AT49LV002NT-12JI [ATMEL]
2-Megabit 256K x 8 Single 2.7-Volt Battery-Voltage Flash Memory; 2兆位256K ×8单2.7伏的电池电压闪存
| 型号： | AT49LV002NT-12JI |
| 厂家： | 
ATMEL |
| 描述： | 2-Megabit 256K x 8 Single 2.7-Volt Battery-Voltage Flash Memory |
| 文件： | 总20页 (文件大小：174K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Single Supply for Read and Write: 2.7V to 3.6 (BV), 3.0 to 3.6V (LV)
• Fast Read Access Time - 70 ns
• Internal Program Control and Timer
• Sector Architecture
– One 16K Byte Boot Block with Programming Lockout
– Two 8K Byte Parameter Blocks
– Two Main Memory Blocks (96K, 128K) Bytes
• Fast Erase Cycle Time - 10 seconds
• Byte By Byte Programming - 30 µs/Byte Typical
• Hardware Data Protection
• DATA Polling For End Of Program Detection
• Low Power Dissipation
2-Megabit
(256K x 8)
– 25 mA Active Current
– 50 µA CMOS Standby Current
Single 2.7-Volt
Battery-Voltage™
Flash Memory
• Typical 10,000 Write Cycles
Description
The AT49BV/LV002(N)(T) is a 3-volt-only in-system reprogrammable Flash Memory.
Its 2 megabits of memory is organized as 262,144 words by 8 bits. Manufactured with
Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 70
ns with power dissipation of just 90 mW over the commercial temperature range.
When the device is deselected, the CMOS standby current is less than 50 µA. For the
AT49BV002
(continued)
AT49LV002
DIP Top View
Pin Configurations
AT49BV002N
AT49LV002N
AT49BV002T
AT49LV002T
AT49BV002NT
AT49LV002NT
*RESET
A16
A15
A12
A7
1
2
3
4
5
6
7
8
9
32 VCC
31 WE
30 A17
29 A14
28 A13
27 A8
Pin Name
A0 - A17
CE
Function
Addresses
A6
Chip Enable
Output Enable
Write Enable
RESET
A5
26 A9
A4
25 A11
24 OE
23 A10
22 CE
21 I/O7
20 I/O6
19 I/O5
18 I/O4
17 I/O3
OE
A3
A2 10
A1 11
WE
A0 12
I/O0 13
I/O1 14
I/O2 15
GND 16
RESET
I/O0 - I/O7
DC
Data Inputs/Outputs
Don’t Connect
VSOP Top View (8 x 14 mm) or
TSOP Top View (8 x 20 mm)
Type 1
PLCC Top View
A11
A9
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
2
A10
CE
A8
3
A13
A14
A17
WE
4
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A7
A6
A5
A4
A3
5
6
7
8
9
29 A14
28 A13
27 A8
26 A9
25 A11
24 OE
23 A10
22 CE
21 I/O7
5
6
7
VCC
*RESET
A16
A15
A12
A7
8
9
10
11
12
13
14
15
16
A2 10
A1 11
A0 12
I/O0 13
A6
A1
A5
A2
A4
A3
Rev. 0982C–07/98
*Note: This pin is a DC on the AT49BV002N(T) and AT49LV002N(T).
AT49BV/LV002N(T) pin 1 for the DIP and PLCC packages
and pin 9 for the TSOP package are don’t connect pins.
The device is erased by executing the erase command
sequence; the device internally controls the erase opera-
tions. There are two 8K byte parameter block sections and
two main memory blocks.
To allow for simple in-system reprogrammability, the
AT49BV/LV002(N)(T) does not require high input voltages
for programming. Five-volt-only commands determine the
read and programming operation of the device. Reading
data out of the device is similar to reading from an EPROM;
it has standard CE, OE, and WE inputs to avoid bus con-
tention. Reprogramming the AT49BV/LV002(N)(T) is per-
formed by erasing a block of data and then programming
on a byte by byte basis. The byte programming time is a
fast 50 µs. The end of a program cycle can be optionally
detected by the DATA polling feature. Once the end of a
byte program cycle has been detected, a new access for a
read or program can begin. The typical number of program
and erase cycles is in excess of 10,000 cycles.
The device has the capability to protect the data in the boot
block; this feature is enabled by a command sequence.
The 16K-byte boot block section includes a reprogramming
lock out feature to provide data integrity. The boot sector is
designed to contain user secure code, and when the fea-
ture is enabled, the boot sector is protected from being
reprogrammed.
In the AT49BV/LV002N(T), once the boot block program-
ming lockout feature is enabled, the contents of the boot
block are permanent and cannot be changed. In the
AT49BV/LV002(T), once the boot block programming lock-
out feature is enabled, the contents of the boot block can-
not be changed with input voltage levels of 5.5 volts or less.
Block Diagram
AT49BV/LV002(N)
DATA INPUTS/OUTPUTS
AT49BV/LV002(N)T
DATA INPUTS/OUTPUTS
I/O7 - I/O0
I/O7 - I/O0
V
CC
8
8
GND
INPUT/OUTPUT
BUFFERS
INPUT/OUTPUT
BUFFERS
OE
WE
CONTROL
LOGIC
CE
PROGRAM
PROGRAM
RESET
DATA LATCHES
DATA LATCHES
Y DECODER
X DECODER
Y-GATING
Y-GATING
3FFFF
3FFFF
ADDRESS
INPUTS
MAIN MEMORY
BLOCK 2
BOOT BLOCK
(16K BYTES)
3C000
3BFFF
(128K BYTES)
20000
1FFFF
PARAMETER
BLOCK 1
MAIN MEMORY
BLOCK 1
(8K BYTES)
3A000
39FFF
(96K BYTES)
08000
07FFF
PARAMETER
BLOCK 2
PARAMETER
BLOCK 2
(8K BYTES)
38000
37FFF
(8K BYTES)
06000
05FFF
MAIN MEMORY
BLOCK 1
PARAMETER
BLOCK 1
(96K BYTES)
20000
1FFFF
(8K BYTES)
04000
03FFF
MAIN MEMORY
BLOCK 2
BOOT BLOCK
(16K BYTES)
(128K BYTES)
00000
00000
AT49BV/LV002(N)(T)
2
AT49BV/LV002(N)(T)
Device Operation
READ: The AT49BV/LV002(N)(T) is accessed like an
EPROM. When CE and OE are low and WE is high, the
data stored at the memory location determined by the
address pins is asserted on the outputs. The outputs are
put in the high impedance state whenever CE or OE is
high. This dual-line control gives designers flexibility in pre-
venting bus contention.
CHIP ERASE: If the boot block lockout has been enabled,
the Chip Erase function will erase Parameter Block 1,
Parameter Block 2, Main Memory Block 1, and Main Mem-
ory Block 2 but not the boot block. If the Boot Block Lockout
has not been enabled, the Chip Erase function will erase
the entire chip. After the full chip erase the device will
return back to read mode. Any command during chip erase
will be ignored.
COMMAND SEQUENCES: When the device is first pow-
ered on it will be reset to the read or standby mode
depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command
sequences are shown in the Command Definitions table.
The command sequences are written by applying a low
pulse on the WE or CE input with CE or WE low (respec-
tively) and OE high. The address is latched on the falling
edge of CE or WE, whichever occurs last. The data is
latched by the first rising edge of CE or WE. Standard
microprocessor write timings are used. The address loca-
tions used in the command sequences are not affected by
entering the command sequences.
SECTOR ERASE: As an alternative to a full chip erase, the
device is organized into sectors that can be individually
erased. There are two 8K-byte parameter block sections
and two main memory blocks. The 8K-byte parameter
block sections can be independently erased and repro-
grammed. The two main memory sections are designed to
be used as alternative memory sectors. That is, whenever
one of the blocks has been erased and reprogrammed, the
other block should be erased and reprogrammed before
the first block is again erased. The Sector Erase command
is a six bus cycle operation. The sector address is latched
on the falling WE edge of the sixth cycle while the 30H data
input command is latched at the rising edge of WE. The
sector erase starts after the rising edge of WE of the sixth
cycle. The erase operation is internally controlled; it will
automatically time to completion.
RESET: A RESET input pin is provided to ease some sys-
tem applications. When RESET is at a logic high level, the
device is in its standard operating mode. A low level on the
RESET input halts the present device operation and puts
the outputs of the device in a high impedance state. If the
RESET pin makes a high to low transition during a program
or erase operation, the operation may not be sucessfully
completed and the operation will have to be repeated after
a high level is applied to the RESET pin. When a high level
is reasserted on the RESET pin, the device returns to the
read or standby mode, depending upon the state of the
control inputs. By applying a 12V ± 0.5V input signal to the
RESET pin, the boot block array can be reprogrammed
even if the boot block lockout feature has been enabled
(see Boot Block Programming Lockout Override section).
The RESET feature is not available on the
AT49BV/LV002N(T).
BYTE PROGRAMMING: Once the memory array is
erased, the device is programmed (to a logical “0”) on a
byte-by-byte basis. Please note that a data “0” cannot be
programmed back to a “1”; only erase operations can con-
vert “0”s to “1”s. Programming is accomplished via the
internal device command register and is a 4 bus cycle
operation (please refer to the Command Definitions table).
The device will automatically generate the required internal
program pulses.
The program cycle has addresses latched on the falling
edge of WE or CE, whichever occurs last, and the data
latched on the rising edge of WE or CE, whichever occurs
first. Programming is completed after the specified tBP cycle
time. The DATA polling feature may also be used to indi-
cate the end of a program cycle.
ERASURE: Before a byte can be reprogrammed, the main
memory block or parameter block which contains the byte
must be erased. The erased state of the memory bits is a
logical “1”. The entire device can be erased at one time by
using a 6-byte software code. The software chip erase
code consists of 6-byte load commands to specific address
locations with a specific data pattern (please refer to the
Chip Erase Cycle Waveforms).
BOOT BLOCK PROGRAMMING LOCKOUT: The device
has one designated block that has a programming lockout
feature. This feature prevents programming of data in the
designated block once the feature has been enabled. The
size of the block is 16K bytes. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enabling the lockout feature will allow the boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be acti-
vated; the boot block’s usage as a write protected region is
optional to the user. The address range of the boot block is
00000 to 03FFF for the AT49BV/LV002(N) while the
After the software chip erase has been initiated, the device
will internally time the erase operation so that no external
clocks are required. The maximum time needed to erase
the whole chip is tEC. If the boot block lockout feature has
been enabled, the data in the boot sector will not be
erased.
3
address range of the boot block is 3C000 to 3FFFF for the
AT49BV/LV002(N)T.
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed with input voltage of
5.5V or less. Data in the main memory block can still be
changed through the regular programming method. To acti-
vate the lockout feature, a series of six program commands
to specific addresses with specific data must be performed.
Please refer to the Command Definitions table.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING: The AT49BV/LV002(N)(T) features
DATA polling to indicate the end of a program cycle. During
a program cycle an attempted read of the last byte loaded
will result in the complement of the loaded data on I/O7.
Once the program cycle has been completed, true data is
valid on all outputs and the next cycle may begin. DATA
polling may begin at any time during the program cycle.
BOOT BLOCK LOCKOUT DETECTION: A software
method is available to determine if programming of the boot
block section is locked out. When the device is in the soft-
ware product identification mode (see Software Product
Identification Entry and Exit sections) a read from address
location 00002H will show if programming the boot block is
locked out for the AT49BV/LV002(N), and a read from
address location 3C002H will show if programming the
bootblock is locked out for AT49BV/LV002(N)T. If the data
on I/O0 is low, the boot block can be programmed; if the
data on I/O0 is high, the program lockout feature has been
activated and the block cannot be programmed. The soft-
ware product identification code should be used to return to
standard operation.
TOGGLE BIT: In addition to DATA polling the
AT49BV/LV002(N)(T) provides another method for deter-
mining the end of a program or erase cycle. During a pro-
gram or erase operation, successive attempts to read data
from the device will result in I/O6 toggling between one and
zero. Once the program cycle has completed, I/O6 will stop
toggling and valid data will be read. Examining the toggle
bit may begin at any time during a program cycle.
HARDWARE DATA PROTECTION: Hardware features
protect against inadvertent programs to the
AT49BV/LV002(N)(T) in the following ways: (a) VCC sense:
if VCC is below 1.8V (typical), the program function is inhib-
ited. (b) Program inhibit: holding any one of OE low, CE
high or WE high inhibits program cycles. (c) Noise filter:
pulses of less than 15 ns (typical) on the WE or CE inputs
will not initiate a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE:
The user can override the boot block programming lockout
by taking the RESET pin to 12 volts during the entire chip
erase, sector erase or byte programming operation. When
the RESET pin is brought back to TTL levels the boot block
programming lockout feature is again active. This feature is
not available on the AT49BV/LV002N(T).
PRODUCT IDENTIFICATION: The product identification
mode identifies the device and manufacturer as Atmel. It
AT49BV/LV002(N)(T)
4
AT49BV/LV002(N)(T)
Command Definition (in Hex)(1)
1st Bus
Cycle
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Command
Sequence
Bus
Cycles
Addr
Addr
5555
5555
5555
5555
5555
5555
XXXX
Data
DOUT
AA
Addr Data Addr Data Addr Data Addr Data Addr Data
Read
1
6
6
4
6
3
3
1
Chip Erase
2AAA
2AAA
2AAA
2AAA
2AAA
2AAA
55
55
55
55
55
55
5555
5555
5555
5555
5555
5555
80
80
A0
80
90
F0
5555
5555
Addr
5555
AA
AA
DIN
AA
2AAA
2AAA
55
55
5555
SA(4)
10
30
Sector Erase
AA
Byte Program
Boot Block Lockout(2)
Product ID Entry
Product ID Exit(3)
Product ID Exit(3)
AA
AA
2AAA
55
5555
40
AA
AA
F0
Notes: 1. The DATA FORMAT in each bus cycle is as follows: I/O7 - I/O0 (Hex)
2. The 16K byte boot sector has the address range 00000H to 03FFFH for the AT49BV/LV002(N) and 3C000H to 3FFFFH for
the AT49BV/LV002(N)T
3. Either one of the Product ID Exit commands can be used.
4. SA = sector addresses:
For the AT49BV/LV002(N):
SA = 00000 to 03FFF for BOOT BLOCK
Nothing will happen and the device goes back to the read mode in 100 ns
SA = 04000 to 05FFF for PARAMETER BLOCK 1
SA = 06000 to 07FFF for PARAMETER BLOCK 2
SA = 08000 to 1FFFF for MAIN MEMORY ARRAY BLOCK 1
This command will erase - PB1, PB2 and MMB1
SA = 20000 to 3FFFF for MAIN MEMORY ARRAY BLOCK 2
For the AT49BV/LV002(N)T:
SA = 3C000 to 3FFFF for BOOT BLOCK
Nothing will happen and the device goes back to the read mode in 100 ns
SA = 3A000 to 3BFFF for PARAMETER BLOCK 1
SA = 38000 to 39FFF for PARAMETER BLOCK 2
SA = 20000 to 37FFF for MAIN MEMORY ARRAY BLOCK 1
This command will erase - PB1, PB2 and MMB1
SA = 00000 to IFFFF for MAIN MEMORY ARRAY BLOCK 2
Absolute Maximum Ratings
*NOTICE:
Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other condi-
tions beyond those indicated in the operational sec-
tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground.............................-0.6V to VCC + 0.6V
Voltage on OE
with Respect to Ground...................................-0.6V to +13.5V
5
DC and AC Operating Range
AT49LV002(N)(T)-70
AT49BV/LV002(N)(T)-90
0°C - 70°C
AT49BV/LV002(N)(T)-12
0°C - 70°C
Com.
Ind.
0°C - 70°C
-40°C - 85°C
3.0V - 3.6V
Operating
Temperature (Case)
-40°C - 85°C
-40°C - 85°C
V
CC Power Supply
2.7V - 3.6V/3.0V - 3.6V
2.7V - 3.6V/3.0V - 3.6V
Operating Modes
Ai
Ai
Ai
X
Mode
CE
VIL
VIL
VIH
X
OE
VIL
VIH
X(1)
X
WE
VIH
VIL
X
RESET(6)
I/O
Read
VIH
VIH
VIH
VIH
VIH
VIH
VIL
DOUT
DIN
Program/Erase(2)
Standby/Write Inhibit
Program Inhibit
Program Inhibit
Output Disable
Reset
High Z
VIH
X
X
VIL
VIH
X
X
X
High Z
High Z
X
X
X
Product Identification
A1 - A17 = VIL, A9 = VH,(3)
A0 = VIL
Manufacturer Code(4)
Device Code(4)
Hardware
A1 - A17 = VIL, A9 = VH,(3)
A0 = VIH
VIL
VIL
VIH
A0 = VIL, A1 - A17=VIL
A0 = VIH, A1 - A17=VIL
Manufacturer Code(4)
Device Code(4)
Software(5)
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH = 12.0V ± 0.5V.
4. Manufacturer Code: 1FH, Device Code: 07H - AT49BV/LV002(N), 08H - AT49BV/LV002(N)T
5. See details under Software Product Identification Entry/Exit.
6. This pin is not available on the AT49BV/LV002N(T).
DC Characteristics
Symbol
Parameter
Condition
Min
Max
10
10
50
3
Units
µA
µA
µA
mA
mA
V
ILI
Input Load Current
Output Leakage Current
VCC Standby Current CMOS
VCC Standby Current TTL
VCC Active Current
Input Low Voltage
VIN = 0V to VCC
ILO
VI/O = 0V to VCC
ISB1
CE = VCC - 0.3V to VCC
CE = 2.0V to VCC
f = 5 MHz; IOUT = 0 mA
ISB2
(1)
ICC
25
0.6
VIL
VIH
VOL
VOH
Input High Voltage
2.0
2.4
V
Output Low Voltage
IOL = 2.1 mA
.45
V
Output High Voltage
IOH = -400 µA
V
Note:
1. In the erase mode, ICC is 50 mA.
AT49BV/LV002(N)(T)
6
AT49BV/LV002(N)(T)
AC Read Characteristics
AT49LV002(N)(T)-70
AT49BV/LV002(N)(T)-90
AT49BV/LV002(N)(T)-12
Symbol
Parameter
Min
Max
70
Min
Max
90
Min
Max
120
120
50
Units
ns
tACC
Address to Output Delay
CE to Output Delay
OE to Output Delay
CE or OE to Output Float
(1)
tCE
70
90
ns
(2)
tOE
0
0
35
0
0
40
0
0
ns
(3)(4)
tDF
25
25
30
ns
Output Hold from OE, CE or
Address, whichever occurred first
tOH
0
0
0
ns
AC Read Waveforms (1)(2)(3)(4)
ADDRESS
ADDRESS VALID
CE
tCE
tOE
OE
tDF
tOH
tACC
HIGH Z
OUTPUT
VALID
OUTPUT
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change
without impact on tACC
.
.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
Input Test Waveform and
Measurement Level
Output Load Test
3.0V
2.4V
1.8K
1.3K
AC
AC
OUTPUT
PIN
DRIVING
1.5V
LEVELS
0.4V
MEASUREMENT
LEVEL
30 pF
tR, tF < 5
Pin Capacitance
(f = 1 MHz, T = 25°C)(1)
Typ
4
Max
6
Units
pF
Conditions
VIN = 0V
CIN
COUT
8
12
pF
VOUT = 0V
Note:
1. This parameter is characterized and is not 100% tested.
7
AC Byte Load Characteristics
Symbol
Parameter
Min
0
Max
Units
ns
t
AS, tOES
Address, OE Set-up Time
Address Hold Time
tAH
tCS
tCH
tWP
tDS
70
0
ns
Chip Select Set-up Time
Chip Select Hold Time
Write Pulse Width (WE or CE)
Data Set-up Time
ns
0
ns
90
70
0
ns
ns
ns
ns
t
DH, tOEH
Data, OE Hold Time
Write Pulse Width High
90
tWPH
AC Byte Load Waveforms
WE Controlled
OE
tOES
tOEH
ADDRESS
CE
tAS
tAH
tCH
tCS
WE
tWPH
tWP
tDH
tDS
DATA IN
CE Controlled
OE
tOES
tOEH
ADDRESS
WE
tAS
tAH
tCH
tCS
CE
tWPH
tWP
tDH
tDS
DATA IN
AT49BV/LV002(N)(T)
8
AT49BV/LV002(N)(T)
Program Cycle Characteristics
Symbol
Parameter
Min
Typ
Max
Units
µs
tBP
Byte Programming Time
Address Set-up Time
Address Hold Time
Data Set-up Time
Data Hold Time
30
50
tAS
0
ns
tAH
70
70
0
ns
tDS
ns
tDH
ns
tWP
Write Pulse Width
Write Pulse Width High
Erase Cycle Time
90
90
ns
tWPH
tEC
ns
10
seconds
Program Cycle Waveforms
A0 - A17
Sector or Chip Erase Cycle Waveforms
(1)
OE
CE
t
t
WP
WPH
WE
A0 - A17
DATA
t
t
t
AS
AH
DH
5555
5555
5555
Note 2
2AAA
2AAA
t
t
EC
DS
55
BYTE 1
80
BYTE 2
55
BYTE 4
Note 3
BYTE 5
AA
BYTE 0
AA
BYTE 3
Notes: 1. OE must be high only when WE and CE are both low.
2. For chip erase, the address should be 5555. For sector erase, the address depends on what sector is to be erased.
(See note 4 under command definitions.)
3. For chip erase, the data should be 10H, and for sector erase, the data should be 30H.
9
Data Polling Characteristics
Symbol
Parameter
Min
10
Typ
Max
Units
ns
tDH
Data Hold Time
tOEH
tOE
OE Hold Time
10
ns
OE to Output Delay(2)
Write Recovery Time
ns
tWR
0
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
DATA Polling Waveforms
WE
CE
t
OEH
OE
t
DH
t
WR
t
OE
HIGHZ
An
I/O7
A0-A17
An
An
An
An
Toggle Bit Characteristics
Symbol
Parameter
Min
Typ
Max
Units
ns
tDH
Data Hold Time
10
10
tOEH
tOE
tOEHP
tWR
OE Hold Time
ns
OE to Output Delay(2)
OE High Pulse
ns
150
0
ns
Write Recovery Time
ns
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
WE
CE
tOEH
tOEHP
OE
tOE
tDH
HIGH Z
I/O6
tWR
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.
The tOEHP specification must be met by the toggling input(s).
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
AT49BV/LV002(N)(T)
10
AT49BV/LV002(N)(T)
Software Product
Boot Block Lockout
Identification Entry(1)
Feature Enable Algorithm(1)
LOAD DATA AA
TO
LOAD DATA AA
ADDRESS 5555
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA 90
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
ENTER PRODUCT
IDENTIFICATION
(2)(3)(5)
MODE
LOAD DATA 55
TO
ADDRESS 2AAA
Software Product
Identification Exit(1)
LOAD DATA 40
TO
ADDRESS 5555
OR
LOAD DATA AA
TO
LOAD DATA F0
TO
ADDRESS 5555
ANY ADDRESS
(2)
PAUSE 1 second
LOAD DATA 55
TO
ADDRESS 2AAA
EXIT PRODUCT
IDENTIFICATION
Notes for boot block lockout feature enable:
(4)
MODE
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
LOAD DATA F0
TO
2. Boot block lockout feature enabled.
ADDRESS 5555
EXIT PRODUCT
IDENTIFICATION
(4)
MODE
Notes for software product identification
1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. A1 - A17 = VIL.
Manufacture Code is read for A0 = VIL;
Device Code is read for A0 = VIH.
3. The device does not remain in identification mode if
powered down.
4. The device returns to standard operation mode.
5. Device Code: 07H - AT49BV/LV002(N)
08H - AT49BV/LV002(N)T
11
AT49BV002 Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
90
50
0.1
AT49BV002-90JC
AT49BV002-90PC
AT49BV002-90TC
AT49BV002-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
50
50
50
0.3
0.1
0.3
AT49BV002-90JI
AT49BV002-90PI
AT49BV002-90TI
AT49LV002-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49BV002-12JC
AT49BV002-12PC
AT49BV002-12TC
AT49BV002-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49BV002-12JI
AT49BV002-12PI
AT49BV002-12TI
AT49BV002-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
AT49BV/LV002(N)(T)
12
AT49BV/LV002(N)(T)
AT49LV002 Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
70
50
0.1
AT49LV002-70JC
AT49LV002-70PC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002-70TC
AT49LV002-70VC
50
50
50
50
50
0.3
0.1
0.3
0.1
0.3
AT49LV002-70JI
AT49LV002-70PI
AT49LV002-70TI
AT49LV002-70VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
90
AT49LV002-90JC
AT49LV002-90PC
AT49LV002-90TC
AT49LV002-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002-90JI
AT49LV002-90PI
AT49LV002-90TI
AT49LV002-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49LV002-12JC
AT49LV002-12PC
AT49LV002-12TC
AT49LV002-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002-12JI
AT49LV002-12PI
AT49LV002-12TI
AT49LV002-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
13
AT49BV002N Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
90
50
0.1
AT49BV002N-90JC
AT49BV002N-90PC
AT49BV002N-90TC
AT49BV002N-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
50
50
50
0.3
0.1
0.3
AT49BV002N-90JI
AT49BV002N-90PI
AT49BV002N-90TI
AT49BV002N-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49BV002N-12JC
AT49BV002N-12PC
AT49BV002N-12TC
AT49BV002N-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49BV002N-12JI
AT49BV002N-12PI
AT49BV002N-12TI
AT49BV002N-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
AT49BV/LV002(N)(T)
14
AT49BV/LV002(N)(T)
AT49LV002N Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
70
50
0.1
AT49LV002N-70JC
AT49LV002N-70PC
AT49LV002N-70TC
AT49LV002N-70VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
50
50
50
50
50
0.3
0.1
0.3
0.1
0.3
AT49LV002N-70JI
AT49LV002N-70PI
AT49LV002N-70TI
AT49LV002N-70VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
90
AT49LV002N-90JC
AT49LV002N-90PC
AT49LV002N-90TC
AT49LV002N-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002N-90JI
AT49LV002N-90PI
AT49LV002N-90TI
AT49LV002N-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49LV002N-12JC
AT49LV002N-12PC
AT49LV002N-12TC
AT49LV002N-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002N-12JI
AT49LV002N-12PI
AT49LV002N-12TI
AT49LV002N-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
15
AT49BV002T Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
90
50
0.1
AT49BV002T-90JC
AT49BV002T-90PC
AT49BV002T-90TC
AT49BV002T-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
50
50
50
0.3
0.1
0.3
AT49BV002T-90JI
AT49BV002T-90PI
AT49BV002T-90TI
AT49BV002T-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49BV002T-12JC
AT49BV002T-12PC
AT49BV002T-12TC
AT49BV002T-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49BV002T-12JI
AT49BV002T-12PI
AT49BV002T-12TI
AT49BV002T-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
AT49BV/LV002(N)(T)
16
AT49BV/LV002(N)(T)
AT49BV002T Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
70
50
0.1
AT49LV002T-70JC
AT49LV002T-70PC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002T-70TC
AT49LV002T-70VC
50
50
50
50
50
0.3
0.1
0.3
0.1
0.3
AT49LV002T-70JI
AT49LV002T-70PI
AT49LV002T-70TI
AT49LV002T-70VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
90
AT49LV002T-90JC
AT49LV002T-90PC
AT49LV002T-90TC
AT49LV002T-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002T-90JI
AT49LV002T-90PI
AT49LV002T-90TI
AT49LV002T-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49LV002T-12JC
AT49LV002T-12PC
AT49LV002T-12TC
AT49LV002T-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002T-12JI
AT49LV002T-12PI
AT49LV002T-12TI
AT49LV002T-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
17
AT49BV002NT Ordering Information
tACC
(ns)
ICC (mA)
Ordering Code
Package
Operation Range
90
50
50
50
50
0.1
0.3
0.1
0.3
AT49BV002NT-90JC
AT49BV002NT-90PC
AT49BV002NT-90TC
AT49BV002NT-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49BV002NT-90JI
AT49BV002NT-90PI
AT49BV002NT-90TI
AT49BV002NT-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49BV002NT-12JC
AT49BV002NT-12PC
AT49BV002NT-12TC
AT49BV002NT-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49BV002NT-12JI
AT49BV002NT-12PI
AT49BV002NT-12TI
AT49BV002NT-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
AT49BV/LV002(N)(T)
18
AT49BV/LV002(N)(T)
AT49LV002NT Ordering Information
tACC
(ns)
ICC (mA)
Ordering Code
Package
Operation Range
70
50
50
50
50
50
50
0.1
0.3
0.1
0.3
0.1
0.3
AT49LV002NT-70JC
AT49LV002NT-70PC
AT49LV002NT-70TC
AT49LV002NT-70VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002NT-70JI
AT49LV002NT-70PI
AT49LV002NT-70TI
AT49LV002NT-70VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
90
AT49LV002NT-90JC
AT49LV002NT-90PC
AT49LV002NT-90TC
AT49LV002NT-90VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002NT-90JI
AT49LV002NT-90PI
AT49LV002NT-90TI
AT49LV002NT-90VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
120
AT49LV002NT-12JC
AT49LV002NT-12PC
AT49LV002NT-12TC
AT49LV002NT-12VC
32J
Commercial
32P6
32T
32V
(0° to 70°C)
AT49LV002NT-12JI
AT49LV002NT-12PI
AT49LV002NT-12TI
AT49LV002NT-12VI
32J
Industrial
32P6
32T
32V
(-40° to 85°C)
Package Type
32J
32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC)
32-Lead, 0.600" Wide, Plastic Dual In-line Package (PDIP)
32-Lead, Thin Small Outline Package (TSOP)
32P6
32T
32V
32-Lead, Thin Small Outline Package (VSOP) (8 x 14 mm)
19
Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
32P6, 32-Lead, 0.600" Wide,
Plastic Dual In-line Package (PDIP)
Dimensions in Inches and (Millimeters)
1.67(42.4)
1.64(41.7)
.025(.635) X 30° - 45°
.045(1.14) X 45° PIN NO. 1
.012(.305)
PIN
1
IDENTIFY
.008(.203)
.530(13.5)
.553(14.0)
.490(12.4)
.566(14.4)
.530(13.5)
.547(13.9)
.032(.813)
.026(.660)
.021(.533)
.013(.330)
.595(15.1)
.585(14.9)
.090(2.29)
MAX
.030(.762)
.015(3.81)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.050(1.27) TYP
1.500(38.10) REF
.300(7.62) REF
.430(10.9)
.390(9.90)
.220(5.59)
MAX
.005(.127)
MIN
AT CONTACT
POINTS
SEATING
PLANE
.065(1.65)
.015(.381)
.022(.559)
.014(.356)
.161(4.09)
.125(3.18)
.065(1.65)
.041(1.04)
.022(.559) X 45° MAX (3X)
.110(2.79)
.090(2.29)
.630(16.0)
.590(15.0)
.453(11.5)
.447(11.4)
0
15
.495(12.6)
.485(12.3)
REF
.012(.305)
.008(.203)
.690(17.5)
.610(15.5)
32T, 32-Lead, Plastic Thin Small Outline
Package (TSOP)
32V, 32-Lead, Plastic Thin Small Outline
Package (VSOP)
Dimensions in Millimeters and (Inches)*
Dimensions in Millimeters and (Inches)
INDEX
MARK
INDEX
MARK
18.5(.728)
18.3(.720)
20.2(.795)
19.8(.780)
12.5(.492)
12.3(.484)
14.2(.559)
13.8(.543)
0.50(.020)
BSC
0.25(.010)
0.15(.006)
0.50(.020)
BSC
0.25(.010)
0.15(.006)
7.50(.295)
REF
7.50(.295)
REF
8.20(.323)
7.80(.307)
8.10(.319)
7.90(.311)
1.20(.047) MAX
1.20(.047) MAX
0.15(.006)
0.05(.002)
0.15(.006)
0.05(.002)
0
0.20(.008)
0.10(.004)
REF
5
0
0.20(.008)
0.10(.004)
REF
5
0.70(.028)
0.50(.020)
0.70(.028)
0.50(.020)
*Controlling dimension: millimeters
AT49BV/LV002(N)(T)
20
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