APX9168 [ANPEC]
Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor;
| 型号： | APX9168 |
| 厂家： | 
ANPEC ELECTRONICS COROPRATION |
| 描述： | Single-Phase Full-Wave Motor Dr iver with Built - in Hall Sensor |
| 文件： | 总13页 (文件大小：208K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
APX9168
Single-Phase Full-Wave Motor Driver with Built-in Hall Sensor
Features
General Description
The APX9168 is an integrated Hall Effect Sensor IC de-
signed for electric commutation of single-phase DC
brushless motor applications. The device is built-in lock
•
•
•
•
•
•
•
•
On-Chip Hall Sensor
Silent Driver
High Sensitivity Hall Effect Sensor IC: ±15G(Type.)
Built-in Lock Protection and Auto Restart Function
FGOutput
protection. When fan is locked, the device will enter the
lock protection mode. It is also with thermal shutdown
function. The APX9168 is available in a low cost TO-92M5
and SOP-8F Packages.
Built-In Thermal Protection Circuit
TO-92M5 and SOP-8F Packages
Lead Free and Green Devices Available
(RoHS Compliant)
Pin Description
APX9168
Front View
1 : FG
2 : VDD
3 : OUT1
4 : OUT2
5 : GND
Applications
•
•
Brushless DC Fans
1
2
3
4
5
Brushless DC Motors
APX9168
VDD 1
NC 2
8 FG
7 GND
SOP-8F
OUT2 3
NC 4
6 OUT1
5 NC
Ordering and Marking I nform ation
A P X 9168
P ackage C ode
E : T O -92M 5 K E : S O P -8F
A ssem bly M aterial
H andling C ode
T em perature R ange
P ackage C ode
O perating A m bient T em perature R ange
I : -40 to 105 ℃
H andling C ode
P B : P lastic B ag
T R : T ape & R eel
A ssem bly M aterial
G : H alogen and Lead F ree D evice
X X X X X - D ate C ode
A P X
9168
A P X 9168 E :
X X X X X
A P X 9168
X X X X X
X X X X X - D ate C ode
A P X 9168 K E :
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
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ANPEC Electronics Corp.
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Rev. A.3 - Jun., 2017
APX9168
Absolute Maxim um Ratings (TA= 25°C unless otherwise noted) (Note 1)
Symbol
VDD
Parameter
VDD Pin Supply Voltage (VDD to GND)
Rating
Unit
V
-0.3 to 20
Output Pin (OUT1, OUT2) Output Voltage
VOUT
-0.3 to 20
450
V
Output Pin (OUT1, OUT2) Maximum Output Current – Continuous
IOUT
Hold
1000
1200
150
mA
Peak
oC
oC
oC
Maximum Junction Temperature
TJ
Storage Temperature
TSTG
TSOR
-65 to 150
260
Maximum Lead Soldering Temperature, 10 Seconds
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Therm al Characteristics
Symbol
Parameter
Typical Value
Unit
Thermal Resistance-Junction to Ambient (Note 2)
TO-92M5
SOP-8F
131
oC/W
RTH,JA
156.25
Power Dissipation, TA = 25°C
PD
TO-92M5
SOP-8F
950
800
mW
Note 3 : The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) =(TJ – TA) / θJA; TJ =
150°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Recom m ended Operating Conditions
Symbol
Parameter
Range
Unit
V
VDD
VDD Supply Voltage
2.5 to 17
-40 to 105
-40 to 125
TA
Operating Ambient Temperature
Junction Temperature
oC
TJ
oC
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Rev. A.3 - Jun., 2017
APX9168
Electrical Characteristics (TA=25°C, VDD=12V unless otherwise noted)
APX9168
Typ.
5.5
Symbol
Parameter
Test Conditions
Unit
Min.
Max.
IDD
VO
VDD Supply Current
VDD=17V, no load
6.5
mA
V
Output Driver Saturation Voltage
FG Pin Low Voltage
IOUT=400mA, Upper and Lower total
-
-
-
-
-
-
-
-
0.65
0.2
0.8
IFG=5mA
VFG=12V
VFG
IFGL
TON
TOFF
ILIM
0.4
V
FG Pin Off Leakage Current
Lock Detection On Time
<0.1
0.4
1
-
µA
sec
sec
mA
oC
Lock Detection Off Time
4
-
Internal Current Limit (50% Output)
Over Temperature Shutdown Threshold
Over Temperature Shutdown Hysteresis
1100
165
30
-
-
OTS
-
oC
Magnetic Characteristics (TA=25°C, VDD=12V unless otherwise noted)
APX9168
Typ.
15
Symbol
Parameter
Test Conditions
Unit
Min.
5
Max.
30
-5
Bop
Brp
Magnetic Operation Point
Magnetic Release Point
Magnetic Hysteresis
Gauss
Gauss
Gauss
-30
-
-15
Bhys
30
-
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Rev. A.3 - Jun., 2017
APX9168
Typical Operating Characteristics
Output Saturation Voltage vs.
Output Current
VDD Supply Current vs. VDD Supply Voltage
1.2
1
7
VDD = 12V
6
5
4
3
2
1
Upper Side
0.8
0.6
0.4
0.2
0
Lower Side
0
0
100 200 300 400 500 600 700 800 900 1000
Output Current(mA)
0 1 2 3 4 5 6 7 8 9 1011121314151617181920
VDD Supply Voltage(V)
Magnetic Switching Points vs.
Junction Temperature
Magnetic Switching Points vs.
VDD Supply Voltage
30
30
20
10
0
VDD = 12V
Bop
Bop
20
10
0
-10
-20
-30
-10
Brp
-20
Brp
-30
-50 -25
0
25
50
75
100 125 150
0
1 2 3 4 5 6 7 8 9 1011 1213 1415 1617 18
VDD Supply Voltage(V)
Junction Temperature(oC)
Maximum Power Dissipation vs.
Ambient Temperature
FG Pin Low Voltage vs. Sink Current
1000
0.5
0.45
0.4
900
800
700
600
500
400
300
200
100
0
VDD = 2.5V
0.35
0.3
TO-92M5
0.25
0.2
SOP-8F
0.15
0.1
VDD = 12V
0.05
0
0
1
2
3
4
5
6
7
8
9
10
0
25
50
75
100
125
150
Ambient Temperature(oC)
FG Pin Sink Current(mA)
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Rev. A.3 - Jun., 2017
APX9168
Pin Description
TO-92M5
PIN
FUNCTION
NO.
1
NAME
FG
Rotation Speed Output
Supply Voltage Input.
H-bridge output connection.
H-bridge output connection.
Ground of the IC.
2
VDD
3
OUT1
OUT2
GND
4
5
SOP-8F
PIN
Func tion
N O.
1
NAM E
VDD
N C
Sup ply V oltage Input.
No co nnection.
2
3
O UT2
N C
H-brid ge output co nnection.
No co nnection.
4
5
N C
No co nnection.
6
O UT1
G ND
FG
H-brid ge output co nnection.
Gro und of th e IC.
7
8
Rotation Spe ed or Dete ction O utput. This is an ope n-dra in output.
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Rev. A.3 - Jun., 2017
APX9168
Block Diagram
VDD
Voltage
Regulator
OUT2
OUT1
Hall
Plane
Logic Control
Citcuit
FG
Oscillator
GND
Typical Application Circuit
Pull High
Voltage
APX9168
D1
RFG
VIN
1
2
3
FG
GND
OUT1
NC
8
VDD
NC
1
2
3
4
5
7
6
5
Pull High
Voltage
C1
OUT2
NC
4
RFG
coil
VIN
D1
C1
coil
Notes: D1 is to protect IC when reverse power input.
C1 must use at least 1μF/25V capacitor and place as close to IC as possible .
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Rev. A.3 - Jun., 2017
APX9168
Function Description
Output Switch Principle
The APX9168 built in a Hall-effect sensor plane to sense
the vertical magnetic flux density (B). There are two out-
put drivers in APX9168 to drive single-phase DC
brushless motor. When the N pole magnetic field close
to the IC marking surface and the magnetic flux density
higher than operate point (Bop), the OUT1 pin output will
turn to LOW and the OUT2 pin output will turn to HIGH.
When the N pole magnetic field far away the IC marking
surface and S pole magnetic field close to the IC marking
surface until the magnetic flux density higher than re-
lease point (Brp), the OUT1 pin output will turn HIGH and
the OUT2 pin output will turn LOW.
B=0
TOFF
TOFF
OUT2
TON
OUT1
FG
Brp
Bop
Lock
Lock
S
N
N
S
Release Reset
Detection
Thermal Protection
Marking Surface
(TO-92M5)
Marking Surface
(TO-92M5)
The APX9168 has a thermal protection. When the inter-
nal junction temperature reaches 165oC, the output de-
vices will be switched off. When the IC’s junction tem-
perature cools by 30oC, the thermal sensor will turn the
output devices on again, resulting in a pulsed output dur-
ing continuous thermal protection.
N
S
S
N
Marking Surface
(SOP-8F)
Marking Surface
(SOP-8F)
VOUT1
VOUT1
B
B
Brp
Bop
Brp
Bop
Bhys
Bhys
VOUT2
VOUT2
B
B
Brp
Bop
Brp
Bop
Lockup Protection and Automatic Restart
The APX9168 detects the rotation of the motor by internal
hall sensor signal, and adjusts lock detection ON time
(TON) and lock detection OFF time (TOFF) by internal counter.
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Rev. A.3 - Jun., 2017
APX9168
Package I nform ation
TO-92M4
D
I
E
s
Hall element location
1.95
0.52
Sensitive Area (0.286x0.286mm2)
Position of Hall Sensor
reference to the top-left of package
x= 1.45±0.1mm
b
e
c
y= 1.95±0.1mm
TO-92M5
INCHES
S
Y
M
B
O
L
MILLIMETERS
MIN.
MAX.
3.70
0.41
0.41
5.27
MIN.
MAX.
0.146
0.016
0.016
0.207
A
3.60
0.35
0.35
5.17
0.142
0.014
0.014
0.204
b
c
D
0.037 BSC
e
0.95 BSC
0.059
0.159
0.543
0.053
0.025
0.063
0.171
0.622
0.061
0.033
E
1.50
4.04
13.80
1.34
0.63
1.60
4.34
15.80
1.54
0.83
l
L
L2
s
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ANPEC Electronics Corp.
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Rev. A.3 - Jun., 2017
APX9168
Package I nform ation
SOP-8F
D
0.37
0.88
e
b
C
0.60
S
Y
M
B
O
SOP-8F
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
0.059
0.020
0.010
0.197
0.244
0.157
L
A
1.24
0.31
0.17
4.80
5.80
3.80
1.50
0.51
0.25
5.00
6.20
4.00
0.049
0.012
0.007
0.189
0.228
0.150
b
c
D
E
E1
e
h
1.27 BSC
0.050 BSC
0.020
0.010
0.25
0.50
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Rev. A.3 - Jun., 2017
APX9168
Carrier Tape & Reel Dim ensions
P0
P2
P1
OD0
A
K0
A0
A
OD1
B
B
SECTION A-A
SECTION B-B
d
T1
Application
SOP-8F
A
H
T1
12.4+2.00 13.0+0.50
-0.00 -0.20
P2 D0
C
d
D
W
E1
F
5.5 ±0.05
K0
330.0±2.00
P0
50 MIN.
P1
1.5 MIN.
D1
20.2 MIN. 12.0 ±0.30 1.75±0.10
T
A0
B0
1.5+0.10
-0.00
0.6+0.00
-0.40
4.0±0.10
8.0 ±0.10
2.0±0.05
1.5 MIN.
6.90±0.10 5.30±0.10 2.00±0.10
(mm)
Devices Per Unit
Package Type
SOP-8F
Unit
Quantity
2500
Tape & Reel
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Rev. A.3 - Jun., 2017
APX9168
Taping Direction I nform ation
SOP-8F
USER DIRECTION OF FEED
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APX9168
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Temperature min (Tsmin
)
Temperature max (Tsmax
Time (Tsmin to Tsmax) (ts)
)
Average ramp-up rate
(Tsmax to TP)
3 °C/second max.
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body Temperature
(Tp)*
See Classification Temp in table 1
20** seconds
See Classification Temp in table 2
30** seconds
Time (tP)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax
)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
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Rev. A.3 - Jun., 2017
APX9168
Classification Reflow Profiles ( Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Volume mm3
≥350
Package
Thickness
<2.5 mm
Volume mm3
<350
235 °C
220 °C
≥2.5 mm
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mm3
Volume mm3
350-2000
260 °C
Volume mm3
<350
>2000
260 °C
245 °C
245 °C
260 °C
260 °C
250 °C
1.6 mm – 2.5 mm
≥2.5 mm
250 °C
245 °C
Reliability Test Program
Test item
Method
JESD-22, B102
JESD-22, A108
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
SOLDERABILITY
HOLT
PCT
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
TCT
HBM
VMM≧200V
MM
10ms, 1tr≧100mA
Latch-Up
Custom er Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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Rev. A.3 - Jun., 2017
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