AO3703L [AOS]

P-Channel Enhancement Mode Field Effect Transistor with Schottky Diode; P沟道增强型场效应晶体管,肖特基二极管
AO3703L
型号: AO3703L
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

P-Channel Enhancement Mode Field Effect Transistor with Schottky Diode
P沟道增强型场效应晶体管,肖特基二极管

晶体 肖特基二极管 晶体管 场效应晶体管
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AO3703  
P-Channel Enhancement Mode Field Effect Transistor  
with Schottky Diode  
General Description  
Features  
VDS (V) = -20V  
The AO3703 uses advanced trench technology to provide  
excellent R DS(ON) and low gate charge. A Schottky diode is  
provided to facilitate the implementation of a bidirectional  
blocking switch, or for DC-DC conversion applications.  
Standard Product AO3703 is Pb-free (meets ROHS & Sony  
259 specifications). AO3703L is a Green Product ordering  
option. AO3703 and AO3703L are electrically identical.  
ID = -2.7 A (VGS = -10V)  
RDS(ON) < 97m(VGS = -4.5V)  
RDS(ON) < 130m(VGS = -2.5V)  
RDS(ON) < 190m(VGS = -1.8V)  
SCHOTTKY  
VDS (V) = 20V, IF = 1A, VF<0.5V@0.5A  
D
K
SOT-23-5  
Top View  
D
K
G
S
A
1
2
3
5
4
G
A
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
MOSFET  
-20  
Schottky  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
±8  
TA=25°C  
TA=70°C  
-2.7  
ID  
A
Continuous Drain Current  
A
-2.1  
B
IDM  
Pulsed Drain Current  
-10  
VKA  
Schottky reverse voltage  
20  
2
V
A
TA=25°C  
TA=70°C  
IF  
IFM  
A
Continuous Forward Current  
1
B
Pulsed Forward Current  
10  
TA=25°C  
TA=70°C  
1.14  
0.72  
0.92  
0.59  
PD  
W
Power Dissipation  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
-55 to 150  
°C  
Parameter: Thermal Characteristics MOSFET  
Symbol  
Typ  
80.3  
117  
Max  
110  
150  
80  
Units  
A
t 10s  
Maximum Junction-to-Ambient  
Maximum Junction-to-Ambient  
RθJA  
°C/W  
A
Steady-State  
Steady-State  
C
RθJL  
58.5  
Maximum Junction-to-Lead  
Alpha & Omega Semiconductor, Ltd.  
AO3703  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=-250µA, VGS=0V  
-20  
V
V
DS=-16V, VGS=0V  
-1  
-5  
IDSS  
Zero Gate Voltage Drain Current  
µΑ  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
V
V
DS=0V, VGS=±8V  
±100  
-1  
nA  
V
VGS(th)  
ID(ON)  
DS=VGS ID=-250µA  
-0.3  
-10  
-0.6  
VGS=-4.5V, VDS=-5V  
VGS=-4.5V, ID=-2.7A  
A
76  
111  
101  
134  
7
97  
mΩ  
TJ=125°C  
135  
130  
190  
RDS(ON)  
Static Drain-Source On-Resistance  
mΩ  
mΩ  
S
V
GS=-2.5V, ID=-2A  
VGS=-1.8V, ID=-1A  
VDS=-5V, ID=-2.7A  
IS=-1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
4
-0.78  
-1  
-2  
V
Maximum Body-Diode Continuous Current  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
540  
72  
pF  
pF  
pF  
V
GS=0V, VDS=-10V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
49  
VGS=0V, VDS=0V, f=1MHz  
12  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
6.1  
0.6  
1.6  
10  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=-4.5V, VDS=-10V, ID=-2.7A  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
V
GS=-4.5V, VDS=-10V, RL=2.8,  
GEN=3Ω  
Turn-On Rise Time  
12  
R
tD(off)  
tf  
Turn-Off DelayTime  
44  
Turn-Off Fall Time  
22  
trr  
IF=-2.7A, dI/dt=100A/µs  
IF=-2.7A, dI/dt=100A/µs  
21  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
7.5  
nC  
SCHOTTKY PARAMETERS  
VF  
Forward Voltage Drop  
IF=0.5A  
0.39  
0.5  
0.1  
20  
V
VR=16V  
Irm  
Maximum reverse leakage current  
mA  
VR=16V, TJ=125°C  
CT  
trr  
Junction Capacitance  
VR=10V  
34  
5.2  
0.8  
pF  
IF=1A, dI/dt=100A/µs  
IF=1A, dI/dt=100A/µs  
10  
Schottky Reverse Recovery Time  
Schottky Reverse Recovery Charge  
ns  
Qrr  
nC  
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value  
in any given application depends on the user's specific board design. The current rating is based on the t 10s thermal resistance rating.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.  
D. The static characteristics in Figures 1 to 6 are obtained using 80µs pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA  
curve provides a single pulse rating. Rev0: July 2006  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICA  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISIN  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  
AO3703  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
6
15  
-4.5V  
VDS=-5V  
-3.0V  
-2.5V  
-8V  
4
2
0
10  
5
-2.0V  
125°C  
VGS=-1.5V  
25°C  
0
0
1
2
3
4
5
0
0.5  
1
1.5  
2
-VDS (Volts)  
-VGS(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
200  
150  
100  
50  
1.8  
1.6  
1.4  
1.2  
1
VGS=-2.5V  
VGS=-1.8V  
VGS=-1.8V  
VGS=-4.5V  
VGS=-2.5V  
VGS=-4.5V  
0.8  
0
2
4
6
0
25  
50  
75  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
100  
125  
150  
175  
-ID (A)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
200  
150  
100  
50  
1E+01  
1E+00  
1E-01  
1E-02  
1E-03  
1E-04  
1E-05  
1E-06  
ID=-2.7A  
125°C  
25°C  
125°C  
25°C  
0
2
4
6
8
0.0  
0.2  
0.4  
0.6  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics  
0.8  
1.0  
1.2  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AO3703  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
800  
600  
400  
200  
0
5
4
3
2
1
0
VDS=-10V  
ID=-2.7A  
Ciss  
Crss  
Coss  
15  
0
2
4
6
8
0
5
10  
-VDS (Volts)  
20  
-Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
20  
15  
10  
5
TJ(Max)=150°C  
TJ(Max)=150°C  
TA=25°C  
TA=25°C  
100µs  
10µs  
1ms  
RDS(ON)  
limited  
0.1s  
DC  
10ms  
1s  
10s  
1
0.1  
0
0.1  
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
1000  
-VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
P
D=Ton/T  
0.1  
TJ,PK=TA+PDM.ZθJA.RθJA  
T
T
RθJA=110°C/W  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
Alpha & Omega Semiconductor, Ltd.  

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