FS6370-01-XTP [AMI]
Clock Generator, CMOS, PDSO16,;![FS6370-01-XTP](http://pdffile.icpdf.com/pdf2/p00234/img/icpdf/FS6370-01-XT_1369959_icpdf.jpg)
型号: | FS6370-01-XTP |
厂家: | ![]() |
描述: | Clock Generator, CMOS, PDSO16, 光电二极管 |
文件: | 总24页 (文件大小:328K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
1.0 Features
• Just-in-time customization of clock frequencies via internal non-volatile 128-bit serial EEPROM
• I2C™-bus serial interface
• Three on-chip PLLs with programmable reference and feedback dividers
• Four independently programmable muxes and post dividers
• Programmable power-down of all PLLs and output clock drivers
• Tristate outputs for board testing
• One PLL and two mux/post-divider combinations can be modified via SEL_CD input
• 5V to 3.3V operation
• Accepts 5MHz to 27MHz crystal resonators
2.0 Description
The FS6370 is a CMOS clock generator IC designed to minimize cost and component count in a variety of electronic systems. Three EEPROM-
programmable phase-locked loops (PLLs) driving four programmable muxes and post dividers provide a high degree of flexibility.
An internal EEPROM permits just-in-time factory programming of devices for end user requirements.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VSS
SEL_CD
PD/SCL
VSS
VDD
CLK_A
VDD
CLK_B
CLK_C
VSS
XIN
XOUT
OE/SDA
VDD
CLK_D
MODE
Figure 1: Pin Configuration
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com
1
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
XIN
Reference
Oscillator
Mux A
Mux B
Mux C
Post
Divider A
XOUT
CLK_A
CLK_B
CLK_C
PLL A
Power Down
Control
MODE
Post
Divider B
PLL B
PLL C
PD/SCL
I2C-bus
Interface
OE/SDA
Post
Divider C
EEPROM
Mux D
Post
Divider D
CLK_D
SEL_CD
FS6370
Figure 2: Block Diagram
Table 1: Pin Descriptions
Pin
1
Type
P
Name
VSS
Description
Ground
2
DIU
DIU
P
SEL_CD
PD/SCL
VSS
Selects one of two programmed PLL C, Mux C/D and post divider C/D combinations
3
Power-down input (run mode) or serial interface clock input (program mode)
4
Ground
5
AI
XIN
Crystal oscillator feedback
6
AO
DIUO
P
DIU
DO
P
XOUT
OE/SDA
VDD
Crystal oscillator drive
7
Output enable input (run mode) or serial interface data input/output (program mode)
8
Power supply (5V to 3.3V)
Selects either program mode (low) or run mode (high)
D clock output
9
MODE
CLK_D
VSS
10
11
12
13
14
15
16
Ground
DO
DO
P
CLK_C
CLK_B
VDD
C clock output
B clock output
Power supply (5V to 3.3V)
A clock output
DO
P
CLK_A
VDD
Power supply (5V to 3.3V)
U
D
Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DI = Input with Internal Pull-Up; DI = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin
AMI Semiconductor - Rev. 2.0, Mar. 05
2
www.amis.com
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
3.0 Functional Block Description
3.1 Phase Locked Loops (PLLs)
Each of the three on-chip PLLs is a standard phase- and frequency-locked loop architecture that multiplies a reference frequency to a desired frequency by
a ratio of integers. This frequency multiplication is exact.
As shown in Figure 3, each PLL consists of a reference divider, a phase-frequency detector (PFD), a charge pump, an internal loop filter, a voltage-controlled
oscillator (VCO), and a feedback divider.
REF
During operation, the reference frequency (f ), generated by the on-board crystal oscillator, is first reduced by the reference divider. The divider value is
R
often referred to as the modulus, and is denoted as N for the reference divider. The divided reference is fed into the PFD.
VCO
The PFD controls the frequency of the VCO (f ) through the charge pump and loop filter. The VCO provides a high-speed, low noise, continuously variable
F
frequency clock source for the PLL. The output of the VCO is fed back to the PFD through the feedback divider (the modulus is denoted by N ) to close
the loop.
LFTC
Loop
REFDIV[7:0]
Filter
CP
fREF
Reference
UP
Divider
(NR)
fVCO
Phase-
Frequency
Detector
Voltage
Controlled
Oscillator
Charge
Pump
DOWN
FBKDIV[10:0]
fPD
Feedback
Divider (NF)
Figure 3: PLL Block Diagram
The PFD will drive the VCO up or down in frequency until the divided reference frequency and the divided VCO frequency appearing at the inputs of the
PFD are equal. The input/output relationship between the reference frequency and the VCO frequency is:
NF
NR
fVCO
= fREF
3.1.1 Reference Divider
The reference divider is designed for low phase jitter. The divider accepts the output of the reference oscillator and provides a divided-down frequency to
the PFD. The reference divider is an 8-bit divider, and can be programmed for any modulus from 1 to 255 by programming the equivalent binary value.
A divide-by-256 can also be achieved by programming the eight bits to 00h.
3.1.2 Feedback Divider
The feedback divider is based on a dual-modulus pre-scaler technique. The technique allows the same granularity as a fully programmable feedback divider,
while still allowing the programmable portion to operate at low speed. A high-speed pre-divider (also called a pre-scaler) is placed between the VCO and
the programmable feedback divider because of the high speeds at which the VCO can operate. The dual-modulus technique insures reliable operation at
any speed that the VCO can achieve and reduces the overall power consumption of the divider.
AMI Semiconductor - Rev. 2.0, Mar. 05
3
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
For example, a fixed divide-by-eight pre-scaler could have been used in the feedback divider. Unfortunately, a divide-by-eight would limit the effective
modulus of the entire feedback divider to multiples of eight. This limitation would restrict the ability of the PLL to achieve a desired input-frequency-to-
output-frequency ratio without making both the reference and feedback divider values comparatively large. Generally, very large values are undesirable
as they degrade the bandwidth of the PLL, increasing phase jitter and acquisition time.
To understand the operation of the feedback divider, refer to Figure 4. The M-counter (with a modulus always equal to M) is cascaded with the dual-
modulus pre-scaler. The A-counter controls the modulus of the pres-caler. If the value programmed into the A-counter is A, the pre-scaler will be set to
divide by N+1 for A pre-scaler outputs. Thereafter, the prescaler divides by N until the M-counter output resets the A-counter, and the cycle begins again.
Note that N=8, and A and M are binary numbers.
Dual
Modulus
Prescaler
fVCO
M
fPD
Counter
FBKDIV[2:0]
FBKDIV[10:3]
A
Counter
Figure 4: Feedback Divider
Suppose that the A-counter is programmed to zero. The modulus of the pre-scaler will always be fixed at N; and the entire modulus of the feedback divider
becomes MxN.
Next, suppose that the A-counter is programmed to a one. This causes the pre-scaler to switch to a divide-by-N+1 for its first divide cycle and then revert
to a divide-by-N. In effect, the A-counter absorbs (or "swallows") one extra clock during the entire cycle of the feedback divider. The overall modulus is
now seen to be equal to MxN+1.
This example can be extended to show that the feedback divider modulus is equal to MxN+A, where A<M.
3.1.3 Feedback Divider Programming
For proper operation of the feedback divider, the A-counter must be programmed only for values that are less than or equal to the M-counter. Therefore,
not all divider moduli below 56 are available for use. This is shown in Table 2.
Above a modulus of 56, the feedback divider can be programmed to any value up to 2047.
Table 2: Feedback Divider Modulus Under 56
A-Counter: FBKDIV[2:0]
M-Counter:
FBKDIV[10:3]
000
8
001
9
010
-
011
-
100
-
101
110
111
00000001
00000010
00000011
00000100
00000101
00000110
00000111
-
-
-
-
16
24
32
40
48
56
17
25
33
41
49
57
18
26
34
42
50
58
-
-
-
-
27
35
43
51
59
-
-
-
-
-
36
44
52
60
-
-
45
53
61
-
-
-
54
62
63
Feedback Divider Modulus
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
4
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
3.2 Post Divider Muxes
As shown in Figure 2, a mux in front of each post divider stage can select from any one of the three PLL frequencies or the reference frequency. The mux
selection is controlled by bits in the EEPROM or the control registers.
The input frequency on two of the four multiplexers (muxes C and D in Figure 2) can be altered without reprogramming by a logic-level input on the
SEL_CD pin.
3.3 Post Dividers
A post divider performs several useful functions. First, it allows the VCO to be operated in a narrower range of speeds compared to the variety of output
clock speeds that the device is required to generate. Second, it changes the basic PLL equation to:
NF
1
fCLK = fREF
NR NP
where NP is the post divider modulus. The extra integer in the denominator permits more flexibility in the programming of the loop for many applications
where frequencies must be achieved exactly.
The modulus on two of the four post dividers (post dividers C and D in Figure 2) can be altered without reprogramming by a logic level on the SEL_CD
pin.
4.0 Device Operation
The FS6370 has two modes of operation:
• Program mode: during which either the EEPROM or the FS6370 control registers can be programmed directly with the desired PLL settings
• Run mode: where the PLL settings stored the EEPROM are transferred to the FS6370 control registers on power-up, and the device then operates based
on those settings
Note that the EEPROM locations are not physically the same registers used to control the FS6370.
Direct access to either the EEPROM or the FS6370 control registers is achieved in program mode. The EEPROM register contents are automatically
transferred to the FS6370 control registers in normal device operation (run mode).
4.1 MODE Pin
The MODE pin controls the mode of operation. A logic-low places the FS6370 in program mode. A logic-high puts the device in run mode. A pull-up on
this pin defaults the device into run mode.
Reprogramming of either the control registers or the EEPROM is permitted at any time if the MODE pin is a logic-low.
Note, however, that a logic-high state on the MODE pin is latched so that only one transfer of EEPROM data to the FS6370 control registers can occur.
If a second transfer of EEPROM data into the FS6370 is desired, power (VDD) must be removed and reapplied to the device.
The MODE pin also controls the function of the PD/SCL and OE/SDA pins. In run mode, these two pins function as power-down (PD) and output enable
(OE) controls. In program mode, the pins function as the I2C interface for clock (SCL) and data (SDA).
4.2 SEL_CD Pin
The SEL_CD pin provides a way to alter the operation of PLL C, muxes C and D, and post dividers C and D without having to reprogram the device. A
logic-low on the SEL_CD pin selects the control bits with a "C1" or "D1" notation, per Table 3. A logic-high on the SEL_CD pin selects the control bits with
"C2" or "D2" notation, per Table 3.
Note that changing between two running frequencies using the SEL_CD pin may produce glitches in the output, especially if the post-divider(s) is/are
altered.
AMI Semiconductor - Rev. 2.0, Mar. 05
5
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
4.3 Oscillator Overdrive
For applications where an external reference clock is provided (and the crystal oscillator is not required), the reference clock should be connected to XOUT
and XIN must be left unconnected (float).
For best results, make sure the reference clock signal is as jitter-free as possible, can drive a 40pF load with fast rise and fall times, and can swing rail-to-
rail.
If the reference clock is not a rail-to-rail signal, the reference must be AC coupled to XOUT through a 0.01µF or 0.1µF capacitor. A minimum 1V peak-to-
peak signal is required to drive the internal differential oscillator buffer.
5.0 Run Mode
If the MODE pin is set to a logic-high, the device enters the run mode. The high state is latched (see MODE pin). The FS6370 then copies the stored
EEPROM data into its control registers and begins normal operation based on that data when the self-load is complete.
The self-load process takes about 89,000 clocks of the crystal oscillator. During the self-load time, all clock outputs are held low. At a reference frequency
of 27MHz, the self-load takes about 3.3ms to complete.
If the EEPROM is empty (all zeros), the crystal reference frequency provides the clock for all four outputs.
No external programming access to the FS6370 is possible in run mode. The dual-function PD/SCL and OE/SDA pins become a power-down (PD) and
output enable (OE) control, respectively.
5.1 Power-Down and Output Enable
A logic-high on the PD/SCL pin powers down only those portions of the FS6370 which have their respective power-down control bits enabled. Note that
the PD/SCL pin has an internal pull-up.
When a post divider is powered down, the associated output driver is forced low. When all PLLs and post dividers are powered down the crystal oscillator
is also powered down. The XIN pin is forced low, and the XOUT pin is pulled high.
A logic-low on the OE/SDA pin tristates all output clocks. Note that this pin has an internal pull-up.
6.0 Program Mode
If the MODE pin is logic-low, the device enters the program mode. All internal registers are cleared to zero, delivering the crystal frequency to all outputs.
The device allows programming of either the internal 128-bit EEPROM or the on-chip control registers via I2C control over the PD/SCL and OE/SDA pins.
The EEPROM and the FS6370 act as two separate parallel devices on the same on-chip I2C-bus. Choosing either the EEPROM or the device control registers
is done via the I2C device address.
The dual-function PD/SCL and OE/SDA pins become the serial data I/O (SDA) and serial clock input (SCL) for normal I2C communications. Note that power-
down and output enable control via the PD/SCL and OE/SDA pins is not available.
6.1 EEPROM Programming
Data must be loaded into the EEPROM in a most-significant-bit (MSB) to least-significant-bit (LSB) order. The register map of the EEPROM is noted in
Table 3.
The device address of the EEPROM is:
A6
1
A5
0
A4
1
A3
0
A2
X
A1
X
A0
X
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
6
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
6.1.1 Write Operation
The EEPROM can only be written to with the random register write procedure (see Section 8.2.2). The procedure consists of the device address, the
register address, a R/W bit, and one byte of data.
Following the STOP condition, the EEPROM initiates its internally timed 4ms write cycle, and commits the data byte to memory. No acknowledge signals
are generated during the EEPROM internal write cycle.
If a stop bit is transmitted before the entire write command sequence is complete, then the command is aborted and no data is written to memory.
If more than eight bits are transmitted before the stop bit is sent, then the EEPROM will clear the previously loaded data byte and will begin loading the
data buffer again.
6.1.2 Acknowledge Polling
The EEPROM does not acknowledge while it internally commits data to memory. This feature can be used to increase data throughput by determining
when the internal write cycle is complete.
The process is to initiate the random register write procedure with a START condition, the EEPROM device address, and the write command bit (R/W=0).
If the EEPROM has completed its internal 4ms write cycle, the EEPROM will acknowledge on the next clock, and the write command can continue.
If the EEPROM has not completed the internal 4ms write cycle, the random register write procedure must be restarted by sending the START condition,
device address and R/W bit. This sequence must be repeated until the EEPROM acknowledges.
6.1.3 Read Operation
The EEPROM supports both the random register read procedure and the sequential register read procedure (both are outlined in Section 6).
For sequential read operations, the EEPROM has an internal address pointer that increments by one at the end of each read operation. The pointer directs
the EEPROM to transmit the next sequentially addressed data byte, allowing the entire memory contents to be read in one operation.
6.2 Direct Register Programming
The FS6370 control registers may be directly accessed by simply using the FS6370 device address in the read or write operations. The operation of the
device will follow the register values. The register map of the FS6370 is identical to that of the EEPROM shown in Table 3.
The FS6370 supports the random read and write procedures, as well as the sequential read and write procedures described in Section 8.
The device address for the FS6370 is:
A6
1
A5
0
A4
1
A3
1
A2
1
A1
0
A0
0
7.0 Cost Reduction Migration Path
The FS6370 is compatible with the programmable register-based FS6377 or a fixed-frequency ROM-based clock generator. Attention should be paid to
the board layout if a migration path to either of these devices is desired.
7.1 Programming Migration Path
If the design can support I2C programming overhead, a cost reduction from the EEPROM-based FS6370 to the register-based FS6377 is possible.
Figure 5 shows the five pins that may not be compatible between the various devices if programming of the FS6370 or the FS6377 is desired.
AMI Semiconductor - Rev. 2.0, Mar. 05
7
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
VSS
SDA
VDD
SCL
(FS6370)
(FS6377)
(FS6370)
(FS6377)
1
16
PD/SCL
2
3
4
5
6
7
8
15
14
13
12
11
10
9
SEL_CD
CLK_A
VDD
(FS6370)
PD
VSS
XIN
CLK_B
CLK_C
VSS
(FS6377)
OE/SDA
XOUT
(FS6370)
MODE
CLK_D
(FS6370)
OE
VDD
(FS6377)
ADDR
(FS6377)
Figure 5: FS6370 to FS6377
7.2 Non-Programming Migration Path
If the design has solidified on a particular EEPROM programming pattern, the EEPROM pattern can be hard-coded into a ROM-based device. For high-
volume requirements, a ROM-based device offers significant cost savings over the FS6370. Contact an AMIS sales representative for more detail.
8.0 I2C-bus Control Interface
This device is a read/write slave device meeting all Philips I2C-bus specifications except a "general call." The bus has to be controlled by a master
device that generates the serial clock SCL, controls bus access and generates the START and STOP conditions while the device works as a
slave. Both master and slave can operate as a transmitter or receiver, but the master device determines which mode is activated. A device
that sends data onto the bus is defined as the transmitter, and a device receiving data as the receiver.
2
DD
DD
I C-bus logic levels noted herein are based on a percentage of the power supply (V ). A logic-one corresponds to a nominal voltage of V , while a logic-
SS
low corresponds to ground (V ).
8.1 Bus Conditions
Data transfer on the bus can only be initiated when the bus is not busy. During the data transfer, the data line (SDA) must remain stable whenever the
clock line (SCL) is high. Changes in the data line while the clock line is high will be interpreted by the device as a START or STOP condition. The following
bus conditions are defined by the I2C-bus protocol.
8.1.1 Not Busy
Both the data (SDA) and clock (SCL) lines remain high to indicate the bus is not busy.
8.1.2 START Data Transfer
A high to low transition of the SDA line while the SCL input is high indicates a START condition. All commands to the device must be preceded by a START
condition.
8.1.3 STOP Data Transfer
A low to high transition of the SDA line while SCL is held high indicates a STOP condition. All commands to the device must be followed by a STOP
condition.
AMI Semiconductor - Rev. 2.0, Mar. 05
8
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
8.1.4 Data Valid
The state of the SDA line represents valid data if the SDA line is stable for the duration of the high period of the SCL line after a START condition occurs.
The data on the SDA line must be changed only during the low period of the SCL signal. There is one clock pulse per data bit.
Each data transfer is initiated by a START condition and terminated with a STOP condition. The number of data bytes transferred between START and
STOP conditions is determined by the master device, and can continue indefinitely. However, data that is overwritten to the device after the first 16 bytes
will overflow into the first register, then the second, and so on, in a first-in, first-overwritten fashion.
8.1.5 Acknowledge
When addressed, the receiving device is required to generate an acknowledge after each byte is received. The master device must generate an extra clock
pulse to coincide with the acknowledge bit. The acknowledging device must pull the SDA line low during the high period of the master acknowledge clock
pulse. Setup and hold times must be taken into account.
The master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been read (clocked) out of the slave.
In this case, the slave must leave the SDA line high to enable the master to generate a STOP condition.
8.2 I2C-bus Operation
All programmable registers can be accessed randomly or sequentially via this bi-directional two wire digital interface. The device accepts the following
I2C-bus commands.
8.2.1 Device Address
After generating a START condition, the bus master broadcasts a seven-bit device address followed by a R/W bit.
The device address of the FS6370 is:
A6
1
A5
0
A4
1
A3
1
A2
1
A1
0
A0
0
Any one of eight possible addresses are available for the EEPROM. The least significant three bits are don't care's.
A6
1
A5
0
A4
1
A3
0
A2
X
A1
X
A0
X
8.2.2 Random Register Write Procedure
Random write operations allow the master to directly write to any register. To initiate a write procedure, the R/W bit that is transmitted after the seven-
bit device address is a logic-low. This indicates to the addressed slave device that a register address will follow after the slave device acknowledges its
device address. The register address is written into the slave's address pointer. Following an acknowledge by the slave, the master is allowed to write eight
bits of data into the addressed register. A final acknowledge is returned by the device, and the master generates a STOP condition.
If either a STOP or a repeated START condition occurs during a register write, the data that has been transferred is ignored.
8.2.3 Random Register Read Procedure
Random read operations allow the master to directly read from any register. To perform a read procedure, the R/W bit that is transmitted after the seven-
bit address is a logic-low, as in the register write procedure. This indicates to the addressed slave device that a register address will follow after the slave
device acknowledges its device address. The register address is then written into the slave's address pointer.
Following an acknowledge by the slave, the master generates a repeated START condition. The repeated START terminates the write procedure, but not
until after the slave's address pointer is set. The slave address is then resent, with the R/W bit set this time to a logic-high, indicating to the slave that data
will be read. The slave will acknowledge the device address, and then transmits the eight-bit word. The master does not acknowledge the transfer but
does generate a STOP condition.
AMI Semiconductor - Rev. 2.0, Mar. 05
9
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
8.2.4 Sequential Register Write Procedure
Sequential write operations allow the master to write to each register in order. The register pointer is automatically incremented after each write. This
procedure is more efficient than the random register write if several registers must be written.
To initiate a write procedure, the R/W bit that is transmitted after the seven-bit device address is a logic-low. This indicates to the addressed slave device
that a register address will follow after the slave device acknowledges its device address. The register address is written into the slave's address pointer.
Following an acknowledge by the slave, the master is allowed to write up to 16 bytes of data into the addressed register before the register address
pointer overflows back to the beginning address. An acknowledge by the device between each byte of data must occur before the next data byte is sent.
Registers are updated every time the device sends an acknowledge to the host. The register update does not wait for the STOP condition to occur.
Registers are therefore updated at different times during a sequential register write.
8.2.5 Sequential Register Read Procedure
Sequential read operations allow the master to read from each register in order. The register pointer is automatically incremented by one after each read.
This procedure is more efficient than the random register read if several registers must be read.
To perform a read procedure, the R/W bit that is transmitted after the seven-bit address is a logic-low, as in the register write procedure. This indicates
to the addressed slave device that a register address will follow after the slave device acknowledges its device address. The register address is then written
into the slave's address pointer.
Following an acknowledge by the slave, the master generates a repeated START condition. The repeated START terminates the write procedure, but not
until after the slave's address pointer is set. The slave address is then resent, with the R/W bit set this time to a logic-high, indicating to the slave that data
will be read. The slave will acknowledge the device address, and then transmits all 16 bytes of data starting with the initial addressed register. The register
address pointer will overflow if the initial register address is larger than zero. After the last byte of data, the master does not acknowledge the transfer
but does generate a STOP condition.
AMI Semiconductor - Rev. 2.0, Mar. 05
10
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
S
DEVICE ADDRESS
W
A
REGISTER ADDRESS
A
DATA
A P
7-bit Receive
Device Address
Register Address
Acknowledge
Data
Acknowledge
STOP Condition
Acknowledge
START
Command
WRITE Command
From bus host
to device
From device
to bus host
Figure 6: Random Register Write Procedure
S
DEVICE ADDRESS
W
A
REGISTER ADDRESS
A
S
DEVICE ADDRESS
R
A
DATA
A P
7-bit Receive
Device Address
7-bit Receive
Device Address
Register Address
Acknowledge
Data
Acknowledge
STOP Condition
NO Acknowledge
Repeat START
START
Command
WRITE Command
Acknowledge
READ Command
From bus host
to device
From device
to bus host
Figure 7: Random Register Read Procedure
S
DEVICE ADDRESS
W
A
REGISTER ADDRESS
A
DATA
A
DATA
A
DATA
A P
7-bit Receive
Device Address
Register Address
Acknowledge
Data
Data
Data
Acknowledge
Acknowledge
Acknowledge
Acknowledge
START
Command
WRITE Command
STOP Command
From bus host
to device
From device
to bus host
Figure 8: Sequential Register Write Procedure
S
DEVICE ADDRESS
W
A
REGISTER ADDRESS
A
S
DEVICE ADDRESS
R
A
DATA
A
DATA
A P
7-bit Receive
Device Address
7-bit Receive
Device Address
Register Address
Acknowledge
Data
Data
Acknowledge
Acknowledge
NO Acknowledge
STOP Command
Repeat START
START
Command
WRITE Command
Acknowledge
READ Command
From bus host
to device
From device
to bus host
Figure 9: Sequential Register Read Procedure
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
11
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
9.0 Programming Information
Table 3: Register Map (Note: All register bits are cleared to zero on power-up.)
Address
Byte 15
Byte 14
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
MUX_D2[1:0]
(selected via SEL_CD = 1)
POST_D2[3:0]
MUX_C2[1:0]
(selected via SEL_CD = 1)
PDPOST_A
PDPOST_D
PDPOST_C
PDPOST_B
POST_C2[3:0]
(selected via SEL_CD = 1)
(selected via SEL_CD = 1)
POST_D1[3:0]
(selected via SEL_CD = 0)
POST_C1[3:0]
(selected via SEL_CD = 0)
Byte 13
Byte 12
Byte 11
POST_B[3:0]
POST_A[3:0]
MUX_D1[1:0]
(selected via SEL_CD = 0)
LFTC_C2
(SEL_CD=1)
CP_C2
(SEL_CD=1)
FBKDIV_C2[10:8] M-Counter
(selected via SEL_CD pin = 1)
Reserved (0)
FBKDIV_C2[7:3] M-Counter
(selected via SEL_CD pin = 1)
FBKDIV_C2[2:0] A-Counter
(selected via SEL_CD pin = 1)
Byte 10
Byte 9
Byte 8
Byte 7
Byte 6
REFDIV_C2[7:0]
(selected via SEL_CD pin = 1)
MUX_C1[1:0]
LFTC_C1
(SEL_CD=0)
CP_C1
(SEL_CD=0)
FBKDIV_C1[10:8] M-Counter
(selected via SEL_CD = 0)
PDPLL_C
(selected via SEL_CD = 0)
FBKDIV_C1[7:3] M-Counter
(selected via SEL_CD = 0)
FBKDIV_C1[2:0] A-Counter
(selected via SEL_CD = 1)
REFDIV_C1[7:0]
(selected via SEL_CD = 0)
Byte 5
Byte 4
Byte 3
MUX_B[1:0]
MUX_A[1:0]
PDPLL_B
CP_B
FBKDIV_B[10:8] M-Counter
FBKDIV_B[2:0] A-Counter
LFTC_B
FBKDIV_B[7:3] M-Counter
REFDIV_B[7:0]
LFTC_A CP_A
Byte 2
Byte 1
Byte 0
PDPLL_A
FBKDIV_A[10:8] M-Counter
FBKDIV_A[2:0] A-Counter
FBKDIV_A[7:3] M-Counter
REFDIV_A[7:0]
9.1 Control Bit Assignments
If any PLL control bit is altered during device operation, including those bits controlling the reference and feedback dividers, the output frequency will
slew smoothly (in a glitch-free manner) to the new frequency. The slew rate is related to the programmed loop filter time constant.
However, any programming changes to any mux or post divider control bits will cause a glitch on an operating clock output.
9.1.1 Power-Down
All power-down functions are controlled by enable bits. That is, the bits select which portions of the FS6370 to power-down when the PD input is asserted.
If the power-down bit contains a one, the related circuit will shut down if the PD pin is high (run mode only). When the PD pin is low, power is enabled
to all circuits.
If the power-down bit contains a zero, the related circuit will continue to function regardless of the PD pin state.
AMI Semiconductor - Rev. 2.0, Mar. 05
12
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Table 4: Power-Down Bits
Table 5: Divider Control Bits
Name
Description
Name
Description
Reference Divider A (N
Power-Down PLL A
Bit = 0
REFDIV_A[7:0]
(Bits 7-0)
REFDIV_B[7:0]
(Bits 31-24)
REFDIV_C1[7:0]
(Bits 55-48)
REFDIV_C2[7:0]
(Bits 79-72)
R
)
Power on
Power off
PDPLL_A
(Bit 21)
Bit = 1
R
Reference Divider B (N )
Power-Down PLL B
Bit = 0
R
Reference Divider C1 (N )
selected when the SEL-CD pin = 0
Reference Divider C2 (N )
selected when the SEL-CD pin = 1
Power on
Power off
PDPLL_B
(Bit 45)
Bit = 1
R
Power-Down PLL C
Bit = 0
Power on
Power off
PDPLL_C
(Bit 69)
F
Feedback Divider A (N )
Bit = 1
FBKDIV_A[2:0]
FBKDIV_A[10:3]
A-Counter value
FBKDIV_A[10:0]
(Bits 18-8)
Reserved (0)
(Bit 69)
Set these reserved bits to zero (0)
M-Counter value
Power-Down POST divider A
F
Feedback Divider B (N )
Bit = 0
Bit = 1
Power on
Power off
PDPOST_A
(Bit 120)
FBKDIV_B[2:0]
A-Counter value
M-Counter value
FBKDIV_B[10:0]
(Bits 42-32)
FBKDIV_B[10:3]
Power-Down POST divider B
Feedback Divider C1 (N )
F
Bit = 0
Bit = 1
Power on
Power off
PDPOST_B
(Bit 121)
selected when the SEL-CD pin = 0
FBKDIV_C1[2:0]
FBKDIV_C1[10:3]
A-Counter value
FBKDIV_C1[10:0]
(Bits 66-56)
Power-Down POST divider C
M-Counter value
Bit = 0
Bit = 1
Power on
Power off
PDPOSTC
(Bit 122)
F
Feedback Divider C2 (N )
selected when the SEL-CD pin = 1
Power-Down POST divider D
FBKDIV_C2[2:0]
FBKDIV_C2[10:3]
A-Counter value
M-Counter value
FBKDIV_C2[10:0]
(Bits 90-80)
Bit = 0
Bit = 1
Power on
Power off
PDPOSTD
(Bit 123)
Table 6: Post Divider Control Bits
Table 7: Post Divider Modulus
Bit [3]
Bit [2]
Bit [1]
Bit [0]
Divide By
Name
Description
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
2
3
4
5
6
8
9
POST_A[3:0]
(Bits 99-96)
POST divider A (see Table 7)
POST divider B (see Table 7)
POST_B[3:0]
(Bits 103-100)
POST_C1[3:0]
(Bits 107-104)
POST divider C1 (see Table 7)
selected when the SEL_CD pin = 0
POST_C2[3:0]
(Bits 115-112)
POST divider C2 (see Table 7)
selected when the SEL_CD pin = 1
POST_D1[3:0]
(Bits 111-108)
POST divider D1 (see Table 7)
selected when the SEL_CD pin = 0
10
12
15
16
18
20
25
50
POST_D2[3:0]
(Bits 119-116)
POST divider D2 (see Table 7)
selected when the SEL_CD pin = 1
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
13
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Table 8: PLL Tuning Bits
Table 9: Mux Select Bits
Name Description
MUX A Frequency Select
Name
Description
Loop Filter Time Constant A
Short time constant: 7µs
Long time constant: 20µs
Bit = 0
Bit = 1
LFTC_A
(Bit 20)
Bit 23
Bit 22
0
0
1
1
0
1
0
1
Reference frequency
Loop Filter Time Constant B
MUX_A[1:0]
(Bits 23-22)
PLL A frequency
PLL B frequency
PLL C frequency
Short time constant: 7µs
Long time constant: 20µs
Bit = 0
Bit = 1
LFTC_B
(Bit 44)
Loop Filter Time Constant C1
selected when the SEL_CD pin = 0
MUX B Frequency Select
Short time constant: 7µs
Long time constant: 20µs
Bit = 0
Bit = 1
LFTC_C1
(Bit 68)
Bit 47
Bit 46
0
0
1
1
0
1
0
1
Reference frequency
PLL A frequency
PLL B frequency
PLL C frequency
Loop Filter Time Constant C2
selected when the SEL_CD pin = 1
MUX_B[1:0]
(Bits 47-46)
Short time constant: 7µs
Bit = 0
LFTC_C2
(Bit 92)
Long time constant: 20µs
Bit = 1
Charge Pump A
Bit = 0
MUX C1 Frequency Select
selected when the SEL_CD pin = 0
Current = 2µA
Current = 10µA
CP_A
(Bit 19)
Bit 71
Bit 70
Bit = 1
Charge Pump B
Bit = 0
0
0
1
1
0
1
0
1
Reference frequency
PLL A frequency
PLL B frequency
PLL C frequency
MUX_C1[1:0]
(Bits 71-70)
Current = 2µA
Current = 10µA
CP_B
(Bit 43)
Bit = 1
Charge Pump C1
selected when the SEL_CD pin = 0
MUX C2 Frequency Select
selected when the SEL_CD pin = 1
Current = 2µA
Current = 10µA
Bit = 0
CP_C1
(Bit 67)
Bit = 1
Bit 125
Bit 124
Charge Pump C2
0
0
1
1
0
1
0
1
Reference frequency
PLL A frequency
PLL B frequency
PLL C frequency
selected when the SEL_CD pin = 1
MUX_C2[1:0]
(Bits 125-124)
Current = 2µA
Bit = 0
CP_C2
(Bit 91)
Current = 10µA
Bit = 1
MUX D1 Frequency Select
selected when the SEL_CD pin = 0
Bit 95
Bit 94
0
0
1
1
0
1
0
1
Reference frequency
PLL A frequency
PLL B frequency
PLL C frequency
MUX_D1[1:0]
(Bits 95-94)
MUX D2 Frequency Select
selected when the SEL_CD pin = 1
Bit 127
Bit 126
0
0
1
1
0
1
0
1
Reference frequency
PLL A frequency
PLL B frequency
PLL C frequency
MUX_D2[1:0]
(Bits 127-126)
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
14
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
10.0 Electrical Specifications
Table 10: Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
7
Units
V
SS
DD
V
SS
Supply Voltage, dc (V = ground)
V -0.5
Input Voltage, dc
V
1
V
SS
DD
V -0.5
V +0.5
Output Voltage, dc
V
O
V
SS
DD
V -0.5
V +0.5
-50
-50
-65
-55
50
50
mA
mA
°C
I
I
DD
IK
Input Clamp Current, dc (V < 0 or V > V )
I
I
I
DD
OK
Output Clamp Current, dc (V < 0 or V > V )
Storage Temperature Range (non-condensing)
Ambient Temperature Range, Under Bias
Junction Temperature
I
150
125
150
S
T
°C
A
T
°C
J
T
Per IPC/JEDEC
J-STD-020B
Re-Flow Solder Profile
Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
2
kV
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the
device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect
device performance, functionality and reliability.
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a
high-energy electrostatic discharge.
Table 11: Operating Conditions
Parameter
Symbol
Conditions/Description
5V 10ꢀ
Min.
4.5
3
Typ.
5
Max.
5.5
Units
V
Supply Voltage
DD
V
3.3V 10ꢀ
3.3
3.6
Ambient Operating Temperature Range
0
5
70
27
°C
A
T
Crystal Resonator Frequency
Crystal Resonator Load Capacitance
Serial Data Transfer Rate
MHz
pF
XIN
f
Parallel resonant, AT cut
Standard mode
18
XL
C
10
100
15
kb/s
pF
Output Driver Load Capacitance
L
C
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
15
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Table 12: DC Electrical Specifications
Parameter
Overall
Symbol
Conditions/Description
= 5.5V, f = 50MHz, C = 15pF
See Figure 11 for more information
Additional operating current demand,
Min.
Typ.
Max.
Units
DD
V
CLK
L
DD
I
Supply Current, Dynamic
Supply Current, Write
Supply Current, Read
43
2
mA
mA
DD(write)
I
DD
EEPROM program mode, V = 5.5V
Additional operating current demand,
DD(read)
I
1
mA
mA
DD
EEPROM program mode, V = 5.5V
DD
V
= 5.5V, powered down via PD pin
DDL
I
Supply Current, Static
0.3
Dual Function I/O (PD/SCL, OESDA)
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
V +0.3
3.85
2.52
3.85
2.52
3.85
2.52
Run mode (PD, OE)
DD
V +0.3
DD
V +0.3
IH
V
High-Level Input Voltage
Low-Level Input Voltage
Hysteresis Voltage
Register program mode (SDA, SCL)
EEPROM program mode (SDA, SCL)
Run mode (PD, OE)
V
V
V
DD
V +0.3
DD
V +0.3
DD
V +0.3
SS
V -0.3
1.65
1.08
1.65
1.08
1.65
1.08
SS
V -0.3
SS
V -0.3
IL
V
Register program mode (SDA, SCL)
EEPROM program mode (SDA, SCL)
Run mode (PD, OE)
SS
V -0.3
SS
V -0.3
SS
V -0.3
2.20
1.44
2.20
1.44
0.275
0.18
hys
V
Register program mode (SDA, SCL)
EEPROM program mode (SDA, SCL)
Run/register program mode
EEPROM program mode
-1
-1
-20
1
1
-80
µA
µA
mA
IH
I
High-Level Input Current
IL
V = 0V
IL
I
Low-Level Input Current (pull-up)
Low-Level Output Sink Current (SDA)
-36
26
3.0
OL
Run/register program mode, V = 0.4V
OL
I
OL
EEPROM program mode, V = 0.4V
Mode and Frequency Select Inputs (MODE, SEL_CD)
DD
DD
V
V
V
V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
V +0.3
2.4
2.0
IH
V
High-Level Input Voltage
Low-Level Input Voltage
V
V
DD
DD
DD
DD
V +0.3
SS
V -0.3
0.8
0.8
1
IL
V
SS
V -0.3
µA
µA
IH
IL
I
I
High-Level Input Current
Low-Level Input Current (pull-up)
Crystal Oscillator Feedback (XIN)
-1
-20
-36
-80
DD
V
DD
V
DD
V
DD
V
= 5.5V
= 3.6V
= 5.5V
2.9
1.7
54
TH
V
Threshold Bias Voltage
High-Level Input Current
V
µA
mA
IH
I
= 5.5V, oscillator powered down
5
15
µA
pF
IL
I
Low-Level Input Current
Crystal Loading Capacitance*
-25
-54
18
-75
L(xtal)
C
As seen by an external crystal connected to XIN and XOUT
As seen by an external clock driver on XOUT; XIN
unconnected
L(XIN)
C
Input Loading Capacitance*
36
pF
Crystal Oscillator Drive (XOUT)
High-Level Output Source Current
Low-Level Output Sink Current
OH
DD
DD
O
I
V
V
= V(XIN) = 5.5V, V = 0V
10
-10
21
-21
30
-30
mA
mA
OL
I
0
= 5.5V, V(XIN) = V = 5.5V
Clock Outputs (CLK_A, CLK_B, CLK_C, CLK_D)
High-Level Output Source Current
Low-Level Output Sink Current
OH
OL
O
I
I
V = 2.4V
-125
23
mA
mA
O
V = 0.4V
OH
OL
O
DD
Z
Z
V = 0.5V ; output driving high
29
27
Ω
Output Impedance
O
DD
V = 0.5V ; output driving low
µA
mA
mA
Z
I
Tristate Output Current
Short Circuit Source Current*
Short Circuit Sink Current*
-10
10
SCH
DD
DD
O
I
I
V
V
= 5.5V, V = 0V; shorted for 30s, max
-150
123
SCL
O
= V = 5.5V; shorted for 30s, max
DD
A
Unless otherwise stated, V = 5.0V ± 10%, no load on any output, and ambient temperature range T = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not
currently production tested to any specific limits. Min. and Max. characterization data are ± 3σ from typical. Negative currents indicate current flows out of the device.
AMI Semiconductor - Rev. 2.0, Mar. 05
16
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Low Drive Current (mA)
High Drive Current (mA)
Voltage
(V)
Voltage
(V)
150
100
50
Min.
0
Typ.
0
Max.
0
Min.
-87
-85
-83
-80
-74
-65
-61
-53
-48
-39
-32
-21
-13
0
Typ.
-112
-110
-108
-104
-97
-88
-84
-77
-71
-62
-55
-44
-36
-24
-15
0
Max.
-150
-147
-144
-139
-131
-121
-116
-108
-102
-92
0
0
0.2
0.5
0.7
1
9
11
25
34
46
52
61
66
73
77
81
83
85
87
88
89
91
12
0.5
1
22
29
39
44
51
55
60
62
65
65
66
67
68
69
29
40
1.5
2
55
1.2
1.5
1.7
2
64
2.5
2.7
3
0
-
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
76
83
-50
-100
-150
-200
92
3.2
3.5
3.7
4
2.2
2.5
2.7
3
97
104
108
112
117
119
120
121
123
-85
-74
4.2
4.5
4.7
5
-65
3.5
4
-52
MIN
TYP
MAX
-43
4.5
5
-28
Output Voltage (V)
5.2
5.5
-11
The data in this table represents nominal characterization data only.
5.5
0
Figure 10: CLK_A, CLK_B, CLK_C, CLK_D Clock Outputs
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
17
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
110
All outputs at the same frequency
100
All outputs at the same
frequency, CL = OpF
90
80
70
60
50
40
30
20
10
0
All outputs at 200MHz
except output under test
All outputs at 4MHz
except output under test
All outputs off except output under test
L
All outputs off except output under test, C = OpF
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Output Frequency (MHz)
DD
V
L
= 5.0V; Reference Frequency = 27.00MHz; VCO Frequency = 200MHz, C = 17pF except where noted
45
All outputs at the same frequency
40
35
All outputs at the same
L
frequency, C = OpF
30
All outputs at 100MHz
25
All outputs at 2MHz
except output under test
except output under test
20
15
All outputs off except
output under test
10
L
All outputs off except output under test, C = OpF
5
0
0
10
20
30
40
50
60
70
80
90
100
Output Frequency (MHz)
DD
V
L
= 3.3V; Reference Frequency = 27.00MHz; VCO Frequency = 100MHz, C = 17pF except where noted
Figure 11: Dynamic Current vs. Output Frequency
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
18
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Table 13: AC Timing Specifications
Parameter
Symbol Conditions/Description
Clock (MHz) Min.
Typ.
Max. Units
Overall
wc
t
EEPROM Write Cycle Time
4
ms
0.8
0.8
40
150
100
230
170
DD
V
V
V
V
= 5.5V
= 3.6V
= 5.5V
= 3.6V
Output Frequency*
MHz
O
f
DD
DD
DD
VCO Frequency*
VCO Gain*
MHz
MHz/V
µs
VCO
f
40
400
7
VCO
A
LFTC bit = 0
LFTC bit = 1
O
Loop Filter Time Constant*
20
2.0
2.1
1.8
1.9
L
V = 0.5V to 4.5V; C = 15pF
Rise Time*
Fall Time*
ns
ns
r
t
O
L
V = 0.3V to 3.0V; C = 15pF
O
L
V = 4.5V to 0.5V; C = 15pF
f
t
O
L
V = 3.0V to 0.3V; C = 15pF
Tristate Enable Delay*
Tristate Disable Delay*
1
1
8
8
ns
ns
µs
PZL, PZH
t
t
PZL, PZH
t
t
Output active from power-up, RUN mode via PD pin
After last register is written, register program mode
100
Clock Stabilization Time*
STB
t
1
ms
Divider Modulus
Feedback Divider
Reference Divider
Post Divider
See also Table 2
8
1
1
2047
255
50
F
N
N
N
R
P
See also Table 8
Clock Outputs (PLL A clock via CLK_A pin)
Duty Cycle*
Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period
100
100
45
45
45
45
55
55
55
55
ꢀ
ps
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
45
R
PX
N =63, N =50, no other PLLs active
y
Jitter, Long Term (σ (τ))*
j(LT)
t
L
F
R
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, =14.318MHz, N =220, N =63,
50
100
50
165
110
390
PX
N =50, all other PLLs active (B=60MHz, C=40MHz, D=14.318MHz)
L
XIN
F
R
PX
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, no
other PLLs active
j(∆P)
t
Jitter, Period (peak-peak)*
ps
L
XIN
F
R
PX
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, all
other PLLs active (B=60MHz, C=40MHz, D=14.318MHz)
Clock Outputs (PLL B clock via CLK_B pin)
Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period
Duty Cycle*
100
100
60
ꢀ
ps
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
45
75
R
Px
N =63, N =50, no other PLLs active
y
j(LT)
T
Jitter, Long Term (σ (τ))*
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
R
Px
N =63, N =50, all other PLLs active (A=50MHz, C=40MHz, D=14.318MHz)
L
XIN
F
R
Px
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, no
other PLLs active
100
60
120
400
J(∆P)
T
Jitter, Period (peak-peak)*
ps
L
XIN
F
R
Px
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, all
other PLLs active (A=50MHz, C=40MHz, D=14.318MHz)
Clock Outputs (PLL_C clock via CLK_C pin)
Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period
Duty Cycle*
100
100
40
ꢀ
ps
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
45
R
Px
N =63, N =50, no other PLLs active
y
j(LT)
T
Jitter, Long Term (σ (τ))*
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
105
120
440
R
Px
N =63, N =50, all other PLLs active (A=50MHz, B=60MHz, D=14.318MHz)
L
XIN
F
R
Px
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, no
other PLLs active
100
40
J(∆P)
T
Jitter, Period (peak-peak)*
ps
L
XIN
F
R
Px
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, N =220, N =63, N =50, all
other PLLs active (A=50MHz, B=60MHz, D=14.318MHz)
Clock Outputs (Crystal Oscillator via CLK_D pin)
Ratio of pulse width (as measured from rising edge to next falling edge at 2.5V) to one clock period
Duty Cycle*
14.318
14.318
14.318
14.318
14.318
ꢀ
ps
L
XIN
F
On rising edges 500µs apart at 2.5V relative to an ideal clock, C =15pF, f =14.318MHz, N =220,
20
40
R
Px
N =63, N =50, no other PLLs active
y
j(LT)
T
Jitter, Long Term (σ (τ))*
L
XIN
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, all other PLLs active
(A=50MHz, B=60MHz, C=40MHz)
L
XIN
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, no other PLLs active
90
J(∆P)
T
Jitter, Period (peak-peak)*
ps
L
XIN
From rising edge to the next rising edge at 2.5V, C =15pF, f =14.318MHz, all other PLLs active
(A=50MHz, B=60MHz, C=40MHz)
450
DD
A
Unless otherwise stated, V = 5.0V ± 10%, no load on any output, and ambient temperature range T = 0°C to 70°C. Parameters denoted with an asterisk ( * ) represent nominal characterization data and are not
currently production tested to any specific limits. Min. and Max. characterization data are ± 3σ from typical.
AMI Semiconductor - Rev. 2.0, Mar. 05
19
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Table 14: Serial Interface Timing Specifications
Standard Mode
Parameter
Symbol
Conditions/Description
SCL
Units
Min.
0
Max.
100
SCL
f
Clock Frequency
kHz
µs
BUF
t
Bus Free Time Between STOP and START
Set-up Time, START (repeated)
Hold Time, START
4.7
4.7
4.0
250
0
su:STA
t
µs
hd:STA
t
µs
su:DAT
t
Set-up Time, Data Input
Hold Time, Data Input
SDA
SDA
ns
µs
hd:DAT
t
Minimum delay to bridge undefined region of the falling edge of
SCL to avoid unintended START or STOP
AA
t
µs
Output Data Valid From Clock
3.5
R
t
Rise Time, Data and Clock
Fall Time, Data and Clock
High Time, Clock
SDA, SCL
SDA, SCL
SCL
1000
300
ns
ns
µs
µs
µs
F
t
HI
t
4.0
4.7
4.0
LO
t
Low Time, Clock
SCL
su:STO
t
Set-up Time, STOP
SCL
thd:STA
tsu:STA
tsu:STO
SDA
ADDRESS OR
DATA VALID
DATA CAN
CHANGE
START
STOP
Figure 12: Bus Timing Data
tHI
tR
tF
tLO
SCL
tsu:STA
thd:STA
tsu:STO
tsu:DAT
thd:DAT
SDA
IN
tBUF
tAA
tAA
SDA
OUT
Figure 13: Data Transfer Sequence
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
20
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
11.0 Package Information For Both ‘Green’ and ‘Non-Green’
Table 15: 16-pin SOIC (0.150”) Package Dimensions
Dimensions
Inches
Min.
Millimeters
Max.
0.068
Min.
1.55
Max.
A
A1
A2
B
0.061
0.004
0.055
0.013
1.73
0.249
1.55
0.49
0.249
9.98
3.99
0.0098 0.102
0.061
0.019
1.40
0.33
C
0.0075 0.0098 0.191
D
E
0.386
0.150
0.393
0.157
9.80
3.81
e
0.050 BSC
1.27 BSC
H
h
0.230
0.244
0.016
0.035
8°
5.84
0.25
0.41
0°
6.20
0.41
0.89
8°
0.010
0.016
0°
L
Θ
Table 16: 16-pin SOIC (0.150”) Package Characteristics
Parameter
Symbol
Conditions/Description
Air flow = 0 m/s
Typ.
109
Units
Thermal Impedance, Junction to Free-Air
16-pin 0.150" SOIC
JA
Θ
°C/W
Corner lead
4.0
3.0
0.4
0.5
11
L
Lead Inductance, Self
nH
Center lead
12
L
Lead Inductance, Mutual
Lead Capacitance, Bulk
Any lead to any adjacent lead
nH
pF
11
C
SS
Any lead to V
12.0 Ordering Information
Table 17: Device Ordering Codes
Operating
Temperature Range
Shipping
Configuration
Ordering Code
Device Number
Package Type
16-pin (0.150") SOIC
(small outline package)
-XTP (Tape & Reel)
-XTD (Tube/Tray)
11575-801-XTP (or -XTD)
FS6370-01
0°C to 70°C (Commercial)
0°C to 70°C (Commercial)
16-pin (0.150") SOIC
(small outline package)
'Green' or lead-free packaging
-XTP (Tape & Reel)
-XTD (Tube/Tray)
11575-819-XTP (or - XTD)
FS6370-01g
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com.
21
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
13.0 Demonstration Software
Windows 3.1x/95/98-based software is available from AMIS that illustrates the capabilities of the FS6370. The software can operate under Windows NT.
Contact your local sales representative for more information.
13.1 Software Requirements
• PC running MS Windows 3.1x or 95/98. Software also runs on Windows NT in a calculation mode only.
• 1.8MB available space on hard drive C.
13.2 Software Installation Instructions
At the appropriate disk drive prompt (A:\) unzip the compressed demo files to a directory of your choice. Run setup.exe to install the software.
13.3 Demo Program Operation
Launch the fs6370.exe program. Note that the parallel port can not be accessed if your machine is running Windows NT. A warning message will appear
stating: "This version of the demo program cannot communicate with the FS6370 hardware when running on a Windows NT operating system. Do you
want to continue anyway, using just the calculation features of this program?" Clicking OK starts the program for calculation only.
The FS6370 demonstration hardware is no longer available nor supported.
The opening screen is shown in Figure 14.
Figure 14: Opening Screen
AMI Semiconductor - Rev. 2.0, Mar. 05
22
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
13.3.1 Example Programming
Type a value for the crystal resonator frequency in MHz in the reference crystal box. This frequency provides the basis for all of the PLL calculations that
follow.
Next, click on the PLL A box. A pop-up screen similar to Figure 15 should appear. Type in a desired output clock frequency in MHz, set the operating
voltage (3.3V or 5V), and the desired maximum output frequency error. Pressing calculate solutions generates several possible divider and VCO-speed
combinations.
Figure 15: PLL Screen
For a 100MHz output, the VCO should ideally operate at a higher frequency, and the reference and feedback dividers should be as small as possible. In
this example, highlight solution #7. Notice the VCO operates at 200MHz with a post divider of 2 to obtain an optimal 50 percent duty cycle.
Now choose which mux and post divider to use (that is, choose an output pin for the 100MHz output). Selecting A places the PostDiv value in solution
#7 into post divider A and switches mux A to take the output of PLL A.
The PLL screen should disappear, and now the value in the PLL A box is the new VCO frequency chosen in solution #7. Note that mux A has been switched
to PLL A and the post divider A has the chosen 100MHz output displayed.
Repeat the steps for PLL B.
PLL C supports two different output frequencies depending on the setting of the SEL_CD pin. Both mux C and mux D are also affected by the logic level
on the SEL_CD pin, as are the post dividers C and D (see Section 4.2 for more detail).
AMI Semiconductor - Rev. 2.0, Mar. 05
23
www.amis.com.
Data Sheet
FS6370-01/FS6370-01g EEPROM Programmable 3-PLL Clock Generator IC
Figure 16: Post Divider Menu
Click on PLL C1 to open the PLL screen. Set a desired frequency, however, now choose the post divider B as the output divider. Notice the post divider
box has split in two (as shown in Figure 16). The post divider B box now shows that the divider is dependent on the setting of the SEL_CD pin for as long
as mux B is the PLL C output.
Clicking on post divider A reveals a pull-down menu provided to permit adjustment of the post divider value independently of the PLL screen. A typical
menu is shown in Figure 16. The range of possible post divider values is also given in Table 7.
The EEPROM settings are shown to the left in the screen shown in Figure 14. Clicking on a register location displays a screen shown in Figure 17. Individual
bits can be poked, or the entire register value can be changed.
Figure 17: Register Screen
Production Technical Data - The information contained in this document applies to a product in production. AMI Semiconductor and its subsidiaries ("AMIS") have made every effort to ensure that the information is accurate and
reliable. However, the characteristics and specifications of the product are subject to change without notice and the information is provided "AS IS" without warranty of any kind (express or implied). Customers are advised to obtain
the latest version of relevant information to verify that data being relied on is the most current and complete. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice.
Products sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no other warranty, express or implied, and disclaims the warranties of noninfringement,
merchantability, or fitness for a particular purpose. AMI Semiconductor's products are intended for use in ordinary commercial applications. These products are not designed, authorized, or warranted to be suitable for use in life-
support systems or other critical applications where malfunction may cause personal injury. Inclusion of AMIS products in such applications is understood to be fully at the customer's risk. Applications requiring extended temperature
range, operation in unusual environmental conditions, or high reliability, such as military or medical life-support, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2005 AMI
Semiconductor, Inc.
AMI Semiconductor - Rev. 2.0, Mar. 05
www.amis.com
24
相关型号:
©2020 ICPDF网 联系我们和版权申明