AS1744G [AMSCO]
High-Speed, Low-Voltage, Dual, Single-Supply, 4з, SPDT Analog Switches; 高速，低电压，双通道，单电源， 4з ， SPDT模拟开关
| 型号： | AS1744G |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | High-Speed, Low-Voltage, Dual, Single-Supply, 4з, SPDT Analog Switches |
| 文件： | 总16页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
austriamicrosystems
Data Sheet
AS1744 , AS1745
High-Speed, Low-Voltage, Dual, Single-Supply,
4Ω, SPDT Analog Switches
1 General Description
2 Key Features
ꢀ
ON-Resistance:
The AS1744/AS1745 are high-speed, low-voltage, dual
single-pole/double-throw (SPDT) analog switches.
- 4Ω (+5V supply)
- 5.5Ω (+3V supply)
Fast switching speeds, low ON-resistance, and low
power-consumption make these devices ideal for single-
cell battery powered applications.
ꢀ
ꢀ
ꢀ
ꢀ
RON Matching: 0.2Ω (+5V supply)
RON Flatness: 1Ω (+5V supply)
Supply Voltage Range: +1.8 to +5.5V
These highly-reliable devices operate from a +1.8 to
+5.5V supply, are differentiated by inverted logic, and
support break-before-make switching.
1.8V Operation:
With low ON-resistance (RON), RON matching, and RON
flatness, the devices can accurately switch signals for
sample and hold circuits, digital filters, and op-amp gain
switching networks.
- 9.5Ω ON-Resistance over Temperature
- 38ns Turn On Time
- 12ns Turn Off Time
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Current-Handling: 100mA Continuous
Break-Before-Make Switching
Rail-to-Rail Signal Handling
The devices are available in a 10-pin MSOP package
and a 10-pin TDFN package.
Crosstalk: -90dB at 1MHz
Off-Isolation: -85dB at 1MHz
Total Harmonic Distortion: 0.1%
Operating Temperature Range: -40 to +85ºC
ꢀ
Package Types:
- 10-pin MSOP
- 10-pin TDFN
3 Applications
The devices are ideal for use in power routing systems,
cordless and mobile phones, MP3 players, CD and DVD
players, PDAs, handheld computers, digital cameras,
and any other application where high-speed signal
switching is required.
Figure 1. Block Diagrams
1
IN1
2
10
1
IN1
2
10
COM1
9
COM1
9
Truth Table
NOx to NCx to
COMx COMx
INx
NC1
3
NO1
NO1
3
NC1
8
8
Low
Off
On
On
Off
AS1745
AS1744
V+
V+
GND
4
GND
4
High
7
7
Switches shown for low input.
NC2
5
NO2
6
NO2
5
NC2
6
IN2
COM2
IN2
COM2
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Data Sheet
4 Absolute Maximum Ratings
Stresses beyond those listed in Table 1 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 5 Electrical
Characteristics on page 3 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 1. Absolute Maximum Ratings
Parameter
Min
Max Units
Comments
V+, IN1, IN2 to GND
-0.3
+7
V
V
V+
+ 0.3
COMx, NOx, NCx to GND †
-0.3
COMx, NOx, NCx Continuous Current
COMx, NOx, NCx Peak Current
Continuous Power Dissipation (TAMB = +70ºC)
Electro-Static Discharge
-100 +100
-150 +150
330
mA
mA
mW
V
Pulsed at 1ms, 10% duty cycle
Derate at 4.7mW/ºC above +70ºC
HBM Mil-Std883E 3015.7 methods
Norm: JEDEC 17
1000
Latch Up Immunity
100
mA
ºC
Operating Temperature Range
Junction Temperature
-40
-65
+85
150
ºC
Storage Temperature Range
+150
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
Package Body Temperature
+260
ºC
† Signals on pins COM1, COM2, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes.
Limit forward-diode current to the maximum current rating.
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Data Sheet
5 Electrical Characteristics
V+ = +4.5 to 5.5V, VIH = +2.4V, VIL = +0.8V, TAMB = TMIN to TMAX (unless otherwise specified). Typ Values @TAMB = +25ºC.
Table 2. +5V Supply Electrical Characteristics
Symbol
Parameter
Conditions
Min Typ Max Unit
Analog Switch
VCOMx,
Analog Signal
Range
VNOx,
VNCx
0
V+
V
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
2.5
0.1
4
V+ = 4.5V, ICOMx = 10mA,
RON
ON-Resistance
Ω
VNOx or VNCx = 0 to V+
4.5
0.2
ON-Resistance
Match Between
V+ = 4.5V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
∆RON
Ω
Channels 1
ON-Resistance
Flatness 2
TAMB = TMIN to TMAX
0.4
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
0.5
1
V+ = 4.5V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
RFLAT(ON)
Ω
nA
nA
nA
1.2
NOx or NCx Off-
Leakage Current 3
COMx Off-
-0.1 ±0.01 0.1
0.3
-0.1 ±0.01 0.1
INOx(OFF),
INCx(OFF)
V+ = 5.5V, VCOMx = 1 or 4.5V,
VNOx or VNCx = 4.5 or 1V
TAMB = TMIN to TMAX -0.3
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
V+ = 5.5V, VCOMx = 1 or 4.5V,
VNOx or VNCx = 4.5 or 1V
ICOMx(OFF)
Leakage Current 3
COMx On-
-3
3
0.4
4
-0.4 ±0.1
-4
V+ = 5.5V, VCOMx = 4.5 or 1V,
VNOx or VNCx = 4.5 or 1V
ICOMx(ON)
Leakage Current 3
TAMB = TMIN to TMAX
Logic Input: INx
VIH
VIL
Input Logic High
Input Logic Low
2.4
V
V
0.8
Input Leakage
Current
IIH, IIL
VINx = 0 or +5.5V
-100
5
100
nA
Switch Dynamic Characteristics
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
14
4
17
18
6
VNOx or VNCx = 3V, RLOAD = 300Ω,
Turn On Time 3
Turn Off Time 3
tON
ns
ns
ns
CLOAD = 35pF, Figure 11
VNOx or VNCx = 3V, RLOAD = 300Ω,
tOFF
CLOAD = 35pF, Figure 11
TAMB = TMIN to TMAX
TAMB = +25ºC
8
Break-Before-
Make 3
10
VNOx or VNCx = 3V, RLOAD = 300Ω,
tBBM
CLOAD = 35pF, Figure 12
TAMB = TMIN to TMAX
1
Q
Charge Injection
VGEN = 2V, RGEN = 0, CLOAD = 1.0nF, Figure 13
7
pC
pF
CNOx(OFF),
CNCx(OFF)
NOx, NCx Off-
Capacitance
VNOx or VNCx = GND, f = 1MHz, Figure 14
20
COMx On-
CCOMx(ON)
VCOMx = GND, f = 1MHz, Figure 14
56
pF
dB
Capacitance
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF,
-52
-85
-52
-90
0.1
Figure 15
Off-Isolation 4
Crosstalk 5
VISO
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 15
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 15
VCT
dB
%
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 15
Total Harmonic
Distortion
THD
f = 20Hz to 20kHz, VNOx = 5Vp-p, RLOAD = 600Ω
Power Supply
Positive Supply
Current
I+
V+ = 5.5V, VINx = 0 or V+
0.01
1.0
µA
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Data Sheet
V+ = +2.7 to 3.6V, VIH = +2.0V, VIL = +0.4V, TAMB = TMIN to TMAX (unless otherwise specified). Typ values @ TAMB = +25ºC.
Table 3. +3V Supply Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ Max Unit
Analog Switch
VCOMx,
VNOx,
VNCx
Analog Signal Range
ON-Resistance
0
V+
V
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
5
5.5
8
V+ = 2.7V, ICOMx = 10mA,
RON
Ω
VNOx or VNCx = 0 to V+
ON-Resistance
Match Between
0.1
0.2
V+ = 2.7V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
∆RON
Ω
Channels 1
ON-Resistance
Flatness 2
TAMB = TMIN to TMAX
0.4
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
1.5
2
V+ = 2.7V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
RFLAT(ON)
Ω
nA
nA
nA
2.5
-0.1 ±0.01 0.1
0.3
-0.1 ±0.01 0.1
NOx or NCx Off-
INOx(OFF),
INCx(OFF)
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 3 or 1V
Leakage Current 3
TAMB = TMIN to TMAX -0.3
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
COMx Off-Leakage
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 3 or 1V
ICOMx(OFF)
ICOMx(ON)
Current 3
-3
3
0.4
4
-0.4 ±0.1
-4
COMx On-Leakage
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 1 or 3V
Current 3
TAMB = TMIN to TMAX
Logic Input: (INx)
VIH
VIL
Input Logic High
Input Logic Low
2.0
V
V
0.4
Input Leakage
Current
IIH,IIL
VINx = 0 or +5.5V
-100
5
100 nA
Switch Dynamic Characteristics
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
17
6
23
ns
28
VNOx or VNCx = 2V, RLOAD =
Turn On Time 3
tON
300Ω, CLOAD = 35pF, Figure 11
8
VNOx or VNCx = 2V, RLOAD =
300Ω, CLOAD = 35pF, Figure 11
Turn Off Time 3
tOFF
ns
10
TAMB = TMIN to TMAX
TAMB = +25ºC
11
VNOx or VNCx = 2V, RLOAD =
300Ω, CLOAD = 35pF, Figure 12
Break-Before-Make 3
tBBM
ns
TAMB = TMIN to TMAX
1
Q
Charge Injection
VGEN = 1.5V, RGEN = 0, CLOAD = 1.0nF, Figure 13
0
pC
pF
CNOx(OFF),
CNCx(OFF)
NOx, NCx Off-
Capacitance
VNOx or VNCx = GND, f = 1MHz, Figure 14
20
COMx On-
CCOMx(ON)
VCOMx = GND, f = 1MHz, Figure 14
56
pF
dB
Capacitance
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 15
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 15
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 15
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 15
-52
-85
-52
-90
Off-Isolation 4
Crosstalk 5
VISO
VCT
dB
Power Supply
Positive Supply
Current
I+
V+ = 3.6V, VIN = 0 or +3.6V
0.01
1.0 µA
1. ∆RON = RON(MAX) - RON(MIN).
2. Flatness is defined as the difference between the maximum and the minimum value of ON-resistance as measured
over the specified analog signal ranges.
3. Guaranteed by design.
4. Off-Isolation = 20log10(VCOMx/VNOx), VCOMx = output, VNOx = input to off switch.
5. Between any two switches.
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Data Sheet
6 Typical Operating Characteristics
Figure 2. Frequency Response
Figure 3. THD vs. Frequency
10
0.12
0.1
Bandwidth
0
-10
-20
-30
0.08
0.06
0.04
0.02
0
Isolation
-40
-50
Crosstalk
-60
-70
-80
-90
-100
0.001
0.1
10
1000
1000
10000
100000
Frequency (MHz)
Frequency (Hz)
Figure 4. RON vs. VCOM and Temperature (VDD = 5V)
Figure 5. RON vs. VCOM and Temperature (VDD = 3V)
3.5
4.5
4.0
Temp = +85ºC
3.0
3.5
Temp = +85ºC
2.5
Temp = +25ºC
3.0
Temp = +25ºC
2.5
2.0
Temp = -40ºC
Temp = -40ºC
2.0
1.5
1.0
1.5
1.0
0
1
2
3
4
5
0.0
1.0
2.0
3.0
VCOM (V)
VCOM (V)
Figure 6. RON vs. VCOM
Figure 7. tON/tOFF vs. Temperature (V+ = 5V)
14
25
12
10
20
tON
VDD = 1.8V
8
15
VDD = 2.5V
6
4
2
0
10
VDD = 3V
VDD = 4.5V
tOFF
5
VDD = 5V
0
0
1
2
3
4
5
-40
25
85
VCOM (V)
Temperature (°C)
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Data Sheet
ON-Resistance
Figure 8. tON/tOFF vs. Supply Voltage
Figure 9. Charge Injection
40
35
30
25
20
15
10
5
30
20
tON
10
tOFF
0
VDD = 3V VDD = 5V
-5
0
0
1
2
3
4
5
1.5
2.5
3.5
4.5
5.5
VCOM (V)
Supply Voltage (V)
7 Detailed Description
The AS1744/AS1745 are low ON-resistance, low-voltage, dual analog SPDT switches that operate from a single +1.8
to +5.5V supply.
CMOS process technology allows switching of analog signals that are within the supply voltage range (GND to V+).
ON-Resistance
When powered from a +5V supply, the low RON (4Ω max) allows high continuous currents to be switched in a wide
range of applications. All devices have low RON flatness (1Ω, max) so they can meet or exceed the low-distortion audio
requirements of modern portable audio devices.
Bi-Directional Switching
Pins NOx, NCx, and COMx are bi-directional, thus they can be used as inputs or outputs.
Analog Signal Levels
Analog signals ranging over the entire supply voltage (V+ to GND) can be passed with very little change in ON-resis-
tance (see Typical Operating Characteristics on page 5).
Logic Inputs
The AS1744/AS1745 logic inputs (INx) can be driven up to +5.5V regardless of the supply voltage value. For example,
with a +3.3V supply, IN+ may be driven low to GND and high to +5.5V. This allows the devices to interface with +5V
systems using a supply of less than 5V.
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Data Sheet
Power-Supply Sequencing
8 Application Information
Power-Supply Sequencing
Proper power-supply sequencing is critical for proper operation. The recommended sequence is as follows:
1. V+
2. NOx, NCx, COMx
Always apply V+ before applying analog signals, especially if the analog signal is not current-limited. If the above
sequence is not possible, and if the analog inputs are not current-limited to less than 30mA, add a small-signal diode
as shown in Figure 10 (D1). If the analog signal can dip below GND, add diode D2. Adding these diodes will reduce the
analog range to a diode-drop (about 0.7V) below V+ (for D1), and a diode-drop above ground (for D2).
Note: Operation beyond the absolute maximum ratings (see page 2) may permanently damage the devices.
Overvoltage Protection
ON-resistance increases slightly at lower supply voltages.
Figure 10. Overvoltage Protection Using 2 External Blocking Diodes
AS1744/AS1745
D1
V+
V+
NOx
COMx
VGEN
GND
D2
Adding diode D2 to the circuit shown in Figure 10 causes the logic threshold to be shifted relative to GND. Diodes D1
and D2 also protect against overvoltage conditions.
For example, in the circuit shown in Figure 10, if the supply voltage goes below the absolute maximum rating, and if a
fault voltage up to the absolute maximum rating is applied to an analog signal pin, no damage will result.
Note: The supply voltage (V+) must not exceed the absolute maximum rating of +7V.
Power Supply Bypass
Power supply connections to the devices must maintain a low impedance to ground. This can be done using a bypass
capacitor, which will also improve noise margin and prevent switching noise propagation from the V+ supply to other
components.
Layout Considerations
High-speed switches require proper layout and design procedures for optimum performance.
ꢀ
ꢀ
ꢀ
Reduce stray inductance and capacitance by keeping traces short and wide.
Ensure that bypass capacitors are as close to the device as possible.
Use large ground planes where possible.
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Data Sheet
Timing Diagrams and Test Setups
Timing Diagrams and Test Setups
Figure 11. Switching Time
AS1744/
AS1745
tR < 5ns
tF < 5ns
VIH + 0.5V
Logic
V+
V+
50%
50%
tOFF
NOx or NCx
Input
VIN
COMx
0
VOUT
NCx or NOx
VOUT
Switch
†
0.9 x VOUT
RLOAD
CLOAD
0.9 x VOUT
Output
0
INx
tON
Logic
Input
GND
Logic input waveforms inverted for switches
that have the opposite logic sense.
†
Includes stray capacitance and fixture capacitance.
Figure 12. Break-Before-Make Interval
tR < 5ns
tF < 5ns
AS1744/
AS1745
V+
V+
VIH + 0.5V
NOx or NCx
VIN
COMx
VOUT
Logic
Input
50%
NCx or NOx
RLOAD
†
0
CLOAD
INx
0.9 x VOUT
VOUT
Logic
Input
GND
†
tD
Includes stray capacitance and fixture capacitance.
Figure 13. Charge Injection
AS1744/
AS1745
V+
V+
∆VOUT
INx
VOUT
VINL to
VINH
NCx
or NOx
INx
COMx
Off
Off
Off
Off
VOUT
On
On
RGEN
CLOAD
GND
VGEN
INx
INx depends on switch configuration; input polar-
ity is determined by the sense of the switches.
Q = ∆VOUT x CLOAD
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Data Sheet
Timing Diagrams and Test Setups
Figure 14. NOx, NCx, and COMx Capacitance
AS1744/
AS1745
V+
COMx
V+
10nF
1MHz
Capacitance
Analyzer
VINH or
VINL
NCx or
NOx
INx
GND
Figure 15. Off-Isolation, On-Loss, and Crosstalk
Network Analyzer
VIN
50Ω
50Ω
COMx
V+
V+
10nF
AS1744/
AS1745
NCx
VOUT
Measure
Reference
NOx
V+
INx
GND
50Ω
50Ω
50Ω
Notes:
1. Measurements are standardized against short-circuit at all terminals.
2. Off-isolation is measured between COMx and the off NCx/NOx terminal of each switch. Off-isolation =
20log(VOUT/VIN).
3. Crosstalk is measured from one channel to all other channels.
4. Signal direction through the switch is reversed; worst values are recorded.
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Data Sheet
Pin Assignments
9 Pinout and Packaging
Pin Assignments
Figure 16. Pin Assignments (Top View)
IN1
NO1
GND
NO2
IN2
1
2
3
4
5
10 COM1
IN1
NC1
GND
NC2
IN2
1
2
3
4
5
10 COM1
9
8
7
6
NC1
V+
9
8
7
6
NO1
V+
AS1744
AS1745
NC2
COM2
NO2
COM2
Pin Descriptions
Table 4. Pin Descriptions
Pin Number
Pin Name
Description
AS1744
AS1745
Analog Switch 1 Common
Analog Switch 2 Common
Ground
10
6
10
6
3
1
5
2
4
9
7
8
COM1
COM2
GND
IN1
3
Analog Switch 1 Logic Control Input
Analog Switch 2 Logic Control Input
Analog Switch 1 Normally Closed Terminal
Analog Switch 2 Normally Closed Terminal
Analog Switch 1 Normally Open Terminal
Analog Switch 2 Normally Open Terminal
Input Supply Voltage. +1.8 to +5.5V
1
5
IN2
9
NC1
NC2
NO1
NO2
V+
7
2
4
8
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Data Sheet
Package Drawings and Markings
Package Drawings and Markings
The devices are available in a 10-pin MSOP package and a 10-pin TDFN package.
Figure 17. 10-pin MSOP Package
Symbol
A
Typ
1.10
0.10
0.86
3.00
2.95
4.90
3.00
2.95
0.51
0.51
0.15
0.15
0.31
0.41
±Tol
Max
Symbol
b
Typ
0.23
±Tol
+0.07/-0.08
A1
A2
D
±0.05
b1
c
0.20
±0.05
±0.08
0.18
±0.08
±0.10
c1
0.15
+0.03/-0.02
D2
E
±0.10
θ1
θ2
θ3
L
3.0º
±3.0º
±0.15
12.0º
12.0º
0.55
±3.0º
E1
E2
E3
E4
R
±0.10
±3.0º
±0.10
±0.15
±0.13
L1
aaa
bbb
ccc
e
0.95BSC
0.10
-
-
-
-
±0.13
+0.15/-0.08
+0.15/-0.08
±0.08
0.08
R1
t1
0.25
0.50 BSC
0.50 BSC
-
-
t2
±0.08
S
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Data Sheet
Package Drawings and Markings
Notes:
1. All dimensions are in millimeters, angles in degrees, unless otherwise specified.
2. Datums B and C to be determined at datum plane H.
3. Dimensions D and E1 are to be determined at datum plane H.
4. Dimensions D2 and E2 are for top package; dimensions D and E1 are for bottom package.
5. Cross section A-A to be determined at 0.13 to 0.25mm from lead tip.
6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
7. Dimensions E1 and E2 do not include interlead flash or protrusion.
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AS1744, AS1745
austriamicrosystems
Data Sheet
Package Drawings and Markings
Figure 18. 10-pin TDFN Package (3.0x3.0mm)
D2
SEE
D
DETAIL B
D2/2
D/2
PIN 1 MARKER
-B-
INDEX AREA
(D/2 xE/2)
4
NXK
N N-1
10
NXb
bbb
ddd
5
e
aaa C 2x
TOP VIEW
INDEX AREA
(D/2 xE/2)
C
A B
(ND-1) X e
6
C
4
BOTTOM VIEW
ccc
C
C
7
8
10
NX
0.08
SEATING
PLANE
-C-
SIDE VIEW
Datum A or B
D
e
Terminal Tip
5
DETAIL B
ODD TERMINAL SIDE
TYPE A
Typ
Variations
Typ
Symbol
A
Min
0.70
0.00
Max
0.80
0.05
Notes
1, 2
Symbol
Min
Max
Notes
1, 2
0.75
0.02
D BSC
E BSC
D2
3.00
3.00
A1
A3
L1
1, 2
1, 2
0.20 REF
1, 2
2.20
1.40
0.30
2.70
1.75
0.50
1, 2
0.15
0.13
14º
1, 2
E2
1, 2
L2
1, 2
L
0.40
10
5
1, 2
θ
0º
1, 2
N
1, 2
K
0.20
0.17
0.18
1, 2
ND
1, 2, 5
K2
b
1, 2
0.25
0.5
0.30
1, 2, 5
e
aaa
bbb
ccc
ddd
eee
ggg
0.15
0.10
0.10
0.05
0.08
0.10
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
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Revision 1.53
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AS1744, AS1745
austriamicrosystems
Data Sheet
Package Drawings and Markings
Notes:
1. Dimensioning and tolerancing are compliant with ASME Y14.5M-1994.
2. Dimensions are in millimeters, angles in degrees (º).
3. N is the total number of terminals.
4. The terminal 1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of
terminal 1 identifier are optional, but must be located within the zone indicated. The terminal 1 identifier may
be either a mold, embedded metal or mark feature.
5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip.
6. ND refers to the maximum number of terminals on D side.
7. Variation shown in Figure 18 is for illustration purposes only.
8. For variation identifier dimension details, refer to the Dimensions table.
9. For a complete set of dimensions for each variation, refer to the Variations table.
10. Unilateral coplanarity zone applies to the exposed heat sink slug and the terminals.
11. For a rectangular package, the terminal side of the package is determined by:
- Type 1: Terminals are on the short side of the package.
- Type 2: Terminals are on the long side of the package.
12. Variations specified as NJR (non JEDEC registered), with an additional dash number (e.g., -1, -2) are pack-
ages currently not registered with JEDEC.
13. When more than one variations exist for the same profile height, body size (DxE), and pitch, then those vari-
ations will be denoted by an additional dash number (i.e., -1,-2) for identification. The new variations shall be
created based on any or all of the following factors: terminal count, terminal length, and exposed pad sizes.
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AS1744, AS1745
austriamicrosystems
Data Sheet
10 Ordering Information
The devices are available as the standard products shown in Table 5.
Table 5. Ordering Information
Type
Description
Delivery Form
Tube
Package
AS1744G
AS1744G-T
Dual SPDT Switch
Dual SPDT Switch
10-pin MSOP
10-pin MSOP
Tape and Reel
AS1744V-T †
AS1745G
Dual SPDT Switch
Tape and Reel
10-pin TDFN
Dual SPDT Switch
Dual SPDT Switch
Tube
10-pin MSOP
10-pin MSOP
AS1745G-T
Tape and Reel
AS1745V-T †
Dual SPDT Switch
Tape and Reel
10-pin TDFN
† Available upon request. Contact austriamicrosystems, AG for details.
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AS1744, AS1745
austriamicrosystems
Data Sheet
Copyrights
Copyright © 1997-2006, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, trans-
lated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement. austriami-
crosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information.
This product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-
sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for
each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the tech-
nical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
A-8141 Schloss Premstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com
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