54121-101-13-XXX [AMPHENOL]
Board Connector, 13 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle;
| 型号： | 54121-101-13-XXX |
| 厂家： | 
Amphenol |
| 描述： | Board Connector, 13 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Black Insulator, Receptacle |
| 文件： | 总2页 (文件大小：188K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BergStik® Unshrouded Stacking Headers
2.54 mm
■ Wide variety of stack heights
in 0.5 mm increments
■ High temperature plastic
■ Selective plating
Technical Data
Mating Data
Page
■
■
Dubox™ Vertical receptacles
24
Physical
Housing: High temperature,
black thermoplastic
Operating Temperature Range
-65°C to +125°C
Dubox™ Low profile vertical receptacles 26, 28
Packaging
Standard: Bags
Flammability rating: UL 94 V-0
Pin: Phosphor-bronze
Processing Information
Compatible with wave, vapor-phase, and
IR reflow soldering processes
Reference Information
File no. E66906
Plating: Gold or tin-lead over 1.27 µm nickel
Electrical Performance
Current rating: 3 A continuous
File no. LR46923
Product drawing: By 5-digit base part number
Product specification: BUS-12-114
Specifications subject to change without notice.
Insulation resistance: 5000 MΩ min.
Dielectric withstanding voltage: 1500 V
Mechanical Performance
Pin retention to housing:
9 N min.
Typical Applications
Receptacle
mating side
mating side
Board
Space
OAL
OAL
OAL
Stack
Height
Stack
Height
solder side
solder side
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
12
BergStik® Unshrouded Stacking Headers
2.54 mm
Part Number
Solder
Side
Option
Total
Positions
Row
Option
Lead
Plating
Pin Style
Stack Height
5
4
1 = Through Hole (TMT)
2 = Surface Mount (SMT)
1 = Single Row (TMT only)
2 = Double Row
0 1 to 3 6 single row (TMT)
0 4 to 7 2 double row (TMT)
0 4 to 5 0 double row (SMT
XX.XX = mm
Pin
OAL (TMT)
OAL (SMT)
mm
1 = 2.41
Specify mm
Style
0 1
0 2
0 3
0 4
0 5
0 6
0 7
0 8
0 9
1 0
1 1
1 2
mm
2 = 3.05
12.20
13.50
15.90
16.76
17.65
18.91
20.96
23.50
26.04
28.58
31.12
33.66
10.42
11.72
14.12
14.98
15.87
17.13
19.18
21.72
24.26
26.80
29.34
31.88
(i.e. 08.50 = 8.50 mm
in 0.50 mm increments
4 = SMT (double row only)
08.00 min. - 25.00 max.)
1 = 0.76 µm gold on mating area, tin-lead on solder side
4 = 3.81 µm tin-lead
8 = 0.38 µm gold on mating area, tin-lead on solder side
Step-by-Step Design
1. Determine desired board spacing (0.50 mm increments)
2. Select Dubox™ receptacle and calculate stack height
Stack Height = Board Spacing – Receptacle Height
3. Find the insertion depth from the chart below.
Calculate max./min. OAL
OAL = Stack Height + solder side + Insertion Depth
4. Select the Pin Style with OAL between max.
and min. values
Dubox™ RECEPTACLES
Low Profile
7.00
Vertical
8.50
Height
Insertion Depth (max.)
Insertion Depth (min.)
6.10
3.86
6.10
4.34
Example:
Recommended PCB Layout
1. Application requires a board spacing of 22.50
2. Select the Dubox™ Low Profile Receptacle
with height of 7.00
The Header Stack Height is 22.50 - 7.00 = 15.50
3. For standard board applications, the
3.05 solder side is selected
OAL (max.) = 15.50 + 3.05 + 6.10 = 24.65
OAL (min.) = 15.50 + 3.05 + 3.86 = 22.41
4. Select Pin Style 08 with OAL = 23.50
5. Part Number is 54122-108-72-1550
Dimensions in mm
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics
13
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