AS7263_技术文档

AS7263

6-Channel NIR Spectral_ID Device with

Electronic Shutter and Smart Interface

The AS7263 is a digital 6-channel spectrometer for spectral

identification in the near IR (NIR) light wavelengths. AS7263

consists of 6 independent optical filters whose spectral re-

sponse is defined in the NIR wavelengths from approximately

600nm to 870nm with full-width half-max (FWHM) of 20nm. An

integrated LED driver with programmable current is provided

for electronic shutter applications.

General Description

The AS7263 integrates Gaussian filters into standard CMOS sil-

icon via Nano-optic deposited interference filter technology

and is packaged an LGA package that provides a built in aper-

ture to control the light entering the sensor array.

Control and Spectral data access is implemented through either

the I²C register set, or with a high level AT Spectral Command

set via a serial UART.

Ordering Information and Content Guide appear at end of

datasheet.

Key Benefits & Features

The benefits and features of AS7263, 6-Channel NIR

Spectral_ID Device with Electronic Shutter and Smart Interface

are listed below:

Figure 1:

Added Value of Using AS7263

Benefits

Features

• 6 near-IR channels: 610nm, 680nm, 730nm, 760nm,

810nm and 860nm, each with 20nm FWHM

• Compact 6-channel spectrometry solution

• Simple text-based command interface via UART,

or direct register read and write with interrupt

on sensor ready option on I²C

• UART or I²C slave digital Interface

• Lifetime-calibrated sensing with no drift over

time or temperature

• NIR filter set realized by silicon interference filters

• No additional signal conditioning required

• Electronic shutter control/synchronization

• Low voltage operation

• 16-bit ADC with digital access

• Programmable LED drivers

• 2.7V to 3.6V with I²C interface

• 20-pin LGA package 4.5mm x 4.7mm x 2.5mm,

-40°C to 85°C temperature range

• Small, robust package, with built-in aperture

ams Datasheet

[v1-00] 2016-Nov-25

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AS7263 − General Description

Applications

The AS7263 applications include:

• Product authentication

• Bank note/document validation

• Chemical analysis

• Food/beverage safety

Block Diagram

The functional blocks of this device are shown below:

Figure 2:

AS7263 NIR Spectral_ID System

3V

10uF

100nF

3V

VDD1

RX / SCL_S

VDD2

3V

uP

TX / SDA_S

INT

LED_IND

LED_DRV

AS7263

Light

6-channel

NIR

Sensor

MOSI

MISO

Source

Flash

Memory

SCK

Light in

CSN_EE

Reflective

Surface

GND

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AS7263 − Pin Assignment

The device pin assignments are described below.

Pin Assignment

Figure 3:

Pin Diagram (Top View)

20

16

1

15

5

11

6

10

Figure 4:

Pin Description

Pin Number

Pin Name

Description

1

2

NF

RESN

Not Functional. Do not connect.

Reset, Active LOW

3

SCK

SPI Serial Clock

4

MOSI

SPI Master Out Slave In

SPI Master In Slave Out

5

MISO

6

CSN_EE

CSN_SD

I2C_ENB

NF

Chip Select for External Serial Flash Memory, Active LOW

Chip Select for SD Card Interface, Active LOW

Select UART (Low) or I²C (High) Operation

Not Functional. Do not connect.

7

8

9

10

11

12

13

14

NF

Not Functional. Do not connect.

RX/SCL_S

TX/SDA_S

INT

RX (UART) or SCL_S (I²C Slave) Depending on I²C_ENB

TX (UART) or SDA_S (I²C Slave) Depending on I²C_ENB

Interrupt, Active LOW

VDD2

Voltage Supply

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AS7263 − Pin Assignment

Pin Number

Pin Name

LED_DRV

GND

Description

LED Driver Output for Driving LED, Current Sink

Ground

15

16

17

18

19

20

VDD1

Voltage Supply

LED_IND

NF

LED Driver Output for Indicator LED, Current Sink

Not Functional. Do not connect.

NF

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AS7263 − Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under

Absolute Maximum Ratings

Electrical Characteristics is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability. The device is not designed for high energy UV

(ultraviolet) environments, including upward looking outdoor

applications, which could affect long term optical performance.

Figure 5:

Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

V

Supply Voltage VDD1

Supply Voltage VDD2

-0.3

5

V

Pin VDD1 to GND

Pin VDD2 to GND

DD1_MAX

V

DD2_MAX

Input/Output Pin

Voltage

V

-0.3

VDD+0.3

V

Input/Output Pin to GND

JESD78D

DD_IO

Input Current

(latch-up immunity)

I

100

mA

SCR

Electrostatic Discharge

HBM

1000

V

JS-001-2014

JSD22-C101F

ESD

HBM

Electrostatic Discharge

CDM

500

CDM

Temperature Ranges and Storage Conditions

Storage Temperature

Range

T

-40

85

260

85

°C

%

STRG

IPC/JEDEC J-STD-020

The reflow peak soldering

temperature (body

temperature) is specified

according to IPC/JEDEC

J-STD-020

Package Body

Temperature

T

BODY

“Moisture/Reflow

Sensitivity Classification

for Non-hermetic Solid

State Surface Mount

Devices.”

Relative Humidity

(non-condensing)

RH

5

NC

Moisture Sensitivity

Level

Maximum floor life time of

168 hours

MSL

3

ams Datasheet

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AS7263 − Electrical Characteristics

All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V,

Electrical Characteristics

T

=25°C. The parameters with min and max values are

AMB

guaranteed with production tests or SQC (Statistical Quality

Control) methods.

Figure 6:

Electrical Characteristics of AS7263

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

General Operating Conditions

VDD1

/VDD2

Voltage Operating Supply UART Interface

2.97

3.3

3.6

V

VDD1

/VDD2

2

Voltage Operating Supply

2.7

-40

3.3

25

I C Interface

T

Operating Temperature

Operating Current

Standby Current

85

5

°C

mA

μA

AMB

I

VDD

(1)

12

16

I

STANDBY

Internal RC Oscillator

Frequency

F

15.7

-8.5

16.3

1.2

MHz

ns

OSC

(2)

Internal Clock Jitter

@25°C

t

JITTER

Temperature Sensor

Absolute Accuracy of the

Temperature

Measurement

D

I

8.5

°C

TEMP

Indicator LED

LED Current

1

4

8

mA

%

IND

I

Accuracy of Current

-30

30

ACC

Voltage Range of

Connected LED

V

Vds of current sink

0.3

VDD

V

LED

LED_DRV

I

LED Current

12.5, 25, 50 or 100

12.5

-10

100

10

mA

%

LED1

ACC

I

Accuracy of Current

Voltage Range of

Connected LED

V

Vds of current sink

0.3

VDD

V

LED

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AS7263 − Electrical Characteristics

Symbol

Parameter

Conditions

Digital Inputs and Outputs

Vin=0V or VDD

Min

Typ

Max

Unit

I , I

Logic Input Current

-1

1

μA

IH IL

Logic Input Current (RESN

pin)

I

Vin=0V

-0.2

mA

ILRESN

0.7*

VDD

V

CMOS Logic High Input

CMOS Logic Low Input

VDD

V

IH

0.3*

VDD

V

0

IL

VDD -

0.4

V

CMOS Logic High Output I=1mA

OH

V

CMOS Logic Low Output

Current Rise Time

I=1mA

0.4

5

V

OL

(2)

C(Pad)=30pF

ns

t

RISE

(2)

Current Fall Time

5

FALL

Note(s):

1. 15μA over temperature

2. Guaranteed, not tested in production

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AS7263 − Timing Characteristics

Timing Characteristics

Figure 7:

AS7263 I²C Slave Timing Characteristics

Symbol Parameter

Condition

Min

Typ

Max

Unit

I²C Interface

f

SCL Clock Frequency

0

400

kHz

μs

SCLK

Bus Free Time

Between a STOP and

START

t

1.3

BUF

Hold Time

(Repeated) START

t

0.6

1.3

0.6

μs

HS:STA

LOW Period of SCL

Clock

t

LOW

HIGH Period of SCL

Clock

t

HIGH

Setup Time for a

Repeated START

t

SU:STA

t

Data Hold Time

Data Setup Time

0

0.9

μs

ns

HS:DAT

100

SU:DAT

Rise Time of Both

SDA and SCL

t

20

0.6

300

ns

μs

pF

R

Fall Time of Both SDA

and SCL

t

F

Setup Time for STOP

Condition

t

SU:STO

Capacitive Load for

Each Bus Line

CB — total capacitance of

one bus line in pF

C

400

10

B

I/O Capacitance

(SDA, SCL)

C

I/O

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AS7263 − Timing Characteristics

Figure 8:

I²C Slave Timing Diagram

t_LOW

t_R

t_F

SCL

t_HIGH

P

S

P

t_SU:DAT

t_SU:STA

t_HD:STA

t_HD:DAT

t_SU:STO

V_IH

V_IL

SDA

t_BUF

Stop

Start

Figure 9:

AS7263 SPI Timing Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

SPI Interface

f

Clock Frequency

Clock High Time

Clock Low Time

SCK Rise Time

SCK Fall Time

0

40

5

16

MHz

ns

SCK

t

SCK_H

t

ns

SCK_L

t

ns

SCK_RISE

t

5

ns

SCK_FALL

Time between CSN high-low

transition to first SCK high

transition

t

CSN Setup Time

CSN Hold Time

50

ns

CSN_S

Time between last SCK

falling edge and CSN

low-high transition

t

100

CSN_H

t

CSN Disable Time

Data-Out Setup Time

Data-Out Hold Time

Data-In Valid

100

5

ns

CSN_DIS

t

DO_S

t

5

DO_H

t

10

DI_V

Note(s):

1. Guaranteed, not tested in production

ams Datasheet

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AS7263 − Timing Characteristics

Figure 10:

SPI Master Write Timing Diagram

t_{CS N_DIS}

CSN

tCSN_H

t_{SCK_RISE}

t_{SCK_FALL}

t_{CSN_S}

SCK

t_{DO_S}

t_{DO_H}

MOSI

MISO

MSB

LSB

HI-Z

Figure 11:

SPI Master Read Timing Diagram

CSN_xx

tSCK_H

tSCK_L

SCK

t_{DI_V}

Dont care

MOSI

MISO

MSB

LSB

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AS7263 − Timing Characteristics

Optical Characteristics

Figure 12:

(1)

Optical Characteristics of AS7263 (Pass Band)

Channel

(nm)

Symbol Parameter Test Conditions

Min

Typ

Max

Unit

counts/

(2), (4)

(3),(4)

R

S

Channel R

Channel S

Channel T

Channel U

Channel V

Channel W

610

680

730

760

810

860

20

Incandescent

35

2

(ꢀW/cm )

counts/

(2), (4)

(3),(4)

2

(ꢀW/cm )

counts/

T

2

(ꢀW/cm )

counts/

U

V

2

(ꢀW/cm )

counts/

2

(ꢀW/cm )

counts/

W

2

(ꢀW/cm )

Full Width

Half Max

FWHM

Wacc

20

5

nm

Wavelength

Accuracy

Dark

Channel

Counts

GAIN=64,

dark

f

5

counts

deg

T

=25°C

AMB

Angle of

Incidence

On the sensors

20.0

Note(s):

1. Calibration & measurements are made using diffused light.

2. Each channel is tested with GAIN = 16x, Integration Time (INT_T) = 166ms and VDD = VDD1 = VDD2 = 3.3V, T_AMB=25°C.

3. The accuracy of the channel counts/ꢀW/cm²is 12%.

4. The light source is an incandescent light with an irradiance of ~1500ꢀW/cm²(300-1000nm). The energy at each channel (R, S, T, U,

V, W) is calculated with a 33nm bandwidth around the center wavelengths (610, 680, 730, 760, 810, 860nm).

ams Datasheet

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AS7263 − Typical Operating Characteristics

Typical Operating

Characteristics

Figure 13:

Spectral Responsivity

AS7263

1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

R

S

T

U

V

W

0

550

600

650

700

750

800

850

900

950

λ - Wavelength (nm)

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AS7263 − Detailed Description

Detailed Description

Figure 14:

Internal Block Diagram

VDD1

VDD2

INT

LED_IND

RX / SCL_S

2

UART / I C

LED_DRV

TX / SDA_S

I2C_ENB

°C

MISO

Spectral_ID

Engine

SPI

Master

MOSI

SCK

CSN_SD

Multi

Spectral

Sensor

R

S T U V

W

SYNC / RESN

RC Osc

16MHz

GND

6-Channel NIR Spectral_ID Detector

The AS7263 6-channel Spectral_ID is a next-generation digital

spectral sensor device. Each channel has a Gaussian filter

characteristic with a full width half maximum (FWHM)

bandwidth of 20nm. The channels are spaced roughly at 50nm

intervals in the NIR spectrum: R, S, T, U, V, W. The sensor contains

analog-to-digital converters (16-bit resolution ADC), which

integrate the current from each channel’s photodiode. Upon

completion of the conversion cycle, the integrated result is

transferred to the corresponding data registers. The transfers

are double-buffered to ensure that the integrity of the data is

maintained.

Interference filters enable high temperature stability and

eliminate lifetime drift. Filter accuracy will be affected by the

angle of incidence, and require 0° angle of incidence 20.0° for

specified accuracy. Angles of light beyond this will shift the

spectral response of the filters. The LGA package aperture

assists in the control of the light input, helping to maintain the

proper angle of incidence at the sensors.

ams Datasheet

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AS7263 − Detailed Description

Data Conversion Description

AS7263 spectral conversion is implemented via two photodi-

ode banks per device. Bank 1 consists of data from the S, T, U,

V photodiodes. Bank 2 consists of data from the R, T, U, W pho-

todiodes. Spectral conversion requires the integration time (IT

in ms) set to complete. If both photodiode banks are required

to complete the conversion, the 2nd bank requires an addition-

al IT ms. Minimum IT for a single bank conversion is 2.8 ms. If

data is required from all 6 photodiodes then the device must

perform 2 full conversions (2 x Integration Time).

The spectral conversion process is controlled with BANK Mode

settings as follows:

BANK Mode 0: Data will be available in registers S, T, U & V (R

and W registers will be zero)

BANK Mode 1: Data will be available in registers R, T, U & W (V

and W registers will be zero)

BANK Mode 2: Data will be available in registers R, S, T, U, V & W

When the bank setting is Mode 0, Mode 1, or Mode 2, the spec-

tral data conversion process operates continuously, with new

data available after each IT ms period. In the continuous modes,

care should be taken to assure prompt interrupt servicing so

that integration values from both banks are all derived from the

same spectral conversion cycle.

BANK Mode 3: Data will be available in registers R, S, T, U, V & W

in One-Shot mode

When the bank setting is Mode 3, the device operates in

One-Shot mode. Spectral conversion occurs only when bit 0 of

the control register (1SHOT) is set to 1. The 1SHOT bit in the

control register is subsequently cleared by hardware at the

same time the DATA_RDY bit is set to 1 indicating the availability

of spectral conversion result data. The One-Shot mode is in-

tended for use when it is critical to ensure that spectral conver-

sion results are obtained contemporaneously.

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AS7263 − Detailed Description

Figure 15:

Photo Diode Array

T

U

V

S

R

W

Figure 16:

Bank Mode and Data Conversion

BANK Mode 0

One Conversion

S, T, U, V

R, T, U, W

S, T, U, V

Integration Time

BANK Mode 1

One Conversion

Integration Time

BANK Mode 2

1st Conversion

Integration Time

2nd Conversion

R, T, U, W

Integration Time

RC Oscillator

The timing generation circuit consists of an on-chip 16MHz,

temperature compensated oscillator, which provides the mas-

ter clock for the AS7263.

ams Datasheet

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AS7263 − Detailed Description

Temperature Sensor

The Temperature Sensor is constantly measuring the on-chip

temperature and enables temperature compensation proce-

dures.

Reset

Pulling down the RESN pin for longer than 100ms resets the

AS7263.

Figure 17:

Reset Circuit

RESN

CLE

Reset

Push > 100ms

AS7263

Indicator LED

The LED, connected to pin LED_IND, can be used to indicate

programming progress of the device.

While programming the AS7263 via the external SD card the

indicator LED starts flashing (500ms pulses). When program-

ming is completed the indicator LED is switched off. The LED

(LED0) can be turned ON/OFF via AT commands or via I²C reg-

ister control. The LED sink current is programmable from 1mA,

2mA, 4mA and 8mA.

Electronic Shutter with LED_DRV Driver Control

There are two LED driver outputs that can be used to control

up to 2 LEDs. This will allow different wavelength light sources

to be used in the same system. The LED output sink currents are

programmable and can drive external LED sources: LED_IND

from 1mA, 2mA, 4mA and 8mA and LED_DRV from 12.5mA,

25mA, 50mA and 100mA. The sources can be turned off and on

via I²C registers control or AT commands and provides the de-

vice with an electronic shutter.

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AS7263 − Detailed Description

Interrupt Operation

If BANK is set to Mode 0 or Mode 1 then the data is ready after

st

the 1 integration time. If BANK is set to Mode 2 or Mode 3 then

the data is ready after two integration times. If the interrupt is

enabled (INT = 1) then when the data is ready, the INT line is

pulled low and DATA_RDY is set to 1. The INT line is released

(returns high) when the control register is read. DATA_RDY is

cleared to 0 when any of the sensor registers R, S, T, U, V, W are

st

read. Since each sensor value is 2 bytes, after the 1 byte is read

nd

the 2 byte is shadow-protected in case an integration cycle

st

completes just after the 1 byte is read.

In continuous spectral conversion mode (BANK setting of Mode

0, Mode 1, or Mode 2), the sensors continue to gather informa-

tion at the rate of the integration time, hence if the sensor reg-

isters are not read when the interrupt line goes low, it will stay

low and the next cycle’s sensor data will be available in the

registers at the end of the next integration cycle. When the con-

trol register BANK bits are written with a value of Mode 3,

One-Shot Spectral Conversion mode is entered. When a single

set of contemporaneous sensor readings is desired, writing

BANK Mode 3 to the control register immediately triggers ex-

actly two spectral data conversion cycles. At the end of these

two conversion cycles, the DATA_RDY bit is set as for the other

BANK modes. To perform a new One-Shot sequence, the control

register BANK bits should be written with a value of Mode 3

again. This process may continue until the user writes a different

value into the BANK bits.

I²C Slave Interface

If selected by the I2C_ENB pin setting, interface and control can

be accomplished through an I²C compatible slave interface to

a set of registers that provide access to device control functions

and output data. These registers on the AS7263 are, in reality,

implemented as virtual registers in software. The actual I²C slave

hardware registers number only three and are described in the

table below. The steps necessary to access the virtual registers

defined in the following are explained in pseudocode for exter-

nal I²C master writes and reads below.

I²C Feature List

• Fast mode (400kHz) and standard mode (100kHz) support.

• 7+1-bit addressing mode.

• Write format: Byte.

• Read format: Byte.

• SDA input delay and SCL spike filtering by integrated

RC-components.

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AS7263 − Detailed Description

Figure 18:

I²C Slave Device Address and Physical Registers

Entity

Description

Note

Byte = 1001 001x

Device Slave

Address

8-bit Slave Address

x= 1 for Master Read (byte = 93 hex)

x= 0 for Master Write (byte = 92 hex)

Register Address = 0x00

Bit 1: TX_VALID

I²C slave interface STATUS

register.

Read-only.

0 -> New data may be written to WRITE register

1 -> WRITE register occupied. Do NOT write.

Bit 0: RX_VALID

STATUS

Register

0 -> No data is ready to be read in READ register.

1 -> Data byte available in READ register.

Register Address = 0x01

I²C slave interface WRITE

register.

Write-only.

8-Bits of data written by the I²C Master intended

for receipt by the I²C slave. Used for both virtual

register addresses and write data.

WRITE Register

READ Register

I²C slave interface

READ register.

Read-only.

Register Address = 0x02

8-Bits of data to be read by the I²C Master.

I²C Virtual Register Write Access

Figure 19 shows the pseudocode necessary to write virtual

registers on the AS7263. Note that, because the actual registers

of interest are realized as virtual registers, a means of indicating

whether there is a pending read or write operation of a given

virtual register is needed. To convey this information, the most

significant bit of the virtual register address is used as a marker.

If it is 1, then a write is pending, otherwise the slave is expecting

a virtual read operation. The pseudocode illustrates the proper

technique for polling of the I²C slave status register to ensure

the slave is ready for each transaction.

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AS7263 − Detailed Description

Figure 19:

I²C Virtual Register Byte Write

Pseudocode

Poll I²C slave STATUS register;

If TX_VALID bit is 0, a write can be performed on the interface;

Send a virtual register address and set the MSB of the register address to 1 to indicate the pending write;

Poll I²C slave STATUS register;

If TX_VALID bit is 0, the virtual register address for the write has been received and the data may now be written;

Write the data.

Sample Code:

#define I2C_AS72XX_SLAVE_STATUS_REG0x00

#define I2C_AS72XX_SLAVE_WRITE_REG0x01

#define I2C_AS72XX_SLAVE_READ_REG0x02

#define I2C_AS72XX_SLAVE_TX_VALID0x02

#define I2C_AS72XX_SLAVE_RX_VALID0x01

void i2cm_AS72xx_write(uint8_t virtualReg, uint8_t d)

{

volatile uint8_tstatus;

while (1)

{

// Read slave I²C status to see if the write buffer is ready.

status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG);

if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)

// No inbound TX pending at slave. Okay to write now.

break ;

}

// Send the virtual register address (setting bit 7 to indicate a pending write).

i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, (virtualReg | 0x80)) ;

while (1)

{

// Read the slave I2C status to see if the write buffer is ready.

status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;

if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)

// No inbound TX pending at slave. Okay to write data now.

break;

}

// Send the data to complete the operation.

i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, d);

}

ams Datasheet

[v1-00] 2016-Nov-25

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AS7263 − Detailed Description

I²C Virtual Register Read Access

Figure 20 shows the pseudocode necessary to read virtual reg-

isters on the AS7263. Note that in this case, reading a virtual

register, the register address is not modified.

Figure 20:

I²C Virtual Register Byte Read

Pseudocode

Poll I²C slave STATUS register;

If TX_VALID bit is 0, the virtual register address for the read may be written;

Send a virtual register address;

Poll I²C slave STATUS register;

If RX_VALID bit is 1, the read data is ready;

Read the data.

Sample Code:

uint8_t i2cm_AS72xx_read(uint8_t virtualReg)

{

volatile uint8_t status, d ;

while (1)

{

// Read slave I2C status to see if the read buffer is ready.

status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;

if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0)

// No inbound TX pending at slave. Okay to write now.

break ;

}

// Send the virtual register address (setting bit 7 to indicate a pending write).

i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, virtualReg) ;

while (1)

{

// Read the slave I²C status to see if our read data is available.

status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ;

if ((status & I2C_AS72XX_SLAVE_RX_VALID) != 0)

// Read data is ready.

break ;

}

// Read the data to complete the operation.

d = i2cm_read(I2C_AS72XX_SLAVE_READ_REG) ;

return d ;s

}

The details of the i2cm_read() and i2cm_write() functions in

previous Figures are dependent upon the nature and imple-

mentation of the external I²C master device.

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AS7263 − Detailed Description

I²C Virtual Register Set

The figure below provides a summary of the AS7263 I²C register

set. Figures after that provide additional details. All register

data is hex or, where noted, 32-bit floating point, and all

multi-byte entities are Big Endian (most significant byte is

situated at the lowest register address).

Figure 21:

I²C Register Set Overview

Addr

Name

<D0>

Version Registers

0x00:

0x01

HW_Version

FW_Version

Hardware Version

Firmware Version

0x02:

0x03

Control Registers

DATA_

RDY

0x04

Control_Setup

RST

INT

GAIN

Bank

Integration Time

RSVD

0x05

0x06

INT_T

Device_Temp

Device Temperature

LED_

DRV

0x07

LED_Control

RSVD

ICL_DRV

ICL_IND

LED_IND

Sensor Raw Data Registers

0x08

0x09

0x0A

0x0B

0x0C

0x0D

0x0E

0x0F

0x10

0x11

0x12

0x13

R_High

R_Low

S_High

S_Low

T_High

T_Low

U_High

U_Low

V_High

V_Low

W_High

W_Low

Channel R High Data Byte

Channel R Low Data Byte

Channel S High Data Byte

Channel S Low Data Byte

Channel T High Data Byte

Channel T Low Data Byte

Channel U High Data Byte

Channel U Low Data Byte

Channel V High Data Byte

Channel V Low Data Byte

Channel W High Data Byte

Channel W Low Data Byte

ams Datasheet

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AS7263 − Detailed Description

Addr

Name

<D0>

Sensor Calibrated Data Registers

Channel R Calibrated Data (float)

0x14:

0x17

R_Cal

S_Cal

T_Cal

U_Cal

V_Cal

W_Cal

0x18:

0x1B

Channel S Calibrated Data (float)

Channel T Calibrated Data (float)

Channel U Calibrated Data (float)

Channel V Calibrated Data (float)

Channel W Calibrated Data (float)

0x1C:

0x1F

0x20:

0x23

0x24:

0x27

0x28:

0x2B

Detailed Register Description

Figure 22:

HW Version Registers

Addr: 0x00

HW_Version

Bit

Bit Name

Default

Access

Bit Description

7:0

Device Type

0100000

R

Device type number

Addr: 0x01

HW_Version

Bit

Bit Name

Default

Access

Bit Description

7:0

HW Version

00111111

R

Hardware version

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Detailed Description

Figure 23:

FW Version Registers

Addr: 0x02

FW_Version

Access

Bit

7:6

5:0

Bit Name

Default

Bit Description

Minor

Version

R

Minor Version [1:0]

Sub Version

Addr: 0x03

FW_Version

Bit

Bit Name

Access

Bit Description

Major

Version

7:4

R

Major Version

Minor

Version

3:0

R

Minor Version [5:2]

Figure 24:

Control Setup Register

Addr: 0x04/0x84

Control_Setup

Bit

Bit Name

Default

Access

Bit Description

Soft Reset, Set to 1 for soft reset, goes

to 0 automatically after the reset

7

RST

INT

0

R/W

Enable interrupt pin output (INT),

1: Enable, 0: Disable

6

0

R/W

Sensor Channel Gain Setting (all

channels)

‘b00=1x; ‘b01=3.7x; ‘b10=16x;

‘b11=64x

5:4

GAIN

BANK

Data Conversion Type (continuous)

‘b00=Mode 0; ‘b01=Mode 1;

3:2

10

R/W

‘b10=Mode 2; ‘b11=Mode 3 One-Shot

1: Data Ready to Read, sets INT active

if interrupt is enabled.

Can be polled if not using INT.

1

0

DATA_RDY

RSVD

0

R/W

R

Reserved; Unused

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Document Feedback

AS7263 − Detailed Description

Figure 25:

Integration Time Register

Addr: 0x05/0x85

INT_T

Bit

Bit Name

Default

Access

Bit Description

Integration time =

<value> * 2.8ms

7:0

INT_T

0xFF

R/W

Figure 26:

Device Temperature Register

Addr: 0x06

Device_Temp

Access

Bit

Bit Name

Default

Bit Description

Device temperature

data byte (°C)

7:0

Device_Temp

R

Figure 27:

LED Control Register

Addr: 0x07/0x87

LED Control

Bit

Bit Name

Default

Access

Bit Description

7:6

RSVD

0

R

Reserved

LED_DRV current limit

5:4

3

ICL_DRV

LED_DRV

ICL_IND

LED_IND

00

R/W

‘b00=12.5mA; ‘b01=25mA;

‘b10=50mA; ‘b11=100mA

Enable LED_DRV

1: Enabled; 0: Disabled

0

00

0

R/W

LED_IND current limit

‘b00=1mA; ‘b01=2mA; ‘b10=4mA;

‘b11=8mA

2:1

0

Enable LED_IND

1: Enabled; 0: Disabled

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AS7263 − Detailed Description

Figure 28:

Sensor Raw Data Registers

Addr: 0x08

R_High

Access

Bit

Bit Name

Default

Bit Description

7:0

R_High

R

Channel R High Data Byte

Addr: 0x09

R_Low

Bit

Bit Name

Access

Bit Description

7:0

R_Low

R

Channel R Low Data Byte

Addr: 0x0A

S_High

Bit

Bit Name

Access

Bit Description

7:0

S_High

R

Channel S High Data Byte

Addr: 0x0B

S_Low

Bit

Bit Name

Access

Bit Description

7:0

S_Low

R

Channel S Low Data Byte

Addr: 0x0C

T_High

Bit

Bit Name

Access

Bit Description

7:0

T_High

R

Channel T High Data Byte

Addr: 0x0D

T_Low

Bit

Bit Name

Access

Bit Description

7:0

T_Low

R

Channel T Low Data Byte

Addr: 0x0E

U_High

Bit

Bit Name

Access

Bit Description

7:0

U_High

R

Channel U High Data Byte

Addr: 0x0F

U_Low

Bit

Bit Name

Access

Bit Description

7:0

U_Low

R

Channel U Low Data Byte

ams Datasheet

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Page 25

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AS7263 − Detailed Description

Addr: 0x10

Bit Name

V_High

Access

Bit

Default

Bit Description

7:0

V_High

R

Channel V High Data Byte

Addr: 0x11

V_Low

Bit

Bit Name

Access

Bit Description

7:0

V_Low

R

Channel V Low Data Byte

Addr: 0x12

W_High

Bit

Bit Name

Access

Bit Description

7:0

W_High

R

Channel W High Data Byte

Addr: 0x13

W_Low

Bit

Bit Name

Access

Bit Description

7:0

W_Low

R

Channel W Low Data Byte

Figure 29:

Sensor Calibrated Data Registers

Addr: 0x14:0x17

R_Cal

Bit

Bit Name

Default

Access

Bit Description

31:0

R_Cal

R

Channel R Calibrated Data (float)

Addr: 0x18:0x1B

S_Cal

Bit

Bit Name

Access

Bit Description

31:0

S_Cal

R

Channel S Calibrated Data (float)

Addr: 0x1C:0x1F

T_Cal

Bit

Bit Name

Access

Bit Description

31:0

T_Cal

R

Channel T Calibrated Data (float)

Addr: 0x20:0x23

U_Cal

Bit

Bit Name

Access

Bit Description

31:0

U_Cal

R

Channel U Calibrated Data (float)

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Detailed Description

Addr: 0x24:0x27

V_Cal

Access

Bit

Bit Name

Default

Bit Description

31:0

V_Cal

R

Channel V Calibrated Data (float)

Addr: 0x28:0x2B

W_Cal

Bit

Bit Name

Access

Bit Description

31:0

W_Cal

R

Channel W Calibrated Data (float)

4-Byte Floating-Point (FP) Registers

Several 4-byte registers (hex) are shown in the tables. Here is

an example of how the registers are used to represent floating

point data (based on the IEEE 754 standard):

Figure 30:

Example of the IEEE 754 Standard

The floating point (FP) value assumed by 32 bit binary32 data

with a biased exponent e (the 8 bit unsigned integer) and a 23

bit fraction is (for the above example).

23







–i

(e – 127)

^sign

 ^(b

FPvalue = (–1)

1 +

_{23 – i})(2 ) x2









i = 1

23





–i

(124 – 127)

⁰



 ^(b

FPvalue = (–1) 1 +

_{23 – i})(2 ) x2









i = 1

ams Datasheet

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AS7263 − Detailed Description

FPvalue = (1)x(1 + 2^–2)x2^(–3)= 0.15625

UART Interface

If selected by the I2C_ENB pin setting, the UART module imple-

ments the TX and RX signals as defined in the RS-232 / V.24

standard communication protocol.

It has on both, receive and transmit path, a 16 entry deep FIFO.

It can generate interrupts as required.

UART Feature List¹

• Full Duplex Operation (Independent Serial Receive and

Transmit Registers) with FIFO buffer of 8 byte for each.

• At a clock rate of 16MHz it supports communication at

115200Baud.

• Supports Serial Frames with 8 Data Bits, 1 Parity Bit and 1

Stop Bit.

• High Resolution Baud Rate Generator.

Theory of Operation

Transmission

If data is available in the transmit FIFO, it will be moved into the

output shift register and the data will be transmitted at the

configured Baud Rate, starting with a Start Bit (logic zero) and

followed by a Stop Bit (logic one).

Reception

At any time, with the receiver being idle, if a falling edge of a

start bit is detected on the input, a byte will be received and

stored in the receive FIFO. The following Stop Bit will be checked

to be logic one.

1. With UART operation, min VDD of 2.97V is required as shown in Electrical Characteristics Figures.

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AS7263 − Detailed Description

Figure 31:

UART Protocol

Data Bits

D4

TX

D7

P

D0

D1

D2

D3

D5

D6

D0

Start Bit

Parity Bit Stop Bit Next Start

Tbit=1/Baude Rate

Always Low

Even or odd Always High

RX

D7

P

D1

D2

D3

D4

D0

Start Bit detected

After Tbit/2: Sampling of Start Bit

After T_bit: Sampling of Data

Sample Points

AT Command Interface

The microprocessor interface to control the NIR Spectral_ID

Sensor is via the UART, using the AT Commands across the UART

interface.

The 6-channel Spectral _ID sensor provides a text-based serial

command interface borrowed from the “AT Command” model

used in early Hayes modems.

For example:

• Read DATA value: ATDATA → <data>OK

• Set the gain of the sensor to 1x: ATGAIN =0 → OK

The “AT Command Interface Block Diagram”, shown below be-

tween the network interface and the core of the system, pro-

vides access to the Spectral_ID engine’s control and configura-

tion functions.

Figure 32:

AT Command Interface Block Diagram

RX

AT

Command

Interface

AT Commands

Spectral_ID

Engine

uP

TX

AT Command Interface

AS726x

ams Datasheet

[v1-00] 2016-Nov-25

Page 29

Document Feedback

AS7263 − Detailed Description

In the Figure below, numeric values may be specified with no

leading prefix, in which case they will be interpreted as

decimals, or with a leading “0x” to indicate that they are

hexadecimal numbers, or with a leading “‘b” to indicate that

they are binary numbers. The commands are loosely grouped

into functional areas. Texts appearing between angle brackets

(‘<‘ and ‘>‘) are commands or response arguments. A carriage

return character, a linefeed character, or both may terminate

commands and responses. Note that any command that

encounters an error will generate the “ERROR” response shown,

for example, in the NOP command at the top of the first table,

but has been omitted elsewhere in the interest of readability

and clarity.

Figure 33:

AT Commands

Command

Response

Description / Parameters

Spectral Data per Channel

<R_value>,

<S_value>,

<T_value>,

<U_value>,

<V_value>,

<W_value> OK

Read R, S, T, U, V & W data. Returns comma-separated 16-bit

integers.

ATDATA

<Cal_R_value>,

<Cal_S_value>,

<Cal_T_value>,

<Cal_U_value>,

<Cal_V_value>,

Read calibrated R, S, T, U, V & W data. Returns comma-separated

32-bit floating point values.

ATCDATA

<Cal_W_value> OK

Sensor Configuration

Set sensor integration time. Values should be in the range [1...

255], with

ATINTTIME=<value> OK

integration time = <value> * 2.8ms.

Read sensor integration time, with

integration time = <value> * 2.8ms.

ATINTTIME

ATGAIN=<value>

ATGAIN

<value> OK

OK

Set sensor gain: 0=1X, 1=3.7x, 2=16x, 3=64x

Read sensor gain setting, returning 0, 1, 2, or 3 as defined

immediately above.

<value>OK

ATTEMP

Read temperature of chip in degree Celsius

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Detailed Description

Command

Response

Description / Parameters

Set Sensor Mode

0 = BANK Mode 0;

1 = BANK Mode 1;

2 = BANK Mode 2;

3 = BANK Mode 3 One-Shot;

4 = Sensors OFF

ATTCSMD=<value> OK

In One-Shot mode, each ATTCSMD=3 command triggers a

One-Shot reading

ATTCSMD

<value> OK

Read Sensor Mode, see above

<value>= # of samples

ATBURST=<value>

OK

(ATBURST=1 means run until ATBURST=0 is received (a special

case for continuous output)

LED Driver Controls

ATLED0=<value>

ATLED0

OK

Sets LED_IND: 100=ON, 0=OFF

Reads LED_IND setting: 100=ON, 0=OFF

Sets LED_DRV: 100=ON, 0=OFF

Reads LED_DRV setting: 100=ON, 0=OFF

<100|0>OK

OK

ATLED1=<value>

ATLED1

<100|0>OK

Sets LED_IND and LED_DRV current

LED_IND: bits 3:0; LED_DRV: 7:4 bits

LED_IND: ‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8ma

LED_DRV: ‘b00=12.5mA; ‘b01=25mA; ‘b10=50mA; ‘b11=100mA

ATLEDC=<value>

OK

ATLEDC

<value>OK

Reads LED_IND and LED_DRV current settings as shown above

NOP, Version Access, System Reset

OK → Success

ERROR → Failure

AT

NOP

ATRST

None

Software Reset – no response

Returns the system software version number

<SWversion#>→OK

ERROR → Failure

ATVERSW

Returns the system hardware revision and product ID, with bits

7:4 containing the part ID, and bits 3:0 yielding the chip revision

value.

<HWversion#>→ OK

ERROR → Failure

ATVERHW

Firmware Update

<value>= 16-bit checksum. Initial the firmware update process.

Bytes that follow is always 56k bytes

ATFWU=<value>

ATFW=<value>

ATFWS

OK

Download new firmware

Up to 7 Bytes represented as hex chars with no leading or

trailing 0x.

Repeat command till all 56k bytes of firmware are downloaded

Causes the active image to switch between the two possible

current images and then resets the IC

ams Datasheet

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AS7263 − Application Information

Application Information

Figure 34:

AS7263 Typical Application Circuit

3V3

17 VDD1

14 VDD2

RESN

CSN_SD

CSN_EE

MISO

7

6

5

4

3

8

1uF

100nF 10uF

1

2

5

6

3

7

/CS

DO

DI

10K

RST

2

16 GND

MOSI

Flash

Memory

3V3 Vled

SCK

CLK

15 LED_DRV

18 LED_IND

I2C_ENB

/WP

AS7263

/HOLD

DNP

0R

RX

11 RX/SCL_S

12 TX/SDA_S

13 INT

NC

19

20

1

10

9

TX

INT

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Package Drawings & Markings

Package Drawings & Markings

Figure 35:

Package Drawing LGA

RoHS

Green

Note(s):

1. XXXXX = tracecode

ams Datasheet

[v1-00] 2016-Nov-25

Page 33

Document Feedback

AS7263 − PCB Pad Layout

Suggested PCB pad layout guidelines for the LGA device are

shown.

PCB Pad Layout

Figure 36:

Recommended PCB Pad Layout

0.30

0.65

Unit: mm

1

4.40

Page 34

amsDatasheet

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[v1-00] 2016-Nov-25

AS7263 − Mechanical Data

Mechanical Data

Figure 37:

Tape & Reel Information

Note(s):

1. Each reel contains 2000 parts.

2. Measured from centreline of sprocket hole to centreline of pocket.

3. Cumulative tolerance of 10 sprocket holes is 0.20.

4. Other material available.

5. All dimensions in millimeters unless otherwise stated.

ams Datasheet

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Document Feedback

AS7263 − Storage & Soldering Information

Storage & Soldering

Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 38:

Solder Reflow Profile

Parameter

Reference

Device

2.5°C/s

Average temperature gradient in preheating

Soak time

t

2 to 3 minutes

Max 60 s

Max 50 s

Max 10 s

260° C

soak

t

Time above 217°C

1

t

Time above 230°C

2

Time above T

-10°C

t

peak

3

T

Peak temperature in reflow

peak

Temperature gradient in cooling

Max -5°C/s

Figure 39:

Solder Reflow Profile Graph

Not to scale — for reference only

T_peak

T₃

T₂

T₁

Time (s)

t₃

t₂

t₁

t_soak

Note(s):

1. Not to scale - for reference only.

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Storage & Soldering Information

Manufacturing Process Considerations

The AS7263 package is compatible with standard reflow

no-clean and cleaning processes including aqueous, solvent or

ultrasonic techniques. However, as an open-aperture device,

precautions must be taken to avoid particulate or solvent

contamination as a result of any manufacturing processes,

including pick and place, reflow, cleaning, integration assembly

and/or testing. Temporary covering of the aperture is allowed.

To avoid degradation of accuracy or performance in the end

product, care should be taken that any temporary covering and

associated sealants/debris are thoroughly removed prior to any

optical testing or final packaging.

Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is baked prior to being

dry packed for shipping.

Devices are dry packed in a sealed aluminized envelope called

a moisture-barrier bag with silica gel to protect them from

ambient moisture during shipping, handling, and storage

before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 12 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 12 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 12 month shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

ams Datasheet

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AS7263 − Storage & Soldering Information

Floor Life

The module has been assigned a moisture sensitivity level of

MSL 3. As a result, the floor life of devices removed from the

moisture barrier bag is 168 hours from the time the bag was

opened, provided that the devices are stored under the

following conditions:

• Floor Life: 168 hours

• Ambient Temperature: <30°C

• Relative Humidity: <60%

If the floor life or the temperature/humidity conditions have

been exceeded, the devices must be rebaked prior to solder

reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded,

rebake at 50°C for 12 hours.

Page 38

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AS7263 − Ordering & Contact Information

Ordering & Contact Information

Figure 40:

(1) (2)

Ordering Information

Ordering

Delivery

Form

Delivery

Quantity

Package Marking

Code

Description

6-Channel NIR Spectral_ID

Device with Electronic

Shutter & Smart Interface

AS7263-BLGT

20-pinLGA

AS7263

Tape & Reel

2000 pcs/reel

Note(s):

1. Required companion serial flash memory (must be ams verified) is ordered from the flash memory supplier (e.g. AT25SF041-SSHD-B

from Adesto Technologies)

2. AS7263 flash memory software is available from ams.

Online product information is available at

www.ams.com/AS7263

Buy our products or get free samples online at:

www.ams.com/ICdirect

Technical Support is available at:

www.ams.com/Technical-Support

Provide feedback about this document at:

www.ams.com/Document-Feedback

For further information and requests, e-mail us at:

ams_sales@ams.com

For sales offices, distributors and representatives, please visit:

www.ams.com/contact

Headquarters

ams AG

Tobelbader Strasse 30

8141 Premstaetten

Austria, Europe

Tel: +43 (0) 3136 500 0

Website: www.ams.com

ams Datasheet

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[v1-00] 2016-Nov-25

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AS7263 − RoHS Compliant & ams Green Statement

RoHS: The term RoHS compliant means that ams AG products

fully comply with current RoHS directives. Our semiconductor

products do not contain any chemicals for all 6 substance

categories, including the requirement that lead not exceed

0.1% by weight in homogeneous materials. Where designed to

be soldered at high temperatures, RoHS compliant products are

suitable for use in specified lead-free processes.

RoHS Compliant & ams Green

Statement

ams Green (RoHS compliant and no Sb/Br): ams Green

defines that in addition to RoHS compliance, our products are

free of Bromine (Br) and Antimony (Sb) based flame retardants

(Br or Sb do not exceed 0.1% by weight in homogeneous

material).

Important Information: The information provided in this

statement represents ams AG knowledge and belief as of the

date that it is provided. ams AG bases its knowledge and belief

on information provided by third parties, and makes no

representation or warranty as to the accuracy of such

information. Efforts are underway to better integrate

information from third parties. ams AG has taken and continues

to take reasonable steps to provide representative and accurate

information but may not have conducted destructive testing or

chemical analysis on incoming materials and chemicals. ams AG

and ams AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited

information may not be available for release.

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AS7263 − Copyrights & Disclaimer

Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,

material herein may not be reproduced, adapted, merged,

translated, stored, or used without the prior written consent of

the copyright owner.

Copyrights & Disclaimer

Devices sold by ams AG are covered by the warranty and patent

indemnification provisions appearing in its General Terms of

Trade. ams AG makes no warranty, express, statutory, implied,

or by description regarding the information set forth herein.

ams AG reserves the right to change specifications and prices

at any time and without notice. Therefore, prior to designing

this product into a system, it is necessary to check with ams AG

for current information. This product is intended for use in

commercial applications. Applications requiring extended

temperature range, unusual environmental requirements, or

high reliability applications, such as military, medical

life-support or life-sustaining equipment are specifically not

recommended without additional processing by ams AG for

each application. This product is provided by ams AG “AS IS”

and any express or implied warranties, including, but not

limited to the implied warranties of merchantability and fitness

for a particular purpose are disclaimed.

ams AG shall not be liable to recipient or any third party for any

damages, including but not limited to personal injury, property

damage, loss of profits, loss of use, interruption of business or

indirect, special, incidental or consequential damages, of any

kind, in connection with or arising out of the furnishing,

performance or use of the technical data herein. No obligation

or liability to recipient or any third party shall arise or flow out

of ams AG rendering of technical or other services.

ams Datasheet

Page 41

[v1-00] 2016-Nov-25

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AS7263 − Document Status

Document Status

Product Status

Definition

Information in this datasheet is based on product ideas in

the planning phase of development. All specifications are

design goals without any warranty and are subject to

change without notice

Product Preview

Pre-Development

Information in this datasheet is based on products in the

design, validation or qualification phase of development.

The performance and parameters shown in this document

are preliminary without any warranty and are subject to

change without notice

Preliminary Datasheet

Datasheet

Pre-Production

Production

Information in this datasheet is based on products in

ramp-up to full production or full production which

conform to specifications in accordance with the terms of

ams AG standard warranty as given in the General Terms of

Trade

Information in this datasheet is based on products which

conform to specifications in accordance with the terms of

ams AG standard warranty as given in the General Terms of

Trade, but these products have been superseded and

should not be used for new designs

Datasheet (discontinued)

Discontinued

Page 42

amsDatasheet

Document Feedback

[v1-00] 2016-Nov-25

AS7263 − Revision Information

Revision Information

Changes from 0-90 (2016-Nov-04) to current revision 1-00 (2016-Nov-25)

Initial production version for release

Page

Completely revised version

Note(s):

1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.

2. Correction of typographical errors is not explicitly mentioned.

ams Datasheet

[v1-00] 2016-Nov-25

Page 43

Document Feedback

AS7263 − Content Guide

1

2

General Description

Key Benefits & Features

Applications

Content Guide

Block Diagram

3

5

6

Pin Assignment

Absolute Maximum Ratings

Electrical Characteristics

8

Timing Characteristics

11 Optical Characteristics

12 Typical Operating Characteristics

13 Detailed Description

13 6-Channel NIR Spectral_ID Detector

14 Data Conversion Description

15 RC Oscillator

16 Temperature Sensor

16 Reset

16 Indicator LED

16 Electronic Shutter with LED_DRV Driver Control

17 Interrupt Operation

17 I²C Slave Interface

17 I²C Feature List

18 I²C Virtual Register Write Access

20 I²C Virtual Register Read Access

21 I²C Virtual Register Set

22 Detailed Register Description

27 4-Byte Floating-Point (FP) Registers

28 UART Interface

28 UART Feature List

28 Theory of Operation

28 Transmission

28 Reception

29 AT Command Interface

32 Application Information

33 Package Drawings & Markings

34 PCB Pad Layout

35 Mechanical Data

36 Storage & Soldering Information

36 Soldering Information

37 Manufacturing Process Considerations

37 Storage Information

37 Moisture Sensitivity

37 Shelf Life

38 Floor Life

38 Rebaking Instructions

39 Ordering & Contact Information

Page 44

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amsDatasheet

[v1-00] 2016-Nov-25

AS7263 − Content Guide

40 RoHS Compliant & ams Green Statement

41 Copyrights & Disclaimer

42 Document Status

43 Revision Information

ams Datasheet

[v1-00] 2016-Nov-25

Page 45

Document Feedback


型号：	AS7263
厂家：	AMS(艾迈斯)
描述：	6 near-IR channels: 610nm, 680nm, 730nm, 760nm, 810nm and 860nm, each with 20nm FWHM
文件：	总45页 (文件大小：956K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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