AON6522 [AOS]
25V N-Channel AlphaMOS; 25V N沟道AlphaMOS
| 型号： | AON6522 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | 25V N-Channel AlphaMOS |
| 文件： | 总6页 (文件大小：286K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AON6522
25V N-Channel AlphaMOS
General Description
Product Summary
VDS
• Latest Trench Power AlphaMOS (αMOS LV) technology
• Very Low RDS(on) at 4.5VGS
25V
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
RDS(ON) (at VGS = 4.5V)
200A
• Low Gate Charge
• High Current Capability
• RoHS and Halogen-Free Compliant
< 0.95mΩ
< 1.3mΩ
Application
• DC/DC Converters in Computing, Servers, and POL
100% UIS Tested
100% Rg Tested
• Isolated DC/DC Converters in Telecom and Industrial
D
DFN5X6
Top View
Top View
Bottom View
1
8
7
6
5
2
3
4
G
S
PIN1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Maximum
25
Units
Drain-Source Voltage
Gate-Source Voltage
VDS
V
V
VGS
±20
TC=25°C
200
Continuous Drain
Current G
ID
TC=100°C
151
A
Pulsed Drain Current C
IDM
450
71
TA=25°C
TA=70°C
Continuous Drain
Current
IDSM
A
57
Avalanche Current C
Avalanche energy L=0.1mH C
IAS
50
A
mJ
V
EAS
125
36
VDS Spike
100ns
VSPIKE
TC=25°C
TC=100°C
TA=25°C
TA=70°C
83
PD
W
Power Dissipation B
33
7.3
PDSM
W
°C
Power Dissipation A
4.7
Junction and Storage Temperature Range
TJ, TSTG
-55 to 150
Thermal Characteristics
Parameter
Symbol
Typ
14
40
1
Max
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
t ≤ 10s
17
55
RθJA
Maximum Junction-to-Ambient A D
Maximum Junction-to-Case
Steady-State
Steady-State
RθJC
1.5
Rev 0: Jan 2012
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Page 1 of 6
AON6522
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
ID=250µA, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
25
V
VDS=25V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
µA
5
TJ=55°C
VDS=0V, VGS= ±20V
VDS=VGS, ID=250µA
VGS=10V, ID=20A
IGSS
Gate-Body leakage current
Gate Threshold Voltage
100
2
nA
V
VGS(th)
1
1.4
0.75
1.1
1
0.95
1.4
1.3
mΩ
RDS(ON)
Static Drain-Source On-Resistance
TJ=125°C
VGS=4.5V, ID=20A
VDS=5V, ID=20A
IS=1A,VGS=0V
mΩ
S
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
100
0.7
1
V
Maximum Body-Diode Continuous Current
100
A
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
7036
2778
353
pF
pF
pF
Ω
VGS=0V, VDS=15V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
VGS=0V, VDS=0V, f=1MHz
0.5
1.1
1.7
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
107
49.7
11.7
21.4
12.3
12.8
68.5
28.8
145
68
nC
nC
nC
nC
ns
Qg(4.5V) Total Gate Charge
VGS=10V, VDS=15V, ID=20A
Qgs
Qgd
tD(on)
tr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
VGS=10V, VDS=15V, RL=0.75Ω,
ns
RGEN=3Ω
tD(off)
tf
ns
ns
trr
IF=20A, dI/dt=500A/µs
IF=20A, dI/dt=500A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
31
ns
Qrr
nC
106
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends
on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature TJ(MAX)=150°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 0: Jan 2012
www.aosmd.com
Page 2 of 6
AON6522
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
80
60
40
20
0
100
80
60
40
20
0
4.5V
3V
10V
VDS=5V
2.5V
125°C
25°C
VGS=2V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
2
3
4
5
VGS(Volts)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
Figure 2: Transfer Characteristics (Note E)
2.0
1.5
1.0
0.5
0.0
1.6
1.4
1.2
1
VGS=10V
ID=20A
VGS=4.5V
VGS=4.5V
ID=20A
VGS=10V
0.8
0
5
10
15
ID (A)
20
25
30
0
25
50
75
100
125
150
175
Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
Figure 4: On-Resistance vs. Junction Temperature
2
1.5
1
1.00E+02
1.00E+01
1.00E+00
1.00E-01
1.00E-02
1.00E-03
1.00E-04
1.00E-05
ID=20A
125°C
125°C
25°C
0.5
0
25°C
0
0.2
0.4
0.6
0.8
1
1.2
2
4
6
8
10
VGS (Volts)
VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Figure 6: Body-Diode Characteristics (Note E)
Rev 0: Jan 2012
www.aosmd.com
Page 3 of 6
AON6522
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
10000
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
VDS=15V
ID=20A
Ciss
8
6
4
Coss
2
Crss
0
0
20
40
60
Qg (nC)
80
100
120
0
5
10
15
20
25
30
VDS (Volts)
Figure 7: Gate-Charge Characteristics
Figure 8: Capacitance Characteristics
500
400
300
200
100
0
1000.0
100.0
10.0
1.0
RDS(ON)
limited
10µs
TJ(Max)=150°C
TC=25°C
100µs
1ms
DC
TJ(Max)=150°C
TC=25°C
0.1
0.0
0.01
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
VDS (Volts)
Pulse Width (s)
Figure 9: Maximum Forward Biased
Safe Operating Area (Note F)
Figure 10: Single Pulse Power Rating Junction-to-Case
(Note F)
10
1
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJC=1.5°C/W
PD
0.1
Single Pulse
Ton
T
0.01
0.00001
0.0001
0.001
0.01
Pulse Width (s)
0.1
1
10
100
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev 0: Jan 2012
www.aosmd.com
Page 4 of 6
AON6522
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
80
60
40
20
0
250
200
150
100
50
0
0
25
50
75
100
125
150
0
25
50
TCASE (°C)
Figure 13: Current De-rating (Note F)
75
100
125
150
TCASE (°C)
Figure 12: Power De-rating (Note F)
10000
TA=25°C
1000
100
10
1
0.00001
0.001
0.1
Pulse Width (s)
10
1000
Figure 14: Single Pulse Power Rating Junction-to-
Ambient (Note H)
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=55°C/W
0.1
PD
0.01
Single Pulse
0.1
Ton
T
0.001
0.0001
0.001
0.01
1
10
100
1000
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance (Note H)
Rev 0: Jan 2012
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Page 5 of 6
AON6522
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
td(on)
t
r
td(off)
t
f
ton
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LIA2R
BVDSS
Vds
Id
Vgs
Vds
+
Vgs
Vdd
I AR
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Qrr = - Idt
Vds +
Vds -
Ig
DUT
Vgs
trr
L
Isd
I F
Isd
Vgs
dI/dt
I RM
+
Vdd
VDC
Vdd
-
Vds
Rev 0: Jan 2012
www.aosmd.com
Page 6 of 6
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