RFP-250250-4AAXX [ANAREN]
Surface Mount Attenuators; 表面贴装式衰减器
| 型号： | RFP-250250-4AAXX |
| 厂家： | 
ANAREN MICROWAVE |
| 描述： | Surface Mount Attenuators |
| 文件： | 总2页 (文件大小：483K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Model RFP-250250-4AAXX
Surface Mount Attenuators
8 Watts
General Specifications
Resistive Element:
Thick film
Substrate:
Terminals:
Beryllium oxide ceramic
Thick film silver
Electrical Specifications
Attenuation Value:
1, 2, 3, 4, 5, 6, 9, 10, 20 or
30 dB
DC - 2.5 GHz
8 Watts
Features
• DC - 2.5 GHz
Frequency Range:
Power:
• 8 Watts
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
• BeO Ceramic
• Non-Nichrome Resistive
Element
• Low VSWR
• 100% Tested
Outline Drawing
TOP VIEW
SIDE VIEW
.040
BOTTOM VIEW
.250
.230
RFP
AA
XXdB
.060
.250
.170
.115
HATCHED AREA INDICATES
LOCATION OF
.055
.085
.165
PROTECTIVE COATING
Note: XX denotes attenuation value.
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Model RFP-250250-4AAXX
Specifications
PART NUMBER ATTENUATION (dB)TOL. (+/-dB) WIDTH LENGTH THK POWER (WATTS) VSWR FREQ.(GHz)
RFP-250250-4AA1
RFP-250250-4AA2
RFP-250250-4AA3
RFP-250250-4AA4
RFP-250250-4AA5
RFP-250250-4AA6
RFP-250250-4AA9
RFP-250250-4AA10
RFP-250250-4AA20
RFP-250250-4AA30
1
0.30
0.40
0.40
0.40
0.40
0.40
0.40
0.40
0.75
1.50
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.04
8
8
8
8
8
8
8
8
8
8
1.20:1
1.20:1
1.20:1
1.20:1
1.25:1
1.30:1
1.30:1
1.30:1
1.25:1
1.20:1
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.0
2
3
4
5
6
9
10
20
30
Suggested Mounting Procedures
Power Derating
SOLDER
PASTE
100
SOLDER
PASTE
75
50
SCREW
(2 PLS.)
PC BOARD
HEATSINK
SOLDER
FILLED VIA
25
0
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
25
50
75
100
125
150
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
P.C.B. SOLDER INTERFACE TEMPERATURE — °C
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
2
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
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