59112-F22-20-XXX [AMPHENOL]

Board Connector, 40 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator, Receptacle;
59112-F22-20-XXX
型号: 59112-F22-20-XXX
厂家: Amphenol    Amphenol
描述:

Board Connector, 40 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Solder Terminal, Black Insulator, Receptacle

文件: 总2页 (文件大小:116K)
中文:  中文翻译
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Minitek™ Unshrouded Stacking Headers  
2,00 mm  
CUSTOMISABLE:  
Wide variety of stack heights in  
0.13 mm increments  
Custom sizes to meet your specific  
design requirements  
High temperature plastic  
Technical Data  
Mating Data  
Page  
Physical  
Housing: High-temperature,  
black thermoplastic  
Operating Temperature  
-55°C to +125°C  
Minitek™ ctw contacts and housings  
Minitek™Vertical receptacles  
Minitek™Shunts  
48  
50  
52  
Packaging  
Flammability rating: UL 94 V-0  
Pin: Phosphor-bronze  
Standard: TMT in bags  
SMT in Tape-and-reel  
Optional: Tubes (see drawing)  
Processing Information  
Plating: Gold over 1.27 µm nickel  
Compatible with wave, vapor-phase, and  
IR reflow soldering processes  
Electrical Performance  
Current rating: 2 A continuous  
Insulation resistance: 1000 Mmin.  
Contact resistance: 25 mmax.  
Dielectric withstanding voltage: 650 V  
Voltage rating: 200 V  
Reference Information  
File no. E66906  
File no. LR46923  
Product drawing: 59112, 59132, or 59202  
Product specification: DPS-12-011  
Specifications subject to change without notice.  
Mechanical Performance  
Mating cycles (durability): 100  
Typical Applications  
Receptacle  
Mating side  
Mating side  
Mating side  
Board  
Space  
OAL  
OAL  
OAL  
Stack  
OAL  
Stack  
Height  
Stack  
Height  
Height  
Solder side  
Solder side  
Solder side  
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics  
42  
Minitek™ Unshrouded Stacking Headers  
2,00 mm  
Part Number  
Solder  
Side  
Option  
Positions  
Per Row  
Lead  
Plating  
Pin Style  
Stack Height  
5
9
2
0 2 to 2 5 (TMT)  
0 2 to 2 5 (SMT)  
1 = Through Mount (TMT)  
2 = Surface Mount (SMT)  
G = 0,76 µm Gold on mating area,  
2-6 µmTin-Lead on solder side  
F = Gold flash  
XX.X = mm  
1 = 2.50  
3 = 3.00  
0 = SMT  
Specify mm  
[i.e., 037 = 03.7 mm]  
in 0.1 mm increments  
PACKING:  
Pin  
Style  
OAL (TMT)  
mm  
Height (SMT)  
mm  
=
=
Bags (TMT)  
2 2  
2 4  
2 6  
2 8  
3 0  
3 2  
3 4  
3 6  
3 8  
4 0  
8.20  
9.55  
6.53  
7.87  
8.51  
10.11  
11.86  
12.42  
13.92  
15.42  
17.40  
19.41  
A
Tape-and-reel (SMT)  
10.19  
11.79  
13.54  
14.10  
15.60  
17.09  
19.08  
21.08  
Step-by-Step Design  
1. Determine desired board spacing  
2. Select receptacle and calculate stack height  
Stack Height = Board Spacing – Receptacle Height  
3. Find the insertion depth from the chart below.  
Calculate max./min. OAL  
OAL = Stack Height + Tail + Insertion Depth  
4. Select the Pin Style with OAL between max.  
and min. values  
RECEPTACLES  
TMT  
SMT  
Height (mm)  
4.50  
2.30  
Insertion  
4.30  
3.03  
2.20  
1.43  
Depth (max.)  
Insertion  
Depth (min.)  
Example:  
1. Application requires a board spacing of 14.1  
Recommended PCB Layout  
2. Select the appropriate receptacle, in this case  
3.0 height (SMT)  
The Header Stack Height is 14.1 – 3.0 = 11.1  
3. For 1,6 mm board application (TMT),  
the 2.5 Solder side is selected  
OAL (max.) = 14.1 + 2.5 + 3.4 = 20.0  
OAL (min.) = 14.1 + 2.5 + 1.28 = 17.88  
4. Select Pin Style 38 with OAL = 19.07  
5. Part Number is 59112-G38-10-141  
Dimensions in mm  
Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics  
43  

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