AOZ1310 [AOS]
Single Channel USB Switch; 单路USB开关
| 型号： | AOZ1310 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Single Channel USB Switch |
| 文件： | 总11页 (文件大小：519K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOZ1310
Single Channel USB Switch
General Description
Features
The AOZ1310 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switch family intended for applications where heavy
capacitive loads and short-circuits are likely to be
encountered. This device incorporates a 70 mΩ
N-channel MOSFET power switch for power-distribution
systems. The switch is controlled by a logic enable input.
Gate drive is provided by an internal charge pump
designed to control the power-switch rise time and fall
time to minimize current surges during switching. The
charge pump requires no external components and
allows operation from supplies as low as 2.7 V.
z Typical 80 mΩ (NFET)
z 0.5A maximum continuous current
z Vin range of 2.7 V to 5.5 V
z Open Drain Fault Flag
z Fault Flag deglitched (blanking time)
z Thermal shutdown
z Reverse current blocking
z Package: SOT23-5
Applications
z Notebook Computers
z Desktop Computers
The AOZ1310 is available in an SOT23-5 package and is
rated over the -40 °C to +85 °C ambient temperature
range.
Typical Application
VIN
OUT
IN
LOAD
C2
0.1μF
C1
22μF
R1
10kΩ
AOZ1310
Cin
OC
EN
GND
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Page 1 of 11
AOZ1310
Ordering Information
Maximum
Continuous Current
Typical Short-circuit
Current Limit
Enable
Setting
Output
Discharge Environmental
Part Number Channel 1 Channel 2 Channel 1 Channel 2
Package
AOZ1341AI
AOZ1341EI
SO-8
Active Low
Active High
EPAD MSOP-8
SO-8
1 A
1A
1.5 A
2 A
1.5 A
2 A
AOZ1341AI-1
AOZ1341EI-1
AOZ1342PI
EPAD MSOP-8
Active Low EPAD SO-8
Active High EPAD SO-8
1.5 A
1.5 A
1.5A
0.5A
AOZ1342PI-1
AOZ1343AI*
AOZ1343EI*
AOZ1343AI-1*
AOZ1343EI-1*
AOZ1312AI-1
AOZ1312EI-1
AOZ1310CI-1
Green Product
No
SO-8
Active Low
RoHS Compliant
EPAD MSOP-8
2 A
0.75 A
SO-8
Active High
EPAD MSOP-8
SO-8
Active High
1.5 A
0.5 A
None
None
2 A
None
None
EPAD MSOP-8
0.75 A
Active High SOT23-5
*Contact factory for availability
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information.
Pin Configuration
AOZ1310CI-1
1
2
3
5
OUT
GND
OC
IN
4
EN
SOT23-5
(Top View)
Pin Description
Pin Name
Pin Number
Pin Function
OUT
GND
OC
1
2
3
4
5
Power-switch output, IN-OUT
Ground
Overcurrent, open-drain output, active low, IN-OUT
Enable input, logic high turns on power switch, IN-OUT
Input voltage
EN
IN
Rev. 1.3 July 2011
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Page 2 of 11
AOZ1310
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings may damage the
Recommended Operating Conditions
The device is not guaranteed to operate beyond the
device.
Recommended Operating Conditions.
Parameter
Input Voltage (VIN)
Enable Voltage (VEN
Rating
Parameter
Input Voltage (VIN)
Rating
6 V
6 V
+2.7 V to +5.5 V
-40 °C to +125 °C
)
Junction Temperature (TJ)
Package Thermal Resistance (ΘJA
SOT23-5
Storage Temperature (TS)
ESD Rating(1)
Note:
-55 °C to +150 °C
2 kV
)
191 °C/W
1. Devices are inherently ESD sensitive, handling precautions are
required. Human body model is a 100 pF capacitor discharging
through a 1.5 kΩ resistor.
Electrical Characteristics
T = 25 °C, V = V =5.5 V, unless otherwise specified.
A
IN
EN
(3)
Symbol
Parameter
Conditions
Min.
Typ. Max. Units
POWER SWITCH
RDS(ON) Switch On-Resistance
VIN = 5.5 V, IOUT = 0.5 A
80
0.6
0.4
145
1.5
1
mΩ
tr
Rise Time, Output
VIN = 5.5 V , CL = 1 μF, RL = 10 Ω
VIN = 2.7 V, CL = 1μF, RL = 10 Ω
VIN = 5.5 V
ms
tf
Fall Time, Output
0.05
0.05
0.5
0.5
ms
VIN = 2.7 V
FET Leakage Current
Out connect to ground,
VI(ENx) = 5.5 V,
-40 °C ≤ TJ ≤ 125 °C(2)
1
μA
or VI(ENx) = 0 V
ENABLE INPUT EN
VIH
VIL
II
High-level Input Voltage
2.7V ≤ VIN ≤ 5.5V
2.7V ≤ VIN ≤ 5.5V
2.0
V
V
Low-level Input Voltage
Input Current
0.8
-0.5
3
-0.5
μA
ms
ton
toff
Turn-on Time
CL = 100 μF, RL = 10 Ω
CL = 100 μF, RL = 10 Ω
Turn-off Time
10
CURRENT LIMIT
IOS
Short-circuit Output Current
0.5
0.6
0.8
1.0
1.1
A
A
IOC_TRIP Overcurrent Trip Threshold
SUPPLY CURRENT
0.85
Supply Current, Low-level
Output
No load on OUT,
VI(ENx) = 5.5 V,
or VI(ENx) = 0 V
TJ = 25°C
-40 °C ≤ TJ ≤ 125 °C(2)
0.5
0.5
1
5
μA
μA
μA
Supply Current, High-level
Output
No load on OUT,
VI(ENx) = 0 V,
or VI(ENx) = 5.5 V
TJ = 25°C
-40 °C ≤ TJ ≤ 125 °C(2)
50
50
70
90
Reverse Leakage Current
UNDERVOLTAGE LOCKOUT
Low-level Voltage, IN
VI(OUTx) = 5.5V, IN = ground TJ = 25 °C
0.2
2
2.5
V
Hysteresis, IN
TJ = 25°C
200
mV
Rev. 1.3 July 2011
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Page 3 of 11
AOZ1310
Electrical Characteristics (Continued)
T = 25 °C, V = V =5.5 V, unless otherwise specified.
A
IN
EN
(3)
Symbol
Parameter
Conditions
Min.
Typ. Max. Units
OVERCURRENT OC
Output low Voltage VOL(OCx) IO(OCx) = 5mA
Off-state Current O(OCx) = 5V or 3.3V
OCx assertion or deassertion
0.4
1
V
V
μA
ms
OC_L Deglitch
4
8
15
THERMAL SHUTDOWN
Thermal Shutdown
Threshold
135
105
°C
°C
°C
Recovery from Thermal
Shutdown
Hysteresis
30
Note:
2. Parameters are guaranteed by design only and not production tested.
3. Pulse testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
Functional Block Diagram
IN
OUT
Gate Driver
UVLO
Comparator
Current
Limit
2.5V
Thermal
Shutdown
EN
OC
Deglitch
AOZ1310
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AOZ1310
Functional Characteristics
Figure 2. Turn-Off Delay and Fall Time
with 1μF Load (Active High)
Figure 1. Turn-On Delay and Rise Time
with 1μF Load (Active High)
R
= 10ꢀ
= 1μF
= 25°C
L
L
R
C
T
= 10ꢀ
= 1μF
= 25°C
L
L
A
C
T
A
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
200μs/div
Figure 4. Turn-Off Delay and Fall Time
Figure 3. Turn-On Delay and Rise Time
with 100μF Load (Active High)
with 100μF Load (Active High)
R
C
A
= 10ꢀ
= 100μF
= 25°C
L
L
R
C
A
= 10ꢀ
= 100μF
= 25°C
L
L
T
T
EN
5V/div
EN
5V/div
VOUT
2V/div
VOUT
2V/div
200μs/div
500μs/div
Rev. 1.3 July 2011
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Page 5 of 11
AOZ1310
Typical Characteristics
Figure 5. Supply Current, Output Enabled
vs. Junction Temperature
Figure 6. Supply Current, Output Disabled
vs. Junction Temperature
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
70
60
50
40
30
20
10
0
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
Vin=5.5V
Vin=5V
Vin=3.3V
Vin=2.7V
-50
0
50
100
150
-50
0
50
100
C)
150
Junction Temperature (°C)
Junction Temperature (
°
Figure 7. UVLO Threshold vs. Junction Temperature
2.22
2.21
2.20
2.19
2.18
2.17
2.16
2.15
2.14
2.13
2.12
2.11
Rising
Falling
-50
0
50
100
150
Junction Temperature (°C)
Rev. 1.3 July 2011
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Page 6 of 11
AOZ1310
Detailed Description
The AOZ1310 is a member of Alpha and Omega
Semiconductor’s single-channel power-distribution
switches family. The AOZ1310 is intended for
applications where heavy capacitive loads and
short-circuits are likely to be encountered. Gate drive is
provided by an internal charge pump designed to control
the power-switch rise times and fall times to minimize
current surges during switching. The charge pump
requires no external components and allows operation
from supplies as low as 2.7 V.
Enable
The logic enable disables the power switch, charge
pump, gate driver, logic device, and other circuitry to
reduce the supply current. When the enable receives a
logic high the supply current is reduced to approximately
1 μA. The enable input is compatible with both TTL and
CMOS logic levels.
Over-current
The over-current open drain output is asserted
(active low) when an over-current condition occurs.
The output will remain asserted until the over-current
condition is removed. A 15 ms deglitch circuit prevents
the over-current from false triggering.
Power Switch
The power switch is a N-channel MOSFET with a low
on-state resistance capable of delivering 1 A of
continuous current. Configured as a high-side switch,
the MOSFET will go into high impedance when disabled.
Thus, preventing current flow from OUT to IN and IN to
OUT.
Thermal Shut-down Protection
When the output load exceeds the current-limit threshold
or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode,
pulling the overcurrent (OC) logic output low.
Charge Pump
An internal charge pump supplies power to the circuits
and provides the necessary voltage to drive the gate of
the MOSFET beyond the source. The charge pump is
capable of operating down to a low voltage of 2.7 Volts.
During current limit or short circuit conditions, the
increasing power dissipation in the chip causing the die
temperature to rise. When the die temperature reaches a
certain level, the thermal shutdown circuitry will shutdown
the device. The thermal shutdown will cycle repeatedly
until the short circuit condition is resolved.
Driver
The driver controls the voltage on the gate to the power
MOSFET switch. This is used to limit the large current
surges when the switch is being turned On and Off.
Proprietary circuitry controls the rise and fall time of the
output voltages.
Rev. 1.3 July 2011
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Page 7 of 11
AOZ1310
Applications Information
Input Capacitor Selection
Power Dissipation Calculation
The input capacitor prevents large voltage transients
from appearing at the input, and provides the
Calculate the power dissipation for normal load condition
using the following equation:
instantaneous current needed each time the switch turns
on and to limit input voltage drop. The input capacitor
also prevents high-frequency noise on the power line
from passing through the output of the power side. The
choice of the input capacitor is based on its ripple current
and voltage ratings rather than its capacitor value. The
2
P = R x (I )
OUT
D
ON
The worst case power dissipation occurs when the load
current hits the current limit due to over-current or short
circuit faults. The power dissipation under these
conditions can be calculated using the following
equation:
input capacitor should be located as close to the V pin
IN
as possible. A 1 μF and above ceramic cap is
recommended. However, higher capacitor values further
reduce the voltage drop at the input.
P = (V – V
) x I
LIMIT
D
IN
OUT
Layout Guidelines
Output Capacitor Selection
Good PCB layout is important for improving the thermal
and overall performance of the AOZ1310. To optimize the
switch response time to output short-circuit conditions
keep all traces as short as possible to reduce the effect of
unwanted parasitic inductance. Place the input and
output bypass capacitors as close as possible to the IN
and OUT pins. The input and output PCB traces should
be as wide as possible for the given PCB space. Use a
ground plane to enhance the power dissipation capability
of the device.
The output capacitor acts in a similar way. A small 0.1 μF
capacitor prevents high-frequency noise from going into
the system. Also, the output capacitor has to supply
enough current for a large load that it may encounter
during system transients. This bulk capacitor must be
large enough to supply fast transient load in order to
prevent the output from dropping.
Rev. 1.3 July 2011
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Page 8 of 11
AOZ1310
Package Dimensions, SOT23-5
Gauge Plane
C
Seating Plane
L2
D
e1
5
L
E
E1
1
θ
e
b
A2
A
aaa
A1
RECOMMENDED LAND PATTERN
Dimensions in millimeters
Dimensions in inches
Symbols Min.
Nom. Max.
Symbols Min.
Nom. Max.
1.90
A
A1
A2
b
C
D
E
E1
e
e1
L
L2
aaa
θ
—
—
—
0.88
0.40
0.13
2.90
2.80
1.60
0.95 BSC
1.90 BSC
0.40
0.25 BSC
0.10
1.00
0.10
0.95
0.50
0.20
3.00
3.00
1.70
A
A1
A2
b
C
D
E
E1
e
e1
L
L2
aaa
θ
—
0.00
—
—
0.039
0.004
0.00
0.70
0.35
0.10
2.80
2.60
1.50
0.028 0.035 0.037
0.014 0.016 0.020
0.004 0.005 0.008
0.110 0.114 0.118
0.102 0.110 0.118
0.059 0.063 0.067
0.037 BSC
2.40
0.80
0.95
UNIT: mm
0.63
0.075 BSC
0.30
0°
0.60
8°
0.012 0.016 0.024
0.010 BSC
0.004
—
—
0°
8°
Notes:
1. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
2. Dimension "L" is measured in gauge plane.
3. Tolerance 0.10mm (4 mil) unless otherwise specified
4. Refer to JEDEC MO-193C AB.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Rev. 1.3 July 2011
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Page 9 of 11
AOZ1310
Tape and Reel Dimensions, SOT23-5
Tape
P2
P1
D1
D0
E1
K0
E2
E
B0
A0
P0
Feeding Direction
Unit: mm
Package
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
SOT23-5/6L
LP
3.15
0.10
3.20
0.10
1.40
0.10
1.50
1.00
8.00
0.30
1.75
0.10
3.50
0.05
4.00
0.10
4.00
0.10
2.00
0.05
0.23
0.03
0.05 +0.10 / -0
Reel
W1
S
K
R
M
N
J
H
Unit: mm
Tape Size
8mm
Reel Size
M
N
W1
H
S
K
R
J
ø177.8
ø177.8
Max.
55.0
Min.
8.4
13.0
1.5
10.1
Min.
12.7
4.0
0.1
+1.50 / -0.0 +0.5 / -0.2
Min
Leader/Trailer and Orientation
Leader Tape
500mm min.
Trailer Tape
300mm min.
Components Tape
Orientation in Pocket
Rev. 1.3 July 2011
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Page 10 of 11
AOZ1310
Part Marking
AOZ1310CI-1
(SOT23-5)
Assembly Lot Code
Year Code and Week Code
Part Number Code
Option Code and Assembly Location
This datasheet contains preliminary data; supplementary data may be published at a later date.
Alpha & Omega Semiconductor reserves the right to make changes at any time without notice.
LIFE SUPPORT POLICY
ALPHA & OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
Rev. 1.3 July 2011
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Page 11 of 11
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