3090-221F [API]
General Purpose Inductor, 0.22uH, 1%, 1 Element, Iron-Core, SMD, 1010, CHIP;
| 型号： | 3090-221F |
| 厂家： | 
API Delevan |
| 描述： | General Purpose Inductor, 0.22uH, 1%, 1 Element, Iron-Core, SMD, 1010, CHIP 电感器 固定电感器 射频感应器 |
| 文件： | 总1页 (文件大小：1145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3090R
3090
SERIES
Micro i® Low Profile Chip Inductors
SERIES 3090 IRON CORE
0.010
0.015
0.022
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
3.90
4.70
5.60
6.80
8.20
20%
20%
20%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
42
42
40
40
40
38
35
30
25
32
32
32
32
34
34
34
34
34
34
30
28
24
24
24
24
25
25
25
25
24
22
22
22
20
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
7.9
1000
1000
1000
900
900
900
800
700
650
510
410
370
330
300
250
220
200
180
160
140
120
100
95
0.095
0.115
0.140
0.185
0.100
0.110
0.135
0.16
0.19
0.08
0.10
0.12
0.14
0.16
0.20
0.25
0.30
0.36
0.45
0.50
0.60
0.70
1.10
1.20
1.25
1.30
1.50
1.90
2.30
3.00
3.50
4.00
4.50
5.00
890
810
765
640
870
830
750
690
630
970
870
795
765
690
615
550
500
460
410
390
355
330
265
250
245
240
225
200
180
160
145
135
130
120
-100M
-150M
-220M
-330K
-390K
-470K
-560K
-680K
-820K
-101K
-121K
-151K
-181K
-221K
-271K
-331K
-391K
-471K
-561K
-681K
-821K
-102K
-122K
-152K
-182K
-222K
-272K
-332K
-392K
-472K
-562K
-682K
-822K
-103K
Actual Size
Physical Parameters
Inches
Millimeters
1.27 Max.
2.54 0.254
2.54 0.254
1.27 Min.
A
B
C
D
E
F
0.050 Max.
0.100 0.010
0.100 0.010
0.050 Min.
0.015 Min. (Typ.)
0.020 Max. (Typ.) 0.51 Max. (
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
90
85
80
70
65
60
55
53
0.38 Min. (T
yp.)
Typ.)
Current Rating at 90°C Ambient 35°C
Rise
Operating Temperature Range
–55°C
to +125°C
0.105 W
proved
Maximum Power Dissipation at 90°C
7.9
7.9
7.9
50
45
40
Core Material Powdered iron core for im
temperature stability.
10.0
Mechanical Configuration Units are ep
oxy
encapsulated. Contact area for reflow sold
ering are gold
plated per MIL-G-45204 Type 1 Grade A.
connections are thermal compression bon
Internal
ded.
Optional Tolerances: J = 5% H = 3% G = 2% F = 1%
*Complete part # must include series # PLUS the dash #
For surface finish information, refer to www.delevanfinishes.com
Termination Finish Options
Standard: Gold over Nickel.
For Tin/Lead over Nickel: Add suffix “S” to
allow an additional .010 inch for maximum
RoHS, order 3090R - XXXKS.
part number and
height. For
Notes 1) Designed specifically for reflow
other high temperature processes with m
exhibit solder fillet. 2) Self Resonant Freq
soldering and
etalized edges to
uency (SRF)
values 250 MHz and above are calculated
reference only.
and for
Packaging Tape & reel (8mm): 7" reel, 2
000 pieces max.;
13" reel, 8000 pieces max.
MIL-PRF-83446 (Reference) for testing m
ethods only.
Made in the U.S.A.
.
270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814 • E-mail: apisales@delevan com • www.delevan.com
1/2009
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