AT24C1024SC-09BT [ATMEL]

EEPROM, 128KX8, Serial, CMOS, CARD-8;
AT24C1024SC-09BT
型号: AT24C1024SC-09BT
厂家: ATMEL    ATMEL
描述:

EEPROM, 128KX8, Serial, CMOS, CARD-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总14页 (文件大小:212K)
中文:  中文翻译
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Features  
Low-voltage and Standard-voltage Operation, VCC = 2.7V–5.5V  
Internally Organized 131,072x 8  
Two-wire Serial Interface  
Schmitt Triggers, Filtered Inputs for Noise Suppression  
Bidirectional Data Transfer Protocol  
1 MHz (5V) and 400 kHz (2.7V) Compatibility  
256-byte Page Write Mode (Partial Page Writes Allowed)  
Self-timed Write Cycle (5 ms Typical)  
High Reliability  
– Endurance: 100,000 Write Cycles  
– Data Retention: 40 Years  
– 5.5V ESD Protection: >4000V  
Two-wire Serial  
EEPROM Smart  
Card Module  
Description  
The AT24C1024SC provides 1,048,576 bits of serial electrically erasable and pro-  
grammable read only memory (EEPROM) organized as 131,072 words of 8 bits each.  
This device is optimized for use in smart card applications where low-power and low-  
voltage operation may be essential. This device is available in a standard ISO 7816  
smart card module (see Ordering Information, page 11). All devices are functionally  
equivalent to Atmel serial EEPROM products offered in standard IC packages (PDIP,  
SOIC, dBGA, LAP), with the exception of the slave address and write protect func-  
tions, which are not required for smart card applications.  
1K (131,072 x 8)  
AT24C1024SC  
Table 1. Pin Configurations  
Pad Name  
VCC  
Description  
ISO Module Contact  
Power Supply Voltage  
Ground  
C1  
GND  
SCL  
C5  
Serial Clock Input  
Serial Data Input/Output  
No Connect  
C3  
C7  
SDA  
NC  
C2, C4, C6, C8  
Figure 1. Card Module Contact  
C5 = GND  
C6 = NC  
VCC = C1  
NC = C2  
SCL = C3  
NC = C4  
C7 = SDA  
C8 = NC  
5045A–SEEPR–04/04  
Absolute Maximum Ratings*  
NOTICE:* Stresses beyond those listed under Absolute Maxi-  
mum Ratingsmay cause permanent damage to the  
device. This is a stress rating only; functional opera-  
tion of the device at these or any other conditions  
beyond those indicated in the operational sections of  
this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may  
affect device reliability.  
Operating Temperature......................................−55°C to +125°C  
Storage Temperature .........................................−65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground........................................ −1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Figure 2. Block Diagram  
Pin Description  
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each  
EEPROM device and negative edge clock data out of each device.  
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is  
open-drain driven and may be wire-ORed with any number of other open-drain or open  
collector devices.  
Memory Organization AT24C1024SC, 1024K SERIAL EEPROM: The 1024K is internally organized as 512  
pages of 256 bytes each. Random word addressing requires a 17-bit data word  
address.  
2
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
Pin Capacitance  
Table 2. Pin Capacitance(1)  
Applicable over recommended operating range fromTA = 25°C, f = 1.0 MHz, VCC = +2.7V  
Symbol  
CI/O  
Test Condition  
Max  
8
Units  
pF  
Conditions  
VI/O = 0V  
VIN = 0V  
Input/Output Capacitance (SDA)  
Input Capacitance (SCL)  
CIN  
6
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
DC Characteristics  
Table 3. DC Characteristics(1)  
Symbol  
VCC  
Parameter  
Test Condition  
Min  
Typ  
Max  
5.5  
2.0  
5.0  
3.0  
6.0  
3.0  
Units  
V
Supply Voltage  
Supply Current  
Supply Current  
2.7  
ICC1  
VCC = 5.0V  
VCC = 5.0V  
VCC = 2.7V  
Read at 400 kHz  
mA  
mA  
µA  
ICC2  
Write at 400 kHz  
ISB  
Standby Current  
VIN = VCC or GND  
V
CC = 5.5V  
ILI  
Input Leakage Current  
VIN = VCC or GND  
VOUT = VCC or GND  
0.10  
0.05  
µA  
µA  
Output Leakage  
Current  
ILO  
3.0  
VIL  
Input Low Level(2)  
Input High Level(2)  
Output Low Level  
0.6  
V
CC x 0.3  
V
V
V
VIH  
VOL  
VCC x 0.7  
VCC + 0.5  
0.4  
VCC = 3.0V  
IOL = 2.1 mA  
Note:  
1. Applicable over recommended operating range fromTAC = 0°C to +70°C, VCC = +2.7V to +5.5V (unless otherwise noted)  
2. VIL min and VIH max are reference only and are not tested.  
AC Characteristics  
Table 4. AC Characteristics(1)  
2.7-volt  
Max  
5.0-volt  
Max  
Symbol  
fSCL  
Parameter  
Min  
Min  
Units  
kHz  
µs  
Clock Frequency, SCL  
Clock Pulse Width Low  
Clock Pulse Width High  
Clock Low to Data Out Valid  
400  
1000  
tLOW  
1.3  
0.6  
0.4  
0.4  
tHIGH  
tAA  
µs  
0.05  
0.9  
0.05  
0.55  
µs  
Time the bus must be free before a new  
transmission can start(2)  
tBUF  
1.3  
0.5  
µs  
tHD.STA  
tSU.STA  
tHD.DAT  
tSU.DAT  
tR  
Start Hold Time  
0.6  
0.6  
0
0.25  
0.25  
0
µs  
µs  
µs  
ns  
µs  
Start Set-up Time  
Data In Hold Time  
Data In Set-up Time  
Inputs Rise Time(2)  
100  
100  
0.3  
0.3  
3
5045ASEEPR04/04  
Table 4. AC Characteristics(1) (Continued)  
2.7-volt  
Max  
5.0-volt  
Symbol  
Parameter  
Min  
Min  
Max  
Units  
tF  
Inputs Fall Time(2)  
Stop Set-up Time  
Data Out Hold Time  
Write Cycle Time  
5.0V, 25°C, Page Mode  
300  
100  
ns  
tSU.STO  
tDH  
0.6  
50  
0.25  
50  
µs  
ns  
tWR  
10  
10  
ms  
Endurance(2)  
100K  
100K  
Write Cycles  
Note:  
1. Applicable over recommended operating range from TA = 0°C to +70°C, VCC = +2.7V to +5.5V, CL = 100 pF (unless other-  
wise noted). Test conditions are listed in Note 2.  
2. This parameter is characterized and is not 100% tested.  
3. AC measurement conditions:  
RL (connects to VCC): 1.3 k(2.7V, 5V)  
Input pulse voltages: 0.3VCC to 0.7VCC  
Input rise and fall times: 50ns  
Input and output timing reference voltages: 0.5VCC  
4
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
Device Operation  
CLOCK AND DATA TRANSITIONS: The SDA pin is normally pulled high with an exter-  
nal device. Data on the SDA pin may change only during SCL-low time periods (see  
Figure 5 on page 6). Data changes during SCL-high periods will indicate a start or stop  
condition as defined below.  
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition  
that must precede any other command (see Figure 6 on page 7).  
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition.  
After a read sequence, the stop command will place the EEPROM in a standby power  
mode (Figure 6 on page 7).  
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the  
EEPROM in 8-bit words. The EEPROM sends a zero during the ninth clock cycle to  
acknowledge that it has received each word.  
STANDBY MODE: The AT24C1024SC features a low-power standby mode that is  
enabled upon power-up and after the receipt of the stop bit and the completion of any  
internal operations.  
MEMORY RESET: After an interruption in protocol, power loss, or system reset, any  
two-wire part can be reset by following these steps:  
1. Clock up to 9 cycles.  
2. Look for SDA high in each cycle while SCL is high.  
3. Create a start condition as SDA is high.  
5
5045ASEEPR04/04  
Timing Diagrams  
Bus Timing  
Figure 3. Bus Timing(1)  
Note:  
1. SCL: Serial Clock; SDA: Serial Data I/O  
2. The write cycle time tWR is the time from a valid stop condition of a write sequence to  
the end of the internal clear/write cycle.  
Write Cycle Timing  
Figure 4. Write Cycle Timing  
(1)  
tWR  
Note:  
1. SCL: Serial Clock; SDA: Serial Data I/O  
Data Validity  
Figure 5. Data Validity  
SDA  
SCL  
DATA STABLE  
DATA STABLE  
DATA  
CHANGE  
6
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
Start and Stop Definition Figure 6. Start and Stop Definition  
SDA  
SCL  
START  
STOP  
Output Acknowledge  
Figure 7. Output Acknowledge  
SCL  
DATA IN  
DATA OUT  
START  
ACKNOWLEDGE  
7
5045ASEEPR04/04  
Device Addressing  
The 1024K EEPROM requires an 8-bit device address word following a start condition to  
enable the chip for a read or write operation (see Figure 8). The device address word  
consists of a mandatory one, zerosequence for the first four most significant bits as  
shown. This is common to all two-wire EEPROM devices.  
The next three bits of the device address word are unused. These three unused bits  
should be set to 0.  
The seventh bit (P0) of the device address is a memory page address bit. The memory  
page address bit is the most significant bit of the data word address that follows.  
The eighth bit of the device address is the read/write operation select bit. A read opera-  
tion is initiated if this bit is high and a write operation is initiated if this bit is low.  
Upon a compare of the device address, the EEPROM will output a 0. If a compare is  
not made, the device will return to a standby state.  
Figure 8. Device Address  
1
0
1
0
0
0
P0 R/W  
LSB  
MSB  
Write Operations  
BYTE WRITE: To select a data word in the 1024K memory requires a 17-bit word  
address. The word address field consists of the P0 bit of the device address, then the  
most significant word address followed by the least significant word address (see Figure  
9).  
A write operation requires the P0 bit and two 8-bit word addresses following the device  
address word and acknowledgment. Upon receipt of this address, the EEPROM will  
again respond with a 0and then clock in the first 8-bit data word. Following receipt of  
the 8-bit data word, the EEPROM will output a 0. The addressing device, such as a  
microcontroller, then must terminate the write sequence with a stop condition. At this  
time the EEPROM enters an internally-timed write cycle, tWR, to the nonvolatile memory.  
All inputs are disabled during this write cycle and the EEPROM will not respond until the  
write is complete (see Figure 9).  
Figure 9. Byte Write  
LEAST  
MOST SIGNIFICANT  
SIGNIFICANT  
P0  
PAGE WRITE: The 1024K EEPROM is capable of 256-byte page writes.  
A page write is initiated the same way as a byte write, but the microcontroller does not  
send a stop condition after the first data word is clocked in. Instead, after the EEPROM  
acknowledges receipt of the first data word, the microcontroller can transmit up to 255  
more data words. The EEPROM will respond with a 0after each data word received.  
The microcontroller must terminate the page write sequence with a stop condition (see  
Figure 10).  
8
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
Figure 10. Page Write  
LEAST  
MOST SIGNIFICANT  
SIGNIFICANT  
P0  
L
S
B
The lower eight data word address bits are internally incremented following the receipt  
of each data word. The higher data word address bits are not incremented, retaining the  
memory page row location. When the word address, internally generated, reaches the  
page boundary, the following byte is placed at the beginning of the same page. If more  
than 256 data words are transmitted to the EEPROM, the data word address will roll  
overand previous data will be overwritten. The address roll overduring write is from  
the last byte of the current page to the first byte of the same page.  
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the  
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves send-  
ing a start condition followed by the device address word. The read/write bit is  
representative of the operation desired. Only if the internal write cycle has completed  
will the EEPROM respond with a 0, allowing the read or write sequence to continue.  
9
5045ASEEPR04/04  
Read Operations  
Read operations are initiated the same way as write operations with the exception that  
the read/write select bit in the device address word is set to one. There are three read  
operations: current address read, random address read and sequential read.  
CURRENT ADDRESS READ: The internal data word address counter maintains the  
last address accessed during the last read or write operation, incremented by one. This  
address stays valid between operations as long as the chip power is maintained. The  
address roll overduring read is from the last byte of the last memory page to the first  
byte of the first page.  
Once the device address with the read/write select bit set to one is clocked in and  
acknowledged by the EEPROM, the current address data word is serially clocked out.  
The microcontroller does not respond with an input 0but does generate a following  
stop condition (see Figure 11).  
Figure 11. Current Address Read  
S
R
E
A
D
T
A
R
T
S
T
O
P
DEVICE  
ADDRESS  
SDA LINE  
R
/
W
DATA  
M
S
B
A
C
K
N
O
L
S
B
A
C
K
RANDOM READ: A random read requires a dummybyte write sequence to load in the  
data word address. Once the device address word and data word address are clocked  
in and acknowledged by the EEPROM, the microcontroller must generate another start  
condition. The microcontroller now initiates a current address read by sending a device  
address with the read/write select bit high. The EEPROM acknowledges the device  
address and serially clocks out the data word. The microcontroller does not respond  
with a 0but does generate a following stop condition (see Figure 12).  
Figure 12. Random Read  
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
S
T
O
P
R
E
A
D
1st, 2nd WORD  
ADDRESS n  
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
0
SDA LINE  
M
S
B
DATA n  
P0  
A
C
K
L
S C  
B
A
A
C
K
N
O
R
/
W
K
A
C
K
DUMMY WRITE  
10  
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or  
a random address read. After the microcontroller receives a data word, it responds with  
an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to  
increment the data word address and serially clock out sequential data words. When the  
memory address limit is reached, the data word address will roll overand the sequen-  
tial read will continue. The sequential read operation is terminated when the  
microcontroller does not respond with a 0but does generate a following stop condition  
(see Figure 13)  
Figure 13. Sequential Read.  
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
S
T
O
P
R
E
A
D
1st, 2nd WORD  
ADDRESS n  
DEVICE  
ADDRESS  
DEVICE  
ADDRESS  
0
SDA LINE  
M
S
B
DATA n  
P0  
A
C
K
L
S C  
B
A
A
C
K
N
O
R
/
W
K
A
C
K
DUMMY WRITE  
11  
5045ASEEPR04/04  
AT24C32SC Ordering Information  
Ordering Code  
Package(1)  
Voltage Range  
2.7V5.5V  
Temperature Range  
Commercial (0°C70°C)  
Commercial (0°C70°C)  
Industrial (40°C85°C)  
AT24C1024SC-09AT  
AT24C1024SC-09BT  
AT24C1024SC-10WI  
M2 A Module  
M2 B Module  
7 mil Wafer  
2.7V5.5V  
2.7V5.5V  
Package Type(1)  
M2 A Module  
M2 B Module  
Description  
M2 ISO 7816 Smart Card Module  
M2 ISO 7816 Smart Card Module with Atmel Logo  
Note:  
1. Formal drawings may be obtained from an Atmel sales office.  
12  
AT24C1024SC  
5045ASEEPR04/04  
AT24C1024SC  
Smart Card Module  
Ordering Code: 09AT  
Ordering Code: 09BT  
Module Size: M2  
Module Size: M2  
Dimension*: 12.6 x 11.4 [mm]  
Glob Top: Square - 8.6 x 8.6 [mm]  
Thickness: 0.58 [mm] max.  
Pitch: 14.25 mm  
Dimension*: 12.6 x 11.4 [mm]  
Glob Top: Square - 8.6 x 8.6 [mm]  
Thickness: 0.58 [mm] max.  
Pitch: 14.25 mm  
Note:  
* 1  
The module dimensions listed refer to the dimensions of the exposed metal contact  
area. The actual dimensions of the module after excise or punching from the carrier tape  
are generally 0.4 mm greater in both directions (i.e., a punched M2 module will yield  
13.0 x 11.8 mm).  
13  
5045ASEEPR04/04  
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© Atmel Corporation 2003. All rights reserved. Atmel® and combinations thereof are registered trademarks,  
of Atmel Corporation or its subsidiaries. Other terms and product names may be the trademarks of others.  
Printed on recycled paper.  
5045ASEEPR04/04  

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