AT97SC3201-X1AC [ATMEL]

Trusted Platform Module; 可信平台模块
AT97SC3201-X1AC
型号: AT97SC3201-X1AC
厂家: ATMEL    ATMEL
描述:

Trusted Platform Module
可信平台模块

文件: 总7页 (文件大小:212K)
中文:  中文翻译
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Features  
Full TCG/TCPA V1.1b Compatibility  
Single Chip Turnkey Solution  
Hardware Asymmetric Crypto Engine  
2048 RSA Sign in 500 ms Using CRT  
AVR 8-bit RISC Microprocessor  
Internal EEPROM Storage for 10+ RSA Keys  
33 MHz LPC (Low Pin Count) Bus for Easy PC Interface  
100 KHz System Management Bus (SMBus) Two-wire Interface  
Secure Hardware and Firmware Design and Chip Layout  
True Random Number Generator (RNG)  
Secure Real-time Clock Option  
3.3V 10ꢀ Supply Voltage  
28-lead TSSOP Package or 40-lead MLF Package  
0–70°C Temperature Range  
Trusted  
Platform  
Module  
Description  
The AT97SC3201 is a fully integrated security module designed to be integrated into  
personal computers and other embedded systems. It implements version 1.1b of the  
Trusted Computing Platform Alliance (TCPA) specification for Trusted Platform  
Modules (TPM). This specification has been adopted by the Trusted Computing Group  
(TCG).  
AT97SC3201  
Summary  
The TPM includes a crypto accelerator capable of computing a 2048-bit RSA  
signature in 500 ms and a 1024-bit RSA signature in 100 ms, both using CRT.  
Communication to and from the TPM can occur through one of two interface  
protocols: either a 33-MHz LPC interface or a 100-KHz SMBus two-wire interface.  
Figure 1. AT97SC3201 Block Diagram  
ROM  
Program  
EEPROM  
Program  
AVR  
8/16 Bit  
CPU  
33 MHz  
LPC  
Interface  
SRAM  
EEPROM  
Data  
SMBCLK/IOA  
SMBDAT/IOB  
IOC  
SMBus Interface  
or GPIO  
RNG  
CRYPTO  
Engine  
VBB  
32.768 kHz  
RTC  
Timer  
Physical  
Security  
Circuitry  
The chip includes a full hardware random number generator that is used for the TCG  
protocol and is also available to the system for any random numbers it may need  
during normal operation.  
Rev. 2015DS-TPM–7/04  
Note: This is a summary document. A complete document is  
available under NDA. For more information, please contact your  
local Atmel sales office.  
A real-time clock function is available using an external battery and crystal. The chip provides  
tamper detection if the battery or crystal are removed or tampered with, and the current time  
value can be signed by the appropriate internal keys to verify its accuracy. (Contact Atmel for  
current status of this option.)  
The battery detector can be used without the crystal for lower cost. In this mode, the TPM can  
indicate to the system if it has been removed from the PC in any way and can also take  
actions internally.  
The chip uses a dynamic internal memory management scheme to store from 10 to 20 keys.  
Other than the standard TCG commands (TPM_Evictkey, TPM_Loadkey), no system inter-  
vention is required to manage this internal key cache.  
The TPM is offered to OEM manufacturers as a turnkey solution, including the firmware inte-  
grated on the chip. In addition, Atmel provides the necessary driver software for integration  
into certain operating systems, along with BIOS drivers. A TCG Software Stack (TSS), also  
supplied by Atmel and available under license, provides communication support to any appli-  
cation using MSCAPI or PKCS #11 Cryptographic APIs. (Contact Atmel for a complete list of  
operating systems supported.)  
Full documentation for TCG primitives can be found on the TCG Web site,  
www.trustedcomputinggroup.org. This specification includes only mechanical and electrical  
information.  
2
AT97SC3201  
2015DS-TPM–7/04  
AT97SC3201  
Absolute Maximum Ratings  
*NOTICE:  
Stresses beyond those listed under Absolute  
Maximum Ratings” may cause permanent  
damage to the device. This is a stress rating only  
and functional operation of the device at these or  
any other conditions beyond those indicated in  
the operational sections of this specification may  
cause temporary or permanent failure. Exposure  
to absolute maximum rating conditions for  
extended periods may affect device reliability.  
Operating Temperature..............................0°C to +70°C  
Storage Temperature (without Bias)...........0°C to + 70°C  
Voltage on I/O Pins..............................0.1 to VCC +0.3V  
Voltage on VCC with Respect to Ground.................6.0V  
Maximum ESD Voltage..........................................2000V  
Table 1. DC Parameters*  
Symbol  
VCC  
Parameter  
Min  
Nom  
Max  
3.6  
50  
Units  
V
Notes  
Supply Voltage  
3.0  
3.3  
25  
5
ICC  
Operating Current at fclk = 33 MHz  
Static Current  
mA  
mA  
IST  
10  
VCC = 3.6V; fxtal = 0 Hz,  
active inputs  
ISL  
Sleep Current, Chip Idle  
Battery Current  
40  
2
100  
µA  
µA  
µA  
V
VCC = 3.6V; fxtal = 0 Hz  
VCC = 0V; fxtal = 0 Hz.  
Vin = VCC or GND  
IBB  
4
ILIO  
VIH  
VIL  
Input Leakage  
0.1  
3
Input High Threshold  
Input Low Threshold  
Output High Voltage  
Output Low Voltage  
Output Low Current, CLKRUN#  
Input Pin Capacitance  
0.5 * VCC  
0.5  
VCC + 0.5  
0.3 * VCC  
V
VOH  
VOL  
IOLCR  
CI  
0.9 * VCC  
0.98 * VCC  
V
At IOUT = 500 uA  
At IOUT = 1.5mA  
At VOUT = .615 * VCC  
Note 1  
0.1 * VCC  
V
7
mA  
pF  
6
* VCC = 3.0 to 3.6V; Temperature = 0 to 70°C  
Note: These parameters guaranteed but not tested.  
3
2015DS-TPM–7/04  
Table 2. AC Parameters*  
Symbol  
Parameter  
Min  
Nom  
Max  
Units  
Notes  
TVAL  
CLK to Signal Valid Delay – LAD0-3  
2
5
11  
ns  
Measured at Vtrise = 0.285 * VCC and Vtfal =  
0.615 * VCC. Measured from clk at Vtest = 0.4  
* VCC; Load = 200Ω  
TON  
Float to Active Delay  
2
4
ns  
ns  
ns  
ns  
ms  
m
TOFF  
Active to Float Delay  
28  
TSU  
Input Setup Time to CLK  
Input Hold Time from CLK  
Reset Active Time after Power Stable  
Reset Active after CLK Stable  
Reset Active to Output Float Delay  
CLK Period  
7
0
2
TH  
500  
TRST  
1
Note 2  
TRST-CLK  
TRST-OFF  
TCLKIN  
TCLKLO  
TCLKHI  
100  
Note 2  
40  
31  
18  
18  
ns  
ns  
ns  
ns  
Note 2  
29.5  
13.4  
13.4  
30  
Note 3  
CLK Low Duration  
Note 1, Note 3  
Note 1, Note 3  
CLK High Duration  
* Cl = 10pf. VCC = 3.0 to 3.7V; Temperature = 0 to 70°C  
Note:  
1. All parameters measured with respect to signal crossing Vtest = 0.4 * VCC unless otherwise noted.  
2. These parameters guaranteed but not tested.  
3. The minimum parameter must never be violated under any circumstances unless Ireset# is asserted. If proper CLKRUN#  
signaling is observed, the maximum specification can be violated.  
Table 3. Ordering Information  
Ordering Code  
Package  
28A3  
Operation Range  
AT97SC3201-01AC  
AT97SC3201-X1AC  
AT97SC3201-01MC  
AT97SC3201-X1MC  
Commercial (0° to 70° C)  
Commercial (0° to 70° C)  
Commercial (0° to 70° C)  
Commercial (0° to 70° C)  
28A3  
lead-free  
lead-free  
40ML1  
40ML1  
4
AT97SC3201  
2015DS-TPM–7/04  
AT97SC3201  
Package Drawing  
28A3 – TSSOP  
b
L
L1  
E1  
E
e
End View  
Top View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
D
MIN  
MAX  
NOM  
9.70  
NOTE  
SYMBOL  
A2  
A
D
9.60  
9.80  
2, 5  
E
8.10 BSC  
6.10  
E1  
A
6.00  
6.20  
1.20  
1.05  
0.30  
3, 5  
4
Side View  
A2  
b
0.80  
0.19  
1.00  
e
0.65 BSC  
0.60  
L
0.45  
0.75  
L1  
1.00 REF  
Notes: 1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information.  
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15 mm (0.006 in) per side.  
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)  
per side.  
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b  
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between  
protrusion and adjacent lead is 0.07 mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
1/8/02  
DRAWING NO.  
28A3  
TITLE  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,  
Thin Shrink Small Outline Package (TSSOP)  
A
R
5
2015DS-TPM–7/04  
40ML1  
A
A1  
A3  
D
N
A2  
1
2
3
Pin 1 Indicator  
E
Top View  
L
0
Side View  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
D2  
MIN  
MAX  
NOM  
6.00 BSC  
6.00 BSC  
4.10  
NOTE  
SYMBOL  
D
E2  
E
D2  
E2  
A
3.95  
3.95  
-
4.25  
4.25  
0.90  
0.05  
0.70  
1
4.10  
2
0.85  
b
3
A1  
A2  
A3  
L
0.0  
-
0.01  
0.65  
N
0.20 REF  
0.40  
e
0.30  
0.18  
0.50  
0.30  
e
0.50 BSC  
0.23  
PIN1 ID  
b
2
Bottom View  
Notes:  
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions,  
tolerances, datums, etc.  
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the  
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.  
3/9/04  
DRAWING NO. REV.  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
40ML1, 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad  
Flat No Lead Package (MLF2)  
40ML1  
A
R
6
AT97SC3201  
2015DS-TPM–7/04  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 487-2600  
Memory  
RF/Automotive  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
TEL (49) 71-31-67-0  
FAX (49) 71-31-67-2340  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
Europe  
Atmel Sarl  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
Microcontrollers  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
FAX 1(719) 540-1759  
Biometrics/Imaging/Hi-Rel MPU/  
High Speed Converters/RF Datacom  
Avenue de Rochepleine  
TEL (41) 26-426-5555  
FAX (41) 26-426-5500  
La Chantrerie  
BP 70602  
44306 Nantes Cedex 3, France  
TEL (33) 2-40-18-18-18  
FAX (33) 2-40-18-19-60  
Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimhatsui  
East Kowloon  
BP 123  
38521 Saint-Egreve Cedex, France  
TEL (33) 4-76-58-30-00  
FAX (33) 4-76-58-34-80  
ASIC/ASSP/Smart Cards  
Zone Industrielle  
Hong Kong  
TEL (852) 2721-9778  
FAX (852) 2722-1369  
13106 Rousset Cedex, France  
TEL (33) 4-42-53-60-00  
FAX (33) 4-42-53-60-01  
Japan  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
FAX 1(719) 540-1759  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Scottish Enterprise Technology Park  
Maxwell Building  
East Kilbride G75 0QR, Scotland  
TEL (44) 1355-803-000  
FAX (44) 1355-242-743  
e-mail  
literature@atmel.com  
Web Site  
http://www.atmel.com  
© Atmel Corporation 2004.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty  
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors  
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does  
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted  
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical  
components in life support devices or systems.  
ATMEL® is the registered trademark of Atmel Corporation.  
Other terms and product names may be the trademark of others.  
Printed on recycled paper.  
2015DS-TPM–7/04  

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