ATA5774-PXQW [ATMEL]

Microcontroller with UHF ASK/FSK Transmitter; 微控制器与超高频ASK / FSK发射器
ATA5774-PXQW
型号: ATA5774-PXQW
厂家: ATMEL    ATMEL
描述:

Microcontroller with UHF ASK/FSK Transmitter
微控制器与超高频ASK / FSK发射器

微控制器
文件: 总287页 (文件大小:3981K)
中文:  中文翻译
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General Features  
Complete Key Fob IC Consisting of an AVR® Microcontroller and RF Transmitter PLL in  
a Single QFN24 5 mm × 5 mm Package (Pitch 0.65 mm)  
– f0 = 310 MHz to 350 MHz (ATA5773)  
– f0 = 429 MHz to 439 MHz (ATA5774)  
– f0 = 868 MHz to 928 MHz (ATA5771)  
Automotive Qualified  
Temperature Range –40°C to +85°C  
ESD Protection: HBM 2500V, MM 100V, CDM 1000V  
Supply voltage 2.0V to 4.0V for Single Li-cell Power Supply  
Low Power Consumption  
– Active Mode: Typical 9.8 mA at 3.0V and 4 MHz Microcontroller-clock  
– Power-down Mode: Typical 200 nA at 3.0V  
Modulation Scheme ASK/FSK  
Microcontroller  
with  
UHF ASK/FSK  
Transmitter  
Integrated PLL Loop Filter  
High Output Power (8 dBm at 315 MHz/7.5 dBm at 433 MHz/ 5.5 dBm at 868 MHz)  
High Performance, Low Power AVR 8-bit Microcontroller  
Advanced RISC Architecture  
ATA5771  
ATA5773  
ATA5774  
Non-volatile Program and Data Memories  
– 4 KByte of In-system Programmable Program Memory Flash  
– 256 Bytes In-system Programmable EEPROM  
– 256 Bytes Internal SRAM  
Peripheral Features  
– Two Timer/Counter, 8- and 16-bit Counters with Two PWM Channels on Both  
– 10-bit ADC  
– Programmable Watchdog Timer with Separate On-chip Oscillator  
– Universal Serial Interface (USI)  
Special Microcontroller Features  
– debugWIRE On-chip Debug System  
– In-system Programmable via SPI Port  
– External and Internal Interrupt Sources  
– Pin Change Interrupt on 12 Pins  
– Enhanced Power-on Reset Circuit  
– Programmable Brown-out Detection Circuit  
– Internal Calibrated Oscillator  
– On-chip Temperature Sensor  
12 Programmable I/O Lines  
1. General Description  
The ATA5771/ATA5773/ATA5774 is a single key fob IC containing the AVR microcon-  
troller ATtiny44V and the UHF PLL transmitters T5750/53/54 build-up using a stacked  
die technique supplied in a QFN24 5 mm × 5 mm package. These devices have been  
specially developed for the demands of RF low-cost data transmission systems with  
data rates of up to 32 kBit/s. Its main applications are in the areas of Remote Key-  
less-Entry (RKE), Passive Entry Go (PEG), and Remote Start. It can be used in the  
frequency range of f0 = 310 MHz to 350 MHz, f0 = 429 MHz to 439 MHz or  
f0 = 868 MHz to 928 MHz for ASK or FSK data transmission.  
9137B–RKE–02/09  
Figure 1-1. ASK System Block Diagram  
UHF ASK/FSK  
Remote Control Transmitter  
ATA5771/73/74  
S1  
PXY  
PXY  
PXY  
PXY  
PXY  
PXY  
PXY  
ATtiny44V  
VDD  
GND  
PXY  
PXY  
PXY  
PXY  
PXY  
VS  
S1  
S1  
T5750  
T5753  
T5754  
Power  
up/down  
ENABLE  
GND_RF  
UHF ASK/FSK  
Remote Control Receiver  
ATA5760  
ATA5761  
ATA5723  
ATA5724  
ATA5728  
ATA5745  
ATA5746  
f/4  
PLL  
1 to 6  
Micro-  
controller  
CLK  
Demod  
Control  
VCC_RF  
VS  
XTO  
VCO  
Antenna  
PA_ENABLE  
ANT2  
PLL  
XTO  
Loop  
Antenna  
PA  
ANT1  
LNA  
VCO  
VS  
2
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
Figure 1-2. FSK System Block Diagram  
UHF ASK/FSK  
Remote Control Transmitter  
ATA5771/73/74  
S1  
PXY  
PXY  
PXY  
PXY  
PXY  
PXY  
PXY  
ATtiny44V  
VDD  
GND  
PXY  
PXY  
PXY  
PXY  
PXY  
VS  
S1  
S1  
T5750  
T5753  
T5754  
Power  
up/down  
ENABLE  
GND_RF  
UHF ASK/FSK  
Remote Control Receiver  
ATA5760  
f/4  
PLL  
ATA5761  
ATA5723  
ATA5724  
ATA5728  
ATA5745  
ATA5746  
1 to 6  
Micro-  
controller  
CLK  
Demod  
Control  
VCC_RF  
VS  
XTO  
VCO  
Antenna  
PA_ENABLE  
ANT2  
PLL  
XTO  
Loop  
Antenna  
PA  
ANT1  
LNA  
VCO  
VS  
3
9137B–RKE–02/09  
2. Pin Configuration  
Figure 2-1. Pinning QFN24 5 mm x 5 mm  
24 23 22 21 20 19  
18  
VCC  
PB0  
PB1  
1
2
3
4
5
6
PA0  
17  
16  
15  
14  
13  
PA1  
PA2  
PB3/RESET  
PB2  
PA3/T0  
PA4/USCK  
PA5/MISO  
PA7  
7
8
9
10 11 12  
Table 2-1.  
Pin Description  
Pin  
1
Symbol  
VCC  
Function  
Microcontroller supply voltage  
2
PB0  
Port B is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port B is a 4-bit bi-directional I/O port with internal pull-up resistor  
3
PB1  
4
PB3/RESET Port B is a 4-bit bi-directional I/O port with internal pull-up resistor/reset input  
5
PB2  
PA7  
Port B is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
6
7
PA6 / MOSI Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
CLK Clock output signal for microcontroller. The clock output frequency is set by the crystal to fXTAL/4  
PA_ENABLE Switches on power amplifier, used for ASK modulation  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
ANT2  
ANT1  
Emitter of antenna output stage  
Open collector antenna output  
GND  
Ground  
PA5/MISO  
PA4/SCK  
PA3/T0  
PA2  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Port A is a 4-bit bi-directional I/O port with internal pull-up resistor  
Microcontroller ground  
PA1  
PA0  
GND  
XTAL  
Connection for crystal  
VS_RF  
GND_RF  
ENABLE  
GND  
Transmitter supply voltage  
Transmitter ground  
Enable input  
Ground  
GND  
Ground/backplane (exposed die pad)  
4
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
3. Functional Description  
For a typical key fob application 3-4 interconnections between the microcontroller and the trans-  
mitter are required (see Figure 1-1 on page 2 and Figure 1-2 on page 3). The CLK line is used to  
allow the microcontroller to generate an XTAL-based transmitter signal. The ENABLE line is  
used to start the XTO, PLL, and clock output of the transmitter. The PA_ENABLE line is used to  
enable the power amplifier in ASK and FSK mode. In FSK mode a 4th line is necessary to modu-  
late the load capacity of the XTAL. To wake-up the system from standby mode at least one key  
input is required. After pressing the key, the microcontroller starts up with the internal RC oscilla-  
tor. For TX operation user software must control ENABLE, PA_ENABLE and XTAL load  
capacity as described in the following section.  
If ENABLE = L and PA_ENABLE = L the transmitter and the microcontroller (MCU) are in  
standby mode, reducing the power consumption so that a lithium cell can be used as power sup-  
ply for several years.  
If ENABLE = H and PA_ENABLE = L, the XTO, PLL and the CLK driver from the transmitter are  
activated. The crystal oscillator together with the PLL from the RF transmitter typically requires  
< 1 ms (ATA5773 < 3 ms) until the PLL is locked and the clock output (Pin 8) is stable.  
If ENABLE = H and PA_ENABLE = H, the XTO, PLL, CLK driver and the Power Amplifier (PA)  
are switched on. The ASK modulation is done by switching on/off the power amplifier via  
PA_ENABLE. The FSK modulation is done by switching on/off an additional capacitor between  
the XTAL load capacitor and GND, thus changing the reference frequency of the PLL. This is  
done using a MOS switch controlled by a microcontroller output. The power amplifier is switched  
on via PA_ENABLE = H.  
The MCU has to wait at least > 1 ms ATA5774 (> 3 ms ATA5773, > 4 ms ATA5771) after setting  
ENABLE = H, before the external clock can be used. The external clock is connected via the  
timer0 input pin that clocks the USI from the MCU to achieve an accurate data transfer. The fre-  
quency of the internal RC oscillator is affected by ambient temperature and operating voltage.  
The USI provides 2 two serial synchronous data transfer modes, with different physical I/O ports  
for the data output. The two wire mode is used for ASK and the three wire mode is used for FSK.  
Table 3-1.  
Type  
Typical Current Consumption in Active Mode at 3.0V and 25°C  
Microcontroller (4 MHz  
Transmitter  
8.5 mA  
Internal RC Oscillator)  
Total  
ATA5771  
ATA5773  
ATA5774  
0.8 mA  
9.3 mA  
9.8 mA  
9.8 mA  
9.0 mA  
0.8 mA  
9.0 mA  
0.8 mA  
Table 3-2.  
Current Consumption in Power-down Mode at 3.0V and –40°C to +85°C  
Microcontroller  
(Watchdog Timer  
Type  
Transmitter  
Disabled)  
Total  
ATA5771  
ATA5773  
ATA5774  
Typ. < 10 nA  
Max. 350 nA  
Typ. 200 nA  
Typ. < 210 nA  
Max. 24 µA(1)  
Max. 24.35 µA(1)  
Note:  
1. Maximum value measured in final test at 125°C. Value at 85°C: See Appendix 4, page 196,  
Figure 23-12 “Power Down Supply Current versus VCC  
5
9137B–RKE–02/09  
4. UHF ASK/FSK Transmitter Block  
Integrated PLL Loop Filter  
Maximum Output Power (ATA5771: 5.5 dBm, ATA5773: 8.0 dBm, ATA5774: 7.5 dBm) with Low  
Supply Current  
Modulation Scheme ASK/FSK  
– FSK Modulation is Achieved by Switching on/off an Additional Capacitor Between the XTAL  
Load Capacitor and GND. This is Done Using a MOS Switch Controlled by a Microcontroller  
Output.  
Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply  
Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C  
Single-ended Antenna Output with High Efficient Power Amplifier  
External CLK Output for Clocking the Microcontroller  
More detailed information about the UHF ASK/FSK Transmitter Block can be found in Appendix  
1, 2 and 3.  
ATA5771  
ATA5773  
ATA5774  
see Appendix 1:  
see Appendix 2:  
see Appendix 3:  
Data sheet T5750 (868 MHz band)  
Data sheet T5753 (315 MHz band)  
Data sheet T5754 (433 MHz band)  
Table 4-1.  
Transmitter Pin Cross Reference List  
Pin Name Pin Number T5750/53/54  
CLK  
Pin Number ATA5771/73/74  
1
8
PA_ENABLE  
ANT2  
2
3
4
5
6
7
8
9
10  
11  
20  
21  
22  
23  
ANT1  
XTAL  
VS  
GND  
ENABLE  
Note:  
For the ATA5771/ATA5773/ATA5774 following points differs in the data sheets:  
- The temperature range is limited to –40°C to +85°C  
- ESD protection: HBM 2500V, MM 100V, CDM 1000V  
- Figure 4-1 on page 7: Two output power measurement  
- For FSK modulation an additional MOS switch is required  
6
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
Figure 4-1. Output Power Measurement ATA5771/ATA5773/ATA5774  
VS  
C1 = 1 nF  
L1  
Power  
meter  
ANT1  
ANT2  
Z = 50Ω  
C2  
ZLopt  
Rin  
50Ω  
Table 4-2.  
Output Power Measurement ATA5771/ATA5773/ATA5774  
Device  
L1  
C2  
ATA5771  
ATA5773  
ATA5774  
10 nH  
47 nH  
33 nH  
0.5 pF  
3.3 pF  
2.4 pF  
7
9137B–RKE–02/09  
5. Microcontroller Block  
High-performance Low-power AVR 8-bit Microcontroller  
Advanced Risc Architecture  
Non-volatile Program and Data Memory  
– 4KByte of In-system Programmable Program Flash  
– Endurance: 10.000 Write/Erase Cycles  
– 256 Bytes In-system Programmable EEPROM  
– Endurance: 100.000 Write/Erase Cycles  
– 256 Bytes Internal SRAM  
Programming Lock for Self-programming Flash Program and EEPROM Data Security  
Peripheral Features  
– Two Timer/Counter, 8- and 16-bit Counters with Two PWM Channels on Both  
Programmable Watchdog Timer with Separate On-chip Oscillator  
On-chip Analog Comparator  
– Universal Serial Interface  
Special Microcontroller Features  
– Debug Wire On-chip Debug System  
– In-system Programmable via SPI Port  
– External and Internal Interrupt Sources  
– Pin Change Interrupt on 12 Pins  
– Low Power Idle, ADC Noise Reduction, Standby and Power-down Modes  
– Enhanced Power-on Reset Circuit  
– Programmable Brown-out Detection Circuit  
– Internal Calibrated Oscillator  
– On-chip Temperature Sensor  
12 Programmable I/O Lines  
Operating Voltage  
– 1.8V to 5.5V  
Speed Grade  
– 0 to 4 MHz at 2.0V to 4.0V  
Temperature Range  
– –40°C to +85°C  
Low Power Consumption  
– Active Mode: 4 MHz, 3V, 0.8 mA  
– Power-down Mode: 3V, 0.2 µA  
More detailed information about the Microcontroller Block can be found in Appendix 4 and 5.  
ATA5771, ATA5773, ATA5774  
see Appendix 4: Datasheet ATtiny44  
and Appendix 5: Appendix B - ATtiny44V  
8
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
Table 5-1.  
Microcontroller Cross Reference List  
Pin Number  
Pin Number  
Pin Name  
ATtiny44V  
ATA5771/ATA5773/ATA5774  
VCC  
1
2
1
2
PB0  
PB1  
3
3
PB3/NRESET  
PB2  
4
4
5
5
PA7  
6
6
PA6/MOSI  
PA5/MISO  
PA4/USCK  
PA3/T0  
PA2  
7
7
8
13  
14  
15  
16  
17  
18  
19  
9
10  
11  
12  
13  
14  
PA1  
PA0  
GND  
Note:  
For the ATA5771/ATA5773/ATA5774 following points differs in the data sheet ATtiny44V:  
- The temperature range is limited to –40°C to +85°C  
- The supply voltage range is limited from 2.0V to 4.0V  
9
9137B–RKE–02/09  
6. Application  
Figure 6-1. Typical ASK Application ATA5771/ATA5773/ATA5774  
VCC  
68 nF  
VCC  
24  
23  
22  
21  
20  
19  
SW1  
SW2  
SW3  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
VCC  
PB0  
PB1  
PA0  
PA1  
PA2  
ATA577x  
PB3/RESET  
PB2  
PA3/T0  
PA4/SCK  
PA5/MISO  
PA7  
7
8
9
10  
11  
12  
VCC  
RF Choke  
10  
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
Figure 6-2. Typical FSK Application ATA5771/ATA5773/ATA5774  
VCC  
68 nF  
VCC  
24  
23  
22  
21  
20  
19  
SW1  
1
2
3
4
5
6
18  
VCC  
PB0  
PB1  
PA0  
SW2  
17  
PA1  
16  
SW3  
PA2  
ATA577x  
15  
PB3/RESET  
PB2  
PA3/T0  
14  
PA4/SCK  
13  
PA7  
PA5/MISO  
7
8
9
10  
11  
12  
VCC  
RF Choke  
11  
9137B–RKE–02/09  
7. Ordering Information  
Extended Type Number  
Package  
Remarks  
ATA5771-PXQW  
QFN24 5 mm x 5 mm  
QFN24 5 mm x 5 mm  
QFN24 5 mm x 5 mm  
Microcontroller with UHF Tx for 868 MHz to 928 MHz  
Microcontroller with UHF Tx for 310 MHz to 350 MHz  
Microcontroller with UHF Tx for 429 MHZ to 439 MHz  
ATA5773-PXQW  
ATA5774-PXQW  
8. Package Information  
Package: QFN 24 - 5 x 5  
Exposed pad 3.6 x 3.6  
(acc. JEDEC OUTLINE No. MO-220)  
Dimensions in mm  
Not indicated tolerances ±0.05  
5
0.9±0.1  
+0  
0.05-0.05  
3.6  
24  
1
19  
24  
18  
13  
1
6
technical drawings  
according to DIN  
specifications  
6
12  
0.65 nom.  
7
Drawing-No.: 6.543-5122.01-4  
Issue: 1; 15.11.05  
3.25  
12  
ATA5771/ATA5773/ATA5774  
9137B–RKE–02/09  
ATA5771/ATA5773/ATA5774  
9. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Features on page 1 changed  
Figure 1-1 “ASK System Block Diagram” on page 2 changed  
Figure 1-2 “FSK System Block Diagram” on page 3 changed  
Section 3 “Functional Description” on page 5 changed  
Table 4-1 “Transmitter Pin Cross Reference List” on page 6 changed  
Section 5 “Microcontroller Block” on page 8 changed  
9137B-RKE-02/09  
13  
9137B–RKE–02/09  
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9137B–RKE–02/09  
Features  
Integrated PLL Loop Filter  
ESD Protection also at ANT1/ANT2  
(4 kV HBM/200V MM; Except Pin 2: 4 kV HBM/100V MM)  
High Output Power (5.5 dBm) with Low Supply Current (8.5 mA)  
Modulation Scheme ASK/FSK  
– FSK Modulation is Achieved by Connecting an Additional Capacitor Between the  
XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller  
Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply  
Single Li-cell for Power Supply  
Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C/+125°C  
Package TSSOP8L  
UHF ASK/FSK  
Transmitter  
Single-ended Antenna Output with High Efficient Power Amplifier  
CLK Output for Clocking the Microcontroller  
One-chip Solution with Minimum External Circuitry  
125°C Operation for Tire Pressure Systems  
T5750  
1. Description  
The T5750 is a PLL transmitter IC which has been developed for the demands of RF  
low-cost transmission systems at data rates up to 32 kBaud. The transmitting  
frequency range is 868 MHz to 928 MHz. It can be used in both FSK and ASK  
systems.  
Figure 1-1. System Block Diagram  
UHF ASK/FSK  
UHF ASK/FSK  
Remote control transmitter  
Remote control receiver  
1 Li cell  
T5750  
T5760/  
T5761  
1 to 3 Micro-  
controller  
Demod  
Control  
Encoder  
ATARx9x  
PLL  
Keys  
Antenna Antenna  
XTO  
VCO  
LNA  
PLL  
XTO  
LNA  
VCO  
4546F–RKE–12/08  
2. Pin Configuration  
Figure 2-1. Pinning TSSOP8L  
CLK  
PA_ENABLE  
ANT2  
1
2
3
4
8
7
6
5
ENABLE  
GND  
VS  
ANT1  
XTAL  
Table 2-1.  
Pin  
Pin Description  
Symbol  
Function  
Configuration  
VS  
Clock output signal for micro con roller  
The clock output frequency is set by the  
crystal to fXTAL/4  
100Ω  
100Ω  
CLK  
1
CLK  
50 kΩ  
PA_ENABLE  
UREF = 1.1V  
Switches on power amplifier, used for  
ASK modulation  
2
PA_ENABLE  
20 µA  
ANT1  
ANT2  
3
4
ANT2  
ANT1  
Emitter of antenna output stage  
Open collector antenna output  
2
T5750  
4546F–RKE–12/08  
T5750  
Table 2-1.  
Pin  
Pin Description (Continued)  
Symbol  
Function  
Configuration  
VS  
VS  
1.5 kΩ  
1.2 kΩ  
5
XTAL  
Connection for crystal  
XTAL  
182 µA  
6
7
VS  
Supply voltage  
Ground  
See ESD protection circuitry (see Figure 4-5 on page 9)  
See ESD protection circuitry (see Figure 4-5 on page 9)  
GND  
200 kΩ  
ENABLE  
8
ENABLE  
Enable input  
Figure 2-2. Block Diagram  
T5750  
Power up/down  
f
CLK  
PA_ENABLE  
ANT2  
ENABLE  
4
1
8
7
f
64  
GND  
2
PDF  
CP  
VS  
3
4
6
5
LF  
ANT1  
PA  
VCO  
XTO  
XTAL  
PLL  
3
4546F–RKE–12/08  
3. General Description  
This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmit-  
ters to be assembled. The VCO is locked to 64 × fXTAL hence a 13.5672 MHz crystal is needed  
for a 868.3 MHz transmitter and a 14.2969 MHz crystal for a 915 MHz transmitter. All other PLL  
and VCO peripheral elements are integrated.  
The XTO is a series resonance oscillator so that only one capacitor together with a crystal con-  
nected in series to GND are needed as external elements.  
The crystal oscillator together with the PLL needs typically < 1 ms until the PLL is locked and the  
CLK output is stable. There is a wait time of 4 ms must be used until the CLK is used for the  
microcontroller and the PA is switched on.  
The power amplifier is an open-collector output delivering a current pulse which is nearly inde-  
pendent from the load impedance. The delivered output power is hence controllable via the  
connected load impedance.  
This output configuration enables a simple matching to any kind of antenna or to 50Ω. A high  
power efficiency of η= Pout/(IS,PA × VS) of 24% for the power amplifier at 868.3 MHz results when  
an optimized load impedance of ZLoad = (166 + j226)Ω is used at 3V supply voltage.  
4. Functional Description  
If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very  
small amount of current, so that a lithium cell used as power supply can work for several years.  
With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L  
only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The  
VCO locks to 64 times the XTO frequency.  
With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are  
on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform  
the ASK modulation.  
4.1  
4.2  
ASK Transmission  
The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t 4 ms, then the CLK  
signal can be taken to clock the microcontroller and the output power can be modulated by  
means of pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcon-  
troller switches back to internal clocking. The T5750 is switched back to standby mode with  
ENABLE = L.  
FSK Transmission  
The T5750 is activated by ENABLE = H. PA_ENABLE must remain L for t 4 ms, then the CLK  
signal can be taken to clock the microcontroller and the power amplifier is switched on with  
PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to  
switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain  
output port, thus changing the reference frequency of the PLL. If the switch is closed, the output  
frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L  
and the microcontroller switches back to internal clocking. The T5750 is switched back to  
standby mode with ENABLE = L.  
The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the fol-  
lowing tolerances are considered.  
4
T5750  
4546F–RKE–12/08  
T5750  
Figure 4-1. Tolerances of Frequency Modulation  
VS  
CStray1  
CStray2  
LM  
C4  
XTAL  
CM  
RS  
C0  
C5  
CSwitch  
Using C4 = 9.2 pF ±2%, C5 = 6.8 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capaci-  
tances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the  
crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21.5 kHz  
typical with worst case tolerances of ±16.8 kHz to ±28.0 kHz results.  
4.3  
CLK Output  
An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS  
compatible if the load capacitance is lower than 10 pF.  
4.3.1  
Clock Pulse Take-over  
The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel®’s  
ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the  
T5750 with ENABLE = H, and after 4 ms to assume the clock signal of the transmission IC, so  
that the message can be sent with crystal accuracy.  
4.3.2  
Output Matching and Power Setting  
The output power is set by the load impedance of the antenna. The maximum output power is  
achieved with a load impedance of ZLoad,opt = (166 + j226)Ω at 868.3 MHz. There must be a low  
resistive path to VS to deliver the DC current.  
The delivered current pulse of the power amplifier is 7.7 mA and the maximum output power is  
delivered to a resistive load of 475Ω if the 0.53 pF output capacitance of the power amplifier is  
compensated by the load impedance.  
An optimum load impedance of:  
Z
Load = 475Ω || j/(2 × p × f × 0.53 pF) = (166 + j226)Ω thus results for the maximum output  
power of 5.5 dBm.  
The load impedance is defined as the impedance seen from the T5750’s ANT1, ANT2 into the  
matching network. Do not confuse this large signal load impedance with a small signal input  
impedance delivered as input characteristic of RF amplifiers and measured from the application  
into the IC instead of from the IC into the application for a power amplifier.  
Less output power is achieved by lowering the real parallel part of 475Ωwhere the parallel imag-  
inary part should be kept constant.  
Output power measurement can be done with the circuit of Figure 4-2 on page 6. Note that the  
component values must be changed to compensate the individual board parasitics until the  
T5750 has the right load impedance ZLoad,opt = (166 + j226)Ω at 868.3 MHz. Also the damping of  
the cable used to measure the output power must be calibrated out.  
5
4546F–RKE–12/08  
Figure 4-2. Output Power Measurement  
VS  
C1  
1 nF  
L1 10 nH  
Power  
meter  
Z = 50Ω  
C2  
ANT1  
1.5 pF  
C3  
ZLopt  
Rin  
50Ω  
2.7 pF  
ANT2  
4.4  
Application Circuit  
For the supply-voltage blocking capacitor C3 a value of 68 nF/X7R is recommended (see Figure  
4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the  
power amplifier where C1 typically is 3.9 pF/NP0 and C2 is 1 pF/NP0; for C2 two capacitors in  
series should be used to achieve a better tolerance value and to have the possibility to realize  
the ZLoad,opt by using standard valued capacitors.  
C1 forms together with the pins of T5750 and the PCB board wires a series resonance loop that  
suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the  
best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and  
ANT2.  
The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop  
antenna is too high.  
L1 (50 nH to 100 nH) can be printed on PCB. C4 should be selected so that the XTO runs on  
the load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF  
load-capacitance crystal.  
6
T5750  
4546F–RKE–12/08  
T5750  
Figure 4-3. ASK Application Circuit  
S1  
VDD  
VSS  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
S2  
20  
BPXY  
7
T5750  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
64  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
VS  
Loop  
Antenna  
LF  
C1  
ANT1  
XTAL  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
7
4546F–RKE–12/08  
Figure 4-4. FSK Application Circuit  
S1  
VDD  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
20  
18  
S2  
VSS  
BP42/T2O  
BPXY  
7
T5750  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
64  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
Loop  
Antenna  
LF  
VS  
C1  
C5  
XTAL  
ANT1  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
8
T5750  
4546F–RKE–12/08  
T5750  
Figure 4-5. ESD Protection Circuit  
VS  
ANT1  
ANT2  
CLK  
PA_ENABLE  
XTAL  
ENABLE  
GND  
5. Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Symbol  
Minimum  
Maximum  
Unit  
V
Supply voltage  
VS  
5
100  
Power dissipation  
Junction temperature  
Storage temperature  
Ambient temperature  
Input voltage  
Ptot  
mW  
°C  
°C  
°C  
V
Tj  
Tstg  
150  
–55  
–55  
–0.3  
125  
Tamb  
125  
(VS + 0.3)(1)  
VmaxPA_ENABLE  
Note:  
1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V.  
6. Thermal Resistance  
Parameters  
Symbol  
Value  
Unit  
Junction ambient  
RthJA  
170  
K/W  
7. Electrical Characteristics  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Power down,  
V
ENABLE < 0.25V, 40°C to 85°C  
350  
7
nA  
µA  
nA  
Supply current  
VPA_ENABLE < 0.25V, 85°C to +125°C  
VPA_ENABLE < 0.25V, 25°C  
IS_Off  
<10  
(100% correlation tested)  
Power up, PA off, VS = 3V,  
VENABLE > 1.7V, VPA_ENABLE < 0.25V  
IS  
3.6  
8.5  
5.5  
4.6  
11  
8
mA  
mA  
Supply current  
Output power  
Power up, VS = 3.0,  
VENABLE > 1.7V, VPA_ENABLE > 1.7V  
IS_Transmit  
PRef  
VS = 3.0V, Tamb = 25°C,  
f = 868.3 MHz, ZLoad = (166 + j226)Ω  
3.5  
dBm  
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
9
4546F–RKE–12/08  
7. Electrical Characteristics (Continued)  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Tamb = –40°C to +85°C,  
VS = 3.0V  
VS = 2.0V  
Output power variation for the full  
temperature range  
ΔPRef  
ΔPRef  
–1.5  
–4.0  
dB  
dB  
Tamb = –40°C to +125°C,  
Output power variation for the full VS = 3.0V  
ΔPRef  
ΔPRef  
–2.0  
–4.5  
dB  
dB  
temperature range  
VS = 2.0V,  
POut = PRef + ΔPRef  
Achievable output-power range  
Selectable by load impedance  
POut_typ  
–3  
+5.5  
dBm  
fCLK = f0/128  
Load capacitance at pin CLK = 10 pF  
fO ±1 × fCLK  
fO ±4 × fCLK  
Spurious emission  
–52  
–52  
dBc  
dBc  
other spurious are lower  
f
XTO = f0/64  
fXTAL = resonant frequency of the XTAL,  
M 10 fF, load capacitance selected  
Oscillator frequency XTO  
(= phase comparator frequency)  
C
fXTO  
accordingly  
Tamb = –40°C to +85°C,  
Tamb = –40°C to +125°C  
–30  
–40  
fXTAL  
+30  
+40  
ppm  
ppm  
PLL loop bandwidth  
250  
–116  
–80  
kHz  
Referred to fPC = fXT0,  
25 kHz distance to carrier  
Phase noise of phase comparator  
In loop phase noise PLL  
Phase noise VCO  
–110  
–74  
dBc/Hz  
25 kHz distance to carrier  
dBc/Hz  
at 1 MHz  
at 36 MHz  
–89  
–120  
–86  
–117  
dBc/Hz  
dBc/Hz  
Frequency range of VCO  
fVCO  
868  
928  
MHz  
Clock output frequency (CMOS  
microcontroller compatible)  
f0/256  
MHz  
V0h  
V0l  
VS × 0.8  
V
V
Voltage swing at pin CLK  
CLoad 10 pF  
VS × 0.2  
110  
7
Series resonance R of the crystal  
Capacitive load at pin XT0  
Rs  
Ω
pF  
FSK modulation frequency rate  
ASK modulation frequency rate  
Duty cycle of the modulation signal = 50%  
Duty cycle of the modulation signal = 50%  
0
0
32  
kHz  
kHz  
32  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
ENABLE input  
1.7  
1.7  
20  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
(1)  
PA_ENABLE input  
VS  
5
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
10  
T5750  
4546F–RKE–12/08  
T5750  
8. Ordering Information  
Extended Type Number  
Package  
Remarks  
T5750-6AQJ  
TSSOP8L  
Taped and reeled, Marking: T570, Pb-free  
9. Package Information  
Package: TSSOP 8L  
Dimensions in mm  
3±0.1  
3±0.1  
+0.06  
3.8±0.3  
4.9±0.1  
0.31-0.07  
0.65 nom.  
3 x 0.65 = 1.95 nom.  
8
5
4
technical drawings  
according to DIN  
specifications  
1
Drawing-No.: 6.543-5083.01-4  
Issue: 2; 15.03.04  
11  
4546F–RKE–12/08  
10. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Put datasheet in the newest template  
4546F-RKE-12/08  
Section 7 “Electrical Characteristics” on page 10 changed  
Put datasheet in the newest template  
Pb-free logo on page 1 deleted  
4546E-RKE-02/07  
4546D-RKE-09/05  
Pb-free logo on page 1 added  
Ordering Information on page 11 changed  
Put datasheet in the newest template  
4546C-RKE-05/05  
Rename M4xCx9x in ATARx9x  
Table “Absolute Maximum Ratings” on page 9: New heading rows added  
Table “Absolute Maximum Ratings” on page 9: row “Input voltage” added  
Table “Absolute Maximum Ratings” on page 9: table note 1 added  
Table “Electrical Characteristics” on pages 9 to 10: row “PA_ENABLE input”  
changed  
4546B-RKE-07/04  
Table “Electrical Characteristics” on pages 9 to 10: table note 1 added  
Table “Ordering Informations” on page 11: Remarks changed  
12  
T5750  
4546F–RKE–12/08  
Headquarters  
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Atmel Corporation  
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4546F–RKE–12/08  
Features  
Integrated PLL Loop Filter  
ESD Protection also at ANT1/ANT2  
(4 kV HBM/200 V MM; Except Pin 2: 4 kV HBM/100 V MM)  
High Output Power (8.0 dBm) with Low Supply Current (9.0 mA)  
Modulation Scheme ASK/FSK  
– FSK Modulation is Achieved by Connecting an Additional Capacitor Between the  
XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller  
Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply  
Single Li-cell for Power Supply  
Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to +85°C/125°C  
Package TSSOP8L  
UHF ASK/FSK  
Transmitter  
Single-ended Antenna Output with High Efficient Power Amplifier  
CLK Output for Clocking the Microcontroller  
One-chip Solution with Minimum External Circuitry  
125°C Operation for Tire Pressure Systems  
T5753  
1. Description  
The T5753 is a PLL transmitter IC which has been developed for the demands of RF  
low-cost transmission systems at data rates up to 32 kBaud. The transmitting  
frequency range is 310 MHz to 350 MHz. It can be used in both FSK and ASK  
systems.  
Figure 1-1. System Block Diagram  
UHF ASK/FSK  
UHF ASK/FSK  
Remote control transmitter  
Remote control receiver  
1 Li cell  
T5753  
U3741B/  
U3745B/  
T5743/  
1 to 3 Micro-  
controller  
Demod  
IF Amp  
Control  
T5744  
Encoder  
ATARx9x  
PLL  
Keys  
Antenna Antenna  
XTO  
VCO  
LNA  
PLL  
XTO  
LNA  
VCO  
4510J–RKE–12/08  
2. Pin Configuration  
Figure 2-1. Pinning TSSOP8L  
T5753  
CLK  
PA_ENABLE  
ANT2  
1
2
3
4
8
7
6
5
ENABLE  
GND  
VS  
ANT1  
XTAL  
Table 2-1.  
Pin  
Pin Description  
Symbol  
Function  
Configuration  
VS  
Clock output signal for microcontroller  
The clock output frequency is set by the  
crystal to fXTAL/4  
100Ω  
CLK  
1
CLK  
100Ω  
50 kΩ  
PA_ENABLE  
U
= 1.1V  
REF  
Switches on power amplifier, used for  
ASK modulation  
2
PA_ENABLE  
20 µA  
ANT1  
ANT2  
3
4
ANT2  
ANT1  
Emitter of antenna output stage  
Open collector antenna output  
2
T5753  
4510J–RKE–12/08  
T5753  
Table 2-1.  
Pin  
Pin Description (Continued)  
Symbol  
Function  
Configuration  
VS  
VS  
1.5 kΩ  
1.2 kΩ  
5
XTAL  
Connection for crystal  
XTAL  
182 µA  
6
7
VS  
Supply voltage  
Ground  
See ESD protection circuitry (see Figure 4-5 on page 9)  
See ESD protection circuitry (see Figure 4-5 on page 9)  
GND  
200 kΩ  
ENABLE  
8
ENABLE  
Enable input  
Figure 2-2. Block Diagram  
T5753  
Power up/down  
f
CLK  
PA_ENABLE  
ANT2  
ENABLE  
4
1
8
7
f
32  
GND  
2
PDF  
CP  
VS  
3
4
6
5
LF  
ANT1  
PA  
VCO  
XTO  
XTAL  
PLL  
3
4510J–RKE–12/08  
3. General Description  
This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmit-  
ters to be assembled. The VCO is locked to 32 fXTAL hence a 9.8438 MHz crystal is needed for a  
315 MHz transmitter. All other PLL and VCO peripheral elements are integrated.  
The XTO is a series resonance oscillator so that only one capacitor together with a crystal con-  
nected in series to GND are needed as external elements.  
The crystal oscillator together with the PLL needs typically < 3 ms until the PLL is locked and the  
CLK output is stable. There is a wait time of 3 ms until the CLK is used for the microcontroller  
and the PA is switched on.  
The power amplifier is an open-collector output delivering a current pulse which is nearly inde-  
pendent from the load impedance. The delivered output power is hence controllable via the  
connected load impedance.  
This output configuration enables a simple matching to any kind of antenna or to 50 Ω. A high  
power efficiency of η= Pout/(IS,PA VS) of 40% for the power amplifier results when an optimized  
load impedance of ZLoad = (255 + j192) Ω is used at 3 V supply voltage.  
4. Functional Description  
If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very  
small amount of current so that a lithium cell used as power supply can work for several years.  
With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L  
only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The  
VCO locks to 32 times the XTO frequency.  
With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are  
on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform  
the ASK modulation.  
4.1  
4.2  
ASK Transmission  
The T5753 is activated by ENABLE = H. PA_ENABLE must remain L for typically 3 ms, then  
the CLK signal can be taken to clock the microcontroller and the output power can be modulated  
by means of Pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the micro-  
controller switches back to internal clocking. The T5753 is switched back to standby mode with  
ENABLE = L.  
FSK Transmission  
The T5753 is activated by ENABLE = H. PA_ENABLE must remain L for typically 3 ms, then  
the CLK signal can be taken to clock the microcontroller and the power amplifier is switched on  
with PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to  
switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain  
output port, thus changing the reference frequency of the PLL. If the switch is closed, the output  
frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L  
and the microcontroller switches back to internal clocking. The T5753 is switched back to  
standby mode with ENABLE = L.  
The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the fol-  
lowing tolerances are considered.  
4
T5753  
4510J–RKE–12/08  
T5753  
Figure 4-1. Tolerances of Frequency Modulation  
VS  
CStray1  
CStray2  
LM  
C4  
XTAL  
CM  
RS  
C0  
Crystal equivalent circuit  
C5  
CSwitch  
Using C4 = 8.2 pF ±5%, C5 = 10 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capaci-  
tances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the  
crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21.5 kHz  
typical with worst case tolerances of ±16.25 kHz to ±28.01 kHz results.  
4.3  
CLK Output  
An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS  
compatible if the load capacitance is lower than 10 pF.  
4.3.1  
Clock Pulse Take-over  
The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel®’s  
ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the  
T5753 with ENABLE = H, and after 3 ms to assume the clock signal of the transmission IC, so  
that the message can be sent with crystal accuracy.  
4.3.2  
Output Matching and Power Setting  
The output power is set by the load impedance of the antenna. The maximum output power is  
achieved with a load impedance of ZLoad,opt = (255 + j192)Ω. There must be a low resistive path  
to VS to deliver the DC current.  
The delivered current pulse of the power amplifier is 9 mA and the maximum output power is  
delivered to a resistive load of 400Ω if the 1.0 pF output capacitance of the power amplifier is  
compensated by the load impedance.  
An optimum load impedance of:  
Z
Load = 400Ω || j/(2 × π 1.0 pF) = (255 + j192)Ω thus results for the maximum output power of  
8 dBm.  
The load impedance is defined as the impedance seen from the T5753’s ANT1, ANT2 into the  
matching network. Do not confuse this large signal load impedance with a small signal input  
impedance delivered as input characteristic of RF amplifiers and measured from the application  
into the IC instead of from the IC into the application for a power amplifier.  
Less output power is achieved by lowering the real parallel part of 400Ωwhere the parallel imag-  
inary part should be kept constant.  
Output power measurement can be done with the circuit of Figure 4-2. Note that the component  
values must be changed to compensate the individual board parasitics until the T5753 has the  
right load impedance ZLoad,opt = (255 + j192)Ω. Also the damping of the cable used to measure  
the output power must be calibrated out.  
5
4510J–RKE–12/08  
Figure 4-2. Output Power Measurement at f = 315 MHz  
VS  
C1  
1 nF  
L1 56 nH  
Power  
meter  
Z = 50Ω  
C2  
ANT1  
3.3 pF  
ZLopt  
Rin  
50Ω  
ANT2  
Note:  
For 345 MHz C2 has to be changed to 2.7 pF  
4.4  
Application Circuit  
For the blocking of the supply voltage a capacitor value of C3 = 68 nF/X7R is recommended  
(see Figure 4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop  
antenna to the power amplifier where C1 typically is 22 pF/NP0 and C2 is 10.8 pF/NP0  
(18 pF + 27 pF in series); for C2 two capacitors in series should be used to achieve a better tol-  
erance value and to have the possibility to realize the ZLoad,opt by using standard valued  
capacitors.  
C1 forms together with the pins of T5753 and the PCB board wires a series resonance loop that  
suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the  
best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and  
ANT2.  
The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop  
antenna is too high.  
L1 ([50 nH to 100 nH) can be printed on PCB. C4 should be selected that the XTO runs on the  
load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF  
load-capacitance crystal.  
6
T5753  
4510J–RKE–12/08  
T5753  
Figure 4-3. ASK Application Circuit  
S1  
VDD  
VSS  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
S2  
20  
BPXY  
7
T5753  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
32  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
VS  
Loop  
Antenna  
LF  
C1  
ANT1  
XTAL  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
7
4510J–RKE–12/08  
Figure 4-4. FSK Application Circuit  
S1  
VDD  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
20  
18  
S2  
VSS  
BP42/T2O  
BPXY  
7
T5753  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
32  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
Loop  
Antenna  
LF  
VS  
C1  
C5  
XTAL  
ANT1  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
8
T5753  
4510J–RKE–12/08  
T5753  
Figure 4-5. ESD Protection Circuit  
VS  
ANT1  
ANT2  
CLK  
PA_ENABLE  
XTAL  
ENABLE  
GND  
5. Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Symbol  
Minimum  
Maximum  
Unit  
V
Supply voltage  
VS  
5
100  
Power dissipation  
Junction temperature  
Storage temperature  
Ambient temperature  
Input voltage  
Ptot  
mW  
°C  
°C  
°C  
V
Tj  
Tstg  
150  
–55  
–55  
–0.3  
125  
Tamb  
125  
(VS + 0.3)(1)  
VmaxPA_ENABLE  
Note:  
1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V.  
6. Thermal Resistance  
Parameters  
Symbol  
Value  
Unit  
Junction ambient  
RthJA  
170  
K/W  
7. Electrical Characteristics  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Power down,  
VENABLE < 0.25 V, -40°C to 85°C  
350  
7
nA  
µA  
nA  
Supply current  
VPA-ENABLE < 0.25 V, -40°C to +125°C  
IS_Off  
VPA-ENABLE < 0.25 V, 25°C  
(100% correlation tested)  
< 10  
Power up, PA off, VS = 3 V,  
Supply current  
Supply current  
Output power  
IS  
3.7  
9
4.8  
mA  
mA  
VENABLE > 1.7 V, VPA-ENABLE < 0.25 V  
Power up, VS = 3.0 V,  
VENABLE > 1.7 V, VPA-ENABLE > 1.7 V  
IS_Transmit  
PRef  
11.6  
10.5  
VS = 3.0V, Tamb = 25°C,  
f = 315 MHz, ZLoad = (255 + j192)W  
6.0  
8.0  
dBm  
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
9
4510J–RKE–12/08  
7. Electrical Characteristics (Continued)  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Tamb = –40°C to +85°C,  
VS = 3.0V  
VS = 2.0V  
Output power variation for the full  
temperature range  
ΔPRef  
ΔPRef  
–1.5  
–4.0  
dB  
dB  
Tamb = –40°C to +125°C,  
VS = 3.0V  
VS = 2.0V,  
Output power variation for the full  
temperature range  
ΔPRef  
ΔPRef  
–2.0  
–4.5  
dB  
dB  
POut = PRef + ΔPRef  
Achievable output-power range  
Spurious emission  
Selectable by load impedance  
POut_typ  
0
8.0  
dBm  
fCLK = f0/128  
Load capacitance at pin CLK = 10 pF  
fO ±1 × fCLK  
–55  
–52  
dBc  
dBc  
fO ±4 × fCLK  
other spurious are lower  
f
XTO = f0/32  
fXTAL = resonant frequency of the XTAL,  
CM 10 fF, load capacitance selected  
Oscillator frequency XTO  
(= phase comparator frequency)  
fXTO  
accordingly  
Tamb = –40°C to +85°C,  
Tamb = –40°C to +125°C  
–30  
–40  
fXTAL  
+30  
+40  
ppm  
ppm  
PLL loop bandwidth  
250  
–116  
–86  
kHz  
Referred to fPC = fXT0,  
25 kHz distance to carrier  
Phase noise of phase comparator  
In loop phase noise PLL  
Phase noise VCO  
–110  
–80  
dBc/Hz  
25 kHz distance to carrier  
dBc/Hz  
at 1 MHz  
at 36 MHz  
–94  
–125  
–90  
–121  
dBc/Hz  
dBc/Hz  
Frequency range of VCO  
fVCO  
310  
350  
MHz  
Clock output frequency (CMOS  
microcontroller compatible)  
f0/128  
MHz  
V0h  
V0l  
V
V
Voltage swing at pin CLK  
CLoad 10 pF  
VS × 0.8  
VS × 0.2  
Series resonance R of the crystal  
Capacitive load at pin XT0  
Rs  
110  
7
Ω
pF  
FSK modulation frequency rate  
ASK modulation frequency rate  
Duty cycle of the modulation signal = 50%  
Duty cycle of the modulation signal = 50%  
0
0
32  
kHz  
kHz  
32  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
ENABLE input  
1.7  
1.7  
20  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
(1)  
PA_ENABLE input  
VS  
5
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
10  
T5753  
4510J–RKE–12/08  
T5753  
8. Ordering Information  
Extended Type Number  
Package  
TSSOP8L  
TSSOP8L  
Remarks  
T5753-6AQJ  
Taped and reeled, Marking: T573, Pb-free  
T5753-6APJ  
Taped and reeled, Marking: T573, small reel, Pb-free  
Note:  
1. J = –40°C to +125°C + lead-free  
9. Package Information  
Package: TSSOP 8L  
Dimensions in mm  
3±0.1  
3±0.1  
+0.06  
3.8±0.3  
4.9±0.1  
0.31-0.07  
0.65 nom.  
3 x 0.65 = 1.95 nom.  
8
5
4
technical drawings  
according to DIN  
specifications  
1
Drawing-No.: 6.543-5083.01-4  
Issue: 2; 15.03.04  
11  
4510J–RKE–12/08  
10. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Put datasheet in the newest template  
4510J-RKE-12/08  
Section 4.3.1 “Clock Pulse Take-over” on page 5 changed  
Put datasheet in the newest template  
Pb-free Logo on page 1 deleted  
4510I-RKE-02/07  
4510H-RKE-09/05  
Pb-free Logo on page 1 added  
Put datasheet in the newest template  
Section 1 “Description” on page 1 changed  
Figure title Figure 4-2 on page 6 changed  
4510G-RKE-02/05  
4510F-RKE-02/05  
Table “Electrical Characteristics” on pages 9 to 10 changed  
Table “Ordering Information” on page 11 changed  
Table “Absolute Maximum Ratings” (page 8): row “Input voltage” added  
Table “Absolute Maximum Ratings” (page 8): table note 1 added  
Table “Electrical Characteristics” (page 10): row “PA_ENABLE input“ changed  
Table “Electrical Characteristics” (page 10): table note 1 added  
Table “Ordering Information” (page 11): Remarks changed  
12  
T5753  
4510J–RKE–12/08  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
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auto_control@atmel.com  
www.atmel.com/contacts  
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www.atmel.com/literature  
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4510J–RKE–12/08  
Features  
Integrated PLL Loop Filter  
ESD Protection also at ANT1/ANT2  
(4 kV HBM/200V MM; Except Pin 2: 4 kV HBM/100V MM)  
High Output Power (7.5 dBm) with Low Supply Current (9.0 mA)  
Modulation Scheme ASK/ FSK  
– FSK Modulation is Achieved by Connecting an Additional Capacitor Between the  
XTAL Load Capacitor and the Open Drain Output of the Modulating Microcontroller  
Easy to Design-in Due to Excellent Isolation of the PLL from the PA and Power Supply  
Single Li-cell for Power Supply  
Supply Voltage 2.0V to 4.0V in the Temperature Range of –40°C to 85°C/125°C  
Package TSSOP8L  
UHF ASK/FSK  
Transmitter  
Single-ended Antenna Output with High Efficient Power Amplifier  
CLK Output for Clocking the Microcontroller  
One-chip Solution with Minimum External Circuitry  
125°C Operation for Tire Pressure Systems  
T5754  
1. Description  
The T5754 is a PLL transmitter IC which has been developed for the demands of RF  
low-cost transmission systems at data rates up to 32 kBaud. The transmitting  
frequency range is 429 MHz to 439 MHz. It can be used in both FSK and ASK  
systems.  
Figure 1-1. System Block Diagram  
UHF ASK/FSK  
UHF ASK/FSK  
Remote control transmitter  
Remote control receiver  
1 Li cell  
T5754  
U3741B/  
U3745B/  
T5743/  
1 to 3 Micro-  
controller  
Demod  
Control  
T5744  
Encoder  
ATARx9x  
PLL  
Keys  
Antenna Antenna  
XTO  
VCO  
PLL  
XTO  
Power  
amp.  
LNA  
VCO  
4511I–RKE–02/07  
2. Pin Configuration  
Figure 2-1. Pinning TSSOP8L  
CLK  
PA_ENABLE  
ANT2  
1
2
3
4
8
7
6
5
ENABLE  
GND  
VS  
ANT1  
XTAL  
Table 2-1.  
Pin  
Pin Description  
Symbol  
Function  
Configuration  
VS  
Clock output signal for micro con roller  
The clock output frequency is set by the  
crystal to fXTAL/4  
100Ω  
CLK  
1
CLK  
100Ω  
50 kΩ  
PA_ENABLE  
UREF = 1.1V  
Switches on power amplifier, used for  
ASK modulation  
2
PA_ENABLE  
20 µA  
ANT1  
ANT2  
3
4
ANT2  
ANT1  
Emitter of antenna output stage  
Open collector antenna output  
2
T5754  
4511I–RKE–02/07  
T5754  
Table 2-1.  
Pin  
Pin Description (Continued)  
Symbol  
Function  
Configuration  
VS  
VS  
1.5 kΩ  
1.2 kΩ  
5
XTAL  
Connection for crystal  
XTAL  
182 µA  
6
7
VS  
Supply voltage  
Ground  
See ESD protection circuitry (see Figure 4-5 on page 9)  
See ESD protection circuitry (see Figure 4-5 on page 9)  
GND  
200 kΩ  
ENABLE  
8
ENABLE  
Enable input  
Figure 2-2. Block Diagram  
T5754  
Power up/down  
f
CLK  
PA_ENABLE  
ANT2  
ENABLE  
4
1
8
7
f
32  
GND  
2
PDF  
CP  
VS  
3
4
6
5
LF  
ANT1  
PA  
VCO  
XTO  
XTAL  
PLL  
3
4511I–RKE–02/07  
3. General Description  
This fully integrated PLL transmitter allows particularly simple, low-cost RF miniature transmit-  
ters to be assembled. The VCO is locked to 32 fXTAL hence a 13.56 MHz crystal is needed for a  
433.92 MHz transmitter. All other PLL and VCO peripheral elements are integrated.  
The XTO is a series resonance oscillator so that only one capacitor together with a crystal con-  
nected in series to GND are needed as external elements.  
The crystal oscillator together with the PLL needs typically < 1 ms until the PLL is locked and the  
CLK output is stable. There is a wait time of 1 ms until the CLK is used for the microcontroller  
and the PA is switched on.  
The power amplifier is an open-collector output delivering a current pulse which is nearly inde-  
pendent from the load impedance. The delivered output power is hence controllable via the  
connected load impedance.  
This output configuration enables a simple matching to any kind of antenna or to 50. A high  
power efficiency of η= Pout/(IS,PA VS) of 36% for the power amplifier results when an optimized  
load impedance of ZLoad = (166 + j223)is used at 3V supply voltage.  
4. Functional Description  
If ENABLE = L and the PA_ENABLE = L, the circuit is in standby mode consuming only a very  
small amount of current so that a lithium cell used as power supply can work for several years.  
With ENABLE = H the XTO, PLL and the CLK driver are switched on. If PA_ENABLE remains L  
only the PLL and the XTO is running and the CLK signal is delivered to the microcontroller. The  
VCO locks to 32 times the XTO frequency.  
With ENABLE = H and PA_ENABLE = H the PLL, XTO, CLK driver and the power amplifier are  
on. With PA_ENABLE the power amplifier can be switched on and off, which is used to perform  
the ASK modulation.  
4.1  
4.2  
ASK Transmission  
The T5754 is activated by ENABLE = H. PA_ENABLE must remain L for t 1 ms, then the CLK  
signal can be taken to clock the microcontroller and the output power can be modulated by  
means of pin PA_ENABLE. After transmission PA_ENABLE is switched to L and the microcon-  
troller switches back to internal clocking. The T5754 is switched back to standby mode with  
ENABLE = L.  
FSK Transmission  
The T5754 is activated by ENABLE = H. PA_ENABLE must remain L for t 1 ms, then the CLK  
signal can be taken to clock the microcontroller and the power amplifier is switched on with  
PA_ENABLE = H. The chip is then ready for FSK modulation. The microcontroller starts to  
switch on and off the capacitor between the XTAL load capacitor and GND with an open-drain  
output port, thus changing the reference frequency of the PLL. If the switch is closed, the output  
frequency is lower than if the switch is open. After transmission PA_ENABLE is switched to L  
and the microcontroller switches back to internal clocking. The T5754 is switched back to  
standby mode with ENABLE = L.  
The accuracy of the frequency deviation with XTAL pulling method is about ±25% when the fol-  
lowing tolerances are considered.  
4
T5754  
4511I–RKE–02/07  
T5754  
Figure 4-1. Tolerances of Frequency Modulation  
VS  
CStray1  
CStray2  
LM  
C4  
XTAL  
CM  
RS  
C0  
Crystal equivalent circuit  
C5  
CSwitch  
Using C4 = 9.2 pF ±2%, C5 = 6.8 pF ±5%, a switch port with CSwitch = 3 pF ±10%, stray capaci-  
tances on each side of the crystal of CStray1 = CStray2 = 1 pF ±10%, a parallel capacitance of the  
crystal of C0 = 3.2 pF ±10% and a crystal with CM = 13 fF ±10%, an FSK deviation of ±21 kHz  
typical with worst case tolerances of ±16.3 kHz to ±28.8 kHz results.  
4.3  
CLK Output  
An output CLK signal is provided for a connected microcontroller, the delivered signal is CMOS  
compatible if the load capacitance is lower than 10 pF.  
4.3.1  
Clock Pulse Take-over  
The clock of the crystal oscillator can be used for clocking the microcontroller. Atmel®’s  
ATARx9x has the special feature of starting with an integrated RC-oscillator to switch on the  
T5754 with ENABLE = H, and after 1 ms to assume the clock signal of the transmission IC, so  
that the message can be sent with crystal accuracy.  
4.3.2  
Output Matching and Power Setting  
The output power is set by the load impedance of the antenna. The maximum output power is  
achieved with a load impedance of ZLoad,opt = (166 + j223). There must be a low resistive path  
to VS to deliver the DC current.  
The delivered current pulse of the power amplifier is 9 mA and the maximum output power is  
delivered to a resistive load of 465if the 1.0 pF output capacitance of the power amplifier is  
compensated by the load impedance.  
An optimum load impedance of:  
Z
Load = 465|| j/(2 × π 1.0 pF) = (166 + j223)thus results for the maximum output power of  
7.5 dBm.  
The load impedance is defined as the impedance seen from the T5754’s ANT1, ANT2 into the  
matching network. Do not confuse this large signal load impedance with a small signal input  
impedance delivered as input characteristic of RF amplifiers and measured from the application  
into the IC instead of from the IC into the application for a power amplifier.  
Less output power is achieved by lowering the real parallel part of 465where the parallel imag-  
inary part should be kept constant.  
Output power measurement can be done with the circuit of Figure 4-2 on page 6. Note that the  
component values must be changed to compensate the individual board parasitics until the  
T5754 has the right load impedance ZLoad,opt = (166 + j223). Also the damping of the cable  
used to measure the output power must be calibrated out.  
5
4511I–RKE–02/07  
Figure 4-2. Output Power Measurement  
VS  
C1  
1 nF  
L1 33 nH  
Power  
meter  
Z = 50Ω  
C2  
ANT1  
2.2 pF  
ZLopt  
Rin  
50Ω  
ANT2  
4.4  
Application Circuit  
For the supply-voltage blocking capacitor C3 a value of 68 nF/X7R is recommended (see Figure  
4-3 on page 7 and Figure 4-4 on page 8). C1 and C2 are used to match the loop antenna to the  
power amplifier where C1 typically is 8.2 pF/NP0 and C2 is 6 pF/NP0 (10 pF + 15 pF in series);  
for C2 two capacitors in series should be used to achieve a better tolerance value and to have  
the possibility to realize the ZLoad,opt by using standard valued capacitors.  
C1 forms together with the pins of T5754 and the PCB board wires a series resonance loop that  
suppresses the 1st harmonic, hence the position of C1 on the PCB is important. Normally the  
best suppression is achieved when C1 is placed as close as possible to the pins ANT1 and  
ANT2.  
The loop antenna should not exceed a width of 1.5 mm, otherwise the Q-factor of the loop  
antenna is too high.  
L1 ([50 nH to 100 nH) can be printed on PCB. C4 should be selected that the XTO runs on the  
load resonance frequency of the crystal. Normally, a value of 12 pF results for a 15 pF  
load-capacitance crystal.  
6
T5754  
4511I–RKE–02/07  
T5754  
Figure 4-3. ASK Application Circuit  
S1  
VDD  
VSS  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
S2  
20  
BPXY  
7
T5754  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
32  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
VS  
Loop  
Antenna  
LF  
C1  
ANT1  
XTAL  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
7
4511I–RKE–02/07  
Figure 4-4. FSK Application Circuit  
S1  
VDD  
BPXY  
BPXY  
BPXY  
OSC1  
ATARx9x  
VS  
1
20  
18  
S2  
VSS  
BP42/T2O  
BPXY  
7
T5754  
Power up/down  
CLK  
ENABLE  
f
4
1
2
8
7
f
32  
PA_ENABLE  
GND  
PDF  
CP  
C3  
C2  
ANT2  
VS  
3
4
6
5
Loop  
Antenna  
LF  
VS  
C1  
C5  
XTAL  
ANT1  
XTAL  
PA  
VCO  
XTO  
PLL  
L1  
C4  
VS  
8
T5754  
4511I–RKE–02/07  
T5754  
Figure 4-5. ESD Protection Circuit  
VS  
ANT1  
ANT2  
CLK  
PA_ENABLE  
XTAL  
ENABLE  
GND  
5. Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Symbol  
Minimum  
Maximum  
Unit  
V
Supply voltage  
VS  
5
100  
Power dissipation  
Junction temperature  
Storage temperature  
Ambient temperature  
Input voltage  
Ptot  
mW  
°C  
°C  
°C  
V
Tj  
Tstg  
150  
–55  
–55  
–0.3  
125  
Tamb  
125  
(VS + 0.3)(1)  
VmaxPA_ENABLE  
Note:  
1. If VS + 0.3 is higher than 3.7V, the maximum voltage will be reduced to 3.7V.  
6. Thermal Resistance  
Parameters  
Symbol  
Value  
Unit  
Junction ambient  
RthJA  
170  
K/W  
7. Electrical Characteristics  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0 V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Power down  
V
ENABLE < 0.25V, 40°C to 85°C  
350  
7
nA  
µA  
nA  
Supply current  
VPA-ENABLE < 0.25V, 40°C to +125°C  
VPA-ENABLE < 0.25V, 25°C  
IS_Off  
< 10  
(100% correlation tested)  
Power up, PA off, VS = 3V,  
VENABLE > 1.7V, VPA-ENABLE < 0.25V  
Supply current  
Supply current  
Output power  
IS  
3.7  
9
4.8  
11.6  
10  
mA  
mA  
Power up, VS = 3.0V,  
VENABLE > 1.7V, VPA-ENABLE > 1.7V  
IS_Transmit  
PRef  
VS = 3.0V, Tamb = 25°C,  
f = 433.92 MHz, ZLoad = (166 + j233)Ω  
5.5  
7.5  
dBm  
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
9
4511I–RKE–02/07  
7. Electrical Characteristics (Continued)  
VS = 2.0V to 4.0V, Tamb = –40°C to 125°C unless otherwise specified.  
Typical values are given at VS = 3.0 V and Tamb = 25°C. All parameters are referred to GND (pin 7).  
Parameters  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Tamb = –40°C to +85°C,  
VS = 3.0V  
VS = 2.0V  
Output power variation for the full  
temperature range  
PRef  
PRef  
–1.5  
–4.0  
dB  
dB  
Tamb = –40°C to +125°C,  
Output power variation for the full VS = 3.0V  
PRef  
PRef  
–2.0  
–4.5  
dB  
dB  
temperature range  
VS = 2.0V  
POut = PRef + PRef  
Achievable output-power range  
Selectable by load impedance  
POut_typ  
0
7.5  
dBm  
fCLK = f0/128  
Load capacitance at pin CLK = 10 pF  
fO ±1 × fCLK  
fO ±4 × fCLK  
Spurious emission  
–55  
–52  
dBc  
dBc  
other spurious are lower  
f
XTO = f0/32  
fXTAL = resonant frequency of the XTAL,  
CM 10 fF, load capacitance selected  
Oscillator frequency XTO  
(= phase comparator frequency)  
fXTO  
accordingly  
Tamb = –40°C to +85°C  
Tamb = –40°C to +125°C  
–30  
–40  
fXTAL  
+30  
+40  
ppm  
ppm  
PLL loop bandwidth  
250  
–116  
–86  
kHz  
Referred to fPC = fXT0,  
25 kHz distance to carrier  
Phase noise of phase comparator  
In loop phase noise PLL  
Phase noise VCO  
–110  
–80  
dBc/Hz  
25 kHz distance to carrier  
dBc/Hz  
at 1 MHz  
at 36 MHz  
–94  
–125  
–90  
–121  
dBc/Hz  
dBc/Hz  
Frequency range of VCO  
fVCO  
429  
439  
MHz  
Clock output frequency (CMOS  
microcontroller compatible)  
f0/128  
MHz  
V0h  
V0l  
VS × 0.8  
V
V
Voltage swing at pin CLK  
CLoad 10 pF  
VS × 0.2  
110  
7
Series resonance R of the crystal  
Capacitive load at pin XT0  
Rs  
pF  
FSK modulation frequency rate  
ASK modulation frequency rate  
Duty cycle of the modulation signal = 50%  
Duty cycle of the modulation signal = 50%  
0
0
32  
kHz  
kHz  
32  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
ENABLE input  
1.7  
1.7  
20  
Low level input voltage  
High level input voltage  
Input current high  
VIl  
VIh  
IIn  
0.25  
V
V
µA  
(1)  
PA_ENABLE input  
VS  
5
Note:  
1. If VS is higher than 3.6V, the maximum voltage will be reduced to 3.6V.  
10  
T5754  
4511I–RKE–02/07  
T5754  
8. Ordering Information  
Extended Type Number  
Package  
TSSOP8L  
TSSOP8L  
Remarks  
T5754-6AQJ  
Taped and reeled, Marking: T574, Pb-free  
T5754-6APJ  
Taped and reeled, Marking: T574, small reel, Pb-free  
9. Package Information  
Package: TSSOP 8L  
Dimensions in mm  
3±0.1  
3±0.1  
+0.06  
3.8±0.3  
4.9±0.1  
0.31-0.07  
0.65 nom.  
3 x 0.65 = 1.95 nom.  
8
5
4
technical drawings  
according to DIN  
specifications  
1
Drawing-No.: 6.543-5083.01-4  
Issue: 2; 15.03.04  
11  
4511I–RKE–02/07  
10. Revision History  
Please note that the following page numbers referred to in this section refer to the specific revision  
mentioned, not to this document.  
Revision No.  
History  
Put datasheet in a new template  
Pb-free logo on page 1 deleted  
4711I-RKE-02/07  
Pb-free logo on page 1 added  
4711H-RKE-09/05  
4711G-RKE-05/05  
Ordering Information on page 11 changed  
Put datasheet in a new template  
Package Information (page 11): Replace old package drawing through current  
version  
Abs. Max. Ratings table (page 9): row “Input voltage” added  
Abs. Max. Ratings table (page 9): table note 1 added  
El. Char. table (pages 9 to 10): row “PA_ENABLE input“ changed  
El. Char. table (pages 9 to 10): table note 1 added  
4711F-RKE-07/04  
Ordering Information table (page 11): Remarks changed  
12  
T5754  
4511I–RKE–02/07  
Atmel Corporation  
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4511I–RKE–02/07  
Features  
High Performance, Low Power AVR® 8-Bit Microcontroller  
Advanced RISC Architecture  
– 120 Powerful Instructions – Most Single Clock Cycle Execution  
– 32 x 8 General Purpose Working Registers  
– Fully Static Operation  
Non-volatile Program and Data Memories  
– 2/4/8K Byte of In-System Programmable Program Memory Flash (ATtiny24/44/84)  
Endurance: 10,000 Write/Erase Cycles  
– 128/256/512 Bytes In-System Programmable EEPROM (ATtiny24/44/84)  
Endurance: 100,000 Write/Erase Cycles  
– 128/256/512 Bytes Internal SRAM (ATtiny24/44/84)  
– Programming Lock for Self-Programming Flash Program and EEPROM Data  
Security  
8-bit  
Microcontroller  
with 2/4/8K  
Bytes In-System  
Programmable  
Flash  
Peripheral Features  
– Two Timer/Counters, 8- and 16-bit counters with two PWM Channels on both  
– 10-bit ADC  
8 single-ended channels  
12 differential ADC channel pairs with programmable gain (1x, 20x)  
Temperature Measurement  
– Programmable Watchdog Timer with Separate On-chip Oscillator  
– On-chip Analog Comparator  
ATtiny24/44/84  
Automotive  
Preliminary  
– Universal Serial Interface  
Special Microcontroller Features  
– debugWIRE On-chip Debug System  
– In-System Programmable via SPI Port  
– External and Internal Interrupt Sources  
– Pin Change Interrupt on 12 pins  
– Low Power Idle, ADC Noise Reduction, Standby and Power-down Modes  
– Enhanced Power-on Reset Circuit  
– Programmable Brown-out Detection Circuit  
– Internal Calibrated Oscillator  
– On-chip Temperature Sensor  
I/O and Packages  
– 14-pin SOIC, 20-pin QFN/MLF: Twelve Programmable I/O Lines  
Operating Voltage:  
– 2.7 - 5.5V for ATtiny24/44/84  
Speed Grade  
– ATtiny24/44/84: 0 - 8 MHz @ 2.7 - 5.5V, 0 - 16 MHz @ 4.5 - 5.5V  
Automotive Temperature Range  
Low Power Consumption  
– Active Mode:  
1 MHz, 2.7V: 800 µA  
– Power-down Mode:  
2.7V: 2.0 µA  
Rev. 7701C–AVR–12/08  
1. Pin Configurations  
Figure 1-1. Pinout ATtiny24/44/84  
SOIC  
VCC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
GND  
(PCINT8/XTAL1) PB0  
(PCINT9/XTAL2) PB1  
PA0 (ADC0/AREF/PCINT0)  
PA1 (ADC1/AIN0/PCINT1)  
PA2 (ADC2/AIN1/PCINT2)  
PA3 (ADC3/T0/PCINT3)  
PA4 (ADC4/USCK/SCL/T1/PCINT4)  
PA5 (ADC5/DO/MISO/OC1B/PCINT5)  
(PCINT11/RESET/dW) PB3  
(PCINT10/INT0/OC0A/CKOUT) PB2  
(PCINT7/ICP/OC0B/ADC7) PA7  
(PCINT6/OC1A/SDA/MOSI/ADC6) PA6  
8
QFN/MLF  
Pin 16: PA6 (PCINT6/OC1A/SDA/MOSI/ADC6)  
Pin 20: PA5 (ADC5/DO/MISO/OC1B/PCINT5)  
(ADC4/USCK/SCL/T1/PCINT4) PA4  
(ADC3/T0/PCINT3) PA3  
1
15 PA7 (PCINT7/ICP/OC0B/ADC7)  
14 PB2 (PCINT10/INT0/OC0A/CKOUT)  
13 PB3 (PCINT11/RESET/dW)  
12 PB1 (PCINT9/XTAL2)  
2
3
4
5
(ADC2/AIN1/PCINT2) PA2  
(ADC1/AIN0/PCINT1) PA1  
(ADC0/AREF/PCINT0) PA0  
11 PB0 (PCINT8/XTAL1)  
NOTE  
Bottom pad should be  
soldered to ground.  
DNC: Do Not Connect  
1.1  
Disclaimer  
Typical values contained in this data sheet are based on simulations and characterization of actual ATtiny24/44/84 AVR  
microcontrollers manufactured on the typical process technology. Applicable Automotive Min. and Max. values will be  
available after devices representative of the whole process excursion (corner run) have been characterized.  
2
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
2. Overview  
The ATtiny24/44/84 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced  
RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny24/44/84  
achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize  
power consumption versus processing speed.  
2.1  
Block Diagram  
Figure 2-1. Block Diagram  
VCC  
8-BIT DATABUS  
INTERNAL  
INTERNAL  
OSCILLATOR  
CALIBRATED  
OSCILLATOR  
GND  
PROGRAM  
COUNTER  
STACK  
POINTER  
WATCHDOG  
TIMER  
TIMING AND  
CONTROL  
MCU CONTROL  
REGISTER  
PROGRAM  
FLASH  
SRAM  
MCU STATUS  
REGISTER  
INSTRUCTION  
REGISTER  
GENERAL  
PURPOSE  
REGISTERS  
TIMER/  
COUNTER0  
X
Y
Z
INSTRUCTION  
DECODER  
TIMER/  
COUNTER1  
CONTROL  
LINES  
ALU  
STATUS  
REGISTER  
INTERRUPT  
UNIT  
PROGRAMMING  
LOGIC  
EEPROM  
OSCILLATORS  
ISP INTERFACE  
DATA REGISTER  
PORT A  
DATA DIR.  
REG.PORT A  
ADC  
DATA REGISTER  
PORT B  
DATA DIR.  
REG.PORT B  
PORT A DRIVERS  
PORT B DRIVERS  
PA7-PA0  
PB3-PB0  
The AVR core combines a rich instruction set with 32 general purpose working registers. All the  
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent  
3
7701C–AVR–12/08  
registers to be accessed in one single instruction executed in one clock cycle. The resulting  
architecture is more code efficient while achieving throughputs up to ten times faster than con-  
ventional CISC microcontrollers.  
The ATtiny24/44/84 provides the following features: 2/4/8K byte of In-System Programmable  
Flash, 128/256/512 bytes EEPROM, 128/256/512 bytes SRAM, 12 general purpose I/O lines, 32  
general purpose working registers, a 8-bit Timer/Counter with two PWM channels, a 16-bit  
timer/counter with two PWM channels, Internal and External Interrupts, a 8-channel 10-bit ADC,  
programmable gain stage (1x, 20x) for 12 differential ADC channel pairs, a programmable  
Watchdog Timer with internal Oscillator, internal calibrated oscillator, and three software select-  
able power saving modes. The Idle mode stops the CPU while allowing the SRAM,  
Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The  
Power-down mode saves the register contents, disabling all chip functions until the next Inter-  
rupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules  
except ADC, to minimize switching noise during ADC conversions. In Standby mode, the crys-  
tal/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast  
start-up combined with low power consumption.  
The device is manufactured ng Atmel’s high density non-volatile memory technology. The On-  
chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI  
serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code  
running on the AVR core.  
The ATtiny24/44/84 AVR is supported with a full suite of program and system development tools  
including: C Compilers, Macro Assemblers, Program Debugger/Simulators, In-Circuit Emulators,  
and Evaluation kits.  
2.2  
Automotive Quality Grade  
The ATtiny24/44/84 have been developed and manufactured according to the most stringent  
requirements of the international standard ISO-TS-16949 grade 1. This data sheet contains limit  
values extracted from the results of extensive characterization (Temperature and Voltage). The  
quality and reliability of the ATtiny24/44/84 have been verified during regular product qualifica-  
tion as per AEC-Q100.  
As indicated in the ordering information paragraph, the product is available in only one tempera-  
ture grade,  
Table 2-1.  
Temperature Grade Identification for Automotive Products  
Temperature  
Temperature  
Identifier  
Comments  
-40 ; +125  
Z
Full AutomotiveTemperature Range  
4
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
2.3  
Pin Descriptions  
2.3.1  
VCC  
Supply voltage.  
2.3.2  
2.3.3  
GND  
Ground.  
Port B (PB3...PB0)  
Port B is a 4-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port B output buffers have symmetrical drive characteristics with both high sink and source  
capability except PB3 which has the RESET capability. To use pin PB3 as an I/O pin, instead of  
RESET pin, program (‘0’) RSTDISBL fuse. As inputs, Port B pins that are externally pulled low  
will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a  
reset condition becomes active, even if the clock is not running.  
Port B also serves the functions of various special features of the ATtiny24/44/84 as listed on  
Section 12.3 ”Alternate Port Functions” on page 61.  
2.3.4  
2.3.5  
RESET  
Reset input. A low level on this pin for longer than the minimum pulse length will generate a  
reset, even if the clock is not running. The minimum pulse length is given in Table 9-1 on page  
41. Shorter pulses are not guaranteed to generate a reset.  
Port A (PA7...PA0)  
Port A is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port A output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port A pins are tri-stated when a reset condition becomes active,  
even if the clock is not running.  
Port A has an alternate functions as analog inputs for the ADC, analog comparator, timer/coun-  
ter, SPI and pin change interrupt as described in ”Alternate Port Functions” on page 61  
5
7701C–AVR–12/08  
3. Resources  
A comprehensive set of development tools, drivers and application notes, and datasheets are  
available for download on http://www.atmel.com/avr.  
4. About Code Examples  
This documentation contains simple code examples that briefly show how to use various parts of  
the device. These code examples assume that the part specific header file is included before  
compilation. Be aware that not all C compiler vendors include bit definitions in the header files  
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documen-  
tation for more details.  
For I/O Registers located in extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI”  
instructions must be replaced with instructions that allow access to extended I/O. Typically  
“LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”.  
6
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
5. CPU Core  
5.1  
Overview  
This section discusses the AVR core architecture in general. The main function of the CPU core  
is to ensure correct program execution. The CPU must therefore be able to access memories,  
perform calculations, control peripherals, and handle interrupts.  
5.2  
Architectural Overview  
Figure 5-1. Block Diagram of the AVR Architecture  
Data Bus 8-bit  
Program  
Counter  
Status  
and Control  
Flash  
Program  
Memory  
32 x 8  
General  
Purpose  
Registrers  
Instruction  
Register  
Interrupt  
Unit  
Instruction  
Decoder  
Watchdog  
Timer  
ALU  
Analog  
Comparator  
Control Lines  
Timer/Counter 0  
Timer/Counter 1  
Data  
SRAM  
Universal  
Serial Interface  
EEPROM  
I/O Lines  
In order to maximize performance and parallelism, the AVR uses a Harvard architecture – with  
separate memories and buses for program and data. Instructions in the Program memory are  
executed with a single level pipelining. While one instruction is being executed, the next instruc-  
tion is pre-fetched from the Program memory. This concept enables instructions to be executed  
in every clock cycle. The Program memory is In-System Reprogrammable Flash memory.  
7
7701C–AVR–12/08  
The fast-access Register File contains 32 x 8-bit general purpose working registers with a single  
clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU) operation. In a typ-  
ical ALU operation, two operands are output from the Register File, the operation is executed,  
and the result is stored back in the Register File – in one clock cycle.  
Six of the 32 registers can be used as three 16-bit indirect address register pointers for Data  
Space addressing – enabling efficient address calculations. One of the these address pointers  
can also be used as an address pointer for look up tables in Flash Program memory. These  
added function registers are the 16-bit X-, Y-, and Z-register, described later in this section.  
The ALU supports arithmetic and logic operations between registers or between a constant and  
a register. Single register operations can also be executed in the ALU. After an arithmetic opera-  
tion, the Status Register is updated to reflect information about the result of the operation.  
Program flow is provided by conditional and unconditional jump and call instructions, able to  
directly address the whole address space. Most AVR instructions have a single 16-bit word for-  
mat. Every Program memory address contains a 16- or 32-bit instruction.  
During interrupts and subroutine calls, the return address Program Counter (PC) is stored on the  
Stack. The Stack is effectively allocated in the general data SRAM, and consequently the Stack  
size is only limited by the total SRAM size and the usage of the SRAM. All user programs must  
initialize the SP in the Reset routine (before subroutines or interrupts are executed). The Stack  
Pointer (SP) is read/write accessible in the I/O space. The data SRAM can easily be accessed  
through the five different addressing modes supported in the AVR architecture.  
The memory spaces in the AVR architecture are all linear and regular memory maps.  
A flexible interrupt module has its control registers in the I/O space with an additional Global  
Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt Vector in the  
Interrupt Vector table. The interrupts have priority in accordance with their Interrupt Vector posi-  
tion. The lower the Interrupt Vector address, the higher the priority.  
The I/O memory space contains 64 addresses for CPU peripheral functions as Control Regis-  
ters, SPI, and other I/O functions. The I/O memory can be accessed directly, or as the Data  
Space locations following those of the Register File, 0x20 - 0x5F.  
5.3  
5.4  
ALU – Arithmetic Logic Unit  
The high-performance AVR ALU operates in direct connection with all the 32 general purpose  
working registers. Within a single clock cycle, arithmetic operations between general purpose  
registers or between a register and an immediate are executed. The ALU operations are divided  
into three main categories – arithmetic, logical, and bit-functions. Some implementations of the  
architecture also provide a powerful multiplier supporting both signed/unsigned multiplication  
and fractional format. See the “Instruction Set” section for a detailed description.  
Status Register  
The Status Register contains information about the result of the most recently executed arithme-  
tic instruction. This information can be used for altering program flow in order to perform  
conditional operations. Note that the Status Register is updated after all ALU operations, as  
specified in the Instruction Set Reference. This will in many cases remove the need for using the  
dedicated compare instructions, resulting in faster and more compact code.  
The Status Register is not automatically stored when entering an interrupt routine and restored  
when returning from an interrupt. This must be handled by software.  
8
ATtiny24/44/84  
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ATtiny24/44/84  
5.4.1  
SREG – AVR Status Register  
Bit  
7
I
6
T
5
H
4
S
3
V
2
N
1
Z
0
C
0x3F (0x5F)  
Read/Write  
Initial Value  
SREG  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
• Bit 7 – I: Global Interrupt Enable  
The Global Interrupt Enable bit must be set for the interrupts to be enabled. The individual inter-  
rupt enable control is then performed in separate control registers. If the Global Interrupt Enable  
Register is cleared, none of the interrupts are enabled independent of the individual interrupt  
enable settings. The I-bit is cleared by hardware after an interrupt has occurred, and is set by  
the RETI instruction to enable subsequent interrupts. The I-bit can also be set and cleared by  
the application with the SEI and CLI instructions, as described in the instruction set reference.  
• Bit 6 – T: Bit Copy Storage  
The Bit Copy instructions BLD (Bit LoaD) and BST (Bit STore) use the T-bit as source or desti-  
nation for the operated bit. A bit from a register in the Register File can be copied into T by the  
BST instruction, and a bit in T can be copied into a bit in a register in the Register File by the  
BLD instruction.  
• Bit 5 – H: Half Carry Flag  
The Half Carry Flag H indicates a Half Carry in some arithmetic operations. Half Carry is useful  
in BCD arithmetic. See the “Instruction Set Description” for detailed information.  
• Bit 4 – S: Sign Bit, S = N  
V
The S-bit is always an exclusive or between the Negative Flag N and the Two’s Complement  
Overflow Flag V. See the “Instruction Set Description” for detailed information.  
• Bit 3 – V: Two’s Complement Overflow Flag  
The Two’s Complement Overflow Flag V supports two’s complement arithmetics. See the  
“Instruction Set Description” for detailed information.  
• Bit 2 – N: Negative Flag  
The Negative Flag N indicates a negative result in an arithmetic or logic operation. See the  
“Instruction Set Description” for detailed information.  
• Bit 1 – Z: Zero Flag  
The Zero Flag Z indicates a zero result in an arithmetic or logic operation. See the “Instruction  
Set Description” for detailed information.  
• Bit 0 – C: Carry Flag  
The Carry Flag C indicates a carry in an arithmetic or logic operation. See the “Instruction Set  
Description” for detailed information.  
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7701C–AVR–12/08  
5.5  
General Purpose Register File  
The Register File is optimized for the AVR Enhanced RISC instruction set. In order to achieve  
the required performance and flexibility, the following input/output schemes are supported by the  
Register File:  
• One 8-bit output operand and one 8-bit result input  
Two 8-bit output operands and one 8-bit result input  
Two 8-bit output operands and one 16-bit result input  
• One 16-bit output operand and one 16-bit result input  
Figure 5-2 on page 10 shows the structure of the 32 general purpose working registers in the  
CPU.  
Figure 5-2. AVR CPU General Purpose Working Registers  
7
0
Addr.  
R0  
R1  
0x00  
0x01  
0x02  
R2  
R13  
R14  
R15  
R16  
R17  
0x0D  
0x0E  
0x0F  
0x10  
0x11  
General  
Purpose  
Working  
Registers  
R26  
R27  
R28  
R29  
R30  
R31  
0x1A  
0x1B  
0x1C  
0x1D  
0x1E  
0x1F  
X-register Low Byte  
X-register High Byte  
Y-register Low Byte  
Y-register High Byte  
Z-register Low Byte  
Z-register High Byte  
Most of the instructions operating on the Register File have direct access to all registers, and  
most of them are single cycle instructions.  
As shown in Figure 5-2, each register is also assigned a Data memory address, mapping them  
directly into the first 32 locations of the user Data Space. Although not being physically imple-  
mented as SRAM locations, this memory organization provides great flexibility in access of the  
registers, as the X-, Y- and Z-pointer registers can be set to index any register in the file.  
5.5.1  
The X-register, Y-register, and Z-register  
The registers R26..R31 have some added functions to their general purpose usage. These reg-  
isters are 16-bit address pointers for indirect addressing of the data space. The three indirect  
address registers X, Y, and Z are defined as described in Figure 5-3 on page 11.  
10  
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ATtiny24/44/84  
Figure 5-3. The X-, Y-, and Z-registers  
15  
XH  
XL  
0
0
X-register  
7
0
0
7
R27 (0x1B)  
R26 (0x1A)  
15  
YH  
YL  
ZL  
0
0
Y-register  
Z-register  
7
7
R29 (0x1D)  
R28 (0x1C)  
15  
ZH  
0
0
7
7
0
R31 (0x1F)  
R30 (0x1E)  
In the different addressing modes these address registers have functions as fixed displacement,  
automatic increment, and automatic decrement (see the instruction set reference for details).  
5.6  
Stack Pointer  
The Stack is mainly used for storing temporary data, for storing local variables and for storing  
return addresses after interrupts and subroutine calls. The Stack Pointer Register always points  
to the top of the Stack. Note that the Stack is implemented as growing from higher memory loca-  
tions to lower memory locations. This implies that a Stack PUSH command decreases the Stack  
Pointer.  
The Stack Pointer points to the data SRAM Stack area where the Subroutine and Interrupt  
Stacks are located. This Stack space in the data SRAM must be defined by the program before  
any subroutine calls are executed or interrupts are enabled. The Stack Pointer must be set to  
point above 0x60. The Stack Pointer is decremented by one when data is pushed onto the Stack  
with the PUSH instruction, and it is decremented by two when the return address is pushed onto  
the Stack with subroutine call or interrupt. The Stack Pointer is incremented by one when data is  
popped from the Stack with the POP instruction, and it is incremented by two when data is  
popped from the Stack with return from subroutine RET or return from interrupt RETI.  
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The number of  
bits actually used is implementation dependent. Note that the data space in some implementa-  
tions of the AVR architecture is so small that only SPL is needed. In this case, the SPH Register  
will not be present.  
5.6.1  
SPH and SPL – Stack Pointer High and Low  
Bit  
15  
SP15  
SP7  
7
14  
SP14  
SP6  
6
13  
SP13  
SP5  
5
12  
SP12  
SP4  
4
11  
SP11  
SP3  
3
10  
SP10  
SP2  
2
9
SP9  
SP1  
1
8
SP8  
SP0  
0
0x3E (0x5E)  
0x3D (0x5D)  
SPH  
SPL  
Read/Write  
Initial Value  
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
R/W  
R/W  
0
0
0
0
0
0
0
0
0
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7701C–AVR–12/08  
5.7  
Instruction Execution Timing  
This section describes the general access timing concepts for instruction execution. The AVR  
CPU is driven by the CPU clock clkCPU, directly generated from the selected clock source for the  
chip. No internal clock division is used.  
Figure 5-4 on page 12 shows the parallel instruction fetches and instruction executions enabled  
by the Harvard architecture and the fast access Register File concept. This is the basic pipelin-  
ing concept to obtain up to 1 MIPS per MHz with the corresponding unique results for functions  
per cost, functions per clocks, and functions per power-unit.  
Figure 5-4. The Parallel Instruction Fetches and Instruction Executions  
T1  
T2  
T3  
T4  
clkCPU  
1st Instruction Fetch  
1st Instruction Execute  
2nd Instruction Fetch  
2nd Instruction Execute  
3rd Instruction Fetch  
3rd Instruction Execute  
4th Instruction Fetch  
Figure 5-5 on page 12 shows the internal timing concept for the Register File. In a single clock  
cycle an ALU operation using two register operands is executed, and the result is stored back to  
the destination register.  
Figure 5-5. Single Cycle ALU Operation  
T1  
T2  
T3  
T4  
clkCPU  
Total Execution Time  
Register Operands Fetch  
ALU Operation Execute  
Result Write Back  
5.8  
Reset and Interrupt Handling  
The AVR provides several different interrupt sources. These interrupts and the separate Reset  
Vector each have a separate Program Vector in the Program memory space. All interrupts are  
assigned individual enable bits which must be written logic one together with the Global Interrupt  
Enable bit in the Status Register in order to enable the interrupt.  
The lowest addresses in the Program memory space are by default defined as the Reset and  
Interrupt Vectors. The complete list of vectors is shown in ”Interrupts” on page 50. The list also  
determines the priority levels of the different interrupts. The lower the address the higher is the  
priority level. RESET has the highest priority, and next is INT0 – the External Interrupt Request  
0.  
12  
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ATtiny24/44/84  
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts are dis-  
abled. The user software can write logic one to the I-bit to enable nested interrupts. All enabled  
interrupts can then interrupt the current interrupt routine. The I-bit is automatically set when a  
Return from Interrupt instruction – RETI – is executed.  
There are basically two types of interrupts. The first type is triggered by an event that sets the  
Interrupt Flag. For these interrupts, the Program Counter is vectored to the actual Interrupt Vec-  
tor in order to execute the interrupt handling routine, and hardware clears the corresponding  
Interrupt Flag. Interrupt Flags can also be cleared by writing a logic one to the flag bit position(s)  
to be cleared. If an interrupt condition occurs while the corresponding interrupt enable bit is  
cleared, the Interrupt Flag will be set and remembered until the interrupt is enabled, or the flag is  
cleared by software. Similarly, if one or more interrupt conditions occur while the Global Interrupt  
Enable bit is cleared, the corresponding Interrupt Flag(s) will be set and remembered until the  
Global Interrupt Enable bit is set, and will then be executed by order of priority.  
The second type of interrupts will trigger as long as the interrupt condition is present. These  
interrupts do not necessarily have Interrupt Flags. If the interrupt condition disappears before the  
interrupt is enabled, the interrupt will not be triggered.  
When the AVR exits from an interrupt, it will always return to the main program and execute one  
more instruction before any pending interrupt is served.  
Note that the Status Register is not automatically stored when entering an interrupt routine, nor  
restored when returning from an interrupt routine. This must be handled by software.  
When using the CLI instruction to disable interrupts, the interrupts will be immediately disabled.  
No interrupt will be executed after the CLI instruction, even if it occurs simultaneously with the  
CLI instruction. The following example shows how this can be used to avoid interrupts during the  
timed EEPROM write sequence..  
Assembly Code Example  
in r16, SREG  
; store SREG value  
cli ; disable interrupts during timed sequence  
sbiEECR, EEMPE ; start EEPROM write  
sbiEECR, EEPE  
outSREG, r16  
; restore SREG value (I-bit)  
C Code Example  
char cSREG;  
cSREG = SREG;/* store SREG value */  
/* disable interrupts during timed sequence */  
_CLI();  
EECR |= (1<<EEMPE); /* start EEPROM write */  
EECR |= (1<<EEPE);  
SREG = cSREG; /* restore SREG value (I-bit) */  
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7701C–AVR–12/08  
When using the SEI instruction to enable interrupts, the instruction following SEI will be exe-  
cuted before any pending interrupts, as shown in this example.  
Assembly Code Example  
sei ; set Global Interrupt Enable  
sleep; enter sleep, waiting for interrupt  
; note: will enter sleep before any pending  
; interrupt(s)  
C Code Example  
_SEI(); /* set Global Interrupt Enable */  
_SLEEP(); /* enter sleep, waiting for interrupt */  
/* note: will enter sleep before any pending interrupt(s) */  
5.8.1  
Interrupt Response Time  
The interrupt execution response for all the enabled AVR interrupts is four clock cycles mini-  
mum. After four clock cycles the Program Vector address for the actual interrupt handling routine  
is executed. During this four clock cycle period, the Program Counter is pushed onto the Stack.  
The vector is normally a jump to the interrupt routine, and this jump takes three clock cycles. If  
an interrupt occurs during execution of a multi-cycle instruction, this instruction is completed  
before the interrupt is served. If an interrupt occurs when the MCU is in sleep mode, the interrupt  
execution response time is increased by four clock cycles. This increase comes in addition to the  
start-up time from the selected sleep mode.  
A return from an interrupt handling routine takes four clock cycles. During these four clock  
cycles, the Program Counter (two bytes) is popped back from the Stack, the Stack Pointer is  
incremented by two, and the I-bit in SREG is set.  
14  
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ATtiny24/44/84  
6. Memories  
This section describes the different memories in the ATtiny24/44/84. The AVR architecture has  
two main memory spaces, the Data memory and the Program memory space. In addition, the  
ATtiny24/44/84 features an EEPROM Memory for data storage. All three memory spaces are lin-  
ear and regular.  
6.1  
In-System Re-programmable Flash Program Memory  
The ATtiny24/44/84 contains 2/4/8K byte On-chip In-System Reprogrammable Flash memory  
for program storage. Since all AVR instructions are 16 or 32 bits wide, the Flash is organized as  
1024/2048/4096 x 16.  
The Flash memory has an endurance of at least 10,000 write/erase cycles. The ATtiny24/44/84  
Program Counter (PC) is 10/11/12 bits wide, thus addressing the 1024/2048/4096 Program  
memory locations. ”Memory Programming” on page 164 contains a detailed description on Flash  
data serial downloading using the SPI pins.  
Constant tables can be allocated within the entire Program memory address space (see the  
LPM – Load Program memory instruction description).  
Timing diagrams for instruction fetch and execution are presented in ”Instruction Execution Tim-  
ing” on page 12.  
Figure 6-1. Program Memory Map  
Program Memory  
0x0000  
0x03FF/0x07FF/0xFFF  
6.2  
SRAM Data Memory  
Figure 6-2 on page 16 shows how the ATtiny24/44/84 SRAM Memory is organized.  
The lower 160 Data memory locations address both the Register File, the I/O memory and the  
internal data SRAM. The first 32 locations address the Register File, the next 64 locations the  
standard I/O memory, and the last 128/256/512 locations address the internal data SRAM.  
The five different addressing modes for the Data memory cover: Direct, Indirect with Displace-  
ment, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In the Register  
File, registers R26 to R31 feature the indirect addressing pointer registers.  
The direct addressing reaches the entire data space.  
The Indirect with Displacement mode reaches 63 address locations from the base address given  
by the Y- or Z-register.  
15  
7701C–AVR–12/08  
When using register indirect addressing modes with automatic pre-decrement and post-incre-  
ment, the address registers X, Y, and Z are decremented or incremented.  
The 32 general purpose working registers, 64 I/O Registers, and the 128/256/512 bytes of inter-  
nal data SRAM in the ATtiny24/44/84 are all accessible through all these addressing modes.  
The Register File is described in ”General Purpose Register File” on page 10.  
Figure 6-2. Data Memory Map  
Data Memory  
0x0000 - 0x001F  
0x0020 - 0x005F  
0x0060  
32 Registers  
64 I/O Registers  
Internal SRAM  
(128/256/512 x 8)  
0x0DF/0x015F/0x025F  
6.2.1  
Data Memory Access Times  
This section describes the general access timing concepts for internal memory access. The  
internal data SRAM access is performed in two clkCPU cycles as described in Figure 6-3 on page  
16.  
Figure 6-3. On-chip Data SRAM Access Cycles  
T1  
T2  
T3  
clkCPU  
Address valid  
Compute Address  
Address  
Data  
WR  
Data  
RD  
Memory Access Instruction  
Next Instruction  
16  
ATtiny24/44/84  
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ATtiny24/44/84  
6.3  
EEPROM Data Memory  
The ATtiny24/44/84 contains 128/256/512 bytes of data EEPROM memory. It is organized as a  
separate data space, in which single bytes can be read and written. The EEPROM has an  
endurance of at least 100,000 write/erase cycles. The access between the EEPROM and the  
CPU is described in the following, specifying the EEPROM Address Registers, the EEPROM  
Data Register, and the EEPROM Control Register. For a detailed description of Serial data  
downloading to the EEPROM, see ”Serial Downloading” on page 168.  
6.3.1  
EEPROM Read/Write Access  
The EEPROM Access Registers are accessible in the I/O space.  
The write access times for the EEPROM are given in Table 6-1 on page 23. A self-timing func-  
tion, however, lets the user software detect when the next byte can be written. If the user code  
contains instructions that write the EEPROM, some precautions must be taken. In heavily fil-  
tered power supplies, VCC is likely to rise or fall slowly on Power-up/down. This causes the  
device for some period of time to run at a voltage lower than specified as minimum for the clock  
frequency used. See ”Preventing EEPROM Corruption” on page 20 for details on how to avoid  
problems in these situations.  
In order to prevent unintentional EEPROM writes, a specific write procedure must be followed.  
See ”Atomic Byte Programming” on page 17 and ”Split Byte Programming” on page 17 for  
details on this.  
When the EEPROM is read, the CPU is halted for four clock cycles before the next instruction is  
executed. When the EEPROM is written, the CPU is halted for two clock cycles before the next  
instruction is executed.  
6.3.2  
Atomic Byte Programming  
Using Atomic Byte Programming is the simplest mode. When writing a byte to the EEPROM, the  
user must write the address into the EEARL Register and data into EEDR Register. If the  
EEPMn bits are zero, writing EEPE (within four cycles after EEMPE is written) will trigger the  
erase/write operation. Both the erase and write cycle are done in one operation and the total  
programming time is given in Table 1. The EEPE bit remains set until the erase and write opera-  
tions are completed. While the device is busy with programming, it is not possible to do any  
other EEPROM operations.  
6.3.3  
Split Byte Programming  
It is possible to split the erase and write cycle in two different operations. This may be useful if  
the system requires short access time for some limited period of time (typically if the power sup-  
ply voltage falls). In order to take advantage of this method, it is required that the locations to be  
written have been erased before the write operation. But since the erase and write operations  
are split, it is possible to do the erase operations when the system allows doing time-critical  
operations (typically after Power-up).  
6.3.4  
Erase  
To erase a byte, the address must be written to EEAR. If the EEPMn bits are 0b01, writing the  
EEPE (within four cycles after EEMPE is written) will trigger the erase operation only (program-  
ming time is given in Table 1). The EEPE bit remains set until the erase operation completes.  
While the device is busy programming, it is not possible to do any other EEPROM operations.  
17  
7701C–AVR–12/08  
6.3.5  
Write  
To write a location, the user must write the address into EEAR and the data into EEDR. If the  
EEPMn bits are 0b10, writing the EEPE (within four cycles after EEMPE is written) will trigger  
the write operation only (programming time is given in Table 1). The EEPE bit remains set until  
the write operation completes. If the location to be written has not been erased before write, the  
data that is stored must be considered as lost. While the device is busy with programming, it is  
not possible to do any other EEPROM operations.  
The calibrated Oscillator is used to time the EEPROM accesses. Make sure the Oscillator fre-  
quency is within the requirements described in ”Oscillator Calibration Register – OSCCAL” on  
page 32.  
The following code examples show one assembly and one C function for erase, write, or atomic  
write of the EEPROM. The examples assume that interrupts are controlled (e.g., by disabling  
interrupts globally) so that no interrupts will occur during execution of these functions.  
18  
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ATtiny24/44/84  
Assembly Code Example  
EEPROM_write:  
; Wait for completion of previous write  
sbic EECR,EEPE  
rjmp EEPROM_write  
; Set Programming mode  
ldi r16, (0<<EEPM1)|(0<<EEPM0)  
out EECR, r16  
; Set up address (r17) in address register  
out EEARL, r17  
; Write data (r16) to data register  
out EEDR,r16  
; Write logical one to EEMPE  
sbi EECR,EEMPE  
; Start eeprom write by setting EEPE  
sbi EECR,EEPE  
ret  
C Code Example  
void EEPROM_write(unsigned char ucAddress, unsigned char ucData)  
{
/* Wait for completion of previous write */  
while(EECR & (1<<EEPE))  
;
/* Set Programming mode */  
EECR = (0<<EEPM1)|(0>>EEPM0)  
/* Set up address and data registers */  
EEARL = ucAddress;  
EEDR = ucData;  
/* Write logical one to EEMPE */  
EECR |= (1<<EEMPE);  
/* Start eeprom write by setting EEPE */  
EECR |= (1<<EEPE);  
}
Note:  
The code examples are only valid for ATtiny24 and ATtiny44, using 8-bit addressing mode.  
19  
7701C–AVR–12/08  
The next code examples show assembly and C functions for reading the EEPROM. The exam-  
ples assume that interrupts are controlled so that no interrupts will occur during execution of  
these functions.  
Assembly Code Example  
EEPROM_read:  
; Wait for completion of previous write  
sbic EECR,EEPE  
rjmp EEPROM_read  
; Set up address (r17) in address register  
out EEARL, r17  
; Start eeprom read by writing EERE  
sbi EECR,EERE  
; Read data from data register  
in r16,EEDR  
ret  
C Code Example  
unsigned char EEPROM_read(unsigned char ucAddress)  
{
/* Wait for completion of previous write */  
while(EECR & (1<<EEPE))  
;
/* Set up address register */  
EEARL = ucAddress;  
/* Start eeprom read by writing EERE */  
EECR |= (1<<EERE);  
/* Return data from data register */  
return EEDR;  
}
Note:  
The code examples are only valid for ATtiny24 and ATtiny44, using 8-bit addressing mode.  
6.3.6  
Preventing EEPROM Corruption  
During periods of low VCC, the EEPROM data can be corrupted because the supply voltage is  
too low for the CPU and the EEPROM to operate properly. These issues are the same as for  
board level systems using EEPROM, and the same design solutions should be applied.  
An EEPROM data corruption can be caused by two situations when the voltage is too low. First,  
a regular write sequence to the EEPROM requires a minimum voltage to operate correctly. Sec-  
ondly, the CPU itself can execute instructions incorrectly, if the supply voltage is too low.  
EEPROM data corruption can easily be avoided by following this design recommendation:  
Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can  
be done by enabling the internal Brown-out Detector (BOD). If the detection level of the internal  
BOD does not match the needed detection level, an external low VCC reset protection circuit can  
be used. If a reset occurs while a write operation is in progress, the write operation will be com-  
pleted provided that the power supply voltage is sufficient.  
20  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
6.4  
I/O Memory  
The I/O space definition of the ATtiny24/44/84 is shown in ”Register Summary” on page 212.  
All ATtiny24/44/84 I/Os and peripherals are placed in the I/O space. All I/O locations may be  
accessed by the LD/LDS/LDD and ST/STS/STD instructions, transferring data between the 32  
general purpose working registers and the I/O space. I/O Registers within the address range  
0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the  
value of single bits can be checked by using the SBIS and SBIC instructions. See the instruction  
set section for more details. When using the I/O specific commands IN and OUT, the I/O  
addresses 0x00 - 0x3F must be used. When addressing I/O Registers as data space using LD  
and ST instructions, 0x20 must be added to these addresses.  
For compatibility with future devices, reserved bits should be written to zero if accessed.  
Reserved I/O memory addresses should never be written.  
Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most  
other AVRs, the CBI and SBI instructions will only operate on the specified bit, and can therefore  
be used on registers containing such Status Flags. The CBI and SBI instructions work with reg-  
isters 0x00 to 0x1F only.  
The I/O and Peripherals Control Registers are explained in later sections.  
6.4.1  
General Purpose I/O Registers  
The ATtiny24/44/84 contains three General Purpose I/O Registers. These registers can be used  
for storing any information, and they are particularly useful for storing global variables and status  
flags. General Purpose I/O Registers within the address range 0x00 - 0x1F are directly bit-  
accessible using the SBI, CBI, SBIS, and SBIC instructions.  
21  
7701C–AVR–12/08  
6.5  
Register Description  
6.5.1  
EEARH – EEPROM Address Register  
Bit  
7
6
5
4
3
2
1
0
EEAR8  
R/W  
X
0x1F (0x3F)  
Read/Write  
Initial Value  
EEARH  
R
0
R
0
R
0
R
0
R
0
R
0
R
0
• Bits 7..1 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 0 – EEAR8: EEPROM Address  
The EEPROM Address Register – EEARH – specifies the most significant bit for EEPROM  
address in the 512 bytes EEPROM space for Tiny84. This bit is reserved bit in the ATtiny24/44  
and will always read as zero. The initial value of EEAR is undefined. A proper value must be  
written before the EEPROM may be accessed.  
6.5.2  
EEARL – EEPROM Address Register  
Bit  
0x1E (0x3E)  
7
6
EEAR6  
R/W  
X
5
EEAR5  
R/W  
X
4
EEAR4  
R/W  
X
3
EEAR3  
R/W  
X
2
EEAR2  
R/W  
X
1
EEAR1  
R/W  
X
0
EEAR0  
R/W  
X
EEAR7  
EEARL  
Read/Write  
Initial Value  
R/W  
X
• Bits 7..0 – EEAR7..0: EEPROM Address  
The EEPROM Address Register – EEARL – specifies the EEPROM address. In the 128 bytes  
EEPROM space in ATiny24 bit 7 is reserved and always read as zero. The EEPROM data bytes  
are addressed linearly between 0 and 128/256/512. The initial value of EEAR is undefined. A  
proper value must be written before the EEPROM may be accessed.  
6.5.3  
EEDR – EEPROM Data Register  
Bit  
7
6
EEDR6  
R/W  
0
5
EEDR5  
R/W  
0
4
EEDR4  
R/W  
0
3
EEDR3  
R/W  
0
2
EEDR2  
R/W  
0
1
EEDR1  
R/W  
0
0
EEDR0  
R/W  
0
0x1D (0x3D)  
Read/Write  
Initial Value  
EEDR7  
R/W  
0
EEDR  
• Bits 7..0 – EEDR7..0: EEPROM Data  
For the EEPROM write operation the EEDR Register contains the data to be written to the  
EEPROM in the address given by the EEAR Register. For the EEPROM read operation, the  
EEDR contains the data read out from the EEPROM at the address given by EEAR.  
6.5.4  
EECR – EEPROM Control Register  
Bit  
0x1C (0x3C)  
7
6
5
EEPM1  
R/W  
X
4
EEPM0  
R/W  
X
3
EERIE  
R/W  
0
2
EEMPE  
R/W  
0
1
EEPE  
R/W  
X
0
EERE  
R/W  
0
EECR  
Read/Write  
Initial Value  
R
0
R
0
22  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
• Bit 7 – Res: Reserved Bit  
This bit is reserved for future use and will always read as 0 in ATtiny24/44/84. For compatibility  
with future AVR devices, always write this bit to zero. After reading, mask out this bit.  
• Bit 6 – Res: Reserved Bit  
This bit is reserved in the ATtiny24/44/84 and will always read as zero.  
• Bits 5, 4 – EEPM1 and EEPM0: EEPROM  
Mode Bits  
The EEPROM Programming mode bits setting defines which programming action that will be  
triggered when writing EEPE. It is possible to program data in one atomic operation (erase the  
old value and program the new value) or to split the Erase and Write operations in two different  
operations. The Programming times for the different modes are shown in Table 6-1. While EEPE  
is set, any write to EEPMn will be ignored. During reset, the EEPMn bits will be reset to 0b00  
unless the EEPROM is busy programming.  
Table 6-1.  
EEPROM Mode Bits  
Programming  
EEPM1  
EEPM0  
Time  
3.4 ms  
1.8 ms  
1.8 ms  
Operation  
0
0
1
1
0
1
0
1
Erase and Write in one operation (Atomic Operation)  
Erase Only  
Write Only  
Reserved for future use  
• Bit 3 – EERIE: EEPROM Ready Interrupt Enable  
Writing EERIE to one enables the EEPROM Ready Interrupt if the I-bit in SREG is set. Writing  
EERIE to zero disables the interrupt. The EEPROM Ready Interrupt generates a constant inter-  
rupt when Non-volatile memory is ready for programming.  
• Bit 2 – EEMPE: EEPROM Master Program Enable  
The EEMPE bit determines whether writing EEPE to one will have effect or not.  
When EEMPE is set, setting EEPE within four clock cycles will program the EEPROM at the  
selected address. If EEMPE is zero, setting EEPE will have no effect. When EEMPE has been  
written to one by software, hardware clears the bit to zero after four clock cycles.  
• Bit 1 – EEPE: EEPROM Program Enable  
The EEPROM Program Enable Signal EEPE is the programming enable signal to the EEPROM.  
When EEPE is written, the EEPROM will be programmed according to the EEPMn bits setting.  
The EEMPE bit must be written to one before a logical one is written to EEPE, otherwise no  
EEPROM write takes place. When the write access time has elapsed, the EEPE bit is cleared  
by hardware. When EEPE has been set, the CPU is halted for two cycles before the next  
instruction is executed.  
• Bit 0 – EERE: EEPROM Read Enable  
The EEPROM Read Enable Signal – EERE – is the read strobe to the EEPROM. When the cor-  
rect address is set up in the EEAR Register, the EERE bit must be written to one to trigger the  
23  
7701C–AVR–12/08  
EEPROM read. The EEPROM read access takes one instruction, and the requested data is  
available immediately. When the EEPROM is read, the CPU is halted for four cycles before the  
next instruction is executed. The user should poll the EEPE bit before starting the read opera-  
tion. If a write operation is in progress, it is neither possible to read the EEPROM, nor to change  
the EEAR Register.  
6.5.5  
6.5.6  
6.5.7  
GPIOR2 – General Purpose I/O Register 2  
Bit  
0x15 (0x35)  
7
6
5
4
3
2
1
0
MSB  
LSB  
R/W  
0
GPIOR2  
GPIOR1  
GPIOR0  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
GPIOR1 – General Purpose I/O Register 1  
Bit  
7
MSB  
R/W  
0
6
5
4
3
2
1
0
0x14 (0x34)  
Read/Write  
Initial Value  
LSB  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
GPIOR0 – General Purpose I/O Register 0  
Bit  
7
MSB  
R/W  
0
6
5
4
3
2
1
0
0x13 (0x33)  
Read/Write  
Initial Value  
LSB  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
24  
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ATtiny24/44/84  
7. System Clock and Clock Options  
7.1  
Clock Systems and their Distribution  
Figure 7-1 on page 25 presents the principal clock systems in the AVR and their distribution. All  
of the clocks need not be active at a given time. In order to reduce power consumption, the  
clocks to modules not being used can be halted by using different sleep modes, as described in  
”Power Management and Sleep Modes” on page 34. The clock systems are detailed below.  
Figure 7-1. Clock Distribution  
General I/O  
Modules  
Flash and  
EEPROM  
ADC  
CPU Core  
RAM  
clkI/O  
clkCPU  
AVR Clock  
Control Unit  
clkADC  
clkFLASH  
Reset Logic  
Watchdog Timer  
Source clock  
Watchdog clock  
System Clock  
Prescaler  
Clock  
Multiplexer  
Watchdog  
Oscillator  
Crystal
Oscillator  
Low-Frequency  
Crystal Oscillator  
Calibrated RC  
Oscillator  
External Clock  
7.1.1  
7.1.2  
CPU Clock – clkCPU  
The CPU clock is routed to parts of the system concerned with operation of the AVR core.  
Examples of such modules are the General Purpose Register File, the Status Register and the  
Data memory holding the Stack Pointer. Halting the CPU clock inhibits the core from performing  
general operations and calculations.  
I/O Clock – clkI/O  
The I/O clock is used by the majority of the I/O modules, like Timer/Counter. The I/O clock is  
also used by the External Interrupt module, but note that some external interrupts are detected  
by asynchronous logic, allowing such interrupts to be detected even if the I/O clock is halted.  
7.1.3  
7.1.4  
Flash Clock – clkFLASH  
The Flash clock controls operation of the Flash interface. The Flash clock is usually active simul-  
taneously with the CPU clock.  
ADC Clock – clkADC  
The ADC is provided with a dedicated clock domain. This allows halting the CPU and I/O clocks  
in order to reduce noise generated by digital circuitry. This gives more accurate ADC conversion  
results.  
25  
7701C–AVR–12/08  
7.2  
Clock Sources  
The device has the following clock source options, selectable by Flash Fuse bits as shown  
below. The clock from the selected source is input to the AVR clock generator, and routed to the  
appropriate modules.  
Table 7-1.  
Device Clocking Options Select(1)  
Device Clocking Option  
External Clock  
CKSEL3..0  
0000  
0010  
Calibrated Internal RC Oscillator 8.0 MHz  
Watchdog Oscillator 128 kHz  
External Low-frequency Oscillator  
External Crystal/Ceramic Resonator  
Reserved  
0100  
0110  
1000-1111  
0101, 0111, 0011,0001  
Note:  
1. For all fuses “1” means unprogrammed while “0” means programmed.  
The various choices for each clocking option is given in the following sections. When the CPU  
wakes up from Power-down or Power-save, the selected clock source is used to time the start-  
up, ensuring stable Oscillator operation before instruction execution starts. When the CPU starts  
from reset, there is an additional delay allowing the power to reach a stable level before com-  
mencing normal operation. The Watchdog Oscillator is used for timing this real-time part of the  
start-up time. The number of WDT Oscillator cycles used for each time-out is shown in Table 7-2  
on page 26.  
Table 7-2.  
Number of Watchdog Oscillator Cycles  
Typ Time-out  
4 ms  
Number of Cycles  
512  
64 ms  
8K (8,192)  
7.3  
7.4  
Default Clock Source  
The device is shipped with CKSEL = “0010”, SUT = “10”, and CKDIV8 programmed. The default  
clock source setting is therefore the Internal RC Oscillator running at 8.0 MHz with longest start-  
up time and an initial system clock prescaling of 8, resulting in 1.0 MHz system clock. This  
default setting ensures that all users can make their desired clock source setting using an In-  
System or High-voltage Programmer.  
Crystal Oscillator  
XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can  
be configured for use as an On-chip Oscillator, as shown in Figure 7-2. Either a quartz  
crystal or a ceramic resonator may be used.  
C1 and C2 should always be equal for both crystals and resonators. The optimal value of the  
capacitors depends on the crystal or resonator in use, the amount of stray capac-itance, and the  
electromagnetic noise of the environment. Some initial guidelines for choosing capacitors for  
use with crystals are given in Table 7-3 on page 27. For ceramic resonators, the capacitor val-  
ues given by the manufacturer should be used.  
26  
ATtiny24/44/84  
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ATtiny24/44/84  
Figure 7-2. Crystal Oscillator Connections  
C2  
XTAL2  
XTAL1  
GND  
C1  
The Oscillator can operate in three different modes, each optimized for a specific frequency  
range. The operating mode is selected by the fuses CKSEL3..1 as shown in Table 7-3 on page  
27.  
Table 7-3.  
Crystal Oscillator Operating Modes  
Recommended Range for Capacitors C1 and  
C2 for Use with Crystals (pF)  
CKSEL3..1  
100(1)  
101  
Frequency Range (MHz)  
0.4 - 0.9  
0.9 - 3.0  
3.0 - 8.0  
8.0 -  
12 - 22  
12 - 22  
12 - 22  
110  
111  
Notes: 1. This option should not be used with crystals, only with ceramic resonators.  
The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in Table  
7-4 on page 28.  
27  
7701C–AVR–12/08  
Table 7-4.  
Start-up Times for the Crystal Oscillator Clock Selection  
Start-up Time from  
Power-down and  
Power-save  
Additional Delay  
from Reset  
CKSEL0  
SUT1..0  
(VCC = 5.0V)  
Recommended Usage  
Ceramic resonator, fast  
rising power  
0
00  
258 CK(1)  
258 CK(1)  
1K CK(2)  
1K CK(2)  
1K CK(2)  
16K CK  
16K CK  
16K CK  
14CK + 4.1 ms  
14CK + 65 ms  
14CK  
Ceramic resonator, slowly  
rising power  
0
0
0
1
1
1
1
01  
10  
11  
00  
01  
10  
11  
Ceramic resonator, BOD  
enabled  
Ceramic resonator, fast  
rising power  
14CK + 4.1 ms  
14CK + 65 ms  
14CK  
Ceramic resonator, slowly  
rising power  
Crystal Oscillator, BOD  
enabled  
Crystal Oscillator, fast  
rising power  
14CK + 4.1 ms  
14CK + 65 ms  
Crystal Oscillator, slowly  
rising power  
Notes: 1. These options should only be used when not operating close to the maximum frequency of the  
device, and only if frequency stability at start-up is not important for the application. These  
options are not suitable for crystals.  
2. These options are intended for use with ceramic resonators and will ensure frequency stability  
at start-up. They can also be used with crystals when not operating close to the maximum fre-  
quency of the device, and if frequency stability at start-up is not important for the application.  
7.5  
Low-frequency Crystal Oscillator  
To use a 32.768 kHz watch crystal as the clock source for the device, the low-frequency crystal  
oscillator must be selected by setting CKSEL fuses to ‘0110’. The crystal should be connected  
as shown in Figure 7-2. See the 32 kHz Crystal Oscillator Application Note for details on oscilla-  
tor operation and how to choose appropriate values for C1 and C2.  
When this oscillator is selected, start-up times are determined by the SUT fuses as shown in  
Table 7-5.  
Table 7-5.  
Start-up Times for the Low Frequency Crystal Oscillator Clock Selection  
Start-up Time from  
Power Down and Power  
Save  
Additional Delay from  
Reset (VCC = 5.0V)  
SUT1..0  
Recommended usage  
Fast rising power or BOD  
enabled  
00  
1K CK(1)  
4 ms  
01  
10  
11  
1K CK(1)  
32K CK  
64 ms  
Slowly rising power  
64 ms  
Stable frequency at start-up  
Reserved  
Notes: 1. These options should only be used if frequency stability at start-up is not important for the  
application.  
28  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
7.6  
Calibrated Internal RC Oscillator  
By default, the Internal RC Oscillator provides an approximate 8 MHz clock. Though voltage and  
temperature dependent, this clock can be very accurately calibrated by the the user. See Table  
22-2 on page 181 and ”Internal Oscillator Speed” on page 205 for more details. The device is  
shipped with the CKDIV8 Fuse programmed. See ”System Clock Prescaler” on page 31 for  
more details.  
This clock may be selected as the system clock by programming the CKSEL Fuses as shown in  
Table 7-6. If selected, it will operate with no external components. During reset, hardware loads  
the pre-programmed calibration value into the OSCCAL Register and thereby automatically cal-  
ibrates the RC Oscillator. The accuracy of this calibration is shown as Factory calibration in  
Table 22-2 on page 181.  
By changing the OSCCAL register from SW, see ”Oscillator Calibration Register – OSCCAL” on  
page 32, it is possible to get a higher calibration accuracy than by using the factory calibration.  
The accuracy of this calibration is shown as User calibration in Table 22-2 on page 181.  
When this Oscillator is used as the chip clock, the Watchdog Oscillator will still be used for the  
Watchdog Timer and for the Reset Time-out. For more information on the pre-programmed cali-  
bration value, see the section ”Calibration Byte” on page 166.  
Table 7-6.  
Internal Calibrated RC Oscillator Operating Modes  
CKSEL3..0  
Nominal Frequency  
8.0 MHz  
0010(1)  
Note:  
1. The device is shipped with this option selected.  
When this Oscillator is selected, start-up times are determined by the SUT Fuses as shown in  
Table 7-7 on page 29..  
Table 7-7.  
Start-up Times for the Internal Calibrated RC Oscillator Clock Selection  
Start-up Time  
from Power-down  
Additional Delay from  
Reset (VCC = 5.0V)  
SUT1..0  
00  
Recommended Usage  
BOD enabled  
6 CK  
6 CK  
6 CK  
14CK  
01  
14CK + 4 ms  
14CK + 64 ms  
Reserved  
Fast rising power  
Slowly rising power  
10(1)  
11  
Note:  
1. The device is shipped with this option selected.  
7.7  
External Clock  
To drive the device from an external clock source, CLKI should be driven as shown in Figure 7-3  
on page 30. To run the device on an external clock, the CKSEL Fuses must be programmed to  
“0000”.  
29  
7701C–AVR–12/08  
Figure 7-3. External Clock Drive Configuration  
EXTERNAL  
CLOCK  
CLKI  
GND  
SIGNAL  
When this clock source is selected, start-up times are determined by the SUT Fuses as shown in  
Table 7-8 on page 30.  
Table 7-8.  
Start-up Times for the External Clock Selection  
Start-up Time from Power-  
down and Power-save  
Additional Delay from  
Reset  
SUT1..0  
00  
Recommended Usage  
BOD enabled  
6 CK  
6 CK  
6 CK  
14CK  
01  
14CK + 4 ms  
14CK + 64 ms  
Reserved  
Fast rising power  
Slowly rising power  
10  
11  
When applying an external clock, it is required to avoid sudden changes in the applied clock fre-  
quency to ensure stable operation of the MCU. A variation in frequency of more than 2% from  
one clock cycle to the next can lead to unpredictable behavior. It is required to ensure that the  
MCU is kept in Reset during such changes in the clock frequency.  
Note that the System Clock Prescaler can be used to implement run-time changes of the internal  
clock frequency while still ensuring stable operation. See to ”System Clock Prescaler” on page  
31 for details.  
30  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
7.8  
128 kHz Internal Oscillator  
The 128 kHz internal Oscillator is a low power Oscillator providing a clock of 128 kHz. The fre-  
quency is nominal at 3V and 25° C. This clock may be select as the system clock by  
programming the CKSEL Fuses to “0100”.  
When this clock source is selected, start-up times are determined by the SUT Fuses as shown in  
Table 7-9 on page 31.  
Table 7-9.  
Start-up Times for the 128 kHz Internal Oscillator  
Start-up Time from Power-  
down and Power-save  
Additional Delay from  
Reset  
SUT1..0  
Recommended Usage  
BOD enabled  
00  
6 CK  
6 CK  
6 CK  
14CK  
01  
14CK + 4 ms  
14CK + 64 ms  
Reserved  
Fast rising power  
Slowly rising power  
10  
11  
7.9  
System Clock Prescaler  
The ATtiny24/44/84 system clock can be divided by setting the Clock Prescale Register –  
CLKPR. This feature can be used to decrease power consumption when the requirement for  
processing power is low. This can be used with all clock source options, and it will affect the  
clock frequency of the CPU and all synchronous peripherals. clkI/O, clkADC, clkCPU, and clkFLASH  
are divided by a factor as shown in Table 7-10 on page 33.  
7.9.1  
Switching Time  
When switching between prescaler settings, the System Clock Prescaler ensures that no  
glitches occur in the clock system and that no intermediate frequency is higher than neither the  
clock frequency corresponding to the previous setting, nor the clock frequency corresponding to  
the new setting.  
The ripple counter that implements the prescaler runs at the frequency of the undivided clock,  
which may be faster than the CPU’s clock frequency. Hence, it is not possible to determine the  
state of the prescaler – even if it were readable, and the exact time it takes to switch from one  
clock division to another cannot be exactly predicted.  
From the time the CLKPS values are written, it takes between T1 + T2 and T1 + 2*T2 before the  
new clock frequency is active. In this interval, 2 active clock edges are produced. Here, T1 is the  
previous clock period, and T2 is the period corresponding to the new prescaler setting.  
31  
7701C–AVR–12/08  
7.10 Register Description  
7.10.1  
Oscillator Calibration Register – OSCCAL  
Bit  
7
6
5
4
3
2
1
0
0x31 (0x51)  
Read/Write  
Initial Value  
CAL7  
R/W  
CAL6  
R/W  
CAL5  
R/W  
CAL4  
R/W  
CAL3  
R/W  
CAL2  
R/W  
CAL1  
R/W  
CAL0  
R/W  
OSCCAL  
Device Specific Calibration Value  
The Oscillator Calibration Register is used to trim the Calibrated Internal RC Oscillator to  
remove process variations from the oscillator frequency. A pre-programmed calibration value is  
automatically written to this register during chip reset, giving the Factory calibrated frequency as  
specified in Table 22-2 on page 181. The application software can write this register to change  
the oscillator frequency. The oscillator can be calibrated to frequencies as specified in Table 22-  
2 on page 181. Calibration outside that range is not guaranteed.  
Note that this oscillator is used to time EEPROM and Flash write accesses, and these write  
times will be affected accordingly. If the EEPROM or Flash are written, do not calibrate to more  
than 8.8 MHz. Otherwise, the EEPROM or Flash write may fail.  
The CAL7 bit determines the range of operation for the oscillator. Setting this bit to 0 gives the  
lowest frequency range, setting this bit to 1 gives the highest frequency range. The two fre-  
quency ranges are overlapping, in other words a setting of OSCCAL = 0x7F gives a higher  
frequency than OSCCAL = 0x80.  
The CAL6..0 bits are used to tune the frequency within the selected range. A setting of 0x00  
gives the lowest frequency in that range, and a setting of 0x7F gives the highest frequency in the  
range.  
7.10.2  
Clock Prescale Register – CLKPR  
Bit  
7
6
5
4
3
2
1
0
CLKPCE  
R/W  
0
CLKPS3  
R/W  
CLKPS2  
R/W  
CLKPS1  
R/W  
CLKPS0  
R/W  
CLKPR  
0x26 (0x46)  
Read/Write  
Initial Value  
R
0
R
0
R
0
See Bit Description  
• Bit 7 – CLKPCE: Clock Prescaler Change Enable  
The CLKPCE bit must be written to logic one to enable change of the CLKPS bits. The CLKPCE  
bit is only updated when the other bits in CLKPR are simultaniosly written to zero. CLKPCE is  
cleared by hardware four cycles after it is written or when the CLKPS bits are written. Rewriting  
the CLKPCE bit within this time-out period does neither extend the time-out period, nor clear the  
CLKPCE bit.  
• Bits 6..4 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bits 3..0 – CLKPS3..0: Clock Prescaler Select Bits 3 - 0  
These bits define the division factor between the selected clock source and the internal system  
clock. These bits can be written run-time to vary the clock frequency to suit the application  
requirements. As the divider divides the master clock input to the MCU, the speed of all synchro-  
nous peripherals is reduced when a division factor is used. The division factors are given in  
Table 7-10 on page 33.  
32  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
To avoid unintentional changes of clock frequency, a special write procedure must be followed  
to change the CLKPS bits:  
1. Write the Clock Prescaler Change Enable (CLKPCE) bit to one and all other bits in  
CLKPR to zero.  
2. Within four cycles, write the desired value to CLKPS while writing a zero to CLKPCE.  
Interrupts must be disabled when changing prescaler setting to make sure the write procedure is  
not interrupted.  
The CKDIV8 Fuse determines the initial value of the CLKPS bits. If CKDIV8 is unprogrammed,  
the CLKPS bits will be reset to “0000”. If CKDIV8 is programmed, CLKPS bits are reset to  
“0011”, giving a division factor of eight at start up. This feature should be used if the selected  
clock source has a higher frequency than the maximum frequency of the device at the present  
operating conditions. Note that any value can be written to the CLKPS bits regardless of the  
CKDIV8 Fuse setting. The Application software must ensure that a sufficient division factor is  
chosen if the selcted clock source has a higher frequency than the maximum frequency of the  
device at the present operating conditions. The device is shipped with the CKDIV8 Fuse  
programmed.  
Table 7-10. Clock Prescaler Select  
CLKPS3  
CLKPS2  
CLKPS1  
CLKPS0  
Clock Division Factor  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
2
4
8
16  
32  
64  
128  
256  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
33  
7701C–AVR–12/08  
8. Power Management and Sleep Modes  
Sleep modes enable the application to shut down unused modules in the MCU, thereby saving  
power. The AVR provides various sleep modes allowing the user to tailor the power consump-  
tion to the application’s requirements.  
8.1  
Sleep Modes  
Figure 7-1 on page 25 presents the different clock systems in the ATtiny24/44/84, and their dis-  
tribution. The figure is helpful in selecting an appropriate sleep mode. Table 8-1 shows the  
different sleep modes and their wake up sources  
Table 8-1.  
Active Clock Domains and Wake-up Sources in the Different Sleep Modes  
Active Clock Domains  
Oscillators  
Wake-up Sources  
Sleep Mode  
Idle  
X
X
X
X
X
X
X
X
X
X
X
X
X
ADC Noise  
Reduction  
X
X(1)  
Power-down  
Stand-by(2)  
X(1)  
X
X(1)  
Note:  
1. For INT0, only level interrupt.  
2. Only recommended with external crystal or resonator selected as clock source  
To enter any of the three sleep modes, the SE bit in MCUCR must be written to logic one and a  
SLEEP instruction must be executed. The SM1..0 bits in the MCUCR Register select which  
sleep mode (Idle, ADC Noise Reduction, Standby or Power-down) will be activated by the  
SLEEP instruction. See Table 8-2 on page 37 for a summary.  
If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The MCU  
is then halted for four cycles in addition to the start-up time, executes the interrupt routine, and  
resumes execution from the instruction following SLEEP. The contents of the Register File and  
SRAM are unaltered when the device wakes up from sleep. If a reset occurs during sleep mode,  
the MCU wakes up and executes from the Reset Vector.  
8.2  
Idle Mode  
When the SM1..0 bits are written to 00, the SLEEP instruction makes the MCU enter Idle mode,  
stopping the CPU but allowing Analog Comparator, ADC, Timer/Counter, Watchdog, and the  
interrupt system to continue operating. This sleep mode basically halts clkCPU and clkFLASH, while  
allowing the other clocks to run.  
Idle mode enables the MCU to wake up from external triggered interrupts as well as internal  
ones like the Timer Overflow. If wake-up from the Analog Comparator interrupt is not required,  
34  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
the Analog Comparator can be powered down by setting the ACD bit in the Analog Comparator  
Control and Status Register – ACSR. This will reduce power consumption in Idle mode. If the  
ADC is enabled, a conversion starts automatically when this mode is entered.  
8.3  
ADC Noise Reduction Mode  
When the SM1..0 bits are written to 01, the SLEEP instruction makes the MCU enter ADC Noise  
Reduction mode, stopping the CPU but allowing the ADC, the external interrupts, and the  
Watchdog to continue operating (if enabled). This sleep mode halts clkI/O, clkCPU, and clkFLASH  
while allowing the other clocks to run.  
,
This improves the noise environment for the ADC, enabling higher resolution measurements. If  
the ADC is enabled, a conversion starts automatically when this mode is entered. Apart form the  
ADC Conversion Complete interrupt, only an External Reset, a Watchdog Reset, a Brown-out  
Reset, an SPM/EEPROM ready interrupt, an external level interrupt on INT0 or a pin change  
interrupt can wake up the MCU from ADC Noise Reduction mode.  
8.4  
Power-down Mode  
When the SM1..0 bits are written to 10, the SLEEP instruction makes the MCU enter Power-  
down mode. In this mode, the Oscillator is stopped, while the external interrupts, and the Watch-  
dog continue operating (if enabled). Only an External Reset, a Watchdog Reset, a Brown-out  
Reset, an external level interrupt on INT0, or a pin change interrupt can wake up the MCU. This  
sleep mode halts all generated clocks, allowing operation of asynchronous modules only.  
Note that if a level triggered interrupt is used for wake-up from Power-down mode, the changed  
level must be held for some time to wake up the MCU. See ”External Interrupts” on page 52 for  
details  
8.5  
8.6  
Standby Mode  
When the SM1..0 bits are 11 and an external crystal/resonator clock option is selected, the  
SLEEP instruction makes the MCU enter Standby mode. This mode is identical to Power-down  
with the exception that the Oscillator is kept running. From Standby mode, the device wakes up  
in six clock cycles.  
Power Reduction Register  
The Power Reduction Register (PRR), see ”PRR – Power Reduction Register” on page 38, pro-  
vides a method to stop the clock to individualperipherals to reduce power consumption. The  
current state of the peripheral is frozenand the I/O registers can not be read or written.  
Resources used by the peripheral when stopping the clock will remain occupied, hence the  
peripheral should in most cases be disabled before stopping the clock. Waking up a module,  
which is done by clearing the bit in PRR, puts the module in the same state as before shutdown.  
Module shutdown can be used in Idle mode and Active mode to significantly reduce the overall  
power consumption. See ”Power-down Supply Current” on page 196 for examples. In all other  
sleep modes, the clock is already stopped.  
35  
7701C–AVR–12/08  
8.7  
Minimizing Power Consumption  
There are several issues to consider when trying to minimize the power consumption in an AVR  
controlled system. In general, sleep modes should be used as much as possible, and the sleep  
mode should be selected so that as few as possible of the device’s functions are operating. All  
functions not needed should be disabled. In particular, the following modules may need special  
consideration when trying to achieve the lowest possible power consumption.  
8.7.1  
8.7.2  
Analog to Digital Converter  
If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should be dis-  
abled before entering any sleep mode. When the ADC is turned off and on again, the next  
conversion will be an extended conversion. See ”Analog to Digital Converter” on page 138 for  
details on ADC operation.  
Analog Comparator  
When entering Idle mode, the Analog Comparator should be disabled if not used. When entering  
ADC Noise Reduction mode, the Analog Comparator should be disabled. In the other sleep  
modes, the Analog Comparator is automatically disabled. However, if the Analog Comparator is  
set up to use the Internal Voltage Reference as input, the Analog Comparator should be dis-  
abled in all sleep modes. Otherwise, the Internal Voltage Reference will be enabled,  
independent of sleep mode. See ”Analog Comparator” on page 134 for details on how to config-  
ure the Analog Comparator.  
8.7.3  
8.7.4  
Brown-out Detector  
If the Brown-out Detector is not needed in the application, this module should be turned off. If the  
Brown-out Detector is enabled by the BODLEVEL Fuses, it will be enabled in all sleep modes,  
and hence, always consume power. In the deeper sleep modes, this will contribute significantly  
to the total current consumption. See ”Brown-out Detection” on page 43 for details on how to  
configure the Brown-out Detector.  
Internal Voltage Reference  
The Internal Voltage Reference will be enabled when needed by the Brown-out Detection, the  
Analog Comparator or the ADC. If these modules are disabled as described in the sections  
above, the internal voltage reference will be disabled and it will not be consuming power. When  
turned on again, the user must allow the reference to start up before the output is used. If the  
reference is kept on in sleep mode, the output can be used immediately. See ”Internal Voltage  
Reference” on page 44 for details on the start-up time.  
8.7.5  
8.7.6  
Watchdog Timer  
If the Watchdog Timer is not needed in the application, this module should be turned off. If the  
Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence, always consume  
power. In the deeper sleep modes, this will contribute significantly to the total current consump-  
tion. See ”Watchdog Timer” on page 44 for details on how to configure the Watchdog Timer.  
Port Pins  
When entering a sleep mode, all port pins should be configured to use minimum power. The  
most important thing is then to ensure that no pins drive resistive loads. In sleep modes where  
both the I/O clock (clkI/O) and the ADC clock (clkADC) are stopped, the input buffers of the device  
will be disabled. This ensures that no power is consumed by the input logic when not needed. In  
36  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
some cases, the input logic is needed for detecting wake-up conditions, and it will then be  
enabled. See the section ”Digital Input Enable and Sleep Modes” on page 60 for details on  
which pins are enabled. If the input buffer is enabled and the input signal is left floating or has an  
analog signal level close to VCC/2, the input buffer will use excessive power.  
For analog input pins, the digital input buffer should be disabled at all times. An analog signal  
level close to VCC/2 on an input pin can cause significant current even in active mode. Digital  
input buffers can be disabled by writing to the Digital Input Disable Register (DIDR0). See  
”DIDR0 – Digital Input Disable Register 0” on page 156 for details.  
8.8  
Register Description  
8.8.1  
MCUCR – MCU Control Register  
The MCU Control Register contains control bits for power management.  
Bit  
7
6
5
SE  
R/W  
0
4
3
2
R
0
1
ISC01  
R/W  
0
0
ISC00  
R/W  
0
PUD  
R/W  
0
SM1  
R/W  
0
SM0  
R/W  
0
MCUCR  
Read/Write  
Initial Value  
R
0
• Bit 5 – SE: Sleep Enable  
The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP  
instruction is executed. To avoid the MCU entering the sleep mode unless it is the programmer’s  
purpose, it is recommended to write the Sleep Enable (SE) bit to one just before the execution of  
the SLEEP instruction and to clear it immediately after waking up.  
• Bits 4, 3 – SM1..0: Sleep Mode Select Bits 2..0  
These bits select between the three available sleep modes as shown in Table 8-2 on page 37.  
Table 8-2.  
Sleep Mode Select  
SM1  
SM0  
Sleep Mode  
Idle  
0
0
1
1
0
1
0
1
ADC Noise Reduction  
Power-down  
Standby(1)  
Note:  
1. Only recommended with external crystal or resonator selected as clock source  
• Bit 2 – Res: Reserved Bit  
This bit is a reserved bit in the ATtiny24/44/84 and will always read as zero.  
37  
7701C–AVR–12/08  
8.8.2  
PRR – Power Reduction Register  
Bit  
7
6
5
4
3
PRTIM1  
R/W  
0
2
PRTIM0  
R/W  
0
1
PRUSI  
R/W  
0
0
PRADC  
R/W  
0
PRR  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
• Bits 7, 6, 5, 4- Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 3- PRTIM1: Power Reduction Timer/Counter1  
Writing a logic one to this bit shuts down the Timer/Counter1 module. When the Timer/Counter1  
is enabled, operation will continue like before the shutdown.  
• Bit 2- PRTIM0: Power Reduction Timer/Counter0  
Writing a logic one to this bit shuts down the Timer/Counter0 module. When the Timer/Counter0  
is enabled, operation will continue like before the shutdown.  
• Bit 1 - PRUSI: Power Reduction USI  
Writing a logic one to this bit shuts down the USI by stopping the clock to the module. When  
waking up the USI again, the USI should be re initialized to ensure proper operation.  
• Bit 0 - PRADC: Power Reduction ADC  
Writing a logic one to this bit shuts down the ADC. The ADC must be disabled before shut down.  
The analog comparator cannot use the ADC input MUX when the ADC is shut down.  
38  
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ATtiny24/44/84  
9. System Control and Reset  
9.0.1  
Resetting the AVR  
During reset, all I/O Registers are set to their initial values, and the program starts execution  
from the Reset Vector. The instruction placed at the Reset Vector must be a RJMP – Relative  
Jump – instruction to the reset handling routine. If the program never enables an interrupt  
source, the Interrupt Vectors are not used, and regular program code can be placed at these  
locations. The circuit diagram in Figure 9-1 on page 40 shows the reset logic. Table 9-1 on page  
41 defines the electrical parameters of the reset circuitry.  
The I/O ports of the AVR are immediately reset to their initial state when a reset source goes  
active. This does not require any clock source to be running.  
After all reset sources have gone inactive, a delay counter is invoked, stretching the internal  
reset. This allows the power to reach a stable level before normal operation starts. The time-out  
period of the delay counter is defined by the user through the SUT and CKSEL Fuses. The dif-  
ferent selections for the delay period are presented in ”Clock Sources” on page 26.  
9.0.2  
Reset Sources  
The ATtiny24/44/84 has four sources of reset:  
• Power-on Reset. The MCU is reset when the supply voltage is below the Power-on Reset  
threshold (VPOT).  
• External Reset. The MCU is reset when a low level is present on the RESET pin for longer than  
the minimum pulse length when RESET function is enabled.  
• Watchdog Reset. The MCU is reset when the Watchdog Timer period expires and the  
Watchdog is enabled.  
• Brown-out Reset. The MCU is reset when the supply voltage VCC is below the Brown-out Reset  
threshold (VBOT) and the Brown-out Detector is enabled.  
39  
7701C–AVR–12/08  
Figure 9-1. Reset Logic  
DATA BUS  
MCU Status  
Register (MCUSR)  
Power-on Reset  
Circuit  
Brown-out  
Reset Circuit  
BODLEVEL [1..0]  
Pull-up Resistor  
SPIKE  
FILTER  
Watchdog  
Oscillator  
Delay Counters  
Clock  
CK  
Generator  
TIMEOUT  
CKSEL[1:0]  
SUT[1:0]  
9.0.3  
Power-on Reset  
A Power-on Reset (POR) pulse is generated by an On-chip detection circuit. The detection level  
is defined in ”System and Reset Characterizations” on page 182. The POR is activated when-  
ever VCC is below the detection level. The POR circuit can be used to trigger the Start-up Reset,  
as well as to detect a failure in supply voltage.  
A Power-on Reset (POR) circuit ensures that the device is reset from Power-on. Reaching the  
Power-on Reset threshold voltage invokes the delay counter, which determines how long the  
device is kept in RESET after VCC rise. The RESET signal is activated again, without any delay,  
when VCC decreases below the detection level.  
Figure 9-2. MCU Start-up, RESET Tied to VCC  
V
CCRR  
VCC  
VPORMAX  
VPORMIN  
RESET  
VRST  
tTOUT  
TIME-OUT  
INTERNAL  
RESET  
40  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 9-3. MCU Start-up, RESET Extended Externally  
VPOT  
VCC  
VRST  
RESET  
tTOUT  
TIME-OUT  
INTERNAL  
RESET  
Table 9-1.  
Symbol  
Power On Reset Specifications  
Parameter  
Min  
1.1  
0.8  
Typ  
1.4  
1.3  
Max  
1.7  
Units  
Power-on Reset Threshold Voltage (rising)  
Power-on Reset Threshold Voltage (falling)()  
V
V
VPOT  
1.6  
VCC Max. start voltage to ensure internal Power-  
on Reset signal  
VPORMAX  
VPORMIN  
0.4  
V
V
VCC Min. start voltage to ensure internal Power-  
on Reset signal  
-0.1  
VCCRR  
VRST  
VCC Rise Rate to ensure Power-on Reset  
RESET Pin Threshold Voltage  
0.01  
V/ms  
V
0.1 VCC  
0.9VCC  
Note:  
1. Before rising, the supply has to be between VPORMIN and VPORMAX to ensure a Reset.  
9.0.4  
External Reset  
An External Reset is generated by a low level on the RESET pin if enabled. Reset pulses longer  
than the minimum pulse width (see ”System and Reset Characterizations” on page 182) will  
generate a reset, even if the clock is not running. Shorter pulses are not guaranteed to generate  
a reset. When the applied signal reaches the Reset Threshold Voltage – VRST – on its positive  
edge, the delay counter starts the MCU after the Time-out period – tTOUT – has expired.  
41  
7701C–AVR–12/08  
Figure 9-4. External Reset During Operation  
CC  
42  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
9.0.5  
Brown-out Detection  
ATtiny24/44/84 has an On-chip Brown-out Detection (BOD) circuit for monitoring the VCC level  
during operation by comparing it to a fixed trigger level. The trigger level for the BOD can be  
selected by the BODLEVEL Fuses. The trigger level has a hysteresis to ensure spike free  
Brown-out Detection. The hysteresis on the detection level should be interpreted as VBOT+  
VBOT + VHYST/2 and VBOT- = VBOT - VHYST/2.  
=
When the BOD is enabled, and VCC decreases to a value below the trigger level (VBOT- in Figure  
9-5 on page 43), the Brown-out Reset is immediately activated. When VCC increases above the  
trigger level (VBOT+ in Figure 9-5 on page 43), the delay counter starts the MCU after the Time-  
out period tTOUT has expired.  
The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level for lon-  
ger than tBOD given in ”System and Reset Characterizations” on page 182.  
Figure 9-5. Brown-out Reset During Operation  
VBOT+  
VCC  
VBOT-  
RESET  
t
TOUT  
TIME-OUT  
INTERNAL  
RESET  
9.0.6  
Watchdog Reset  
When the Watchdog times out, it will generate a short reset pulse of one CK cycle duration. On  
the falling edge of this pulse, the delay timer starts counting the Time-out period tTOUT. See  
”Watchdog Timer” on page 44 for details on operation of the Watchdog Timer.  
Figure 9-6. Watchdog Reset During Operation  
CC  
CK  
43  
7701C–AVR–12/08  
9.1  
Internal Voltage Reference  
ATtiny24/44/84 features an internal bandgap reference. This reference is used for Brown-out  
Detection, and it can be used as an input to the Analog Comparator or the ADC.  
9.1.1  
Voltage Reference Enable Signals and Start-up Time  
The voltage reference has a start-up time that may influence the way it should be used. The  
start-up time is given in ”System and Reset Characterizations” on page 182. To save power, the  
reference is not always turned on. The reference is on during the following situations:  
1. When the BOD is enabled (by programming the BODLEVEL [2..0] Fuse).  
2. When the bandgap reference is connected to the Analog Comparator (by setting the  
ACBG bit in ACSR).  
3. When the ADC is enabled.  
Thus, when the BOD is not enabled, after setting the ACBG bit or enabling the ADC, the user  
must always allow the reference to start up before the output from the Analog Comparator or  
ADC is used. To reduce power consumption in Power-down mode, the user can avoid the three  
conditions above to ensure that the reference is turned off before entering Power-down mode.  
9.2  
Watchdog Timer  
The Watchdog Timer is clocked from an On-chip Oscillator which runs at 128 kHz. By controlling  
the Watchdog Timer prescaler, the Watchdog Reset interval can be adjusted as shown in Table  
9-4 on page 48. The WDR – Watchdog Reset – instruction resets the Watchdog Timer. The  
Watchdog Timer is also reset when it is disabled and when a Chip Reset occurs. Ten different  
clock cycle periods can be selected to determine the reset period. If the reset period expires  
without another Watchdog Reset, the ATtiny24/44/84 resets and executes from the Reset Vec-  
tor. For timing details on the Watchdog Reset, refer to Table 9-4 on page 48.  
The Wathdog Timer can also be configured to generate an interrupt instead of a reset. This can  
be very helpful when using the Watchdog to wake-up from Power-down.  
To prevent unintentional disabling of the Watchdog or unintentional change of time-out period,  
two different safety levels are selected by the fuse WDTON as shown in Table 9-2. See ”Timed  
Sequences for Changing the Configuration of the Watchdog Timer” on page 45 for details.  
Table 9-2.  
WDT Configuration as a Function of the Fuse Settings of WDTON  
Safety  
Level  
WDT Initial  
State  
How to Disable the  
WDT  
How to Change Time-  
out  
WDTON  
Unprogrammed  
Programmed  
1
2
Disabled  
Enabled  
Timed sequence  
Always enabled  
No limitations  
Timed sequence  
44  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 9-7. Watchdog Timer  
WATCHDOG  
PRESCALER  
128 kHz  
OSCILLATOR  
WATCHDOG  
RESET  
WDP0  
WDP1  
WDP2  
WDP3  
WDE  
MCU RESET  
9.3  
Timed Sequences for Changing the Configuration of the Watchdog Timer  
The sequence for changing configuration differs slightly between the two safety levels. Separate  
procedures are described for each level.  
9.3.1  
Safety Level 1  
In this mode, the Watchdog Timer is initially disabled, but can be enabled by writing the WDE bit  
to one without any restriction. A timed sequence is needed when disabling an enabled Watch-  
dog Timer. To disable an enabled Watchdog Timer, the following procedure must be followed:  
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written  
to WDE regardless of the previous value of the WDE bit.  
2. Within the next four clock cycles, in the same operation, write the WDE and WDP bits as  
desired, but with the WDCE bit cleared.  
9.3.2  
Safety Level 2  
In this mode, the Watchdog Timer is always enabled, and the WDE bit will always read as one. A  
timed sequence is needed when changing the Watchdog Time-out period. To change the  
Watchdog Time-out, the following procedure must be followed:  
1. In the same operation, write a logical one to WDCE and WDE. Even though the WDE  
always is set, the WDE must be written to one to start the timed sequence.  
2. Within the next four clock cycles, in the same operation, write the WDP bits as desired,  
but with the WDCE bit cleared. The value written to the WDE bit is irrelevant.  
45  
7701C–AVR–12/08  
9.4  
Register Description  
9.4.1  
MCUSR – MCU Status Register  
The MCU Status Register provides information on which reset source caused an MCU Reset.  
Bit  
7
6
5
4
3
2
1
0
0x34 (0x54)  
Read/Write  
Initial Value  
WDRF  
R/W  
BORF  
R/W  
EXTRF  
R/W  
PORF  
R/W  
MCUSR  
R
0
R
0
R
0
R
0
See Bit Description  
• Bits 7..4 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 3 – WDRF: Watchdog Reset Flag  
This bit is set if a Watchdog Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
• Bit 2 – BORF: Brown-out Reset Flag  
This bit is set if a Brown-out Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
• Bit 1 – EXTRF: External Reset Flag  
This bit is set if an External Reset occurs. The bit is reset by a Power-on Reset, or by writing a  
logic zero to the flag.  
• Bit 0 – PORF: Power-on Reset Flag  
This bit is set if a Power-on Reset occurs. The bit is reset only by writing a logic zero to the flag.  
To make use of the Reset Flags to identify a reset condition, the user should read and then reset  
the MCUSR as early as possible in the program. If the register is cleared before another reset  
occurs, the source of the reset can be found by examining the Reset Flags.  
9.4.2  
WDTCSR – Watchdog Timer Control and Status Register  
Bit  
0x21 (0x41)  
7
6
5
4
3
2
WDP2  
R/W  
0
1
WDP1  
R/W  
0
0
WDP0  
R/W  
0
WDIF  
WDIE  
WDP3  
WDCE  
R/W  
0
WDE  
R/W  
X
WDTCSR  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
0
• Bit 7 – WDIF: Watchdog Timeout Interrupt Flag  
This bit is set when a time-out occurs in the Watchdog Timer and the Watchdog Timer is config-  
ured for interrupt. WDIF is cleared by hardware when executing the corresponding interrupt  
handling vector. Alternatively, WDIF is cleared by writing a logic one to the flag. When the I-bit in  
SREG and WDIE are set, the Watchdog Time-out Interrupt is executed.  
• Bit 6 – WDIE: Watchdog Timeout Interrupt Enable  
When this bit is written to one, WDE is cleared, and the I-bit in the Status Register is set, the  
Watchdog Time-out Interrupt is enabled. In this mode the corresponding interrupt is executed  
instead of a reset if a timeout in the Watchdog Timer occurs.  
If WDE is set, WDIE is automatically cleared by hardware when a time-out occurs. This is useful  
for keeping the Watchdog Reset security while using the interrupt. After the WDIE bit is cleared,  
46  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
the next time-out will generate a reset. To avoid the Watchdog Reset, WDIE must be set after  
each interrupt.  
Table 9-3.  
Watchdog Timer Configuration  
WDE  
WDIE  
Watchdog Timer State  
Stopped  
Action on Time-out  
None  
0
0
1
1
0
1
0
1
Running  
Interrupt  
Running  
Reset  
Running  
Interrupt  
• Bit 4 – WDCE: Watchdog Change Enable  
This bit must be set when the WDE bit is written to logic zero. Otherwise, the Watchdog will not  
be disabled. Once written to one, hardware will clear this bit after four clock cycles. See the  
description of the WDE bit for a Watchdog disable procedure. This bit must also be set when  
changing the prescaler bits. See ”Timed Sequences for Changing the Configuration of the  
Watchdog Timer” on page 45.  
• Bit 3 – WDE: Watchdog Enable  
When the WDE is written to logic one, the Watchdog Timer is enabled, and if the WDE is written  
to logic zero, the Watchdog Timer function is disabled. WDE can only be cleared if the WDCE bit  
has logic level one. To disable an enabled Watchdog Timer, the following procedure must be  
followed:  
1. In the same operation, write a logic one to WDCE and WDE. A logic one must be written  
to WDE even though it is set to one before the disable operation starts.  
2. Within the next four clock cycles, write a logic 0 to WDE. This disables the Watchdog.  
In safety level 2, it is not possible to disable the Watchdog Timer, even with the algorithm  
described above. See ”Timed Sequences for Changing the Configuration of the Watchdog  
Timer” on page 45.  
In safety level 1, WDE is overridden by WDRF in MCUSR. See ”MCUSR – MCU Status Regis-  
ter” on page 46 for description of WDRF. This means that WDE is always set when WDRF is set.  
To clear WDE, WDRF must be cleared before disabling the Watchdog with the procedure  
described above. This feature ensures multiple resets during conditions causing failure, and a  
safe start-up after the failure.  
Note:  
If the watchdog timer is not going to be used in the application, it is important to go through a  
watchdog disable procedure in the initialization of the device. If the Watchdog is accidentally  
enabled, for example by a runaway pointer or brown-out condition, the device will be reset, which  
in turn will lead to a new watchdog reset. To avoid this situation, the application software should  
always clear the WDRF flag and the WDE control bit in the initialization routine.  
• Bits 5, 2..0 – WDP3..0: Watchdog Timer Prescaler 3, 2, 1, and 0  
The WDP3..0 bits determine the Watchdog Timer prescaling when the Watchdog Timer is  
enabled. The different prescaling values and their corresponding Timeout Periods are shown in  
Table 9-4 on page 48.  
47  
7701C–AVR–12/08  
Table 9-4.  
Watchdog Timer Prescale Select  
Number of WDT Oscillator  
Typical Time-out at  
VCC = 5.0V  
WDP3  
WDP2  
WDP1  
WDP0  
Cycles  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
2K cycles  
16 ms  
32 ms  
64 ms  
0.125 s  
0.25 s  
0.5 s  
4K cycles  
8K cycles  
16K cycles  
32K cycles  
64K cycles  
128K cycles  
256K cycles  
512K cycles  
1024K cycles  
1.0 s  
2.0 s  
4.0 s  
8.0 s  
Reserved  
48  
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ATtiny24/44/84  
The following code example shows one assembly and one C function for turning off the WDT.  
The example assumes that interrupts are controlled (e.g., by disabling interrupts globally) so that  
no interrupts will occur during execution of these functions.  
Assembly Code Example(1)  
WDT_off:  
WDR  
; Clear WDRF in MCUSR  
ldi r16, (0<<WDRF)  
out MCUSR, r16  
; Write logical one to WDCE and WDE  
; Keep old prescaler setting to prevent unintentional Watchdog Reset  
in r16, WDTCR  
ori r16, (1<<WDCE)|(1<<WDE)  
out WDTCR, r16  
; Turn off WDT  
ldi r16, (0<<WDE)  
out WDTCR, r16  
ret  
C Code Example(1)  
void WDT_off(void)  
{
_WDR();  
/* Clear WDRF in MCUSR */  
MCUSR = 0x00  
/* Write logical one to WDCE and WDE */  
WDTCR |= (1<<WDCE) | (1<<WDE);  
/* Turn off WDT */  
WDTCR = 0x00;  
}
Note:  
1. See ”About Code Examples” on page 6.  
49  
7701C–AVR–12/08  
10. Interrupts  
This section describes the specifics of the interrupt handling as performed in ATtiny24/44/84.  
For a general explanation of the AVR interrupt handling, see ”Reset and Interrupt Handling” on  
page 12.  
10.1 Interrupt Vectors  
Table 10-1. Reset and Interrupt Vectors  
Vector No.  
Program Address  
Source  
Interrupt Definition  
External Pin, Power-on Reset,  
1
0x0000  
RESET  
Brown-out Reset, Watchdog Reset  
2
3
0x0001  
0x0002  
0x0003  
0x0004  
0x0005  
0x0006  
0x0007  
0x0008  
0x0009  
0x000A  
0x000B  
0x000C  
0x000D  
0x000E  
0x000F  
0x0010  
INT0  
External Interrupt Request 0  
Pin Change Interrupt Request 0  
Pin Change Interrupt Request 1  
Watchdog Time-out  
PCINT0  
4
PCINT1  
5
WDT  
6
TIMER1 CAPT  
TIMER1 COMPA  
TIMER1 COMPB  
TIMER1 OVF  
TIMER0 COMPA  
TIMER0 COMPB  
TIMER0 OVF  
ANA_COMP  
ADC  
Timer/Counter1 Capture Event  
Timer/Counter1 Compare Match A  
Timer/Counter1 Compare Match B  
Timer/Counter0 Overflow  
Timer/Counter0 Compare Match A  
Timer/Counter0 Compare Match B  
Timer/Counter0 Overflow  
Analog Comparator  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
ADC Conversion Complete  
EEPROM Ready  
EE_RDY  
USI_START  
USI_OVF  
USI START  
USI Overflow  
If the program never enables an interrupt source, the Interrupt Vectors are not used, and regular  
program code can be placed at these locations. The most typical and general program setup for  
the Reset and Interrupt Vector Addresses in ATtiny24/44/84 is:  
50  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Address Labels Code  
Comments  
0x0000  
0x0001  
0x0002  
0x0003  
0x0004  
0x0005  
0x0006  
0x0007  
0x0008  
0x0009  
0x000A  
0x000B  
0x000C  
0x000D  
0x000E  
0x000F  
0x0010  
;
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
rjmp  
RESET  
; Reset Handler  
; IRQ0 Handler  
; PCINT0 Handler  
; PCINT1 Handler  
EXT_INT0  
PCINT0  
PCINT1  
WATCHDOG  
TIM1_CAPT  
TIM1_COMPA  
TIM1_COMPB  
TIM1_OVF  
TIM0_COMPA  
TIM0_COMPB  
TIM0_OVF  
ANA_COMP  
ADC  
; Watchdog Interrupt Handler  
; Timer1 Capture Handler  
; Timer1 Compare A Handler  
; Timer1 Compare B Handler  
; Timer1 Overflow Handler  
; Timer0 Compare A Handler  
; Timer0 Compare B Handler  
; Timer0 Overflow Handler  
; Analog Comparator Handler  
; ADC Conversion Handler  
; EEPROM Ready Handler  
EE_RDY  
USI_STR  
USI_OVF  
; USI STart Handler  
; USI Overflow Handler  
0x0011 RESET: ldi  
r16, high(RAMEND); Main program start  
0x0012  
0x0013  
0x0014  
0x0015  
0x0016  
...  
out  
ldi  
SPH,r16  
; Set Stack Pointer to top of RAM  
r16, low(RAMEND)  
SPL,r16  
out  
sei  
; Enable interrupts  
<instr> xxx  
...  
... ...  
51  
7701C–AVR–12/08  
11. External Interrupts  
The External Interrupts are triggered by the INT0 pin or any of the PCINT11..0 pins. Observe  
that, if enabled, the interrupts will trigger even if the INT0 or PCINT11..0 pins are configured as  
outputs. This feature provides a way of generating a software interrupt. Pin change 0 interrupts  
PCI0 will trigger if any enabled PCINT7..0 pin toggles. Pin change 1 interrupts PCI1 will trigger if  
any enabled PCINT11..8 pin toggles. The PCMSK0 and PCMSK1 Registers control which pins  
contribute to the pin change interrupts. Pin change interrupts on PCINT11..0 are detected asyn-  
chronously. This implies that these interrupts can be used for waking the part also from sleep  
modes other than Idle mode.  
The INT0 interrupts can be triggered by a falling or rising edge or a low level. This is set up as  
indicated in the specification for the MCU Control Register – MCUCR. When the INT0 interrupt is  
enabled and is configured as level triggered, the interrupt will trigger as long as the pin is held  
low. Note that recognition of falling or rising edge interrupts on INT0 requires the presence of an  
I/O clock, described in ”Clock Systems and their Distribution” on page 25. Low level interrupt on  
INT0 is detected asynchronously. This implies that this interrupt can be used for waking the part  
also from sleep modes other than Idle mode. The I/O clock is halted in all sleep modes except  
Idle mode.  
Note that if a level triggered interrupt is used for wake-up from Power-down, the required level  
must be held long enough for the MCU to complete the wake-up to trigger the level interrupt. If  
the level disappears before the end of the Start-up Time, the MCU will still wake up, but no inter-  
rupt will be generated. The start-up time is defined by the SUT and CKSEL Fuses as described  
in ”System Clock and Clock Options” on page 25.  
11.1 Pin Change Interrupt Timing  
An example of timing of a pin change interrupt is shown in Figure .  
Timing of pin change interrupts  
pin_lat  
pcint_in_(0)  
PCINT(0)  
clk  
0
x
D
Q
pcint_syn  
pcint_setflag  
PCIF  
pin_sync  
PCINT(0) in PCMSK(x)  
LE  
clk  
clk  
PCINT(0)  
pin_lat  
pin_sync  
pcint_in_(0)  
pcint_syn  
pcint_setflag  
PCIF  
52  
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ATtiny24/44/84  
11.2 Register Description  
11.2.1  
MCUCR – MCU Control Register  
The External Interrupt Control Register A contains control bits for interrupt sense control.  
Bit  
7
6
5
SE  
R/W  
0
4
3
2
1
ISC01  
R/W  
0
0
ISC00  
R/W  
0
0x35 (0x55)  
Read/Write  
Initial Value  
PUD  
R/W  
0
SM1  
R/W  
0
SM0  
R/W  
0
MCUCR  
R
0
R
0
• Bits 1, 0 – ISC01, ISC00: Interrupt Sense Control 0 Bit 1 and Bit 0  
The External Interrupt 0 is activated by the external pin INT0 if the SREG I-flag and the corre-  
sponding interrupt mask are set. The level and edges on the external INT0 pin that activate the  
interrupt are defined in Table 11-1 on page 53. The value on the INT0 pin is sampled before  
detecting edges. If edge or toggle interrupt is selected, pulses that last longer than one clock  
period will generate an interrupt. Shorter pulses are not guaranteed to generate an interrupt. If  
low level interrupt is selected, the low level must be held until the completion of the currently  
executing instruction to generate an interrupt.  
Table 11-1. Interrupt 0 Sense Control  
ISC01  
ISC00  
Description  
0
0
1
1
0
1
0
1
The low level of INT0 generates an interrupt request.  
Any logical change on INT0 generates an interrupt request.  
The falling edge of INT0 generates an interrupt request.  
The rising edge of INT0 generates an interrupt request.  
11.2.2  
GIMSK – General Interrupt Mask Register  
Bit  
7
6
5
PCIE1  
R/W  
0
4
PCIE0  
R/w  
0
3
2
1
0
0x3B (0x5B)  
Read/Write  
Initial Value  
INT0  
R/W  
0
GIMSK  
R
0
R
0
R
0
R
0
R
0
• Bits 7, 3..0 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 6 – INT0: External Interrupt Request 0 Enable  
When the INT0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), the exter-  
nal pin interrupt is enabled. The Interrupt Sense Control0 bits 1/0 (ISC01 and ISC00) in the  
External Interrupt Control Register A (EICRA) define whether the external interrupt is activated  
on rising and/or falling edge of the INT0 pin or level sensed. Activity on the pin will cause an  
interrupt request even if INT0 is configured as an output. The corresponding interrupt of External  
Interrupt Request 0 is executed from the INT0 Interrupt Vector.  
• Bit 5 – PCIE1: Pin Change Interrupt Enable 1  
When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin  
change interrupt 1 is enabled. Any change on any enabled PCINT11..8 pin will cause an inter-  
rupt. The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI1  
Interrupt Vector. PCINT11..8 pins are enabled individually by the PCMSK1 Register.  
53  
7701C–AVR–12/08  
• Bit 4– PCIE0: Pin Change Interrupt Enable 0  
When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one), pin  
change interrupt 0 is enabled. Any change on any enabled PCINT7..0 pin will cause an interrupt.  
The corresponding interrupt of Pin Change Interrupt Request is executed from the PCI0 Inter-  
rupt Vector. PCINT7..0 pins are enabled individually by the PCMSK0 Register.  
11.2.3  
GIFR – General Interrupt Flag Register  
Bit  
0x3A (0x5A  
7
6
5
PCIF1  
R/W  
0
4
PCIF0  
R/W  
0
3
2
1
0
INTF0  
R/W  
0
GIFR  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
• Bits 7, 3..0 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 6 – INTF0: External Interrupt Flag 0  
When an edge or logic change on the INT0 pin triggers an interrupt request, INTF0 becomes set  
(one). If the I-bit in SREG and the INT0 bit in GIMSK are set (one), the MCU will jump to the cor-  
responding Interrupt Vector. The flag is cleared when the interrupt routine is executed.  
Alternatively, the flag can be cleared by writing a logical one to it. This flag is always cleared  
when INT0 is configured as a level interrupt.  
• Bit 5 – PCIF1: Pin Change Interrupt Flag 1  
When a logic change on any PCINT11..8 pin triggers an interrupt request, PCIF1 becomes set  
(one). If the I-bit in SREG and the PCIE1 bit in GIMSK are set (one), the MCU will jump to the  
corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alter-  
natively, the flag can be cleared by writing a logical one to it.  
• Bit 4– PCIF0: Pin Change Interrupt Flag 0  
When a logic change on any PCINT7..0 pin triggers an interrupt request, PCIF becomes set  
(one). If the I-bit in SREG and the PCIE0 bit in GIMSK are set (one), the MCU will jump to the  
corresponding Interrupt Vector. The flag is cleared when the interrupt routine is executed. Alter-  
natively, the flag can be cleared by writing a logical one to it.  
11.2.4  
PCMSK1 – Pin Change Mask Register 1  
Bit  
0x20 (0x40)  
7
6
5
4
3
PCINT11  
R/W  
2
PCINT10  
R/W  
1
PCINT9  
R/W  
0
0
PCINT8  
R/W  
0
PCMSK1  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
0
0
• Bits 7, 4– Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bits 3..0 – PCINT11..8: Pin Change Enable Mask 11..8  
Each PCINT11..8 bit selects whether pin change interrupt is enabled on the corresponding I/O  
pin. If PCINT11..8 is set and the PCIE1 bit in GIMSK is set, pin change interrupt is enabled on  
54  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
the corresponding I/O pin. If PCINT11..8 is cleared, pin change interrupt on the corresponding  
I/O pin is disabled.  
11.2.5  
PCMSK0 – Pin Change Mask Register 0  
Bit  
0x12 (0x32)  
7
6
5
PCINT5  
R/W  
0
4
PCINT4  
R/W  
0
3
PCINT3  
R/W  
0
2
PCINT2  
R/W  
0
1
PCINT1  
R/W  
0
0
PCINT0  
R/W  
0
PCINT7  
PCINT6  
R/W  
0
PCMSK0  
Read/Write  
Initial Value  
R/W  
0
• Bits 7..0 – PCINT7..0: Pin Change Enable Mask 7..0  
Each PCINT7..0 bit selects whether pin change interrupt is enabled on the corresponding I/O  
pin. If PCINT7..0 is set and the PCIE0 bit in GIMSK is set, pin change interrupt is enabled on the  
corresponding I/O pin. If PCINT7..0 is cleared, pin change interrupt on the corresponding I/O pin  
is disabled.  
55  
7701C–AVR–12/08  
12. I/O Ports  
12.1 Overview  
All AVR ports have true Read-Modify-Write functionality when used as general digital I/O ports.  
This means that the direction of one port pin can be changed without unintentionally changing  
the direction of any other pin with the SBI and CBI instructions. The same applies when chang-  
ing drive value (if configured as output) or enabling/disabling of pull-up resistors (if configured as  
input). Each output buffer has symmetrical drive characteristics with both high sink and source  
capability. The pin driver is strong enough to drive LED displays directly. All port pins have indi-  
vidually selectable pull-up resistors with a supply-voltage invariant resistance. All I/O pins have  
protection diodes to both VCC and Ground as indicated in Figure 12-1 on page 56. See ”Electri-  
cal Characteristics” on page 179 for a complete list of parameters.  
Figure 12-1. I/O Pin Equivalent Schematic  
Rpu  
Pxn  
Logic  
Cpin  
See Figure  
"General Digital I/O" for  
Details  
All registers and bit references in this section are written in general form. A lower case “x” repre-  
sents the numbering letter for the port, and a lower case “n” represents the bit number. However,  
when using the register or bit defines in a program, the precise form must be used. For example,  
PORTB3 for bit no. 3 in Port B, here documented generally as PORTxn. The physical I/O Regis-  
ters and bit locations are listed in ”EXT_CLOCK = external clock is selected as system clock.” on  
page 70.  
Three I/O memory address locations are allocated for each port, one each for the Data Register  
– PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The Port Input Pins  
I/O location is read only, while the Data Register and the Data Direction Register are read/write.  
However, writing a logic one to a bit in the PINx Register, will result in a toggle in the correspond-  
ing bit in the Data Register. In addition, the Pull-up Disable – PUD bit in MCUCR disables the  
pull-up function for all pins in all ports when set.  
Using the I/O port as General Digital I/O is described in ”Ports as General Digital I/O” on page  
57. Most port pins are multiplexed with alternate functions for the peripheral features on the  
device. How each alternate function interferes with the port pin is described in ”Alternate Port  
Functions” on page 61. Refer to the individual module sections for a full description of the alter-  
nate functions.  
56  
ATtiny24/44/84  
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ATtiny24/44/84  
Note that enabling the alternate function of some of the port pins does not affect the use of the  
other pins in the port as general digital I/O.  
12.2 Ports as General Digital I/O  
The ports are bi-directional I/O ports with optional internal pull-ups. Figure 12-2 shows a func-  
tional description of one I/O-port pin, here generically called Pxn.  
Figure 12-2. General Digital I/O(1)  
PUD  
Q
D
DDxn  
Q CLR  
WDx  
RDx  
RESET  
1
0
Q
D
Pxn  
PORTxn  
Q CLR  
RESET  
WPx  
WRx  
SLEEP  
RRx  
SYNCHRONIZER  
RPx  
D
Q
D
L
Q
Q
PINxn  
Q
clk I/O  
WDx:  
RDx:  
WRx:  
RRx:  
RPx:  
WPx:  
WRITE DDRx  
READ DDRx  
WRITE PORTx  
PUD:  
SLEEP:  
clkI/O  
PULLUP DISABLE  
SLEEP CONTROL  
I/O CLOCK  
:
READ PORTx REGISTER  
READ PORTx PIN  
WRITE PINx REGISTER  
Note:  
1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O  
,
SLEEP, and PUD are common to all ports.  
12.2.1  
Configuring the Pin  
Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in  
”EXT_CLOCK = external clock is selected as system clock.” on page 70, the DDxn bits are  
accessed at the DDRx I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn  
bits at the PINx I/O address.  
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written logic one,  
Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is configured as an input  
pin.  
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up resistor is  
activated. To switch the pull-up resistor off, PORTxn has to be written logic zero or the pin has to  
be configured as an output pin. The port pins are tri-stated when reset condition becomes active,  
even if no clocks are running.  
57  
7701C–AVR–12/08  
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven  
high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port  
pin is driven low (zero).  
12.2.2  
12.2.3  
Toggling the Pin  
Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn.  
Note that the SBI instruction can be used to toggle one single bit in a port.  
Switching Between Input and Output  
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn}  
= 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output  
low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully accept-  
able, as a high-impedant environment will not notice the difference between a strong high driver  
and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all  
pull-ups in all ports.  
Switching between input with pull-up and output low generates the same problem. The user  
must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn}  
= 0b10) as an intermediate step.  
Table 12-1 on page 58 summarizes the control signals for the pin value.  
Table 12-1. Port Pin Configurations  
PUD  
DDxn  
PORTxn  
(in MCUCR)  
I/O  
Pull-up  
No  
Comment  
0
0
1
1
0
1
X
0
Input  
Tri-state (Hi-Z)  
0
Input  
Yes  
No  
Pxn will source current if ext. pulled low.  
Tri-state (Hi-Z)  
0
1
Input  
1
X
X
Output  
Output  
No  
Output Low (Sink)  
Output High (Source)  
1
No  
12.2.4  
Reading the Pin Value  
Independent of the setting of Data Direction bit DDxn, the port pin can be read through the  
PINxn Register bit. As shown in Figure 12-2 on page 57, the PINxn Register bit and the preced-  
ing latch constitute a synchronizer. This is needed to avoid metastability if the physical pin  
changes value near the edge of the internal clock, but it also introduces a delay. Figure 12-3 on  
page 59 shows a timing diagram of the synchronization when reading an externally applied pin  
value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min  
respectively.  
58  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 12-3. Synchronization when Reading an Externally Applied Pin value  
SYSTEM CLK  
INSTRUCTIONS  
SYNC LATCH  
PINxn  
XXX  
XXX  
in r17, PINx  
0x00  
tpd, max  
0xFF  
r17  
tpd, min  
Consider the clock period starting shortly after the first falling edge of the system clock. The latch  
is closed when the clock is low, and goes transparent when the clock is high, as indicated by the  
shaded region of the “SYNC LATCH” signal. The signal value is latched when the system clock  
goes low. It is clocked into the PINxn Register at the succeeding positive clock edge. As indi-  
cated by the two arrows tpd,max and tpd,min, a single signal transition on the pin will be delayed  
between ½ and 1½ system clock period depending upon the time of assertion.  
When reading back a software assigned pin value, a nop instruction must be inserted as indi-  
cated in Figure 12-4 on page 59. The out instruction sets the “SYNC LATCH” signal at the  
positive edge of the clock. In this case, the delay tpd through the synchronizer is one system  
clock period.  
Figure 12-4. Synchronization when Reading a Software Assigned Pin Value  
SYSTEM CLK  
0xFF  
r16  
out PORTx, r16  
nop  
in r17, PINx  
INSTRUCTIONS  
SYNC LATCH  
PINxn  
0x00  
tpd  
0xFF  
r17  
The following code example shows how to set port A pins 0 and 1 high, 2 and 3 low, and define  
the port pins from 4 to 5 as input with a pull-up assigned to port pin 4. The resulting pin values  
59  
7701C–AVR–12/08  
are read back again, but as previously discussed, a nop instruction is included to be able to read  
back the value recently assigned to some of the pins.  
Assembly Code Example(1)  
...  
; Define pull-ups and set outputs high  
; Define directions for port pins  
ldi r16,(1<<PA4)|(1<<PA1)|(1<<PA0)  
ldi r17,(1<<DDA3)|(1<<DDA2)|(1<<DDA1)|(1<<DDA0)  
out PORTA,r16  
out DDRA,r17  
; Insert nop for synchronization  
nop  
; Read port pins  
in  
r16,PINA  
...  
C Code Example  
unsigned char i;  
...  
/* Define pull-ups and set outputs high */  
/* Define directions for port pins */  
PORTA = (1<<PA4)|(1<<PA1)|(1<<PA0);  
DDRA = (1<<DDA3)|(1<<DDA2)|(1<<DDA1)|(1<<DDA0);  
/* Insert nop for synchronization*/  
_NOP();  
/* Read port pins */  
i = PINA;  
...  
Note:  
1. For the assembly program, two temporary registers are used to minimize the time from pull-  
ups are set on pins 0, 1 and 4, until the direction bits are correctly set, defining bit 2 and 3 as  
low and redefining bits 0 and 1 as strong high drivers.  
12.2.5  
Digital Input Enable and Sleep Modes  
As shown in Figure 12-2 on page 57, the digital input signal can be clamped to ground at the  
input of the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep  
Controller in Power-down mode, Power-save mode, and Standby mode to avoid high power  
consumption if some input signals are left floating, or have an analog signal level close to VCC/2.  
SLEEP is overridden for port pins enabled as external interrupt pins. If the external interrupt  
request is not enabled, SLEEP is active also for these pins. SLEEP is also overridden by various  
other alternate functions as described in ”Alternate Port Functions” on page 61.  
If a logic high level (“one”) is present on an asynchronous external interrupt pin configured as  
“Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the external interrupt  
is not enabled, the corresponding External Interrupt Flag will be set when resuming from the  
above mentioned Sleep mode, as the clamping in these sleep mode produces the requested  
logic change.  
60  
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ATtiny24/44/84  
12.2.6  
Unconnected Pins  
If some pins are unused, it is recommended to ensure that these pins have a defined level. Even  
though most of the digital inputs are disabled in the deep sleep modes as described above, float-  
ing inputs should be avoided to reduce current consumption in all other modes where the digital  
inputs are enabled (Reset, Active mode and Idle mode).  
The simplest method to ensure a defined level of an unused pin, is to enable the internal pull-up.  
In this case, the pull-up will be disabled during reset. If low power consumption during reset is  
important, it is recommended to use an external pull-up or pulldown. Connecting unused pins  
directly to VCC or GND is not recommended, since this may cause excessive currents if the pin is  
accidentally configured as an output.  
12.3 Alternate Port Functions  
Most port pins have alternate functions in addition to being general digital I/Os. Figure 12-5 on  
page 62 shows how the port pin control signals from the simplified Figure 12-2 on page 57 can  
be overridden by alternate functions. The overriding signals may not be present in all port pins,  
but the figure serves as a generic description applicable to all port pins in the AVR microcon-  
troller family.  
61  
7701C–AVR–12/08  
Figure 12-5. Alternate Port Functions(1)  
PUOExn  
PUOVxn  
1
0
PUD  
DDOExn  
DDOVxn  
1
0
Q
D
DDxn  
Q CLR  
WDx  
RDx  
PVOExn  
PVOVxn  
RESET  
1
0
1
0
Pxn  
Q
D
PORTxn  
PTOExn  
Q CLR  
DIEOExn  
DIEOVxn  
SLEEP  
WPx  
RESET  
WRx  
1
0
RRx  
SYNCHRONIZER  
RPx  
SET  
D
Q
D
L
Q
Q
PINxn  
CLR Q  
CLR  
clk I/O  
DIxn  
AIOxn  
PUOExn: Pxn PULL-UP OVERRIDE ENABLE  
PUOVxn: Pxn PULL-UP OVERRIDE VALUE  
DDOExn: Pxn DATA DIRECTION OVERRIDE ENABLE  
DDOVxn: Pxn DATA DIRECTION OVERRIDE VALUE  
PVOExn: Pxn PORT VALUE OVERRIDE ENABLE  
PVOVxn: Pxn PORT VALUE OVERRIDE VALUE  
PUD:  
WDx:  
RDx:  
RRx:  
WRx:  
RPx:  
WPx:  
PULLUP DISABLE  
WRITE DDRx  
READ DDRx  
READ PORTx REGISTER  
WRITE PORTx  
READ PORTx PIN  
WRITE PINx  
DIEOExn: Pxn DIGITAL INPUT-ENABLE OVERRIDE ENABLE  
DIEOVxn: Pxn DIGITAL INPUT-ENABLE OVERRIDE VALUE  
clkI/O  
:
I/O CLOCK  
SLEEP:  
SLEEP CONTROL  
DIxn:  
DIGITAL INPUT PIN n ON PORTx  
AIOxn:  
ANALOG INPUT/OUTPUT PIN n ON PORTx  
PTOExn: Pxn, PORT TOGGLE OVERRIDE ENABLE  
Note:  
1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O  
,
SLEEP, and PUD are common to all ports. All other signals are unique for each pin.  
Table 12-2 on page 63 summarizes the function of the overriding signals. The pin and port  
indexes from Figure 12-5 on page 62 are not shown in the succeeding tables. The overriding  
signals are generated internally in the modules having the alternate function.  
62  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Table 12-2. Generic Description of Overriding Signals for Alternate Functions  
Signal Name  
Full Name  
Description  
If this signal is set, the pull-up enable is controlled by the PUOV  
signal. If this signal is cleared, the pull-up is enabled when  
{DDxn, PORTxn, PUD} = 0b010.  
Pull-up Override  
Enable  
PUOE  
If PUOE is set, the pull-up is enabled/disabled when PUOV is  
set/cleared, regardless of the setting of the DDxn, PORTxn,  
and PUD Register bits.  
Pull-up Override  
Value  
PUOV  
DDOE  
DDOV  
If this signal is set, the Output Driver Enable is controlled by the  
DDOV signal. If this signal is cleared, the Output driver is  
enabled by the DDxn Register bit.  
Data Direction  
Override Enable  
If DDOE is set, the Output Driver is enabled/disabled when  
DDOV is set/cleared, regardless of the setting of the DDxn  
Register bit.  
Data Direction  
Override Value  
If this signal is set and the Output Driver is enabled, the port  
value is controlled by the PVOV signal. If PVOE is cleared, and  
the Output Driver is enabled, the port Value is controlled by the  
PORTxn Register bit.  
Port Value  
Override Enable  
PVOE  
Port Value  
Override Value  
If PVOE is set, the port value is set to PVOV, regardless of the  
setting of the PORTxn Register bit.  
PVOV  
PTOE  
Port Toggle  
Override Enable  
If PTOE is set, the PORTxn Register bit is inverted.  
Digital Input  
Enable Override  
Enable  
If this bit is set, the Digital Input Enable is controlled by the  
DIEOV signal. If this signal is cleared, the Digital Input Enable  
is determined by MCU state (Normal mode, sleep mode).  
DIEOE  
DIEOV  
Digital Input  
Enable Override  
Value  
If DIEOE is set, the Digital Input is enabled/disabled when  
DIEOV is set/cleared, regardless of the MCU state (Normal  
mode, sleep mode).  
This is the Digital Input to alternate functions. In the figure, the  
signal is connected to the output of the schmitt-trigger but  
before the synchronizer. Unless the Digital Input is used as a  
clock source, the module with the alternate function will use its  
own synchronizer.  
DI  
Digital Input  
This is the Analog Input/Output to/from alternate functions. The  
signal is connected directly to the pad, and can be used bi-  
directionally.  
Analog  
Input/Output  
AIO  
The following subsections shortly describe the alternate functions for each port, and relate the  
overriding signals to the alternate function. Refer to the alternate function description for further  
details.  
63  
7701C–AVR–12/08  
12.3.1  
Alternate Functions of Port A  
The Port A pins with alternate function are shown in Table 12-7 on page 68.  
Table 12-3. Port A Pins Alternate Functions  
Port Pin  
Alternate Function  
ADC0: ADC input channel 0.  
PA0  
AREF: External analog reference.  
PCINT0: Pin change interrupt 0 source 0.  
ADC1: ADC input channel 1.  
PA1  
PA2  
PA3  
AIN0:  
Analog Comparator Positive Input.  
PCINT1:Pin change interrupt 0 source 1.  
ADC2: ADC input channel 2.  
AIN1:  
Analog Comparator Negative Input.  
PCINT2: Pin change interrupt 0 source 2.  
ADC3: ADC input channel 3.  
T0:  
Timer/Counter0 counter source.  
PCINT3: Pin change interrupt 0 source 3.  
ADC4: ADC input channel 4.  
USCK: USI Clock three wire mode.  
SCL : USI Clock two wire mode.  
PA4  
PA5  
PA6  
PA7  
T1:  
Timer/Counter1 counter source.  
PCINT4: Pin change interrupt 0 source 4.  
ADC5: ADC input channel 5.  
DO:  
USI Data Output three wire mode.  
OC1B: Timer/Counter1 Compare Match B output.  
PCINT5: Pin change interrupt 0 source 5.  
ADC6: ADC input channel 6.  
DI:  
USI Data Input three wire mode.  
USI Data Input two wire mode.  
SDA:  
OC1A: Timer/Counter1 Compare Match A output.  
PCINT6: Pin change interrupt 0 source 6.  
ADC7: ADC input channel 7.  
OC0B: Timer/Counter0 Compare Match B output.  
ICP1:  
Timer/Counter1 Input Capture Pin.  
PCINT7: Pin change interrupt 0 source 7.  
• Port A, Bit 0 – ADC0/AREF/PCINT0  
ADC0: Analog to Digital Converter, Channel 0.  
AREF: External Analog Reference for ADC. Pullup and output driver are disabled on PA0 when  
the pin is used as an external reference or Internal Voltage Reference with external capacitor at  
the AREF pin by setting (one) the bit REFS0 in the ADC Multiplexer Selection Register  
(ADMUX).  
PCINT0: Pin Change Interrupt source 0. The PA0 pin can serve as an external interrupt source  
for pin change interrupt 0.  
64  
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ATtiny24/44/84  
• Port A, Bit 1 – ADC1/AIN0/PCINT1  
ADC1: Analog to Digital Converter, Channel 1.  
AIN0: Analog Comparator Positive Input. Configure the port pin as input with the internal pull-up  
switched off to avoid the digital port function from interfering with the function of the Analog  
Comparator.  
PCINT1: Pin Change Interrupt source 1. The PA1 pin can serve as an external interrupt source  
for pin change interrupt 0.  
• Port A, Bit 2 – ADC2/AIN1/PCINT2  
ADC2: Analog to Digital Converter, Channel 2.  
AIN1: Analog Comparator Negative Input. Configure the port pin as input with the internal pull-up  
switched off to avoid the digital port function from interfering with the function of the Analog  
Comparator.  
PCINT2: Pin Change Interrupt source 2. The PA2 pin can serve as an external interrupt source  
for pin change interrupt 0.  
• Port A, Bit 3 – ADC3/T0/PCINT3  
ADC3: Analog to Digital Converter, Channel 3.  
T0: Timer/Counter0 counter source.  
PCINT3: Pin Change Interrupt source 3. The PA3 pin can serve as an external interrupt source  
for pin change interrupt 0.  
• Port A, Bit 4 – ADC4/USCK/SCL/T1/PCINT4  
ADC4: Analog to Digital Converter, Channel 4.  
USCK: Three-wire mode Universal Serial Interface Clock.  
SCL: Two-wire mode Serial Clock for USI Two-wire mode.  
T1: Timer/Counter1 counter source.  
PCINT4: Pin Change Interrupt source 4. The PA4 pin can serve as an external interrupt source  
for pin change interrupt 0.  
• Port A, Bit 5 – ADC5/DO/OC1B/PCINT5  
ADC5: Analog to Digital Converter, Channel 5.  
DO: Data Output in USI Three-wire mode. Data output (DO) overrides PORTA5 value and it is  
driven to the port when the data direction bit DDA5 is set (one). However the PORTA5 bit still  
controls the pullup, enabling pullup if direction is input and PORTA5 is set(one).  
OC1B: Output Compare Match output: The PA5 pin can serve as an external output for the  
Timer/Counter1 Compare Match B. The PA5 pin has to be configured as an output (DDA5 set  
(one)) to serve this function. The OC1B pin is also the output pin for the PWM mode timer  
function.  
PCINT5: Pin Change Interrupt source 5. The PA5 pin can serve as an external interrupt source  
for pin change interrupt 0.  
65  
7701C–AVR–12/08  
• Port A, Bit 6 – ADC6/DI/SDA/OC1A/PCINT6  
ADC6: Analog to Digital Converter, Channel 6.  
SDA: Two-wire mode Serial Interface Data.  
DI: Data Input in USI Three-wire mode. USI Three-wire mode does not override normal port  
functions, so pin must be configure as an input for DI function.  
OC1A, Output Compare Match output: The PA6 pin can serve as an external output for the  
Timer/Counter1 Compare Match A. The PA6 pin has to be configured as an output (DDA6 set  
(one)) to serve this function. The OC1A pin is also the output pin for the PWM mode timer  
function.  
PCINT6: Pin Change Interrupt source 6. The PA6 pin can serve as an external interrupt source  
for pin change interrupt 0.  
• Port A, Bit 7 – ADC7/OC0B/ICP1/PCINT7  
ADC7: Analog to Digital Converter, Channel 7.  
OC1B, Output Compare Match output: The PA7 pin can serve as an external output for the  
Timer/Counter1 Compare Match B. The PA7 pin has to be configured as an output (DDA7 set  
(one)) to serve this function. The OC1B pin is also the output pin for the PWM mode timer  
function.  
ICP1, Input Capture Pin: The PA7 pin can act as an Input Capture Pin for Timer/Counter1.  
PCINT7: Pin Change Interrupt source 7. The PA7 pin can serve as an external interrupt source  
for pin change interrupt 0.  
Table 12-4 on page 66 to Table 12-6 on page 67 relate the alternate functions of Port A to the  
overriding signals shown in Figure 12-5 on page 62.  
Table 12-4. Overriding Signals for Alternate Functions in PA7..PA5  
Signal  
Name  
PA7/ADC7/OC0B/ICP1/  
PCINT7  
PA6/ADC6/DI/SDA/OC1A/  
PCINT6  
PA5/ADC5/DO/OC1B/  
PCINT5  
PUOE  
PUOV  
DDOE  
DDOV  
0
0
0
0
0
0
0
0
0
0
USIWM1  
(SDA + PORTA6) • DDRA6  
(USIWM1 DDA6) + OC1A  
enable  
(USIWM1 USIWM0) +  
OC1B enable  
PVOE  
PVOV  
OC0B enable  
OC0B  
USIWM1 USIWM0 DO +  
(~USIWM1 USIWM0) •  
OC1B}  
( USIWM1DDA6) OC1A  
PTOE  
0
0
0
USISIE + (PCINT6 • PCIE0)  
+ ADC6D  
DIEOE  
PCINT7 • PCIE0 + ADC7D  
PCINT5 • PCIE + ADC5D  
DIEOV  
DI  
PCINT7 • PCIE0  
PCINT7/ICP1 Input  
ADC7 Input  
USISIE + PCINT7 • PCIE0  
DI/SDA/PCINT6 Input  
ADC6 Input  
PCINT5 • PCIE  
PCINT5 Input  
ADC5 Input  
AIO  
66  
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7701C–AVR–12/08  
ATtiny24/44/84  
Table 12-5. Overriding Signals for Alternate Functions in PA4..PA2  
Signal  
Name  
PA4/ADC4/USCK/SCL/T1/P  
CINT4  
PA3/ADC3/T0/PCINT3  
PA2/ADC2/AIN1/PCINT2  
PUOE  
PUOV  
DDOE  
0
0
0
0
0
0
0
0
USIWM1  
USI_SCL_HOLD +  
PORTA4) • ADC4D  
DDOV  
0
0
PVOE  
PVOV  
PTOE  
USIWM1 • ADC4D  
0
0
0
0
0
0
0
USI_PTOE  
USISIE +  
DIEOE  
(PCINT3 • PCIE0) + ADC3D  
PCINT3 • PCIE0  
PCINT2 • PCIE + ADC2D  
(PCINT4 • PCIE0) + ADC4D  
USISIE +  
DIEOV  
DI  
PCINT3 • PCIE0  
PCINT0 Input  
(PCINT4 • PCIE0)  
USCK/SCL/T1/PCINT4 input PCINT1 Input  
ADC4 Input ADC3 Input  
ADC2/Analog Comparator  
Negative Input  
AIO  
Table 12-6. Overriding Signals for Alternate Functions in PA1..PA0  
PA1/ADC1/AIN0/PCINT1  
Signal  
Name  
PA0/ADC0/AREF/PCINT0  
RESET •  
PUOE  
PUOV  
DDOE  
DDOV  
PVOE  
0
0
0
0
0
(REFS1 • REFS0 + REFS1 • REFS0)  
0
RESET •  
(REFS1 • REFS0 + REFS1 • REFS0)  
0
RESET •  
(REFS1 • REFS0 + REFS1 • REFS0)  
PVOV  
PTOE  
DIEOE  
DIEOV  
DI  
0
0
0
0
PCINT1 • PCIE0 + ADC1D  
PCINT1 • PCIE0  
PCINT1 Input  
PCINT0 • PCIE0 + ADC0D  
PCINT0 • PCIE0  
PCINT0 Input  
ADC1 Input  
AIO  
ADC1/Analog Comparator Positive Input  
Analog reference  
67  
7701C–AVR–12/08  
12.3.2  
Alternate Functions of Port B  
The Port B pins with alternate function are shown in Table 12-7 on page 68.  
Table 12-7. Port B Pins Alternate Functions  
Port Pin  
Alternate Function  
XTAL1: Crystal Oscillator Input.  
PB0  
PCINT8: Pin change interrupt 1 source 8.  
XTAL2: Crystal Oscillator Output.  
PB1  
PB2  
PCINT9: Pin change interrupt 1 source 9.  
INT0:  
External Interrupt 0 Input.  
OC0A: Timer/Counter0 Compare Match A output.  
CKOUT: System clock output.  
PCINT10:Pin change interrupt 1 source 10.  
RESET: Reset pin.  
PB3  
dW:  
debugWire I/O.  
PCINT11:Pin change interrupt 1 source 11.  
• Port B, Bit 0 – XTAL1/PCINT8  
XTAL1: Chip Clock Oscillator pin 1. Used for all chip clock sources except internal calibrateble  
RC oscillator. When used as a clock pin, the pin can not be used as an I/O pin. When using  
internal calibratable RC Oscillator as a chip clock source, PB0 serves as an ordinary I/O pin.  
PCINT8: Pin Change Interrupt source 8. The PB0 pin can serve as an external interrupt source  
for pin change interrupt 1.  
• Port B, Bit 1 – XTAL2/PCINT9  
XTAL2: Chip Clock Oscillator pin 2. Used as clock pin for all chip clock sources except internal  
calibrateble RC Oscillator and external clock. When used as a clock pin, the pin can not be used  
as an I/O pin. When using internal calibratable RC Oscillator or External clock as a Chip clock  
sources, PB1 serves as an ordinary I/O pin.  
PCINT9: Pin Change Interrupt source 9. The PB1 pin can serve as an external interrupt source  
for pin change interrupt 1.  
• Port B, Bit 2 – INT0/OC0A/CKOUT/PCINT10  
INT0: External Interrupt Request 0.  
OC0A: Output Compare Match output: The PB2 pin can serve as an external output for the  
Timer/Counter0 Compare Match A. The PB2 pin has to be configured as an output (DDB2 set  
(one)) to serve this function. The OC0A pin is also the output pin for the PWM mode timer  
function.  
CKOUT - System Clock Output: The system clock can be output on the PB2 pin. The system  
clock will be output if the CKOUT Fuse is programmed, regardless of the PORTB2 and DDB2  
settings. It will also be output during reset.  
PCINT10: Pin Change Interrupt source 10. The PB2 pin can serve as an external interrupt  
source for pin change interrupt 1.  
68  
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ATtiny24/44/84  
• Port B, Bit 3 – RESET/dW/PCINT11  
RESET: External Reset input is active low and enabled by unprogramming (“1”) the RSTDISBL  
Fuse. Pullup is activated and output driver and digital input are deactivated when the pin is used  
as the RESET pin.  
dW: When the debugWIRE Enable (DWEN) Fuse is programmed and Lock bits are unpro-  
grammed, the debugWIRE system within the target device is activated. The RESET port pin is  
configured as a wire-AND (open-drain) bi-directional I/O pin with pull-up enabled and becomes  
the communication gateway between target and emulator.  
PCINT11: Pin Change Interrupt source 11. The PB3 pin can serve as an external interrupt  
source for pin change interrupt 1.  
Table 12-8 on page 69 and Table 12-9 on page 70 relate the alternate functions of Port B to the  
overriding signals shown in Figure 12-5 on page 62.  
Table 12-8. Overriding Signals for Alternate Functions in PB3..PB2  
PB3/RESET/dW/  
PCINT11  
Signal  
Name  
PB2/INT0/OC0A/CKOUT/PCINT10  
PUOE  
PUOV  
DDOE  
RSTDISBL (1)+ DEBUGWIRE_ENABLE (2)  
CKOUT  
0
1
RSTDISBL(1) + DEBUGWIRE_ENABLE(2)  
CKOUT  
DEBUGWIRE_ENABLE(2) • debugWire  
Transmit  
DDOV  
1'b1  
PVOE  
PVOV  
PTOE  
RSTDISBL(1) + DEBUGWIRE_ENABLE(2)  
CKOUT + OC0A enable  
0
0
CKOUT • System Clock + CKOUT • OC0A  
0
RSTDISBL(1) + DEBUGWIRE_ENABLE(2)  
PCINT11 • PCIE1  
+
DIEOE  
DIEOV  
PCINT10 • PCIE1 + INT0  
DEBUGWIRE_ENABLE(2) + (RSTDISBL(1)  
PCINT11 • PCIE1)  
PCINT10 • PCIE1 + INT0  
INT0/PCINT10 Input  
DI  
dW/PCINT11 Input  
AIO  
1.  
2.  
RSTDISBL is 1 when the Fuse is “0” (Programmed).  
DebugWIRE is enabled wheb DWEN Fuse is programmed and Lock bits are unprogrammed.  
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Table 12-9. Overriding Signals for Alternate Functions in PB1..PB0  
Signal  
Name  
PUOE  
PUOV  
DDOE  
DDOV  
PVOE  
PVOV  
PTOE  
PB1/XTAL2/PCINT9  
PB0/XTAL1/PCINT8  
EXT_OSC (1)  
EXT_CLOCK (2) + EXT_OSC(1)  
0
0
EXT_OSC(1)  
EXT_CLOCK(2) + EXT_OSC(1)  
0
0
EXT_OSC(1)  
EXT_CLOCK(2) + EXT_OSC(1)  
0
0
0
0
EXT_OSC (1)  
+
EXT_CLOCK(2) + EXT_OSC(1)  
(PCINT8 • PCIE1)  
+
DIEOE  
DIEOV  
PCINT9 • PCIE1  
( EXT_CLOCK(2) • PWR_DOWN ) +  
(EXT_CLOCK(2) • EXT_OSC(1) • PCINT8 • PCIE1)  
EXT_OSC(1) • PCINT9 • PCIE1  
DI  
PCINT9 Input  
XTAL2  
CLOCK/PCINT8 Input  
XTAL1  
AIO  
1.  
2.  
EXT_OSC = crystal oscillator or low frequency crystal oscillator is selected as system clock.  
EXT_CLOCK = external clock is selected as system clock.  
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12.4 Register Description  
12.4.1  
MCUCR – MCU Control Register  
Bit  
7
6
5
SE  
R/W  
0
4
3
2
1
ISC01  
R
0
ISC00  
R
PUD  
R/W  
0
SM1  
R/W  
0
SM0  
R/W  
0
MCUCR  
Read/Write  
Initial Value  
R
0
R
0
0
0
• Bits 7, 2– Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 6 – PUD: Pull-up Disable  
When this bit is written to one, the pull-ups in the I/O ports are disabled even if the DDxn and  
PORTxn Registers are configured to enable the pull-ups ({DDxn, PORTxn} = 0b01). See ”Con-  
figuring the Pin” on page 57 for more details about this feature.  
12.4.2  
12.4.3  
12.4.4  
12.4.5  
12.4.6  
PORTA – Port A Data Register  
Bit  
7
6
PORTA6  
R/W  
0
5
PORTA5  
R/W  
0
4
PORTA4  
R/W  
0
3
PORTA3  
R/W  
0
2
PORTA2  
R/W  
0
1
PORTA1  
R/W  
0
0
PORTA0  
R/W  
0
PORTA7  
R/W  
0
PORTA  
DDRB  
PINB  
0x1B (0x3B)  
Read/Write  
Initial Value  
DDRA – Port A Data Direction Register  
Bit  
7
DDA7  
R/W  
0
6
DDA6  
R/W  
0
5
DDA5  
R/W  
0
4
DDA4  
R/W  
0
3
DDA3  
R/W  
0
2
DDA2  
R/W  
0
1
DDA1  
R/W  
0
0
DDA0  
R/W  
0
0x1A (0x3A)  
Read/Write  
Initial Value  
PINA – Port A Input Pins Address  
Bit  
7
PINA7  
R/W  
0
6
PINA6  
R/W  
0
5
4
3
2
1
0
0x19 (0x39)  
Read/Write  
Initial Value  
PINA5  
R/W  
N/A  
PINA4  
R/W  
N/A  
PINA3  
R/W  
N/A  
PINA2  
R/W  
N/A  
PINA1  
R/W  
N/A  
PINA0  
R/W  
N/A  
PORTB – Port B Data Register  
Bit  
7
6
5
4
3
PORTB3  
R/W  
0
2
PORTB2  
R/W  
0
1
PORTB1  
R/W  
0
0
PORTB0  
R/W  
0
PORTB  
0x18 (0x38)  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
DDRB – Port B Data Direction Register  
Bit  
7
6
5
4
3
DDB3  
R/W  
0
2
DDB2  
R/W  
0
1
DDB1  
R/W  
0
0
DDB0  
R/W  
0
0x17 (0x37)  
Read/Write  
Initial Value  
DDRB  
R
0
R
0
R
0
R
0
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12.4.7  
PINB – Port BInput Pins Address  
Bit  
7
6
5
4
3
2
1
0
0x16 (0x36)  
Read/Write  
Initial Value  
PINB3  
R/W  
N/A  
PINB2  
R/W  
N/A  
PINB1  
R/W  
N/A  
PINB0  
R/W  
N/A  
PINB  
R
0
R
0
R
R
N/A  
N/A  
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13. 8-bit Timer/Counter0 with PWM  
13.1 Features  
Two Independent Output Compare Units  
Double Buffered Output Compare Registers  
Clear Timer on Compare Match (Auto Reload)  
Glitch Free, Phase Correct Pulse Width Modulator (PWM)  
Variable PWM Period  
Frequency Generator  
Three Independent Interrupt Sources (TOV0, OCF0A, and OCF0B)  
13.2 Overview  
Timer/Counter0 is a general purpose 8-bit Timer/Counter module, with two independent Output  
Compare Units, and with PWM support. It allows accurate program execution timing (event man-  
agement) and wave generation.  
A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 13-1 on page 73. For  
the actual placement of I/O pins, refer to Figure 1-1 on page 2. CPU accessible I/O Registers,  
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-  
tions are listed in the ”Register Description” on page 84.  
Figure 13-1. 8-bit Timer/Counter Block Diagram  
Count  
TOVn  
(Int.Req.)  
Clear  
Direction  
Control Logic  
Clock Select  
clkTn  
Edge  
Detector  
Tn  
TOP  
BOTTOM  
( From Prescaler )  
Timer/Counter  
TCNTn  
=
= 0  
OCnA  
(Int.Req.)  
Waveform  
Generation  
OCnA  
=
OCRnA  
Fixed  
TOP  
Value  
OCnB  
(Int.Req.)  
Waveform  
Generation  
OCnB  
=
OCRnB  
TCCRnA  
TCCRnB  
13.2.1  
Registers  
The Timer/Counter (TCNT0) and Output Compare Registers (OCR0A and OCR0B) are 8-bit  
registers. Interrupt request (abbreviated to Int.Req. in the figure) signals are all visible in the  
Timer Interrupt Flag Register (TIFR0). All interrupts are individually masked with the Timer Inter-  
rupt Mask Register (TIMSK0). TIFR0 and TIMSK0 are not shown in the figure.  
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on  
the T0 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter  
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uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source  
is selected. The output from the Clock Select logic is referred to as the timer clock (clkT0).  
The double buffered Output Compare Registers (OCR0A and OCR0B) is compared with the  
Timer/Counter value at all times. The result of the compare can be used by the Waveform Gen-  
erator to generate a PWM or variable frequency output on the Output Compare pins (OC0A and  
OC0B). See ”Output Compare Unit” on page 75 for details. The Compare Match event will also  
set the Compare Flag (OCF0A or OCF0B) which can be used to generate an Output Compare  
interrupt request.  
13.2.2  
Definitions  
Many register and bit references in this section are written in general form. A lower case “n”  
replaces the Timer/Counter number, in this case 0. A lower case “x” replaces the Output Com-  
pare Unit, in this case Compare Unit A or Compare Unit B. However, when using the register or  
bit defines in a program, the precise form must be used, i.e., TCNT0 for accessing  
Timer/Counter0 counter value and so on.  
The definitions in Table 13-1 on page 74 are also used extensively throughout the document.  
Table 13-1. Definitions  
BOTTOM  
The counter reaches the BOTTOM when it becomes 0x00.  
MAX  
The counter reaches its MAXimum when it becomes 0xFF (decimal 255).  
TOP  
The counter reaches the TOP when it becomes equal to the highest value in the  
count sequence. The TOP value can be assigned to be the fixed value 0xFF  
(MAX) or the value stored in the OCR0A Register. The assignment is depen-  
dent on the mode of operation.  
13.3 Timer/Counter Clock Sources  
The Timer/Counter can be clocked by an internal or an external clock source. The clock source  
is selected by the Clock Select logic which is controlled by the Clock Select (CS02:0) bits  
located in the Timer/Counter Control Register (TCCR0B). For details on clock sources and pres-  
caler, see ”Timer/Counter Prescaler” on page 120.  
13.4 Counter Unit  
The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit. Figure  
13-2 on page 74 shows a block diagram of the counter and its surroundings.  
Figure 13-2. Counter Unit Block Diagram  
TOVn  
(Int.Req.)  
DATA BUS  
Clock Select  
count  
clear  
Edge  
Detector  
Tn  
clkTn  
TCNTn  
Control Logic  
direction  
( From Prescaler )  
bottom  
top  
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Signal description (internal signals):  
count  
direction  
clear  
Increment or decrement TCNT0 by 1.  
Select between increment and decrement.  
Clear TCNT0 (set all bits to zero).  
clkTn  
Timer/Counter clock, referred to as clkT0 in the following.  
Signalize that TCNT0 has reached maximum value.  
Signalize that TCNT0 has reached minimum value (zero).  
top  
bottom  
Depending of the mode of operation used, the counter is cleared, incremented, or decremented  
at each timer clock (clkT0). clkT0 can be generated from an external or internal clock source,  
selected by the Clock Select bits (CS02:0). When no clock source is selected (CS02:0 = 0) the  
timer is stopped. However, the TCNT0 value can be accessed by the CPU, regardless of  
whether clkT0 is present or not. A CPU write overrides (has priority over) all counter clear or  
count operations.  
The counting sequence is determined by the setting of the WGM01 and WGM00 bits located in  
the Timer/Counter Control Register (TCCR0A) and the WGM02 bit located in the Timer/Counter  
Control Register B (TCCR0B). There are close connections between how the counter behaves  
(counts) and how waveforms are generated on the Output Compare output OC0A. For more  
details about advanced counting sequences and waveform generation, see ”Modes of Opera-  
tion” on page 78.  
The Timer/Counter Overflow Flag (TOV0) is set according to the mode of operation selected by  
the WGM01:0 bits. TOV0 can be used for generating a CPU interrupt.  
13.5 Output Compare Unit  
The 8-bit comparator continuously compares TCNT0 with the Output Compare Registers  
(OCR0A and OCR0B). Whenever TCNT0 equals OCR0A or OCR0B, the comparator signals a  
match. A match will set the Output Compare Flag (OCF0A or OCF0B) at the next timer clock  
cycle. If the corresponding interrupt is enabled, the Output Compare Flag generates an Output  
Compare interrupt. The Output Compare Flag is automatically cleared when the interrupt is exe-  
cuted. Alternatively, the flag can be cleared by software by writing a logical one to its I/O bit  
location. The Waveform Generator uses the match signal to generate an output according to  
operating mode set by the WGM02:0 bits and Compare Output mode (COM0x1:0) bits. The max  
and bottom signals are used by the Waveform Generator for handling the special cases of the  
extreme values in some modes of operation. See ”Modes of Operation” on page 78.  
Figure 13-3 on page 76 shows a block diagram of the Output Compare unit.  
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Figure 13-3. Output Compare Unit, Block Diagram  
DATA BUS  
OCRnx  
TCNTn  
= (8-bit Comparator )  
OCFnx (Int.Req.)  
top  
bottom  
Waveform Generator  
OCnx  
FOCn  
WGMn1:0  
COMnX1:0  
The OCR0x Registers are double buffered when using any of the Pulse Width Modulation  
(PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of operation, the dou-  
ble buffering is disabled. The double buffering synchronizes the update of the OCR0x Compare  
Registers to either top or bottom of the counting sequence. The synchronization prevents the  
occurrence of odd-length, non-symmetrical PWM pulses, thereby making the output glitch-free.  
The OCR0x Register access may seem complex, but this is not case. When the double buffering  
is enabled, the CPU has access to the OCR0x Buffer Register, and if double buffering is dis-  
abled the CPU will access the OCR0x directly.  
13.5.1  
Force Output Compare  
In non-PWM waveform generation modes, the match output of the comparator can be forced by  
writing a one to the Force Output Compare (0x) bit. Forcing Compare Match will not set the  
OCF0x Flag or reload/clear the timer, but the OC0x pin will be updated as if a real Compare  
Match had occurred (the COM0x1:0 bits settings define whether the OC0x pin is set, cleared or  
toggled).  
13.5.2  
13.5.3  
Compare Match Blocking by TCNT0 Write  
All CPU write operations to the TCNT0 Register will block any Compare Match that occur in the  
next timer clock cycle, even when the timer is stopped. This feature allows OCR0x to be initial-  
ized to the same value as TCNT0 without triggering an interrupt when the Timer/Counter clock is  
enabled.  
Using the Output Compare Unit  
Since writing TCNT0 in any mode of operation will block all Compare Matches for one timer  
clock cycle, there are risks involved when changing TCNT0 when using the Output Compare  
Unit, independently of whether the Timer/Counter is running or not. If the value written to TCNT0  
equals the OCR0x value, the Compare Match will be missed, resulting in incorrect waveform  
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ATtiny24/44/84  
generation. Similarly, do not write the TCNT0 value equal to BOTTOM when the counter is  
down-counting.  
The setup of the OC0x should be performed before setting the Data Direction Register for the  
port pin to output. The easiest way of setting the OC0x value is to use the Force Output Com-  
pare (0x) strobe bits in Normal mode. The OC0x Registers keep their values even when  
changing between Waveform Generation modes.  
Be aware that the COM0x1:0 bits are not double buffered together with the compare value.  
Changing the COM0x1:0 bits will take effect immediately.  
13.6 Compare Match Output Unit  
The Compare Output mode (COM0x1:0) bits have two functions. The Waveform Generator uses  
the COM0x1:0 bits for defining the Output Compare (OC0x) state at the next Compare Match.  
Also, the COM0x1:0 bits control the OC0x pin output source. Figure 13-4 on page 77 shows a  
simplified schematic of the logic affected by the COM0x1:0 bit setting. The I/O Registers, I/O  
bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O Port Control  
Registers (DDR and PORT) that are affected by the COM0x1:0 bits are shown. When referring  
to the OC0x state, the reference is for the internal OC0x Register, not the OC0x pin. If a system  
reset occur, the OC0x Register is reset to “0”.  
Figure 13-4. Compare Match Output Unit, Schematic  
COMnx1  
Waveform  
Generator  
COMnx0  
FOCn  
D
Q
1
0
OCn  
Pin  
OCnx  
D
Q
PORT  
D
Q
DDR  
clkI/O  
The general I/O port function is overridden by the Output Compare (OC0x) from the Waveform  
Generator if either of the COM0x1:0 bits are set. However, the OC0x pin direction (input or out-  
put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction  
Register bit for the OC0x pin (DDR_OC0x) must be set as output before the OC0x value is visi-  
ble on the pin. The port override function is independent of the Waveform Generation mode.  
The design of the Output Compare pin logic allows initialization of the OC0x state before the out-  
put is enabled. Note that some COM0x1:0 bit settings are reserved for certain modes of  
operation, see ”Register Description” on page 84  
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13.6.1  
Compare Output Mode and Waveform Generation  
The Waveform Generator uses the COM0x1:0 bits differently in Normal, CTC, and PWM modes.  
For all modes, setting the COM0x1:0 = 0 tells the Waveform Generator that no action on the  
OC0x Register is to be performed on the next Compare Match. For compare output actions in  
the non-PWM modes refer to Table 13-2 on page 84. For fast PWM mode, refer to Table 13-3 on  
page 84, and for phase correct PWM refer to Table 13-4 on page 85.  
A change of the COM0x1:0 bits state will have effect at the first Compare Match after the bits are  
written. For non-PWM modes, the action can be forced to have immediate effect by using the 0x  
strobe bits.  
13.7 Modes of Operation  
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is  
defined by the combination of the Waveform Generation mode (WGM02:0) and Compare Output  
mode (COM0x1:0) bits. The Compare Output mode bits do not affect the counting sequence,  
while the Waveform Generation mode bits do. The COM0x1:0 bits control whether the PWM out-  
put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes  
the COM0x1:0 bits control whether the output should be set, cleared, or toggled at a Compare  
Match (See ”Modes of Operation” on page 78).  
For detailed timing information refer to Figure 13-8 on page 82, Figure 13-9 on page 83, Figure  
13-10 on page 83 and Figure 13-11 on page 83 in ”Timer/Counter Timing Diagrams” on page  
82.  
13.7.1  
Normal Mode  
The simplest mode of operation is the Normal mode (WGM02:0 = 0). In this mode the counting  
direction is always up (incrementing), and no counter clear is performed. The counter simply  
overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then restarts from the bot-  
tom (0x00). In normal operation the Timer/Counter Overflow Flag (TOV0) will be set in the same  
timer clock cycle as the TCNT0 becomes zero. The TOV0 Flag in this case behaves like a ninth  
bit, except that it is only set, not cleared. However, combined with the timer overflow interrupt  
that automatically clears the TOV0 Flag, the timer resolution can be increased by software.  
There are no special cases to consider in the Normal mode, a new counter value can be written  
anytime.  
The Output Compare Unit can be used to generate interrupts at some given time. Using the Out-  
put Compare to generate waveforms in Normal mode is not recommended, since this will  
occupy too much of the CPU time.  
13.7.2  
Clear Timer on Compare Match (CTC) Mode  
In Clear Timer on Compare or CTC mode (WGM02:0 = 2), the OCR0A Register is used to  
manipulate the counter resolution. In CTC mode the counter is cleared to zero when the counter  
value (TCNT0) matches the OCR0A. The OCR0A defines the top value for the counter, hence  
also its resolution. This mode allows greater control of the Compare Match output frequency. It  
also simplifies the operation of counting external events.  
The timing diagram for the CTC mode is shown in Figure 13-5 on page 79. The counter value  
(TCNT0) increases until a Compare Match occurs between TCNT0 and OCR0A, and then coun-  
ter (TCNT0) is cleared.  
78  
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ATtiny24/44/84  
Figure 13-5. CTC Mode, Timing Diagram  
OCnx Interrupt Flag Set  
TCNTn  
OCn  
(Toggle)  
(COMnx1:0 = 1)  
1
2
3
4
Period  
An interrupt can be generated each time the counter value reaches the TOP value by using the  
OCF0A Flag. If the interrupt is enabled, the interrupt handler routine can be used for updating  
the TOP value. However, changing TOP to a value close to BOTTOM when the counter is run-  
ning with none or a low prescaler value must be done with care since the CTC mode does not  
have the double buffering feature. If the new value written to OCR0A is lower than the current  
value of TCNT0, the counter will miss the Compare Match. The counter will then have to count to  
its maximum value (0xFF) and wrap around starting at 0x00 before the Compare Match can  
occur.  
For generating a waveform output in CTC mode, the OC0A output can be set to toggle its logical  
level on each Compare Match by setting the Compare Output mode bits to toggle mode  
(COM0A1:0 = 1). The OC0A value will not be visible on the port pin unless the data direction for  
the pin is set to output. The waveform generated will have a maximum frequency of 0 = fclk_I/O/2  
when OCR0A is set to zero (0x00). The waveform frequency is defined by the following  
equation:  
f
clk_I/O  
f
= -------------------------------------------------------  
OCnx  
2
N
(1 + OCRnx)  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle that the  
counter counts from MAX to 0x00.  
13.7.3  
Fast PWM Mode  
The fast Pulse Width Modulation or fast PWM mode (WGM02:0 = 3 or 7) provides a high fre-  
quency PWM waveform generation option. The fast PWM differs from the other PWM option by  
its single-slope operation. The counter counts from BOTTOM to TOP then restarts from BOT-  
TOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR0A when WGM2:0 = 7. In non-  
inverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match  
between TCNT0 and OCR0x, and set at BOTTOM. In inverting Compare Output mode, the out-  
put is set on Compare Match and cleared at BOTTOM. Due to the single-slope operation, the  
operating frequency of the fast PWM mode can be twice as high as the phase correct PWM  
mode that use dual-slope operation. This high frequency makes the fast PWM mode well suited  
for power regulation, rectification, and DAC applications. High frequency allows physically small  
sized external components (coils, capacitors), and therefore reduces total system cost.  
In fast PWM mode, the counter is incremented until the counter value matches the TOP value.  
The counter is then cleared at the following timer clock cycle. The timing diagram for the fast  
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7701C–AVR–12/08  
PWM mode is shown in Figure 13-6 on page 80. The TCNT0 value is in the timing diagram  
shown as a histogram for illustrating the single-slope operation. The diagram includes non-  
inverted and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes repre-  
sent Compare Matches between OCR0x and TCNT0.  
Figure 13-6. Fast PWM Mode, Timing Diagram  
OCRnx Interrupt Flag Set  
OCRnx Update and  
TOVn Interrupt Flag Set  
TCNTn  
(COMnx1:0 = 2)  
(COMnx1:0 = 3)  
OCn  
OCn  
1
2
3
4
5
6
7
Period  
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches TOP. If the inter-  
rupt is enabled, the interrupt handler routine can be used for updating the compare value.  
In fast PWM mode, the compare unit allows generation of PWM waveforms on the OC0x pins.  
Setting the COM0x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output  
can be generated by setting the COM0x1:0 to three: Setting the COM0A1:0 bits to one allowes  
the AC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is not available  
for the OC0B pin (See Table 13-3 on page 84). The actual OC0x value will only be visible on the  
port pin if the data direction for the port pin is set as output. The PWM waveform is generated by  
setting (or clearing) the OC0x Register at the Compare Match between OCR0x and TCNT0, and  
clearing (or setting) the OC0x Register at the timer clock cycle the counter is cleared (changes  
from TOP to BOTTOM).  
The PWM frequency for the output can be calculated by the following equation:  
f
clk_I/O  
f
= --------------------  
OCnxPWM  
N
256  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
The extreme values for the OCR0A Register represents special cases when generating a PWM  
waveform output in the fast PWM mode. If the OCR0A is set equal to BOTTOM, the output will  
be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0A equal to MAX will result  
in a constantly high or low output (depending on the polarity of the output set by the COM0A1:0  
bits.)  
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-  
ting OC0x to toggle its logical level on each Compare Match (COM0x1:0 = 1). The waveform  
generated will have a maximum frequency of 0 = fclk_I/O/2 when OCR0A is set to zero. This fea-  
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ATtiny24/44/84  
ture is similar to the OC0A toggle in CTC mode, except the double buffer feature of the Output  
Compare unit is enabled in the fast PWM mode.  
13.7.4  
Phase Correct PWM Mode  
The phase correct PWM mode (WGM02:0 = 1 or 5) provides a high resolution phase correct  
PWM waveform generation option. The phase correct PWM mode is based on a dual-slope  
operation. The counter counts repeatedly from BOTTOM to TOP and then from TOP to BOT-  
TOM. TOP is defined as 0xFF when WGM2:0 = 1, and OCR0A when WGM2:0 = 5. In non-  
inverting Compare Output mode, the Output Compare (OC0x) is cleared on the Compare Match  
between TCNT0 and OCR0x while upcounting, and set on the Compare Match while down-  
counting. In inverting Output Compare mode, the operation is inverted. The dual-slope operation  
has lower maximum operation frequency than single slope operation. However, due to the sym-  
metric feature of the dual-slope PWM modes, these modes are preferred for motor control  
applications.  
In phase correct PWM mode the counter is incremented until the counter value matches TOP.  
When the counter reaches TOP, it changes the count direction. The TCNT0 value will be equal  
to TOP for one timer clock cycle. The timing diagram for the phase correct PWM mode is shown  
on Figure 13-7 on page 81. The TCNT0 value is in the timing diagram shown as a histogram for  
illustrating the dual-slope operation. The diagram includes non-inverted and inverted PWM out-  
puts. The small horizontal line marks on the TCNT0 slopes represent Compare Matches  
between OCR0x and TCNT0.  
Figure 13-7. Phase Correct PWM Mode, Timing Diagram  
OCnx Interrupt Flag Set  
OCRnx Update  
TOVn Interrupt Flag Set  
TCNTn  
(COMnx1:0 = 2)  
OCn  
(COMnx1:0 = 3)  
OCn  
1
2
3
Period  
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOTTOM. The  
Interrupt Flag can be used to generate an interrupt each time the counter reaches the BOTTOM  
value.  
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on the  
OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM. An inverted  
PWM output can be generated by setting the COM0x1:0 to three: Setting the COM0A0 bits to  
81  
7701C–AVR–12/08  
one allows the OC0A pin to toggle on Compare Matches if the WGM02 bit is set. This option is  
not available for the OC0B pin (See Table 13-4 on page 85). The actual OC0x value will only be  
visible on the port pin if the data direction for the port pin is set as output. The PWM waveform is  
generated by clearing (or setting) the OC0x Register at the Compare Match between OCR0x  
and TCNT0 when the counter increments, and setting (or clearing) the OC0x Register at Com-  
pare Match between OCR0x and TCNT0 when the counter decrements. The PWM frequency for  
the output when using phase correct PWM can be calculated by the following equation:  
f
clk_I/O  
f
= --------------------  
OCnxPCPWM  
N
510  
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).  
The extreme values for the OCR0A Register represent special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCR0A is set equal to BOTTOM, the  
output will be continuously low and if set equal to MAX the output will be continuously high for  
non-inverted PWM mode. For inverted PWM the output will have the opposite logic values.  
At the very start of period 2 in Figure 13-7 on page 81 OCn has a transition from high to low  
even though there is no Compare Match. The point of this transition is to guaratee symmetry  
around BOTTOM. There are two cases that give a transition without Compare Match.  
• OCR0A changes its value from MAX, like in Figure 13-7 on page 81. When the OCR0A value  
is MAX the OCn pin value is the same as the result of a down-counting Compare Match. To  
ensure symmetry around BOTTOM the OCn value at MAX must correspond to the result of an  
up-counting Compare Match.  
• The timer starts counting from a value higher than the one in OCR0A, and for that reason  
misses the Compare Match and hence the OCn change that would have happened on the way  
up.  
13.8 Timer/Counter Timing Diagrams  
The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore shown as a  
clock enable signal in the following figures. The figures include information on when Interrupt  
Flags are set. Figure 13-8 on page 82 contains timing data for basic Timer/Counter operation.  
The figure shows the count sequence close to the MAX value in all modes other than phase cor-  
rect PWM mode.  
Figure 13-8. Timer/Counter Timing Diagram, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 13-9 on page 83 shows the same timing data, but with the prescaler enabled.  
82  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 13-9. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
TOVn  
MAX - 1  
MAX  
BOTTOM  
BOTTOM + 1  
Figure 13-10 on page 83 shows the setting of OCF0B in all modes and OCF0A in all modes  
except CTC mode and PWM mode, where OCR0A is TOP.  
Figure 13-10. Timer/Counter Timing Diagram, Setting of OCF0x, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
OCRnx  
OCFnx  
OCRnx - 1  
OCRnx  
OCRnx + 1  
OCRnx + 2  
OCRnx Value  
Figure 13-11 on page 83 shows the setting of OCF0A and the clearing of TCNT0 in CTC mode  
and fast PWM mode where OCR0A is TOP.  
Figure 13-11. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with Pres-  
caler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
(CTC)  
TOP - 1  
TOP  
BOTTOM  
BOTTOM + 1  
OCRnx  
TOP  
OCFnx  
83  
7701C–AVR–12/08  
13.9 Register Description  
13.9.1  
TCCR0A – Timer/Counter Control Register A  
Bit  
7
COM0A1  
R/W  
6
COM0A0  
R/W  
5
COM0B1  
R/W  
4
COM0B0  
R/W  
3
2
1
WGM01  
R/W  
0
0
WGM00  
R/W  
0
TCCR0A  
0x30 (0x50)  
Read/Write  
Initial Value  
R
0
R
0
0
0
0
0
• Bits 7:6 – COM0A1:0: Compare Match Output A Mode  
These bits control the Output Compare pin (OC0A) behavior. If one or both of the COM0A1:0  
bits are set, the OC0A output overrides the normal port functionality of the I/O pin it is connected  
to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0A pin  
must be set in order to enable the output driver.  
When OC0A is connected to the pin, the function of the COM0A1:0 bits depends on the  
WGM02:0 bit setting. Table 13-2 on page 84 shows the COM0A1:0 bit functionality when the  
WGM02:0 bits are set to a normal or CTC mode (non-PWM).  
Table 13-2. Compare Output Mode, non-PWM Mode  
COM01  
COM00  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC0A disconnected.  
Toggle OC0A on Compare Match  
Clear OC0A on Compare Match  
Set OC0A on Compare Match  
Table 13-3 on page 84 shows the COM0A1:0 bit functionality when the WGM01:0 bits are set to  
fast PWM mode.  
Table 13-3. Compare Output Mode, Fast PWM Mode(1)  
COM01  
COM00  
Description  
0
0
Normal port operation, OC0A disconnected.  
WGM02 = 0: Normal Port Operation, OC0A Disconnected.  
WGM02 = 1: Toggle OC0A on Compare Match.  
0
1
1
1
0
1
Clear OC0A on Compare Match, set OC0A at BOTTOM  
(non-inverting mode)  
Set OC0A on Compare Match, clear OC0A at BOTTOM  
(inverting mode)  
Note:  
1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Com-  
pare Match is ignored, but the set or clear is done at BOTTOM. See ”Fast PWM Mode” on  
page 79 for more details.  
84  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Table 13-4 on page 85 shows the COM0A1:0 bit functionality when the WGM02:0 bits are set to  
phase correct PWM mode.  
Table 13-4. Compare Output Mode, Phase Correct PWM Mode(1)  
COM0A1  
COM0A0  
Description  
0
0
Normal port operation, OC0A disconnected.  
WGM02 = 0: Normal Port Operation, OC0A Disconnected.  
WGM02 = 1: Toggle OC0A on Compare Match.  
0
1
1
1
0
1
Clear OC0A on Compare Match when up-counting. Set OC0A on  
Compare Match when down-counting.  
Set OC0A on Compare Match when up-counting. Clear OC0A on  
Compare Match when down-counting.  
Note:  
1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case, the Com-  
pare Match is ignored, but the set or clear is done at TOP. See ”Phase Correct PWM Mode” on  
page 81 for more details.  
• Bits 5:4 – COM0B1:0: Compare Match Output B Mode  
These bits control the Output Compare pin (OC0B) behavior. If one or both of the COM0B1:0  
bits are set, the OC0B output overrides the normal port functionality of the I/O pin it is connected  
to. However, note that the Data Direction Register (DDR) bit corresponding to the OC0B pin  
must be set in order to enable the output driver.  
When OC0B is connected to the pin, the function of the COM0B1:0 bits depends on the  
WGM02:0 bit setting. Table 13-2 on page 84 shows the COM0A1:0 bit functionality when the  
WGM02:0 bits are set to a normal or CTC mode (non-PWM).  
Table 13-5. Compare Output Mode, non-PWM Mode  
COM01  
COM00  
Description  
0
0
1
1
0
1
0
1
Normal port operation, OC0B disconnected.  
Toggle OC0B on Compare Match  
Clear OC0B on Compare Match  
Set OC0B on Compare Match  
Table 13-3 on page 84 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to  
fast PWM mode.  
Table 13-6. Compare Output Mode, Fast PWM Mode(1)  
COM01  
COM00  
Description  
0
0
0
1
Normal port operation, OC0B disconnected.  
Reserved  
Clear OC0B on Compare Match, set OC0B at BOTTOM  
(non-inverting mode)  
1
1
0
1
Set OC0B on Compare Match, clear OC0B at BOTTOM  
(inverting mode)  
85  
7701C–AVR–12/08  
Note:  
1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Com-  
pare Match is ignored, but the set or clear is done at BOTTOM. See ”Fast PWM Mode” on  
page 79 for more details.  
Table 13-4 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to phase cor-  
rect PWM mode.  
Table 13-7. Compare Output Mode, Phase Correct PWM Mode(1)  
COM0A1  
COM0A0  
Description  
0
0
0
1
Normal port operation, OC0B disconnected.  
Reserved  
Clear OC0B on Compare Match when up-counting. Set OC0B on  
Compare Match when down-counting.  
1
1
0
1
Set OC0B on Compare Match when up-counting. Clear OC0B on  
Compare Match when down-counting.  
Note:  
1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case, the Com-  
pare Match is ignored, but the set or clear is done at TOP. See ”Phase Correct PWM Mode” on  
page 81 for more details.  
• Bits 3, 2 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bits 1:0 – WGM01:0: Waveform Generation Mode  
Combined with the WGM02 bit found in the TCCR0B Register, these bits control the counting  
sequence of the counter, the source for maximum (TOP) counter value, and what type of wave-  
form generation to be used, see Table 13-8 on page 86. Modes of operation supported by the  
Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare Match (CTC) mode,  
and two types of Pulse Width Modulation (PWM) modes (see ”Modes of Operation” on page 78).  
Table 13-8. Waveform Generation Mode Bit Description  
Timer/Counter  
Mode of  
Operation  
Update of  
OCRx at  
TOV Flag  
Set on(1)  
Mode  
WGM2  
WGM1  
WGM0  
TOP  
0
0
0
0
Normal  
0xFF  
Immediate  
TOP  
MAX  
PWM, Phase  
Correct  
1
0
0
1
0xFF  
BOTTOM  
2
3
4
0
0
1
1
1
0
0
1
0
CTC  
OCRA  
0xFF  
Immediate  
BOTTOM  
MAX  
MAX  
Fast PWM  
Reserved  
PWM, Phase  
Correct  
5
1
0
1
OCRA  
TOP  
BOTTOM  
6
7
1
1
1
1
0
1
Reserved  
Fast PWM  
OCRA  
BOTTOM  
TOP  
Note:  
1. MAX  
= 0xFF  
BOTTOM = 0x00  
86  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
13.9.2  
TCCR0B – Timer/Counter Control Register B  
Bit  
7
FOC0A  
W
6
FOC0B  
W
5
4
3
WGM02  
R/W  
0
2
CS02  
R/W  
0
1
CS01  
R/W  
0
0
CS00  
R/W  
0
TCCR0B  
0x33 (0x53)  
Read/Write  
Initial Value  
R
0
R
0
0
0
• Bit 7 – FOC0A: Force Output Compare A  
The FOC0A bit is only active when the WGM bits specify a non-PWM mode.  
However, for ensuring compatibility with future devices, this bit must be set to zero when  
TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0A bit,  
an immediate Compare Match is forced on the Waveform Generation unit. The OC0A output is  
changed according to its COM0A1:0 bits setting. Note that the FOC0A bit is implemented as a  
strobe. Therefore it is the value present in the COM0A1:0 bits that determines the effect of the  
forced compare.  
A FOC0A strobe will not generate any interrupt, nor will it clear the timer in CTC mode using  
OCR0A as TOP.  
The FOC0A bit is always read as zero.  
• Bit 6 – FOC0B: Force Output Compare B  
The FOC0B bit is only active when the WGM bits specify a non-PWM mode.  
However, for ensuring compatibility with future devices, this bit must be set to zero when  
TCCR0B is written when operating in PWM mode. When writing a logical one to the FOC0B bit,  
an immediate Compare Match is forced on the Waveform Generation unit. The OC0B output is  
changed according to its COM0B1:0 bits setting. Note that the FOC0B bit is implemented as a  
strobe. Therefore it is the value present in the COM0B1:0 bits that determines the effect of the  
forced compare.  
A FOC0B strobe will not generate any interrupt, nor will it clear the timer in CTC mode using  
OCR0B as TOP.  
The FOC0B bit is always read as zero.  
• Bits 5:4 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 3 – WGM02: Waveform Generation Mode  
See the description in the ”TCCR0A – Timer/Counter Control Register A” on page 84.  
• Bits 2:0 – CS02:0: Clock Select  
The three Clock Select bits select the clock source to be used by the Timer/Counter.  
87  
7701C–AVR–12/08  
Table 13-9. Clock Select Bit Description  
CS02  
CS01  
CS00  
Description  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source (Timer/Counter stopped)  
clkI/O/(No prescaling)  
clkI/O/8 (From prescaler)  
clkI/O/64 (From prescaler)  
clkI/O/256 (From prescaler)  
clkI/O/1024 (From prescaler)  
External clock source on T0 pin. Clock on falling edge.  
External clock source on T0 pin. Clock on rising edge.  
If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will clock the  
counter even if the pin is configured as an output. This feature allows software control of the  
counting.  
13.9.3  
TCNT0 – Timer/Counter Register  
Bit  
7
6
5
4
3
2
1
0
0x32 (0x52)  
Read/Write  
Initial Value  
TCNT0[7:0]  
TCNT0  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Timer/Counter Register gives direct access, both for read and write operations, to the  
Timer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes) the Compare  
Match on the following timer clock. Modifying the counter (TCNT0) while the counter is running,  
introduces a risk of missing a Compare Match between TCNT0 and the OCR0x Registers.  
13.9.4  
OCR0A – Output Compare Register A  
Bit  
7
6
5
4
3
2
1
0
0x36 (0x56)  
Read/Write  
Initial Value  
OCR0A[7:0]  
OCR0A  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Output Compare Register A contains an 8-bit value that is continuously compared with the  
counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to  
generate a waveform output on the OC0A pin.  
13.9.5  
OCR0B – Output Compare Register B  
Bit  
7
6
5
4
3
2
1
0
0x3C (0x5C)  
Read/Write  
Initial Value  
OCR0B[7:0]  
OCR0B  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Output Compare Register B contains an 8-bit value that is continuously compared with the  
counter value (TCNT0). A match can be used to generate an Output Compare interrupt, or to  
generate a waveform output on the OC0B pin.  
88  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
13.9.6  
TIMSK0 – Timer/Counter 0 Interrupt Mask Register  
Bit  
7
6
5
4
3
2
OCIE0B  
R/W  
0
1
OCIE0A  
R/W  
0
0
TOIE0  
R/W  
0
0x39 (0x59)  
Read/Write  
Initial Value  
TIMSK0  
R
0
R
0
R
0
R
0
R
0
• Bits 7..3 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 2– OCIE0B: Timer/Counter Output Compare Match B Interrupt Enable  
When the OCIE0B bit is written to one, and the I-bit in the Status Register is set, the  
Timer/Counter Compare Match B interrupt is enabled. The corresponding interrupt is executed if  
a Compare Match in Timer/Counter occurs, i.e., when the OCF0B bit is set in the Timer/Counter  
Interrupt Flag Register – TIFR0.  
• Bit 1– OCIE0A: Timer/Counter0 Output Compare Match A Interrupt Enable  
When the OCIE0A bit is written to one, and the I-bit in the Status Register is set, the  
Timer/Counter0 Compare Match A interrupt is enabled. The corresponding interrupt is executed  
if a Compare Match in Timer/Counter0 occurs, i.e., when the OCF0A bit is set in the  
Timer/Counter 0 Interrupt Flag Register – TIFR0.  
• Bit 0– TOIE0: Timer/Counter0 Overflow Interrupt Enable  
When the TOIE0 bit is written to one, and the I-bit in the Status Register is set, the  
Timer/Counter0 Overflow interrupt is enabled. The corresponding interrupt is executed if an  
overflow in Timer/Counter0 occurs, i.e., when the TOV0 bit is set in the Timer/Counter 0 Inter-  
rupt Flag Register – TIFR0.  
13.9.7  
TIFR0 – Timer/Counter 0 Interrupt Flag Register  
Bit  
0x38 (0x58)  
7
6
5
4
3
2
OCF0B  
R/W  
0
1
OCF0A  
R/W  
0
0
TOV0  
R/W  
0
TIFR0  
Read/Write  
Initial Value  
R
0
R
0
R
0
R
0
R
0
• Bits 7..3 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and will always read as zero.  
• Bit 2– OCF0B: Output Compare Flag 0 B  
The OCF0B bit is set when a Compare Match occurs between the Timer/Counter and the data in  
OCR0B – Output Compare Register0 B. OCF0B is cleared by hardware when executing the cor-  
responding interrupt handling vector. Alternatively, OCF0B is cleared by writing a logic one to  
the flag. When the I-bit in SREG, OCIE0B (Timer/Counter Compare B Match Interrupt Enable),  
and OCF0B are set, the Timer/Counter Compare Match Interrupt is executed.  
• Bit 1– OCF0A: Output Compare Flag 0 A  
The OCF0A bit is set when a Compare Match occurs between the Timer/Counter0 and the data  
in OCR0A – Output Compare Register0. OCF0A is cleared by hardware when executing the cor-  
responding interrupt handling vector. Alternatively, OCF0A is cleared by writing a logic one to  
the flag. When the I-bit in SREG, OCIE0A (Timer/Counter0 Compare Match Interrupt Enable),  
and OCF0A are set, the Timer/Counter0 Compare Match Interrupt is executed.  
89  
7701C–AVR–12/08  
• Bit 0– TOV0: Timer/Counter0 Overflow Flag  
The bit TOV0 is set when an overflow occurs in Timer/Counter0. TOV0 is cleared by hardware  
when executing the corresponding interrupt handling vector. Alternatively, TOV0 is cleared by  
writing a logic one to the flag. When the SREG I-bit, TOIE0 (Timer/Counter0 Overflow Interrupt  
Enable), and TOV0 are set, the Timer/Counter0 Overflow interrupt is executed.  
The setting of this flag is dependent of the WGM02:0 bit setting. See Table 13-8 on page 86 and  
”Waveform Generation Mode Bit Description” on page 86.  
90  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
14. 16-bit Timer/Counter1  
14.1 Features  
True 16-bit Design (i.e., Allows 16-bit PWM)  
Two independent Output Compare Units  
Double Buffered Output Compare Registers  
One Input Capture Unit  
Input Capture Noise Canceler  
Clear Timer on Compare Match (Auto Reload)  
Glitch-free, Phase Correct Pulse Width Modulator (PWM)  
Variable PWM Period  
Frequency Generator  
External Event Counter  
Four independent interrupt Sources (TOV1, OCF1A, OCF1B, and ICF1)  
14.2 Overview  
The 16-bit Timer/Counter unit allows accurate program execution timing (event management),  
wave generation, and signal timing measurement.  
Most register and bit references in this section are written in general form. A lower case “n”  
replaces the Timer/Counter number, and a lower case “x” replaces the Output Compare unit  
channel. However, when using the register or bit defines in a program, the precise form must be  
used, i.e., TCNT1 for accessing Timer/Counter1 counter value and so on.  
A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 14-1 on page 92. For  
the actual placement of I/O pins, refer to ”Pinout ATtiny24/44/84” on page 2. CPU accessible I/O  
Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register  
and bit locations are listed in the ”Register Description” on page 113.  
91  
7701C–AVR–12/08  
Figure 14-1. 16-bit Timer/Counter Block Diagram(1)  
Count  
TOVn  
(Int.Req.)  
Clear  
Control Logic  
Clock Select  
Direction  
clkTn  
Edge  
Detector  
Tn  
TOP  
BOTTOM  
( From Prescaler )  
Timer/Counter  
TCNTn  
=
= 0  
OCnA  
(Int.Req.)  
Waveform  
Generation  
OCnA  
=
OCRnA  
OCnB  
(Int.Req.)  
Fixed  
TOP  
Values  
Waveform  
OCnB  
=
Generation  
OCRnB  
( From Analog  
Comparator Ouput )  
ICFn (Int.Req.)  
Edge  
Detector  
Noise  
Canceler  
ICRn  
ICPn  
TCCRnA  
TCCRnB  
Note:  
1. See Figure 1-1 on page 2 for Timer/Counter1 pin placement and description.  
14.2.1  
Registers  
The Timer/Counter (TCNT1), Output Compare Registers (OCR1A/B), and Input Capture Regis-  
ter (ICR1) are all 16-bit registers. Special procedures must be followed when accessing the 16-  
bit registers. These procedures are described in the section ”Accessing 16-bit Registers” on  
page 94. The Timer/Counter Control Registers (TCCR1A/B) are 8-bit registers and have no CPU  
access restrictions. Interrupt requests (abbreviated to Int.Req. in the figure) signals are all visible  
in the Timer Interrupt Flag Register (TIFR). All interrupts are individually masked with the Timer  
Interrupt Mask Register (TIMSK). TIFR and TIMSK are not shown in the figure.  
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock source on  
the T1 pin. The Clock Select logic block controls which clock source and edge the Timer/Counter  
uses to increment (or decrement) its value. The Timer/Counter is inactive when no clock source  
is selected. The output from the Clock Select logic is referred to as the timer clock (clk ).  
1
T
The double buffered Output Compare Registers (OCR1A/B) are compared with the Timer/Coun-  
ter value at all time. The result of the compare can be used by the Waveform Generator to  
generate a PWM or variable frequency output on the Output Compare pin (OC1A/B). See ”Out-  
put Compare Units” on page 100. The compare match event will also set the Compare Match  
Flag (OCF1A/B) which can be used to generate an Output Compare interrupt request.  
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The Input Capture Register can capture the Timer/Counter value at a given external (edge trig-  
gered) event on either the Input Capture pin (ICP1) or on the Analog Comparator pins (See  
”Analog Comparator” on page 134). The Input Capture unit includes a digital filtering unit (Noise  
Canceler) for reducing the chance of capturing noise spikes.  
The TOP value, or maximum Timer/Counter value, can in some modes of operation be defined  
by either the OCR1A Register, the ICR1 Register, or by a set of fixed values. When using  
OCR1A as TOP value in a PWM mode, the OCR1A Register can not be used for generating a  
PWM output. However, the TOP value will in this case be double buffered allowing the TOP  
value to be changed in run time. If a fixed TOP value is required, the ICR1 Register can be used  
as an alternative, freeing the OCR1A to be used as PWM output.  
14.2.2  
Definitions  
The following definitions are used extensively throughout the section:  
BOTTOM  
MAX  
The counter reaches the BOTTOM when it becomes 0x0000.  
The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535).  
The counter reaches the TOP when it becomes equal to the highest value in the count  
sequence. The TOP value can be assigned to be one of the fixed values: 0x00FF, 0x01FF,  
or 0x03FF, or to the value stored in the OCR1A or ICR1 Register. The assignment is  
dependent of the mode of operation.  
TOP  
14.2.3  
Compatibility  
The 16-bit Timer/Counter has been updated and improved from previous versions of the 16-bit  
AVR Timer/Counter. This 16-bit Timer/Counter is fully compatible with the earlier version  
regarding:  
• All 16-bit Timer/Counter related I/O Register address locations, including Timer Interrupt  
Registers.  
• Bit locations inside all 16-bit Timer/Counter Registers, including Timer Interrupt Registers.  
• Interrupt Vectors.  
The following control bits have changed name, but have same functionality and register location:  
• PWM10 is changed to WGM10.  
• PWM11 is changed to WGM11.  
• CTC1 is changed to WGM12.  
The following bits are added to the 16-bit Timer/Counter Control Registers:  
• 1A and 1B are added to TCCR1A.  
• WGM13 is added to TCCR1B.  
The 16-bit Timer/Counter has improvements that will affect the compatibility in some special  
cases.  
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14.3 Accessing 16-bit Registers  
The TCNT1, OCR1A/B, and ICR1 are 16-bit registers that can be accessed by the AVR CPU via  
the 8-bit data bus. The 16-bit register must be byte accessed using two read or write operations.  
Each 16-bit timer has a single 8-bit register for temporary storing of the high byte of the 16-bit  
access. The same temporary register is shared between all 16-bit registers within each 16-bit  
timer. Accessing the low byte triggers the 16-bit read or write operation. When the low byte of a  
16-bit register is written by the CPU, the high byte stored in the temporary register, and the low  
byte written are both copied into the 16-bit register in the same clock cycle. When the low byte of  
a 16-bit register is read by the CPU, the high byte of the 16-bit register is copied into the tempo-  
rary register in the same clock cycle as the low byte is read.  
Not all 16-bit accesses uses the temporary register for the high byte. Reading the OCR1A/B 16-  
bit registers does not involve using the temporary register.  
To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read, the low  
byte must be read before the high byte.  
The following code examples show how to access the 16-bit timer registers assuming that no  
interrupts updates the temporary register. The same principle can be used directly for accessing  
the OCR1A/B and ICR1 Registers. Note that when using “C”, the compiler handles the 16-bit  
access.  
Assembly Code Examples(1)  
...  
; Set TCNT1 to 0x01FF  
ldir17,0x01  
ldir16,0xFF  
outTCNT1H,r17  
outTCNT1L,r16  
; Read TCNT1 into r17:r16  
in r16,TCNT1L  
in r17,TCNT1H  
...  
C Code Examples(1)  
unsigned int i;  
...  
/* Set TCNT1 to 0x01FF */  
TCNT1 = 0x1FF;  
/* Read TCNT1 into i */  
i = TCNT1;  
...  
Note:  
1. See ”About Code Examples” on page 6.  
The assembly code example returns the TCNT1 value in the r17:r16 register pair.  
It is important to notice that accessing 16-bit registers are atomic operations. If an interrupt  
occurs between the two instructions accessing the 16-bit register, and the interrupt code  
updates the temporary register by accessing the same or any other of the 16-bit timer registers,  
then the result of the access outside the interrupt will be corrupted. Therefore, when both the  
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main code and the interrupt code update the temporary register, the main code must disable the  
interrupts during the 16-bit access.  
The following code examples show how to do an atomic read of the TCNT1 Register contents.  
Reading any of the OCR1A/B or ICR1 Registers can be done by using the same principle.  
Assembly Code Example(1)  
TIM16_ReadTCNT1:  
; Save global interrupt flag  
in r18,SREG  
; Disable interrupts  
cli  
; Read TCNT1 into r17:r16  
in r16,TCNT1L  
in r17,TCNT1H  
; Restore global interrupt flag  
outSREG,r18  
ret  
C Code Example(1)  
unsigned int TIM16_ReadTCNT1( void )  
{
unsigned char sreg;  
unsigned int i;  
/* Save global interrupt flag */  
sreg = SREG;  
/* Disable interrupts */  
_CLI();  
/* Read TCNT1 into i */  
i = TCNT1;  
/* Restore global interrupt flag */  
SREG = sreg;  
return i;  
}
Note:  
1. See ”About Code Examples” on page 6.  
The assembly code example returns the TCNT1 value in the r17:r16 register pair.  
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The following code examples show how to do an atomic write of the TCNT1 Register contents.  
Writing any of the OCR1A/B or ICR1 Registers can be done by using the same principle.  
Assembly Code Example(1)  
TIM16_WriteTCNT1:  
; Save global interrupt flag  
in r18,SREG  
; Disable interrupts  
cli  
; Set TCNT1 to r17:r16  
outTCNT1H,r17  
outTCNT1L,r16  
; Restore global interrupt flag  
outSREG,r18  
ret  
C Code Example(1)  
void TIM16_WriteTCNT1( unsigned int i )  
{
unsigned char sreg;  
unsigned int i;  
/* Save global interrupt flag */  
sreg = SREG;  
/* Disable interrupts */  
_CLI();  
/* Set TCNT1 to i */  
TCNT1 = i;  
/* Restore global interrupt flag */  
SREG = sreg;  
}
Note:  
1. See ”About Code Examples” on page 6.  
The assembly code example requires that the r17:r16 register pair contains the value to be writ-  
ten to TCNT1.  
14.3.1  
Reusing the Temporary High Byte Register  
If writing to more than one 16-bit register where the high byte is the same for all registers written,  
then the high byte only needs to be written once. However, note that the same rule of atomic  
operation described previously also applies in this case.  
14.4 Timer/Counter Clock Sources  
The Timer/Counter can be clocked by an internal or an external clock source. The clock source  
is selected by the Clock Select logic which is controlled by the Clock Select (CS12:0) bits  
located in the Timer/Counter control Register B (TCCR1B). For details on clock sources and  
prescaler, see ”Timer/Counter Prescaler” on page 120.  
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14.5 Counter Unit  
The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional counter unit.  
Figure 14-2 on page 97 shows a block diagram of the counter and its surroundings.  
Figure 14-2. Counter Unit Block Diagram  
DATA BUS (8-bit)  
TOVn  
(Int.Req.)  
TEMP (8-bit)  
Clock Select  
Edge  
Count  
Tn  
Detector  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
Clear  
clkTn  
Control Logic  
Direction  
TCNTn (16-bit Counter)  
( From Prescaler )  
TOP  
BOTTOM  
Signal description (internal signals):  
Count  
Increment or decrement TCNT1 by 1.  
Direction  
Clear  
Select between increment and decrement.  
Clear TCNT1 (set all bits to zero).  
clkT  
Timer/Counter clock.  
1
TOP  
Signalize that TCNT1 has reached maximum value.  
Signalize that TCNT1 has reached minimum value (zero).  
BOTTOM  
The 16-bit counter is mapped into two 8-bit I/O memory locations: Counter High (TCNT1H) con-  
taining the upper eight bits of the counter, and Counter Low (TCNT1L) containing the lower eight  
bits. The TCNT1H Register can only be indirectly accessed by the CPU. When the CPU does an  
access to the TCNT1H I/O location, the CPU accesses the high byte temporary register (TEMP).  
The temporary register is updated with the TCNT1H value when the TCNT1L is read, and  
TCNT1H is updated with the temporary register value when TCNT1L is written. This allows the  
CPU to read or write the entire 16-bit counter value within one clock cycle via the 8-bit data bus.  
It is important to notice that there are special cases of writing to the TCNT1 Register when the  
counter is counting that will give unpredictable results. The special cases are described in the  
sections where they are of importance.  
Depending on the mode of operation used, the counter is cleared, incremented, or decremented  
at each timer clock (clk ). The clk 1 can be generated from an external or internal clock source,  
1
T
T
selected by the Clock Select bits (CS12:0). When no clock source is selected (CS12:0 = 0) the  
timer is stopped. However, the TCNT1 value can be accessed by the CPU, independent of  
whether clkT is present or not. A CPU write overrides (has priority over) all counter clear or  
1
count operations.  
The counting sequence is determined by the setting of the Waveform Generation mode bits  
(WGM13:0) located in the Timer/Counter Control Registers A and B (TCCR1A and TCCR1B).  
There are close connections between how the counter behaves (counts) and how waveforms  
are generated on the Output Compare outputs OC1x. For more details about advanced counting  
sequences and waveform generation, see ”Modes of Operation” on page 103.  
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The Timer/Counter Overflow Flag (TOV1) is set according to the mode of operation selected by  
the WGM13:0 bits. TOV1 can be used for generating a CPU interrupt.  
14.6 Input Capture Unit  
The Timer/Counter incorporates an Input Capture unit that can capture external events and give  
them a time-stamp indicating time of occurrence. The external signal indicating an event, or mul-  
tiple events, can be applied via the ICP1 pin or alternatively, via the analog-comparator unit. The  
time-stamps can then be used to calculate frequency, duty-cycle, and other features of the sig-  
nal applied. Alternatively the time-stamps can be used for creating a log of the events.  
The Input Capture unit is illustrated by the block diagram shown in Figure 14-3 on page 98. The  
elements of the block diagram that are not directly a part of the Input Capture unit are gray  
shaded. The small “n” in register and bit names indicates the Timer/Counter number.  
Figure 14-3. Input Capture Unit Block Diagram  
DATA BUS (8-bit)  
TEMP (8-bit)  
ICRnH (8-bit)  
ICRnL (8-bit)  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
ICRn (16-bit Register)  
TCNTn (16-bit Counter)  
WRITE  
ACO*  
ACIC*  
ICNC  
ICES  
Analog  
Comparator  
Noise  
Canceler  
Edge  
Detector  
ICFn (Int.Req.)  
ICPn  
When a change of the logic level (an event) occurs on the Input Capture pin (ICP1), alternatively  
on the Analog Comparator output (ACO), and this change confirms to the setting of the edge  
detector, a capture will be triggered. When a capture is triggered, the 16-bit value of the counter  
(TCNT1) is written to the Input Capture Register (ICR1). The Input Capture Flag (ICF1) is set at  
the same system clock as the TCNT1 value is copied into ICR1 Register. If enabled (ICIE1 = 1),  
the Input Capture Flag generates an Input Capture interrupt. The ICF1 flag is automatically  
cleared when the interrupt is executed. Alternatively the ICF1 flag can be cleared by software by  
writing a logical one to its I/O bit location.  
Reading the 16-bit value in the Input Capture Register (ICR1) is done by first reading the low  
byte (ICR1L) and then the high byte (ICR1H). When the low byte is read the high byte is copied  
into the high byte temporary register (TEMP). When the CPU reads the ICR1H I/O location it will  
access the TEMP Register.  
The ICR1 Register can only be written when using a Waveform Generation mode that utilizes  
the ICR1 Register for defining the counter’s TOP value. In these cases the Waveform Genera-  
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tion mode (WGM13:0) bits must be set before the TOP value can be written to the ICR1  
Register. When writing the ICR1 Register the high byte must be written to the ICR1H I/O location  
before the low byte is written to ICR1L.  
For more information on how to access the 16-bit registers refer to ”Accessing 16-bit Registers”  
on page 94.  
14.6.1  
Input Capture Trigger Source  
The main trigger source for the Input Capture unit is the Input Capture pin (ICP1).  
Timer/Counter1 can alternatively use the Analog Comparator output as trigger source for the  
Input Capture unit. The Analog Comparator is selected as trigger source by setting the Analog  
Comparator Input Capture (ACIC) bit in the Analog Comparator Control and Status Register  
(ACSR). Be aware that changing trigger source can trigger a capture. The Input Capture Flag  
must therefore be cleared after the change.  
Both the Input Capture pin (ICP1) and the Analog Comparator output (ACO) inputs are sampled  
using the same technique as for the T1 pin (Figure 15-1 on page 120). The edge detector is also  
identical. However, when the noise canceler is enabled, additional logic is inserted before the  
edge detector, which increases the delay by four system clock cycles. Note that the input of the  
noise canceler and edge detector is always enabled unless the Timer/Counter is set in a Wave-  
form Generation mode that uses ICR1 to define TOP.  
An Input Capture can be triggered by software by controlling the port of the ICP1 pin.  
14.6.2  
Noise Canceler  
The noise canceler improves noise immunity by using a simple digital filtering scheme. The  
noise canceler input is monitored over four samples, and all four must be equal for changing the  
output that in turn is used by the edge detector.  
The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNC1) bit in  
Timer/Counter Control Register B (TCCR1B). When enabled the noise canceler introduces addi-  
tional four system clock cycles of delay from a change applied to the input, to the update of the  
ICR1 Register. The noise canceler uses the system clock and is therefore not affected by the  
prescaler.  
14.6.3  
Using the Input Capture Unit  
The main challenge when using the Input Capture unit is to assign enough processor capacity  
for handling the incoming events. The time between two events is critical. If the processor has  
not read the captured value in the ICR1 Register before the next event occurs, the ICR1 will be  
overwritten with a new value. In this case the result of the capture will be incorrect.  
When using the Input Capture interrupt, the ICR1 Register should be read as early in the inter-  
rupt handler routine as possible. Even though the Input Capture interrupt has relatively high  
priority, the maximum interrupt response time is dependent on the maximum number of clock  
cycles it takes to handle any of the other interrupt requests.  
Using the Input Capture unit in any mode of operation when the TOP value (resolution) is  
actively changed during operation, is not recommended.  
Measurement of an external signal’s duty cycle requires that the trigger edge is changed after  
each capture. Changing the edge sensing must be done as early as possible after the ICR1  
Register has been read. After a change of the edge, the Input Capture Flag (ICF1) must be  
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cleared by software (writing a logical one to the I/O bit location). For measuring frequency only,  
the clearing of the ICF1 flag is not required (if an interrupt handler is used).  
14.7 Output Compare Units  
The 16-bit comparator continuously compares TCNT1 with the Output Compare Register  
(OCR1x). If TCNT equals OCR1x the comparator signals a match. A match will set the Output  
Compare Flag (OCF1x) at the next timer clock cycle. If enabled (OCIE1x = 1), the Output Com-  
pare Flag generates an Output Compare interrupt. The OCF1x flag is automatically cleared  
when the interrupt is executed. Alternatively the OCF1x flag can be cleared by software by writ-  
ing a logical one to its I/O bit location. The Waveform Generator uses the match signal to  
generate an output according to operating mode set by the Waveform Generation mode  
(WGM13:0) bits and Compare Output mode (COM1x1:0) bits. The TOP and BOTTOM signals  
are used by the Waveform Generator for handling the special cases of the extreme values in  
some modes of operation (”Modes of Operation” on page 103).  
A special feature of Output Compare unit A allows it to define the Timer/Counter TOP value (i.e.,  
counter resolution). In addition to the counter resolution, the TOP value defines the period time  
for waveforms generated by the Waveform Generator.  
Figure 14-4 on page 100 shows a block diagram of the Output Compare unit. The small “n” in  
the register and bit names indicates the device number (n = 1 for Timer/Counter 1), and the “x”  
indicates Output Compare unit (A/B). The elements of the block diagram that are not directly a  
part of the Output Compare unit are gray shaded.  
Figure 14-4. Output Compare Unit, Block Diagram  
DATA BUS (8-bit)  
TEMP (8-bit)  
OCRnxH Buf. (8-bit)  
OCRnxL Buf. (8-bit)  
TCNTnH (8-bit)  
TCNTnL (8-bit)  
OCRnx Buffer (16-bit Register)  
TCNTn (16-bit Counter)  
OCRnxH (8-bit)  
OCRnxL (8-bit)  
OCRnx (16-bit Register)  
=
(16-bit Comparator )  
OCFnx (Int.Req.)  
TOP  
OCnx  
Waveform Generator  
BOTTOM  
WGMn3:0  
COMnx1:0  
The OCR1x Register is double buffered when using any of the twelve Pulse Width Modulation  
(PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation, the  
double buffering is disabled. The double buffering synchronizes the update of the OCR1x Com-  
pare Register to either TOP or BOTTOM of the counting sequence. The synchronization  
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prevents the occurrence of odd-length, non-symmetrical PWM pulses, thereby making the out-  
put glitch-free.  
The OCR1x Register access may seem complex, but this is not case. When the double buffering  
is enabled, the CPU has access to the OCR1x Buffer Register, and if double buffering is dis-  
abled the CPU will access the OCR1x directly. The content of the OCR1x (Buffer or Compare)  
Register is only changed by a write operation (the Timer/Counter does not update this register  
automatically as the TCNT1 and ICR1 Register). Therefore OCR1x is not read via the high byte  
temporary register (TEMP). However, it is a good practice to read the low byte first as when  
accessing other 16-bit registers. Writing the OCR1x Registers must be done via the TEMP Reg-  
ister since the compare of all 16 bits is done continuously. The high byte (OCR1xH) has to be  
written first. When the high byte I/O location is written by the CPU, the TEMP Register will be  
updated by the value written. Then when the low byte (OCR1xL) is written to the lower eight bits,  
the high byte will be copied into the upper 8-bits of either the OCR1x buffer or OCR1x Compare  
Register in the same system clock cycle.  
For more information of how to access the 16-bit registers refer to ”Accessing 16-bit Registers”  
on page 94.  
14.7.1  
Force Output Compare  
In non-PWM Waveform Generation modes, the match output of the comparator can be forced by  
writing a one to the Force Output Compare (1x) bit. Forcing compare match will not set the  
OCF1x flag or reload/clear the timer, but the OC1x pin will be updated as if a real compare  
match had occurred (the COM11:0 bits settings define whether the OC1x pin is set, cleared or  
toggled).  
14.7.2  
14.7.3  
Compare Match Blocking by TCNT1 Write  
All CPU writes to the TCNT1 Register will block any compare match that occurs in the next timer  
clock cycle, even when the timer is stopped. This feature allows OCR1x to be initialized to the  
same value as TCNT1 without triggering an interrupt when the Timer/Counter clock is enabled.  
Using the Output Compare Unit  
Since writing TCNT1 in any mode of operation will block all compare matches for one timer clock  
cycle, there are risks involved when changing TCNT1 when using any of the Output Compare  
channels, independent of whether the Timer/Counter is running or not. If the value written to  
TCNT1 equals the OCR1x value, the compare match will be missed, resulting in incorrect wave-  
form generation. Do not write the TCNT1 equal to TOP in PWM modes with variable TOP  
values. The compare match for the TOP will be ignored and the counter will continue to 0xFFFF.  
Similarly, do not write the TCNT1 value equal to BOTTOM when the counter is downcounting.  
The setup of the OC1x should be performed before setting the Data Direction Register for the  
port pin to output. The easiest way of setting the OC1x value is to use the Force Output Com-  
pare (1x) strobe bits in Normal mode. The OC1x Register keeps its value even when changing  
between Waveform Generation modes.  
Be aware that the COM1x1:0 bits are not double buffered together with the compare value.  
Changing the COM1x1:0 bits will take effect immediately.  
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14.8 Compare Match Output Unit  
The Compare Output mode (COM1x1:0) bits have two functions. The Waveform Generator uses  
the COM1x1:0 bits for defining the Output Compare (OC1x) state at the next compare match.  
Secondly the COM1x1:0 bits control the OC1x pin output source. Figure 14-5 on page 102  
shows a simplified schematic of the logic affected by the COM1x1:0 bit setting. The I/O Regis-  
ters, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the general I/O port  
control registers (DDR and PORT) that are affected by the COM1x1:0 bits are shown. When  
referring to the OC1x state, the reference is for the internal OC1x Register, not the OC1x pin. If  
a system reset occur, the OC1x Register is reset to “0”.  
Figure 14-5. Compare Match Output Unit, Schematic  
COMnx1  
Waveform  
Generator  
COMnx0  
FOCnx  
D
Q
1
0
OCnx  
Pin  
OCnx  
D
Q
PORT  
D
Q
DDR  
clkI/O  
The general I/O port function is overridden by the Output Compare (OC1x) from the Waveform  
Generator if either of the COM1x1:0 bits are set. However, the OC1x pin direction (input or out-  
put) is still controlled by the Data Direction Register (DDR) for the port pin. The Data Direction  
Register bit for the OC1x pin (DDR_OC1x) must be set as output before the OC1x value is visi-  
ble on the pin. The port override function is generally independent of the Waveform Generation  
mode, but there are some exceptions. See Table 14-1 on page 113, Table 14-2 on page 113  
and Table 14-3 on page 114 for details.  
The design of the Output Compare pin logic allows initialization of the OC1x state before the out-  
put is enabled. Note that some COM1x1:0 bit settings are reserved for certain modes of  
operation. See ”Register Description” on page 113  
The COM1x1:0 bits have no effect on the Input Capture unit.  
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14.8.1  
Compare Output Mode and Waveform Generation  
The Waveform Generator uses the COM1x1:0 bits differently in normal, CTC, and PWM modes.  
For all modes, setting the COM1x1:0 = 0 tells the Waveform Generator that no action on the  
OC1x Register is to be performed on the next compare match. For compare output actions in the  
non-PWM modes refer to Table 14-1 on page 113. For fast PWM mode refer to Table 14-2 on  
page 113, and for phase correct and phase and frequency correct PWM refer to Table 14-3 on  
page 114.  
A change of the COM1x1:0 bits state will have effect at the first compare match after the bits are  
written. For non-PWM modes, the action can be forced to have immediate effect by using the 1x  
strobe bits.  
14.9 Modes of Operation  
The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare pins, is  
defined by the combination of the Waveform Generation mode (WGM13:0) and Compare Output  
mode (COM1x1:0) bits. The Compare Output mode bits do not affect the counting sequence,  
while the Waveform Generation mode bits do. The COM1x1:0 bits control whether the PWM out-  
put generated should be inverted or not (inverted or non-inverted PWM). For non-PWM modes  
the COM1x1:0 bits control whether the output should be set, cleared or toggle at a compare  
match (”Compare Match Output Unit” on page 102)  
For detailed timing information refer to ”Timer/Counter Timing Diagrams” on page 110.  
14.9.1  
Normal Mode  
The simplest mode of operation is the Normal mode (WGM13:0 = 0). In this mode the counting  
direction is always up (incrementing), and no counter clear is performed. The counter simply  
overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and then restarts from the  
BOTTOM (0x0000). In normal operation the Timer/Counter Overflow Flag (TOV1) will be set in  
the same timer clock cycle as the TCNT1 becomes zero. The TOV1 flag in this case behaves  
like a 17th bit, except that it is only set, not cleared. However, combined with the timer overflow  
interrupt that automatically clears the TOV1 flag, the timer resolution can be increased by soft-  
ware. There are no special cases to consider in the Normal mode, a new counter value can be  
written anytime.  
The Input Capture unit is easy to use in Normal mode. However, observe that the maximum  
interval between the external events must not exceed the resolution of the counter. If the interval  
between events are too long, the timer overflow interrupt or the prescaler must be used to  
extend the resolution for the capture unit.  
The Output Compare units can be used to generate interrupts at some given time. Using the  
Output Compare to generate waveforms in Normal mode is not recommended, since this will  
occupy too much of the CPU time.  
14.9.2  
Clear Timer on Compare Match (CTC) Mode  
In Clear Timer on Compare or CTC mode (WGM13:0 = 4 or 12), the OCR1A or ICR1 Register  
are used to manipulate the counter resolution. In CTC mode the counter is cleared to zero when  
the counter value (TCNT1) matches either the OCR1A (WGM13:0 = 4) or the ICR1 (WGM13:0 =  
12). The OCR1A or ICR1 define the top value for the counter, hence also its resolution. This  
mode allows greater control of the compare match output frequency. It also simplifies the opera-  
tion of counting external events.  
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The timing diagram for the CTC mode is shown in Figure 14-6 on page 104. The counter value  
(TCNT1) increases until a compare match occurs with either OCR1A or ICR1, and then counter  
(TCNT1) is cleared.  
Figure 14-6. CTC Mode, Timing Diagram  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
TCNTn  
OCnA  
(Toggle)  
(COMnA1:0 = 1)  
1
2
3
4
Period  
An interrupt can be generated at each time the counter value reaches the TOP value by either  
using the OCF1A or ICF1 flag according to the register used to define the TOP value. If the inter-  
rupt is enabled, the interrupt handler routine can be used for updating the TOP value. However,  
changing the TOP to a value close to BOTTOM when the counter is running with none or a low  
prescaler value must be done with care since the CTC mode does not have the double buffering  
feature. If the new value written to OCR1A or ICR1 is lower than the current value of TCNT1, the  
counter will miss the compare match. The counter will then have to count to its maximum value  
(0xFFFF) and wrap around starting at 0x0000 before the compare match can occur. In many  
cases this feature is not desirable. An alternative will then be to use the fast PWM mode using  
OCR1A for defining TOP (WGM13:0 = 15) since the OCR1A then will be double buffered.  
For generating a waveform output in CTC mode, the OC1A output can be set to toggle its logical  
level on each compare match by setting the Compare Output mode bits to toggle mode  
(COM1A1:0 = 1). The OC1A value will not be visible on the port pin unless the data direction for  
the pin is set to output (DDR_OC1A = 1). The waveform generated will have a maximum fre-  
quency of 1A = fclk_I/O/2 when OCR1A is set to zero (0x0000). The waveform frequency is defined  
by the following equation:  
f
clk_I/O  
= -------------------------------------------------------  
OCnA  
2
N
(1 + OCRnA)  
The N variable represents the prescaler factor (1, 8, 64, 256, or 1024).  
As for the Normal mode of operation, the TOV1 flag is set in the same timer clock cycle that the  
counter counts from MAX to 0x0000.  
14.9.3  
Fast PWM Mode  
The fast Pulse Width Modulation or fast PWM mode (WGM13:0 = 5, 6, 7, 14, or 15) provides a  
high frequency PWM waveform generation option. The fast PWM differs from the other PWM  
options by its single-slope operation. The counter counts from BOTTOM to TOP then restarts  
from BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is cleared  
on the compare match between TCNT1 and OCR1x, and set at BOTTOM. In inverting Compare  
Output mode output is set on compare match and cleared at BOTTOM. Due to the single-slope  
operation, the operating frequency of the fast PWM mode can be twice as high as the phase cor-  
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rect and phase and frequency correct PWM modes that use dual-slope operation. This high  
frequency makes the fast PWM mode well suited for power regulation, rectification, and DAC  
applications. High frequency allows physically small sized external components (coils, capaci-  
tors), hence reduces total system cost.  
The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either ICR1 or  
OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and the max-  
imum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can be  
calculated by using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
FPWM  
log(2)  
In fast PWM mode the counter is incremented until the counter value matches either one of the  
fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 5, 6, or 7), the value in ICR1 (WGM13:0 =  
14), or the value in OCR1A (WGM13:0 = 15). The counter is then cleared at the following timer  
clock cycle. The timing diagram for the fast PWM mode is shown in Figure 14-7 on page 105.  
The figure shows fast PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1  
value is in the timing diagram shown as a histogram for illustrating the single-slope operation.  
The diagram includes non-inverted and inverted PWM outputs. The small horizontal line marks  
on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The OC1x  
interrupt flag will be set when a compare match occurs.  
Figure 14-7. Fast PWM Mode, Timing Diagram  
OCRnx/TOP Update and  
TOVn Interrupt Flag Set and  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
5
6
7
8
Period  
The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches TOP. In addition  
the OC1A or ICF1 flag is set at the same timer clock cycle as TOV1 is set when either OCR1A or  
ICR1 is used for defining the TOP value. If one of the interrupts are enabled, the interrupt han-  
dler routine can be used for updating the TOP and compare values.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the  
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.  
Note that when using fixed TOP values the unused bits are masked to zero when any of the  
OCR1x Registers are written.  
The procedure for updating ICR1 differs from updating OCR1A when used for defining the TOP  
value. The ICR1 Register is not double buffered. This means that if ICR1 is changed to a low  
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value when the counter is running with none or a low prescaler value, there is a risk that the new  
ICR1 value written is lower than the current value of TCNT1. The result will then be that the  
counter will miss the compare match at the TOP value. The counter will then have to count to the  
MAX value (0xFFFF) and wrap around starting at 0x0000 before the compare match can occur.  
The OCR1A Register however, is double buffered. This feature allows the OCR1A I/O location  
to be written anytime. When the OCR1A I/O location is written the value written will be put into  
the OCR1A Buffer Register. The OCR1A Compare Register will then be updated with the value  
in the Buffer Register at the next timer clock cycle the TCNT1 matches TOP. The update is done  
at the same timer clock cycle as the TCNT1 is cleared and the TOV1 flag is set.  
Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using  
ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,  
if the base PWM frequency is actively changed (by changing the TOP value), using the OCR1A  
as TOP is clearly a better choice due to its double buffer feature.  
In fast PWM mode, the compare units allow generation of PWM waveforms on the OC1x pins.  
Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted PWM output  
can be generated by setting the COM1x1:0 to three (see Table 14-2 on page 113). The actual  
OC1x value will only be visible on the port pin if the data direction for the port pin is set as output  
(DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x Register at  
the compare match between OCR1x and TCNT1, and clearing (or setting) the OC1x Register at  
the timer clock cycle the counter is cleared (changes from TOP to BOTTOM).  
The PWM frequency for the output can be calculated by the following equation:  
f
clk_I/O  
f
= -------------------------------------  
OCnxPWM  
N
(1 + TOP)  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).  
The extreme values for the OCR1x Register represents special cases when generating a PWM  
waveform output in the fast PWM mode. If the OCR1x is set equal to BOTTOM (0x0000) the out-  
put will be a narrow spike for each TOP+1 timer clock cycle. Setting the OCR1x equal to TOP  
will result in a constant high or low output (depending on the polarity of the output set by the  
COM1x1:0 bits.)  
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved by set-  
ting OC1A to toggle its logical level on each compare match (COM1A1:0 = 1). The waveform  
generated will have a maximum frequency of 1A = fclk_I/O/2 when OCR1A is set to zero (0x0000).  
This feature is similar to the OC1A toggle in CTC mode, except the double buffer feature of the  
Output Compare unit is enabled in the fast PWM mode.  
14.9.4  
Phase Correct PWM Mode  
The phase correct Pulse Width Modulation or phase correct PWM mode (WGM13:0 = 1, 2, 3,  
10, or 11) provides a high resolution phase correct PWM waveform generation option. The  
phase correct PWM mode is, like the phase and frequency correct PWM mode, based on a dual-  
slope operation. The counter counts repeatedly from BOTTOM (0x0000) to TOP and then from  
TOP to BOTTOM. In non-inverting Compare Output mode, the Output Compare (OC1x) is  
cleared on the compare match between TCNT1 and OCR1x while upcounting, and set on the  
compare match while downcounting. In inverting Output Compare mode, the operation is  
inverted. The dual-slope operation has lower maximum operation frequency than single slope  
operation. However, due to the symmetric feature of the dual-slope PWM modes, these modes  
are preferred for motor control applications.  
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The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or defined  
by either ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to  
0x0003), and the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolu-  
tion in bits can be calculated by using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
PCPWM  
log(2)  
In phase correct PWM mode the counter is incremented until the counter value matches either  
one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGM13:0 = 1, 2, or 3), the value in ICR1  
(WGM13:0 = 10), or the value in OCR1A (WGM13:0 = 11). The counter has then reached the  
TOP and changes the count direction. The TCNT1 value will be equal to TOP for one timer clock  
cycle. The timing diagram for the phase correct PWM mode is shown on Figure 14-8 on page  
107. The figure shows phase correct PWM mode when OCR1A or ICR1 is used to define TOP.  
The TCNT1 value is in the timing diagram shown as a histogram for illustrating the dual-slope  
operation. The diagram includes non-inverted and inverted PWM outputs. The small horizontal  
line marks on the TCNT1 slopes represent compare matches between OCR1x and TCNT1. The  
OC1x interrupt flag will be set when a compare match occurs.  
Figure 14-8. Phase Correct PWM Mode, Timing Diagram  
OCRnx/TOP Update and  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
TOVn Interrupt Flag Set  
(Interrupt on Bottom)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
Period  
The Timer/Counter Overflow Flag (TOV1) is set each time the counter reaches BOTTOM. When  
either OCR1A or ICR1 is used for defining the TOP value, the OC1A or ICF1 flag is set accord-  
ingly at the same timer clock cycle as the OCR1x Registers are updated with the double buffer  
value (at TOP). The interrupt flags can be used to generate an interrupt each time the counter  
reaches the TOP or BOTTOM value.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the  
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.  
Note that when using fixed TOP values, the unused bits are masked to zero when any of the  
OCR1x Registers are written. As the third period shown in Figure 14-8 on page 107 illustrates,  
changing the TOP actively while the Timer/Counter is running in the phase correct mode can  
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result in an unsymmetrical output. The reason for this can be found in the time of update of the  
OCR1x Register. Since the OCR1x update occurs at TOP, the PWM period starts and ends at  
TOP. This implies that the length of the falling slope is determined by the previous TOP value,  
while the length of the rising slope is determined by the new TOP value. When these two values  
differ the two slopes of the period will differ in length. The difference in length gives the unsym-  
metrical result on the output.  
It is recommended to use the phase and frequency correct mode instead of the phase correct  
mode when changing the TOP value while the Timer/Counter is running. When using a static  
TOP value there are practically no differences between the two modes of operation.  
In phase correct PWM mode, the compare units allow generation of PWM waveforms on the  
OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and an inverted  
PWM output can be generated by setting the COM1x1:0 to three (See Table 14-3 on page 114).  
The actual OC1x value will only be visible on the port pin if the data direction for the port pin is  
set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing) the OC1x  
Register at the compare match between OCR1x and TCNT1 when the counter increments, and  
clearing (or setting) the OC1x Register at compare match between OCR1x and TCNT1 when  
the counter decrements. The PWM frequency for the output when using phase correct PWM can  
be calculated by the following equation:  
f
clk_I/O  
f
= ---------------------------------  
OCnxPCPWM  
2
N
TOP  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).  
The extreme values for the OCR1x Register represent special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the  
output will be continuously low and if set equal to TOP the output will be continuously high for  
non-inverted PWM mode. For inverted PWM the output will have the opposite logic values.  
14.9.5  
Phase and Frequency Correct PWM Mode  
The phase and frequency correct Pulse Width Modulation, or phase and frequency correct PWM  
mode (WGM13:0 = 8 or 9) provides a high resolution phase and frequency correct PWM wave-  
form generation option. The phase and frequency correct PWM mode is, like the phase correct  
PWM mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM  
(0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output mode, the  
Output Compare (OC1x) is cleared on the compare match between TCNT1 and OCR1x while  
upcounting, and set on the compare match while downcounting. In inverting Compare Output  
mode, the operation is inverted. The dual-slope operation gives a lower maximum operation fre-  
quency compared to the single-slope operation. However, due to the symmetric feature of the  
dual-slope PWM modes, these modes are preferred for motor control applications.  
The main difference between the phase correct, and the phase and frequency correct PWM  
mode is the time the OCR1x Register is updated by the OCR1x Buffer Register, (see Figure 14-  
8 on page 107 and Figure 14-9 on page 109).  
The PWM resolution for the phase and frequency correct PWM mode can be defined by either  
ICR1 or OCR1A. The minimum resolution allowed is 2-bit (ICR1 or OCR1A set to 0x0003), and  
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the maximum resolution is 16-bit (ICR1 or OCR1A set to MAX). The PWM resolution in bits can  
be calculated using the following equation:  
log(TOP + 1)  
R
= ----------------------------------  
PFCPWM  
log(2)  
In phase and frequency correct PWM mode the counter is incremented until the counter value  
matches either the value in ICR1 (WGM13:0 = 8), or the value in OCR1A (WGM13:0 = 9). The  
counter has then reached the TOP and changes the count direction. The TCNT1 value will be  
equal to TOP for one timer clock cycle. The timing diagram for the phase correct and frequency  
correct PWM mode is shown on Figure 14-9 on page 109. The figure shows phase and fre-  
quency correct PWM mode when OCR1A or ICR1 is used to define TOP. The TCNT1 value is in  
the timing diagram shown as a histogram for illustrating the dual-slope operation. The diagram  
includes non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT1  
slopes represent compare matches between OCR1x and TCNT1. The OC1x interrupt flag will be  
set when a compare match occurs.  
Figure 14-9. Phase and Frequency Correct PWM Mode, Timing Diagram  
OCnA Interrupt Flag Set  
or ICFn Interrupt Flag Set  
(Interrupt on TOP)  
OCRnx/TOP Updateand  
TOVn Interrupt Flag Set  
(Interrupt on Bottom)  
TCNTn  
(COMnx1:0 = 2)  
OCnx  
(COMnx1:0 = 3)  
OCnx  
1
2
3
4
Period  
The Timer/Counter Overflow Flag (TOV1) is set at the same timer clock cycle as the OCR1x  
Registers are updated with the double buffer value (at BOTTOM). When either OCR1A or ICR1  
is used for defining the TOP value, the OC1A or ICF1 flag set when TCNT1 has reached TOP.  
The interrupt flags can then be used to generate an interrupt each time the counter reaches the  
TOP or BOTTOM value.  
When changing the TOP value the program must ensure that the new TOP value is higher or  
equal to the value of all of the Compare Registers. If the TOP value is lower than any of the  
Compare Registers, a compare match will never occur between the TCNT1 and the OCR1x.  
As Figure 14-9 on page 109 shows the output generated is, in contrast to the phase correct  
mode, symmetrical in all periods. Since the OCR1x Registers are updated at BOTTOM, the  
length of the rising and the falling slopes will always be equal. This gives symmetrical output  
pulses and is therefore frequency correct.  
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Using the ICR1 Register for defining TOP works well when using fixed TOP values. By using  
ICR1, the OCR1A Register is free to be used for generating a PWM output on OC1A. However,  
if the base PWM frequency is actively changed by changing the TOP value, using the OCR1A as  
TOP is clearly a better choice due to its double buffer feature.  
In phase and frequency correct PWM mode, the compare units allow generation of PWM wave-  
forms on the OC1x pins. Setting the COM1x1:0 bits to two will produce a non-inverted PWM and  
an inverted PWM output can be generated by setting the COM1x1:0 to three (See Table 14-3 on  
page 114). The actual OC1x value will only be visible on the port pin if the data direction for the  
port pin is set as output (DDR_OC1x). The PWM waveform is generated by setting (or clearing)  
the OC1x Register at the compare match between OCR1x and TCNT1 when the counter incre-  
ments, and clearing (or setting) the OC1x Register at compare match between OCR1x and  
TCNT1 when the counter decrements. The PWM frequency for the output when using phase  
and frequency correct PWM can be calculated by the following equation:  
f
clk_I/O  
f
= ---------------------------------  
OCnxPFCPWM  
2
N
TOP  
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).  
The extreme values for the OCR1x Register represents special cases when generating a PWM  
waveform output in the phase correct PWM mode. If the OCR1x is set equal to BOTTOM the  
output will be continuously low and if set equal to TOP the output will be set to high for non-  
inverted PWM mode. For inverted PWM the output will have the opposite logic values.  
14.10 Timer/Counter Timing Diagrams  
The Timer/Counter is a synchronous design and the timer clock (clkT1) is therefore shown as a  
clock enable signal in the following figures. The figures include information on when interrupt  
flags are set, and when the OCR1x Register is updated with the OCR1x buffer value (only for  
modes utilizing double buffering). Figure 14-10 on page 110 shows a timing diagram for the set-  
ting of OCF1x.  
Figure 14-10. Timer/Counter Timing Diagram, Setting of OCF1x, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
OCRnx  
OCFnx  
OCRnx - 1  
OCRnx  
OCRnx + 1  
OCRnx + 2  
OCRnx Value  
Figure 14-11 on page 111 shows the same timing data, but with the prescaler enabled.  
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Figure 14-11. Timer/Counter Timing Diagram, Setting of OCF1x, with Prescaler (fclk_I/O/8)  
clkI/O  
clkTn  
(clkI/O/8)  
TCNTn  
OCRnx  
OCFnx  
OCRnx - 1  
OCRnx  
OCRnx + 1  
OCRnx + 2  
OCRnx Value  
Figure 14-12 on page 111 shows the count sequence close to TOP in various modes. When  
using phase and frequency correct PWM mode the OCR1x Register is updated at BOTTOM.  
The timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by  
BOTTOM+1 and so on. The same renaming applies for modes that set the TOV1 flag at  
BOTTOM.  
Figure 14-12. Timer/Counter Timing Diagram, no Prescaling  
clkI/O  
clkTn  
(clkI/O/1)  
TCNTn  
TOP - 1  
TOP - 1  
TOP  
TOP  
BOTTOM  
TOP - 1  
BOTTOM + 1  
TOP - 2  
(CTC and FPWM)  
TCNTn  
(PC and PFC PWM)  
TOVn (FPWM)  
and ICFn (if used  
as TOP)  
OCRnx  
(Update at TOP)  
New OCRnx Value  
Old OCRnx Value  
Figure 14-13 on page 112 shows the same timing data, but with the prescaler enabled.  
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Figure 14-13. Timer/Counter Timing Diagram, with Prescaler (fclk_I/O/8)  
clk  
I/O  
clk  
Tn  
(clk /8)  
I/O  
TCNTn  
TOP - 1  
TOP - 1  
TOP  
TOP  
BOTTOM  
TOP - 1  
BOTTOM + 1  
TOP - 2  
(CTC and FPWM)  
TCNTn  
(PC and PFC PWM)  
TOVn(FPWM)  
and ICFn(if used  
as TOP)  
OCRnx  
(Update at TOP)  
Old OCRnx Value  
New OCRnx Value  
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14.11 Register Description  
14.11.1 TCCR1A – Timer/Counter1 Control Register A  
Bit  
7
COM1A1  
R/W  
6
COM1A0  
R/W  
5
COM1B1  
R/W  
4
COM1B0  
R/W  
3
2
1
WGM11  
R/W  
0
0
WGM10  
R/W  
0
TCCR1A  
0x2F (0x4F)  
Read/Write  
Initial Value  
R
0
R
0
0
0
0
0
• Bit 7:6 – COM1A1:0: Compare Output Mode for Channel A  
• Bit 5:4 – COM1B1:0: Compare Output Mode for Channel B  
The COM1A1:0 and COM1B1:0 control the Output Compare pins (OC1A and OC1B respec-  
tively) behavior. If one or both of the COM1A1:0 bits are written to one, the OC1A output  
overrides the normal port functionality of the I/O pin it is connected to. If one or both of the  
COM1B1:0 bit are written to one, the OC1B output overrides the normal port functionality of the  
I/O pin it is connected to. However, note that the Data Direction Register (DDR) bit correspond-  
ing to the OC1A or OC1B pin must be set in order to enable the output driver.  
When the OC1A or OC1B is connected to the pin, the function of the COM1x1:0 bits is depen-  
dent of the WGM13:0 bits setting. Table 14-1 on page 113 shows the COM1x1:0 bit functionality  
when the WGM13:0 bits are set to a Normal or a CTC mode (non-PWM).  
Table 14-1. Compare Output Mode, non-PWM  
COM1A1/COM1B1  
COM1A0/COM1B0  
Description  
0
0
0
1
Normal port operation, OC1A/OC1B disconnected.  
Toggle OC1A/OC1B on Compare Match.  
Clear OC1A/OC1B on Compare Match (Set output to  
low level).  
1
1
0
1
Set OC1A/OC1B on Compare Match (Set output to  
high level).  
Table 14-2 on page 113 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to  
the fast PWM mode.  
Table 14-2. Compare Output Mode, Fast PWM(1)  
COM1A1/COM1B1  
COM1A0/COM1B0  
Description  
0
0
Normal port operation, OC1A/OC1B disconnected.  
WGM13=0: Normal port operation, OC1A/OC1B  
disconnected.  
0
1
WGM13=1: Toggle OC1A on Compare Match, OC1B  
reserved.  
Clear OC1A/OC1B on Compare Match, set  
OC1A/OC1B at BOTTOM (non-inverting mode)  
1
1
0
1
Set OC1A/OC1B on Compare Match, clear  
OC1A/OC1B at BOTTOM (inverting mode)  
Note:  
1. A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. In  
this case the compare match is ignored, but the set or clear is done at BOTTOM. ”Fast PWM  
Mode” on page 104 for more details.  
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Table 14-3 shows the COM1x1:0 bit functionality when the WGM13:0 bits are set to the phase  
correct or the phase and frequency correct, PWM mode.  
Table 14-3. Compare Output Mode, Phase Correct and Phase and Frequency Correct  
PWM(Note:)  
COM1A1/COM1B1  
COM1A0/COM1B0  
Description  
0
0
Normal port operation, OC1A/OC1B disconnected.  
WGM13=0: Normal port operation, OC1A/OC1B  
disconnected.  
0
1
WGM13=1: Toggle OC1A on Compare Match, OC1B  
reserved.  
Clear OC1A/OC1B on Compare Match when up-  
counting. Set OC1A/OC1B on Compare Match when  
downcounting.  
1
1
0
1
Set OC1A/OC1B on Compare Match when up-  
counting. Clear OC1A/OC1B on Compare Match  
when downcounting.  
Note:  
A special case occurs when OCR1A/OCR1B equals TOP and COM1A1/COM1B1 is set. ”Phase  
Correct PWM Mode” on page 106 for more details.  
• Bit 1:0 – WGM11:0: Waveform Generation Mode  
Combined with the WGM13:2 bits found in the TCCR1B Register, these bits control the counting  
sequence of the counter, the source for maximum (TOP) counter value, and what type of wave-  
form generation to be used, see Table 14-4 on page 115. Modes of operation supported by the  
Timer/Counter unit are: Normal mode (counter), Clear Timer on Compare match (CTC) mode,  
and three types of Pulse Width Modulation (PWM) modes. (”Modes of Operation” on page 103).  
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Table 14-4. Waveform Generation Mode Bit Description(1)  
WGM12  
(CTC1)  
WGM11  
WGM10  
Timer/Counter Mode of  
Update of  
OCR1x at  
TOV1 Flag  
Set on  
Mode  
WGM13  
(PWM11) (PWM10) Operation  
TOP  
0
1
2
3
4
5
6
7
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Normal  
0xFFFF  
0x00FF  
0x01FF  
0x03FF  
OCR1A  
0x00FF  
0x01FF  
0x03FF  
Immediate  
TOP  
MAX  
PWM, Phase Correct, 8-bit  
PWM, Phase Correct, 9-bit  
PWM, Phase Correct, 10-bit  
CTC  
BOTTOM  
BOTTOM  
BOTTOM  
MAX  
TOP  
TOP  
Immediate  
BOTTOM  
BOTTOM  
BOTTOM  
Fast PWM, 8-bit  
TOP  
Fast PWM, 9-bit  
TOP  
Fast PWM, 10-bit  
TOP  
PWM, Phase and Frequency  
Correct  
8
9
1
1
0
0
0
0
0
1
ICR1  
BOTTOM  
BOTTOM  
BOTTOM  
BOTTOM  
PWM, Phase and Frequency  
Correct  
OCR1A  
10  
11  
12  
13  
14  
15  
1
1
1
1
1
1
0
0
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
1
PWM, Phase Correct  
PWM, Phase Correct  
CTC  
ICR1  
OCR1A  
ICR1  
TOP  
BOTTOM  
BOTTOM  
MAX  
TOP  
Immediate  
(Reserved)  
Fast PWM  
ICR1  
OCR1A  
BOTTOM  
BOTTOM  
TOP  
Fast PWM  
TOP  
Note:  
1. The CTC1 and PWM11:0 bit definition names are obsolete. Use the WGM12:0 definitions. However, the functionality and  
location of these bits are compatible with previous versions of the timer.  
14.11.2 TCCR1B – Timer/Counter1 Control Register B  
Bit  
7
ICNC1  
R/W  
0
6
ICES1  
R/W  
0
5
4
WGM13  
R/W  
0
3
WGM12  
R/W  
0
2
CS12  
R/W  
0
1
CS11  
R/W  
0
0
CS10  
R/W  
0
0x2E (0x4E)  
Read/Write  
Initial Value  
TCCR1B  
R
0
• Bit 7 – ICNC1: Input Capture Noise Canceler  
Setting this bit (to one) activates the Input Capture Noise Canceler. When the noise canceler is  
activated, the input from the Input Capture pin (ICP1) is filtered. The filter function requires four  
successive equal valued samples of the ICP1 pin for changing its output. The Input Capture is  
therefore delayed by four Oscillator cycles when the noise canceler is enabled.  
• Bit 6 – ICES1: Input Capture Edge Select  
This bit selects which edge on the Input Capture pin (ICP1) that is used to trigger a capture  
event. When the ICES1 bit is written to zero, a falling (negative) edge is used as trigger, and  
when the ICES1 bit is written to one, a rising (positive) edge will trigger the capture.  
When a capture is triggered according to the ICES1 setting, the counter value is copied into the  
Input Capture Register (ICR1). The event will also set the Input Capture Flag (ICF1), and this  
can be used to cause an Input Capture Interrupt, if this interrupt is enabled.  
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When the ICR1 is used as TOP value (see description of the WGM13:0 bits located in the  
TCCR1A and the TCCR1B Register), the ICP1 is disconnected and consequently the Input Cap-  
ture function is disabled.  
• Bit 5 – Reserved Bit  
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be  
written to zero when TCCR1B is written.  
• Bit 4:3 – WGM13:2: Waveform Generation Mode  
See TCCR1A Register description.  
• Bit 2:0 – CS12:0: Clock Select  
The three Clock Select bits select the clock source to be used by the Timer/Counter, see Figure  
14-10 and Figure 14-11.  
Table 14-5. Clock Select Bit Description  
CS12  
CS11  
CS10  
Description  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
No clock source (Timer/Counter stopped).  
clkI/O/1 (No prescaling)  
clkI/O/8 (From prescaler)  
clkI/O/64 (From prescaler)  
clkI/O/256 (From prescaler)  
clkI/O/1024 (From prescaler)  
External clock source on T1 pin. Clock on falling edge.  
External clock source on T1 pin. Clock on rising edge.  
If external pin modes are used for the Timer/Counter1, transitions on the T1 pin will clock the  
counter even if the pin is configured as an output. This feature allows software control of the  
counting.  
14.11.3 TCCR1C – Timer/Counter1 Control Register C  
Bit  
0x22 (0x42)  
7
6
5
4
3
2
1
0
FOC1A  
FOC1B  
TCCR1C  
Read/Write  
Initial Value  
W
0
W
0
R
0
R
0
R
0
R
0
R
0
R
0
• Bit 7 – FOC1A: Force Output Compare for Channel A  
• Bit 6 – FOC1B: Force Output Compare for Channel B  
The FOC1A/FOC1B bits are only active when the WGM13:0 bits specifies a non-PWM mode.  
However, for ensuring compatibility with future devices, these bits must be set to zero when  
TCCR1A is written when operating in a PWM mode. When writing a logical one to the  
FOC1A/FOC1B bit, an immediate compare match is forced on the Waveform Generation unit.  
The OC1A/OC1B output is changed according to its COM1x1:0 bits setting. Note that the  
FOC1A/FOC1B bits are implemented as strobes. Therefore it is the value present in the  
COM1x1:0 bits that determine the effect of the forced compare.  
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A FOC1A/FOC1B strobe will not generate any interrupt nor will it clear the timer in Clear Timer  
on Compare match (CTC) mode using OCR1A as TOP.  
The FOC1A/FOC1B bits are always read as zero.  
• Bit 5..0 – Reserved Bit  
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be  
written to zero when the register is written.  
14.11.4 TCNT1H and TCNT1L – Timer/Counter1  
Bit  
7
6
5
4
3
2
1
0
0x2D (0x4D)  
0x2C (0x4C)  
Read/Write  
Initial Value  
TCNT1[15:8]  
TCNT1[7:0]  
TCNT1H  
TCNT1L  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
0
The two Timer/Counter I/O locations (TCNT1H and TCNT1L, combined TCNT1) give direct  
access, both for read and for write operations, to the Timer/Counter unit 16-bit counter. To  
ensure that both the high and low bytes are read and written simultaneously when the CPU  
accesses these registers, the access is performed using an 8-bit temporary high byte register  
(TEMP). This temporary register is shared by all the other 16-bit registers. See ”Accessing 16-bit  
Registers” on page 94.  
Modifying the counter (TCNT1) while the counter is running introduces a risk of missing a com-  
pare match between TCNT1 and one of the OCR1x Registers.  
Writing to the TCNT1 Register blocks (removes) the compare match on the following timer clock  
for all compare units.  
14.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A  
Bit  
7
6
5
4
3
2
1
0
0x2B (0x4B)  
0x2A (0x4A)  
Read/Write  
Initial Value  
OCR1A[15:8]  
OCR1A[7:0]  
OCR1AH  
OCR1AL  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
R/W  
0
R/W  
0
R/W  
0
0
0
14.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B  
Bit  
7
6
5
4
3
2
1
0
0x29 (0x49)  
0x28 (0x48)  
Read/Write  
Initial Value  
OCR1B[15:8]  
OCR1B[7:0]  
OCR1BH  
OCR1BL  
R/W  
0
R/W  
0
R/W  
0
R/W  
R/W  
R/W  
0
R/W  
0
R/W  
0
0
0
The Output Compare Registers contain a 16-bit value that is continuously compared with the  
counter value (TCNT1). A match can be used to generate an Output Compare interrupt, or to  
generate a waveform output on the OC1x pin.  
The Output Compare Registers are 16-bit in size. To ensure that both the high and low bytes are  
written simultaneously when the CPU writes to these registers, the access is performed using an  
8-bit temporary high byte register (TEMP). This temporary register is shared by all the other 16-  
bit registers. See ”Accessing 16-bit Registers” on page 94.  
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14.11.7 ICR1H and ICR1L – Input Capture Register 1  
Bit  
7
6
5
4
3
2
1
0
0x25 (0x45)  
0x24 (0x44)  
Read/Write  
Initial Value  
ICR1[15:8]  
ICR1[7:0]  
ICR1H  
ICR1L  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The Input Capture is updated with the counter (TCNT1) value each time an event occurs on the  
ICP1 pin (or optionally on the Analog Comparator output for Timer/Counter1). The Input Capture  
can be used for defining the counter TOP value.  
The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes are read  
simultaneously when the CPU accesses these registers, the access is performed using an 8-bit  
temporary high byte register (TEMP). This temporary register is shared by all the other 16-bit  
registers. ”Accessing 16-bit Registers” on page 94.  
14.11.8 TIMSK1 – Timer/Counter Interrupt Mask Register 1  
Bit  
0x0C (0x2C)  
7
6
5
4
3
2
OCIE1B  
R/W  
0
1
OCIE1A  
R/W  
0
0
TOIE1  
R/W  
0
ICIE1  
TIMSK1  
Read/Write  
Initial Value  
R
0
R
0
R/W  
0
R
0
R
0
• Bit 7,6,4,3 – Reserved Bit  
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be  
written to zero when the register is written.  
• Bit 5 – ICIE1: Timer/Counter1, Input Capture Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Countern Input Capture interrupt is enabled. The  
corresponding Interrupt Vector (See “Interrupts” on page 66.) is executed when the  
ICF1 Flag, located in TIFR1, is set.  
• Bit 2– OCIE1B: Timer/Counter1, Output Compare B Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Output Compare B Match interrupt is enabled. The corresponding  
Interrupt Vector (see ”Interrupts” on page 50) is executed when the OCF1B flag, located in  
TIFR1, is set.  
• Bit 1– OCIE1A: Timer/Counter1, Output Compare A Match Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Output Compare A Match interrupt is enabled. The corresponding  
Interrupt Vector (see ”Interrupts” on page 50) is executed when the OCF1A flag, located in  
TIFR1, is set.  
• Bit 0 – TOIE1: Timer/Counter1, Overflow Interrupt Enable  
When this bit is written to one, and the I-flag in the Status Register is set (interrupts globally  
enabled), the Timer/Counter1 Overflow interrupt is enabled. The corresponding Interrupt Vector  
(see ”Interrupts” on page 50) is executed when the TOV1 flag, located in TIFR1, is set.  
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14.11.9 TIFR1 – Timer/Counter Interrupt Flag Register 1  
Bit  
7
6
5
4
3
2
OCF1B  
R/W  
0
1
OCF1A  
R/W  
0
0
TOV1  
R/W  
0
0x0B (0x2B)  
Read/Write  
Initial Value  
ICIF1  
TIFR1  
R
0
R
0
R/W  
R
0
R
0
0
• Bit 7,6,4,3 – Reserved Bit  
This bit is reserved for future use. For ensuring compatibility with future devices, this bit must be  
written to zero when the register is written.  
• Bit 5– ICF1: Timer/Counter1, Input Capture Flag  
This flag is set when a capture event occurs on the ICP1 pin. When the Input Capture Register  
(ICR1) is set by the WGM13:0 to be used as the TOP value, the ICF1 flag is set when the coun-  
ter reaches the TOP value.  
ICF1 is automatically cleared when the Input Capture Interrupt Vector is executed. Alternatively,  
ICF1 can be cleared by writing a logic one to its bit location.  
• Bit 2– OCF1B: Timer/Counter1, Output Compare B Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output  
Compare Register B (OCR1B).  
Note that a Forced Output Compare (1B) strobe will not set the OCF1B flag.  
OCF1B is automatically cleared when the Output Compare Match B Interrupt Vector is exe-  
cuted. Alternatively, OCF1B can be cleared by writing a logic one to its bit location.  
• Bit 1– OCF1A: Timer/Counter1, Output Compare A Match Flag  
This flag is set in the timer clock cycle after the counter (TCNT1) value matches the Output  
Compare Register A (OCR1A).  
Note that a Forced Output Compare (1A) strobe will not set the OCF1A flag.  
OCF1A is automatically cleared when the Output Compare Match A Interrupt Vector is exe-  
cuted. Alternatively, OCF1A can be cleared by writing a logic one to its bit location.  
• Bit 0– TOV1: Timer/Counter1, Overflow Flag  
The setting of this flag is dependent of the WGM13:0 bits setting. In Normal and CTC modes,  
the TOV1 flag is set when the timer overflows. See Table 14-4 on page 115 for the TOV1 flag  
behavior when using another WGM13:0 bit setting.  
TOV1 is automatically cleared when the Timer/Counter1 Overflow Interrupt Vector is executed.  
Alternatively, TOV1 can be cleared by writing a logic one to its bit location.  
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15. Timer/Counter Prescaler  
Timer/Counter 0, and 1 share the same prescaler module, but the Timer/Counters can have dif-  
ferent prescaler settings. The description below applies to all Timer/Counters. Tn is used as a  
general name, n = 0, 1.  
The Timer/Counter can be clocked directly by the system clock (by setting the CSn2:0 = 1). This  
provides the fastest operation, with a maximum Timer/Counter clock frequency equal to system  
clock frequency (fCLK_I/O). Alternatively, one of four taps from the prescaler can be used as a  
clock source. The prescaled clock has a frequency of either fCLK_I/O/8, fCLK_I/O/64, fCLK_I/O/256, or  
fCLK_I/O/1024.  
15.0.1  
Prescaler Reset  
The prescaler is free running, i.e., operates independently of the Clock Select logic of the  
Timer/CounterCounter, and it is shared by the Timer/Counter Tn. Since the prescaler is not  
affected by the Timer/Counter’s clock select, the state of the prescaler will have implications for  
situations where a prescaled clock is used. One example of prescaling artifacts occurs when the  
timer is enabled and clocked by the prescaler (6 > CSn2:0 > 1). The number of system clock  
cycles from when the timer is enabled to the first count occurs can be from 1 to N+1 system  
clock cycles, where N equals the prescaler divisor (8, 64, 256, or 1024).  
It is possible to use the Prescaler Reset for synchronizing the Timer/Counter to program  
execution.  
15.0.2  
External Clock Source  
An external clock source applied to the Tn pin can be used as Timer/Counter clock (clkTn). The  
Tn pin is sampled once every system clock cycle by the pin synchronization logic. The synchro-  
nized (sampled) signal is then passed through the edge detector. Figure 15-1 on page 120  
shows a functional equivalent block diagram of the Tn synchronization and edge detector logic.  
The registers are clocked at the positive edge of the internal system clock (clkI/O). The latch is  
transparent in the high period of the internal system clock.  
The edge detector generates one clkT0 pulse for each positive (CSn2:0 = 7) or negative (CSn2:0  
= 6) edge it detects.  
Figure 15-1. T0 Pin Sampling  
Tn_sync  
(To Clock  
Tn  
D
Q
D
Q
D
Q
Select Logic)  
LE  
clkI/O  
Synchronization  
Edge Detector  
The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system clock cycles  
from an edge has been applied to the Tn pin to the counter is updated.  
Enabling and disabling of the clock input must be done when Tn has been stable for at least one  
system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse is generated.  
Each half period of the external clock applied must be longer than one system clock cycle to  
ensure correct sampling. The external clock must be guaranteed to have less than half the sys-  
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tem clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since the edge detector uses  
sampling, the maximum frequency of an external clock it can detect is half the sampling fre-  
quency (Nyquist sampling theorem). However, due to variation of the system clock frequency  
and duty cycle caused by Oscillator source (crystal, resonator, and capacitors) tolerances, it is  
recommended that maximum frequency of an external clock source is less than fclk_I/O/2.5.  
An external clock source can not be prescaled.  
Figure 15-2. Prescaler for Timer/Counter0  
clkI/O  
Clear  
PSR10  
T0  
Synchronization  
clkT0  
Note:  
1. The synchronization logic on the input pins (T0) is shown in Figure 15-1 on page 120.  
15.1 Register Description  
15.1.1  
GTCCR – General Timer/Counter Control Register  
Bit  
7
6
5
4
3
2
1
0
PSR10  
R/W  
0
0x23 (0x43)  
Read/Write  
Initial Value  
TSM  
R/W  
0
GTCCR  
R
0
R
0
R
0
R
0
R
0
R
0
• Bit 7 – TSM: Timer/Counter Synchronization Mode  
Writing the TSM bit to one activates the Timer/Counter Synchronization mode. In this mode, the  
value that is written to the PSR10 bit is kept, hence keeping the Prescaler Reset signal asserted.  
This ensures that the Timer/Counter is halted and can be configured without the risk of advanc-  
ing during configuration. When the TSM bit is written to zero, the PSR10 bit is cleared by  
hardware, and the Timer/Counter start counting.  
• Bit 0 – PSR10: Prescaler 0 Reset Timer/Counter n  
When this bit is one, the Timer/Countern prescaler will be Reset. This bit is normally cleared  
immediately by hardware, except if the TSM bit is set.  
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16. USI – Universal Serial Interface  
16.1 Features  
Two-wire Synchronous Data Transfer (Master or Slave)  
Three-wire Synchronous Data Transfer (Master or Slave)  
Data Received Interrupt  
Wakeup from Idle Mode  
In Two-wire Mode: Wake-up from All Sleep Modes, Including Power-down Mode  
Two-wire Start Condition Detector with Interrupt Capability  
16.2 Overview  
The Universal Serial Interface (USI), provides the basic hardware resources needed for serial  
communication. Combined with a minimum of control software, the USI allows significantly  
higher transfer rates and uses less code space than solutions based on software only. Interrupts  
are included to minimize the processor load.  
A simplified block diagram of the USI is shown in Figure 16-1 on page 122. For the actual place-  
ment of I/O pins, refer to ”Pinout ATtiny24/44/84” on page 2. CPU accessible I/O Registers,  
including I/O bits and I/O pins, are shown in bold. The device-specific I/O Register and bit loca-  
tions are listed in the ”Register Descriptions” on page 130.  
Figure 16-1. Universal Serial Interface, Block Diagram  
(Output only)  
DO  
D
LE  
Q
(Input/Open Drain)  
DI/SDA  
3
2
USIDR  
1
0
TIM0 COMP  
3
2
0
1
(Input/Open Drain)  
USCK/SCL  
4-bit Counter  
1
0
CLOCK  
HOLD  
[1]  
Two-wire Clock  
Control Unit  
USISR  
2
USICR  
The 8-bit Shift Register is directly accessible via the data bus and contains the incoming and  
outgoing data. The register has no buffering so the data must be read as quickly as possible to  
ensure that no data is lost. The most significant bit is connected to one of two output pins  
depending of the wire mode configuration. A transparent latch is inserted between the Serial  
Register Output and output pin, which delays the change of data output to the opposite clock  
edge of the data input sampling. The serial input is always sampled from the Data Input (DI) pin  
independent of the configuration.  
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The 4-bit counter can be both read and written via the data bus, and can generate an overflow  
interrupt. Both the Serial Register and the counter are clocked simultaneously by the same clock  
source. This allows the counter to count the number of bits received or transmitted and generate  
an interrupt when the transfer is complete. Note that when an external clock source is selected  
the counter counts both clock edges. In this case the counter counts the number of edges, and  
not the number of bits. The clock can be selected from three different sources: The USCK pin,  
Timer/Counter0 Compare Match or from software.  
The Two-wire clock control unit can generate an interrupt when a start condition is detected on  
the Two-wire bus. It can also generate wait states by holding the clock pin low after a start con-  
dition is detected, or after the counter overflows.  
16.3 Functional Descriptions  
16.3.1  
Three-wire Mode  
The USI Three-wire mode is compliant to the Serial Peripheral Interface (SPI) mode 0 and 1, but  
does not have the slave select (SS) pin functionality. However, this feature can be implemented  
in software if necessary. Pin names used by this mode are: DI, DO, and USCK.  
Figure 16-2. Three-wire Mode Operation, Simplified Diagram  
DO  
DI  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
USCK  
SLAVE  
DO  
DI  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
USCK  
PORTxn  
MASTER  
Figure 16-2 on page 123 shows two USI units operating in Three-wire mode, one as Master and  
one as Slave. The two Shift Registers are interconnected in such way that after eight USCK  
clocks, the data in each register are interchanged. The same clock also increments the USI’s 4-  
bit counter. The Counter Overflow (interrupt) Flag, or USIOIF, can therefore be used to deter-  
mine when a transfer is completed. The clock is generated by the Master device software by  
toggling the USCK pin via the PORT Register or by writing a one to the USITC bit in USICR.  
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Figure 16-3. Three-wire Mode, Timing Diagram  
( Reference )  
1
2
3
4
5
6
7
8
CYCLE  
USCK  
USCK  
DO  
MSB  
MSB  
6
5
4
3
2
1
LSB  
LSB  
6
5
4
3
2
1
DI  
A
B
C
D
E
The Three-wire mode timing is shown in Figure 16-3 on page 124. At the top of the figure is a  
USCK cycle reference. One bit is shifted into the USI Shift Register (USIDR) for each of these  
cycles. The USCK timing is shown for both external clock modes. In External Clock mode 0  
(USICS0 = 0), DI is sampled at positive edges, and DO is changed (Data Register is shifted by  
one) at negative edges. External Clock mode 1 (USICS0 = 1) uses the opposite edges versus  
mode 0, i.e., samples data at negative and changes the output at positive edges. The USI clock  
modes corresponds to the SPI data mode 0 and 1.  
Referring to the timing diagram (Figure 16-3 on page 124), a bus transfer involves the following  
steps:  
1. The Slave device and Master device sets up its data output and, depending on the proto-  
col used, enables its output driver (mark A and B). The output is set up by writing the  
data to be transmitted to the Serial Data Register. Enabling of the output is done by set-  
ting the corresponding bit in the port Data Direction Register. Note that point A and B  
does not have any specific order, but both must be at least one half USCK cycle before  
point C where the data is sampled. This must be done to ensure that the data setup  
requirement is satisfied. The 4-bit counter is reset to zero.  
2. The Master generates a clock pulse by software toggling the USCK line twice (C and D).  
The bit value on the slave and master’s data input (DI) pin is sampled by the USI on the  
first edge (C), and the data output is changed on the opposite edge (D). The 4-bit counter  
will count both edges.  
3. Step 2 is repeated eight times for a complete register (byte) transfer.  
4. After eight clock pulses (i.e., 16 clock edges) the counter will overflow and indicate that  
the transfer is completed. The data bytes transferred must now be processed before a  
new transfer can be initiated. The overflow interrupt will wake up the processor if it is set  
to Idle mode. Depending of the protocol used the slave device can now set its output to  
high impedance.  
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16.3.2  
SPI Master Operation Example  
The following code demonstrates how to use the USI module as a SPI Master:  
SPITransfer:  
out  
ldi  
out  
ldi  
USIDR,r16  
r16,(1<<USIOIF)  
USISR,r16  
r16,(1<<USIWM0)|(1<<USICS1)|(1<<USICLK)|(1<<USITC)  
SPITransfer_loop:  
out  
in  
USICR,r16  
r16, USISR  
sbrs  
rjmp  
in  
r16, USIOIF  
SPITransfer_loop  
r16,USIDR  
ret  
The code is size optimized using only eight instructions (+ ret). The code example assumes that  
the DO and USCK pins are enabled as output in the DDRE Register. The value stored in register  
r16 prior to the function is called is transferred to the Slave device, and when the transfer is com-  
pleted the data received from the Slave is stored back into the r16 Register.  
The second and third instructions clears the USI Counter Overflow Flag and the USI counter  
value. The fourth and fifth instruction set Three-wire mode, positive edge Shift Register clock,  
count at USITC strobe, and toggle USCK. The loop is repeated 16 times.  
The following code demonstrates how to use the USI module as a SPI Master with maximum  
speed (fsck = fck/4):  
SPITransfer_Fast:  
out  
ldi  
ldi  
USIDR,r16  
r16,(1<<USIWM0)|(0<<USICS0)|(1<<USITC)  
r17,(1<<USIWM0)|(0<<USICS0)|(1<<USITC)|(1<<USICLK)  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
out  
USICR,r16 ; MSB  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16  
USICR,r17  
USICR,r16 ; LSB  
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out  
in  
USICR,r17  
r16,USIDR  
ret  
16.3.3  
SPI Slave Operation Example  
The following code demonstrates how to use the USI module as a SPI Slave:  
init:  
ldi  
out  
r16,(1<<USIWM0)|(1<<USICS1)  
USICR,r16  
...  
SlaveSPITransfer:  
out  
ldi  
out  
USIDR,r16  
r16,(1<<USIOIF)  
USISR,r16  
SlaveSPITransfer_loop:  
in  
r16, USISR  
sbrs  
rjmp  
in  
r16, USIOIF  
SlaveSPITransfer_loop  
r16,USIDR  
ret  
The code is size optimized using only eight instructions (+ ret). The code example assumes that  
the DO is configured as output and USCK pin is configured as input in the DDR Register. The  
value stored in register r16 prior to the function is called is transferred to the master device, and  
when the transfer is completed the data received from the Master is stored back into the r16  
Register.  
Note that the first two instructions is for initialization only and needs only to be executed  
once.These instructions sets Three-wire mode and positive edge Shift Register clock. The loop  
is repeated until the USI Counter Overflow Flag is set.  
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16.3.4  
Two-wire Mode  
The USI Two-wire mode is compliant to the Inter IC (TWI) bus protocol, but without slew rate lim-  
iting on outputs and input noise filtering. Pin names used by this mode are SCL and SDA.  
Figure 16-4. Two-wire Mode Operation, Simplified Diagram  
VCC  
SDA  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
SCL  
HOLD  
SCL  
Two-wire Clock  
Control Unit  
SLAVE  
SDA  
SCL  
Bit7  
Bit6  
Bit5  
Bit4  
Bit3  
Bit2  
Bit1  
Bit0  
PORTxn  
MASTER  
Figure 16-4 on page 127 shows two USI units operating in Two-wire mode, one as Master and  
one as Slave. It is only the physical layer that is shown since the system operation is highly  
dependent of the communication scheme used. The main differences between the Master and  
Slave operation at this level, is the serial clock generation which is always done by the Master,  
and only the Slave uses the clock control unit. Clock generation must be implemented in soft-  
ware, but the shift operation is done automatically by both devices. Note that only clocking on  
negative edge for shifting data is of practical use in this mode. The slave can insert wait states at  
start or end of transfer by forcing the SCL clock low. This means that the Master must always  
check if the SCL line was actually released after it has generated a positive edge.  
Since the clock also increments the counter, a counter overflow can be used to indicate that the  
transfer is completed. The clock is generated by the master by toggling the USCK pin via the  
PORT Register.  
The data direction is not given by the physical layer. A protocol, like the one used by the TWI-  
bus, must be implemented to control the data flow.  
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Figure 16-5. Two-wire Mode, Typical Timing Diagram  
SDA  
1 - 7  
8
9
1 - 8  
9
1 - 8  
9
SCL  
S
P
ADDRESS  
R/W  
ACK  
DATA  
ACK  
DATA  
ACK  
A
B
C
D
E
F
Referring to the timing diagram (Figure 16-5 on page 128), a bus transfer involves the following  
steps:  
1. The a start condition is generated by the Master by forcing the SDA low line while the  
SCL line is high (A). SDA can be forced low either by writing a zero to bit 7 of the Shift  
Register, or by setting the corresponding bit in the PORT Register to zero. Note that the  
Data Direction Register bit must be set to one for the output to be enabled. The slave  
device’s start detector logic (Figure 16-6 on page 128) detects the start condition and  
sets the USISIF Flag. The flag can generate an interrupt if necessary.  
2. In addition, the start detector will hold the SCL line low after the Master has forced an  
negative edge on this line (B). This allows the Slave to wake up from sleep or complete  
its other tasks before setting up the Shift Register to receive the address. This is done by  
clearing the start condition flag and reset the counter.  
3. The Master set the first bit to be transferred and releases the SCL line (C). The Slave  
samples the data and shift it into the Serial Register at the positive edge of the SCL  
clock.  
4. After eight bits are transferred containing slave address and data direction (read or  
write), the Slave counter overflows and the SCL line is forced low (D). If the slave is not  
the one the Master has addressed, it releases the SCL line and waits for a new start  
condition.  
5. If the Slave is addressed it holds the SDA line low during the acknowledgment cycle  
before holding the SCL line low again (i.e., the Counter Register must be set to 14 before  
releasing SCL at (D)). Depending of the R/W bit the Master or Slave enables its output. If  
the bit is set, a master read operation is in progress (i.e., the slave drives the SDA line)  
The slave can hold the SCL line low after the acknowledge (E).  
6. Multiple bytes can now be transmitted, all in same direction, until a stop condition is given  
by the Master (F). Or a new start condition is given.  
If the Slave is not able to receive more data it does not acknowledge the data byte it has last  
received. When the Master does a read operation it must terminate the operation by force the  
acknowledge bit low after the last byte transmitted.  
Figure 16-6. Start Condition Detector, Logic Diagram  
USISIF  
CLOCK  
HOLD  
D Q  
D Q  
SDA  
CLR  
CLR  
SCL  
Write( USISIF)  
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16.3.5  
Start Condition Detector  
The start condition detector is shown in Figure 16-6 on page 128. The SDA line is delayed (in  
the range of 50 to 300 ns) to ensure valid sampling of the SCL line. The start condition detector  
is only enabled in Two-wire mode.  
The start condition detector is working asynchronously and can therefore wake up the processor  
from the Power-down sleep mode. However, the protocol used might have restrictions on the  
SCL hold time. Therefore, when using this feature in this case the Oscillator start-up time set by  
the CKSEL Fuses (see ”Clock Systems and their Distribution” on page 25) must also be taken  
into the consideration. See the USISIF bit description in ”USISR – USI Status Register” on page  
130 for further details.  
16.3.6  
Clock speed considerations  
Maximum frequency for SCL and SCK is fCK /4. This is also the maximum data transmit and  
receieve rate in both two- and three-wire mode. In two-wire slave mode the Two-wire Clock Con-  
trol Unit will hold the SCL low until the slave is ready to receive more data. This may reduce the  
actual data rate in two-wire mode.  
16.4 Alternative USI Usage  
When the USI unit is not used for serial communication, it can be set up to do alternative tasks  
due to its flexible design.  
16.4.1  
16.4.2  
16.4.3  
16.4.4  
Half-duplex Asynchronous Data Transfer  
By utilizing the Shift Register in Three-wire mode, it is possible to implement a more compact  
and higher performance UART than by software only.  
4-bit Counter  
The 4-bit counter can be used as a stand-alone counter with overflow interrupt. Note that if the  
counter is clocked externally, both clock edges will generate an increment.  
12-bit Timer/Counter  
Combining the USI 4-bit counter and Timer/Counter0 allows them to be used as a 12-bit  
counter.  
Edge Triggered External Interrupt  
By setting the counter to maximum value (F) it can function as an additional external interrupt.  
The Overflow Flag and Interrupt Enable bit are then used for the external interrupt. This feature  
is selected by the USICS1 bit.  
16.4.5  
Software Interrupt  
The counter overflow interrupt can be used as a software interrupt triggered by a clock strobe.  
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16.5 Register Descriptions  
16.5.1  
USIBR – USI Data Buffer  
Bit  
7
MSB  
R
6
5
4
3
2
1
0
LSB  
R
0x10 (0x30)  
Read/Write  
Initial Value  
USIBR  
R
0
R
0
R
0
R
0
R
0
R
0
0
0
16.5.2  
USIDR – USI Data Register  
Bit  
7
6
5
4
3
2
1
0
0x0F (0x2F)  
Read/Write  
Initial Value  
MSB  
R/W  
0
LSB  
R/W  
0
USIDR  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The USI uses no buffering of the Serial Register, i.e., when accessing the Data Register  
(USIDR) the Serial Register is accessed directly. If a serial clock occurs at the same cycle the  
register is written, the register will contain the value written and no shift is performed. A (left) shift  
operation is performed depending of the USICS1..0 bits setting. The shift operation can be con-  
trolled by an external clock edge, by a Timer/Counter0 Compare Match, or directly by software  
using the USICLK strobe bit. Note that even when no wire mode is selected (USIWM1..0 = 0)  
both the external data input (DI/SDA) and the external clock input (USCK/SCL) can still be used  
by the Shift Register.  
The output pin in use, DO or SDA depending on the wire mode, is connected via the output latch  
to the most significant bit (bit 7) of the Data Register. The output latch is open (transparent) dur-  
ing the first half of a serial clock cycle when an external clock source is selected (USICS1 = 1),  
and constantly open when an internal clock source is used (USICS1 = 0). The output will be  
changed immediately when a new MSB written as long as the latch is open. The latch ensures  
that data input is sampled and data output is changed on opposite clock edges.  
Note that the corresponding Data Direction Register to the pin must be set to one for enabling  
data output from the Shift Register.  
16.5.3  
USISR – USI Status Register  
Bit  
7
6
USIOIF  
R/W  
0
5
USIPF  
R/W  
0
4
USIDC  
R
3
USICNT3  
R/W  
2
USICNT2  
R/W  
1
USICNT1  
R/W  
0
USICNT0  
R/W  
USISIF  
R/W  
0
USISR  
0x0E (0x2E)  
Read/Write  
Initial Value  
0
0
0
0
0
The Status Register contains Interrupt Flags, line Status Flags and the counter value.  
• Bit 7 – USISIF: Start Condition Interrupt Flag  
When Two-wire mode is selected, the USISIF Flag is set (to one) when a start condition is  
detected. When output disable mode or Three-wire mode is selected and (USICSx = 0b11 &  
USICLK = 0) or (USICS = 0b10 & USICLK = 0), any edge on the SCK pin sets the flag.  
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ATtiny24/44/84  
An interrupt will be generated when the flag is set while the USISIE bit in USICR and the Global  
Interrupt Enable Flag are set. The flag will only be cleared by writing a logical one to the USISIF  
bit. Clearing this bit will release the start detection hold of USCL in Two-wire mode.  
A start condition interrupt will wakeup the processor from all sleep modes.  
• Bit 6 – USIOIF: Counter Overflow Interrupt Flag  
This flag is set (one) when the 4-bit counter overflows (i.e., at the transition from 15 to 0). An  
interrupt will be generated when the flag is set while the USIOIE bit in USICR and the Global  
Interrupt Enable Flag are set. The flag is cleared if a one is written to the USIOIF bit or by read-  
ing the USIBR register. Clearing this bit will release the counter overflow hold of SCL in Two-  
wire mode.  
A counter overflow interrupt will wakeup the processor from Idle sleep mode.  
• Bit 5 – USIPF: Stop Condition Flag  
When Two-wire mode is selected, the USIPF Flag is set (one) when a stop condition is detected.  
The flag is cleared by writing a one to this bit. Note that this is not an Interrupt Flag. This signal is  
useful when implementing Two-wire bus master arbitration.  
• Bit 4 – USIDC: Data Output Collision  
This bit is logical one when bit 7 in the Shift Register differs from the physical pin value. The flag  
is only valid when Two-wire mode is used. This signal is useful when implementing Two-wire  
bus master arbitration.  
• Bits 3..0 – USICNT3..0: Counter Value  
These bits reflect the current 4-bit counter value. The 4-bit counter value can directly be read or  
written by the CPU.  
The 4-bit counter increments by one for each clock generated either by the external clock edge  
detector, by a Timer/Counter0 Compare Match, or by software using USICLK or USITC strobe  
bits. The clock source depends of the setting of the USICS1..0 bits. For external clock operation  
a special feature is added that allows the clock to be generated by writing to the USITC strobe  
bit. This feature is enabled by write a one to the USICLK bit while setting an external clock  
source (USICS1 = 1).  
Note that even when no wire mode is selected (USIWM1..0 = 0) the external clock input  
(USCK/SCL) are can still be used by the counter.  
16.5.4  
USICR – USI Control Register  
Bit  
7
USISIE  
R/W  
0
6
USIOIE  
R/W  
0
5
USIWM1  
R/W  
4
USIWM0  
R/W  
3
USICS1  
R/W  
0
2
USICS0  
R/W  
0
1
0
USITC  
W
0x0D (0x2D)  
Read/Write  
Initial Value  
USICLK  
USICR  
W
0
0
0
0
The Control Register includes interrupt enable control, wire mode setting, Clock Select setting,  
and clock strobe.  
• Bit 7 – USISIE: Start Condition Interrupt Enable  
Setting this bit to one enables the Start Condition detector interrupt. If there is a pending inter-  
rupt when the USISIE and the Global Interrupt Enable Flag is set to one, this will immediately be  
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executed. See the USISIF bit description in ”USISR – USI Status Register” on page 130 for fur-  
ther details.  
• Bit 6 – USIOIE: Counter Overflow Interrupt Enable  
Setting this bit to one enables the Counter Overflow interrupt. If there is a pending interrupt when  
the USIOIE and the Global Interrupt Enable Flag is set to one, this will immediately be executed.  
See the USIOIF bit description in ”USISR – USI Status Register” on page 130 for further details.  
• Bit 5..4 – USIWM1..0: Wire Mode  
These bits set the type of wire mode to be used. Basically only the function of the outputs are  
affected by these bits. Data and clock inputs are not affected by the mode selected and will  
always have the same function. The counter and Shift Register can therefore be clocked exter-  
nally, and data input sampled, even when outputs are disabled. The relations between  
USIWM1..0 and the USI operation is summarized in Table 16-1.  
Table 16-1. Relations between USIWM1..0 and the USI Operation  
USIWM1  
USIWM0  
Description  
Outputs, clock hold, and start detector disabled. Port pins operates as  
normal.  
0
0
Three-wire mode. Uses DO, DI, and USCK pins.  
The Data Output (DO) pin overrides the corresponding bit in the PORT  
Register in this mode. However, the corresponding DDR bit still controls the  
data direction. When the port pin is set as input the pins pull-up is controlled  
by the PORT bit.  
0
1
The Data Input (DI) and Serial Clock (USCK) pins do not affect the normal  
port operation. When operating as master, clock pulses are software  
generated by toggling the PORT Register, while the data direction is set to  
output. The USITC bit in the USICR Register can be used for this purpose.  
Two-wire mode. Uses SDA (DI) and SCL (USCK) pins(1)  
.
The Serial Data (SDA) and the Serial Clock (SCL) pins are bi-directional and  
uses open-collector output drives. The output drivers are enabled by setting  
the corresponding bit for SDA and SCL in the DDR Register.  
When the output driver is enabled for the SDA pin, the output driver will force  
the line SDA low if the output of the Shift Register or the corresponding bit in  
the PORT Register is zero. Otherwise the SDA line will not be driven (i.e., it is  
released). When the SCL pin output driver is enabled the SCL line will be  
forced low if the corresponding bit in the PORT Register is zero, or by the start  
detector. Otherwise the SCL line will not be driven.  
1
0
The SCL line is held low when a start detector detects a start condition and  
the output is enabled. Clearing the Start Condition Flag (USISIF) releases the  
line. The SDA and SCL pin inputs is not affected by enabling this mode. Pull-  
ups on the SDA and SCL port pin are disabled in Two-wire mode.  
Two-wire mode. Uses SDA and SCL pins.  
Same operation as for the Two-wire mode described above, except that the  
SCL line is also held low when a counter overflow occurs, and is held low until  
the Counter Overflow Flag (USIOIF) is cleared.  
1
1
Note:  
1. The DI and USCK pins are renamed to Serial Data (SDA) and Serial Clock (SCL) respectively  
to avoid confusion between the modes of operation.  
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• Bit 3..2 – USICS1..0: Clock Source Select  
These bits set the clock source for the Shift Register and counter. The data output latch ensures  
that the output is changed at the opposite edge of the sampling of the data input (DI/SDA) when  
using external clock source (USCK/SCL). When software strobe or Timer/Counter0 Compare  
Match clock option is selected, the output latch is transparent and therefore the output is  
changed immediately. Clearing the USICS1..0 bits enables software strobe option. When using  
this option, writing a one to the USICLK bit clocks both the Shift Register and the counter. For  
external clock source (USICS1 = 1), the USICLK bit is no longer used as a strobe, but selects  
between external clocking and software clocking by the USITC strobe bit.  
Table 16-2 on page 133 shows the relationship between the USICS1..0 and USICLK setting and  
clock source used for the Shift Register and the 4-bit counter.  
Table 16-2. Relations between the USICS1..0 and USICLK Setting  
USICS1  
USICS0  
USICLK  
Shift Register Clock Source  
4-bit Counter Clock Source  
0
0
0
No Clock  
No Clock  
Software clock strobe  
(USICLK)  
Software clock strobe  
(USICLK)  
0
0
0
1
1
Timer/Counter0 Compare  
Match  
Timer/Counter0 Compare  
Match  
X
1
1
1
1
0
1
0
1
0
0
1
1
External, positive edge  
External, negative edge  
External, positive edge  
External, negative edge  
External, both edges  
External, both edges  
Software clock strobe (USITC)  
Software clock strobe (USITC)  
• Bit 1 – USICLK: Clock Strobe  
Writing a one to this bit location strobes the Shift Register to shift one step and the counter to  
increment by one, provided that the USICS1..0 bits are set to zero and by doing so the software  
clock strobe option is selected. The output will change immediately when the clock strobe is exe-  
cuted, i.e., in the same instruction cycle. The value shifted into the Shift Register is sampled the  
previous instruction cycle. The bit will be read as zero.  
When an external clock source is selected (USICS1 = 1), the USICLK function is changed from  
a clock strobe to a Clock Select Register. Setting the USICLK bit in this case will select the  
USITC strobe bit as clock source for the 4-bit counter (see Table 16-2 on page 133).  
• Bit 0 – USITC: Toggle Clock Port Pin  
Writing a one to this bit location toggles the USCK/SCL value either from 0 to 1, or from 1 to 0.  
The toggling is independent of the setting in the Data Direction Register, but if the PORT value is  
to be shown on the pin the DDRE4 must be set as output (to one). This feature allows easy clock  
generation when implementing master devices. The bit will be read as zero.  
When an external clock source is selected (USICS1 = 1) and the USICLK bit is set to one, writ-  
ing to the USITC strobe bit will directly clock the 4-bit counter. This allows an early detection of  
when the transfer is done when operating as a master device.  
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17. Analog Comparator  
The Analog Comparator compares the input values on the positive pin AIN0 and negative pin  
AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on the negative pin  
AIN1, the Analog Comparator output, ACO, is set. The comparator can trigger a separate inter-  
rupt, exclusive to the Analog Comparator. The user can select Interrupt triggering on comparator  
output rise, fall or toggle. A block diagram of the comparator and its surrounding logic is shown  
in Figure 17-1 on page 134.  
Figure 17-1. Analog Comparator Block Diagram(1)  
BANDGAP  
REFERENCE  
ACBG  
ACME  
ADEN  
ADC MULTIPLEXER  
OUTPUT(1)  
Notes: 1. See Table 17-1 on page 135.  
2. See Figure 1-1 on page 2 and Table 12-9 on page 70 for Analog Comparator pin placement.  
17.1 Analog Comparator Multiplexed Input  
When the Analog to Digital Converter (ADC) is configurated as single ended input channel, it is  
possible to select any of the ADC7..0 pins to replace the negative input to the Analog Compara-  
tor. The ADC multiplexer is used to select this input, and consequently, the ADC must be  
switched off to utilize this feature. If the Analog Comparator Multiplexer Enable bit (ACME in  
ADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is zero), MUX1..0 in ADMUX  
select the input pin to replace the negative input to the Analog Comparator, as shown in Table  
17-1. If ACME is cleared or ADEN is set, AIN1 is applied to the negative input to the Analog  
Comparator.  
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Table 17-1. Analog Comparator Multiplexed Input  
ACME  
ADEN  
MUX4..0  
xx  
Analog Comparator Negative Input  
0
1
1
1
1
1
1
1
1
1
x
1
0
0
0
0
0
0
0
0
AIN1  
xx  
AIN1  
00000  
00001  
00010  
00011  
00100  
00101  
00110  
00111  
ADC0  
ADC1  
ADC2  
ADC3  
ADC4  
ADC5  
ADC6  
ADC7  
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17.2 Register Description  
17.2.1  
ADCSRB – ADC Control and Status Register B  
Bit  
7
6
ACME  
R/W  
0
5
4
ADLAR  
R/w  
3
2
ADTS2  
R/W  
0
1
ADTS1  
R/W  
0
0
ADTS0  
R/W  
0
0x03 (0x23)  
Read/Write  
Initial Value  
BIN  
R/W  
0
ADCSRB  
R
0
R
0
0
• Bit 6 – ACME: Analog Comparator Multiplexer Enable  
When this bit is written logic one and the ADC is switched off (ADEN in ADCSRA is zero), the  
ADC multiplexer selects the negative input to the Analog Comparator. When this bit is written  
logic zero, AIN1 is applied to the negative input of the Analog Comparator. For a detailed  
description of this bit, see ”Analog Comparator Multiplexed Input” on page 134.  
17.2.2  
ACSR – Analog Comparator Control and Status Register  
Bit  
0x08 (0x28)  
7
6
5
4
3
ACIE  
R/W  
0
2
ACIC  
R/W  
0
1
ACIS1  
R/W  
0
0
ACIS0  
R/W  
0
ACD  
ACBG  
ACO  
ACI  
R/W  
0
ACSR  
Read/Write  
Initial Value  
R/W  
0
R/W  
0
R/W  
N/A  
• Bit 7 – ACD: Analog Comparator Disable  
When this bit is written logic one, the power to the Analog Comparator is switched off. This bit  
can be set at any time to turn off the Analog Comparator. This will reduce power consumption in  
Active and Idle mode. When changing the ACD bit, the Analog Comparator Interrupt must be  
disabled by clearing the ACIE bit in ACSR. Otherwise an interrupt can occur when the bit is  
changed.  
• Bit 6 – ACBG: Analog Comparator Bandgap Select  
When this bit is set, a fixed bandgap reference voltage replaces the positive input to the Analog  
Comparator. When this bit is cleared, AIN0 is applied to the positive input of the Analog  
Comparator.  
• Bit 5 – ACO: Analog Comparator Output  
The output of the Analog Comparator is synchronized and then directly connected to ACO. The  
synchronization introduces a delay of 1 - 2 clock cycles.  
• Bit 4 – ACI: Analog Comparator Interrupt Flag  
This bit is set by hardware when a comparator output event triggers the interrupt mode defined  
by ACIS1 and ACIS0. The Analog Comparator interrupt routine is executed if the ACIE bit is set  
and the I-bit in SREG is set. ACI is cleared by hardware when executing the corresponding inter-  
rupt handling vector. Alternatively, ACI is cleared by writing a logic one to the flag.  
• Bit 3 – ACIE: Analog Comparator Interrupt Enable  
When the ACIE bit is written logic one and the I-bit in the Status Register is set, the Analog Com-  
parator interrupt is activated. When written logic zero, the interrupt is disabled.  
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• Bit 2 – ACIC: Analog Comparator Input Capture Enable  
When written logic one, this bit enables the input capture function in Timer/Counter1 to be trig-  
gered by the Analog Comparator. The comparator output is in this case directly connected to the  
input capture front-end logic, making the comparator utilize the noise canceler and edge select  
features of the Timer/Counter1 Input Capture interrupt. When written logic zero, no connection  
between the Analog Comparator and the input capture function exists. To make the comparator  
trigger the Timer/Counter1 Input Capture inter-rupt, the ICIE1 bit in the Timer Interrupt Mask  
Register (TIMSK1) must be set.  
• Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode Select  
These bits determine which comparator events that trigger the Analog Comparator interrupt. The  
different settings are shown in Table 17-2.  
Table 17-2. ACIS1/ACIS0 Settings  
ACIS1  
ACIS0  
Interrupt Mode  
0
0
1
1
0
1
0
1
Comparator Interrupt on Output Toggle.  
Reserved  
Comparator Interrupt on Falling Output Edge.  
Comparator Interrupt on Rising Output Edge.  
When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be disabled by  
clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt can occur when the  
bits are changed.  
17.2.3  
DIDR0 – Digital Input Disable Register 0  
Bit  
0x01 (0x21)  
7
6
5
ADC5D  
R/W  
0
4
ADC4D  
R/W  
0
3
ADC3D  
R/W  
0
2
ADC2D  
R/W  
0
1
ADC1D  
R/W  
0
0
ADC0D  
R/W  
0
ADC7D  
ADC6D  
R/W  
0
DIDR0  
Read/Write  
Initial Value  
R/W  
0
• Bits 1, 0 – ADC0D,ADC1D: ADC 1/0 Digital input buffer disable  
When this bit is written logic one, the digital input buffer on the AIN1/0 pin is disabled. The corre-  
sponding PIN Register bit will always read as zero when this bit is set. When an analog signal is  
applied to the AIN1/0 pin and the digital input from this pin is not needed, this bit should be writ-  
ten logic one to reduce power consumption in the digital input buffer.  
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18. Analog to Digital Converter  
18.1 Features  
10-bit Resolution  
1.0 LSB Integral Non-linearity  
± 2 LSB Absolute Accuracy  
65 - 260 µs Conversion Time  
Up to 76 kSPS at Maximum Resolution  
Eight Multiplexed Single Ended Input Channels  
Twelve differential input channels with selectable gain (1x, 20x)  
Temperature sensor input channel  
Optional Left Adjustment for ADC Result Readout  
0 - VCC ADC Input Voltage Range  
1.1V ADC Reference Voltage  
Free Running or Single Conversion Mode  
ADC Start Conversion by Auto Triggering on Interrupt Sources  
Interrupt on ADC Conversion Complete  
Sleep Mode Noise Canceler  
Unipolar / Bipolar Input Mode  
Input Polarity Reversal channels  
18.2 Overview  
The ATtiny24/44/84 features a 10-bit successive approximation ADC. The ADC is connected to  
8-pin port A for external sources. In addition to external sources internal temperature sensor can  
be measured by ADC. Analog Multiplexer allows eight single-ended channels or 12 differential  
channels from Port A. The programmable gain stage provides ampification steps 0 dB (1x) and  
26 dB (20x) for 12 differential ADC channels.  
The ADC contains a Sample and Hold circuit which ensures that the input voltage to the ADC is  
held at a constant level during conversion. A block diagram of the ADC is shown in Figure 18-1  
on page 139.  
Internal reference voltage of nominally 1.1V is provided On-chip. Alternatively, VCC can be used  
as reference voltage for single ended channels. There is also an option to use an external volt-  
age reference and turn-off the internal voltage reference.  
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Figure 18-1. Analog to Digital Converter Block Schematic  
ADC CONVERSION  
COMPLETE IRQ  
INTERRUPT  
FLAGS  
ADTS2...ADTS0  
8-BIT DATA BUS  
15  
0
ADC CTRL. & STATUS B  
REGISTER (ADCSRB)  
ADC CTRL. & STATUS A  
REGISTER (ADCSRA)  
ADC MULTIPLEXER  
SELECT (ADMUX)  
ADC DATA REGISTER  
(ADCH/ADCL)  
BIN  
IPR  
TRIGGER  
SELECT  
AREF  
MUX DECODER  
PRESCALER  
START  
V
CC  
CONVERSION LOGIC  
INTERNAL  
REFERENCE  
1.1V  
TEMPERATURE  
SENSOR  
SAMPLE & HOLD  
COMPARATOR  
10-BIT DAC  
-
+
ADC8  
AGND  
SINGLE ENDED / DIFFERENTIAL SELECTION  
ADC7  
ADC MULTIPLEXER  
OUTPUT  
ADC6  
ADC5  
ADC4  
ADC3  
ADC2  
ADC1  
ADC0  
POS.  
INPUT  
MUX  
+
-
GAIN  
AMPLIFIER  
NEG.  
INPUT  
MUX  
18.3 ADC Operation  
The ADC converts an analog input voltage to a 10-bit digital value through successive approxi-  
mation. The minimum value represents GND and the maximum value represents the reference  
voltage.The voltage reference for the ADC may be selected by writing to the REFS1..0 bits in  
ADMUX. The VCC supply, the AREF pin or an internal 1.1V voltage reference may be selected  
as the ADC voltage reference.  
The analog input channel and differential gain are selected by writing to the MUX5..0 bits in  
ADMUX. Any of the eight ADC input pins ADC7..0 can be selected as single ended inputs to the  
ADC. For differential measurements all analog inputs next to each other can be selected as a  
input pair. Every input is also possible to measure with ADC3. These pairs of differential inputs  
are measured by ADC trough the differential gain amplifier.  
If differential channels are selected, the differential gain stage amplifies the voltage difference  
between the selected input pair by the selected gain factor, 1x or 20x, according to the setting of  
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the MUX0 bit in ADMUX. This amplified value then becomes the analog input to the ADC. If sin-  
gle ended channels are used, the gain amplifier is bypassed altogether.  
The offset of the differential channels can be measure by selecting the same input for both neg-  
ative and positive input. Offset calibration can be done for ADC0, ADC3 and ADC7. When ADC0  
or ADC3 or ADC7 is selected as both the positive and negative input to the differential gain  
amplifier , the remaining offset in the gain stage and conversion circuitry can be measured  
directly as the result of the conversion. This figure can be subtracted from subsequent conver-  
sions with the same gain setting to reduce offset error to below 1 LSB.  
The on-chip temperature sensor is selected by writing the code “100010” to the MUX5..0 bits in  
ADMUX register.  
The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Voltage reference and  
input channel selections will not go into effect until ADEN is set. The ADC does not consume  
power when ADEN is cleared, so it is recommended to switch off the ADC before entering power  
saving sleep modes.  
The ADC generates a 10-bit result which is presented in the ADC Data Registers, ADCH and  
ADCL. By default, the result is presented right adjusted, but can optionally be presented left  
adjusted by setting the ADLAR bit in ADCSRB.  
If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read  
ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content of the data  
registers belongs to the same conversion. Once ADCL is read, ADC access to data registers is  
blocked. This means that if ADCL has been read, and a conversion completes before ADCH is  
read, neither register is updated and the result from the conversion is lost. When ADCH is read,  
ADC access to the ADCH and ADCL Registers is re-enabled.  
The ADC has its own interrupt which can be triggered when a conversion completes. When ADC  
access to the data registers is prohibited between reading of ADCH and ADCL, the interrupt will  
trigger even if the result is lost.  
18.4 Starting a Conversion  
A single conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC.  
This bit stays high as long as the conversion is in progress and will be cleared by hardware  
when the conversion is completed. If a different data channel is selected while a conversion is in  
progress, the ADC will finish the current conversion before performing the channel change.  
Alternatively, a conversion can be triggered automatically by various sources. Auto Triggering is  
enabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The trigger source is  
selected by setting the ADC Trigger Select bits, ADTS in ADCSRB (see description of the ADTS  
bits for a list of the trigger sources). When a positive edge occurs on the selected trigger signal,  
the ADC prescaler is reset and a conversion is started. This provides a method of starting con-  
versions at fixed intervals. If the trigger signal still is set when the conversion completes, a new  
conversion will not be started. If another positive edge occurs on the trigger signal during con-  
version, the edge will be ignored. Note that an Interrupt Flag will be set even if the specific  
interrupt is disabled or the Global Interrupt Enable bit in SREG is cleared. A conversion can thus  
be triggered without causing an interrupt. However, the Interrupt Flag must be cleared in order to  
trigger a new conversion at the next interrupt event.  
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Figure 18-2. ADC Auto Trigger Logic  
ADTS[2:0]  
PRESCALER  
CLKADC  
START  
ADIF  
ADATE  
SOURCE 1  
.
.
.
CONVERSION  
LOGIC  
.
EDGE  
DETECTOR  
SOURCE n  
ADSC  
Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion as soon  
as the ongoing conversion has finished. The ADC then operates in Free Running mode, con-  
stantly sampling and updating the ADC Data Register. The first conversion must be started by  
writing a logical one to the ADSC bit in ADCSRA. In this mode the ADC will perform successive  
conversions independently of whether the ADC Interrupt Flag, ADIF is cleared or not.  
If Auto Triggering is enabled, single conversions can be started by writing ADSC in ADCSRA to  
one. ADSC can also be used to determine if a conversion is in progress. The ADSC bit will be  
read as one during a conversion, independently of how the conversion was started.  
18.5 Prescaling and Conversion Timing  
Figure 18-3. ADC Prescaler  
ADEN  
START  
Reset  
7-BIT ADC PRESCALER  
CK  
ADPS0  
ADPS1  
ADPS2  
ADC CLOCK SOURCE  
By default, the successive approximation circuitry requires an input clock frequency between 50  
kHz and 200 kHz to get maximum resolution. If a lower resolution than 10 bits is needed, the  
input clock frequency to the ADC can be higher than 200 kHz to get a higher sample rate.  
The ADC module contains a prescaler, which generates an acceptable ADC clock frequency  
from any CPU frequency above 100 kHz. The prescaling is set by the ADPS bits in ADCSRA.  
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The prescaler starts counting from the moment the ADC is switched on by setting the ADEN bit  
in ADCSRA. The prescaler keeps running for as long as the ADEN bit is set, and is continuously  
reset when ADEN is low.  
When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the conversion  
starts at the following rising edge of the ADC clock cycle.  
A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is switched  
on (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize the analog circuitry.  
The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal conver-  
sion and 14.5 ADC clock cycles after the start of an first conversion. When a conversion is  
complete, the result is written to the ADC Data Registers, and ADIF is set. In Single Conversion  
mode, ADSC is cleared simultaneously. The software may then set ADSC again, and a new  
conversion will be initiated on the first rising ADC clock edge.  
When Auto Triggering is used, the prescaler is reset when the trigger event occurs. This assures  
a fixed delay from the trigger event to the start of conversion. In this mode, the sample-and-hold  
takes place two ADC clock cycles after the rising edge on the trigger source signal. Three addi-  
tional CPU clock cycles are used for synchronization logic.  
In Free Running mode, a new conversion will be started immediately after the conversion com-  
pletes, while ADSC remains high. For a summary of conversion times, see Table 18-1 on page  
143.  
Figure 18-4. ADC Timing Diagram, First Conversion (Single Conversion Mode)  
Next  
First Conversion  
Conversion  
Cycle Number  
1
2
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
1
2
3
ADC Clock  
ADEN  
ADSC  
ADIF  
Sign and MSB of Result  
LSB of Result  
ADCH  
ADCL  
MUX and REFS  
Update  
Conversion  
Complete  
MUX and REFS  
Update  
Sample & Hold  
Figure 18-5. ADC Timing Diagram, Single Conversion  
One Conversion  
Next Conversion  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
1
2
3
Cycle Number  
ADC Clock  
ADSC  
ADIF  
ADCH  
Sign and MSB of Result  
LSB of Result  
ADCL  
Sample & Hold  
Conversion  
Complete  
MUX and REFS  
Update  
MUX and REFS  
Update  
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Figure 18-6. ADC Timing Diagram, Auto Triggered Conversion  
One Conversion  
Next Conversion  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
1
2
Cycle Number  
ADC Clock  
Trigger  
Source  
ADATE  
ADIF  
ADCH  
ADCL  
Sign and MSB of Result  
LSB of Result  
Sample &  
Hold  
Prescaler  
Reset  
Conversion  
Complete  
Prescaler  
Reset  
MUX and REFS  
Update  
Figure 18-7. ADC Timing Diagram, Free Running Conversion  
One Conversion  
Next Conversion  
11  
12  
13  
1
2
3
4
Cycle Number  
ADC Clock  
ADSC  
ADIF  
ADCH  
ADCL  
Sign and MSB of Result  
LSB of Result  
Sample & Hold  
MUX and REFS  
Update  
Conversion  
Complete  
Table 18-1. ADC Conversion Time  
Sample & Hold (Cycles from  
Start of Conversion)  
Condition  
Conversion Time (Cycles)  
First conversion  
14.5  
1.5  
2
25  
13  
Normal conversions  
Auto Triggered conversions  
13.5  
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18.6 Changing Channel or Reference Selection  
The MUX5:0 and REFS1:0 bits in the ADMUX Register are single buffered through a temporary  
register to which the CPU has random access. This ensures that the channels and reference  
selection only takes place at a safe point during the conversion. The channel and reference  
selection is continuously updated until a conversion is started. Once the conversion starts, the  
channel and reference selection is locked to ensure a sufficient sampling time for the ADC. Con-  
tinuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF in  
ADCSRA is set). Note that the conversion starts on the following rising ADC clock edge after  
ADSC is written. The user is thus advised not to write new channel or reference selection values  
to ADMUX until one ADC clock cycle after ADSC is written.  
If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Special  
care must be taken when updating the ADMUX Register, in order to control which conversion  
will be affected by the new settings.  
If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If the  
ADMUX Register is changed in this period, the user cannot tell if the next conversion is based  
on the old or the new settings. ADMUX can be safely updated in the following ways:  
a. When ADATE or ADEN is cleared.  
b. During conversion, minimum one ADC clock cycle after the trigger event.  
c. After a conversion, before the Interrupt Flag used as trigger source is cleared.  
When updating ADMUX in one of these conditions, the new settings will affect the next ADC  
conversion.  
18.6.1  
ADC Input Channels  
When changing channel selections, the user should observe the following guidelines to ensure  
that the correct channel is selected:  
In Single Conversion mode, always select the channel before starting the conversion. The chan-  
nel selection may be changed one ADC clock cycle after writing one to ADSC. However, the  
simplest method is to wait for the conversion to complete before changing the channel selection.  
In Free Running mode, always select the channel before starting the first conversion. The chan-  
nel selection may be changed one ADC clock cycle after writing one to ADSC. However, the  
simplest method is to wait for the first conversion to complete, and then change the channel  
selection. Since the next conversion has already started automatically, the next result will reflect  
the previous channel selection. Subsequent conversions will reflect the new channel selection.  
18.6.2  
ADC Voltage Reference  
The reference voltage for the ADC (VREF) indicates the conversion range for the ADC. Single  
ended channels that exceed VREF will result in codes close to 0x3FF. VREF can be selected as  
either VCC, or internal 1.1V reference, or external AREF pin. The first ADC conversion result  
after switching reference voltage source may be inaccurate, and the user is advised to discard  
this result.  
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18.7 ADC Noise Canceler  
The ADC features a noise canceler that enables conversion during sleep mode to reduce noise  
induced from the CPU core and other I/O peripherals. The noise canceler can be used with ADC  
Noise Reduction and Idle mode. To make use of this feature, the following procedure should be  
used:  
a. Make sure that the ADC is enabled and is not busy converting. Single Conversion  
mode must be selected and the ADC conversion complete interrupt must be enabled.  
b. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion  
once the CPU has been halted.  
c. If no other interrupts occur before the ADC conversion completes, the ADC interrupt  
will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If  
another interrupt wakes up the CPU before the ADC conversion is complete, that  
interrupt will be executed, and an ADC Conversion Complete interrupt request will be  
generated when the ADC conversion completes. The CPU will remain in active mode  
until a new sleep command is executed.  
Note that the ADC will not be automatically turned off when entering other sleep modes than Idle  
mode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before enter-  
ing such sleep modes to avoid excessive power consumption.  
18.7.1  
Analog Input Circuitry  
The analog input circuitry for single ended channels is illustrated in Figure 18-8 on page 145. An  
analog source applied to ADCn is subjected to the pin capacitance and input leakage of that pin,  
regardless of whether that channel is selected as input for the ADC. When the channel is  
selected, the source must drive the S/H capacitor through the series resistance (combined resis-  
tance in the input path).  
The ADC is optimized for analog signals with an output impedance of approximately 10 kΩ or  
less. If such a source is used, the sampling time will be negligible. If a source with higher imped-  
ance is used, the sampling time will depend on how long time the source needs to charge the  
S/H capacitor, with can vary widely. The user is recommended to only use low impedant sources  
with slowly varying signals, since this minimizes the required charge transfer to the S/H  
capacitor.  
Signal components higher than the Nyquist frequency (fADC/2) should not be present to avoid  
distortion from unpredictable signal convolution. The user is advised to remove high frequency  
components with a low-pass filter before applying the signals as inputs to the ADC.  
Figure 18-8. Analog Input Circuitry  
IIH  
ADCn  
1..100 kΩ  
CS/H= 14 pF  
IIL  
VCC/2  
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18.7.2  
Analog Noise Canceling Techniques  
Digital circuitry inside and outside the device generates EMI which might affect the accuracy of  
analog measurements. If conversion accuracy is critical, the noise level can be reduced by  
applying the following techniques:  
a. Keep analog signal paths as short as possible. Make sure analog tracks run over the  
analog ground plane, and keep them well away from high-speed switching digital  
tracks.  
b. Use the ADC noise canceler function to reduce induced noise from the CPU.  
c. If any port pins are used as digital outputs, it is essential that these do not switch  
while a conversion is in progress.  
18.7.3  
ADC Accuracy Definitions  
An n-bit single-ended ADC converts a voltage linearly between GND and VREF in 2n steps  
(LSBs). The lowest code is read as 0, and the highest code is read as 2n-1.  
Several parameters describe the deviation from the ideal behavior:  
• Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal transition (at  
0.5 LSB). Ideal value: 0 LSB.  
Figure 18-9. Offset Error  
Output Code  
Ideal ADC  
Actual ADC  
Offset  
Error  
VREF  
Input Voltage  
• Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the last  
transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below maximum).  
Ideal value: 0 LSB  
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Figure 18-10. Gain Error  
Gain  
Error  
Output Code  
Ideal ADC  
Actual ADC  
VREF  
Input Voltage  
• Integral Non-linearity (INL): After adjusting for offset and gain error, the INL is the maximum  
deviation of an actual transition compared to an ideal transition for any code. Ideal value: 0  
LSB.  
Figure 18-11. Integral Non-linearity (INL)  
Output Code  
Ideal ADC  
Actual ADC  
V
Input Voltage  
REF  
• Differential Non-linearity (DNL): The maximum deviation of the actual code width (the interval  
between two adjacent transitions) from the ideal code width (1 LSB). Ideal value: 0 LSB.  
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Figure 18-12. Differential Non-linearity (DNL)  
Output Code  
0x3FF  
1 LSB  
DNL  
0x000  
0
VREF Input Voltage  
• Quantization Error: Due to the quantization of the input voltage into a finite number of codes, a  
range of input voltages (1 LSB wide) will code to the same value. Always ± 0.5 LSB.  
• Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition compared to  
an ideal transition for any code. This is the compound effect of offset, gain error, differential  
error, non-linearity, and quantization error. Ideal value: ± 0.5 LSB.  
18.8 ADC Conversion Result  
After the conversion is complete (ADIF is high), the conversion result can be found in the ADC  
Result Registers (ADCL, ADCH). The form of the conversion result depends on the type of the  
conversio as there are three types of conversions: single ended conversion, unipolar differential  
conversion and bipolar differential conversion.  
18.8.1  
Single Ended Conversion  
For single ended conversion, the result is  
V
1024  
IN  
ADC = -----------------------------  
V
REF  
where VIN is the voltage on the selected input pin and VREF the selected voltage reference (see  
Table 18-3 on page 150 and Table 18-4 on page 151). 0x000 represents analog ground, and  
0x3FF represents the selected reference voltage minus one LSB. The result is presented in one-  
sided form, from 0x3FF to 0x000.  
18.8.2  
Unipolar Differential Conversion  
If differential channels and an unipolar input mode are used, the result is  
(V  
V  
)
NEG  
1024  
POS  
----------------------------------------------------------  
ADC =  
GAIN  
V
REF  
where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative input pin,  
and VREF the selected voltage reference. The voltage of the positive pin must always be larger  
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than the voltage of the negative pin or otherwise the voltage difference is saturated to zero. The  
result is presented in one-sided form, from 0x000 (0d) through 0x3FF (+1023d). The GAIN is  
either 1x or 20x.  
18.8.3  
Bipolar Differential Conversion  
If differential channels and a bipolar input mode are used, the result is  
(V  
V  
)
NEG  
512  
POS  
-------------------------------------------------------  
ADC =  
GAIN  
V
REF  
where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative input pin,  
and VREF the selected voltage reference. The result is presented in two’s complement form, from  
0x200 (-512d) through 0x1FF (+511d). The GAIN is either 1x or 20x. Note that if the user wants  
to perform a quick polarity check of the result, it is sufficient to read the MSB of the result (ADC9  
in ADCH). If the bit is one, the result is negative, and if this bit is zero, the result is positive.  
As default the ADC converter operates in the unipolar input mode, but the bipolar input mode  
can be selected by writting the BIN bit in the ADCSRB to one. In the bipolar input mode two-  
sided voltage differences are allowed and thus the voltage on the negative input pin can also be  
larger than the voltage on the positive input pin.  
18.9 Temperature Measurement  
The temperature measurement is based on an on-chip temperature sensor that is coupled to a  
single ended ADC8 channel. Selecting the ADC8 channel by writing the MUX5:0 bits in ADMUX  
register to “100010” enables the temperature sensor. The internal 1.1V reference must also be  
selected for the ADC reference source in the temperature sensor measurement. When the tem-  
perature sensor is enabled, the ADC converter can be used in single conversion mode to  
measure the voltage over the temperature sensor. The measured voltage has a linear relation-  
ship to the temperature as described in Table 51. The voltage sensitivity is approximately 1 mV /  
°C and the accuracy of the temperature measurement is +/- 10° C after offset calibration. Band-  
gap is always calibrated and its accuracy is only guaranteed between 1.0V and 1.2V  
Table 18-2. Temperature vs. Sensor Output Voltage (Typical Case)  
Temperature / °C  
-40 °C  
+25 °C  
+85 °C  
+125 °C  
Voltage / mV  
243 mV  
314 mv  
380 mV  
424 mV  
The values described in Table 18-2 on page 149 are typical values. However, due to the process  
variation the temperature sensor output voltage varies from one chip to another. To be capable  
of achieving more accurate results the temperature measurement can be calibrated in the appli-  
cation software. The software calibration requires that a calibration value is measured and  
stored in a register or EEPROM for each chip, as a part of the production test. The sofware cali-  
bration can be done utilizing the formula:  
T = {[(ADCH << 8) | ADCL] - TOS} / k  
where ADCn are the ADC data registers, k is a fixed coefficient and TOS is the temperature sen-  
sor offset value determined and stored into EEPROM as a part of the production test.To obtain  
best accuracy the coefficient k should be measured using two temperature calibrations. Using  
offset calibration, set k = 1.0, where k = (1024*1.07mV/°C)/1.1V~1.0 [1/° C].  
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18.10 Register Description  
18.10.1 ADMUX – ADC Multiplexer Selection Register  
Bit  
7
REFS1  
R/W  
0
6
REFS0  
R/W  
0
5
MUX5  
R/W  
0
4
MUX4  
R/W  
0
3
MUX3  
R/W  
0
2
MUX2  
R/W  
0
1
MUX1  
R/W  
0
0
MUX0  
R/W  
0
0x07 (0x27)  
Read/Write  
Initial Value  
ADMUX  
• Bit 7:6 – REFS1:REFS0: Reference Selection Bits  
These bits select the voltage reference for the ADC, as shown in Table 18-3 on page 150. If  
these bits are changed during a conversion, the change will not go in effect until this conversion  
is complete (ADIF in ADCSR is set).  
Special care should be taken when changing differential channels. Once a differential channel  
has been selected, the stage may take as much as 25 ADC clock cycles to stabilize to the new  
value. Thus conversions should not be started within the first 13 clock cycles after selecting a  
new differential channel. Alternatively, conversion results obtained within this period should be  
discarded.  
The same settling time should be observed for the first differential conversion after changing  
ADC reference (by changing the REFS1:0 bits in ADMUX).  
If channels where differential gain is used ie. the gainstage, using VCC or an optional external  
AREF higher than (VCC - 1V) is not recommended, as this will affect ADC accuracy. It is not  
allowed to connect internal voltage reference to AREF pin, if an external voltage is being applied  
to it already. Internal voltage reference is connected AREF pin when REFS1:0 is set to value  
‘11’.  
Table 18-3. Voltage Reference Selections for ADC  
REFS1  
REFS0  
Voltage Reference Selection  
0
0
VCC used as analog reference, disconnected from PA0 (AREF).  
External Voltage Reference at PA0 (AREF) pin, Internal Voltage Reference  
turned off.  
0
1
1
1
0
1
Internal 1.1V Voltage Reference.  
Reserved.  
• Bits 5:0 – MUX5:0: Analog Channel and Gain Selection Bits  
The value of these bits selects which combination of analog inputs are connected to the ADC. In  
case of differential input , gain selection is also made with these bits. Selections on Table 18-4  
on page 151 show values for single endid channels and where the the differential channels as  
well as the offset calibration selections are located. Selecting the single-ended channel ADC8  
enables the temperature measurement. See Table 18-4 on page 151 for details. If these bits are  
changed during a conversion, the change will not go into effect until this conversion is complete  
(ADIF in ADCSRA is set).  
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Table 18-4. Single Endid Input channel Selections.  
Single Ended Input  
ADC0 (PA0)  
MUX5..0  
000000  
ADC1 (PA1)  
000001  
ADC2 (PA2)  
000010  
ADC3 (PA3)  
000011  
ADC4 (PA4)  
000100  
ADC5 (PA5)  
000101  
ADC6 (PA6)  
000110  
ADC7 (PA7)  
000111  
Reserved for differential channels(1)  
001000 - 011111  
100000  
0V (AGND)  
1.1V (I Ref)  
100001  
ADC8(2)  
100010  
Reserved for offset calibration(3)  
Reserved for reversal differential channels(1)  
100011 - 100111  
101000 - 111111  
Notes: 1. See Table 18-5 on page 152 for details.  
2. ”Temperature Measurement” on page 149  
3. For offset calibration only .See Table 18-5 on page 152 and ”ADC Operation” on page 139  
See Table 18-5 on page 152 for details of selections of differential input channel selections as  
well as selections of offset calibration channels. MUX0 bit works as a gain selection bit for differ-  
ential channels shown in Table 18-5 on page 152. When MUX0 bit is cleared (‘0’) 1x gain is  
selected and when it is set (‘1’) 20x gain is selected. For normal differential channel pairs MUX5  
bit work as a polarity reversal bit. Togling of the MUX5 bit exhanges the positive and negative  
channel other way a round.  
For offset calibration purpose the offset of the certain differential channels can be measure by  
selecting the same input for both negative and positive input. This calibration can be done for  
ADC0, ADC3 and ADC7. ”ADC Operation” on page 139 describes offset calibration in a more  
detailed level.  
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Table 18-5. Differential Input channel Selections.  
MUX5..0  
Positive Differential  
Input  
Negative Differential  
Input  
Gain 1x  
N/A  
Gain 20x  
100011  
001001  
001011  
101001  
001101  
001111  
101101  
010001  
101011  
101111  
110001  
100101  
010011  
010101  
010111  
011001  
110011  
011011  
110101  
111011  
011101  
110111  
111101  
011111  
111001  
111111  
100111  
ADC0 (PA0) (1)  
ADC1 (PA1)  
ADC3 (PA3)  
ADC0 (PA0)  
ADC2 (PA2)  
ADC3 (PA3)  
ADC1 (PA1)  
ADC3 (PA3)  
ADC0 (PA0)  
ADC1 (PA1)  
ADC2 (PA2)  
ADC3 (PA3)(1)  
ADC4 (PA4  
ADC5 (PA5)  
ADC6 (PA6)  
ADC7 (PA7)  
ADC3 (PA3)  
ADC5 (PA5)  
ADC3 (PA3)  
ADC4 (PA4)  
ADC6 (PA6)  
ADC3 (PA3)  
ADC5 (PA5)  
ADC7 (PA7)  
ADC3 (PA3)  
ADC6 (PA6)  
ADC7 (PA7)(1)  
ADC0 (PA0)  
001000  
001010  
101000  
001100  
001110  
101100  
010000  
101010  
101110  
110000  
100100  
010010  
010100  
010110  
011000  
110010  
011010  
110100  
111010  
011100  
110110  
111100  
011110  
111000  
111110  
100110  
ADC1 (PA1)  
ADC2 (PA2)  
ADC3 (PA3)  
ADC4 (PA4  
ADC5 (PA5)  
ADC6 (PA6)  
ADC7 (PA7)  
1.  
For offset calibration only .See ”ADC Operation” on page 139  
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18.10.2 ADCSRA – ADC Control and Status Register A  
Bit  
7
ADEN  
R/W  
0
6
ADSC  
R/W  
0
5
ADATE  
R/W  
0
4
ADIF  
R/W  
0
3
ADIE  
R/W  
0
2
ADPS2  
R/W  
0
1
ADPS1  
R/W  
0
0
ADPS0  
R/W  
0
0x06 (0x26)  
Read/Write  
Initial Value  
ADCSRA  
• Bit 7 – ADEN: ADC Enable  
Writing this bit to one enables the ADC. By writing it to zero, the ADC is turned off. Turning the  
ADC off while a conversion is in progress, will terminate this conversion.  
• Bit 6 – ADSC: ADC Start Conversion  
In Single Conversion mode, write this bit to one to start each conversion. In Free Running mode,  
write this bit to one to start the first conversion. The first conversion after ADSC has been written  
after the ADC has been enabled, or if ADSC is written at the same time as the ADC is enabled,  
will take 25 ADC clock cycles instead of the normal 13. This first conversion performs initializa-  
tion of the ADC.  
ADSC will read as one as long as a conversion is in progress. When the conversion is complete,  
it returns to zero. Writing zero to this bit has no effect.  
• Bit 5 – ADATE: ADC Auto Trigger Enable  
When this bit is written to one, Auto Triggering of the ADC is enabled. The ADC will start a con-  
version on a positive edge of the selected trigger signal. The trigger source is selected by setting  
the ADC Trigger Select bits, ADTS in ADCSRB.  
• Bit 4 – ADIF: ADC Interrupt Flag  
This bit is set when an ADC conversion completes and the data registers are updated. The ADC  
Conversion Complete Interrupt is executed if the ADIE bit and the I-bit in SREG are set. ADIF is  
cleared by hardware when executing the corresponding interrupt handling vector. Alternatively,  
ADIF is cleared by writing a logical one to the flag. Beware that if doing a Read-Modify-Write on  
ADCSRA, a pending interrupt can be disabled. This also applies if the SBI instruction is used.  
• Bit 3 – ADIE: ADC Interrupt Enable  
When this bit is written to one and the I-bit in SREG is set, the ADC Conversion Complete Inter-  
rupt is activated.  
• Bits 2:0 – ADPS2:0: ADC Prescaler Select Bits  
These bits determine the division factor between the system clock frequency and the input clock  
to the ADC.  
Table 18-6. ADC Prescaler Selections  
ADPS2  
ADPS1  
ADPS0  
Division Factor  
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
2
2
4
8
16  
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Table 18-6. ADC Prescaler Selections (Continued)  
ADPS2  
ADPS1  
ADPS0  
Division Factor  
1
1
1
0
1
1
1
0
1
32  
64  
128  
18.10.3 ADCL and ADCH – ADC Data Register  
18.10.3.1  
ADLAR = 0  
Bit  
15  
14  
13  
12  
11  
10  
9
8
0x05 (0x25)  
0x04 (0x24)  
ADC9  
ADC8  
ADCH  
ADCL  
ADC7  
ADC6  
ADC5  
ADC4  
ADC3  
ADC2  
ADC1  
ADC0  
7
R
R
0
6
R
R
0
5
R
R
0
4
R
R
0
3
R
R
0
2
R
R
0
1
R
R
0
0
R
R
0
Read/Write  
Initial Value  
0
0
0
0
0
0
0
0
18.10.3.2  
ADLAR = 1  
Bit  
15  
14  
13  
12  
11  
10  
9
8
0x05 (0x25)  
0x04 (0x24)  
ADC9  
ADC8  
ADC7  
ADC6  
ADC5  
ADC4  
ADC3  
ADC2  
ADCH  
ADCL  
ADC1  
ADC0  
5
4
3
2
1
0
7
R
R
0
6
R
R
0
Read/Write  
Initial Value  
R
R
0
R
R
0
R
R
0
R
R
0
R
R
0
R
R
0
0
0
0
0
0
0
0
0
When an ADC conversion is complete, the result is found in these two registers.  
When ADCL is read, the ADC Data Register is not updated until ADCH is read. Consequently, if  
the result is left adjusted and no more than 8-bit precision is required, it is sufficient to read  
ADCH. Otherwise, ADCL must be read first, then ADCH.  
The ADLAR bit in ADCSRB, and the MUXn bits in ADMUX affect the way the result is read from  
the registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared (default), the result  
is right adjusted.  
• ADC9:0: ADC Conversion Result  
These bits represent the result from the conversion, as detailed in ”ADC Conversion Result” on  
page 148.  
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18.10.4 ADCSRB – ADC Control and Status Register B  
Bit  
7
BIN  
R/W  
0
6
ACME  
R/W  
0
5
4
ADLAR  
R/W  
0
3
2
ADTS2  
R/W  
0
1
ADTS1  
R/W  
0
0
ADTS0  
R/W  
0
0x03 (0x23)  
Read/Write  
Initial Value  
ADCSRB  
R/W  
0
R/W  
0
• Bits 7 – BIN: Bipolar Input Mode  
The gain stage is working in the unipolar mode as default, but the bipolar mode can be selected  
by writing the BIN bit in the ADCSRB register. In the unipolar mode only one-sided conversions  
are supported and the voltage on the positive input must always be larger than the voltage on  
the negative input. Otherwise the result is saturated to the voltage reference. In the bipolar mode  
two-sided conversions are supported and the result is represented in the two’s complement  
form. In the unipolar mode the resolution is 10 bits and the bipolar mode the resolution is 9 bits +  
1 sign bit.  
• Bit 6 – ACME: Analog Comparator Multiplexer Enable  
See ”ADCSRB – ADC Control and Status Register B” on page 136.  
• Bit 5 – Res: Reserved Bit  
This bit is reserved bit in the ATtiny24/44/84 and will always read as what was wrote there.  
• Bit 4 – ADLAR: ADC Left Adjust Result  
The ADLAR bit affects the presentation of the ADC conversion result in the ADC Data Register.  
Write one to ADLAR to left adjust the result. Otherwise, the result is right adjusted. Changing the  
ADLAR bit will affect the ADC Data Register immediately, regardless of any ongoing conver-  
sions. For a comple the description of this bit, see ”ADCL and ADCH – ADC Data Register” on  
page 154.  
• Bit 3 – Res: Reserved Bit  
This bit is reserved bit in the ATtiny24/44/84 and will always read as what was wrote there.  
• Bits 2:0 – ADTS2:0: ADC Auto Trigger Source  
If ADATE in ADCSRA is written to one, the value of these bits selects which source will trigger  
an ADC conversion. If ADATE is cleared, the ADTS2:0 settings will have no effect. A conversion  
will be triggered by the rising edge of the selected Interrupt Flag. Note that switching from a trig-  
ger source that is cleared to a trigger source that is set, will generate a positive edge on the  
trigger signal. If ADEN in ADCSRA is set, this will start a conversion. Switching to Free Running  
mode (ADTS[2:0]=0) will not cause a trigger event, even if the ADC Interrupt Flag is set.  
Table 18-7. ADC Auto Trigger Source Selections  
ADTS2  
ADTS1  
ADTS0  
Trigger Source  
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
Free Running mode  
Analog Comparator  
External Interrupt Request 0  
Timer/Counter0 Compare Match A  
Timer/Counter0 Overflow  
155  
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Table 18-7. ADC Auto Trigger Source Selections  
ADTS2  
ADTS1  
ADTS0  
Trigger Source  
1
1
1
0
1
1
1
0
1
Timer/Counter1 Compare Match B  
Timer/Counter1 Overflow  
Timer/Counter1 Capture Event  
18.10.5 DIDR0 – Digital Input Disable Register 0  
Bit  
7
ADC7D  
R/W  
0
6
ADC6D  
R/W  
0
5
ADC5D  
R/W  
0
4
3
ADC3D  
R/W  
0
2
ADC2D  
R/W  
0
1
ADC1D  
R/W  
0
0
ADC0D  
R/W  
0
0x01 (0x21)  
Read/Write  
Initial Value  
ADC4D  
DIDR0  
R/W  
0
• Bits 7..0 – ADC7D..ADC0D: ADC7..0 Digital Input Disable  
When this bit is written logic one, the digital input buffer on the corresponding ADC pin is dis-  
abled. The corresponding PIN register bit will always read as zero when this bit is set. When an  
analog signal is applied to the ADC7..0 pin and the digital input from this pin is not needed, this  
bit should be written logic one to reduce power consumption in the digital input buffer.  
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19. debugWIRE On-chip Debug System  
19.1 Features  
Complete Program Flow Control  
Emulates All On-chip Functions, Both Digital and Analog , except RESET Pin  
Real-time Operation  
Symbolic Debugging Support (Both at C and Assembler Source Level, or for Other HLLs)  
Unlimited Number of Program Break Points (Using Software Break Points)  
Non-intrusive Operation  
Electrical Characteristics Identical to Real Device  
Automatic Configuration System  
High-Speed Operation  
Programming of Non-volatile Memories  
19.2 Overview  
The debugWIRE On-chip debug system uses a One-wire, bi-directional interface to control the  
program flow, execute AVR instructions in the CPU and to program the different non-volatile  
memories.  
19.3 Physical Interface  
When the debugWIRE Enable (DWEN) Fuse is programmed and Lock bits are unprogrammed,  
the debugWIRE system within the target device is activated. The RESET port pin is configured  
as a wire-AND (open-drain) bi-directional I/O pin with pull-up enabled and becomes the commu-  
nication gateway between target and emulator.  
Figure 19-1. The debugWIRE Setup  
1.8 - 5.5V  
VCC  
dW  
dW(RESET)  
GND  
Figure 19-1 on page 157 shows the schematic of a target MCU, with debugWIRE enabled, and  
the emulator connector. The system clock is not affected by debugWIRE and will always be the  
clock source selected by the CKSEL Fuses.  
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When designing a system where debugWIRE will be used, the following observations must be  
made for correct operation:  
• Pull-Up resistor on the dW/(RESET) line must be in the range of 10k to 20 kΩ. However, the  
pull-up resistor is optional.  
• Connecting the RESET pin directly to VCC will not work.  
• Capacitors inserted on the RESET pin must be disconnected when using debugWire.  
• All external reset sources must be disconnected.  
19.4 Software Break Points  
debugWIRE supports Program memory Break Points by the AVR Break instruction. Setting a  
Break Point in AVR Studio® will insert a BREAK instruction in the Program memory. The instruc-  
tion replaced by the BREAK instruction will be stored. When program execution is continued, the  
stored instruction will be executed before continuing from the Program memory. A break can be  
inserted manually by putting the BREAK instruction in the program.  
The Flash must be re-programmed each time a Break Point is changed. This is automatically  
handled by AVR Studio through the debugWIRE interface. The use of Break Points will therefore  
reduce the Falsh Data retention. Devices used for debugging purposes should not be shipped to  
end customers.  
19.5 Limitations of debugWIRE  
The debugWIRE communication pin (dW) is physically located on the same pin as External  
Reset (RESET). An External Reset source is therefore not supported when the debugWIRE is  
enabled.  
The debugWIRE system accurately emulates all I/O functions when running at full speed, i.e.,  
when the program in the CPU is running. When the CPU is stopped, care must be taken while  
accessing some of the I/O Registers via the debugger (AVR Studio). See the debugWIRE docu-  
mentation for detailed description of the limitations.  
A programmed DWEN Fuse enables some parts of the clock system to be running in all sleep  
modes. This will increase the power consumption while in sleep. Thus, the DWEN Fuse should  
be disabled when debugWire is not used.  
19.6 Register Description  
The following section describes the registers used with the debugWire.  
DWDR – debugWire Data Register  
19.6.1  
Bit  
7
6
5
4
3
2
1
0
0x27 (0x47)  
Read/Write  
Initial Value  
DWDR[7:0]  
DWDR  
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
R/W  
0
The DWDR Register provides a communication channel from the running program in the MCU  
to the debugger. This register is only accessible by the debugWIRE and can therefore not be  
used as a general purpose register in the normal operations.  
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20. Self-Programming the Flash  
The device provides a Self-Programming mechanism for downloading and uploading program  
code by the MCU itself. The Self-Programming can use any available data interface and associ-  
ated protocol to read code and write (program) that code into the Program memory.  
The Program memory is updated in a page by page fashion. Before programming a page with  
the data stored in the temporary page buffer, the page must be erased. The temporary page buf-  
fer is filled one word at a time using SPM and the buffer can be filled either before the Page  
Erase command or between a Page Erase and a Page Write operation:  
Alternative 1, fill the buffer before a Page Erase  
• Fill temporary page buffer  
• Perform a Page Erase  
• Perform a Page Write  
Alternative 2, fill the buffer after Page Erase  
• Perform a Page Erase  
• Fill temporary page buffer  
• Perform a Page Write  
If only a part of the page needs to be changed, the rest of the page must be stored (for example  
in the temporary page buffer) before the erase, and then be re-written. When using alternative 1,  
the Boot Loader provides an effective Read-Modify-Write feature which allows the user software  
to first read the page, do the necessary changes, and then write back the modified data. If alter-  
native 2 is used, it is not possible to read the old data while loading since the page is already  
erased. The temporary page buffer can be accessed in a random sequence. It is essential that  
the page address used in both the Page Erase and Page Write operation is addressing the same  
page.  
20.0.1  
20.0.2  
Performing Page Erase by SPM  
To execute Page Erase, set up the address in the Z-pointer, write “00000011” to SPMCSR and  
execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored.  
The page address must be written to PCPAGE in the Z-register. Other bits in the Z-pointer will  
be ignored during this operation.  
• The CPU is halted during the Page Erase operation.  
Filling the Temporary Buffer (Page Loading)  
To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write  
“00000001” to SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The  
content of PCWORD in the Z-register is used to address the data in the temporary buffer. The  
temporary buffer will auto-erase after a Page Write operation or by writing the CTPB bit in  
SPMCSR. It is also erased after a system reset. Note that it is not possible to write more than  
one time to each address without erasing the temporary buffer.  
If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded will be  
lost.  
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20.0.3  
Performing a Page Write  
To execute Page Write, set up the address in the Z-pointer, write “00000101” to SPMCSR and  
execute SPM within four clock cycles after writing SPMCSR. The data in R1 and R0 is ignored.  
The page address must be written to PCPAGE. Other bits in the Z-pointer must be written to  
zero during this operation.  
• The CPU is halted during the Page Write operation.  
20.1 Addressing the Flash During Self-Programming  
The Z-pointer is used to address the SPM commands.  
Bit  
15  
Z15  
Z7  
7
14  
Z14  
Z6  
6
13  
Z13  
Z5  
5
12  
Z12  
Z4  
4
11  
Z11  
Z3  
3
10  
Z10  
Z2  
2
9
Z9  
Z1  
1
8
Z8  
Z0  
0
ZH (R31)  
ZL (R30)  
Since the Flash is organized in pages (see Table 21-7 on page 167), the Program Counter can  
be treated as having two different sections. One section, consisting of the least significant bits, is  
addressing the words within a page, while the most significant bits are addressing the pages.  
This is shown in Figure 21-1 on page 168. Note that the Page Erase and Page Write operations  
are addressed independently. Therefore it is of major importance that the software addresses  
the same page in both the Page Erase and Page Write operation.  
The LPM instruction uses the Z-pointer to store the address. Since this instruction addresses the  
Flash byte-by-byte, also the LSB (bit Z0) of the Z-pointer is used.  
Figure 20-1. Addressing the Flash During SPM(1)  
BIT 15  
ZPCMSB  
ZPAGEMSB  
1
0
0
Z - REGISTER  
PCMSB  
PAGEMSB  
PCWORD  
PROGRAM  
COUNTER  
PCPAGE  
PAGE ADDRESS  
WITHIN THE FLASH  
WORD ADDRESS  
WITHIN A PAGE  
PROGRAM MEMORY  
PAGE  
PAGE  
INSTRUCTION WORD  
PCWORD[PAGEMSB:0]:  
00  
01  
02  
PAGEEND  
Note:  
1. The different variables used in Figure 20-1 are listed in Table 21-7 on page 167.  
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20.1.1  
20.1.2  
EEPROM Write Prevents Writing to SPMCSR  
Note that an EEPROM write operation will block all software programming to Flash. Reading the  
Fuses and Lock bits from software will also be prevented during the EEPROM write operation. It  
is recommended that the user checks the status bit (EEPE) in the EECR Register and verifies  
that the bit is cleared before writing to the SPMCSR Register.  
Reading the Fuse and Lock Bits from Software  
It is possible to read both the Fuse and Lock bits from software. To read the Lock bits, load the  
Z-pointer with 0x0001 and set the RFLB and SPMEN bits in SPMCSR. When an LPM instruction  
is executed within three CPU cycles after the RFLB and SPMEN bits are set in SPMCSR, the  
value of the Lock bits will be loaded in the destination register. The RFLB and SPMEN bits will  
auto-clear upon completion of reading the Lock bits or if no LPM instruction is executed within  
three CPU cycles or no SPM instruction is executed within four CPU cycles. When RFLB and  
SPMEN are cleared, LPM will work as described in the Instruction set Manual.  
Bit  
Rd  
7
6
5
4
3
2
1
0
LB2  
LB1  
The algorithm for reading the Fuse Low byte is similar to the one described above for reading  
the Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and set the RFLB and  
SPMEN bits in SPMCSR. When an LPM instruction is executed within three cycles after the  
RFLB and SPMEN bits are set in the SPMCSR, the value of the Fuse Low byte (FLB) will be  
loaded in the destination register as shown below. See Table 21-5 on page 166 for a detailed  
description and mapping of the Fuse Low byte.  
Bit  
Rd  
7
6
5
4
3
2
1
0
FLB7  
FLB6  
FLB5  
FLB4  
FLB3  
FLB2  
FLB1  
FLB0  
Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an LPM instruc-  
tion is executed within three cycles after the RFLB and SPMEN bits are set in the SPMCSR, the  
value of the Fuse High byte (FHB) will be loaded in the destination register as shown below. See  
Table 21-4 on page 165 for detailed description and mapping of the Fuse High byte.  
Bit  
Rd  
7
6
5
4
3
2
1
0
FHB7  
FHB6  
FHB5  
FHB4  
FHB3  
FHB2  
FHB1  
FHB0  
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are  
unprogrammed, will be read as one.  
20.1.3  
Preventing Flash Corruption  
During periods of low VCC, the Flash program can be corrupted because the supply voltage is  
too low for the CPU and the Flash to operate properly. These issues are the same as for board  
level systems using the Flash, and the same design solutions should be applied.  
A Flash program corruption can be caused by two situations when the voltage is too low. First, a  
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,  
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions  
is too low.  
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Flash corruption can easily be avoided by following these design recommendations (one is  
sufficient):  
1. Keep the AVR RESET active (low) during periods of insufficient power supply voltage.  
This can be done by enabling the internal Brown-out Detector (BOD) if the operating volt-  
age matches the detection level. If not, an external low VCC reset protection circuit can be  
used. If a reset occurs while a write operation is in progress, the write operation will be  
completed provided that the power supply voltage is sufficient.  
2. Keep the AVR core in Power-down sleep mode during periods of low VCC. This will pre-  
vent the CPU from attempting to decode and execute instructions, effectively protecting  
the SPMCSR Register and thus the Flash from unintentional writes.  
20.1.4  
Programming Time for Flash when Using SPM  
The calibrated RC Oscillator is used to time Flash accesses. Table 20-1 shows the typical pro-  
gramming time for Flash accesses from the CPU.  
Table 20-1. SPM Programming Time(1)  
Symbol  
Min Programming Time  
Max Programming Time  
Flash write (Page Erase, Page Write, and  
write Lock bits by SPM)  
3.7 ms  
4.5 ms  
Note:  
1. The min and max programming times is per individual operation.  
20.2 Register Description  
20.2.1  
SPMCSR – Store Program Memory Control and Status Register  
The Store Program Memory Control and Status Register contains the control bits needed to con-  
trol the Program memory operations.  
Bit  
7
6
5
4
CTPB  
R/W  
0
3
RFLB  
R/W  
0
2
PGWRT  
R/W  
0
1
PGERS  
R/W  
0
0
SPMEN  
R/W  
0
SPMCSR  
0x37 (0x57)  
Read/Write  
Initial Value  
R
0
R
0
R
0
• Bits 7..5 – Res: Reserved Bits  
These bits are reserved bits in the ATtiny24/44/84 and always read as zero.  
• Bit 4 – CTPB: Clear Temporary Page Buffer  
If the CTPB bit is written while filling the temporary page buffer, the temporary page buffer will be  
cleared and the data will be lost.  
• Bit 3 – RFLB: Read Fuse and Lock Bits  
An LPM instruction within three cycles after RFLB and SPMEN are set in the SPMCSR Register,  
will read either the Lock bits or the Fuse bits (depending on Z0 in the Z-pointer) into the destina-  
tion register. See ”EEPROM Write Prevents Writing to SPMCSR” on page 161 for details.  
• Bit 2 – PGWRT: Page Write  
If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock  
cycles executes Page Write, with the data stored in the temporary buffer. The page address is  
taken from the high part of the Z-pointer. The data in R1 and R0 are ignored. The PGWRT bit  
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will auto-clear upon completion of a Page Write, or if no SPM instruction is executed within four  
clock cycles. The CPU is halted during the entire Page Write operation.  
• Bit 1 – PGERS: Page Erase  
If this bit is written to one at the same time as SPMEN, the next SPM instruction within four clock  
cycles executes Page Erase. The page address is taken from the high part of the Z-pointer. The  
data in R1 and R0 are ignored. The PGERS bit will auto-clear upon completion of a Page Erase,  
or if no SPM instruction is executed within four clock cycles. The CPU is halted during the entire  
Page Write operation.  
• Bit 0 – SPMEN: Store Program Memory Enable  
This bit enables the SPM instruction for the next four clock cycles. If written to one together with  
either CTPB, RFLB, PGWRT, or PGERS, the following SPM instruction will have a special  
meaning, see description above. If only SPMEN is written, the following SPM instruction will  
store the value in R1:R0 in the temporary page buffer addressed by the Z-pointer. The LSB of  
the Z-pointer is ignored. The SPMEN bit will auto-clear upon completion of an SPM instruction,  
or if no SPM instruction is executed within four clock cycles. During Page Erase and Page Write,  
the SPMEN bit remains high until the operation is completed.  
Writing any other combination than “10001”, “01001”, “00101”, “00011” or “00001” in the lower  
five bits will have no effect.  
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21. Memory Programming  
This section describes the different methods for Programming the ATtiny24/44/84 memories.  
21.1 Program And Data Memory Lock Bits  
The ATtiny24/44/84 provides two Lock bits which can be left unprogrammed (“1”) or can be pro-  
grammed (“0”) to obtain the additional security listed in Table 21-2 on page 164. The Lock bits  
can only be erased to “1” with the Chip Erase command.  
Program memory can be read out via the debugWIRE interface when the DWEN fuse is pro-  
grammed, even if the Lock Bits are set. Thus, when Lock Bit security is required, should always  
debugWIRE be disabled by clearing the DWEN fuse.  
Table 21-1. Lock Bit Byte(1)  
Lock Bit Byte  
Bit No  
Description  
Default Value  
7
6
5
4
3
2
1
0
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
LB2  
LB1  
Lock bit  
Lock bit  
Note:  
1. “1” means unprogrammed, “0” means programmed  
Table 21-2. Lock Bit Protection Modes(1)(2)  
Memory Lock Bits Protection Type  
LB Mode  
LB2  
LB1  
1
2
1
1
No memory lock features enabled.  
Further programming of the Flash and EEPROM is disabled in  
High-voltage and Serial Programming mode. The Fuse bits are  
locked in both Serial and High-voltage Programming mode.(1)  
debugWire is disabled.  
1
0
0
0
Further programming and verification of the Flash and EEPROM  
is disabled in High-voltage and Serial Programming mode. The  
Fuse bits are locked in both Serial and High-voltage  
Programming mode.(1) debugWire is disabled.  
3
Notes: 1. Program the Fuse bits before programming the LB1 and LB2.  
2. “1” means unprogrammed, “0” means programmed  
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21.2 Fuse Bytes  
The ATtiny24/44/84 has three Fuse bytes. Table 21-4 on page 165 to Table 21-5 on page 166  
describe briefly the functionality of all the fuses and how they are mapped into the Fuse bytes.  
Note that the fuses are read as logical zero, “0”, if they are programmed..  
Table 21-3. Fuse Extended Byte  
Fuse High Byte  
Bit No Description  
Default Value  
7
6
5
4
3
2
1
0
-
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
-
-
-
-
-
-
SELFPRGEN  
Self-Programming Enable  
Table 21-4. Fuse High Byte  
Fuse High Byte  
RSTDISBL(1)  
DWEN(2)  
Bit No  
Description  
Default Value  
7
6
External Reset disable  
DebugWIRE Enable  
1 (unprogrammed)  
1 (unprogrammed)  
Enable Serial Program and Data  
Downloading  
0 (programmed, SPI  
prog. enabled)  
SPIEN(3)  
6
4
WDTON(4)  
Watchdog Timer always on  
1 (unprogrammed)  
1 (unprogrammed,  
EEPROM not  
preserved)  
EEPROM memory is preserved through  
the Chip Erase  
EESAVE  
3
BODLEVEL2(5)  
BODLEVEL1(5)  
BODLEVEL0(5)  
2
1
0
Brown-out Detector trigger level  
Brown-out Detector trigger level  
Brown-out Detector trigger level  
1 (unprogrammed)  
1 (unprogrammed)  
1 (unprogrammed)  
Notes: 1. See ”Alternate Functions of Port B” on page 68 for description of RSTDISBL and DWEN  
Fuses. When programming the RSTDISBL Fuse, High-voltage Serial programming has to be  
used to change fuses to perform further programming  
2. DWEN must be unprogrammed when Lock Bit security is required. See ”Program And Data  
Memory Lock Bits” on page 164.  
3. The SPIEN Fuse is not accessible in SPI Programming mode.  
4. See ”WDT Configuration as a Function of the Fuse Settings of WDTON” on page 44 for  
details.  
5. See Table 22-5 on page 182 for BODLEVEL Fuse decoding.  
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Table 21-5. Fuse Low Byte  
Fuse Low Byte  
CKDIV8(1)  
CKOUT  
Bit No  
Description  
Default Value  
7
6
5
4
3
2
1
0
Divide clock by 8  
0 (programmed)  
Clock Output Enable  
Select start-up time  
Select start-up time  
Select Clock source  
Select Clock source  
Select Clock source  
Select Clock source  
1 (unprogrammed)  
1 (unprogrammed)(2)  
0 (programmed)(2)  
0 (programmed)(3)  
0 (programmed)(3)  
1 (unprogrammed)(3)  
0 (programmed)(3)  
SUT1  
SUT0  
CKSEL3  
CKSEL2  
CKSEL1  
CKSEL0  
Notes: 1. See ”System Clock Prescaler” on page 31 for details.  
2. The default value of SUT1..0 results in maximum start-up time for the default clock source.  
See Table 7-7 on page 29 for details.  
3. The default setting of CKSEL3..0 results in internal RC Oscillator @ 8.0 MHz. See Table 7-6  
on page 29 for details.  
The status of the Fuse bits is not affected by Chip Erase. Note that the Fuse bits are locked if  
Lock bit1 (LB1) is programmed. Program the Fuse bits before programming the Lock bits.  
21.2.1  
Latching of Fuses  
The fuse values are latched when the device enters programming mode and changes of the  
fuse values will have no effect until the part leaves Programming mode. This does not apply to  
the EESAVE Fuse which will take effect once it is programmed. The fuses are also latched on  
Power-up in Normal mode.  
21.3 Signature Bytes  
All Atmel microcontrollers have a three-byte signature code which identifies the device. This  
code can be read in both serial and High-voltage Programming mode, also when the device is  
locked. The three bytes reside in a separate address space. For the ATtiny24/44/84 the signa-  
ture bytes are given in Table 21-6.  
Table 21-6. Device ID  
Signature Bytes Address  
Parts  
0x000  
0x1E  
0x1E  
0x1E  
0x001  
0x91  
0x92  
0x93  
0x002  
0x0B  
0x07  
ATtiny24  
ATtiny44  
ATtiny84  
0x0C  
21.4 Calibration Byte  
Signature area of the ATtiny24/44/84 has one byte of calibration data for the internal RC Oscilla-  
tor. This byte resides in the high byte of address 0x000. During reset, this byte is automatically  
written into the OSCCAL Register to ensure correct frequency of the calibrated RC Oscillator.  
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21.5 Page Size  
Table 21-7. No. of Words in a Page and No. of Pages in the Flash  
Device  
Flash Size  
Page Size  
PCWORD  
No. of Pages  
PCPAGE  
PCMSB  
1K words  
ATtiny24  
16 words  
PC[3:0]  
64  
PC[9:4]  
9
(2K bytes)  
2K words  
(4K bytes)  
ATtiny44  
ATtiny84  
32 words  
32 words  
PC[4:0]  
PC[4:0]  
64  
PC[10:5]  
PC[11:5]  
10  
11  
4K words  
(8K bytes)  
128  
Table 21-8. No. of Words in a Page and No. of Pages in the EEPROM  
Device  
EEPROM Size  
128 bytes  
Page Size  
4 bytes  
PCWORD  
EEA[1:0]  
EEA[1:0]  
EEA[1:0]  
No. of Pages  
PCPAGE  
EEA[6:2]  
EEA[7:2]  
EEA[8:2]  
EEAMSB  
ATtiny24  
ATtiny44  
ATtiny84  
32  
64  
6
7
8
256 bytes  
4 bytes  
512 bytes  
4 bytes  
128  
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21.6 Serial Downloading  
Both the Flash and EEPROM memory arrays can be programmed using the serial SPI bus while  
RESET is pulled to GND. The serial interface consists of pins SCK, MOSI (input) and MISO (out-  
put). After RESET is set low, the Programming Enable instruction needs to be executed first  
before program/erase operations can be executed. NOTE, in Table 21-9 on page 168, the pin  
mapping for SPI programming is listed. Not all parts use the SPI pins dedicated for the internal  
SPI interface.  
Figure 21-1. Serial Programming and Verify(1)  
+1.8 - 5.5V  
VCC  
MOSI  
MISO  
SCK  
RESET  
GND  
Note:  
1. If the device is clocked by the internal Oscillator, it is no need to connect a clock source to the  
CLKI pin.  
Table 21-9. Pin Mapping Serial Programming  
Symbol  
MOSI  
MISO  
SCK  
Pins  
PA6  
PA5  
PA4  
I/O  
Description  
Serial Data in  
Serial Data out  
Serial Clock  
I
O
I
When programming the EEPROM, an auto-erase cycle is built into the self-timed programming  
operation (in the Serial mode ONLY) and there is no need to first execute the Chip Erase  
instruction. The Chip Erase operation turns the content of every memory location in both the  
Program and EEPROM arrays into 0xFF.  
Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high periods  
for the serial clock (SCK) input are defined as follows:  
Low: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz  
High: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz  
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21.6.1  
Serial Programming Algorithm  
When writing serial data to the ATtiny24/44/84, data is clocked on the rising edge of SCK.  
When reading data from the ATtiny24/44/84, data is clocked on the falling edge of SCK. See  
Figure 22-3 and Figure 22-4 for timing details.  
To program and verify the ATtiny24/44/84 in the Serial Programming mode, the following  
sequence is recommended (see four byte instruction formats in Table 21-11):  
1. Power-up sequence:  
Apply power between VCC and GND while RESET and SCK are set to “0”. In some sys-  
tems, the programmer can not guarantee that SCK is held low during power-up. In this  
case, RESET must be given a positive pulse of at least two CPU clock cycles duration  
after SCK has been set to “0”.  
2. Wait for at least 20 ms and enable serial programming by sending the Programming  
Enable serial instruction to pin MOSI.  
3. The serial programming instructions will not work if the communication is out of synchro-  
nization. When in sync. the second byte (0x53), will echo back when issuing the third  
byte of the Programming Enable instruction. Whether the echo is correct or not, all four  
bytes of the instruction must be transmitted. If the 0x53 did not echo back, give RESET a  
positive pulse and issue a new Programming Enable command.  
4. The Flash is programmed one page at a time. The memory page is loaded one byte at a  
time by supplying the 5 LSB of the address and data together with the Load Program  
memory Page instruction. To ensure correct loading of the page, the data low byte must  
be loaded before data high byte is applied for a given address. The Program memory  
Page is stored by loading the Write Program memory Page instruction with the 3 MSB of  
the address. If polling (RDY/BSY) is not used, the user must wait at least tWD_FLASH before  
issuing the next page. (See Table 21-10 on page 170.) Accessing the serial program-  
ming interface before the Flash write operation completes can result in incorrect  
programming.  
5. A: The EEPROM array is programmed one byte at a time by supplying the address and  
data together with the appropriate Write instruction. An EEPROM memory location is first  
automatically erased before new data is written. If polling (RDY/BSY) is not used, the  
user must wait at least tWD_EEPROM before issuing the next byte. (See Table 21-10 on  
page 170.) In a chip erased device, no 0xFFs in the data file(s) need to be programmed.  
B: The EEPROM array is programmed one page at a time. The Memory page is loaded  
one byte at a time by supplying the 2 LSB of the address and data together with the Load  
EEPROM Memory Page instruction. The EEPROM Memory Page is stored by loading  
the Write EEPROM Memory Page Instruction with the 4 MSB of the address. When using  
EEPROM page access only byte locations loaded with the Load EEPROM Memory Page  
instruction is altered. The remaining locations remain unchanged. If polling (RDY/BSY) is  
not used, the used must wait at least tWD_EEPROM before issuing the next page (See Table  
21-10 on page 170). In a chip erased device, no 0xFF in the data file(s) need to be  
programmed.  
6. Any memory location can be verified by using the Read instruction which returns the con-  
tent at the selected address at serial output MISO.  
7. At the end of the programming session, RESET can be set high to commence normal  
operation.  
8. Power-off sequence (if needed):  
Set RESET to “1”.  
Turn VCC power off.  
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Table 21-10. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location  
Symbol  
Minimum Wait Delay  
4.5 ms  
tWD_FLASH  
tWD_EEPROM  
tWD_ERASE  
tWD_FUSE  
4.0 ms  
4.0 ms  
4.5 ms  
21.6.2  
Serial Programming Instruction set  
Table 21-11 on page 170 and Figure 21-2 on page 171 describes the Instruction set.  
Table 21-11. Serial Programming Instruction Set  
Instruction Format  
Instruction/Operation(1)  
Programming Enable  
Byte 1  
$AC  
Byte 2  
Byte 3  
$00  
Byte4  
$00  
$53  
$80  
$00  
Chip Erase (Program Memory/EEPROM)  
Poll RDY/BSY  
$AC  
$00  
$00  
$F0  
$00  
data byte out  
Load Instructions  
Load Extended Address byte  
Load Program Memory Page, High byte  
Load Program Memory Page, Low byte  
Load EEPROM Memory Page (page access)  
Read Instructions  
$4D  
$48  
$40  
$C1  
$00  
Extended adr  
adr LSB  
$00  
adr MSB  
adr MSB  
$00  
high data byte in  
low data byte in  
data byte in  
adr LSB  
adr LSB  
Read Program Memory, High byte  
Read Program Memory, Low byte  
Read EEPROM Memory  
Read Lock bits  
$28  
$20  
$A0  
$58  
$30  
$50  
$58  
$50  
$38  
adr MSB  
adr MSB  
$00  
adr LSB  
adr LSB  
adr LSB  
$00  
high data byte out  
low data byte out  
data byte out  
data byte out  
data byte out  
data byte out  
data byte out  
data byte out  
data byte out  
$00  
Read Signature Byte  
$00  
adr LSB  
$00  
Read Fuse bits  
$00  
Read Fuse High bits  
$08  
$00  
Read Extended Fuse Bits  
Read Calibration Byte  
$08  
$00  
$00  
$00  
Write Instructions(6)  
Write Program Memory Page  
Write EEPROM Memory  
Write EEPROM Memory Page (page access)  
Write Lock bits  
$4C  
$C0  
$C2  
$AC  
adr MSB  
$00  
adr LSB  
adr LSB  
adr LSB  
$00  
$00  
data byte in  
$00  
$00  
$E0  
data byte in  
170  
ATtiny24/44/84  
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ATtiny24/44/84  
Table 21-11. Serial Programming Instruction Set (Continued)  
Instruction Format  
Byte 2 Byte 3  
Instruction/Operation(1)  
Write Fuse bits  
Byte 1  
$AC  
Byte4  
$A0  
$A8  
$A4  
$00  
$00  
$00  
data byte in  
data byte in  
data byte in  
Write Fuse High bits  
Write Extended Fuse Bits  
$AC  
$AC  
Notes: 1. Not all instructions are applicable for all parts.  
2. a = address  
3. Bits are programmed ‘0’, unprogrammed ‘1’.  
4. To ensure future compatibility, unused Fuses and Lock bits should be unprogrammed (‘1’) .  
5. Refer to the correspondig section for Fuse and Lock bits, Calibration and Signature bytes and Page size.  
6. Instructions accessing program memory use a word address. This address may be random within the page range.  
7. See htt://www.atmel.com/avr for Application Notes regarding programming and programmers.  
If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending. Wait until  
this bit returns ‘0’ before the next instruction is carried out.  
Within the same page, the low data byte must be loaded prior to the high data byte.  
After data is loaded to the page buffer, program the EEPROM page, see Figure 21-2 on page  
171.  
Figure 21-2. Serial Programming Instruction example  
Serial Programming Instruction  
Load Program Memory Page (High/Low Byte)/  
Load EEPROM Memory Page (page access)  
Write Program Memory Page/  
Write EEPROM Memory Page  
Byte 1  
Byte 2  
Byte 3  
Byte 4  
Byte 1  
Byte 2  
Byte 3  
Byte 4  
Adr MSB  
Adr LSB  
Adr MSB  
Adr LSB  
Bit 15 B  
0
Bit 15 B  
0
Page Buffer  
Page Offset  
Page 0  
Page 1  
Page 2  
Page Number  
Page N-1  
Program Memory/  
EEPROM Memory  
171  
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21.7 High-voltage Serial Programming  
This section describes how to program and verify Flash Program memory, EEPROM Data mem-  
ory, Lock bits and Fuse bits in the ATtiny24/44/84.  
Figure 21-3. High-voltage Serial Programming  
+11.5 - 12.5V  
+1.8 - 5.5V  
PB3  
PB0  
VCC  
PA4  
(RESET)  
SCI  
SDO  
SII  
PA5  
PA6  
GND  
SDI  
Table 21-12. Pin Name Mapping  
Signal Name in High-voltage  
Serial Programming Mode  
Pin Name  
PA6  
I/O  
Function  
Serial Data Input  
SDI  
SII  
I
PA5  
I
Serial Instruction Input  
SDO  
SCI  
PA4  
O
I
Serial Data Output  
PB0  
Serial Clock Input (min. 220ns period)  
The minimum period for the Serial Clock Input (SCI) during High-voltage Serial Programming is  
220 ns.  
Table 21-13. Pin Values Used to Enter Programming Mode  
Pin  
Symbol  
Value  
PA0  
PA1  
PA2  
Prog_enable[0]  
Prog_enable[1]  
Prog_enable[2]  
0
0
0
172  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
21.8 High-voltage Serial Programming Algorithm  
To program and verify the ATtiny24/44/84 in the High-voltage Serial Programming mode, the fol-  
lowing sequence is recommended (See instruction formats in Table 21-15 on page 176):  
21.8.1  
Enter High-voltage Serial Programming Mode  
The following algorithm puts the device in High-voltage Serial Programming mode:  
1. Apply 4.5 - 5.5V between VCC and GND.  
2. Set RESET pin to “0” and toggle SCI at least six times.  
3. Set the Prog_enable pins listed in Table 21-13 on page 172 to “000” and wait at least 100  
ns.  
4. Apply VHVRST - 5.5V to RESET. Keep the Prog_enable pins unchanged for at least tHVRST  
after the High-voltage has been applied to ensure the Prog_enable signature has been  
latched.  
5. Shortly after latching the Prog_enable signature, the device will activly output data on the  
Prog_enable[2]/SDO pin, and the resulting drive contention may increase the power con-  
sumption. To minimize this drive contention, release the Prog_enable[2] pin after tHVRST  
has elapsed.  
6. Wait at least 50 µs before giving any serial instructions on SDI/SII.  
Table 21-14. High-voltage Reset Characteristics  
Minimum High-voltage Period for  
Supply Voltage  
RESET Pin High-voltage Threshold  
Latching Prog_enable  
VCC  
VHVRST  
11.5V  
11.5V  
tHVRST  
100 ns  
100 ns  
4.5V  
5.5V  
21.8.2  
Considerations for Efficient Programming  
The loaded command and address are retained in the device during programming. For efficient  
programming, the following should be considered.  
• The command needs only be loaded once when writing or reading multiple memory locations.  
• Skip writing the data value 0xFF that is the contents of the entire EEPROM (unless the  
EESAVE Fuse is programmed) and Flash after a Chip Erase.  
• Address High byte needs only be loaded before programming or reading a new 256 word  
window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes  
reading.  
21.8.3  
Chip Erase  
The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock bits are  
not reset until the Program memory has been completely erased. The Fuse bits are not  
changed. A Chip Erase must be performed before the Flash and/or EEPROM are re-  
programmed.  
Note:  
1. The EEPROM memory is preserved during Chip Erase if the EESAVE Fuse is programmed.  
1. Load command “Chip Erase” (see Table 21-15 on page 176).  
2. Wait after Instr. 3 until SDO goes high for the “Chip Erase” cycle to finish.  
3. Load Command “No Operation”.  
173  
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21.8.4  
Programming the Flash  
The Flash is organized in pages, see ”Page Size” on page 167. When programming the Flash,  
the program data is latched into a page buffer. This allows one page of program data to be pro-  
grammed simultaneously. The following procedure describes how to program the entire Flash  
memory:  
1. Load Command “Write Flash” (see Table 21-15 on page 176).  
2. Load Flash Page Buffer.  
3. Load Flash High Address and Program Page. Wait after Instr. 3 until SDO goes high for  
the “Page Programming” cycle to finish.  
4. Repeat 2 through 3 until the entire Flash is programmed or until all data has been  
programmed.  
5. End Page Programming by Loading Command “No Operation”.  
When writing or reading serial data to the ATtiny24/44/84, data is clocked on the rising edge of  
the serial clock, see Figure 22-5 on page 186, Figure 21-3 on page 172 and Table 22-9 on page  
186 for details.  
Figure 21-4. Addressing the Flash which is Organized in Pages  
PCMSB  
PAGEMSB  
PROGRAM  
COUNTER  
PCPAGE  
PCWORD  
PAGE ADDRESS  
WITHIN THE FLASH  
WORD ADDRESS  
WITHIN A PAGE  
PROGRAM MEMORY  
PAGE  
PAGE  
PCWORD[PAGEMSB:0]:  
00  
INSTRUCTION WORD  
01  
02  
PAGEEND  
Figure 21-5. High-voltage Serial Programming Waveforms  
SDI  
PB0  
MSB  
LSB  
LSB  
SII  
MSB  
SDO  
MSB  
LSB  
SCI  
0
1
2
3
4
5
6
7
8
9
10  
174  
ATtiny24/44/84  
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ATtiny24/44/84  
21.8.5  
Programming the EEPROM  
The EEPROM is organized in pages, see Table 22-8 on page 186. When programming the  
EEPROM, the data is latched into a page buffer. This allows one page of data to be pro-  
grammed simultaneously. The programming algorithm for the EEPROM Data memory is as  
follows (refer to Table 21-15 on page 176):  
1. Load Command “Write EEPROM”.  
2. Load EEPROM Page Buffer.  
3. Program EEPROM Page. Wait after Instr. 2 until SDO goes high for the “Page Program-  
ming” cycle to finish.  
4. Repeat 2 through 3 until the entire EEPROM is programmed or until all data has been  
programmed.  
5. End Page Programming by Loading Command “No Operation”.  
21.8.6  
21.8.7  
Reading the Flash  
The algorithm for reading the Flash memory is as follows (refer to Table 21-15 on page 176):  
1. Load Command "Read Flash".  
2. Read Flash Low and High Bytes. The contents at the selected address are available at  
serial output SDO.  
Reading the EEPROM  
The algorithm for reading the EEPROM memory is as follows (refer to Table 21-15 on page  
176):  
1. Load Command “Read EEPROM”.  
2. Read EEPROM Byte. The contents at the selected address are available at serial output  
SDO.  
21.8.8  
21.8.9  
Programming and Reading the Fuse and Lock Bits  
The algorithms for programming and reading the Fuse Low/High bits and Lock bits are shown in  
Table 21-15 on page 176.  
Reading the Signature Bytes and Calibration Byte  
The algorithms for reading the Signature bytes and Calibration byte are shown in Table 21-15 on  
page 176.  
21.8.10 Power-off sequence  
Set SCI to “0”. Set RESET to “1”. Turn VCC power off.  
175  
7701C–AVR–12/08  
Table 21-15. High-voltage Serial Programming Instruction Set for ATtiny24/44/84  
Instruction Format  
Instruction  
Instr.1/5  
Instr.2/6  
Instr.3/7  
Instr.4  
Operation Remarks  
SDI  
SII  
0_1000_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
Wait after Instr.3 until SDO  
goes high for the Chip Erase  
cycle to finish.  
Chip Erase  
SDO  
SDI  
SII  
0_0001_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
Load “Write  
Flash”  
Command  
Enter Flash Programming code.  
SDO  
Repeat after Instr. 1 - 7until the  
entire page buffer is filled or  
until all data within the page is  
filled. See Note 1.  
SDI  
SII  
0_ bbbb_bbbb _00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_eeee_eeee_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1101_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
SDO  
Load Flash  
Page Buffer  
SDI  
SII  
0_dddd_dddd_00  
0_0011_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1101_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1100_00  
x_xxxx_xxxx_xx  
Instr 5-7.  
SDO  
Wait after Instr 3 until SDO  
goes high. Repeat Instr. 2 - 3  
for each loaded Flash Page  
until the entire Flash or all data  
is programmed. Repeat Instr. 1  
for a new 256 byte page. See  
Note 1.  
Load Flash  
High Address  
and Program  
Page  
SDI  
SII  
0_0000_000a_00  
0_0001_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
SDO  
SDI  
SII  
0_0000_0010_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
Load “Read  
Flash”  
Command  
Enter Flash Read mode.  
SDO  
SDI  
SII  
0_bbbb_bbbb_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_0000_000a_00  
0_0001_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
q_qqqq_qqqx_xx  
Repeat Instr. 1, 3 - 6 for each  
new address. Repeat Instr. 2 for  
a new 256 byte page.  
Read Flash  
Low and High  
Bytes  
SDO  
SDI  
SII  
0_0000_0000_00  
0_0111_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1100_00  
p_pppp_pppx_xx  
Instr 5 - 6.  
SDO  
SDI  
SII  
0_0001_0001_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
Load “Write  
EEPROM”  
Command  
Enter EEPROM Programming  
mode.  
SDO  
0_eeee_eeee_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
Repeat Instr. 1 - 5 until the  
entire page buffer is filled or  
until all data within the page is  
filled. See Note 2.  
SDI  
SII  
0_bbbb_bbbb_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_aaaa_aaaa_00  
0_0001_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1101_00  
x_xxxx_xxxx_xx  
Load  
EEPROM  
Page Buffer  
SDO  
SDI  
SII  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
SDO  
Wait after Instr. 2 until SDO  
goes high. Repeat Instr. 1 - 2  
for each loaded EEPROM page  
until the entire EEPROM or all  
data is programmed.  
SDI  
SII  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
Program  
EEPROM  
Page  
SDO  
176  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Table 21-15. High-voltage Serial Programming Instruction Set for ATtiny24/44/84 (Continued)  
Instruction Format  
Instruction  
Instr.1/5  
Instr.2/6  
Instr.3/7  
Instr.4  
Operation Remarks  
SDI  
SII  
0_bbbb_bbbb_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_aaaa_aaaa_00  
0_0001_1100_00  
x_xxxx_xxxx_xx  
0_eeee_eeee_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1101_00  
x_xxxx_xxxx_xx  
Repeat Instr. 1 - 6 for each new  
address. Wait after Instr. 6 until  
SDO goes high. See Note 3.  
Write  
SDO  
EEPROM  
Byte  
SDI  
SII  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
Instr. 5-6  
SDO  
SDI  
SII  
0_0000_0011_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
Load “Read  
EEPROM”  
Command  
Enter EEPROM Read mode.  
SDO  
SDI  
SII  
0_bbbb_bbbb_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_aaaa_aaaa_00  
0_0001_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
q_qqqq_qqq0_00  
Read  
EEPROM  
Byte  
Repeat Instr. 1, 3 - 4 for each  
new address. Repeat Instr. 2 for  
a new 256 byte page.  
SDO  
SDI  
SII  
0_0100_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_A987_6543_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
Wait after Instr. 4 until SDO  
goes high. Write A - 3 = “0” to  
program the Fuse bit.  
Write Fuse  
Low Bits  
SDO  
SDI  
SII  
0_0100_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_IHGF_EDCB_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1100_00  
x_xxxx_xxxx_xx  
Wait after Instr. 4 until SDO  
goes high. Write F - B = “0” to  
program the Fuse bit.  
Write Fuse  
High Bits  
SDO  
SDI  
SII  
0_0100_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_000J_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_0110_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1110_00  
x_xxxx_xxxx_xx  
Wait after Instr. 4 until SDO  
goes high. Write J = “0” to  
program the Fuse bit.  
Write Fuse  
Extended Bits  
SDO  
SDI  
SII  
0_0010_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0021_00  
0_0010_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_0100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_xxxx_xx  
Wait after Instr. 4 until SDO  
goes high. Write 2 - 1 = “0” to  
program the Lock Bit.  
Write Lock  
Bits  
SDO  
SDI  
SII  
0_0000_0100_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
A_9876_543x_xx  
Read Fuse  
Low Bits  
Reading A - 3 = “0” means the  
Fuse bit is programmed.  
SDO  
SDI  
SII  
0_0000_0100_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1010_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1100_00  
I_HGFE_DCBx_xx  
Read Fuse  
High Bits  
Reading F - B = “0” means the  
Fuse bit is programmed.  
SDO  
SDI  
SII  
0_0000_0100_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1010_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1110_00  
x_xxxx_xxJx_xx  
Read Fuse  
Extended Bits  
Reading J = “0” means the  
Fuse bit is programmed.  
SDO  
SDI  
SII  
0_0000_0100_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
x_xxxx_x21x_xx  
Read Lock  
Bits  
Reading 2, 1 = “0” means the  
Lock bit is programmed.  
SDO  
SDI  
SII  
0_0000_1000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_00bb_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0110_1100_00  
q_qqqq_qqqx_xx  
Read  
Signature  
Bytes  
Repeats Instr 2 4 for each  
signature byte address.  
SDO  
SDI  
SII  
0_0000_1000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0000_1100_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1000_00  
x_xxxx_xxxx_xx  
0_0000_0000_00  
0_0111_1100_00  
p_pppp_pppx_xx  
Read  
Calibration  
Byte  
SDO  
SDI  
SII  
0_0000_0000_00  
0_0100_1100_00  
x_xxxx_xxxx_xx  
Load “No  
Operation”  
Command  
SDO  
177  
7701C–AVR–12/08  
Note:  
a = address high bits, b = address low bits, d = data in high bits, e = data in low bits, p = data out high bits, q = data out low bits,  
x = don’t care, 1 = Lock Bit1, 2 = Lock Bit2, 3 = CKSEL0 Fuse, 4 = CKSEL1 Fuse, 5 = CKSEL2 Fuse, 6 = CKSEL3 Fuse, 7 =  
SUT0 Fuse, 8 = SUT1 Fuse, 9 = CKDIV8 Fuse, A = CKOUT Fuse, B = BODLEVEL0 Fuse, C = BODLEVEL1 Fuse, D=  
BODLEVEL2 Fuse, E = EESAVE Fuse, F = WDTON Fuse, G = SPIEN Fuse, H = DWEN Fuse, I = RSTDISBL Fuse  
Notes: 1. For page sizes less than 256 words, parts of the address (bbbb_bbbb) will be parts of the page address.  
2. For page sizes less than 256 bytes, parts of the address (bbbb_bbbb) will be parts of the page address.  
3. The EEPROM is written page-wise. But only the bytes that are loaded into the page are actually written to the EEPROM.  
Page-wise EEPROM access is more efficient when multiple bytes are to be written to the same page. Note that auto-erase  
of EEPROM is not available in High-voltage Serial Programming, only in SPI Programming.  
178  
ATtiny24/44/84  
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ATtiny24/44/84  
22. Electrical Characteristics  
22.1 Absolute Maximum Ratings  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability.  
Automotive Operating Temperature.............– 40°C to +125° C  
Storage Temperature....................................– 65°C to +150°C  
Voltage on any Pin except RESET  
with respect to Ground ..............................0.5V to VCC+0.5V  
Voltage on RESET with respect to Ground....0.5V to +13.0V  
Voltage on VCC with respect to Ground.............0.5V to 6.0V  
DC Current per I/O Pin ............................................... 40.0 mA  
DC Current VCC and GND Pins................................ 200.0 mA  
Injection Current at VCC = 0V to 5V(2)....................... ±5.0mA(1)  
Note:  
1. Maximum current per port = ±30mA  
2. Functional corruption may occur .  
Table 22-1. DC Characteristics TA = -40°C to 125°C, VCC = 2.7V to 5.5V (unless otherwise noted)(1)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Units  
VIL  
Input Low Voltage  
VCC = 2.4V - 5.5V  
-0.5  
0.3VCC  
V
Input High-voltage  
Except RESET pin  
(3)  
(3)  
VIH  
VCC = 2.4V - 5.5V  
0.6VCC  
0.9VCC  
VCC +0.5(2)  
VCC +0.5(2)  
V
V
Input High-voltage  
RESET pin  
VIH2  
Output Low Voltage(4)  
(Port B,PORTA)  
IOL = 10 mA, VCC = 5V  
IOL = 5 mA, VCC = 3V  
0.8  
0.5  
V
V
VOL  
Output High-voltage(5)  
(Port B2:0,PORTA)  
IOH = -10 mA, VCC = 5V  
IOH = -5 mA, VCC = 3V  
4.3  
2.5  
V
V
VOH  
Input Leakage  
Current I/O Pin  
Vcc = 5.5V, pin low  
(absolute value)  
IILPORTA  
IIHPORTA  
IIHPORTB  
IILPORTB  
50  
50  
1
nA  
nA  
µA  
µA  
Input Leakage  
Current I/O Pin  
Vcc = 5.5V, pin high  
(absolute value)  
Input Leakage  
Current I/O Pin  
Vcc = 5.5V, pin low  
(absolute value)  
<0.05  
<0.05  
Input Leakage  
Current I/O Pin  
Vcc = 5.5V, pin high  
(absolute value)  
1
RRST  
Rpu  
Reset Pull-up Resistor  
I/O Pin Pull-up Resistor  
30  
20  
60  
50  
kΩ  
kΩ  
179  
7701C–AVR–12/08  
Table 22-1. DC Characteristics TA = -40°C to 125°C, VCC = 2.7V to 5.5V (unless otherwise noted)(1) (Continued)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
0.4  
Max.  
1.5  
3.0  
10.0  
0.2  
0.5  
2.5  
30  
Units  
mA  
mA  
mA  
mA  
mA  
mA  
µA  
Active 1MHz, VCC = 3V  
Active 4MHz, VCC = 3V  
Active 8MHz, VCC = 5V  
Idle 1MHz, VCC = 3V  
Idle 4MHz, VCC = 3V  
Idle 8MHz, VCC = 5V  
WDT enabled, VCC = 3V  
WDT enabled, VCC = 5V  
WDT disabled, VCC = 3V  
WDT disabled, VCC = 5V  
1.8  
5.0  
Power Supply Current  
0.075  
0.3  
ICC  
1.2  
5.0  
9.0  
50  
µA  
Power-down mode  
2.5  
24  
µA  
4.3  
36  
µA  
Analog Comparator Input  
Leakage Current  
VCC = 5V  
Vin = VCC/2  
IACLK  
-50  
50  
nA  
Notes: 1. All DC Characteristics contained in this data sheet are based on actual silicon characterization of ATtiny24/44/84 AVR micro-  
controllers manufactured in corner run process technology. These values are preliminary values representing design  
targets, and will be updated after characterization of actual Automotive silicon.  
2. “Max” means the highest value where the pin is guaranteed to be read as low.  
3. “Min” means the lowest value where the pin is guaranteed to be read as high.  
4. Although each I/O port can sink more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state  
conditions (non-transient), the following must be observed:  
1] The sum of all IOL, for all ports, should not exceed 60 mA.  
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater  
than the listed test condition.  
5. Although each I/O port can source more than the test conditions (10 mA at VCC = 5V, 5 mA at VCC = 3V) under steady state  
conditions (non-transient), the following must be observed:  
1] The sum of all IOH, for all ports, should not exceed 60 mA.  
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current  
greater than the listed test condition. Pull up driving strenght of the PB3 RESET pad is weak.  
22.2 Speed Grades  
Figure 22-1. Maximum Frequency vs. VCC  
16MHz  
8MHz  
Safe Operating  
Area  
2.7V  
4.5V  
5.5V  
180  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
22.3 Clock Characterizations  
22.3.1  
Calibrated Internal RC Oscillator Accuracy  
Table 22-2. Calibration Accuracy of Internal RC Oscillator  
Frequency  
VCC  
Temperature  
Accuracy  
Factory  
Calibration  
8.0 MHz  
3V  
25°C  
±2%  
User Calibration  
Oscillator Jitter  
7.3 - 8.1 MHz  
8.0 MHz  
2.7V - 5.5V  
2.7V - 5.5V  
-40°C - 125°C  
-40° C - 125°  
±20%  
Standard Deviation 0.4 ns(1)  
Note:  
1. The overall jitter increase proportionally to the divider ratio  
Example: with Oscillator divided by 32, jitter standard deviation will be 32 x 0.4 ns = 12.8 ns.  
22.3.2  
External Clock Drive Waveforms  
Figure 22-2. External Clock Drive Waveforms  
VIH1  
VIL1  
22.3.3  
External Clock Drive  
Table 22-3. External Clock Drive  
VCC = 2.7 - 5.5V  
VCC = 4.5 - 5.5V  
Symbol  
1/tCLCL  
tCLCL  
Parameter  
Min.  
0
Max.  
Min.  
0
Max.  
Units  
MHz  
ns  
Clock Frequency  
10  
20  
Clock Period  
100  
40  
50  
20  
20  
tCHCX  
tCLCX  
High Time  
ns  
Low Time  
40  
ns  
tCLCH  
Rise Time  
1.6  
1.6  
2
0.5  
0.5  
2
μs  
tCHCL  
Fall Time  
μs  
ΔtCLCL  
Change in period from one clock cycle to the next  
%
181  
7701C–AVR–12/08  
22.4 System and Reset Characterizations  
Table 22-4. Reset, Brown-out and Internal Voltage Reference Characteristics(1)  
Symbol  
Parameter  
Condition  
Min  
50  
Typ  
Max  
250  
mV  
Units  
VHYST  
Brown-out Detector Hysteresis  
RAM Retention Voltage(1)  
100  
mV  
2.  
VRAM  
tBOD  
VBG  
tBG  
Min Pulse Width on Brown-out Reset  
Bandgap reference voltage  
Bandgap reference start-up time  
Bandgap reference current consumption  
2
ns  
V
VC C= 2.7V, TA = 25°C  
VC C= 2.7V, TA = 25°C  
VC C= 2.7V, TA = 25°C  
1.0  
1.1  
40  
10  
1.2  
70  
µs  
µA  
IBG  
Notes: 1. Values are guidelines only.  
2. This is the limit to which VDD can be lowered without losing RAM data  
Table 22-5. BODLEVEL Fuse Coding(1)  
BODLEVEL [2..0] Fuses  
Min VBOT  
Typ VBOT  
Max VBOT  
Units  
111  
110  
101  
100  
011  
010  
001  
000  
BOD Disabled  
1.8  
2.7  
4.3  
2.3  
2.2  
1.9  
2.0  
V
Note:  
1. VBOT may be below nominal minimum operating voltage for some devices. For devices where  
this is the case, the device is tested down to VCC = VBOT during the production test. This guar-  
antees that a Brown-out Reset will occur before VCC drops to a voltage where correct  
operation of the microcontroller is no longer guaranteed.  
22.5 ADC Characteristics – Preliminary Data  
Table 22-6. ADC Characteristics, Single Ended Channels. -40 C - 125 C  
Symbol Parameter  
Condition  
Min  
Typ  
Max  
Units  
Resolution  
Single Ended Conversion  
10  
Bits  
Single Ended Conversion  
VREF = 4V, VCC = 4V,  
ADC clock = 200 kHz  
2.0  
2.0  
4.0  
LSB  
LSB  
Absolute accuracy (Including  
INL, DNL, quantization error,  
gain and offset error)  
TUE  
Single Ended Conversion  
VREF = 4V, VCC = 4V,  
ADC clock = 200 kHz  
4.0  
Noise Reduction Mode  
182  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Table 22-6. ADC Characteristics, Single Ended Channels. -40 C - 125 C  
Symbol Parameter  
Condition  
Min  
Typ  
Max  
Units  
Single Ended Conversion  
VREF = 4V, VCC = 4V,  
ADC clock = 200 kHz  
Integral Non-linearity (INL)  
0.5  
1.5  
LSB  
INL  
Single Ended Conversion  
VREF = 4V, VCC = 4V,  
ADC clock = 200 kHz  
Differential Non-linearity  
(DNL)  
0.3  
-3.0  
1.5  
0.7  
5.0  
3.5  
LSB  
LSB  
LSB  
DNL  
Single Ended Conversion  
Gain Error  
VREF = 4V, VCC = 4V,  
-5.0  
-3.5  
ADC clock = 200 kHz  
Single Ended Conversion  
VREF = 4V, VCC = 4V,  
Offset Error  
ADC clock = 200 kHz  
Conversion Time  
Free Running Conversion  
65  
50  
260  
200  
µs  
kHz  
V
Clock Frequency  
Vref  
VIN  
External Voltage Reference  
Input Voltage  
2.56  
GND  
1.0  
AVCC  
VREF  
1.2  
V
VINT  
RAIN  
Internal Voltage Reference  
Analog Input Resistance  
1.1  
V
100  
MΩ  
183  
7701C–AVR–12/08  
Table 22-7. ADC Characteristics, Differential Channels, TA = -40°C to 125°C  
Symbol Parameter  
Condition  
Gain = 1x  
Gain = 20x  
Min  
Typ  
8
Max  
Units  
Bits  
Resolution  
8
Bits  
Gain = 1x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
2.5  
3.0  
0.5  
0.5  
1.5  
0.4  
0.4  
0.7  
2.3  
5.0  
6.0  
2.5  
3.0  
5.0  
1.0  
1.0  
2.0  
5.0  
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
LSB  
TUE  
Absolute Accuracy  
Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Gain = 1x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Bipolar - Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
INL  
Integral Non-Linearity (INL)  
Unipolar - Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Gain = 1x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Bipolar - Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
DNL  
Differential Non-linearity (DNL)  
Unipolar - Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Bipolar -Gain = 1x  
-5.0  
-5.0  
-7.0  
-7.0  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Unipolar -Gain = 1x  
-2.8  
2.2  
5.0  
7.0  
7.0  
LSB  
LSB  
LSB  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Gain Error  
Bipolar -Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Unipolar -Gain = 20x  
-1.8  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
184  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Table 22-7. ADC Characteristics, Differential Channels, TA = -40°C to 125°C (Continued)  
Symbol Parameter  
Condition  
Min  
Typ  
Max  
Units  
Gain = 1x  
VREF = 4V, VCC = 5V  
-5.0  
2.0  
5.0  
LSB  
ADC clock = 50 - 200 kHz  
Bipolar - Gain = 20x  
Offset Error  
V
REF = 4V, VCC = 5V  
-5.0  
-6.5  
2.0  
2.0  
5.0  
6.5  
LSB  
LSB  
ADC clock = 50 - 200 kHz  
Unipolar - Gain = 20x  
VREF = 4V, VCC = 5V  
ADC clock = 50 - 200 kHz  
Clock Frequency  
50  
65  
200  
260  
kHz  
µs  
V
Conversion Time  
Reference Voltage  
Input Voltage  
VREF  
VIN  
2.56  
AVCC - 0.5  
AVCC  
GND  
V
VDIFF  
Input Differential Voltage  
-VREF/Gain  
VREF/Gain  
V
22.6 Serial Programming Characteristics  
Figure 22-3. Serial Programming Timing  
MOSI  
tSLSH  
tOVSH  
tSHOX  
SCK  
tSHSL  
MISO  
tSLIV  
Figure 22-4. Serial Programming Waveforms  
SERIAL DATA INPUT  
MSB  
LSB  
LSB  
(MOSI)  
SERIAL DATA OUTPUT  
MSB  
(MISO)  
SERIAL CLOCK INPUT  
(SCK)  
SAMPLE  
185  
7701C–AVR–12/08  
Table 22-8. Serial Programming Characteristics, TA = -40° C to 125° C, VCC = 2.7 - 5.5V  
(Unless Otherwise Noted)  
Symbol  
1/tCLCL  
tCLCL  
Parameter  
Min  
0
Typ  
Max  
Units  
MHz  
ns  
Oscillator Frequency (ATtiny24/44/84V)  
Oscillator Period (ATtiny24/44/84V)  
4
250  
Oscillator Frequency (ATtiny24/44/84, VCC = 4.5V -  
5.5V)  
1/tCLCL  
0
20  
MHz  
tCLCL  
tSHSL  
tSLSH  
tOVSH  
tSHOX  
tSLIV  
Oscillator Period (ATtiny24/44/84, VCC = 4.5V - 5.5V)  
SCK Pulse Width High  
50  
ns  
ns  
ns  
ns  
ns  
ns  
2 tCLCL*  
SCK Pulse Width Low  
2 tCLCL  
*
MOSI Setup to SCK High  
tCLCL  
MOSI Hold after SCK High  
SCK Low to MISO Valid  
2 tCLCL  
TBD  
TBD  
TBD  
Note:  
1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz  
22.7 High-voltage Serial Programming Characteristics  
Figure 22-5. High-voltage Serial Programming Timing  
CC  
CK  
Table 22-9. High-voltage Serial Programming Characteristics  
TA = 25°C ± 10%, VCC = 5.0V ± 10% (Unless otherwise noted)  
Symbol  
tSHSL  
Parameter  
Min  
110  
110  
50  
Typ  
Max  
Units  
ns  
SCI (PB0) Pulse Width High  
tSLSH  
SCI (PB0) Pulse Width Low  
ns  
tIVSH  
SDI (PA6), SII (PB1) Valid to SCI (PB0) High  
SDI (PA6), SII (PB1) Hold after SCI (PB0) High  
SCI (PB0) High to SDO (PA4) Valid  
Wait after Instr. 3 for Write Fuse Bits  
ns  
tSHIX  
50  
ns  
tSHOV  
16  
ns  
tWLWH_PFB  
2.5  
ms  
186  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
187  
7701C–AVR–12/08  
23. Typical Characteristics – Preliminary Data  
The data contained in this section is largely based on simulations and characterization of similar  
devices in the same process and design methods. Thus, the data should be treated as indica-  
tions of how the part will behave.  
The following charts show typical behavior. These figures are not tested during manufacturing.  
All current consumption measurements are performed with all I/O pins configured as inputs and  
with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock  
source.  
The power consumption in Power-down mode is independent of clock selection.  
The current consumption is a function of several factors such as: operating voltage, operating  
frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient tempera-  
ture. The dominating factors are operating voltage and frequency.  
The current drawn from capacitive loaded pins may be estimated (for one pin) as CL*VCC*f where  
CL = load capacitance, VCC = operating voltage and f = average switching frequency of I/O pin.  
The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to  
function properly at frequencies higher than the ordering code indicates.  
The difference between current consumption in Power-down mode with Watchdog Timer  
enabled and Power-down mode with Watchdog Timer disabled represents the differential cur-  
rent drawn by the Watchdog Timer.  
23.1 Active Supply Current  
Figure 23-1. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) - Temp.=25°C  
ACTIVE S UP P LY CURRENT vs . LOW FREQUENCY  
0.1 - 1.0 MHz - Temperature = 25˚C  
1.2  
5.5 V  
1
0.8  
0.6  
0.4  
0.2  
0
5.0 V  
4.5 V  
3.3 V  
3.0 V  
2.7 V  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
Figure 23-2. Active Supply Current vs. Low Frequency (0.1 - 1.0 MHz) - Temp.=125°C  
188  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
ACTIVE S UP P LY CURRENT vs . LOW FREQUENCY  
0.1 - 1.0 MHz - Temperature = 125˚C  
1.2  
1
5.5 V  
5.0 V  
4.5 V  
0.8  
0.6  
0.4  
0.2  
0
3.3 V  
3.0 V  
2.7 V  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
Figure 23-3. Active Supply Current vs. frequency (1 - 20 MHz) - Temp.=25°C  
ACTIVE S UP P LY CURRENT vs . FREQUENCY  
1 - 20 MHz - Temperature = 25˚C  
25  
20  
15  
10  
5
5.5 V  
5.0 V  
4.5 V  
3.3 V  
3.0 V  
2.7 V  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
Figure 23-4. Active Supply Current vs. frequency (1 - 20 MHz) - Temp.=125°C  
189  
7701C–AVR–12/08  
ACTIVE S UP P LY CURRENT vs . FREQUENCY  
1 - 20 MHz - Temperature = 125˚C  
25  
20  
15  
10  
5
5.5 V  
5.0 V  
4.5 V  
3.3 V  
3.0 V  
2.7 V  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
Figure 23-5. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)  
ACTIVE S UP P LY CURRENT vs . VCC  
INTERNAL RC OSCILLATOR, 8 MHz  
7
6
5
4
3
2
1
0
125 ˚C  
85 ˚C  
25 ˚C  
-45 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
190  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-6. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)  
ACTIVE SUPPLY CURRENT vs . VCC  
INTERNAL RC OSCILLATOR, 1MHz  
1.4  
1.2  
1
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
0.8  
0.6  
0.4  
0.2  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 23-7. Active Supply Current vs. VCC (Internal RC Oscillator, 128 kHz)  
ACTIVE S UP P LY CURRENT vs . V CC  
INTERNAL RC OSCILLATOR, 128 KHz  
0.2  
0.16  
0.12  
0.08  
0.04  
0
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
191  
7701C–AVR–12/08  
23.2 Idle Supply Current  
Figure 23-8. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz)  
IDLE S UP P LY CURRENT vs . LOW FREQUENCY  
0.1 - 1.0 MHz - Temperature= 125˚C  
0.012  
0.01  
5.5 V  
5.0 V  
4.5 V  
0.008  
0.006  
0.004  
0.002  
0
3.3 V  
3.0 V  
2.7 V  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
Figure 23-9. Idle Supply Current vs. Frequency (1 - 20 MHz)  
IDLE SUPPLY CURRENT vs. FREQUENCY  
1 - 20 MHz - Temperature = 125 ˚C  
4
3.5  
3
5.5 V  
5.0 V  
4.5 V  
2.5  
2
3.3 V  
3.0 V  
2.7 V  
1.5  
1
0.5  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
192  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-10. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)  
IDLE SUPPLY CURRENT vs. VCC  
INTERNAL RC OSCILLATOR, 8 MHz  
2
1.8  
1.6  
1.4  
1.2  
1
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
0.8  
0.6  
0.4  
0.2  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 23-11. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)  
IDLE SUPPLY CURRENT vs. VCC  
INTERNAL RC OSCILLATOR, 1 MHz  
0.35  
0.3  
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
0.25  
0.2  
0.15  
0.1  
0.05  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
193  
7701C–AVR–12/08  
Figure 23-12. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)  
IDLE SUPPLY CURRENT vs. VCC  
INTERNAL RC OSCILLATOR, 128 KHz  
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
194  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
23.3 Supply Current of IO modules  
The tables and formulas below can be used to calculate the additional current consumption for  
the different I/O modules in Active and Idle mode. The enabling or disabling of the I/O modules  
are controlled by the Power Reduction Register. See ”Power Reduction Register” on page 35 for  
details.  
Table 23-1. Additional Current Consumption for the different I/O modules (absolute values)  
PRR bit  
Typical numbers  
VCC = 2V, F = 1MHz  
6.6 uA  
VCC = 3V, F = 4MHz  
26 uA  
VCC = 5V, F = 8MHz  
106 uA  
PRTIM1  
PRTIM0  
PRUSI  
8.7uA  
35 uA  
22 uA  
87 uA  
140 uA  
87 uA  
5.5 uA  
PRADC  
22 uA  
340 uA  
195  
7701C–AVR–12/08  
23.4 Power-down Supply Current  
Figure 23-13. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)  
POWER-DOWN SUPPLY CURRENT vs. VCC  
WATCHDOG TIMER DISABLED  
5
4.5  
4
3.5  
3
125 ˚C  
85 ˚C  
2.5  
2
1.5  
1
0.5  
0
25 ˚C  
-45 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
Figure 23-14. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)  
POWER-DOWN SUPPLY CURRENT vs. VCC  
WATCHDOG TIMER ENABLED  
10  
9
8
7
6
5
4
3
2
1
0
125 ˚C  
-45 ˚C  
85 ˚C  
25 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
196  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
23.5 Pin Pull-up  
Figure 23-15. I/O Pin Pull-up Resistor Current vs. input Voltage (VCC = 2.7V)  
I/O P IN P ULL-UP RES IS TOR CURRENT vs . INP UT VOLTAGE  
VCC = 2.7V  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-45 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
0
0.5  
1
1.5  
2
2.5  
3
V
OP (V)  
Figure 23-16. I/O pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)  
I/O P IN P ULL-UP RES IS TOR CURRENT vs . INP UT VOLTAGE  
VCC = 5.0V  
160  
140  
120  
100  
80  
60  
40  
-45 ˚C  
25 ˚C  
85 ˚C  
20  
125 ˚C  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
VOP (V)  
197  
7701C–AVR–12/08  
Figure 23-17. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)  
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE  
Vcc = 2.7V  
60  
-40 ˚C  
50  
125 ˚C  
40  
30  
20  
10  
0
0
0.5  
1
1.5  
2
2.5  
3
VRESET (V)  
Figure 23-18. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)  
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE  
Vcc = 5.0V  
120  
-40 ˚C  
100  
125 ˚C  
80  
60  
40  
20  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
VRESET (V)  
198  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
23.6 Pin Driver Strength  
Figure 23-19. I/O Pin Output Voltage vs. Sink Current (VCC = 3V)  
I/O PIN OUTPUT VOLTAGE vs . SINK CURRENT  
LOW POWER PINS @ Vcc = 3V  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
IOL (mA)  
Figure 23-20. I/O pin Output Voltage vs. Sink Current (VCC = 5V)  
I/O PIN OUTPUT VOLTAGE vs . SINK CURRENT  
LOW POWER PINS - Vcc = 5.0V  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
125 ˚C  
85 ˚C  
25 ˚C  
-45 ˚C  
0
2
4
6
8
10  
OL (mA)  
12  
14  
16  
18  
20  
I
199  
7701C–AVR–12/08  
Figure 23-21. I/O Pin Output Voltage vs. Source Current (VCC = 3V)  
I/O PIN OUTPUT VOLTAGE vs . SOURCE CURRENT  
LOW POWER PINS @ vcc = 3V  
3.5  
3
2.5  
2
-45 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
1.5  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
IOH (mA)  
Figure 23-22. I/O Pin output Voltage vs. Source Current (VCC = 5V)  
I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT  
LOW POWER PINS @ vc c = 5V  
5.1  
5
4.9  
4.8  
4.7  
4.6  
4.5  
4.4  
4.3  
-45 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
0
2
4
6
8
10  
12  
14  
16  
18  
20  
IOH (mA)  
200  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
23.7 Pin Threshold and Hysteresis  
Figure 23-23. I/O Pin Input Threshold Voltage vs. VCC (VIH, IO Pin Read as ‘1’)  
I/O P IN INP UT THRES HOLD VOLTAGE vs . V  
CC  
VIH, IO PIN READ AS '1'  
3.5  
3
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
2.5  
2
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 23-24. I/O Pin Input threshold Voltage vs. VCC (VIL, IO Pin Read as ‘0’)  
I/O P IN INP UT THRES HOLD VOLTAGE vs . V CC  
VIL, IO PIN READ AS '0'  
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
2.5  
2
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
201  
7701C–AVR–12/08  
Figure 23-25. I/O Pin Input Hysteresis vs. VCC  
I/O P IN INP UT HYS TE RE S IS vs . V CC  
0.5  
0.45  
0.4  
125 ˚C  
85 ˚C  
-20 ˚C  
-40 ˚C  
0.35  
0.3  
0.25  
0.2  
0.15  
0.1  
0.05  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 23-26. Reset Input Threshold Voltage vs. VCC (VIH, IO Pin Threshold as ‘1’)  
RES ET P IN AS I/O THRES HOLD VOLTAGE vs . VCC  
VIH, RESET READ AS '1'  
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
3
2.5  
2
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
202  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-27. Reset Input Threshold Voltage vs. VCC (VIL, IO pin Read as ‘0’)  
RESET PIN AS I/O THRESHOLD VOLTAGE vs. VCC  
VIL, RESET READ AS '0'  
3
2.5  
2
125 ˚C  
85 ˚C  
25 ˚C  
-45 ˚C  
1.5  
1
0.5  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
Figure 23-28. Reset Pin Input Hysteresis vs. VCC  
RES ET P IN INP UT HYS TERES IS vs . V CC  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
203  
7701C–AVR–12/08  
23.8 BOD Threshold and Analog Comparator Offset  
Figure 23-29. BOD Threshold vs. Temperature (BODLEVEL is 4.3V)  
BANDGAP VOLTAGE vs . TEMPERATURE  
BOD = 4.3V  
4.4  
4.35  
4.3  
1
0
4.25  
4.2  
4.15  
-40 -30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120  
Temperature (C)  
Figure 23-30. BOD Threshold vs, Temperature (BODLEVEL is 2.7V)  
BANDGAP VOLTAGE vs . TEMPERATURE  
BOD = 2.7V  
2.78  
2.76  
2.74  
2.72  
2.7  
1
0
2.68  
2.66  
2.64  
-40 -30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120  
Temperature (C)  
204  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-31. BOD Threshold vs. Temperature (BODLEVEL is 1.8V)  
BANDGAP VOLTAGE vs . TEMPERATURE  
BOD = 1.8V  
1.85  
1.84  
1.83  
1.82  
1.81  
1.8  
1
0
1.79  
1.78  
-40 -30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120  
Temperature (C)  
23.9 Internal Oscillator Speed  
Figure 23-32. Watchdog Oscillator Frequency vs. VCC  
WATCHDOG OSCILLATOR FREQUENCY vs . OPERATING VOLTAGE  
124  
122  
120  
118  
116  
114  
112  
110  
108  
106  
104  
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
205  
7701C–AVR–12/08  
Figure 23-33. Calibrated 8 MHz RC Oscillator Frequency vs. VCC  
CALIBRATED 8.0MHz RC OS CILLATOR FREQUENCY vs . OP ERATING VOLTAGE  
9
8.5  
8
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
7.5  
7
6.5  
6
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
Figure 23-34. Calibrated 8 MHz RC oscillator Frequency vs. Temperature  
CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. TEMPERATURE  
8.4  
8.3  
8.2  
8.1  
8
5.0 V  
3.0 V  
7.9  
7.8  
7.7  
-40 -30 -20 -10  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100 110 120  
Te mpe ra ture  
206  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-35. Calibrated 8 MHz RC Oscillator Frequency vs, OSCCAL Value  
CALIBRATED 8.0MHz RC OSCILLATOR FREQUENCY vs. OSCCAL VALUE  
(Vcc=3V)  
16  
14  
12  
10  
8
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
6
4
2
0
0
16  
32  
48  
64  
80  
96 112 128 144 160 176 192 208 224 240  
OSCCAL (X1)  
23.10 Current Consumption of Peripheral Units  
Figure 23-36. ADC Current vs. VCC  
ADC CURRENT vs. V  
CC  
4.0 MHZ FREQUENCY  
700  
600  
500  
400  
300  
200  
100  
0
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
207  
7701C–AVR–12/08  
Figure 23-37. AREF External Reference Current vs. VCC  
AREF CURRENT vs . AREF VOLTAGE WHEN USED AS ADC REFERENCE  
(Vcc=5.5V)  
14  
12  
10  
8
25 ˚C  
6
4
2
0
1.5  
2
2.5  
3
3.5  
AREF (V)  
4
4.5  
5
5.5  
Figure 23-38. Analog Comparator Current vs. VCC  
ADC CURRENT vs. V  
CC  
4.0 MHZ FREQUENCY  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
208  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-39. Programming Current vs. VCC  
I/O MODULE CURRENT vs. VCC  
4.0 MHZ FREQUENCY  
12000  
10000  
8000  
6000  
4000  
2000  
0
25 ˚C  
2.5  
3.5  
4.5  
5.5  
VCC (V)  
Figure 23-40. Brownout Detector Current vs. VCC  
BROWNOUT DETECTOR CURRENT vs . VCC  
BOD le ve l = 1.8V  
16  
14  
12  
10  
8
125 ˚C  
6
25 ˚C  
4
85 ˚C  
2
-40 ˚C  
0
1.5  
1.6  
1.7  
1.8  
1.9  
2
2.1  
2.2  
2.3  
2.4  
2.5  
VCC (V)  
209  
7701C–AVR–12/08  
Figure 23-41. Watchdog Timer Current vs. VCC  
WATCHDOG TIMER CURRENT vs VCC  
30  
25  
20  
15  
10  
5
-40 ˚C  
25 ˚C  
85 ˚C  
125 ˚C  
0
2.5  
3
3.5  
4
4.5  
5
5.5  
V
CC (V)  
23.11 Current Consumption in Reset and Reset Pulse width  
Figure 23-42. Reset Supply Current vs. VCC (0.1 - 1.0 MHz, excluding Current Through the  
Reset Pull-up)  
RES ET S UP P LY CURRENT vs . VCC  
EXCLUDING CURRENT THROUGH THE RESET PULLUP  
0.2  
5.5 V  
5.0 V  
4.5 V  
0.18  
0.16  
0.14  
0.12  
3.3 V  
3.0 V  
2.7 V  
0.1  
0.08  
0.06  
0.04  
0.02  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
Frequency (MHz)  
210  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Figure 23-43. Reset Supply Current vs. VCC (1 - 20 MHz, Excluding Current Through the Reset  
Pull-up)  
RES ET S UP P LY CURRENT vs . V CC  
EXCLUDING CURRENT THROUGH THE RESET PULLUP  
3
2.5  
5.5 V  
5.0 V  
2
4.5 V  
1.5  
3.6 V  
3.3 V  
3.0 V  
1
2.7 V  
0.5  
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
Frequency (MHz)  
Figure 23-44. Minimum Reset Pulse Width vs. VCC  
MINIMUM RES ET P ULS E WIDTH vs . V CC  
1200  
1000  
800  
600  
400  
200  
0
125 ˚C  
85 ˚C  
25 ˚C  
-40 ˚C  
2.5  
3
3.5  
4
4.5  
5
5.5  
VCC (V)  
211  
7701C–AVR–12/08  
24. Register Summary  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Page  
0x3F (0x5F)  
0x3E (0x5E)  
0x3D (0x5D)  
0x3C (0x5C)  
0x3B (0x5B)  
0x3A (0x5A  
0x39 (0x59)  
0x38 (0x58)  
0x37 (0x57)  
0x36 (0x56)  
0x35 (0x55)  
0x34 (0x54)  
0x33 (0x53)  
0x32 (0x52)  
0x31 (0x51)  
0x30 (0x50)  
0x2F (0x4F)  
0x2E (0x4E)  
0x2D (0x4D)  
0x2C (0x4C)  
0x2B (0x4B)  
0x2A (0x4A)  
0x29 (0x49)  
0x28 (0x48)  
0x27 (0x47)  
0x26 (0x46)  
0x25 (0x45)  
0x24 (0x44)  
0x23 (0x43)  
0x22 (0x42)  
0x21 (0x41)  
0x20 (0x40)  
0x1F (0x3F)  
0x1E (0x3E)  
0x1D (0x3D)  
0x1C (0x3C)  
0x1B (0x3B)  
0x1A (0x3A)  
0x19 (0x39)  
0x18 (0x38)  
0x17 (0x37)  
0x16 (0x36)  
0x15 (0x35)  
0x14 (0x34)  
0x13 (0x33)  
0x12 (0x32)  
0x11 (0x31))  
0x10 (0x30)  
0x0F (0x2F)  
0x0E (0x2E)  
0x0D (0x2D)  
0x0C (0x2C)  
0x0B (0x2B)  
0x0A (0x2A)  
0x09 (0x29)  
0x08 (0x28)  
0x07 (0x27)  
0x06 (0x26)  
0x05 (0x25)  
0x04 (0x24)  
0x03 (0x23)  
0x02 (0x22)  
0x01 (0x21)  
0x00 (0x20)  
SREG  
SPH  
I
T
H
S
V
N
Z
C
Page 8  
Page 11  
Page 11  
Page 88  
Page 53  
Page 54  
Page 89  
Page 89  
Page 162  
Page 88  
Page 53  
Page 46  
Page 87  
Page 88  
Page 32  
Page 84  
Page 113  
Page 115  
Page 117  
Page 117  
Page 117  
Page 117  
Page 117  
Page 117  
Page 158  
Page 32  
Page 118  
Page 118  
Page 121  
Page 116  
Page 46  
Page 54  
Page 22  
Page 22  
Page 22  
Page 22  
Page 71  
Page 71  
Page 71  
Page 71  
Page 71  
Page 72  
Page 24  
Page 24  
Page 24  
Page 55  
SP9  
SP1  
SP8  
SP0  
SPL  
SP7  
SP6  
SP5  
SP4  
SP3  
SP2  
Timer/Counter0 – Output Compare Register B  
OCR0B  
GIMSK  
GIFR  
PCIE0  
PCIF0  
INT0  
PCIE1  
INTF0  
PCIF1  
TIMSK0  
TIFR0  
OCIE0B  
OCF0B  
PGWRT  
OCIE0A  
OCF0A  
PGERS  
TOIE0  
TOV0  
SPMEN  
SPMCSR  
OCR0A  
MCUCR  
MCUSR  
TCCR0B  
TCNT0  
OSCCAL  
TCCR0A  
TCCR1A  
TCCR1B  
TCNT1H  
TCNT1L  
OCR1AH  
OCR1AL  
OCR1BH  
OCR1BL  
DWDR  
CTPB  
RFLB  
Timer/Counter0 – Output Compare Register A  
PUD  
SE  
SM1  
SM0  
ISC01  
EXTRF  
CS01  
ISC00  
PORF  
CS00  
WDRF  
WGM02  
BORF  
CS02  
FOC0A  
FOC0B  
Timer/Counter0  
CAL7  
CAL6  
COM0A0  
COM1A0  
ICES1  
CAL5  
COM0B1  
COM1B1  
CAL4  
CAL3  
CAL2  
CAL1  
WGM01  
WGM11  
CS11  
CAL0  
WGM00  
WGM10  
CS10  
COM0A1  
COM1A1  
ICNC1  
COM0B0  
COM1B0  
WGM13  
WGM12  
CS12  
Timer/Counter1 – Counter Register High Byte  
Timer/Counter1 – Counter Register Low Byte  
Timer/Counter1 – Compare Register A High Byte  
Timer/Counter1 – Compare Register A Low Byte  
Timer/Counter1 – Compare Register B High Byte  
Timer/Counter1 – Compare Register B Low Byte  
DWDR[7:0]  
CLKPR  
ICR1H  
CLKPCE  
CLKPS3  
CLKPS2  
CLKPS1  
CLKPS0  
Timer/Counter1 - Input Capture Register High Byte  
Timer/Counter1 - Input Capture Register Low Byte  
ICR1L  
GTCCR  
TCCR1C  
WDTCSR  
PCMSK1  
EEARH  
EEARL  
EEDR  
TSM  
FOC1A  
WDIF  
FOC1B  
WDIE  
PSR10  
WDP3  
WDCE  
WDE  
PCINT11  
WDP2  
PCINT10  
WDP1  
PCINT9  
WDP0  
PCINT8  
EEAR8  
EEAR0  
EEAR7  
EEAR6  
EEAR5  
EEAR4  
EEAR3  
EEAR2  
EEAR1  
EEPROM Data Register  
EECR  
EEPM1  
EEPM0  
EERIE  
PORTA3  
DDA3  
EEMPE  
PORTA2  
DDA2  
EEPE  
PORTA1  
DDA1  
EERE  
PORTA0  
DDA0  
PORTA  
DDRA  
PORTA7  
PORTA6  
PORTA5  
PORTA4  
DDA7  
DDA6  
DDA5  
DDA4  
PINA  
PINA7  
PINA6  
PINA5  
PINA4  
PINA3  
PINA2  
PINA1  
PINA0  
PORTB  
DDRB  
PORTB3  
DDB3  
PORTB2  
DDB2  
PORTB1  
DDB1  
PORTB0  
DDB0  
PINB  
PINB3  
PINB2  
PINB1  
PINB0  
GPIOR2  
GPIOR1  
GPIOR0  
PCMSK0  
Reserved  
USIBR  
General Purpose I/O Register 2  
General Purpose I/O Register 1  
General Purpose I/O Register 0  
PCINT7  
PCINT6  
PCINT5  
PCINT4  
PCINT3  
PCINT2  
PCINT1  
PCINT0  
USI Buffer Register  
USI Data Register  
Page 130  
Page 130  
Page 130  
Page 131  
Page 118  
Page 119  
USIDR  
USISR  
USISIF  
USIOIF  
USIPF  
USIWM1  
ICIE1  
USIDC  
USICNT3  
USICNT2  
USICS0  
OCIE1B  
OCF1B  
USICNT1  
USICLK  
OCIE1A  
OCF1A  
USICNT0  
USITC  
TOIE1  
USICR  
USISIE  
USIOIE  
USIWM0  
USICS1  
TIMSK1  
TIFR1  
ICF1  
TOV1  
Reserved  
Reserved  
ACSR  
ACD  
REFS1  
ADEN  
ACBG  
REFS0  
ADSC  
ACO  
MUX5  
ADATE  
ACI  
MUX4  
ADIF  
ACIE  
MUX3  
ADIE  
ACIC  
MUX2  
ADPS2  
ACIS1  
MUX1  
ADPS1  
ACIS0  
MUX0  
ADPS0  
Page 136  
Page 150  
Page 153  
Page 154  
Page 154  
Page 155  
ADMUX  
ADCSRA  
ADCH  
ADC Data Register High Byte  
ADC Data Register Low Byte  
ADCL  
ADCSRB  
Reserved  
DIDR0  
BIN  
ACME  
ADLAR  
ADTS2  
ADTS1  
ADTS0  
ADC7D  
ADC6D  
ADC5D  
ADC4D  
ADC3D  
PRTIM1  
ADC2D  
PRTIM0  
ADC1D  
PRUSI  
ADC0D  
PRADC  
Page 137,Page 156  
Page 35  
PRR  
212  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Note:  
1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses  
should never be written.  
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these  
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.  
3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI  
instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The  
CBI and SBI instructions work with registers 0x00 to 0x1F only.  
213  
7701C–AVR–12/08  
25. Instruction Set Summary  
Mnemonics  
Operands  
Description  
Operation  
Flags  
#Clocks  
ARITHMETIC AND LOGIC INSTRUCTIONS  
ADD  
ADC  
ADIW  
SUB  
SUBI  
SBC  
SBCI  
SBIW  
AND  
ANDI  
OR  
Rd, Rr  
Rd, Rr  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd  
Add two Registers  
Rd Rd + Rr  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,N,V  
1
1
2
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Add with Carry two Registers  
Add Immediate to Word  
Subtract two Registers  
Subtract Constant from Register  
Subtract with Carry two Registers  
Subtract with Carry Constant from Reg.  
Subtract Immediate from Word  
Logical AND Registers  
Logical AND Register and Constant  
Logical OR Registers  
Rd Rd + Rr + C  
Rdh:Rdl Rdh:Rdl + K  
Rd Rd - Rr  
Rd Rd - K  
Rd Rd - Rr - C  
Rd Rd - K - C  
Rdh:Rdl Rdh:Rdl - K  
Rd Rd Rr  
Rd Rd K  
Z,N,V  
Rd Rd v Rr  
Z,N,V  
ORI  
Logical OR Register and Constant  
Exclusive OR Registers  
One’s Complement  
Rd Rd v K  
Z,N,V  
EOR  
COM  
NEG  
SBR  
CBR  
INC  
Rd Rd Rr  
Rd 0xFF Rd  
Rd 0x00 Rd  
Rd Rd v K  
Z,N,V  
Z,C,N,V  
Z,C,N,V,H  
Z,N,V  
Rd  
Two’s Complement  
Rd,K  
Rd,K  
Rd  
Set Bit(s) in Register  
Clear Bit(s) in Register  
Increment  
Rd Rd (0xFF - K)  
Rd Rd + 1  
Z,N,V  
Z,N,V  
DEC  
TST  
Rd  
Decrement  
Rd Rd 1  
Z,N,V  
Rd  
Test for Zero or Minus  
Clear Register  
Rd Rd Rd  
Rd Rd Rd  
Rd 0xFF  
Z,N,V  
CLR  
SER  
Rd  
Z,N,V  
Rd  
Set Register  
None  
BRANCH INSTRUCTIONS  
RJMP  
IJMP  
k
k
Relative Jump  
PC PC + k + 1  
None  
None  
None  
None  
None  
I
2
2
Indirect Jump to (Z)  
PC Z  
RCALL  
ICALL  
RET  
Relative Subroutine Call  
Indirect Call to (Z)  
PC PC + k + 1  
3
PC Z  
3
Subroutine Return  
PC STACK  
4
RETI  
Interrupt Return  
PC STACK  
4
CPSE  
CP  
Rd,Rr  
Compare, Skip if Equal  
Compare  
if (Rd = Rr) PC PC + 2 or 3  
Rd Rr  
None  
Z, N,V,C,H  
Z, N,V,C,H  
Z, N,V,C,H  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1/2/3  
1
Rd,Rr  
CPC  
Rd,Rr  
Compare with Carry  
Rd Rr C  
1
CPI  
Rd,K  
Compare Register with Immediate  
Skip if Bit in Register Cleared  
Skip if Bit in Register is Set  
Skip if Bit in I/O Register Cleared  
Skip if Bit in I/O Register is Set  
Branch if Status Flag Set  
Branch if Status Flag Cleared  
Branch if Equal  
Rd K  
1
SBRC  
SBRS  
SBIC  
Rr, b  
if (Rr(b)=0) PC PC + 2 or 3  
if (Rr(b)=1) PC PC + 2 or 3  
if (P(b)=0) PC PC + 2 or 3  
if (P(b)=1) PC PC + 2 or 3  
if (SREG(s) = 1) then PCPC+k + 1  
if (SREG(s) = 0) then PCPC+k + 1  
if (Z = 1) then PC PC + k + 1  
if (Z = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (N = 1) then PC PC + k + 1  
if (N = 0) then PC PC + k + 1  
if (N V= 0) then PC PC + k + 1  
if (N V= 1) then PC PC + k + 1  
if (H = 1) then PC PC + k + 1  
if (H = 0) then PC PC + k + 1  
if (T = 1) then PC PC + k + 1  
if (T = 0) then PC PC + k + 1  
if (V = 1) then PC PC + k + 1  
if (V = 0) then PC PC + k + 1  
if ( I = 1) then PC PC + k + 1  
if ( I = 0) then PC PC + k + 1  
1/2/3  
1/2/3  
1/2/3  
1/2/3  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
Rr, b  
P, b  
P, b  
s, k  
s, k  
k
SBIS  
BRBS  
BRBC  
BREQ  
BRNE  
BRCS  
BRCC  
BRSH  
BRLO  
BRMI  
BRPL  
BRGE  
BRLT  
BRHS  
BRHC  
BRTS  
BRTC  
BRVS  
BRVC  
BRIE  
BRID  
k
Branch if Not Equal  
k
Branch if Carry Set  
k
Branch if Carry Cleared  
Branch if Same or Higher  
Branch if Lower  
k
k
k
Branch if Minus  
k
Branch if Plus  
k
Branch if Greater or Equal, Signed  
Branch if Less Than Zero, Signed  
Branch if Half Carry Flag Set  
Branch if Half Carry Flag Cleared  
Branch if T Flag Set  
k
k
k
k
k
Branch if T Flag Cleared  
Branch if Overflow Flag is Set  
Branch if Overflow Flag is Cleared  
Branch if Interrupt Enabled  
Branch if Interrupt Disabled  
k
k
k
k
BIT AND BIT-TEST INSTRUCTIONS  
SBI  
CBI  
LSL  
LSR  
P,b  
P,b  
Rd  
Rd  
Set Bit in I/O Register  
Clear Bit in I/O Register  
Logical Shift Left  
I/O(P,b) 1  
None  
2
2
1
1
I/O(P,b) 0  
None  
Rd(n+1) Rd(n), Rd(0) 0  
Rd(n) Rd(n+1), Rd(7) 0  
Z,C,N,V  
Z,C,N,V  
Logical Shift Right  
214  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Mnemonics  
Operands  
Description  
Operation  
Flags  
#Clocks  
ROL  
Rd  
Rotate Left Through Carry  
Rd(0)C,Rd(n+1)Rd(n),CRd(7)  
Z,C,N,V  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
ROR  
ASR  
SWAP  
BSET  
BCLR  
BST  
BLD  
SEC  
CLC  
SEN  
CLN  
SEZ  
CLZ  
SEI  
Rd  
Rd  
Rd  
s
Rotate Right Through Carry  
Arithmetic Shift Right  
Swap Nibbles  
Rd(7)C,Rd(n)Rd(n+1),CRd(0)  
Z,C,N,V  
Rd(n) Rd(n+1), n=0..6  
Z,C,N,V  
Rd(3..0)Rd(7..4),Rd(7..4)Rd(3..0)  
None  
Flag Set  
SREG(s) 1  
SREG(s) 0  
T Rr(b)  
Rd(b) T  
C 1  
SREG(s)  
s
Flag Clear  
SREG(s)  
Rr, b  
Rd, b  
Bit Store from Register to T  
Bit load from T to Register  
Set Carry  
T
None  
C
C
N
N
Z
Clear Carry  
C 0  
Set Negative Flag  
N 1  
Clear Negative Flag  
Set Zero Flag  
N 0  
Z 1  
Clear Zero Flag  
Z 0  
Z
Global Interrupt Enable  
Global Interrupt Disable  
Set Signed Test Flag  
Clear Signed Test Flag  
Set Twos Complement Overflow.  
Clear Twos Complement Overflow  
Set T in SREG  
I 1  
I
CLI  
I 0  
I
SES  
CLS  
SEV  
CLV  
SET  
CLT  
SEH  
CLH  
S 1  
S
S
V
V
T
S 0  
V 1  
V 0  
T 1  
Clear T in SREG  
T 0  
T
Set Half Carry Flag in SREG  
Clear Half Carry Flag in SREG  
H 1  
H
H
H 0  
DATA TRANSFER INSTRUCTIONS  
MOV  
MOVW  
LDI  
LD  
Rd, Rr  
Rd, Rr  
Rd, K  
Move Between Registers  
Copy Register Word  
Rd Rr  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
Rd+1:Rd Rr+1:Rr  
Load Immediate  
Rd K  
Rd, X  
Load Indirect  
Rd (X)  
LD  
Rd, X+  
Rd, - X  
Rd, Y  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect  
Rd (X), X X + 1  
X X - 1, Rd (X)  
Rd (Y)  
LD  
LD  
LD  
Rd, Y+  
Rd, - Y  
Rd,Y+q  
Rd, Z  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Indirect  
Rd (Y), Y Y + 1  
Y Y - 1, Rd (Y)  
Rd (Y + q)  
Rd (Z)  
LD  
LDD  
LD  
LD  
Rd, Z+  
Rd, -Z  
Rd, Z+q  
Rd, k  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Direct from SRAM  
Store Indirect  
Rd (Z), Z Z+1  
Z Z - 1, Rd (Z)  
Rd (Z + q)  
Rd (k)  
LD  
LDD  
LDS  
ST  
X, Rr  
(X) Rr  
ST  
X+, Rr  
- X, Rr  
Y, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect  
(X) Rr, X X + 1  
X X - 1, (X) Rr  
(Y) Rr  
ST  
ST  
ST  
Y+, Rr  
- Y, Rr  
Y+q,Rr  
Z, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Indirect  
(Y) Rr, Y Y + 1  
Y Y - 1, (Y) Rr  
(Y + q) Rr  
(Z) Rr  
ST  
STD  
ST  
ST  
Z+, Rr  
-Z, Rr  
Z+q,Rr  
k, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Direct to SRAM  
Load Program Memory  
Load Program Memory  
Load Program Memory and Post-Inc  
Store Program Memory  
In Port  
(Z) Rr, Z Z + 1  
Z Z - 1, (Z) Rr  
(Z + q) Rr  
ST  
STD  
STS  
LPM  
LPM  
LPM  
SPM  
IN  
(k) Rr  
R0 (Z)  
Rd, Z  
Rd (Z)  
Rd, Z+  
Rd (Z), Z Z+1  
(z) R1:R0  
Rd, P  
P, Rr  
Rr  
Rd P  
1
1
2
2
OUT  
PUSH  
POP  
Out Port  
P Rr  
Push Register on Stack  
Pop Register from Stack  
STACK Rr  
Rd STACK  
Rd  
MCU CONTROL INSTRUCTIONS  
NOP  
No Operation  
Sleep  
None  
None  
None  
None  
1
1
SLEEP  
WDR  
(see specific descr. for Sleep function)  
(see specific descr. for WDR/Timer)  
For On-chip Debug Only  
Watchdog Reset  
Break  
1
BREAK  
N/A  
215  
7701C–AVR–12/08  
26. Ordering Information  
26.1 ATtiny24/44/84  
Ordering Code  
Speed (MHz)(3)  
Power Supply (V)  
Package(1)(2)  
Operation Range  
ATtiny24-15SSZ  
ATtiny24-15MZ  
16  
16  
2.7 - 5.5  
2.7 - 5.5  
TU  
PC  
Automotive (-40° to +125°C)  
Automotive (-40° to +125°C)  
ATtiny44-15SSZ  
ATtiny44-15MZ  
16  
16  
2.7 - 5.5  
2.7 - 5.5  
TU  
PC  
Automotive (-40° to +125°C)  
Automotive (-40° to +125°C)  
ATtiny84-15MZ  
16  
2.7 - 5.5  
PC  
Automotive (-40° to +125°C)  
Notes: 1. Green and ROHS packaging  
2. Tape and Reel with Dry-pack delivery.  
3. For Speed vs. VCC,see Figure 22-1 on page 180.  
Package Type  
TU  
PC  
14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC)  
20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)  
216  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
27. Packaging Information  
27.1 PC  
217  
7701C–AVR–12/08  
27.2 TU  
218  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
28. Errata  
The revision letter in this section refers to the revision of the ATtiny24/44/84 Automotive device.  
28.1 ATtiny24 Automotive  
28.1.1  
Rev. E  
1. No known errata.  
28.2 ATtiny44 Automotive  
28.2.1  
Rev. D  
1. No known errata.  
28.3 ATtiny84 Automotive  
28.3.1  
Rev. B  
1. No known errata.  
219  
7701C–AVR–12/08  
29. Datasheet Revision History  
29.1 Rev A 05/07  
1. Initial Automotive version. Started from Industrial specification document 8006 rev. E  
09/06.  
29.2 Rev B 09/07  
29.3 Rev C 11/08  
1. DC Characteristics updated. Section 22. on page 179.  
2. ADC maximum resolution corrected. Section 18. on page 138.  
3. POR value updated. Table 9-1 on page 41.  
1. Internal RC oscillator accuracy update. See Section “7.6” on page 29.  
2. ADC characteristics update. See Section “22.5” on page 182.  
3. DC characteristics update. See Table 22-1 on page 179.  
4. Brown-out Detector Hysteresis See Table 22-4 on page 182  
5. Calibrated Internal RC Oscillator Accuracy update See Section “22-2” on page 181.  
220  
ATtiny24/44/84  
7701C–AVR–12/08  
ATtiny24/44/84  
Features ..................................................................................................... 1  
1
2
Pin Configurations ................................................................................... 2  
1.1 Disclaimer ................................................................................................................2  
Overview ................................................................................................... 3  
2.1 Block Diagram .........................................................................................................3  
2.2 Automotive Quality Grade .......................................................................................4  
2.3 Pin Descriptions .......................................................................................................5  
3
4
5
Resources ................................................................................................. 6  
About Code Examples ............................................................................. 6  
CPU Core .................................................................................................. 7  
5.1 Overview ..................................................................................................................7  
5.2 Architectural Overview .............................................................................................7  
5.3 ALU – Arithmetic Logic Unit .....................................................................................8  
5.4 Status Register ........................................................................................................8  
5.5 General Purpose Register File ..............................................................................10  
5.6 Stack Pointer .........................................................................................................11  
5.7 Instruction Execution Timing .................................................................................12  
5.8 Reset and Interrupt Handling .................................................................................12  
6
7
Memories ................................................................................................ 15  
6.1 In-System Re-programmable Flash Program Memory ..........................................15  
6.2 SRAM Data Memory ..............................................................................................15  
6.3 EEPROM Data Memory ........................................................................................17  
6.4 I/O Memory ............................................................................................................21  
6.5 Register Description ..............................................................................................22  
System Clock and Clock Options ......................................................... 25  
7.1 Clock Systems and their Distribution .....................................................................25  
7.2 Clock Sources .......................................................................................................26  
7.3 Default Clock Source .............................................................................................26  
7.4 Crystal Oscillator ...................................................................................................26  
7.5 Low-frequency Crystal Oscillator ...........................................................................28  
7.6 Calibrated Internal RC Oscillator ...........................................................................29  
7.7 External Clock .......................................................................................................29  
7.8 128 kHz Internal Oscillator ....................................................................................31  
7.9 System Clock Prescaler ........................................................................................31  
1
7701C–AVR–05/08  
7.10 Register Description ............................................................................................32  
8
Power Management and Sleep Modes ................................................. 34  
8.1 Sleep Modes ..........................................................................................................34  
8.2 Idle Mode ...............................................................................................................34  
8.3 ADC Noise Reduction Mode ..................................................................................35  
8.4 Power-down Mode .................................................................................................35  
8.5 Standby Mode .......................................................................................................35  
8.6 Power Reduction Register .....................................................................................35  
8.7 Minimizing Power Consumption ............................................................................36  
8.8 Register Description ..............................................................................................37  
9
System Control and Reset .................................................................... 39  
9.1 Internal Voltage Reference ....................................................................................44  
9.2 Watchdog Timer ....................................................................................................44  
9.3 Timed Sequences for Changing the Configuration of the Watchdog Timer ..........45  
9.4 Register Description ..............................................................................................46  
10 Interrupts ................................................................................................ 50  
10.1 Interrupt Vectors ..................................................................................................50  
11 External Interrupts ................................................................................. 52  
11.1 Pin Change Interrupt Timing ................................................................................52  
11.2 Register Description ............................................................................................53  
12 I/O Ports .................................................................................................. 56  
12.1 Overview ..............................................................................................................56  
12.2 Ports as General Digital I/O .................................................................................57  
12.3 Alternate Port Functions ......................................................................................61  
12.4 Register Description ............................................................................................71  
13 8-bit Timer/Counter0 with PWM ............................................................ 73  
13.1 Features ..............................................................................................................73  
13.2 Overview ..............................................................................................................73  
13.3 Timer/Counter Clock Sources .............................................................................74  
13.4 Counter Unit ........................................................................................................74  
13.5 Output Compare Unit ...........................................................................................75  
13.6 Compare Match Output Unit ................................................................................77  
13.7 Modes of Operation .............................................................................................78  
13.8 Timer/Counter Timing Diagrams .........................................................................82  
2
ATtiny24/44/84  
7701C–AVR–05/08  
ATtiny24/44/84  
13.9 Register Description ............................................................................................84  
14 16-bit Timer/Counter1 ............................................................................ 91  
14.1 Features ..............................................................................................................91  
14.2 Overview ..............................................................................................................91  
14.3 Accessing 16-bit Registers ..................................................................................94  
14.4 Timer/Counter Clock Sources .............................................................................96  
14.5 Counter Unit ........................................................................................................97  
14.6 Input Capture Unit ...............................................................................................98  
14.7 Output Compare Units .......................................................................................100  
14.8 Compare Match Output Unit ..............................................................................102  
14.9 Modes of Operation ...........................................................................................103  
14.10 Timer/Counter Timing Diagrams .....................................................................110  
14.11 Register Description ........................................................................................113  
15 Timer/Counter Prescaler ..................................................................... 120  
15.1 Register Description ..........................................................................................121  
16 USI – Universal Serial Interface .......................................................... 122  
16.1 Features ............................................................................................................122  
16.2 Overview ............................................................................................................122  
16.3 Functional Descriptions .....................................................................................123  
16.4 Alternative USI Usage .......................................................................................129  
16.5 Register Descriptions ........................................................................................130  
17 Analog Comparator .............................................................................. 134  
17.1 Analog Comparator Multiplexed Input ...............................................................134  
17.2 Register Description ..........................................................................................136  
18 Analog to Digital Converter ................................................................. 138  
18.1 Features ............................................................................................................138  
18.2 Overview ............................................................................................................138  
18.3 ADC Operation ..................................................................................................139  
18.4 Starting a Conversion ........................................................................................140  
18.5 Prescaling and Conversion Timing ....................................................................141  
18.6 Changing Channel or Reference Selection .......................................................144  
18.7 ADC Noise Canceler .........................................................................................145  
18.8 ADC Conversion Result .....................................................................................148  
18.9 Temperature Measurement ...............................................................................149  
3
7701C–AVR–05/08  
18.10 Register Description ........................................................................................150  
19 debugWIRE On-chip Debug System .................................................. 157  
19.1 Features ............................................................................................................157  
19.2 Overview ............................................................................................................157  
19.3 Physical Interface ..............................................................................................157  
19.4 Software Break Points .......................................................................................158  
19.5 Limitations of debugWIRE .................................................................................158  
19.6 Register Description ..........................................................................................158  
20 Self-Programming the Flash ............................................................... 159  
20.1 Addressing the Flash During Self-Programming ...............................................160  
20.2 Register Description ..........................................................................................162  
21 Memory Programming ......................................................................... 164  
21.1 Program And Data Memory Lock Bits ...............................................................164  
21.2 Fuse Bytes .........................................................................................................165  
21.3 Signature Bytes .................................................................................................166  
21.4 Calibration Byte .................................................................................................166  
21.5 Page Size ..........................................................................................................167  
21.6 Serial Downloading ............................................................................................168  
21.7 High-voltage Serial Programming ......................................................................172  
21.8 High-voltage Serial Programming Algorithm .....................................................173  
22 Electrical Characteristics .................................................................... 179  
22.1 Absolute Maximum Ratings ...............................................................................179  
22.2 Speed Grades ...................................................................................................180  
22.3 Clock Characterizations .....................................................................................181  
22.4 System and Reset Characterizations ................................................................182  
22.5 ADC Characteristics – Preliminary Data ............................................................183  
22.6 Serial Programming Characteristics ..................................................................185  
22.7 High-voltage Serial Programming Characteristics .............................................186  
23 Typical Characteristics – Preliminary Data ....................................... 187  
23.1 Active Supply Current ........................................................................................187  
23.2 Idle Supply Current ............................................................................................191  
23.3 Supply Current of IO modules ...........................................................................194  
23.4 Power-down Supply Current ..............................................................................195  
23.5 Pin Pull-up .........................................................................................................196  
4
ATtiny24/44/84  
7701C–AVR–05/08  
ATtiny24/44/84  
23.6 Pin Driver Strength ............................................................................................198  
23.7 Pin Threshold and Hysteresis ............................................................................200  
23.8 BOD Threshold and Analog Comparator Offset ................................................203  
23.9 Internal Oscillator Speed ...................................................................................204  
23.10 Current Consumption of Peripheral Units ........................................................206  
23.11 Current Consumption in Reset and Reset Pulse width ...................................209  
24 Register Summary ............................................................................... 211  
25 Instruction Set Summary ..................................................................... 213  
26 Ordering Information ........................................................................... 215  
26.1 ATtiny24/44/84 ..................................................................................................215  
27 Packaging Information ........................................................................ 216  
27.1 PC ......................................................................................................................216  
27.2 TU ......................................................................................................................217  
28 Errata ..................................................................................................... 218  
28.1 ATtiny24 Automotive .........................................................................................218  
28.2 ATtiny44 Automotive .........................................................................................218  
28.3 ATtiny84 Automotive .........................................................................................218  
29 Datasheet Revision History ................................................................. 219  
29.1 Rev A 05/07 .......................................................................................................219  
29.2 Rev B 09/07 .......................................................................................................219  
29.3 Rev C 05/08 .......................................................................................................219  
5
7701C–AVR–05/08  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Atmel Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
Hong Kong  
Tel: (852) 2721-9778  
Fax: (852) 2722-1369  
Atmel Europe  
Le Krebs  
Atmel Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
Tel: (81) 3-3523-3551  
Fax: (81) 3-3523-7581  
8, Rue Jean-Pierre Timbaud  
BP 309  
78054 Saint-Quentin-en-  
Yvelines Cedex  
France  
Tel: (33) 1-30-60-70-00  
Fax: (33) 1-30-60-71-11  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
avr@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any  
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMELS TERMS AND CONDI-  
TIONS OF SALE LOCATED ON ATMELS WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY  
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-  
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF  
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no  
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided  
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use  
as components in applications intended to support or sustain life.  
© 2008 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of  
Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.  
7701C–AVR–05/08  
Appendix B - ATtiny24V/ATtiny44V/ATtiny84V  
Automotive Specification at 1.8V  
This document contains information specific to devices operating at voltage between  
1.8V and 3.6V. Only deviations with standard operating characteristics are covered in  
this appendix, all other information can be found in the complete Automotive  
datasheet. The complete ATtiny24/ATtiny44/ATtiny84 automotive datasheet can be  
found on www.atmel.com  
8-bit  
Microcontroller  
with 2/4/8K  
Bytes In-System  
Programmable  
Flash  
ATtiny24V  
ATtiny44V  
ATtiny84V  
Appendix B  
Preliminary  
7819A–AVR–01/09  
1. Electrical Characteristics  
1.1  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Parameters  
Value  
–40 to +85  
–65 to +175  
–0.5 to VCC + 0.5  
6.0  
Unit  
°C  
°C  
V
Operating temperature  
Storage temperature  
Voltage on any pin except RESET with respect to ground  
Maximum operating voltage  
DC current per I/O pin  
V
30.0  
mA  
mA  
DC current VCC and GND pins  
200.0  
1.2  
DC Characteristics  
TA = –40° C to +85°C, VCC = 1.8V to 3.6V (unless otherwise noted)  
Symbol Parameters  
Condition  
Min.  
Typ.  
Max.  
Unit  
Input low voltage, except XTAL1 and  
RESET pin  
(1)  
VIL  
VIH  
VCC = 1.8V to 3.6V  
–0.5  
+0.2VCC  
V
Input high voltage, except XTAL1  
and RESET pins  
(2)  
VCC = 1.8V to 3.6V  
0.7VCC  
VCC + 0.5  
V
(1)  
VIL1  
VIH1  
VIL2  
VIH2  
Input low voltage, XTAL1 pin  
Input high voltage, XTAL1 pin  
Input low voltage, RESET pin  
Input high voltage, RESET pin  
VCC = 1.8V to 3.6V  
VCC = 1.8V to 3.6V  
VCC = 1.8V to 3.6V  
VCC = 1.8V to 3.6V  
–0.5  
0.9VCC  
–0.5  
+0.2VCC  
V
V
V
V
(2)  
(2)  
VCC + 0.5  
(1)  
+0.2VCC  
0.9VCC  
VCC + 0.5  
Output low voltage(3)  
I/O pin except RESET  
,
VOL  
VOH  
IOL = 2 mA, VCC = 1.8V  
IOH = –2mA, VCC = 1.8V  
0.2  
V
V
Output high voltage(4)  
,
1.2  
I/O pin except RESET  
Active 4 MHz, VCC = 3V  
Idle 4 MHz, VCC = 3V  
0.8  
0.2  
2.5  
0.5  
mA  
mA  
Power supply current  
ICC  
WDT disabled, VCC = 3V  
WDT enabled, VCC = 3V  
0.2  
4
24  
30  
Power-down mode  
µA  
mV  
nA  
Analog comparator  
Input offset voltage  
VCC = 2.7V  
Vin = VCC/2  
VACIO  
IACLK  
< 10  
40  
Analog comparator  
Input leakage current  
VCC = 2.7V  
Vin = VCC/2  
–50  
+50  
Notes: 1. “Max” means the highest value where the pin is guaranteed to be read as low  
2. “Min” means the lowest value where the pin is guaranteed to be read as high  
3. Although each I/O port can sink more than the test conditions (2 mA at VCC = 1.8V) under steady state conditions (nontran-  
sient), the following must be observed: (1) The sum of all IOL, for all ports, should not exceed 50 mA. If IOL exceeds the test  
condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test  
condition.  
4. Although each I/O port can source more than the test conditions (0.5 mA at VCC = 1.8V) under steady state conditions  
(nontransient), the following must be observed: (1) The sum of all IOL, for ports B0 to B5, should not exceed 50 mA. If IOL  
exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than  
the listed test condition.  
2
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
7819A–AVR–01/09  
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
1.3  
Maximum Speed versus VCC  
Maximum frequency is dependent on VCC. As shown in Figure 1-1, the Maximum Frequency vs.  
CC curve is linear between 1.8V < VCC < 3.6V.  
V
Figure 1-1. Maximum Frequency versus VCC  
8 MHz  
4 MHz  
1.8V  
2.7V  
3.6V  
1.4  
Clock Characterizations  
Table 1-1.  
Calibration Accuracy of Internal RC Oscillator  
Frequency  
VCC  
Temperature  
Accuracy  
User Calibration  
7.3 MHz to 8.1 MHz  
1.8V to 3.6V  
–40°C to +85°C  
±25%  
3
7819A–AVR–01/09  
1.5  
ADC Characteristics  
TA = –40° C to +85°C, VCC = 1.8V to 3.6V (unless otherwise noted)  
Symbol  
Parameters  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Resolution  
Single ended conversion  
10  
Bits  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
2
4.0  
4.0  
LSB  
Absolute accuracy (Including INL,  
DNL, quantization error, gain and  
offset error)  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
Noise Reduction Mode  
2
LSB  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
Integral Non-Linearity (INL)  
Differential Non-Linearity (DNL)  
Gain error  
0.5  
0.2  
1.5  
0.7  
LSB  
LSB  
LSB  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
–7.0  
–3.0  
+1.5  
+5.0  
VCC = 1.8V, VRef = 1.8V,  
ADC clock = 200 kHz  
Offset error  
–3.5  
1.8  
+3.5  
LSB  
V
VREF  
Reference voltage  
AVCC  
1.6  
ADC Characteristics  
TA = –40° C to +85°C, VCC = 1.8V to 3.6V (unless otherwise noted)  
Symbol  
Parameters  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Differential conversion, gain = 1x  
BIPOLAR mode only  
Resolution  
8
Bits  
Absolute accuracy (Including INL,  
DNL, quantization error, gain and  
offset error)  
Gain = 1x, VCC = 1.8V, VRef = 1.3V,  
ADC clock = 125 kHz  
1.6  
0.7  
5.0  
2.5  
LSB  
LSB  
LSB  
LSB  
Gain = 1x, VCC = 1.8V,  
VRef = 1.3V,  
ADC clock = 125kHz  
Integral Non-Linearity (INL)  
Differential Non-Linearity (DNL)  
Gain Error  
Gain = 1x, VCC = 1.8V,  
VRef = 1.3V,  
ADC clock = 125 kHz  
0.3  
1.0  
Gain = 1x, VCC = 1.8V,  
VRef = 1.3V,  
–7.0  
+1.50  
0.0  
+7.0  
+4.0  
ADC clock = 125 kHz  
Gain = 1x, VCC = 1.8V.  
VRef = 1.3V,  
ADC clock = 125 kHz  
Offset Error  
–4.0  
1.30  
LSB  
V
AVCC –  
0.5  
VREF  
Reference Voltage  
4
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
7819A–AVR–01/09  
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
2. Ordering Information  
Power Supply  
1.8V to 3.6V  
1.8V to 3.6V  
1.8V to 3.6V  
1.8V to 3.6V  
1.8V to 3.6V  
Speed (MHz)  
ISP Flash  
2 KB  
Ordering Code  
ATtiny24V-15SST  
ATtiny24V-15MT  
ATtiny44V-15SST  
ATtiny44V-15MT  
ATtiny84V-15MT  
Package  
TU  
Operation Range  
4-8  
4-8  
4-8  
4-8  
4-8  
Automotive (–40°C to +85°C)  
Automotive (–40°C to +85°C)  
Automotive (–40°C to +85°C)  
Automotive (–40°C to +85°C)  
Automotive (–40°C to +85°C)  
2 KB  
PN  
4 KB  
TU  
4 KB  
PN  
8 KB  
PN  
3. Package Information  
Table 3-1.  
Package Types  
Description  
Package Type  
TU 14-Lead, 0.150” Body Width  
Plastic Gull Wing Small Outline Package (SOIC)  
TU  
PN  
PN 32-Lead, 5.0 x 5.0 mm Body, 0.50 mm Pitch  
Quad Flat No Lead ackage (QFN)  
5
7819A–AVR–01/09  
Figure 3-1. TU  
6
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
7819A–AVR–01/09  
ATtiny24V/ATtiny44V/ATtiny84V [Preliminary]  
Figure 3-2. PN  
7
7819A–AVR–01/09  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: 1(408) 441-0311  
Fax: 1(408) 487-2600  
Atmel Asia  
Atmel Europe  
Le Krebs  
8, Rue Jean-Pierre Timbaud  
BP 309  
Atmel Japan  
Unit 1-5 & 16, 19/F  
BEA Tower, Millennium City 5  
418 Kwun Tong Road  
Kwun Tong, Kowloon  
Hong Kong  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
78054  
Saint-Quentin-en-Yvelines Cedex Tel: (81) 3-3523-3551  
Tel: (852) 2245-6100  
Fax: (852) 2722-1369  
France  
Tel: (33) 1-30-60-70-00  
Fax: (33) 1-30-60-71-11  
Fax: (81) 3-3523-7581  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
avr@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any  
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMELS TERMS AND CONDI-  
TIONS OF SALE LOCATED ON ATMELS WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY  
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-  
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF  
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no  
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided  
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use  
as components in applications intended to support or sustain life.  
© 2009 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, AVR® and others are registered trademarks or trade-  
marks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.  
7819A–AVR–01/09  

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