A29800TV-70IF [AMICC]

Flash, 512KX16, 70ns, PDSO48, ROHS COMPLIANT, TSOP1-48;
A29800TV-70IF
型号: A29800TV-70IF
厂家: AMIC TECHNOLOGY    AMIC TECHNOLOGY
描述:

Flash, 512KX16, 70ns, PDSO48, ROHS COMPLIANT, TSOP1-48

光电二极管 内存集成电路
文件: 总37页 (文件大小:572K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
A29800 Series  
1024K X 8 Bit / 512K X 16 Bit CMOS 5.0 Volt-only,  
Boot Sector Flash Memory  
Document Title  
1024K X 8 Bit / 512K X 16 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory  
Revision History  
Rev. No. History  
Issue Date  
Remark  
0.0  
0.1  
Initial issue  
May 4, 2001  
Preliminary  
Error Correction:  
December 24, 2002  
October 7, 2003  
July 15, 2004  
P.10: Autoselect Command Sequence (line 15), XX11h XX03h  
Final version release  
1.0  
1.1  
1.2  
1.3  
1.4  
Final  
Add Pb-Free package type for -70 grade  
Add -70I series products  
January 24, 2007  
November 13, 2007  
February 26, 2009  
Modify symbol “L” outline dimensions in TSOP 48L package  
Update -70I series product working temperature range: read -40°C  
to +85°C, erase & program 0°C to +85°C  
1.5  
1.6  
Error correction: Modify Figure 3. Erase Operation  
April 28, 2009  
Modify the latency time of erase suspend from 20μs to 30μs  
Error correction: Modify the way to check write operation status by  
December 01, 2009  
either  
or  
to by  
and  
OE CE  
OE  
CE  
1.7  
1.8  
Error correction: Delete tWPH Max. 50μs  
Page 1: Change from typical 100,000 cycles to minimum 100,000  
Cycles  
December 21, 2009  
December 31, 2010  
1.9  
Replace all non Pb-Free parts with Pb-Free ones  
October 21, 2011  
(October, 2011, Version 1.9)  
AMIC Technology, Corp.  
A29800 Series  
1024K X 8 Bit / 512K X 16 Bit CMOS 5.0 Volt-only,  
Boot Sector Flash Memory  
Features  
„ Minimum 100,000 program/erase cycles per sector  
„ 20-year data retention at 125°C  
- Reliable operation for the life of the system  
„ Compatible with JEDEC-standards  
„ 5.0V ± 10% for read and write operations  
„ Access times:  
- 55/70/90 (max.)  
„ Current:  
- 28mA read current (word mode)  
- Pinout and software compatible with single-power-supply  
- 20 mA typical active read current (byte mode)  
- 30 mA typical program/erase current  
Flash memory standard  
- Superior inadvertent write protection  
- 1 μA typical CMOS standby  
„
Polling and toggle bits  
- Provides a software method of detecting completion of  
program or erase operations  
Data  
„ Flexible sector architecture  
- 16 Kbyte/ 8 KbyteX2/ 32 Kbyte/ 64 KbyteX15 sectors  
- 8 Kword/ 4 KwordX2/ 16 Kword/ 32 KwordX15 sectors  
- Any combination of sectors can be erased  
- Supports full chip erase  
„ Erase Suspend/Erase Resume  
- Suspends a sector erase operation to read data from, or  
program data to, a non-erasing sector, then resumes the  
erase operation  
- Sector protection:  
A hardware method of protecting sectors to prevent any  
inadvertent program or erase operations within that sector  
„ Extended read operating temperature range: -40°C ~ +85°C  
for – I series  
„ Extended erase and program temperature range: 0°C ~  
+85°C for – I series  
„ Hardware reset pin (  
)
RESET  
- Hardware method to reset the device to reading array  
data  
„ Package options  
- 44-pin SOP or 48-pin TSOP (I)  
- All Pb-free (Lead-free) products are RoHS compliant  
„ Top or bottom boot block configurations available  
„ Embedded Erase Algorithms  
- Embedded Erase algorithm will automatically erase the  
entire chip or any combination of designated sectors and  
verify the erased sectors  
- Embedded Program algorithm automatically writes and  
verifies bytes at specified addresses  
General Description  
The device requires only a single 5.0 volt power supply for  
both read and write functions.  
The A29800 is a 5.0 volt only Flash memory organized as  
1048,576 bytes of 8 bits or 524,288 words of 16 bits each. The  
Internally generated and regulated voltages are provided for  
the program and erase operations.  
A29800 offers the  
function. The 1024 Kbytes of data  
RESET  
are further divided into nineteen sectors for flexible sector  
erase capability. The 8 bits of data appear on I/O0 - I/O7 while  
the addresses are input on A1 to A18; the 16 bits of data  
appear on I/O0~I/O15. The A29800 is offered in 44-pin SOP  
and 48-Pin TSOP packages. This device is designed to be  
programmed in-system with the standard system 5.0 volt VCC  
supply. Additional 12.0 volt VPP is not required for in-system  
write or erase operations. However, the A29800 can also be  
programmed in standard EPROM programmers.  
The A29800 has the first toggle bit, I/O6, which indicates  
whether an Embedded Program or Erase is in progress, or it is  
in the Erase Suspend. Besides the I/O6 toggle bit, the A29800  
has a second toggle bit, I/O2, to indicate whether the  
addressed sector is being selected for erase. The A29800 also  
offers the ability to program in the Erase Suspend mode. The  
standard A29800 offers access times of 55, 70 and 90 ns,  
allowing high-speed microprocessors to operate without wait  
states. To eliminate bus contention the device has separate  
The A29800 is entirely software command set compatible with  
the JEDEC single-power-supply Flash standard. Commands  
are written to the command register using standard  
microprocessor write timings. Register contents serve as input  
to an internal state-machine that controls the erase and  
programming circuitry.  
Write cycles also internally latch addresses and data needed  
for the programming and erase operations. Reading data out  
of the device is similar to reading from other Flash or EPROM  
devices.  
Device programming occurs by writing the proper program  
command sequence. This initiates the Embedded Program  
algorithm - an internal algorithm that automatically times the  
program pulse widths and verifies proper program margin.  
Device erasure occurs by executing the proper erase  
command sequence. This initiates the Embedded Erase  
algorithm  
-
an internal algorithm that automatically  
preprograms the array (if it is not already programmed) before  
executing the erase operation.  
During erase, the device automatically times the erase pulse  
widths and verifies proper erase margin.  
chip enable (  
), write enable (  
) and output enable  
WE  
CE  
(
) controls.  
OE  
(October, 2011, Version 1.9)  
1
AMIC Technology, Corp.  
A29800 Series  
The host system can detect whether a program or erase  
operation is complete by reading the I/O7 ( Polling) and  
I/O6 (toggle) status bits. After a program or erase cycle has  
been completed, the device is ready to read array data or  
accept another command.  
The sector erase architecture allows memory sectors to be  
erased and reprogrammed without affecting the data contents  
of other sectors. The A29800 is fully erased when shipped  
from the factory.  
The Erase Suspend feature enables the user to put erase on  
hold for any period of time to read data from, or program data  
to, any other sector that is not selected for erasure. True  
background erase can thus be achieved.  
Power consumption is greatly reduced when the device is  
placed in the standby mode.  
Data  
The hardware  
pin terminates any operation in  
RESET  
progress and resets the internal state machine to reading  
array data.  
The hardware sector protection feature disables operations for  
both program and erase in any combination of the sectors  
of memory. This can be achieved via programming equipment.  
Pin Configurations  
„ SOP  
„ TSOP (I)  
RY/BY  
1
RESET  
WE  
44  
43  
42  
A18  
A17  
A7  
2
3
4
A8  
A15  
A14  
A13  
A12  
A11  
A10  
A9  
A8  
NC  
NC  
WE  
RESET  
NC  
NC  
RY/BY  
A18  
A17  
A7  
1
2
3
4
5
6
7
8
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
A16  
BYTE  
VSS  
I/O15 (A-1)  
I/O7  
I/O14  
I/O6  
I/O13  
I/O5  
I/O12  
I/O4  
VCC  
I/O11  
I/O3  
I/O10  
I/O2  
I/O9  
I/O1  
I/O8  
A9  
41  
40  
39  
38  
A10  
A11  
A6  
5
6
A5  
A4  
A3  
A2  
A1  
A0  
A12  
A13  
7
8
37  
36  
35  
34  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
A14  
A15  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
A29800V  
A16  
CE  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
BYTE  
VSS  
VSS  
OE  
I/O0  
I/O8  
I/O1  
I/O9  
I/O2  
I/O15 (A-1)  
I/O7  
A6  
A5  
A4  
A3  
A2  
A1  
20  
21  
22  
23  
24  
29  
28  
27  
26  
25  
I/O0  
OE  
I/O14  
I/O6  
VSS  
CE  
A0  
I/O13  
I/O5  
I/O12  
I/O4  
I/O10  
I/O3  
VCC  
I/O11  
23  
22  
(October, 2011, Version 1.9)  
2
AMIC Technology, Corp.  
A29800 Series  
Block Diagram  
RY/BY  
I/O0 - I/O15 (A-1)  
VCC  
VSS  
Sector Switches  
Input/Output  
Buffers  
Erase Voltage  
Generator  
RESET  
State  
Control  
WE  
BYTE  
PGM Voltage  
Generator  
Command  
Register  
Chip Enable  
Output Enable  
Logic  
STB  
Data Latch  
CE  
OE  
Y-Decoder  
Y-Gating  
STB  
VCC Detector  
Timer  
A0-A18  
X-decoder  
Cell Matrix  
Pin Descriptions  
Pin No.  
A0 - A18  
I/O0 - I/O14  
Description  
Address Inputs  
Data Inputs/Outputs  
Data Input/Output, Word Mode  
I/O15  
I/O15 (A-1)  
A-1  
LSB Address Input, Byte Mode  
Chip Enable  
CE  
WE  
Write Enable  
Output Enable  
OE  
Hardware Reset  
RESET  
BYTE  
Selects Byte Mode or Word Mode  
Ready/  
- Output  
BUSY  
RY/  
BY  
VSS  
VCC  
Ground  
Power Supply  
(October, 2011, Version 1.9)  
3
AMIC Technology, Corp.  
A29800 Series  
Absolute Maximum Ratings*  
*Comments  
Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to this device. These  
are stress ratings only. Functional operation of this device at  
these or any other conditions above those indicated in the  
operational sections of these specification is not implied or  
intended. Exposure to the absolute maximum rating  
conditions for extended periods may affect device reliability.  
Ambient Operating Temperature . . . . ….. -55°C to + 125°C  
Storage Temperature . . . . . . . . . . . . . . …. -65°C to + 125°C  
Ground to VCC . . . . . . . . . . . . . . . . . . . . . ….. -2.0V to 7.0V  
Output Voltage (Note 1) . . . . . . . . . . . . . . …... -2.0V to 7.0V  
A9,  
&
(Note 2) . . . . . . . . . . ….. -2.0V to 12.5V  
RESET  
OE  
All other pins (Note 1) . . . . . . . . . . . . . . . . ….. -2.0V to 7.0V  
Output Short Circuit Current (Note 3) . . . . . . ….. . . . 200mA  
Operating Ranges  
Notes:  
Commercial (C) Devices  
1. Minimum DC voltage on input or I/O pins is -0.5V. During  
voltage transitions, inputs may undershoot VSS to -2.0V  
for periods of up to 20ns. Maximum DC voltage on output  
and I/O pins is VCC +0.5V. During voltage transitions,  
outputs may overshoot to VCC +2.0V for periods up to  
20ns.  
Ambient Temperature (TA) . . . . . . . . …. .. . . . . 0°C to +70°C  
Extended Range Devices  
Ambient Temperature (TA)  
For – I series (read) . . . . . . . . . . . . . . . . . . -40°C to + 85°C  
For – I series (erase, program) . . . . . . . . . . . . 0°C to + 85°C  
2. Minimum DC input voltage on A9 pins is -0.5V. During  
voltage transitions, A9,  
and  
may overshoot  
RESET  
OE  
VSS to -2.0V for periods of up to 20ns. Maximum DC input  
voltage on A9 and is +12.5V which may overshoot to  
OE  
VCC Supply Voltages  
13.5V for periods up to 20ns.  
3. No more than one output is shorted at a time. Duration of  
the short circuit should not be greater than one second.  
VCC for ± 10% devices . . . . . . . . . . . …... . . +4.5V to +5.5V  
Operating ranges define those limits between which the  
functionally of the device is guaranteed.  
Device Bus Operations  
This section describes the requirements and use of the  
device bus operations, which are initiated through the  
internal command register. The command register itself does  
not occupy any addressable memory location. The register is  
composed of latches that store the commands, along with  
the address and data information needed to execute the  
command. The contents of the register serve as inputs to the  
internal state machine. The state machine outputs dictate the  
function of the device. The appropriate device bus operations  
table lists the inputs and control levels required, and the  
resulting output. The following subsections describe each of  
these operations in further detail.  
Table 1. A29800 Device Bus Operations  
Operation  
A0 - A18  
I/O0 - I/O7  
I/O8 - I/O15  
=VIH  
WE  
CE  
OE  
RESET  
=VIL  
BYTE  
BYTE  
Read  
Write  
L
L
H
X
X
H
X
X
H
L
H
AIN  
AIN  
X
DOUT  
DIN  
DOUT  
DIN  
High-Z  
L
H
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
X
CMOS Standby  
TTL Standby  
X
X
H
X
X
High-Z  
High-Z  
High-Z  
High-Z  
DIN  
High-Z  
High-Z  
High-Z  
High-Z  
DIN  
VCC ± 0.5 V  
VCC ± 0.5 V  
H
L
H
H
X
Output Disable  
Hardware Reset  
X
X
X
L
X
Temporary Sector Unprotect  
(See Note)  
VID  
AIN  
Legend:  
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In  
Note:  
See the "Sector Protection/Unprotection" section and Temporary Sector Unprotect for more information.  
(October, 2011, Version 1.9)  
4
AMIC Technology, Corp.  
A29800 Series  
Word/Byte Configuration  
Program and Erase Operation Status  
During an erase or program operation, the system may check  
the status of the operation by reading the status bits on I/O7 -  
I/O0. Standard read cycle timings and ICC read specifications  
apply. Refer to "Write Operation Status" for more information,  
and to each AC Characteristics section for timing diagrams.  
The  
pin determines whether the I/O pins I/O15 - I/O0  
BYTE  
operate in the byte or word configuration. If the  
pin is  
BYTE  
set at logic “1”, the device is in word configuration, I/O15 - I/O0  
are active and controlled by and  
.
OE  
CE  
If the  
pin is set at logic “0”, the device is in byte  
BYTE  
configuration, and only I/O0 - I/O7 are active and controlled by  
and . I/O8- I/O14 are tri-stated, and I/O15 pin is used as  
Standby Mode  
When the system is not reading or writing to the device, it can  
place the device in the standby mode. In this mode, current  
consumption is greatly reduced, and the outputs are placed in  
CE  
OE  
an input for the LSB(A-1) address function.  
Requirements for Reading Array Data  
the high impedance state, independent of the  
input.  
OE  
To read array data from the outputs, the system must drive  
The device enters the CMOS standby mode when the  
&
CE  
the  
and  
pins to VIL.  
is the power control and  
CE  
OE  
CE  
pins are both held at VCC ± 0.5V. (Note that this is a  
RESET  
more restricted voltage range than VIH.) The device enters the  
TTL standby mode when is held at VIH, while is  
selects the device.  
OE  
data to the output pins.  
is the output control and gates array  
CE  
RESET  
should remain at VIH all the time  
WE  
held at VCC±0.5V. The device requires the standard access  
time (tCE) before it is ready to read data.  
during read operation. The internal state machine is set for  
reading array data upon device power-up, or after a hardware  
reset. This ensures that no spurious alteration of the memory  
content occurs during the power transition. No command is  
necessary in this mode to obtain array data. Standard  
microprocessor read cycles that assert valid addresses on the  
device address inputs produce valid data on the device data  
outputs. The device remains enabled for read access until the  
command register contents are altered.  
If the device is deselected during erasure or programming,  
the device draws active current until the operation is  
completed.  
ICC3 in the DC Characteristics tables represents the standby  
current specification.  
Output Disable Mode  
See "Reading Array Data" for more information. Refer to the  
AC Read Operations table for timing specifications and to the  
Read Operations Timings diagram for the timing waveforms,  
lCC1 in the DC Characteristics table represents the active  
current specification for reading array data.  
When the  
input is at VIH, output from the device is  
OE  
disabled. The output pins are placed in the high impedance  
state.  
: Hardware Reset Pin  
RESET  
Writing Commands/Command Sequences  
The  
pin provides a hardware method of resetting the  
RESET  
device to reading array data. When the system drives the  
pin low for at least a period of tRP, the device  
To write a command or command sequence (which includes  
programming data to the device and erasing sectors of  
RESET  
memory), the system must drive  
and  
to VIL, and  
CE  
immediately terminates any operation in progress, tristates all  
data output pins, and ignores all read/write attempts for the  
WE  
to VIH. An erase operation can erase one sector, multiple  
OE  
duration of the  
pulse. The device also resets the  
RESET  
sectors, or the entire device. The Sector Address Tables  
indicate the address range that each sector occupies. A  
"sector address" consists of the address inputs required to  
uniquely select a sector. See the "Command Definitions"  
section for details on erasing a sector or the entire chip, or  
suspending/resuming the erase operation.  
internal state machine to reading array data. The operation  
that was interrupted should be reinitiated once the device is  
ready to accept another command sequence, to ensure data  
integrity.  
The  
pin may be tied to the system reset circuitry. A  
RESET  
After the system writes the autoselect command sequence,  
the device enters the autoselect mode. The system can then  
read autoselect codes from the internal register (which is  
separate from the memory array) on I/O7 - I/O0. Standard read  
cycle timings apply in this mode. Refer to the "Autoselect  
Mode" and "Autoselect Command Sequence" sections for  
more information.  
system reset would thus also reset the Flash memory,  
enabling the system to read the boot-up firmware from the  
Flash memory.  
Refer to the AC Characteristics tables for  
and diagram.  
parameters  
RESET  
ICC2 in the DC Characteristics table represents the active  
current specification for the write mode. The "AC  
Characteristics" section contains timing specification tables  
and timing diagrams for write operations.  
(October, 2011, Version 1.9)  
5
AMIC Technology, Corp.  
A29800 Series  
Table 2. A29800 Top Boot Block Sector Address Table  
Sector A18  
A17  
A16  
A15  
A14  
A13  
A12  
Sector Size  
(Kbytes/  
Kwords)  
Address Range (in hexadecimal)  
(x16)  
(x8)  
Address Range  
Address Range  
SA0  
SA1  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
32/16  
8/4  
00000h - 07FFFh 00000h - 0FFFFh  
08000h - 0FFFFh 10000h - 1FFFFh  
10000h - 17FFFh 20000h - 2FFFFh  
18000h - 1FFFFh 30000h - 3FFFFh  
20000h - 27FFFh 40000h - 4FFFFh  
28000h - 2FFFFh 50000h - 5FFFFh  
30000h - 37FFFh 60000h - 6FFFFh  
SA2  
SA3  
SA4  
SA5  
SA6  
SA7  
38000h -3FFFFh  
40000h -47FFFh  
48000h -4FFFFh  
70000h -7FFFFh  
80000h -8FFFFh  
90000h -9FFFFh  
SA8  
SA9  
SA10  
SA11  
SA12  
SA13  
SA14  
SA15  
SA16  
SA17  
SA18  
50000h - 57FFFh A0000h - AFFFFh  
58000h - 5FFFFh B0000h - BFFFFh  
60000h - 67FFFh C0000h - CFFFFh  
68000h - 6FFFFh D0000h - DFFFFh  
70000h - 77FFFh E0000h - EFFFFh  
78000h - 7BFFFh F0000h - F7FFFh  
7C000h - 7CFFFh F8000h - F9FFFh  
7D000h - 7DFFFh FA000h - FBFFFh  
7E000h - 7FFFFh FC000h - FFFFFh  
1
1
0
1
8/4  
1
1
X
16/8  
Note:  
Address range is A18: A-1 in byte mod and A18: A0 in word mode. See the “Word/Byte Configuration” section for more  
information.  
(October, 2011, Version 1.9)  
6
AMIC Technology, Corp.  
A29800 Series  
Table 3. A29800 Bottom Boot Block Sector Address Table  
Sector A18  
A17  
A16  
A15  
A14  
A13  
A12  
Sector Size  
(Kbytes /  
Kwords)  
Address Range  
(x 16)  
(x 8)  
Address Range  
Address Range  
SA0  
SA1  
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
1
X
0
16/8  
8/4  
00000h - 01FFFh  
02000h - 02FFFh  
03000h - 03FFFh  
04000h - 07FFFh  
08000h - 0FFFFh  
10000h - 17FFFh  
18000h - 1FFFFh  
20000h - 27FFFh  
28000h - 2FFFFh  
30000h - 37FFFh  
38000h - 3FFFFh  
40000h - 47FFFh  
48000h - 4FFFFh  
50000h - 57FFFh  
58000h - 5FFFFh  
60000h - 67FFFh  
00000h - 03FFFh  
04000h - 05FFFh  
06000h - 07FFFh  
08000h - 0FFFFh  
10000h - 1FFFFh  
20000h - 2FFFFh  
30000h - 3FFFFh  
40000h - 4FFFFh  
50000h - 5FFFFh  
60000h - 6FFFFh  
70000h - 7FFFFh  
80000h - 8FFFFh  
90000h - 9FFFFh  
A0000h - AFFFFh  
B0000h - BFFFFh  
C0000h - CFFFFh  
SA2  
0
1
1
8/4  
SA3  
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
32/16  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
64/32  
SA4  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
SA5  
SA6  
SA7  
SA8  
SA9  
SA10  
SA11  
SA12  
SA13  
SA14  
SA15  
SA16  
SA17  
SA18  
68000h - 6FFFFh D0000h - DFFFFh  
70000h - 77FFFh  
78000h - 7FFFFh  
E0000h - EFFFFh  
F0000h - FFFFFh  
Note:  
Address range is A18: A-1 in byte mode and A18: A0 in word mode. See the “Word/Byte Configuration” section for more  
information  
(October, 2011, Version 1.9)  
7
AMIC Technology, Corp.  
A29800 Series  
Autoselect Mode  
The autoselect mode provides manufacturer and device  
identification, and sector protection verification, through  
identifier codes output on I/O7 - I/O0. This mode is primarily  
intended for programming equipment to automatically match  
appropriate highest order address bits. Refer to the  
corresponding Sector Address Tables. The Command  
Definitions table shows the remaining address bits that are  
don't care. When all necessary bits have been set as  
required, the programming equipment may then read the  
corresponding identifier code on I/O7 - I/O0.  
To access the autoselect codes in-system, the host system  
can issue the autoselect command via the command register,  
as shown in the Command Definitions table. This method  
does not require VID. See "Command Definitions" for details  
on using the autoselect mode.  
a
device to be programmed with its corresponding  
programming algorithm. However, the autoselect codes can  
also be accessed in-system through the command register.  
When using programming equipment, the autoselect mode  
requires VID (11.5V to 12.5 V) on address pin A9. Address  
pins A6, A1, and A0 must be as shown in Autoselect Codes  
(High Voltage Method) table. In addition, when verifying  
sector protection, the sector address must appear on the  
Table 4. A29800 Autoselect Codes (High Voltage Method)  
A18  
to  
A11  
to  
A9  
A8  
to  
A6  
A5  
to  
A1  
A0  
I/O8  
to  
I/O7  
to  
Description  
Mode  
CE OE WE  
A12  
A10  
A7  
A2  
I/O15  
I/O0  
Manufacturer ID: AMIC  
Device ID: A29800  
(Top Boot Block)  
L
L
L
L
H
H
X
X
VID  
X
X
L
L
X
X
L
L
L
X
B3h  
X
37h  
0Eh  
0Eh  
8Fh  
8Fh  
7Fh  
Word  
Byte  
Word  
Byte  
X
X
VID  
H
Device ID: A29800  
(Bottom Boot Block)  
B3h  
X
L
L
L
L
H
H
X
X
X
X
VID  
X
X
L
L
X
X
L
H
H
Continuation ID  
VID  
H
X
01h  
(protected)  
X
X
Sector Protection Verification  
L
L
H
SA  
X
VID  
X
L
X
H
L
00h  
(unprotected)  
L=Logic Low= VIL, H=Logic High=VIH, SA=Sector Address, X=Don’t Care.  
(October, 2011, Version 1.9)  
8
AMIC Technology, Corp.  
A29800 Series  
Sector Protection/Unprotection  
The hardware sector protection feature disables both  
program and erase operations in any sector. The hardware  
sector unprotection feature re-enables both program and  
erase operations in previously protected sectors.  
START  
Sector protection/unprotection must be implemented using  
programming equipment. The procedure requires a high  
voltage (VID) on address pin A9 and the control pins.  
The device is shipped with all sectors unprotected.  
RESET = VID  
(Note 1)  
It is possible to determine whether a sector is protected or  
unprotected. See "Autoselect Mode" for details.  
Hardware Data Protection  
Perform Erase or  
Program Operations  
The requirement of command unlocking sequence for  
programming or erasing provides data protection against  
inadvertent writes (refer to the Command Definitions table). In  
addition, the following hardware data protection measures  
prevent accidental erasure or programming, which might  
otherwise be caused by spurious system level signals during  
VCC power-up transitions, or from system noise. The device is  
powered up to read array data to avoid accidentally writing  
data to the array.  
RESET = VIH  
Write Pulse "Glitch" Protection  
Temporary Sector  
Unprotect  
Completed (Note 2)  
Noise pulses of less than 5ns (typical) on  
do not initiate a write cycle.  
,
or  
OE CE  
WE  
Logical Inhibit  
Notes:  
1. All protected sectors unprotected.  
2. All previously protected sectors are protected once again.  
Write cycles are inhibited by holding any one of  
=VIL,  
OE  
CE  
CE  
= VIH or  
= VIH. To initiate a write cycle,  
and  
WE  
WE  
Figure 1. Temporary Sector Unprotect Operation  
must be a logical zero while  
is a logical one.  
OE  
Power-Up Write Inhibit  
If  
=
= VIL and  
= VIH during power up, the  
OE  
WE  
device does not accept commands on the rising edge of  
. The internal state machine is automatically reset to  
CE  
WE  
reading array data on the initial power-up.  
Temporary Sector Unprotect  
This feature allows temporary unprotection of previous  
protected sectors to change data in-system. The Sector  
Unprotect mode is activated by setting the  
pin to VID.  
RESET  
During this mode, formerly protected sectors can be  
programmed or erased by selecting the sector addresses.  
Once VID is removed from the  
pin, all the previously  
RESET  
protected sectors are protected again. Figure 1 shows the  
algorithm, and the Temporary Sector Unprotect diagram  
shows the timing waveforms, for this feature.  
(October, 2011, Version 1.9)  
9
AMIC Technology, Corp.  
A29800 Series  
Command Definitions  
Autoselect Command Sequence  
Writing specific address and data commands or sequences  
into the command register initiates device operations. The  
Command Definitions table defines the valid register  
command sequences. Writing incorrect address and data  
values or writing them in the improper sequence resets the  
device to reading array data.  
The autoselect command sequence allows the host system to  
access the manufacturer and devices codes, and determine  
whether or not  
a sector is protected. The Command  
Definitions table shows the address and data requirements.  
This method is an alternative to that shown in the Autoselect  
Codes (High Voltage Method) table, which is intended for  
PROM programmers and requires VID on address bit A9.  
The autoselect command sequence is initiated by writing two  
unlock cycles, followed by the autoselect command. The  
device then enters the autoselect mode, and the system may  
read at any address any number of times, without initiating  
another command sequence.  
All addresses are latched on the falling edge of  
or  
,
CE  
WE  
whichever happens later. All data is latched on the rising  
edge of or , whichever happens first. Refer to the  
WE  
CE  
appropriate timing diagrams in the "AC Characteristics"  
section.  
A read cycle at address XX00h retrieves the manufacturer  
code and another read cycle at XX03h retrieves the  
continuation code. A read cycle at address XX01h in word  
mode (or 02h in byte mode) returns the device code. A read  
cycle containing a sector address (SA) and the address 02h  
in returns 01h if that sector is protected, or 00h if it is  
unprotected. Refer to the Sector Address tables for valid  
sector addresses.  
Reading Array Data  
The device is automatically set to reading array data after  
device power-up. No commands are required to retrieve data.  
The device is also ready to read array data after completing  
an Embedded Program or Embedded Erase algorithm. After  
the device accepts an Erase Suspend command, the device  
enters the Erase Suspend mode. The system can read array  
data using the standard read timings, except that if it reads at  
an address within erase-suspended sectors, the device  
The system must write the reset command to exit the  
autoselect mode and return to reading array data.  
outputs status data. After completing  
a programming  
Word/Byte Program Command Sequence  
operation in the Erase Suspend mode, the system may once  
again read array data with the same exception. See "Erase  
Suspend/Erase Resume Commands" for more information on  
this mode.  
The system may program the device by word or byte,  
depending on the state of the  
pin. Programming is a  
BYTE  
four-bus-cycle operation. The program command sequence is  
initiated by writing two unlock write cycles, followed by the  
program set-up command. The program address and data  
are written next, which in turn initiate the Embedded Program  
algorithm. The system is not required to provide further  
controls or timings. The device automatically provides  
internally generated program pulses and verify the  
programmed cell margin. Table 5 shows the address and  
data requirements for the byte program command sequence.  
When the Embedded Program algorithm is complete, the  
device then returns to reading array data and addresses are  
longer latched. The system can determine the status of the  
The system must issue the reset command to re-enable the  
device for reading array data if I/O5 goes high, or while in the  
autoselect mode. See the "Reset Command" section, next.  
See also "Requirements for Reading Array Data" in the  
"Device Bus Operations" section for more information. The  
Read Operations table provides the read parameters, and  
Read Operation Timings diagram shows the timing diagram.  
Reset Command  
Writing the reset command to the device resets the device to  
reading array data. Address bits are don't care for this  
command. The reset command may be written between the  
sequence cycles in an erase command sequence before  
erasing begins. This resets the device to reading array data.  
Once erasure begins, however, the device ignores reset  
commands until the operation is complete.  
The reset command may be written between the sequence  
cycles in a program command sequence before programming  
begins. This resets the device to reading array data (also  
applies to programming in Erase Suspend mode). Once  
programming begins, however, the device ignores reset  
commands until the operation is complete.  
program operation by using I/O7, I/O6, or RY/  
. See “White  
BY  
Operation Status” for information on these status bits.  
Any commands written to the device during the Embedded  
Program Algorithm are ignored. Not that a hardware reset  
immediately terminates the programming operation. The Byte  
Program command sequence should be reinitiated once the  
device has reset to reading array data, to ensure data  
integrity.  
Programming is allowed in any sequence and across sector  
boundaries. A bit cannot be programmed from a “0” back to a  
“1”. Attempting to do so may halt the operation and set I/O5  
The reset command may be written between the sequence  
cycles in an autoselect command sequence. Once in the  
autoselect mode, the reset command must be written to  
return to reading array data (also applies to autoselect during  
Erase Suspend).  
to “1”, or cause the  
Polling algorithm to indicate the  
Data  
operation was successful. However, a succeeding read will  
show that the data is still “0”. Only erase operations can  
convert a “0” to a “1”.  
If I/O5 goes high during a program or erase operation, writing  
the reset command returns the device to reading array data  
(also applies during Erase Suspend).  
(October, 2011, Version 1.9)  
10  
AMIC Technology, Corp.  
A29800 Series  
Any commands written to the chip during the Embedded  
Erase algorithm are ignored. The system can determine the  
status of the erase operation by using I/O7, I/O6, or I/O2. See  
"Write Operation Status" for information on these status bits.  
When the Embedded Erase algorithm is complete, the device  
returns to reading array data and addresses are no longer  
latched.  
Figure 3 illustrates the algorithm for the erase operation. See  
the Erase/Program Operations tables in "AC Characteristics"  
for parameters, and to the Chip/Sector Erase Operation  
Timings for timing waveforms.  
START  
Write Program  
Command  
Sequence  
Data Poll  
from System  
Sector Erase Command Sequence  
Embedded  
Program  
algorithm in  
progress  
Sector erase is a six-bus-cycle operation. The sector erase  
command sequence is initiated by writing two unlock cycles,  
followed by a set-up command. Two additional unlock write  
cycles are then followed by the address of the sector to be  
erased, and the sector erase command. The Command  
Definitions table shows the address and data requirements  
for the sector erase command sequence.  
The device does not require the system to preprogram the  
memory prior to erase. The Embedded Erase algorithm  
automatically programs and verifies the sector for an all zero  
data pattern prior to electrical erase. The system is not  
required to provide any controls or timings during these  
operations.  
After the command sequence is written, a sector erase time-  
out of 50μs begins. During the time-out period, additional  
sector addresses and sector erase commands may be  
written. Loading the sector erase buffer may be done in any  
sequence, and the number of sectors may be from one sector  
to all sectors. The time between these additional cycles must  
be less than 50μs, otherwise the last address and command  
might not be accepted, and erasure may begin. It is  
recommended that processor interrupts be disabled during  
this time to ensure all commands are accepted. The  
interrupts can be re-enabled after the last Sector Erase  
command is written. If the time between additional sector  
erase commands can be assumed to be less than 50μs, the  
system need not monitor I/O3. Any command other than  
Sector Erase or Erase Suspend during the time-out period  
resets the device to reading array data. The system must  
rewrite the command sequence and any additional sector  
addresses and commands.  
Verify Data ?  
Yes  
No  
Increment Address  
Last Address ?  
Yes  
Programming  
Completed  
Note : See the appropriate Command Definitions table for  
program command sequence.  
Figure 2. Program Operation  
The system can monitor I/O3 to determine if the sector erase  
timer has timed out. (See the " I/O3: Sector Erase Timer"  
section.) The time-out begins from the rising edge of the final  
Chip Erase Command Sequence  
Chip erase is a six-bus-cycle operation. The chip erase  
command sequence is initiated by writing two unlock cycles,  
followed by a set-up command. Two additional unlock write  
cycles are then followed by the chip erase command, which  
in turn invokes the Embedded Erase algorithm.  
The device does not require the system to preprogram prior  
to erase. The Embedded Erase algorithm automatically  
preprograms and verifies the entire memory for an all zero  
data pattern prior to electrical erase. The system is not  
required to provide any controls or timings during these  
operations. The Command Definitions table shows the  
address and data requirements for the chip erase command  
sequence.  
pulse in the command sequence.  
WE  
Once the sector erase operation has begun, only the Erase  
Suspend command is valid. All other commands are ignored.  
When the Embedded Erase algorithm is complete, the device  
returns to reading array data and addresses are no longer  
latched. The system can determine the status of the erase  
operation by using I/O7, I/O6, or I/O2. Refer to "Write  
Operation Status" for information on these status bits.  
Figure 3 illustrates the algorithm for the erase operation.  
Refer to the Erase/Program Operations tables in the "AC  
Characteristics" section for parameters, and to the Sector  
Erase Operations Timing diagram for timing waveforms.  
(October, 2011, Version 1.9)  
11  
AMIC Technology, Corp.  
A29800 Series  
Erase Suspend/Erase Resume Commands  
START  
The Erase Suspend command allows the system to interrupt  
a sector erase operation and then read data from, or program  
data to, any sector not selected for erasure. This command is  
valid only during the sector erase operation, including the  
50μs time-out period during the sector erase command  
sequence. The Erase Suspend command is ignored if written  
during the chip erase operation or Embedded Program  
algorithm. Writing the Erase Suspend command during the  
Sector Erase time-out immediately terminates the time-out  
period and suspends the erase operation. Addresses are  
"don't cares" when writing the Erase Suspend command.  
When the Erase Suspend command is written during a sector  
erase operation, the device requires a maximum of 30μs to  
suspend the erase operation. However, when the Erase  
Suspend command is written during the sector erase time-  
out, the device immediately terminates the time-out period  
and suspends the erase operation.  
Write Erase  
Command  
Sequence  
Data Poll  
from System  
Embedded  
Erase  
algorithm in  
progress  
No  
Data = FFh ?  
After the erase operation has been suspended, the system  
can read array data from or program data to any sector not  
selected for erasure. (The device "erase suspends" all  
sectors selected for erasure.) Normal read and write timings  
and command definitions apply. Reading at any address  
within erase-suspended sectors produces status data on I/O7  
- I/O0. The system can use I/O7, or I/O6 and I/O2 together, to  
determine if a sector is actively erasing or is erase-  
suspended. See "Write Operation Status" for information on  
these status bits.  
After an erase-suspended program operation is complete, the  
system can once again read array data within non-suspended  
sectors. The system can determine the status of the program  
operation using the I/O7 or I/O6 status bits, just as in the  
standard program operation. See "Write Operation Status" for  
more information.  
Yes  
Erasure Completed  
Note :  
1. See the appropriate Command Definitions table for erase  
command sequences.  
2. See "I/O3 : Sector Erase Timer" for more information.  
Figure 3. Erase Operation  
The system may also write the autoselect command  
sequence when the device is in the Erase Suspend mode.  
The device allows reading autoselect codes even at  
addresses within erasing sectors, since the codes are not  
stored in the memory array. When the device exits the  
autoselect mode, the device reverts to the Erase Suspend  
mode, and is ready for another valid operation. See  
"Autoselect Command Sequence" for more information.  
The system must write the Erase Resume command  
(address bits are "don't care") to exit the erase suspend  
mode and continue the sector erase operation. Further writes  
of the Resume command are ignored. Another Erase  
Suspend command can be written after the device has  
resumed erasing.  
(October, 2011, Version 1.9)  
12  
AMIC Technology, Corp.  
A29800 Series  
Table 5. A29800 Command Definitions  
Bus Cycles (Notes 2 - 5)  
Third Fourth  
Command  
Sequence  
(Note 1)  
First  
Addr Data Addr Data  
RA RD  
Second  
Fifth  
Sixth  
Addr Data Addr Data Addr Data Addr Data  
Read (Note 6)  
Reset (Note 7)  
1
1
XXX F0  
555  
Word  
Byte  
Word  
Byte  
2AA  
555  
2AA  
555  
Manufacturer ID  
4
4
AA  
55  
55  
90 X00  
37  
AAA  
AAA  
555  
B30E  
0E  
555  
AA  
AAA  
X01  
90  
Device ID,  
Top Boot Block  
555  
2AA  
555  
AAA  
555  
X02  
Word  
Byte  
B38F  
8F  
555  
90  
X01  
X02  
X03  
Device ID,  
Bottom Boot Block  
AA  
AA  
55  
4
4
AAA  
AAA  
Word  
Byte  
555  
AAA  
555  
2AA  
555  
2AA  
555  
AAA  
555  
Continuation ID  
55  
55  
90  
7F  
X06  
XX00  
(SA)  
X02  
Word  
Sector Protect Verify  
(Note 9)  
XX01  
00  
4
AA  
90  
(SA)  
X04  
Byte  
AAA  
555  
AAA  
01  
Word  
Byte  
Word  
Byte  
Word  
Byte  
555  
2AA  
555  
2AA  
555  
2AA  
555  
555  
AAA  
555  
Program  
4
6
6
AA  
AA  
AA  
55  
55  
55  
A0  
80  
80  
PA  
PD  
AA  
AA  
AAA  
555  
555  
AAA  
555  
2AA  
555  
2AA  
555  
555  
Chip Erase  
55  
55  
10  
30  
AAA  
555  
AAA  
555  
AAA  
Sector Erase  
SA  
AAA  
AAA  
AAA  
Erase Suspend (Note 9)  
Erase Resume (Note 10)  
1
1
XXX B0  
XXX 30  
Legend:  
X = Don't care  
RA = Address of the memory location to be read.  
RD = Data read from location RA during read operation.  
PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the  
whichever happens later.  
or  
pulse,  
CE  
WE  
PD = Data to be programmed at location PA. Data latches on the rising edge of  
or  
pulse, whichever happens first.  
CE  
WE  
SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A18 - A12 select a unique sector.  
Note:  
1. See Table 1 for description of bus operations.  
2. All values are in hexadecimal.  
3. Except when reading array or autoselect data, all bus cycles are write operation.  
4. Address bits A18 - A11 are don't cares for unlock and command cycles, unless SA or PA required.  
5. No unlock or command cycles required when reading array data.  
6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high  
(while the device is providing status data).  
7. The fourth cycle of the autoselect command sequence is a read cycle.  
8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more information.  
9. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode.  
10. The Erase Resume command is valid only during the Erase Suspend mode.  
(October, 2011, Version 1.9)  
13  
AMIC Technology, Corp.  
A29800 Series  
Write Operation Status  
Several bits, I/O2, I/O3, I/O5, I/O6, I/O7, RY/  
the A29800 to determine the status of a write operation.  
Table 6 and the following subsections describe the functions  
are provided in  
BY  
START  
of these status bits. I/O7, I/O6 and RY/  
each offer a  
BY  
method for determining whether  
a program or erase  
operation is complete or in progress. These three bits are  
discussed first.  
Read I/O  
Address = VA  
7-I/O0  
I/O7:  
Polling  
Data  
The  
Polling bit, I/O7, indicates to the host system  
Data  
whether an Embedded Algorithm is in progress or completed,  
Yes  
I/O  
7
= Data ?  
No  
or whether the device is in Erase Suspend. Polling is  
Data  
pulse in the  
valid after the rising edge of the final  
program or erase command sequence.  
WE  
During the Embedded Program algorithm, the device outputs  
on I/O7 the complement of the datum programmed to I/O7.  
This I/O7 status also applies to programming during Erase  
Suspend. When the Embedded Program algorithm is  
complete, the device outputs the datum programmed to I/O7.  
The system must provide the program address to read valid  
status information on I/O7. If a program address falls within a  
No  
I/O5 = 1?  
Yes  
protected sector,  
Polling on I/O7 is active for  
Data  
approximately 2μs, then the device returns to reading array  
data.  
Read I/O  
7
- I/O0  
During the Embedded Erase algorithm,  
Polling  
Address = VA  
Data  
produces a "0" on I/O7. When the Embedded Erase algorithm  
is complete, or if the device enters the Erase Suspend mode,  
Polling produces a "1" on I/O7.This is analogous to the  
Data  
complement/true datum output described for the Embedded  
Program algorithm: the erase function changes all the bits in  
a sector to "1"; prior to this, the device outputs the  
"complement," or "0." The system must provide an address  
within any of the sectors selected for erasure to read valid  
status information on I/O7.  
Yes  
I/O7  
= Data ?  
No  
After an erase command sequence is written, if all sectors  
selected for erasing are protected,  
Polling on I/O7 is  
Data  
active for approximately 100μs, then the device returns to  
reading array data. If not all selected sectors are protected,  
the Embedded Erase algorithm erases the unprotected  
sectors, and ignores the selected sectors that are protected.  
When the system detects I/O7 has changed from the  
complement to true data, it can read valid data at I/O7 - I/O0  
on the following read cycles. This is because I/O7 may  
change asynchronously with I/O0 - I/O6 while Output Enable  
FAIL  
PASS  
Note :  
1. VA = Valid address for programming. During a sector  
erase operation, a valid address is an address within any  
sector selected for erasure. During chip erase, a valid  
address is any non-protected sector address.  
(
) is asserted low. The  
Polling Timings (During  
Data  
OE  
Embedded Algorithms) figure in the "AC Characteristics"  
section illustrates this. Table 6 shows the outputs for  
2. I/O  
7
should be rechecked even if I/O  
may change simultaneously with I/O  
5 = "1" because  
I/O7  
5
.
Data  
Polling algorithm.  
Polling on I/O7. Figure 4 shows the  
Data  
Figure 4. Data Polling Algorithm  
(October, 2011, Version 1.9)  
14  
AMIC Technology, Corp.  
A29800 Series  
I/O2: Toggle Bit II  
RY/  
: Read/  
Busy  
BY  
The "Toggle Bit II" on I/O2, when used with I/O6, indicates  
whether a particular sector is actively erasing (that is, the  
Embedded Erase algorithm is in progress), or whether that  
sector is erase-suspended. Toggle Bit II is valid after the  
The RY/  
is a dedicated, open-drain output pin that  
BY  
indicates whether an Embedded algorithm is in progress or  
complete. The RY/ status is valid after the rising edge of  
BY  
pulse in the command sequence. Since  
the final  
WE  
rising edge of the final  
I/O2 toggles when the system reads at addresses within  
those sectors that have been selected for erasure. (The  
pulse in the command sequence.  
WE  
RY/  
is an open-drain output, several RY/  
pins can be  
BY  
BY  
tied together in parallel with a pull-up resistor to VCC.  
If the output is low (Busy), the device is actively erasing or  
programming. (This includes programming in the Erase  
Suspend mode.) If the output is high (Ready), the device is  
ready to read array data (including during the Erase Suspend  
mode), or is in the standby mode.  
system may use  
and  
to control the read cycles.) But  
CE  
OE  
I/O2 cannot distinguish whether the sector is actively erasing  
or is erase-suspended. I/O6, by comparison, indicates  
whether the device is actively erasing, or is in Erase  
Suspend, but cannot distinguish which sectors are selected  
for erasure. Thus, both status bits are required for sector and  
mode information. Refer to Table 6 to compare outputs for  
I/O2 and I/O6.  
Figure 5 shows the toggle bit algorithm in flowchart form, and  
the section " I/O2: Toggle Bit II" explains the algorithm. See  
also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle  
Bit Timings figure for the toggle bit timing diagram. The I/O2  
vs. I/O6 figure shows the differences between I/O2 and I/O6 in  
graphical form.  
Table 6 shows the outputs for RY/  
. Refer to “  
RESET  
BY  
Timings”, “Timing Waveforms for Program Operation” and  
“Timing Waveforms for Chip/Sector Erase Operation” for  
more information.  
I/O6: Toggle Bit I  
Toggle Bit I on I/O6 indicates whether an Embedded Program  
or Erase algorithm is in progress or complete, or whether the  
device has entered the Erase Suspend mode. Toggle Bit I  
may be read at any address, and is valid after the rising edge  
Reading Toggle Bits I/O6, I/O2  
of the final  
pulse in the command sequence (prior to the  
WE  
Refer to Figure 5 for the following discussion. Whenever the  
system initially begins reading toggle bit status, it must read  
I/O7 - I/O0 at least twice in a row to determine whether a  
toggle bit is toggling. Typically, a system would note and  
store the value of the toggle bit after the first read. After the  
second read, the system would compare the new value of the  
toggle bit with the first. If the toggle bit is not toggling, the  
device has completed the program or erase operation. The  
system can read array data on I/O7 - I/O0 on the following  
read cycle.  
However, if after the initial two read cycles, the system  
determines that the toggle bit is still toggling, the system also  
should note whether the value of I/O5 is high (see the section  
on I/O5). If it is, the system should then determine again  
whether the toggle bit is toggling, since the toggle bit may  
have stopped toggling just as I/O5 went high. If the toggle bit  
is no longer toggling, the device has successfully completed  
the program or erase operation. If it is still toggling, the device  
did not complete the operation successfully, and the system  
must write the reset command to return to reading array data.  
The remaining scenario is that the system initially determines  
that the toggle bit is toggling and I/O5 has not gone high. The  
system may continue to monitor the toggle bit and I/O5  
through successive read cycles, determining the status as  
described in the previous paragraph. Alternatively, it may  
choose to perform other system tasks. In this case, the  
system must start at the beginning of the algorithm when it  
returns to determine the status of the operation (top of Figure  
5).  
program or erase operation), and during the sector erase  
time-out.  
During an Embedded Program or Erase algorithm operation,  
successive read cycles to any address cause I/O6 to toggle.  
(The system may use  
and  
to control the read  
CE  
OE  
cycles.) When the operation is complete, I/O6 stops toggling.  
After an erase command sequence is written, if all sectors  
selected for erasing are protected, I/O6 toggles for  
approximately 100μs, then returns to reading array data. If  
not all selected sectors are protected, the Embedded Erase  
algorithm erases the unprotected sectors, and ignores the  
selected sectors that are protected.  
The system can use I/O6 and I/O2 together to determine  
whether a sector is actively erasing or is erase-suspended.  
When the device is actively erasing (that is, the Embedded  
Erase algorithm is in progress), I/O6 toggles. When the  
device enters the Erase Suspend mode, I/O6 stops toggling.  
However, the system must also use I/O2 to determine which  
sectors are erasing or erase-suspended. Alternatively, the  
system can use I/O7 (see the subsection on " I/O7 :  
Polling").  
Data  
If a program address falls within a protected sector, I/O6  
toggles for approximately 2μs after the program command  
sequence is written, then returns to reading array data.  
I/O6 also toggles during the erase-suspend-program mode,  
and stops toggling once the Embedded Program algorithm is  
complete.  
The Write Operation Status table shows the outputs for  
Toggle Bit I on I/O6. Refer to Figure 5 for the toggle bit  
algorithm, and to the Toggle Bit Timings figure in the "AC  
Characteristics" section for the timing diagram. The I/O2 vs.  
I/O6 figure shows the differences between I/O2 and I/O6 in  
graphical form. See also the subsection on " I/O2: Toggle Bit  
II".  
(October, 2011, Version 1.9)  
15  
AMIC Technology, Corp.  
A29800 Series  
I/O5: Exceeded Timing Limits  
I/O5 indicates whether the program or erase time has  
exceeded a specified internal pulse count limit. Under these  
conditions I/O5 produces a "1." This is a failure condition that  
indicates the program or erase cycle was not successfully  
completed.  
START  
The I/O5 failure condition may appear if the system tries to  
program a "1 "to a location that is previously programmed to  
"0." Only an erase operation can change a "0" back to a "1."  
Under this condition, the device halts the operation, and  
when the operation has exceeded the timing limits, I/O5  
produces a "1."  
Read I/O  
7
-I/O  
0
Read I/O7-I/O  
0
(Note 1)  
No  
Under both these conditions, the system must issue the reset  
command to return the device to reading array data.  
I/O3: Sector Erase Timer  
Toggle Bit  
= Toggle ?  
After writing a sector erase command sequence, the system  
may read I/O3 to determine whether or not an erase  
operation has begun. (The sector erase timer does not apply  
to the chip erase command.) If additional sectors are  
selected for erasure, the entire time-out also applies after  
each additional sector erase command. When the time-out is  
complete, I/O3 switches from "0" to "1." The system may  
ignore I/O3 if the system can guarantee that the time between  
additional sector erase commands will always be less than  
50μs. See also the "Sector Erase Command Sequence"  
section.  
Yes  
No  
I/O5 = 1?  
Yes  
- I/O  
After the sector erase command sequence is written, the  
Read I/O  
7
0
(Notes 1,2)  
system should read the status on I/O7 (  
Polling) or I/O6  
Data  
Twice  
(Toggle Bit 1) to ensure the device has accepted the  
command sequence, and then read I/O3. If I/O3 is "1", the  
internally controlled erase cycle has begun; all further  
commands (other than Erase Suspend) are ignored until the  
erase operation is complete. If I/O3 is "0", the device will  
accept additional sector erase commands. To ensure the  
command has been accepted, the system software should  
check the status of I/O3 prior to and following each  
subsequent sector erase command. If I/O3 is high on the  
second status check, the last command might not have been  
accepted. Table 6 shows the outputs for I/O3.  
No  
Toggle Bit  
= Toggle ?  
Yes  
Program/Erase  
Operation Not  
Program/Erase  
Commplete, Write  
Reset Command  
Operation Complete  
Notes :  
1. Read toggle bit twice to determine whether or not it is  
toggling. See text.  
2. Recheck toggle bit because it may stop toggling as I/O  
5
changes to "1". See text.  
Figure 5. Toggle Bit Algorithm  
(October, 2011, Version 1.9)  
16  
AMIC Technology, Corp.  
A29800 Series  
Table 6. Write Operation Status  
I/O7  
I/O6  
I/O5  
(Note 2)  
0
I/O3  
I/O2  
RY/  
BY  
Operation  
(Note 1)  
(Note 1)  
Standard  
Mode  
Embedded Program Algorithm  
Embedded Erase Algorithm  
Toggle  
Toggle  
N/A  
1
No toggle  
0
I/O7  
0
0
0
Toggle  
Toggle  
0
1
Erase  
Reading within Erase  
Suspended Sector  
1
No toggle  
N/A  
Suspend  
Mode  
Reading within Non-Erase  
Suspend Sector  
Data  
I/O7  
Data  
Data  
0
Data  
N/A  
Data  
N/A  
1
0
Erase-Suspend-Program  
Toggle  
Notes:  
1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further details.  
2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.  
See “I/O5: Exceeded Timing Limits” for more information.  
Maximum Negative Input Overshoot  
20ns  
20ns  
+0.8V  
-0.5V  
-2.0V  
20ns  
Maximum Positive Input Overshoot  
20ns  
VCC+2.0V  
VCC+0.5V  
2.0V  
20ns  
20ns  
(October, 2011, Version 1.9)  
17  
AMIC Technology, Corp.  
A29800 Series  
DC Characteristics  
TTL/NMOS Compatible  
Parameter  
Symbol  
Parameter Description  
Input Load Current  
A9, Input Load Current  
Test Description  
Min.  
Typ.  
Max.  
Unit  
μA  
ILI  
VIN = VSS to VCC. VCC = VCC Max  
VCC = VCC Max,  
±1.0  
ILIT  
100  
&
μA  
OE RESET  
A9,  
&
=12.5V  
OE RESET  
ILO  
Output Leakage Current  
VOUT = VSS to VCC. VCC = VCC Max  
±1.0  
μA  
ICC1  
VCC Active Read Current  
(Notes 1, 2)  
20  
30  
30  
mA  
= VIL,  
= VIH  
=VIH  
CE  
OE  
OE  
VCC Active Write (Program/Erase)  
Current (Notes 2, 3, 4)  
ICC2  
ICC3  
40  
mA  
mA  
= VIL,  
= VIH,  
CE  
CE  
VCC Standby Current (Note 2)  
0.4  
1.0  
= VCC ± 0.5V  
RESET  
VIL  
VIH  
Input Low Level  
Input High Level  
-0.5  
2.0  
0.8  
V
V
VCC+0.5  
Voltage for Autoselect and  
Temporary Unprotect Sector  
Output Low Voltage  
VID  
VCC = 5.25 V  
10.5  
V
12.5  
0.45  
VOL  
VOH  
IOL = 12mA, VCC = VCC Min  
IOH = -2.5 mA, VCC = VCC Min  
V
V
Output High Voltage  
2.4  
CMOS Compatible  
Parameter  
Symbol  
Parameter Description  
Input Load Current  
A9,  
Test Description  
Min.  
Typ.  
Max.  
Unit  
μA  
ILI  
VIN = VSS to VCC, VCC = VCC Max  
VCC = VCC Max,  
±1.0  
ILIT  
50  
&
Input Load Current  
μA  
OE RESET  
A9,  
&
= 12.5V  
OE RESET  
Output Leakage Current  
ILO  
VOUT = VSS to VCC, VCC = VCC Max  
±1.0  
μA  
VCC Active Read Current  
(Notes 1,2)  
ICC1  
20  
30  
mA  
= VIL,  
= VIL,  
= VIH  
CE  
CE  
OE  
OE  
VCC Active Program/Erase Current  
(Notes 2,3,4)  
ICC2  
ICC3  
30  
1
40  
5
mA  
= VIH  
VCC Standby Current (Notes 2, 5)  
μA  
=
= VCC ± 0.5 V  
CE RESET  
VIL  
VIH  
Input Low Level  
Input High Level  
-0.5  
V
V
0.8  
0.7 x VCC  
VCC+0.3  
Voltage for Autoselect and  
Temporary Sector Unprotect  
Output Low Voltage  
VID  
VCC = 5.25 V  
10.5  
12.5  
0.45  
V
VOL  
VOH1  
VOH2  
IOL = 12.0 mA, VCC = VCC Min  
IOH = -2.5 mA, VCC = VCC Min  
IOH = -100 μA. VCC = VCC Min  
V
V
V
0.85 x VCC  
VCC-0.4  
Output High Voltage  
Notes for DC characteristics (both tables):  
1. The ICC current listed includes both the DC operation current and the frequency dependent component (at 6 MHz).  
The frequency component typically is less than 2 mA/MHz, with  
2. Maximum ICC specifications are tested with VCC = VCC max.  
at VIH.  
OE  
3. ICC active while Embedded Algorithm (program or erase) is in progress.  
4. Not 100% tested.  
5. For CMOS mode only, ICC3 = 20μA max at extended temperatures (> +85°C).  
(October, 2011, Version 1.9)  
18  
AMIC Technology, Corp.  
A29800 Series  
AC Characteristics  
Read Only Operations  
Parameter Symbols  
Description  
Test Setup  
Speed  
Unit  
JEDEC  
tAVAV  
Std  
tRC  
-55  
55  
55  
-70  
70  
70  
-90  
Read Cycle Time (Note 2)  
Address to Output Delay  
Min.  
90  
90  
ns  
ns  
tAVQV  
tACC  
Max.  
= VIL  
= VIL  
CE  
OE  
tELQV  
tGLQV  
tCE  
Chip Enable to Output Delay  
Output Enable to Output Delay  
Output Enable Hold Read  
Max.  
Max.  
Min.  
Min.  
55  
30  
0
70  
30  
0
90  
35  
0
ns  
ns  
ns  
ns  
= VIL  
OE  
tOE  
tOEH  
Time (Note 2)  
Toggle and  
Polling  
10  
10  
10  
Data  
tEHQZ  
tGHQZ  
tDF  
tDF  
Chip Enable to Output High Z  
Max.  
Min.  
18  
18  
20  
20  
20  
20  
ns  
ns  
Output Enable to Output High Z  
(Notes 1,2)  
tAXQX  
tOH  
Output Hold Time from Addresses,  
0
0
0
ns  
or  
CE OE  
, Whichever Occurs First  
Notes:  
1. Output driver disable time.  
2. Not 100% tested.  
(October, 2011, Version 1.9)  
19  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for Read Only Operation  
tRC  
Addresses  
CE  
Addresses Stable  
t
ACC  
tDF  
t
OE  
OE  
tOEH  
WE  
tCE  
tOH  
High-Z  
High-Z  
Output  
Output Valid  
RESET  
RY/BY  
0V  
AC Characteristics  
Hardware Reset (  
Parameter  
)
RESET  
Description  
Test Setup  
All Speed Options  
Unit  
JEDEC  
Std  
Pin Low (During Embedded  
Algorithms) to Read or Write (See Note)  
RESET  
tREADY  
Max  
20  
μs  
Pin Low (Not During Embedded  
RESET  
Algorithms) to Read or Write (See Note)  
tREADY  
Max  
500  
ns  
tRP  
tRH  
tRB  
Min  
Min  
Min  
500  
50  
0
ns  
ns  
ns  
Pulse Width  
RESET  
RESET  
High Time Before Read (See Note)  
Recovery Time  
RY/  
BY  
Note: Not 100% tested.  
(October, 2011, Version 1.9)  
20  
AMIC Technology, Corp.  
A29800 Series  
Timings  
RESET  
RY/BY  
CE, OE  
RESET  
t
RH  
t
RP  
t
Ready  
Reset Timings NOT during Embedded Algorithms  
Reset Timings during Embedded Algorithms  
t
Ready  
RY/BY  
t
RB  
CE, OE  
RESET  
t
RP  
(October, 2011, Version 1.9)  
21  
AMIC Technology, Corp.  
A29800 Series  
Temporary Sector Unprotect  
Parameter  
Description  
All Speed Options  
Unit  
JEDEC  
Std  
tVIDR  
VID Rise and Fall Time (See Note)  
Min  
Min  
500  
4
ns  
Setup Time for Temporary Sector  
RESET  
tRSP  
μs  
Unprotect  
Note: Not 100% tested.  
Temporary Sector Unprotect Timing Diagram  
12V  
0 or 5V  
RESET  
0 or 5V  
t
VIDR  
tVIDR  
Program or Erase Command Sequence  
CE  
WE  
t
RSP  
RY/BY  
AC Characteristics  
Word/Byte Configuration (  
Parameter  
)
BYTE  
Description  
All Speed Options  
Unit  
JEDEC  
Std  
-55  
-70  
-90  
tELFL/tELFH  
Max  
Max  
Min  
5
ns  
ns  
ns  
to  
Switching Low or High  
BYTE  
CE  
tFLQZ  
tFHQV  
20  
55  
20  
70  
20  
90  
Switching Low to Output High-Z  
Switching High to Output Active  
BYTE  
BYTE  
(October, 2011, Version 1.9)  
22  
AMIC Technology, Corp.  
A29800 Series  
Timings for Read Operations  
BYTE  
CE  
OE  
BYTE  
t
ELFL  
Data Output  
(I/O -I/O14  
Data Output  
(I/O -I/O  
BYTE  
Switching  
I/O -I/O14  
0
0
)
0
7)  
from word to  
byte mode  
I/O15  
Output  
Address Input  
I/O15 (A-1)  
t
FLQZ  
t
ELFH  
BYTE  
Data Output  
(I/O -I/O  
Data Output  
(I/O0-I/O14)  
I/O -I/O14  
0
0
7
)
BYTE  
Switching  
from byte to  
word mode  
I/O15  
Output  
Address Input  
I/O15 (A-1)  
t
FHQV  
Timings for Write Operations  
BYTE  
CE  
The falling edge of the last WE signal  
WE  
BYTE  
t
SET  
(tAS  
)
t
HOLD(tAH)  
Note:  
Refer to the Erase/Program Operations table for tAS and tAH specifications.  
(October, 2011, Version 1.9)  
23  
AMIC Technology, Corp.  
A29800 Series  
AC Characteristics  
Erase and Program Operations  
Parameter  
Description  
Speed  
Unit  
JEDEC  
tAVAV  
Std  
tWC  
tAS  
-55  
-70  
70  
0
-90  
Write Cycle Time (Note 1)  
Min.  
Min.  
Min.  
Min.  
Min.  
Min.  
55  
90  
ns  
ns  
ns  
ns  
ns  
ns  
Address Setup Time  
Address Hold Time  
tAVWL  
tWLAX  
tDVWH  
tWHDX  
tAH  
45  
25  
45  
30  
0
45  
45  
Data Setup Time  
tDS  
Data Hold Time  
tDH  
Output Enable Setup Time  
Read Recover Time Before Write  
tOES  
0
tGHWL  
tGHWL  
Min.  
0
ns  
(
high to  
low)  
WE  
OE  
tELWL  
tWHEH  
tCS  
Min.  
Min.  
0
0
ns  
ns  
Setup Time  
Hold Time  
CE  
CE  
tCH  
tWLWH  
tWHWL  
tWP  
Write Pulse Width  
Min.  
Min.  
Typ.  
30  
35  
20  
7
45  
ns  
ns  
tWPH  
Write Pulse Width High  
Byte  
Byte Programming Operation  
(Note 2)  
tWHWH1  
tWHWH2  
tWHWH1  
μs  
Word  
Typ.  
12  
tWHWH2  
tvcs  
Sector Erase Operation (Note 2)  
VCC Set Up Time (Note 1)  
Typ.  
Min.  
Min  
Min  
1
50  
0
sec  
μs  
ns  
ns  
tRB  
Recovery Time from RY/  
BY  
tBUSY  
30  
30  
35  
Program/Erase Valid to RY/  
Delay  
BY  
Notes:  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
(October, 2011, Version 1.9)  
24  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for Program Operation  
Program Command Sequence (last two cycles)  
Read Status Data (last two cycles)  
tWC  
tAS  
Addresses  
CE  
PA  
PA  
555h  
PA  
t
AH  
t
CH  
tGHWL  
OE  
tWP  
tWHWH1  
WE  
tCS  
tWPH  
tDS  
tDH  
Data  
A0h  
PD  
DOUT  
Status  
tRB  
tBUSY  
RY/BY  
VCC  
t
VCS  
Note :  
1. PA = program addrss, PD = program data, Dout is the true data at the program address.  
2. Illustration shows device in word mode.  
(October, 2011, Version 1.9)  
25  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for Chip/Sector Erase Operation  
Erase Command Sequence (last two cycles)  
Read Status Data  
t
AS  
tWC  
SA  
555h for chip erase  
VA  
Addresses  
CE  
2AAh  
VA  
tAH  
tGHWL  
t
CH  
OE  
tWP  
WE  
tWPH  
t
WHWH2  
tCS  
tDS  
tDH  
In  
Progress  
Data  
55h  
30h  
10h for chip erase  
Complete  
t
RB  
tBUSY  
RY/BY  
t
VCS  
VCC  
Note :  
1. SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data (see "Write Operaion Ststus").  
2. Illustratin shows device in word mode.  
(October, 2011, Version 1.9)  
26  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for  
Polling (During Embedded Algorithms)  
Data  
tRC  
Addresses  
CE  
VA  
VA  
VA  
t
ACC  
CE  
t
tCH  
tOE  
OE  
tDF  
tOEH  
WE  
t
OH  
High-Z  
Valid Data  
I/O  
7
Complement  
Complement  
Status Data  
True  
True  
High-Z  
I/O0  
- I/O  
6
Valid Data  
Status Data  
tBUSY  
RY/BY  
Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data  
read cycle.  
(October, 2011, Version 1.9)  
27  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for Toggle Bit (During Embedded Algorithms)  
tRC  
Addresses  
CE  
VA  
VA  
VA  
VA  
t
ACC  
t
CE  
t
CH  
tOE  
OE  
tDF  
tOEH  
WE  
tOH  
I/O6 , I/O2  
Valid Status  
(first read)  
Valid Status  
Valid Status  
Valid Data  
tBUSY  
(second read)  
(stop togging)  
RY/BY  
Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status read  
cycle, and array data read cycle.  
(October, 2011, Version 1.9)  
28  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for I/O2 vs. I/O6  
Enter  
Erase  
Enter Erase  
Suspend Program  
Erase  
Resume  
Embedded  
Suspend  
Erasing  
WE  
Erase  
Suspend  
Program  
Erase  
Erase  
Erase Suspend  
Read  
Erase Suspend  
Read  
Erase  
Complete  
I/O6  
I/O2  
I/O2  
and I/O  
6
toggle with OE and CE  
Note : Both I/O  
6
and I/O  
2
toggle with OE or CE. See the text on I/O  
6
and I/O  
2
in the section "Write Operation Statue" for  
more information.  
AC Characteristics  
Erase and Program Operations  
Alternate Controlled Writes  
CE  
Parameter  
Description  
Speed  
Unit  
JEDEC  
Std  
tWC  
tAS  
-55  
-70  
70  
0
-90  
tAVAV  
tAVEL  
tELAX  
tDVEH  
tEHDX  
Write Cycle Time (Note 1)  
Min.  
Min.  
Min.  
Min.  
Min.  
Min.  
55  
90  
ns  
ns  
ns  
ns  
ns  
ns  
Address Setup Time  
Address Hold Time  
tAH  
40  
25  
45  
30  
0
45  
45  
tDS  
Data Setup Time  
tDH  
Data Hold Time  
tOES  
Output Enable Setup Time  
Read Recover Time Before Write  
0
tGHEL  
tGHEL  
Min.  
0
ns  
(
High to  
Low)  
WE  
OE  
tWLEL  
tEHWH  
tWS  
tWH  
Min.  
Min.  
0
0
ns  
ns  
Setup Time  
WE  
Hold Time  
WE  
CE  
CE  
tELEH  
tEHEL  
tCP  
Min.  
Min.  
30  
20  
35  
20  
45  
20  
ns  
ns  
Pulse Width  
tCPH  
Pulse Width High  
Byte  
Typ.  
Typ.  
7
Programming Operation  
(Note 2)  
tWHWH1  
tWHWH1  
μs  
Word  
12  
tWHWH2  
tWHWH2  
sec  
Sector Erase Operation (Note 2)  
Typ.  
1
Notes:  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
(October, 2011, Version 1.9)  
29  
AMIC Technology, Corp.  
A29800 Series  
Timing Waveforms for Alternate  
Controlled Write Operation (  
=VIH on A29800)  
RESET  
CE  
PA for program  
SA for sector erase  
555 for chip erase  
555 for program  
2AA for erase  
Data Polling  
PA  
Addresses  
tWC  
tAS  
tAH  
tWH  
WE  
tGHEL  
OE  
tWHWH1 or 2  
tCP  
tBUSY  
tCPH  
tDH  
CE  
tWS  
tDS  
Data  
DOUT  
I/O7  
tRH  
A0 for program  
55 for erase  
PD for program  
30 for sector erase  
10 for chip erase  
RESET  
RY/BY  
Note :  
1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O7 = Complement of Data Input, DOUT = Array Data.  
2. Figure indicates the last two bus cycles of the command sequence.  
Erase and Programming Performance  
Parameter  
Sector Erase Time  
Typ. (Note 1)  
Max. (Note 2)  
Unit  
sec  
sec  
μs  
Comments  
1.0  
11  
7
8
Excludes 00h programming  
prior to erasure (Note 4)  
Chip Erase Time (Note 3)  
Byte Programming Time  
Word Programming Time  
300  
500  
Excludes system-level  
overhead (Note 5)  
12  
7.2  
6.3  
μs  
Chip Programming Time  
(Note 3)  
Byte Mode  
Word Mode  
21.6  
18.6  
sec  
sec  
Notes:  
1. Typical program and erase times assume the following conditions: 25°C, 5.0V VCC, 10,000 cycles. Additionally, programming  
typically assumes checkerboard pattern.  
2. Under worst case conditions of 90°C, VCC = 4.5V (4.75V for -55), 100,000 cycles.  
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes  
program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only then  
does the device set I/O5 = 1. See the section on I/O5 for further information.  
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.  
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 4  
for further information on command definitions.  
6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles.  
(October, 2011, Version 1.9)  
30  
AMIC Technology, Corp.  
A29800 Series  
Latch-up Characteristics  
Description  
Min.  
-1.0V  
Max.  
VCC+1.0V  
+100 mA  
12.5V  
Input Voltage with respect to VSS on all I/O pins  
VCC Current  
-100 mA  
-1.0V  
Input voltage with respect to VSS on all pins except I/O pins  
(including A9,  
and  
)
RESET  
OE  
Includes all pins except VCC. Test conditions: VCC = 5.0V, one pin at time.  
TSOP and SOP Pin Capacitance  
Parameter Symbol  
Parameter Description  
Input Capacitance  
Test Setup  
VIN=0  
Typ.  
6
Max.  
Unit  
pF  
CIN  
COUT  
CIN2  
7.5  
12  
9
Output Capacitance  
VOUT=0  
VIN=0  
8.5  
7.5  
pF  
Control Pin Capacitance  
pF  
Notes:  
1. Sampled, not 100% tested.  
2. Test conditions TA = 25°C, f = 1.0MHz  
Data Retention  
Parameter  
Test Conditions  
150°C  
Min  
10  
Unit  
Years  
Years  
Minimum Pattern Data Retention Time  
20  
125°C  
(October, 2011, Version 1.9)  
31  
AMIC Technology, Corp.  
A29800 Series  
Test Conditions  
Test Specifications  
Test Condition  
-55  
All others  
Unit  
Output Load  
1 TTL gate  
100  
Output Load Capacitance, CL(including jig capacitance)  
Input Rise and Fall Times  
30  
5
pF  
ns  
V
20  
Input Pulse Levels  
0.0 - 3.0  
1.5  
0.45 - 2.4  
0.8, 2.0  
0.8, 2.0  
Input timing measurement reference levels  
Output timing measurement reference levels  
V
1.5  
V
Test Setup  
5.0 V  
2.7 KΩ  
Device  
Under  
Test  
Diodes = IN3064 or Equivalent  
CL  
6.2 KΩ  
(October, 2011, Version 1.9)  
32  
AMIC Technology, Corp.  
A29800 Series  
Ordering Information  
Top Boot Sector Flash  
Active Read  
Current  
Typ. (mA)  
Program/Erase  
Current  
Access Time  
Standby Current  
Part No.  
Package  
(ns)  
Typ. (μA)  
Typ. (mA)  
A29800TM-55F  
A29800TM-55IF  
A29800TV-55F  
A29800TV-55IF  
A29800TM-70F  
A29800TM-70IF  
A29800TV-70F  
A29800TV-70IF  
A29800TM-90F  
A29800TM-90IF  
A29800TV-90F  
A29800TV-90IF  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
55  
20  
20  
20  
30  
30  
30  
1
1
1
70  
90  
Note: -I is for industrial operating temperature range: -40°C to +85°C  
(October, 2011, Version 1.9)  
33  
AMIC Technology, Corp.  
A29800 Series  
Bottom Boot Sector Flash  
Active Read  
Current  
Typ. (mA)  
Program/Erase  
Current  
Access Time  
Standby Current  
Part No.  
Package  
(ns)  
Typ. (μA)  
Typ. (mA)  
A29800UM-55F  
A29800UM-55IF  
A29800UV-55F  
A29800UV-55IF  
A29800UM-70F  
A29800UM-70IF  
A29800UV-70F  
A29800UV-70IF  
A29800UM-90F  
A29800UM-90IF  
A29800UV-90F  
A29800UV-90IF  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
44Pin Pb-Free SOP  
44Pin Pb-Free SOP  
48Pin Pb-Free TSOP  
48Pin Pb-Free TSOP  
55  
20  
20  
20  
30  
30  
30  
1
1
1
70  
90  
Note: -I is for industrial operating temperature range: -40°C to +85°C  
(October, 2011, Version 1.9)  
34  
AMIC Technology, Corp.  
A29800 Series  
Package Information  
SOP 44L Outline Dimensions  
unit: inches/mm  
23  
44  
Gauge Plane  
0.010"  
θ
L
1
22  
b
Detail F  
D
L
1
S
e
y
Seating Plane  
See Detail F  
Dimensions in inches  
Dimensions in mm  
Symbol  
Min  
Nom  
-
Max  
0.118  
-
Min  
Nom  
-
Max  
3.00  
-
A
A1  
A2  
b
-
-
0.10  
2.62  
0.33  
0.18  
-
0.004  
-
-
0.103  
0.106  
0.016  
0.008  
1.122  
0.496  
0.050  
0.631  
0.032  
0.0675  
-
0.109  
0.020  
0.010  
1.130  
0.500  
-
2.69  
0.40  
0.20  
28.50  
12.60  
1.27  
16.03  
0.80  
1.71  
-
2.77  
0.50  
0.25  
28.70  
12.70  
-
0.013  
C
D
E
0.007  
-
0.490  
12.45  
-
e
-
HE  
L
0.620  
0.643  
0.040  
-
15.75  
0.61  
-
16.33  
1.02  
-
0.024  
L1  
S
-
-
0.045  
0.004  
8°  
-
1.14  
0.10  
8°  
y
-
-
-
-
-
-
θ
0°  
0°  
Notes:  
1. The maximum value of dimension D includes end flash.  
2. Dimension E does not include resin fins.  
3. Dimension S includes end flash.  
(October, 2011, Version 1.9)  
35  
AMIC Technology, Corp.  
A29800 Series  
Package Information  
TSOP 48L (Type I) Outline Dimensions  
unit: inches/mm  
D
D1  
1
48  
D
24  
25  
θ
L
Detail "A"  
Detail "A"  
Dimensions in inches  
Dimensions in mm  
Symbol  
Min  
-
Nom  
Max  
Min  
Nom  
Max  
A
A1  
A2  
b
-
-
0.047  
0.006  
0.042  
0.011  
0.008  
0.795  
0.728  
0.476  
-
-
1.20  
0.15  
0.002  
0.037  
0.007  
0.004  
0.779  
0.720  
-
0.05  
0.94  
0.18  
0.12  
19.80  
18.30  
-
-
1.00  
0.039  
0.009  
-
1.06  
0.22  
0.27  
c
-
0.20  
D
D1  
E
e
0.787  
0.724  
0.472  
0.020 BASIC  
20.00  
18.40  
12.00  
0.50 BASIC  
0.60  
20.20  
18.50  
12.10  
L
0.020  
0.024 0.0275  
0.011 Typ.  
0.50  
0.70  
S
y
0.28 Typ.  
-
-
-
-
0.004  
8°  
-
0.10  
8°  
0°  
0°  
-
θ
Notes:  
1. The maximum value of dimension D includes end flash.  
2. Dimension E does not include resin fins.  
3. Dimension S includes end flash.  
(October, 2011, Version 1.9)  
36  
AMIC Technology, Corp.  

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