AT49F020-15PL [ATMEL]
Flash, 256KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32;型号: | AT49F020-15PL |
厂家: | ATMEL |
描述: | Flash, 256KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 ATM 异步传输模式 光电二极管 内存集成电路 |
文件: | 总12页 (文件大小:337K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• Single Voltage Operation
– 5V Read
– 5V Reprogramming
• Fast Read Access Time - 90 ns
• Internal Program Control and Timer
• 8K Bytes Boot Block With Lockout
• Fast Erase Cycle Time - 10 seconds
• Byte-By-Byte Programming - 50 µs/Byte
• Hardware Data Protection
• DATA Polling For End Of Program Detection
• Low Power Dissipation
– 50 mA Active Current
– 100 µA CMOS Standby Current
• Typical 10,000 Write Cycles
2-Megabit
(256K x 8)
5-volt Only
Flash Memory
Description
The AT49F020 is a 5-volt only in-system Flash Memory. Its 2 megabits of memory is
organized as 262,144 words by 8 bits. Manufactured with Atmel’s advanced nonvola-
tile CMOS technology, the device offers access times to 90 ns with power dissipation
of just 275 mW over the commercial temperature range. When the device is dese-
lected, the CMOS standby current is less than 100 µA.
AT49F020
To allow for simple in-system reprogrammability, the AT49F020 does not require high
input voltages for programming. Five-volt-only commands determine the read and
programming operation of the device. Reading data out of the device is similar to
reading from an EPROM. Reprogramming the AT49F020 is performed by erasing the
entire 2 megabits of memory and then programming on a byte by byte basis. The byte
(continued)
Not Recommended
for New Design
Contact Atmel to discuss
the latest design in trends
and options
Pin Configurations
PLCC Top View
Pin Name
A0 - A17
CE
Function
Addresses
A7
A6
A5
A4
A3
5
6
7
8
9
29 A14
28 A13
27 A8
26 A9
25 A11
24 OE
23 A10
22 CE
21 I/O7
Chip Enable
Output Enable
Write Enable
Data Inputs/Outputs
No Connect
OE
A2 10
A1 11
A0 12
I/O0 13
WE
I/O0 - I/O7
NC
TSOP Top View
DIP Top View
Type 1
NC
A16
A15
A12
A7
1
2
3
4
5
6
7
8
9
32 VCC
31 WE
30 A17
29 A14
28 A13
27 A8
A11
A9
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
2
A10
CE
A8
3
A6
A13
A14
A17
WE
VCC
NC
A16
A15
A12
A7
4
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A5
26 A9
5
A4
25 A11
24 OE
23 A10
22 CE
21 I/O7
20 I/O6
19 I/O5
18 I/O4
17 I/O3
6
A3
7
A2 10
A1 11
8
9
A0 12
10
11
12
13
14
15
16
I/O0 13
I/O1 14
I/O2 15
GND 16
A6
A1
A5
A2
Rev. 0567C–10/98
A4
A3
1
programming time is a fast 50 µs. The end of a program
cycle can be optionally detected by the DATA polling fea-
ture. Once the end of a byte program cycle has been
detected, a new access for a read or program can begin.
The typical number of program and erase cycles is in
excess of 10,000 cycles.
The optional 8K bytes boot block section includes a repro-
gramming write lock out feature to provide data integrity.
The boot sector is designed to contain user secure code,
and when the feature is enabled, the boot sector is perma-
nently protected from being reprogrammed.
Block Diagram
DATA INPUTS/OUTPUTS
I/O0 - I/O7
VCC
GND
OE
DATA LATCH
OE, CE AND WE
WE
LOGIC
CE
INPUT/OUTPUT
BUFFERS
Y DECODER
ADDRESS
Y-GATING
3FFFF
MAIN MEMORY
INPUTS
X DECODER
(248K BYTES)
02000
01FFF
OPTIONAL BOOT
BLOCK (8K BYTES)
00000
Device Operation
READ: The AT49F020 is accessed like an EPROM. When
CE and OE are low and WE is high, the data stored at the
memory location determined by the address pins is
asserted on the outputs. The outputs are put in the high
impedance state whenever CE or OE is high. This dual-line
control gives designers flexibility in preventing bus conten-
tion.
latched on the rising edge of WE or CE, whichever occurs
first. Programming is completed after the specified tBP cycle
time. The DATA polling feature may also be used to indi-
cate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT: The device
has one designated block that has a programming lockout
feature. This feature prevents programming of data in the
designated block once the feature has been enabled. The
size of the block is 8K bytes. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enabling the lockout feature will allow the boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be acti-
vated; the boot block’s usage as a write protected region is
optional to the user. The address range of the boot block is
00000H to 01FFFH.
ERASURE: Before a byte can be reprogrammed, the 256K
bytes memory array (or 248K bytes if the boot block fea-
tured is used) must be erased. The erased state of the
memory bits is a logical “1”. The entire device can be
erased at one time by using a 6-byte software code. The
software chip erase code consists of 6-byte load com-
mands to specific address locations with a specific data
pattern (please refer to the Chip Erase Cycle Waveforms).
After the software chip erase has been initiated, the device
will internally time the erase operation so that no external
clocks are required. The maximum time needed to erase
the whole chip is tEC. If the boot block lockout feature has
been enabled, the data in the boot sector will not be
erased.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed. Data in the main
memory block can still be changed through the regular pro-
gramming method. To activate the lockout feature, a series
of six program commands to specific addresses with spe-
cific data must be performed. Please refer to the Command
Definitions table.
BYTE PROGRAMMING: Once the memory array is
erased, the device is programmed (to a logical “0”) on a
byte-by-byte basis. Please note that a data “0” cannot be
programmed back to a “1”; only erase operations can con-
vert “0”s to “1”s. Programming is accomplished via the
internal device command register and is a 4 bus cycle
operation (please refer to the Command Definitions table).
The device will automatically generate the required internal
program pulses.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine if programming of the boot
block section is locked out. When the device is in the soft-
ware product identification mode (see Software Product
Identification Entry and Exit sections) a read from address
location 00002H will show if programming the boot block is
locked out. If the data on I/O0 is low, the boot block can be
programmed; if the data on I/O0 is high, the program lock-
out feature has been activated and the block cannot be
The program cycle has addresses latched on the falling
edge of WE or CE, whichever occurs last, and the data
AT49F020
2
AT49F020
programmed. The software product identification code
should be used to return to standard operation.
TOGGLE BIT: In addition to DATA polling the AT49F020
provides another method for determining the end of a pro-
gram or erase cycle. During a program or erase operation,
successive attempts to read data from the device will result
in I/O6 toggling between one and zero. Once the program
cycle has completed, I/O6 will stop toggling and valid data
will be read. Examining the toggle bit may begin at any time
during a program cycle.
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the AT49F020 in
the following ways: (a) VCC sense—if VCC is below 3.8V
(typical), the program function is inhibited; (b) Program
inhibit—holding any one of OE low, CE high or WE high
inhibits program cycles; and (c) Noise filter—pulses of less
than 15 ns (typical) on the WE or CE inputs will not initiate
a program cycle.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING: The AT49F020 features DATA polling to
indicate the end of a program cycle. During a program
cycle an attempted read of the last byte loaded will result in
the complement of the loaded data on I/O7. Once the pro-
gram cycle has been completed, true data is valid on all
outputs and the next cycle may begin. DATA polling may
begin at any time during the program cycle.
Command Definition (in Hex)
Command
Sequence
Bus
Cycles
1st Bus
Cycle
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Addr
Data
DOUT
AA
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Read
1
6
4
Addr
5555
5555
Chip Erase
2AAA
2AAA
55
55
5555
5555
80
A0
5555
Addr
AA
DIN
2AAA
2AAA
55
5555
5555
10
Byte
AA
Program
Boot Block
Lockout(1)
6
3
3
1
5555
5555
5555
XXXX
AA
AA
AA
F0
2AAA
2AAA
2AAA
55
55
55
5555
5555
5555
80
90
F0
5555
AA
55
40
Product ID
Entry
Product ID
Exit(2)
Product ID
Exit(2)
Notes: 1. The 8K byte boot sector has the address range 00000H to 01FFFH.
2. Either one of the Product ID exit commands can be used.
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
All Input Voltages (including NC Pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground.............................-0.6V to VCC + 0.6V
Voltage on OE
with Respect to Ground...................................-0.6V to +13.5V
3
DC and AC Operating Range
AT49F020-90
0°C - 70°C
AT49F020-12
0°C - 70°C
AT49F020-15
0°C - 70°C
Com.
Operating
Temperature (Case)
Ind.
-40°C - 85°C
5V ± 10%
-40°C - 85°C
5V ± 10%
-40°C - 85°C
5V ± 10%
VCC Power Supply
Operating Modes
Mode
CE
VIL
VIL
VIH
X
OE
VIL
VIH
X(1)
X
WE
VIH
VIL
X
Ai
Ai
Ai
X
I/O
Read
DOUT
DIN
Program(2)
Standby/Write Inhibit
Program Inhibit
Program Inhibit
Output Disable
Product Identification
High Z
VIH
X
X
VIL
VIH
X
X
High Z
A1 - A17 = VIL, A9 = VH,(3) A0 = VIL
A1 - A17 = VIL, A9 = VH,(3) A0 = VIH
A0 = VIL, A1 - A17=VIL
Manufacturer Code(4)
Device Code(4)
Hardware
VIL
VIL
VIH
Manufacturer Code(4)
Device Code(4)
Software(5)
A0 = VIH, A1 - A17=VIL
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
4. Manufacturer Code: 1FH, Device Code: 0BH.
5. See details under Software Product Identification Entry/Exit.
DC Characteristics
Symbol
Parameter
Condition
Min
Max
Units
µA
µA
µA
µA
mA
mA
V
ILI
Input Load Current
Output Leakage Current
VIN = 0V to VCC
VI/O = 0V to VCC
10
10
ILO
Com.
Ind.
100
300
3
ISB1
VCC Standby Current CMOS
CE = VCC - 0.3V to VCC
ISB2
VCC Standby Current TTL
VCC Active Current
CE = 2.0V to VCC
(1)
ICC
f = 5 MHz; IOUT = 0 mA
50
VIL
Input Low Voltage
0.8
VIH
Input High Voltage
2.0
V
VOL
VOH1
VOH2
Output Low Voltage
Output High Voltage
Output High Voltage CMOS
IOL = 2.1 mA
0.45
V
IOH = -400 µA
2.4
4.2
V
IOH = -100 µA; VCC = 4.5V
V
Note:
1. In the erase mode, ICC is 90 mA.
AT49F020
4
AT49F020
AC Read Characteristics
AT49F020-90
Min Max
AT49F020-12
AT49F020-15
Symbol
Parameter
Min
Max
Min
Max
Units
ns
tACC
Address to Output Delay
CE to Output Delay
OE to Output Delay
CE or OE to Output Float
90
90
40
25
120
120
50
150
150
70
(1)
tCE
ns
(2)
tOE
0
0
0
0
0
0
ns
(3)(4)
tDF
30
40
ns
Output Hold from OE, CE or
Address, whichever occurred first
tOH
0
0
0
ns
AC Read Waveforms(1)(2)(3)(4)
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC
.
.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveforms and
Measurement Level
Output Test Load
tR, tF < 5 ns
Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
CIN
Typ
4
Max
6
Units
pF
Conditions
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. This parameter is characterized and is not 100% tested.
5
AC Byte Load Characteristics
Symbol
Parameter
Min
0
Max
Units
ns
t
AS, tOES
Address, OE Set-up Time
Address Hold Time
tAH
tCS
tCH
tWP
tDS
50
0
ns
Chip Select Set-up Time
Chip Select Hold Time
Write Pulse Width (WE or CE)
Data Set-up Time
ns
0
ns
90
50
0
ns
ns
t
DH, tOEH
Data, OE Hold Time
Write Pulse Width High
ns
tWPH
90
ns
AC Byte Load Waveforms
WE Controlled
CE Controlled
AT49F020
6
AT49F020
Program Cycle Characteristics
Symbol
Parameter
Min
Typ
Max
Units
µs
tBP
Byte Programming Time
Address Set-up Time
Address Hold Time
Data Set-up Time
Data Hold Time
10
50
tAS
0
ns
tAH
50
50
0
ns
tDS
ns
tDH
ns
tWP
Write Pulse Width
Write Pulse Width High
Erase Cycle Time
90
90
ns
tWPH
tEC
ns
10
seconds
Program Cycle Waveforms
Chip Erase Cycle Waveforms
Note:
1. OE must be high only when WE and CE are both low.
7
Data Polling Characteristics(1)
Symbol
Parameter
Min
10
Typ
Max
Units
ns
tDH
Data Hold Time
tOEH
tOE
OE Hold Time
10
ns
OE to Output Delay(2)
Write Recovery Time
ns
tWR
0
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
Toggle Bit Characteristics(1)
Symbol
Parameter
Min
10
Typ
Max
Units
ns
tDH
Data Hold Time
OE Hold Time
tOEH
tOE
tOEHP
tWR
10
ns
OE to Output Delay(2)
ns
OE High Pulse
150
0
ns
Write Recovery Time
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling
input(s).
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
AT49F020
8
AT49F020
Software Product Identification Entry(1) Boot Block Lockout
Feature Enable Algorithm(1)
LOAD DATA AA
TO
LOAD DATA AA
TO
ADDRESS 5555
ADDRESS 5555
LOAD DATA 55
TO
LOAD DATA 55
TO
ADDRESS 2AAA
ADDRESS 2AAA
LOAD DATA 90
TO
LOAD DATA 80
TO
ADDRESS 5555
ADDRESS 5555
ENTER PRODUCT
IDENTIFICATION
MODE(2)(3)(5)
LOAD DATA AA
TO
ADDRESS 5555
Software Product Identification Exit(1)
LOAD DATA 55
TO
LOAD DATA AA
TO
OR
LOAD DATA F0
TO
ADDRESS 2AAA
ADDRESS 5555
ANY ADDRESS
LOAD DATA 40
TO
LOAD DATA 55
TO
EXIT PRODUCT
IDENTIFICATION
MODE(4)
ADDRESS 5555
ADDRESS 2AAA
PAUSE 1 second(2)
LOAD DATA F0
TO
ADDRESS 5555
Notes for boot block lockout feature enable:
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
EXIT PRODUCT
IDENTIFICATION
MODE(4)
2. Boot block lockout feature enabled.
Notes for software product identification:
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. A1 - A17 = VIL.
Manufacturer Code is read for A0 = VIL;
Device Code is read for A0 = VIH.
3. The device does not remain in identification mode if
powered down.
4. The device returns to standard operation mode.
5. Manufacturer Code is 1FH. The Device Code is
0BH.
9
Ordering Information(1)
ICC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
90
50
0.1
AT49F020-90JC
AT49F020-90PC
AT49F020-90TC
32J
Commercial
32P6
32T
(0° to 70°C)
50
50
50
50
50
0.3
0.1
0.3
0.1
0.3
AT49F020-90JI
AT49F020-90PI
AT49F020-90TI
32J
Industrial
32P6
32T
(-40° to 85°C)
120
150
AT49F020-12JC
AT49F020-12PC
AT49F020-12TC
32J
Commercial
32P6
32T
(0° to 70°C)
AT49F020-12JI
AT49F020-12PI
AT49F020-12TI
32J
Industrial
32P6
32T
(-40° to 85°C)
AT49F020-15JC
AT49F020-15PC
AT49F020-15TC
32J
Commercial
32P6
32T
(0° to 70°C)
AT49F020-15JI
AT49F020-15PI
AT49F020-15TI
32J
Industrial
32P6
32T
(-40° to 85°C)
Note:
1. The AT49F020 has an optional boot block feature. The part number shown in the Ordering Information table is for devices
with the boot block in the lower address range (i.e., 00000H to 01FFFH). Users requiring the boot block to be in the higher
address range should contact Atmel.
Package Type
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32J
32P6
32T
AT49F020
10
AT49F020
Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC OUTLINE MS-016 AE
32P6, 32-Lead, 0.600" Wide, Plastic Dual Inline
Package (PDIP)
Dimensions in Inches and (Millimeters)
1.67(42.4)
1.64(41.7)
PIN
1
.025(.635) X 30˚ - 45˚
.045(1.14) X 45˚ PIN NO. 1
.012(.305)
IDENTIFY
.008(.203)
.566(14.4)
.530(13.5)
.530(13.5)
.553(14.0)
.490(12.4)
.547(13.9)
.032(.813)
.026(.660)
.021(.533)
.013(.330)
.595(15.1)
.585(14.9)
.090(2.29)
MAX
1.500(38.10) REF
.030(.762)
.015(.381)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.050(1.27) TYP
.220(5.59)
MAX
.005(.127)
MIN
.300(7.62) REF
.430(10.9)
.390(9.90)
SEATING
PLANE
AT CONTACT
POINTS
.065(1.65)
.015(.381)
.022(.559)
.014(.356)
.161(4.09)
.125(3.18)
.065(1.65)
.041(1.04)
.110(2.79)
.090(2.29)
.022(.559) X 45˚ MAX (3X)
.630(16.0)
.590(15.0)
.453(11.5)
.447(11.4)
0
15
REF
.495(12.6)
.485(12.3)
.012(.305)
.008(.203)
.690(17.5)
.610(15.5)
32T, 32-Lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*
JEDEC OUTLINE MO-142 BD
INDEX
MARK
18.5(.728)
18.3(.720)
20.2(.795)
19.8(.780)
0.50(.020)
BSC
0.25(.010)
0.15(.006)
7.50(.295)
REF
8.20(.323)
7.80(.307)
1.20(.047) MAX
0.15(.006)
0.05(.002)
0
0.20(.008)
0.10(.004)
REF
5
0.70(.028)
0.50(.020)
*Controlling dimension: millimeters
11
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http://www.atmel.com
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1-(408) 436-4309
© Atmel Corporation 1998.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war-
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®
™
Marks bearing and/or are registered trademarks and trademarks of Atmel Corporation.
Terms and product names in this document may be trademarks of others.
Printed on recycled paper.
0567C–10/98/xM
相关型号:
SI9130DB
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