TSC695F-25MA-E [ATMEL]
Rad-Hard 32-bit SPARC Embedded Processor; 抗辐射的32位SPARC嵌入式处理器型号: | TSC695F-25MA-E |
厂家: | ATMEL |
描述: | Rad-Hard 32-bit SPARC Embedded Processor |
文件: | 总42页 (文件大小:2495K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• Integer Unit Based on SPARC V7 High-performance RISC Architecture
• Optimized Integrated 32/64-bit Floating-point Unit
• On-chip Peripherals
– EDAC and Parity Generator and Checker
– Memory Interface
Chip Select Generator
Waitstate Generation
Memory Protection
– DMA Arbiter
– Timers
Rad-Hard 32-bit
SPARC
Embedded
Processor
General Purpose Timer (GPT)
Real-time Clock Timer (RTCT)
Watchdog Timer (WDT)
– Interrupt Controller with 5 External Inputs
– General Purpose Interface (GPI)
– Dual UART
• Speed Optimized Code RAM Interface
8- or 40-bit boot-PROM (Flash) Interface
• IEEE 1149.1 Test Access Port (TAP) for Debugging and Test Purposes
• Fully Static Design
• Performance: 12 MIPs/3 MFlops (Double Precision) at SYSCLK = 15 MHz
• Core Consumption: 1.0W Typ. at 20 MIPs/0.7W typ. at 10 MIPs
• Operating Range: 4.5V to 5.5V(1) -55°C to +125°C
• Total Dose Radiation Capability (Parametric and Functional): 300 KRADs (Si)
• SEU Event Rate Better than 3 E-8 Error/Component/Day (Worst Case)
• Latch-up Immunity Better than (LET) 100 MeV-cm2/mg
• Quality Grades: ESA SCC, QML Q or V
• Package: 256 MQFPF; Bare Die
TSC695F
Note:
1. For 3.3V capability see the TSC695FL datasheet on the Atmel site.
Description
The TSC695F (ERC32 Single-Chip) is a highly integrated, high-performance 32-bit
RISC embedded processor implementing the SPARC architecture V7 specification. It
has been developed with the support of the ESA (European Space Agency), and
offers a full development environment for embedded space applications.
The processor is manufactured using the Atmel 0.5 µm radiation tolerant (≥ 300
KRADs (Si)) CMOS enhanced process (RTP). It has been specially designed for
space, as it has on-chip concurrent transient and permanent error detection.
The TSC695F includes an on-chip Integer Unit (IU), a Floating Point Unit (FPU), a
Memory Controller and a DMA arbiter. For real-time applications, the TSC695F offers
a high security watchdog, two timers, an interrupt controller, parallel and serial inter-
faces. Fault tolerance is supported using parity on internal/external buses and an
EDAC on the external data bus. The design is highly testable with the support of an
On-Chip Debugger (OCD), and a boundary scan through JTAG interface.
Rev. 4118H–AERO–06/03
Block Diagram
Figure 1. TSC695F Block Diagram
32-bit
Integer
Unit
DMA
TAP
DMA Ctrl
Arbiter
32/64-bit
Floating-Point
Unit
Clock
&
Parity
Gen./Chk.
Reset
Access
Controller
Parity
Managt
Mem Ctrl
Gen./Chk.
Wait State
Controller
Ready/Busy
Add.+Size+ASI
Address
Interface
Error
Managt
Real Time Clock
Timer
Watch
Dog
General Purpose
Timer
EDAC
Data+Check bits
Parities
Interrupt
General Purpose
Interface
UART B
UART A
Parity
Gen./Check.
Controller
Interrupts
GPI bits
RxD, TxD
Pin Descriptions
For pin assignment, refer to package section.
Table 1. Pin Descriptions
Signal
Type
Active
Description
RA[31:0]
RAPAR
RASI[3:0]
RSIZE[1:0]
RASPAR
CPAR
I/O,
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
32-bit registered address bus
Registered address bus parity
4-bit registered address space identifier
2-bit registered bus transaction size
Registered ASI and SIZE parity
Control bus parity
Output buffer: 400 pF
High
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
High
High
D[31:0]
CB[6:0]
DPAR
32-bit data bus
7-bit check-bit bus
High
High
Low
High
High
High
Low
High
Data bus parity
RLDSTO
ALE
Registered atomic load-store
Address latch enable
Data transfer
DXFER
LOCK
I/O
I/O
I/O
I/O
I/O
Bus lock
RD
Read access
WE
Write enable
WRT
Advanced write
MHOLD+FHOLD
+BHOLD+FCCV
MHOLD
O
Low
Memory bus hold
MDS
O
O
I
Low
Low
Low
Memory data strobe
-
MEXC
Memory exception
-
PROM8
BA[1:0]
Select 8-bit wide PROM
Latched address used for 8-bit wide boot PROM
PROM chip select
-
O
O
I
-
ROMCS
ROMWRT
MEMCS[9:0]
MEMWR
Low
Low
Low
Low
-
ROM write enable
-
O
O
Memory chip select
Output buffer: 400 pF
Output buffer: 400 pF
Memory write strobe
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4118H–AERO–06/03
TSC695F
Table 1. Pin Descriptions (Continued)
Signal
Type
Active
Description
OE
O
O
O
O
O
O
O
I
Low
Low
High
Low
Low
Low
Low
Low
Low
Low
Low
High
Low
Low
Low
Low
Low
High
Low
High
High
High
High
High
Memory output enable
Data buffer enable
Output buffer: 400 pF
BUFFEN
DDIR
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Data buffer direction
Data buffer direction
I/O chip select
DDIR
IOSEL[3:0]
IOWR
I/O and exchange memory write strobe
Exchange memory chip select
Bus ready
EXMCS
BUSRDY
BUSERR
DMAREQ
DMAGNT
DMAAS
DRDY
I
Bus error
I
DMA request
O
I
DMA grant
DMA address strobe
Data ready during DMA access
IU error
O
O
O
O
I
IUERR
CPUHALT
SYSERR
SYSHALT
SYSAV
NOPAR
INULL
Processor (IU & FPU) halt and freeze
System error
System halt
O
I
System availability
No parity
O
O
O
O
O
I
Integer unit nullify cycle
Instruction fetch
INST
Used to check the execute
stage of IU
FLUSH
DIA
FPU instruction flush
Delay instruction annulled
Real Time Clock Counter output
Receive data UART ’A’ and ’B’
Transmit data UART ’A’ and ’B’
GPI input/output
instruction pipeline
RTC
-
RxA/RxB
TxA/TxB
GPI[7:0]
GPIINT
EXTINT[4:0]
EXTINTACK
IWDE
Input trigger
O
I/O
O
I
-
Input trigger
High
GPI interrupt
-
External interrupt
Input trigger
O
I
High
High
High
External interrupt acknowledge
Internal watch dog enable
External watch dog input interrupt
Watch dog clock
-
-
EWDINT
WDCLK
CLK2
I
Input trigger
I
-
I
Double frequency clock
System clock
-
SYSCLK
RESET
SYSRESET
TMODE[1:0]
DEBUG
TCK
O
O
I
-
Low
Low
Output reset
-
System input reset
Factory test mode
Input trigger
I
Functional mode=00
I
High
Low
Software debug mode
Test (JTAG) clock
-
I
-
TRST
I
Test (JTAG) reset
pull-up ≈ 37 kΩ
TMS
I
Test (JTAG) mode select
Test (JTAG) data input
Test (JTAG) data output
Main internal power
Output driver power
pull-up ≈ 37 kΩ
TDI
I
pull-up ≈ 37 kΩ
TDO
O
-
-
-
VCCI/VSSI
VCCO/VSSO
Note:
If not specified, the output buffer type is 150 pF, the input buffer type is TTL.
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4118H–AERO–06/03
System Architecture The TSC695F is to be used as an embedded processor requiring only memory and
application specific peripherals to be added to form a complete on-board computer. All
other system support functions are provided by the core.
Figure 2. System Architecture Based on TSC695F
DMA Unit
Boot PROM
Ax[31:0]
Xtd PROM
Xchg Mem
Glue
Logic
Xtd RAM
Local
Memory
I/O 0
to
I/O 3
DMAGNT
DMAREQ
DMAAS
Xtd I/O
(BUFFEN, DDIR)
Xtd general
MEMCtrl
(ROMCS, EXMCS, IOSEL[3:0], MEMWR, IOWR, OE, BUSRDY,...)
Memory
Interface
FPU
RAMCtrl
(MEMCS[9:0], MEMWR, OE)
RAM
Memory
DMA
DMA
(0 WS)
A[31:0]
IU
User
Application
Peripherals
TSC695F
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TSC695F
4118H–AERO–06/03
TSC695F
Product Description
Integer Unit
The Integer Unit (IU) is designed for highly dependable space and military applications,
and includes support for error detection. The RISC architecture makes the creation of a
processor that can execute instructions at a rate approaching one instruction per pro-
cessor clock possible.
To achieve that rate of execution, the IU employs a four-stage instruction pipeline that
permits parallel execution of multiple instructions.
•
•
Fetch - The processor outputs the instruction address to fetch the instruction.
Decode - The instruction is placed in the instruction register and is decoded. The
processor reads the operands from the register file and computes the next
instruction address.
•
•
Execute - The processor executes the instruction and saves the results in temporary
registers. Pending traps are prioritized and internal traps are taken during this stage.
Write - If no trap is taken, the processor writes the result to the destination register.
All four stages operate in parallel, working on up to four different instructions at a time. A
basic ‘single-cycle’ instruction enters the pipeline and completes infour cycles.
By the time it reaches the write stage, three more instructions have entered and are
moving through the pipeline behind it. So, after the first four cycles, a single-cycle
instruction exits the pipeline and a single-cycle instruction enters the pipeline on every
cycle. Of course, a ’single-cycle’ instruction actually takes four cycles to complete, but
they are called single cycle because with this type of instruction the processor can com-
plete one instruction per cycle after the initial four-cycle delay.
Floating-point Unit
The FLoating Point Unit (FPU) is designed to provide execution of single and double-
precision floating-point instructions concurrently with execution of integer instructions by
the IU. The FPU is compliant to the ANSI/IEEE-754 (1985) floating-point standard.
The FPU is designed for highly dependable space and military applications, and
includes support for concurrent error detection and testability.
The FPU uses a four stage instruction pipeline consisting of fetch, decode, execute and
write stages (F, D, E and W). The fetch unit captures instructions and their addresses
from the data and address buses. The decode unit contains logic to decode the floating-
point instruction opcodes. The execution unit handles all instruction execution. The exe-
cution unit includes a floating-point queue (FP queue), which contains stored floating-
point operate (FPop) instructions under execution and their addresses. The execution
unit controls the load unit, the store unit, and the datapath unit. The FPU depends upon
the IU to access all addresses and control signals for memory access. Floating-point
loads and stores are executed in conjunction with the IU, which provides addresses and
control signals while the FPU supplies or stores the data. Instruction fetch for integer
and floating-point instructions is provided by the IU.
The FPU provides three types of registers: f registers, FSR, and the FP queue. The FSR
is a 32-bit status and control register. It keeps track of rounding modes, floating-point
trap types, queue status, condition codes, and various IEEE exception information. The
floating-point queue contains the floating-point instruction currently under execution,
along with its corresponding address.
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4118H–AERO–06/03
Instruction Set
TSC695F instructions fall into six functional categories: load/store, arithmetic/logi-
cal/shift, control transfer, read/write control register, floating-point, and miscellaneous.
Please refer to SPARC V7 Instruction-set Manual.
Note:
The execution of IFLUSH will cause an illegal instruction trap.
On-chip Peripherals
Memory Interface
The TSC695F is designed to allow easy interfacing to internal/external memory
resources.
Table 2. Memory Mapping
Memory Contents
Start Address
Size (bytes)
Data Size and Parity Options
Boot PROM
0x00000000
0x01000000
128K → 16M
8-bit mode
40-bit mode
8-bit mode
40-bit mode
No parity/-No EDAC/-Only byte write
Parity + EDAC mandatory/-Only word write
No parity/-No EDAC/-Only byte write
Extended PROM
Max: 15M
Parity + EDAC mandatory/-Only word write
Exchange Memory
System Registers
RAM (8 blocks)
Extended RAM
I/O Area 0
0x01F00000
0x01F80000
0x02000000
0x04000000
0x10000000
0x11000000
0x12000000
0x13000000
0x14000000
0x80000000
4k → 512k
512K (124 used)
8*32K → 8*4M
Max: 192M
0 → 16M
Parity + EDAC option/-Only word write
Parity/-Only word read/write access
Parity + EDAC option/-All data sizes allowed
Parity option/-All data sizes allowed
I/O Area 1
0 → 16M
I/O Area 2
0 → 16M
I/O Area 3
0 → 16M
Extended I/O Area
Extended General
Max: 1728M
Max: 2G
No parity/-All data sizes allowed
System Registers
The system registers are only writable by IU in the supervisor mode or by DMA during
halt mode.
Table 3. System Registers Address Map
System Register Name
System Control Register
Software Reset
Address
SYSCTR
SWRST
PDOWN
SYSFSR
FAILAR
0x 01F8 0000
0x 01F8 0004
0x 01F8 0008
0x 01F8 00A0
0x 01F8 00A4
0x 01F8 00B0
0x 01F8 00D0
Power Down
System Fault Status Register
Failing Address Register
Error & Reset Status Register
Test Control Register
ERRRSR
TESCTR
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TSC695F
4118H–AERO–06/03
TSC695F
Table 3. System Registers Address Map (Continued)
System Register Name
Address
Memory Configuration Register
I/O Configuration Register
MCNFR
0x 01F8 0010
0x 01F8 0014
0x 01F8 0018
0x 01F8 0020
0x 01F8 0024
0x 01F8 0028
0x 01F8 002C
0x 01F8 0044
0x 01F8 0048
0x 01F8 004C
0x 01F8 0050
0x 01F8 0054
0x 01F8 0060
0x 01F8 0064
0x 01F8 0080
0x 01F8 0084
0x 01F8 0088
0x 01F8 008C
0x 01F8 0098
0x 01F8 00A8
0x 01F8 00AC
0x 01F8 00E0
0x 01F8 00E4
0x 01F8 00E8
IOCNFR
WSCNFR
APS1BR
APS1ER
APS2BR
APS2ER
INTSHR
INTPDR
INTMKR
INTCLR
INTFCR
WDOGTR
WDOGST
RTCCR
Waitstate Configuration Register
Access Protection Segment 1 Base Register
Access Protection Segment 1 End Register
Access Protection Segment 2 Base Register
Access Protection Segment 2 End Register
Interrupt Shape Register
Interrupt Pending Register
Interrupt Mask Register
Interrupt Clear Register
Interrupt Force Register
Watchdog Timer Register
Watchdog Timer Trap Door Set
Real Time Clock Timer <Counter> Register
Real Time Clock Timer <Scaler> Register
General Purpose Timer <Counter> Register
General Purpose Timer <Scaler> Register
Timers Control Register
RTCSR
GPTCR
GPTSR
TIMCTR
GPICNFR
GPIDATR
UARTAR
UARTBR
UARTSR
General Purpose Interface Configuration Register
General Purpose Interface Data Register
UART ’A’ Rx & Tx Register
UART ’B’ Rx & Tx Register
UART Status Register
Wait-state and Time-out
Generator
It is possible to control the wait-state generation by programming a Wait-state Configu-
ration Register. The maximum programmable number of wait-states is applied by
default at reset.
It is possible to program the number of wait-states for the following combinations:
–
–
–
–
RAM read and write
PROM read and write (i.e. EEPROM or Flash write)
Exchange Memory read/write
Four individual I/O peripherals read/write
A bus time-out function of 256 system clock cycles is provided for the bus ready con-
trolled memory areas, i.e., the Extended PROM, Exchange Memory, Extended RAM,
7
4118H–AERO–06/03
Extended I/O and the Extended General areas.
EDAC
The TSC695F includes a 32-bit EDAC (Error Detection And Correction). Seven bits
(CB[6:0]) are used as check bits over the data bus. The Data Bus Parity signal (DPAR)
is used to check and generate the odd parity over the 32-bit data bus. This means that
altogether 40 bits are used when the EDAC is enabled.
The TSC695F EDAC uses a 7-bit Hamming code which detects any double bit error on
the 40-bit bus as a non-correctable error. In addition, the EDAC detects all bits stuck-at-
one and stuck-at-zero failure for any nibble in the data word as a non-correctable error.
Stuck-at-one and stuck-at-zero for all 32 bits of the data word is also detected as a non-
correctable error.
Memory and I/O Parity
The TSC695F handles parity towards memory and I/O in a special way. The processor
can be programmed to use no parity, only parity or parity and EDAC protection towards
memory and to use parity or no towards I/O. The signal used for the parity bit is DPAR.
Memory Redundancy
Programming the Memory Configuration Register, the TSC695F provides chip selects
for two redundant memory banks for replacement of faulty banks.
Memory Access Protection
•
•
Unimplemented Areas - Access to all unimplemented memory areas are handled by
the TSC695F and detected as illegal.
RAM Write Access Protection - The TSC695F can be programmed to detect and
mask write accesses in any part of the RAM. The protection scheme is enabled only
for data area, not for the instruction area. The programmable write access
protection is based on two segments.
•
Boot PROM Write Protection - The TSC695F supports a qualified PROM write for
an 8-bit wide PROM and/or for a 40-bit wide PROM.
DMA
DMA Interface
The TSC695F supports Direct Memory Access (DMA). The DMA unit requests access
to the processor bus by asserting the DMA request signal (DMAREQ). When the DMA
unit receives the DMAGNT signal in response, the processor bus is granted. In case the
processor is in the power-down mode the processor is permanent tri-stated, and a
DMAREQ will directly give a DMAGNT. The TSC695F includes a DMA session time-out
function.
Bus Arbiter
The TSC695F always has the lowest priority on the system bus.
Traps
A trap is a vectored transfer of control to the supervisor through a special trap table that
contains the first four instructions of each trap handler. The base address of the table is
established by supervisor and the displacement, within the table, is determined by the
trap type. Two categories of traps can appear.
8
TSC695F
4118H–AERO–06/03
TSC695F
Synchronous Traps
Table 4. Synchronous Traps
Trap
Priority
Trap Type (tt) Comments
Sources: SYSRESET* pin
software reset
watchdog reset
Reset
1
–
IU or System error reset
Non-restartable,imprecise
Severe error requiring a re-boot
error
2.1
2.2
2.3
2.4
64h
62h
65h
63h
61h
TSC695F enters (if not masked) in halt or reset mode
Non-restartable,
precise error
Error not removable, PC & nPC OK
TSC695F enters (if not masked) in halt or reset mode
Special case of non-restartable, precise error.
TSC695F enters (if not masked) in halt or reset mode
Register file error
Retrying instruction but PC & nPC have to be re-adjusted
TSC695F enters (if not masked) in halt or reset mode
Restartable, late error
Restartable,
precise error
Retrying instruction
TSC695F enters (if not masked) in halt or reset mode
2
2.5
Parity error on control bus
Parity error on data bus
Parity error on address bus
Access to protected or unimplemented area
Uncorrectable error in memory
Bus time out
Instruction access
(Error on instruction fetch)
3
4
5
6
01h
02h
03h
04h
05h
06h
07h
Bus error
Illegal Instruction
Privileged instruction
FPU disabled
–
–
–
Overflow
During SAVE instruction or trap taken
Window
Underflow
7
8
During RESTORE instruction or RETT instruction
Memory address not aligned
Non-restartable error
Data bus error
–
9.1
9.2
9.3
9.4
9.5
Severe error, cannot restart the instruction
Parity error on FPU data bus
Restartable error
Can be removed restarting the instruction
Sequence error
–
–
Unimplemented FPop
Invalid operation
Division by zero
Overflow
Underflow
IEEE exceptions:
9
9.6
08h
Inexact
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4118H–AERO–06/03
Table 4. Synchronous Traps (Continued)
Trap
Priority
Trap Type (tt) Comments
Idem “instruction access”
Data access exception
(Error on data load)
10
11
12
09h
System register access violation
Tag overflow
0Ah
TADDccTV and TSUBccTV instructions
Trap on integer condition codes (Ticc)
Trap instructions
80h to FFh
Table 5. Interrupts or Asynchronous Traps
Trap
Priority
Comments
Trap Type (tt)
1Fh
Watchdog time-out
External INT 4
13
Internal or external (EWDINT pin)
14
1Eh
EXTINTAK on only one of EXTINT[4:0]
Real time clock timer
General purpose timer
External INT 3
15
1Dh
–
16
1Ch
–
17
1Bh
EXTINTAK on only one of EXTINT[4:0]
External INT 2
18
1Ah
EXTINTAK on only one of EXTINT[4:0]
DMA time-out
19
19h
–
DMA access error
UART Error
20
18h
–
21
17h
–
Correctable error in memory
Data ready
22
16h
Data read OK but source not updated
–
UART B
Transmitter ready
23
15h
Data ready
Transmitter ready
–
UART A
24
25
26
14h
13h
12h
External INT 1
External INT 0
EXTINTAK on only one of EXTINT[4:0]
EXTINTAK on only one of EXTINT[4:0]
Logical OR of:
IU hardware error masked
IU error mode masked
System hardware error masked
Masked hardware errors
27
11h
It is possible to mask each individual interrupt (except Watchdog time-out). The interrupts in the Interrupt Pending Register
are cleared automatically when the interrupt is acknowledged.
By programming the Interrupt Shape Register, it is possible to define the external interrupts to either be active low or active
high and to define the external interrupts to either be edge or level sensitive.
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TSC695F
4118H–AERO–06/03
TSC695F
Timers
In software debug mode the timers are controlled by a system register bit and the exter-
nal pin DEBUG.
General Purpose Timer
The General Purpose Timer (GPT) provides, in addition to a generalized counter func-
tion, a mechanism for setting the step size in which actual time counts are performed.
GPT is clocked by the internal system clock. They are possible to program to be either
of single-shot type or periodical type and in both cases generate an interrupt when the
delay time has elapsed. The current value of the scaler and counter of the GPT can be
read.
Real Time Clock Timer
Watchdog Timer
The only functional differences between the two timers are that the Real Time Clock
Timer (RTCT) has an 8-bit scaler (16-bit scaler for GPT) and that the RTCT interrupt has
higher priority than the GPT interrupt.
RTCT information is available on RTC output pin.
Setting the external pin IWDE to VCC enables the internal watchdog timer. Otherwise the
watchdog function must be externally provided.
The watchdog is supplied from a separate external input (WDCLK). After reset, the timer
is enabled and starts running with the maximum range. If the timer is not refreshed
(reprogrammed) before the counter reaches zero value, an interrupt is sent. Simulta-
neously, the timer starts counting a reset time-out period. If the timer is not
acknowledged before the reset time-out period elapses, a reset is applied to TSC695F.
UARTs
Two full duplex asynchronous receiver transmitters (UART) are included. In software
debug mode the UART’s are controlled by system register bits.
The data format of the UART’s is eight bits. It is possible to choose between even or odd
parity, or no parity, and between one and two stop bits. The UART’s provide double buff-
ering, i.e. each UART consists of a transmitter holding register, a receiver holding
register, a transmitter shift register, and a receiver shift register. Each of these registers
are 8-bit wide. For each UART a RX and TX Register is provided. The UART’s generate
an interrupt each time a byte has been received or a byte has been sent. There is
another interrupt to indicate errors.
The baud rate of both the UART’s is programmable. The clock is derived either from the
system clock or can use the watchdog clock.
General Purpose Interface
The General Purpose Interface (GPI) is an 8-bit parallel I/O port. Each pin can be config-
ured as an input or an output.
A falling or rising edge detection is made on each selected GPI inputs. Every input tran-
sition on GPI generates an external positive pulse on GPIINT pin of two SYSCLK width.
Execution Modes
Reset Mode
Reset mode is entered when:
–
–
The SYSRES input is asserted
Software reset which is caused by the software writing to a Software Reset
Register
–
–
Watchdog reset which is caused by a Watchdog counter time-out
Error reset which is caused by a hardware parity error
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4118H–AERO–06/03
This RESET output has a minimum of 1024 SYSCLK width to allow the usage of Flash
memories.
The error and Reset Status Register contain the source of the last processor reset.
Run Mode
In this mode the IU/FPU is executing, while all peripherals are running (if software
enabled).
System Halt Mode
System Halt mode is entered when the SYSHALT input is asserted. In this mode, the IU
and FPU are frozen, while the timers (includeing the internal watchdog timer) and
UART’s are stopped.
Power Down Mode
Error Halt Mode
This mode is entered by writing to the Power-down Register. In this mode, the IU and
FPU are frozen. The TSC695F leaves the power-down mode if an external interrupt is
asserted.
Error Halt mode is entered under the following circumstances:
–
–
A internal hardware parity error.
The IU enters error mode.
The only way to exit Error Halt Mode is through Cold Reset by asserting SYSRESET.
Error Handler
The TSC695F has one error output signal (SYSERR) which indicates that an unmasked
error has occurred. Any error signalled on the error inputs from the IU and the FPU is
latched and reflected in the Error and Reset Status Register. By default, an error leads
to a processor halt.
Parity Checking
The TSC695F includes:
–
–
–
–
–
Parity checking and generation (if required) on the external data bus
Parity checking on the external address bus
Parity checking on ASI and SIZE
Parity checking and generation on all system registers
Parity generation and checking on the internal control bus to the IU
All external parity checking can be disabled using the NOPAR signal.
System Clock
The TSC695F uses CLK2 clock input directly and creates a system clock signal by
dividing CLK2 by two. It drives SYSCLK pin with a nominal 50% duty cycle for the appli-
cation. It is highly recommended that only SYSCLK rising edge is used as reference as
far as possible.
System Availability
Test Mode
The SYSAV bit in the Error and Reset Status Register can be used by software to indi-
cate system availability.
The TSC695F includes a number of software test facilities such as EDAC test, Parity
test, Interrupt test, Error test and a simple Test Access Port. These test functions are
controlled using the Test Control Register.
12
TSC695F
4118H–AERO–06/03
TSC695F
Test and Diagnostic
Hardware Functions
A variety of TSC695F test and diagnostic hardware functions, including boundary scan,
internal scan, clock control and On-chip Debugger, are controlled through an IEEE
1149.1 (JTAG) standard Test Access Port (TAP).
Test Access Port
The TAP interfaces to the JTAG bus via 5 dedicated pins on the TSC695F chip. These
pins are:
•
•
•
•
•
TCK (input): Test Clock
TMS (input): Test Mode Select
TDI (input): Test Data Input
TDO (output): Test Data Output
TRST (input): Test Reset
Instruction Register
Five standard instructions are supported by the TSC695F TAP.
Binary Value Name of Instruction Data Register Scan Chain Accessed
00. 0000
00. 0001
00. 0011
EXTEST
Boundary Scan
Register
Boundary scan chain
Boundary scan chain
Boundary scan chain
SAMPLE/PRELOAD
INTEST
Boundary Scan
Register
Boundary Scan
Register
11. 1111
10. 0000
BYPASS
IDCODE
Bypass Register
Bypass register
Device ID Register
ID register scan chain
Debugging
The design is highly testable with the support of an On-Chip Debugger (OCD), an inter-
nal and boundary scan through JTAG interface.
13
4118H–AERO–06/03
Electrical Characteristics
Absolute Maximum Ratings
Note: Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Military Range............................................... -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
Supply Voltage...................................................-0.5V to +7.0V
Input Voltage......................................................-0.5V to +7.0V
DC Characteristics
Table 6. DC Characteristics at VDD 5V ± 10%
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
Input Low Voltage
for trigger input
VIL trigger
–
–
0.8
V
VCC = 4.5 to 5.5V
Input High Voltage
for trigger input
VIH trigger
∆VT
3.0
–
–
0.9
–
–
–
V
V
V
V
V
VCC = 4.5 to 5.5V
VCC = 4.5 to 5.5V
VCC = 4.5 to 5.5V
VCC = 4.5 to 5.5V
Input Hysteresis
for trigger input
Input Low Voltage
for TTL input
VIL TTL
VIH TTL
VOL400 pF
–
0.8
–
Input High Voltage
for TTL input
2.2
–
–
VCC = 4.5 to 5.5V
Output Low Voltage
for 400 pF buffer
0.3
0.4
IOL = 12 mA
VCC = 4.5 to 5.5V
IOH = -16 mA
Output High Voltage
for 400 pF buffer
VOH400 pF
VOL150 pF
VOH150 pF
2.4
–
0.3
0.3
4.3
–
0.4
–
V
V
V
VCC = 4.5 to 5.5V
IOL = 4 mA
Output Low Voltage
for 150 pF buffer
VCC = 4.5 to 5.5V
IOH = -6 mA
Output High Voltage
for 150 pF buffer
2.4
–
–
–
–
–
–
–
–
–
–
–
–
230
210
170
41
VCC = 5.5V, f = 25 MHz
VCC = 5.5V, f = 20 MHz
VCC = 5.5V, f = 10 MHz
VCC = 5.5V, f = 25MHz
VCC = 5.5V, f = 20 MHz
VCC = 5.5V, f = 10 MHz
Operating Supply Current
for core processor
IccOP
mA
mA
Power Down Supply Current
for core processor
IccPD
38
30
14
TSC695F
4118H–AERO–06/03
TSC695F
Capacitance Ratings
Parameter
CIN
Description
Input Capacitance
Max
7 pF
8 pF
8 pF
COUT
Output Capacitance
Input/Output Capacitance
CIO
AC Characteristics
Table 7. AC Characteristics (SYSCLK Freq. = 25 MHz − 5V ±10%) Cload = 50 pF, Vref = 2.5V
Min
(ns)
Max
Parameter
(ns) Comment
Reference Edge
t1
t2
t3
t4
t5
t6
20
40
9.75
–
–
–
CLK2 period
–
SYSCLK period
–
–
CLK2 high and low pulse width
RA(31:0)RAPARRSIZERLDSTOoutputdelay
–
6.5
SYSCLK+
SYSCLK+
SYSCLK+
–
12.5 MEMCS*(9:0) ROMCS* EXMCS* output delay
–
15
DDIR DDIR* output delay
MEMWR* IOWR*output delay
formula: 13.5 ns + 1/4 t2
t7
t8
–
23.5
SYSCLK- or SYSCLK+
OE* HL output delay
formula: 10.5 ns + 1/4 t2
–
11.5
9
20.5
–
SYSCLK+
SYSCLK+
t9_1
t9_2
Data setup time during load
t9
Data setup time during load mNOPAR = 0 rpa =
rec = either 1 or 0
–
SYSCLK+
SYSCLK+
SYSCLK-
SYSCLK+
SYSCLK+
SYSCLK-
t10
t11
t12
t13
t14
5
–
8
–
–
–
Data hold time during load
Data output delay
28
–
Data output valid to HZ – guaranteed by design
CB output delay
19
13
ALE* output delay
BUFFEN* HL output delay
formula: 11 ns + 1/4 t2
t15
–
21
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK-
SYSCLK+
SYSCLK+
SYSCLK+
t16
t17
t20
t21
t22
t23
–
–
15
15
15
–
MHOLD* output delay – guaranteed by design
MDS* DRDY* output delay
–
MEXC* output delay
10
3
RASI(3:0) RSIZE(1:0) RASPAR setup time
RASI(3:0) RSIZE(1:0) RASPAR hold time
BOOT PROM address output delay
–
–
13
15
4118H–AERO–06/03
Table 7. AC Characteristics (SYSCLK Freq. = 25 MHz − 5V ±10%) Cload = 50 pF, Vref = 2.5V (Continued)
Min
(ns)
Max
Parameter
t24
(ns) Comment
Reference Edge
SYSCLK+
12
0
–
–
BUSRDY* setup time
t25
BUSRDY* hold time
IOSEL output delay
SYSCLK+
SYSCLK+ HL
SYSCLK- LH
t27
t28
t29
–
12
0
15
20
20
DMAAS setup time
formula of max: 1/2 t2
SYSCLK+
DMAAS hold time
formula of max: 1/2 t2
SYSCLK-
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK+
-
t30
t31
t32
t33
t36
t37
t38
t39
t40
t41
t46
t48
t49
t50
t52
t53
t54
t56
t57
t60
12
–
–
15
–
DMAREQ* setup time
DMAGNT* output delay
RA(31:0) RAPAR CPAR setup time
RA(31:0) RAPAR CPAR hold time
TCK period
10
3
–
100
10
4
–
–
TMS setup time
TCK+
–
TMS hold time
TCK+
10
10
–
–
TDI setup time
TCK+
–
TDI hold time
TCK+
20
22
22
20
20
–
TDO output delay
TCK-
–
INULL output delay
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK-
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK+
SYSCLK+
–
RESET* CPUHALT* output delay
SYSERR* SYSAV output delay
IUERR* output delay
–
–
12
0
EXTINT(4:0) setup time
EXTINT(4:0) hold time
EXTINTACK output delay
OE* LH output delay (no DMA mode)
BUFFEN* LH output delay
INST output delay
–
–
15
8.5
9
–
–
–
22
Data output delay to low-Z – guaranteed by design
formula: 10 ns + 1/4 t2
t61
20
–
SYSCLK+
16
TSC695F
4118H–AERO–06/03
Figure 3. 150 pF Buffer Response (Data from simulation)
17
TSC695F
4118H–AERO–06/03
Figure 4. 400 pF Buffer Response (Data from simulation)
18
TSC695F
4118H–AERO–06/03
TSC695F
Figure 5. OE*/400 pF Buffer Response (Data from simulation)
19
4118H–AERO–06/03
1 (RAM fetch)
2 (RAM load)
3 (RAM fetch)
4 (RAM store)
m ws
5 (RAM fetch)
t1
t3
t3
CLK2
n ws
n ws
n ws
n ws
t2
SYSCLK
RA [31:0]
ALE
t4_1
t4_1
t4_1
t4_1
FA1
LA1
FA2
SA1
FA3
t14
t14
t5
t5
t5
t5
MEMCS* [0]
MEMCS* [1]
ROMCS*
t6
t6
DDIR
t7
t7
MEMWR*
BUFFEN*
t8
t56
t56
t8
OE*
D [31:0]
DPAR
t10
t10
t10
t11
t61
t9
LD1
t12
t12
t12
FD1
FP1
FC1
FD2
FP2
FC2
SD1
SP1
FD3
FP3
FC3
previous stored data
t11
t61
t9
LP1
previous stored parity
t61
t9
LC1
t13
SC1
CB [6:0]
INST
previous stored checkbyte
t60
t60
t60
t60
t16
t17
t16
MHOLD*
MDS*
t17
t17
t17
t17
t17
t17
1 (RAM fetch)
2 (RAM atomic load store)
3 (RAM fetch)
t4_1
t2
SYSCLK
RA [31:0]
t4_1
FA1
ALSA
FA5
ALE*
t5
t5
t5
t5
MEMCS* [0]
MEMCS* [1]
t6
t6
t6
t6
DDIR
t7
t7
MEMWR*
BUFFEN*
t8
t56
t8
t56
t8
OE*
t10
t10
t61
t9
t9
t11
t11
t12
FD1
FP1
FC1
FD5
FP5
FC5
D [31:0]
DPAR
byte from RAM
word from RAM
t10
word to RAM
t10
t9
t61
t9
t12
t12
parity from RAM
t10
parity to RAM
parity from RAM
t10
t9
t61
t9
t13
checkbyte to RAM
CB [6:0]
INST
checkbyte from RAM
checkbyte from RAM
t60
t60
t16
t16
held to update the full word
MHOLD*
MDS*
t46
t46
INULL
RLDSTO
LOCK
t4_1
t4_1
t4_2
t4_2
1 (RAM fetch)
2 (RAM double load)
t2
3 (RAM fetch)
4 (RAM double store)
5 (RAM fetch)
SYSCLK
t4_1
t4_1
t4_1
FA2
t4_1
t4_1
t4_1
FA3
FA1
LA1
LA2
SA1
SA2
RA [31:0]
ALE*
t5
t5
t5
t5
t5
t5
t5
MEMCS* [0]
MEMCS* [1]
DDIR
t5
t6
t6
t7
t7
t7
t7
MEMWR*
BUFFEN*
t8
t56
t8
t56
t8
OE*
D [31:0]
DPAR
t9
t9
t9
t10
LD2
t61
t61
t61
t11
t11
t11
t11
t12
FD1
FP1
FC1
LD1
LP1
LC1
FD2
FP2
FC2
SD1
SP1
SD2
SP2
SC2
FD3
t10
LP2
t12
t12
FP3
FC3
t10
LC2
t13
t13
SC1
CB [6:0]
INST
t60
t60
t16
t16
MHOLD*
MDS*
t46
t46
INULL
LOCK
t4_2
t4_2
1 (RAM fetch)
2 (RAM load correctable data)
internal error correction
3 (RAM fetch)
t2
4 (RAM fetch)
load
SYSCLK
ALE*
t14
t14
t4_1
t4_1
t4_1
FA3
RA[31-0]
FA1
LA1
FA2
t5
t5
t5
t5
MEMCS*[0]
MEMCS*[1]
DDIR
MEMWR*
IOWR*
t8
t56
t56
t8
OE*
BUFFEN*
t9
t10
t9
t10
LD1
D[31-0]
CB[6-0]
DPAR
FD1
FC1
FP1
FD2
FC2
FP2
FD2
FC2
FP2
FD3
FC3
FP3
data correction
LC1
LP1
made inside
1-bit error on 40-bit data
t16
t16
MHOLD*
MEXC*
t17
t17
MDS*
t60
t60
INST
INULL
1 (RAM fetch)
2 (RAM load)
internal error detection
3 (RAM fetch)
exception
4 (null cycle)
t2
5 (RAM fetch)
6 (RAM fetch)
load
trap
SYSCLK
ALE*
t14
t14
t4_1
t4_1
t4_1
FA3
t4_1
TA1
RA[31-0]
FA1
LD1
FA2
TA2
t5
t5
t5
t5
MEMCS*[0]
MEMCS*[1]
DDIR
MEMWR*
IOWR*
t8
t56
t8
t56
OE*
BUFFEN*
t10
LD1
t10
FD2
t9
t9
D[31-0]
CB[6-0]
DPAR
FD1
FD2
FD2
FD3
TD1
TC1
TP1
TD2
TC2
TP2
FC1
FP1
LC1
FC2
FP2
FC2
FP2
FC2
FP2
FC3
FP3
LP1
2-bit error on 40-bit data
t16
t16
MHOLD*
MEXC*
MDS*
t20
t20
t17
t17
t60
t60
t60
t46
t60
t46
INST
INULL
1 (RAM fetch)
t2
2 (RAM load)
3 (RAM fetch)
internal error
4 (null cycle)
5 (RAM fetch)
6 (RAM fetch)
fetch
trap
SYSCLK
ALE*
t4_1
t4_1
unimplemented address
LA1
RA[31-0]
FA1
FA2
FA3
TA1
TA2
t5
t5
MEMCS*[0]
MEMCS*[1]
DDIR
MEMWR*
IOWR*
BUFFEN*
t56
t8
t8
t56
OE*
D[31-0]
MHOLD*
MEXC*
MDS*
t9
t10
t9
t10
FD2
FD1
no data
FD3
TD1
TD2
t16
t16
t20
t20
t17
t17
t60
t60
t60
t46
t60
t46
INST
INULL
1 (RAM fetch)
2 (i/o store)
rdy waiting
3 (RAM fetch)
start of cycle
(n-1) ws
end of cycle
t2
SYSCLK
ALE*
t4_1
FA1
t4_1
t5
t4_1
FA2
SA1
RA[31-0]
MEMCS*[0]
IOSEL*[0]
t5
t27
t27
t25
t24
t24
BUSRDY*
t6
t6
DDIR
MEMWR*
t7
t7
IOWR*
BUFFEN*
OE*
t15
t56
t57
t8
t10
t61
t9
t11
t12
FD1
SD1
FD2
D[31-0]
INST
previous stored data
t60
t60
t16
t16
MHOLD*
MDS*
1 (RAM fetch)
2 (i/o load)
rdy waiting
3 (RAM fetch)
start of cycle
(n-1) ws
end of cycle
t2
SYSCLK
ALE*
t14
t14
t4_1
t5
t4_1
FA2
FA1
LA1
RA[31-0]
t5
MEMCS*[0]
IOSEL*[0]
t27
t27
t25
t24
t24
BUSRDY*
DDIR
MEMWR*
IOWR*
BUFFEN*
OE*
t15
t8
t57
t56
t56
t8
t10
data driven by external buffers (c.f BUFFEN*)
t9
t9
t10
FD1
LD1
FD2
D[31-0]
INST
t60
t60
t16
t16
MHOLD*
MDS*
t17
t17
1 (RAM fetch)
2 (xchgRAM store)
rdy waiting in between
3 (RAM fetch)
start of cycle
n ws
end of cycle
t2
SYSCLK
ALE*
t4_1
t4_1
FA2
RA[31-0]
MEMCS*[0]
EXMCS*
DDIR
FA1
SA1
t5
t5
t5
t5
t6
t6
t7
t7
t7
MEMWR*
IOWR*
t7
t15
t57
t8
BUFFEN*
OE*
t56
t25
t24
t24
BUSRDY*
D[31-0]
INST
t61
t60
t11
t12
FD1
SD1
FD2
previous stored data
t60
t16
t16
MHOLD*
MDS*
1 (RAM fetch)
2 (xchgRAM load)
rdy waiting
3 (RAM fetch)
start of cycle
n ws
end of cycle
t2
SYSCLK
ALE*
t14
t14
t4_1
t4_1
FA2
RA[31-0]
MEMCS*[0]
FA1
LA1
t5
t5
t5
t5
EXMCS*
DDIR
MEMWR*
IOWR*
t15
t57
BUFFEN*
OE*
t56
t8
t24
t24
t25
BUSRDY*
D[31-0]
INST
t9
t10
FD1
LD1
FD2
data driven by external buffers (c.f BUFFEN*)
t60
t60
t16
t16
MHOLD*
MDS*
t17
t17
1 (ROM fetch)
2 (8-bit ROM fetch or load word)
byte 1 byte 2
(n-1) ws (n-1) ws
3 (ROM fetch)
byte 0
(n-1) ws
byte 3
(n-1) ws
start of
cycle
end of
cycle
t2
SYSCLK
ALE*
t14
t4
t4_1
t4_1
t4_1
RSIZE[0,1]
RA[31-0]
BA[0,1]
10
t4_1
FA2
FA1
FA2
t23
(address mod. 4)
t23
t23
t23
0
1
2
3
0
t5
t5
t5
ROMCS*
MEMCS*[0]
DDIR
MEMWR*
t15
t57
t56
t15
BUFFEN*
t8
t8
OE*
data driven by external buffers (c.f BUFFEN*)
D[31-8]
t10
t10
t10
FD2-2
t10
t9
t9
t9
t9
D[7-0]
INST
FD2-0
FD2-1
FD2-3
t60
t60
t16
(1 = fetch,
0 = load word)
t16
t16
MHOLD*
MDS*
t17
t17
t17
1 (RAM fetch)
2 (8-bit ROM write)
(n-1) ws
3 (RAM fetch)
t2
4 (8-bit ROM write)
(n-1) ws
5 (RAM fetch)
start of
cycle
start of
cycle
SYSCLK
ALE*
t4_1
t4_1
FA2
t4_1
t23
t4_1
FA3
RA[31-0]
BA[0,1]
FA1
SA1
addr.=mod. 4
SA2
addr.=mod. 4 +1
t23
00
00
00
01
00
t4_1
t5
t4_1
10
t4_1
t5
t4_1
10
RSIZE[0,1]
MEMCS*[0]
ROMCS*
DDIR
10
t5
t5
t6
t5
t5
t6
t5
t5
t6
t6
t7
t7
t7
t7
MEMWR*
IOWR*
t15
t57
t8
t15
t57
t12
BUFFEN*
OE*
t56
t56
t61
t61
t9
t11
t12
t9
t11
byte D[7:0]
SD1
byte D[7:0]
SD2
D[31-0]
INST
FD1
t60
FD2
t60
t60
t16
t16
t16
t16
MHOLD*
MDS*
1 (RAM fet2ch()RAM fetch)
3 (DMA session)
(0 cycle min) nth DMA store (0 ws)
4 (RAM fet5ch()RAM fetch)
(null cycle)lead-in (0 cycle min) 1st DMA load (0 ws)
lead-out
cont’
t2
SYSCLK
ALE*
t14
t14
t14
t33
t14
t33
D SAn
t4_1
FA2
t4_1
FA2
t4_1
t32
t32
t21
FA1
FS1
FZ1
D LA1
FA3
FS3
FZ3
RA[31-0]
RASI[3-0]
(held to the end of RAM access)
(held to the end of RAM access)
t22
t22
t21
D LS1
t4_1
FS2
t4_1
t4_1
t4_1
D SSn
FS2
t4_1
t22
t22
t4_1
FZ2
t21
1 0
t21
1 0
(only word access)
FZ2
RSIZE[1-0]
DMAREQ*
DMAGNT*
DMAAS
(only word access)
t30
t30
early time for DMAREQ* desassertion
t31
t31
t28
t32
t32
t29
t28
t32
t32
t29
t33
t33
t33
t33
t31
t31
t31
t31
RD
(pull-up on WE*)
t5
WRT
MEMCS*[9-0]
DRDY*
t5
t5
t5
t5
t17
t56
t17
t17
t17
t8
t8
t56
OE*
t7
t7
MEMWR*
DDIR
corrected data if needed
t10
t6
t6
t10
t9
t10
t9
t11
t12
t9
(held to the end of RAM access)
t13 t13
t10
t9
t9
t9
FD1
D LD1
D LD1
D SDn
FD2
D[31-0]
DPAR
(from RAM)
(from TSC695F)
t10
t9
FP1
t10
t10
t9
t11
t12
D LP1
(from TSC695F)
D LP1
(from RAM)
t10
DSPn
FP2
Parity generated by TSC695F if dpe =1,
else, same timing as D[31-0]
t10
t9
FC1
t10
corrected parity if needed
t9
t13
D SCn
t13
D LC1
FC2
CB[7-0]
(from RAM)
t16
t16
MHOLD*
Sampled
Prioritized
Latched
FA2
Taken
FA4
SYSCLK
RA[31:0]
ALE*
FA(-1)
FD(-1)
FA0
FA1
FD1
FA3
FD3
TTA0
TD0
TTA1
TD1
TSA0
TSD0
TSA1
TSA2
D[31:0]
INULL
FD0
t53
FD2
FD4
TSD1
t52
EXTINT[i]
t54
t54
EXTINTACK
SYSCLK
RA[31:0]
FAn-1
09H
10
FAn
09H
10
FAn+1
09H
10
FAn+1
09H
10
FAn+2
09H
10
RASI[3:0]
RSIZE[1:0]
t14
t14
ALE*
SYSHALT*
t16
t16
MHOLD*
SYSAV
t49
t49
t48
t48
CPUHALT*
D[31:0]
FDn+2
FDn+1
FDn-1
FDn
SYSCLK
RA[31:0]
FAn-1
09H
10
FAn
09H
10
FAn+1
09H
RASI[3:0]
RSIZE[1:0]
10
t14
ALE*
IUERR*
t50
t50
t49
SYSERR*
MHOLD*
SYSAV
t16
t49
t48
CPUHALT*
D[31:0]
FDn-1
FDn
SYSCLK
SYSRESET*
RA[31:0]
FA n
FA n+1
0H
4H
8H
RASI[3:0]
RSIZE[1:0]
t14
t46
t14
ALE*
INULL
t47
t48
t48
RESET*
TSC695F
Package Description
Thermal Characteristics The thermal performance of a package is measured by its ability to dissipate the power
required by the device into its surroundings. The electrical power drawn by the device
generates heat on the top surface of the die. This heat is conducted through the pack-
age to the surface and then transferred when there is surrounding air by convection.
Each heat transfer step has corresponding resistance, when there is surrounding air, to
the heat flow, which is given the value Rθ, the thermal resistance coefficient. Subscripts
are added to the coefficient to specify the two points that the heat is transferred
between. Commonly used coefficients are Rθja (junction to ambient air), Rθjc (junction
to case) and Rθca (case to ambient).
An electrical analogy can be made, as shown in Figure 23, to illustrate the heat flow of a
package. The heat transfer can be characterized mathematically by the following
equation:
Tj – Ta = P × Rθja
–
–
Where:
P = Device operating power (Watts)
Tj = Temperature of a junction on the device (°C)
Ta = Temperature of the surrounding ambient air (°C)
Rθja = Rθjc + Rθca in °C/W
Figure 23. Thermal Model
Rθja
Rθca
Heat Flow
Cavity
Rθjc
Die
Package
Table 8. Thermal Characteristics
Conditions
Rθ -
ja
Value
20 ~ 23
0.4
Unit
Temperature
Air
Blown air
jc
°C/W
25/90°C
ja
31 ~ 41
0.4
Stationary air
jc
37
4118H–AERO–06/03
256-lead MQFP-F Package
38
TSC695F
4118H–AERO–06/03
TSC695F
256-lead MQFP-F Pin
Assignments
Table 9. Pin Assignments
Pin
Signal
GPIINT
GPI[7]
VCCO
VSSO
GPI[6]
GPI[5]
GPI[4]
GPI[3]
VCCO
VSSO
GPI[2]
GPI[1]
GPI[0]
D[31]
Pin
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
Signal
D[0]
Pin
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
Signal
RA[0]
Pin
Signal
DXFER
MEXC
1
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
2
RSIZE[1]
RSIZE[0]
RASI[3]
VCCO
VSSO
RASI[2]
RASI[1]
RASI[0]
RA[31]
RA[30]
VCCO
VSSO
RA[29]
RA[28]
RA[27]
VCCO
VSSO
RA[26]
RA[25]
RA[24]
VCCI
VCCO
3
VSSO
VCCO
4
RAPAR
RASPAR
DPAR
VSSO
5
RESET
SYSRESET
BA[1]
6
7
VCCO
8
VSSO
BA[0]
9
SYSCLK
TDO
CB[6]
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
CB[5]
TRST
VCCO
TMS
VSSO
TDI
CB[4]
TCK
CB[3]
D[30]
CLK2
CB[2]
VCCO
VSSO
D[29]
DRDY
CB[1]
DMAAS
VCCO
VCCO
VSSO
D[28]
VSSO
CB[0]
VCCI
DMAGNT
EXMCS
VCCI
ALE
VSSI
VCCI
D[27]
VSSI
D[26]
VSSI
VSSI
PROM8
ROMCS
MEMCS[9]
VCCO
VCCO
VSSO
D[25]
VCCO
VSSO
RA[23]
RA[22]
RA[21]
VCCO
VSSO
RA[20]
RA[19]
RA[18]
VCCO
VSSO
DMAREQ
BUSERR
BUSRDY
ROMWRT
NOPAR
SYSHALT
CPUHALT
VCCO
D[24]
VSSO
D[23]
MEMCS[8]
MEMCS[7]
MEMCS[6]
MEMCS[5]
MEMCS[4]
MEMCS[3]
VCCO
D[22]
VCCO
VSSO
D[21]
VSSO
D[20]
SYSERR
SYSAV
EXTINT[4]
D[19]
D[18]
VSSO
39
4118H–AERO–06/03
Table 9. Pin Assignments (Continued)
Pin
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Signal
VCCO
VSSO
D[17]
D[16]
VCCI
VSSI
D[15]
D[14]
VCCO
VSSO
D[13]
D[12]
D[11]
D[10]
VCCO
VSSO
D[9]
Pin
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Signal
RA[17]
RA[16]
RA[15]
VCCO
VSSO
RA[14]
VCCI
Pin
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
Signal
EXTINT[3]
EXTINT[2]
EXTINT[1]
EXTINT[0]
VCCI
Pin
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
Signal
MEMCS[2]
MEMCS[1]
MEMCS[0]
VCCI
VSSI
VSSI
OE
EXTINTACK
IUERR
VCCO
VSSO
VCCO
VSSI
VSSO
RA[13]
RA[12]
VCCO
VSSO
RA[11]
RA[10]
RA[9]
MEMWR
BUFFEN
DDIR
CPAR
TXA
VCCO
RXA
VSSO
RXB
DDIR
TXB
MHOLD
MDS
VCCO
VSSO
RA[8]
IOWR
IOSEL[3]
VCCO
VSSO
WDCLK
IWDE
D[8]
D[7]
RA[7]
EWDINT
TMODE[1]
TMODE[0]
DEBUG
INULL
D[6]
RA[6]
IOSEL[2]
IOSEL[1]
IOSEL[0]
WRT
VCCO
VSSO
D[5]
VCCO
VSSO
RA[5]
D[4]
RA[4]
WE
DIA
D[3]
RA[3]
VCCO
VSSO
VCCO
D[2]
VCCO
VSSO
RA[2]
VSSO
VCCO
VSSO
D[1]
RD
FLUSH
INST
RLDSTO
LOCK
RA[1]
RTC
40
TSC695F
4118H–AERO–06/03
TSC695F
Ordering Information
Table 10. Possible Order Entries
Temperature
Range
Maximum Speed
(MHz)
Part-Number
Supply Voltage
Packaging
MQFP-F256
MQFP-F256
MQFP-F256
MQFP-F256
MQFP-F256
Die
Quality Flow
Engineering Samples
Standard Mil.
QML-Q
TSC695F-25MA-E
TSC695F-25MA
5V
5V
5V
5V
5V
5V
5V
5V
25°C
25
25
25
25
25
25
25
25
-55° to +125°C
-55° to +125°C
-55° to +125°C
-55° to +125°C
25°C
5962-0054001QXC
5962-0054001VXC
TSC695F-25SASB
TSC695F-25MB-E
5962-0054001Q9A
5962-0054001V9A
QML-V
SCC B
Engineering Samples
QML-Q
-55° to +125°C
-55° to +125°C
Die
Die
QML-V
41
4118H–AERO–06/03
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Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard
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Printed on recycled paper.
4118H–AERO–06/03
/xM
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