AT93C46-10PK-5.0C [ATMEL]

EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8;
AT93C46-10PK-5.0C
型号: AT93C46-10PK-5.0C
厂家: ATMEL    ATMEL
描述:

EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 光电二极管
文件: 总15页 (文件大小:198K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Medium-voltage and Standard-voltage Operation  
– 5.0 (VCC = 4.5V to 5.5V)  
– 2.7 (VCC = 2.7V to 5.5V)  
User-selectable Internal Organization  
– 1K: 128 x 8 or 64 x 16  
– 2K: 256 x 8 or 128 x 16  
– 4K: 512 x 8 or 256 x 16  
Three-wire Serial Interface  
2 MHz Clock Rate (5V)  
Self-timed Write Cycle (10 ms max)  
High Reliability  
– Endurance: 1 Million Write Cycles  
– Data Retention: 100 Years  
8-lead PDIP and 8-lead JEDEC SOIC Packages  
Three-wire  
Serial  
Automotive  
EEPROMs  
Description  
The AT93C46/56/66 provides 1024/2048/4096 bits of serial electrically erasable pro-  
grammable read only memory (EEPROM) organized as 64/128/256 words of 16 bits  
each, when the ORG pin is connected to VCC and 128/256/512 words of 8 bits each  
when it is tied to ground. The device is optimized for use in many automotive applica-  
tions where low power and low voltage operations are essential. The AT93C46/56/66  
is available in space-saving 8-lead PDIP and 8-lead JEDEC SOIC packages. The  
AT93C46/56/66 is enabled through the Chip Select pin (CS), and accessed via a  
3-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock  
(SK). Upon receiving a Read instruction at DI, the address is decoded and the data is  
clocked out serially on the data output pin DO. The WRITE cycle is completely self-  
timed and no separate erase cycle is required before write. The Write cycle is only  
enabled when it is in the Erase/Write Enable state. When CS is brought “high” follow-  
ing the initiation of a write cycle, the DO pin outputs the Ready/Busy status.  
1K (128 x 8 or 64 x 16)  
2K (256 x 8 or 128 x 16)  
4K (512 x 8 or 256 x 16)  
AT93C46  
AT93C56(1)  
AT93C66(2)  
The AT93C46/56/66 is available in 4.5V to 5.5V and 2.7V to 5.5V versions.  
Note: 1. This device is not recom-  
mended for new designs.  
Table 1. Pin Configuration  
8-lead PDIP  
Pin Name  
CS  
Function  
Please refer to AT93C56A.  
Chip Select  
2. This device is not recom-  
mended for new designs.  
Please refer to AT93C66A.  
CS  
SK  
DI  
1
2
3
4
8
7
6
5
VCC  
DC  
SK  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
ORG  
GND  
DI  
DO  
DO  
GND  
VCC  
ORG  
8-lead SOIC  
Power Supply  
Internal Organization  
CS  
1
8
7
6
5
VCC  
SK  
DI  
2
3
4
DC  
ORG  
GND  
DO  
Rev. 3264E–SEEPR–10/04  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute Maxi-  
mum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional  
operation of the device at these or any other condi-  
tions beyond those indicated in the operational sec-  
tions of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended  
periods may affect device reliability  
Operating Temperature......................................−55°C to +125°C  
Storage Temperature .........................................−65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground........................................ −1.0V to +7.0V  
Maximum Operating Voltage .......................................... 6.25V  
DC Output Current........................................................ 5.0 mA  
Figure 1. Block Diagram  
Note:  
When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is connected to ground, the “x 8” organiza-  
tion is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the  
internal 1 Meg ohm pullup, then the “x 16” organization is selected.  
For the AT93C46, if “x 16” organization is the mode of choice and Pin 6 (ORG) is left unconnected, Atmel recommends  
using the AT93C46A device. For more details, see the AT93C46A datasheet.  
2
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
Table 2. Pin Capacitance(1)  
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted).  
Symbol  
COUT  
CIN  
Test Conditions  
Max  
5
Units  
pF  
Conditions  
VOUT = 0V  
VIN = 0V  
Output Capacitance (DO)  
Input Capacitance (CS, SK, DI)  
5
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
Table 3. DC Characteristics  
Applicable over recommended operating range from: TA = 40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise  
noted).  
Symbol  
VCC1  
Parameter  
Test Condition  
Min  
2.7  
4.5  
Typ  
Max  
5.5  
Unit  
V
Supply Voltage  
Supply Voltage  
VCC2  
5.5  
V
READ at 1.0 MHz  
WRITE at 1.0 MHz  
CS = 0V  
0.5  
0.5  
6.0  
17  
2.0  
mA  
mA  
µA  
µA  
µA  
µA  
ICC  
Supply Current  
VCC = 5.0V  
2.0  
ISB1  
ISB2  
IIL  
Standby Current  
Standby Current  
Input Leakage  
VCC = 2.7V  
10.0  
30  
VCC = 5.0V  
CS = 0V  
VIN = 0V to VCC  
VIN = 0V to VCC  
0.1  
0.1  
1.0  
IOL  
Output Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
1.0  
(1)  
VIL1  
0.6  
V
CC x 0.3  
2.7V VCC 5.5V  
(1)  
VIH1  
VCC x 0.7  
VCC + 1  
0.4  
V
V
V
VOL1  
VOH1  
IOL = 2.1 mA  
2.7V VCC 5.5V  
IOH = 0.4 mA  
2.4  
Note:  
1. VIL min and VIH max are reference only and are not tested.  
3
3264E–SEEPR–10/04  
Table 4. AC Characteristics  
Applicable over recommended operating range from TA = 40°C to + 125°C, VCC = As Specified,  
CL = 1 TTL Gate and 100 pF (unless otherwise noted).  
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Units  
SK Clock  
Frequency  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
0
0
2
1
fSK  
MHz  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
tSKH  
tSKL  
tCS  
SK High Time  
SK Low Time  
ns  
ns  
ns  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
Minimum CS  
Low Time  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
50  
50  
tCSS  
CS Setup Time  
Relative to SK  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
100  
tDIS  
tCSH  
tDIH  
DI Setup Time  
CS Hold Time  
DI Hold Time  
Relative to SK  
Relative to SK  
Relative to SK  
ns  
ns  
ns  
0
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
100  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
500  
tPD1  
tPD0  
tSV  
Output Delay to ‘1’  
Output Delay to ‘0’  
CS to Status Valid  
AC Test  
AC Test  
AC Test  
ns  
ns  
ns  
ns  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
500  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
250  
250  
CS to DO in High  
Impedance  
AC Test  
CS = VIL  
4.5V VCC 5.5V  
2.7V VCC 5.5V  
100  
100  
tDF  
tWP  
Write Cycle Time  
5.0V, 25°C  
2.7V VCC 5.5V  
3
10  
ms  
Endurance(1)  
1M  
Write Cycles  
Note:  
1. This parameter is characterized and is not 100% tested.  
4
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
Table 5. Instruction Set for the AT93C46  
Address  
Data  
Op  
Instruction  
SB  
Code  
x 8  
x 16  
x 8  
x 16  
Comments  
Reads data stored in memory, at  
specified address  
READ  
1
10  
A6 - A0  
A5 - A0  
Write enable must precede all  
programming modes  
EWEN  
1
00  
11XXXXX  
11XXXX  
ERASE  
WRITE  
1
1
11  
01  
A6 - A0  
A6 - A0  
A5 - A0  
A5 - A0  
Erase memory location An - A0  
Writes memory location An - A0  
D7 - D0  
D7 - D0  
D15 - D0  
Erases all memory locations. Valid  
only at VCC = 4.5V to 5.5V  
ERAL  
1
00  
10XXXXX  
10XXXX  
Writes all memory locations. Valid  
only at VCC = 4.5V to 5.5V  
WRAL  
EWDS  
1
1
00  
00  
01XXXXX  
00XXXXX  
01XXXX  
00XXXX  
D15 - D0  
Disables all programming instructions  
Note:  
The Xs in the address field represent don’t care values and must be clocked.  
Table 6. Instruction Set for the AT93C56(1) and AT93C66(2)  
Address  
Op  
Data  
Instruction  
SB  
Code  
x 8  
x 16  
x 8  
x 16  
Comments  
Reads data stored in memory, at  
specified address  
READ  
1
10  
A8 - A0  
A7 - A0  
Write enable must precede all  
programming modes  
EWEN  
1
00  
11XXXXXXX  
11XXXXXX  
ERASE  
WRITE  
1
1
11  
01  
A8 - A0  
A8 - A0  
A7 - A0  
A7 - A0  
Erase memory location An - A0  
Writes memory location An - A0  
D7 - D0  
D15 - D0  
Erases all memory locations. Valid  
only at VCC = 4.5V to 5.5V  
ERAL  
1
00  
10XXXXXXX  
10XXXXXX  
Writes all memory locations. Valid  
only at VCC = 5.0V 10% and Disable  
Register cleared  
WRAL  
EWDS  
1
1
00  
00  
01XXXXXXX  
00XXXXXXX  
01XXXXXX  
00XXXXXX  
D7 - D0  
D15 - D0  
Disables all programming instructions  
Note:  
1. This device is not recommended for new designs. Please refer to AT93C56A.  
2. This device is not recommended for new designs. Please refer to AT93C66A.  
3. The Xs in the address field represent don’t care values and must be clocked.  
5
3264E–SEEPR–10/04  
Functional  
Description  
The AT93C46/56/66 is accessed via a simple and versatile 3-wire serial communication  
interface. Device operation is controlled by seven instructions issued by the host pro-  
cessor. A valid instruction starts with a rising edge of CS and consists of a Start Bit (logic  
“1”) followed by the appropriate Op Code and the desired memory Address location.  
READ (READ): The Read (READ) instruction contains the address code for the mem-  
ory location to be read. After the instruction and address are decoded, data from the  
selected memory location is available at the serial output pin DO. Output data changes  
are synchronized with the rising edges of serial clock SK. It should be noted that a  
dummy bit (logic “0”) precedes the 8- or 16-bit data output string.  
ERASE/WRITE (EWEN): To assure data integrity, the part automatically goes into the  
Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable  
(EWEN) instruction must be executed first before any programming instructions can be  
carried out. Please note that once in the EWEN state, programming remains enabled  
until an EWDS instruction is executed or VCC power is removed from the part.  
ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified  
memory location to the logical “1” state. The self-timed erase cycle starts once the  
ERASE instruction and address are decoded. The DO pin outputs the Ready/Busy sta-  
tus of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A  
logic “1” at pin DO indicates that the selected memory location has been erased, and the  
part is ready for another instruction.  
WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be  
written into the specified memory location. The self-timed programming cycle, tWP, starts  
after the last bit of data is received at serial data input pin DI. The DO pin outputs the  
Ready/Busy status of the part if CS is brought high after being kept low for a minimum of  
250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic “1”  
indicates that the memory location at the specified address has been written with the  
data pattern contained in the instruction and the part is ready for further instructions. A  
Ready/Busy status cannot be obtained if the CS is brought high after the end of the self-  
timed programming cycle, tWP  
.
ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-  
ory array to the logic “1” state and is primarily used for testing purposes. The DO pin  
outputs the Ready/Busy status of the part if CS is brought high after being kept low for a  
minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V 10%.  
WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations  
with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy  
status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).  
The WRAL instruction is valid only at VCC = 5.0V 10%.  
ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the  
Erase/Write Disable (EWDS) instruction disables all programming modes and should be  
executed after all programming operations. The operation of the Read instruction is  
independent of both the EWEN and EWDS instructions and can be executed at any  
time.  
6
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
Timing Diagrams  
Figure 2. Synchronous Data Timing  
Note:  
1. This is the minimum SK period.  
Table 7. Organization Key for Timing Diagrams  
AT93C46 (1K)  
AT93C56 (2K)(1)  
x 8 x 16  
AT93C66 (4K)(2)  
I/O  
AN  
DN  
x 8  
A6  
x 16  
A5  
x 8  
A8  
x 16  
A7  
(3)  
(4)  
A8  
D7  
A7  
D15  
D7  
D15  
D7  
D15  
Notes: 1. This device is not recommended for new designs. Please refer to AT93C56A.  
2. This device is not recommended for new designs. Please refer to AT93C66A.  
3. A8 is a don’t care value, but the extra clock is required.  
4. A7 is a don’t care value, but the extra clock is required.  
Figure 3. READ Timing  
tCS  
High Impedance  
7
3264E–SEEPR–10/04  
Figure 4. EWEN Timing  
tCS  
CS  
SK  
DI  
...  
1
0
0
1
1
Figure 5. EWDS Timing  
tCS  
CS  
SK  
DI  
...  
0
0
0
1
0
Figure 6. WRITE Timing  
tCS  
CS  
SK  
DI  
...  
...  
AN  
DN  
1
0
1
A0  
D0  
HIGH IMPEDANCE  
BUSY  
READY  
DO  
tWP  
Figure 7. WRAL Timing(1)  
tCS  
CS  
SK  
DI  
1
0
0
0
1
...  
DN ... D0  
BUSY  
HIGH IMPEDANCE  
DO  
READY  
tWP  
Note:  
1. Valid only at VCC = 4.5V to 5.5V.  
8
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
Figure 8. ERASE Timing  
tCS  
CS  
STANDBY  
CHECK  
STATUS  
SK  
DI  
A0  
1
1
1
AN  
...  
AN-1 AN-2  
tDF  
tSV  
HIGH IMPEDANCE  
HIGH IMPEDANCE  
BUSY  
DO  
READY  
tWP  
Figure 9. ERAL Timing(1)  
tCS  
CS  
STANDBY  
CHECK  
STATUS  
SK  
DI  
1
0
0
1
0
tDF  
tSV  
BUSY  
HIGH IMPEDANCE  
HIGH IMPEDANCE  
DO  
READY  
tWP  
Note:  
1. Valid only at VCC = 4.5V to 5.5V.  
9
3264E–SEEPR–10/04  
AT93C46 Ordering Information  
Ordering Code  
Package  
Operation Range  
AT93C46-10PA-5.0C  
AT93C46-10SA-5.0C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
AT93C46-10PA-2.7C  
AT93C46-10SA-2.7C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
Package Type  
8P3  
8S1  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
Options  
5.0  
2.7  
Standard Operation (4.5V to 5.5V)  
Low Voltage (2.7V to 5.5V)  
10  
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
AT93C56(1) Ordering Information  
Ordering Code  
Package  
Operation Range  
AT93C56-10PA-5.0C  
AT93C56-10SA-5.0C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
AT93C56-10PA-2.7C  
AT93C56-10SA-2.7C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
Note:  
1. This device is not recommended for new designs. Please refer to AT93C56A.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
Options  
8P3  
8S1  
5.0  
2.7  
Standard Operation (4.5V to 5.5V)  
Low Voltage (2.7V to 5.5V)  
11  
3264E–SEEPR–10/04  
AT93C66(1) Ordering Information  
Ordering Code  
Package  
Operation Range  
AT93C66-10PA-5.0C  
AT93C66-10SA-5.0C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
AT93C66-10PA-2.7C  
AT93C66-10SA-2.7C  
8P3  
8S1  
Automotive  
(40°C to 125°C)  
Note:  
1. This device is not recommended for new designs. Please refer to AT93C66A.  
Package Type  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
Options  
8P3  
8S1  
5.0  
2.7  
Standard Operation (4.5V to 5.5V)  
Low Voltage (2.7V to 5.5V)  
12  
AT93C46/56/66  
3264E–SEEPR–10/04  
AT93C46/56/66  
Packaging Information  
8P3 – PDIP  
E
1
E1  
N
Top View  
c
eA  
End View  
COMMON DIMENSIONS  
(Unit of Measure = inches)  
D
e
MIN  
MAX  
0.210  
0.195  
0.022  
0.070  
0.045  
0.014  
0.400  
NOM  
NOTE  
SYMBOL  
D1  
A2 A  
A
2
A2  
b
0.115  
0.014  
0.045  
0.030  
0.008  
0.355  
0.005  
0.300  
0.240  
0.130  
0.018  
0.060  
0.039  
0.010  
0.365  
5
6
6
b2  
b3  
c
D
3
3
4
3
b2  
L
D1  
E
b3  
4 PLCS  
0.310  
0.250  
0.100 BSC  
0.300 BSC  
0.130  
0.325  
0.280  
b
E1  
e
Side View  
eA  
L
4
2
0.115  
0.150  
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.  
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.  
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.  
4. E and eA measured with the leads constrained to be perpendicular to datum.  
5. Pointed or rounded lead tips are preferred to ease insertion.  
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).  
01/09/02  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8P3, 8-lead, 0.300" Wide Body, Plastic Dual  
In-line Package (PDIP)  
8P3  
B
R
13  
3264E–SEEPR–10/04  
8S1 – JEDEC SOIC  
C
1
E
E1  
L
N
Top View  
End View  
e
B
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.35  
0.10  
MAX  
1.75  
0.25  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
0.31  
0.17  
4.80  
3.81  
5.79  
0.51  
0.25  
5.00  
3.99  
6.20  
C
D
E1  
E
D
Side View  
e
1.27 BSC  
L
0.40  
0˚  
1.27  
8˚  
Note:  
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.  
10/7/03  
REV.  
TITLE  
DRAWING NO.  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
B
R
Small Outline (JEDEC SOIC)  
14  
AT93C46/56/66  
3264E–SEEPR–10/04  
Atmel Corporation  
Atmel Operations  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Memory  
RF/Automotive  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
Tel: (49) 71-31-67-0  
Fax: (49) 71-31-67-2340  
2325 Orchard Parkway  
San Jose, CA 95131, USA  
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