AS3932_07 [AMSCO]
3D Low Frequency Wakeup Receiver; 3D低频唤醒接收器型号: | AS3932_07 |
厂家: | AMS(艾迈斯) |
描述: | 3D Low Frequency Wakeup Receiver |
文件: | 总34页 (文件大小:402K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AS3932
3D Low Frequency Wakeup Receiver
Wake-up sensitivity 100 µVRMS (typ.)
Adjustable sensitivity level
1 General Description
The AS3932 is a 3-channel low power ASK receiver that is able to
generate a wake-up upon detection of a data signal which uses a LF
carrier frequency between 110 - 150 kHz. The integrated correlator
can be used for detection of a programmable 16-bit wake-up pattern.
The device can operate using one, two, or three active channels.
Highly resistant to false wake-ups
False wake-up counter
Periodical forced wake-up supported (1s – 2h)
Low power listening modes
The AS3932 provides a digital RSSI value for each active channel, it
supports a programmable data rate. The AS3932 offers a real-time
clock (RTC), which is either derived from a crystal oscillator or the
internal RC oscillator.
Current consumption in 3-channel listening mode 1.7 µA (typ.)
Programmable data-rate 0.5 – 4 kbaud (Manchester encoded)
Digital RSSI values available for each channel
Dynamic range 64dB
The programmable features of AS3932 enable to optimize its
settings for achieving a longer distance while retaining a reliable
wake-up generation. The sensitivity level of AS3932 can be adjusted
in presence of a strong field or in noisy environments.
5 bit RSSI step (2dB per step)
RTC based on 32kHz XTAL, RC-OSC, or External Clock
Operating temperature range -40ºC to +85ºC
Operating supply voltage 2.4V – 3.6V (TA = 25ºC)
Bidirectional serial digital interface (SDI)
Package option: 16-pin TSSOP, 16LD QFN (4x4)
The device is available in 16-pin TSSOP and 16LD QFN (4x4)
packages.
2 Key Features
3-channel ASK wake-up receiver
Carrier frequency range 110 - 150 kHz
One, two, or three channel operation
Reliable 1-D, 2-D or 3-D wake-up pattern detection
Programmable wake-up pattern (16bits)
Doubling of wake-up pattern supported
Wake-up without pattern detection supported
3 Applications
The AS3932 is ideal for Active RFID tags, Real-time location
systems, Operator identification, Access control, and Wireless
sensors.
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AS3932
Datasheet - Applications
Figure 1. AS3932 Typical Application Diagram with Crystal Oscillator
VCC
VCC
XIN
CS
NC
CL
CBAT
XTAL
TRANSMITTER
XOUT
DAT
WAKE
SCL
TX
LF1P
LF2P
LF3P
LFN
AS3932
SDO
SDI
GND
VSS
Figure 2. AS3932 Typical Application Diagram with RC Oscillator
VCC
VCC
XIN
CS
NC
CBAT
XOUT
LF1P
LF2P
LF3P
LFN
DAT
WAKE
SCL
TRANSMITTER
TX
AS3932
SDO
SDI
GND
VSS
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AS3932
Datasheet - Applications
Figure 3. AS3932 Typical Application Diagram with Clock from External Source
VCC
CBAT
VCC
XIN
CS
NC
EXTERNAL CLOCK
R
C
XOUT
DAT
WAKE
SCL
TRANSMITTER
LF1P
LF2P
LF3P
LFN
AS3932
TX
SDO
SDI
GND
VSS
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AS3932
Datasheet - Contents
Contents
1 General Description ..................................................................................................................................................................
2 Key Features.............................................................................................................................................................................
3 Applications...............................................................................................................................................................................
4 Pin Assignments .......................................................................................................................................................................
4.1 TSSOP Package ..................................................................................................................................................................................
1
1
1
5
5
4.1.1 Pin Descriptions........................................................................................................................................................................... 5
4.2 QFN Package.......................................................................................................................................................................................
4.2.1 Pin Descriptions........................................................................................................................................................................... 6
6
5 Absolute Maximum Ratings ......................................................................................................................................................
6 Electrical Characteristics...........................................................................................................................................................
7
8
7 Typical Operating Characteristics ........................................................................................................................................... 10
8 Detailed Description................................................................................................................................................................ 11
8.1 Operating Modes................................................................................................................................................................................ 12
8.1.1 Power Down Mode .................................................................................................................................................................... 12
8.1.2 Listening Mode .......................................................................................................................................................................... 12
8.1.3 Preamble Detection / Pattern Correlation.................................................................................................................................. 13
8.1.4 Data Receiving .......................................................................................................................................................................... 13
8.2 System and Block Specification ......................................................................................................................................................... 14
8.2.1 Register Table ........................................................................................................................................................................... 14
8.2.2 Register Table Description and Default Values......................................................................................................................... 14
8.2.3 Serial Data Interface (SDI)......................................................................................................................................................... 16
8.2.4 SDI Timing................................................................................................................................................................................. 19
8.3 Channel Amplifier and Frequency Detector........................................................................................................................................ 20
8.3.1 Frequency Detector / AGC ........................................................................................................................................................ 20
8.3.2 Antenna Damper........................................................................................................................................................................ 21
8.4 Channel Selector / Demodulator / Data Slicer.................................................................................................................................... 21
8.5 Correlator............................................................................................................................................................................................ 22
8.6 Wake-up Protocol - Carrier Frequency 125 kHz................................................................................................................................. 23
8.6.1 Without Pattern Detection.......................................................................................................................................................... 23
8.6.2 Single Pattern Detection............................................................................................................................................................ 24
8.7 False Wake-up Register ..................................................................................................................................................................... 26
8.8 Real Time Clock (RTC)....................................................................................................................................................................... 27
8.8.1 Crystal Oscillator........................................................................................................................................................................ 28
8.8.2 RC-Oscillator ............................................................................................................................................................................. 28
8.8.3 External Clock Source ............................................................................................................................................................... 29
8.9 Channel Selection in Scanning Mode and ON/OFF Mode................................................................................................................. 29
9 Package Drawings and Markings ........................................................................................................................................... 30
10 Ordering Information............................................................................................................................................................. 33
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AS3932
Datasheet - Pin Assignments
4 Pin Assignments
4.1 TSSOP Package
Figure 4. Pin Assignments 16-pin TSSOP Package
1
2
3
4
5
6
7
CS
16
15
NC
SCL
DAT
SDI
SDO
VCC
GND
LF3P
WAKE
14
13
12
VSS
AS3932
XOUT
11
10
9
XIN
LFN
LF2P
LF1P
8
4.1.1 Pin Descriptions
Table 1. Pin Descriptions 16-pin TSSOP Package
Pin
Number
Pin Name
Pin Type
Description
CS
SCL
SDI
1
2
Chip select
SDI interface clock
SDI data input
Digital input
3
SDO
VCC
GND
LF3P
LF2P
LF1P
LFN
4
Digital output / tristate
Supply pad
SDI data output (tristate when CS is low)
Positive supply voltage
Negative supply voltage
Input antenna channel three
Input antenna channel two
Input antenna channel one
Common ground for antenna one, two and three
Crystal oscillator input
5
6
Supply pad
7
8
9
Analog I/O
10
11
12
13
14
15
16
XIN
XOUT
VSS
WAKE
DAT
NC
Crystal oscillator output
Substrate
Supply pad
Digital output
-
Wake-up output IRQ
Data output
Not connected
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AS3932
Datasheet - Pin Assignments
4.2 QFN Package
Figure 5. Pin Assignments 16LD QFN (4x4) Package
16
13
15
14
1
2
SCL
CS
LF3P
LF2P
12
11
AS3932
3
4
LF1P
LFN
10
9
NC
DAT
8
6
5
7
4.2.1 Pin Descriptions
Table 2. Pin Descriptions 16LD QFN (4x4) Package
Pin
Number
Pin Name
Pin Type
Description
LF3P
LF2P
LF1P
LFN
1
2
Input antenna channel three
Input antenna channel two
Input antenna channel one
3
Analog I/O
4
Common ground for antenna one, two and three
Crystal oscillator input
Crystal oscillator output
Substrate
XIN
5
XOUT
VSS
WAKE
DAT
NC
6
7
Supply pad
Digital output
-
8
Wake-up output IRQ
Data output
9
10
11
12
13
14
15
16
Not connected
CS
Chip select
SCL
SDI
Digital input
SDI interface clock
SDI data input
SDO
VCC
GND
Digital output / tristate
Supply pad
SDI data output (tristate when CS is low)
Positive supply voltage
Negative supply voltage
Supply pad
Note: The exposed pad has to be connected to ground.
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AS3932
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Electrical Characteristics on page 8 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Notes
DC supply voltage (VDD)
Input pin voltage (VIN)
-0.5
-0.5
-100
5
5
V
V
Input current (latch up immunity) (ISOURCE)
Electrostatic Discharge
100
mA
Norm: Jedec 78
Electrostatic discharge (ESD)
Continuous Power Dissipation
±2
kV
Norm: MIL 883 E method 3015 (HBM)
Total power dissipation
(all supplies and outputs)
(Pt)
0.07
mW
Temperature Ranges and Storage Conditions
Storage temperature (Tstrg
)
-65
150
260
85
ºC
ºC
%
Norm: IPC/JEDEC J-STD-020
The reflow peak soldering temperature (body
temperature) is specified according IPC/JEDEC
J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-hermetic Solid State
Surface Mount Devices”.
Package body temperature (Tbody
)
Humidity non-condensing
5
Moisture Sensitivity Level (MSL)
3
Represents a maximum floor life time of 168h
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AS3932
Datasheet - Electrical Characteristics
6 Electrical Characteristics
Table 4. Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Operating Conditions
VDD
VSS
Positive supply voltage
Negative supply voltage
Ambient temperature
2.4
0
3.6
0
V
V
TAMB
-40
85
ºC
DC/AC Characteristics for Digital Inputs and Outputs
CMOS Input
VIH
High level input voltage
Low level input voltage
Input leakage current
0.58* VDD 0.7* VDD 0.83* VDD
0.125* VDD 0.2* VDD 0.3* VDD
100
V
V
VIL
ILEAK
nA
CMOS Output
VOH
High level output voltage
Low level output voltage
Capacitive load
With a load current of 1mA
With a load current of 1mA
For a clock frequency of 1 MHz
VDD - 0.4
VSS + 0.4
400
V
V
VOL
CL
pF
Tristate CMOS Output
VOH
VOL
IOZ
High level output voltage
Low level output voltage
Tristate leakage current
With a load current of 1mA
With a load current of 1mA
to VDD and VSS
VDD - 0.4
VSS + 0.4
100
V
V
nA
Table 5. Electrical System Specifications
Symbol
Input Characteristics
RIN
Parameter
Conditions
Min
Typ
Max
Units
Input Impedance
In case no antenna damper is set (R1<4>=0)
2
MΩ
kHz
kHz
Fmin
Minimum Input Frequency
Maximum Input Frequency
110
150
Fmax
Current Consumption
IPWD
Power Down Mode
400
2.7
nA
Current Consumption in
standard listening mode with
one active channel and RC-
oscillator as RTC
I1CHRC
I2CHRC
µA
Current Consumption in
standard listening mode with
two active channels and RC-
oscillator as RTC
4.2
5.7
2.7
µA
µA
µA
Current Consumption in
standard listening mode with
three active channels and RC-
oscillator as RTC
I3CHRC
8.3
Current Consumption in
scanning mode with three
active channels and RC-
oscillator as RTC
I3CHSCRC
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AS3932
Datasheet - Electrical Characteristics
Table 5. Electrical System Specifications
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Current Consumption in ON/
OFF mode with three active
channels and RC-oscillator as
RTC
11% Duty Cycle
1.7
I3CHOORC
µA
50% Duty Cycle
3.45
Current Consumption in
standard listening mode with
three active channels and
crystal oscillator as RTC
I3CHXT
IDATA
6.5
8.9
12
µA
µA
Current Consumption in
Preamble detection / Pattern
correlation / Data receiving
mode (RC-oscillator)
With 125 kHz carrier frequency and 1kbps
data-rate. No load on the output pins.
8.3
Input Sensitivity
With 125 kHz carrier frequency, chip in default
mode, 4 half bits burst + 4 symbols preamble
and single preamble detection
Input Sensitivity on all
channels
SENS
100
µVrms
µs
Channel Settling Time
TSAMP
Amplifier settling time
250
Crystal Oscillator
FXTAL
Frequency
Start-up Time
Crystal dependent
Crystal dependent
32.768
kHz
s
TXTAL
1
IXTAL
Current consumption
1
1
µA
External Clock Source
IEXTCL
RC Oscillator
FRCNCAL
Current consumption
µA
Frequency
Frequency
If no calibration is performed
27
31
32.768
32.768
42
kHz
kHz
If calibration with 32.768 kHz reference signal
is performed
FRCCAL32
34.5
Maximum achievable frequency after
calibration
FRCCALMAX
FRCCALMIN
Frequency
Frequency
35
30
kHz
kHz
Minimum achievable frequency after calibration
Periods of
reference
clock
TCALRC
IRC
Calibration time
65
Current consumption
200
nA
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AS3932
Datasheet - Typical Operating Characteristics
7 Typical Operating Characteristics
Figure 6. Sensitivity over Voltage and Temperature
Figure 7. Sensitivity over RSSI
1000000
120
95 o
C
C
100000
10000
1000
100
100
80
60
40
20
0
27 o
-40 o
C
10
1
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
2.4
3
Supply Voltage [V]
3.6
RSSI [dB]
Figure 8. RC-Osc Frequency over Voltage (calibr.)
Figure 9. RC-Osc Frequency over Temperature (calibr.)
34.5
34.5
34
34
33.5
33
33.5
33
32.5
32
32.5
32
31.5
31
31.5
31
-36 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
2.4
2.6
2.8
3
3.2
3.4
3.6
Operating Temperature [oC]
Supply Voltage [V]
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AS3932
Datasheet - Detailed Description
8 Detailed Description
The AS3932 is a three-dimensional low power low-frequency wake-up receiver. The AS3932 is capable to detect the presence of an inductive
coupled carrier and extract the envelope of the On-Off-Keying (OOK) modulated carrier. In case the carrier is Manchester coded the clock is
recovered from the transmitted signal and the data can be correlated with a programmed pattern. If the detected pattern corresponds to the
stored one a wake-up signal (IRQ) is risen up. The pattern correlation can be bypassed in which case the wake-up detection is based only on the
frequency detection.
The AS3932 is made up by three independent receiving channels, one envelop detector, one data correlator, 8 programmable registers with the
main logic and a real time clock.
The digital logic can be accessed by an SPI. The real time clock can be based on a crystal oscillator or on an internal RC one. If the internal RC
oscillator is used, a calibration procedure can be performed to improve its accuracy.
Figure 10. Block Diagram of LF Wake-up Receiver AS3932
AS3932
Wake-up
IRQ
SCL
Data
Channel
Amplifier 1
RSSI
SDI
Main Logic
SPI
LF1P
SDO
CS
Freq. OK
Channel
Selector
Envelope Detector /
Data Slicer
Data
Correlator
Channel
Amplifier 2
RSSI
LF2P
Freq. OK
DAT
Data
Channel
Amplifier 3
RSSI
LF3P
LFN
I/V
Bias
Freq. OK
RC RTC
Xtal RTC
GND
VCC
Xin
Xout
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AS3932
Datasheet - Detailed Description
AS3932 needs the following external components:
Power supply capacitor - CBAT – 100 nF
32.768 kHz crystal with its two pulling capacitors – XTAL and CL – (it is possible to omit these components if the internal RC oscillator is
used instead of the crystal oscillator).
One, two, or three LC resonators according to the number of used channels.
In case the internal RC-oscillator is used (no crystal oscillator is mounted), the pin XIN has to be connected to the supply, while pin XOUT should
stay floating. Application diagrams with and without crystal are shown in Figure 1 and Figure 2
8.1 Operating Modes
8.1.1 Power Down Mode
In Power Down Mode AS3932 is completely switched off. The typical current consumption is 400 nA.
8.1.2 Listening Mode
In listening mode only the active channel amplifiers and the RTC are running. In this mode the system detects the presence of a carrier. In case
the carrier is detected the RSSI can be displayed.
If the three dimensional detection is not required it is possible to deactivate one or more channels. In case only two channels are required the
deactivated channel must be the number two, while if only one channel detection is needed the active channel must be the number one.
Inside this mode it is possible to distinguish the following three sub modes:
Standard Listening mode. All channels are active at the same time
Scanning mode (Low Power mode 1). All used channels are active, but only one per time slot, where the time slot T is defined as 1ms.
Thus, if all three channels are active the procedure is as follows (see Figure 11): for the first millisecond only channel one is active while channel
two and three are powered down; for the next millisecond only channel three is active while channel one and two are powered down; finally,
channel two is active while the other two are deactivated. This channel rotation goes on until the presence of the carrier is detected by any of the
channels; then immediately all three channels will become active at the same time. Now AS3932 can perform a simultaneous multidirectional
evaluation (on all three channels) of the field and evaluate which channel has the strongest RSSI. The channel with the highest RSSI will be put
through to the demodulator. In this way it is possible to perform multidirectional monitoring of the field with a current consumption of a single
channel, keeping the sensitivity as good as if all channels are active at the same time.
Figure 11. Scanning Mode
Channel 1
Channel 3
time
Channel 2
time
Presence
of carrier
time
t 0 + 5 T
t 0
t 0 + T
t 0 + 2 T
t 0 + 3 T
t 0 + 4 T
t 1
time
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AS3932
Datasheet - Detailed Description
ON/OFF mode (Low Power mode 2). All active channels are on at the same time but not for the whole time (time slot T is defined as 1ms).
An on-off duty-ratio is defined. This duty ratio is programmable see R4<7:6>.
Figure 12. ON/OFF Mode
Channel 1
Channel 2
time
Channel 3
time
Presence
of carrier
time
3 *t 0
t 0
t 0 + T
2 *t 0
2 *t 0 + T
time
For each of these sub modes it is possible to enable a further feature called Artificial Wake-up. The Artificial Wake-up is a counter based on the
used RTC. Three bits define a time window see R8<2:0>. If no activity is seen within this time window the chip will produce an interrupt on the
WAKE pin that lasts 128 µs. With this interrupt the microcontroller (µC) can get feedback on the surrounding environment (e.g. read the false
wake-up register R13<7:0>) and/or take actions in order to change the setup.
8.1.3 Preamble Detection / Pattern Correlation
The preamble detection and pattern correlation are only considered for the wake-up when the data correlator function is enabled (see R1<1>).
The correlator searches first for preamble frequency (constant frequency of Manchester clock defined according to bit-rate transmission, see
Table 19) and then for data pattern.
If the pattern is matched the wake-up interrupt is displayed on the WAKE output and the chip goes in Data receiving mode. If the pattern fails the
internal wake-up (on all active channels) is terminated and no IRQ is produced.
8.1.4 Data Receiving
After a successful wake-up the chip enters the data receiving mode. In this mode the chip can be retained a normal OOK receiver. The received
data are streamed out on the pin DAT. It is possible to put the chip back to listening mode either with a direct command (CLEAR_WAKE (see
Table 12)) or by using the timeout feature. This feature automatically sets the chip back to listening mode after a certain time R7<7:5>.
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AS3932
Datasheet - Detailed Description
8.2 System and Block Specification
8.2.1 Register Table
Table 6. Register Table
7
6
5
4
3
2
1
0
R0
R1
n.a.
MUX_123
ATT_ON
EN_A2
EN_A3
EN_PAT2
EN_A1
PWD
ON_OFF
ABS_HY
S_ABSH
HY_20m
AGC_TLIM
AGC_UD
EN_WPAT
EN_RTC
R2
W_PAT_T<1:0>
HY_POS
Reserved
S_WU1<1:0>
R3
FS_SLC<2:0>
FS_ENV<2:0>
R4
T_OFF<1:0>
R_VAL<1:0>
GR<3:0>
R5
TS2<7:0>
TS1<7:0>
R6
R7
T_OUT<2:0>
T_HBIT<4:0>
R8
n.a.
T_AUTO<2:0>
R9
n.a.
Reserved
R10
R11
R12
R13
n.a.
n.a.
n.a.
RSSI1<4:0>
RSSI3<4:0>
RSSI2<4:0>
F_WAKE
8.2.2 Register Table Description and Default Values
Table 7. Default Values of Registers
Default
Register
Name
Type
Description
Value
R0<5>
R0<4>
R0<3>
R0<2>
R0<1>
R0<0>
R1<7>
R1<6>
R1<5>
R1<4>
R1<2>
R1<1>
R1<0>
R2<7>
R2<6:5>
R2<4:2>
R2<1:0>
ON_OFF
MUX_123
EN_A2
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
On/Off operation mode. (Duty-cycle defined in the register R4<7:6>
Scan mode enable
1
Channel 2 enable
EN_A3
1
Channel 3 enable
EN_A1
1
Channel 1 enable
PWD
0
Power down
ABS_HY
AGC_TLIM
AGC_UD
ATT_ON
EN_PAT2
EN_WPAT
EN_RTC
S_ABSH
W_PAT
0
Data slicer absolute reference
AGC acting only on the first carrier burst
AGC operating in both direction (up-down)
Antenna damper enable
0
1
0
0
Double wake-up pattern correlation
Data correlation enable
1
1
Crystal oscillator enable
0
Data slicer threshold reduction
Pattern correlation tolerance (see Table 20)
Reserved
00
000
00
Reserved
S_WU1
R/W
Tolerance setting for the stage wake-up (see Table 14)
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AS3932
Datasheet - Detailed Description
Table 7. Default Values of Registers
Default
Value
Register
R3<7>
Name
Type
R/W
R/W
Description
Data slicer hysteresis
HY_20m
HY_POS
0
0
if HY_20m = 0 then comparator hysteresis = 40mV
if HY_20m = 1 then comparator hysteresis = 20mV
Data slicer hysteresis on both edges (HY_POS = 0 → hysteresis on both
edges; HY_POS = 1 → hysteresis only on positive edges)
R3<6>
R3<5:3>
R3<2:0>
FS_SCL
FS_ENV
R/W
R/W
100
000
Data slicer time constant (see Table 18)
Envelop detector time constant (see Table 17)
Off time in ON/OFF operation mode
T_OFF=00
T_OFF=01
1ms
2ms
4ms
8ms
R4<7:6>
T_OFF
R/W
00
T_OFF=10
T_OFF=11
R4<5:4>
R4<3:0>
D_RES
GR
R/W
R/W
01
Antenna damping resistor (see Table 16)
Gain reduction (see Table 15)
0000
2nd Byte of wake-up pattern
R5<7:0>
R6<7:0>
TS2
TS1
R/W
R/W
01101001
10010110
1st Byte of wake-up pattern
Automatic time-out (see Table 21)
Bit rate definition (see Table 19)
Artificial wake-up
T_AUTO=000
R7<7:5>
R7<4:0>
T_OUT
T_HBIT
R/W
R/W
000
01011
No artificial wake-up
1 sec
T_AUTO=001
T_AUTO=010
5 sec
R8<2:0>
T_AUTO
R/W
000
T_AUTO=011
20 sec
T_AUTO=100
2 min
T_AUTO=101
15min
T_AUTO=110
1 hour
T_AUTO=111
2 hour
R9<6:0>
R10<4:0>
R11<4:0>
R12<4:0>
R13<7:0>
Reserved
RSSI1
000000
Reserved
R
R
R
R
RSSI channel 1
RSSI2
RSSI channel 2
RSSI3
RSSI channel 3
F_WAK
False wake-up register
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AS3932
Datasheet - Detailed Description
8.2.3 Serial Data Interface (SDI)
This 4-wires interface is used by the Microcontroller (µC) to program the AS3932. The maximum clock frequency of the SDI is 2MHz.
Table 8. Serial Data Interface (SDI) pins
Name
Signal
Signal Level
Description
CS
Digital Input with pull down
CMOS
Chip Select
Serial Data input for writing registers, data to
transmit and/or writing addresses to select
readable register
SDI
Digital Input with pull down
CMOS
Serial Data output for received data or read
value of selected registers
SDO
Digital Output
CMOS
CMOS
SCLK
Digital Input with pull down
Clock for serial data read and write
Note: SDO is set to tristate if CS is low. In this way more than one device can communicate on the same SDO bus.
SDI Command Structure. To program the SDI the CS signal has to go high. A SDI command is made up by a two bytes serial command and
the data is sampled on the falling edge of SCLK. The Table 9 shows how the command looks like, from the MSB (B15) to LSB (B0). The
command stream has to be sent to the SDI from the MSB (B15) to the LSB (B0).
Table 9. SDI Command Structure
Mode
B15 B14
Register address / Direct Command
B12 B11 B10 B9
Register Data
B4 B3
B13
B8
B7
B6
B5
B2
B1
B0
The first two bits (B15 and B14) define the operating mode. There are three modes available (write, read, direct command) plus one spare (not
used), as shown in Table 10.
Table 10. SDI Command Structure
B15
0
B14
0
Mode
WRITE
0
1
READ
1
0
NOT ALLOWED
DIRECT COMMAND
1
1
In case a write or read command happens the next 6 bits (B13 to B8) define the register address which has to be written respectively read, as
shown in Table 11.
Table 11. SDI Command Structure
B13
0
B12
0
B11
0
B10
0
B9
0
B8
0
Read/Write register
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
1
1
0
0
0
1
0
0
0
0
0
1
0
1
0
0
0
1
1
0
0
0
0
1
1
1
0
0
1
0
0
0
0
0
1
0
0
1
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Datasheet - Detailed Description
Table 11. SDI Command Structure
B13
0
B12
0
B11
1
B10
0
B9
1
B8
0
Read/Write register
R10
R11
R12
R13
0
0
1
0
1
1
0
0
1
1
0
0
0
0
1
1
0
1
The last 8 bits are the data that has to be written respectively read. A CS toggle high-low-high terminates the command mode.
If a direct command is sent (B15-B14=11) the bits from B13 to B8 defines the direct command while the last 8 bits are omitted. The Table 12
shows all possible direct commands:
Table 12. List of Direct Commands
COMMAND_MODE
clear_wake
B13
0
B12
0
B11
0
B10
0
B9
0
B8
0
reset_RSSI
0
0
0
0
0
1
trim_osc
0
0
0
0
1
0
clear_false
0
0
0
0
1
1
preset_default
0
0
0
1
0
0
All direct commands are explained below:
- clear_wake: clears the wake state of the chip. In case the chip has woken up (WAKE pin is high) the chip is set back to listening mode
- reset_RSSI: resets the RSSI measurement.
- trim_osc: starts the trimming procedure of the internal RC oscillator (see Figure 21)
- clear_false: resets the false wake-up register (R13<7:0>=00)
- preset_default: sets all register in the default mode, as shown in Figure 7
Writing of Data to Addressable Registers (WRITE Mode). The SDI is sampled at the falling edge of SCLK (as shown in the following
diagrams).
A CS toggling high-low-high indicates the end of the WRITE command after register has been written. The following example shows a write
command.
Figure 13. Writing of a Single Byte (falling edge sampling)
CS
SCLK
X
X
0
0
A5
A4
A3
A2
A1
SCLK
A0
D7
D6
D5
D4
D3
D2
D1
D0
SDI
CS falling
edge signals
end of
SCLK rising
edge Data is
transfered from
µC
Data is moved
to Address
A5-A0
Two leading
Zeros indicate
WRITE Mode
falling edge
Data is
WRITE Mode
sampled
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Datasheet - Detailed Description
Figure 14. Writing of Register Data with Auto-incrementing Address
CS
SCLK
A A A A A A D D D D D D D D D D D D D D D D D D
5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6
D D D D D D D D D D
1 0 7 6 5 4 3 2 1 0
X
X
0 0
SDI
CS falling
edge signals
end of
Two leading
Zeros indicate
WRITE Mode
Data is moved
to Address
<A5-A0 >
Data is moved
to Address
<A5-A0 > +1
Data is moved
Data is moved
to Address
<A5-A0 > +n
to Address
<A5-A0 > + (n-1)
WRITE Mode
Reading of Data from Addressable Registers (READ Mode). Once the address has been sent through SDI, the data can be fed
through the SDO pin out to the microcontroller.
A CS LOW toggling high-low-high has to be performed after finishing the read mode session, in order to indicate the end of the READ command
and prepare the Interface to the next command control Byte.
To transfer bytes from consecutive addresses, SDI master has to keep the CS signal high and the SCLK clock has to be active as long as data
need to be read.
Figure 15. Reading of Single Register Byte
CS
SCLK
X
X
0
1
A5
A4
A3
A2
A1
A0
SDI
SDO
X
X
D7
D6
D5
D4
D3
D2
D1
D0
SCLK rising
edge Data is
moved from
Address
SCLK rising
edge Data is
transfered from
µC
SCLK falling
edge Data is
transfered to
µC
CS falling
edge signals
end of READ
Mode
SCLK
01 pattern
indicates
READ Mode
falling edge
Data is
sampled
<A5-A0>
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AS3932
Datasheet - Detailed Description
Figure 16. Send Direct COMMAND Byte
CS
SCLK
X
X
1
1
C5
C4
C3
C2
SCLK
falling edge
Data is
sampled
C
C0
SDI
1
Two leading
ONE indicate
COMMAND
Mode
SCLK rising
edge Data is
transfered from
µC
CS falling edge
signals the end of
COMMAND Mode
8.2.4 SDI Timing
Table 13. SDI Timing Parameters
Symbol
TCSCLK
TDCLK
THCL
Parameter
Conditions
Min
Typ
Max
Units
ns
Time CS to Sampling Data
Time Data to Sampling Data
SCLK High Time
500
300
200
1
ns
ns
TCLK
SCLK period
µs
Time Sampling Data to CS
down
TCLKCS
TCST
500
500
ns
ns
CS Toggling time
Figure 17. SDI Timing Diagram
TCST
CS
t
t
TCSCLK
SPI
TDCLK
THCL
SCLK
TCLKCS
t
TCLK
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AS3932
Datasheet - Detailed Description
8.3 Channel Amplifier and Frequency Detector
Each of the 3 channels consists of a variable gain amplifier, an automatic gain control and a frequency detector. The latter detects the presence
of a carrier. As soon as the carrier is detected the AGC is enabled, the gain of the VGA is reduced and set to the right value and the RSSI can be
displayed.
It is possible to enable/disable individual channels, in case not all three channels are needed. This enables to reduce the current consumption by
1.5 µA (typ.) per channel.
8.3.1 Frequency Detector / AGC
The frequency detection uses the RTC as time base. In case the internal RC oscillator is used as RTC, it must be calibrated, but the calibration
is guaranteed for a 32.768 kHz crystal oscillator only. The frequency detection criteria can be tighter or more relaxed according to the setup
described in R2<1:0> (see Table 14).
Table 14. Tolerance Settings for Wake-up
R2<1>
R2<0>
Tolerance
relaxed
0
0
1
1
0
1
0
1
tighter (medium)
stringent
reserved
The AGC can operate in two modes:
AGC down only (R1<5>=0)
AGC up and down (R1<5>=1)
As soon as the AGC starts to operate, the gain in the VGA is set to maximum. If the AGC down only mode is selected, the AGC can only
decrease the gain. Since the RSSI is directly derived from the VGA gain, the system holds the RSSI peak.
When the AGC up and down mode is selected, the RSSI can follow the input signal strength variation in both directions.
Regardless which AGC operation mode is used, the AGC needs maximum 35 carrier periods to settle.
The RSSI is available for all 3 channels at the same time and it is stored in 3 registers (R10<4:0>, R11<4:0>, R12<4:0>)
Both AGC modes (only down or down and up) can also operate with time limitation. This option allows AGC operation only in time slot of 256µs
following the internal wake-up. Then the AGC (RSSI) is frozen till the wake-up or RSSI reset occurs.
The RSSI is reset either with the direct command 'clear_wakeup' or 'reset_RSSI'. The 'reset_RSSI' command resets only the AGC setting but
does not terminate wake-up condition. This means that if the signal is still present the new AGC setting (RSSI) will appear not later than 300µs
(35 LF carrier periods) after the command was received. The AGC setting is reset if for duration of 3 Manchester half symbols no carrier is
detected. If the wake-up IRQ is cleared the chip will go back to listening mode.
In case the maximum amplification at the beginning is a drawback (e.g. in noisy environment) it is possible to set a smaller starting gain on the
amplifier, according to the Table 15. In this way it is possible to reduce the false frequency detection.
Table 15. Bit Setting of Gain Reduction
R4<3>
R4<2>
R4<1>
R4<0>
0
Gain reduction
no gain reduction
n.a.
0
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
1
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
0 or 1
n.a.
-4dB
-8dB
-12dB
-16dB
-20dB
-24dB
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AS3932
Datasheet - Detailed Description
8.3.2 Antenna Damper
The antenna damper allows the chip to deal with higher field strength, it is enabled by register R1<4>. It consists of shunt resistors which
degrade the quality factor of the resonator by reducing the signal at the input of the amplifier. In this way the resonator sees a smaller parallel
resistance (in the band of interest) which degrades its quality factor in order to increase the linear range of the channel amplifier (the amplifier
doesn't saturate in presence of bigger signals). Table 16 shows the bit setup.
Table 16. Antenna Damper Bit Setup
R4<5>
R4<4>
Shunt resistor (parallel to the resonator at 125 kHz)
0
0
1
1
0
1
0
1
1 kΩ
3 kΩ
9 kΩ
27 kΩ
8.4 Channel Selector / Demodulator / Data Slicer
When at least one of three gain channel enters initial wake-up state the channel selector makes a decision which gain channel to connect to the
envelope detector. If only one channel is in wake-up state the selection is obvious. If more than one channel enters wake-up state in 256µs
following the first active channel the channel with highest RSSI value is selected. The output signal (amplified LF carrier) of selected channel is
connected to the input of the demodulator.
The performance of the demodulator can be optimized according to bit rate and preamble length as described in Table 17 and Table 18.
Table 17. Bit Setup for the Envelop Detector for Different Symbol Rates
R3<2>
R3<1>
R3<0>
Symbol rate [Manchester symbols/s]
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
4096
2184
1490
1130
910
762
655
512
If the bit rate gets higher the time constant in the envelop detector must be set to a smaller value. This means that higher noise is injected
because of the wider band. The next table is a rough indication of how the envelop detector looks like for different bit rates. By using proper data
slicer settings it is possible to improve the noise immunity paying the penalty of a longer preamble. In fact if the data slicer has a bigger time
constant it is possible to reject more noise, but every time a transmission occurs, the data slicer need time to settle. This settling time will
influence the length of the preamble. Table 18 gives a correlation between data slicer setup and minimum required preamble length.
Table 18. Bit Setup for the Data Slicer for Different Preamble Length
R3<5>
R3<4>
R3<3>
Minimum preamble length [ms]
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0.8
1.15
1.55
1.9
2.3
2.65
3
3.5
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Datasheet - Detailed Description
Note: These times are minimum required, but it is recommended to prolong the preamble.
The comparator of the data slicer can work only with positive or with symmetrical threshold (R3<6>). In addition the threshold can be 20 or 40
mV (R3<7>)
In case the length of the preamble is an issue the data slicer can also work with an absolute threshold (R1<7>). In this case the bits R3<2:0>
would not influence the performance. It is even possible to reduce the absolute threshold in case the environment is not particularly noisy
(R2<7>).
8.5 Correlator
After frequency detection the data correlation is only performed if the correlator is enabled (R1<1>=1).
The data correlation consists of checking the presence of a preamble (ON/OFF modulated carrier) followed by a certain pattern.
After the frequency detection the correlator waits 16 bits (see bit rate definition in Table 19) and if no preamble is detected the chip is set back to
listening mode and the false wake-up register (R13<7:0>) is incremented by one.
To get started with the pattern correlation the correlator needs to detect at least 4 bits of the preamble (ON/OFF modulated carrier).
The bit duration is defined in the register R7<4:0> according to the Table 19 as function of the Real Time Clock (RTC) periods.
Table 19. Bit Rate Setup
Bit duration in RTC
clock periods
Symbol rate (Manchester
symbols/s)
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
Bit rate (bits/s)
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
4
8192
6552
5460
4680
4096
3640
3276
2978
2730
2520
2340
2184
2048
1926
1820
1724
1638
1560
1488
1424
1364
1310
1260
1212
1170
1128
4096
3276
2730
2340
2048
1820
1638
1489
1365
1260
1170
1092
1024
963
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
910
862
819
780
744
712
682
655
630
606
585
564
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Datasheet - Detailed Description
Table 19. Bit Rate Setup
Bit duration in RTC
clock periods
Symbol rate (Manchester
symbols/s)
R7<4>
R7<3>
R7<2>
R7<1>
R7<0>
Bit rate (bits/s)
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
30
31
32
1092
1056
1024
546
528
512
If the preamble is detected correctly the correlator keeps searching for a data pattern. The duration of the preamble plus the pattern should not
be longer than 40 bits (see bit rate definition in Table 19). The data pattern can be defined by the user and consists of two bytes which are stored
in the registers R5<7:0> and R6<7:0>. The two bytes define the pattern consisting of 16 half bit periods. This means the pattern and the bit
period can be selected by the user. The only limitation is that the pattern (in combination with preamble) must obey Manchester coding and
timing. It must be noted that according to Manchester coding a down-to-up bit transition represents a symbol "0", while a transition up-to-down
represents a symbol "1". If the default code is used (96 [hex]) the binary code is (10 01 01 10 01 10 10 01). MSB has to be transmitted first.
The user can also select (R1<2>) if single or double data pattern is used for wake-up. In case double pattern detection is set, the same pattern
has to be repeated 2 times.
Additionally it is possible to set the number of allowed missing zero bits (not symbols) in the received bitstream (R2<6:5>), as shown in the
Table 20.
Table 20. Allowed Pattern Detection Errors
R2<6>
R2<5>
Maximum allowed error in the pattern detection
No error allowed
0
0
1
1
0
1
0
1
1 missed zero
2 missed zeros
3 missed zeros
If the pattern matches the wake-up, interrupt is displayed on the WAKE output.
If the pattern detection fails, the internal wake-up (on all active channels) is terminated with no signal sent to MCU and the false wake-up register
will be incremented (R13<7:0>).
8.6 Wake-up Protocol - Carrier Frequency 125 kHz
The wake-up state is terminated with the direct command ‘clear_wake’ Table 12. This command terminates the MCU activity. The termination
can also be automatic in case there is no response from MCU. The time out for automatic termination is set in a register R7<7:5>, as shown in
the Table 21.
Table 21. Timeout Setup
R7<7>
R7<6>
R7<5>
Time out
0 sec
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
50 msec
100 msec
150 msec
200 msec
250 msec
300 msec
350 msec
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Datasheet - Detailed Description
8.6.1 Without Pattern Detection
Figure 18. Wake-up Protocol Overview without Pattern Detection (only carrier frequency detection)
Carrier Burst
Data
Carrier Burst > 550 us
DAT
WAKE
Clear_wake
In case the data correlation is disabled (R1<1>=0) the AS3932 wakes up upon detection of the carrier frequency only as shown in Figure 18. In
order to ensure that AS3932 wakes up the carrier burst has to last longer than 550 µs. To set AS3932 back to listening mode there are two
possibilities: either the microcontroller sends the direct command clear_wake via SDI or the time out option is used (R7<7:5>). In case the latter
is chosen, AS3932 is automatically set to listening mode after the time defined in T_OUT (R7<7:5>), counting starts at the low-to-high WAKE
edge on the WAKE pin.
8.6.2 Single Pattern Detection
The Figure 19 shows the wake-up protocol in case the pattern correlation is enabled (R1<1>=1) for a 125 kHz carrier frequency. The initial
carrier burst has to be longer than 550 µs and can last maximum 16 bits (see bit rate definition in Table 19). If the ON/OFF mode is used
(R1<5>=1), the minimum value of the maximum carrier burst duration is limited to 10 ms. This is summarized in Table 22. In case the carrier
burst is too long the internal wake-up will be set back to low and the false wake-up counter (R13<7:0>) will be incremented by one. The carrier
burst must be followed by a preamble (0101... modulated carrier with a bit duration defined in Table 19) and the wake-up pattern stored in the
registers R5<7:0> and R6<7:0>. The preamble must have at least 4 bits and the preamble duration together with the pattern should not be
longer than 40 bits. If the wake-up pattern is correct, the signal on the WAKE pin goes high one bit after the end of the pattern and the data
transmission can get started. To set the chip back to listening mode the direct command clear_wake, as well as the time out option (R7<7:5>)
can be used.
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Datasheet - Detailed Description
Figure 19. Wake-up Protocol Overview with Single Pattern Detection
Carrier Burst
Preamble
Pattern
Data
1 bit Preamble
1 bit Preamble
Carrier Burst > 550 µs
Preamble > 4 bit duration
Carrier Burst < 16 bit duration
Preamble + Pattern < 40 bit duration
DAT
WAKE
Clear_wake
Table 22. Preamble Requirements in Standard Mode, Scanning Mode and ON/OFF Mode
Maximum duration of the carrier burst in Standard Maximum duration of the carrier burst in ON/OFF Mode
Bit rate (bit/s)
Mode and Scanning Mode (ms)
(ms)
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
8192
6552
5460
4680
4096
3640
3276
2978
2730
2520
2340
2184
2048
1926
1820
1724
1638
1.95
2.44
2.93
3.41
3.90
4.39
4.88
5.37
5.86
6.34
6.83
7.32
7.81
8.30
8.79
9.28
9.76
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Datasheet - Detailed Description
Table 22. Preamble Requirements in Standard Mode, Scanning Mode and ON/OFF Mode
Maximum duration of the carrier burst in Standard Maximum duration of the carrier burst in ON/OFF Mode
Bit rate (bit/s)
Mode and Scanning Mode (ms)
(ms)
10.25
10.75
11.23
11.73
12.21
12.69
13.20
13.67
14.18
14.65
15.15
15.62
1560
1488
1424
1364
1310
1260
1212
1170
1128
1092
1056
1024
10.25
10.75
11.23
11.73
12.21
12.69
13.20
13.67
14.18
14.65
15.15
15.62
8.7 False Wake-up Register
The wake-up strategy in the AS3932 is based on 2 steps:
1. Frequency Detection: in this phase the frequency of the received signal is checked.
2. Pattern Correlation: here the pattern is demodulated and checked whether it corresponds to the valid one.
If there is a disturber or noise capable to overcome the first step (frequency detection) without producing a valid pattern, then a false wake-up call
happens.Each time this event is recognized a counter is incremented by one and the respective counter value is stored in a memory cell (false
wake-up register). Thus, the microcontroller can periodically look at the false wake-up register, to get a feeling how noisy the surrounding
environment is and can then react accordingly (e.g. reducing the gain of the LNA during frequency detection, set the AS3932 temporarily to
power down etc.), as shown in the Figure 20. The false wake-up counter is a useful tool to quickly adapt the system to any changes in the noise
environment and thus avoid false wake-up events.
Most wake-up receivers have to deal with environments that can rapidly change. By periodically monitoring the number of false wake-up events
it is possible to adapt the system setup to the actual characteristics of the environment and enables a better use of the full flexibility of AS3932.
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Revision 1.7
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AS3932
Datasheet - Detailed Description
Figure 20. Concept of the False Wake-up Register together with the system
Wakeup
Level 1
Wakeup
Level 2
Pattern Correlator
WAKE
Frequency Detector
Unsuccessful
pattern
correlation
False wakeup
register
Register Setup
READ FALSE WAKEUP REGISTER
Microcontroller
8.8 Real Time Clock (RTC)
The RTC can be based on a crystal oscillator (R1<0>=1), the internal RC-oscillator (R1<0>=0), or an external clock source (R1<0>=1). The
crystal oscillator has higher precision of the frequency with higher current consumption and needs three external components (crystal plus two
capacitors). The RC-oscillator is completely integrated and can be calibrated if a reference signal is available for a very short time to improve the
frequency accuracy. The calibration gets started with the trim_osc direct command. Since no non-volatile memory is available the calibration
must be done every time after the RCO is turned off. The RCO is turned off when the chip is in power down mode, a POR happened, or the
crystal oscillator is enabled. Since the RTC defines the time base of the frequency detection, the selected frequency (frequency of the crystal
oscillator or the reference frequency used for calibration of the RC oscillator) should be about one forth of the carrier frequency:
FRTC ~ FCAR * 0.25
Where: FCAR is the carrier frequency and FRTC is the RTC frequency
The third option for the RTC is the use of an external clock source, which must be applied directly to the XIN pin (XOUT floating).
(EQ 1)
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AS3932
Datasheet - Detailed Description
8.8.1 Crystal Oscillator
Table 23. Characteristics of XTAL
Symbol
Parameter
Conditions
Min
Typ
Max
±120
60
Units
Crystal accuracy
(initial)
Overall accuracy
p.p.m.
Crystal motional resistance
Frequency
KΩ
32.768
±5
kHz
Contribution of the oscillator to the
frequency error
p.p.m
Start-up Time
Duty cycle
Crystal dependent
1
50
1
s
45
55
%
Current consumption
µA
8.8.2 RC-Oscillator
Table 24. Characteristics of RCO
Symbol
Parameter
Conditions
Min
Typ
Max
Units
If no calibration is performed
If calibration is performed
Periods of reference clock
27
31
32.768
32.768
42
34.5
65
kHz
kHz
Frequency
Calibration time
cycles
nA
Current consumption
200
To trim the RC-Oscillator, set the chip select (CS) to high before sending the direct command trim_osc over SDI. Then 65 digital clock cycles of
the reference clock (e.g. 32.768 kHz) have to be sent on the clock bus (SCLK), as shown in Figure 21. After that the signal on the chip select
(CS) has to be pulled down.
The calibration is effective after the 65th reference clock edge and it will be stored in a volatile memory. In case the RC-oscillator is switched off
or a power-on-reset happens (e.g. battery change) the calibration has to be repeated.
Figure 21. RC-Oscillator Calibration via SDI
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AS3932
Datasheet - Detailed Description
8.8.3 External Clock Source
To clock the AS3932 with an external signal the crystal oscillator has to be enabled (R1<0>=1). As shown in the Figure 3 the clock must be
applied on the pin XIN while the pin XOUT must stay floating. The RC time constant has to be 15µs with a tolerance of ±10% (e.g. R=680 kΩ
and C=22pF). In the Table 25 the clock characteristics are summarized.
Table 25. Characteristics of External Clock
Symbol
VI
Parameter
Low level
Conditions
Min
0
Typ
Max
Units
V
0.1 * VDD
Vh
High level
0.9 * VDD
VDD
3
V
Tr
Rise-time
µs
µs
µs
Tf
Fall-time
3
T = RC
RC Time constant
13.5
15
16.5
Note: In power down mode the external clock has to be set to VDD.
8.9 Channel Selection in Scanning Mode and ON/OFF Mode
In case only 2 channels are active and one of the Low Power modes is enabled, then the channels 1 and 3 have to be active. If the chip works in
On-Off mode and only one channel is active then the active channel has to be the channel 1.
Both Low Power modes are not allowed to be enabled at the same time.
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AS3932
Datasheet - Package Drawings and Markings
9 Package Drawings and Markings
The product is available in a 16-pin TSSOP package.
Figure 22. Drawings and Dimensions
AS3932 @
YYWWMZZ
Notes:
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
Symbol
R
Min
Nom
Max
Symbol
Min
-
Nom
Max
1.20
0.15
1.05
0.30
0.20
5.10
-
0.09
-
-
-
-
A
A1
A2
b
-
R1
0.09
0.05
0.80
0.19
0.09
4.90
-
-
1.00
S
0.20
-
-
θ1
θ2
θ3
aaa
bbb
ccc
ddd
N
0º
-
-
8º
-
-
12 REF
12 REF
0.10
0.10
0.05
0.20
16
c
-
-
-
D
5.00
-
-
E
6.40 BSC
4.40
-
-
E1
e
4.30
-
4.50
-
-
-
0.65 BSC
0.60
-
-
L
0.45
-
0.75
-
L1
1.00 REF
Marking: YYWWMZZ.
YY
WW
Manufacturing Week
M
ZZ
@
Year (i.e. 10 for 2010)
Assembly plant identifier
Assembly traceability code
Sublot identifier
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AS3932
Datasheet - Package Drawings and Markings
The product is available in a 16LD QFN (4x4) package.
Figure 23. Drawings and Dimensions
AS3932
YYWWXZZ
@
Symbol
A
Min
0.80
0
Nom
0.90
Max
1.00
0.05
A1
A3
L
0.02
0.20 REF
0.50
0.40
0
0.60
0.15
0.35
L1
b
-
0.25
0.30
D
4.00 BSC
4.00 BSC
0.65 BSC
2.40
E
e
D2
E2
aaa
bbb
ccc
ddd
eee
fff
2.30
2.50
Notes:
2.30
2.40
2.50
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
-
-
-
-
-
-
0.15
-
-
-
-
-
-
2. All dimensions are in millimeters. Angles are in degrees.
0.10
3. Dimension b applies to metallized terminal and is measured between 0.25mm
and 0.30mm from terminal tip. Dimension L1 represents terminal full back from
package edge up to 0.15mm is acceptable.
0.10
0.05
0.08
4. Coplanarity applies to the exposed heat slug as well as the terminal.
5. Radius on terminal is optional.
0.10
N
16
6. N is the total number of terminals.
Marking: YYWWXZZ.
YY
WW
X
ZZ
Assembly traceability code
@
Year (i.e. 10 for 2010) Manufacturing Week
Assembly plant identifier
Sublot identifier
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Revision 1.7
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AS3932
Datasheet - Revision History
Revision History
Table 26. Revision History
Revision
1.0
Date
Owner
Description
Feb 12, 2009
Feb 24, 2009
Table 27 (Ordering information), -Z removed from part numbers
1.0a
New figure inserted Figure 2 on page 2, all subsequent chapters and page numbers are
therefore incremented by one
1.1
Apr 2, 2009
Default Values of RegistersTable 7, default value of R4<3:0> corrected
Bit Setting of Gain ReductionTable 15, stepsize of gain reduction increased to -4dBm
Description of external components on page 12 updated
esn
1.11
1.12
Apr 22, 2009
May 25, 2009
Update of Section 10 Ordering Information on page 33
Updated Wake-up Protocol - Carrier Frequency 125 kHz 8.6 and description of Section
8.8.2 RC-Oscillator on page 28
1.13
Jul 13, 2009
Updated Key Features for External Clock
Added Figure 3 AS3932 Typical Application Diagram with Clock from External Source
Added External Clock Source in Electrical System SpecificationsTable 5
1.2
Oct 13, 2009
Deleted table Minimum duration of carrier burst in ON/OFF mode (Manchester decoder
enabled)
Updated Real Time Clock (RTC) 8.8 with External Clock
Added External Clock Source 8.8.3
mrh
Added a new section SDI Timing 8.2.4
Updated R11 and R12 in Table 7
1.3
1.4
Mar 25, 2010
Sep 21, 2010
Mar 04, 2011
Updated clock frequency of SDI to 2MHz in Serial Data Interface (SDI) 8.2.3
Updated time constant of RC filter in External Clock Source 8.8.3
Updated Figure 19 and Figure 8.7
Updated General Description, Key Features, Figure 1, Figure 2, Figure 3, Figure 4, Table 1,
Figure 5, Table 2, Figure 10, Section 8.1.4, Table 6, Table 7, Section 8.1.4, Section 8.6.1,
Figure 19, Section 8.6.2, Package Drawings and Markings.
Deleted figure “Synchronization of Data with Recovered Manchester Clock” and chapter on
“Single Pattern Detection (Manchester decoder enabled)”
1.5
rlc
jry
Updated Absolute Maximum Ratings
Mar 17, 2011
Jun 14, 2011
Feb 04, 2012
Jun 18, 2013
Deleted max value for IPWD parameter
1.6
1.7
Corrected data inconsistencies across the datasheet.
Corrected package drawings in Figure 23 on page 31.
Note: Typos may not be explicitly mentioned under revision history.
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AS3932
Datasheet - Ordering Information
10 Ordering Information
The devices are available as the standard products shown in Table 27.
Table 27. Ordering Information
Ordering Code
AS3932-BTST
AS3932-BQFT
Type
Marking
AS3932
AS3932
Delivery Form 1
7 inches Tape & Reel
7 inches Tape & Reel
Delivery Quantity
1000 pcs
16-pin TSSOP
16LD QFN (4x4)
1000 pcs
1. Dry Pack Sensitivity Level =3 according to IPC/JEDEC J-STD-033A for full reels.
Note: All products are RoHS compliant and ams green.
Buy our products or get free samples online at www.ams.com/ICdirect
Technical Support is available at www.ams.com/Technical-Support
For further information and requests, email us at sales@ams.com
(or) find your local distributor at www.ams.com/distributor
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AS3932
Datasheet - Copyrights
Copyrights
Copyright © 1997-2013, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights
reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no
warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing
by ams AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by ams AG is believed to be correct and accurate. However, ams AG shall not be liable to recipient or any third
party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other
services.
Contact Information
Headquarters
ams AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel : +43 (0) 3136 500 0
Fax : +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
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