APE2016 [APLUS]

very low cost voice and melody synthesizer with 4-bits CPU; 成本非常低的声音和旋律合成了4位CPU


型号：	APE2016
厂家：	APLUS INTERGRATED CIRCUITS
描述：	very low cost voice and melody synthesizer with 4-bits CPU 成本非常低的声音和旋律合成了4位CPU
文件：	总8页 (文件大小：253K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PLUS MAKE YOUR PRODUCTION A-PLUS

APExx16 Series

DATA SHEET

A^PLUSINTEGRATED CIRCUITS INC.

Address:

3 F-10, No. 32, Sec. 1, Chenggung Rd., Taipei,

Sales E-mail:

Taiwan 115, R.O.C.

sales@aplusinc.com.tw

(115)台北市南港區成功路㆒段 32 號 3 樓之 10.

Technology E-mail:

service@aplusinc.com.tw

TEL: 886-2-2782-9266

FAX: 886-2-2782-9255

WEBSITE : http: //www.aplusinc.com.tw

APExx16 Series

1.0 General Description

The APExx16 series are very low cost voice and melody synthesizer with 4-bits CPU. They have various

features including 4-bits ALU, ROM, RAM, I/O ports, timers, clock generator, voice and melody

synthesizer, and PWM (Direct drive) or D/A current outputs, etc. The audio synthesizer contains one

voice-channel and two melody-channels. Furthermore, they consist of 27 instructions in these devices.

With CMOS technology and halt function can minimize power dissipation. Their architectures are similar

to RISC, with two stages of instruction pipeline. They allow all instructions to be executed in a single

cycle, except for program branches and data table read instructions (which need two instruction cycles).

2.0 Features

(1) Single power supply can operate from 2.4V to 5.5V at 4MHz or 8MHz.

(2) Program ROM: 16k x 10 bits ( APE8416 /APE10616 /APE12716 are 64k x 10 bits )

(3) 1 set of 16-bits DPR can access up to 64k x 10 bits melody data memory space, and 1 set of 19-bits

VPR can access up to 512k x 10 bits voice data memory space.

Product

APE1016

APE1516

APE2016

APE3116

APE4116

APE6316

APE8416

APE10616

APE12716

Voice Duration (sec) Voice Pointer (VPR) ROM Size (10-bits)

15-bits

16-bits

17-bits

18-bits

19-bits

32k

48k

64k

96k

128k

192k

256k

106

127

320k

384k

(4) Data Registers:

a). 128 x 4-bits data RAM (00-7Fh)

b). Unbanked special function registers (SFR) range: 00h-2Fh

(5) I/O Ports:

a). PRA: 4-bits I/O Port A (10h) can be programmed to input/output individually. (Register control)

b). PRB: 4-bits I/O Port B (13h) can be configured to input/output individually. (Mask option)

c). PRC: 4-bits I/O Port C (14h) can be programmed to input/output individually. (Register control)

d). PRD: 4-bits I/O Port D (15h) can be programmed to input/output individually. (Register control)

(6) On-chip clock generator: Resistive Clock Drive (RM) or Crystal oscillator (HM)

(7) Timer: 1-set Voice Interrupt (Timer0: a 9-bits auto-reload timer/counter).

(8) Stack: 2-level subroutine nesting.

(9) Built-in 4 Level Volume Control can be programmed.

Rev 1.1

2003/9/2

APExx16 Series

(10) Built-in 8 Level DAC current output can be configured. (Mask option)

(11) Built-in IR Carry Output: Port B[1] can be configured as IR pin by 38k / 56kHz. (Mask option)

(12) External Reset: Port B[3] can be configured as reset pin. (Mask opton)

(13) HALT and Release from HALT function to reduce power consumption

(14) Watch Dog Timer (WDT)

(15) Instruction: 1-cycle instruction except for table read and program branches which are 2-cycles

(16) Number of instruction: 27

(17) DAC: 1 channel voice and dual tone melody synthesizer (One 9-bits Cout or 8-bits PWM output).

FIGURE 1 : ROM Map of APExx16 Series

PC[13:0]

14-bit x 2 STACK

16-bit Data Pointer

19-bit Voice Pointer

Reset Vector

00000h

000FEh

000FFh-00400h

00401h

Reserved for Testing

00000h-03FFFh

Program ROM

00000h-0FFFFh

Data ROM for Melody

00000h-7FFFFh

* APE8416 /APE10616 /APE12716 are 64k x 10 bits

Voice ROM for Voice

Rev 1.1

2003/9/2

APExx16 Series

3.0 Pin Description

Pad Name

PWM2/Cout

PWM1

Pin Attr.

Description

PWM2 output, or Current Output of Audio.

PWM1 output.

Vdd1~3

Power

Power supply during operation.

PRA0~3

PRC0~3

PRD0~3

I/O port can be programmed to input/output individually.

Input type with weak pull-low or fix-input-floating capability.

Buffer Output type.

I/O

I/O port can be configured to input/output individually or HM OSC pad.

Input type with weak pull-low or fix-input-floating capability.

Buffer Output type.

PRB0 / OSC2

I/O port can be configured to input/output individually.

Input type with weak pull-low or fix-input-floating capability.

Buffer Output type.

PRB1 / IR

I/O

Mask option selected as an IR Carrier Output with 38k / 56kHz

I/O port can be configured to input/output individually.

Input type with weak pull-low or fix-input-floating capability.

Buffer Output type.

PRB2

I/O port can be configured to input/output individually.

Input type with weak pull-low or fix-input-floating capability.

Buffer Output type.

PRB3 / Reset

I/O

Mask option selected as an external RESET pin with weak pull-low

capability.

OSC1

RM/HM mode Oscillator input

Ground Potential

GND1~4

Power

4.0 DC Characteristics

Symbol

Parameter

Vdd

Min.

Typ.

Max. Unit

Condition

Vdd

Operating voltage

2.4

5.5

depending on Freq.

4.5

4MHz, RM,

in HALT Mode

Isb

Iop

Iih

Standby

Supply

current

-3

4MHz, RM,

IO Floating

Operating

Input current

(Internal pull low)

Input ports with weak

pull-low

Ioh

Iol

Output-high current

Output-low current

-10

0.8 ~ 4.8

0.9 ~ 6.5

4MHz, RM

(IO ports)

4.5

DAC output current

(8-level option)

4MHz, RM

(Full scale)

Cout

Fosc(3v- 2.4v)

Fosc (3v)

dF/F

Frequency stability

Fosc lot variation

-5

Vdd=3V, Rosc=180k,

4MHz

-10

Rev 1.1

2003/9/2

APExx16 Series

FIGURE 2 : Frequency vs. Rosc (at 3V)

Resistor (Rosc ohms)

Frequency (MHz)

110k

200k

300k

430k

14.84

8.25

5.54

3.92

Rosc vs Freq.

14.84

8.25

5.54

3.92

100

200

300

400

500

Rosc (k ohm )

5.0 Application Circuit

Rev 1.1

2003/9/2

APExx16 Series

6.0 Bonding Diagram of APE1016 /APE1516 /APE2016

GND1

PRD0

PRD1

PRD2

PRD3

PRC0

ROM

PRC1

PRC2

Chip Size : 1432 um x 1650 um

Pad Size : 80 um x 80 um

Vdd3

PRC3

PRB0

* The IC substrate must be connected to GND.

PWM2/Cout

Vdd2

OSC1 15

GND2

Vdd1

PRB3 PRB2

PRB1

PRA0

PRA2

PRA1

PRA3

GND3

PWM1

(0,0)

Pad #

Pad Name

Vdd3

Pad #

Pad Name

GND2

647

466

182

1261

235

PWM2/Cout

Vdd2

OSC1

350

PRB0/OSC2

PRC3

465

PWM1

GND3

145

293

580

PRC2

695

PRA3

413

PRC1

810

PRA2

533

PRC0

925

PRA1

653

PRD3

1040

1155

1270

1385

1500

PRA0

773

PRD2

PRB3/Reset

PRB2

893

PRD1

1013

1133

1253

PRD0

PRB1/IR

Vdd1

GND1

Rev 1.1

2003/9/2

APExx16 Series

6.1 Bonding Diagram of APE3116 /APE4116 /APE6316

GND1

PRD0

PRD1 23

ROM

PRD2

PRD3

PRC0

PRC1

PRC2

PRC3

PRB0

Chip Size : 1408 um x 2556 um

Pad Size : 80 um x 80 um

* The IC substrate must be connected to GND.

Vdd3

OSC1

PRB1

GND2

PWM2/Cout

Vdd2

PRB3 PRB2

Vdd1

PRA0

PRA2 PRA1

PRA3

GND3

PWM1

(0,0)

Pad #

Pad Name

Pad #

Pad Name

PRB1/IR

OSC1

Vdd3

647

466

182

1248

405

PWM2/Cout

Vdd2

570

PRB0/OSC2

PRC3

733

PWM1

GND3

145

293

430

563

696

829

962

1095

1228

1248

896

PRC2

1056

1218

1379

1540

1700

1861

2022

2310

PRA3

PRC1

PRA2

PRC0

PRA1

PRD3

PRA0

PRD2

PRB3/Reset

PRB2

PRD1

PRD0

Vdd1

GND1

GND2

272

Rev 1.1

2003/9/2

APExx16 Series

6.2 Bonding Diagram of APE8416 /APE10616 /APE12716

GND1

PRC2

PRB3

PRC3

PRC1

PRD3

PRD0

PRC0

PRD2

PRD1

Vdd1

ROM

Chip Size : 2288 um x 2364 um

Pad Size : 80 um x 80 um

* The IC substrate must be connected to GND.

GND4

GND3

GND2

PWM1

Vdd3

PRB1

PRB2

Vdd2

PRB0

OSC1

PRA0 PRA1

PRA2 PRA3

PWM2/Cout

(0,0)

Pad #

Pad Name

GND4

Pad #

Pad Name

PRA3

404

294

146

2109

2128

1927

1765

1603

1441

1279

1117

955

GND3

GND2

GND1

PRD0

212

2204

PWM1

Vdd3

183

467

PWM2/Cout

Vdd2

PRD1

815

PRD2

OSC1

976

PRD3

PRB0/OSC2

PRB1/IR

PRB2

1140

1304

1465

1626

1787

1948

PRC0

PRC1

PRC2

739

PRA0

PRC3

631

PRA1

PRB3/Reset

Vdd1

469

PRA2

307

Rev 1.1

2003/9/2

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