AT24C11-10TQ-2.7 [ATMEL]

EEPROM, 128X8, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153AA, TSSOP-8;
AT24C11-10TQ-2.7
型号: AT24C11-10TQ-2.7
厂家: ATMEL    ATMEL
描述:

EEPROM, 128X8, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153AA, TSSOP-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 ATM 异步传输模式 光电二极管 内存集成电路
文件: 总13页 (文件大小:534K)
中文:  中文翻译
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Features  
Low Voltage and Standard Voltage Operation: 2.7 (VCC = 2.7V to 5.5V)  
Internally Organized 128 x 8  
Two-wire Serial Interface  
Bidirectional Data Transfer Protocol  
1 MHz Compatibility  
4-Byte Page Write Mode  
Self-Timed Write Cycle (5 ms max)  
High Reliability  
Two-wire  
– Endurance: 1 Million Write Cycles  
– Data Retention: 100 Years  
Automotive  
Temperature  
Serial EEPROM  
1K (128 x 8)  
Automotive Grade and Lead-Free/Halogen-Free Devices Available  
8-lead JEDEC SOIC and 8-lead TSSOP Packages  
Description  
The AT24C11 provides 1024 bits of serial electrically erasable and programmable  
read only memory (EEPROM) organized as 128 words of 8 bits each. The device is  
optimized for use in many automotive applications where low power and low voltage  
operation are essential. The AT24C11 is available in space saving 8-lead JEDEC  
SOIC and 8-lead TSSOP packages and is accessed via a Two-wire serial interface. In  
addition, the entire family is available in 2.7V (2.7V to 5.5V).  
AT24C11  
Note: Not recommended for new  
design; please refer to  
AT24C01B Automotive  
datasheet.  
Table 0-1.  
Pin Name  
NC  
Pin Configuration  
Function  
No Connect  
SDA  
Serial Data  
SCL  
Serial Clock Input  
Test Input (GND or VCC)  
TEST  
8-lead TSSOP  
8-lead SOIC  
NC  
NC  
1
2
3
4
8
7
6
5
VCC  
TEST  
SCL  
NC  
NC  
1
8
7
6
5
VCC  
TEST  
SCL  
2
3
4
NC  
NC  
GND  
SDA  
GND  
SDA  
Rev. 5093E–SEEPR–8/07  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability.  
Operating Temperature..................................–55°C to +125°C  
Storage Temperature.....................................–65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground....................................1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Figure 0-1. Block Diagram  
VCC  
GND  
WP  
START  
SCL  
STOP  
LOGIC  
SDA  
SERIAL  
CONTROL  
LOGIC  
EN  
H.V. PUMP/TIMING  
DATA RECOVERY  
LOAD  
COMP  
DEVICE  
ADDRESS  
COMPARATOR  
LOAD  
INC  
A2  
A1  
A0  
R/W  
DATA WORD  
EEPROM  
ADDR/COUNTER  
Y DEC  
SERIAL MUX  
DOUT/ACK  
LOGIC  
DIN  
DOUT  
1. Pin Description  
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM  
device and negative edge clock data out of each device.  
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain  
driven and may be wire-ORed with any number of other open-drain or open collector devices.  
2
AT24C11  
5093E–SEEPR–8/07  
AT24C11  
2. Memory Organization  
AT24C11, 1K SERIAL EEPROM: Internally organized with 32 pages of 4 bytes each. The 1K  
requires a 7-bit data word address for random word addressing.  
Table 2-1.  
Pin Capacitance  
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +2.7V to +5.5V  
Symbol  
CI/O  
Test Condition  
Max  
8
Units  
pF  
Condition  
VI/O = 0V  
VIN = 0V  
Input/Output Capacitance (SDA)  
Input Capacitance (A0, A1, A2, SCL)  
CIN  
6
pF  
Table 2-2.  
DC Characteristics  
Applicable over recommended operating range from: TAE = 40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise  
noted)  
Symbol  
VCC1  
VCC2  
ICC  
Parameter  
Test Condition  
Min  
2.7  
4.5  
Typ  
Max  
5.5  
Units  
V
Supply Voltage  
Supply Voltage  
5.5  
V
Supply Current VCC = 5.0V  
Supply Current VCC = 5.0V  
Standby Current VCC = 1.8V  
Standby Current VCC = 2.5V  
Standby Current VCC = 2.7V  
Standby Current VCC = 5.0V  
Input Leakage Current  
Output Leakage Current  
Input Low Level(1)  
READ at 100 kHz  
WRITE at 100 kHz  
VIN = VCC or VSS  
VIN = VCC or VSS  
VIN = VCC or VSS  
VIN = VCC or VSS  
VIN = VCC or VSS  
VOUT = VCC or VSS  
0.4  
2.0  
1.0  
mA  
mA  
µA  
µA  
µA  
µA  
µA  
µA  
V
ICC  
3.0  
ISB1  
ISB2  
ISB3  
ISB4  
ILI  
0.6  
3.0  
1.4  
4.0  
1.6  
4.0  
8.0  
18.0  
3.0  
0.10  
0.05  
ILO  
3.0  
VIL  
–0.6  
VCC × 0.3  
VCC + 0.5  
0.4  
VIH  
Input High Level(1)  
VCC × 0.7  
V
VOL2  
VOL1  
Output Low Level VCC = 3.0V  
Output Low Level VCC = 1.8V  
IOL = 2.1 mA  
V
IOL = 0.15 mA  
0.2  
V
Note:  
1. VIL min and VIH max are reference only and are not tested.  
3
5093E–SEEPR–8/07  
Table 2-3.  
AC Characteristics  
Applicable over recommended operating range from TA = 40°C to +125°C, VCC = +2.7V to  
+5.5V, CL = 1 TTL Gate and 100 pF (unless otherwise noted)  
2.7V, 5.0V  
Symbol  
fSCL  
Parameter  
Min  
Max  
Units  
kHz  
µs  
Clock Frequency, SCL  
Clock Pulse Width Low  
Clock Pulse Width High  
Clock Low to Data Out Valid  
1000  
tLOW  
0.4  
0.4  
tHIGH  
tAA  
µs  
0.05  
0.55  
µs  
Time the bus must be free before a new  
transmission can start(1)  
tBUF  
0.5  
µs  
tHD.STA  
tSU.STA  
tHD.DAT  
tSU.DAT  
tR  
Start Hold Time  
0.25  
0.6  
0
µs  
µs  
µs  
ns  
µs  
ns  
µs  
ns  
ms  
Start Set-up Time  
Data In Hold Time  
Data In Set-up Time  
Inputs Rise Time(1)  
Inputs Fall Time(1)  
Stop Set-up Time  
Data Out Hold Time  
Write Cycle Time  
100  
0.3  
tF  
100  
tSU.STO  
tDH  
0.25  
50  
tWR  
5
Write  
Cycles  
Endurance(1)  
5.0V, 25°C, Page Mode  
1M  
Note:  
1. This parameter is ensured by characterization only.  
3. Device Operation  
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external  
device. Data on the SDA pin may change only during SCL low time periods (see Figure 3-3 on  
page 6). Data changes during SCL high periods will indicate a start or stop condition as defined  
below.  
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which  
must precede any other command (see Figure 3-4 on page 6).  
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition which ter-  
minates all communications. After a read sequence, the stop command will place the EEPROM  
in a standby power mode (see Figure 3-4 on page 6).  
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the  
EEPROM in 8-bit words. Any device on the system bus receiving data (when communicating  
with the EEPROM) must pull the SDA bus low to acknowledge that it has successfully received  
each word. This must happen during the ninth clock cycle after each word received and after all  
other system devices have freed the SDA bus. The EEPROM will likewise acknowledge by pull-  
ing SDA low after receiving each address or data word (see Figure 3-5 on page 6).  
4
AT24C11  
5093E–SEEPR–8/07  
AT24C11  
STANDBY MODE: The AT24C11 features a low power standby mode which is enabled: (a)  
upon power-up and (b) after the receipt of the STOP bit and the completion of any internal  
operations.  
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-wire part  
can be reset by following these steps:  
(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create  
a start condition as SDA is high.  
Figure 3-1. Bus Timing  
SCL: Serial Clock, SDA: Serial Data I/O  
tHIGH  
tF  
tR  
tLOW  
tLOW  
SCL  
tSU.STA  
tHD.STA  
tHD.DAT  
tSU.DAT  
tSU.STO  
SDA IN  
tAA  
tDH  
tBUF  
SDA OUT  
Figure 3-2. Write Cycle Timing  
SCL: Serial Clock, SDA: Serial Data I/O  
SCL  
SDA  
ACK  
8th BIT  
WORDn  
(1)  
t
wr  
START  
CONDITION  
STOP  
CONDITION  
Note:  
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.  
5
5093E–SEEPR–8/07  
Figure 3-3. Data Validity  
SDA  
SCL  
DATA STABLE  
DATA STABLE  
DATA  
CHANGE  
Figure 3-4. Start and Stop Definition  
SDA  
SCL  
START  
STOP  
Figure 3-5. Output Acknowledge  
SCL  
1
8
9
DATA IN  
DATA OUT  
START  
ACKNOWLEDGE  
6
AT24C11  
5093E–SEEPR–8/07  
AT24C11  
4. Write Operations  
BYTE WRITE: Following a start condition, a write operation requires a 7-bit data word address  
and a low write bit. Upon receipt of this address, the EEPROM will again respond with a zero  
and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM  
will output a zero and the addressing device, such as a microcontroller, must terminate the write  
sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle  
to the nonvolatile memory. All inputs are disabled during this write cycle, tWR, and the EEPROM  
will not respond until the write is complete (see refer to Figure 5-1 on page 8).  
PAGE WRITE: The AT24C11 is capable of a 4-byte page write.  
A page write is initiated the same as a byte write but the microcontroller does not send a stop  
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges  
receipt of the first data word, the microcontroller can transmit up to three more data words. The  
EEPROM will respond with a zero after each data word received. The microcontroller must ter-  
minate the page write sequence with a stop condition (see Figure 5-2 on page 8).  
The data word address lower 2 bits are internally incremented following the receipt of each data  
word. The higher five data word address bits are not incremented, retaining the memory page  
row location. When the word address, internally generated, reaches the page boundary, the fol-  
lowing byte is placed at the beginning of the same page. If more than four data words are  
transmitted to the EEPROM, the data word address will “roll over” and previous data will be  
overwritten. Access to 1 additional page is available upon request.  
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the  
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a  
start condition followed by the device address word. The read/write bit is representative of the  
operation desired. Only if the internal write cycle has completed will the EEPROM respond with  
a zero allowing the read or write sequence to continue.  
5. Read Operations  
Read operations are initiated the same way as write operations with the exception that the  
read/write select bit in the device address word is set to one. There are two read operations:  
byte read and sequential read.  
BYTE READ: A byte read is initiated with a start condition followed by a 7-bit data word address  
and a high read bit. The AT24C11 will respond with an acknowledge and then serially output 8  
data bits. The microcontroller does not respond with a zero but does generate a following stop  
condition (see Figure 5-3 on page 8).  
SEQUENTIAL READ: Sequential reads are initiated the same as a byte read. After the micro-  
controller receives an 8-bit data word, it responds with an acknowledge. As long as the  
EEPROM receives an acknowledge, it will continue to increment the data word address and  
serially clock out sequential data words. When the memory address limit is reached, the data  
word address will “roll over” and the sequential read will continue. The sequential read operation  
is terminated when the microcontroller does not respond with an input zero but does generate a  
following stop condition (see Figure 5-4 on page 8).  
7
5093E–SEEPR–8/07  
Figure 5-1. Byte Write  
Figure 5-2. Page Write  
Figure 5-3. Byte Read  
Figure 5-4. Sequential Read  
8
AT24C11  
5093E–SEEPR–8/07  
AT24C11  
AT24C11 Ordering Information  
Ordering Code  
Package  
Operation Range  
Lead-free/Halogen-free/  
Automotive Temperature  
AT24C11N-10SQ-2.7  
AT24C11-10TQ-2.7  
8S1  
8A2  
(–40°C to 85°C)  
Package Type  
8S1  
8A2  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)  
Options  
2.7  
Low-Voltage (2.7V to 5.5V)  
9
5093E–SEEPR–8/07  
Packaging Information  
8S1 – JEDEC SOIC  
C
1
E
E1  
L
N
Top View  
End View  
e
B
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.35  
0.10  
MAX  
1.75  
0.25  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
0.31  
0.17  
4.80  
3.81  
5.79  
0.51  
0.25  
5.00  
3.99  
6.20  
C
D
E1  
E
e
D
Side View  
1.27 BSC  
L
0.40  
0˚  
1.27  
8˚  
Note:  
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.  
10/7/03  
REV.  
TITLE  
DRAWING NO.  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
B
R
Small Outline (JEDEC SOIC)  
10  
AT24C11  
5093E–SEEPR–8/07  
AT24C11  
8A2 – TSSOP  
3
2 1  
Pin 1 indicator  
this corner  
E1  
E
L1  
N
L
Top View  
End View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
MAX  
NOM  
3.00  
NOTE  
SYMBOL  
D
2.90  
3.10  
2, 5  
A
b
E
6.40 BSC  
4.40  
E1  
A
4.30  
4.50  
1.20  
1.05  
0.30  
3, 5  
4
A2  
b
0.80  
0.19  
1.00  
e
A2  
D
e
0.65 BSC  
0.60  
L
0.45  
0.75  
Side View  
L1  
1.00 REF  
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,  
datums, etc.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm  
(0.010 in) per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the  
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
5/30/02  
DRAWING NO.  
TITLE  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8A2, 8-lead, 4.4 mm Body, Plastic  
Thin Shrink Small Outline Package (TSSOP)  
B
8A2  
R
11  
5093E–SEEPR–8/07  
Revision History  
Doc. Rev.  
Date  
Comments  
Updated to new Template  
Updated common figures  
Added Note to first page  
5093E  
8/2007  
Removed PDIP package offering  
Removed PB parts  
5093D  
5093C  
1/2007  
9/2006  
Revision history implemented; Removed  
‘Preliminary’ status from datasheet.  
12  
AT24C11  
5093E–SEEPR–8/07  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
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Hong Kong  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
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Le Krebs  
Atmel Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
Tel: (81) 3-3523-3551  
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8, Rue Jean-Pierre Timbaud  
BP 309  
78054 Saint-Quentin-en-  
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Tel: (33) 1-30-60-70-00  
Fax: (33) 1-30-60-71-11  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
s_eeprom@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
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5093E–SEEPR–8/07  

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