1722B50-100J [ANAREN]

RF Transformer, 1700MHz Min, 2200MHz Max;


型号：	1722B50-100J
厂家：	ANAREN MICROWAVE
描述：	RF Transformer, 1700MHz Min, 2200MHz Max 变压器
文件：	总12页 (文件大小：677K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Model 1722B50-100J

Rev A

Ultra Low Profile 0805 Balun

50Ω to 200Ω Balanced

Description

The 1722B50-100J is a low profile sub-miniature balanced to unbalanced

transformer designed for differential inputs and output locations on next generation

wireless chipsets in an easy to use surface mount package covering the UMTS,

PCS, DCS and CDMA frequencies. The 1722B50-100J is ideal for high volume

manufacturing and is higher performance than traditional ceramic, and lumped

element baluns. The 1722B50-100J has an unbalanced port impedance of 50Ω and

a 200Ω balanced port impedance**. This transformation enables single ended

signals to be applied to differential ports on modern semiconductors. The output

ports have equal amplitude (-3dB) with 180 degree phase differential. The 1722B50-

100J is available on tape and reel for pick and place high volume manufacturing.

Detailed Electrical Specifications*: Specifications subject to change without notice.

ROOM (25°C)

Features:

Parameter

Frequency

Min.

1.7

Typ.

Max

2.2

Unit

GHz

Ω

• 1.7 – 2.2 GHz

• 0.7mm Height Profile

• 50 Ohm to 2 x 100 Ohm

• DCS/PCS/ UMTS/CDMA

• Low Insertion Loss

• Input to Output DC Isolation

• Surface Mountable

• Tape & Reel

Unbalanced Port Impedance

Balanced Port Impedance**

Return Loss

Insertion Loss***

Amplitude Balance

Phase Balance

Power Handling

Thermal Resistance

Operating Temperature

200

0.5

±0.6

±4

Ω

0.7

±0.9

±8

0.5

TBD

+85

Degrees

Watts

ºC / Watt

ºC

• Non-conductive Surface

-55

*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50 Ω nominal impedance.

P^**i¹n^00ΩCo^refn^erf^eiⁿg^cu^{e t}r^oa^gt^ri^oo^unn^{d. *** Insertion Loss stated at room temperature (0.8 dB Max at +85 ºC)}

The internal configuration of the ultra-low profile balun is diagramed to

the left; the unbalanced port is terminated in an open-circuit and the

two balanced ports are connected to ground. The ground connection

for the two balanced ports are connected together and brought out on

a common pin of the balun. This pin is labeled “DC/RF ground”. For

many chipset applications there is an opportunity to use this

configuration as a single bias point if applicable.

Balun Pin Configruation

λ 4

The use of differential circuits is increasing in highly integrated circuits,

because of its inherent noise immunity properties. Differential circuits

have superior performance when looking at properties like cross

coupling, immunity to external noise sources and power supply noise.

When designing power amplifiers differential circuits also help

minimize 2^ndand 3^rdorder intermodulation products.

λ 4

The construction of the ultra-low profile balun is bonded multi-layered

stripline made of low loss dielectric material with plated through vias

connecting the internal circuitry to the external printed circuit board,

similar to that of other Xinger hybrids and directional couplers.

USA/Canada:

Toll Free:

(315) 432-8909

(800) 411-6596

+44 2392-232392

Available on Tape

and Reel for Pick and

Place Manufacturing.

Europe:

Model 1722B50-100J

Rev A

Outline Drawing

Top View (Near-side)

Side View

Bottom View (Far-side)

±.005

.080

±.004

2X .014

[0.35

±0.13

[2.03

±.003

±0.08

]

±0.10

.027

]

[0.70

]

±.004

±0.10

.030

[0.76

]

±.004

6X .009

[0.22

±.005

.050

±0.10

]

±0.13

[1.27

]

Orientation

Marker Denotes

Pin Location

Orientation

Marker Denotes

Pin Location

±.004

6X .012

[0.30

Pin Designation

±0.10

]

GND / DC Feed

+ RF GND

Out 1

Out 2

Dimensions are in Inches [Millimeters]

Mechanical Outline

GND

Tolerances are Non-Cumulative

Typical Broadband Performance: 0 GHz. to 6.0 GHz.

USA/Canada:

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Europe:

(315) 432-8909

(800) 411-6596

+44 2392-232392

Available on Tape and

Reel for Pick and Place

Manufacturing.

Model 1722B50-100J

Rev A

Typical Performance: 1.7 GHz. to 2.2 GHz.

Mounting Configuration:

In order for Xinger surface mount components to work optimally, there must be a 50Ω transmission line to the

unbalanced port and 100 Ω transmission lines from the balanced ports. If this condition is not satisfied, amplitude

balance, insertion loss and VSWR may not meet published specifications.

All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/^oC.

An example of the PCB footprint used in the testing of these parts is shown on the next page. An example of a DC-

biased footprint is also shown on the next page. In specific designs, the transmission line widths need to be adjusted to

the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.

USA/Canada:

Toll Free:

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(800) 411-6596

+44 2392-232392

Available on Tape

and Reel for Pick and

Place Manufacturing.

Europe:

Model 1722B50-100J

Rev A

DC Bias Footprint

No Bias Footprint

6X .016

[0.35]

DC Bias

6X .016

[0.35]

4X .010

[0.25]

6X .013

[0.33]

6X .013

[0.33]

.026

[0.66]

6X .002

[0.05]

6X .002

[0.05]

4X .010

[0.25]

3X Transmission

Line

3X Transmission

Line

Plated thru

holes to

ground

Plated thru

Circuit Pattern

hole to

ground

Footprint Pad (s)

Solder Resist

Dimensions are in Inches [Millimeters]

Mounting Footprint

Dimensions are in Inches [Millimeters]

Mounting Footprint

Manufacturing Instructions

This section contains mounting instructions for hand soldering components in a lab environment and high volume pick

and place operations.

Mounting parts in a lab environment

The following steps outline the process for hand soldering Anaren’s components to pre-populated PWBs.

1. The picture to the right shows the mounting location

for the component to be installed.

3. The picture to the right shows the mounting location

with excess solder removed.

2. Using solder wick and water-soluble flux, remove

excess solder from pads where component will be

mounted.

4. There needs to be exposed copper/plated area to

place solder iron to transfer heat to the component

pads. The picture to the right shows areas of exposed

tin-lead plating where the soldering tip will be placed for

heat transfer.

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Manufacturing.

Model 1722B50-100J

Rev A

5. Clean excess flux from board, and any other

debris. Apply small amounts of solder paste

(SN63PB37 or equivalent) to each pad on

board.

7. Using a hand held soldering iron with Metcal solder

tip STTC-042 or equivalent, place tweezers on top of

component for support, place iron on exposed plated

area reflowing solder paste and tin-lead plating on part.

(Repeat for each pad) If necessary apply water-soluble

liquid flux to each pad and touch solder iron to exposed

plated area to complete the proper solder connection.

6. Place component on solder paste and align to pads.

8. Inspect all pads to ensure solder connection to

component pads and PWB pads. Clean excess flux

from component and PWB.

Mounting parts in High Volume Pick and Place

Component Mounting Process

The process for assembling this component in a conventional surface mount process is shown below. This process

is conducive to both low and high volume usage.

Clean

Reflow

Clean &

Inspect

Apply

Place

component

to substrate

Substrate

Solder Paste

to Substrate

component

on substrate

Surface Mounting Process Steps

Storage of Components: Commonly used storage procedures used to control oxidation should be followed for

these surface mount components. The storage temperatures should be held between 15 C and 60 C.

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Europe:

Model 1722B50-100J

Rev A

Substrate: Depending upon the particular component, the circuit material has an x and y coefficient of thermal

expansion of between 17 and 25 ppm/°C. This coefficient minimizes solder joint stresses due to similar expansion

rates of most commonly used board substrates such as RF35, RO4350, FR4, polyimide and G-10 materials.

Mounting to “hard” substrates (alumina etc.) is possible depending upon operational temperature requirements. The

solder surfaces of the coupler are all copper plated with a tin-lead exterior finish.

Solder Paste: All conventional solder paste formulations will work well with Anaren’s surface mount components.

Solder paste can be applied with stencils or syringe dispensers. An example of a stenciled solder paste deposit is

shown below. As shown in the figure solder paste is applied to the RF and ground pads.

Solder Paste Application

Component Positioning: These surface mount components are placed with automatic pick and place mechanisms.

A place component is shown below.

Component Placement

The exploded view of the PWB, solder paste and component is shown below.

Exploded Mounting Features

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Model 1722B50-100J

Rev A

Reflow: The surface mount component is conducive to most of today’s conventional reflow methods. A low and high

temperature thermal reflow profiles are shown in below.

Low Temperature Solder Reflow Thermal Profile

High Temperature Solder Reflow Thermal Profile

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Europe:

Model 1722B50-100J

Rev A

Test Instructions

A balun consists of an “unbalanced” port and two “balanced

ports”. The balun is a passive and reversible device.

Therefore the “unbalanced” port can be used as either an

input or an output; likewise the “balanced” ports can be used

as inputs or outputs.

Evaluating the performance of the “balanced” port

requires several measurements and some transformation

of single ended S-parameters into balanced. The

following equation describes the relationship between the

single ended measurements and the balance port

measurements.

Baluns are also frequently used as impedance-transforming

devices. For historical reasons the most commonly used

impedances of the “unbalanced” ports are 50 Ω or 75 Ω and

simple transformation ratios of 1:1, 1:2, and 1:4 are widely

used. This creates components with impedances in the

ranges of 50:50, 50:100 and 50:200 Ω for 50 Ω system

impedance and 75:75, 75:150 and 75:300 Ω for 75 Ω system

impedances.

SD22 = 20Log10

(

S22²+ S33²

)

(

S23²+ S32²

)

(1)

Equation (1) transforms the 2 sets of single ended return

loss measurements combined with insertion loss

measurements into a balanced port impedance. Complex

values of all the S-parameters must be used to make the

equation valid, and is to be used with data that has been

deembedded and renormalized to the goal impedances.

This document discusses some of the issues involving

evaluating the performance of general baluns on different

types of equipment. The techniques and pitfalls identified are

general for all types of baluns and not just for the stripline

version described here. There are two basic frequency

domain methods and one time-domain method.

Due to way the balun works (any balun, both Flux

coupled and stripline version) one will find 6 dB worth of

return loss measured singled ended onto either port 2 or

port 3 of any balun.

The first section describes the preferred method, which

enables the user to get full S-parameters of the entire balun.

This allows the user to gain significant insight into the

performance of all aspects of the balun. Most of the same

results can be obtained using the other approaches.

2-ports analyzer techniques

Using a 2-port analyzer to evaluate the performance of a 3-

port device involves some switching of cables and performing

multiple measurements to gather enough information to

perform the calculation to evaluate the true balanced

performance.

In the following section the “unbalanced” port is labeled P1

and the corresponding return loss is labeled S11,

consequently return loss measured on the two “balanced”

ports (P2 and P3) are labeled S22 and S33. Furthermore the

logical “balanced” port is labeled PD2 and its corresponding

return loss is labeled SD22.

Figure 1a Return loss of balun measured as a 3 ports device

Return loss measurements using 2-port

analyzers

Terminating the “balanced” ports with the correct loads and

performing a straightforward return loss measurement on the

“unbalanced” port one can evaluate the “unbalanced” return

loss.

Figure 1b Return loss of balun measured as logical 2-port device

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Model 1722B50-100J

Rev A

Figure (1a) and (1b) shows the return loss of a typical balun Equation (4) is used to determine the insertion loss of a

depicted in both single ended and differential modes. balun. This Equation only looks at the transmitted

Combining the measurements of S22 and S33 from Figure energy and therefore the insertion loss due to miss-

(1a) with measurements of S23 and S32 using equation (1) matched ports is accounted for.

the differential mode return loss is shown in Figure (1b)

Evaluating balun performance of non 50

Phase and amplitude measurements using a

Ohm units

2-port analyzer

The technique of deembedding is a significant obstacle

in evaluating the actual performance of any microwave

system. For microwave devices like baluns the test

board must be deembedded correctly to achieve

To evaluate the phase and amplitude balance of a balun it is

important to note that the system, in which it is measured,

must be repeatable to within the tolerance of which the

measurements are required.

correct

S-parameters

when

performing

renormalization of the port impedances.

So if a mechanical switch is employed to connect between

the two differential ports and the analyzer it has to be If the impedance or line lengths are incorrect in the

repeatable enough not to perturb the results. Likewise, if a deembed files, the performance measured could differ

simple approach of manually unhooking and re-hooking from the performance of the part in an actual system.

coaxial lines, good RF-measurements techniques should be Here is a list of parameters that are directly affected by

followed.

the deembed files:

1. For the phase and amplitude balance, the

deembed files have to represent the test board

used within the accuracy of the test being

performed.

Amplitude and phase balance is evaluated using the following

equation:

2. For the return loss, the correct length of the test

board is crucial or the consequent

renormalization will fail.

S31

AB = 20Log10

S31

(2)

S21

3. For overall insertion loss both the length and

insertion loss of the test board is important to

know accurately.

PB = ang

(

)

(3)

S21

It should be noted that if the parameters are used in the

reverse order the results are still correct, but the balance will

have an opposite sign. However, in most case the user is

only interested in the absolute value and therefore the sign is

of no importance.

Anaren will inform any customer, upon request, of the

deembed files and algorithms used in obtaining the

published results.

Back-to-Back measurements

Multi-ports analyzer techniques

This technique involves mounting two identical units in a

Back-to-Back configuration. This enables the user to evaluate

the insertion loss of both units in series and calculate the loss

by dividing the results by 2. The drawback in evaluating the

insertion loss of baluns in this manor is that balun #1 is used

to match into balun #2 and assuming good production

tolerances the result will become “too” good. The Back-to-

Back measurement technique gives valid results. However,

the results are a measurement of insertion loss in the case of

perfect match.

Multi-port analyzers have made the evaluation of balun

significantly easier, but still not without pitfalls. When

evaluating the overall performance of a balun one can

look at the balun as either a 3 ports device or a logical

2-port device, where one of the ports is balanced. The

results that the analyzer will present are significantly

different and will be covered in the following section.

Evaluating the performance of a balun as a 3 port

device

On a multi-port analyzer this is a straightforward

technique, which gives full S-parameters of the balun.

Each of the measurements must be combined in the

same fashion as described in the previous section. All

the same discussions apply and the same equations

should be used to evaluate performance parameters.

More representative insertion loss measurements are based

on adding the measurements of S21 and S31 after each of

the measurements have been deembedded and renormalized

to the target impedances.

IL = 20Log10

(

S12 ²+ S13²

)

(4)

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Model 1722B50-100J

Rev A

Evaluating the performance of a balun as logical 2-port

device

Many of the newer Agilents multiport Network analyzer

models have the capabilities to make balanced measurement

by transforming the analyzer from a 3-port network analyzer

into a 2-port analyzer with one or two balanced ports. The

transformations described in the previous section are now

done in firmware. This approach lets the user set up any type

of measurements of the balun and evaluate the actual

performance of the circuit in real-time on the screen of the

analyzer.

Evaluating balun performance of non 50 Ohm units

The discussion about deembedding from the previous

sections is also important for 3-port analyzers and will not be

discussed any further here.

Time Domain techniques

Anaren does not use the time Domain technique very often,

but some customers in their evaluations have employed it.

Figure 2 Time domain data taken on a Tektronix 20GS/s oscilloscope.

A part was tested using a 2.4 GHz source, driving an equal

split power divider. One of the power divider outputs was

connected to the trigger and the other was used to drive the

balun circuit (mounted on the test board). The two outputs of

the balun (two terminals of the differential port) were then

connected to the two oscilloscope channels via phase and

amplitude matched cables.

This technique is capable to get a indication of phase and

amplitude balance, but this technique is not capable of

measuring the return loss performance. Likewise, evaluating

the insertion loss is cumbersome and potentially inaccurate.

The following figure shows actual measurements performed

on a 2.45 GHz balun in a 50 Ohm system.

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Model 1722B50-100J

Rev A

Packaging and Ordering Information

Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order

quantities are 4000 per reel. See Model Numbers below for further ordering information.

ØA

ØC

ØD

TABLE 1

REEL DIMENSIONS (inches [mm])

QUANTITY/REEL

4000

ØA

ØC

ØD

7.00 [177.8]

0.32 [8.0]

2.0 [50.8]

0.512 [13.0]

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Europe:

Model 1722B50-100J

Rev A

2425 B 50-50 J P R

Input

Output Impedance

+ Coupling

Package

Shipping

Package

Frequency

Function

Plating

Impedance

Dimensions

150 x 150 mils

(4mm x 4mm)

P = Lead

S = Tin

R = Reel

B = Bulk

00550 = 50

0110 = 100

0910 = 900

0921 = 900

1222 = 1200

1416 = 1400

1722 = 1700

2022 = 2000

2425 = 2400

3436 = 3400

4859 = 4800

5153 = 5100

5159 = 5100

5759 = 5700

–

500 MHz

Balun

50 Ohm

75 Ohm

100

12.5Ω to Ground

1000 MHz

2100 MHz

2200 MHz

1500 MHz

2200 MHz

2500 MHz

3600 MHz

5900MHz

5300 MHz

5900 MHz

Filter

15Ω

25Ω

to Ground

120 x 120 mils

Filter / Balun

3dB Coupler

Directional

Circulator

Dual Balun

(3mm x 3mm)

37.5Ω to Ground

126 x 79 mils

(3.2mm x 2mm)

100 x 80 mils

(2.5mm x 2mm)

120 x 60 mils

(3mm x 1.5mm)

80 x 50 mils

(2mm x 1.25mm)

50Ω

75Ω

to Ground

100Ω to Ground

3dB Hybrid

10dB Directional

20dB Directional

Clockwise

Anti Clockwise

90 x 60 mils

(2.25mm x 1.5mm)

60 x 30 mils

(1.5mm x 0.75mm)

140 x 80 mils

(3.5mm x 2mm)

1414 = 14000– 14500 MHz

0819 = 800 + 1900 MHz

0826 = 800

2600 MHz

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Available on Tape and

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Manufacturing.

1722B50-100J [ANAREN]

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