HDB-D4-040M006P [AMPHENOL]

Board Connector, 40 Contact(s), 4 Row(s), Female, Right Angle, Solder Terminal,;
HDB-D4-040M006P
型号: HDB-D4-040M006P
厂家: Amphenol    Amphenol
描述:

Board Connector, 40 Contact(s), 4 Row(s), Female, Right Angle, Solder Terminal,

文件: 总5页 (文件大小:791K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product Data Sheet  
Amphenol® HDB3 Series High Density  
Mother Board & Daughter Board Connectors  
No. 201-3  
Rectangular Interconnects with  
.070” X .060” Grid Spacing  
HDB 3 Mother Board  
Connector  
This new connector series incorporates a higher  
density contact pattern and lower mated height  
than Amphenol’s original Low Mating Force rectan-  
gular connectors while utilizing the same durable  
and reliable B3 contact.  
The B3 brush (bristle brush bunch) contact is  
comprised of multiple strands of high tensile wire  
that intermesh to create an electrical connection.  
HDB 3 Daughter Board  
Connector  
HDB3 CONNECTOR PERFORMANCE  
BENEFITS OF THE BRUSH CONTACT  
• Redundant current paths: 14-70 gas tight points  
of contact per mated bunch  
Durability:  
100,000 mating cycles  
Insertion/Extraction Force: 1.5 ounce typical per contact  
Operating Temperature:  
Current Rating:  
-65° to 150°C  
• Very smooth low friction interface  
2 amperes  
• Low mating forces: 1.5 oz. typical per contact,  
70-90% lower than conventional contacts  
• Long contact life: 100,000 cycles of mating and  
unmating without performance degradation  
• Documented intermittency free performance: No  
10 nano-second discontinuities during  
Hot swap 1 ampere maximum  
(load dependent)  
Insulation Resistance:  
5 gigaohms minimum  
Dielectric Withstanding  
Voltage:  
750 volts, 60 hertz, rms @ Sea  
Level 250 volts, 60 hertz,  
50,000,000 cycles of 0.010” displacement  
• Impervious to fretting  
rms @ 70,000 feet Elevation  
• Contact interface meets M55302/166 thru /171  
Solderability:  
Salt Fog:  
MIL-STD-202, Method 208  
48 Hours IAW MIL-STD-1344,  
method 1001, test condition B  
HDB3 FEATURES  
Humidity:  
Vibration:  
IAW MIL-STD-1344, method  
1002, type II  
Polarization:  
Keying:  
“D” shaped design  
4 hours in each of 3 mutually  
perpendicular axes IAW MIL-ST  
1344, method 2005,  
Optional keys offer 36 unique  
keying combinations  
Guide Pins  
Optional guide pins provide  
additional alignment  
test condition V, letter H  
Shock:  
1 shock along each of three  
mutually perpendicular axes IAW  
MIL-STD-1344, method 2004,  
test condition G  
Radial Misalignment:  
Capable of correcting up to a  
.020" initial radial misalign-  
ment  
Angular Misalignment: Capable of mating with up to a  
2° initial angular misalignment  
Data Rate:  
Capable of 3.125 Gbps (consult  
Amphenol for arrangement)  
@2009 Amphenol Corporation  
Printed in U.S.A.  
1/8/2009  
Amphenol  
1
HDB3 MATERIALS  
Insulator:  
Contact:  
Liquid crystal polymer, 30% glass filled  
Wire:  
Beryllium copper per ASTM B197; finish is gold per ASTM B488  
over nickel per AMS-QQ-N-290.  
Holder:  
Sleeve:  
Brass similar to UNS C33500; finish is gold per MIL-G-45204 or tin-lead per  
MIL-P-81728 or tin per MIL-T-10727 (RoHS Compliant).  
Stainless Steel per AMS-5514, passivated IAW QQ-P-35  
(Daughter Board connector only)  
Keys/Guide Pins:  
Stainless Steel  
MOTHER BOARD  
DAUGHTER BOARD  
.335 MAX.  
.086 MIN. DIA.  
THRU HOLE  
(USE NO. 2 SCREW)  
.350  
.350  
.325  
.150 ±.005  
.086 MIN. DIA.  
THRU HOLE  
(USE NO. 2 SCREW)  
PIN 1  
.150 ±.020  
TYP.  
PIN 1  
.035  
TYP.  
A
B
C
B
A
.070  
TYP.  
.016 ±.001  
TYP.  
.016 ±.001  
DIA.TYP.  
.090 TYP.  
.150 ±.020  
TYP.  
.060 TYP.  
.025  
.195 MIN. HEX  
.070 MIN DEEP  
.030 TYP.  
(USE 3/16 HEX HEAD)  
.540  
.420  
Number of Dimension Dimension Dimension  
Contacts  
A
B
C
040  
080  
120  
160  
40  
1.375  
2.075  
1.775  
3.475  
0.800  
1.500  
2.200  
2.900  
1.075  
1.775  
2.475  
3.175  
80  
120  
.350  
.410  
.470  
160  
.530  
All dimensions for reference only.  
CUSTOM CONFIGURATIONS  
• Hybrid configurations are available with any combination  
of brush and power, coax, and/or fiber optic contacts  
• Partially populated arrangements for high voltage or high  
speed data transfer up to 3.125 Gbps. (shown at right)  
Consult Amphenol Aerospace with your design requirements.  
2
HDB3 MOTHER BOARD CONNECTOR HOW TO ORDER  
Example part number:  
HDB-M4 - 040 M 20 2 X  
Hardware  
HDB-M4 Designates HDB3 Mother Board Connectors  
Type  
Stickout  
(Dim. K)  
Number of Contacts  
X
No Hardware  
N/A  
Number of Dimension Dimension Dimension  
G
Polarization Key  
Qty. 2  
0.250  
Contacts  
A
B
C
040  
080  
120  
160  
40  
1.375  
2.075  
1.775  
3.475  
0.800  
1.500  
2.200  
2.900  
1.075  
1.775  
2.475  
3.175  
H
J
Polarization Key  
Qty. 2  
0.500  
0.750  
0.250  
0.500  
0.750  
80  
120  
Polarization Key  
Qty. 2  
160  
T
U
V
Guide Pin  
Qty. 2  
Brush Wire Plating  
M
C
0.000050 Au Min. thick over Nickel  
0.000020 Au Min. thick over Nickel  
Guide Pin  
Qty. 2  
Guide Pin  
Qty. 2  
Termination  
Type  
Stickout  
(Dim. E)  
Type  
Stickout  
(Dim. E)  
0.240  
Contact Terminition Finish  
20  
21  
22  
23  
24  
25  
PCB, Straight, .016 Dia. 0.060  
26  
27  
28  
29  
30  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
2
5
6
Gold plated in accordance with  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
PCB, Straight, .016 Dia  
0.090  
0.120  
0.150  
0.180  
0.210  
0.270  
0.300  
0.360  
0.420  
MIL-G-45204, Type II, .00030 Min.  
thick Gold over .000050 Min. thick  
Nickel  
Tin plated in accordance with  
ASTM B545, .00010 Min. thick  
Matte Tin over .00010 Min. thick  
Nickel  
Tin-Lead plated in accordance with  
SAE-AMS-P-81728, .00010 Min.  
thick Tin-Lead over .00010 Min.  
thick Copper  
HDB-M4-XXXXXXXX drawing is available on-line at  
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.  
HDB3 DAUGHTER BOARD CONNECTOR HOW TO ORDER  
Example part number:  
HDB-D4 - 040 M 02 2 X  
HDB-D4 Designates HDB3 Daughter Board Connectors  
Hardware  
Type  
Number of Contacts  
X
P
No Hardware  
Number of Dimension Dimension Dimension  
Contacts  
Polarization Key  
Qty. 2  
A
B
C
040  
080  
120  
160  
40  
1.375  
2.075  
1.775  
3.475  
0.800  
1.500  
2.200  
2.900  
1.075  
1.775  
2.475  
3.175  
L
Polarization Key  
Qty. 2  
80  
120  
160  
Brush Wire Plating  
Contact Terminition Finish  
M
C
0.000050 Au Min. thick over Nickel  
0.000020 Au Min. thick over Nickel  
2
5
6
Gold plated in accordance with  
MIL-G-45204, Type II, .00030 Min.  
thick Gold over .000050 Min. thick  
Nickel  
Termination  
Type  
Stickout  
(Dim. E)  
0.060  
Tin plated in accordance with  
ASTM B545, .00010 Min. thick  
Matte Tin over .00010 Min. thick  
Nickel  
00  
01  
02  
03  
04  
05  
06  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
PCB, Right Angle, .016 Dia.  
0.090  
0.120  
0.150  
0.180  
0.210  
0.300  
Tin-Lead plated in accordance with  
SAE-AMS-P-81728, .00010 Min.  
thick Tin-Lead over .00010 Min.  
thick Copper  
HDB-D4-XXXXXXXX drawing is available on-line at  
www.amphenol-aerospace.com. Then go to board level, then go to HDB3.  
3
Recommended Mother Board Layout  
Recommended Daughter Board Layout  
B
B
.060  
.110 ±.005  
.005  
.110 ±.005  
.005  
.205  
M
M
.025  
.030  
.070  
.035  
.
300  
.035  
.070  
.150  
.060  
BOARD  
EDGE  
FINISHED HOLE SIZE PER  
CUSTOMER STANDARDS FOR  
.205  
FINISHED HOLE SIZE PER  
CUSTOMER STANDARDS FOR  
A
.016 PCB TAIL  
A
.016 PCB TAIL  
Dimensions  
No. of Contacts  
B
40  
80  
1.075  
1.775  
2.475  
3.175  
120  
160  
Mated Connector Pair Assembled  
to Boards (0.680” Total Mated Height)  
MOTHER  
BOARD  
MOTHER  
BOARD  
CONNECTOR  
DAUGHTER  
BOARD  
CONNECTOR  
.500  
DAUGHTER  
BOARD  
.560  
.620  
.680  
Mother Board Connector Keying (Optional)  
Daughter Board Connector Keying (Optional)  
4
CONNECTOR COMPARISON  
The Amphenol HDB3 Connector offers advantages over competitive connectors:  
• Higher density contact pattern  
• Uses less board space  
• Allows for shorter mated height  
• Provides the durability and performance of the Brush contact  
• Low cost  
Amphenol  
HDB 3  
Hypertronics  
Airborn  
RM4  
HPH  
Contact System  
Brush  
100,000  
1.5  
Hyperboloid  
2,000  
Pin & Socket  
500  
Durability, Mating Cycles  
Contact Mating Forces, Ounces  
1.5  
2.5  
Mother Board  
Daughter Board  
.070 X .060  
.070 X .060  
.350  
.075 X .075  
.075 X .100  
.443  
.075 X .070  
.075 X .100  
.400  
Contact Arrangement  
Connector Width  
Mated Height, MB to 4th row of DB .  
Contacts  
680  
.986  
.915  
40  
80  
29  
38  
86  
37  
Contacts per Linear  
Inch (Contacts/  
Connector Length)  
102  
120  
110  
160  
164  
37  
43  
46  
40  
40  
For additional information on this product or other Amphenol products contact:  
Amphenol Corporation  
Amphenol Aerospace  
40-60 Delaware Avenue  
Sidney, New York 13838-1395  
Phone: 800-678-0141 and ask for BLP (Board Level Product) Marketing  
Email: blp-marketing @amphenol-aerospace.com  
Web: www.amphenol-aerospace.com  
See Amphenol Low Mating Force Rectangular Connectors Catalog, 12-035.  
Notice: Specifications are subject to change without notice. Contact your nearest Amphenol Corporation Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate  
and reliable but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty  
that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should assume that all safety measures are indicated or that other measures may not be required. Specifications  
are typical and may not apply to all connectors.  
AMPHENOL is a registered trademark of Amphenol Corporation.  
5

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