AON6702 [AOS]

Transistor;
AON6702
型号: AON6702
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

Transistor

文件: 总7页 (文件大小:275K)
中文:  中文翻译
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AON6702  
30V N-Channel MOSFET  
TM  
SRFET  
General Description  
Product Summary  
SRFETTM AON6702 uses advanced trench technology  
with a monolithically integrated Schottky diode to provide  
excellent RDS(ON),and low gate charge. This device is  
suitable for use as a low side FET in SMPS, load  
switching and general purpose applications.  
VDS  
30V  
ID (at VGS=10V)  
85A  
R
DS(ON) (at VGS=10V)  
< 2m  
< 3mΩ  
RDS(ON) (at VGS = 4.5V)  
100% UIS Tested  
100% Rg Tested  
DFN5X6  
D
Top View  
Top View  
Bottom View  
1
2
3
4
8
7
6
5
SRFETTM  
Soft Recovery MOSFET:  
Integrated Schottky Diode  
G
PIN1  
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
30  
±20  
85  
V
V
VGS  
TC=25°C  
Continuous Drain  
Current G  
ID  
TC=100°C  
67  
A
Pulsed Drain Current C  
IDM  
260  
26  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
IDSM  
A
20  
IAR  
72  
A
EAR  
259  
83  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
33  
TA=25°C  
2.3  
PDSM  
W
°C  
Power Dissipation A  
1.4  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
14  
40  
1
Max  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
18  
55  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
Steady-State  
Steady-State  
RθJC  
1.5  
Rev 2: November 2010  
www.aosmd.com  
Page 1 of 7  
AON6702  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=1mA, VGS=0V  
VDS=30V, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
0.1  
mA  
100  
IDSS  
Zero Gate Voltage Drain Current  
TJ=125°C  
TJ=125°C  
VDS=0V, VGS= ±20V  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
0.1  
2.4  
µA  
V
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
1.2  
1.8  
260  
A
1.7  
2.6  
2
3.2  
3
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=4.5V, ID=20A  
2.4  
mΩ  
S
VDS=5V, ID=20A  
IS=1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
140  
0.45  
0.7  
85  
V
Maximum Body-Diode Continuous Current  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
4720 5900 7080  
pF  
pF  
pF  
V
GS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
770  
336  
0.2  
1100 1430  
560  
0.4  
784  
0.6  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
82  
41  
14  
14  
103  
51  
17  
23  
17  
11  
61  
27  
123  
61  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V) Total Gate Charge  
VGS=10V, VDS=15V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
20  
32  
VGS=10V, VDS=15V, RL=0.75,  
RGEN=3Ω  
ns  
tD(off)  
tf  
ns  
ns  
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
14  
32  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
17  
40  
20  
48  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allow s it.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.Maximum UIS current limited by test equipment .  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,  
assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.  
G. The maximum current rating is limited by package.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 2: November 2010  
www.aosmd.com  
Page 2 of 7  
AON6702  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
200  
180  
160  
140  
120  
100  
80  
200  
180  
160  
140  
120  
100  
80  
10V  
4V  
VDS=5V  
4.5V  
3.5V  
60  
125°C  
60  
VGS=3V  
40  
40  
25°C  
20  
20  
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
VGS(Volts)  
VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
3.0  
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=20A  
VGS=4.5V  
VGS=10V  
2.5  
2.0  
1.5  
1.0  
VGS=4.5V  
ID=20A  
0.8  
0
25  
50  
75  
100  
125  
150  
175  
0
5
10  
15  
20  
25  
30  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
6
5
4
3
2
1
1.0E+02  
ID=20A  
1.0E+01  
125°C  
1.0E+00  
1.0E-01  
1.0E-02  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
2
4
6
8
10  
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 2: November 2010  
www.aosmd.com  
Page 3 of 7  
AON6702  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
9000  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
VDS=15V  
ID=20A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
20  
40  
60  
g (nC)  
80  
100  
120  
0
5
10  
V
15  
DS (Volts)  
20  
25  
Q
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
700  
600  
500  
400  
300  
200  
100  
0
1000.0  
100.0  
10.0  
1.0  
RDS(ON)  
10µs  
TJ(Max)=150°C  
TC=25°C  
limited  
100µs  
1ms  
DC  
TJ(Max)=150°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
V
DS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
J,PK=TC+PDM.ZθJC.RθJC  
θJC=1.5°C/W  
T
R
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 2: November 2010  
www.aosmd.com  
Page 4 of 7  
AON6702  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
230  
200  
170  
140  
110  
80  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
TA=100°C  
TA=125°C  
TA=150°C  
50  
20  
0
25  
50  
75  
100  
125  
150  
0.000001  
0.00001  
0.0001  
0.001  
Time in avalanche, tA (s)  
T
CASE (°C)  
Figure 12: Single Pulse Avalanche capability (Note  
C)  
Figure 13: Power De-rating (Note F)  
10000  
1000  
100  
10  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
1
0.00001  
0.001  
0.1  
10  
1000  
0
25  
50  
75  
100  
125  
150  
T
CASE (°C)  
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
Figure 14: Current De-rating (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
T
J,PK=TA+PDM.ZθJA.RθJA  
θJA=55°C/W  
R
0.1  
0.01  
PD  
Ton  
Single Pulse  
T
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Rev 2: November 2010  
www.aosmd.com  
Page 5 of 7  
AON6702  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
1.0E-06  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
20A  
10A  
VDS=30V  
5A  
VDS=15V  
IS=1A  
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100 125 150 175  
Temperature (°C)  
Temperature (°C)  
Figure 18: Diode Forward voltage vs. Junction  
Temperature  
Figure 17: Diode Reverse Leakage Current vs.  
Junction Temperature  
60  
50  
40  
30  
20  
8
7
6
5
4
20  
16  
12  
8
3
di/dt=800A/µs  
di/dt=800A/µs  
125ºC  
125ºC  
2.5  
2
trr  
Qrr  
25ºC  
25ºC  
1.5  
1
25ºC  
25ºC  
S
Irm  
125ºC  
4
0.5  
0
125ºC  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
I
S (A)  
I
S (A)  
Figure 18: Diode Reverse Recovery Charge and Peak  
Current vs. Conduction Current  
Figure 19: Diode Reverse Recovery Time and  
Softness Factor vs. Conduction Current  
55  
10  
8
25  
20  
15  
10  
5
2.5  
2
trr  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
Is=20A  
Is=20A  
125ºC  
125ºC  
25ºC  
6
1.5  
1
25ºC  
25ºC  
25ºC  
Qrr  
4
S
125º  
125ºC  
2
0.5  
0
Irm  
0
0
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di/dt (A/µs)  
di/dt (A/µs)  
Figure 20: Diode Reverse Recovery Charge and  
Peak Current vs. di/dt  
Figure 21: Diode Reverse Recovery Time and  
Softness Factor vs. di/dt  
Rev 2: November 2010  
www.aosmd.com  
Page 6 of 7  
AON6702  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Rev 2: November 2010  
www.aosmd.com  
Page 7 of 7  

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