AOT1N60 [AOS]

1.3A, 600V N-Channel MOSFET; 1.3A , 600V N沟道MOSFET
AOT1N60
型号: AOT1N60
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

1.3A, 600V N-Channel MOSFET
1.3A , 600V N沟道MOSFET

文件: 总5页 (文件大小:136K)
中文:  中文翻译
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AOT1N60  
1.3A, 600V N-Channel MOSFET  
formerly engineering part number AOT9600  
General Description  
Features  
The AOT1N60 has been fabricated using an  
advanced high voltage MOSFET process that is  
designed to deliver high levels of performance and  
robustness in popular AC-DC applications.  
By providing low RDS(on), Ciss and Crss along with  
guaranteed avalanche capability these parts can be  
adopted quickly into new and existing offline power  
supply designs.  
VDS (V) = 700V @ 150°C  
ID = 1.3A  
RDS(ON) < 9(VGS = 10V)  
100% UIS Tested!  
100% R g Tested!  
C iss , C oss , C rss Tested!  
Top View  
D
TO-220  
G
G
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain  
Current B  
Pulsed Drain Current C  
Avalanche Current C  
600  
±30  
1.3  
0.8  
4
V
V
VGS  
TC=25°C  
TC=100°C  
ID  
A
IDM  
IAR  
1.0  
15  
A
Repetitive avalanche energy C  
EAR  
EAS  
dv/dt  
mJ  
Single pulsed avalanche energy G  
Peak diode recovery dv/dt  
TC=25°C  
30  
5
41.7  
mJ  
V/ns  
W
PD  
Power Dissipation B  
Derate above 25oC  
0.33  
W/ C  
o
TJ, TSTG  
Junction and Storage Temperature Range  
-50 to 150  
°C  
°C  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds  
Thermal Characteristics  
TL  
300  
Parameter  
Symbol  
RθJA  
Typical  
Maximum  
Units  
Maximum Junction-to-Ambient A  
Maximum Case-to-Sink A  
°C/W  
55  
65  
0.5  
3
RθCS  
-
°C/W  
°C/W  
Maximum Junction-to-Case D,F  
RθJC  
2
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOT1N60  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V, TJ=25°C  
ID=250µA, VGS=0V, TJ=150°C  
600  
V
V
BVDSS  
Drain-Source Breakdown Voltage  
700  
0.6  
BVDSS  
Breakdown Voltage Temperature  
Coefficient  
V/ oC  
ID=250µA, VGS=0V  
/TJ  
VDS=600V, VGS=0V  
1
10  
100  
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
VDS=480V, TJ=125°C  
IGSS  
VGS(th)  
RDS(ON)  
gFS  
Gate-Body leakage current  
Gate Threshold Voltage  
VDS=0V, VGS=±30V  
nA  
V
VDS=VGS, ID=250µA  
3
4.1  
7.5  
Static Drain-Source On-Resistance  
Forward Transconductance  
Diode Forward Voltage  
VGS=10V, ID=0.65A  
VDS=40V, ID=0.65A  
IS=1A, VGS=0V  
9
S
0.9  
VSD  
0.65  
1
1
4
V
Maximum Body-Diode Continuous Current  
Maximum Body-Diode Pulsed Current  
IS  
A
ISM  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
100  
11  
130  
14.5  
1.8  
160  
17.5  
2.2  
pF  
pF  
pF  
VGS=0V, VDS=25V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
1.4  
2.8  
VGS=0V, VDS=0V, f=1MHz  
VGS=10V, VDS=480V, ID=1A  
VGS=10V, VDS=300V, ID=1A,  
3.5  
5.3  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
6.1  
1.3  
3.1  
10  
8
2
nC  
nC  
nC  
ns  
ns  
ns  
ns  
4
12  
8
6.7  
20  
RG=25Ω  
tD(off)  
tf  
25  
15  
137  
0.76  
11.5  
114  
0.63  
trr  
IF=1.3A,dI/dt=100A/µs,VDS=100V  
IF=1.3A,dI/dt=100A/µs,VDS=100V  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
µC  
A: The value of R θJA is measured with the device in a still air environment with T A =25°C.  
=150°C in a TO220 package, using junction-to-casethermal resistance, andismoreuseful in setting  
B. The power dissipation PD is based on TJ(MAX)  
the upper dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=150°C.  
G. L=60mH, IAS=1A, VDD=150V, RG=10, Starting TJ=25°C  
Rev0: July 2008  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOT1N60  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
2.0  
10  
10V  
6.5V  
VDS=40V  
-55°C  
25°C  
8
1.5  
6V  
1.0  
0.5  
0.0  
1
125°C  
VGS=5.5V  
0.1  
0
5
10  
15  
20  
25  
30  
2
4
6
10  
V
DS (Volts)  
V
GS(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
14  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
13  
12  
11  
10  
9
VGS=10V  
ID=0.5A  
VGS=10V  
8
7
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
-100  
-50  
0
50  
100  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
150  
200  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
1.2  
1.0E+01  
1.0E+00  
1.1  
1
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
0.9  
25°C  
0.8  
0.0  
0.2  
0.4  
0.6  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.8  
1.0  
1.2  
-100  
-50  
0
50  
Temperature (oC)  
Figure 5: Break Down vs. Junction Temperature  
100  
150  
200  
V
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOT1N60  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
1000  
100  
10  
VDS=480  
ID=1A  
Ciss  
6
Coss  
3
Crss  
1
0
0
1
10  
100  
0
2
4
6
8
Qg (nC)  
VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
10.0  
1.0  
0.1  
0.0  
1.4  
10µs  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
RDS(ON)  
limited  
100µs  
10ms  
0.1s  
DC  
1ms  
TJ(Max)=150°C  
TC=25°C  
1
10  
100  
1000  
0
25  
50  
75  
100  
125  
150  
V
DS (Volts)  
T
CASE (°C)  
Figure 9: Maximum Forward Biased Safe Operating  
Area for AOT1N60 (Note F)  
Figure 10: Current De-rating (Note B)  
10  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
J,PK=TA+PDM.ZθJC.RθJC  
RθJC=3°C/W  
T
1
0.1  
PD  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance for AOT1N60 (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOT1N60  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Vds  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
t d(on)  
t
r
t d(off)  
t
f
t on  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
2
EAR= 1/2 LI  
AR  
BVDSS  
Vds  
Id  
Vds  
+
Vgs  
Vdd  
IAR  
Vgs  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode RecoveryTest Circuit & Waveforms  
Qrr = - Idt  
Vds +  
DUT  
Vgs  
Isd  
Vds -  
Ig  
trr  
L
IF  
Isd  
dI/dt  
+
IRM  
Vdd  
Vgs  
VDC  
Vdd  
-
Vds  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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