AAT3239ITS-3.3-T1 [ANALOGICTECH]

500mA MicroPower LDO; 500毫安微功率LDO
AAT3239ITS-3.3-T1
型号: AAT3239ITS-3.3-T1
厂家: ADVANCED ANALOGIC TECHNOLOGIES    ADVANCED ANALOGIC TECHNOLOGIES
描述:

500mA MicroPower LDO
500毫安微功率LDO

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中文:  中文翻译
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AAT3239  
500mA MicroPower™ LDO  
PowerLinear  
General Description  
Features  
The AAT3239 MicroPower low dropout (LDO) linear  
regulator is ideally suited for portable applications  
where very fast transient response, extended battery  
life, and small size are critical. The AAT3239 has  
been specifically designed for high-speed turn-on  
and turn-off performance, fast transient response,  
good power supply rejection ratio (PSRR), and is  
reasonably low noise, making it ideal for powering  
sensitive circuits with fast switching requirements.  
500mA Output Current  
Low Dropout: 400mV at 300mA  
High Accuracy: ±2.0%  
70µA Quiescent Current  
Fast Line and Load Transient Response  
High-Speed Device Turn-On and Shutdown  
High Power Supply Rejection Ratio  
Low Self Noise  
Short-Circuit Protection  
Over-Temperature Protection  
Uses Low Equivalent Series Resistance  
(ESR) Ceramic Capacitors  
Noise Reduction Bypass Capacitor  
Shutdown Mode for Longer Battery Life  
Low Temperature Coefficient  
TSOPJW 8-Pin Package  
Other features include low quiescent current, typical-  
ly 70µA, and low dropout voltage which is typically  
less than 400mV at 300mA. The device is output  
short-circuit protected and has a thermal shutdown  
circuit for additional protection under extreme operat-  
ing conditions.  
The AAT3239 also features a low-power shutdown  
mode for extended battery life. A reference bypass  
pin has been provided to improve PSRR perform-  
ance and output noise by connecting a small exter-  
nal capacitor from the AAT3239's reference output to  
ground.  
Applications  
Cellular Phones  
Digital Cameras  
Notebook Computers  
Personal Portable Electronics  
Portable Communication Devices  
The AAT3239 is available in a Pb-free, 8-pin  
TSOPJW package in factory-programmed voltages.  
Typical Application  
VIN  
VOUT  
IN  
OUT  
AAT3239  
BYP  
ON/OFF  
1µF  
EN  
GND  
10nF  
2.2µF  
GND  
GND  
3239.2006.03.1.2  
1
AAT3239  
500mA MicroPower™ LDO  
Pin Descriptions  
Pin #  
Symbol  
Function  
1
BYP  
Bypass capacitor connection; to improve AC ripple rejection, connect a 10nF  
capacitor to GND. This will also provide a soft-start function.  
2
EN  
Enable pin; this pin should not be left floating. When pulled low, the PMOS  
pass transistor turns off and all internal circuitry enters low-power mode, con-  
suming less than 1µA.  
3
4
OUT  
IN  
Output pin; should be decoupled with 2.2µF ceramic capacitor.  
Input voltage pin; should be decoupled with 1µF or greater capacitor.  
Ground connection pin.  
5, 6, 7, 8  
GND  
Pin Configuration  
TSOPJW-8  
(Top View)  
1
2
3
4
8
7
6
5
BYP  
EN  
GND  
GND  
GND  
GND  
OUT  
IN  
2
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
Absolute Maximum Ratings1  
Symbol  
Description  
Value  
Units  
VIN  
VENIN(MAX)  
IOUT  
Input Voltage  
6
V
V
Maximum EN to Input Voltage  
DC Output Current  
0.3  
PD/(VIN - VO)  
-40 to 150  
mA  
°C  
TJ  
Operating Junction Temperature Range  
Thermal Information2  
Symbol  
Description  
Rating  
Units  
ΘJA  
PD  
Maximum Thermal Resistance  
Maximum Power Dissipation3 (TA = 25°C)  
90  
°C/W  
W
1.11  
Recommended Operating Conditions  
Symbol  
Description  
Rating  
Units  
VIN  
T
Input Voltage4  
(VOUT + VDO) to 5.5  
-40 to +85  
V
Ambient Temperature Range  
°C  
1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at condi-  
tions other than the operating conditions specified is not implied. Only one Absolute Maximum Rating should be applied at any one time.  
2. Mounted on a demo board.  
3. Derate 11.1mW/°C above 25°C.  
4. To calculate minimum input voltage, use the following equation: VIN(MIN) = VOUT(MAX) + VDO(MAX) as long as VIN 2.5V.  
3239.2006.03.1.2  
3
AAT3239  
500mA MicroPower™ LDO  
Electrical Characteristics1  
VIN = VOUT(NOM) + 1.2V for VOUT options greater than 1.5V. VIN = 2.5 for VOUT 1.5V. IOUT = 1mA, COUT = 2.2µF,  
CIN = 1µF, TA = -40°C to +85°C, unless otherwise noted. Typical values are TA = 25°C.  
Symbol  
Description  
Conditions  
Min Typ Max Units  
TA = 25°C  
TA = -40 to 85°C -2.5  
TA = 25°C -2.0  
-1.5  
1.5  
2.5  
2.0  
3.5  
IOUT = 1mA to 300mA  
VOUT  
Output Voltage Tolerance  
%
IOUT = 1mA to 500mA  
TA = -40 to 85°C -3.5  
500  
IOUT  
VDO  
Output Current  
VOUT > 1.2V  
IOUT = 300mA  
IOUT = 500mA  
VOUT < 0.4V  
mA  
mV  
V
400 600  
0.8 1.2  
600  
Dropout Voltage2, 3  
ISC  
IQ  
Short-Circuit Current  
Ground Current  
mA  
µA  
µA  
VIN = 5V, No Load, EN = VIN  
VIN = 5V, EN = 0V  
70 125  
1
ISD  
Shutdown Current  
VOUT  
VOUT*VIN  
/
Line Regulation  
VIN = VOUT + 1 to 5.0V  
0.09  
2.5  
%/V  
mV  
mV  
V
IN = VOUT + 1V to VOUT + 2V,  
IOUT = 500mA, TR/TF = 2µs  
OUT = 1mA to 300mA, TR<5µs  
VOUT(line) Dynamic Line Regulation  
VOUT(load) Dynamic Load Regulation  
I
100  
120  
15  
IOUT = 1mA to 500mA, TR<5µs  
BYP = Open  
tENDLY  
VEN(L)  
VEN(H)  
IEN  
Enable Delay Time  
µs  
V
Enable Threshold Low  
Enable Threshold High  
0.6  
1.5  
V
Leakage Current on Enable Pin VEN = 5V  
1
67  
µA  
1kHz  
IOUT = 10mA,  
PSRR  
TSD  
Power Supply Rejection Ratio  
10kHz  
1MHz  
47  
dB  
°C  
CBYP = 10nF  
45  
Over-Temperature Shutdown  
Threshold  
145  
Over-Temperature Shutdown  
Hysteresis  
THYS  
eN  
12  
50  
22  
°C  
Output Noise  
Noise Power BW = 300Hz to 50kHz  
µVrms  
ppm/°C  
Output Voltage Temperature  
Coefficient  
TC  
1. The AAT3239 is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range and is assured  
by design, characterization, and correlation with statistical process controls.  
2. VDO is defined as VIN - VOUT when VOUT is 98% of nominal.  
3. For VOUT < 2.1V, VDO = 2.5V - VOUT  
.
4
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
Typical Characteristics  
Unless otherwise noted, VIN = 5V, TA = 25°C.  
Dropout Voltage vs. Temperature  
Dropout Characteristics  
3.20  
3.00  
2.80  
2.60  
2.40  
2.20  
2.00  
1.80  
1.60  
1.40  
900  
840  
IOUT = 0mA  
IL = 400mA  
IL = 500mA  
780  
720  
660  
600  
540  
480  
420  
360  
300  
240  
180  
120  
60  
IOUT = 500mA  
IOUT = 300mA  
IL = 300mA  
IOUT = 150mA  
IOUT = 100mA  
IL = 100mA  
IL = 50mA  
IL = 150mA  
IOUT = 50mA  
IOUT = 10mA  
0
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120  
2.70 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50 3.60 3.70  
Temperature (°C)  
Input Voltage (V)  
Dropout Voltage vs. Output Current  
Ground Current vs. Input Voltage  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
IOUT = 500mA  
85°C  
IOUT = 300mA  
IOUT = 0mA  
25°C  
IOUT = 150mA  
IOUT = 10mA  
-40°C  
IOUT = 50mA  
0
50  
100 150 200 250 300 350 400 450 500  
2
2.5  
3
3.5  
4
4.5  
5
Input Voltage (V)  
Output Current (mA)  
Output Voltage vs. Temperature  
Quiescent Current vs. Temperature  
1.203  
1.202  
1.201  
1.200  
1.199  
1.198  
1.197  
1.196  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100 110 120  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90 100  
Temperature (°C)  
Temperature (°C)  
3239.2006.03.1.2  
5
AAT3239  
500mA MicroPower™ LDO  
Typical Characteristics  
Unless otherwise noted, VIN = 5V, TA = 25°C.  
Initial Power-Up Response Time  
(CBYP = 10nF)  
Turn-On Time From Enable (VIN present)  
(CBYP = 10nF)  
VEN = 5V/div  
VEN (5V/div)  
VIN = 4V  
VOUT = 1V/div  
VOUT (1V/div)  
Time (5µs/div)  
Time (400µs/div)  
Turn-Off Response Time  
(CBYP = 10nF)  
Line Transient Response  
6
3.04  
VEN (5V/div)  
5
3.03  
3.02  
3.01  
3.00  
2.99  
2.98  
VIN  
4
3
2
VOUT  
1
VOUT (1V/div)  
0
Time (50µs/div)  
Time (100µs/div)  
Load Transient Response 100mA  
Load Transient Response 300mA  
1.90  
300  
200  
100  
0
2.00  
1.90  
1.80  
1.70  
1.60  
1.50  
1.40  
750  
600  
450  
300  
150  
0
VOUT  
VOUT  
1.85  
1.80  
1.75  
IOUT  
IOUT  
1.70  
-100  
Time (100µs/div)  
Time (100µs/div)  
6
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
Typical Characteristics  
Unless otherwise noted, VIN = 5V, TA = 25°C.  
Load Transient Response 500mA  
AAT3239 Self Noise  
(COUT = 10µF, ceramic)  
2.1  
2
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1.9  
10  
1
VOUT  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
0.1  
Band Power:  
300Hz to 50kHz = 44.6µVrms/rtHz  
100Hz to 100kHz = 56.3µVrms/rtHz  
IOUT  
0.01  
0.001  
1.2  
1.1  
1
0.01  
0.1  
1
10  
100  
1000  
10000  
Time (100µs/div)  
Frequency (kHz)  
Over-Current Protection  
VIH and VIL vs. VIN  
1200  
1000  
800  
600  
400  
200  
0
1.250  
1.225  
1.200  
1.175  
1.150  
1.125  
1.100  
1.075  
1.050  
VIH  
VIL  
-200  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
Time (20ms/div)  
Input Voltage (V)  
3239.2006.03.1.2  
7
AAT3239  
500mA MicroPower™ LDO  
Functional Block Diagram  
OUT  
IN  
Active  
Feedback  
Control  
Over-Current  
Protection  
Over-  
Temperature  
Protection  
+
Error  
Amplifier  
-
Fast  
Start  
Control  
Voltage  
Reference  
EN  
BYP  
GND  
applications where fast line and load transient  
response are required. This rapid transient  
response behavior is accomplished through the  
implementation of an active error amplifier feedback  
control. This proprietary circuit design is unique to  
this MicroPower LDO regulator.  
Functional Description  
The AAT3239 is intended for LDO regulator appli-  
cations where output current load requirements  
range from no load to 500mA. Refer to the Thermal  
Considerations discussion of this datasheet for  
details on maximum power dissipation.  
The LDO regulator output has been specifically  
optimized to function with low-cost, low-ESR  
ceramic capacitors. However, the design will allow  
for operation over a wide range of capacitor types.  
The advanced circuit design of the AAT3239 has  
been specifically optimized for very fast start-up  
and shutdown timing. This CMOS LDO has been  
tailored for superior transient response characteris-  
tics, a trait which is particularly important for appli-  
cations that require fast power supply timing, such  
as GSM cellular telephone handsets.  
A bypass pin has been provided to allow the addition  
of an optional voltage reference bypass capacitor to  
reduce output self noise and increase power supply  
ripple rejection. Device self noise and PSRR will be  
improved by the addition of a small ceramic capaci-  
tor in this pin. However, increased values of CBYPASS  
may slow down the LDO regulator turn-on time.  
The high-speed turn-on capability of the AAT3239  
is enabled through the implementation of a fast  
start control circuit, which accelerates the power-  
up behavior of fundamental control and feedback  
circuits within the LDO regulator.  
This LDO regulator has complete short-circuit and  
thermal protection. The integral combination of  
these two internal protection circuits gives the  
AAT3239 a comprehensive safety system to guard  
against extreme adverse operating conditions.  
Device power dissipation is limited to the package  
type and thermal dissipation properties. Refer to the  
Thermal Considerations discussion of this datasheet  
for details on device operation at maximum output  
current loads.  
Fast turn-off response time is achieved by an  
active output pull-down circuit, which is enabled  
when the LDO regulator is placed in shutdown  
mode. This active fast shutdown circuit has no  
adverse effect on normal device operation.  
The AAT3239 has very fast transient response  
characteristics, which is an important feature for  
8
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
Bypass Capacitor and Low Noise  
Applications  
Applications Information  
To assure the maximum possible performance is  
obtained from the AAT3239, please refer to the fol-  
lowing application recommendations.  
A bypass capacitor pin is provided to enhance the  
low noise characteristics of the AAT3239 LDO regu-  
lator. The bypass capacitor is not necessary for  
operation of the AAT3239. However, for best device  
performance, a small ceramic capacitor should be  
placed between the bypass pin (BYP) and the device  
ground pin (GND). The value of CBYP may range  
from 470pF to 10nF. For lowest noise and best pos-  
sible power supply ripple rejection performance, a  
10nF capacitor should be used. To practically realize  
the highest power supply ripple rejection and lowest  
output noise performance, it is critical that the capac-  
itor connection between the BYP pin and GND pin be  
direct and PCB traces should be as short as possi-  
ble. Refer to the PCB Layout Recommendations  
section of this document for examples.  
Input Capacitor  
Typically, a 1µF or larger capacitor is recommend-  
ed for CIN in most applications. A CIN capacitor is  
not required for basic LDO regulator operation.  
However, if the AAT3239 is physically located more  
than three centimeters from an input power source,  
a CIN capacitor will be needed for stable operation.  
CIN should be located as closely to the device VIN  
pin as practically possible. CIN values greater than  
1µF will offer superior input line transient response  
and will assist in maximizing the highest possible  
power supply ripple rejection.  
There is a relationship between the bypass capac-  
itor value and the LDO regulator turn-on and turn-  
off time. In applications where fast device turn-on  
and turn-off time are desired, the value of CBYP  
should be reduced.  
Ceramic, tantalum, or aluminum electrolytic capac-  
itors may be selected for CIN. There is no specific  
capacitor ESR requirement for CIN. However, for  
500mA LDO regulator output operation, ceramic  
capacitors are recommended for CIN due to their  
inherent capability over tantalum capacitors to with-  
stand input current surges from low impedance  
sources such as batteries in portable devices.  
In applications where low noise performance and/  
or ripple rejection are less of a concern, the bypass  
capacitor may be omitted. The fastest device turn-  
on time will be realized when no bypass capacitor  
is used.  
Output Capacitor  
DC leakage on this pin can affect the LDO regula-  
tor output noise and voltage regulation perform-  
ance. For this reason, the use of a low leakage,  
high quality ceramic (NPO or C0G type) or film  
capacitor is highly recommended.  
For proper load voltage regulation and operational  
stability, a capacitor is required between pins VOUT  
and GND. The COUT capacitor connection to  
the LDO regulator ground pin should be made as  
direct as practically possible for maximum device  
performance.  
Capacitor Characteristics  
The AAT3239 has been specifically designed to func-  
tion with very low ESR ceramic capacitors. For best  
performance, ceramic capacitors are recommended.  
Ceramic composition capacitors are highly recom-  
mended over all other types of capacitors for use  
with the AAT3239. Ceramic capacitors offer many  
advantages over their tantalum and aluminum elec-  
trolytic counterparts. A ceramic capacitor typically  
has very low ESR, is lower cost, has a smaller PCB  
footprint, and is non-polarized. Line and load tran-  
sient response of the LDO regulator is improved by  
using low-ESR ceramic capacitors. Since ceramic  
capacitors are non-polarized, they are not prone to  
incorrect connection damage.  
Typical output capacitor values for maximum output  
current conditions range from 1µF to 10µF.  
Applications utilizing the exceptionally low output  
noise and optimum power supply ripple rejection  
characteristics of the AAT3239 should use 2.2µF or  
greater for COUT. If desired, COUT may be increased  
without limit.  
In low output current applications where output  
load is less than 10mA, the minimum value for  
COUT can be as low as 0.47µF.  
3239.2006.03.1.2  
9
AAT3239  
500mA MicroPower™ LDO  
Equivalent Series Resistance: ESR is a very  
important characteristic to consider when selecting  
a capacitor. ESR is the internal series resistance  
associated with a capacitor that includes lead  
resistance, internal connections, size and area,  
material composition, and ambient temperature.  
Typically, capacitor ESR is measured in milliohms  
for ceramic capacitors and can range to more than  
several ohms for tantalum or aluminum electrolytic  
capacitors.  
When the LDO regulator is in shutdown mode, an  
internal 1.5kresistor is connected between VOUT  
and GND. This is intended to discharge COUT when  
the LDO regulator is disabled. The internal 1.5kΩ  
has no adverse effect on device turn-on time.  
Short-Circuit Protection  
The AAT3239 contains an internal short-circuit pro-  
tection circuit that will trigger when the output load  
current exceeds the internal threshold limit. Under  
short-circuit conditions, the output of the LDO reg-  
ulator will be current limited until the short-circuit  
condition is removed from the output or LDO regu-  
lator package power dissipation exceeds the  
device thermal limit.  
Ceramic Capacitor Materials: Ceramic capaci-  
tors less than 0.1µF are typically made from NPO  
or C0G materials. NPO and C0G materials gener-  
ally have tight tolerance and are very stable over  
temperature. Larger capacitor values are usually  
composed of X7R, X5R, Z5U, or Y5V dielectric  
materials. These two material types are not rec-  
ommended for use with LDO regulators since the  
capacitor tolerance can vary more than ±50% over  
the operating temperature range of the device. A  
2.2µF Y5V capacitor could be reduced to 1µF over  
temperature; this could cause problems for circuit  
operation. X7R and X5R dielectrics are much  
more desirable. The temperature tolerance of X7R  
dielectric is better than ±15%.  
Thermal Protection  
The AAT3239 has an internal thermal protection cir-  
cuit which will turn on when the device die temper-  
ature exceeds 145°C. The internal thermal protec-  
tion circuit will actively turn off the LDO regulator  
output pass device to prevent the possibility of over-  
temperature damage. The LDO regulator output  
will remain in a shutdown state until the internal die  
temperature falls back below the 145°C trip point.  
Capacitor area is another contributor to ESR.  
Capacitors that are physically large in size will have  
a lower ESR when compared to a smaller sized  
capacitor of an equivalent material and capacitance  
value. These larger devices can improve circuit tran-  
sient response when compared to an equal value  
capacitor in a smaller package size.  
The combination and interaction between the short-  
circuit and thermal protection systems allow the  
LDO regulator to withstand indefinite short-circuit  
conditions without sustaining permanent damage.  
No-Load Stability  
Consult capacitor vendor datasheets carefully  
when selecting capacitors for LDO regulators.  
The AAT3239 is designed to maintain output volt-  
age regulation and stability under operational no-  
load conditions. This is an important characteristic  
for applications where the output current may drop  
to zero.  
Enable Function  
The AAT3239 features an LDO regulator enable/  
disable function. This pin (EN) is active high and is  
compatible with CMOS logic. To assure the LDO  
regulator will switch on, the EN turn-on control level  
must be greater than 1.5V. The LDO regulator will  
go into the disable shutdown mode when the volt-  
age on the EN pin falls below 0.6V. If the enable  
function is not needed in a specific application, it  
may be tied to VIN to keep the LDO regulator in a  
continuously on state.  
Reverse Output-to-Input Voltage  
Conditions and Protection  
Under normal operating conditions, a parasitic  
diode exists between the output and input of the  
LDO regulator. The input voltage should always  
remain greater than the output load voltage main-  
taining a reverse bias on the internal parasitic  
10  
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
diode. Conditions where VOUT might exceed VIN  
should be avoided since this would forward bias  
the internal parasitic diode and allow excessive  
current flow into the VOUT pin, possibly damaging  
the LDO regulator.  
Constants for the AAT3239 are TJ(MAX), the maxi-  
mum junction temperature for the device which is  
125°C, and TJA = 90°C/W, the package thermal  
resistance. Typically, maximum conditions are calcu-  
lated at the maximum operating temperature of TA =  
85°C and under normal ambient conditions where  
TA = 25°C. Given TA = 85°C, the maximum package  
power dissipation is 444mW. At TA = 25°C, the max-  
imum package power dissipation is 1.11W.  
In applications where there is a possibility of VOUT  
exceeding VIN for brief amounts of time during nor-  
mal operation, the use of a larger value CIN capaci-  
tor is highly recommended. A larger value of CIN  
with respect to COUT will effect a slower CIN decay  
rate during shutdown, thus preventing VOUT from  
exceeding VIN. In applications where there is a  
greater danger of VOUT exceeding VIN for extended  
periods of time, it is recommended to place a  
Schottky diode across VIN to VOUT (connecting the  
cathode to VIN and anode to VOUT). The Schottky  
diode forward voltage should be less than 0.45 volts.  
The maximum continuous output current for the  
AAT3239 is a function of the package power dissi-  
pation and the input-to-output voltage drop across  
the LDO regulator. Refer to the following simple  
equation:  
PD(MAX)  
VIN - VOUT  
IOUT(MAX)  
<
Thermal Considerations and High  
Output Current Applications  
The AAT3239 is designed to deliver a continuous  
output load current of 500mA under normal opera-  
tions. The short-circuit current limit is greater than  
500mA, typically active at 600mA.  
For example, if VIN = 4.2V, VOUT = 1.8V, and TA =  
25°C, IOUT(MAX) < 463mA. If the output load current  
were to exceed 463mA or if the ambient tempera-  
ture were to increase, the internal die temperature  
would increase. If the condition remained constant,  
the LDO regulator thermal protection circuit would  
activate.  
The limiting characteristics for the maximum output  
load current safe operating area is essentially pack-  
age power dissipation, the internal preset thermal  
limit of the device, and the input-to-output voltage  
drop across the AAT3239. In order to obtain high  
operating currents, careful device layout and circuit  
operating conditions need to be taken into account.  
To determine the maximum output current for a  
given output voltage, refer to the following equa-  
tion. This calculation accounts for the total power  
dissipation of the LDO regulator, including that  
caused by ground current.  
The following discussions will assume the LDO reg-  
ulator is mounted on a printed circuit board utilizing  
the minimum recommended footprint as stated in  
the layout considerations section of this document.  
At any given ambient temperature (TA), the maxi-  
mum package power dissipation can be determined  
by the following equation:  
PD(MAX) = (VIN - VOUT)IOUT + (VIN x IGND  
)
This formula can be solved for IOUT to determine the  
maximum output current.  
PD(MAX) - (VIN × IGND  
VIN - VOUT  
)
IOUT  
=
TJ(MAX) - TA  
θJA  
PD(MAX)  
=
3239.2006.03.1.2  
11  
AAT3239  
500mA MicroPower™ LDO  
The following is an example for an AAT3239 set for  
a 1.5 volt output:  
continuous input level for VOUT = 1.5V at 500mA for  
TA = 25°C. To maintain this high input voltage and  
output current level, the LDO regulator must be  
operated in a duty-cycled mode. Refer to the follow-  
ing calculation for duty cycle operation:  
VOUT  
VIN  
= 1.5V  
= 4.2V  
= 125µA  
IGND = 125µA  
IOUT = 500mA  
IGND  
1.11W - (4.2V × 125µA)  
4.2 - 1.5  
IOUT  
=
VIN = 4.2V  
VOUT = 1.5V  
I
OUT(MAX) = 411mA  
100(PD(MAX)  
)
%DC =  
%DC =  
(VIN - VOUT)IOUT + VIN × IGND  
From the discussion above, PD(MAX) was determined  
to equal 1.11W at TA = 25°C.  
100(1.11W)  
(4.2V - 1.5V)500mA + 4.2V × 125µA  
Thus, the AAT3239 can sustain a constant 1.5V out-  
put at a 411mA load current at an ambient tempera-  
ture of 25°C. Higher input-to-output voltage differ-  
entials can be obtained with the AAT3239, while  
maintaining device functions within the thermal safe  
operating area. To accomplish this, the device ther-  
mal resistance must be reduced by increasing the  
heat sink area or by operating the LDO regulator in  
a duty-cycled mode.  
%DC = 82%  
D(MAX) is assumed to be 1.1W  
P
For a 500mA output current and a 2.7V drop across  
the AAT3239 at an ambient temperature of 25°C,  
the maximum on-time duty cycle for the device  
would be 82%.  
The following curves show the safe operating area  
for duty-cycled operation from ambient room tem-  
perature to the maximum operating level.  
For example, an application requires VIN = 4.2V  
while VOUT = 1.5V at a 500mA load and TA = 25°C.  
VIN is greater than 3.7V, which is the maximum safe  
Device Duty Cycle vs. VDROP  
(VOUT = 1.5V @ 25°C)  
Device Duty Cycle vs. VDROP  
(VOUT = 1.5V @ 85°C)  
3.5  
3
3.5  
3
700mA  
450mA  
2.5  
2.5  
2
2
600mA  
400mA  
1.5  
1.5  
500mA  
400mA  
1
350mA  
1
0.5  
0
0.5  
300mA  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Duty Cycle (%)  
Duty Cycle (%)  
12  
3239.2006.03.1.2  
AAT3239  
500mA MicroPower™ LDO  
Evaluation Board Layout  
The AAT3239 evaluation layout follows the recom-  
mend printed circuit board layout procedures and  
can be used as an example for good application  
layouts.  
Note: Board layout shown is not to scale.  
Figure 3: Evaluation Board  
Component Side Layout.  
Figure 4: Evaluation Board  
Solder Side Layout.  
Figure 5: Evaluation Board Top Side  
Silk Screen Layout/Assembly Drawing.  
3239.2006.03.1.2  
13  
AAT3239  
500mA MicroPower™ LDO  
Ordering Information  
Output Voltage  
Package  
Marking1  
Part Number (Tape and Reel)2  
1.5V  
1.8V  
1.85V  
2.5V  
3.3V  
TSOPJW-8  
TSOPJW-8  
TSOPJW-8  
TSOPJW-8  
TSOPJW-8  
JVXYY  
NHXYY  
JWXYY  
QXXYY  
MAXYY  
AAT3239ITS-1.5-T1  
AAT3239ITS-1.8-T1  
AAT3239ITS-1.85-T1  
AAT3239ITS-2.5-T1  
AAT3239ITS-3.3-T1  
All AnalogicTech products are offered in Pb-free packaging. The term “Pb-free” means  
semiconductor products that are in compliance with current RoHS standards, including  
the requirement that lead not exceed 0.1% by weight in homogeneous materials. For more  
information, please visit our website at http://www.analogictech.com/pbfree.  
Package Information  
TSOPJW-8  
0.325 0.075  
0.65 BSC 0.65 BSC 0.65 BSC  
3.025 0.075  
7°  
0.04 REF  
0.010  
0.45 0.15  
0.055 0.045  
2.75 0.25  
All dimensions in millimeters.  
1. XYY = assembly and date code.  
2. Sample stock is generally held on part numbers listed in BOLD.  
© Advanced Analogic Technologies, Inc.  
AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work rights,  
or other intellectual property rights are implied. AnalogicTech reserves the right to make changes to their products or specifications or to discontinue any product or service without notice.  
Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. AnalogicTech  
warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with AnalogicTech’s standard warranty. Testing and other quality con-  
trol techniques are utilized to the extent AnalogicTech deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed.  
Advanced Analogic Technologies, Inc.  
830 E. Arques Avenue, Sunnyvale, CA 94085  
Phone (408) 737-4600  
Fax (408) 737-4611  
14  
3239.2006.03.1.2  

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