AOTF260L [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AOTF260L |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总3页 (文件大小：39K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AOTF260L, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOTF260L. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOTF260L passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
Product Description
II.
III.
IV.
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOTF260L uses Trench MOSFET technology that is uniquely optimized to provide the most
efficient high frequency switching performance. Both conduction and switching power losses are
minimized due to an extremely low combination of RDS(ON), Ciss and Coss. This device is ideal for
boost converters and synchronous rectifiers for consumer, telecom, industrial power supplies and
LED backlighting.
Details refer to the datasheet.
II. Die / Package Information:
AOTF260L
Process
Standard sub-micron
6V N channel process
TO220F
Bare Cu
Soft solder
Package Type
Lead Frame
Die Attach
Bond wire
Al wire
Mold Material
Moisture Level
Epoxy resin with silica filler
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
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III. Result of Reliability Stress for AOTF260L
Test Item
Test Condition Time
Point
Lot
Attribution
Total
Sample size of
Failures
Number
Reference
Standard
11 lots
1815pcs
0
JESD22-
A113
MSL
Precondition
-
168hr 85°c
/85%RH +3 cycle
reflow@250°c
168hrs
500 hrs
1000 hrs
1 lot
308pcs
0
JESD22-
A108
HTGB
Temp = 150°c ,
Vgs=100% of
Vgsmax
3 lots
(Note A*)
1 lot
77 pcs / lot
308pcs
168hrs
500 hrs
1000 hrs
0
0
JESD22-
A108
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
3 lots
(Note A*)
5 lots
77 pcs / lot
275pcs
100 hrs
96 hrs
JESD22-
A110
HAST
130°c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
(Note A*)
11 lots
55 pcs / lot
847pcs
0
0
JESD22-
A102
Pressure Pot
121°c , 29.7psi,
RH=100%
(Note A*)
9 lots
77 pcs / lot
693pcs
250 / 500
cycles
JESD22-
A104
Temperature
Cycle
-65°c to 150°c ,
air to air,
(Note A*)
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 7
MTTF = 15704 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOTF260L). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109
/
/
[2 (N) (H) (Af)]
= 1.83 x 109
[2x (2x77x168+3x2x77x500) x258] = 7
MTTF = 109 / FIT = 1.38 x 108hrs = 15704 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
32
100 deg C
13
115 deg C
5.64
130 deg C
2.59
150 deg C
1
Af
258
87
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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