APL158115UC-TRG [ANPEC]

DUAL INPUT LOW DROPOUT REGULATOR; 双输入低压差稳压器
APL158115UC-TRG
型号: APL158115UC-TRG
厂家: ANPEC ELECTRONICS COROPRATION    ANPEC ELECTRONICS COROPRATION
描述:

DUAL INPUT LOW DROPOUT REGULATOR
双输入低压差稳压器

稳压器 输入元件
文件: 总17页 (文件大小:310K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APL1581  
DUAL INPUT LOW DROPOUT REGULATOR  
Features  
General Description  
·
·
Adjustable or Fixed Output  
The APL1581 series of high performance positive volt-  
age regulators are designed for use in applications re-  
quiring very low dropout voltage at 5Amp.  
520mV typ. Dropout at 5A in Dual Power  
Voltage Mode  
·
·
·
·
·
Remote Sense Pin Available  
2% Accuracy Over Temperature Range  
Build-in Over Temperature Protection  
Build-in Current Limit  
The APL1581 can provide a output voltage at the range of  
1.25V to 2.55V where both 5V and 3.3V voltage supplies  
are available.  
The superior dropout characteristics result in reducing  
heat dissipation compared to regular LDOs. The APL1581  
also provides excellent regulation over line, load, and tem-  
perature variations.  
5 Pin TO-220 and TO-263, TO-252, SOP-8-P  
Packages  
·
Lead Free and Green Devices Available  
(RoHS Compliant)  
Current limit is trimmed to ensure specified output cur-  
rent and controlled short-circuit current. On-chip thermal  
limiting provides protection against any combina-  
tion of overload that would create excessive junction  
temperature.  
Applications  
·
·
·
·
Microprocessor Supplies  
Chip Set Supplies  
VGA Card Power  
The APL1581 is available in both the through-hole and  
surface mount versions of the industry standard 5-Pin  
TO-220 and TO-263, TO-252, SOP-8P power packages.  
LCD Monitor Power  
Ordering and Marking Information  
Package Code  
F : TO-220-5  
KA : SOP-8P  
APL1581  
G : TO-263-5  
U :TO-252-5  
Assembly Material  
Handling Code  
Temperature Range  
C : 0 to 70 C  
°
Handling Code  
TR : Tape & Reel  
Voltage Code :  
Temperature Range  
Package Code  
15 : 1.5V  
25 : 2.5V  
18 : 1.8V  
Blank : Adjustable Version  
Assembly Material  
L : Lead Free Device  
Voltage Code  
G : Halogen and Lead Free Device  
15  
APL1581  
XXXXX  
APL1581  
XXXXX  
APL1581-15 F/G/U :  
XXXXX - Date Code  
XXXXX - Date Code  
APL1581 KA :  
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which  
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for  
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen  
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by  
weight).  
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise  
customers to obtain the latest version of relevant information to verify before placing orders.  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.5 - Mar., 2008  
APL1581  
Pin Configuration  
VIN  
5
4
5
VIN  
VCNTL  
4
3
2
1
VCNTL  
TAB is VOUT  
3
2
1
VOUT  
VOUT  
TAB is VOUT  
ADJ (or GND)  
VSENSE  
ADJ(or GND)  
VSENSE  
Front View of TO-252-5  
Front View of TO-220-5  
VSENSE  
ADJ (or GND)  
VCNTL  
VOUT  
VOUT  
VOUT  
VOUT  
1
2
3
4
8
7
6
5
5
4
VIN  
VCNTL  
TAB is VOUT  
3
2
1
VOUT  
VIN  
ADJ (or GND)  
VSENSE  
SOP-8-P (Top View)  
NC = No internal connection  
= Thermal Pad  
Front View of TO-263-5  
(connected to VOUT plane for better heat  
dissipation)  
Pin 5~8 must be connected together by a shortest  
wide track or plane.  
Pin Description  
PIN  
Description  
Name  
I/O  
Positive side of the reference voltage, which allows remote sensing to  
obtain excellent load regulation.  
VSENSE  
I
Negative side of the reference voltage, which allows to use resistor divider  
to set an expect output voltage. A small bypass capacitor can be connected  
from this pin to ground to improve PSRR performance.  
ADJ  
O
O
For fixed voltage devices this is the bottom of the resistor divider that sets  
the output voltage.  
GND  
Output pin of the regulator, which connects to the TAB. A minimum of 10mF  
capacitor must be connected from this pin to ground to ensure the stability.  
VOUT  
VCNTL  
VIN  
O
I
Supply pin of the control circuitry, which must be always higher than VOUT  
for the device to regulate. (See electrical characteristics)  
Power input pin of the regulator, which must be always higher than VOUT for  
the device to regulate. (See electrical characteristics)  
I
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Rev. B.5 - Mar., 2008  
APL1581  
Block Diagram  
VOUT  
VIN  
VCNTL  
Current  
Limit  
VSENSE  
ADJ/GND  
Thermal  
Protection  
Voltage  
Regulation  
Absolute Maximum Ratings (Note 1, 2)  
Symbol  
Parameter  
Rating  
Unit  
V
VIN  
Input Voltage  
7
7
VCNTL  
Control Voltage  
V
PD  
Power Dissipation  
Internally Limited  
W
TJ  
Junction Temperature  
150  
-65 to +150  
260  
°C  
°C  
°C  
TSTG  
TSDR  
Storage Temperature Range  
Maximum Lead Soldering Temperature, 10 Seconds  
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD  
(max) = (TJ – TA) / qJA; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in  
excessive die temperature.  
Thermal Characteristics  
Symbol  
Parameter  
Typical Value  
Unit  
Junction-to-Ambient Resistance in free air (Note 3)  
TO-263-5 (Toplayer plane size : 15mm x 15 mm)  
TO-252-5 (Toplayer plane size : 10mm x 10 mm)  
SOP-8-P (Toplayer plane size : 10mm x 10 mm)  
Junction-to-Case Resistance (Note 4)  
28  
42  
68  
oC/W  
oC/W  
qJA  
TO-220-5  
3
4
5
qJC  
TO-263-5  
TO-252-5  
Note 3: qJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The sizes of the  
rectangular plane, where the devices are mounted, are shown in the table.  
Note 4: The case temperature is measured on the TAB of the device mounted on the test board described in Note 3 except the  
package TO-220-5. The case temperature of the TO-220-5 is measured on the bottom of the case directly below the die.  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.5 - Mar., 2008  
APL1581  
Electrical Characteristics  
Unless otherwise noted , these specifications apply over CIN = 10mF, CCNTL = 1mF, COUT = 10mF, and TA = 0 to 70°C.  
Typical values refer to TA = 25°C. VOUT = VSENSE  
.
APL1581  
TYP  
UNIT  
Symbol  
Parameter  
Test Conditions  
MIN  
MAX  
Reference Voltage  
VCNTL=2.75~5.5V, VIN=2.05~5.5V,  
IO =10mA~5A, VADJ=0V  
VREF  
1.225  
1.250  
1.275  
V
APL1581  
Output Voltage  
(IO =0~5A for fixed versions)  
1.470  
1.764  
2.450  
1.500  
1.800  
2.500  
1.530  
1.836  
2.550  
APL1581-15 VCNTL=3~5.5V , VIN=2.3~5.5V  
APL1581-18 VCNTL=3.3~5.5V , VIN=2.6~5.5V  
APL1581-25 VCNTL=4~5.5V , VIN=3.3~5.5V  
VOUT  
V
Line Regulation  
(IO =0A for fixed versions)  
APL1581 VCNTL=2.75~5.5V, VIN=1.75~5.5V,  
IO =10mA, VADJ=0V  
REGLINE  
3
5
mV  
APL1581-15 VCNTL=3~5.5V, VIN=2.3~5.5V  
APL1581-18 VCNTL=3.3~5.5V, VIN=2.6~5.5V  
APL1581-25 VCNTL=4~5.5V, VIN=3~5.5V  
Load Regulation (Note 5  
)
(IO =0~5A for fixed versions)  
APL1581 VCNTL=2.75V, VIN=2.1V, VADJ =0V,  
IO =10mA~5A  
REGLOAD  
mV  
APL1581-15 VCNTL=3V, VIN=2.35V  
APL1581-18 VCNTL=3.3V, VIN=2.65V  
APL1581-25 VCNTL=4V, VIN=3.35V  
Dropout Voltage (Note 6)  
IO =5A for all versions  
APL1581 VIN=2.05V, VADJ =0V  
APL1581-15 VIN=2.3V  
VCNTL-VOUT  
1.20  
0.52  
1.35  
0.75  
V
V
APL1581-18 VIN=2.6V  
APL1581-25 VIN=3.3V  
Dropout Voltage (Note 6)  
IO =5A for all versions  
APL1581 VCNTL=2.75V, VADJ =0V  
APL1581-15 VCNTL=3V  
VIN-VOUT  
APL1581-18 VCNTL=3.3V  
APL1581-25 VCNTL=4V  
ILIMIT  
ILMIN  
5
A
Current Limit  
VCNTL-VOUT=1.5V, VIN-VOUT=0.6V  
VCNTL=5V, VIN=3.3V, VADJ =0V  
Minimum Load Current  
(Note7)  
0.8  
10  
mA  
%/W  
APL1581  
REGTHERMAL  
0.01  
Thermal Regulation  
30ms Pulse  
Power Supply Ripple  
Rejection  
VRIPPLE=1VPP at 120Hz, IO=5A  
APL1581 VCNTL=5V, VIN=5V, VADJ =0V  
APL1581-15 VCNTL=5.25V, VIN=5.25V  
APL1581-18 VCNTL=5.55V, VIN=5.55V  
APL1581-25 VCNTL=6.25V, VIN=6.25V  
VCNTL-VOUT=1.5V, VIN-VOUT=0.8V,  
PSRR  
60  
70  
dB  
ICNTL  
IGND  
IADJ  
45  
8
120  
13  
mA  
mA  
mA  
CNTL Pin Current  
IO =5A  
Ground Pin Current  
APL1581-15 VCNTL =3V, VIN =2.3V  
APL1581-18 VCNTL =3.3V, VIN =2.6V  
APL1581-25 VCNTL =4V, VIN =3.3V  
Adjust Pin Current  
APL1581 VCNTL=2.75V, VIN=2.05V , VADJ =0V  
50  
120  
Note 5 : Low duty cycle pulse test with Kelvin connections are required to maintain data accuracy .  
Note 6 : Dropout voltage is defined as the minimum difference between VIN and VOUT required to maintain 1% VOUT  
regulation.  
Note 7 : Minimum load current is defined as the minimum current required at the output to maintain VOUT regulation.  
Copyright ã ANPEC Electronics Corp.  
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Rev. B.5 - Mar., 2008  
APL1581  
Application Circuit  
(1) Adjustable Output VoltageDevice  
VIN  
+3.3V  
VIN  
VOUT  
APL1581  
(Adj.)  
VSENSE  
ADJ  
VOUT  
+2.5V/5A  
VCNTL  
+5V  
VCNTL  
R1  
VREF  
120  
COUT  
CCNTL  
CIN  
470uF  
10uF  
100uF  
R2  
120  
GND  
GND  
* VOUT = VREF ( 1+ R2 / R1 ) + IADJ * R2  
where VREF =1.25V (typical)  
IADJ=50mA (typical)  
* R1 is typically in range of 100W to 125W to satisfy the minimum load current requirement.  
(2) Fixed Output VoltageDevice  
V
+3.3V  
IN  
VIN  
VOUT  
V
OUT  
+2.5V/5A  
APL1581-25  
V
CNTL  
VCNTL  
VSENSE  
+5V  
GND  
COUT  
CCNTL  
CIN  
470uF  
10uF  
100uF  
GND  
GND  
(3) With Enable Control Application  
V
+3.3V  
IN  
VIN  
VOUT  
APL1581  
(Adj.)  
VSENSE  
ADJ  
V
OUT  
+2.5V/5A  
Q1  
Q2  
V
CNTL  
VCNTL  
10k  
10k  
R1  
+5V  
VREF  
120  
COUT  
CCNTL  
CIN  
470uF  
Enable  
GND  
10uF  
100uF  
R2  
120  
GND  
Q1 : APM2301A  
Q2 : APM2300A  
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Rev. B.5 - Mar., 2008  
APL1581  
Typical Characteristics  
Reference Voltage vs. Junction Temperature  
Adjust Pin Current vs. Junction Temperature  
80  
1.275  
1.270  
1.265  
1.260  
1.255  
1.250  
1.245  
1.240  
1.235  
1.230  
1.225  
70  
60  
50  
40  
30  
20  
10  
0
-50 -25  
0
25  
50  
75  
100 125 150  
-50 -25  
0
25  
50  
75  
100 125 150  
JunctionTemperature (°C)  
JunctionTemperature (°C)  
Minimum Load Current vs. Junction Temperature  
VIN-VOUT Dropout Voltage vs. Output Current  
700  
1.2  
TJ=125°C  
600  
1.0  
V
CNTL-VOUT=10.75V  
500  
0.8  
0.6  
0.4  
0.2  
0.0  
TJ=25°C  
400  
V
CNTL-VOUT=1.45V  
300  
TJ=-50°C  
200  
100  
0
-50  
-25  
0
25  
50  
75  
100  
125  
150  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Output Current (A)  
JunctionTemperature (°C)  
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Rev. B.5 - Mar., 2008  
APL1581  
Typical Characteristics  
Short-Circuit Current vs. Junction Temperature  
VCONTROL-VOUT Dropout Voltage vs. Output Current  
1.4  
14  
TJ=-50°C  
VIN=5.0V  
12  
1.3  
1.2  
1.1  
TJ=0°C  
10  
VIN=3.3V  
8
TJ=25°C  
1.0  
0.9  
0.8  
0.7  
6
4
2
0
TJ=125°C  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
-50  
-25  
0
25  
50  
75  
100  
125  
150  
JunctionTemperature (°C)  
Output Current (A)  
Control Pin Current vs. Output Current  
Control Pin Current vs. Output Current  
VIN-VOUT=0.6V  
VIN-VOUT=0.8V  
80  
160  
TJ=-50°C  
TJ=0°C  
TJ=25°C  
TJ=75°C  
TJ=125°C  
TJ=25°C  
70  
60  
50  
40  
30  
20  
10  
0
140  
120  
100  
80  
60  
40  
TJ=0°C  
TJ=-50°C  
TJ=125°C  
TJ=75°C  
20  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Output Current (A)  
Output Current (A)  
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Rev. B.5 - Mar., 2008  
APL1581  
Typical Characteristics  
Control Pin Current vs. Output Current  
Control Pin Current vs. Output Current  
VIN-VOUT=1.0V  
VIN-VOUT=4.25V  
80  
70  
TJ=-50°C  
70  
60  
TJ=-50°C  
TJ=0°C  
TJ=25°C  
60  
50  
40  
30  
20  
10  
0
TJ=0°C  
TJ=25°C  
50  
40  
30  
20  
TJ=75°C  
TJ=75°C  
TJ=125°C  
TJ=125°C  
10  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
Output Current (A)  
Output Current (A)  
Application Information  
General  
APL1581 is available in SOP-8P, TO-252-5,  
The APL1581 (adjustable or fixed) regulator is a 5 ter-  
minal device designed specifically to provide extremely  
low dropout voltages comparable to the PNP type with-  
out the disadvantage of the extra power dissipation  
due to the base current associated with PNP regulators.  
This is done by bringing out the control pin of the regu-  
lator that provides the base current to the power NPN  
and connecting it to a voltage that is greater than the  
voltage present at the VIN pin. This flexibility makes  
APL1581 ideal for applications where dual inputs are  
available, such as a computer motherboard with an  
ATX power supply that provides 5V and 3.3V to the  
board.  
TO-263-5, and TO-220-5 packages to meet different  
power dissipation applications.  
Output Voltage Setting  
See Figure 1 Adjustable APL1581 develops a 1.25V  
reference voltage between the VSENSE pin and the  
ADJ pin. Placing a resistor between these two termi-  
nals causes a constant current to flow through R1 and  
down through R2 to set the overall output voltage. In  
general, R1 is chosen so that this current is the speci-  
fied minimum load current of 10mA.The current out of  
the ADJ pin is small, typically 50mA and itadds to the  
current from R1. Because IADJ is very small, it needs  
to be considered only when very precise output volt-  
age setting is required. For best regulation, the top of  
the resistor divider should be connected directly to  
the SENSE pin. The adjustable APL1581 can be pro-  
APL1581 is equipped with a 1.25V reference, preci-  
sion and fast voltage regulations, on-chip current and  
thermal limits, and remote sensing capability to re-  
duce system total cost.  
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Rev. B.5 - Mar., 2008  
APL1581  
Application Information (Cont.)  
Output Voltage Setting (Cont.)  
regardless of whether they are inside or outside the  
regulation loop.  
grammable to anyvoltagesin the range of 1.25V to 5.5V  
according to the following formula:  
VOUT  
VIN  
VIN  
VOUT  
R2  
APL1581  
VOUT = VREF x (1+  
) + IADJ x R2  
R1  
VCNTL  
VCNTL  
VSENSE  
Load  
ADJ  
R1  
R2  
where VREF = 1.25V (typical)  
Adjustable  
Device  
IADJ = 50mA (typical)  
The recommended R1 is in range of 100W to125W to  
satisfy the minimum load current requirement. Proper  
sizes of R2 and R1 are also concerned for power  
dissipation.  
RP  
VOUT  
V
IN  
VIN  
VOUT  
APL1581  
VCNTL VSENSE  
V
CNTL  
Load  
GND  
VIN  
VIN  
VOUT  
VOUT  
APL1581  
Fixed Voltage  
Device  
VCNTL  
VCNTL  
VSENSE  
ADJ  
R1  
VRE F  
RP  
Figure 2 Remote Voltage Sensing  
Stability and Output Capacitors  
IADJ=50uA  
R2  
Figure 1 Setting Output Voltage  
Grounding and Output Sensing  
The circuit design of using the APL1581 series re-  
quires an output capacitor as part of the device fre-  
quency compensation. The following chart shows a  
stable region to select output capacitor for APL1581.  
This region above the curve indicates minimum re-  
quired ESR and capacitance to maintain stability.  
However, the output capacitor should have an ESR  
less than1W.  
The APL1581 allows true Kelvin sensing for both the  
high and low side of the load. Figure 2 shows the de-  
vice connected to take advantage of the remote sense  
feature. The SENSE pin and the top of the resistor  
divider are connected to the top of the load; the bot-  
tom of the resistor divider is connected to the bottom  
of the load. Typically the load is a microprocessor  
and parasitic resistance RPis made up of the PC traces  
and /or connector resistance between the regulator  
and the processor. RP is now connectedinside the  
regulation loop of theAPL1581 and for reasonable val-  
ues of RP the load regulation at the load will be  
negligible. Voltage drops due to RP are not eliminated;  
they will add to the dropout voltage of the regulator  
100  
80  
Stable Region  
60  
40  
20  
0
1
10  
100  
1000  
Capacitance(mF)  
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Rev. B.5 - Mar., 2008  
APL1581  
Application Information (Cont.)  
Stability and Output Capacitors (Cont.)  
exceeded under continuous normal load conditions.  
Careful consideration must be given to all sources of  
thermal resistance from junction to ambient, includ-  
ing junction-to-case, case-to-heat sink interface, and  
heat sink resistance itself.  
A low-ESR solid tantalum and aluminum electrolytic  
capacitor (ESR<1W) works extremelywelland provides  
good transient response andstabilityover temperature.  
Ultra-low-ESR capacitors, such as ceramic chip  
capacitors, may promote unstable or under-damped  
transient response, but proper ceramic chip capaci-  
tors placed near loads can be used as decoupling  
capacitors.  
See Figure 3 The SOP-8P is a cost-effective package  
featuring a small size as a standard SOP-8 and a  
bottom thermal pad to minimize the thermal resistance  
of the package, being applicable to high current  
applications. The thermal pad is soldered to the top  
VOUT plane which may be connected to internal or  
bottom VOUT plane by vias to reduce the heat sink  
thermal resistance. Therefore, the printed circuit board  
(PCB) forms a heat sink and dissipates heat into am-  
bient air.  
The output capacitors are also used to reduce the slew  
rate of load current and help theAPL1581 to minimize  
variations of the output voltage, improving transient  
response. For this purpose, the low-ESR capacitors  
are recommended.  
Input Capacitors  
The input capacitors of VCNTL and VIN pins are not  
required for stability but for supplying surge currents  
during large load transients, and this will prevent the  
input rail from drooping and improve the performance  
of theAPL1581. Because parasitic inductors from volt-  
age sources or other bulk capacitors to the VCNTL  
and VIN pins will limit the slew rate of the surge cur-  
rents during large load transients, resulting in voltage  
drop at VIN and VCNTL pins.  
Top layer  
VOUT plane  
for Heat Dissipation  
(Larger area is better)  
COUT  
8
1
7
2
6
3
5
4
Load  
Vias  
Vias  
A capacitor of 1mF (ceramic chip capacitor) or greater  
(aluminum electrolytic capacitor) is recommended and  
connected near VCNTLpin. For VINpin, an aluminum  
electrolytic capacitor (>33mF) is recommended. It is  
not necessary to use low-ESR capacitors. More ca-  
pacitance reduces the variations of the input voltage  
at VIN pin.  
Soldering area  
(140mil x  
110mil)  
CIN  
CCNTL  
for bottom pad  
Figure 3 Recommended SOP-8P Layout  
Layout and Thermal Consideration  
The APL1581 series have internal power and thermal  
limiting (TJ=150oC typical) circuitry designed to pro-  
tect the device under overload conditions. However,  
maximum junction temperature ratings should not be  
Copyright ã ANPEC Electronics Corp.  
10  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Package Information  
TO-220-5  
D
Q
b
e
e1  
E
L
H1  
A
c
J1  
F
Millimeters  
Inches  
Dim  
Min.  
3.55  
0.63  
0.35  
14.22  
1.57  
6.68  
9.65  
1.14  
5.84  
2.03  
13.72  
3.53  
2.54  
Max.  
4.83  
1.02  
0.56  
16.51  
1.83  
6.94  
10.67  
1.40  
6.60  
3.05  
14.22  
4.09  
3.43  
Min.  
Max.  
0.190  
0.040  
0.022  
0.650  
0.072  
0.273  
0.420  
0.055  
0.260  
0.120  
0.560  
0.161  
0.135  
A
b
0.140  
0.025  
0.014  
0.560  
0.062  
0.263  
0.380  
0.045  
0.230  
0.080  
0.540  
0.139  
0.100  
c
D
e
e1  
E
F
H1  
J1  
L
R
Q
Copyright ã ANPEC Electronics Corp.  
11  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Package Information  
TO-263-5  
A
c2  
E
E1  
b
e
c
SEE VIEW A  
GAUGE PLANE  
SEATING PLANE  
L
VIEW A  
TO-263-5  
S
Y
M
B
O
L
MILLIMETERS  
INCHES  
MIN.  
MAX.  
4.83  
0.25  
0.99  
0.74  
MIN.  
MAX.  
0.190  
0.010  
0.039  
0.029  
0.065  
0.380  
0.354  
0.450  
0.354  
A
4.06  
0.160  
0.000  
0.020  
0.015  
0.045  
0.330  
0.236  
0.380  
0.245  
0.00  
0.51  
0.38  
A1  
b
c
c2  
1.14  
8.38  
6.00  
9.65  
6.22  
1.65  
9.65  
9.00  
11.43  
9.00  
D
D1  
E
E1  
e
1.70 BSC  
0.067 BSC  
0.575  
0.070  
0.625  
0.110  
0.066  
8o  
14.61  
1.78  
15.88  
2.79  
1.68  
8o  
H
L
L1  
0
0o  
0o  
Note : Follow from JEDEC TO-263 BB.  
Copyright ã ANPEC Electronics Corp.  
12  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Packaging Information  
TO-252-5  
E
A
c2  
E1  
b3  
c
b
e
SEE VIEW A  
SEATING PLANE  
GAUGE PLANE  
L
VIEW A  
TO-252-5  
S
Y
M
B
O
L
MILLIMETERS  
MIN.  
INCHES  
MAX.  
2.39  
0.13  
0.89  
5.46  
MIN.  
MAX.  
0.094  
0.005  
0.035  
0.215  
0.024  
0.035  
0.245  
A
2.18  
0.086  
A1  
b
0.020  
0.170  
0.018  
0.018  
0.210  
0.180  
0.250  
0.150  
0.50  
4.32  
b3  
c
0.46  
0.46  
5.33  
4.57  
6.35  
3.81  
0.61  
0.89  
6.22  
6.00  
6.73  
c2  
D
D1  
E
0.236  
0.265  
E1  
e
6.00  
0.236  
1.27 BSC  
0.050 BSC  
0.370  
0.055  
0.035  
0.410  
0.070  
0.080  
9.40  
1.40  
0.89  
10.41  
1.78  
H
L
L3  
0
2.03  
°
°
8
°
8
°
0
0
Copyright ã ANPEC Electronics Corp.  
13  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Packaging Information  
SOP-8-P  
D
SEE VIEW  
A
D1  
THERMAL  
PAD  
°
e
b
c
GAUGE PLANE  
SEATING PLANE  
L
VIEW A  
SOP-8P  
S
Y
M
B
O
L
MILLIMETERS  
INCHES  
MIN.  
MAX.  
1.60  
MIN.  
MAX.  
0.063  
0.006  
A
0.000  
0.049  
0.012  
0.007  
0.15  
A1  
A2  
b
0.00  
1.25  
0.31  
0.17  
0.020  
0.010  
0.51  
0.25  
c
D
0.189  
0.098  
0.197  
0.138  
4.80  
2.25  
5.80  
3.80  
2.00  
5.00  
3.50  
6.20  
4.00  
3.00  
D1  
E
0.228  
0.150  
0.079  
0.244  
0.157  
0.118  
E1  
E2  
e
1.27 BSC  
0.050 BSC  
0.010  
0.016  
0o  
0.020  
0.050  
8o  
0.25  
0.40  
0o  
0.50  
1.27  
8o  
h
L
0
Note : 1. Follow JEDEC MS-012 BA.  
2. Dimension "D" does not include mold flash, protrusions  
or gate burrs. Mold flash, protrusion or gate burrs shall not  
exceed 6 mil per side .  
3. Dimension "E" does not include inter-lead flash or protrusions.  
Inter-lead flash and protrusions shall not exceed 10 mil per side.  
Copyright ã ANPEC Electronics Corp.  
14  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Carrier Tape & Reel Dimensions  
P0  
P2  
P1  
OD0  
A
K0  
A0  
A
OD1  
B
B
SECTION A-A  
SECTION B-B  
d
T1  
Application  
TO-263-5  
A
H
T1  
C
d
D
W
E1  
F
24.4+2.00 13.0+0.50  
-0.00 -0.20  
381.0±2.00 60 MIN.  
P0 P1  
1.5 MIN. 20.2 MIN. 24.0±0.30 1.75±0.10 11.5±0.10  
P2 D0  
D1  
T
A0  
10.8±0.20 16.1±0.20 5.2±0.20  
E1  
B0  
K0  
1.5+0.10  
-0.00  
0.6+0.00  
-0.40  
4.0±0.10 16.0±0.10 2.0±0.10  
T1  
1.5 MIN.  
Application  
TO-252-5  
A
H
C
d
D
W
F
16.4+2.00 13.0+0.50  
330.0±2.00 50 MIN.  
P0 P1  
4.0±0.10 8.0±0.10  
1.5 MIN. 20.2 MIN. 16.0±0.30 1.75±0.10 7.50±0.05  
-0.00  
P2  
-0.20  
D0  
1.5+0.10  
-0.00  
D1  
1.5 MIN.  
d
T
A0  
6.80±0.20  
W
B0  
10.40±  
0.20  
K0  
2.50±0.20  
F
0.6+0.00  
-0.40  
2.0±0.05  
Application  
SOP-8-P  
A
H
T1  
C
D
E1  
12.4+2.00 13.0+0.50  
330.0±2.00 50 MIN.  
P0 P1  
4.0±0.10 8.0±0.10  
1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05  
-0.00  
P2  
2.0±0.05  
-0.20  
D0  
D1  
T
A0  
B0  
K0  
1.5+0.10  
-0.00  
0.6+0.00  
-0.40  
1.5 MIN.  
6.40±0.20 5.20±0.20 2.10±0.20  
(mm)  
Copyright ã ANPEC Electronics Corp.  
15  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Devices Per Unit  
Package Type  
TO-252-5  
Unit  
Quantity  
2500  
Tape & Reel  
Tape & Reel  
Tape & Reel  
TO-263-5  
1000  
SOP-8-P  
2500  
Reflow Condition (IR/Convection or VPR Reflow)  
tp  
TP  
Critical Zone  
TL to TP  
Ramp-up  
TL  
tL  
Tsmax  
Tsmin  
Ramp-down  
ts  
Preheat  
25  
°
t 25 C to Peak  
Time  
Reliability Test Program  
Test item  
SOLDERABILITY  
HOLT  
PCT  
TST  
ESD  
Method  
MIL-STD-883D-2003  
MIL-STD-883D-1005.7  
JESD-22-B, A102  
MIL-STD-883D-1011.9  
MIL-STD-883D-3015.7  
JESD 78  
Description  
245°C, 5 sec  
1000 Hrs Bias @125°C  
168 Hrs, 100%RH, 121°C  
-65°C~150°C, 200 Cycles  
VHBM > 2KV, VMM > 200V  
10ms, 1tr > 100mA  
Latch-Up  
Copyright ã ANPEC Electronics Corp.  
16  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  
APL1581  
Classification Reflow Profiles  
Profile Feature  
Average ramp-up rate  
(TL to TP)  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
- Temperature Min (Tsmin)  
- Temperature Max (Tsmax)  
- Time (min to max) (ts)  
Time maintained above:  
- Temperature (TL)  
183°C  
60-150 seconds  
217°C  
60-150 seconds  
- Time (tL)  
Peak/Classification Temperature (Tp)  
See table 1  
See table 2  
Time within 5°C of actual  
Peak Temperature (tp)  
10-30 seconds  
20-40 seconds  
Ramp-down Rate  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Time 25°C to Peak Temperature  
Note: All temperatures refer to topside of the package. Measured on the body surface.  
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures  
Volume mm3  
350  
Volume mm3  
Package Thickness  
<350  
<2.5 mm  
³ 2.5 mm  
240 +0/-5°C  
225 +0/-5°C  
225 +0/-5°C  
225 +0/-5°C  
Table 2. Pb-free Process – Package Classification Reflow Temperatures  
Volume mm3  
<350  
Volume mm3  
Volume mm3  
>2000  
Package Thickness  
350-2000  
<1.6 mm  
1.6 mm – 2.5 mm  
³ 2.5 mm  
260 +0°C*  
260 +0°C*  
250 +0°C*  
260 +0°C*  
250 +0°C*  
245 +0°C*  
260 +0°C*  
245 +0°C*  
245 +0°C*  
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated  
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL  
level.  
Customer Service  
Anpec Electronics Corp.  
Head Office :  
No.6, Dusing 1st Road, SBIP,  
Hsin-Chu, Taiwan, R.O.C.  
Tel : 886-3-5642000  
Fax : 886-3-5642050  
Taipei Branch :  
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,  
Sindian City City, Taipei County 23146, Taiwan  
Tel : 886-2-2910-3838  
Fax : 886-2-2917-3838  
Copyright ã ANPEC Electronics Corp.  
17  
www.anpec.com.tw  
Rev. B.5 - Mar., 2008  

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