AT24C04B-W-11 [ATMEL]
Two-wire Serial EEPROM; 两线串行EEPROM
| 型号： | AT24C04B-W-11 |
| 厂家： | 
ATMEL |
| 描述： | Two-wire Serial EEPROM |
| 文件： | 总28页 (文件大小：524K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Low-voltage and Standard-voltage Operation
─ 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 512 x 8 (4K), or 1024 x 8 (8K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 16-byte Page (4K, 8K) Write Modes
• Partial Page Writes Allowed
Two-wire
Serial EEPROM
• Self-timed Write Cycle (5 ms max)
• High-reliability
4K (512 x 8)
8K (1024 x 8)
─ Endurance: 1 Million Write Cycles
─ Data Retention: 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-MAP (MLP 2x3), 5-lead
SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages
• Lead-free/Halogen-free
AT24C04B
AT24C08B
• Die Sales: Wafer Form and Tape and Reel
Description
The AT24C04B/08B provides 4096/8192 bits of serial electrically erasable and
programmable read-only memory (EEPROM) organized as 512/1024 words of 8 bits
each. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operation are essential. The AT24C04B/08B is
available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-
MAP (MLP 2x3), 5-lead SOT23, 8-lead TSSOP, and 8-ball dBGA2 packages and is
accessed via a Two-wire serial interface. In addition, the AT24C04B/08B is available in
1.8V (1.8V to 5.5V) version.
Figure 1. Pin Configurations
8-lead Ultra-Thin
Mini-MAP (MLP 2x3)
Pin Name
Description
Address Inputs
8-ball dBGA2
A0 – A2
8
7
6
5
1
2
3
4
VCC
WP
A0
VCC
WP
8
7
6
5
1
2
3
4
A0
A1
A1
SDA
SCL
WP
Serial Data
SCL
SDA
A2
SCL
SDA
A2
GND
GND
Serial Clock Input
Write Protect
No Connect
Ground
Bottom View
Bottom View
8-lead TSSOP
8-lead SOIC
NC
A0
A1
1
2
3
4
8
7
6
5
VCC
A0
A1
VCC
1
2
3
4
8
7
6
5
GND
VCC
WP
WP
A2
SCL
SDA
A2
SCL
SDA
Power Supply
GND
GND
Note: For use of 5-lead SOT23
4K: The software A2 and A1 bits in the
device address word must be set to zero
to properly communicate.
5-lead SOT23
8-lead PDIP
VCC
8
1
7
2
6
3
5
4
A0
SCL
WP
VCC
1
2
3
5
8K: The software A2 bit in the device
address word must be set to zero to
properly communicate.
WP
A1
A2
GND
SDA
SCL
SDA
4
GND
5226G–SEEPR–11/09
Absolute Maximum Ratings
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating
only and functional operation of the device at
these or any other condition beyond those
indicated in the operational sections of this
specification is not implied. Exposure to
absolute maximum rating conditions for
extended periods may affect device reliability.
Operating Temperature .......................... • 55°C to +125°C
Storage Temperature ........................... • 65°C to + 150°C
Voltage on Any Pin with
Respect to Ground ...................................• 0.1V to +7.0V
Maximum Operating Voltage.................................... 6.25V
DC Output Current.................................................. 5.0 mA
Figure 2.
Block Diagram
V
CC
GND
WP
START
STOP
LOGIC
SCL
SDA
SERIAL
EN
H.V. PUMP/TIMING
DATA RECOVERY
CONTROL
LOGIC
LOAD
COMP
DEVICE
ADDRESS
COMPARATOR
LOAD
INC
A2
A1
A0
R/W
DATA WORD
EEPROM
ADDR/COUNTER
Y DEC
SERIAL MUX
DOUT/ACK
LOGIC
DIN
DOUT
2
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
1.
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be
wire-ORed with any number of other open-drain or open-collector devices.
DEVICE/PAGE ADDRESSES (A2, A1, A0): The AT24C04B uses the A2 and A1 inputs for hard wire addressing and a
toal of four 4K devices may be addressed on a single bus system. The A0 pin is a no connect and can be connected to
ground (device addressing is discussed in detail under the Device Addressing section).
The AT24C08B only uses the A2 input for hardware addressing and a total of two 8K devices may be addressed on a
single bus system. The A0 and A1 pins are no connects and can be connected to ground (device addressing is
discussed in detail under the Device Addressing section).
Table 1. Write Protect
Part of the Array Protected
WP Pin Status
24C04B/08B
At VCC
Full Array
At GND
Normal Read/Write Operations
3
5226G–SEEPR–11/09
2.
Memory Organization
AT24C04B, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data
word address for random word addressing.
AT24C08B, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit
data word address for random word addressing.
Table 2. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V
Symbol
CI/O
CIN
Test Condition
Input/Output Capacitance (SDA)
Input Capacitance (A0, A1, A2, SCL)
Max
8
Units
pF
Conditions
VI/O = 0V
6
pF
VIN = 0V
Note: 1. This parameter is characterized and is not 100% tested.
Table 3. DC Characteristics
Applicable over recommended operating range from:
TAI = –40°C to +85°C, VCC = +1.8V to +5.5V (unless otherwise noted)
Symbol
VCC1
VCC2
VCC3
VCC4
ICC
Parameter
Test Condition
Min
Typ
Max
5.5
5.5
5.5
5.5
1.0
3.0
3.0
4.0
4.0
18.0
3.0
3.0
Units
V
Supply Voltage
Supply Voltage
Supply Voltage
Supply Voltage
1.8
2.5
2.7
4.5
V
V
V
Supply Current VCC = 5.0V
Supply Current VCC = 5.0V
Supply Current VCC = 1.8V
Supply Current VCC = 2.5V
Supply Current VCC = 2.7V
Supply Current VCC = 5.0V
Input Leakage Current
Output Leakage Current
Input Low Level(1)
READ at 100 kHz
0.4
2.0
mA
mA
µA
µA
µA
µA
µA
µA
V
ICC
WRITE at 100 kHz
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VOUT = VCC or VSS
ISB1
0.6
ISB2
1.4
ISB3
1.6
ISB4
8.0
ILI
0.10
0.05
ILO
VIL
- 0.6
VCC x 0.3
VCC + 0.5
0.4
VIH
Input High Level(1)
VCC x 0.7
V
VOL2
VOL1
Output Low Level VCC = 3.0V
Output Low Level VCC = 1.8V
IOL = 2.1 mA
V
IOL = 0.15 mA
0.2
V
Note: 1. VIL min and VIH max are reference only and are not tested.
4
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
Table 4. AC Characteristics
Applicable over recommended operating range from TAI
CL = 1 TTL Gate and 100 pF (unless otherwise noted)
=
–40°C to +85°C, VCC
=
+1.8V to +5.5V,
1.8, 2.5, 2.7
5.0-volt
Symbol
Parameter
Units
Min
Max
Min
Max
fSCL
tLOW
tHIGH
tI
Clock Frequency, SCL
Clock Pulse Width Low
400
1000
kHz
µs
1.2
0.6
0.4
0.4
Clock Pulse Width High
Noise Suppression Time
Clock Low to Data Out Valid
µs
50
40
ns
tAA
0.1
1.2
0.9
0.05
0.5
0.55
µs
tBUF
Time the bus must be free before a new transmission
can start
µs
tHD.STA
Start Hold Time
0.6
0.6
0
0.25
0.25
0
µs
tSU.STA
Start Setup Time
Data in Hold Time
Data In Setup Time
Inputs Rise Time(1)
Inputs Fall Time(1)
Stop Setup Time
Data Out Hold Time
Write Cycle Time
5.0V, 25°C, Byte Mode
µs
tHD.DAT
µs
tSU.DAT
100
100
ns
tR
0.3
0.3
µs
tF
300
100
ns
TSU.STO
0.6
50
.25
50
µs
ns
tDH
tWR
5
5
ms
Endurancec(1)
1M
1M
Write cycles
Note:
1. This parameter is ensured by characterization only.
5
5226G–SEEPR–11/09
3.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods (see Figure 6 ). Data changes during SCL high periods will indicate a
start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other
command (see Figure 7).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop
command will place the EEPROM in a standby power mode (see Figure 7).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The
EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C04B/08B features a low-power standby mode which is enabled:
(a) Upon power-up and
(b) After the receipt of the STOP bit and the completion of any internal operations.
2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any
2-wire part can be reset by following these steps:
(a) Create a start bit condition,
(b) Clock 9 cycles,
(c) Create another start bit followed by a stop bit condition as shown below. The device is ready for the next
communication after the above steps have been completed.
Figure 3.
Software reset
Dummy Clock Cycles
Start bit
Stop bit
Start bit
1
2
3
8
9
SCL
SDA
6
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
4.
Bus Timing
Figure 4.
SCL: Serial Clock, SDA: Serial Data I/O®
tHIGH
tF
tR
tLOW
tLOW
SCL
tSU.STA
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
5.
Write Cycle Timing
Figure 5.
SCL: Serial Clock, SDA: Serial Data I/O
SCL
ACK
SDA
8th BIT
WORDn
(1)
t
wr
START
STOP
CONDITION
CONDITION
Note:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the
internal clear/write cycle.
7
5226G–SEEPR–11/09
Figure 6.
Data Validity
SDA
SCL
DATA STABLE
DATA STABLE
DATA
CHANGE
Figure 7.
Start and Stop Definition
SDA
SCL
START
STOP
Figure 8.
Output Acknowledge
1
8
9
SCL
DATA IN
DATA OUT
START
ACKNOWLEDGE
8
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
6.
Device Addressing
The 4K and 8K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for
a read or write operation (refer to Figure 9 ).
The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown.
This is common to all the EEPROM devices.
The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a memory page address bit. The
two device address bits must compare to their corresponding hard-wired input pins. The A0 pin is no connect.
The 8K EEPROM only uses the A2 device address bit with the next 2 bits being for memory page addressing. The A2
must compare to its corresponding hard-wired input pin. The A1 and A0 pins are no connect.
For the SOT23 Package Offering:
The 4K EEPROM software A2 and A1 bits in the device address word must be set to zero to properly communicate.
The 8K EEPROM software A2 bit in the device address word must be set to zero to properly communicate.
7.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first
8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device,
such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an
internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the
EEPROM will not respond until the write is complete (see Figure 10 ).
PAGE WRITE: The 4K/8K EEPROM is capable of an 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first
data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can
transmit up to fifteen data words. The EEPROM will respond with a zero after each data word received. The
microcontroller
must
terminate
the
page
write
sequence
with
a
stop
condition.
(see Figure 11 ).
The data word address lower four bits are internally incremented following the receipt of each data word. The higher
data word address bits are not incremented, retaining the memory page row location. When the word address,
internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If
more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data
will be overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The
read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM
respond with a zero allowing the read or write sequence to continue.
9
5226G–SEEPR–11/09
8.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit in the
device address word is set to one. There are three read operations: current address read, random address read and
sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the
last read or write operation, incremented by one. This address stays valid between operations as long as the chip
power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of
the first page. The address “roll over” during write is from the last byte of the current page to the first byte of the same
page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the
current address data word is serially clocked out. The microcontroller does not respond with an input zero but does
generate a following stop condition (see Figure 12).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the
device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller
must generate another start condition. The microcontroller now initiates a current address read by sending a device
address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the
data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure
13).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After
the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an
acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When
the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a
following stop condition (see Figure 14 ).
Figure 9.
Device Address
4K
8K
1
1
0
0
1
1
0
0
A2
A2
A1
P1
P0
P0
R/W
R/W
10
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
Figure 10. Byte Write
Figure 11. Page Write
Figure 12. Current Address Read
11
5226G–SEEPR–11/09
Figure 13. Random Read
Figure 14. Sequential Read
12
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
9.
AT24C04B Ordering Information
Table 5. Ordering Information
Ordering Code
Voltage
1.8
Package
Operational range
AT24C04B-PU
(Bulk form only)
8P3
8S1
AT24C04BN-SH-B(1) (NiPdAu Lead Finish)
AT24C04BN-SH-T(2) (NiPdAu Lead Finish)
1.8
1.8
8S1
AT24C04B-TH-B(1)
AT24C04B-TH-T(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
1.8
8A2
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
1.8
8A2
AT24C04BY6-YH-T(2) (NiPdAu Lead Finish)
AT24C04B-TSU-T(2)
1.8
8Y6
1.8
5TS1
8U3-1
Die Sale
AT24C04BU3-UU-T(2)
1.8
AT24C04B-W-11(3)
1.8
Industrial Temperature (-40°C to 85°C)
Note: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K
per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial
Interface Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
8P3
8S1
8A2
8Y6
5TS1
8U3-1
Options
-1.8
Low-voltage (1.8V to 5.5V)
13
5226G–SEEPR–11/09
10.
AT24C08B Ordering Information
Table 6. Ordering Information
Ordering Code
Voltage
1.8
Package
8P3
Operational range
AT24C08B-PU
(Bulk form only)
AT24C08BN-SH-B(1) (NiPdAu Lead Finish)
AT24C08BN-SH-T(2) (NiPdAu Lead Finish)
1.8
8S1
1.8
8S1
AT24C08B-TH-B(1)
AT24C08B-TH-T(2)
(NiPdAu Lead Finish)
1.8
8A2
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
(NiPdAu Lead Finish)
1.8
8A2
AT24C08BY6-YH-T(2) (NiPdAu Lead Finish)
AT24C08B-TSU-T(2)
1.8
8Y6
1.8
5TS1
8U3-1
Die Sale
AT24C08BU3-UU-T(2)
1.8
AT24C08B-W-11(3)
1.8
Industrial Temperature (-40°C to 85°C)
Note: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K
per reel.
3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial
Interface Marketing.
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (dBGA2)
8P3
8S1
8A2
8Y6
5TS1
8U3-1
Options
-1.8
Low-voltage (1.8V to 5.5V)
14
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
11.
Part Marketing Scheme
11.1. AT24C04B Device Package Marking
8-PDIP
Seal Year
Top Mark
Seal Week
Y = SEAL YEAR
6: 2006
WW = SEAL WEEK
0: 2010
1: 2011
02 = Week 2
04 = Week 4
--- --- --- --- --- --- --- ---
7: 2007
A
T
M
L
U
Y
W
W
8: 2008
9: 2009
2: 2012
3: 2013
:: : :::: :
:: : :::: ::
--- --- --- --- --- --- --- ---
0
*
4
B
1
50 = Week 50
52 = Week 52
Lot Number
--- --- --- --- --- --- --- ---
Pin 1 Indicator (Dot)
Lot Number to Use ALL Characters in Marking
BOTTOM MARK
No Bottom Mark
8-SOIC
Seal Year
Top Mark
Seal Week
Y = SEAL YEAR
WW = SEAL WEEK
02 = Week 2
04 = Week 4
6: 2006
7: 2007
0: 2010
--- --- --- --- --- --- --- ---
1: 2011
1
A
T
M
L
H
Y
W
W
8: 2008
9: 2009
2: 2012
3: 2013
:: : :::: :
:: : :::: ::
--- --- --- --- --- --- --- ---
0
*
4
B
1
50 = Week 50
52 = Week 52
Lot Number
--- --- --- --- --- --- --- ---
Pin 1 Indicator (Dot)
Lot Number to Use ALL Characters in Marking
BOTTOM MARK
No Bottom Mark
8-TSSOP
Top Mark
Pin 1 Indicator (Dot)
--- --- --- ---
Y = SEAL YEAR
WW = SEAL WEEK
02 = Week 2
04 = Week 4
6: 2006
7: 2007
0: 2010
1: 2011
*
H
Y
W
W
8: 2008
9: 2009
2: 2012
3: 2013
:: : :::: :
:: : :::: ::
--- --- --- --- ---
0
4
B
1
50 = Week 50
52 = Week 52
--- --- --- --- ---
Bottom Mark
--- --- --- --- --- --- --- ---
P
H
--- --- --- --- --- --- --- ---
A
A
A
A
A
A
A
A
<- Pin 1 Indicator
15
5226G–SEEPR–11/09
8-Ultra Thin Mini Map
Top Mark
Y = YEAR OF ASSEMBLY
--- --- ---
0
4
B
XX = ATMEL LOT NUMBER TO COORESPOND WITH
NSEB TRACE CODE LOG BOOK.
--- --- ---
H
1
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
--- --- ---
Y
X
X
--- --- ---
*
Y = SEAL YEAR
6: 2006
7: 2007
8: 2008
9: 2009
0: 2010
1: 2011
2: 2012
3: 2013
Pin 1 Indicator (Dot)
ULA
Top Mark
--- --- ---
0
4
B
--- --- ---
Y
X
X
--- --- ---
*
Pin 1 Indicator (Dot)
Y
= BUILD YEAR
2006 = 6
2007 = 7
2008 = 8
Etc.
.
.
.
XX
= ATMEL LOT NUMBER TO COORESPOND WITH
NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
16
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
SOT23
Top Mark
--- --- --- --- ---
Line 1 ----------->
4
B
1
B
U
--- --- --- --- ---
*
XX
V
W
U
=
=
=
=
Device
Voltage Indicator
Write Protect Feature
Material Set
Pin 1 Indicator (Dot)
Bottom Mark
--- --- --- ---
Y
M
T
C
--- --- --- ---
Y
M
=
=
One Digit Year Code
Seal Month
(Use Alpha Designator A-L)
Trace Code
TC
=
dBGA2
Top Mark
Line 1 ----------->
Line 2 ----------->
04BU
YMTC
<---
Pin 1 This Corner
XXX
U
Y
M
TC
=
=
=
=
=
Device
Material Set
One Digit Year Code
Seal Month (Use Alpha Designator A-L)
Trace Code
17
5226G–SEEPR–11/09
11.2. AT24C08B Device Package Marking
dBGA2
Top Mark
Line 1 ----------->
Line 2 ----------->
08BU
YMXX
<---
Pin 1 This Corner
Y = ONE DIGIT YEAR CODE
8: 2008
9: 2009
0: 2010
1: 2011
1
2: 2012
3: 2013
M = SEAL MONTH (USE ALPHA DESIGNATOR A-L)
A = JANUARY
B = FEBRUARY
" " """""""
J = OCTOBER
K = NOVEMBER
L = DECEMBER
XX = TRACE CODE (ATMEL LOT NUMBERS TO CORRESPOND
WITH ATK TRACE CODE LOG BOOK)
8-Ultra Thin Mini MAP
Top Mark
--- --- ---
0
8
B
--- --- ---
H
1
--- --- ---
Y
X
X
--- --- ---
*
Pin 1 Indicator (Dot)
Y
= YEAR OF ASSEMBLY
XX = TRACE ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)
Y = SEAL YEAR
6: 2006
7: 2007
8: 2008
9: 2009
0: 2010
1
1: 2011
2: 2012
3: 2013
18
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
8-PDIP and 8-SOIC
Seal Year
Seal Week
Top Mark
--- --- --- --- --- --- --- ---
A
T
M
L
H
Y
W
W
--- --- --- --- --- --- --- ---
0
*
8
B
1
Lot Number
--- --- --- --- --- --- --- ---
Pin 1 Indicator (Dot)
Y = SEAL YEAR
WW = SEAL WEEK
2: 2012
8: 2008
9: 2009
02 = Week 2
04 = Week 4
:: : :::: :
:: : :::: ::
50 = Week 50
52 = Week 52
3: 2013
4: 2014
5: 2015
0: 2010
1
1: 2011
1
1
SOT23
Top Mark
--- --- --- --- ---
Line 1 ----------->
8
B
1
B
U
--- --- --- --- ---
*
Pin 1 Indicator (Dot)
BACKSIDE MARKING
--- --- --- ---
Y
M
X
X
--- --- --- ---
Y = ONE DIGIT YEAR CODE
4: 2004
5: 2005
6: 2006
7: 2007
8: 2008
9: 2009
M = SEAL MONTH (USE ALPHA DESIGNATOR A-L)
A = JANUARY
B = FEBRUARY
" " """""""
J = OCTOBER
K = NOVEMBER
L = DECEMBER
XX = TRACE CODE (ATMEL LOT NUMBERS TO CORRESPOND WITH TRACE CODE LOG BOOK)
19
5226G–SEEPR–11/09
8-TSSOP
Pin 1 Indicator (Dot)
--- --- --- ---
*
H
Y
W
W
--- --- --- --- ---
0
8
B
1
--- --- --- --- ---
Bottom Mark
--- --- --- --- --- --- ---
C
O
O
--- --- --- --- --- --- ---
A
A
A
A
A
A
A
<- Pin 1 Indicator
COO = Country of Origin
Y = SEAL YEAR
WW = SEAL WEEK
6: 2006
7: 2007
0: 2010
1: 2011
02 = Week 2
04 = Week 4
8: 2008
9: 2009
2: 2012
3: 2013
:: : :::: :
:: : :::: ::
50 = Week 50
52 = Week 52
20
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
12.
Packaging Information
8P3 – PDIP
Figure 15.
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
MIN
–
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
–
NOM
–
NOTE
SYMBOL
D1
A2 A
A
2
A2
b
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
–
5
6
6
b2
b3
c
D
3
3
4
3
b2
L
D1
E
b3
4 PLCS
0.310
0.250
0.100 BSC
0.300 BSC
0.130
0.325
0.280
b
E1
e
Side View
eA
L
4
2
0.115
0.150
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or prortusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
R
21
5226G–SEEPR–11/09
8S1 – JEDEC SOIC
Figure 16. 8S1 – JEDECSOIC
C
1
E
E1
L
N
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
NOTE
SYMBOL
A1
A
–
–
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.00
3.99
6.20
C
D
E1
E
e
–
–
D
–
–
Side View
1.27 BSC
L
0.40
0˚
–
–
1.27
8˚
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerancesd,atums, etc.
10/7/03
REV.
TITLE
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
8S1
B
R
Small Outline (JEDEC SOIC)
22
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
8A2 – TSSOP
Figure 17. 8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
3.00
NOTE
SYMBOL
D
2.90
3.10
2, 5
A
b
E
6.40 BSC
4.40
E1
A
4.30
–
4.50
1.20
1.05
0.30
3, 5
4
–
A2
b
0.80
0.19
1.00
e
A2
–
D
e
0.65 BSC
0.60
L
0.45
0.75
Side View
L1
1.00 REF
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) perside.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
DRAWING NO.
TITLE
REV.
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
2325 Orchard Parkway
San Jose, CA 95131
B
8A2
R
23
5226G–SEEPR–11/09
8Y6 – Mini Map
Figure 18. 8Y6 – Mini Map
A
D2
b
(8X)
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
2.00 BSC
3.00 BSC
1.50
NOTE
SYMBOL
D
E
D2
E2
A
1.40
1.60
1.40
0.60
0.05
0.55
-
-
-
-
A1
A2
A3
L
0.0
-
0.02
-
0.20 REF
0.30
0.20
0.20
0.40
0.30
e
0.50 BSC
0.25
b
2
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in thatradius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied toground
10/16/07
TITLE
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
8Y6
D
R
24
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
5TS1 – SOT23
Figure 19. 5TS1 – SOT23
e1
C
4
5
E1
C
L
E
L1
1
3
2
End View
Top View
b
A2
A
Seating
Plane
A1
e
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
MIN
–
MAX
1.10
0.10
1.00
0.20
NOM
–
NOTE
SYMBOL
NOTES: 1. This drawing is for general information onl y. Refer to JEDEC D rawing
MO-193, Variation AB, for additional in formation.
A
2. Dimension D does not include mold flash, prot rusions, or gate burrs.
Mold flash, prot rusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include inte rlead flash or prot rusion. Interlead
flash or prot rusion shall not exceed 0.15 mm per sid e.
3. The package top m ay be smaller than the pa ckage bottom . Dimensions
D and E1 are dete rmined at the oute rmost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and inte rlead flash, but
including a ny mismatch bet ween the top and bottom of the plastic bod y.
4. These dimensions apply to the flat section of the lead bet ween 0.08 mm
and 0.15 mm from the lead ti p.
5. Dimension "b" does not include Dambar prot rusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum mate rial condition . The Dambar cannot be located on the l ower
radius of the foot. Minimum space bet ween prot rusion and an adjacent lead
shall not be less than 0.07 mm.
A1
A2
c
0.00
0.70
0.08
–
0.90
–
4
D
2.90 BS C
2.80 BS C
1.60 BS C
0.60 REF
0.95 BSC
1.90 BSC
–
2, 3
2, 3
2, 3
E
E1
L1
e
e1
b
0.30
0.50
4, 5
6/25/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
R
PO5TS1
A
25
5226G–SEEPR–11/09
8U3-1 – Dbga2
Figure 20. 8U3-1 – Dbga2
E
D
1.
b
A1
PIN 1 BALLPAD CORNER
A2
Top View
A
PIN 1 BALLPAD CORNER
Side View
1
2
3
4
(d1)
d
7
6
5
8
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
MIN
0.71
0.10
0.40
0.20
MAX
0.91
0.20
0.50
0.30
NOM
0.81
NOTE
SYMBOL
Bottom View
8 SOLDER BALLS
A
A1
A2
b
0.15
0.45
0.25
D
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
1. Dimension “b” is measured at the maxmi um solder ball diameter.
This drawing is for general information only.
E
e
e1
d
d1
6/24/03
TITLE
REV.
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
PO8U3-1
A
R
Small Die Ball Grid Array Package (dBGA2)
26
AT24C04B/08B
5226G–SEEPR–11/09
Two-wire Serial EEPROM
13.
Revision History
Table 7. Revision History
Doc. Rev.
5226G
5226F
Date
Comments
11/2009
5/2009
Corrected AC Characteristics, TAA minimum value from 0.55 to 0.05
Corrected AT24C08B Part Marking Scheme
Add AT24C08B Device Package Marking Details and removed Bumped wafer offering.
Update into MS Format.
5226E
5226D
5226D
5226C
12/2008
08/2008
07/2008
02/2008
Removed ‘Preliminary’ status
Text changes on page 4 and 9
Updated to new template
Updated common Figures
Added Package Marking tables
5226B
5226A
08/2007
06/2007
Initial document release
27
5226G–SEEPR–11/09
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5226G–SEEPR–11/09
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