR applications

io_dataouta[3..0]and io_dataoutb[3..0], four output enables io_coe[3..0], four input clock enables

io_cce_in[3..0], four output clock enables io_cce_out[3..0], four clocks io_cclk[3..0], and four clear

signals io_cclr[3..0].

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Figure 4–60. Column I/O Block Connection to the Interconnect

42 Data &

Control Signals

from Logic Array (2)

Vertical I/O

Block Contains

up to Six IOEs

Vertical I/O Block

16 Control

Signals from I/O

Interconnect (1)

16

42

io_clk[7..0]

IO_datain[3:0]

I/O Block

Local Interconnect

I/O Interconnect

R4, R8 & R24

Interconnects

LAB

LAB Local

Interconnect

C4, C8 & C16

Interconnects

Notes to Figure 4–60:

(1) The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],

four clocks io_bclk[3..0], and four clear signals io_bclr[3..0].

(2) The 42 data and control signals consist of 12 data out lines; six lines each for DDR applications

io_dataouta[5..0]and io_dataoutb[5..0], six output enables io_coe[5..0], six input clock enables

io_cce_in[5..0], six output clock enables io_cce_out[5..0], six clocks io_cclk[5..0], and six clear

signals io_cclr[5..0].

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

Stratix GX devices have an I/O interconnect similar to the R4 and C4

interconnect to drive high-fanout signals to and from the I/O blocks.

There are 16 signals that drive into the I/O blocks composed of four

output enables io_boe[3..0], four clock enables io_bce[3..0], four

clocks io_bclk[3..0], and four clear signals io_bclr[3..0]. The

pin’s datainsignals can drive the IO interconnect, which in turn drives

the logic array or other I/O blocks. In addition, the control and data

signals can be driven from the logic array, providing a slower but more

flexible routing resource. The row or column IOE clocks, io_clk[7..0],

provide a dedicated routing resource for low-skew, high-speed clocks.

I/O clocks are generated from regional, global, or fast regional clocks (see

“PLLs & Clock Networks” on page 4–68). Figure 4–61 illustrates the

signal paths through the I/O block.

Figure 4–61. Signal Path Through the I/O Block

Row or Column

io_clk[7..0]

io_boe[3..0]

To Other

IOEs

io_bce[3..0]

From I/O

Interconnect

io_bclk[3..0]

io_bclr[3..0]

io_datain0

To Logic

Array

io_datain1

oe

ce_in

ce_out

aclr/preset

sclr

io_coe

io_cce_in

io_cce_out

Control

Signal

Selection

IOE

clk_in

From Logic

Array

io_cclr

io_cclk

clk_out

io_dataout0

io_dataout1

Each IOE contains its own control signal selection for the following

control signals: oe, ce_in, ce_out, aclr/preset, sclr/preset,

clk_in, and clk_out. Figure 4–62 illustrates the control signal

selection.

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February 2005

Stratix GX Architecture

Figure 4–62. Control Signal Selection per IOE

io_bclk[3..0]

io_bce[3..0]

io_bclr[3..0]

io_boe[3..0]

Dedicated I/O

Clock [7..0]

I/O Interconnect

[15..0]

io_coe

Local

Interconnect

io_cclr

Local

Interconnect

io_cce_out

Local

Interconnect

io_cce_in

io_cclk

Local

Interconnect

ce_out

clk_out

sclr/preset

Local

Interconnect

clk_in

ce_in

aclr/preset

oe

In normal bidirectional operation, the input register can be used for input

data requiring fast setup times. The input register can have its own clock

input and clock enable separate from the OE and output registers. The

output register can be used for data requiring fast clock-to-output

performance. The OE register can be used for fast clock-to-output enable

timing. The OE and output register share the same clock source and the

same clock enable source from local interconnect in the associated LAB,

dedicated I/O clocks, and the column and row interconnects. Figure 4–63

shows the IOE in bidirectional configuration.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

Figure 4–63. Stratix GX IOE in Bidirectional I/O Configuration

Note (1)

Column or Row

Interconnect

ioe_clk[7..0]

I/O Interconnect

[15..0]

OE

OE Register

Output

Delay

D

Q

t

ZX

clkout

ENA

CLRN/PRN

OE Register

t

Delay

Output

Enable Clock

Enable Delay

CO

ce_out

V

CCIO

Optional

PCI Clamp

Output Clock

Enable Delay

V

CCIO

Programmable

Pull-Up

Resistor

aclr/prn

Chip-Wide Reset

Output Register

Logic Array

to Output

Register Delay

Output

Pin Delay

D

Q

Drive Strength Control

Open-Drain Output

Slew Control

sclr/preset

ENA

CLRN/PRN

Input Pin to

Logic Array Delay

Bus-Hold

Circuit

Input Pin to

Input Register Delay

Input Register

D

Q

clkin

ce_in

Input Clock

Enable Delay

ENA

CLRN/PRN

Note to Figure 4–63:

(1) All input signals to the IOE can be inverted at the IOE.

The Stratix GX device IOE includes programmable delays that can be

activated to ensure zero hold times, input IOE register-to-logic array

register transfers, or logic array-to-output IOE register transfers.

A path in which a pin directly drives a register may require the delay to

ensure zero hold time, whereas a path in which a pin drives a register

through combinatorial logic may not require the delay. Programmable

delays exist for decreasing input-pin-to-logic-array and IOE input

register delays. The Quartus II Compiler can program these delays to

automatically minimize setup time while providing a zero hold time.

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February 2005

Stratix GX Architecture

Programmable delays can increase the register-to-pin delays for output

and/or output enable registers. A programmable delay exists to increase

the t_ZXdelay to the output pin, which is required for ZBT interfaces.

Table 4–21 shows the programmable delays for Stratix GX devices.

Table 4–21. Stratix GX Programmable Delay Chain

Programmable Delays

Quartus II Logic Option

Input pin to logic array delay

Input pin to input register delay

Output pin delay

Decrease input delay to internal cells

Decrease input delay to input register

Increase delay to output pin

Output enable register t_COdelay

Output t_ZXdelay

Increase delay to output enable pin

Increase t_ZXdelay to output pin

Increase output clock enable delay

Increase input clock enable delay

Output clock enable delay

Input clock enable delay

Logic array to output register delay Decrease input delay to output register

Output enable clock enable delay Increase output enable clock enable delay

The IOE registers in Stratix GX devices share the same source for clear or

preset. You can program preset or clear for each individual IOE. You can

also program the registers to power up high or low after configuration is

complete. If programmed to power up low, an asynchronous clear can

control the registers. If programmed to power up high, an asynchronous

preset can control the registers. This feature prevents the inadvertent

activation of another device’s active-low input upon power-up. If one

register in an IOE uses a preset or clear signal then all registers in the IOE

must use that same signal if they require preset or clear. Additionally, a

synchronous reset signal is available for the IOE registers.

Double-Data Rate I/O Pins

Stratix GX devices have six registers in the IOE, which support DDR

interfacing by clocking data on both positive and negative clock edges.

The IOEs in Stratix GX devices support DDR inputs, DDR outputs, and

bidirectional DDR modes.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

When using the IOE for DDR inputs, the two input registers clock double

rate input data on alternating edges. An input latch is also used within the

IOE for DDR input acquisition. The latch holds the data that is present

during the clock high times. This allows both bits of data to be

synchronous with the same clock edge (either rising or falling).

Figure 4–64 shows an IOE configured for DDR input. Figure 4–65 shows

the DDR input timing diagram.

Figure 4–64. Stratix GX IOE in DDR Input I/O Configuration

Note (1)

VCCIO

Column or Row

Interconnect

ioe_clk[7..0]

(1)

Optional

To DQS Local

Bus (3)

PCI Clamp

I/O Interconnect DQS Local

[15..0] Bus (1), (2)

(1)

VCCIO

Programmable

Pull-Up

Resistor

Input Pin to

Input Register Delay

sclr

Input Register

D

Q

clkin

ENA

CLRN/PRN

Output Clock

Enable Delay

Bus-Hold

Circuit

aclr/prn

Chip-Wide Reset

Latch

D Q

Input Register

D

Q

ENA

CLRN/PRN

Notes to Figure 4–64:

(1) All input signals to the IOE can be inverted at the IOE.

(2) This signal connection is only allowed on dedicated DQ function pins.

(3) This signal is for dedicated DQS function pins only.

4–104

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February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Figure 4–65. Input Timing Diagram in DDR Mode

Data at

input pin

A0 B1 A1 B2 A2 B3 A3 B4

CLK

A'

A1

B1

A2

B2

A3

B3

Input To

Logic Array

B'

When using the IOE for DDR outputs, the two output registers are

configured to clock two data paths from LEs on rising clock edges. These

output registers are multiplexed by the clock to drive the output pin at a

×2 rate. One output register clocks the first bit out on the clock high time,

while the other output register clocks the second bit out on the clock low

time. Figure 4–66 shows the IOE configured for DDR output. Figure 4–67

shows the DDR output timing diagram.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

Figure 4–66. Stratix GX IOE in DDR Output I/O Configuration

Notes (1), (2)

Column or Row

Interconnect

IOE_CLK[7..0]

I/O Interconnect

[15..0]

OE Register

D

Q

Output

Delay

t

ZX

clkout

ENA

CLRN/PRN

OE Register

Delay

Output

Enable Clock

Enable Delay

t

CO

Output Clock

Enable Delay

aclr/prn

V

CCIO

Optional

PCI Clamp

Chip-Wide Reset

OE Register

V

CCIO

D

Q

Programmable

Pull-Up

Resistor

sclr

Used for

DDR SDRAM

ENA

CLRN/PRN

Output Register

Logic Array

to Output

D

Q

Register Delay

Output

Pin Delay

clk

ENA

CLRN/PRN

Drive Strength Control

Open-Drain Output

Slew Control

Output Register

Logic Array

to Output

Register Delay

D

Q

Bus-Hold

Circuit

ENA

CLRN/PRN

Notes to Figure 4–66:

(1) All input signals to the IOE can be inverted at the IOE.

(2) The tristate is by default active high. It can, however, be designed to be active low.

4–106

Altera Corporation

February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Figure 4–67. Output Timing Diagram in DDR Mode

CLK

A1

B1

A2

B2

A3

B3

A4

B4

A

B

From Internal

Registers

B1 A1 B2 A2 B3 A3

DDR output

The Stratix GX IOE operates in bidirectional DDR mode by combining the

DDR input and DDR output configurations. Stratix GX device I/O pins

transfer data on a DDR bidirectional bus to support DDR SDRAM. The

negative-edge-clocked OE register holds the OE signal inactive until the

falling edge of the clock. This is done to meet DDR SDRAM timing

requirements.

External RAM Interfacing

Stratix GX devices support DDR SDRAM at up to 200 MHz (400-Mbps

data rate) through dedicated phase-shift circuitry, QDR and QDRII

SRAM interfaces up to 167 MHz, and ZBT SRAM interfaces up to 200

MHz. Stratix GX devices also provide preliminary support for reduced

latency DRAM II (RLDRAM II) at rates up to 200 MHz through the

dedicated phase-shift circuitry.

1

In addition to the required signals for external memory

interfacing, Stratix GX devices offer the optional clock enable

signal. By default the Quartus II software sets the clock enable

signal high, which tells the output register to update with new

values. The output registers hold their own values if the design

sets the clock enable signal low. See Figure 4–63.

f

To find out more about the DDR SDRAM specification, see the JEDEC

web site (www.jedec.org). For information on memory controller

megafunctions for Stratix GX devices, see the Altera web site

(www.altera.com). See AN 342: Interfacing DDR SDRAM with Stratix &

Stratix GX Devices for more information on DDR SDRAM interface in

Stratix GX. Also see AN 349: QDR SRAM Controller Reference Design for

Stratix & Stratix GX Devices and AN 329: ZBT SRAM Controller Reference

Design for Stratix & Stratix GX Devices.

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February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

Table 4–22 shows the performance specification for DDR SDRAM,

RLDRAM II, QDR SRAM, QDRII SRAM, and ZBT SRAM interfaces in

EP1SGX10 through EP1SGX40 devices. The DDR SDRAM and QDR

SRAM numbers in Table 4–22 have been verified with hardware

characterization with third-party DDR SDRAM and QDR SRAM devices

over temperature and voltage extremes.

Table 4–22. External RAM Support in EP1SGX10 Through EP1SGX40 Devices

Maximum Clock Rate (MHz)

-7 Speed

DDR Memory Type

I/O Standard

-5 Speed Grade -6 Speed Grade

Grade

DDR SDRAM (1), (2)

SSTL-2

200

150

167

133

DDR SDRAM - side banks (2), (3),

SSTL-2

(4)

RLDRAM II (4)

QDR SRAM (6)

QDRII SRAM (6)

ZBT SRAM (7)

1.8-V HSTL

1.5-V HSTL

LVTTL

200

167

200

(5)

167

200

133

167

Notes to Table 4–22:

(1) These maximum clock rates apply if the Stratix GX device uses DQS phase-shift circuitry to interface with DDR

SDRAM. DQS phase-shift circuitry is only available in the top and bottom I/O banks (I/O banks 3, 4, 7, and 8).

(2) For more information on DDR SDRAM, see AN 342: Interfacing DDR SDRAM with Stratix & Stratix GX Devices.

(3) DDR SDRAM is supported on the Stratix GX device side I/O banks (I/O banks 1, 2, 5, and 6) without dedicated

DQS phase-shift circuitry. The read DQS signal is ignored in this mode.

(4) These performance specifications are preliminary.

(5) This device does not support RLDRAM II.

(6) For more information on QDR or QDRII SRAM, see AN 349: QDR SRAM Controller Reference Design for Stratix &

Stratix GX Devices.

(7) For more information on ZBT SRAM, see AN 329: ZBT SRAM Controller Reference Design for Stratix & Stratix GX

Devices.

In addition to six I/O registers and one input latch in the IOE for

interfacing to these high-speed memory interfaces, Stratix GX devices

also have dedicated circuitry for interfacing with DDR SDRAM. In every

Stratix GX device, the I/O banks at the top (I/O banks 3 and 4) and

bottom (I/O banks 7 and 8) of the device support DDR SDRAM up to 200

MHz. These pins support DQS signals with DQ bus modes of ×8, ×16, or

×32.

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February 2005

Stratix GX Device Handbook, Volume 1

Stratix GX Architecture

Table 4–23 shows the number of DQ and DQS buses that are supported

per device.

Table 4–23. DQS & DQ Bus Mode Support

Device Package

Note (1)

Number of ×8

Groups

Number of ×16

Groups

Number of ×32

Groups

EP1SGX10 672-pin FineLine BGA

EP1SGX25 672-pin FineLine BGA

1,020-pin FineLine BGA

12 (2)

16 (3)

20

0

8

0

4

EP1SGX40 1,020-pin FineLine BGA

20

Notes to Table 4–23:

(1) See the Selectable I/O Standards in Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook,

Volume 2 for V_REFguidelines.

(2) These packages have six groups in I/O banks 3 and 4 and six groups in I/O banks 7 and 8.

(3) These packages have eight groups in I/O banks 3 and 4 and eight groups in I/O banks 7 and 8.

A compensated delay element on each DQS pin automatically aligns

input DQS synchronization signals with the data window of their

corresponding DQ data signals. The DQS signals drive a local DQS bus in

the top and bottom I/O banks. This DQS bus is an additional resource to

the I/O clocks and clocks DQ input registers with the DQS signal.

Two separate single phase-shifting reference circuits are located on the

top and bottom of the Stratix GX device. Each circuit is driven by a system

reference clock through the CLKpins that is the same frequency as the

DQS signal. Clock pins CLK[15..12]pfeed the phase-shift circuitry on

the top of the device and clock pins CLK[7..4]pfeed the phase-shift

circuitry on the bottom of the device. The phase-shifting reference circuit

on the top of the device controls the compensated delay elements for all

10 DQS pins located at the top of the device. The phase-shifting reference

circuit on the bottom of the device controls the compensated delay

elements for all 10 DQS pins located on the bottom of the device. All

10 delay elements (DQS signals) on either the top or bottom of the device

shift by the same degree amount. For example, all 10 DQS pins on the top

of the device can be shifted by 90° and all 10 DQS pins on the bottom of

the device can be shifted by 72°. The reference circuits require a maximum

of 256 system reference clock cycles to set the correct phase on the DQS

delay elements. Figure 4–68 illustrates the phase-shift reference circuit

control of each DQS delay shift on the top of the device. This same circuit

is duplicated on the bottom of the device.

Altera Corporation

February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

Figure 4–68. Simplified Diagram of the DQS Phase-Shift Circuitry

Input

Reference

Clock

Phase

Comparator

Up/Down

Counter

Delay Chains

Control Signals

to DQS Pins

6

See the External Memory Interfaces chapter of the Stratix GX Device

Handbook, Volume 2 for more information on external memory interfaces.

Programmable Drive Strength

The output buffer for each Stratix GX device I/O pin has a programmable

drive strength control for certain I/O standards. The LVTTL and

LVCMOS standard has several levels of drive strength that the user can

control. SSTL-3 class I and II, SSTL-2 class I and II, HSTL class I and II, and

3.3-V GTL+ support a minimum setting, the lowest drive strength that

guarantees the I_OH/I_OLof the standard. Using minimum settings

provides signal slew rate control to reduce system noise and signal

overshoot.

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Altera Corporation

February 2005

Stratix GX Architecture

Table 4–24 shows the possible settings for the I/O standards with drive

strength control.

Table 4–24. Programmable Drive Strength

I_OH/ I_OLCurrent Strength Setting (mA)

I/O Standard

3.3-V LVTTL

24 (1), 16, 12, 8, 4

24 (2), 12 (1), 8, 4, 2

16 (1), 12, 8, 2

3.3-V LVCMOS

2.5-V LVTTL/LVCMOS

1.8-V LVTTL/LVCMOS

1.5-V LVCMOS

12 (1), 8, 2

8 (1), 4, 2

GTL/GTL+

Support maximum and minimum strength

1.5-V HSTL class I and II

1.8-V HSTL class I and II

SSTL-3 class I and II

SSTL-2 class I and II

SSTL-18 class I and II

Notes to Table 4–24:

(1) This is the Quartus II software default current setting.

(2) I/O banks 1 and 2 do not support this setting.

The Quartus II software, beginning with version 4.2, reports current

strength as “PCI Compliant” for 3.3-V PCI, 3.3-V PCI-X 1.0, and Compact

PCI I/O standards.

Stratix GX devices support series on-chip termination (OCT) using

programmable drive strength. For more information, contact your Altera

Support Representative.

Open-Drain Output

Stratix GX devices provide an optional open-drain (equivalent to an

open-collector) output for each I/O pin. This open-drain output enables

the device to provide system-level control signals (that is, interrupt and

write-enable signals) that can be asserted by any of several devices.

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February 2005

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I/O Structure

Slew-Rate Control

The output buffer for each Stratix GX device I/O pin has a programmable

output slew-rate control that can be configured for low-noise or high-

speed performance. A faster slew rate provides high-speed transitions for

high-performance systems. However, these fast transitions may

introduce noise transients into the system. A slow slew rate reduces

system noise, but adds a nominal delay to rising and falling edges. Each

I/O pin has an individual slew-rate control, allowing you to specify the

slew rate on a pin-by-pin basis. The slew-rate control affects both the

rising and falling edges.

Bus Hold

Each Stratix GX device I/O pin provides an optional bus-hold feature.

The bus-hold circuitry can weakly hold the signal on an I/O pin at its last-

driven state. Since the bus-hold feature holds the last-driven state of the

pin until the next input signal is present, an external pull-up or pull-down

resistor is not needed to hold a signal level when the bus is tri-stated.

Table 4–25 shows bus hold support for different pin types.

Table 4–25. Bus Hold Support

Pin Type

Bus Hold

I/O pins

v

CLK[15..0]

CLK[0,1,2,3,8,9,10,11]

FCLK

v

FPLL[7..10]CLK

The bus-hold circuitry also pulls undriven pins away from the input

threshold voltage where noise can cause unintended high-frequency

switching. You can select this feature individually for each I/O pin. The

bus-hold output drives no higher than V_CCIOto prevent overdriving

signals. If the bus-hold feature is enabled, the programmable pull-up

option cannot be used. Disable the bus-hold feature when using open-

drain outputs with the GTL+ I/O standard or when the I/O pin has been

configured for differential signals.

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February 2005

Stratix GX Architecture

The bus-hold circuitry uses a resistor with a nominal resistance (R_BH) of

approximately 7 kΩ to weakly pull the signal level to the last-driven state.

The chapter DC & Switching Characteristics of the Stratix GX Device

Handbook, Volume 1 gives the specific sustaining current driven through

this resistor and the overdrive current used to identify the next-driven

input level. This information is provided for each V_CCIOvoltage level.

The bus-hold circuitry is active only after configuration. When going into

user mode, the bus-hold circuit captures the value on the pin present at

the end of configuration.

Programmable Pull-Up Resistor

Each Stratix GX device I/O pin provides an optional programmable pull-

up resistor during user mode. If this feature is enabled for an I/O pin, the

pull-up resistor (typically 25 kΩ) weakly holds the output to the V_CCIO

level of the output pin’s bank. Table 4–26 shows which pin types support

the weak pull-up resistor feature.

Table 4–26. Programmable Weak Pull-Up Resistor Support

Pin Type

Programmable Weak Pull-Up Resistor

I/O pins

v

CLK[15..0]

FCLK

v

FPLL[7..10]CLK

Configuration pins

JTAG pins

v (1)

Note to Table 4–26:

(1) TDO pins do not support programmable weak pull-up resistors.

Advanced I/O Standard Support

Stratix GX device IOEs support the following I/O standards:

■

LVTTL

LVCMOS

1.5 V

1.8 V

2.5 V

3.3-V PCI

3.3-V PCI-X 1.0

3.3-V AGP (1× and 2×)

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February 2005

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I/O Structure

■

LVDS

LVPECL

3.3-V PCML

HyperTransport

Differential HSTL (on input/output clocks only)

Differential SSTL (on output column clock pins only)

GTL/GTL+

1.5-V HSTL class I and II

1.8-V HSTL Class I and II

SSTL-3 class I and II

SSTL-2 class I and II

SSTL-18 class I and II

CTT

Table 4–27 describes the I/O standards supported by Stratix GX devices.

Table 4–27. Stratix GX Supported I/O Standards (Part 1 of 2)

Input Reference

Board

Termination

Voltage (V_TT)

(V)

Output Supply

Voltage (V_REF

)

Voltage (V_CCIO

)

I/O Standard

Type

(V)

LVTTL

Single-ended

Differential

N/A

0.75

1.25

0.8

3.3

2.5

1.8

1.5

3.3

2.5

1.5

2.5

N/A

1.5

1.8

2.5

N/A

0.75

1.25

1.20

1.5

LVCMOS

2.5 V

1.8 V

1.5 V

3.3-V PCI

3.3-V PCI-X 1.0

LVDS

LVPECL

Differential

3.3-V PCML

HyperTransport

Differential HSTL (1)

Differential SSTL (2)

GTL

Differential

Voltage-referenced

GTL+

1.0

1.5-V HSTL class I and II

1.8-V HSTL class I and II

SSTL-18 class I and II

SSTL-2 class I and II

0.75

0.9

0.75

0.9

0.90

1.25

0.90

1.25

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Stratix GX Architecture

Table 4–27. Stratix GX Supported I/O Standards (Part 2 of 2)

Input Reference

Board

Output Supply

Termination

Voltage (V_TT)

(V)

Voltage (V_REF

)

Voltage (V_CCIO

)

I/O Standard

Type

(V)

SSTL-3 class I and II

AGP (1× and 2×)

CTT

Voltage-referenced

1.5

1.32

1.5

3.3

1.5

N/A

1.5

Notes to Table 4–27:

(1) This I/O standard is only available on input and output clock pins.

(2) This I/O standard is only available on output column clock pins.

f

For more information on I/O standards supported by Stratix GX

devices, see the Selectable I/O Standards in Stratix & Stratix GX Devices

chapter of the Stratix GX Device Handbook, Volume 2.

Stratix GX devices contain eight I/O banks in addition to the four

enhanced PLL external clock out banks, as shown in Figure 4–69. The four

I/O banks on the right and left of the device contain circuitry to support

high-speed differential I/O for LVDS, LVPECL, 3.3-V PCML, and

HyperTransport inputs and outputs. These banks support all I/O

standards listed in Table 4–27 except PCI I/O pins or PCI-X 1.0, GTL,

SSTL-18 Class II, and HSTL Class II outputs. The top and bottom I/O

banks support all single-ended I/O standards. Additionally, Stratix GX

devices support four enhanced PLL external clock output banks,

allowing clock output capabilities such as differential support for SSTL

and HSTL. Table 4–28 shows I/O standard support for each I/O bank.

Altera Corporation

February 2005

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I/O Structure

Figure 4–69. Stratix GX I/O Banks

Notes (1), (2), (3)

DQST9 DQST8 DQST7 DQST6 DQST5

PLL7 VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3

Bank 3

DQST4 DQST3 DQST2 DQST1 DQST0

VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4

Bank 4

PLL5

PLL11

9

10

I/O Bank 13 (5)

I/O Bank 14 (5)

LVDS, LVPECL, 3.3-V PCML,

and HyperTransport I/O Block

and Regular I/O Pins (3)

(4)

I/O Banks 3, 4, 9 & 10 Support

All Single-Ended I/O Standards (2)

I/O Banks 1 and 2 Support All

Single-Ended I/O Standards Except

Differential HSTL Output Clocks,

Differential SSTL-2 Output Clocks,

HSTL Class II, GTL, SSTL-18 Class II,

PCI, PCI-X, and AGP 1×/2×

PLL1

PLL2

I/O Bank 17 (5)

1.5-V PCML (5)

I/O Bank 16 (5)

I/O Bank 15 (5)

I/O Banks 7, 8, 11 & 12 Support

All Single-Ended I/O Standards (2)

(4)

LVDS, LVPECL, 3.3-V PCML,

and HyperTransport I/O Block

and Regular I/O Pins (3)

Bank 8

11

12

Bank 7

VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8

DQSB9 DQSB8 DQSB7 DQSB6 DQSB5

PLL12

VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7

DQSB4 DQSB3 DQSB2 DQSB1 DQSB0

PLL8

PLL6

Notes to Figure 4–69:

(1) Figure 4–69 is a top view of the Stratix GX silicon die.

(2) Banks 9 through 12 are enhanced PLL external clock output banks.

(3) If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the

I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.

(4) For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in

Stratix & Stratix GX Devices chapter in the Stratix GX Device Handbook, Volume 2.

(5) These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on reference

clocks and receiver input pins (AC coupled)

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Stratix GX Architecture

Table 4–28 shows I/O standard support for each I/O bank.

Table 4–28. I/O Support by Bank (Part 1 of 2)

Top & Bottom Banks

Enhanced PLL External

Clock Output Banks

(9, 10, 11 & 12)

Left Banks

(1 & 2)

I/O Standard

(3, 4, 7 & 8)

LVTTL

v

LVCMOS

2.5 V

1.8 V

1.5 V

3.3-V PCI

3.3-V PCI-X 1.0

LVPECL

v

3.3-V PCML

LVDS

HyperTransport technology

Differential HSTL (clock

inputs)

v

Differential HSTL (clock

outputs)

v

Differential SSTL (clock

outputs)

3.3-V GTL

v

3.3-V GTL+

v

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

SSTL-18 class I

SSTL-18 class II

SSTL-2 class I

SSTL-2 class II

SSTL-3 class I

v

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February 2005

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I/O Structure

Table 4–28. I/O Support by Bank (Part 2 of 2)

Enhanced PLL External

Clock Output Banks

(9, 10, 11 & 12)

Top & Bottom Banks

Left Banks

(1 & 2)

I/O Standard

(3, 4, 7 & 8)

SSTL-3 class II

v

AGP (1× and 2×)

CTT

Each I/O bank has its own VCCIOpins. A single device can support 1.5-,

1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different standard

independently. Each bank also has dedicated VREFpins to support any

one of the voltage-referenced standards (such as SSTL-3) independently.

Each I/O bank can support multiple standards with the same V_CCIOfor

input and output pins. Each bank can support one voltage-referenced

I/O standard. For example, when V_CCIOis 3.3 V, a bank can support

LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.

Differential On-Chip Termination

Stratix GX devices provide differential on-chip termination (LVDS I/O

standard) to reduce reflections and maintain signal integrity. Differential

on-chip termination simplifies board design by minimizing the number

of external termination resistors required. Termination can be placed

inside the package, eliminating small stubs that can still lead to

reflections. The internal termination is designed using transistors in the

linear region of operation.

Stratix GX devices support internal differential termination with a

nominal resistance value of 137.5 Ω for LVDS input receiver buffers.

LVPECL signals require an external termination resistor. Figure 4–70

shows the device with differential termination.

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Stratix GX Architecture

Figure 4–70. LVDS Input Differential On-Chip Termination

Transmitting

Device

Receiving Device with

Differential Termination

Z

0

+

R

D

Ð

0

I/O banks on the left and right side of the device support LVDS receiver

(far-end) differential termination.

Table 4–29 shows the Stratix GX device differential termination support.

Table 4–29. Differential Termination Supported by I/O Banks

Top & Bottom

Banks (3, 4, 7 & 8)

Differential Termination Support

I/O Standard Support

Left Banks (1 & 2)

Differential termination (1), (2)

LVDS

v

Notes to Table 4–29:

(1) Clock pin CLK0, CLK2, CLK9, CLK11, and pins FPLL[7..10]CLKdo not support differential termination.

(2) Differential termination is only supported for LVDS because of a 3.3-V V_{CC IO}

.

Table 4–30 shows the termination support for different pin types.

Table 4–30. Differential Termination Support Across Pin Types

R_D

Pin Type

Top and bottom I/O banks (3, 4, 7, and 8)

DIFFIO_RX[]

v

CLK[0,2,9,11],CLK[4-7],CLK[12-15]

CLK[1,3,8,10]

FCLK

FPLL[7..10]CLK

The differential on-chip resistance at the receiver input buffer is

118 Ω 20 %.

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February 2005

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Stratix GX Device Handbook, Volume 1

I/O Structure

However, there is additional resistance present between the device ball

and the input of the receiver buffer, as shown in Figure 4–71. This

resistance is because of package trace resistance (which can be calculated

as the resistance from the package ball to the pad) and the parasitic layout

metal routing resistance (which is shown between the pad and the

intersection of the on-chip termination and input buffer).

Figure 4–71. Differential Resistance of LVDS Differential Pin Pair (R_D)

Pad

Package Ball

LVDS

Input Buffer

0.3 Ω

9.3 Ω

R

D

Differential On-Chip

Termination Resistor

0.3 Ω

Pad

Package Ball

Table 4–31 defines the specification for internal termination resistance for

commercial devices.

Table 4–31. Differential On-Chip Termination

Resistance

Symbol

Description

Conditions

Unit

Min Typ Max

R_D(2)

Internal differential termination for LVDS

Commercial (1), (3)

Industrial (2), (3)

110 135 165

100 135 170

Ω

Notes to Table 4–31:

(1) Data measured over minimum conditions (T_j= 0 C, V_{CC IO}+5%) and maximum conditions (T_j= 85 C,

V_CCIO= –5%).

(2) Data measured over minimum conditions (T_j= –40 C, V_CCIO+5%) and maximum conditions (T_j= 100 C,

V_CCIO= –5%).

(3) LVDS data rate is supported for 840 Mbps using internal differential termination.

MultiVolt I/O Interface

The Stratix GX architecture supports the MultiVolt I/O interface feature,

which allows Stratix GX devices in all packages to interface with systems

of different supply voltages.

The Stratix GX VCCINTpins must always be connected to a 1.5-V power

supply. With a 1.5-V V_CCINTlevel, input pins are 1.5-V, 1.8-V, 2.5-V, and

3.3-V tolerant. The VCCIOpins can be connected to either a 1.5-V, 1.8-V,

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Stratix GX Architecture

2.5-V, or 3.3-V power supply, depending on the output requirements.

The output levels are compatible with systems of the same voltage as the

power supply (for example, when VCCIOpins are connected to a 1.5-V

power supply, the output levels are compatible with 1.5-V systems).

When VCCIOpins are connected to a 3.3-V power supply, the output high

is 3.3 V and is compatible with 3.3-V or 5.0-V systems.

Table 4–32 summarizes Stratix GX MultiVolt I/O support.

Table 4–32. Stratix GX MultiVolt I/O Support

Input Signal (5)

1.5 V 1.8 V 2.5 V 3.3 V 5.0 V 1.5 V 1.8 V 2.5 V 3.3 V 5.0 V

Note (1)

Output Signal (6)

V_CCIO(V)

1.5

1.8

2.5

3.3

v

v (2)

v

v (3)

v (3) v (3)

v (2) v (2)

v

v (2)

v (4) v (3) v (3) v (3)

Notes to Table 4–32:

(1) To drive inputs higher than V_CCIObut less than 4.1 V, disable the PCI clamping diode. However, to drive 5.0-V

inputs to the device, enable the PCI clamping diode to prevent V_Ifrom rising above 4.0 V.

(2) The input pin current may be slightly higher than the typical value.

(3) Although V_CCIOspecifies the voltage necessary for the Stratix GX device to drive out, a receiving device powered

at a different level can still interface with the Stratix GX device if it has inputs that tolerate the V_CCIOvalue.

(4) Stratix GX devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode.

(5) This is the external signal that is driving the Stratix GX device.

(6) This represents the system voltage that Stratix GX supports when a VCCIO pin is connected to a specific voltage

level. For example, when VCCIO is 3.3 V and if the I/O standard is LVTTL/LVCMOS, the output high of the signal

coming out from Stratix GX is 3.3 V and is compatible with 3.3-V or 5.0-V systems.

Because Stratix GX devices can be used in a mixed-voltage environment,

they have been designed specifically to tolerate any possible power-up

sequence. Therefore, the VCCIOand VCCINTpower supplies may be

powered in any order.

Power

Sequencing &

Hot Socketing

Signals can be driven into Stratix GX devices before and during power up

without damaging the device. In addition, Stratix GX devices do not

drive out during power up. Once operating conditions are reached and

the device is configured, Stratix GX devices operate as specified by the

user. For more information, see the Selectable I/O Standards in Stratix &

Stratix GX Devices chapter of the Stratix GX Device Handbook, Volume 2.

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IEEE Std. 1149.1 (JTAG) Boundary-Scan Support

All Stratix GX devices provide JTAG BST circuitry that complies with the

IEEE Std. 1149.1

(JTAG)

Boundary-Scan

Support

IEEE Std. 1149.1a-1990 specification. JTAG boundary-scan testing can be

performed either before or after, but not during configuration. Stratix GX

devices can also use the JTAG port for configuration together with either

the Quartus II software or hardware using either Jam Files (.jam) or Jam

Byte-Code Files (.jbc).

Stratix GX devices support IOE I/O standard setting reconfiguration

through the JTAG BST chain. The JTAG chain can update the I/O

standard for all input and output pins any time before or during user

mode. You can use this ability for JTAG testing before configuration when

some of the Stratix GX pins drive or receive from other devices on the

board using voltage-referenced standards. Because the Stratix GX device

may not be configured before JTAG testing, the I/O pins may not be

configured for appropriate electrical standards for chip-to-chip

communication. Programming those I/O standards via JTAG allows you

to fully test I/O connection to other devices.

The enhanced PLL reconfiguration bits are part of the JTAG chain before

configuration and after power-up. After device configuration, the PLL

reconfiguration bits are not part of the JTAG chain.

Stratix GX devices also use the JTAG port to monitor the logic operation

of the device with the SignalTap^®embedded logic analyzer. Stratix GX

devices support the JTAG instructions shown in Table 4–33.

Table 4–33. Stratix GX JTAG Instructions (Part 1 of 2)

JTAG Instruction

Description

Allows a snapshot of signals at the device pins to be captured and examined during

normal device operation, and permits an initial data pattern to be output at the device pins.

Also used by the SignalTap^®embedded logic analyzer.

SAMPLE/PRELOAD

Allows the external circuitry and board-level interconnects to be tested by forcing a test

pattern at the output pins and capturing test results at the input pins.

EXTEST(1)

Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data

to pass synchronously through selected devices to adjacent devices during normal device

operation.

BYPASS

USERCODE

IDCODE

Selects the 32-bit USERCODEregister and places it between the TDI and TDO pins,

allowing the USERCODEto be serially shifted out of TDO.

Selects the IDCODE register and places it between TDI and TDO, allowing the IDCODE

to be serially shifted out of TDO.

Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data

to pass synchronously through selected devices to adjacent devices during normal device

operation, while tri-stating all of the I/O pins.

HIGHZ(1)

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Stratix GX Architecture

Table 4–33. Stratix GX JTAG Instructions (Part 2 of 2)

JTAG Instruction

Description

Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data

to pass synchronously through selected devices to adjacent devices during normal device

operation while holding I/O pins to a state defined by the data in the boundary-scan

register.

CLAMP(1)

Used when configuring a Stratix GX device through the JTAG port with a MasterBlaster^TM

or ByteBlasterMV^TMdownload cable, or when using a .jamfile or .jbcfile with an

embedded processor.

ICR instructions

PULSE_NCONFIG Emulates pulsing the nCONFIGpin low to trigger reconfiguration even though the physical

pin is unaffected.

Allows the IOE standards to be configured through the JTAG chain. Stops configuration if

executed during configuration. Can be executed before or after configuration.

CONFIG_IO

SignalTap

Monitors internal device operation with the SignalTap embedded logic analyzer.

instructions

Note to Table 4–33:

(1) Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.

The Stratix GX device instruction register length is 10 bits, and the

USERCODE register length is 32 bits. Tables 4–34 and 4–35 show the

boundary-scan register length and IDCODE information for Stratix GX

devices.

Table 4–34. Stratix GX Boundary-Scan Register Length

Device

Boundary-Scan Register Length

EP1SGX10

EP1SGX25

EP1SGX40

1,029

1,665

1,941

Table 4–35. 32-Bit Stratix GX Device IDCODE (Part 1 of 2)

IDCODE (32 Bits) (1)

Device

Manufacturer Identity

Version (4 Bits)

Part Number (16 Bits)

LSB (1 Bit) (2)

(11 Bits)

EP1SGX10

EP1SGX25

0000

0010 0000 0100 0001

0010 0000 0100 0011

000 0110 1110

1

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February 2005

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Stratix GX Device Handbook, Volume 1

IEEE Std. 1149.1 (JTAG) Boundary-Scan Support

Table 4–35. 32-Bit Stratix GX Device IDCODE (Part 2 of 2)

IDCODE (32 Bits) (1)

Device

Manufacturer Identity

(11 Bits)

Version (4 Bits)

Part Number (16 Bits)

LSB (1 Bit) (2)

EP1SGX40

0000

0010 0000 0100 0101

000 0110 1110

1

Notes to Table 4–35:

(1) The most significant bit (MSB) is at the left end of the string.

(2) The IDCODE’s least significant bit (LSB) is always 1.

Figure 4–72 shows the timing requirements for the JTAG signals.

Figure 4–72. Stratix GX JTAG Waveforms

TMS

TDI

t_JCP

t_JCH

t _JCL

t_JPH

t_JPSU

TCK

TDO

t_JPXZ

t_JPZX

t_JPCO

t_JSSU

t_JSH

Signal

to Be

Captured

t_JSCO

t_JSZX

t_JSXZ

Signal

to Be

Driven

Table 4–36 shows the JTAG timing parameters and values for Stratix GX

devices.

Table 4–36. Stratix GX JTAG Timing Parameters & Values (Part 1 of 2)

Symbol

t_JCP

Parameter

Min (ns) Max (ns)

100

50

TCKclock period

t_JCH

TCKclock high time

TCKclock low time

JTAG port setup time

t_JCL

50

t_JPSU

20

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Stratix GX Architecture

Table 4–36. Stratix GX JTAG Timing Parameters & Values (Part 2 of 2)

Symbol

t_JPH

Parameter

Min (ns) Max (ns)

JTAG port hold time

45

25

20

45

35

t_JPCO

t_JPZX

t_JPXZ

t_JSSU

t_JSH

JTAG port clock to output

JTAG port high impedance to valid output

JTAG port valid output to high impedance

Capture register setup time

Capture register hold time

t_JSCO

t_JSZX

t_JSXZ

Update register clock to output

Update register high impedance to valid output

Update register valid output to high impedance

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IEEE Std. 1149.1 (JTAG) Boundary-Scan Support

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Stratix GX Device Handbook, Volume 1

5. Configuration & Testing

SGX51005-1.0

Stratix^®GX devices feature the SignalTap^®embedded logic analyzer,

which monitors design operation over a period of time through the

IEEE Std. 1149.1 (JTAG) circuitry. You can analyze internal logic at speed

without bringing internal signals to the I/O pins. This feature is

particularly important for advanced packages, such as FineLine BGA^®

packages, because it can be difficult to add a connection to a pin during

the debugging process after a board is designed and manufactured.

SignalTap

Embedded Logic

Analyzer

The logic, circuitry, and interconnects in the Stratix GX architecture are

configured with CMOS SRAM elements. Stratix GX devices are

reconfigurable and are 100% tested prior to shipment. As a result, you do

not have to generate test vectors for fault coverage purposes, and can

instead focus on simulation and design verification. In addition, you do

not need to manage inventories of different ASIC designs. Stratix GX

devices can be configured on the board for the specific functionality

required.

Configuration

Stratix GX devices are configured at system power-up with data stored in

an Altera serial configuration device or provided by a system controller.

Altera offers in-system programmability (ISP)-capable configuration

devices that configure Stratix GX devices via a serial data stream.

Stratix GX devices can be configured in under 100 ms using 8-bit parallel

data at 100 MHz. The Stratix GX device’s optimized interface allows

microprocessors to configure it serially or in parallel, and synchronously

or asynchronously. The interface also enables microprocessors to treat

Stratix GX devices as memory and configure them by writing to a virtual

memory location, making reconfiguration easy. After a Stratix GX device

has been configured, it can be reconfigured in-circuit by resetting the

device and loading new data. Real-time changes can be made during

system operation, enabling innovative reconfigurable computing

applications.

Operating Modes

The Stratix GX architecture uses SRAM configuration elements that

require configuration data to be loaded each time the circuit powers up.

The process of physically loading the SRAM data into the device is called

configuration. During initialization, which occurs immediately after

configuration, the device resets registers, enables I/O pins, and begins to

operate as a logic device. The I/O pins are tri-stated during power up,

Altera Corporation

February 2005

5–1

Configuration

and before and during configuration. Together, the configuration and

initialization processes are called command mode. Normal device

operation is called user mode.

A built-in weak pull-up resistor pulls all user I/O pins to V_CCIObefore

and during device configuration.

SRAM configuration elements allow Stratix GX devices to be

reconfigured in-circuit by loading new configuration data into the device.

With real-time reconfiguration, the device is forced into command mode

with a device pin. The configuration process loads different configuration

data, reinitializes the device, and resumes user-mode operation. You can

perform in-field upgrades by distributing new configuration files either

within the system or remotely.

Configuration Schemes

You can load the configuration data for a Stratix GX device with one of

five configuration schemes (see Table 5–1), chosen on the basis of the

target application. You can use a configuration device, intelligent

controller, or the JTAG port to configure a Stratix GX device. A

configuration device can automatically configure a Stratix GX device at

system power-up.

You can configure multiple Stratix GX devices in any of five

configuration schemes by connecting the configuration enable (nCE) and

configuration enable output (nCEO) pins on each device.

Table 5–1. Data Sources for Configuration

Configuration Scheme

Data Source

Configuration device

Passive serial (PS)

Enhanced or EPC2 configuration device

ByteBlasterMV™ or MasterBlaster™ download

cable or serial data source

Passive parallel

Parallel data source

asynchronous (PPA)

Fast passive parallel

JTAG

Parallel data source

MasterBlaster or ByteBlasterMV download cable

or a microprocessor with a Jam or JBC file (.jam

or .jbc)

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Configuration & Testing

Partial Reconfiguration

The enhanced PLLs within the Stratix GX device family support partial

reconfiguration of their multiply, divide, and time delay settings without

reconfiguring the entire device. You can use either serial data from the

logic array or regular I/O pins to program the PLL’s counter settings in a

serial chain. This option provides considerable flexibility for frequency

synthesis, allowing real-time variation of the PLL frequency and delay.

The rest of the device is functional while reconfiguring the PLL. See the

Stratix GX Architecture chapter of the Stratix GX Device Handbook,

Volume 1 for more information on Stratix GX PLLs.

Remote Update Configuration Modes

Stratix GX devices also support remote configuration using an Altera

enhanced configuration device (for example, EPC16, EPC8, and EPC4

devices) with page mode selection. Factory configuration data is stored in

the default page of the configuration device. This is the default

configuration which contains the design required to control remote

updates and handle or recover from errors. You write the factory

configuration once into the flash memory or configuration device.

Remote update data can update any of the remaining pages of the

configuration device. If there is an error or corruption in a remote update

configuration, the configuration device reverts back to the factory

configuration information.

There are two remote configuration modes: remote and local

configuration. You can use the remote update configuration mode for all

three configuration modes: serial, parallel synchronous, and parallel

asynchronous. Configuration devices (for example, EPC16 devices) only

support serial and parallel synchronous modes. Asynchronous parallel

mode allows remote updates when an intelligent host is used to configure

the Stratix GX device. This host must support page mode settings similar

to an EPC16 device.

Remote Update Mode

When the Stratix GX device is first powered-up in remote update

programming mode, it loads the configuration located at page

address 000. The factory configuration should always be located at page

address 000, and should never be remotely updated. The factory

configuration contains the required logic to perform the following

operations:

■

Determine the page address/load location for the next application’s

configuration data

Recover from a previous configuration error

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February 2005

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Stratix GX Device Handbook, Volume 1

Configuration

■

Receive new configuration data and write it into the configuration

device

The factory configuration is the default and takes control if an error

occurs while loading the application configuration.

While in the factory configuration, the factory-configuration logic

performs the following operations:

■

Loads a remote update-control register to determine the page

address of the new application configuration

Determines whether to enable a user watchdog timer for the

application configuration

Determines what the watchdog timer setting should be if it is

enabled

The user watchdog timer is a counter that must be continually reset

within a specific amount of time in the user mode of an application

configuration to ensure that valid configuration occurred during a

remote update. Only valid application configurations designed for

remote update can reset the user watchdog timer in user mode. If a valid

application configuration does not reset the user watchdog timer in a

specific amount of time, the timer updates a status register and loads the

factory configuration. The user watchdog timer is automatically disabled

for factory configurations.

If an error occurs in loading the application configuration, the

configuration logic writes a status register to specify the cause of the

reconfiguration. Once this occurs, the Stratix GX device automatically

loads the factory configuration, which reads the status register and

determines the reason for reconfiguration. Based on the reason, the

factory configuration takes appropriate steps and writes the remote

update control register to specify the next application configuration page

to be loaded.

When the Stratix GX device successfully loads the application

configuration, it enters into user mode. The Stratix GX device then

executes the main application of the user. Intellectual property (IP), such

as a Nios^®embedded processor, can help the Stratix GX device determine

when remote update is coming. The Nios embedded processor or user

logic receives incoming data, writes it to the configuration device, and

loads the factory configuration. The factory configuration reads the

remote update status register and determine the valid application

configuration to load. Figure 5–1 shows the Stratix GX remote update.

Figure 5–2 shows the transition diagram for remote update mode.

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February 2005

Configuration & Testing

Figure 5–1. Stratix GX Device Remote Update

Configuration

Device

(1)

Page 7

Application Configuration

Watchdog

Timer

Page 6

New Remote

Configuration Data

Stratix GX Device

Page 0

Factory Configuration

Configuration Device Updates

Stratix GX Device with Factory

Configuration (to Handle Update)

or New Application Configuration

Note to Figure 5–1:

(1) When the Stratix GX device is configured with the factory configuration, it can handle update data from EPC16,

EPC8, or EPC4 configuration device pages and point to the next page in the configuration device.

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Stratix GX Device Handbook, Volume 1

Configuration

Figure 5–2. Remote Update Transition Diagram

Notes (1), (2)

Application 1

Configuration

Power-Up

Configuration

Error

Configuration

Error

Reload an

Application

Factory

Configuration

Reload an

Application

Configuration

Error

Application n

Configuration

Notes to Figure 5–2:

(1) Remote update of application configuration is controlled by a Nios embedded processor or user logic programmed

in the factory or application configurations.

(2) Up to seven pages can be specified allowing up to seven different configuration applications.

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Stratix GX Device Handbook, Volume 1

Configuration & Testing

Local Update Mode

Local update mode is a simplified version of the remote update. This

feature is intended for simple systems that need to load a single

application configuration immediately upon power-up without loading

the factory configuration first. Local update designs have only one

application configuration to load, so it does not require a factory

configuration to determine which application configuration to use.

Figure 5–3 shows the transition diagram for local update mode.

Figure 5–3. Local Update Transition Diagram

Power-Up

or nCONFIG

nCONFIG

Application

Configuration

Error

nCONFIG

Configuration

Error

Factory

Configuration

Stratix GX devices offer on-chip circuitry for automated checking of

single event upset (SEU) detection. Some applications that require the

device to operate error free at high elevations or in close proximity to

earth’s North or South Pole require periodic checks to ensure continued

data integrity. The error detection cyclic redundancy code (CRC) feature

controlled by the Device & Pin Options dialog box in the Quartus II

software uses a 32-bit CRC circuit to ensure data reliability and is one of

the best options for mitigating SEU.

Stratix GX

Automated

Single Event

Upset (SEU)

Detection

Altera Corporation

February 2005

5–7

Stratix GX Device Handbook, Volume 1

Temperature-Sensing Diode

You can implement the error detection CRC feature with existing

circuitry in Stratix GX devices, eliminating the need for external logic. For

Stratix GX devices, the CRC is computed by Quartus II and downloaded

into the device as a part of the configuration bit stream. The CRC_ERROR

pin reports a soft error when configuration SRAM data is corrupted,

triggering device reconfiguration.

Custom-Built Circuitry

Dedicated circuitry is built into Stratix GX devices to perform error

detection automatically. This error detection circuitry constantly checks

for errors in the configuration SRAM cells while the device is in user

mode. You can monitor one external pin for the error and use it to trigger

a reconfiguration cycle. You can select the desired time between checks

by adjusting a built-in clock divider.

Software Interface

In the Quartus II software version 4.1 and later, you can turn on the

automated error detection CRC feature in the Device & Pin Options

dialog box. This dialog box allows you to enable the feature and set the

internal frequency of the CRC between 400 kHz to 100 MHz. This

controls the rate that the CRC circuitry verifies the internal configuration

SRAM bits in the FPGA device.

For more information on CRC, refer to AN 357: Error Detection Using CRC

in Altera FPGA Devices.

Stratix GX devices include a diode-connected transistor for use as a

temperature sensor in power management. This diode is used with an

external digital thermometer device such as a MAX1617A or MAX1619

from MAXIM Integrated Products. These devices steer bias current

through the Stratix GX diode, measuring forward voltage and converting

this reading to temperature in the form of an 8-bit signed number (7 bits

plus sign). The external device’s output represents the package

temperature of the Stratix GX device and can be used for intelligent

power management.

Temperature-

Sensing Diode

The diode requires two pins (tempdiodepand tempdioden) on the

Stratix GX device to connect to the external temperature-sensing device,

as shown in Figure 5–4. The temperature-sensing diode is a passive

element and therefore can be used before the Stratix GX device is

powered.

5–8

Altera Corporation

Stratix GX Device Handbook, Volume 1

February 2005

Configuration & Testing

Figure 5–4. External Temperature-Sensing Diode

Stratix GX Device

Temperature-Sensing

Device

tempdiodep

tempdioden

Table 5–2 shows the specifications for bias voltage and current of the

Stratix GX temperature-sensing diode.

Table 5–2. Temperature-Sensing Diode Electrical Characteristics

Parameter

Minimum

Typical

100

Maximum

120

Units

μA

V

I_BIAShigh

80

8

I_BIASlow

10

12

V_BP– V_BN

V_BN

0.3

0.9

0.7

V

Series resistance

3

W

The temperature-sensing diode works for the entire operating range

shown in Figure 5–5.

Altera Corporation

February 2005

5–9

Stratix GX Device Handbook, Volume 1

Temperature-Sensing Diode

Figure 5–5. Temperature Versus Temperature-Sensing Diode Voltage

0.95

0.90

0.85

0.80

0.75

100 μA Bias Current

10 μA Bias Current

0.70

Voltage

(Across Diode)

0.65

0.60

0.55

0.50

0.45

0.40

–55

–30

–5

20

45

70

95

120

Temperature ( C)

5–10

Stratix GX Device Handbook, Volume 1

Altera Corporation

February 2005

6. DC & Switching

Characteristics

SGX51006-1.1

Stratix^®GX devices are offered in both commercial and industrial grades.

However, industrial-grade devices may have limited speed-grade

availability.

Operating

Conditions

Tables 6–1 through 6–12 provide information on absolute maximum

ratings, recommended operating conditions, DC operating conditions,

and transceiver block absolute maximum ratings. Notes for Tables 6–1

through 6–6 immediately follow Table 6–6, notes for Table 6–7

immediately follow that table, and notes for Tables 6–8 through 6–12

immediately follow Table 6–12.

Table 6–1. Stratix GX Device Absolute Maximum Ratings

Notes (1), (2)

Symbol

V_CCINT

V_CCIO

V_I

Parameter

Conditions

Minimum

–0.5

Maximum

2.4

Unit

V

Supply voltage

With respect to ground (3)

–0.5

4.6

V

DC input voltage

–0.5

4.6

V

I_OUT

DC output current, per pin

Storage temperature

Ambient temperature

Junction temperature

–25

25

mA

° C

T_STG

T_AMB

T_J

No bias

–65

150

Under bias

–65

135

BGA packages under bias

135

Table 6–2. Stratix GX Device Recommended Operating Conditions (Part 1 of 2)

Note (7), (12), (13)

Symbol

Parameter

Conditions

Minimum

Maximum

Unit

V_CCINT

Supply voltage for internal logic (4)

and input buffers

1.425

1.575

V

V_CCIO

Supply voltage for output buffers, (4), (5)

3.3-V operation

3.00 (3.135)

2.375

1.71

3.60 (3.465)

2.625

1.89

Supply voltage for output buffers, (4)

2.5-V operation

Supply voltage for output buffers, (4)

1.8-V operation

Supply voltage for output buffers, (4)

1.5-V operation

1.4

1.6

V_I

Input voltage

(3), (6)

–0.5

4.1

Altera Corporation

August 2005

6–1

Operating Conditions

Table 6–2. Stratix GX Device Recommended Operating Conditions (Part 2 of 2)

Note (7), (12), (13)

Symbol

Parameter

Conditions

Minimum

Maximum

V_CCIO

Unit

V_O

T_J

Output voltage

Operating junction temperature

0

V

For commercial

use

85

° C

For industrial use

–40

100

° C

Table 6–3. Stratix GX Device DC Operating Conditions

Note (12)

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Unit

I_I

Input pin leakage

current

V_I= V_CCIOmaxto 0 V

(8)

–10

10

μA

I_OZ

Tri-stated I/O pin

leakage current

V_O= V_CCIOmaxto 0 V

(8)

–10

10

μA

R_CONF

Value of I/O pin pull-

up resistor before

and during

V

_CCIO= 3.0 V (9)

_CCIO= 2.375 V (9)

_CCIO= 1.71 V (9)

20

30

60

50

80

kΩ

150

configuration

Table 6–4. Stratix GX Transceiver Block Absolute Maximum Ratings

Symbol Parameter Conditions

Minimum Maximum

Units

V_CCA

V_CCP

V_CCR

Transceiver block supply Commercial and

voltage industrial

–0.5

4.6

2.4

V

Transceiver block supply Commercial and

voltage industrial

Transceiver block supply Commercial and

Voltage industrial

V_CCT

V_CCG

Transceiver block supply Commercial and

voltage industrial

–0.5

2.4

V

Transceiver block supply Commercial and

voltage

industrial

Receiver input

voltage

V_ICMV_ODsingle / 2

Commercial and

industrial

1.675

(10), (13)

V_ICMV_ODsingle / 2

Commercial and

industrial

1.675

(10), (13)

V

refclkb input

voltage

6–2

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–5. Stratix GX Transceiver Block Operating Conditions

Symbol

Parameter

Conditions

Minimum

Typical Maximum Units

V_CCA

Transceiver block supply

voltage

Commercial

and industrial

3.135

3.3

3.465

V

V_CCP

Transceiver block supply

voltage

Commercial

and industrial

1.425

1.5

1.575

V

V_CCR

V_CCT

V_CCG

Transceiver block supply

voltage

Commercial

and industrial

1.425

170

1.5

1.575

2,000

1,175

1,600

V

Transceiver block supply

voltage

Commercial

and industrial

V

Transceiver block supply

voltage

Commercial

and industrial

V

V_ID

Receiver input differential

voltage swing

Commercial

and industrial

mV

(differential p-p)

Commercial

and industrial

400

refclkb input differential

voltage swing

V_ICM

Receiver input common

mode voltage

Commercial

and industrial

1,025

350

1,100

V_OD

(differential p-p)

Transmitter output differential Commercial

voltage

and industrial

V_OCM

Transmitter output common

mode voltage

Commercial

and industrial

750

2K

R_REF(11)

Reference resistor

Commercial

2K –1%

2K +1%

Ω

and industrial

Table 6–6. Stratix GX Transceiver Block On-Chip Termination (Part 1 of 2)

Symbol

Parameter

Conditions

Min

Typ

Max Units

Rx

Receiver termination

Commercial and industrial, 100-Ω setting

Commercial and industrial, 120-Ω setting

Commercial and industrial, 150-Ω setting

103

120

149

103

120

149

108

128

158

108

128

158

113

134

167

113

134

167

Ω

Tx

Transmitter termination Commercial and industrial, 100-Ω setting

Commercial and industrial, 120-Ω setting

Commercial and industrial, 150-Ω setting

Altera Corporation

August 2005

6–3

Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–6. Stratix GX Transceiver Block On-Chip Termination (Part 2 of 2)

Symbol

Parameter

Conditions

Min

Typ

Max Units

Refclkb Dedicated transceiver

clock termination

Commercial and industrial, 100-Ω setting

Commercial and industrial, 120-Ω setting

Commercial and industrial, 150-Ω setting

103

120

149

108

128

158

113

134

167

Ω

Notes to Tables 6–1 through 6–6:

(1) See the Operating Requirements for Altera Devices Data Sheet.

(2) Conditions beyond those listed in Table 6–1 may cause permanent damage to a device. Additionally, device

operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device.

(3) Minimum DC input is –0.5 V. During transitions, the inputs may undershoot to –0.5 V or overshoot to 4.6 V for

input currents less than 100 mA and periods shorter than 20 ns. (The information in this note does not include the

transceiver pins. See note 13 for information about the transient voltage on the transceiver pins.)

(4) Maximum V_CCrise time is 100 ms, and V_CCmust rise monotonically.

(5) V_CCIOmaximum and minimum conditions for LVPECL, LVDS, and 3.3-V PCML are shown in parentheses.

(6) All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before V_CCINTand V_CCIOare

powered.

(7) Typical values are for T_A= 25° C, V_CCINT= 1.5 V, and V_CCIO= 1.5 V, 1.8 V, 2.5 V, and 3.3 V.

(8) This value is specified for normal device operation. The value may vary during power-up. This applies for all V_CCIO

settings (3.3, 2.5, 1.8, and 1.5 V).

(9) Pin pull-up resistance values decrease if an external source drives the pin higher than V_CCIO

.

(10) The device can tolerate prolonged operation at this absolute maximum, as long as the maximum specification is

not violated.

(11) Each useable quad requires its own R_REFresistor path to ground. For example, the “D” in the EP1SGX25DC1020

device code means it has two useable quad so two different R_REFpins must be connected to a R_REFresistor each to

ground. The DC signal on the R_REFpin must be as clean as possible. Ensure that no noise is coupled to this pin.

(12) The Stratix GX device’s recommended operating conditions do not include the transceiver. Refer to Tables 6–4 to

6–7.

(13) Minimum DC input to the transceiver pins is –0.5 V. During transitions, the transceiver pins may undershoot to

–0.5 V or overshoot to 3.5 V for input currents less than 100 mA and periods shorter than 20 ns.

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 1 of 7)

-6 Commercial &

Industrial Speed

Grade

-7 Commercial &

Industrial Speed

Grade

-5 Commercial

Speed Grade (1)

Symbol /

Description

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

Power per

quadrant

(PCS +

PMA)

3.125 Gbps, 400-

mV V_od

0 pre-emphasis

450

mW

6–4

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 2 of 7)

-6 Commercial &

-7 Commercial &

Industrial Speed

-5 Commercial

Speed Grade (1)

Industrial Speed

Symbol /

Description

Grade

(1)

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

20

Reference Clock

Jitter

components

<20 MHz

20

ps

tolerance

(peak-to-

peak)

Wideband

50

Reference

input clock

frequency

Dedicated

refclkb pins

25

650

25

650

25

312.5 MHz

PLD clock

resources

325

156.25 MHz

Receiver

Serial data

rate

(general)

Commercial /

industrial

614

500

20

3,187.5 614

3,187.5 500

3,187.5 614

3,187.5 500

2,500 Mbps

312.5 MHz

Serial data

rate (8B/10B industrial

encoded)

Commercial /

Parallel

398.4

100

20

375

100

20

transceiver/

logic array

interface

speed

Rate

XAUI mode only

100

ppm

matching

frequency

tolerance

8B/10B Custom Receiver Jitter Tolerance using Encoded CJPAT

Note (2)

Deterministic 500 Mbps

jitter

0.45

0.71

UI

Total jitter

500 Mbps

0.71

Fibre Channel Receiver Jitter Tolerance using 8B/10B Encoded CJTPAT

Note (2)

Deterministic 1.0625 Gbps

jitter

0.37

0.68

UI

Total jitter

1.0625 Gbps

0.68

Altera Corporation

August 2005

6–5

Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 3 of 7)

-6 Commercial &

Industrial Speed

-7 Commercial &

Industrial Speed

Grade

-5 Commercial

Speed Grade (1)

Symbol /

Description

Grade

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

Sinusoidal

jitter

f = 42.5 kHz at

1.0625 Gbps

1.5

UI

f = 637 kHz at

1.0625 Gbps

0.1

Deterministic 2.125 Gbps

jitter

0.33

Total jitter

2.125 Gbps

0.62

1.5

0.62

1.5

0.62

1.5

UI

Sinusoidal

jitter

f = 85 kHz at

2.125 Gbps

f = 1,274 kHz at

2.125 Gbps

0.1

UI

Serial Rapid I/O Receiver Jitter Tolerance using 8B/10B Encoded CJPAT

Note (2)

1.25 Gbps

Deterministic

jitter

0.45

UI

1.25 Gbps

Total jitter

0.71

0.41

0.71

0.41

0.71

0.41

UI

Deterministic 2.5 Gbps

jitter

Total jitter

2.5 Gbps

0.65

0.36

0.65

0.36

0.65

N/A

UI

Deterministic 3.125 Gbps

jitter

Total jitter

3.125 Gbps

0.60

N/A

UI

SONET Receiver Jitter Tolerance using PRBS23

Note (2)

f = 6 kHz at 2.48832

Gbps

Sinusoidal

jitter

1.5

UI

f = 1 MHz at

2.48832 Gbps

0.15

XAUI Receiver Jitter Tolerance using 8B/10B Encoded CJPAT

Note (2)

Deterministic 3.125 Gbps

jitter

0.37

N/A

UI

Total jitter

3.125 Gbps

0.65

6–6

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 4 of 7)

-6 Commercial &

-7 Commercial &

Industrial Speed

-5 Commercial

Speed Grade (1)

Industrial Speed

Symbol /

Description

Grade

(1)

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

Sinusoidal

jitter

f = 22.1 kHz at

3.125 Gbps

8.5

N/A

f = 1.875 MHz at

3.125 Gbps

0.1

N/A

f = 20 MHz at

3.125 Gbps

10^-12

32

10^-12

32

10^-12

32

BER

Receive

latency (4)

Single width

Double width

7

5

7

5

7

5

(3)

19

Channel to

channel bit

skew

XAUI mode /

inter-quadrant

only

40

N/A

UI (7)

tolerance (5),

(6)

Run-length

(8)

80

UI

Receive

return loss

(differential)

100 MHz to

2.5 Ghz

–10

dB

Receive

return loss

(common

mode)

100 MHz to

2.5 Ghz

–6

dB

Transmitter

Commercial /

industrial

Serial data

rate

500

20

3,187.5 500

398.4 20

3,187.5 500

2,500 Mbps

312.5 MHz

Parallel

transceiver/

core

375

20

interface

speed

8B/10B Custom Transmitter Jitter using Encoded CRPAT

Note (9)

Deterministic 500 Mbps

0.11

0.18

0.11

0.18

UI

jitter

Pre-emphasis = 1

_OD= 1,400 mV

V

Total jitter

0.18

Altera Corporation

August 2005

6–7

Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 5 of 7)

-6 Commercial &

Industrial Speed

-7 Commercial &

Industrial Speed

Grade

-5 Commercial

Speed Grade (1)

Symbol /

Description

Grade

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

Fibre Channel Transmitter Jitter using 8B/10B Encoded CRPAT

Note (9)

Deterministic 1.0625 Gbps

0.09

UI

jitter

Pre-emphasis = 0

_OD= 1,200 mV

V

Total jitter

0.17

0.16

0.17

0.16

0.17

0.16

UI

Deterministic 2.125 Gbps

jitter

Pre-emphasis= 1

_OD= 1,200 mV

V

Total jitter

0.33

UI

Serial Rapid I/O Short Run Transmitter Jitter using 8B/10B Encoded CRPAT

Note (9)

Deterministic

jitter

1.25 Gbps

Pre-emphasis = 1

0.09

UI

V

_OD= 1,600 mV

Total jitter

0.17

0.15

0.17

0.15

0.17

0.15

UI

Deterministic 2.5 Gbps

jitter

Pre-emphasis = 1

_OD= 800 mV

V

Total jitter

0.32

0.15

0.32

0.15

0.32

N/A

UI

Deterministic 3.125 Gbps

jitter

Pre-emphasis = 1

_OD= 800 mV

V

Total jitter

0.32

N/A

UI

Serial Rapid I/O Long Run Transmitter Jitter using 8B/10B Encoded CRPAT

Note (9)

1.25 Gbps

Pre-emphasis = 1

Deterministic

jitter

0.09

V_OD= 1,600 mV

Total jitter

0.17

0.18

0.17

0.18

0.17

0.18

UI

2.5 Gbps

Pre-emphasis = 2

Deterministic

jitter

V_OD= 1,400 mV

Total jitter

0.35

0.20

0.35

0.20

0.35

N/A

UI

3.125 Gbps

Pre-emphasis = 2

Deterministic

jitter

V_OD= 1,400 mV

Total jitter

0.37

0.20

0.37

0.20

N/A

UI

SONET Transmitter Jitter PRBS23

Note (9)

2.48832 Gbps

Pre-emphasis = 1

Total jitter

0.20

V_OD= 800 mV

6–8

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 6 of 7)

-6 Commercial &

-7 Commercial &

Industrial Speed

-5 Commercial

Speed Grade (1)

Industrial Speed

Symbol /

Description

Grade

(1)

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

XAUI Transmitter Jitter using 8B/10B Encoded CJPAT

Note (9)

3.125 Gbps

Pre-emphasis = 0

Deterministic

jitter

0.15

0.32

0.15

0.32

N/A

UI

V_OD= 1,200 mV

Total jitter

N/A

UI

Jitter transfer Low bandwidth

3

MHz

bandwidth

setting at

(10)

3.125 Gbps

High bandwidth

setting at

3.125 Gbps

4.7

3.2

4.3

4.7

3.2

4.3

N/A

3.2

4.3

MHz

Low bandwidth

setting at

2.5 Gbps

High bandwidth

setting at

2.5 Gbps

Output t_RISE

20% to 80%

60

3

130

8

60

3

130

8

60

3

130

8

ps

(3)

ps

Output t_FALL80% to 20%

Transmit

latency (11)

Single width

Double width

3

7

3

7

3

7

Intra

10

differential

pair skew

Channel to

channel

skew

Within a single

quadrant

50

ps

Altera Corporation

August 2005

6–9

Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–7. Stratix GX Transceiver Block AC Specification (Part 7 of 7)

-6 Commercial &

Industrial Speed

-7 Commercial &

Industrial Speed

Grade

-5 Commercial

Speed Grade (1)

Symbol /

Description

Grade

Conditions

Unit

(1)

Min Typ

Max

Min Typ

Max

Min Typ

Max

Outputreturn 100 MHz to

loss 2.5 GHz

–10

dB

Notes to Table 6–7:

(1) All numbers for the -6 and -7 speed grades are for both commercial and industrial unless specified otherwise in the

Conditions column. Speed grade -5 is available only for commercial specifications.

(2) Not all V_IDand equalizer values will get the same results. The condition for the specification was that the V_IDbefore

jitter was added is 1,000 mV and the equalizer was set to the maximum condition of 111 (equalizer control setting

= 4 in the MegaWizard Plug-In Manager).

(3) Number of parallel clocks.

(4) Receive latency delay from serial receiver indata to parallel receiver data.

(5) Per IEEE Standard 802.3ae @ 3.125 for –5 and –6.

(6) The specification is for channel aligner tolerance.

(7) UI = Unit Interval.

(8) Run-length conditions are true for all data rates, but the average transition density must be enough to keep the

receiver phase aligned and the overall data must be DC balanced.

(9) Not all combinations of V_ODand pre-emphasis will get the same results.

(10) The numbers are for 3.125-Gbps data rate for –5 and –6 devices and 2.5 Gbps for –7 devices.

(11) Transmitter latency delay from parallel transceiver data to serial transceiver out data.

Table 6–8. LVTTL Specifications

Symbol

Parameter

Output supply voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Conditions

Minimum

3.0

Maximum

3.6

Units

V_CCIO

V

V_IH

V_IL

1.7

4.1

–0.5

2.4

0.7

V_OH

V_OL

I_OH= –4 to –24 mA (1)

I_OL= 4 to 24 mA (1)

0.45

Table 6–9. LVCMOS Specifications

Symbol

Parameter

Conditions

Minimum

3.0

Maximum

3.6

Units

V_CCIO

Output supply voltage

High-level input voltage

Low-level input voltage

V

V_IH

V_IL

1.7

4.1

–0.5

0.7

6–10

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–9. LVCMOS Specifications

Symbol

Parameter

Conditions

Minimum

Maximum

Units

V_OH

High-level output voltage

V_CCIO= 3.0,

V

_CCIO– 0.2

V

I_OH= –0.1 mA

V_OL

Low-level output voltage

V_CCIO= 3.0,

I_OL= 0.1 mA

0.2

V

Table 6–10. 2.5-V I/O Specifications

Note (1)

Symbol

Parameter

Output supply voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Conditions

Minimum

2.375

1.7

Maximum

2.625

4.1

Units

V

V_CCIO

V_IH

V_IL

V

–0.5

2.1

0.7

V

V_OH

I_OH= –0.1 mA

V

I

_OH= –1 mA

_OH= –2 to –16 mA (1)

2.0

V

1.7

V

V_OL

Low-level output voltage

I_OL= 0.1 mA

0.2

0.4

0.7

V

I

_OH= 1 mA

V

_OH= 2 to 16 mA (1)

V

Table 6–11. 1.8-V I/O Specifications

Symbol

Parameter

Output supply voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Conditions

Minimum

Maximum

Units

V_CCIO

1.65

0.65 × V_CCIO2.25

–0.3 0.35 × V_CCIO

1.95

V

V_IH

V_IL

V_OH

V_OL

I_OH= –2 to –8 mA (1) V_CCIO– 0.45

I_OL= 2 to 8 mA (1)

0.45

Table 6–12. 1.5-V I/O Specifications

Symbol

Parameter

Output supply voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Conditions

Minimum

Maximum

Units

V_CCIO

1.4

1.6

V

V_IH

V_IL

0.65 × V_CCIOV_CCIO+ 0.3

–0.3

0.35 × V_CCIO

V_OH

I_OH= –2 mA (1)

0.75 × V_CCIO

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–12. 1.5-V I/O Specifications

Symbol

Parameter

Conditions

Minimum

Maximum

Units

V_OL

Low-level output voltage

I_OL= 2 mA (1)

0.25 × V_CCIO

V

Note to Tables 6–8 through 6–12:

(1) Drive strength is programmable according to values in found in the Stratix GX Architecture chapter of the

Stratix GX Device Handbook, Volume 1.

Figures 6–1 and 6–2 show receiver input and transmitter output

waveforms, respectively, for all differential I/O standards (LVDS, 3.3-V

PCML, LVPECL, and HyperTransport technology).

Figure 6–1. Receiver Input Waveforms for Differential I/O Standards

Single-Ended Waveform

Positive Channel (p) = V

OH

V

OD

Negative Channel (n) = V

OL

V

CM

Ground

Differential Waveform

(V

OD

(Differential) = 2 x V (single-ended))

OD

V

OD

p − n = 0 V

V

OD

6–12

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

DC & Switching Characteristics

Figure 6–2. Transmitter Output Waveforms for Differential I/O Standards

Single-Ended Waveform

Positive Channel (p) = V

OH

V

OD

Negative Channel (n) = V

OL

V

CM

Ground

Differential Waveform

(V

OD

(Differential) = 2 x V (single-ended))

OD

V

OD

p − n = 0 V

V

OD

Tables 6–13 through 6–33 provide information about specifications and

bus hold parameters for 1.5-V Stratix GX devices. Notes for Tables 6–14

through 6–33 immediately follow Table 6–33.

Table 6–13. 3.3-V LVDS I/O Specifications (Part 1 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

V_ID(1)

I/O supply voltage

3.135

300

3.3

3.465

1,000

V

Input differential voltage

swing (single-ended)

0.1 V < V_CM< 1.1 V

W = 1 through 10

mV

1.1 V < V_CM< 1.6 V

W = 1

200

100

300

1,000

mV

1.1 V < V_CM< 1.6 V

W = 2 through 10

1.6 V < V_CM< 1.8 V

W = 1 through 10

Altera Corporation

August 2005

6–13

Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–13. 3.3-V LVDS I/O Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_ICM(1)

Input common-mode

voltage

LVDS

0.3 V < V_ID< 1.0 V

W = 1 through 10

100

1,600

1,100

250

1,100

1,800

1,600

mV

LVDS

0.3 V < V_ID< 1.0 V

W = 1 through 10

LVDS

0.2 V < V_ID< 1.0 V

W = 1

LVDS

0.1 V < V_ID< 1.0 V

W = 2 through 10

V_OD

Differential output voltage R_L= 100 Ω

375

550

50

mV

ΔV_OD

Change in V_ODbetween

high and low

R_L= 100 Ω

V_OCM

ΔV_OCM

R_L

Output common-mode

voltage

R_L= 100 Ω

1,125

90

1,200

1,375

50

mV

Ω

Change in V_OCMbetween R_L= 100 Ω

high and low

Receiver differential input

resistor, external

100

110

Note to Table 6–13:

(1) For up to 1 Gbps in DPA mode and 840 Mbps in non-DPA mode

Table 6–14. 3.3-V PCML Specifications (Part 1 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

I/O supply voltage

3.135

300

3.3

3.465

600

V

V_ID

Input differential voltage

swing (single-ended)

mV

V_ICM

V_OD

Input common mode

voltage

1.5

3.465

500

50

V

mV

V

Output differential voltage

(single-ended)

300

370

ΔV_OD

V_OCM

Change in V_ODbetween

high and low

Output common mode

voltage

2.5

2.85

3.3

6–14

Altera Corporation

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DC & Switching Characteristics

Table 6–14. 3.3-V PCML Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

ΔV_OCM

Change in V_OCMbetween

high and low

50

mV

V_T

R₁

Output termination voltage

V_CCIO

50

V

Output external pull-up

resistors

45

55

W

R₂

Output external pull-up

resistors

50

W

Table 6–15. LVPECL Specifications

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

I/O supply voltage

3.135

300

3.3

3.465

1,000

V

V_ID

Input differential voltage

swing (single-ended)

mV

V_ICM

Input common mode

voltage

1

2

V

V_OD

Differential output voltage R_L= 100 Ω

525

1.5

700

1.7

970

1.9

mV

V_OCM

Output common mode

voltage

R_L= 100 Ω

R_L

Receiver differential input

resistor, external

90

100

110

W

Table 6–16. HyperTransport Specifications (Part 1 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

I/O supply voltage

2.375

380

2.5

2.625

820

50

V

V_OD

Differential output voltage R_L= 100 Ω

485

mV

ΔV_OD

Change in between high

and low

R_L= 100 Ω

V_OCM

ΔV_OCM

V_ID

Output common mode

voltage

440

300

650

780

50

mV

Change in between high

and low

Differential input voltage

swing (single-ended)

900

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–16. HyperTransport Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_ICM

Input common mode

voltage

300

900

mV

R_L

Receiver differential input

resistor, external

90

100

110

W

Table 6–17. 3.3-V PCI Specifications

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

Output supply voltage

High-level input voltage

3.0

3.3

3.6

V

V_IH

0.5 ×

V_CCIO

0.5

+

V_IL

Low-level input voltage

High-level output voltage

Low-level output voltage

–0.5

0.3 ×

V_CCIO

V

V_OH

V_OL

I_OUT= –500 μA

I_OUT= 1,500 μA

0.9 ×

V_CCIO

0.1 ×

V_CCIO

Table 6–18. PCI-X Specifications

Symbol

Parameter

Conditions

Minimum Typical Maximum Units

V_CCIO

Output supply voltage

High-level input voltage

3.0

3.6

V

V_IH

0.5 ×

V_CCIO

0.5

+

V_IL

Low-level input voltage

Input pull-up voltage

–0.5

0.35 ×

V_CCIO

V

V_IPU

V_OH

V_OL

0.7 ×

V_CCIO

High-level output voltage

Low-level output voltage

I_OUT= –500 μA

I_OUT= 1,500 μA

0.9 ×

V_CCIO

0.1 ×

V_CCIO

6–16

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–19. GTL+ I/O Specifications

Symbol

Parameter

Termination voltage

Reference voltage

Conditions

Minimum Typical Maximum Units

V_TT

1.35

1.5

1.0

1.65

1.12

V

V_REF

V_IH

0.88

High-level input voltage

Low-level input voltage

V_REF+ 0.1

V_IL

V_REF

0.1

–

V_OL

Low-level output voltage

I_OL= 36 mA (1)

0.65

V

Table 6–20. GTL I/O Specifications

Symbol

Parameter

Termination voltage

Reference voltage

High-level input voltage

Conditions

Minimum Typical Maximum Units

V_TT

1.14

0.74

1.2

0.8

1.26

0.86

V

V_REF

V_IH

V_REF

+

0.05

V_IL

Low-level input voltage

Low-level output voltage

V_REF

0.05

–

V

V_OL

I_OL= 40 mA (1)

0.4

Table 6–21. SSTL-18 Class I Specifications

Symbol

Parameter

Conditions

Minimum

Typical

1.8

Maximum

1.95

Units

V_CCIO

Output supply voltage

Reference voltage

1.65

V

V_REF

V_TT

0.8

0.9

1.0

Termination voltage

High-level DC input voltage

V_REF– 0.04

V_REF

V_REF+ 0.04

V_IH(DC)

V_REF

+

0.125

V_IL(DC)

V_IH(AC)

V_IL(AC)

V_OH

Low-level DC input voltage

High-level AC input voltage

Low-level AC input voltage

High-level output voltage

Low-level output voltage

V_REF

0.125

–

V

V_REF

0.275

+

V_REF

0.275

–

I_OH= –6.7 mA

(1)

V_TT+ 0.475

V_OL

I_OL= 6.7 mA (1)

V_TT– 0.475

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Operating Conditions

Table 6–22. SSTL-18 Class II Specifications

Symbol

Parameter

Conditions

Minimum

Typical

1.8

Maximum

Units

V_CCIO

Output supply voltage

Reference voltage

1.65

1.95

V

V_REF

V_TT

0.8

0.9

1.0

Termination voltage

High-level DC input voltage

V_REF– 0.04

V_REF

V_REF+ 0.04

V_IH(DC)

V_REF

+

0.125

V_IL(DC)

V_IH(AC)

V_IL(AC)

V_OH

Low-level DC input voltage

High-level AC input voltage

Low-level AC input voltage

High-level output voltage

Low-level output voltage

V_REF

0.125

–

V

V_REF

0.275

+

V_REF

0.275

I_OH= –13.4 mA V_TT+ 0.630

(1)

V_OL

I_OL= 13.4 mA (1)

V_TT– 0.630

Table 6–23. SSTL-2 Class I Specifications

Symbol

Parameter

Conditions

Minimum

2.375

Typical

2.5

Maximum

2.625

Units

V_CCIO

Output supply voltage

Termination voltage

Reference voltage

V

V_TT

V_REF

V_IH

V_REF– 0.04

1.15

V_REF

1.25

V_REF+ 0.04

1.35

High-level input voltage

Low-level input voltage

High-level output voltage

V_REF+ 0.18

–0.3

3.0

V_IL

V_REF– 0.18

V_OH

I_OH= –8.1 mA

V_TT+ 0.57

(1)

V_OL

Low-level output voltage

I_OL= 8.1 mA (1)

V_TT– 0.57

V

Table 6–24. SSTL-2 Class II Specifications (Part 1 of 2)

Symbol

Parameter

Conditions

Minimum

2.3

Typical

2.5

Maximum

2.7

Units

V_CCIO

Output supply voltage

Termination voltage

Reference voltage

V

V_TT

V_REF

V_IH

V_REF– 0.04

1.15

V_REF

1.25

V_REF+ 0.04

1.35

High-level input voltage

Low-level input voltage

V_REF+ 0.18

–0.3

V_CCIO+ 0.3

V_REF– 0.18

V_IL

6–18

Altera Corporation

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Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–24. SSTL-2 Class II Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V_OH

High-level output voltage

I_OH= –16.4 mA V_TT+ 0.76

V

(1)

V_OL

Low-level output voltage

I_OL= 16.4 mA (1)

V_TT– 0.76

V

Table 6–25. SSTL-3 Class I Specifications

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V

V_CCIO

Output supply voltage

Termination voltage

3.0

3.3

3.6

V_TT

V_REF

V_IH

V_REF– 0.05 V_REF

V_REF+ 0.05

1.7

V

Reference voltage

1.3

1.5

V

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

V_REF+ 0.2

–0.3

V_CCIO+ 0.3

V_REF– 0.2

V

V_IL

V

V_OH

V_OL

I_OH= –8 mA (1) V_TT+ 0.6

I_OL= 8 mA (1)

V

V_TT– 0.6

V

Table 6–26. SSTL-3 Class II Specifications

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

3.6

Units

V

V_CCIO

Output supply voltage

Termination voltage

3.0

3.3

V_TT

V_REF

V_IH

V_REF– 0.05 V_REF

V_REF+ 0.05

1.7

V

Reference voltage

1.3

1.5

V

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

V_REF+ 0.2

–0.3

V_CCIO+ 0.3

V_REF– 0.2

V

V_IL

V

V_OH

V_OL

I_OH= –16 mA (1) V_TT+ 0.8

I_OL= 16 mA (1)

V

V_TT– 0.8

V

Table 6–27. 3.3-V AGP 2× Specifications (Part 1 of 2)

Symbol

Parameter

Output supply voltage

Reference voltage

Conditions

Minimum

Typical

Maximum

Units

V_CCIO

3.15

3.3

3.45

V

V_REF

0.39 ×

0.41 ×

V_CCIO

V_IH

V_IL

High-level input voltage (2)

Low-level input voltage (2)

0.5 × V_CCIO

V_CCIO+ 0.5

V

0.3 × V_CCIO

Altera Corporation

August 2005

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Operating Conditions

Table 6–27. 3.3-V AGP 2× Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V_OH

V_OL

High-level output voltage

Low-level output voltage

I_OUT= –0.5 mA 0.9 × V_CCIO

3.6

V

I_OUT= 1.5 mA

0.1 × V_CCIO

Table 6–28. 3.3-V AGP 1× Specifications

Symbol

Parameter

Conditions

Minimum

Maximum

3.45

Units

V_CCIO

Output supply voltage

High-level input voltage (2)

Low-level input voltage (2)

High-level output voltage

Low-level output voltage

3.15

0.5 × V_CCIO

3.3

V

V_IH

V_IL

V_CCIO+ 0.5

0.3 × V_CCIO

3.6

V_OH

V_OL

I_OUT= –0.5 mA 0.9 × V_CCIO

I_OUT= 1.5 mA

0.1 × V_CCIO

Table 6–29. 1.5-V HSTL Class I Specifications

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V

V_CCIO

Output supply voltage

Input reference voltage

Termination voltage

1.4

1.5

1.6

0.9

0.8

V_REF

V_TT

0.68

0.75

V

0.7

V

_IH(DC)

DC high-level input voltage

DC low-level input voltage

AC high-level input voltage

AC low-level input voltage

High-level output voltage

Low-level output voltage

V_REF+ 0.1

–0.3

V

_IL(DC)

_IH(AC)

_IL(AC)

V_REF– 0.1

V_REF– 0.2

0.4

V

V_REF+ 0.2

V

V_OH

V_OL

I_OH= 8 mA (1)

I_OH= –8 mA (1)

V_CCIO– 0.4

V

Table 6–30. 1.5-V HSTL Class II Specifications (Part 1 of 2)

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V_CCIO

Output supply voltage

Input reference voltage

Termination voltage

1.4

1.5

1.6

0.9

0.8

V

V_REF

V_TT

0.68

0.75

0.7

V

_IH(DC)

_IL(DC)

DC high-level input voltage

DC low-level input voltage

V_REF+ 0.1

–0.3

V_REF– 0.1

6–20

Stratix GX Device Handbook, Volume 1

Altera Corporation

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DC & Switching Characteristics

Table 6–30. 1.5-V HSTL Class II Specifications (Part 2 of 2)

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

V_REF– 0.2

0.4

Units

V_IH(AC)

AC high-level input voltage

AC low-level input voltage

High-level output voltage

Low-level output voltage

V_REF+ 0.2

V

_IL(AC)

V_OH

V_OL

I_OH= 16 mA (1) V_CCIO– 0.4

I_OH= –16 mA (1)

Table 6–31. 1.5-V Differential HSTL Specifications

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

Units

V_CCIO

I/O supply voltage

1.4

1.5

1.6

V

_DIF(DC)

_CM(DC)

_DIF(AC)

DC input differential

voltage

0.2

DC common mode input

voltage

0.68

0.4

0.9

V

AC differential input

voltage

Table 6–32. CTT I/O Specifications

Symbol

Parameter

Conditions

Minimum

Typical

Maximum

3.6

Units

V_CCIO

_TT/V_REF

Output supply voltage

3.0

3.3

1.5

V

Termination and input

reference voltage

1.35

1.65

V_IH

V_IL

V_OH

V_OL

I_O

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

V_REF+ 0.2

V_REF+ 0.4

–10

V

V_REF– 0.2

I_OH= –8 mA

I_OL= 8 mA

V

V_REF– 0.4

10

V

Output leakage current

GND ≤ V_OUT

≤

μA

(when output is high Z)

V_CCIO

Altera Corporation

August 2005

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Power Consumption

Table 6–33. Bus Hold Parameters

V_CCIOLevel

Parameter

Conditions

Units

1.5 V

Max

1.8 V

Max

2.5 V

Max

3.3 V

Max

Min

Low sustaining V_IN> V_IL

current

25

30

50

70

μA

V

(maximum)

High sustaining V_IN< V_IH

–25

–30

–50

–70

current

(minimum)

Low overdrive

current

0 V < V_IN

V_CCIO

<

160

–160

1.0

200

–200

1.07

300

–300

1.7

500

–500

2.0

High overdrive 0 V < V_IN

<

current

V_CCIO

Bus-hold trip

point

0.5

0.68

0.7

0.8

Notes to Tables 6–14 through 6–33:

(1) Drive strength is programmable according to values in the Stratix GX Architecture chapter of the Stratix GX Device

Handbook, Volume 1.

(2) V_REFspecifies the center point of the switching range.

Detailed power consumption information for Stratix GX devices will be

released when available.

Power

Consumption

The DirectDrive^™technology and MultiTrack^™interconnect ensure

Timing Model

predictable performance, accurate simulation, and accurate timing

analysis across all Stratix GX device densities and speed grades. This

section describes and specifies the performance, internal, external, and

PLL timing specifications.

All specifications are representative of worst-case supply voltage and

junction temperature conditions.

Preliminary & Final Timing

Timing models can have either preliminary or final status. The

Quartus^®II software displays an informational message during the

design compilation if the timing models are preliminary. Table 6–34

shows the status of the Stratix GX device timing models.

6–22

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Preliminary status means the timing model is subject to change. Initially,

timing numbers are created using simulation results, process data, and

other known parameters. These tests are used to make the preliminary

numbers as close to the actual timing parameters as possible.

Final timing numbers are based on actual device operation and testing.

These numbers reflect the actual performance of the device under

worst-case voltage and junction temperature conditions.

Table 6–34. Stratix GX Device Timing Model Status

Device

Preliminary

Final

EP1SGX10

—

v

EP1SGX25

EP1SGX40

Performance

Table 6–35 shows Stratix GX device performance for some common

designs. All performance values were obtained with Quartus II software

compilation of LPM, or MegaCore^®functions for the FIR and FFT

designs.

Table 6–35. Stratix GX Device Performance (Part 1 of 3)

Notes (1), (2)

Resources Used

Performance

-6 -7

Speed Speed Speed Units

Grade Grade Grade

TriMatrix

LEs Memory

Blocks

-5

Applications

DSP

Blocks

LE

16-to-1 multiplexer (1)

32-to-1 multiplexer (3)

16-bit counter

22

46

16

64

0

1

0

407.83 324.56 288.68

318.26 255.29 242.89

422.11 422.11 390.01

321.85 290.52 261.23

317.76 277.62 241.48

MHz

64-bit counter

TriMatrix

memory

Simple dual-port RAM 32 × 18

bit

M512 block

FIFO 32 × 18 bit

30

0

1

0

319.18 278.86 242.54

290.86 255.55 222.27

MHz

TriMatrix

memory

Simple dual-port RAM 128 × 36

bit

M4K block

True dual-port RAM 128 × 18 bit

FIFO 128 × 36 bit

0

1

0

290.86 255.55 222.27

MHz

34

Altera Corporation

August 2005

6–23

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–35. Stratix GX Device Performance (Part 2 of 3)

Notes (1), (2)

Resources Used

Performance

-6 -7

Speed Speed Speed Units

Grade Grade Grade

TriMatrix

LEs Memory

Blocks

-5

Applications

DSP

Blocks

TriMatrix

memory

M-RAM

block

Single port

RAM 4K × 144 bit

1

0

1

0

255.95 223.06 194.06

255.95 233.06 194.06

278.94 243.19 211.59

255.95 223.06 194.06

280.66 254.32 221.28

269.83 237.69 206.82

275.86 244.55 212.76

287.85 253.29 220.36

MHz

Simple dual-port

RAM 4K × 144 bit

True dual-port

RAM 4K × 144 bit

Single port

RAM 8K × 72 bit

Simple dual-port

RAM 8K × 72 bit

True dual-port

RAM 8K × 72 bit

Single port

RAM 16K × 36 bit

Simple dual-port

RAM 16K × 36 bit

True dual-port

RAM 16K × 36 bit

TriMatrix

memory

M-RAM

block

Single port

RAM 32K × 18 bit

Simple dual-port

RAM 32K × 18 bit

True dual-port

RAM 32K × 18 bit

Single port

RAM 64K × 9 bit

Simple dual-port

RAM 64K × 9 bit

True dual-port

RAM 64K × 9 bit

DSP block 9 × 9-bit multiplier (3)

18 × 18-bit multiplier (4)

36 × 36-bit multiplier (4)

36 × 36-bit multiplier (5)

18-bit, 4-tap FIR filter

0

1

335.0 293.94 255.68

278.78 237.41 206.52

148.25 134.71 117.16

278.78 237.41 206.52

MHz

6–24

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August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–35. Stratix GX Device Performance (Part 3 of 3)

Notes (1), (2)

Resources Used

Performance

TriMatrix

LEs Memory

Blocks

-5

-6

-7

Applications

DSP

Blocks

Speed Speed Speed Units

Grade Grade Grade

Larger

Designs

8-bit, 16-tap parallel FIR filter

8-bit, 1,024-point FFT function

58

0

5

4

1

141.26 133.49 114.88

261.09 235.51 205.21

MHz

870

Notes to Table 6–35:

(1) These design performance numbers were obtained using the Quartus II software.

(2) Numbers not listed will be included in a future version of the data sheet.

(3) This application uses registered inputs and outputs.

(4) This application uses registered multiplier input and output stages within the DSP block.

(5) This application uses registered multiplier input, pipeline, and output stages within the DSP block.

Internal Timing Parameters

Internal timing parameters are specified on a speed grade basis

independent of device density. Tables 6–36 through 6–42 describe the

Stratix GX device internal timing microparameters for LEs, IOEs,

TriMatrix^™memory structures, DSP blocks, and MultiTrack

interconnects.

Table 6–36. LE Internal Timing Microparameter Descriptions

Symbol

Parameter

LE register setup time before clock

LE register hold time after clock

LE register clock-to-output delay

LE combinational LUT delay for data-in to data-out

Minimum clear pulse width

t_SU

t_H

t_CO

t_LUT

t_CLR

t_PRE

Minimum preset pulse width

t_CLKHL

Minimum clock high or low time

Altera Corporation

August 2005

6–25

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–37. IOE Internal Timing Microparameter Descriptions

Symbol

Parameter

t_SU

t_H

IOE input and output register setup time before clock

IOE input and output register hold time after clock

IOE input and output register clock-to-output delay

Row input pin to IOE combinational output

Column input pin to IOE combinational output

Row IOE data input to combinational output pin

Column IOE data input to combinational output pin

Minimum clear pulse width

t_CO

t_{PIN2COMBOUT_R}

t_{PIN2COMBOUT_C}

t_{COMBIN2PIN_R}

t_{COMBIN2PIN_C}

t_CLR

t_PRE

Minimum preset pulse width

t_CLKHL

Minimum clock high or low time

Table 6–38. DSP Block Internal Timing Microparameter Descriptions

Symbol

Parameter

t_SU

t_H

Input, pipeline, and output register setup time before clock

Input, pipeline, and output register hold time after clock

Input, pipeline, and output register clock-to-output delay

Input register to DSP block pipeline register in 9 × 9-bit mode

t_CO

t_INREG2PIPE9

t_INREG2PIPE18

Input register to DSP block pipeline register in 18 × 18-bit

mode

t_{PIPE2OUTREG2ADD}

t_{PIPE2OUTREG4ADD}

DSP block pipeline register to output register delay in two-

multipliers adder mode

DSP Block Pipeline Register to output register delay in four-

multipliers adder mode

t_PD9

Combinational input to output delay for 9 × 9-bit mode

Combinational input to output delay for 18 × 18-bit mode

Combinational input to output delay for 36 × 36-bit mode

Minimum clear pulse width

t_PD18

t_PD36

t_CLR

t_CLKHL

Minimum clock high or low time

6–26

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

DC & Switching Characteristics

Table 6–39. M512 Block Internal Timing Microparameter Descriptions

Symbol

Parameter

t_M512RC

Synchronous read cycle time

t_M512WC

Synchronous write cycle time

t_M512WERESU

t_M512WEREH

t_M512DATASU

t_M512DATAH

Write or read enable setup time before clock

Write or read enable hold time after clock

Data setup time before clock

Data hold time after clock

t_M512WADDRSU

t_M512WADDRH

t_M512RADDRSU

t_M512RADDRH

t_M512DATACO1

t_M512DATACO2

t_M512CLKHL

t_M512CLR

Write address setup time before clock

Write address hold time after clock

Read address setup time before clock

Read address hold time after clock

Clock-to-output delay when using output registers

Clock-to-output delay without output registers

Minimum clock high or low time

Minimum clear pulse width

Table 6–40. M4K Block Internal Timing Microparameter Descriptions (Part

1 of 2)

Symbol

Parameter

t_M4KRC

Synchronous read cycle time

t_M4KWC

Synchronous write cycle time

t_M4KWERESU

t_M4KWEREH

t_M4KBESU

Write or read enable setup time before clock

Write or read enable hold time after clock

Byte enable setup time before clock

Byte enable hold time after clock

A port data setup time before clock

A port data hold time after clock

t_M4KBEH

t_M4KDATAASU

t_M4KDATAAH

t_M4KADDRASU

t_M4KADDRAH

t_M4KDATABSU

t_M4KDATABH

t_M4KADDRBSU

t_M4KADDRBH

A port address setup time before clock

A port address hold time after clock

B port data setup time before clock

B port data hold time after clock

B port address setup time before clock

B port address hold time after clock

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–40. M4K Block Internal Timing Microparameter Descriptions (Part

2 of 2)

Symbol

Parameter

Clock-to-output delay when using output registers

Clock-to-output delay without output registers

Minimum clock high or low time

t_M4KDATACO1

t_M4KDATACO2

t_M4KCLKHL

t_M4KCLR

Minimum clear pulse width

Table 6–41. M-RAM Block Internal Timing Microparameter Descriptions

Symbol Parameter

tMRAMRC

Synchronous read cycle time

t_MRAMWC

Synchronous write cycle time

t_MRAMWERESU

t_MRAMWEREH

t_MRAMBESU

Write or read enable setup time before clock

Write or read enable hold time after clock

Byte enable setup time before clock

Byte enable hold time after clock

A port data setup time before clock

A port data hold time after clock

t_MRAMBEH

t_MRAMDATAASU

t_MRAMDATAAH

t_MRAMADDRASU

t_MRAMADDRAH

t_MRAMDATABSU

t_MRAMDATABH

t_MRAMADDRBSU

t_MRAMADDRBH

t_MRAMDATACO1

t_MRAMDATACO2

t_MRAMCLKHL

t_MRAMCLR

A port address setup time before clock

A port address hold time after clock

B port setup time before clock

B port hold time after clock

B port address setup time before clock

B port address hold time after clock

Clock-to-output delay when using output registers

Clock-to-output delay without output registers

Minimum clock high or low time

Minimum clear pulse width

6–28

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

DC & Switching Characteristics

Table 6–42. Routing Delay Internal Timing Microparameter Descriptions

Symbol

Parameter

t_R4

Delay for an R4 line with average loading; covers a distance

of four LAB columns

t_R8

Delay for an R8 line with average loading; covers a distance

of eight LAB columns

t_R24

t_C4

Delay for an R24 line with average loading; covers a distance

of 24 LAB columns

Delay for an C4 line with average loading; covers a distance

of four LAB rows

t_C8

Delay for an C8 line with average loading; covers a distance

of eight LAB rows

t_C16

Delay for an C16 line with average loading; covers a distance

of 16 LAB rows

t_LOCAL

Local interconnect delay

Table 6–43. Stratix GX Reset & PLL Lock Time Parameter Descriptions

Symbol

t_{ANALOGRESETPW}

t_{DIGITALRESETPW}

t_{TX_PLL_LOCK}

Parameter

Pulse width to power down analog circuits.

Pulse width to reset digital circuits

The time it takes the tx_pll to lock to the

reference clock.

t_{RX_FREQLOCK}

The time until the clock recovery unit (CRU)

switches to data mode from lock to reference

mode.

t_{RX_FREQLOCK2PHASELOCK}The time until CRU phase locks to data after

switching from lock to data mode.

Figure 6–3 shows the TriMatrix memory waveforms for the M512, M4K,

and M-RAM timing parameters shown in Tables 6–39 through 6–41.

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Timing Model

Figure 6–3. Dual-Port RAM Timing Microparameter Waveform

wrclock

t_WEREH

t_WERESU

wren

t_WADDRH

t_WADDRSU

an-1

an

a0

a1

a2

a3

a4

a5

wraddress

data-in

a6

t_DATAH

din-1

din4

din5

din6

din

t_DATASU

rdclock

t_WEREH

t_WERESU

rden

t_RC

rdaddress

bn

b1

b2

b3

b0

t_DATACO1

doutn-1

doutn

dout0

reg_data-out

doutn-2

t_DATACO2

doutn

doutn-1

dout0

unreg_data-out

6–30

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Figure 6–4. Stratix GX Transceiver Reset & PLL Lock Time Waveform Note (1)

t_WEREH

t_WERESU

rden

t_RC

rdaddress

bn

b0

t_DATACO1

doutn-1

doutn

reg_data-out

doutn-2

t_DATACO2

doutn

doutn-1

unreg_data-out

Note to Figure 6–4:

(1) Waveforms are for minimum pulse width timing and output timing only. Please refer to the Stratix GX Transceiver

User Guide for the complete reset sequence.

Tables 6–44 through 6–50 show the internal timing microparameters for

all Stratix GX devices.

Table 6–44. LE Internal Timing Microparameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

10

Max

Min

10

Max

Min

11

Max

t_SU

ns

t_H

100

114

t_CO

t_LUT

t_CLR

t_PRE

156

366

176

459

202

527

100

114

t_CLKHL

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August 2005

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Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–45. IOE Internal Timing Microparameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

64

Max

Min

68

Max

Min

68

Max

t_SU

t_H

ns

76

80

t_CO

162

1,038

927

171

1,093

976

171

t_{PIN2COMBOUT_R}

t_{PIN2COMBOUT_C}

t_{COMBIN2PIN_R}

t_{COMBIN2PIN_C}

t_CLR

1,256

1,122

3,563

3,860

2,944

3,189

3,099

3,357

262

90

276

95

317

109

t_PRE

t_CLKHL

Table 6–46. DSP Block Internal Timing Microparameters

-5 Speed

Grade

-6 Speed

Grade

-7 Speed

Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_SU

t_H

0

ns

67

75

86

t_CO

142

158

181

t_INREG2PIPE18

t_INREG2PIPE9

t_{PIPE2OUTREG2ADD}

t_{PIPE2OUTREG4ADD}

t_PD9

2,613

3,390

2,002

2,899

3,709

4,795

7,495

2,982

3,993

2,203

3,189

4,081

5,275

8,245

3,429

4,591

2,533

3,667

4,692

6,065

9,481

t_PD18

t_PD36

t_CLR

450

500

575

t_CLKHL

1,350

1,500

1,724

6–32

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

DC & Switching Characteristics

Table 6–47. M512 Block Internal Timing Microparameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

3,340

3,318

Min

Max

3,816

3,590

Min

Max

4,387

4,128

t_M512RC

ns

t_M512WC

t_M512WERESU

t_M512WERH

110

34

123

38

141

43

t_M512DATASU

t_M512DATAH

t_M512WADDRASU

t_M512WADDRH

t_M512DATACO1

t_M512DATACO2

t_M512CLKHL

t_M512CLR

110

34

123

38

141

43

110

34

123

38

141

43

424

472

541

3,366

3,846

4,421

150

170

167

189

192

217

Table 6–48. M4K Block Internal Timing Microparameters (Part 1 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

3,807

2,556

Min

Max

4,320

2,840

Min

Max

4,967

3,265

t_M4KRC

ns

t_M4KWC

t_M4KWERESU

t_M4KWERH

t_M4KDATASU

t_M4KDATAH

131

34

149

38

171

43

131

34

149

38

171

43

t_M4KWADDRASU

t_M4KWADDRH

t_M4KRADDRASU

t_M4KRADDRH

t_M4KDATABSU

t_M4KDATABH

t_M4KADDRBSU

t_M4KADDRBH

131

34

149

38

171

43

131

34

149

38

171

43

131

34

149

38

171

43

131

34

149

38

171

43

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August 2005

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Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–48. M4K Block Internal Timing Microparameters (Part 2 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

571

Min

Max

635

Min

Max

729

t_M4KDATACO1

t_M4KDATACO2

t_M4KCLKHL

t_M4KCLR

ns

3,984

4,507

5,182

150

170

167

189

192

255

Table 6–49. M-RAM Block Internal Timing Microparameters

-5 -6 -7

Symbol

Unit

Min

Max

4,364

3,654

Min

Max

4,838

4,127

Min

Max

5,562

4,746

t_MRAMRC

ns

t_MRAMWC

t_MRAMWERESU

t_MRAMWERH

t_MRAMDATASU

t_MRAMDATAH

25

18

25

18

25

18

25

18

25

18

25

18

25

20

25

20

25

20

25

20

25

20

25

20

28

23

28

23

28

23

28

23

28

23

28

23

t_MRAMWADDRASU

t_MRAMWADDRH

t_MRAMRADDRASU

t_MRAMRADDRH

t_MRAMDATABSU

t_MRAMDATABH

t_MRAMADDRBSU

t_MRAMADDRBH

t_MRAMDATACO1

t_MRAMDATACO2

t_MRAMCLKHL

1,038

4,362

1,053

4,939

1,210

5,678

270

135

300

150

345

172

t_MRAMCLR

6–34

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

DC & Switching Characteristics

Table 6–50. Stratix GX Transceiver Reset & PLL Lock Time Parameters

Symbol

t_{ANALOGRESETPW}(5)

t_{DIGITALRESETPW}(5)

Min

1

Typ

Max

Units

mS

4

Parallel clock

cycle

t_{TX_PLL_LOCK}(3)

10

5

µS

mS

µS

t_{RX_FREQLOCK}(4)

t_{RX_FREQLOCK2PHASELOCK}(2)

5

Notes to Table 6–50:

(1) The minimum pulse width specified is associated with the power-down of circuits.

(2) The clock recovery unit (CRU) phase locked-to-data time is based on a data rate of 500 Mbps and 8B/10B encoded

data.

(3) After #pll_areset, pll_enable, or PLL power-up, the time required for the transceiver PLL to lock to the

reference clock.

(4) After #rx_analogreset, the time for the CRU to switch to lock-to-data mode.

(5) There is no maximum pulse width specification. The GXB can be held in reset indefinitely.

Routing delays vary depending on the load on a specific routing line. The

Quartus II software reports the routing delay information when running

the timing analysis for a design. Contact Altera Applications Engineering

for more details.

External Timing Parameters

External timing parameters are specified by device density and speed

grade. Figure 6–5 shows the timing model for bidirectional IOE pin

timing. All registers are within the IOE.

Altera Corporation

August 2005

6–35

Stratix GX Device Handbook, Volume 1

Timing Model

Figure 6–5. External Timing in Stratix GX Devices

OE Register

PRN

D

Q

t

INSU

INH

OUTCO

Dedicated

Clock

CLRN

Output Register

PRN

Bidirectional

D

Q

CLRN

Input Register

PRN

D

Q

CLRN

All external I/O timing parameters shown are for 3.3-V LVTTL or

LVCMOS I/O standards with the maximum current strength. For

external I/O timing using standards other than LVTTL or LVCMOS use

the I/O standard input and output delay adders in Tables 6–72 through

6–76.

Table 6–51 shows the external I/O timing parameters when using fast

regional clock networks.

Table 6–51. Stratix GX Fast Regional Clock External I/O Timing Parameters

Notes (1), (2)

Conditions

Symbol

Parameter

t_INSU

Setup time for input or bidirectional pin using column IOE

input register with fast regional clock fed by FCLK pin

t_INH

Hold time for input or bidirectional pin using column IOE

input register with fast regional clock fed by FCLK pin

t_OUTCO

Clock-to-output delay output or bidirectional pin using

column IOE output register with fast regional clock fed by

FCLK pin

C_LOAD= 10 pF

Notes to Table 6–51:

(1) These timing parameters are sample-tested only.

(2) These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device

and speed grade and whether it is t_COor t_SU. You should use the Quartus II software to verify the external timing

for any pin.

6–36

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–52 shows the external I/O timing parameters when using

regional clock networks.

Table 6–52. Stratix GX Regional Clock External I/O Timing Parameters

Notes (1), (2)

Conditions

Symbol

Parameter

t_INSU

Setup time for input or bidirectional pin using column IOE

input register with regional clock fed by CLK pin

t_INH

Hold time for input or bidirectional pin using column IOE

input register with regional clock fed by CLK pin

t_OUTCO

Clock-to-output delay output or bidirectional pin using

C_LOAD= 10 pF

column IOE output register with regional clock fed by CLK

t_INSUPLL

Setup time for input or bidirectional pin using column IOE

input register with regional clock fed by Enhanced PLL with

default phase setting

t_INHPLL

Hold time for input or bidirectional pin using column IOE

input register with regional clock fed by Enhanced PLL with

default phase setting

t_OUTCOPLL

Clock-to-output delay output or bidirectional pin using

column IOE output register with regional clock Enhanced

PLL with default phase setting

C_LOAD= 10 pF

Notes to Table 6–52:

(1) These timing parameters are sample-tested only.

(2) These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device,

speed grade, and the specific parameter in question. You should use the Quartus II software to verify the external

timing for any pin.

Table 6–53 shows the external I/O timing parameters when using global

clock networks.

Table 6–53. Stratix GX Global Clock External I/O Timing Parameters (Part 1 of 2)

Notes (1), (2)

Symbol

Parameter

Conditions

t_INSU

Setup time for input or bidirectional pin using column IOE

input register with global clock fed by CLK pin

t_INH

Hold time for input or bidirectional pin using column IOE

input register with global clock fed by CLK pin

t_OUTCO

t_INSUPLL

Clock-to-output delay output or bidirectional pin using

column IOE output register with global clock fed by CLK pin

C_LOAD= 10 pF

Setup time for input or bidirectional pin using column IOE

input register with global clock fed by Enhanced PLL with

default phase setting

Altera Corporation

August 2005

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Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–53. Stratix GX Global Clock External I/O Timing Parameters (Part 2 of 2)

Notes (1), (2)

Symbol

Parameter

Conditions

t_INHPLL

Hold time for input or bidirectional pin using column IOE

input register with global clock fed by enhanced PLL with

default phase setting

t_OUTCOPLL

Clock-to-output delay output or bidirectional pin using

column IOE output register with global clock enhanced PLL

with default phase setting

C_LOAD= 10 pF

Notes to Table 6–53:

(1) These timing parameters are sample-tested only.

(2) These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device,

speed grade, and the specific parameter in question. You should use the Quartus II software to verify the external

timing for any pin.

Tables 6–54 through 6–59 show the external timing parameters on column

and row pins for EP1SGX10 devices.

Table 6–54. EP1SGX10 Column Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.245

0.000

2.000

2.332

0.000

2.000

2.666

0.000

2.000

ns

4.597

4.920

5.635

Table 6–55. EP1SGX10 Column Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

4.728

2.629

Min

Max

5.078

2.769

Min

Max

6.004

3.158

t_INSU

t_INH

2.114

0.000

2.000

1.035

0.000

0.500

2.218

0.000

2.000

0.941

0.000

0.500

2.348

0.000

2.000

1.070

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

6–38

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August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–56. EP1SGX10 Column Pin Global Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

5.057

2.634

Min

Max

5.438

2.774

Min

Max

6.214

3.162

t_INSU

t_INH

1.785

0.000

2.000

0.988

0.000

0.500

1.814

0.000

2.000

0.936

0.000

0.500

2.087

0.000

2.000

1.066

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–57. EP1SGX10 Row Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.194

0.000

2.000

2.384

0.000

2.000

2.727

0.000

2.000

ns

4.956

4.971

5.463

Table 6–58. EP1SGX10 Row Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

4.906

2.804

Min

Max

4.942

2.627

Min

Max

5.616

2.765

t_INSU

t_INH

2.244

0.000

2.000

1.126

0.000

0.500

2.413

0.000

2.000

1.186

0.000

0.500

2.574

0.000

2.000

1.352

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–59. EP1SGX10 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

1.919

0.000

2.062

0.000

2.368

0.000

ns

Altera Corporation

August 2005

6–39

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–59. EP1SGX10 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_OUTCO

t_INSUPLL

t_INHPLL

2.000

1.126

0.000

0.500

5.231

2.000

1.186

0.000

0.500

5.293

2.000

1.352

0.000

0.500

5.822

ns

t_OUTCOPLL

2.804

2.627

2.765

Tables 6–60 through 6–65 show the external timing parameters on column

and row pins for EP1SGX25 devices.

Table 6–60. EP1SGX25 Column Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.418

0.000

2.000

2.618

0.000

2.000

3.014

0.000

2.000

ns

4.524

4.834

5.538

Table 6–61. EP1SGX25 Column Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

5.229

2.661

Min

Max

5.614

2.799

Min

Max

6.432

3.195

t_INSU

t_INH

1.713

0.000

2.000

1.061

0.000

0.500

1.838

0.000

2.000

1.155

0.000

0.500

2.069

0.000

2.000

1.284

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

6–40

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–62. EP1SGX25 Column Pin Global Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

5.194

2.676

Min

Max

5.569

2.813

Min

Max

6.381

3.208

t_INSU

t_INH

1.790

0.000

2.000

1.046

0.000

0.500

1.883

0.000

2.000

1.141

0.000

0.500

2.120

0.000

2.000

1.220

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–63. EP1SGX25 Row Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.394

0.000

2.000

2.594

0.000

2.000

2.936

0.000

2.000

ns

4.456

4.761

5.454

Table 6–64. EP1SGX25 Row Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

4.880

2.304

Min

Max

5.246

2.427

Min

Max

6.013

2.765

t_INSU

t_INH

1.970

0.000

2.000

1.326

0.000

0.500

2.109

0.000

2.000

1.386

0.000

0.500

2.377

0.000

2.000

1.552

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–65. EP1SGX25 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

1.963

0.000

2.108

0.000

2.379

0.000

ns

Altera Corporation

August 2005

6–41

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–65. EP1SGX25 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_OUTCO

t_INSUPLL

t_INHPLL

2.000

1.326

0.000

0.500

4.887

2.000

1.386

0.000

0.500

5.247

2.000

1.552

0.000

0.500

6.011

ns

t_OUTCOPLL

2.304

2.427

2.765

Tables 6–66 through 6–71 show the external timing parameters on column

and row pins for EP1SGX40 devices.

Table 6–66. EP1SGX40 Column Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.704

0.000

2.000

2.912

0.000

2.000

3.235

0.000

2.000

ns

5.060

5.432

6.226

Table 6–67. EP1SGX40 Column Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

5.255

2.610

Min

Max

5.673

2.751

Min

Max

6.501

3.134

t_INSU

t_INH

2.467

0.000

2.000

1.254

0.000

0.500

2.671

0.000

2.000

1.259

0.000

0.500

3.011

0.000

2.000

1.445

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

6–42

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–68. EP1SGX40 Column Pin Global Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

5.689

2.594

Min

Max

6.116

2.732

Min

Max

7.010

3.113

t_INSU

t_INH

2.033

0.000

2.000

1.228

0.000

0.500

2.184

0.000

2.000

1.278

0.000

0.500

2.451

0.000

2.000

1.415

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–69. EP1SGX40 Row Pin Fast Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

t_OUTCO

2.450

0.000

2.000

2.662

0.000

2.000

3.046

0.000

2.000

ns

4.880

5.241

6.004

Table 6–70. EP1SGX40 Row Pin Regional Clock External I/O Timing Parameters

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

4.932

2.304

Min

Max

5.336

2.427

Min

Max

6.112

2.765

t_INSU

t_INH

2.398

0.000

2.000

1.126

0.000

0.500

2.567

0.000

2.000

1.186

0.000

0.500

2.938

0.000

2.000

1.352

0.000

0.500

ns

t_OUTCO

t_INSUPLL

t_INHPLL

t_OUTCOPLL

Table 6–71. EP1SGX40 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_INSU

t_INH

1.965

0.000

2.128

0.000

2.429

0.000

ns

Altera Corporation

August 2005

6–43

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–71. EP1SGX40 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Unit

Min

Max

Min

Max

Min

Max

t_OUTCO

t_INSUPLL

t_INHPLL

2.000

1.126

0.000

0.500

5.365

2.000

1.186

0.000

0.500

5.775

2.000

1.352

0.000

0.500

6.621

ns

t_OUTCOPLL

2.304

2.427

2.765

External I/O Delay Parameters

External I/O delay timing parameters, both for I/O standard input and

output adders and programmable input and output delays, are specified

by speed grade, independent of device density.

Tables 6–72 through 6–77 show the adder delays associated with column

and row I/O pins. If an I/O standard is selected other than LVTTL 24 mA

with a fast slew rate, add the selected delay to the external t_COand t_SUI/O

parameters.

Table 6–72. Stratix GX I/O Standard Column Pin Input Delay Adders (Part 1 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

0

ps

3.3-V LVTTL

2.5-V LVTTL

1.8-V LVTTL

1.5-V LVTTL

GTL

30

150

210

220

0

31

157

220

231

0

35

180

252

265

0

GTL+

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

0

AGP 2×

0

CTT

120

–30

126

–32

144

–37

SSTL-3 class I

SSTL-3 class II

6–44

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–72. Stratix GX I/O Standard Column Pin Input Delay Adders (Part 2 of 2)

-5 Speed Grade -6 Speed Grade -7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

SSTL-2 class I

–70

180

120

70

–74

189

126

73

–86

217

144

83

ps

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

70

73

83

Table 6–73. Stratix GX I/O Standard Row Pin Input Delay Adders (Part 1 of 2)

-5 Speed Grade -6 Speed Grade

-7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

0

ps

3.3-V LVTTL

2.5-V LVTTL

1.8-V LVTTL

1.5-V LVTTL

GTL

30

150

210

0

31

157

220

0

35

180

252

0

GTL+

220

0

231

0

265

0

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

0

AGP 2×

0

CTT

80

–30

–70

180

0

84

–32

–74

189

0

96

–37

–86

217

0

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

130

136

156

Altera Corporation

August 2005

6–45

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–73. Stratix GX I/O Standard Row Pin Input Delay Adders (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

LVDS (1)

0

ps

70

73

83

70

73

83

40

42

48

LVPECL (1)

–50

330

80

–53

346

84

–61

397

96

3.3-V PCML (1)

HyperTransport (1)

Table 6–74. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 1 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

2 mA

4 mA

570

350

130

0

599

368

137

0

689

423

157

0

ps

8 mA

12 mA

24 mA

4 mA

3.3-V LVTTL

2.5-V LVTTL

570

350

130

70

599

368

137

74

689

423

157

85

8 mA

12 mA

16 mA

24 mA

2 mA

0

830

250

140

100

420

350

1,740

1,160

690

–150

872

263

147

105

441

368

1,827

1,218

725

–157

1,002

302

169

120

507

423

2,101

1,400

833

–181

8 mA

12 mA

16 mA

2 mA

1.8-V LVTTL

1.5-V LVTTL

8 mA

12 mA

2 mA

4 mA

8 mA

GTL

6–46

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–74. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Standard

Unit

Min

Max

Min

Max

Min

Max

GTL+

–110

–230

–30

50

–115

–241

–31

53

–133

–277

–36

61

ps

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

90

95

109

–60

120

24

–50

100

20

–52

105

21

230

0

242

0

278

0

380

190

380

390

399

200

399

410

459

230

459

471

Table 6–75. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 1 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

2 mA

4 mA

570

350

130

0

599

368

137

0

689

423

157

0

ps

8 mA

12 mA

24 mA

4 mA

3.3-V LVTTL

570

350

130

70

599

368

137

74

689

423

157

85

8 mA

12 mA

16 mA

24 mA

0

Altera Corporation

August 2005

6–47

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–75. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Standard

Unit

Min

Max

Min

Max

Min

Max

2.5-V LVTTL

2 mA

8 mA

12 mA

16 mA

2 mA

8 mA

12 mA

2 mA

4 mA

8 mA

830

250

140

100

1,510

420

350

1,740

1,160

690

50

872

263

147

105

1,586

441

368

1,827

1,218

725

53

1,002

302

169

120

1,824

507

423

2,101

1,400

833

61

ps

1.8-V LVTTL

1.5-V LVTTL

CTT

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

LVDS (1)

90

95

109

–60

120

24

–50

100

20

–52

105

21

–20

40

–21

42

–24

48

LVPECL (1)

PCML (1)

–60

70

–63

74

–73

85

HyperTransport Technology (1)

Table 6–76. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 1 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

2 mA

4 mA

1,911

1,691

1,471

1,341

2,011

1,780

1,549

1,412

2,312

2,046

1,780

1,623

ps

8 mA

12 mA

24 mA

6–48

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–76. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 2 of 2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

3.3-V LVTTL

4 mA

8 mA

1,993

1,773

1,553

1,493

1,423

2,631

2,051

1,941

1,901

4,632

3,542

3,472

6,620

6,040

5,570

1,191

1,231

1,111

1,311

1,391

1,431

1,291

1,912

1,832

3,097

2,867

4,916

4,726

3,247

3,257

2,097

1,866

1,635

1,572

1,498

2,768

2,159

2,043

2,001

4,873

3,728

3,655

6,964

6,355

5,862

1,255

1,297

1,171

1,381

1,465

1,507

1,360

2,013

1,929

3,260

3,018

5,174

4,975

3,417

3,428

2,411

2,145

1,879

1,807

1,722

3,182

2,482

2,349

2,300

5,604

4,287

4,203

8,008

7,307

6,740

1,442

1,90

ps

12 mA

16 mA

24 mA

2 mA

2.5-V LVTTL

8 mA

12 mA

16 mA

2 mA

1.8-V LVTTL

1.5-V LVTTL

8 mA

12 mA

2 mA

4 mA

8 mA

GTL

GTL+

3.3-V PCI

1,346

1,587

1,684

1,732

1,563

2,314

2,218

3,748

3,470

5,950

5,721

3,929

3,941

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

Altera Corporation

August 2005

6–49

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–77. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

I/O Standard

Unit

Min

Max

Min

Max

Min

Max

LVCMOS

2 mA

4 mA

8 mA

12 mA

4 mA

8 mA

12 mA

16 mA

2 mA

8 mA

12 mA

16 mA

2 mA

8 mA

12 mA

2 mA

4 mA

8 mA

1,930

1,710

1,490

1,953

1,733

1,513

1,453

2,632

2,052

1,942

1,902

4,537

3,447

3,377

6,575

5,995

5,525

1,410

1,450

1,310

1,797

1,717

1,340

1,400

1,300

1,430

2,031

1,800

1,569

2,055

1,824

1,593

1,530

2,769

2,160

2,044

2,002

4,773

3,628

3,555

6,917

6,308

5,815

1,485

1,527

1,380

1,892

1,808

1,411

1,474

1,369

1,506

2,335

2,069

1,803

2,363

2,097

1,831

1,759

3,183

2,483

2,350

2,301

5,489

4,172

4,088

7,954

7,253

6,686

1,707

1,755

1,586

2,175

2,079

1,622

1,694

1,573

1,731

ps

3.3-V LVTTL

2.5-V LVTTL

1.8-V LVTTL

1.5-V LVTTL

CTT

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

LVDS (1)

LVPECL (1)

3.3-V PCML (1)

HyperTransport technology (1)

Note to Tables 6–72 through 6–77:

(1) These parameters are only available on the left side row I/O pins.

6–50

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Tables 6–78 and 6–79 show the adder delays for the column and row IOE

programmable delays, respectively. These delays are controlled with the

Quartus II software logic options listed in the Parameter column.

Table 6–78. Stratix GX IOE Programmable Delays on Column Pins

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Parameter

Setting

Unit

Min

Max

Min

Max

Min

Max

Decrease input delay to

internal cells

Off

3,970

3,390

2,810

212

3900

0

4,367

3,729

3,091

224

4,290

0

5,022

4,288

3,554

257

4,933

0

ps

On

Small

Medium

Large

Off

Decrease input delay to

input register

On

Decrease input delay to

output register

Off

1,240

0

1,364

0

1,568

0

On

Increase delay to output

Off

0

On

377

0

397

0

456

0

Increase delay to output

enable pin

Off

On

338

0

372

0

427

0

Increase output clock

enable delay

Off

On

540

1,016

0

594

1,118

0

683

1,285

0

Small

Large

Increaseinputclockenable Off

delay

On

Small

540

1,016

0

594

1,118

0

683

1,285

0

Large

Off

Increase output enable

clock enable delay

On

540

1,016

594

1,118

683

1,285

Small

Large

Altera Corporation

August 2005

6–51

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–79. Stratix GX IOE Programmable Delays on Row Pins

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Parameter

Setting

Unit

Min

Max

Min

Max

Min

Max

Decrease input delay to

internal cells

Off

3,970

3,390

2,810

164

3,900

0

4,367

3,729

3,091

173

4,290

0

5,022

4,288

3,554

198

4,933

0

ps

On

Small

Medium

Large

Off

Decrease input delay to

input register

On

Decrease input delay to

output register

Off

1,240

0

1,364

0

1,568

0

On

Increase delay to output

Off

0

On

377

0

397

0

456

0

Increase delay to output

enable pin

Off

On

348

0

383

0

441

0

Increase output clock

enable delay

Off

On

180

260

0

198

286

0

227

328

0

Small

Large

Increaseinputclockenable Off

delay

On

Small

180

260

0

198

286

0

227

328

0

Large

Off

Increase output enable

clock enable delay

On

540

1,016

594

1,118

683

1,285

Small

Large

6–52

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

The scaling factors for output pin timing in Table 6–80 are shown in units

of time per pF unit of capacitance (ps/pF). Add this delay to the

combinational timing path for output or bidirectional pins in addition to

the “I/O Adder” delays shown in Tables 6–72 through 6–77 and the “IOE

Programmable Delays” in Tables 6–78 and 6–79.

Table 6–80. Output Delay Adder for Loading on LVTTL/LVCMOS Output Buffers

LVTTL/LVCMOS Standards

Output Pin Adder Delay (ps/pF)

Conditions

Parameter

3.3-V LVTTL 2.5-V LVTTL 1.8-V LVTTL 1.5-V LVTTL

LVCMOS

Value

24 mA

16 mA

12 mA

8 mA

15

25

30

50

60

–

-

–

8

18

25

35

–

25

40

–

15

20

30

60

Drive Strength

35

80

160

4 mA

2 mA

75

120

SSTL/HSTL Standards

Output Pin Adder Delay (ps/pF)

Conditions

SSTL-3

25

SSTL-2

25

SSTL-1.8

1.5-V HSTL 1.8-V HSTL

Class I

Class II

25

20

25

20

25

20

GTL+/GTL/CTT/PCI Standards

Output Pin Adder Delay (ps/pF)

Conditions

GTL+

GTL

CTT

PCI

AGP

Parameter

Value

V_CCIOvoltage

level

3.3 V

2.5 V

18

15

18

25

-

20

-

20

-

Altera Corporation

August 2005

6–53

Stratix GX Device Handbook, Volume 1

Timing Model

Maximum Input & Output Clock Rates

Tables 6–81 through 6–83 show the maximum input clock rate for column

and row pins in Stratix GX devices.

Table 6–81. Stratix GX Maximum Input Clock Rate for CLK[7..4] & CLK[15..12] Pins

I/O Standard -5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

LVTTL

2.5 V

422

300

400

422

300

400

645

300

500

422

250

350

422

250

350

645

275

500

390

200

300

390

200

300

622

275

450

MHz

1.8 V

1.5 V

LVCMOS

GTL

GTL+

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

Differential HSTL

LVDS

LVPECL

PCML

HyperTransport technology

6–54

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–82. Stratix GX Maximum Input Clock Rate for CLK[0, 2, 9, 11] Pins & FPLL[8..7]CLK Pins

I/O Standard -5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

LVTTL

2.5 V

422

300

400

422

300

400

717

400

717

422

250

350

422

250

350

717

375

717

390

200

300

390

200

300

640

350

640

MHz

1.8 V

1.5 V

LVCMOS

GTL

GTL+

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

Differential HSTL

LVDS

LVPECL

PCML

HyperTransport technology

Table 6–83. Stratix GX Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins (Part 1 of 2)

I/O Standard -5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

LVTTL

2.5 V

422

390

MHz

Altera Corporation

August 2005

6–55

Stratix GX Device Handbook, Volume 1

Timing Model

Table 6–83. Stratix GX Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins (Part 2 of 2)

I/O Standard

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

1.8 V

422

300

400

422

300

400

645

300

645

422

250

350

422

250

350

645

275

645

390

200

300

390

200

300

640

275

640

MHz

1.5 V

LVCMOS

GTL

GTL+

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

Differential HSTL

LVDS

LVPECL

PCML

HyperTransport technology

Tables 6–84 and 6–85 show the maximum output clock rate for column

and row pins in Stratix GX devices.

Table 6–84. Stratix GX Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins (Part 1 of 2)

I/O Standard -5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

LVTTL

2.5 V

350

300

250

300

MHz

6–56

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–84. Stratix GX Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins (Part 2 of 2)

I/O Standard -5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

1.8 V

250

225

350

200

167

200

150

250

225

250

225

350

200

225

200

500

350

250

200

300

167

150

200

133

225

200

225

200

300

200

500

350

250

200

250

125

133

167

133

200

250

200

167

500

350

MHz

1.5 V

LVCMOS

GTL

GTL+

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

1.5-V HSTL class I

1.5-V HSTL class II

1.8-V HSTL class I

1.8-V HSTL class II

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

Differential HSTL

Differential SSTL-2

LVDS

LVPECL

PCML

HyperTransport technology

Table 6–85. Stratix GX Maximum Output Clock Rate (Using I/O Pins) for PLL[1, 2] Pins (Part 1 of 2)

I/O Standard

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

LVTTL

2.5 V

1.8 V

400

350

300

MHz

Altera Corporation

August 2005

6–57

Stratix GX Device Handbook, Volume 1

High-Speed I/O Specification

Table 6–85. Stratix GX Maximum Output Clock Rate (Using I/O Pins) for PLL[1, 2] Pins (Part 2 of 2)

I/O Standard

-5 Speed Grade -6 Speed Grade -7 Speed Grade

Unit

1.5 V

350

400

200

167

150

250

225

250

225

400

300

225

717

420

300

350

167

150

133

225

350

250

225

717

420

300

125

133

200

300

200

500

420

MHz

LVCMOS

GTL

GTL+

SSTL-3 class I

SSTL-3 class II

SSTL-2 class I

SSTL-2 class II

SSTL-18 class I

SSTL-18 class II

HSTL class I

HSTL class II

3.3-V PCI

3.3-V PCI-X 1.0

Compact PCI

AGP 1×

AGP 2×

CTT

Differential HSTL

LVDS

LVPECL

PCML

HyperTransport technology

Table 6–86 provides high-speed timing specifications definitions.

High-Speed I/O

Specification

Table 6–86. High-Speed Timing Specifications & Definitions (Part 1 of 2)

High-Speed Timing Specification Definitions

t_C

f_HSCLK

t_RISE

High-speed receiver/transmitter input and output clock period.

High-speed receiver/transmitter input and output clock frequency.

Low-to-high transmission time.

6–58

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–86. High-Speed Timing Specifications & Definitions (Part 2 of 2)

High-Speed Timing Specification Definitions

t_FALL

High-to-low transmission time.

Timing unit interval (TUI)

The timing budget allowed for skew, propagation delays, and data

sampling window. (TUI = 1/(Receiver Input Clock Frequency ×

Multiplication Factor) = t_C/w).

f_HSDR

Maximum/minimum LVDS data transfer rate (f_HSDR= 1/TUI), non-DPA.

Maximum/minimum LVDS data transfer rate (f_HSDRDPA= 1/TUI), DPA.

f_HSDRDPA

Channel-to-channel skew (TCCS)

The timing difference between the fastest and slowest output edges,

including t_COvariation and clock skew. The clock is included in the TCCS

measurement.

Sampling window (SW)

The period of time during which the data must be valid in order to capture

it correctly. The setup and hold times determine the ideal strobe position

within the sampling window.

SW = t_SW(max) – t_SW(min).

Input jitter (peak-to-peak)

Peak-to-peak input jitter on high-speed PLLs.

Peak-to-peak output jitter on high-speed PLLs.

Duty cycle on high-speed transmitter output clock.

Lock time for high-speed transmitter and receiver PLLs.

Output jitter (peak-to-peak)

t_DUTY

t_LOCK

Table 6–87 shows the high-speed I/O timing specifications for Stratix GX

devices.

Table 6–87. High-Speed I/O Specifications (Part 1 of 4)

Notes (1), (2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Conditions

Unit

Min Typ Max Min Typ Max Min Typ Max

f_HSCLK(Clock

frequency)

(LVDS,

LVPECL,

HyperTransport

technology)

10

717

10

717

10

624 MHz

^{W = 1 to 30 for}≤ 717

Mbps

W = 2 to 30 for > 717

Mbps

f_HSCLK

=

f_HSDR/ W

f_{HSCLK_DPA}

74

717

74

717

74

717 MHz

Altera Corporation

August 2005

6–59

Stratix GX Device Handbook, Volume 1

High-Speed I/O Specification

Table 6–87. High-Speed I/O Specifications (Part 2 of 4)

Notes (1), (2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Conditions

Unit

Min Typ Max Min Typ Max Min Typ Max

f_HSDRDevice

operation

(LVDS,

LVPECL,

HyperTransport

technology)

J = 10

J = 8

J = 7

J = 4

J = 2

300

100

840

624

462

300

100

840

624

462

300

100

840 Mbps

462 Mbps

J = 1 (LVDS and

LVPECL only)

f

_HSDRDPA(LVDS, J=10

300

10

1000 300

840

400

300

10

840 Mbps

LVPECL)

J=8

f_HSCLK(Clock

frequency)

(PCML)

W = 1 to 30

400

10

311

MHz

f_HSCLK

=

f_HSDR/ W

f_HSDRDevice

operation

(PCML)

J = 10

J = 8

J = 7

J = 4

J = 2

J = 1

300

100

400

250

6400

300

100

400

250

6400

300

100

311 Mbps

300 Mbps

200 Mbps

DPA Run

Length

6400

UI

DPA Jitter

Tolerance_(p-p)

all data rates

0.44

DPA Minimum

Eye opening

(p-p)

0.56

5

0.56

5

0.56

5

DPA Receiver

Latency

9

(3)

6–60

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–87. High-Speed I/O Specifications (Part 3 of 4)

Notes (1), (2)

-6 Speed Grade

-5 Speed Grade

-7 Speed Grade

Symbol

Conditions

Unit

Min Typ Max Min Typ Max Min Typ Max

DPA Lock Time Standard Train Trans

ing ition

Patt Den-

ern sity

SPI-4,

CSIX

0000 10%

0000

256

(4)

0011

1111

Rapid IO 0000 25%

1111

256

(4)

1001 50%

0000

Misc

1010 100

1010

%

0101

TCCS

SW

All

200

300

ps

PCML (J = 4, 7, 8, 10)

PCML (J = 2)

750

900

750

900

800

1,200

1,700

550

PCML (J = 1)

1,500

500

1,500

500

LVDS and LVPECL

(J = 1)

LVDS, LVPECL,

HyperTransport

technology (J = 2

through 10)

440

500

ps

Input jitter

tolerance

(peak-to-peak)

All

250

ps

Output jitter

All

160

200

(peak-to-peak)

Output t_RISE

LVDS

80

110 120

80

110 120

80

110 120

ps

HyperTransport

technology

110 170 200

120 170 200

LVPECL

PCML

90

80

130 150

110 135

90

80

130 150

110 135

100 135 150

ps

80

110 135

Altera Corporation

August 2005

6–61

Stratix GX Device Handbook, Volume 1

High-Speed I/O Specification

Table 6–87. High-Speed I/O Specifications (Part 4 of 4)

Notes (1), (2)

-5 Speed Grade

-6 Speed Grade

-7 Speed Grade

Symbol

Conditions

Unit

Min Typ Max Min Typ Max Min Typ Max

Output t_FALL

LVDS

80

110 120

80

110 120

80

110 120

ps

HyperTransport

technology

110 170 200

LVPECL

PCML

90

130 160

90

130 160

100 135 160

110 145 175

ps

%

105 140 175

t_DUTY

LVDS (J = 2 through

47.5 50 52.5 47.5 50 52.5 47.5

50 52.5

10)

LVDS (J =1) and

LVPECL, PCML,

HyperTransport

technology

45

50

55

45

50

55

45

50

55

%

t_LOCK

All

100

μs

Notes to Table 6–87:

(1) When J = 4, 7, 8, and 10, the SERDES block is used.

(2) When J = 2 or J = 1, the SERDES is bypassed.

(3) Number of parallel CLK cycles.

(4) Number of repetitions.

PLL Timing

Tables 6–88 through 6–90 describe the Stratix GX device enhanced PLL

specifications.

Table 6–88. Enhanced PLL Specifications for -5 Speed Grades (Part 1 of 2)

Symbol

Parameter

Min Typ

3 (1)

40

Max

684

60

Unit

MHz

%

f_IN

Input clock frequency

f_INDUTY

Input clock duty cycle

f_EINDUTY

External feedback clock input duty

cycle

40

60

%

t_INJITTER

t_EINJITTER

t_FCOMP

Input clock period jitter

200 (2)

6

ps

ns

External feedback clock period jitter

External feedback clock compensation

time (3)

f_OUT

Output frequency for internal global or

regional clock

0.3

500

526

MHz

f_{OUT_EXT}

Output frequency for external clock (2)

6–62

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–88. Enhanced PLL Specifications for -5 Speed Grades (Part 2 of 2)

Symbol

Parameter

Min Typ

Max

Unit

t_OUTDUTY

Duty cycle for external clock output

45

55

%

(when set to 50%)

t_JITTER

Period jitter for external clock output (5)

100 ps for >200 MHz outclk

20 mUI for <200 MHz outclk

ps or

mUI

t_CONFIG5,6

t_CONFIG11,12

Time required to reconfigure the scan

chains for PLLs 5 and 6

289/f_SCANCLK

Time required to reconfigure the scan

chains for PLLs 11 and 12

193/f_SCANCLK

t_SCANCLK

t_DLOCK

scanclk frequency (4)

22

MHz

Time required to lock dynamically (after

switchover or reconfiguring any non-

post-scale counters/delays) (6)

100

μs

t_LOCK

Time required to lock from end of

device configuration

10

400

μs

f_VCO

PLL internal VCO operating range

300

50

800 (7)

MHz

ps

t_LSKEW

Clock skew between two external clock

outputs driven by the same counter

t_SKEW

Clock skew between two external clock

outputs driven by the different counters

with the same settings

75

ps

f_SS

Spread spectrum modulation frequency 30

150

0.6

kHz

%

% spread

Percentage spread for spread

0.4 0.5

spectrum frequency (9)

t_ARESET

10

ns

Minimum pulse width on areset

signal

Table 6–89. Enhanced PLL Specifications for -6 Speed Grades (Part 1 of 2)

Symbol

Parameter

Min Typ

3 (1)

40

Max

650

60

Unit

MHz

%

f_IN

Input clock frequency

f_INDUTY

Input clock duty cycle

f_EINDUTY

External feedback clock input duty

cycle

40

60

%

t_INJITTER

t_EINJITTER

t_FCOMP

Input clock period jitter

200 (2)

6

ps

ns

External feedback clock period jitter

External feedback clock compensation

time (3)

Altera Corporation

August 2005

6–63

Stratix GX Device Handbook, Volume 1

High-Speed I/O Specification

Table 6–89. Enhanced PLL Specifications for -6 Speed Grades (Part 2 of 2)

Symbol

Parameter

Min Typ

Max

Unit

f_OUT

Output frequency for internal global or

regional clock

0.3

450

MHz

f_{OUT_EXT}

t_OUTDUTY

Output frequency for external clock (2) 0.3

500

55

MHz

%

Duty cycle for external clock output

45

(when set to 50%)

t_JITTER

Period jitter for external clock output (5)

100 ps for >200 MHz outclk

20 mUI for <200 MHz outclk

ps or

mUI

t_CONFIG5,6

t_CONFIG11,12

Time required to reconfigure the scan

chains for PLLs 5 and 6

289/f_SCANCLK

Time required to reconfigure the scan

chains for PLLs 11 and 12

193/f_SCANCLK

t_SCANCLK

t_DLOCK

scanclk frequency (4)

22

MHz

Time required to lock dynamically (after (8)

switchover or reconfiguring any non-

post-scale counters/delays) (6) (10)

100

μs

t_LOCK

Time required to lock from end of

10

400

μs

device configuration (10)

f_VCO

PLL internal VCO operating range

300

800 (7)

MHz

ps

t_LSKEW

Clock skew between two external clock

outputs driven by the same counter

50

75

t_SKEW

Clock skew between two external clock

outputs driven by the different counters

with the same settings

ps

f_SS

Spread spectrum modulation frequency 30

150

0.6

kHz

%

% spread

Percentage spread for spread

0.4 0.5

spectrum frequency (9)

t_ARESET

10

ns

Minimum pulse width on areset

signal

Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 1 of 3)

Symbol

Parameter

Min Typ

Max

565

60

Unit

MHz

%

f_IN

Input clock frequency

3 (1)

40

f_INDUTY

Input clock duty cycle

f_EINDUTY

External feedback clock input duty

cycle

40

60

%

t_INJITTER

Input clock period jitter

200 (2)

ps

t_EINJITTER

External feedback clock period jitter

6–64

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 2 of 3)

Symbol

Parameter

Min Typ

Max

Unit

t_FCOMP

External feedback clock compensation

6

ns

time (3)

f_OUT

Output frequency for internal global or

regional clock

0.3

420

MHz

f_{OUT_EXT}

t_OUTDUTY

Output frequency for external clock (2)

0.3

45

434

55

MHz

%

Duty cycle for external clock output

(when set to 50%)

t_JITTER

Period jitter for external clock output (5)

100 ps for >200 MHz outclk

20 mUI for <200 MHz outclk

ps or

mUI

t_CONFIG5,6

t_CONFIG11,12

Time required to reconfigure the scan

chains for PLLs 5 and 6

289/f_SCANCLK

Time required to reconfigure the scan

chains for PLLs 11 and 12

193/f_SCANCLK

t_SCANCLK

t_DLOCK

scanclk frequency (4)

22

MHz

Time required to lock dynamically (after (8)

switchover or reconfiguring any non-

post-scale counters/delays) (6) (10)

100

μs

t_LOCK

f_VCO

Time required to lock from end of

device configuration (10)

10

400

μs

PLL internal VCO operating range

300

600 (7)

MHz

Altera Corporation

August 2005

6–65

Stratix GX Device Handbook, Volume 1

High-Speed I/O Specification

Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 3 of 3)

Symbol

Parameter

Min Typ

Max

Unit

t_LSKEW

Clock skew between two external clock

outputs driven by the same counter

50

ps

t_SKEW

Clock skew between two external clock

outputs driven by the different counters

with the same settings

75

ps

f_SS

Spread spectrum modulation frequency 30

150

0.6

kHz

%

% spread

Percentage spread for spread

0.5

spectrum frequency (9)

t_ARESET

10

ns

Minimum pulse width on areset

signal

Notes to Tables 6–88 through 6–90:

(1) The minimum input clock frequency to the PFD (f_IN/N) must be at least 3 MHz for Stratix device enhanced PLLs.

(2) See “Maximum Input & Output Clock Rates” on page 6–54.

(3) t_FCOMPcan also equal 50% of the input clock period multiplied by the pre-scale divider n (whichever is less).

(4) This parameter is timing analyzed by the Quartus II software because the scanclk and scandata ports can be

driven by the logic array.

(5) Actual jitter performance may vary based on the system configuration.

(6) Total required time to reconfigure and lock is equal to t_DLOCK+ t_CONFIG. If only post-scale counters and delays are

changed, then t_DLOCKis equal to 0.

(7) The VCO range is limited to 500 to 800 MHz when the spread spectrum feature is selected.

(8) Lock time is a function of PLL configuration and may be significantly faster depending on bandwidth settings or

feedback counter change increment.

(9) Exact, user-controllable value depends on the PLL settings.

(10) The LOCK circuit on Stratix PLLs does not work for industrial devices below -20C unless the PFD frequency > 200

MHz. See the Stratix FPGA Errata Sheet for more information on the PLL.

6–66

Altera Corporation

August 2005

Stratix GX Device Handbook, Volume 1

DC & Switching Characteristics

Table 6–91 describes the Stratix GX device fast PLL specifications.

Table 6–91. Fast PLL Specifications for -5 & -6 Speed Grade Devices

Symbol

Parameter

Min

Max

Unit

f_IN

CLKIN frequency (for m = 1) (1)

CLKIN frequency (for m = 2 to 19)

300

717

MHz

300/

1,000/m

m

CLKIN frequency (for m = 20 to 32)

10

1,000/m

MHz

f_OUT

Output frequency for internal global or

9.4

420

regional clock (2)

f_{OUT_EXT}

f_VCO

Output frequency for external clock

VCO operating frequency

9.375

300

40

717

1,000

60

MHz

%

t_INDUTY

t_INJITTER

t_DUTY

CLKIN duty cycle

Period jitter for CLKIN pin

200

55

ps

Duty cycle for DFFIO 1× CLKOUT pin (3)

Period jitter for DIFFIO clock out (3)

45

%

t_JITTER

80

ps

Period jitter for internal global or

regional clock

100 ps for >200-MHz outclk

20 mUI for <200-MHz outclk

ps or

mUI

t_LOCK

m

Time required for PLL to acquire lock

10

1

100

32

μs

Multiplication factors for m counter (3)

Integer

l0, l1, g0

Multiplication factors for l0, l1, and g0

counter (4), (5)

1

32

t_ARESET

10

ns

Minimum pulse width on areset

signal

Table 6–92. Fast PLL Specifications for -7 & -8 Speed Grades (Part 1 of 2)

Symbol

Parameter

Min

Max

Unit

f_IN

CLKIN frequency (for m = 1) (1),

CLKIN frequency (for m = 2 to 19)

300

640

MHz

300/

700/m

m

CLKIN frequency (for m = 20 to 32)

10

700/m

MHz

f_OUT

Output frequency for internal global or 9.375

420

regional clock (2)

f_{OUT_EXT}

f_VCO

t_INDUTY

t_INJITTER

Output frequency for external clock

VCO operating frequency

CLKIN duty cycle

9.4

300

40

500

700

60

MHz

%

Period jitter for CLKIN pin

200

ps

Altera Corporation

August 2005

6–67

Stratix GX Device Handbook, Volume 1

DLL Jitter

Table 6–92. Fast PLL Specifications for -7 & -8 Speed Grades (Part 2 of 2)

Symbol

Parameter

Min

Max

55

Unit

%

t_DUTY

Duty cycle for DFFIO 1× CLKOUT pin (3) 45

Period jitter for DIFFIO clock out (3)

t_JITTER

80

ps

Period jitter for internal global or

regional clock

100 ps for >200 MHz outclk

20 mUI for <200 MHz outclk

ps or

mUI

t_LOCK

m

Time required for PLL to acquire lock

10

1

100

32

μs

Multiplication factors for m counter (4)

Integer

l0, l1, g0

Multiplication factors for l0, l1, and g0

counter (4), (5)

1

32

t_ARESET

10

ns

Minimum pulse width on areset

signal

Notes to Tables 6–91 & 6–92:

(1) See “Maximum Input & Output Clock Rates” on page 6–54.

(2) When using the SERDES, high-speed differential I/O mode supports a maximum output frequency of 210 MHz

to the global or regional clocks (that is, the maximum data rate 840 Mbps divided by the smallest SERDES J factor

of 4).

(3) This parameter is for high-speed differential I/O mode only.

(4) These counters have a maximum of 32 if programmed for 50/50 duty cycle. Otherwise, they have a maximum

of 16.

(5) High-speed differential I/O mode supports W = 1 to 16 and J = 4, 7, 8, or 10.

Table 6–93 reports the jitter for the DLL in the DQS phase-shift reference

circuit.

DLL Jitter

Table 6–93. DLL Jitter for DQS Phase Shift Reference Circuit

Frequency (MHz)

DLL Jitter (ps)

197 to 200

160 to 196

100 to 159

100

300

500

6–68

Stratix GX Device Handbook, Volume 1

Altera Corporation

August 2005

7. Reference & Ordering

Information

SGX51007-1.0

Stratix^®GX devices are supported by the Altera^®Quartus^®II design

software, which provides a comprehensive environment for system-on-a-

programmable-chip (SOPC) design. The Quartus II software includes

hardware description language and schematic design entry, compilation

and logic synthesis, full simulation and advanced timing analysis,

SignalTap^®logic analysis, and device configuration. See the Design

Software Selector Guide for more details on the Quartus II software

features.

Software

The Quartus II software supports the Windows 2000/NT/98, Sun Solaris,

Linux Red Hat v6.2 and HP-UX operating systems. It also supports

seamless integration with industry-leading EDA tools through the

NativeLink^®interface.

Device pin-outs for Stratix GX devices will be released on the Altera web

site (www.altera.com).

Device Pin-Outs

Figure 7–1 describes the ordering codes for Stratix GX devices.

Ordering

Information

Figure 7–1. Stratix GX Device Packaging Ordering Information

EP1SGX

40

G

F

1020

C

7

N

Family Signature

Optional Suffix

EP1SGX: Stratix GX

Indicates specific device options or

shipment method.

N: Lead free

ES: Engineering sample

Device Type

10

25

40

Speed Grade

5, 6, or 7, with 5 being the fastest

Number of

Transceiver

Channels

Operating Temperature

C: 4

D: 8

F: 16

G: 20

C: Commercial temperature (t = 0˚ C to 85˚ C )

j

I: Industrial temperature (t = -40˚ C to 100˚ C )

j

Package Type

Pin Count

Number of pins for a particular FineLine BGA package

F: FineLine BGA

Altera Corporation

February 2005

7–1

Ordering Information

7–2

Altera Corporation

February 2005

Stratix GX Device Handbook, Volume 1


型号：	EP1SGX10GF1020I5N
厂家：	ALTERA CORPORATION
描述：	Field Programmable Gate Array, CMOS, PBGA1020, 33 X 33 MM, 1 MM PITCH, LEAD FREE, FBGA-1020 栅
文件：	总279页 (文件大小：3682K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

EP1SGX10GF1020I5N [ALTERA]

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