AS5262-HMFP [AMSCO]
12-Bit Magnetic Angle Position Sensor; 12位磁角度位置传感器
| 型号： | AS5262-HMFP |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | 12-Bit Magnetic Angle Position Sensor |
| 文件： | 总37页 (文件大小：1406K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
high
performance
needs great
design.
Datasheet: AS5262 12-Bit Magnetic Angle Position Sensor
Please be patient while we update our brand image as
austriamicrosystems and TAOS are now ams.
www.ams.com
AS5262
12-Bit Magnetic Angle Position Sensor
1 General Description
2 Key Features
360º contactless high resolution angular position sensing
The AS5262 is a contactless magnetic angle position sensor for
accurate angular measurement over a full turn of 360°. A sub range
can be programmed to achieve the best resolution for the
application. It is a system-on-chip, combining integrated Hall
elements, analog front end, digital signal processing and best in
class automotive protection features in a single device.
User programmable start and end point of the application region
+ linearization.
User programmable clamping levels and programming of the
transition point.
Powerful analog output
To measure the angle, only a simple two-pole magnet, rotating over
the center of the chip, is required. The magnet may be placed above
or below the IC.
- Short circuit monitor
- High driving capability for resistive and capacitive loads
Wide temperature range: - 40°C to + 150°C
The absolute angle measurement provides instant indication of the
magnet’s angular position with a resolution of 0.022° = 16384
positions per revolution. According to this resolution the adjustment
of the application specific mechanical positions are possible. The
angular output data is available over a 12 bit ratiometric analog
output.
Small Pb-free package: MLF 16 6x6 (with dimple)
Broken GND and VDD detection over a wide range of different
load conditions.
Saw tooth mode 1,2,3,4 slopes per revolution
The AS5262 operates at a supply voltage of 5V and the supply and
output pins are protected against overvoltage up to +20V. In addition
the supply pins are protected against reverse polarity up to –20V.
3 Benefits
Unique fully differential patented solution
Best protections for automotive applications
Easy to program
Figure 1. Typical Arrangement of AS5262 and magnet
Additional linearization points for output characteristic
Ideal for applications in harsh environments due to contactless
position sensing
Robust system, tolerant to magnet misalignment, air gap
variations, temperature variations and external magnetic fields
High inherent accuracy
High driving capability of analog output (including diagnostics)
Broken GND and VDD detection for all external load cases
4 Applications
The AS5262 is ideal for automotive applications like throttle and
valve position sensing, gearbox position sensor, tumble flap, chassis
height level, pedal position sensing and contactless potentiometers.
www.ams.com
Revision 1.1
1 - 36
AS5262
Datasheet - Applications
Figure 2. AS5262 Block Diagram
VDD3V3_B
VDD3V3_T
High Voltage/
Reverse Polarity
Protection
VDD_T
VDD_B
AS5262
Hall Array
Sin
DSP
CORDIC
OUT_T
OUT_B
Frontend
Amplifier
12
OUT
Driver
12-bit
DAC
Cos
ADC
Single Pin
Interface
(UART)
Controller
OTP Register
(Programming
Parameters)
GND_B
GND_T
www.ams.com
Revision 1.1
2 - 36
AS5262
Datasheet - Contents
Contents
1 General Description ..................................................................................................................................................................
2 Key Features.............................................................................................................................................................................
3 Benefits.....................................................................................................................................................................................
4 Applications...............................................................................................................................................................................
5 Pin Assignments .......................................................................................................................................................................
5.1 Pin Descriptions....................................................................................................................................................................................
6 Absolute Maximum Ratings ......................................................................................................................................................
7 Electrical Characteristics...........................................................................................................................................................
1
1
1
1
4
4
5
6
7.1 Operating Conditions............................................................................................................................................................................
7.2 Magnetic Input Specification.................................................................................................................................................................
7.3 Electrical System Specifications...........................................................................................................................................................
7.4 Timing Characteristics..........................................................................................................................................................................
7.5 Power Management - Supply Monitor ..................................................................................................................................................
8 Detailed Description..................................................................................................................................................................
8.1 Operation..............................................................................................................................................................................................
6
6
7
8
8
9
9
8.1.1 VDD Voltage Monitor................................................................................................................................................................... 9
8.2 Analog Output.......................................................................................................................................................................................
9
8.2.1 Programming Parameters.......................................................................................................................................................... 10
8.2.2 Application Specific Angular Range Programming.................................................................................................................... 10
8.2.3 Application Specific Programming of the Break Point ............................................................................................................... 11
8.2.4 Full Scale Mode......................................................................................................................................................................... 11
8.2.5 Multiple Slope Output ................................................................................................................................................................ 12
8.2.6 Linearization of the Output......................................................................................................................................................... 13
8.2.7 Resolution of Parameters .......................................................................................................................................................... 13
8.2.8 Analog Output Diagnostic Mode................................................................................................................................................ 15
8.2.9 Analog Output Driver Parameters.............................................................................................................................................. 15
8.2.10 Noise Suppressor .................................................................................................................................................................... 16
8.2.11 Hysteresis Function ................................................................................................................................................................. 16
9 Application Information ........................................................................................................................................................... 16
9.1 Recommended Application Schematic............................................................................................................................................... 16
9.2 Programming the AS5262 .................................................................................................................................................................. 18
9.2.1 UART Interface for Programming .............................................................................................................................................. 18
9.2.2 Frame Organization................................................................................................................................................................... 18
9.2.3 WRITE (Command Description) ................................................................................................................................................ 20
9.2.4 READ (Command Description).................................................................................................................................................. 21
9.2.5 Baud-rate Automatic Detection.................................................................................................................................................. 21
9.2.6 Baud-rate Manual Setting (optional).......................................................................................................................................... 21
9.3 OTP Programming Data..................................................................................................................................................................... 23
9.4 READ / WRITE Register Map............................................................................................................................................................. 27
9.5 READ Only Register Map................................................................................................................................................................... 28
9.6 Special Registers................................................................................................................................................................................ 30
9.7 Programming Procedure .................................................................................................................................................................... 31
10 Package Drawings and Markings ......................................................................................................................................... 32
11 Ordering Information ............................................................................................................................................................. 35
www.ams.com
Revision 1.1
3 - 36
AS5262
Datasheet - Pin Assignments
5 Pin Assignments
Figure 3. MLF-16 Pin Configuration (View from Top)
16
15
14
13
TP1_T
TP1_B
1
2
3
4
12 S_B
11 S_T
Epad
VDD3V3_T
VDD3V3_B
10 TP3_B
9
TP3_T
5
6
7
8
5.1 Pin Descriptions
Table 1. MLF-16 Pin Descriptions
Pin Number
Pin Name
TP1_T
Pin Type
Description
1
2
Test pin for fabrication. Connected to ground in the application.
Test pin for fabrication. Connected to ground in the application.
Output of the LDO. 1µF required.
DIO/AIO
Multi purpose pin
TP1_B
3
VDD3V3_T
VDD3V3_B
GND_T
GND_B
TP2_T
AIO
4
Output of the LDO. 1µF required.
5
Ground pin. Connected to ground in the application.
Ground pin. Connected to ground in the application.
Test pin for fabrication. Connected to ground in the application.
Test pin for fabrication. Connected to ground in the application.
Test pin for fabrication. Left open in the application.
Test pin for fabrication. Left open in the application.
Supply pin
6
7
8
TP2_B
DIO/AIO
Multi purpose pin
9
TP3_T
10
TP3_B
Test pin for fabrication. Connected to OUT_T in the application.
( special case for the connection possible → 4-wire mode)
11
12
S_T
S_B
AIO
Test pin for fabrication. Connected to OUT_B in the application.
( special case for the connection possible ® 4-wire mode)
13
14
15
16
OUT_T
OUT_B
VDD_T
VDD_B
Output pin analog output. Over this pin the programming is possible.
Output pin analog output. Over this pin the programming is possible.
Positive supply pin. This pin is over voltage protected.
Analog output pin
Supply pin
Positive supply pin. This pin is over voltage protected.
www.ams.com
Revision 1.1
4 - 36
AS5262
Datasheet - Absolute Maximum Ratings
6 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
DC supply voltage at pin VDD
Overvoltage
No operation
Permanent
VDD
-20
20
V
VOUT
Vdiff
Output voltage OUT
-0.3
-20
20
20
5
V
V
Voltage difference at pin VDD and OUT
DC supply voltage at pin VDD3V3
Input current (latchup immunity)
VDD3V3
Iscr
-0.3
-100
V
Norm: AEC-Q100-004
Norm: AEC-Q100-002
Min -67ºF; Max +257ºF
100
mA
Electrostatic Discharge
ESD
Electrostatic discharge
±2
kV
ºC
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
Body temperature
-55
+150
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”. The lead finish
for Pb-free leaded packages is matte tin (100%
Sn).
TBody
260
85
ºC
%
H
Humidity non-condensing
Moisture Sensitive Level
5
Represents a maximum floor life time of 168h
MSL
3
www.ams.com
Revision 1.1
5 - 36
AS5262
Datasheet - Electrical Characteristics
7 Electrical Characteristics
7.1 Operating Conditions
In this specification, all the defined tolerances for external components need to be assured over the whole operation conditions range and also
over lifetime.
Table 3. Operating Conditions
Symbol
TAMB
Isupp
Parameter
Ambient temperature
Supply current
Conditions
Min
Typ
Max
+150
12
Units
ºC
-40
Only for one die. Must be multiplied by 2
mA
V
VDD
Supply voltage at pin VDD
4.5
5.0
5.5
7.2 Magnetic Input Specification
TAMB = -40 to +150ºC, VDD = 4.5 to 5.5V (5V operation), unless otherwise noted.
Two-pole cylindrical diametrically magnetized source:
Table 4. Magnetic Input Specification
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Required vertical component of the
magnetic field strength on the die’s surface,
measured along a concentric circle with a
radius of 1.25 mm
Bpk
Magnetic input field amplitude
30
70
mT
Required vertical component of the
magnetic field strength on the die’s surface,
measured along a concentric circle with a
radius of 1.25 mm. Increased sensor output
noise.
Magnetic input field amplitude
(extended) default setting
Bpkext
10
90
mT
Boff
Magnetic offset
Constant magnetic stray field
Including offset gradient
± 5
5
mT
%
Field non-linearity
Offset between defined device center and
magnet axis. Dependent on the selected
magnet. Including Eccentricity.
Disp
Displacement radius
1
mm
www.ams.com
Revision 1.1
6 - 36
AS5262
Datasheet - Electrical Characteristics
7.3 Electrical System Specifications
TAMB = -40 to +150ºC, VDD = 4.5 - 5.5V (5V operation), Magnetic Input Specification, unless otherwise noted.
Table 5. Electrical System Specifications
Symbol
Parameter
Conditions
Min
Typ
Max
Units
º
Range > 90
RES
Resolution Analog Output
12
bit
1LSB=1.221mV typ
Best aligned reference magnet at 25ºC
over full turn 360º.
INLopt
Integral non-linearity (optimum)
Integral non-linearity (optimum)
0.5
0.9
deg
deg
Best aligned reference magnet over
temperature -40 -150º over full turn 360º.
INLtemp
Best aligned reference magnet over
temperature -40 -150º over full turn 360º
and displacement
INL
Integral non-linearity
1.4
deg
Monolitic
DNL
ON
Differential non-linearity
Output noise (360º segment)
Power-up time 0-5V
0.05
0.2
deg
%/VDD
ms
1 LSB after filter peak/peak rms value
See
Figure 4
tPwrUp
10
System propagation delay
absolute output: delay of ADC,
DSP and absolute interface
10kOhm, 100 µF RC filter
tdelay
300
µs
Figure 4. Power-up timing Diagram
VDD
4.5V
OUT pin in HiZ
First Valid Data on OUT pin
tPwrUp
www.ams.com
Revision 1.1
7 - 36
AS5262
Datasheet - Electrical Characteristics
7.4 Timing Characteristics
Table 6. Timing Conditions
Symbol
Parameter
WachDog error detection time
Conditions
Conditions
Min
Typ
Max
Units
TDETWD
12
ms
7.5 Power Management - Supply Monitor
Table 7. Power Management - Supply Monitor Conditions
Symbol
VDDUVTH
VDDUVTL
VDDUVHYS
VDDUVDET
VDDUVREC
VDDOVTH
VDDOVTL
VDDOVHYS
Parameter
Min
3.5
3.0
300
10
Typ
4.0
3.5
500
50
Max
4.5
Units
V
VDD undervoltage upper threshold
VDD undervoltage lower threshold
VDD undervoltage hysteresis
VDD undervoltage detection time
VDD undervoltage recovery time
VDD overvoltage upper threshold
VDD overvoltage lower threshold
VDD overvoltage hysteresis
4.0
V
900
250
250
7.0
mV
µ
s
10
50
µs
V
6.0
5.5
300
6.5
6
6.5
V
500
900
mV
VDD overvoltage detection time (analog
path)
ANATOVDET
ANATOVREC
10
10
50
50
250
250
µ
s
s
VDD overvoltage recovery time (analog
path)
µ
www.ams.com
Revision 1.1
8 - 36
AS5262
Datasheet - Detailed Description
8 Detailed Description
The AS5262 is manufactured in a CMOS process and uses a spinning current Hall technology for sensing the magnetic field distribution across
the surface of the chip.
This IC consists of two galvanic isolated dies. All following in and register names refers to one die.
The integrated Hall elements are placed around the center of the device and deliver a voltage representation of the magnetic field at the surface
of the IC.
Through Sigma-Delta Analog / Digital Conversion and Digital Signal-Processing (DSP) algorithms, the AS5262 provides accurate high-resolution
absolute angular position information. For this purpose a Coordinate Rotation Digital Computer (CORDIC) calculates the angle and the
magnitude of the Hall array signals.
The DSP is also used to provide digital information at the outputs that indicate movements of the used magnet towards or away from the device’s
surface.
A small low cost diametrically magnetized (two-pole) standard magnet provides the angular position information.
The AS5262 senses the orientation of the magnetic field and calculates a 14-bit binary code. This code is mapped to a programmable output
characteristic in analog voltage format. This signal is available at the pin (OUT).
The application angular region can be programmed in a user friendly way. The start angle position T1 and the end point T2 can be set and
programmed according the mechanical range of the application with a resolution of 14 bits. In addition the T1Y and T2Y parameter can be set
and programmed according the application. The transition point 0 to 360 degree can be shifted using the break point parameter BP. The voltage
for clamping level low CLL and clamping level high CLH can be programmed with a resolution of 9 bits. Both levels are individually adjustable.
Two additional linearization points can be used to improve the system linearity. These points C1 and C2 are programmable.
The output parameters can be programmed in an OTP register. No additional voltage is required to program the AS5262. The setting may be
overwritten at any time and will be reset to default when power is cycled. To make the setting permanent, the OTP register must be programmed
by using a lock bit the content could be frozen for ever.
The AS5262 is tolerant to magnet misalignment and unwanted external magnetic fields due to differential measurement technique and Hall
sensor conditioning circuitry.
8.1 Operation
8.1.1 VDD Voltage Monitor
VDD Over Voltage Management. If the supply voltage at pin VDD exceeds the over-voltage upper threshold for longer than the detection
time the output is turned off. When the over voltage event has passed and the voltage applied to pin VDD falls below the over-voltage lower
threshold for longer than the recovery time the device enters the normal mode and the output is enabled.
VDD Under Voltage Management. When the voltage applied to the VDD pin falls below the under-voltage lower threshold for longer than
the detection time the output is turned off. When the voltage applied to the VDD pin exceeds the under-voltage upper threshold for longer than
the detection time the device enters the normal mode and the output is enabled.
8.2 Analog Output
By default (after programmed CUST_LOCK OTP bit) the analog output mode is selected. The pin OUT provides an analog voltage that is
proportional to the angle of the rotating magnet and ratiometric to the supply voltage VDD. It can source or sink currents up in normal operation.
A short circuit protection is in place and will switch the output driver in high Z in case of an overload event. Due to an intelligent approach a
permanent short circuit will not damage the device. This is also feasible in a high voltage condition up to 20 V and at the highest specified
ambient temperature.
After the digital signal processing (DSP) a 12-bit Digital-to-Analog converter and output stage provides the output signal.
The DSP maps the application range to the output characteristic. An inversion of the slope is also programmable to allow inversion of the rotation
direction.
The reference voltage for the Digital-to-Analog converter (DAC) is taken from VDD. In this mode, the output voltage is ratiometric to the supply
voltage.
An on-chip diagnostic feature handles the error state at the output. Depending on the failure the output is in HiZ condition or is driven in the
failure band. (see Table 9).
www.ams.com
Revision 1.1
9 - 36
AS5262
Datasheet - Detailed Description
8.2.1 Programming Parameters
The analog output characteristic is programmable by OTP. Depending on the application, the analog output can be adjusted. The user can
program the following application specific parameters:
Mechanical angle start point
Mechanical angle end point
Voltage level at the T1 position
Voltage level at the T2 position
Clamping Level Low
T1
T2
T1Y
T2Y
CLL
CLH
BP
Clamping Level High
Break point (transition point 0 to 360º)
Calibration Point 1
C1
Calibration Point 2
C2
Trim value for C1
C1Y
C2Y
Trim value for C2
These parameters are input parameters. Using the available programming software and programmer these parameters are converted and finally
written into the AS5262 128 bit OTP memory.
8.2.2 Application Specific Angular Range Programming
The application range can be selected by programming T1 with a related T1Y and T2 with a related T2Y into the AS5262. The clamping levels
CLL and CLH can be programmed independent from the T1 and T2 position and both levels can be separately adjusted.
Figure 5. Programming of an Individual Application Range
90 degree
Application range
electrical range
T2
mechanical range
clamping range
high
T1
100%VDD
CLH
T2Y
0 degree
CLL
180 degree
T1Y
CLH
BP
CLL
0
clamping range
low
T1
T2
270 degree
Figure 5 shows a simple example of the selection of the range. The mechanical starting point T1 and the mechanical end point T2 are defining
the mechanical range. A sub range of the internal Cordic output range is used and mapped to the needed output characteristic. The analog
output signal has 12 bit, hence the level T1Y and T2Y can be adjusted with this resolution. As a result of this level and the calculated slope the
clamping region low is defined. The break point BP defines the transition between CLL and CLH. In this example the BP is set to 0 degree. The
BP is also the end point of the clamping level high CLH. This range is defined by the level CLH and the calculated slope. Both clamping levels
can be set independently form each other.
www.ams.com
Revision 1.1
10 - 36
AS5262
Datasheet - Detailed Description
8.2.3 Application Specific Programming of the Break Point
The break point BP can be programmed as well with 14 bits. This is important when the default transition point is inside the application range. In
such a case the default transition point must be shifted out of the application range. The parameter BP defines the new position.
Figure 6. Individual Programming of the Break Point BP
8.2.4 Full Scale Mode
Figure 7. Full Scale Mode
100 % VDD
0
360
For simplification, Figure 7 describes a linear output voltage from rail to rail (0V to VDD) over the complete rotation range. In practice, this is not
feasible due to saturation effects of the output stage transistors. The actual curve will be rounded towards the supply rails (as indicated Figure 7).
www.ams.com
Revision 1.1
11 - 36
AS5262
Datasheet - Detailed Description
8.2.5 Multiple Slope Output
The AS5262 can be programmed to multiple slopes. Where one programmed reference slope characteristic is copied to multiple slopes. Two,
three and four slopes are selectable by the user OTP bits QUADEN (1:0). In addition to the steepness of the slope the clamping levels can be
programmed as well.
Figure 8. Two Slope Mode
100 % VDD
0
360
Figure 9. Four Slope Mode
100 % VDD
0
360
www.ams.com
Revision 1.1
12 - 36
AS5262
Datasheet - Detailed Description
8.2.6 Linearization of the Output
To improve the system linearity an additional 2 point linearization function is implemented in the AS5262.
Figure 10. Linearization of the Output Characteristic
100%VDD
CLH
T2Y
C2Y
C1Y
T1Y
CLL
0
T1 C1
C2 T2
8.2.7 Resolution of Parameters
The programming parameters have a wide resolution of up to 14 bits.
Table 8. Resolution of the Programming Parameters
Symbol
T1
Parameter
Mechanical angle start point
Mechanical angle stop point
Mechanical start voltage level
Mechanical stop voltage level
Clamping level low
Resolution
Note
14 bits
14 bits
12 bits
12 bits
9 bits
T2
T1Y
T2Y
CLL
CLH
BP
Clamping level high
Break point
9 bits
14 bits
4 bits
C1
Calibration Point 1
C2
Calibration Point 2
4 bits
C1Y
C2Y
Trim value C1
3 bits
Trim value C2
3 bits
www.ams.com
Revision 1.1
13 - 36
AS5262
Datasheet - Detailed Description
Figure 11. Overview of the Angular Output Voltage
100
96
Failure Band High
Clamping Region High
CLH
T2Y
Application Region
T1Y
CLL
Clamping Region Low
Failure Band Low
4
0
Figure 11 gives an overview of the different ranges. The failure bands are used to indicate a wrong operation of the AS5262. This can be caused
due to a broken supply line. By using the specified load resistors, the output level will remain in these bands during a fail. It is recommended to
set the clamping level CLL above the lower failure band and the clamping level CLH below the higher failure band.
www.ams.com
Revision 1.1
14 - 36
AS5262
Datasheet - Detailed Description
8.2.8 Analog Output Diagnostic Mode
Due to the low pin count in the application a wrong operation must be indicated by the output pin OUT. This could be realized using the failure
bands. The failure band is defined with a fixed level. The failure band low is specified from 0 to 4% of the supply range over the total operation
range. The failure band high is defined always from 96 to 100%. Several failures can happen during operation. The output signal remains in
these bands over the specified operating and load conditions. All different failures can be grouped into the internal alarms (failures) and the
application related failures.
CLOAD ≤ 33 nF, RPU= 4k…10kΩ
RPD= 4k…10kΩ load pull-up
Table 9. Different Failure Cases of AS5262
Type
Failure Mode
Symbol
Failure Band
Note
Out of magnetic range
(too less or too high magnetic input)
Programmable by OTP bit DIAG_HIGH
MAGRng
High/Low
Cordic overflow
Programmable by OTP bit DIAG_HIGH
Programmable by OTP bit DIAG_HIGH
Programmable by OTP bit DIAG_HIGH
Programmable by OTP bit DIAG_HIGH
COF
OCF
WDF
OF
High/Low
High/Low
High/Low
High/Low
Internal alarms (failures)
Offset compensation finished
Watchdog fail
Oscillator fail
Overvoltage condition
Broken VDD
OV
Dependant on the load resistor
Pull up → failure band high
Pull down → failure band low
BVDD
BVSS
SCO
High/Low
High/Low
Application related
failures
Broken VSS
Short circuit output
Switch off → short circuit dependent
For efficient use of diagnostics, it is recommended to program to clamping levels CLL and CLH.
8.2.9 Analog Output Driver Parameters
The output stage is configured in a push-pull output. Therefore it is possible to sink and source currents.
CLOAD ≤ 33 nF, RPU= 4k…10kΩ ; RPD= 4k…10kΩ load pull-up
Table 10. General Parameters for the Output Driver
Symbol
IOUTSCL
IOUTSCH
TSCDET
TSCREC
ILEAKOUT
BGNDPU
BGNDPD
BVDDPU
BVDDPD
OUTRATIO
Parameter
Min
5
Typ
10
Max
20
Unit
Note
Short circuit output current (low side driver)
Short circuit output current (high side driver)
Short circuit detection time
mA
mA
VOUT=20V
-20
20
2
-10
-5
VOUT=0V
600
20
µs
output stage turned off
output stage turned on
VOUT=VDD=5V
Short circuit recovery time
ms
Output Leakage current
-20
96
0
20
µA
Output voltage broken GND with pull-up
Output voltage broken GND with pull-down
Output voltage broken VDD with pull-up
Output voltage broken VDD with pull-down
Output ratiometric error
100
4
%VDD
%VDD
%VDD
%VDD
%VDD
96
0
100
4
-0.5
0.5
10(1)
10(2)
OUTDNL
OUTINL
Output DNL
Output INL
LSB
LSB
Between 4% and 96% of VDD
Between 4% and 96% of VDD
-10(2)
Notes:
1. This parameter will be finally defined after temperature characterisation.
2. Design target for this value is reduced.
www.ams.com
Revision 1.1
15 - 36
AS5262
Datasheet - Application Information
8.2.10 Noise Suppressor
The noise suppressor is inserted after the angle calculation (first stage) and after range expansion (second stage). This function is capable to
reduce the noise level down to 1 LSB peak to peak over different programing ranges.
4 possible configurations of the noise suppressor can be selected via the OTP bits FILTERCFG<1:0>.
8.2.11 Hysteresis Function
AS5262 device includes a hysteresis function to avoid sudden jumps from CLH to CLL and vice versa caused by noise in the full turn
configuration.
The hysteresis amplitude can be selected via the OTP bits HYSTSEL<1:0>.
9 Application Information
9.1 Recommended Application Schematic
Figure 12 shows the recommended schematic in the application. All components marked with (*) are optional and can be used to further
increase the EMC.
Figure 12. AS5262 6-Wire Connection with Pull-Down / Pull-Up Resistors
Sensor PCB
Electric Control Unit
VDD1
VDD2
OUT2
*
R1_x
*
R2_x
OUT1
16
15
14
13
TP1_T
TP1_B
*
C1_x
C4_x
1
2
3
4
12
11
10
9
S_B
S_T
AS5262
VDD3V3_T
VDD3V3_B
C3_x
CL_T RLPD_T
CL_B RLPD_B
TP3_B
C2_x
TP3_T
5
6
7
8
GND1
GND2
Sensor PCB
Electric Control Unit
RLPU_T
VDD1
VDD2
OUT2
RLPU_B
*
R1_x
*
R2_x
OUT1
16
15
14
13
TP1_T
TP1_B
*
C1_x
C4_x
1
2
3
4
12
11
10
9
S_B
S_T
AS5262
VDD3V3_T
VDD3V3_B
C3_x
CL_T
CL_B
TP3_B
C2_x
TP3_T
5
6
7
8
GND1
GND2
www.ams.com
Revision 1.1
16 - 36
AS5262
Datasheet - Application Information
Table 11. External Components
Symbol
Parameter
Min
0.8
0.8
0
Typ
1
Max
1.2
1.2
4.7
Unit
µF
µF
nF
Note
C1
C2
C3
VDD buffer capacitor
Low ESR 0.3 Ω
Low ESR 0.3 Ω
VDD3V3 regulator capacitor
OUT load capacitor (sensor PCB)
1
Do not increase due to
programming over output.
*
VDD capacitor (optional)
4.7
10
nF
C4
R1
*
VDD serial resistor (optional)
OUT load capacitor (ECU)
OUT serial resistor (optional)
Ω
nF
Ω
CL
0
33
*
50
R2
RLPU
RLPD
OUT pull-up resistance
4
4
10
10
kΩ
kΩ
OUT pull-down resistance
www.ams.com
Revision 1.1
17 - 36
AS5262
Datasheet - Application Information
9.2 Programming the AS5262
The AS5262 programming is a one-time-programming (OTP) method, based on polysilicon fuses. The advantage of this method is that no
additional programming voltage is needed. The internal LDO provides the current for programming.
The OTP consists of 128 bits; several bits are available for user programming. In addition factory settings are stored in the OTP memory. Both
regions are independently lockable by build in lock bits.
A single OTP cell can be programmed only once. Per default, the cell is “0”; a programmed cell will contain a “1”. While it is not possible to reset
a programmed bit from “1” to “0”, multiple OTP writes are possible, as long as only unprogrammed “0”-bits are programmed to “1”.
Independent of the OTP programming, it is possible to overwrite the OTP register temporarily with an OTP write command. This is possible only
if the user lock bit is not programmed.
Due to the programming over the output pin the device will initially start in the communication mode. In this mode the digital angle value can be
read with a specific protocol format. It is a bidirectional communication possible. Parameters can be written into the device. A programming of the
device is triggered by a specific command. With another command (pass2func) the device can be switched into operation mode. In case of a
programmed user lock bit the AS5262 automatically starts up in the functional operation mode. No communication of the specific protocol is
possible after this.
A standard half duplex UART protocol is used to exchange data with the device in the communication mode.
9.2.1 UART Interface for Programming
The AS5262 uses a standard UART interface with an address byte and two data bytes. The read or write mode is selected with bit R/Wn in the
first byte. The timing (baudrate) is selected by the AS5262 over a synchronization frame. The baud rate register can be read and overwritten
(optional). Every start bit is used for synchronisation.
A time out function detects not complete commands and resets the AS5262 UART after the timeout period.
9.2.2 Frame Organization
Each frame is composed by 24 bits. The first byte of the frame specifies the read/write operation with the register address. 16 data bits contains
the communication data. There will be no operation in case of the usage of a not specified CMD. The UART programming interface block of the
AS5262 can operate in slave communication or master communication mode. In the slave communication mode the AS5262 receives the data.
The programming tool is the driver of the single communication line. In case of the master communication mode the AS5262 transmits data in
the frame format. The single communication line can be pulled down by the AS5262.
The UART frame consists of 1 start bit (low level), 8 data bit, 1 even-parity bit and 1 stop bit (high level). Data are transferred from LSB to MSB
Figure 13. General UART Frame
start D0 D1 D2 D3 D4 D5 D6 D7 par stop
Table 12. Bit Timing
Symbol
START
Dx
Parameter
Start bit
Min
Typ
1
Max
Unit
TBIT
TBIT
TBIT
TBIT
TBIT
Note
Data bit
1
PAR
Parity bit
1
STOP
TSW
Stop bit
1
Slave/Master Switch Time
7
www.ams.com
Revision 1.1
18 - 36
AS5262
Datasheet - Application Information
Each communication starts with the reception of a request from the external controller. The request consists of two frames: one synchronization
frame and the command frame.
The synchronization frame contains the data 0x55 and allows the UART to measure the external controller baud rate:
Figure 14. Synchronization Frame
start D0 D1 D2 D3 D4 D5 D6 D7 par stop
The second frame contains the command Read/ Write (1 bit) and the address (7 bits):
Figure 15. Address and Command Frame
AD AD AD
AD AD AD
AD
6
start
R/Wn par stop
0
1
2
3
4
5
Only two commands are possible. In case of read command the idle phase between the command and the answer is the time TSW. In case of
parity error command is not executed.
Table 13. Possible Commands
AS5X63
Communication Mode
Possible Interface
Commands
Command
CMD
Description
WRITE
READ
Write data to the OTP memory or Registers
Read data to the OTP memory or Registers
SLAVE
0
1
SLAVE & MASTER
Notes:
1. In case of Write command the request is followed by the frames containing the data to write.
2. In case of Read command the communication direction will change and the AS5262 will answer with the frames containing the
requested data.
www.ams.com
Revision 1.1
19 - 36
AS5262
Datasheet - Application Information
9.2.3 WRITE (Command Description)
Figure 16. Full Write Command
Synchronization frame
start
D0
D1
D2
D3
D4
D5
D6
D7
par
stop
Write command frame
R/
Wn
start
AD0
AD1
AD2
AD3
AD4
D04
D04
par
par
par
stop
stop
stop
AD5 AD6
Data0 frame (data to write on address AD<6:0>)
start
D00
D01
D02
D03
D05
D05
D06
D07
Data1 frame (data to write on address AD<6:0>+1)
start
D00
D01
D02
D03
D06
D07
Writing the AS5262 KEY in the fuse register (address 0x41) triggers the transfer of the data from the OTP RAM into the Poly Fuse cell.
Writing the AS5262 KEY in the Pass2Func Register (address 0x60) forces the device into normal mode.
www.ams.com
Revision 1.1
20 - 36
AS5262
Datasheet - Application Information
9.2.4 READ (Command Description)
Figure 17. Full Read Command
Synchronization frame:
start
D0
D1
D2
D3
D4
D5
D6
D7
par
par
stop
stop
Read command frame:
start
AD0
AD1
AD2
AD3
AD4
AD5 AD6
R/Wn
Data0 frame (data read from address AD<6:0>) (MASTER):
start
par
par
stop
stop
D04
D00
D01
D02
D03
D05
D05
D06
D07
D07
Data1 frame (data read from address AD<6:0>+1) (MASTER):
start
D00
D01
D02
D03
D04
D06
9.2.5 Baud-rate Automatic Detection
The UART includes a built-in baud-rate monitor that uses the synchronization frame to detect the external controller baud-rate. This baud-rate is
used after the synchronization byte to decode the following frame and to transmit the answer and it is stored in the BAUDREG register.
9.2.6 Baud-rate Manual Setting (optional)
The BAUDREG register can be read and over-written for a possible manual setting of the baud-rate: in case the register is overwritten with a
value different from 0, this value will be used for the following UART communications and the synchronization frame must be removed from the
request.
www.ams.com
Revision 1.1
21 - 36
AS5262
Datasheet - Application Information
Figure 18. Manual Baud-rate Setting
WR BAUDREG
Address
Low Byte
High Byte
synch frame
IDLE
IDLE
IDLE
IDLE
IDLE
P
S
1
0
1
0
1
0
1
0
0
P
S
0
P
S
0
1
0
1
1
1
0
0
0
P
S
0
0
0
0
0
0
0
0
0
AS5262 in Receiving Mode (Write Access)
Figure 19. Simple Read and Write
Low Byte
High Byte
Reg. Address
IDLE
IDLE
S
0
P
IDLE
S
P
S
P
IDLE
AS5262 in Receiving
Mode
AS5262 in Receiving Mode (Write Access)
Low Byte
High Byte
Reg. Address
IDLE
IDLE
S
1
P
S
P
IDLE
S
P
IDLE
AS5262 in Receiving
Mode
AS5262 in transmitting mode (Read Access)
www.ams.com
Revision 1.1
22 - 36
AS5262
Datasheet - Application Information
9.3 OTP Programming Data
Table 14. OTP Memory Map
Data Byte
Bit Number
Symbol
Default
Description
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DATA15 (0x0F)
Factory Settings
AMS (reserved)
DATA14 (0x0E)
CUSTID<0>
CUSTID<1>
CUSTID<2>
CUSTID<3>
CUSTID<4>
CUSTID<5>
CUSTID<6>
X2LIN<0>
X2LIN<1>
X2LIN<2>
X2LIN<3>
X1LIN<0>
X1LIN<1>
X1LIN<2>
X1LIN<3>
Y1LIN<0>
DATA13 (0x0D)
Customer Identifier
Second linearization point (X-axis)
DATA12 (0x0C)
DATA11 (0x0B)
First linearization point (X-axis)
First linearization point (Y-axis)
www.ams.com
Revision 1.1
23 - 36
AS5262
Datasheet - Application Information
Table 14. OTP Memory Map
Data Byte
Bit Number
Symbol
Y1LIN<1>
Y1LIN<2>
Y2LIN<0>
Y2LIN<1>
Y2LIN<2>
CLH<0>
Default
Description
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
First linearization point (Y-axis)
Second linearization point (Y-axis)
CLH<1>
CLH<2>
CLH<3>
CLH<4>
Clamping Level High
DATA10 (0x0A)
DATA9 (0x09)
DATA8 (0x08)
DATA7 (0x07)
CLH<5>
CLH<6>
CLH<7>
CLH<8>
CLL<0>
CLL<1>
CLL<2>
CLL<3>
CLL<4>
Clamping Level Low
CLL<5>
CLL<6>
CLL<7>
CLL<8>
OFFSET<0>
OFFSET<1>
OFFSET<2>
OFFSET<3>
OFFSET<4>
OFFSET<5>
OFFSET<6>
OFFSET<7>
OFFSET<8>
OFFSET<9>
OFFSET<10>
OFFSET<11>
OFFSET<12>
OFFSET<13>
OFFSET<14>
Offset
www.ams.com
Revision 1.1
24 - 36
AS5262
Datasheet - Application Information
Table 14. OTP Memory Map
Data Byte
Bit Number
Symbol
OFFSET<15>
OFFSET<16>
OFFSET<17>
OFFSET<18>
OFFSET<19>
GAIN<0>
GAIN<1>
GAIN<2>
GAIN<3>
GAIN<4>
GAIN<5>
GAIN<6>
GAIN<7>
GAIN<8>
GAIN<9>
GAIN<10>
GAIN<11>
GAIN<12>
GAIN<13>
GAIN<14>
GAIN<15>
GAIN<16>
BP<0>
Default
Description
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Offset
DATA6 (0x06)
DATA5 (0x05)
DATA4 (0x04)
DATA3 (0x003)
Scale Factor
BP<1>
BP<2>
BP<3>
BP<4>
BP<5>
BP<6>
Break Point
BP<7>
BP<8>
BP<9>
BP<10>
BP<11>
BP<12>
BP<13>
DATA2 (0x02)
Sector selection
4
5
ANGLERNG
DIAG_HIGH
0
0
0=Angular Sector≥22.5 degrees;
1=Angular Sector<22.5 degrees
Failure Band Selection
0=Failure Band Low 1=Failure Band
High
www.ams.com
Revision 1.1
25 - 36
AS5262
Datasheet - Application Information
Table 14. OTP Memory Map
Data Byte
Bit Number
Symbol
Default
Description
6
7
QUADEN<0>
0
Quadrant Mode Enable
00=1quadrant;01=2quadrants;
10=3 quadrants;11=4 quadrants
DATA2 (0x02)
QUADEN<1>
AIRGAPSEL
0
0
Magnetic input range extension
0:extended range;1=normal range
0
1
2
3
4
HYSTSEL<0>
HYSTSEL<1>
FILTERCFG<0>
FILTERCFG<1>
0
0
0
0
Hysteresis selection
00=no hysteresis; 01: 56LSB;
10=91LSB; 11=137LSB
Filter Configuration
00=no filter; 01= fast;
10=moderate; 11=slow
DATA1 (0x01)
5
6
7
0
1
2
3
4
5
6
7
Not used
Not used
0
0
0
0
0
0
0
0
0
0
0
Not used
RED_ADD<0>
RED_ADD<1>
RED_ADD<2>
RED_ADD<3>
RED_BIT<0>
RED_BIT<1>
RED_BIT<2>
CUST_LOCK
Redundancy Address
Identify the address of the byte
containing the bit to be changed
DATA0 (0x00)
Redundancy Bit
Identify the position of the bit to be
changed in the byte at the address
RED_ADD<3:0>
Lock bit for Customer Area
www.ams.com
Revision 1.1
26 - 36
AS5262
Datasheet - Application Information
9.4 READ / WRITE Register Map
Table 15. Read / Write Registers
Data Byte
Bit Number
Symbol
BAUDREG<0>
BAUDREG<1>
BAUDREG<2>
BAUDREG<3>
BAUDREG<4>
BAUDREG<5>
BAUDREG<6>
BAUDREG<7>
BAUDREG<8>
Not used
Default
Description
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DATA0 (0x20)
UART Baud Rate Register
Not used
Not used
DATA1 (0x21)
DATA2 (0x22)
DATA3 (0x23)
A read command returns all data bits
at 0
Not used
Not used
Not used
Not used
DAC12IN<8>
DAC12IN<9>
DAC12IN<10>
DAC12IN<11>
DAC12INSEL
R1K10K<0>
R1K10K<1>
DAC12 buffer value
DAC12 buffer selection
Selection of the reference resistance
used for OTP download
Resetn of the Digital Signal Processing
circuit
7
DSPRN
0
0
1
2
3
4
5
6
7
DAC12IN<0>
DAC12IN<1>
DAC12IN<2>
DAC12IN<3>
DAC12IN<4>
DAC12IN<5>
DAC12IN<6>
DAC12IN<7>
0
0
0
0
0
0
0
0
DAC12 buffer value
www.ams.com
Revision 1.1
27 - 36
AS5262
Datasheet - Application Information
9.5 READ Only Register Map
Table 16. Read Only Registers
Data Byte
Bit Number
Symbol
Not used
Default
Description
0
1
2
3
0
0
0
0
A read command returns 0
Offset compensation finished
AGC loop compensation finished
Overflow of the Cordic
OFFSETFINISHED
AGCFINISHED
CORDICOVF
AGC loop saturation because of B field
too strong
4
5
AGCALARML
AGCALARMH
0
0
DATA0 (0x28)
AGC loop saturation because of B field
too weak
0=1K resistance selected for OTP
download;
6
OTP_RES
0
1=10K resistance selected for OTP
download
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
PARITY_ERR
CORDICOUT<0>
CORDICOUT<1>
CORDICOUT<2>
CORDICOUT<3>
CORDICOUT<4>
CORDICOUT<5>
CORDICOUT<6>
CORDICOUT<7>
CORDICOUT<8>
CORDICOUT<9>
CORDICOUT<10>
CORDICOUT<11>
CORDICOUT<12>
CORDICOUT<13>
Not used
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
UART parity error flag
DATA1 (0x29)
DATA2 (0x2A)
DATA3 (0x2B)
Cordic Output
A read command returns all data bits
at 0
Not used
DSPOUT<0>
DSPOUT<1>
DSPOUT<2>
DSPOUT<3>
DSP Output
DSPOUT<4>
DSPOUT<5>
DSPOUT<6>
DSPOUT<7>
www.ams.com
Revision 1.1
28 - 36
AS5262
Datasheet - Application Information
Table 16. Read Only Registers
Data Byte
Bit Number
Symbol
DSPOUT<8>
DSPOUT<9>
DSPOUT<10>
DSPOUT<11>
Not used
Default
Description
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DSP Output
DATA4 (0x2C)
Not used
A read command returns all data bits
at 0
Not used
Not used
AGCVALUE<0>
AGCVALUE<1>
AGCVALUE<2>
AGCVALUE<3>
AGCVALUE<4>
AGCVALUE<5>
AGCVALUE<6>
AGCVALUE<7>
MAG<0>
DATA5 (0x2D)
DATA6 (0x2E)
DATA7 (0x2F)
AGC Value
MAG<1>
MAG<2>
MAG<3>
Magnitude of magnetic field
MAG<4>
MAG<5>
MAG<6>
MAG<7>
Not used
Not used
Not used
Not used
A read command returns all data bits
at 0
Not used
Not used
Not used
Not used
www.ams.com
Revision 1.1
29 - 36
AS5262
Datasheet - Application Information
9.6 Special Registers
Table 17. Special Registers
Data Byte
Bit Number
Symbol
Default
Description
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
AS5262KEY<0>
AS5262KEY<1>
AS5262KEY<2>
AS5262KEY<3>
AS5262KEY<4>
AS5262KEY<5>
AS5262KEY<6>
AS5262KEY<7>
AS5262KEY<8>
AS5262KEY<9>
AS5262KEY<10>
AS5262KEY<11>
AS5262KEY<12>
AS5262KEY<13>
AS5262KEY<14>
AS5262KEY<15>
AS5262KEY<0>
AS5262KEY<1>
AS5262KEY<2>
AS5262KEY<3>
AS5262KEY<4>
AS5262KEY<5>
AS5262KEY<6>
AS5262KEY<7>
AS5262KEY<8>
AS5262KEY<9>
AS5262KEY<10>
AS5262KEY<11>
AS5262KEY<12>
AS5262KEY<13>
AS5262KEY<14>
AS5262KEY<15>
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DATA0 (0x41)
AS5262 KEY<15:0>=0101 0001 0110
0010
A write command with data different
from AS5262 KEY is not executed
A read command returns all data bits
at 0
DATA1 (0x42)
DATA0 (0x60)
DATA1 (0x61)
AS5262 KEY<15:0>=0101 0001 0110
0010
A write command with data different
from AS5262 KEY is not executed
A read command returns all data bits
at 0
www.ams.com
Revision 1.1
30 - 36
AS5262
Datasheet - Application Information
9.7 Programming Procedure
Pull-up on out pin
VDD=5V
Wait 10ms (after the startup time device enters communication mode)
Write command: Trimming bits are written in the OTP RAM
Read command: All the trimming bits are read back to check the correctness of the writing procedure.
Write AS5262KEY in the Fuse register: The OTP RAM content is permanently transferred into the Poly Fuse cells.
Wait 10 ms (fuse time)
Write command, R1K_10K<1:0>=(11)b: Poly Fuse cells are downloaded into the RAM memory using a 10K resistance as reference.
Wait 5 ms (download time)
Read R1K_10K register, the expected value is 00b
Write command, R1K_10K<1:0>=(11)b
Read R1K_10K register, the expected value is (11)b. NB: Step11 and Step12 have to be consecutive.
Read command: all the fused bits downloaded with 10K resistance are read back.
Write command, R1K_10K=<1:0>=(10)b: Poly Fuse cells are downloaded into the RAM memory using a 1K resistance as reference.
Wait 5 ms (download time)
Read R1K_10K register, the expected value is (00)b
Write command register, R1K_10K<1:0>=(10)b
Read R1K_10K register, the expected value is (10)b NB: Step18 and Step19 have to be consecutive.
Read command: All the fused bits downloaded with 1K resistance are read back.
Check that read commands at Steps 5, 13 and 19 are matching
Write AS5262KEY in the Pass2Func register: Device enters normal mode.
www.ams.com
Revision 1.1
31 - 36
AS5262
Datasheet - Package Drawings and Markings
10 Package Drawings and Markings
The device is available in a MLF-16 package.
Figure 20. Package Drawings and Dimensions
Symbol
A
Min
0.80
0
Nom
0.90
Max
1.00
0.05
1.00
A1
A2
A3
L
0.02
-
0.65
0.20 REF
0.60
0.50
0.05
0.05
0º
0.70
0.25
0.15
14º
L1
L2
Θ
0.15
0.10
-
b
0.35
0.20
0.40
0.45
0.30
b1
D
0.25
6.00 BSC
6.00 BSC
1.00 BSC
5.75 BSC
5.75 BSC
4.20
E
e
D1
E1
D2
E2
aaa
bbb
ccc
ddd
eee
fff
4.10
4.30
4.10
4.20
4.30
-
-
-
-
-
-
0.15
-
-
-
-
-
-
0.10
0.10
Notes:
0.05
1. Dimensions and tolerancing confirm to ASME Y14.5M-1994.
2. All dimensions are in miilimeters. Angles are in degrees.
3. Bilaretal coplanarity zone applies to the exposed pad as well as the terminal.
4. Radius on the terminal is optional.
0.08
0.10
N
16
5. N is the total number of terminals.
Marking: YYWWVZZ.
YY
WW
V
ZZ
Year
Week
Assembly plant identifier
Assembly traceability code
www.ams.com
Revision 1.1
32 - 36
AS5262
Datasheet - Package Drawings and Markings
Figure 21. Vertical Cross Section of MLF-16
Notes:
1. All dimensions in mm.
2. Die thickness 0.150mm nom.
3. Adhesive thickness 0.011mm.
4. Spacer thickness 0.203mm typ.
www.ams.com
Revision 1.1
33 - 36
AS5262
Datasheet - Revision History
Revision History
Revision
Date
Owner
Description
Initial revision
Updated Figure 3, Table 1, Table 2, Table 10 and Figure 12
1.0
1.1
Oct 30, 2012
Oct 31, 2012
mub
Note: Typos may not be explicitly mentioned under revision history.
www.ams.com
Revision 1.1
34 - 36
AS5262
Datasheet - Ordering Information
11 Ordering Information
The devices are available as the standard products shown in Table 18.
Table 18. Ordering Information
Ordering Code
Description
Delivery Form
Package
AS5262-HMFP
12-bit programmable redundant angle position sensor with analog outputs
Tape&Reel
MLF 16 6x6
Note: All products are RoHS compliant and ams green.
Buy our products or get free samples online at www.ams.com/ICdirect
Technical Support is available at www.ams.com/Technical-Support
For further information and requests, email us at sales@ams.com
(or) find your local distributor at www.ams.com/distributor
www.ams.com
Revision 1.1
35 - 36
AS5262
Datasheet - Copyrights
Copyrights
Copyright © 1997-2012, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights
reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the
copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no
warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing
by ams AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by ams AG is believed to be correct and accurate. However, ams AG shall not be liable to recipient or any third
party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the
technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other
services.
Contact Information
Headquarters
ams AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
Tel : +43 (0) 3136 500 0
Fax : +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.ams.com/contact
www.ams.com
Revision 1.1
36 - 36
相关型号：
©2020 ICPDF网 联系我们和版权申明