RFP-100N2AE [ANAREN]

Fixed Attenuator, 0MHz Min, 2500MHz Max;
RFP-100N2AE
型号: RFP-100N2AE
厂家: ANAREN MICROWAVE    ANAREN MICROWAVE
描述:

Fixed Attenuator, 0MHz Min, 2500MHz Max

衰减器 射频 微波
文件: 总2页 (文件大小:471K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Model RFP-100-XXAE  
Flanged Attenuators  
100 Watts  
General Specifications  
Resistive Element:  
Thick film  
Substrate:  
Cover:  
Beryllium oxide ceramic  
Alumina ceramic  
Mounting Flange:  
Copper nickel plated per  
QQ-N-290  
Lead(s):  
99.99% pure silver (.005” thk)  
Features  
• DC - 2.5 GHz  
Electrical Specifications  
Attenuation Value:  
1, 2, 3, 4, 5, 6, 9, 10, 20 or  
30 dB  
• 100 Watts  
Frequency Range:  
Power:  
DC - 2.5 GHz  
100 Watts  
• BeO Ceramic  
• Welded Silver Leads  
Notes: Tolerance is .010, unless otherwise specified. Operating  
temperature is -55°C to +150°C (see chart). Designed to meet or  
exceed applicable portions of MIL-E-5400. All dimensions are in  
inches. Lead length 0.15” minimum.  
• Non-Nichrome Resistive  
Element  
• Low VSWR  
Specifications subject to change without notice.  
• 100% Tested  
Outline Drawing  
.800  
.400  
.130 DIA. THRU.  
(2 PLACES)  
RFP  
.225  
100-XX  
AE  
.112  
.050  
.350  
.560  
.120  
.130  
.062  
Note: XX denotes attenuation value.  
VER. 12/5/01  
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121  
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369  
Model RFP-100-XXAE  
Specifications  
45PART NUMBER ATTENUATION (dB)  
TOL. (+/-dB)  
0.40  
POWER (WATTS)  
VSWR  
1.45:1  
1.40:1  
1.35:1  
1.30:1  
1.25:1  
1.20:1  
1.20:1  
1.25:1  
1.20:1  
1.30:1  
FREQ. (GHz)  
RFP-100-1AE  
RFP-100-2AE  
RFP-100-3AE  
RFP-100-4AE  
RFP-100-5AE  
RFP-100-6AE  
RFP-100-9AE  
RFP-100-10AE  
RFP-100-20AE  
RFP-100-30AE  
1
2
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
2.0  
2.5  
2.0  
0.40  
3
0.40  
4
0.30  
5
0.30  
6
0.30  
9
0.30  
10  
20  
30  
0.75  
0.50  
2.00  
Suggested Mounting Procedures  
Power Derating  
.025 MIN.  
(2 PLACES)  
100  
75  
BOARD LOWER  
THAN LEAD.  
BOARD HIGHER  
THAN LEAD.  
BOARD LOWER  
THAN LEAD.  
BOARD EVEN  
WITH LEAD.  
NOT RECOMMENDED APPLICATION  
SCALE:  
SUGGESTED STRESS RELIEF METHODS  
SCALE:  
50  
1. Make sure that the devices are mounted on flat surfaces  
(.001” under the device) to optimize the heat transfer.  
25  
0
2. Drill & tap the heatsink for the appropriate thread size to be  
used.  
3. Coat heatsink with a minimum amount of high quality  
silicone grease (.001” max. thickness).  
25  
50  
75  
100  
125  
150  
CASE TEMPERATURE — °C  
4. Position device on mounting surface and secure using  
socket head screws, flat & split washers. Torque screws to  
the appropriate value. Make sure that the device is flat  
against the heatsink. (Care should be taken to avoid  
upward pressure of the leads towards the lid).  
5. Solder leads in place using an SN63 type solder with a  
controlled temperature iron (210°C).  
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121  
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369  

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