AOD436 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOD436
型号: AOD436
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD436  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOD436 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and low  
gate resistance. This device is ideally suited for use  
as a high side switch in CPU core power conversion.  
Standard Product AOD436 is Pb-free (meets ROHS  
& Sony 259 specifications). AOD436L is a Green  
Product ordering option. AOD436 and AOD436L are  
electrically identical.  
VDS (V) = 30V  
ID = 60A (VGS = 10V)  
R
DS(ON) < 7.5m(VGS = 10V)  
DS(ON) < 13m(VGS = 4.5V)  
R
TO-252  
D-PAK  
D
S
Top View  
Drain Connected  
to Tab  
G
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B,G  
±20  
60  
V
A
TC=25°C G  
TC=100°C B  
ID  
43  
IDM  
IAR  
EAR  
Pulsed Drain Current  
Avalanche Current C  
130  
30  
A
Repetitive avalanche energy L=0.1mH C  
113  
50  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
25  
TA=25°C  
2.5  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.6  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case C  
Symbol  
Typ  
14.2  
39  
Max  
20  
50  
3
Units  
°C/W  
°C/W  
°C/W  
t 10s  
RθJA  
Steady-State  
Steady-State  
RθJC  
2
Alpha & Omega Semiconductor, Ltd.  
AOD436  
Electrical Characteristics (T=25°C unless otherwise noted)  
J
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
30  
V
VDS=24V, VGS=0V  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
100  
3
nA  
V
VGS(th)  
ID(ON)  
1
1.8  
85  
A
VGS=10V, ID=20A  
5.4  
8.1  
9.8  
88  
7.5  
9.7  
13  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
V
GS=4.5V, ID=20A  
DS=5V, ID=20A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
V
S
V
A
IS=1A,VGS=0V  
0.71  
1
Maximum Body-Diode Continuous Current  
85  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1520 1825  
306  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=100kHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
214  
VGS=0V, VDS=0V, f=1MHz  
0.47  
0.7  
SWITCHING PARAMETERS  
Qg(10V)  
Qg(4.5V)  
Qgs  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
31.9  
16.2  
5
39  
20  
nC  
nC  
nC  
nC  
ns  
VGS=4.5V, VDS=15V, ID=20A  
Qgd  
9.6  
tD(on)  
tr  
tD(off)  
tf  
7
VGS=10V, VDS=15V, RL=0.75,  
11.6  
24.2  
7.7  
ns  
RGEN=3Ω  
ns  
ns  
IF=20A, dI/dt=100A/µs  
IF=20A, dI/dt=100A/µs  
trr  
23.8  
15.7  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
30  
ns  
Qrr  
nC  
A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on steady-state R θJA and the maximum allowed junction temperature of 150°C. The value in any given  
application depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB or heatsink allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the  
package limit.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA  
curve provides a single pulse rating.  
G. The maximum current rating is limited by the package current capability.  
Rev 4 : July 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AOD436  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
60  
50  
40  
30  
20  
10  
0
10V  
4.0V  
VDS=5V  
20  
10  
0
3.5V  
125°C  
25°C  
VGS=3V  
0
1
2
3
4
5
1.5  
2
2.5  
3
3.5  
4
4.5  
VDS (Volts)  
V
GS(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
1.8  
1.6  
1.4  
1.2  
1
12  
11  
10  
9
ID=20A  
VGS=10V  
VGS=4.5V  
8
VGS=4.5V  
7
VGS=10V  
6
5
4
0.8  
0
5
10  
15  
20  
25  
30  
0
25  
50  
75  
100  
125  
150  
175  
I
D (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4: On-Resistance vs. Junction  
Temperature  
16  
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
ID=20A  
12  
8
125°C  
25°C  
25°C  
4
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2.00E+00 4.00E+00 6.00E+00 8.00E+00 1.00E+01  
V
SD (Volts)  
V
GS (Volts)  
Figure 6: Body-Diode Characteristics  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOD436  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
2400  
VDS=15V  
ID=20A  
2000  
1600  
1200  
800  
400  
0
8
6
4
2
0
Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
VDS (Volts)  
20  
25  
30  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000  
100  
10  
100  
RDS(ON)  
limited  
TJ(Max)=150°C  
TA=25°C  
10µs  
100µs  
80  
60  
40  
20  
0
1ms  
10ms  
0.1s  
1s  
10s  
TJ(Max)=150°C  
TA=25°C  
1
DC  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
Pulse Width (s)  
V
DS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased  
Safe Operating Area (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=50°C/W  
0.1  
0.01  
PD  
Ton  
T
Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
AOD436  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
60  
40  
20  
TA=25°C  
LID  
tA  
=
BV VDD  
0
0.00001  
0.0001  
Time in avalanche, t A (s)  
Figure 12: Single Pulse Avalanche capability  
0.001  
0.01  
0
25  
50  
75  
TCASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
T
Alpha & Omega Semiconductor, Ltd.  

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